TWI718575B - Metal mask - Google Patents

Abstract

A metal mask includes a mask plate body of metal material and an etching structure formed on one or both sides of the mask plate body. The etching structure has at least one patterned etching groove, and the mask plate body is in the patterned etching groove. The side along the thickness direction of the plate has a base of the plate body, wherein patterned ribs are formed in the patterned etching groove of the etching structure on a single side or both sides of the plate body, or both sides of the plate body are masked Form a symmetrical or asymmetrical etching structure, so that the base of the plate is located in the middle of the thickness of the mask plate, etc., so that the metal mask does not change the thickness of the mask plate, effectively improving its mechanical strength, and Possesses the effect of improving the adhesive sheet during the coating process.

Description

Metal mask

The present invention relates to a metal mask, especially a metal mask used in the coating process to provide a partial masking function for forming a patterned coating on the surface of a glass substrate or a flexible substrate.

In the current manufacturing process of Organic Light-Emitting Diode (OLED) type displays, as shown in FIG. 6, physical vapor deposition (physical vapor deposition, PVD) or chemical vapor deposition (chemical vapor deposition, CVD), etc., when combined with a metal mask 40 with a plurality of patterned plating holes 41 for the coating process, the shadow effect can be prevented. The metal mask 40 must be in contact with the substrate 50 (such as a glass substrate or a flexible substrate, etc.) for the coating process.

In the aforementioned coating process, since the surfaces of the metal mask 40 and the substrate 50 (glass substrate or flexible substrate, etc.) are smooth, in a vacuum environment, adhesion between the metal mask 40 and the substrate 50 (glass substrate or flexible substrate, etc.) is likely to occur. Film phenomenon. In order to improve the problem of sticking in the aforementioned coating process, as shown in FIG. 7, generally related manufacturers currently mostly apply half-etching to the metal mask 60, so that one side of the metal mask 60 is opposite to the patterned coating hole. Half-etched grooves 62 are formed in the peripheral areas of 61 respectively.

However, the process of the half-etching process is more difficult for the control of the precision etching process, resulting in a high product defect rate of the metal mask and a relatively high manufacturing cost. Moreover, when the metal mask is subjected to unbalanced tensile tension, unbalanced strains will be generated, causing deformation or warping of local parts of the metal mask, which affects the quality of the coating.

In addition, in the aforementioned coating process, when the coating step is completed and the vacuum is released, the contact area between the metal mask and the glass substrate or flexible substrate is likely to be stuck due to local low vacuum during the detachment process. This phenomenon causes friction between two objects of dissimilar materials such as a metal mask and a glass substrate or a flexible substrate, which may easily cause scratches, abrasions, and other appearance defects.

The purpose of the present invention is to provide a metal mask, which solves the problem that the structure of the existing metal mask is difficult to achieve better mechanical strength after half-etching in order to improve the problem of the adhesive sheet.

In order to achieve the foregoing objective, the metal mask proposed by the present invention includes: a mask plate body of metal material, which defines a contact area and a peripheral area located at the periphery of the contact area. The contact area is provided with a plurality of plated pattern holes And a shielding portion located between adjacent plating pattern holes; and an etching structure formed on one side of the mask plate body, and the mask plate body is along the plate of the mask plate body in the etching structure The other side in the thickness direction has a plate base, the etching structure includes at least one patterned etching groove and at least one patterned rib located in the patterned etching groove, and the etching depth of the patterned etching groove Less than or equal to the thickness of the base of the board, and the patterned rib is connected to the base of the board.

In order to achieve the foregoing objective, another metal mask provided by the present invention includes: a mask plate of a metal material, which defines a contact area, and a peripheral area located at the periphery of the contact area, and a plurality of coating films are provided in the contact area Pattern holes and shielding portions located between adjacent plating pattern holes; and two etching structures formed on opposite sides of the mask plate body, the mask plate body having a plate body between the two etching structures A base, the etching structure includes at least one patterned etching groove and at least one patterned rib located in the patterned etching groove, and the sum of the etching depths of the patterned etching grooves of the two etching structures is less than or equal to the plate The thickness of the body base, the groove width of the patterned etching groove is greater than or equal to the rib width of the patterned rib, and the patterned rib is a flat surface relative to the surface of the other side of the board base, the The patterned rib is connected to the base of the board.

In order to achieve the foregoing objective, another metal mask provided by the present invention includes: a mask plate of a metal material, which defines a contact area, and a peripheral area located at the periphery of the contact area, and a plurality of coating films are provided in the contact area Pattern holes and shielding portions located between adjacent plating pattern holes; and two etching structures formed on opposite sides of the mask plate body, the mask plate body having a plate body between the two etching structures At the base, each of the etching structures has a patterned etching groove, and the sum of the etching depths of the patterned etching grooves of the two etching structures is less than or equal to the thickness of the base of the board.

Through the aforementioned structural invention of the metal mask, the patterned etching grooves are formed on one or both sides of the mask plate to maintain the effect of the metal mask to improve the adhesive sheet of the coating process. The metal mask of the present invention also has the advantages of Patterned ribs are formed in the patterned etching grooves of the etching structure on one or both sides of the mask plate, or the etching structure on both sides of the mask plate is used to make the base of the plate in the thickness of the mask plate The etched structure can effectively improve the mechanical strength of the metal mask without changing the thickness of the mask plate.

When the metal mask of the present invention has patterned ribs in the patterned etching grooves on a single side or both sides of the mask plate, a plurality of groove units in the patterned etching groove can be connected as a whole to make the pattern of the etching structure The pattern of the chemical etching groove is a continuous pattern, which helps the metal mask to quickly release the vacuum suction when the vacuum is vented, and reduces the friction and scratches of the dissimilar materials between the metal mask and the substrate. When the plurality of groove units are not all connected, the pattern of the patterned etching groove of the etching structure can be made into a discontinuous pattern, and the plurality of patterned ribs are connected to form a continuous pattern, and are connected to the peripheral area of the mask plate body, so , The tension on the peripheral area of the mask plate can be transmitted to the edge of each plated pattern hole in the contact area through the base of the plate and the patterned ribs forming a continuous pattern, and a balanced strain effect can be produced.

When the metal mask of the present invention has a structure of a single patterned etching groove in the patterned etching grooves on both sides of the mask plate, it is helpful for the metal mask to quickly release the vacuum suction when the vacuum is vented, and reduce the metal mask. The case of the cover and the substrate being scratched by the friction of different materials.

10A, 10B, 10C: Mask plate

101: first side

102: second side

11: contact area

111: Coated pattern hole

112: Shading part

113: Hole Edge

12: Surrounding area

13A, 13B, 13C: base of plate

20A, 20B, 20C: etching structure

21A, 21B, 21C: patterned etching groove

211A, 211B: Slot unit

22A, 22B: Patterned ribs

D: The thickness of the mask body

H: etching depth

W1: The groove width of the patterned etching groove

W2: Rib width of patterned ribs

30: substrate

40: metal mask

50: substrate

60: metal mask

61: Patterned coating hole

62: Half-etched groove

FIG. 1 is a schematic plan view of the first preferred embodiment of the metal shield of the present invention.

FIG. 2 is a partial plan view of the first preferred embodiment of the metal shield shown in FIG. 1. FIG.

FIG. 3 is a partial plan view of the second preferred embodiment of the metal shield of the present invention.

4 is a partial plan view of the third preferred embodiment of the metal shield of the present invention.

FIG. 5 is a reference diagram of the use state of the third preferred embodiment of the metal mask shown in FIG. 4 when contacting the substrate for coating operations.

FIG. 6 is a schematic plan view of the first existing metal mask contacting the substrate for film coating operation.

Fig. 7 is a schematic plan view of a second type of metal mask in the prior art.

According to the technical means disclosed in the foregoing content of the invention, the metal mask of the present invention can be implemented in at least the following various specific and feasible preferred embodiments. As shown in FIGS. 1 to 4, as can be seen in the preferred embodiments disclosed by these drawings, the metal mask includes a mask plate body 10A, 10B, 10C formed by a metal material and formed on the One or two etching structures 20A, 20B, and 20C in the mask plate body 10A, 10B, and 10C.

The two opposite sides of the mask plate 10A, 10B, and 10C are respectively a first side 101 and a second side 102, as shown in FIGS. 1 and 2. When the etching structure 20A is one, the etching structure 20A is formed on a single side of the mask plate body 10A, that is, the etching structure 20A is formed on the mask plate body Either one of the first side 101 and the second side 102 of 10A, and the other side of the mask plate 10A relative to the etching structure is a plate base 13A; as shown in FIGS. 3 and 4, When there are two etching structures 20B, 20C, the two etching structures 20B, 20C are formed on opposite sides of the mask plate body 10B, 10C, that is, the two etching structures 20B, 20C are respectively formed on The first side 101 and the second side 102 of the mask plate body 10B, 10C. The mask plate body 10B, 10C has a plate body base 13B, 13C between the two etching structures 20B, 20C.

As shown in FIGS. 1 to 4, the mask plates 10A, 10B, and 10C all define a contact area 11, and a peripheral area 12 located at the periphery of the contact area 11, and the contact area 11 is used to interact with the substrate to be coated ( Such as glass substrate or flexible substrate, etc.), the peripheral area 12 provides a fixed location. The contact area 11 is provided with a plurality of coating pattern holes 111 and a shielding portion located between adjacent coating pattern holes 111 112. Each of the plating pattern holes 111 is a perforation that penetrates the mask plate body 10A, 10B, and 10C.

As shown in FIGS. 1 to 4, the etching structures 20A, 20B, and 20C are formed at least in the shielding portion 112 of the contact area 11 by etching means. The etching structures 20A, 20B, and 20C can also be metal masks. The product requirements are further formed in the peripheral area 12, wherein the etching structures 20A, 20B, 20C do not penetrate the shielding portion 112 of the contact area 11, and the etching structures 20A, 20B, 20C are located within the shielding portion 112 The area of is greater than or equal to 20% of the total area of the contact area 11 (that is, the sum of the area of the multiple plating pattern holes 111 and the area of the shielding portion 112), and less than or equal to 85% of the total area of the contact area 11 Better.

As shown in FIGS. 1 to 3, the etching structure 20A, 20B, 20C includes at least one patterned etching groove 21A, 21B, or the etching structure 20A, 20B may further include at least one patterned rib 22A, 22B. When the etching structure 20A, 20B includes patterned etching grooves 21A, 21B and patterned ribs 22A, 22B, the groove width W1 of the patterned etching grooves 21A, 21B is greater than or equal to the patterned rib 22A , 22B rib width W2 is better.

In the first preferred embodiment of the metal mask shown in FIGS. 1 and 2, the etching structure 20A is formed on a single side of the mask plate body 10A, and the mask plate body 10A is opposite to the other side of the etching structure 20A. One side is the plate base 13A, that is, when the etching structure 20A is formed on the first side 101 of the shield plate 10A, the second side 102 of the shield plate 10A has the plate base 13A; on the contrary, when the The etching structure 20A is formed on the second side 102 of the mask plate 10A, and the first side 101 of the mask plate 10A has a plate base 13A. The etching depth H of the etching structure 20A is preferably less than or equal to one-half of the thickness D of the mask plates 10A, 10B, and 10C, that is, the thickness of the plate base 13 is greater than or equal to the etching structure 20A, 20B , 20C etching depth H.

As shown in the first preferred embodiment of the metal mask shown in FIGS. 1 and 2, the etching structure 20A includes a plurality of patterned etching grooves 21A and a plurality of patterned ribs 22A. The patterned etching groove 21A has a groove width W1 greater than Or equal to the rib width W2 of the patterned rib 22A, the etching depth H of the patterned etching groove 21A is less than or equal to the thickness of the plate base 13A, and the patterned rib 22A is relative to the plate base 13A The surface on the other side is a flat surface. The etching structure 20A on one side of the shielding plate 10A has patterned ribs 22A connected to the plate base 13A, which can effectively improve its mechanical strength.

The patterned etching groove 21A of the etching structure 20A includes a plurality of groove units 211A, and the plurality of groove units 211A can be connected as a whole, so that the pattern of the patterned etching groove 21A of the etching structure 20A is a continuous pattern, which helps When the metal shield is venting the vacuum, the vacuum suction is quickly released. Alternatively, a plurality of the groove units 211A may not be all connected, so that the pattern of the patterned etching groove 21A of the etching structure 20A is a discontinuous pattern, and the plurality of patterned ribs are connected to form a continuous pattern, and the shield can be connected. The peripheral area 12 of the cover plate body 10A, in this way, enables the tension of the peripheral area 12 of the cover plate body 10A to be transmitted to each coating of the contact area 11 through the base of the plate body and the patterned ribs that constitute a continuous pattern The edge of the patterned hole 111 can produce a balanced strain effect.

As shown in the second preferred embodiment of the metal mask shown in FIG. 3, the first side 101 and the second side 102 of the mask plate 10B each have the etching structure 20B, and the mask plate 10B is located in two places. Etched structure Between the structures 20B is the plate base 13B. The two etching structures 20B can be symmetrical or asymmetrical. In this preferred embodiment, it is disclosed that the two etching structures 20B are symmetrical structures. The sum of the etching depth H of the two etching structures 20B is preferably less than or equal to one-half of the thickness D of the mask plate 10B, that is, the thickness of the plate base 13B is greater than or equal to that of the two etching structures 20B The total etching depth H.

In the second preferred embodiment of the metal mask shown in FIG. 3, each of the etching structures 20B includes a plurality of patterned etching grooves 21B and a plurality of patterned ribs 22B. The patterned etching grooves 21B have a groove width W1 is greater than or equal to the rib width W2 of the patterned rib 22B, and the sum of the etching depths H1 and H2 of the patterned etching grooves 21B of the two etching structures 20B is less than or equal to the thickness of the plate base 13B. The patterned rib 22B is a flat surface with respect to the surface on the other side of the plate base 13B. The etching structure 20B of the first side 101 and the second side 102 of the shielding board 10B each has a patterned rib 22B connecting the board base 13B, which can effectively improve its mechanical strength.

The patterned etching groove 21B of the etching structure 20B includes a plurality of groove units 211B, and the plurality of groove units 211B can be connected as a whole, so that the pattern of the patterned etching groove 21B of the etching structure 20B is a continuous pattern, which helps When the metal shield is venting the vacuum, the vacuum suction is quickly released. Alternatively, the plurality of groove units 211B may not be all connected, so that the pattern of the patterned etching groove 21B of the etching structure 20B is a discontinuous pattern, and the plurality of patterned ribs 22B are connected to form a continuous pattern, and can be connected to the patterned etching groove 21B. The peripheral area 12 of the mask plate 10B is thus transmitted to the contact area 11 via the plate base 13 and the patterned ribs 22B that constitute a continuous pattern. The edge of each plated pattern hole 111 can produce a balanced strain effect.

As shown in the third preferred embodiment of the metal mask shown in FIG. 4, the first side 101 and the second side 102 of the mask plate 10C each have the etching structure 20C, and the mask plate 10C is located in two places. Between the etching structures 20C is the plate base 13C. The two etching structures 20C can be symmetrical or asymmetrical. In this preferred embodiment, it is disclosed that the two etching structures 20C are symmetrical structures. The etching of both the etching structure 20C The sum of the engraving depth H is less than or equal to one-half of the thickness D of the mask plate 10C, that is, the thickness of the plate base 13C is greater than or equal to the sum of the etching depths H of the two etching structures 20C.

Each of the etching structures 20C has a patterned etching groove 21C. The structure of a single patterned etching groove 21C helps the metal mask to quickly release the vacuum suction force when the vacuum is vented. In addition, the structure of the two etching structures 20C is used, and the plate base 13C is located between the two etching structures 20C. In this way, the etching depth of the patterned etching grooves 21C on both sides is shortened, reducing the difficulty of the manufacturing process and making the shielding The tension of the peripheral area 12 of the cover plate 10C can be directly transmitted to the edge of each plated pattern hole 111 of the contact area 11 through the plate base 13C, and a balanced strain effect can be produced.

The metal mask of the present invention can be applied to the manufacturing process of organic light emitting diode (OLED) type displays, combining physical vapor deposition (PVD) or chemical vapor deposition (CVD) and other means on its glass substrate or flexible substrate and other substrates. The surface coating process in which the metal mask is fixed by a fixing mechanism with its peripheral area, as shown in FIG. 5, and the contact area 11 of the mask body 10B is brought into contact with the substrate 30 to be coated (such as a glass substrate or Afterwards, a part of the dissociated coating material is generated by physical vapor deposition (PVD) or chemical vapor deposition (CVD) through the coating pattern hole 111 in the metal mask, and then deposited on A plating film is formed at a specific position on the surface of the substrate 30.

As can be seen from the foregoing description, the present invention uses the aforementioned metal mask construction invention, which uses patterned etching grooves to be formed on one or both sides of the mask plate, so that the metal mask maintains the effect of improving the adhesive sheet of the coating process. The metal mask of the present invention also forms patterned ribs in the patterned etching grooves of the etching structure on a single side or both sides of the mask body, or uses the etching structures on both sides of the mask body so that the base of the board body is located The middle position of the thickness of the shield plate, etc., enables the metal shield to effectively improve its mechanical strength without changing the thickness of the shield plate.

10A mask board body 101 First side 102 Second side 11Contact area 111 Coated pattern holes 112 Concealment Department 113 Hole margin 12 Surrounding area 13A plate body base 20A etching structure 21A patterned etching groove 211A slot unit 22A patterned ribs D Thickness of the mask board H Etching depth W1 The groove width of the patterned etching groove W2 The rib width of the patterned rib

Claims (10)

A metal mask includes: a mask plate body of a metal material, which defines a contact area and a peripheral area located at the periphery of the contact area. The contact area is provided with a plurality of plating pattern holes and adjacent plating pattern holes And an etching structure formed on one side of the mask plate, and the mask plate is on the other side of the etching structure along the thickness direction of the mask plate It has a plate base, the etching structure includes at least one patterned etching groove and at least one patterned rib located in the patterned etching groove, and the etching depth of the patterned etching groove is less than or equal to the plate base The width of the patterned etching groove is greater than or equal to the width of the patterned rib, the patterned rib is connected to the base of the board, and the patterned rib is relative to the base of the board. The surface on the other side is a flat surface. The metal mask according to claim 1, wherein the total area of the etching structure in the range of the shielding portion is greater than or equal to 20% of the total area of the contact area, and less than or equal to the total area of the contact area 85%. The metal mask according to claim 1 or 2, wherein the patterned etching groove of the etching structure includes a plurality of groove units, and the plurality of groove units are connected as a whole to form the patterned etching groove of the etching structure Continuous graphics. The metal mask according to claim 1 or 2, wherein the patterned etching groove of the etching structure includes a plurality of groove units, and the groove units are not completely connected, so that the patterned etching groove of the etching structure The pattern is a discontinuous pattern, and the patterned ribs located in the patterned etching groove form a continuous pattern and are connected to the peripheral area of the mask plate. A metal mask, which includes: A mask plate body of metal material, which defines a contact area and a peripheral area located at the periphery of the contact area, the contact area is provided with a plurality of plated pattern holes and a shielding portion located between adjacent plated pattern holes; and two The etching structure is formed on opposite sides of the mask plate body. The mask plate body has a plate body base between the two etching structures. The etching structure includes at least one patterned etching groove and located in the At least one patterned rib in the patterned etching groove, the sum of the etching depths of the patterned etching grooves of the two etching structures is less than or equal to the thickness of the base of the board, and the patterned rib is connected to the base of the board . The metal mask according to claim 5, wherein the total area of the etching structure in the range of the shielding portion is greater than or equal to 20% of the total area of the contact area, and less than or equal to the total area of the contact area 85%, the groove width of the patterned etching groove is greater than or equal to the rib width of the patterned rib, and the surface of the patterned rib on the other side of the base of the plate is a flat surface. The metal mask according to claim 5 or 6, wherein the patterned etching groove of the etching structure includes a plurality of groove units, and the plurality of groove units are connected as a whole to form the patterned etching groove of the etching structure Continuous graphics. The metal mask according to claim 5 or 6, wherein the patterned etching groove of the etching structure includes a plurality of groove units, and the plurality of groove units are not completely connected, so that the patterned etching groove of the etching structure The pattern of is a discontinuous pattern, and the patterned ribs located in the patterned etching groove form a continuous pattern and are connected to the peripheral area of the mask plate. A metal mask includes: a mask plate body of a metal material, which defines a contact area and a peripheral area located at the periphery of the contact area. The contact area is provided with a plurality of plating pattern holes and adjacent plating pattern holes The shielding part between; and Two etching structures are formed on opposite sides of the mask plate body. The mask plate body has a plate body base between the two etching structures. Each of the etching structures has a patterned etching groove. The total etching depth of the patterned etching grooves of the etching structure is less than or equal to the thickness of the base of the board. The metal mask according to claim 9, wherein the total area of the etching structure in the range of the shielding portion is greater than or equal to 20% of the total area of the contact area, and less than or equal to the total area of the contact area 85%.

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