TWI719770B - Cloth fixture and method of fabricating electronic cloth - Google Patents

Abstract

A cloth fixture includes a bakelite base, a cover plate, and a printing board. The bakelite base includes a platform, a first trench, and a fixing component. The platform is configured to place a cloth. The first trench surrounds the platform. The fixing component is in the first trench to fix the cloth. The cover plate is on the bakelite base and has a hollow region aligning with the platform. The printing board is on the cover plate.

Description

Cloth positioning jig and manufacturing method of electronic cloth

The disclosure relates to a cloth positioning jig and a manufacturing method of electronic cloth using the cloth positioning jig.

In recent years, the application of consumer electronic products has grown year by year with the increase in market demand. In the application market of exhibition activities, interactive entertainment and safety warnings, the product concept of integrating electronic components into clothing is still one of the mainstreams in the development of smart clothing. However, the high softness of textiles tends to increase the difficulty of electronic processing. For example, the wrinkles and displacements generated during the electronic processing of textiles will cause the electronic components to be unable to accurately align. Therefore, how to produce high-stability electronic fabrics in large quantities and quickly has become an important issue in related fields.

The present disclosure provides a cloth positioning jig and a manufacturing method of electronic cloth.

According to an embodiment of the present disclosure, the cloth positioning jig includes a bakelite base, a pressing plate and a printing plate. The bakelite base includes a bearing platform, a first groove and And fixed parts. The carrying platform is configured to place the cloth. The first groove surrounds the carrying platform. The fixing member is arranged in the first groove to fix the cloth. The pressing plate is arranged on the bakelite base and has a hollow area to be aligned with the bearing platform. The printing plate is arranged on the pressing plate.

In an embodiment of the present disclosure, the bakelite base has a positioning member, and the pressing plate has a first positioning hole. The first positioning hole is detachably sleeved on the positioning member to fix the pressing plate on the bakelite base.

In an embodiment of the present disclosure, the printed board has a second positioning hole, and the second positioning hole is detachably sleeved on the positioning member to fix the printed board on the pressing plate.

In an embodiment of the present disclosure, the bakelite base has a second groove configured to receive the cloth that exceeds the carrying platform.

In an embodiment of the present disclosure, the width of the pressing plate is greater than the width of the bakelite base.

According to an embodiment of the present disclosure, a manufacturing method of electronic cloth includes: providing a cloth positioning jig; fixing the cloth in a bakelite base; fixing a pressure plate on the bakelite base so that the cloth is exposed from the hollow area; heating and placing the cloth The bakelite base and pressure plate of the cloth make the surface of the cloth flat; the printing plate is fixed on the pressure plate and the printing process is performed to form conductive patterns and insulating patterns on the cloth; and through surface mount technology (surface mount technology, SMT) dispose the electronic components on the cloth.

In an embodiment of the present disclosure, fixing the cloth on the bakelite base includes: arranging the cloth on the carrying platform so that the cloth covers at least the first groove; and arranging the fixing member in the first groove to fix Cloth.

In an embodiment of the present disclosure, the bakelite on which the cloth is placed is heated The heating temperature of the base and the pressing plate is between 110°C and 140°C, and the heating time is between 5 minutes and 20 minutes.

In an embodiment of the present disclosure, the manufacturing method of the electronic cloth further includes arranging the cloth beyond the first groove in the second groove of the bakelite base.

In an embodiment of the present disclosure, the manufacturing method of the electronic cloth further includes arranging the pressing plate beyond the bakelite base on the conveying track of the device that implements the surface adhesion technology.

According to the above-mentioned embodiments of the present disclosure, the cloth positioning jig is used to accurately position the cloth, and since the surface of the cloth tends to be flat due to the arrangement of the fixing member and the heat treatment process, the printing process and the arrangement of the electronic components can be executed. More precise and stable.

50‧‧‧Fabric

100‧‧‧Fabric positioning fixture

110‧‧‧ Bakelite base

111‧‧‧Carrier Platform

113‧‧‧First groove

115‧‧‧Fixture

117‧‧‧Second Groove

119‧‧‧Positioning piece

120‧‧‧Press plate

121‧‧‧First positioning hole

130‧‧‧Printing board

131‧‧‧Second positioning hole

133‧‧‧Printing pattern

200‧‧‧Conveying track

210‧‧‧Conveyor belt

H‧‧‧Knockout area

L‧‧‧Distance

D1‧‧‧First direction

W1, W2‧‧‧Width

S10, S20, S30, S40, S50, S60‧‧‧Step

FIG. 1 is a three-dimensional schematic diagram of a cloth positioning jig according to an embodiment of the present disclosure.

Figure 2 shows an exploded schematic diagram of the cloth positioning jig shown in Figure 1.

FIG. 3 shows a flowchart of a manufacturing method of electronic cloth according to an embodiment of the present disclosure.

4 to 8 are schematic diagrams of various steps in a method of manufacturing an electronic cloth according to an embodiment of the present disclosure.

Hereinafter, a plurality of implementation modes of this disclosure will be disclosed in diagrams, as For the sake of clarity, many practical details will be explained in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. In other words, in some implementations of this disclosure, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements will be shown in a simple schematic manner in the drawings.

The fabric positioning jig of the present disclosure is used to accurately position the fabric, so as to further quickly form conductive loops, insulating loops and conductive contacts on the surface of the fabric through the printing process, and use surface mount technology (SMT) Various electronic components (for example, light-emitting diodes, capacitors, inductors, resistors or integrated circuit chips, etc.) are precisely arranged on the cloth with various loops and conductive contacts.

FIG. 1 is a three-dimensional schematic diagram of a cloth positioning jig 100 according to an embodiment of the present disclosure. Fig. 2 shows an exploded schematic diagram of the cloth positioning jig 100 of Fig. 1. Please refer to FIGS. 1 and 2 at the same time. The cloth positioning jig 100 includes a bakelite base 110, a pressing plate 120 and a printing plate 130. The pressing board 120 is disposed on the bakelite base 110, and the printing board 130 is disposed on the pressing board 120. In some embodiments, each element in the Bakelite base 110 has a heat-resistant temperature of about 260°C or higher to prevent the cloth positioning jig 100 on which the cloth is placed during the heat treatment (described in detail later) and the printing process. Deformation or size change occurs during the drying process. In some embodiments, the top view shape of the Bakelite base 110 may be, for example, a rectangle.

In some embodiments, the Bakelite base 110 includes a supporting platform 111, a first groove 113 and a fixing member 115. The carrying platform 111 is configured to place cloth. The first groove 113 surrounds the carrying platform 111 and is configured to place a fixing member 115. Specifically, the fixing member 115 is placed in the first groove 113 after the cloth is placed on the carrying platform 111, so as to press the cloth beyond the carrying platform 111 and located in the first groove 113 to fix the cloth in the first groove 113. Bakelite base 110. In some embodiments, the fixing member 115 may be, for example, a high-temperature-resistant magnet, so as to generate magnetic force to compress the cloth. In addition, the fixing member 115 placed in the first groove 113 can provide tensile force to pull down the cloth hanging on the side wall of the carrying platform 111, so that the cloth is placed on the surface of the carrying platform 111 (that is, the surface to be electronically processed) It is roughly flat. In addition, since the fixing member 115 fixes the cloth on the bakelite base 110, when the cloth positioning jig 100 on which the cloth is placed is performing heat treatment (described in detail later), the shrinkage of the cloth can cause the cloth to be tightened. , So that the surface of the cloth on the carrying platform 111 tends to be more flat.

In some embodiments, the top view shape of the carrying platform 111 may be, for example, a rectangle. In some embodiments, the number of the fixing members 115 may be four, for example, and the adjacent fixing members 115 are connected to each other to collectively surround the carrying platform 111. However, this disclosure is not limited to this. The top view shape and size of the carrying platform 111 and the number, shape and configuration of the fixing members 115 can be adjusted according to actual needs.

In some embodiments, the Bakelite base 110 has a second groove 117 configured to receive the cloth that exceeds the carrying platform 111 and the first groove 113, so as to prevent the unfixed part of the cloth from shaking violently and affecting the cloth. The flatness of the surface on the bearing platform 111. In some embodiments, the cloth can be stored in the second groove 117 by folding or curling. In some embodiments, the second groove 117 may be disposed on the outer side of the first groove 113 and parallel to the first groove 113 to facilitate the storage of the cloth. In some embodiments, the second groove The number of 117 can be, for example, two, and the two second grooves 117 are parallel to each other. In some embodiments, the depth of the second groove 117 perpendicular to the extension plane of the bakelite base 110 is greater than the depth of the first groove 113 perpendicular to the extension plane of the bakelite base 110, thereby increasing the storage space of the cloth.

In some embodiments, the Bakelite base 110 has a positioning member 119, and the pressing plate 120 has a first positioning hole 121 whose position corresponds to the positioning member 119. The first positioning hole 121 is detachably sleeved on the positioning member 119 to fix the pressing plate 120 on the bakelite base 110. In some embodiments, the arrangement (for example, position distribution) of the positioning member 119 on the bakelite base 110 and the arrangement of the first positioning hole 121 on the pressure plate 120 can make the pressure plate 120 be firmly fixed on the bakelite base 110 . For example, the positioning elements 119 on the bakelite base 110 can be symmetrically distributed or spaced at a fixed distance, and the configuration of the first positioning holes 121 on the pressing plate 120 can also be the same. Although there are four positioning members 119 and four first positioning holes 121 shown in FIG. 2, the disclosure is not limited thereto. In other embodiments, the respective numbers of the positioning members 119 and the first positioning holes 121 can be adjusted according to actual requirements.

In some embodiments, the pressing plate 120 has a hollow area H that is aligned with the carrying platform 111. When the pressing plate 120 is fixed on the bakelite base 110 through the first positioning hole 121, the cloth placed on the carrying platform 111 can be exposed by the hollow area H, thereby performing electronic processing. In some embodiments, the carrying platform 111 and the fixing member 115 may be exposed by the hollow area H together. In some embodiments, the pressing plate 120, the fixing member 115, and the cloth on the carrying platform 111 may have a substantially flush top surface. In some embodiments, the material of the pressing plate 120 may be, for example, stainless steel, copper, aluminum, any suitable high temperature resistant material, or any of the above combination. Since the pressing plate 120 can have a heat-resistant temperature above about 400° C., the cloth positioning jig 100 on which the cloth is placed can be prevented from deforming or dimensional changes during the heat treatment (described in detail later) and the drying process of the printing process.

In some embodiments, the width W2 of the pressing plate 120 in the first direction D1 is greater than the width W1 of the bakelite base 110 in the first direction D1. In this way, when the pressing plate 120 is fixed on the bakelite base 110, a part of the pressing plate 120 can extend beyond the side wall of the bakelite base 110 perpendicular to the first direction D1. This arrangement allows the pressing plate 120 beyond the Bakelite base 110 to be erected on the conveying track of the device performing surface adhesion technology, so that the cloth positioning jig 100 with the cloth placed on it can be transferred to the device performing surface adhesion technology. The electronic components are placed on the cloth.

In some embodiments, the printed board 130 has a second positioning hole 131, and the position of the second positioning hole 131 corresponds to the position of the positioning member 119 and the first positioning hole 121. The second positioning hole 131 is detachably sleeved on the positioning member 119 to fix the printed board 130 on the pressing plate 120. In some embodiments, the printing plate 130 may have a printing pattern 133, and the position of the printing pattern 133 corresponds to the position of the cloth exposed by the hollow area H, so that a printing process is performed to transfer the printing pattern 133 to the surface of the cloth. In some embodiments, the material of the printed board 130 may be, for example, stainless steel, copper, aluminum, any suitable high-strength material, or any combination of the foregoing, so as to improve the stability of the printing process.

FIG. 3 shows a flowchart of a manufacturing method of electronic cloth according to an embodiment of the present disclosure. The manufacturing method of electronic cloth includes steps S10, S20, S30, S40, S50, and S60. In step S10, a cloth positioning jig is provided. In step S20, the cloth is fixed in the bakelite base. In step S30, the pressing plate is fixed on the bakelite base so that the cloth is exposed from the hollow area. In step S40, the bakelite base and the pressing plate on which the cloth is placed are heated, so that the surface of the cloth tends to be flat. In step S50, the printing plate is fixed on the pressing plate, and a printing process is performed to form a conductive pattern and an insulating pattern on the cloth. In step S60, the electronic components are arranged on the cloth through surface adhesion technology. In the following description, the above-mentioned steps will be further explained.

FIG. 4 is a schematic cross-sectional view of the manufacturing method of the electronic cloth according to an embodiment of the present disclosure in steps S10 and S20. First, in step S10, the cloth positioning jig 100 as described above is provided (see Figure 1). Next, in step S20, the cloth 50 is arranged on the carrying platform 111 of the bakelite base 110 so that the cloth 50 covers at least the first groove 113, and the fixing member 115 is placed in the first groove 113 to fix the cloth 50. For example, when the fixing member 115 is a high-temperature resistant magnet, the fixing member 115 can press the cloth 50 through the magnetic force between the fixing member 115 and the bakelite base 110. In some embodiments, the cloth 50 extending beyond the first groove 113 may be stored in the second groove 117 by means such as folding or crimping.

FIG. 5 is a schematic cross-sectional view of the manufacturing method of electronic cloth according to an embodiment of the present disclosure in step S30. In step S30, the pressing plate 120 is fixed to the bakelite base 110 through the sleeve connection between the positioning member 119 (see FIG. 2) and the first positioning hole 121 (see FIG. 2), so that the cloth 50 is removed from the pressing board 120. The hollow area H is exposed. Since the pressing plate 120 can further press the cloth 50 beyond the first groove 113, the stability of the cloth 50 fixed on the bakelite base 110 can be improved. In addition, the pressing plate 120 can cover the second groove 117 to further cover the storage The cloth 50 in the second groove 117 prevents the unfixed part of the cloth 50 from violently shaking and affecting the flatness of the surface of the cloth 50.

FIG. 6 is a schematic cross-sectional view of the method of manufacturing an electronic cloth according to an embodiment of the present disclosure in step S40. In step S40, the bakelite base 110 on which the cloth 50 is placed and the pressing plate 120 are placed in a heating device such as an oven to perform heat treatment. In the process of performing the heat treatment, the cloth 50 will shrink due to heat, and because the surrounding of the cloth 50 is pressed tightly by the fixing member 115, the shrinkage of the cloth 50 will cause the cloth 50 to be tightened, so that the cloth 50 is placed on the supporting platform 111. The surface tends to be flatter, which is conducive to the execution of subsequent printing processes and the configuration of electronic components. In some embodiments, the heating temperature for performing the heat treatment is between 110°C and 140°C. In some embodiments, the heating time for performing the heat treatment is between 5 minutes and 20 minutes. Since the bakelite base 110 and the pressing plate 120 each have a heat-resistant temperature of about 260° C. and above 400° C., there will be no deformation or dimensional change during the heat treatment.

FIG. 7 is a schematic top view of the manufacturing method of electronic cloth according to an embodiment of the present disclosure in step S50. In step S50, the printing plate 130 is fixed on the pressing plate 120 through the sleeve connection between the positioning member 119 (see FIG. 2) and the second positioning hole 131, and a printing process is performed to form a printing pattern 133 (for example, a conductive pattern , Insulating patterns or conductive adhesive patterns, etc.) on the surface of the cloth 50 (see Figure 6). In detail, the printing plates 130 with different printing patterns 133 may be used to perform the printing process of patterns with different functions, respectively. For example, when the printing process of a conductive circuit is to be performed, the printed board 130 with a conductive pattern can be fixed on the pressing plate 120, and conductive materials (such as silver paste, carbon paste, alloy paste, or conductive polymer, etc.) can be used. ) For printing and coating; when the printing process of the insulation circuit is to be performed At this time, the printed board 130 with an insulating pattern can be fixed on the pressing plate 120, and a waterproof insulating material (for example, epoxy, polyurethane, or silicone, etc.) can be used for printing and coating; when the printing process of conductive contacts is to be performed, The printed board 130 with a conductive adhesive pattern can be fixed on the pressing plate 120, and a conductive glue material (for example, silver glue or anisotropic conductive glue, etc.) can be used for printing and coating. By performing more than one printing process, the fabric 50 can have conductive loops, insulating loops, and/or conductive contacts.

Since in step S40, the heat treatment of the cloth 50 has been performed in advance to make the surface of the cloth 50 flattened, when the printing process is performed in step S50, various printing patterns 133 can be accurately formed on the surface of the cloth 50, thereby avoiding printing When the pattern 133 is transferred to the cloth 50, a defect occurs. In addition, since the surface of the cloth 50 can be flattened by the configuration of the fixing member 115 and the heat treatment process, the conductive pattern can be transferred to the cloth 50 with better quality, and the conductive pattern formed on the cloth 50 can have a lower The electrical resistance of the subsequent electronic cloth is improved. In addition, since the bakelite base 110 and the pressing plate 120 each have a heat-resistant temperature of about 260° C. and above 400° C., there will be no deformation or size change during the drying process of the printing process.

FIG. 8 is a three-dimensional schematic diagram of the manufacturing method of the electronic cloth according to an embodiment of the present disclosure in step S60. In step S60, the printing plate 130 fixed on the pressing plate 120 is removed, so that the cloth 50 with various printing patterns 133 is exposed from the hollow area H of the pressing plate 120. Then, the pressing plate 120 beyond the bakelite base 110 is erected on the conveying track 200 of the device for performing surface adhesion technology, so that the cloth positioning jig 100 with the cloth 50 placed on it is transferred to the device for performing surface adhesion technology. The arrangement of electronic components is performed on the cloth 50. in In some embodiments, the bakelite base 110 on which the cloth 50 is placed and the pressing plate 120 can be further placed on the conveyor belt 210 to ensure the stability of the conveying process. In some embodiments, the size of the cloth positioning jig 100 (see Figure 1) can be designed according to the distance L between the conveying rails 200 of the device performing surface adhesion technology, so as to facilitate the direct erection of the cloth positioning jig 100 on In a device that implements surface mount technology. Since the surface of the cloth 50 can be flattened by the configuration of the fixing member 115 and the heat treatment process, the electronic components can be accurately arranged on the cloth 50.

According to the above-mentioned embodiments of the present disclosure, the cloth positioning jig is used to accurately position the cloth, and since the surface of the cloth tends to be flat due to the arrangement of the fixing member and the heat treatment process, the printing process and the arrangement of the electronic components can be executed. More precise and stable.

Although this disclosure has been disclosed in the above manner, it is not intended to limit this disclosure. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, this disclosure is protected The scope shall be subject to the definition of the attached patent application scope.

100‧‧‧Fabric positioning fixture

110‧‧‧ Bakelite base

111‧‧‧Carrier Platform

113‧‧‧First groove

115‧‧‧Fixture

117‧‧‧Second Groove

119‧‧‧Positioning piece

120‧‧‧Press plate

121‧‧‧First positioning hole

130‧‧‧Printing board

131‧‧‧Second positioning hole

133‧‧‧Printing pattern

H‧‧‧Knockout area

D1‧‧‧First direction

W1, W2‧‧‧Width

Claims (9)

A cloth positioning jig, comprising: a bakelite base, the bakelite base comprising: a bearing platform configured to place the cloth; a first groove surrounding the bearing platform; and a fixing member configured on the first In the groove to fix the cloth; a pressing plate arranged on the bakelite base, wherein the pressing plate has a hollow area aligned with the carrying platform, and the width of the pressing plate is greater than the width of the bakelite base And a printed board, which is arranged on the pressing plate. The cloth positioning jig according to claim 1, wherein the bakelite base has a positioning piece, and the pressing plate has a first positioning hole, and the first positioning hole is detachably sleeved on the positioning piece To fix the pressing plate on the bakelite base. The cloth positioning jig according to claim 2, wherein the printing plate has a second positioning hole, and the second positioning hole is detachably sleeved on the positioning member to fix the printing plate On the pressure plate. The cloth positioning jig according to claim 1, wherein the bakelite base has a second groove configured to receive the cloth beyond the carrying platform. A manufacturing method of electronic cloth, comprising: providing the cloth positioning jig according to claim 1; fixing the cloth in the bakelite base; fixing the pressure plate on the bakelite base, Make the cloth exposed by the hollow area; heat the bakelite base on which the cloth is placed and the pressure plate, so that the surface of the cloth tends to be flat; fix the printing plate on the pressure plate , And perform at least one printing process to form conductive patterns and insulating patterns on the cloth; and arrange electronic components on the cloth through surface mount technology (SMT). The method for manufacturing electronic cloth according to claim 5, wherein fixing the cloth in the bakelite base includes: arranging the cloth on the carrying platform so that the cloth covers at least the second A groove; and the fixing member is arranged in the first groove to fix the cloth. The manufacturing method of electronic cloth according to claim 5, wherein the heating temperature of the bakelite base and the pressing plate on which the cloth is placed is between 110° C. and 140° C., and the heating time is between 5. Between minutes and 20 minutes. The manufacturing method of electronic cloth according to claim 5, further comprising arranging the cloth beyond the first groove in the second groove of the bakelite base. The manufacturing method of electronic cloth according to claim 5, further comprising arranging the pressing plate beyond the bakelite base on the conveying track of the device for performing the surface adhesion technology.

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