TWI720931B - Manufacturing method of light-emitting heat dissipation module - Google Patents

Abstract

A method for manufacturing a light-emitting and heat-dissipating module includes the steps of: soldering a light-emitting element and an electrical connector to the front surface of a metal circuit board with high-temperature solder to form a light bar; preparing a heat sink, the heat sink having a main board body and vertically connected to the heat sink A plate-shaped carrying portion on a side edge of the main board body, the carrying portion having a mounting surface facing the main board body for installing the light bar; coating the mounting surface with low-temperature solder, the melting point of the low-temperature solder is lower than the melting point of the high-temperature solder; Place the light bar on the mounting surface and contact the low temperature solder with the back of the metal circuit board; and use a jig to press the light bar against the load-bearing part, and then melt the low temperature solder to weld the light bar On the mounting surface.

Description

Manufacturing method of light-emitting heat dissipation module

The invention relates to a method for manufacturing a light-emitting and heat-dissipating module, in particular to a method for manufacturing a light-emitting and heat-dissipating module for displays and products thereof.

With the evolution of light-emitting diode technology, most of the light sources of displays currently use light-emitting diodes (LEDs). Since high-power LEDs generate a lot of heat during operation, if they cannot effectively dissipate heat, it will affect the luminous efficiency and service life of the LEDs. Therefore, the LED light source of the display must be used with a heat sink.

The thickness of the existing displays is becoming thinner and thinner, which makes the space for installing the light bar and the heat sink is quite limited, and the light bar is very narrow and long and difficult to weld with the heat sink. Therefore, the LED light bar commonly used in displays is usually Adhesively fixes the heat sink with heat-dissipating tape, heat-dissipating paste and heat-conducting silicone glue. However, materials such as heat-dissipating tape, heat-dissipating paste, and heat-conducting silicone have low thermal conductivity, which can easily cause thermal resistance and affect heat dissipation performance. Especially when the LED power is increased, how to improve the heat dissipation performance is a problem that needs to be solved.

Therefore, one of the objectives of the present invention is to provide a The manufacturing method of the light emitting and heat dissipation module of the aforementioned problem.

Therefore, in some embodiments of the manufacturing method of the light-emitting and heat-dissipating module of the present invention, the steps include: soldering the light-emitting element and the electrical connector to the front surface of the metal circuit board with high-temperature solder to form a light bar; and preparing a heat sink to dissipate heat. The component has a main board body and a plate-shaped bearing portion perpendicularly connected to a side edge of the main board body. The bearing portion has a mounting surface facing the main board body for installing the light bar; the mounting surface is coated with low-temperature solder, and the low-temperature solder is coated on the mounting surface. The melting point is lower than the melting point of the high-temperature solder; the light bar is placed on the mounting surface and the back of the metal circuit board is in contact with the low-temperature solder; and the light bar is pressed against the load-bearing part with a jig, and then the The low-temperature solder is melted to weld the light bar to the mounting surface.

In some embodiments, the metal circuit board is surface-treated and the surface is roughened before soldering.

In some embodiments, the metal circuit board is an aluminum substrate, and the surface of the metal circuit board is subjected to zinc replacement treatment and then nickel-plated before soldering.

In some embodiments, the mounting surface is provided with an overflow groove adjacent to the edge of the mounting surface to accommodate the overflowing low temperature solder.

In some embodiments, the fixture and the light bar are approximately the same length, and have a first pressing portion and a second pressing portion opposite to each other, and connecting the first pressing portion and the second pressing portion The elastic connecting part of the, the first pressing part and the second pressing part are pressed against the metal circuit board and the carrying part respectively, and the metal circuit board and the carrying part are clamped in the first pressing part And the second pressing part.

In some embodiments, the melting point of the high temperature solder is between 240 and 260°C, and the melting point of the low temperature solder is between 160 and 180°C.

In some embodiments, before using the fixture, the light bar and the carrying part are pre-fixed by laser welding or touch welding.

Therefore, another objective of the present invention is to provide a light-emitting and heat-dissipating module that can improve the heat-dissipating efficiency.

Therefore, the light-emitting and heat-dissipating module of the present invention is included in some embodiments.

In some embodiments, the mounting surface is provided with an overflow groove adjacent to the edge of the mounting surface to accommodate the overflowing solder when soldering the light bar.

The present invention has the following effects: by pressing the light bar and the load-bearing part by the jig, the low-temperature solder can avoid air bubbles during the welding process, and avoid the heat sink and the light bar due to stress during the welding process. Separate. Since the melting point of the low-temperature solder is lower than the melting point of the high-temperature solder, it can be ensured that the light-emitting element and the electrical connector soldered to the metal circuit board will not be unsoldered when the light bar is soldered to the heat sink. Thereby, the light bar can be well welded to the heat sink to increase the heat dissipation efficiency.

100: luminous cooling module

1: light bar

11: Metal circuit board

12: Light-emitting element

13: electrical connector

2: heat sink

21: Motherboard body

22: Bearing Department

221: mounting surface

222: Overflow Groove

3: Fixture

31: The first pressing part

32: The second pressing part

33: Elastic connection part

4: shell

S1: Step

S2: Step

S3: steps

S4: Step

S5: steps

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Fig. 1 is a step flow chart of an embodiment of a method for manufacturing a light emitting and heat dissipation module of the present invention; Fig. 2 is an incomplete perspective view of the light bar of the embodiment; Fig. 3 is an incomplete perspective view of the heat sink of the embodiment; Fig. 4 It is an incomplete three-dimensional exploded view illustrating the corresponding relationship between the light bar and the heat sink of this embodiment; FIG. 5 is an incomplete three-dimensional view illustrating the combination of the light bar and the heat sink of this embodiment; FIG. 6 is an incomplete three-dimensional view illustrating the light bar of this embodiment An incomplete three-dimensional exploded view of the corresponding relationship between the combination of the heat sink and the fixture; FIG. 7 is an incomplete three-dimensional view illustrating the fixture sandwiching the light bar and the heat sink of the embodiment; and FIG. 8 illustrates the manufacture of the embodiment The light-emitting and heat-dissipating module is assembled in a perspective view of a display housing.

Referring to FIG. 1, an embodiment of the method for manufacturing a light-emitting and heat-dissipating module of the present invention includes the following steps: Step S1, soldering the light-emitting element and the electrical connector to the front surface of the metal circuit board with high-temperature solder to form a light bar; Step S2 , Prepare a heat sink, the heat sink has a main board body and a vertical connection A plate-shaped bearing portion connected to one side edge of the main board body, the bearing portion having a mounting surface facing the main board body for installing the light bar; step S3, coating low temperature solder on the mounting surface, the melting point of the low temperature solder is lower than The melting point of the high-temperature solder; step S4, place the light bar on the mounting surface and contact the low-temperature solder with the back of the metal circuit board; and step S5, use a jig to press the light bar against the carrying part, The low-temperature solder is then melted to weld the light bar to the mounting surface.

The steps of this embodiment are described in detail as follows: Referring to FIG. 2, in this embodiment, step S1 is to solder a plurality of light-emitting elements 12 and two electrical connectors 13 to a metal circuit board with high-temperature solder (not shown) 11 on the front side, and form a light bar 1. The light-emitting element 12 used in this embodiment is an LED, the metal circuit board 11 is an aluminum substrate, and the electrical connector 13 is used to connect to a power source to provide power to the light-emitting element 12. The metal circuit board 11 undergoes surface treatment and roughening before welding, so as to increase the welding bonding force with the light-emitting element 12 and the electrical connector 13. Specifically, the metal circuit board 11 of this embodiment is an aluminum substrate, and the surface of the aluminum substrate is subjected to a "zinc replacement treatment" before soldering, and then nickel-plated. "Zinc replacement treatment" is to first use nitric acid to bite the aluminum material, so that zinc ions can be replaced on the surface of the aluminum material. When the "zinc replacement treatment" is completed, a zinc metal film is formed on the surface of the aluminum material, and "zinc replacement" "Treatment" first uses nitric acid to bite the aluminum material, which also roughens the surface of the aluminum material. After the "zinc replacement treatment" The surface of the metal circuit board 11 is plated with nickel to avoid oxidation of the surface of the metal circuit board 11, and the soldering process is performed after the protective film is formed by the nickel layer. In this embodiment, the melting point of the high-temperature solder is between 240 and 260°C.

Referring to FIG. 3 and FIG. 4, step S2 of this embodiment will be described in detail. A heat sink 2 is prepared. The heat sink 2 has a main board body 21 and a plate-shaped supporting portion 22 perpendicularly connected to a side edge of the main board body 21. The supporting portion 22 has a mounting surface 221 facing the main board body 21 for installing the Light bar 1. In this embodiment, the heat sink 2 is made of aluminum extrusion, and its shape is matched with the housing 4 of a display (see FIG. 8). The main board body 21 is used to be mounted on the inner side of the rear wall of the display housing 4. The carrying portion 22 It is vertically connected with the main board body 21, so that the light bar 1 mounted on the supporting portion 22 can be located on the side of the backlight module (not shown) to provide a side-light-introducing backlight module light source. In this embodiment, the mounting surface 221 is provided with an overflow groove 222 adjacent to the edge of the mounting surface 221 for containing the overflowing low temperature solder in the subsequent steps. In this embodiment, the overflow groove 222 is located adjacent to the connection between the carrying portion 22 and the main board body 21. In a modified embodiment, the overflow groove 222 may also be located adjacent to another It can be set at the edge (that is, the opposite side of the connection), or on both sides.

4 and 5, step S3 is to coat the mounting surface 221 with low temperature solder (not shown), the melting point of the low temperature solder is lower than the melting point of the high temperature solder, in this embodiment, the melting point of the low temperature solder is between 160 to 180°C. Step S4 is to place the light bar 1 on the mounting surface 221 and connect the back of the metal circuit board 11 with the low temperature solder. Contact to solder the metal circuit board 11 to the mounting surface 221 with the low-temperature solder.

Referring to FIGS. 6 and 7, in step S5, a jig 3 is used to compress the light bar 1 and the supporting portion 22, and then the low-temperature solder is melted to weld the light bar 1 to the mounting surface 221. The fixture 3 compresses the light bar 1 and the load-bearing portion 22, which can prevent the low-temperature solder from generating bubbles during the welding process, and prevent the heat sink 2 from being separated from the light bar 1 due to stress during the welding process . Since the melting point of the low-temperature solder is lower than the melting point of the high-temperature solder, it is possible to ensure that the light-emitting element 12 and the electrical connector 13 soldered to the metal circuit board 11 will not be unsoldered when the light bar 1 and the heat sink 2 are soldered . In this embodiment, before using the fixture 3, the light bar 1 and the supporting portion 22 are pre-fixed by laser welding or butt welding, so that the light bar 1 and the supporting portion 22 can be positioned relatively , Thereby making the steps of installing the fixture 3 easier. In this embodiment, the fixture 3 is approximately the same length as the light bar 1, and has a first pressing portion 31 and a second pressing portion 32 opposite to each other, and connecting the first pressing portion 31 and the first pressing portion 31 and the second pressing portion 32. The elastic connecting portion 33 of the two pressing portions 32, the first pressing portion 31 and the second pressing portion 32 are respectively pressed against the metal circuit board 11 and the carrying portion 22, and the metal circuit board 11 and the The supporting portion 22 is sandwiched between the first pressing portion 31 and the second pressing portion 32. After the welding is completed, the jig 3 can be removed to complete the light-emitting heat dissipation module.

Referring to FIG. 8, the finished light-emitting and heat-dissipating module 100 is suitable for being installed on a flat or curved display (not shown), and the heat-dissipating member 2 is used to be installed in the housing 4 of the display.

The light-emitting and heat-dissipating module 100 made in this embodiment is combined with a conventional heat-dissipating glue Compared with the light emitting and heat dissipation module 100 with the combined light bar 1 and the heat sink 2, the heat dissipation efficiency can be greatly improved. Take the light-emitting heat dissipation module 100 of this embodiment as an experimental example, and compare the heat sink 2 and the light bar 1 with the same structure as the experimental example, and use the thermal conductive tape with the thermal conductivity k=1 to combine the light bar 1 and the heat sink 2 as a comparison For example, under the same test conditions, the surface temperature of the light-emitting element 12 of the experimental example is 69.8°C, and the surface temperature of the light-emitting element 12 of the comparative example is 86.6°C. The test results can prove that the light-emitting and heat-dissipating mold made in this example Group 100 can greatly improve the heat dissipation performance.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

S1: Step

S2: Step

S3: steps

S4: Step

S5: steps

Claims (7)

A method for manufacturing a light-emitting and heat-dissipating module includes the steps of: soldering a light-emitting element and an electrical connector to the front surface of a metal circuit board with high-temperature solder to form a light bar; preparing a heat sink, the heat sink having a main board body and vertically connected to the heat sink A plate-shaped carrying portion on a side edge of the main board body, the carrying portion having a mounting surface facing the main board body for installing the light bar; coating the mounting surface with low-temperature solder, the melting point of the low-temperature solder is lower than the melting point of the high-temperature solder; Place the light bar on the mounting surface and contact the low temperature solder with the back of the metal circuit board; and use a jig to press the light bar against the load-bearing part, and then melt the low temperature solder to weld the light bar On the mounting surface. The method for manufacturing a light-emitting and heat-dissipating module according to claim 1, wherein the metal circuit board is surface-treated and the surface is roughened before soldering. According to the method for manufacturing a light emitting and heat dissipation module according to claim 2, wherein the metal circuit board is an aluminum substrate, and the surface of the metal circuit board is subjected to zinc replacement treatment and then nickel-plated before welding. The method for manufacturing a light emitting and heat dissipation module according to claim 1, wherein the mounting surface is provided with an overflow groove adjacent to the edge of the mounting surface to accommodate the overflowing low temperature solder. The method for manufacturing a light-emitting and heat-dissipating module according to claim 1, wherein the jig is approximately the same length as the light bar, and has a first pressing portion and a second pressing portion opposite to each other, and is connected to the first pressing portion The bullets of the resisting portion and the second resisting portion The first pressing part and the second pressing part are pressed against the metal circuit board and the carrying part respectively, and the metal circuit board and the carrying part are sandwiched between the first pressing part and the carrying part. Between the second pressing part. The method for manufacturing a light-emitting heat dissipation module according to claim 1, wherein the melting point of the high-temperature solder is between 240 and 260°C, and the melting point of the low-temperature solder is between 160 and 180°C. The method for manufacturing a light emitting and heat dissipation module according to claim 1, wherein, before using the fixture, the light bar and the carrying part are pre-fixed by laser welding or touch welding.

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