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TWI719280B - Lighting equipment - Google Patents

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Publication number
TWI719280B
TWI719280B TW107104222A TW107104222A TWI719280B TW I719280 B TWI719280 B TW I719280B TW 107104222 A TW107104222 A TW 107104222A TW 107104222 A TW107104222 A TW 107104222A TW I719280 B TWI719280 B TW I719280B
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light
substrate
circuit
cover
main surface
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TW107104222A
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Chinese (zh)
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TW201833477A (en
Inventor
車谷壽光
古川高司
杉浦友博
秋月徹人
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日商松下知識產權經營股份有限公司
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Priority claimed from JP2017026471A external-priority patent/JP6948612B2/en
Priority claimed from JP2017026469A external-priority patent/JP6945138B2/en
Priority claimed from JP2017026348A external-priority patent/JP6865375B2/en
Application filed by 日商松下知識產權經營股份有限公司 filed Critical 日商松下知識產權經營股份有限公司
Publication of TW201833477A publication Critical patent/TW201833477A/en
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Publication of TWI719280B publication Critical patent/TWI719280B/en

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本發明之課題係提供可實現薄型化之照明器具。 照明器具100包含有器具本體106、載置於器具本體106之基板11、配置於基板11之器具本體106側的相反側之第1主面11a的複數之發光元件20、配置於基板11之器具本體106側的第2主面11b並用以將發光用電力供至複數之發光元件20的電源電路90、接受來自外部之電源的電力之器具裝設部8(電性連接部)、連接器具裝設部8與電源電路90之電源電纜199;電源電纜199之一端部在第2主面11b側連接於電源電路90,另一端部在第1主面11a側與器具裝設部8連接。The subject of the present invention is to provide a lighting fixture that can be thinned. The lighting fixture 100 includes a fixture body 106, a substrate 11 placed on the fixture body 106, a plurality of light-emitting elements 20 arranged on the first main surface 11a on the side opposite to the fixture body 106 side of the substrate 11, and fixtures arranged on the substrate 11 The second main surface 11b on the side of the main body 106 is used to supply light-emitting power to the power supply circuit 90 of the plurality of light-emitting elements 20, the appliance installation portion 8 (electrical connection portion) that receives power from an external power source, and the connection appliance device The power supply cable 199 of the installation portion 8 and the power supply circuit 90; one end of the power supply cable 199 is connected to the power supply circuit 90 on the second main surface 11b side, and the other end is connected to the appliance installation portion 8 on the first main surface 11a side.

Description

照明器具Lighting fixtures

本發明係有關於一種具有LED(Light Emitting Diode:發光二極體)等發光元件之照明器具。The present invention relates to a lighting appliance with light-emitting elements such as LED (Light Emitting Diode).

以往,已知有一種例如配置於天花板之照明器具亦即吸頂燈。舉例而言,記載於專利文獻1之以往的吸頂燈包含有器具本體、用以將器具本體裝設於營造材之器具裝設部、支撐於器具本體之光源基板及電路基板。於光源基板安裝有複數之發光二極體(LED:Light Emitting Diode)。於電路基板安裝有構成用以使複數之LED各個點亮的點亮電路。In the past, there has been known, for example, a ceiling lamp, which is a lighting fixture arranged on a ceiling. For example, the conventional ceiling lamp described in Patent Document 1 includes an appliance main body, an appliance installation part for installing the appliance main body on a construction material, a light source substrate and a circuit board supported on the appliance main body. A plurality of light emitting diodes (LED: Light Emitting Diode) are mounted on the light source substrate. The circuit board is mounted with a lighting circuit configured to light each of the plural LEDs.

電路基板於器具本體以環狀方式配置成包圍器具裝設部之周圍。光源基板於器具本體以環狀方式配置成包圍電路基板之周圍。 [先前技術文獻] [專利文獻]The circuit board is arranged in a ring on the appliance body to surround the appliance installation part. The light source substrate is arranged in a ring shape on the appliance body to surround the periphery of the circuit substrate. [Prior Technical Document] [Patent Document]

[專利文獻1]日本特開2012-146666號公報[Patent Document 1] JP 2012-146666 A

[發明欲解決之問題] 組裝上述以往的吸頂燈之際,首先,進行將光源基板及電路基板分別對器具本體定位之定位作業後,需進行以引線連接光源基板與電路基板之配線作業。因此,不易使例如吸頂燈之組裝效率提高。[Problems to be Solved by the Invention] When assembling the above-mentioned conventional ceiling lamp, firstly, after positioning the light source substrate and the circuit substrate to the main body of the appliance, respectively, the wiring operation of connecting the light source substrate and the circuit substrate with leads is required. Therefore, it is not easy to improve the assembling efficiency of, for example, the ceiling lamp.

是故,亦考慮以1片基板實現光源基板與電路基板,此時,由於基板之背面存在例如電路零件、電路零件之引線或焊料等要件,故需要該等之收納空間。此收納空間之存在有可能是使照明器具之厚度增加的主要原因。Therefore, it is also considered to realize the light source substrate and the circuit substrate on a single substrate. In this case, since there are elements such as circuit parts, leads of the circuit parts, or solder on the back of the substrate, such storage space is required. The existence of this storage space may be the main reason for the increase in the thickness of the luminaire.

本發明之目的在於提供可實現薄型化之照明器具。 [解決問題之手段]The object of the present invention is to provide a lighting fixture that can be thinned. [Means to Solve the Problem]

為達成上述目的,本發明之照明器具的一態樣包含有器具本體、載置於器具本體之基板、配置於基板之器具本體側的相反側之第1主面的複數之發光元件、配置於基板之器具本體側的第2主面並用以將發光用電力供至複數之發光元件的電源電路、接受來自外部之電源的電力之電性連接部、連接電性連接部與電源電路之電源電纜;電源電纜之一端部在第2主面側連接於電源電路,另一端部在第1主面側與電性連接部連接。 [發明的功效]In order to achieve the above object, one aspect of the lighting fixture of the present invention includes a fixture body, a substrate placed on the fixture body, a plurality of light-emitting elements arranged on the first principal surface on the opposite side of the fixture body of the substrate, and arranged on The second main surface of the substrate on the main body side of the appliance is used to supply light-emitting power to the power circuit of a plurality of light-emitting elements, an electrical connection portion that receives power from an external power source, and a power cable that connects the electrical connection portion and the power circuit ; One end of the power cable is connected to the power circuit on the second main surface side, and the other end is connected to the electrical connection portion on the first main surface side. [Effect of Invention]

根據本發明,可提供能實現薄型化之照明器具。According to the present invention, it is possible to provide a lighting fixture that can be thinned.

[用以實施發明之形態][Form to implement invention]

以下,就實施形態,一面參照圖式,一面說明。此外,以下說明之實施形態為顯示本發明一具體例者。因而,在以下實施形態所示之數值、形狀、材料、構成要件、構成要件之配置位置及連接形態等為一例,並非限定本發明之主旨。是故,關於以下實施形態之構成要件中未記載於顯示本發明最上位概念之獨立請求項的構成要件,以任意之構成要件來說明。Hereinafter, the embodiment will be described with reference to the drawings. In addition, the embodiment described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements, etc. shown in the following embodiments are just examples, and do not limit the gist of the present invention. Therefore, regarding the constituent requirements of the following embodiments that are not described in the independent claim that shows the highest concept of the present invention, it will be described with arbitrary constituent requirements.

此外,各圖為示意圖,未必嚴密地顯示圖式。又,在各圖中,有對實質上相同之結構附上相同之符號而省略或簡略化重複之說明的情形。In addition, each figure is a schematic diagram, and the figure may not be shown strictly. In addition, in each figure, the same reference numerals are attached to substantially the same structures, and repeated descriptions may be omitted or simplified.

(實施形態) 以下,就實施形態之照明器具100作說明。(Embodiment) Hereinafter, the lighting fixture 100 of the embodiment will be described.

[照明器具之全體結構] 首先,一面參照圖1,一面就實施形態之照明器具100的全體結構作說明。圖1係實施形態之照明器具100的分解立體圖。[Entire structure of lighting fixture] First, referring to FIG. 1, the entire structure of the lighting fixture 100 of the embodiment will be described. Fig. 1 is an exploded perspective view of a lighting fixture 100 according to the embodiment.

如圖1所示,本實施形態之照明器具100係裝設於例如天花板之吸頂燈。此外,圖1之上方(Z軸正方向)相當於與天花板對向之地板面(圖中未示)的方向。亦即,圖1之照明器具100以與平常使用時上下相反之姿勢顯示。As shown in FIG. 1, the lighting fixture 100 of this embodiment is installed on, for example, a ceiling lamp of a ceiling. In addition, the upper side (positive direction of the Z-axis) in FIG. 1 corresponds to the direction of the floor surface (not shown in the figure) facing the ceiling. That is, the lighting fixture 100 of FIG. 1 is displayed in a posture that is opposite to that of normal use.

本實施形態之照明器具100包含有器具本體106、發光模組10、電路蓋150、光源蓋160、照明蓋140、及器具裝設部8。以下,就該等詳細地說明。The lighting fixture 100 of this embodiment includes a fixture body 106, a light emitting module 10, a circuit cover 150, a light source cover 160, a lighting cover 140, and a fixture installation portion 8. Hereinafter, these will be explained in detail.

[器具本體] 圖2係顯示實施形態之器具本體106、發光模組10、電路蓋150、光源蓋160之部分截面圖。具體而言,圖2係觀看在電路蓋150之切斷第2蓋152(後述)的位置之平行於YZ平面的切斷面之截面圖。[Apparatus body] Fig. 2 is a partial cross-sectional view showing the apparatus body 106, the light emitting module 10, the circuit cover 150, and the light source cover 160 of the embodiment. Specifically, FIG. 2 is a cross-sectional view of a cut surface parallel to the YZ plane at a position where the second cover 152 (described later) of the circuit cover 150 is cut.

如圖1及圖2所示,器具本體106形成圓盤狀,係使用例如鋁板或鋼板等板金製成之構件。於器具本體106配置發光模組10等之側的面例如塗佈有光反射率高之白色塗料或蒸鍍有反射性金屬材料。As shown in Figs. 1 and 2, the appliance body 106 is formed in a disc shape, and is a member made of sheet metal such as aluminum plate or steel plate. The surface on the side where the light-emitting module 10 and the like are arranged on the appliance body 106 is coated with a white paint with high light reflectivity or vapor-deposited with a reflective metal material, for example.

又,於器具本體106之中央部形成有圓形開口部,並形成有從該開口部之周緣延伸至發光模組10側的大約圓筒狀之支撐部126。支撐部126係以例如樹脂形成之構件,具有可與器具裝設部8嵌合之構造。於支撐部126並形成有從該支撐部126之前端部沿著軸方向延伸之縫隙狀插通部1261。於該插通部1261插通用以電性連接器具裝設部8與發光模組10之電源電纜199(參照圖7等)。In addition, a circular opening is formed in the central part of the appliance body 106, and an approximately cylindrical support 126 extending from the periphery of the opening to the side of the light-emitting module 10 is formed. The supporting portion 126 is a member formed of, for example, resin, and has a structure that can be fitted with the appliance mounting portion 8. The support portion 126 is formed with a slit-shaped insertion portion 1261 extending from the front end of the support portion 126 in the axial direction. A power cable 199 (refer to FIG. 7 and so on) that is used to electrically connect the appliance installation portion 8 and the light-emitting module 10 is inserted into the insertion portion 1261.

器具本體106具有最外周部1061、最內周部1062、及最外周部1061與最內周部1062之間的中間部1063。最外周部1061、最內周部1062及中間部1063全體形成3層環狀。The appliance body 106 has an outermost peripheral portion 1061, an innermost peripheral portion 1062, and an intermediate portion 1063 between the outermost peripheral portion 1061 and the innermost peripheral portion 1062. The outermost peripheral portion 1061, the innermost peripheral portion 1062, and the intermediate portion 1063 are all formed in a three-layer ring shape.

最外周部1061具有平坦之第1裝設面部1064、及在第1裝設面部1064之外周緣豎立設置之豎立設置部1065,該等遍及全周形成。於第1裝設面部1064裝設照明蓋140,豎立設置部1065從側邊覆蓋第1裝設面部1064與照明蓋140之交界而抑制漏光。The outermost peripheral portion 1061 has a flat first installation surface portion 1064 and an upright installation portion 1065 erected on the outer periphery of the first installation surface portion 1064, which are formed over the entire circumference. The illumination cover 140 is installed on the first installation surface 1064, and the erected portion 1065 covers the boundary between the first installation surface 1064 and the illumination cover 140 from the side to suppress light leakage.

在中間部1063,平坦之第2裝設面部1066、及從第1裝設面部1064延續至第2裝設面部1066之曲板部1067遍及全周形成。第2裝設面部1066平行於第1裝設面部1064,並配置於比該第1裝設面部1064靠近天花板之處(Z軸負方向)。於第2裝設面部1066裝設發光模組10。In the middle portion 1063, a flat second installation surface portion 1066 and a curved plate portion 1067 continuing from the first installation surface portion 1064 to the second installation surface portion 1066 are formed over the entire circumference. The second installation surface portion 1066 is parallel to the first installation surface portion 1064, and is arranged closer to the ceiling than the first installation surface portion 1064 (Z-axis negative direction). The light emitting module 10 is installed on the second installation surface 1066.

最內周部1062係與支撐部126相鄰之部位。於最內周部1062形成有呈對第2裝設面部1066凹陷之形狀的收納凹部1068。收納凹部1068之底面在Z軸方向配置於第1裝設面部1064與第2裝設面部1066之間。於此收納凹部1068收納發光模組10之電路零件80。亦即,由於在納入第1裝設面部1064與第2裝設面部1066之間的收納凹部1068收納了電路零件80,故可使器具本體106整體小型化。The innermost peripheral portion 1062 is a portion adjacent to the supporting portion 126. In the innermost peripheral portion 1062, a receiving recess 1068 having a shape recessed from the second installation surface 1066 is formed. The bottom surface of the accommodating recess 1068 is arranged between the first installation surface portion 1064 and the second installation surface portion 1066 in the Z-axis direction. The accommodating recess 1068 accommodates the circuit components 80 of the light-emitting module 10. In other words, since the circuit component 80 is accommodated in the accommodating recess 1068 that is included between the first installation surface portion 1064 and the second installation surface portion 1066, the entire appliance body 106 can be miniaturized.

[器具裝設部] 器具裝設部8藉插入至器具本體106之支撐部126的內部,而裝設於支撐部126。又,器具裝設部8裝卸自如地裝設於設置在天花板之天花板側裝設構件(省略圖示)。如此,藉器具裝設部8裝卸自如地裝設於天花板側裝設構件,器具本體106裝卸自如地裝設於天花板。此外,器具裝設部8亦兼進行天花板側裝設構件與照明器具100之電性連接。具體而言,天花板側裝設構件藉由電線(圖中未示)與配置於天花板之背面側的商用電源(圖中未示)電性連接。藉將照明器具100設置於天花板,來自商用電源之交流電力可經由天花板側裝設構件供至器具裝設部8。亦即,器具裝設部8係接受來自外部電源(商用電源)之電力的電性連接部。[Apparatus Installation Part] The appliance installation part 8 is inserted into the support part 126 of the appliance body 106 to be installed in the support part 126. In addition, the appliance installation portion 8 is detachably installed on a ceiling-side installation member (not shown) installed on the ceiling. In this way, the appliance main body 106 is detachably installed on the ceiling side installation member by the appliance installation part 8 and the appliance main body 106 is detachably installed on the ceiling. In addition, the appliance installation part 8 also performs electrical connection between the ceiling-side installation member and the lighting appliance 100. Specifically, the ceiling-side mounting member is electrically connected to a commercial power source (not shown in the figure) arranged on the back side of the ceiling through a wire (not shown in the figure). By installing the lighting appliance 100 on the ceiling, AC power from a commercial power source can be supplied to the appliance installation part 8 via the ceiling-side installation member. That is, the appliance installation part 8 is an electrical connection part that receives power from an external power source (commercial power source).

[發光模組] 圖3係從器具本體106側觀看實施形態之發光模組10的平面圖。圖4係從地板側觀看實施形態之發光模組10的平面圖。圖5係實施形態之發光模組10的側視圖。[Light-emitting module] FIG. 3 is a plan view of the light-emitting module 10 of the embodiment viewed from the side of the main body 106 of the apparatus. Fig. 4 is a plan view of the light emitting module 10 of the embodiment viewed from the floor side. FIG. 5 is a side view of the light emitting module 10 of the embodiment.

如圖3~圖5所示,發光模組10具有基板11、配置於基板11之複數的發光元件20、配置於基板11之1個以上(在本實施形態為複數個)之電路零件80。在此,以基板11之器具本體106側的相反側之主面為第1主面11a,以器具本體106側之主面為第2主面11b。亦即,第1主面11a朝向地板側,第2主面11b朝向天花板側。再者,於第1主面11a配置有複數之發光元件20,於第2主面11b配置有電路零件80。As shown in FIGS. 3 to 5, the light-emitting module 10 has a substrate 11, a plurality of light-emitting elements 20 arranged on the substrate 11, and one or more (a plurality of in this embodiment) circuit components 80 arranged on the substrate 11. Here, the main surface on the side opposite to the appliance body 106 side of the substrate 11 is referred to as the first main surface 11a, and the main surface on the appliance main body 106 side is referred to as the second main surface 11b. That is, the first main surface 11a faces the floor side, and the second main surface 11b faces the ceiling side. Furthermore, plural light emitting elements 20 are arranged on the first main surface 11a, and circuit components 80 are arranged on the second main surface 11b.

基板11俯視時(從基板11之厚度方向觀看基板11時)之外形為角被切斷的矩形,且於中央部形成有圓形開口部12。亦即,基板11呈環狀形狀。於開口部12之周圍形成有供電源電纜199貫穿基板11之切口狀貫穿口121。此外,貫穿口只要電源電纜199可貫穿,其形狀可為任何形狀。貫穿孔之其他形狀可舉孔狀等為例。又,貫穿孔之設置處亦可非開口部12之周圍。The outer shape of the substrate 11 in a plan view (when the substrate 11 is viewed from the thickness direction of the substrate 11) is a rectangle with cut corners, and a circular opening 12 is formed in the center. That is, the substrate 11 has a ring shape. A notch-shaped through hole 121 is formed around the opening 12 through which the power supply cable 199 penetrates the substrate 11. In addition, the shape of the through opening may be any shape as long as the power cable 199 can be penetrated. Other shapes of the through holes can be, for example, hole shapes. In addition, the location of the through hole may not be around the opening 12.

基板11可採用例如CEM3(Composite epoxy material-3:環氧樹脂複合材料)基板等玻璃複合基板、樹脂基板、陶瓷基板、或酚醛紙基板等。The substrate 11 may be a glass composite substrate such as a CEM3 (Composite epoxy material-3: epoxy composite material) substrate, a resin substrate, a ceramic substrate, or a phenolic paper substrate, or the like.

本實施形態之複數的發光元件20各為例如LED晶片封裝化之表面安裝型發光元件。即,發光模組10之安裝構造係LED晶片封裝化之LED元件安裝於基板11上之SMD(Surface Mount Device:表面安裝元件)構造。該等複數之發光元件20以回焊方式之焊接與設於第1主面11a之導體圖形(金屬配線)連接。亦即,複數之發光元件20以表面安裝技術安裝於基板11之第1主面11a的第2區域13b。具體而言,於基板11之第1主面11a的複數之安裝位置(應配置發光元件20之位置)塗佈膏狀焊料(亦稱為例如「焊膏」),並將複數之發光元件20配置成與各焊料接觸。之後,經由施加熱之製程(加熱製程)等,連接各發光元件20與設於第1主面11a之金屬配線。如此進行,而將複數之發光元件20以回焊方式焊接於基板11。Each of the plurality of light-emitting elements 20 in this embodiment is, for example, a surface-mounted light-emitting element in which an LED chip is packaged. That is, the mounting structure of the light-emitting module 10 is an SMD (Surface Mount Device) structure in which the LED element packaged by the LED chip is mounted on the substrate 11. The plurality of light-emitting elements 20 are connected to the conductor pattern (metal wiring) provided on the first main surface 11a by reflow soldering. That is, the plurality of light-emitting elements 20 are mounted on the second region 13b of the first main surface 11a of the substrate 11 by the surface mounting technology. Specifically, a plurality of mounting positions on the first main surface 11a of the substrate 11 (a position where the light-emitting elements 20 should be placed) is coated with cream solder (also referred to as "solder paste"), and the plurality of light-emitting elements 20 It is configured to be in contact with each solder. After that, through a process of applying heat (heating process), etc., each light-emitting element 20 is connected to the metal wiring provided on the first main surface 11a. In this way, the plurality of light-emitting elements 20 are soldered to the substrate 11 in a reflow method.

又,發光模組10具有之複數的發光元件20中,至少1個(在本實施形態為1個)為夜燈用發光元件20a,其他複數之發光元件20b為照明用發光元件20b。夜燈用發光元件20a係例如可使亮度、色溫至少1個比照明用發光元件20b低之LED元件。亦即,夜燈用發光元件20a可為具有亮度、色溫至少1個比照明用發光元件20b低的特性之發光元件,亦可為藉調光控制或調色控制使亮度、色溫至少1個比照明用發光元件20b低之發光元件。In addition, among the plurality of light-emitting elements 20 included in the light-emitting module 10, at least one (one in this embodiment) is a night light light-emitting element 20a, and the other plural light-emitting elements 20b are lighting light-emitting elements 20b. The light-emitting element 20a for night light is, for example, an LED element whose brightness and color temperature can be lower than that of the light-emitting element 20b for illumination. That is, the light-emitting element 20a for night light may be a light-emitting element having characteristics of brightness and color temperature lower than that of the light-emitting element 20b for illumination. A light-emitting element with a low light-emitting element 20b for lighting.

又,在本實施形態中,如圖4所示,於基板11之第2主面11b俯視時的中央部分(開口部12之周緣部分)之區域亦即第1區域13a配置有夜燈用發光元件20a。In addition, in this embodiment, as shown in FIG. 4, the first area 13a, which is the area of the central portion (peripheral portion of the opening portion 12) when the second main surface 11b of the substrate 11 is viewed in plan, is provided with a night light emitting device. Element 20a.

照明用發光元件20b係用於一般照明之LED元件。照明用之複數的發光元件20b包含例如色溫彼此不同之複數種發光元件20。The light-emitting element 20b for lighting is an LED element used for general lighting. The plural light-emitting elements 20b for illumination include, for example, plural kinds of light-emitting elements 20 having different color temperatures.

舉例而言,照明用之複數的發光元件20b亦可以色溫高之發光元件20b的群組(第1群組)、及色溫低之發光元件20b的群組(第2群組)構成。此時,亦可藉調整第1群組之發光元件20b及第2群組之發光元件20b各自的亮度、亦即調光控制,進行發光模組10發出之照明光的顏色之調整、亦即調色控制。For example, the plurality of light-emitting elements 20b for illumination may be composed of a group of light-emitting elements 20b with a high color temperature (first group) and a group of light-emitting elements 20b with a low color temperature (second group). At this time, it is also possible to adjust the brightness of each of the light-emitting elements 20b of the first group and the light-emitting elements 20b of the second group, that is, dimming control, to adjust the color of the illuminating light emitted by the light-emitting module 10, that is, Toning control.

又,在本實施形態中,如圖4所示,於基板11之第1主面11a的第1區域13a外周之區域亦即第2區域13b配置有照明用之複數的發光元件20b。Furthermore, in this embodiment, as shown in FIG. 4, a plurality of light-emitting elements 20b for illumination are arranged in the second area 13b, which is the area outside the first area 13a of the first main surface 11a of the substrate 11.

如圖4所示,該等複數之發光元件20b以環狀方式排列配置成包圍基板11之第1區域13a。此外,複數之發光元件20b的電性連接態樣只要與夜燈用發光元件20a獨立,並不特別限定。舉例而言,亦可形成複數個串聯之n(n為2以上之整數)個發光元件20b的群組(發光元件群),並將該等複數個發光元件群並聯。又,配置於基板11之所有發光元件20b亦可串聯。再者,在本實施形態中,以複數之發光元件20構成發光模組10之發光部25。As shown in FIG. 4, the plurality of light-emitting elements 20b are arranged in a ring-shaped manner to surround the first region 13a of the substrate 11. In addition, the electrical connection mode of the plurality of light-emitting elements 20b is not particularly limited as long as it is independent of the light-emitting element 20a for night light. For example, it is also possible to form a plurality of groups of n (n is an integer greater than or equal to 2) light-emitting elements 20b in series (light-emitting element groups), and connect the plurality of light-emitting element groups in parallel. In addition, all the light-emitting elements 20b arranged on the substrate 11 may also be connected in series. Furthermore, in this embodiment, a plurality of light-emitting elements 20 constitute the light-emitting portion 25 of the light-emitting module 10.

如圖3所示,基板11之第2主面11b的第1區域13a係配置有1個以上之電路零件80的區域。該1個以上之電路零件80係構成用於發光部25之動作(點亮、熄滅、調光率之變更等)的電路之至少一部分的零件。1個以上之電路零件80的高度高於發光元件20。在此,「高度」係指設置於基板11時自基板11算起的高度(Z軸方向之長度)。此外,設置於第2主面11b之電路零件80亦可高度皆不高於發光元件20。As shown in FIG. 3, the 1st area|region 13a of the 2nd main surface 11b of the board|substrate 11 is an area|region where one or more circuit components 80 are arrange|positioned. The one or more circuit components 80 constitute at least a part of the circuit used for the operation of the light emitting unit 25 (turning on, off, changing the dimming rate, etc.). The height of one or more circuit components 80 is higher than that of the light-emitting element 20. Here, the “height” refers to the height (the length in the Z-axis direction) from the substrate 11 when it is installed on the substrate 11. In addition, the height of the circuit components 80 disposed on the second main surface 11b may not be higher than that of the light-emitting element 20.

在本實施形態中,於第2主面11b之第1區域13a配置有複數之電路零件80,以該等複數之電路零件80構成將發光用電力供至發光部25之電源電路90。電源電路90以電源電纜199連接於器具裝設部8。此外,此「連接」包含電性連接及機械式連接。藉此,可將來自商用電源之交流電力經由器具裝設部8及電源電纜199供至電源電路90。由於電源電路90將交流電力轉換成適合發光部25之發光的直流電力來供給,故發光部25可發光。In this embodiment, a plurality of circuit components 80 are arranged in the first region 13a of the second main surface 11b, and the plurality of circuit components 80 constitute a power supply circuit 90 that supplies light-emitting power to the light-emitting unit 25. The power supply circuit 90 is connected to the appliance installation part 8 by a power supply cable 199. In addition, this "connection" includes electrical connection and mechanical connection. Thereby, AC power from a commercial power source can be supplied to the power supply circuit 90 via the appliance installation part 8 and the power cable 199. Since the power supply circuit 90 converts AC power into DC power suitable for the light emission of the light-emitting unit 25 and supplies it, the light-emitting unit 25 can emit light.

具體而言,電源電纜199以配置於基板11之貫穿口121內及支撐部126之插通部1261內的狀態,一端部連接於電源電路90,另一端部連接於器具裝設部8。於電源電纜199之另一端部設有對器具裝設部8裝卸自如之連接器(省略圖示)。又,如圖5所示,電源電纜199之一端部配置於第2主面11b側,另一端部配置於第1主面11a側。藉此,電源電纜199側視時與基板11疊合,可使電源電纜199之高度方向(Z軸方向)的設置空間小基板11之厚度量。Specifically, the power cable 199 is arranged in the through hole 121 of the substrate 11 and the insertion portion 1261 of the support portion 126, one end is connected to the power circuit 90, and the other end is connected to the appliance installation portion 8. The other end of the power cable 199 is provided with a connector (not shown) that can be detached from the appliance installation portion 8. Moreover, as shown in FIG. 5, one end part of the power supply cable 199 is arrange|positioned at the side of the 2nd main surface 11b, and the other end part is arrange|positioned at the side of the 1st main surface 11a. Thereby, the power cable 199 is superimposed on the substrate 11 when viewed from the side, and the installation space of the power cable 199 in the height direction (Z-axis direction) can be reduced by the thickness of the substrate 11.

構成電源電路90之複數的電路零件80分別係例如電解電容器或陶瓷電容器等電容元件、電阻元件、線圈元件、抗流線圈(抗流變壓器)、噪音濾波器、及二極體或積體電路元件等半導體元件等。The plural circuit components 80 constituting the power supply circuit 90 are capacitive elements such as electrolytic capacitors or ceramic capacitors, resistive elements, coil elements, choke coils (chance transformers), noise filters, and diodes or integrated circuit elements, respectively. And other semiconductor components.

在本實施形態中,僅於第1主面11a設有形成有圖形之金屬配線(圖中未示),複數之電路零件80對此金屬配線以流動方式之焊接連接。因此,配置於第2主面11b之複數的電路零件80係引線插入安裝型之引線零件(徑向引線零件或軸向引線零件)。第2主面11b上之各電路零件80其引線貫穿基板11並以焊料連接於第1主面11a之金屬配線。具體而言,從第2主面11b側將電路零件80之引線插入至基板11,並將從第1主面11a突出之引線浸於已熔解之焊料,藉此,連接電路零件80與設於第1主面11a之金屬配線。如此,當複數之引線插入安裝型電路零件80匯集於第2主面11b時,可以流動方式之焊接一併連接該等電路零件80之引線與第1主面11a之金屬配線。In this embodiment, only the first main surface 11a is provided with patterned metal wiring (not shown in the figure), and the plurality of circuit components 80 are connected to the metal wiring in a fluid manner by welding. Therefore, the plurality of circuit components 80 arranged on the second main surface 11b are lead components (radial lead components or axial lead components) of a lead-insertion mounting type. The lead of each circuit component 80 on the second main surface 11b penetrates the substrate 11 and is connected to the metal wiring of the first main surface 11a by solder. Specifically, the lead of the circuit component 80 is inserted into the substrate 11 from the second main surface 11b side, and the lead protruding from the first main surface 11a is immersed in the melted solder, thereby connecting the circuit component 80 with the Metal wiring on the first main surface 11a. In this way, when a plurality of lead inserts and mounting type circuit parts 80 are gathered on the second main surface 11b, the lead wires of the circuit parts 80 and the metal wiring of the first main surface 11a can be connected together by welding in a flow method.

此外,雖圖中未示,但於第1主面11a之第1區域13a亦安裝有表面安裝型電路零件。In addition, although not shown in the figure, surface mount circuit components are also mounted on the first area 13a of the first main surface 11a.

又,在圖3及圖4中以鏈線呈現之第1區域13a及第2區域13b的交界不需可目視辨認地顯示於基板11,且形狀亦不需為順著基板11之外形的形狀。舉例而言,亦可以俯視時外接於以複數之電路零件80構成的電源電路90之假想線規定第1區域13a與第2區域13b之交界。In addition, the boundary between the first area 13a and the second area 13b shown as a chain line in FIGS. 3 and 4 does not need to be displayed on the substrate 11 so that it can be visually recognized, and the shape does not need to be a shape that follows the outer shape of the substrate 11. . For example, it is also possible to define the boundary between the first area 13a and the second area 13b by an imaginary line circumscribing the power supply circuit 90 constituted by a plurality of circuit components 80 in a plan view.

[電路蓋] 圖6係顯示實施形態之發光模組10、電路蓋150、光源蓋160之分解立體圖圖。圖7係顯示實施形態之器具本體106、發光模組10、電路蓋150、光源蓋160的部分截面圖。圖7係觀看平行於YZ平面之切斷面的截面圖。[Circuit Cover] FIG. 6 is an exploded perspective view showing the light emitting module 10, the circuit cover 150, and the light source cover 160 of the embodiment. FIG. 7 is a partial cross-sectional view of the appliance body 106, the light-emitting module 10, the circuit cover 150, and the light source cover 160 of the embodiment. Figure 7 is a cross-sectional view of a cut plane parallel to the YZ plane.

如圖6及圖7所示,電路蓋150係從第1主面11a側覆蓋基板11之設有電源電路90的第1區域13a之構件。電路蓋150具有第1蓋151及第2蓋152,該等一體化地裝設於基板11。As shown in FIGS. 6 and 7, the circuit cover 150 is a member that covers the first region 13a of the substrate 11 where the power supply circuit 90 is provided from the side of the first main surface 11a. The circuit cover 150 has a first cover 151 and a second cover 152 which are integrally mounted on the substrate 11.

第1蓋151係覆蓋第1區域13a之夜燈用發光元件20a附近區域以外的構件。具體而言,第1蓋151俯視時形成一部分被切割出切口之環狀。於此切口部1515嵌入第2蓋152。於第1蓋151之中央形成有開口1511,於此開口1511內嵌入支撐部126。在第1蓋151之開口1511的外周之蓋部1512係形成為中空之部分,係實質地覆蓋基板11之第1區域13a的部分。此外,蓋部1512形成為從開口1511往外周緣逐漸朝向天花板側(Z軸方向負側)之錐狀。蓋部1512覆蓋電路零件80之焊接部及電源電纜199等。蓋部1512隔著基板11與器具本體106之收納凹部1068對向。再者,於第1蓋151之蓋部1512的外周側形成有以圖中未示之複數的螺絲固定於基板11之固定部1513。於固定部1513及蓋部1512形成有上述切口部1515。The first cover 151 is a member that covers the area other than the area near the light emitting element 20a for the night light in the first area 13a. Specifically, the first cover 151 is formed in a ring shape in which a part of the slit is cut when viewed in a plan view. The second cover 152 is fitted into this cutout 1515. An opening 1511 is formed in the center of the first cover 151, and the supporting portion 126 is embedded in the opening 1511. The lid portion 1512 on the outer periphery of the opening 1511 of the first lid 151 is formed as a hollow portion, which substantially covers the first region 13a of the substrate 11. In addition, the cover 1512 is formed in a tapered shape gradually toward the ceiling side (the negative side in the Z-axis direction) from the opening 1511 toward the outer periphery. The cover 1512 covers the welding part of the circuit component 80, the power cable 199, and the like. The cover 1512 is opposed to the receiving recess 1068 of the appliance body 106 with the substrate 11 interposed therebetween. Furthermore, a fixing portion 1513 that is fixed to the substrate 11 with a plurality of screws (not shown in the figure) is formed on the outer peripheral side of the cover portion 1512 of the first cover 151. The above-mentioned notch part 1515 is formed in the fixing part 1513 and the cover part 1512.

第1蓋151在本實施形態中以鐵或鋁等金屬形成,具不燃性。又,形成第1蓋151之外側面的部分具有反射從發光部25發出之光的反射面之功能。In this embodiment, the first cover 151 is formed of metal such as iron or aluminum, and is non-flammable. In addition, the portion forming the outer side surface of the first cover 151 has a function of a reflective surface that reflects the light emitted from the light emitting portion 25.

第2蓋152係包圍夜燈用發光元件20a之周圍的構件。第2蓋152以難燃性樹脂形成。具體而言,第2蓋152具有基台部1521及壁部1522。基台部1521形成平板狀,並配置成對基板11平行。基台部1521俯視時形成可嵌入至第1蓋151之切口部1515之形狀。再者,於基台部1521形成有用以使夜燈用發光元件20a露出之俯視呈圓形的開口1523。The second cover 152 is a member that surrounds the night light emitting element 20a. The second cover 152 is formed of flame-retardant resin. Specifically, the second cover 152 has a base portion 1521 and a wall portion 1522. The base portion 1521 is formed in a flat plate shape and is arranged in parallel to the substrate 11. The base portion 1521 has a shape that can be fitted into the cutout portion 1515 of the first cover 151 in a plan view. Furthermore, an opening 1523 having a circular shape in plan view for exposing the night light emitting element 20a is formed in the base portion 1521.

壁部1522從基台部1521之外側的一邊以外之三邊豎立設置。壁部1522豎立設置成沿著蓋部1512之切口部1515,而堵塞切口部1515。亦即,防止從發光部25發出之光從切口部1515入射至第1蓋151內。The wall portion 1522 is erected on three sides other than one side on the outer side of the base portion 1521. The wall portion 1522 is erected to be along the cut portion 1515 of the cover portion 1512 and block the cut portion 1515. That is, the light emitted from the light emitting part 25 is prevented from entering the first cover 151 from the cutout part 1515.

在此,例示了第1蓋151為金屬製,第2蓋152為樹脂製的情形。然而,亦可第1蓋151為樹脂製,第2蓋152為金屬製。又,第1蓋151與第2蓋152亦可兩者皆為金屬製,也亦可兩者皆為樹脂製。Here, the case where the first cover 151 is made of metal and the second cover 152 is made of resin is exemplified. However, the first cover 151 may be made of resin and the second cover 152 may be made of metal. In addition, the first cover 151 and the second cover 152 may both be made of metal, or both may be made of resin.

又,亦可於電路蓋150之內側配置有例如樹脂製之絕緣片。藉此,可使電路蓋150之內面靠近電路蓋150內部之電路零件80,結果,可謀求電路蓋150之小型化。In addition, an insulating sheet made of resin, for example, may be arranged inside the circuit cover 150. Thereby, the inner surface of the circuit cover 150 can be made close to the circuit components 80 inside the circuit cover 150, and as a result, the miniaturization of the circuit cover 150 can be achieved.

[光源蓋] 如圖6及圖2所示,光源蓋160係覆蓋發光模組10之複數的發光元件20之構件,以具有透光性(例如透明)之樹脂等形成。光源蓋160形成圈狀,以包圍電路蓋150之周圍且覆蓋配置成環狀之複數的發光元件20之狀態,固定於發光模組10之第1主面11a。具體而言,光源蓋160具有成一體之第1透光蓋161及第2透光蓋162,該第1透光蓋在第1主面11a側覆蓋複數之照明用發光元件20b,該第2透光蓋在第1主面側11a覆蓋夜燈用發光元件20a。[Light source cover] As shown in FIGS. 6 and 2, the light source cover 160 is a member that covers the plurality of light-emitting elements 20 of the light-emitting module 10, and is formed of light-transmitting (for example, transparent) resin or the like. The light source cover 160 is formed in a ring shape and is fixed to the first main surface 11 a of the light emitting module 10 in a state of surrounding the circuit cover 150 and covering the plurality of light emitting elements 20 arranged in a ring shape. Specifically, the light source cover 160 has a first light-transmitting cover 161 and a second light-transmitting cover 162 that are integrated. The first light-transmitting cover covers the plurality of lighting light-emitting elements 20b on the first main surface 11a side. The light-transmitting cover covers the night light emitting element 20a on the first main surface side 11a.

第1透光蓋161係光源蓋160之環狀部分,具有複數之透鏡1611。複數之透鏡1611與複數之發光元件20b一對一對應而設。透鏡1611可將例如來自對應之發光元件20b的光之配光角擴大。即,透鏡1611具有使光發散之功能。如此,藉將透鏡1611對應各發光元件20b來配置,可精密地控制例如來自複數之發光元件20b各自的光之擴散。The first translucent cover 161 is a ring-shaped part of the light source cover 160 and has a plurality of lenses 1611. The plural lenses 1611 are provided in one-to-one correspondence with the plural light-emitting elements 20b. The lens 1611 can expand, for example, the light distribution angle of the light from the corresponding light emitting element 20b. That is, the lens 1611 has a function of diverging light. In this way, by arranging the lens 1611 corresponding to each light-emitting element 20b, it is possible to precisely control the diffusion of light from each of the plurality of light-emitting elements 20b, for example.

第2透光蓋162係從第1透光蓋161之內緣往內側突出之部分。第2透光蓋162藉與第2蓋152之基台部1521對向配置,而覆蓋夜燈用發光元件20a。第2透光蓋162具有透鏡1621,而可將來自夜燈用發光元件20a之光的配光角擴大。即,透鏡1621具有使光發散的功能。The second light-transmitting cover 162 is a part protruding inward from the inner edge of the first light-transmitting cover 161. The second light-transmitting cover 162 is arranged to face the base portion 1521 of the second cover 152 to cover the night light emitting element 20a. The second translucent cover 162 has a lens 1621, and can expand the light distribution angle of the light from the night light emitting element 20a. That is, the lens 1621 has a function of diverging light.

此外,第1透光蓋161及第2透光蓋162亦可不具透鏡1611、1621。又,亦可以具光擴散性之原材料(例如乳白色樹脂)形成光源蓋160整體。此時,可以光擴散性原材料形成光源蓋160整體,亦可以光擴散性原材料形成第1透光蓋161及第2透光蓋162其中一者,於另一者形成透鏡。又,第1透光蓋161及第2透光蓋162亦可獨立分開。此外,第1透光蓋161及第2透光蓋162比起以具有光擴散性之原材料形成的情形,具有透鏡之構造可較薄。In addition, the first transparent cover 161 and the second transparent cover 162 may not have the lenses 1611 and 1621. In addition, a light-diffusing material (for example, milky white resin) may be used to form the entire light source cover 160. At this time, the light diffusive material may be used to form the entire light source cover 160, or the light diffusive material may be used to form one of the first transparent cover 161 and the second transparent cover 162, and a lens may be formed on the other. In addition, the first light-transmitting cover 161 and the second light-transmitting cover 162 may be independently separated. In addition, the first light-transmitting cover 161 and the second light-transmitting cover 162 can be made thinner with a lens structure than when they are formed of a material having light diffusivity.

[照明蓋] 照明蓋140係覆蓋器具本體106裝設有發光模組10等之側的構件,以具透光性之樹脂形成。照明蓋140以例如乳白色之樹脂形成,可將來自各發光元件20之光擴散後射出至外部。又,照明蓋140對例如器具本體106裝卸自如地裝設。[Illumination Cover] The illumination cover 140 is a member covering the side of the appliance body 106 on which the light emitting module 10 and the like are installed, and is formed of a translucent resin. The lighting cover 140 is formed of, for example, milky white resin, and can diffuse the light from each light-emitting element 20 and emit it to the outside. In addition, the lighting cover 140 is detachably attached to the appliance body 106, for example.

[效果等] 如以上,根據本實施形態,照明器具100包含有器具本體106、載置於器具本體106之基板11、配置於基板11之器具本體106側的相反側之第1主面11a的複數之發光元件20、配置於基板11之器具本體106側的第2主面11b並用以將發光用電力供至複數之發光元件20的電源電路90、連接於外部之電源的器具裝設部8(電性連接部)、連接器具裝設部8與電源電路90之電源電纜199;電源電纜199之一端部在第2主面11b側連接於電源電路90,另一端部在第1主面11a側與器具裝設部8連接。[Effects etc.] As described above, according to the present embodiment, the lighting fixture 100 includes the fixture body 106, the substrate 11 placed on the fixture body 106, and the first main surface 11a disposed on the opposite side of the substrate 11 from the fixture body 106 side. A plurality of light-emitting elements 20, a power supply circuit 90 arranged on the second main surface 11b on the side of the appliance body 106 of the substrate 11 and used for supplying light-emitting power to the plurality of light-emitting elements 20, and an appliance mounting portion 8 connected to an external power source (Electrical connection part), a power cable 199 connecting the appliance installation part 8 and the power circuit 90; one end of the power cable 199 is connected to the power circuit 90 on the second main surface 11b side, and the other end is on the first main surface 11a The side is connected to the appliance installation part 8.

根據此結構,由於電源電纜199之一端部配置於第2主面11b側,另一端部配置於第1主面11a側,故側視基板11時,電源電纜199之一部分與基板11重疊。藉此,可使電源電纜199之高度方向(Z軸方向)的設置空間小基板11之厚度量。According to this structure, since one end of the power cable 199 is arranged on the second main surface 11b side and the other end is arranged on the first main surface 11a side, when the substrate 11 is viewed from the side, a part of the power cable 199 overlaps the substrate 11. As a result, the installation space of the power cable 199 in the height direction (Z-axis direction) can be reduced by the thickness of the substrate 11.

又,電源電纜199雖具可撓性,但由於柔軟性並沒那麼大,故不易使其變形,而需充分確保電源電纜199之佈線空間(設置空間)。如上述,電源電纜199之一端部配置於第2主面11b側,另一端部配置於第1主面11a側時,可使用基板11之第1主面11a側及第2主面11b側各作為佈線空間。舉例而言,比起僅於基板11之第1主面11a側配置電源電纜199之情形,可使第1主面11a側的佈線空間較小。In addition, although the power cable 199 is flexible, it is not easily deformed because it is not so flexible. Therefore, it is necessary to sufficiently ensure a wiring space (installation space) of the power cable 199. As described above, when one end of the power cable 199 is arranged on the second main surface 11b side and the other end is arranged on the first main surface 11a side, each of the first main surface 11a side and the second main surface 11b side of the substrate 11 can be used. As a wiring space. For example, compared to the case where the power cable 199 is arranged only on the first main surface 11a side of the substrate 11, the wiring space on the first main surface 11a side can be made smaller.

再者,電源電纜199之佈線空間亦是決定照明器具100之厚度的因素之一,只要可使此佈線空間小,便亦可使照明器具100自身之厚度薄。Furthermore, the wiring space of the power cable 199 is also one of the factors that determine the thickness of the lighting fixture 100. As long as the wiring space can be made small, the thickness of the lighting fixture 100 itself can also be made thin.

又,照明器具100更包含有從第1主面11a側覆蓋基板11設置有電源電路90之區域(第1區域13a)的電路蓋150,電源電纜199收納於電路蓋150內。In addition, the lighting fixture 100 further includes a circuit cover 150 covering the area (first area 13a) of the substrate 11 where the power supply circuit 90 is provided from the first main surface 11a side, and the power supply cable 199 is housed in the circuit cover 150.

根據此結構,由於可使電源電纜199之佈線空間小,故可使收納電源電纜199之電路蓋150薄。電路蓋150亦是決定照明器具100之厚度的因素之一,藉使此電路蓋150自身為薄型,亦可使照明器具100自身之厚度薄。According to this structure, since the wiring space of the power cable 199 can be made small, the circuit cover 150 for storing the power cable 199 can be made thin. The circuit cover 150 is also one of the factors that determine the thickness of the lighting fixture 100. If the circuit cover 150 itself is thin, the thickness of the lighting fixture 100 itself can also be made thin.

又,照明器具100包含有在第1主面11a側覆蓋複數之發光元件20的光源蓋160,光源蓋160具有使光擴散之透鏡1611、1621。In addition, the lighting fixture 100 includes a light source cover 160 covering a plurality of light emitting elements 20 on the first main surface 11a side, and the light source cover 160 has lenses 1611, 1621 that diffuse light.

根據此結構,可以光源蓋160所具有之透鏡1611、1621使光擴散。因而,比起以具有光擴散性之原材料形成光源蓋160之情形,可使光源蓋160薄,而可謀求照明器具100自身之薄型化。According to this structure, the lenses 1611 and 1621 included in the light source cover 160 can diffuse light. Therefore, compared to the case where the light source cover 160 is formed of a material having light diffusivity, the light source cover 160 can be made thinner, and the luminaire 100 itself can be made thinner.

又,於基板11形成有供電源電纜199貫穿該基板11之貫穿口121。In addition, a through hole 121 through which a power supply cable 199 passes through the substrate 11 is formed on the substrate 11.

根據此結構,由於電源電纜199經由貫穿口121貫穿基板11,故可使電源電纜199緊緻地貫穿基板11。亦可以貫穿口121限制電源電纜199之移動。According to this structure, since the power cable 199 penetrates the substrate 11 through the through opening 121, the power cable 199 can be tightly penetrated through the substrate 11. It is also possible to restrict the movement of the power cable 199 through the opening 121.

又,於基板11之器具本體106側的第2主面11b配置有高度比發光元件20高之1個以上的電路零件80,電路蓋150從第1主面11a側覆蓋基板11設置有該1個以上之電路零件80的區域(第1區域13a)。In addition, one or more circuit components 80 having a height higher than the light emitting element 20 are arranged on the second main surface 11b on the side of the appliance body 106 of the substrate 11, and the circuit cover 150 covers the substrate 11 from the side of the first main surface 11a. A region of more than one circuit component 80 (first region 13a).

根據此結構,由於高度比發光元件20高之電路零件80配置於基板11之第2主面11b,故亦可不以電路蓋150覆蓋該電路零件80。因此,電路蓋150之高度可不考慮電路零件80之高度而設定。亦即,只要電路蓋150為配合以該電路蓋150覆蓋之零件的高度即可,而可使高度比覆蓋電路零件80時低。電路蓋150亦是決定照明器具100之厚度的因素之一,藉使此電路蓋150自身薄型,亦可使照明器具100自身之厚度薄。According to this structure, since the circuit component 80 having a height higher than that of the light-emitting element 20 is arranged on the second main surface 11 b of the substrate 11, the circuit component 80 may not be covered with the circuit cover 150. Therefore, the height of the circuit cover 150 can be set regardless of the height of the circuit component 80. That is, as long as the circuit cover 150 matches the height of the parts covered by the circuit cover 150, the height can be made lower than when the circuit parts 80 are covered. The circuit cover 150 is also one of the factors that determine the thickness of the lighting fixture 100. If the circuit cover 150 itself is thin, the thickness of the lighting fixture 100 can also be made thinner.

再者,當電路蓋150薄型化時,由於電路蓋150不易遮住發光元件20發出之光,故可均等地照明周圍。Furthermore, when the circuit cover 150 is thinned, since the circuit cover 150 cannot easily shield the light emitted by the light-emitting element 20, it can illuminate the surroundings evenly.

由於在基板11之第1主面11a配置有發光元件20,在第2主面11b配置有電路零件80,故發光元件20與電路零件80隔著基板11配置。因此,發光元件20及電路零件80其中一者發出之熱不易傳遞至另一者。因而,可抑制兩者間之熱的影響。Since the light-emitting element 20 is arranged on the first main surface 11 a of the substrate 11 and the circuit component 80 is arranged on the second main surface 11 b, the light-emitting element 20 and the circuit component 80 are arranged with the substrate 11 interposed therebetween. Therefore, the heat generated by one of the light-emitting element 20 and the circuit component 80 is not easily transferred to the other. Therefore, the influence of heat between the two can be suppressed.

此外,在本實施形態中,例示了未於基板11之第1區域13a的第1主面11a安裝電路零件80之情形。然而,亦可於第1區域13a之第1主面11a亦安裝電路零件。此時,使該電路零件高度低於第2主面11b側之電路零件80中高度最高的電路零件。藉此,可抑制防礙電路蓋150之薄型化。In addition, in this embodiment, the case where the circuit component 80 is not mounted on the 1st main surface 11a of the 1st area|region 13a of the board|substrate 11 is illustrated. However, circuit components may also be mounted on the first main surface 11a of the first area 13a. At this time, the height of the circuit component is lower than the circuit component having the highest height among the circuit components 80 on the second main surface 11b side. Thereby, the obstruction of the thinning of the circuit cover 150 can be suppressed.

又,於器具本體106形成有收納1個以上之電路零件80的收納凹部。In addition, a storage recess in which one or more circuit components 80 are stored is formed in the appliance main body 106.

根據此結構,由於器具本體106之收納凹部1068收納有1個以上之電路零件80,故可保護該電路零件80。According to this structure, since one or more circuit components 80 are accommodated in the accommodating recess 1068 of the appliance body 106, the circuit components 80 can be protected.

又,1個以上之電路零件80構成電源電路90。In addition, one or more circuit components 80 constitute a power supply circuit 90.

根據此結構,於1片基板11配置有複數之發光元件20及電源電路90。因此,相較於例如具有發光部之光源基板與具有電源電路之電路基板為獨立分開之情形,不需要將零件安裝於電路基板後從電路基板切掉用於安裝之際的位置限制等之部分的製程。此點從例如照明器具100之製造效率的提高或製造成本之抑制的觀點而言是有利的。According to this structure, a plurality of light-emitting elements 20 and power supply circuits 90 are arranged on one substrate 11. Therefore, compared to the case where the light source board with the light-emitting part and the circuit board with the power supply circuit are separated separately, there is no need to cut the part from the circuit board for the position restriction during installation after the parts are mounted on the circuit board. The manufacturing process. This point is advantageous from the viewpoint of, for example, the improvement of the manufacturing efficiency of the lighting fixture 100 or the suppression of the manufacturing cost.

又,1個以上之電路零件為引入安裝型引線零件。Also, one or more circuit parts are lead-in type lead parts.

根據此結構,可將複數之引入安裝型電路零件80匯集於第2主面11b。藉此,可以流動方式之焊接將複數之電路零件80的引線與第1主面11a之金屬配線一併連接。According to this structure, a plurality of lead-in type circuit components 80 can be collected on the second main surface 11b. Thereby, the lead wires of a plurality of circuit components 80 and the metal wiring of the first main surface 11a can be connected together by welding in a flow method.

又,複數之發光元件20係表面安裝型發光元件,複數之發光元件20中至少1個係夜燈用發光元件20a。In addition, the plurality of light-emitting elements 20 are surface-mounted light-emitting elements, and at least one of the plurality of light-emitting elements 20 is a light-emitting element 20a for a night light.

根據此結構,由於夜燈用發光元件20a係表面安裝型發光元件,故比起所謂之砲彈型發光元件,可使夜燈用發光元件20a薄。夜燈用發光元件20a係決定照明器具100之厚度的因素之一,藉使此夜燈用發光元件20a自身為薄型,亦可使照明器具100自身之厚度薄。According to this structure, since the light-emitting element 20a for a night light is a surface-mounted light-emitting element, the light-emitting element 20a for a night light can be made thinner than a so-called cannonball-type light-emitting element. The night light emitting element 20a is one of the factors that determine the thickness of the lighting fixture 100. If the night light emitting element 20a itself is thin, the thickness of the lighting fixture 100 itself can also be made thin.

又,砲彈型發光元件有該發光元件倒塌而對外形美觀度造成不良影響之虞,在本實施形態中,由於夜燈用發光元件20a係表面安裝型發光元件,故夜燈用發光元件20a不致倒塌。亦即,可抑制對外形美觀度之不良影響。In addition, the cannonball-type light-emitting element may collapse and adversely affect the appearance. In this embodiment, since the light-emitting element 20a for night light is a surface-mounted light-emitting element, the light-emitting element 20a for night light is not collapse. That is, it is possible to suppress adverse effects on the aesthetics of the appearance.

又,複數之發光元件20中不同於夜燈用發光元件20a之其他發光元件20b配置於比夜燈用發光元件20a靠近基板11俯視時的外側之處。In addition, among the plurality of light-emitting elements 20, the other light-emitting element 20b, which is different from the night-light light-emitting element 20a, is arranged closer to the outside of the substrate 11 when viewed from the top than the night-light light-emitting element 20a.

根據此結構,由於其他之發光元件20b配置於比夜燈用發光元件20a靠近基板11俯視時的外側之處,故可使其他之發光元件20b與夜燈用發光元件20a之間隔大。其他之發光元件20b與夜燈用發光元件20a之電壓差因安全性之觀點而有大之情形。因此,當其他之發光元件20b與夜燈用發光元件20a之間隔小時,有因其電壓差而產生短路之虞。然而,如上述,若可使其他之發光元件20b與夜燈用發光元件20a之間隔大,便可抑制短路之產生。According to this structure, since the other light emitting element 20b is arranged closer to the outer side of the substrate 11 than the night light light emitting element 20a when viewed in plan, the distance between the other light emitting element 20b and the night light light emitting element 20a can be made larger. The voltage difference between the other light emitting element 20b and the night light light emitting element 20a may be large from the viewpoint of safety. Therefore, when the interval between the other light-emitting element 20b and the night-light light-emitting element 20a is small, there is a risk of a short circuit due to the voltage difference. However, as described above, if the distance between the other light-emitting element 20b and the night-light light-emitting element 20a can be made larger, the occurrence of a short circuit can be suppressed.

又,照明器具100更包含有在第1主面11a側覆蓋其他之發光元件20b的第1透光蓋161、在第1主面11a側覆蓋夜燈用發光元件20a之第2透光蓋162。In addition, the lighting fixture 100 further includes a first translucent cover 161 covering the other light-emitting elements 20b on the first main surface 11a side, and a second translucent cover 162 covering the night light light-emitting elements 20a on the first main surface 11a side. .

根據此結構,當夜燈用發光元件20a薄時,亦可使覆蓋此之第2透光蓋162薄。在第2透光蓋162這方面亦為決定照明器具100之厚度的因素之一,故藉使第2透光蓋162薄型,可使照明器具100自身之厚度更薄。According to this structure, when the night light emitting element 20a is thin, the second light-transmitting cover 162 covering the light-emitting element 20a can also be thin. The second transparent cover 162 is also one of the factors that determine the thickness of the lighting fixture 100. Therefore, by making the second transparent cover 162 thinner, the thickness of the lighting fixture 100 itself can be made thinner.

又,第1透光蓋161具有使光擴散之透鏡1611。In addition, the first translucent cover 161 has a lens 1611 that diffuses light.

根據此結構,可以第1透光蓋161所具有之透鏡1611使光擴散。因而,比起以具有光擴散性之原材料形成第1透光蓋161之情形,可使第1透光蓋161薄,而可謀求照明器具100自身之薄型化。According to this structure, the lens 1611 included in the first translucent cover 161 can diffuse light. Therefore, compared with a case where the first light-transmitting cover 161 is formed of a material having light diffusibility, the first light-transmitting cover 161 can be made thinner, and the lighting fixture 100 itself can be made thinner.

又,第2透光蓋162具有使光擴散之透鏡1621。In addition, the second translucent cover 162 has a lens 1621 that diffuses light.

根據此結構,可以第2透光蓋162所具有之透鏡1621使光擴散。因而,比起以具有光擴散性之原材料形成第2透光蓋162之情形,可使第2透光蓋162薄,而可謀求照明器具100自身之薄型化。According to this structure, the lens 1621 included in the second light-transmitting cover 162 can diffuse light. Therefore, compared to the case where the second light-transmitting cover 162 is formed of a material having light diffusibility, the second light-transmitting cover 162 can be made thinner, and the lighting fixture 100 itself can be made thinner.

又,第1透光蓋161與第2透光蓋162一體化。In addition, the first light-transmitting cover 161 and the second light-transmitting cover 162 are integrated.

根據此結構,由於第1透光蓋161與第2透光蓋162一體化,故可刪減零件件數。又,亦可抑制照明器具100整體之重量。According to this structure, since the first light-transmitting cover 161 and the second light-transmitting cover 162 are integrated, the number of parts can be reduced. In addition, the weight of the entire luminaire 100 can also be suppressed.

(其他實施形態) 以上,就本發明依據實施形態作了說明,本發明不限於上述實施形態。此外,在之後的說明中,有與上述實施形態相同之部分附上相同之符號而省略其說明之情形。(Other Embodiments) As mentioned above, the present invention has been described based on the embodiments, but the present invention is not limited to the above-mentioned embodiments. In addition, in the following description, the same parts as those in the above-mentioned embodiment are given the same reference numerals and their descriptions may be omitted.

舉例而言,在上述實施形態中,例示了夜燈用發光元件20a配置於第1區域13a,其他之發光元件20b配置於第2區域13b之情形,亦可將夜燈用發光元件20a與其他之發光元件20b配置於第2區域13b。For example, in the above-mentioned embodiment, the case where the light-emitting element 20a for night light is arranged in the first area 13a and the other light-emitting element 20b is arranged in the second area 13b is illustrated. The light-emitting element 20a for night light and other light-emitting elements 20a may be arranged in the second area 13b. The light-emitting element 20b is arranged in the second region 13b.

圖8係顯示變形例之基板11C的概略結構之放大圖。如圖8所示,在變形例之基板11C中,夜燈用發光元件20a與其他之發光元件20b配置於第2區域13b。再者,在基板11C,於夜燈用發光元件20a與其他之發光元件20b之間形成有1對縫隙111。以此1對縫隙111確保了夜燈用發光元件20a與其他之發光元件20b的絕緣距離。藉此,可抑制因夜燈用發光元件20a與其他之發光元件20b的電壓差引起之短路。此外,縫隙111之寬度亦可為不致因夜燈用發光元件20a與其他之發光元件20b的電壓差而產生放電之寬度。此外,只要充分保持夜燈用發光元件20a與其他之發光元件20b的間隔,亦可不設縫隙111。FIG. 8 is an enlarged view showing a schematic structure of a substrate 11C of a modification example. As shown in FIG. 8, in the substrate 11C of the modified example, the night light light-emitting element 20a and the other light-emitting elements 20b are arranged in the second region 13b. Furthermore, in the substrate 11C, a pair of slits 111 are formed between the night light emitting element 20a and the other light emitting element 20b. With this pair of slits 111, the insulation distance between the night light emitting element 20a and the other light emitting elements 20b is ensured. Thereby, the short circuit caused by the voltage difference between the light-emitting element 20a for night light and the other light-emitting element 20b can be suppressed. In addition, the width of the slit 111 may also be a width that does not cause discharge due to the voltage difference between the night light light emitting element 20a and other light emitting elements 20b. In addition, as long as the space between the night light emitting element 20a and the other light emitting elements 20b is sufficiently maintained, the slit 111 may not be provided.

又,發光模組10之基板11除了在上述實施形態所例示之玻璃複合基板及樹脂基板以外,亦可採用例如由表面塗覆有樹脂之金屬材料構成的金屬基底基板。此時,例如以表面安裝技術安裝於基板11之第1主面11a的複數之發光元件20及複數之電路零件80的熱以良好效率經由基板11傳導至器具本體106。In addition, the substrate 11 of the light-emitting module 10 can also be a metal base substrate made of a metal material coated with resin on the surface, in addition to the glass composite substrate and the resin substrate exemplified in the above embodiment. At this time, for example, the heat of the plurality of light-emitting elements 20 and the plurality of circuit components 80 mounted on the first main surface 11a of the substrate 11 by surface mounting technology is conducted to the appliance body 106 via the substrate 11 with good efficiency.

又,基板11之外形不限例如圖3所示之外形。舉例而言,發光模組10亦可具有中央具開口部之圓環狀基板11。In addition, the outer shape of the substrate 11 is not limited to, for example, the outer shape shown in FIG. 3. For example, the light-emitting module 10 may also have an annular substrate 11 with an opening in the center.

又,器具本體106之外形亦不限圖1等所示之外形。器具本體106例如俯視時可呈矩形等多角形之外形,亦可呈由直線及曲線構成之外形。In addition, the outer shape of the appliance body 106 is not limited to the outer shape shown in FIG. 1 and the like. For example, the appliance body 106 may have a polygonal outer shape such as a rectangle when viewed from above, or may have an outer shape composed of straight lines and curves.

又,配置於基板11之1個以上的電路零件80亦可構成不同於電源電路90之種類的電路(電子電路)。舉例而言,根據從照明器具100之外部發送的信號,將複數之發光元件20進行調光控制或調色控制之控制電路亦可以該1個以上之電路零件80構成。又,電源電路90亦可包含上述控制電路。In addition, one or more circuit components 80 arranged on the substrate 11 may constitute a circuit (electronic circuit) of a different type from the power supply circuit 90. For example, according to a signal sent from the outside of the luminaire 100, a control circuit that performs dimming control or color adjustment control on a plurality of light-emitting elements 20 may also be constituted by the one or more circuit components 80. In addition, the power supply circuit 90 may include the above-mentioned control circuit.

又,在上述實施形態及變形例中,發光元件20以LED晶片封裝化之LED元件為例示。然而,亦可採用半導體雷射等半導體發光元件、或者有機EL(Electro Luminescence:電激發光)或無機EL等之EL元件等其他種類的固體發光元件作為發光元件20。In addition, in the above-mentioned embodiments and modifications, the light-emitting element 20 is an LED element packaged with an LED chip as an example. However, semiconductor light-emitting elements such as semiconductor lasers, or other types of solid-state light-emitting elements, such as organic EL (Electro Luminescence) or inorganic EL elements, can also be used as the light-emitting element 20.

此外,對上述實施形態及其變形例施行該業者想出來之各種變形而得出的形態、及藉在不脫離本發明之旨趣的範圍任意地組合各實施形態及其變形例的構成要件及功能而實現的形態亦包含在本發明內。In addition, the above-mentioned embodiment and its modification examples are subjected to various modifications conceived by the manufacturer, and the configuration requirements and functions of each embodiment and its modification examples are arbitrarily combined without departing from the scope of the present invention. The implementation form is also included in the present invention.

8‧‧‧器具裝設部(電性連接部)10‧‧‧發光模組11‧‧‧基板11C‧‧‧基板11a‧‧‧第1主面11b‧‧‧第2主面12‧‧‧開口部13a‧‧‧第1區域(區域)13b‧‧‧第2區域20‧‧‧發光元件20a‧‧‧發光元件(夜燈用發光元件)20b‧‧‧發光元件(其他之發光元件)(照明用發光元件)25‧‧‧發光部80‧‧‧電路零件90‧‧‧電源電路100‧‧‧照明器具106‧‧‧器具本體111‧‧‧縫隙121‧‧‧貫穿口126‧‧‧支撐部140‧‧‧照明蓋150‧‧‧電路蓋151‧‧‧第1蓋152‧‧‧第2蓋160‧‧‧光源蓋161‧‧‧第1透光蓋162‧‧‧第2透光蓋199‧‧‧電源電纜1061‧‧‧最外周部1062‧‧‧最內周部1063‧‧‧中間部1064‧‧‧第1裝設面部1065‧‧‧豎立設置部1066‧‧‧第2裝設面部1067‧‧‧曲板部1068‧‧‧收納凹部1261‧‧‧插通部1511‧‧‧開口1512‧‧‧蓋部1515‧‧‧切口部1521‧‧‧基台部1522‧‧‧壁部1523‧‧‧開口1611‧‧‧透鏡1621‧‧‧透鏡X‧‧‧方向Y‧‧‧方向Z‧‧‧方向8‧‧‧Equipment installation part (electrical connection part) 10‧‧‧Light-emitting module 11‧‧‧Substrate 11C‧‧‧Substrate 11a‧‧‧First main surface 11b‧‧‧Second main surface 12‧‧ ‧Opening 13a‧‧‧First area (area) 13b‧‧‧Second area 20‧‧‧Light-emitting element 20a‧‧‧Light-emitting element (light-emitting element for night light) 20b‧‧‧Light-emitting element (other light-emitting elements ) (Light-emitting element for lighting) 25‧‧‧Light-emitting part 80‧‧‧Circuit parts 90‧‧‧Power circuit 100‧‧‧Lighting appliance 106‧‧‧Apparatus body 111‧‧‧Gap 121‧‧‧Penetration port 126‧ ‧‧Support 140‧‧‧Lighting cover 150‧‧‧Circuit cover 151‧‧‧First cover 152‧‧‧Second cover 160‧‧‧Light source cover 161‧‧‧First light transmission cover 162‧‧‧ 2 Translucent cover 199‧‧‧Power cable 1061‧‧‧Outermost peripheral part 1062‧‧‧Innermost peripheral part 1063‧‧‧Middle part 1064‧‧‧First installation face 1065‧‧‧Erecting part 1066‧‧ ‧Second installation face 1067‧‧‧Curved plate part 1068‧‧‧Receiving concave part 1261‧‧‧Insulation part 1511‧‧‧Opening 1512‧‧‧Cover part 1515‧‧‧Cut part 1521‧‧‧Base part 1522‧‧‧Wall 1523‧‧‧Aperture 1611‧‧‧Lens 1621‧‧‧Lens X‧‧‧Direction Y‧‧‧Direction Z‧‧‧Direction

圖1係實施形態之照明器具的分解立體圖。 圖2係顯示實施形態之器具本體、發光模組、電路蓋、光源蓋之部分截面圖。 圖3係從器具本體側觀看實施形態之發光模組的平面圖。 圖4係從地板側觀看實施形態之發光模組的平面圖。 圖5係實施形態之發光模組的側視圖。 圖6係顯示實施形態之發光模組、電路蓋、光源蓋之分解立體圖。 圖7係顯示實施形態之器具本體、發光模組、電路蓋、光源蓋的部分截面圖。 圖8係顯示變形例之基板的概略結構之放大圖。Fig. 1 is an exploded perspective view of the lighting fixture of the embodiment. Figure 2 is a partial cross-sectional view showing the appliance body, light emitting module, circuit cover, and light source cover of the embodiment. Fig. 3 is a plan view of the light emitting module of the embodiment viewed from the side of the appliance body. Fig. 4 is a plan view of the light emitting module of the embodiment viewed from the floor side. Fig. 5 is a side view of the light emitting module of the embodiment. Fig. 6 is an exploded perspective view showing the light emitting module, circuit cover, and light source cover of the embodiment. Fig. 7 is a partial cross-sectional view showing the appliance body, light emitting module, circuit cover, and light source cover of the embodiment. FIG. 8 is an enlarged view showing a schematic structure of a substrate of a modification example.

10‧‧‧發光模組 10‧‧‧Lighting Module

11‧‧‧基板 11‧‧‧Substrate

11a‧‧‧第1主面 11a‧‧‧The first main surface

11b‧‧‧第2主面 11b‧‧‧Second main surface

20‧‧‧發光元件 20‧‧‧Light-emitting element

20a‧‧‧發光元件(夜燈用發光元件) 20a‧‧‧Light-emitting element (light-emitting element for night light)

20b‧‧‧發光元件(其他之發光元件)(照明用發光元件) 20b‧‧‧Light-emitting devices (other light-emitting devices) (Light-emitting devices for lighting)

25‧‧‧發光部 25‧‧‧Light-emitting part

80‧‧‧電路零件 80‧‧‧Circuit parts

90‧‧‧電源電路 90‧‧‧Power circuit

199‧‧‧電源電纜 199‧‧‧Power cable

X‧‧‧方向 X‧‧‧direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

Claims (14)

一種照明器具,包含:器具本體;基板,載置於該器具本體;複數之發光元件,配置於該基板之該器具本體側的相反側之第1主面上;電源電路,配置於該基板之該器具本體側的第2主面上,並用以將發光用電力供至該複數之發光元件;電性連接部,接受來自外部之電源的電力;電源電纜,連接該電性連接部與該電源電路;該電源電纜之一端部在該第2主面側連接於該電源電路,另一端部在該第1主面側與該電性連接部連接。 A lighting appliance includes: an appliance body; a substrate placed on the appliance body; a plurality of light-emitting elements arranged on the first main surface of the substrate on the opposite side of the appliance body; a power supply circuit arranged on the substrate The second main surface on the side of the appliance body is used to supply light-emitting power to the plurality of light-emitting elements; an electrical connection portion that receives power from an external power source; a power cable that connects the electrical connection portion and the power source Circuit; One end of the power cable is connected to the power circuit on the second main surface side, and the other end is connected to the electrical connection portion on the first main surface side. 如申請專利範圍第1項之照明器具,更包含:電路蓋,其從該第1主面側覆蓋該基板之設置有該電源電路的第1區域,該電源電纜收納於該電路蓋內。 For example, the lighting appliance of the first item of the scope of patent application further includes: a circuit cover covering the first area of the substrate where the power circuit is provided from the first main surface side, and the power cable is housed in the circuit cover. 如申請專利範圍第2項之照明器具,其中,於該基板之該器具本體側的第2主面,配置有高度高於該發光元件之1個以上的電路零件,該電路蓋從該第1主面側覆蓋該基板之設置有該1個以上的電路零件之區域。 For example, the lighting appliance of the second item of the scope of patent application, wherein, on the second main surface of the appliance body side of the substrate, more than one circuit part higher than the light-emitting element is arranged, and the circuit cover is removed from the first The main surface side covers the area of the substrate where the one or more circuit components are provided. 如申請專利範圍第3項之照明器具,其中,於該器具本體形成有收納該1個以上之電路零件用的收納凹部。 For example, the lighting fixture of the third item of the scope of patent application, wherein a housing recess for storing the one or more circuit components is formed in the fixture body. 如申請專利範圍第3項之照明器具,其中,該1個以上之電路零件構成該電源電路。 For example, the lighting appliance of item 3 of the scope of patent application, wherein the one or more circuit parts constitute the power supply circuit. 如申請專利範圍第3項之照明器具,其中,該1個以上之電路零件係引線插入安裝型引線零件。 For example, the lighting appliance of item 3 of the scope of patent application, wherein the one or more circuit parts are lead-inserted lead parts. 如申請專利範圍第1項之照明器具,更包含:光源蓋,其在該第1主面側覆蓋該複數之發光元件,該光源蓋具有使光擴散之透鏡。 For example, the luminaire of item 1 of the scope of patent application further includes: a light source cover covering the plurality of light-emitting elements on the first main surface side, the light source cover having a lens that diffuses light. 如申請專利範圍第1項之照明器具,其中,於該基板形成有供該電源電纜貫穿該基板之貫穿口。 For example, the lighting appliance of the first item of the scope of patent application, wherein a through hole for the power cable to penetrate the substrate is formed on the substrate. 如申請專利範圍第1項之照明器具,其中,該複數之發光元件係表面安裝型發光元件,該複數之發光元件中至少1個係夜燈用發光元件。 For example, the luminaire of item 1 of the scope of patent application, wherein the plurality of light-emitting elements are surface-mounted light-emitting elements, and at least one of the plurality of light-emitting elements is a light-emitting element for night light. 如申請專利範圍第9項之照明器具,其中, 該複數之發光元件中不同於該夜燈用發光元件之其他發光元件,係配置於比該夜燈用發光元件靠近該基板之俯視時的外側之處。 For example, the lighting appliance of item 9 of the scope of patent application, of which, The other light-emitting elements of the plurality of light-emitting elements that are different from the night light-use light-emitting elements are arranged closer to the outer side of the substrate in a plan view than the night light-use light-emitting elements. 如申請專利範圍第10項之照明器具,更包含:第1透光蓋,其在該第1主面側覆蓋該其他之發光元件;第2透光蓋,其在該第1主面側覆蓋該夜燈用發光元件。 For example, the lighting appliance of item 10 of the scope of patent application further includes: a first light-transmitting cover, which covers the other light-emitting elements on the first main surface side; a second light-transmitting cover, which covers the first main surface side This light-emitting element for night light. 如申請專利範圍第11項之照明器具,其中,該第1透光蓋具有使光擴散之透鏡。 For example, the luminaire of item 11 of the scope of patent application, wherein the first light-transmitting cover has a lens for diffusing light. 如申請專利範圍第11項之照明器具,其中,該第2透光蓋具有使光擴散之透鏡。 For example, the luminaire of item 11 of the scope of patent application, wherein the second light-transmitting cover has a lens that diffuses light. 如申請專利範圍第11項之照明器具,其中,該第1透光蓋與該第2透光蓋係一體化。 For example, the lighting appliance of item 11 of the scope of patent application, wherein the first light-transmitting cover and the second light-transmitting cover are integrated.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013048051A (en) * 2011-08-29 2013-03-07 Hitachi Appliances Inc Led lighting device
TWM524426U (en) * 2014-11-27 2016-06-21 Panasonic Ip Man Co Ltd Lighting fixture
JP2016170988A (en) * 2015-03-12 2016-09-23 パナソニックIpマネジメント株式会社 Luminaire
JP2017022015A (en) * 2015-07-13 2017-01-26 パナソニックIpマネジメント株式会社 Lighting device and lighting device using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013048051A (en) * 2011-08-29 2013-03-07 Hitachi Appliances Inc Led lighting device
TWM524426U (en) * 2014-11-27 2016-06-21 Panasonic Ip Man Co Ltd Lighting fixture
JP2016170988A (en) * 2015-03-12 2016-09-23 パナソニックIpマネジメント株式会社 Luminaire
JP2017022015A (en) * 2015-07-13 2017-01-26 パナソニックIpマネジメント株式会社 Lighting device and lighting device using the same

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