TWI719061B - Exposure apparatus, manufacturing method of flat panel display and device menufacturing method, and exposure method - Google Patents

Abstract

The substrate stage device (20) for moving the substrate (P) is provided with: a non-contact holder (32) and a substrate carrier (40) that support different areas of the substrate (P), and a non-contact holder (32) Y voice coil motor (64), X voice coil motor (66) for moving the substrate carrier, and Y linear actuator (62) for moving the substrate carrier relative to the non-contact holder, the non-contact holder, and the substrate The substrate is supported so that the substrate can move relative to the non-contact holder. The substrate carrier (40) holds the substrate and moves the substrate relative to the non-contact holder corresponding to the movement caused by the Y linear actuator. The non-contact holder is capable of supporting The substrate is provided with a plurality of alignment marks (Mk) area supporting surfaces.

Description

Exposure device, manufacturing method of flat panel display, device manufacturing method, and exposure method

The present invention relates to an exposure device, a method for manufacturing a flat panel display, a method for manufacturing a device, and an exposure method. More specifically, it relates to an exposure device and an exposure method that perform exposure while scanning an object with illumination light through an optical system. The manufacturing method of the flat panel display of the exposure device or the manufacturing method of the device.

In the past, in the lithography process for manufacturing electronic components (micro-components) such as liquid crystal display elements and semiconductor components (integrated circuits, etc.), a step-and-scan exposure device (so-called scanning stepper (also called scanning Machine)), etc., which move the photomask or reticle (hereinafter collectively referred to as "mask") and glass plate or wafer (hereinafter collectively referred to as "substrate") in synchronization with the predetermined scanning direction. The energy beam is used to transfer the pattern formed on the mask to the substrate.

As this type of exposure apparatus, there is known one that uses an alignment detection system to measure the position of a mark formed on the substrate (so-called alignment measurement) before the exposure operation is started in order to position the substrate during the exposure operation (see, for example, the patent Literature 1).

In order to improve the exposure accuracy of this type of exposure device, it is better to detect with high precision Alignment marks on the substrate.

Advanced technical literature

[Patent Document 1] Specification of U.S. Patent Application Publication No. 2010/0266961

According to the first aspect of the present invention, there is provided an exposure device that irradiates an object with a plurality of marks through an optical system with illumination light, and drives the object with respect to the illumination light to scan and expose a plurality of divided regions of the object, respectively, It is provided with: a first supporting portion capable of non-contact supporting the plurality of divided regions arranged in at least one of the first and second directions that cross each other in a non-contact manner; and a holding portion that can be held in non-contact by the first supporting portion The aforementioned object supported by the method; the detection unit, which performs the detection operation of detecting the aforementioned plurality of marks provided in the aforementioned plurality of division areas; and the first driving unit, which is held by the aforementioned holding unit and has performed the aforementioned detection operation of the aforementioned object One part is detached from the first support portion, and the holding portion is driven relative to the first support portion.

According to the second aspect of the present invention, there is provided a method for manufacturing a flat panel display, which includes: exposing the aforementioned object using the exposure device of the first aspect; and developing the aforementioned object after exposure.

According to the third aspect of the present invention, a device manufacturing method is provided, which includes: the operation of exposing the object using the exposure device of the first aspect; and the operation of developing the object after the exposure.

According to the fourth aspect of the present invention, there is provided an exposure method in which illumination light is irradiated to an object with a plurality of marks through an optical system, and the object is opposed to the illumination light. Drive to respectively scan and expose a plurality of divided regions of the aforementioned object, which includes: the plurality of divided regions arranged in at least one of the first and second directions that cross each other supported by the first supporting portion in a non-contact manner The movement; the movement of holding the object supported by the first supporting portion in a non-contact manner by the holding portion; the movement of detecting the detection movement of the plurality of marks provided in the plurality of division areas by the detection portion; and by the aforementioned The method in which the holding portion holds and detaches a part of the object that has undergone the detection operation from the first support portion uses an operation in which the holding portion is driven relative to the first support portion by the first driving portion.

10: Liquid crystal exposure device

20: substrate stage device

32: Non-contact holder

40: substrate carrier

50: Main control device

90: Alignment measurement system

92, 94: pre-aligned sensor

96: Precision alignment sensor

P: substrate

Fig. 1 is a diagram schematically showing the configuration of the liquid crystal exposure apparatus of the first embodiment.

Fig. 2 is a sectional view taken along the line A-A of Fig. 1;

FIG. 3 is a detailed diagram showing the substrate stage device included in the liquid crystal exposure device of FIG. 1.

Fig. 4 is an enlarged view of the main part of the substrate stage device.

FIG. 5 is a conceptual diagram of a substrate position measurement system included in the liquid crystal exposure device of FIG. 1. FIG.

6(a) and 6(b) are diagrams showing the pre-alignment sensor provided in the liquid crystal exposure apparatus of FIG. 1 (a top view and a front view, respectively).

Fig. 7 is a block diagram showing the input-output relationship of the main control device with the control system of the liquid crystal exposure device as the center.

8(a) and 8(b) are diagrams (a top view and a front view, respectively) for explaining the operation (part 1) of the substrate stage device during the exposure operation.

9(a) and 9(b) are diagrams (a top view and a front view, respectively) for explaining the operation (part 2) of the substrate stage device during the exposure operation.

10(a) and 10(b) are diagrams (a top view and a front view, respectively) for explaining the operation (part 3) of the substrate stage device during the exposure operation.

11(a) and 11(b) are diagrams (a top view and a front view, respectively) for explaining the operation (part 4) of the substrate stage device during the exposure operation.

FIGS. 12(a) and 12(b) are diagrams (a top view and a front view, respectively) for explaining the operation (the 5) of the substrate stage device during the exposure operation.

FIGS. 13(a) and 13(b) are diagrams (a top view and a front view, respectively) for explaining the operation (part 6) of the substrate stage device during the exposure operation.

14(a) and 14(b) are diagrams (a top view and a front view, respectively) for explaining the operation (the 7) of the substrate stage device during the exposure operation.

15(a) and 15(b) are diagrams (a top view and a front view, respectively) for explaining the operation (the 8) of the substrate stage device during the exposure operation.

16(a) and 16(b) are diagrams (cross-sectional view and top view, respectively) showing the substrate stage device of the second embodiment.

"First Embodiment"

Hereinafter, the first embodiment will be described using FIGS. 1 to 15(b).

FIG. 1 schematically shows the structure of the liquid crystal exposure apparatus 10 of the first embodiment. The liquid crystal exposure device 10 is a step-and-scan projection exposure device that uses a rectangular (angled) glass substrate P (hereinafter simply referred to as substrate P) as an exposure target, such as a liquid crystal display device (flat panel display), etc. The so-called scanner.

The liquid crystal exposure device 10 has an illumination system 12 and maintains a circuit pattern formed thereon The mask stage 14 of the mask M of the same pattern, the projection optical system 16, the device body 18, and the substrate P which is held on the surface (the surface facing the +Z side in FIG. 1) coated with a resist (sensor) The substrate stage device 20, and these control systems, etc. Hereinafter, the direction in which the light mask M and the substrate P are scanned with respect to the projection optical system 16 is the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction, and the X-axis and Y-axis are orthogonal to each other. The direction is described as the Z-axis direction. In addition, the rotation directions around the X axis, the Y axis, and the Z axis will be described as the θx, θy, and θz directions, respectively.

The lighting system 12 is configured in the same manner as the lighting system disclosed in the specification of U.S. Patent No. 5,729,331, for example. That is, the illumination system 12 transmits light emitted from a light source not shown (such as a mercury lamp) through a mirror, a beam splitter, a light valve, a wavelength selective filter, various lenses, etc., not shown, respectively, for exposure Illumination light (illumination light) IL irradiates the mask M. As the illumination light IL, light such as i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm), etc. (or the combined light of the aforementioned i-line, g-line, and h-line) can be used.

The mask stage 14 holds a light-transmitting type mask M. The main control device 50 (refer to FIG. 7) transmits the mask stage 14 (that is, the mask M) to the illumination system 12 (illumination light IL) through a mask stage drive system 52 (refer to FIG. 7) including, for example, a linear motor. Drive in the X-axis direction (SCAN direction) with a predetermined long stroke, and slightly drive in the Y-axis direction and the θz direction. The position information of the mask stage 14 in the horizontal plane is obtained by the mask stage position measuring system 54 (refer to FIG. 7) including, for example, a laser interferometer.

The projection optical system (projection system) 16 is arranged under the mask stage 14. The projection optical system 16 is a so-called multi-lens projection optical system having the same configuration as the projection optical system disclosed in the specification of US Patent No. 6,552,775, etc., and is provided with, for example, an upright image formation Multiple optical systems on both sides of the telecentric. The optical axis AX of the illumination light IL projected from the projection optical system 16 to the substrate P is substantially parallel to the Z axis.

After the liquid crystal exposure device 10 is illuminated by the illuminating light IL from the illuminating system 12 on the mask M located in the predetermined illumination area, the illuminating light passing through the mask M passes through the projection optical system 16 to illuminate the area within the illuminating area. The projected image of the circuit pattern of the mask M (the image of a part of the pattern) is formed on the exposure area on the substrate P. Then, relative to the illumination area (illumination light IL), the mask M is relatively moved in the scanning direction, and relative to the exposure area (illumination light IL), the substrate P is relatively moved in the scanning direction, thereby scanning an illuminated area on the substrate P Expose, and transfer the pattern formed on the mask M to the irradiated area. Here, the illumination area on the mask M and the exposure area on the substrate P (irradiation area of the illumination light) are optically conjugated to each other by the projection optical system 16.

The device body 18 is a part supporting the above-mentioned mask stage 14 and the projection optical system 16, and is installed on the ground F of the clean room through a plurality of anti-vibration devices 18d. The device body 18 has the same structure as the device body disclosed in the specification of US Patent Application Publication No. 2008/0030702, and has an upper frame portion 18a (also referred to as an optical table, etc.) supporting the projection optical system 16 and a pair of lower The stand portion 18b (in FIG. 1 is overlapped in the depth direction of the paper surface, one side is not shown. Refer to FIG. 2) and a pair of middle stand portions 18c.

The substrate stage device 20 is a part for positioning the substrate P with respect to the projection optical system 16 (illumination light IL) with high precision, and drives the substrate P along a horizontal plane (X-axis direction and Y-axis direction) with a predetermined long stroke , And slightly driven in the direction of 6 degrees of freedom. The substrate stage device 20 includes a bottom frame 22, a coarse motion stage 24, a weight reduction device 26, an X guide 28, a substrate stage 30, a non-contact holder 32, a pair of auxiliary stages 34, a substrate carrier 40, and the like.

The bottom frame 22 includes a pair of X pillars 22a. The X column 22a is composed of a rectangular member with a YZ cross-section extending in the X-axis direction. The pair of X-pillars 22a are arranged at predetermined intervals in the Y-axis direction, and are provided on the ground F in a state where they are physically separated from the device main body 18 (isolated by vibration) through the legs 22b, respectively. The pair of X pillars 22a and the legs 22b are integrally connected by the connecting member 22c, respectively.

The coarse motion stage 24 is a part for driving the substrate P in the X-axis direction with a long stroke, and is provided with a pair of X brackets 24a corresponding to the pair of X columns 22a. The X bracket 24a is formed in an inverted L-shaped YZ cross-section, and is placed on the corresponding X-pillar 22a through a plurality of mechanical linear guides 24c.

A pair of X carriages 24a are driven by a part of the substrate platform drive system 56 (refer to FIG. 7) that is used to drive the substrate platform 30, that is, X linear actuators, and by the main control device 50 (refer to FIG. 7), along the corresponding The X-pillar 22a is synchronously driven in the X-axis direction with a predetermined long stroke (about 1 to 1.5 times the length of the substrate P in the X-axis direction). The type of the X linear actuator used to drive the X carriage 24a can be changed as appropriate. In Fig. 2, a linear motor including, for example, a movable part of the X carriage 24a and a fixed part of the corresponding X column 22a is used. 24d, but not limited to this, for example, a feed screw (ball screw) device or the like can also be used.

In addition, as shown in FIG. 2, the coarse motion stage 24 has a pair of Y fixtures 62a. The Y fixing member 62a is composed of a member extending in the Y-axis direction (refer to FIG. 1). One Y fixture 62a is located near the +X side end of the coarse motion stage 24, and the other Y fixture 62a is located near the -X side end of the coarse motion stage 24, respectively erected on a pair of X supports On the frame 24a (refer to FIG. 1). The function of the Y fixing member 62a will be described later.

The weight elimination device 26 is inserted into a pair of X brackets of the coarse motion stage 24 Between 24a, the weight of the system including the substrate platform 30 and the non-contact holder 32 is supported from below. The details of the weight elimination device 26 are disclosed in, for example, the specification of U.S. Patent Application Publication No. 2010/0018950, so the description is omitted. The weight elimination device 26 is mechanically connected to the coarse movement stage 24 through a plurality of connecting devices 26a (also called flexure devices) extending radially from the weight elimination device 26, by being coarsely moved. 24 is pulled, and moves in the X-axis direction integrally with the coarse motion stage 24. In addition, although the weight elimination device 26 is connected to the coarse motion stage 24 through a connecting device 26a extending radially from the weight elimination device 26, since it only moves in the X-axis direction, it can also be extended by extending in the X-axis direction. The directional connecting device 26a is connected to the coarse motion stage 24.

The X guide rod 28 is a part that functions as a platform when the weight reduction device 26 moves. The X guide rod 28 is composed of a member extending in the X-axis direction. As shown in FIG. 1, it is inserted between a pair of X-pillars 22a of the bottom frame 22 and fixed to a pair of lower frame portions 18b of the device body 18. . In the Y-axis direction, the center of the X guide rod 28 is substantially the same as the center of the exposure area generated on the substrate P by the illumination light IL. The upper surface of the X guide rod 28 is set to be parallel to the XY plane (horizontal plane). The aforementioned weight reduction device 26 is placed on the X guide rod 28 in a non-contact state through, for example, an air bearing 26b. When the coarse motion stage 24 moves in the X-axis direction on the bottom frame 22, the weight reduction device 26 is moved in the X-axis direction on the X guide rod 28.

The substrate stage 30 is composed of a rectangular plate (or box-shaped) member with the X-axis direction as the longitudinal direction in a plan view. As shown in FIG. 2, the center part is oscillated relative to the XY plane through a spherical bearing device 26c. The state is supported by the weight elimination device 26 in a non-contact manner from below. In addition, as shown in FIG. 1, a pair of auxiliary stages 34 (not shown in FIG. 2) are connected to the substrate stage 30. The function of the pair of auxiliary platforms 34 will be described later.

Returning to FIG. 2, the substrate platform 30 is a part of the substrate platform driving system 56 (refer to FIG. 6), by including a plurality of linear motors 30a including a fixed part of the coarse motion stage 24 and a movable part of the substrate platform 30 itself (Such as a voice coil motor), and the direction in which the coarse motion stage 24 is crossed to the relative horizontal plane (XY plane), that is, the Z-axis direction, the θx direction, and the θy direction (hereinafter referred to as the Z tilt direction) are appropriately small drive.

The substrate platform 30 is mechanically connected to the coarse motion stage 24 through a plurality of connecting devices 30b (flexure devices) extending radially from the substrate platform 30. The connecting device 30b includes, for example, a ball joint, so as to avoid obstructing the relative movement of the substrate platform 30 with respect to the coarse motion stage 24 in the slight stroke in the Z tilt direction. Moreover, when the coarse motion stage 24 moves with a long stroke in the X-axis direction, it is pulled by the coarse motion stage 24 through the plurality of connecting devices 30b, whereby the coarse motion stage 24 and the substrate platform 30 are integrated Move in the X-axis direction. In addition, since the substrate platform 30 does not move in the Y-axis direction, it can also be connected to the coarse motion stage via a plurality of connecting devices 30b parallel in the X-axis direction without passing through the connecting device 30b extending radially to the coarse motion stage 24. Moving carrier 24.

The non-contact holder 32 is composed of a rectangular plate-shaped (or box-shaped) member with the X-axis direction as the longitudinal direction in a plan view, and supports the substrate P from below on its upper surface. The non-contact holder 32 has a function of preventing the substrate P from bending, wrinkles, etc. (for plane correction). The non-contact holder 32 is fixed on the upper surface of the substrate platform 30, moves in the X-axis direction with a long stroke integrally with the substrate platform 30, and moves slightly in the Z tilt direction.

The length of each of the four sides of the upper surface (substrate support surface) of the non-contact holder 32 is set to be approximately the same as the length of each of the four sides of the substrate P (actually, it is slightly shorter). Therefore, the non-contact holder 32 can support substantially the entire substrate P from below, specifically, it can support the substrate P from below. The exposure target area on the board P (the area on the board P other than the blank area formed near the end).

A pressurized gas supply device and a vacuum suction device, not shown, provided outside the substrate stage device 20 are connected to the non-contact holder 32 through a piping member such as a tube. In addition, a plurality of micro-holes communicating with the piping member are formed on the upper surface (substrate mounting surface) of the non-contact holder 32. The non-contact holder 32 floats the substrate P by ejecting pressurized gas (for example, compressed air) supplied from the pressurized gas supply device through the hole (a part) to the lower surface of the substrate P. In addition, the non-contact holder 32 is used in combination with the ejection of the pressurized gas, and sucks the air between the lower surface of the substrate P and the substrate supporting surface by the vacuum suction force supplied from the vacuum suction device. Thereby, a load (preload) is applied to the substrate P, and the plane is corrected along the upper surface of the non-contact holder 32. However, since a gap is formed between the substrate P and the non-contact holder 32, the relative movement of the substrate P and the non-contact holder 32 in a direction parallel to the horizontal plane is not hindered.

The substrate carrier 40 is a portion that holds the substrate P, and moves the substrate P relative to the illumination light IL (refer to FIG. 1) in the three-degree-of-freedom direction (X-axis direction, Y-axis direction, and θz direction) in the horizontal plane. The substrate carrier 40 is formed in a rectangular frame shape (picture frame shape) in a plan view, and is relatively non-contact holder 32 in a state where the area (blank area) near the end (outer peripheral edge) of the substrate P is held Move along the XY plane. Hereinafter, the details of the substrate carrier 40 will be described using FIG. 3.

As shown in FIG. 3, the substrate carrier 40 includes a pair of X frames 42x and a pair of Y frames 42y. The pair of X frames 42x are respectively composed of flat members extending in the X-axis direction, and are arranged at predetermined intervals in the Y-axis direction (wider than the size of the substrate P and the non-contact holder 32 in the Y-axis direction). In addition, a pair of Y frames 42y are each composed of a flat member extending in the Y-axis direction, They are arranged at predetermined intervals in the X-axis direction (wider than the size of the substrate P and the non-contact holder 32 in the X-axis direction).

The Y frame 42y on the +X side is connected to the vicinity of the respective +X side ends of the pair of X frames 42x through spacers 42a. Similarly, the Y frame 42y on the -X side is connected to the lower surface in the vicinity of the respective -X side ends of the pair of X frames 42x through the spacer 42a. Thereby, the height position of the upper surface of the pair of Y frames 42y (the position in the Z-axis direction) is set to be lower than the height position of the lower surface of the pair of X frames 42x (-Z side).

In addition, a pair of suction pads 44 are separately attached to the lower surfaces of the pair of X frames 42x in the X-axis direction. Therefore, the substrate carrier 40 has, for example, four adsorption pads 44 in total. The suction pad 44 is arranged to protrude from the facing surfaces of the pair of X frames 42x in the direction facing each other (inside the substrate carrier 40). For example, four suction pads 44, the position in the horizontal plane (installation position to the X frame 42x) is set to support the four corners of the substrate P from below (blank area) with the substrate P inserted between the pair of X frames 42x . For example, a vacuum suction device (not shown) is connected to the four suction pads 44 respectively. The suction pad 44 sucks and holds the bottom surface of the substrate P by the vacuum suction force supplied from the above-mentioned vacuum suction device. In addition, the number of adsorption pads 44 is not limited to this, and can be changed suitably.

Here, as shown in FIG. 2, in a state where the non-contact holder 32 and the substrate carrier 40 are combined, the substrate P is supported from below by the suction pad 44 of the substrate carrier 40 (suction holding ) Near the four corners and almost the entire surface including the central part is supported by the non-contact holder 32 in a non-contact manner from below. In this state, the ends of the +X side and -X side of the substrate P protrude from the ends of the non-contact holder 32 on the +X side and -X side, respectively, such as four suction pads 44 (Fig. 2 A part is not shown), which protrudes from the non-contact holder 32 by sucking and holding the substrate P The part. That is, the attachment position of the suction pad 44 to the X frame 42x is set to be outside the non-contact holder 32 in the X-axis direction.

Next, the substrate carrier driving system 60 for driving the substrate carrier 40 (refer to FIG. 7) will be described. In this embodiment, the main control device 50 (refer to FIG. 7) drives the substrate carrier 40 with respect to the non-contact holder 32 in the Y-axis direction with a long stroke through the substrate carrier drive system 60, and drives the substrate carrier 40 slightly The direction of 3 degrees of freedom in the horizontal plane. In addition, the main control device 50 synchronizes (integrally) the non-contact holder 32 and the substrate carrier 40 in the X-axis direction through the above-mentioned substrate stage driving system 56 (refer to FIG. 7) and the substrate carrier driving system 60 drive.

The substrate carrier drive system 60 is provided with a pair of Y linear actuators 62 as shown in FIG. 2. The Y linear actuators 62 include the Y fixing member 62a of the coarse motion stage 24 and the Y fixing member 62a. A Y movable element 62b that synergistically generates thrust in the Y-axis direction. As shown in FIG. 4, the Y movable member 62b of the pair of Y linear actuators 62 is equipped with a Y fixing member 64a and an X fixing member 66a.

The Y fixing member 64a constitutes a Y voice coil motor 64 that cooperates with the Y movable member 64b mounted on the substrate carrier 40 (below the Y frame 42y) to give the substrate carrier 40 a thrust in the Y-axis direction. In addition, the X fixing member 66a constitutes an X voice coil motor 66 that cooperates with the X movable member 66b attached to the substrate carrier 40 (below the Y frame 42y) to give the substrate carrier 40 a thrust in the X-axis direction. In this way, the substrate stage device 20 has a Y voice coil motor 64 and an X voice coil motor 66 on the +X side and the -X side of the substrate carrier 40, respectively.

Here, on the +X side and -X side of the substrate carrier 40, the Y voice coil motor 64 and the X voice coil motor 66 are respectively arranged in point symmetry with the center of gravity of the substrate P as the center. Therefore, when using the X voice coil motor 66 on the +X side of the substrate carrier 40 and the X voice on the -X side of the substrate carrier 40 When the ring motor 66 exerts a thrust in the X-axis direction on the substrate carrier 40, the same effect can be obtained as the thrust applied to the center of gravity position of the substrate P in the X-axis direction, that is, it can suppress the substrate carrier 40 ( The substrate P) acts on a moment in the θz direction. In addition, since the pair of Y voice coil motors 64 are arranged across the center of gravity (line) of the substrate P in the X-axis direction, no moment in the θz direction is applied to the substrate carrier 40.

The substrate carrier 40, through the aforementioned pair of Y voice coil motors 64 and a pair of X voice coil motors 66, is moved relatively coarsely with the stage 24 (that is, the non-contact holder 32) by the main control device 50 (refer to FIG. 7). ) Is slightly driven in the direction of 3 degrees of freedom in the horizontal plane. In addition, the main control device 50 uses the aforementioned pair of X voice coil motors 66 to give the X-axis to the substrate carrier 40 when the coarse motion stage 24 (that is, the non-contact holder 32) moves in the X-axis direction with a long stroke. The thrust force in the direction makes the non-contact holder 32 and the substrate carrier 40 move in a long stroke in the X-axis direction integrally.

In addition, the main control device 50 (refer to FIG. 7) uses the pair of Y linear actuators 62 and the pair of Y voice coil motors 64 to make the substrate carrier 40 longer in the Y-axis direction relative to the non-contact holder 32 Relative movement of the stroke. Specifically, the main control device 50 uses a Y voice coil including a Y fixed member 64a attached to the Y movable member 62b while moving the Y movable member 62b of a pair of Y linear actuators 62 in the Y-axis direction. The motor 64 applies thrust in the Y-axis direction to the substrate carrier 40. Thereby, the substrate carrier 40 is moved independently (separated) from the non-contact holder 32 in the Y-axis direction by a long stroke.

As described above, in the substrate stage device 20 of the present embodiment, the substrate carrier 40 holding the substrate P moves in the X-axis (scanning) direction integrally with the non-contact holder 32 with a long stroke, and in the Y-axis direction, The non-contact holder 32 moves independently with a long stroke. In addition, it can be seen from FIG. 2 that although the Z position of the suction pad 44 and the Z position of the non-contact holder 32 partially overlap, The direction in which the substrate carrier 40 moves with a long stroke relative to the non-contact holder 32 is only the Y-axis direction, so there is no risk of contact between the suction pad 44 and the non-contact holder 32.

In addition, when the substrate platform 30 (that is, the non-contact holder 32) is driven in the Z-inclination direction, the substrate P after plane correction by the non-contact holder 32 is tilted in Z together with the non-contact holder 32 The orientation changes posture, so the substrate carrier 40 that sucks and holds the substrate P will change its posture in the Z tilt direction together with the substrate P. In addition, the posture of the substrate carrier 40 can also be kept unchanged by the elastic deformation of the suction pad 44.

Returning to FIG. 1, a pair of auxiliary platforms 34 are coordinated with the non-contact holder 32 to support the substrate held by the substrate carrier 40 when the substrate carrier 40 is separated from the non-contact holder 32 and relatively moves in the Y-axis direction. The device below P. As described above, the substrate carrier 40 moves relative to the non-contact holder 32 while holding the substrate P. Therefore, after the substrate carrier 40 moves in the +Y direction from the state shown in FIG. 1, the substrate P The vicinity of the end on the +Y side becomes unsupported by the non-contact holder 32. Therefore, the substrate stage device 20 uses one of the pair of auxiliary stages 34 to support the substrate P from below in order to suppress the bending caused by the weight of the portion of the substrate P that is not supported by the non-contact holder 32. The pair of auxiliary platforms 34 have substantially the same structure except that they are arranged symmetrically on the paper.

The auxiliary platform 34 has a plurality of air floating units 36 as shown in FIG. 3. In addition, in this embodiment, the air floating unit 36 is formed in a rod shape extending in the Y-axis direction, and a plurality of air floating units 36 are arranged at predetermined intervals in the X-axis direction. The shape, number, arrangement, etc. of the bending caused by the weight of P are not particularly limited. As shown in FIG. 4, the plurality of air floating units 36 are supported from below by arm-shaped supporting members 36 a protruding from the side surface of the substrate platform 30. Formed between the plurality of air floating units 36 and the non-contact holder 32 Slight gap.

The height position of the upper surface of the air floating unit 36 is set to be substantially the same as the height position of the upper surface of the non-contact holder 32 (or slightly lower). The air floating unit 36 supports the substrate P in a non-contact manner by spraying gas (for example, air) from the upper surface to the lower surface of the substrate P. In addition, although the aforementioned non-contact holder 32 is preloaded to act on the substrate P to correct the plane of the substrate P, the air floating unit 36 can only be used as long as it can suppress the bending of the substrate P. The gas is supplied to the bottom of the substrate P, and the height position of the substrate P on the air floating unit 36 is not particularly controlled.

Next, a description will be given of the in-horizontal position measuring system 70 for measuring the position information of the substrate P in the direction of 6 degrees of freedom. The substrate position measurement system includes: to obtain the position information of the substrate platform 30 in the direction intersecting the horizontal plane (the position information in the Z-axis direction, the rotation amount information in the θx and θy directions. Hereinafter referred to as "Z tilt position information") The Z tilt position measurement system 58 (refer to FIG. 7) and the position information used to obtain the substrate carrier 40 in the XY plane (the position information in the X-axis direction and the Y-axis direction, and the rotation amount information in the θz direction) The position measuring system 70 in the horizontal plane (refer to FIG. 7).

The Z tilt position measuring system 58 (refer to FIG. 7), as shown in FIG. 2, includes a plurality of (at least three) laser displacement meters 58a fixed under the substrate platform 30 and fixed around the spherical bearing device 26c. The laser displacement meter 58a measures the displacement of the substrate platform 30 in the Z-axis direction at the point where the measurement light is irradiated by irradiating the target 58b fixed to the housing of the weight elimination device 26 and receiving the reflected light. The information is supplied to the main control device 50 (refer to FIG. 7). For example, if at least three laser displacement meters 58a are arranged at three locations that are not on the same straight line (for example, corresponding to the position of the apex of an equilateral triangle), the main control device 50 is calculated based on the output of the at least three laser displacement meters 58a The Z tilt position information of the substrate platform 30 (ie, the substrate P). Since the weight elimination device 26 moves along the upper surface (horizontal plane) of the X guide rod 28, the main control device 50 can measure the posture change of the substrate platform 30 relative to the horizontal plane regardless of the X position of the substrate platform 30.

The position measuring system 70 in the horizontal plane (refer to FIG. 7) has a pair of read head units 72 as shown in FIG. One head unit 72 is arranged on the -Y side of the projection optical system 16, and the other head unit 72 is arranged on the +Y side of the projection optical system 16.

Each of the pair of head units 72 uses the reflective diffraction grid of the substrate carrier 40 to obtain the position information of the substrate P in the horizontal plane. Corresponding to the pair of head units 72, a plurality of (for example, six in FIG. 3) scale plates 46 are attached to each of the upper surfaces of a pair of X frames 42x of the substrate carrier 40 as shown in FIG. 3. The scale board 46 is composed of a band-shaped member extending in the X-axis direction in a plan view. The length of the scale board 46 in the X-axis direction is shorter than the length of the X frame 42x in the X-axis direction, and a plurality of scale boards 46 are arranged at predetermined intervals (separated from each other) in the X-axis direction.

FIG. 5 shows the X frame 42x on the +Y side and the head unit 72 corresponding thereto. Each of the plurality of scale plates 46 fixed on the X frame 42x is formed with an X scale 48x and a Y scale 48y. The X scale 48x is formed in a half area of the -Y side of the scale plate 46, and the Y scale 48y is formed in a half area of the +Y side of the scale plate 46. The X scale 48x has a reflection type X diffraction grid, and the Y scale 48y has a reflection type Y diffraction grid. In addition, in FIG. 5, for easy understanding, the interval (pitch) between a plurality of grid lines forming the X scale 48x and the Y scale 48y is shown to be wider than the actual one.

The head unit 72 is equipped with a Y linear actuator 74 as shown in FIG. 4, and the Y linear actuator 74 is used to drive a Y slide with a predetermined stroke in the Y axis direction relative to the projection optical system 16 (see FIG. 1). Piece 76, and a plurality of measuring reading heads (X encoder reading head 78x, 80x, Y encoder reading head 78y, 80y) fixed to the Y sliding piece 76. Except in Figure 1 and Figure 4, it is formed on the left side of the paper. Except for the right symmetry, a pair of head units 72 have the same configuration. In addition, a plurality of scale plates 46 respectively fixed to a pair of X frames 42x are also configured to be bilaterally symmetrical in FIGS. 1 and 4.

The Y linear actuator 74 is fixed to the lower surface of the upper frame portion 18 a of the device body 18. The Y linear actuator 74 includes a linear guide that guides the Y slider 76 straight in the Y-axis direction and a drive system that applies thrust to the Y slider 76. Although the type of linear guide is not particularly limited, it is preferably an air bearing with high repeatability. In addition, the type of the drive system is not particularly limited, and, for example, a linear motor, a belt (or wire) drive device, etc. can be used.

The Y linear actuator 74 is controlled by the main control device 50 (refer to FIG. 7). The stroke amount of the Y slider 76 in the Y-axis direction caused by the Y linear actuator 74 is set to be the same as the stroke amount of the substrate P (the substrate carrier 40) in the Y-axis direction.

The reading head unit 72, as shown in FIG. 5, has a pair of X encoder reading heads 78x (hereinafter referred to as "X reading head 78x") and a pair of Y encoder reading heads 78y (hereinafter referred to as "Y reading head 78y") . The pair of X heads 78x and the pair of Y heads 78y are separately arranged at a predetermined distance in the X-axis direction.

X-read head 78x and Y-read head 78y are, for example, the so-called diffraction interference method encoder heads disclosed in the specification of US Patent Application Publication No. 2008/0094592, which correspond to the corresponding scales (X scale 48x, Y scale 48y) The measurement beam is irradiated downward (-Z direction) and receives the beam (return light) from the scale, thereby supplying the displacement information of the substrate carrier 40 to the main control device 50 (refer to FIG. 7).

That is, the position measuring system 70 in the horizontal plane (refer to FIG. 7) is configured to use a pair of reading head units 72 in total, for example, four X reading heads 78x, and an X scale facing the X reading head 78x 48x to obtain position information of the substrate carrier 40 in the X-axis direction, for example, four X linear encoder systems. Similarly, it is configured to use the total of a pair of read head units 72 For example, four Y read heads 78y and a Y scale 48y facing the Y read head 78y are used to obtain position information of the substrate carrier 40 in the Y-axis direction, for example, four Y linear encoder systems.

Here, the distance between the pair of X heads 78x and the pair of Y heads 78y in the head unit 72 in the X-axis direction is set to be wider than the distance between adjacent scale plates 46. Thereby, for the X encoder system and the Y encoder system, regardless of the position of the substrate carrier 40 in the X axis direction, at least one of the pair of X read heads 78x always faces the X scale 48x and the pair of Y read heads 78y At least one of them always faces the Y scale 48y.

Specifically, the main control device 50 (refer to FIG. 7), in a state where a pair of X read heads 78x are opposed to the X scale 48x, calculates the substrate load based on the average value of the output of the pair of X read heads 78x. With 40 X position information. In addition, the main control device 50 obtains the X position information of the substrate carrier 40 based only on the output of the X head 78x of the pair when only one of the pair of X heads 78x faces the X scale 48x. Therefore, the X encoder system can supply the position information of the substrate carrier 40 to the main control device 50 without interruption. The same applies to the Y encoder system.

Here, as described above, the substrate carrier 40 of this embodiment can also move in the Y-axis direction with a predetermined long stroke. Therefore, the main control device 50 (see FIG. 7) maintains the X-read head 78x and Y-read Each of the head 78y and the corresponding scales 48x, 48y are opposed to each other, corresponding to the position of the substrate carrier 40 in the Y-axis direction, and the Y slider 76 of the pair of read head units 72 (refer to FIG. 4) The method of following the substrate carrier 40 is driven in the Y-axis direction through the Y linear actuator 74 (refer to 4). The main control device 50 combines the displacement (position information) of the Y slider 76 (ie each reading head 78x, 78y) in the Y-axis direction with the output from each reading head 78x, 78y, and comprehensively obtains the substrate carrier Position information in the horizontal plane of 40.

The position (displacement) information of the Y slider 76 (refer to Figure 4) in the horizontal plane, It is obtained by the encoder system 96 having the same measurement accuracy as the encoder system using the above-mentioned X-read head 78x and Y-read head 78y. The Y slider 76, as can be seen from Figures 4 and 5, has a pair of X encoder reading heads 80x (hereinafter referred to as "X reading head 80x") and a pair of Y encoder reading heads 80y (hereinafter referred to as "Y reading Head 80y"). The pair of X heads 80x and the pair of Y heads 80y are separately arranged at a predetermined distance in the Y-axis direction.

The main control device 50 (refer to FIG. 7) uses a plurality of scale plates 82 fixed under the upper frame portion 18a of the main body 18 (refer to FIG. 1 respectively) to obtain the position information of the Y slider 76 in the horizontal plane. The scale plate 82 is composed of a band-shaped member extending in the Y-axis direction in a plan view. In this embodiment, above each of the pair of head units 72, for example, two scale plates 82 are arranged at a predetermined interval (separated from each other) in the Y-axis direction.

As shown in FIG. 5, an X scale 84x is formed in the +X side area under the scale plate 82 opposite to the pair of X read heads 80x, and the -X side area under the scale plate 82 is the same as the above one. A Y scale 84y is formed opposite to the Y head 80y. The X scale 84x and Y scale 84y are light reflection type diffraction grids with substantially the same structure as the X scale 48x and Y scale 48y formed on the scale plate 46. In addition, the X head 80x and Y head 80y are also encoder heads of the diffraction interference method with the same configuration as the above-mentioned X head 78x and Y head 78y (downward head).

A pair of X-read heads 80x and a pair of Y-read heads 80y irradiate the corresponding rulers (X ruler 84x, Y ruler 84y) upward (+Z direction) with the measuring beam, and receive the beam from the ruler, thereby The displacement information of the Y slider 76 (refer to FIG. 4) in the horizontal plane is supplied to the main control device 50 (refer to FIG. 7). The distance between the pair of X heads 80x and the pair of Y heads 80y in the Y-axis direction is set to be wider than the distance between adjacent scale plates 82. Thereby, regardless of the position of the Y slider 76 in the Y axis direction, at least one of the pair of X read heads 80x always faces the X scale 84x and at least one of the pair of Y read heads 80y always faces the Y scale 84y. Therefore, the position information of the Y slider 76 can be continuously supplied to the main control device 50 (refer to FIG. 7).

As shown in FIG. 7, the alignment measurement system 90 has a pre-alignment sense that detects the position of the end of the substrate P after the substrate P (refer to FIG. 1) is loaded (carried in) on the substrate stage device 20 (refer to FIG. 1). The detectors 92, 94, and a precision alignment sensor 96 (hereinafter simply referred to as "alignment sensor 96") for detecting the alignment mark formed on the substrate P.

As shown in FIG. 6(a), the pre-alignment sensor 92 is in a state where the non-contact holder 32 and the substrate carrier 40 are located at the predetermined loading position (substrate exchange position), and can detect the substrate P There is, for example, one position at the end on the +X side. In addition, the pre-alignment sensor 94 is separated and arranged, for example, two in the X-axis direction at a position where the +Y-side end of the substrate P in the loading position can be detected.

The pre-alignment sensor 92 is a well-known edge sensor, and as shown in FIG. 6(b), it includes a light source 92a and a light receiving portion 92b. The light source 92a is arranged above the substrate P by being fixed to, for example, the device body 18 (see FIG. 1), and the light receiving portion 92b is arranged opposite to the light source 92a via the substrate P (under the substrate P). The cross-section orthogonal to the optical axis of the measuring light irradiated from the light source 92a is a line extending in the X-axis direction (refer to FIG. 6(a)). The light receiving portion 92b detects the + of the substrate P by receiving the measuring light X-side end. The pre-alignment sensor 94 is related to the pre-alignment sensor 92 except that the cross-section orthogonal to the optical axis of the measuring light is a line extending in the Y-axis direction (refer to FIG. 6(a)). An edge sensor of the same configuration (light source 94a and light receiving portion 94b). In addition, FIG. 6(a) shows only the measurement light irradiated from the light sources 92a, 94a for easy understanding, and the same reference numerals as the prealignment sensors 92, 94 are assigned to the measurement light.

The main control device 50 (refer to FIG. 7) is based on, for example, a pre-aligned sensor The output of the light-receiving portion 92b of 92 and the light-receiving portion 94b of each of the two pre-alignment sensors 94 is measured for the approximate (rough) position of the substrate P in the 3 degrees of freedom direction in the horizontal plane. Since the substrate P may be rotated in the θz direction when being transported to the substrate stage device 20 by a loading device not shown, the main control device 50 performs the substrate P when the rotation amount exceeds a predetermined threshold. Pre-loading (re-carrying in the movement). Moreover, as long as the rotation amount of the substrate P is within the above-mentioned threshold value, the substrate P is held by the substrate carrier 40. In addition, as necessary, the substrate carrier 40 holding the substrate P is rotated in the θz direction to perform fine adjustment of the position of the substrate P.

As shown in FIG. 6(b), the alignment sensors 96 are provided on the +X side of the projection optical system 16 and arranged at predetermined intervals in the Y-axis direction, for example (not shown in FIGS. 1 and 2). Also, on the substrate P, as shown in FIG. 6(a), a plurality of alignment marks Mk (hereinafter simply referred to as "marks Mk") are formed. Specifically, on the substrate P, for example, four rows of marks Mk (that is, a total of 24 marks Mk) composed of, for example, six marks Mk (that is, a total of 24 marks Mk) are formed at predetermined intervals in the X-axis direction, and are separated from each other in the Y-axis direction. . As will be described later, in this embodiment, for example, four shot regions (rectangular division regions) S1 to S4 are set on the substrate P, and the mark Mk is formed in one shot region, for example, six. More specifically, in one irradiation area, for example, three marks Mk are formed near the end on the +X side, and, for example, three marks Mk are formed near the end on the -X side.

In addition, the number and arrangement of the marks Mk can be appropriately changed depending on, for example, the number of irradiation areas. In addition, although the mark Mk is shown as a white circle in the plan view of FIG. 6(a) etc., the actual mark shape is not limited to this and can be changed as appropriate. In addition, in FIG. 6(a) and the like, for ease of understanding, the mark Mk is shown to be much larger than actual. In addition, the mark Mk may also be formed in the area between adjacent irradiation areas (that is, outside the irradiation area).

For example, the interval between the six alignment sensors 96 in the Y-axis direction mentioned above is set to The interval in the Y-axis direction of, for example, six marks Mk forming the above-mentioned mark row is substantially the same. Thereby, for example, the positions of the six alignment sensors 96 in the X-axis direction are the same, and for example, six alignment marks Mk can be detected at the same time. In addition, in this embodiment, since the six alignment sensors 96 detect six marks Mk at the same time, in the plan view of FIG. 6(a) etc., for example, the detection areas of the six alignment sensors 96 ( The band-shaped area extending in the Y-axis direction is given the same symbol as the alignment sensor 96.

In addition, the center of the Y-axis direction of the detection area formed by the six alignment sensors 96 (refer to the symbol 96 in FIG. 6(a)) is formed by the projection optical system 16 (refer to FIG. 6(b)) The installation positions of six alignment sensors 96 are set in such a way that the center of the exposure area IA on the substrate P is approximately the same in the Y-axis direction. In addition, the center position of the X guide 28 (that is, the non-contact holder 32) in the Y-axis direction is approximately the same as the center position of the exposure area IA in the Y-axis direction. Therefore, for example, the six alignment sensors 96 are in a state where the Y position of the substrate carrier 40 is positioned such that substantially all of the substrate P is supported by the non-contact holder 32, and simultaneously detects, for example, six pairs of inspection objects. Quasi-mark Mk. For example, the outputs of the six alignment sensors 96 are supplied to the main control device 50 (refer to FIG. 7). The precise alignment operation performed by the main control device 50 based on the alignment sensor 96 will be described later.

FIG. 7 is a block diagram showing the input/output relationship of the main control device 50, which is composed mainly of the control system of the liquid crystal exposure device 10 (refer to FIG. 1) and controls the components of the main control device 50. The main control device 50 includes a workstation (or a microcomputer), etc., and overall controls the constituent parts of the liquid crystal exposure device 10.

Next, the exposure operation using the liquid crystal exposure apparatus 10 of this embodiment is demonstrated using FIG. 8(a) ~ FIG. 15(b). Here, in the following description, although it is described on a substrate P The case where there are four irradiation areas (the so-called case of capturing 4 sides) is set, but the number and arrangement of the irradiation areas set on one substrate P can be changed as appropriate. In addition, in the present embodiment, the exposure processing is described as an example starting from the first irradiation area S1 set on the -Y side and the +X side of the substrate P. In addition, in order to avoid excessive complexity of the drawings, some of the elements of the substrate stage device 20 are omitted in FIGS. 8(a) to 10(b). Furthermore, in this embodiment, a plurality of layers (layers) are formed by superimposing and transferring a plurality of mask patterns on the substrate P. In the following description, the case where the patterns after the second layer are formed is also explained. That is, the pattern is formed by overlapping the substrate P on which the pattern (and the plurality of marks Mk) has been formed at least once.

The liquid crystal exposure device 10 (refer to FIG. 1) is managed by the main control device 50 (refer to FIG. 7), and the mask M is loaded on the mask stage 14 by a mask loader (not shown), and The substrate P is mounted on the substrate stage device 20 (the substrate carrier 40 and the non-contact holder 32) by a substrate loader not shown. After the substrate P is loaded on the substrate stage device 20, the main control device 50 performs a pre-alignment operation using the aforementioned pre-alignment sensors 92, 94 (refer to FIGS. 6(a) and 6(b)).

After the pre-alignment operation, the main control device 50 (refer to FIG. 7) performs a precision alignment operation using a plurality of alignment sensors 96. As described above, in this embodiment, the scanning exposure is started from the first shot region S1 (refer to FIG. 6(a)) set on the -Y side and +X side of the substrate P, so the main control device 50 is located here Before the exposure operation of the first shot region S1, detection of, for example, 12 marks Mk formed on a half of the +X side of the substrate P is performed.

The main control device 50 (refer to FIG. 7) is shown in FIG. 8(a), for example, among the four mark rows formed on the substrate P, the second mark row from the +X side is located in a plurality of alignment sensors Directly below 96, control the board carrier device 20 to position the substrate P, In this state, as shown in FIG. 8(b), a plurality of alignment sensors 96 measure the mark Mk positioned directly below and near (not shown in FIG. 8(b). Refer to FIG. 8(a)). The position of the black mark Mk) in the XY plane.

Next, the main control device 50 (refer to FIG. 7), as shown in FIG. 9(a), controls the substrate stage device 20 so that, for example, the four mark rows formed on the substrate P are formed on the most +X side of the mark row The positioning of the substrate P is performed by the method located directly below the plurality of alignment sensors 96. In this state, as shown in FIG. 9(b), the plurality of alignment sensors 96 are measured and positioned directly below The nearby mark Mk (not shown in Fig. 9(b). Refer to the black mark Mk in Fig. 9(a)) in the XY plane.

The main control device 50 (refer to FIG. 7) uses the well-known enhanced full wafer alignment (EGA) based on the position information of a total of 12 marks Mk obtained by the above-mentioned two measurement operations of the alignment marks Mk. In this way, the arrangement information (including information about the position (coordinate value), shape, etc. of the division area) of the first irradiation area S1 (refer to Fig. 6(a)) is calculated. In addition, in this embodiment, in order to suppress the amount of movement of the substrate stage device 20 when the exposure operation of the first shot region S1 in the previous step is moved, the mark row of the second row from the +X side is detected initially. Afterwards, the label row closest to the +X side is detected, but the order of the above detection can also be reversed.

As described above, the detection operation of the mark row is performed in the Y-axis direction so that the center of the non-contact holder 32 and the center of the exposure area IA are approximately the same. Therefore, the main control device 50 (refer to FIG. 7), after calculating the arrangement information of the first shot area S1, in order to perform the scanning exposure operation of the first shot area S1, as shown in FIG. 10(a), set the substrate The carrier 40 is driven with a predetermined stroke (about half the length of the substrate P in the Y axis direction) in the +Y direction relative to the non-contact holder 32, thereby positioning the substrate P at the predetermined exposure start position. At this time, although the substrate The area near the end of the P +Y side will be detached from the non-contact holder 32 without plane correction, but the area including the first shot area S1 (refer to FIG. 6(a)) of the exposure object will be maintained because The state of plane correction, so it will not affect the exposure accuracy. In addition, the non-contact holder 32, the pair of auxiliary stages 34, and the substrate carrier 40 are integrally driven in the −X direction so that the exposure area IA is located outside the substrate P (+X side).

Thereafter, as shown in Figures 11(a) and 11(b), the non-contact holder 32, the pair of auxiliary platforms 34, and the substrate carrier 40 are integrally driven in the +X direction (acceleration, constant velocity movement, deceleration ) (Refer to the black arrow in Figure 11(a)). The projection optical system 16 projects the illumination light IL (not shown in FIG. 11(a)) which passes through the mask M (refer to FIG. 1) to the substrate P moving at a constant speed. At this time, the main control device 50 (refer to FIG. 7) is based on the calculation result of the output of the mask alignment system (not shown) and the above-mentioned arrangement information, while performing the micro-amplification of the substrate carrier 40 in the horizontal plane with 3 degrees of freedom. Positioning (refer to the white arrow and the θz direction in FIG. 11(a)), while moving the substrate P in the +X direction with respect to the illumination light IL (exposure area IA). In addition, the liquid crystal exposure device 10 (refer to FIG. 1), in parallel with the above-mentioned precise alignment operation, previously performed focus mapping using an autofocus sensor (surface position measurement system of the substrate P) not shown in the figure. During the scanning exposure operation described above, the main control device 50 appropriately drives the non-contact holder 32 in the Z tilt direction slightly according to the result of the focus mapping. In addition, FIGS. 11(a) and 11(b) show the substrate stage device 20 immediately after the scanning exposure operation for the first shot region S1 is completed. In addition, although it is described that the liquid crystal exposure device 10 performs focus mapping for positioning the Z-direction position of the substrate P in advance, it may not be performed beforehand, and the focus mapping may be performed at any time immediately before the scan exposure while performing the scanning exposure operation.

Next, the main control device 50 (refer to FIG. 7) is set in the first The second irradiation area S2 on the +Y side of the irradiation area S1 (refer to Fig. 6(a)) is exposed, and as shown in Fig. 12(a) and Fig. 12(b), the substrate carrier 40 is held relatively non-contact Tool 32 drives in the -Y direction.

The main control device 50 (refer to FIG. 7) is from the state shown in FIG. 12(a), as shown in FIGS. 13(a) and 13(b), while moving the substrate carrier 40 and the non-contact holder 32 to -Drive in the X direction, while projecting the illumination light IL to the substrate P, the mask pattern is transferred to the second irradiation area S2. At this time, although the -Y side end of the substrate P also protrudes to the outside of the non-contact holder 32, since the second irradiation area S2 has been plane-corrected by the non-contact holder 32, the exposure accuracy will not be affected .

Here, the main control device 50 (refer to FIG. 7) is based on the alignment measurement operation (FIG. 8(a) ~ FIG. 9(b)) performed before the exposure operation of the first shot region S1. The position information of the 12 marks Mk obtained is obtained, the arrangement information of the second shot area S2 is obtained, and the scanning exposure of the second shot area S2 is performed while the substrate P is slightly positioned in the direction of 3 degrees of freedom based on the arrangement information. That is, in this embodiment, the alignment measurement area is formed across the first and second irradiation areas S1 and S2 by a plurality of (for example, six in this embodiment) alignment sensors 96, so the main control The device 50 can detect all the marks Mk formed in the first and second irradiation regions S1 and S2 through two mark detection operations. Next, the main control device 50 detects all the marks Mk formed in the first and second shot regions S1 and S2 before the scanning exposure operation of the first and second shot regions S1 and S2. Therefore, the main control device 50 no longer detects the mark Mk in the second shot area S2 before the exposure action of the second shot area S2 (only performs the calculation of the arrangement information), and illuminates the first and second shots. The areas S1 and S2 are continuously exposed.

After the scanning exposure operation of the second shot area S2 ends, the main control device 50 (Refer to FIG. 7), in order to perform scanning exposure of the third and fourth shot regions S3, S4 (refer to FIG. 6(a), respectively), the marks formed in the third and fourth shot regions S3, S4 are performed Mk's detection action. The main control device 50 is the same as during the mark detection operation in the first and second irradiation regions S1 and S2, as shown in Fig. 14(a) and Fig. 14(b), moves the substrate carrier 40 to +Y Directional driving performs positioning of the substrate P in such a manner that substantially the entire substrate P is supported by the non-contact holder 32 (planar correction).

The main control device 50 (refer to FIG. 7) drives the non-contact holder 32, the pair of auxiliary platforms 34, and the substrate carrier 40 in the +X direction integrally to form, for example, four mark rows on the substrate P When viewed from the +X side, the third row of mark rows is positioned directly below the plurality of alignment sensors 96 to position the substrate P. In this state, as shown in Figure 14(b), the plurality of The alignment sensor 96 measures the position in the XY plane of the mark Mk (not shown in FIG. 14(b). Refer to the black-out mark Mk in FIG. 14(a)) located in the vicinity of the position directly below.

Next, the main control device 50 (refer to FIG. 7), as shown in FIG. 15(a), controls the substrate stage device 20 so that, for example, the mark formed on the most -X side of the four mark rows formed on the substrate P The positioning of the substrate P is performed in a way that the alignment sensor 96 is located directly below the plurality of alignment sensors 96. In this state, as shown in FIG. 15(b), the alignment sensors 96 are measured and positioned on the front The mark Mk near the lower part (not shown in Fig. 15(b). Refer to the black mark Mk in Fig. 15(a)) in the XY plane. The main control device 50 calculates the third and fourth irradiation areas S3, S4 by the EGA method based on the position information of a total of 12 marks Mk obtained by the above-mentioned two measurement operations of the alignment mark Mk (refer to FIG. 6 (a)) Arrangement information.

Hereinafter, the main control device 50 (refer to FIG. 7), not shown, is the same as the scanning exposure operation of the first and second shot regions S1 and S2 (FIG. 10(a)~FIG. 13(b)). Specifically, while appropriately controlling the substrate stage device 20 based on the above-mentioned arrangement information, the scanning exposure operations of the third and fourth irradiation regions S3 and S4 are sequentially performed.

According to the liquid crystal exposure apparatus 10 of the present embodiment described above, a precision alignment measurement system including, for example, six alignment sensors 96 can simultaneously detect a plurality of irradiation areas (the first and the first in the above-mentioned embodiment). 2) multiple marks Mk in the irradiation areas S1, S2, or the third and fourth irradiation areas S3, S4). Therefore, it is possible to shorten the mark measurement time compared to the case where the mark detection operation is performed for each irradiation area. Therefore, the overall production capacity is increased.

。 In addition, since the non-contact holder 32 has a size that substantially corrects the plane of the substrate P, as described above, even if the simultaneous position measurement of the marks Mk across a plurality of irradiation areas is performed, the plurality of The illuminated area becomes the state after plane correction. Therefore, the position information of a plurality of markers Mk can be obtained reliably

.

"Second Embodiment"

Next, the second embodiment will be described with reference to Figs. 16(a) and 16(b). In the structure of the liquid crystal exposure apparatus of the second embodiment, the structure of the substrate stage device 120 for accurately positioning the substrate P with respect to the projection optical system 16 (refer to FIG. 1) is different from that of the above-mentioned first embodiment. Hereinafter, regarding this second embodiment, only the differences from the above-mentioned first embodiment will be described. Elements having the same configuration and function as those of the above-mentioned first embodiment are given the same reference numerals as in the above-mentioned first embodiment. The description is omitted.

In the above-mentioned first embodiment, the frame-like (frame-like) substrate carrier 40 that holds the substrate P can independently move with a predetermined stroke in the non-scanning direction (Y-axis direction) relative to the non-contact holder 32 (see FIG. 1 etc.) ), in contrast to this, in the substrate stage device 120 in the second embodiment shown in FIGS. 16(a) and 16(b), the substrate carrier 140 is in the scanning direction (X-axis direction). The non-scanning direction and the non-contact holder 32 move integrally with a predetermined long stroke, and this point is different. The point that the substrate carrier 140 can move with a slight stroke in the 3-degree-of-freedom direction in the horizontal plane relative to the non-contact holder 32 is the same as the substrate stage device 20 of the first embodiment described above.

In more detail, in this second embodiment, the coarse motion stage 124 is configured to be movable in the X-axis and Y-axis directions with a predetermined long stroke. Although the structure for moving the coarse motion stage 124 in the Y-axis direction with a long stroke is not particularly limited, for example, a well-known gate-type XY stage device disclosed in the specification of US Patent Application Publication No. 2012/0057140 can be used. In addition, the weight elimination device 26 is connected to the coarse motion stage 124 so as to move in the X-axis and Y-axis directions with a predetermined long stroke integrally with the coarse motion stage 124. In addition, the X guide rod 28 (see FIG. 1 and the like) can also be moved in the Y-axis direction with a predetermined long stroke. Although the structure for moving the X guide rod 28 in the Y axis direction with a long stroke is not particularly limited, it can be mechanically connected to the Y stage of the XY stage device described above, for example. The coarse motion stage 124 and the substrate platform 30 are connected mechanically (but in a state capable of slightly moving in the Z tilt direction) through a plurality of connecting devices 30b (flexing devices), which is the same as the above-mentioned first embodiment. Thereby, the substrate platform 30 and the non-contact holder 32 are integrated with the coarse motion stage 124 to move in the X-axis and Y-axis directions with a predetermined long stroke.

The substrate carrier 140 has a main body portion 142 formed in a rectangular frame shape in a plan view, and a suction portion 144 fixed on the upper surface of the main body portion 142. The suction part 144 is also formed in a rectangular frame shape in a plan view, similarly to the main body part 142. The substrate P is held by the suction portion 144 by, for example, vacuum suction. The non-contact holder 32 is inserted into the opening of the suction portion 144 with a predetermined gap formed on the inner wall surface of the suction portion 144. The point that the non-contact holder 32 applies a load (preload) to the substrate P to correct the plane in a non-contact manner is the same as the above-mentioned first embodiment.

In addition, from the lower surface of the substrate platform 30, a plurality of guide plates 148 (for example, four in this embodiment) guide plates 148 extend radially along the horizontal plane. The substrate carrier 140 has a plurality of pads 146 including air bearings corresponding to the plurality of guide plates 148, and is in a non-contact state by the static pressure of the pressurized gas sprayed from the air bearing to the guide plate 148 Placed on the guide plate 148. Since the substrate platform 30 is slightly driven in the Z tilt direction, the plurality of guide plates 148 also move in the Z tilt direction (posture change) integrally with the substrate platform 30. Therefore, when the posture of the substrate platform 30 changes, the The substrate stage 30, the non-contact holder 32, and the substrate carrier 140 (that is, the substrate P) change postures integrally.

In addition, the substrate carrier 140 is opposed to the substrate platform 30 through a plurality of linear motors 152 (X voice coil motors and Y voice coil motors) including the movable parts of the substrate carrier 140 and the fixed parts of the substrate platform 30. It is slightly driven in the direction of 3 degrees of freedom in the horizontal plane. In addition, when the substrate stage 30 moves along the XY plane with a long stroke, the substrate stage 30 and the substrate carrier 140 are integrated with the substrate carrier 140 to move along the XY plane with a long stroke, and the substrate carrier 140 is moved by the plurality of linear motors 152. The point of imparting thrust is the same as in the first embodiment described above.

In the vicinity of the ends on the +Y side and -Y side of the upper surface of the substrate carrier 140, a plurality of scale plates 46 are respectively fixed in the same manner as in the above-mentioned first embodiment. The method of using the scale plate 46 to obtain the position information of the substrate carrier 140 (ie, the substrate P) in the three-degree-of-freedom direction in the horizontal plane is the same as that of the above-mentioned first embodiment, so the description is omitted.

Similarly in the second embodiment, on the substrate P, for example, four mark rows including six marks Mk arranged at a predetermined interval in the Y-axis direction are formed at predetermined intervals in the X-axis direction, and the main control device 50 ( Referring to FIG. 7), the non-contact holder 32 and the substrate carrier 140 are integrally moved to X in such a way that the mark row is located in the detection field of view of the plurality of alignment sensors 96 Axis direction. In addition, in the above-mentioned first embodiment, when moving between the irradiation areas (Y step movement), the substrate carrier 40 moves with a long stroke in the Y-axis direction relative to the non-contact holder 32 (refer to FIG. 12(a), etc.) However, in this second embodiment, during the Y stepping operation described above, the non-contact holder 32 and the substrate carrier 140 move in the Y-axis direction integrally. Regarding the exposure operation using the substrate stage device 120 of the second embodiment, since it is the same as the exposure operation of the substrate P using the conventional XY stage, the description is omitted. This second embodiment can also obtain the same effects as the above-mentioned first embodiment.

In addition, the configuration described in each of the above-mentioned first and second embodiments can be appropriately changed. For example, in each of the above-mentioned embodiments, since the scanning exposure of the first and second irradiation regions S1 and S2 may cause the shape change (twist, etc.) of the substrate P, the first and second irradiation regions S1 and S2 may change shape (twist, etc.). The alignment measurement of the third and fourth shot regions S3, S4 is performed after the scanning exposure of S2, but it is not limited to this, and all (first to fourth) may be performed before the exposure of the first shot region S1. Within the irradiation area S1~S4) mark the detection action of Mk, and according to the detection result, continuously perform the exposure action of all the irradiation areas S1~S4. In this case, the production capacity can be increased.

In addition, in each of the above-mentioned embodiments, although a sensor group constituted by six alignment sensors 96 arranged at the same position in the X-axis direction and arranged at predetermined intervals in the Y-axis direction, the substrate P is detected at the same time. For example, the above six marks Mk, but the number and arrangement of the alignment sensors 96 are not limited to this, and can be changed appropriately. For example, in addition to the above-mentioned sensor group, another sensor group of the same configuration, such as six alignment sensors 96, may be arranged. In this case, the distance between the above two sensor groups in the X-axis direction can be set to simultaneously detect the first and second mark rows (and the third and fourth mark rows when viewed from the +Y direction). Mark row), and the first and second shot areas S1 and S2 (or the third and fourth shot areas S3, The position measurement of all marks Mk in S4).

In addition, in each of the above-mentioned embodiments, the substrate carrier 40 and the like are formed by, for example, four frame members (a pair of X frames 42x and a pair of Y frames) along the outer peripheral edge (four sides) of the substrate P. The frame 42y) is formed in the shape of a rectangular frame, but it is not limited to this as long as the substrate P can be reliably sucked and held. The substrate carrier 40 and the like may be formed of a frame member along a part of the outer periphery of the substrate P, for example. constitute. Specifically, the substrate carrier can also be formed by, for example, three frame members along three sides of the substrate P in a top view U-shape, or it can also be formed by, for example, two frame members along two adjacent sides of the substrate P It is an L-shape looking down. In addition, the substrate carrier may also be formed by, for example, only one frame member along one side of the substrate P. In addition, the substrate carrier may also be constituted by a plurality of members that hold different parts of the substrate P and perform position control independently of each other.

In addition, the Z tilt position measurement system 58, although shown in FIG. 2 or FIG. 13, uses a laser displacement meter 58a provided under the substrate platform 30 to irradiate and measure the target 58b fixed to the housing of the weight reduction device 26 And receive the reflected light to obtain the displacement information of the substrate platform 30 in the Z-axis direction, but it is not limited to this. It is also possible to replace the Z tilt position measuring system 58 by disposing the Z sensor head 78z together with the X head 78x and the Y head 78y in the head unit 72. As the Z sensor head 78z, for example, a laser displacement meter can be used. In the X frame 42x, there is no area where the scales facing the X head 78x and the Y head 78y are arranged, and a reflective surface is formed by mirror processing. The Z-sensor reading head 78z irradiates the measuring beam on the reflective surface and receives the reflected beam from the reflective surface to obtain the displacement of the substrate carrier 40, 440 in the Z-axis direction in the irradiation point of the measuring beam News. In addition, the type of Z-read head 78z, as long as it can measure the substrate carriers 40, 440 (more Specifically, it is the displacement of the X frame 42x) in the Z-axis direction, and it is not particularly limited.

In addition, although the X-encoder head 78x and Y-encoder head 78y are used to obtain the position information of the substrate P and the Y slider 76 in the XY plane, for example, information that can measure the amount of displacement in the Z-axis direction can also be used. The two-dimensional encoder read head (XZ encoder read head or YZ encoder read head), together with the position information of the substrate P and Y slider 76 in the XY plane, calculate the respective position of the substrate P and Y slider 76 Z tilt displacement information. In this case, the Z tilt position measuring system 58 or the Z sensor head 78z for obtaining the Z tilt position information of the substrate P can be omitted. In addition, in this case, in order to obtain the Z tilt position information of the substrate P, there must be two downward Z reading heads facing the scale plate 46 at any time, so it is better to use the same length as the X frame 42x One piece of long scale board constitutes the scale board 46, or the above-mentioned two-dimensional encoder heads are arranged at predetermined intervals in the X-axis direction, for example, three or more.

In addition, in each of the above-mentioned embodiments, although the plurality of scale plates 46 are arranged at predetermined intervals in the X-axis direction, it is not limited to this. For example, it may be formed to have the same length as the length of the substrate carrier 40 in the X-axis direction. The ruler board is one of the long strips. In this case, since the opposing state of the scale board and the reading head is maintained at any time, the X reading head 78x and the Y reading head 78y of each reading head unit 72 can be one respectively. The same applies to the scale plate 82. When a plurality of scale plates 46 are provided, the length of each scale plate 46 may be different from each other. For example, by setting the length of the scale plate extending in the X-axis direction to be longer than the length of the irradiation area in the X-axis direction, the position control of the substrate P by the read head unit 72 across different scale plates 46 can be avoided during scanning exposure. . In addition, in (for example, the case of capturing 4 surfaces and the case of capturing 6 surfaces), the length of the scale arranged on one side of the projection optical system 16 and the scale arranged on the other side may be different from each other.

In addition, in the above-mentioned embodiments, the position in the horizontal plane of the substrate carrier 40, etc. Although the measurement is performed using an encoder system, it is not limited to this. For example, rod mirrors extending in the X-axis direction and Y-axis direction can be mounted on the substrate carrier 40, and the rod mirror is used for interference. Instrument system to measure the position of the substrate carrier 40 and so on. In addition, although the encoder system of each of the above-mentioned embodiments has a structure in which the substrate carrier 40 has a scale plate 46 (diffraction grid) and the head unit 72 has a measuring head, it is not limited to this, and may be a substrate carrier. 40 and the like have a measuring head, and a scale plate that moves synchronously with the measuring head is mounted on the device body 18 (the configuration is opposite to the above-mentioned embodiments).

In addition, in each of the above embodiments, the non-contact holder 32 supports the substrate P in a non-contact manner, but it is not limited to this as long as it does not hinder the relative movement of the substrate P and the non-contact holder 32 in a direction parallel to the horizontal plane. It can also be supported in a contact state through rolling elements such as balls.

In addition, the light source used in the illumination system 12 and the wavelength of the illumination light IL irradiated from the light source are not particularly limited. For example, it may be ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength 248nm), etc. Light, or F2 laser light (wavelength 157nm) and other vacuum ultraviolet light.

In addition, in each of the above-mentioned embodiments, the same magnification system is used as the projection optical system 16, but it is not limited to this, and a reduction system or an enlargement system may be used.

In addition, the use of the exposure device is not limited to the exposure device for liquid crystal that transfers the pattern of the liquid crystal display element to the square glass plate, but can also be widely applied to the exposure device for the manufacture of organic EL (Electro-Luminescence) panels and the manufacture of semiconductors. The exposure device, the exposure device used to manufacture thin film magnetic heads, micromachines and DNA chips. In addition, not only micro-elements such as semiconductor elements, but also for manufacturing light exposure equipment, EUV exposure equipment, and X-ray exposure It can also be applied to photomasks or reticles used in devices and electron beam exposure devices, as well as exposure devices that transfer circuit patterns to glass substrates or silicon wafers.

In addition, the object to be exposed is not limited to a glass plate, and may be other objects such as a wafer, a ceramic substrate, a thin film member, or a mask master (blank mask). In addition, when the exposure target is a substrate for a flat-panel display, the thickness of the substrate is not particularly limited, and it also includes those in the form of a film (a flexible sheet-like member). Moreover, the exposure apparatus of this embodiment is especially effective when a board|substrate with a side length or a diagonal length of 500 mm or more is an exposure object. In addition, when the substrate to be exposed is a flexible sheet, the sheet may be formed in a roller shape.

Electronic components such as liquid crystal display components (or semiconductor components) are through the steps of designing the functional performance of the components, the steps of making masks (or reticles) according to this design step, and the steps of making glass substrates (or wafers) , The lithography step of transferring the pattern of the photomask (reticle) to the glass substrate by the exposure device and the exposure method of the above embodiments, the development step of developing the exposed glass substrate, and the remaining resist The exposed member of the part other than the part is manufactured by an etching step in which etching is removed, a resist removal step in which unnecessary resist is removed after etching, a component assembly step, an inspection step, and the like. In this case, since the exposure device of the above-mentioned embodiment is used in the lithography step to implement the aforementioned exposure method to form a device pattern on the glass substrate, it is possible to manufacture a high-integration device with good productivity.

In addition, the disclosures of all U.S. patent application publications and U.S. patent specifications related to the exposure apparatus cited in the above-mentioned embodiments are cited as part of the description of this specification.

Industrial availability

As explained above, the exposure device and exposure method of the present invention are suitable for transmitting light The imaging system performs exposure while scanning the object with illumination light. In addition, the manufacturing method of the flat panel display of the present invention is suitable for the production of flat panel displays. In addition, the device manufacturing method of the present invention is suitable for the production of micro devices.

16: Projection optical system

20: substrate stage device

28: X guide rod

30: substrate platform

32: Non-contact holder

34: auxiliary platform

36: Air floating unit

40: substrate carrier

44: Adsorption pad

46: Ruler board

62: Y linear actuator

64: Y voice coil motor

66: X voice coil motor

92: Pre-aligned sensor

92a: light source

92b: Light receiving part

94: pre-aligned sensor

94a: light source

94b: Light receiving part

96: Align the sensor

IA: exposure area

IL: Illumination light

Mk: mark

P: substrate

S1~S4: 1st~4th irradiation area

Claims (23)

An exposure device that illuminates an object with a plurality of marks through an optical system, and makes the object move relative to the illumination light in a first direction to respectively scan and expose a plurality of divided regions of the object, and includes: The support portion can support the plurality of divided regions arranged side by side in a second direction that intersects the first direction in a non-contact manner; the first driving portion moves the first support portion in the first direction; the holding portion, Holds the object supported by the first support part in a non-contact manner; a second drive part moves the holding part in the first or second direction; and a detection part detects and is supported by the first support part The detection operation of the plurality of markings corresponding to the plurality of division areas; the second driving part, when the detection operation of the plurality of markings by the detection part ends, the holding part is opposed to the first support part Relatively move so that a part of the first division area among the plurality of division areas for which the detection operation has been performed is separated from the first support portion; the first drive portion and the second drive portion make the first support portion The holding portion moves in the first direction to scan and expose a second divisional area adjacent to the first divisional area in the second direction. For example, the exposure device of the first item of the scope of patent application, wherein at least one of the first and second driving parts is maintained in such a manner that the plurality of marks of the detection target are located in the detection area of the detection part The part moves relative to the aforementioned detection part. For example, in the exposure device of the first or second patent application, the detection section is provided in a state where all the division areas of the object are supported by the first support section to perform the detection operation. For example, the exposure device of the first or second patent application, wherein the second driving part supports the first of the second divided areas scanned and exposed among the plurality of divided areas where the detection operation has been performed. The supporting position of the supporting portion is changed by relatively moving the holding portion with respect to the first supporting portion. For example, the exposure device according to the first or second patent application, further comprising: a second supporting part supporting the movement of the holding part in the second direction by the second driving part in the first division area And the area detached from the aforementioned first support part. For example, the exposure device of the first or second patent application, wherein the first supporting part and the holding part are provided so as not to contact each other. For example, the exposure device of the first or second patent application, wherein the first support part supports an area different from the holding area of the object held by the holding part. For example, the exposure apparatus of the first or second patent application, wherein the first support portion has a first air supply hole for supplying gas between the object and the first support portion. For example, the exposure device of claim 8, wherein the first support part has a suction hole for sucking the gas between the object and the first support part. For example, the exposure device of the first or second item of the scope of the patent application, which includes a second support portion provided on one side and the other side of the aforementioned first support portion in the aforementioned second direction to support the aforementioned object; the aforementioned second drive The part moves the object supported by the holding part from one of the first support part and the second support part to the other. As for the exposure apparatus of claim 10, the second supporting portion has a second air supply hole for supplying gas between the object and the second supporting portion. For example, the exposure apparatus of item 1 or 2 of the scope of patent application is provided with a third supporting part supporting the holding part; the third supporting part is provided at a position lower than the first supporting part in the vertical direction. For example, the exposure device of item 1 or 2 of the scope of patent application further includes an encoder system for obtaining the position information of the holding part; at least one of the reading head and the scale constituting the encoder system is provided in the holding part. Such as the exposure device of the first or second patent application, wherein the holding portion includes a frame-shaped member that supports at least a part of the outer peripheral portion of the object. Such as the exposure device of the 1st or 2nd patent application, wherein the aforementioned system is used for the substrate of the flat panel display. Such as the exposure device of the 15th patent application, wherein the length of at least one side or the diagonal length of the aforementioned substrate is 500 mm or more. A method for manufacturing a flat-panel display includes: using the exposure device of any one of the scope of the patent application to expose the aforementioned object; and the operation of developing the aforementioned object after exposure. A method of manufacturing a device, which includes: the operation of exposing the aforementioned object by using the exposure device of any one of the scope of the patent application from 1 to 16; and the operation of developing the aforementioned object after the exposure. An exposure method is to irradiate illuminating light to an object with a plurality of marks through an optical system, so that the object moves relative to the illuminating light in a first direction to respectively scan and expose a plurality of divided regions of the object, which includes: The movement of the first support portion to support the plurality of divided regions arranged in a row in a second direction intersecting the first direction in a non-contact manner; the holding portion holds the object supported by the first support portion in a non-contact manner Action; the detection unit is used to detect the detection operation of the plurality of marks corresponding to the plurality of division areas; when the detection operation of the plurality of marks by the detection unit ends, the first drive unit is used to make the detection The holding portion moves relative to the first support portion so that a part of the first division area of the plurality of division areas where the detection operation has been performed is separated from the first support portion; and by the first drive Section, and a second drive section that moves the first support section, moves the first support section and the holding section in the first direction, and scans and exposes the area adjacent to the first division area in the second direction Operation of the second division area. For example, the exposure method of item 19 of the scope of patent application, wherein the holding portion is moved relative to the detecting portion in such a manner that the plurality of marks of the object to be detected are located in the detecting area of the detecting portion. Such as the exposure method of item 19 or 20 in the scope of the patent application, wherein the detection section is used, and the detection operation is performed in a state where all the division areas of the object are supported by the first support section. For example, the exposure method of item 19 or 20 of the scope of patent application, in which the first driver mentioned above is used The moving portion relatively moves the holding portion relative to the first supporting portion in such a manner that the supporting position in the first supporting portion in the second divided area supporting the plurality of divided areas where the detection operation has been performed is changed. For example, the exposure method of item 19 or 20 of the scope of the patent application further includes an operation of supporting the area separated from the first support portion in the first division area by the second support portion.

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