TWI718373B - Force sensor and manufacture method thereof - Google Patents

Abstract

A force sensor includes a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package covers the third substrate. The foregoing force sensor has better reliability.

Description

Force sensor and its manufacturing method

The present invention relates to a force sensor and a manufacturing method thereof, in particular to a force sensor realized by a micro-electromechanical system device and a manufacturing method thereof.

Since the formation of the concept of Microelectromechanical System (MEMS) devices in the 1970s, MEMS devices have progressed from being the object of laboratory exploration to being the object of high-level system integration, and have been widely used in mass consumer devices. Shows amazing and stable growth. The MEMS device includes a movable MEMS element, and various functions of the MEMS device can be realized by sensing or controlling the motion physical quantity of the movable MEMS element. An example is a force sensor, which can detect whether a pressing action and/or pressing force is generated.

The conventional force sensors mainly include piezoresistor pressure sensors and capacitive pressure sensors. Please refer to FIG. 1, the conventional piezoresistor type pressure sensor is provided with a plurality of piezoresistors 12 on the movable film 11. When the pressing stress causes the movable film 11 to deform, the piezoelectric resistor 12 generates a corresponding detection signal. Please refer to FIG. 2, the conventional capacitive pressure sensor includes a movable film 21 and a fixed electrode 22, wherein the movable film 21 corresponds to the fixed electrode 22 to form a sensing capacitor. The detection signal generated by the sensing capacitor is output to a specific application integrated circuit chip 24 for processing through the lead 23. It can be understood that, in order to protect the device, the above-mentioned components need to be packaged with a package body 25 To be packaged. The stress generated by pressing causes deformation of the movable film 21 through the package body 25 and causes the sensing capacitor to output a corresponding detection signal.

According to the above structure, the stress generated by repeated pressing may reduce the reliability of the package body 25 and/or the wire bonding, and even damage the movable film. In addition, the magnitude of the stress generated by pressing can only be controlled by the thickness of the package body 25, so it is not easy to package force sensors of different specifications by a standard assembly process. In view of this, how to improve the reliability of the force sensor and standardize the packaging process is the goal that needs to be worked hard at present.

The present invention provides a force sensor and a manufacturing method thereof. A third substrate is provided between a package body and a MEMS element to serve as the cover of the MEMS element, and the cover is in contact with the MEMS element. The components are connected, so that the MEMS components produce corresponding motions along with the deformation of the cover. According to this structure, the leads in the force sensor can be far away from the stress source generated by pressing, and the MEMS components are not easily damaged by repeated pressing, so the reliability of the device can be greatly improved. In addition, the force sensors of different specifications can be controlled by adjusting the thickness of the third substrate, so the force sensors of different specifications can be packaged by the same assembly process.

A force sensor according to an embodiment of the present invention includes a first substrate, a second substrate, a third substrate, and a package. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate includes a first surface, an opposite second surface, and a microelectromechanical system element, which corresponds to the fixed electrode. The second substrate is disposed on the first substrate with the first surface facing the first substrate, and is connected to the The first conductive contact of a substrate is electrically connected. The third substrate is disposed on the second surface of the second substrate, wherein the third substrate includes a protrusion, which is connected with the microelectromechanical system component. The package body covers the third substrate.

A method of manufacturing a force sensor according to another embodiment of the present invention includes providing a third substrate and defining at least one first connecting portion and a protrusion; providing a second substrate including a first surface and an opposite The second surface; with the second surface facing the third substrate, join the second substrate to the first connection portion and the protruding post of the third substrate; define at least one second connection portion on the first surface of the second substrate; The two substrates define a MEMS element, wherein the MEMS element is connected to the bump; a first substrate is provided, which includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact; A substrate and a second substrate, in which at least one first conductive contact is electrically connected to at least one second connection portion, and the MEMS element corresponds to the fixed electrode; and a package body covers the third substrate.

The following detailed descriptions are provided with specific embodiments and accompanying drawings to make it easier to understand the purpose, technical content, characteristics and effects of the present invention.

11: Movable film

12: Piezo resistor

21: Movable film

22: fixed electrode

23: Lead

24: Integrated circuit chips for specific applications

25: Package body

31: The first substrate

311: fixed electrode

312: The first conductive contact

313: second conductive contact

314: Reference electrode

32: second substrate

32a: first surface

32b: second surface

321: second connecting part

322: conductive material

323: MEMS components

324: Reference Components

33: third substrate

331: first connection part

332: Convex Column

333: Groove

34: Package substrate

341: External conductive contact

35a, 35b: lead

36: Package body

361: protruding part

37: Application-specific integrated circuit chip

38: Protruding pieces

381: bump

382: Tablet

383: connecting pin

39: colloid

Figure 1 is a schematic diagram showing a conventional piezoresistor pressure sensor.

Figure 2 is a schematic diagram showing a conventional capacitive pressure sensor.

Fig. 3 is a schematic diagram showing the force sensor according to the first embodiment of the present invention.

Fig. 4 is a schematic diagram showing the force sensor according to the second embodiment of the present invention.

FIG. 5 is a schematic top view showing the second substrate of the force sensor according to the third embodiment of the present invention.

Fig. 6 is a schematic diagram showing the force sensor of the fourth embodiment of the present invention.

Fig. 7 is a schematic diagram showing the force sensor of the fifth embodiment of the present invention.

Fig. 8 is a schematic diagram showing the force sensor of the sixth embodiment of the present invention.

Fig. 9 is a schematic diagram showing the force sensor of the seventh embodiment of the present invention.

Fig. 10 is a schematic top view showing the protrusion of the force sensor of the seventh embodiment of the present invention.

Fig. 11 is a schematic diagram showing the force sensor of the eighth embodiment of the present invention.

Fig. 12 is a schematic diagram showing the force sensor of the ninth embodiment of the present invention.

FIG. 13 is a schematic diagram showing the force sensor of the tenth embodiment of the present invention.

14a to 14j are schematic diagrams showing the manufacturing steps of the force sensor according to the first embodiment of the present invention.

Hereinafter, various embodiments of the present invention will be described in detail, and the drawings will be used as examples. In addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments, and easy substitutions, modifications, and equivalent changes of any of the embodiments are included in the scope of the present invention, and the scope of the patent application is quasi. In the description of the specification, in order to enable the reader to have a more complete understanding of the present invention, many specific details are provided; however, the present invention may still be implemented under the premise of omitting some or all of the specific details. In addition, well-known steps or elements are not described in details to avoid unnecessary limitation of the present invention. The same or similar elements in the drawings will be represented by the same or similar symbols. It is especially important to note that the drawings are for illustrative purposes only, and do not represent the actual size or quantity of the components. Some details may not be completely drawn in order to keep the drawings concise.

Please refer to FIG. 3, a force sensor according to an embodiment of the present invention includes a first substrate 31, a second substrate 32, a third substrate 33 and a package body 36. The first substrate 31 includes a fixed electrode 311, at least one first conductive contact 312 and at least one second conductive contact 313. In the embodiment shown in FIG. 3, the first substrate 31 includes a plurality of metal layers, which are connected to each other by an internal connection structure to form a required circuit. The uppermost metal layer is partially exposed on the surface of the first substrate 31 to serve as the fixed electrode 311, the first conductive contact 312 and the second conductive contact 313.

The second substrate 32 includes a first surface (ie, the downwardly facing surface of the second substrate 32 shown in FIG. 3 ), an opposite second surface, and a microelectromechanical system element 323. The second substrate 32 faces the first surface The first substrate 31 is disposed on the first substrate 31 and is electrically connected to the first conductive contact 312 of the first substrate 31. For example, the second substrate 32 is joined to the first conductive contact 312 of the first substrate 31 by at least one second connecting portion 321 and the conductive material 322 at the end of the second connecting portion 321. The MEMS element 323 corresponds to the fixed electrode 311 of the first substrate 31 to form a sensing capacitor. It can be understood that as the MEMS element 323 moves relative to the fixed electrode 311, the capacitance value of the sensing capacitor will change, and a corresponding detection signal will be output.

The third substrate 33 is disposed on the second surface of the second substrate 32 (ie, the upper surface of the second substrate 32 shown in FIG. 3). For example, the third substrate 33 is connected to the second surface of the second substrate 32 through the first connecting portion 331 to serve as a cover. In addition, the third substrate 33 includes a protrusion 332 which is connected to the MEMS element 323 of the second substrate 32. The package body 36 covers the third substrate 33. For example, the bonded first substrate 31, second substrate 32, and third substrate 33 are placed on the package substrate 34, and then the second conductive contact 313 of the first substrate 31 and the package are electrically connected with the lead 35a through a wire bonding process. The substrate 34 is finally covered with a package 36 to cover the first substrate 31, the second substrate 32, the third substrate 33 and the leads 35a to protect the above-mentioned components. The first substrate 31 can be electrically connected to the outside through the second conductive contact 313 and the external conductive contact 341 of the package substrate 34.

According to the structure shown in FIG. 3, when the third substrate 33 is pressed and deformed, the MEMS element 323 will move with the third substrate 33 through the protrusion 332. By measuring the change in capacitance value of the sensing capacitor, the force sensor can determine whether it is pressed and the force of the pressing. In other words, the MEMS element 323 of the force sensor of the present invention does not directly bear the stress of pressing, and therefore is not easily damaged by repeated pressing. In addition, as shown in FIG. 3, the third substrate 33 is provided to keep the leads 35a in the force sensor away from the stress source caused by pressing, so that the reliability of the wire bonding and the device can be greatly improved. It should also be noted that the force sensor of the present invention can adjust different measurement ranges by adjusting the thickness of the MEMS device 323, the elastic arm design of the MEMS device 323, and the thickness or material of the package. Can still It is possible to control different measurement ranges by adjusting the thickness of the third substrate, such as 10 Newtons, 100 Newtons or higher. Therefore, force sensors with different measurement ranges can be packaged with the same assembly process.

In an embodiment, the first substrate 31 may include a driving circuit and/or a sensing circuit, etc. For example, analog and/or digital circuits can be used in the first substrate 31, which are usually implemented by circuits designed with application-specific integrated circuits (ASIC). However, it is not limited thereto. In an embodiment, the first substrate 31 may also be referred to as an electrode substrate. For example, the first substrate 10 can be any substrate with suitable mechanical rigidity, including a complementary metal oxide semiconductor (CMOS) substrate, a glass substrate, and the like. Please refer to FIG. 4, the force sensor of the present invention includes an application-specific integrated circuit chip 37. In the embodiment shown in FIG. 4, the first substrate 31 is stacked on the application-specific integrated circuit chip 37, and the second conductive contacts 313 of the first substrate 31 are electrically connected to the application-specific integrated circuit chip 37 by leads 35a. The integrated circuit chip 37 for a specific application is electrically connected to the package substrate 34 by leads 35b. According to this structure, the first substrate 31 can be electrically connected to the outside through the second conductive contacts 313, the application-specific integrated circuit chip 37, and the external conductive contacts 341 of the packaging substrate 34. It can be understood that the parallel arrangement of the first substrate 31 and the integrated circuit chip for a specific application can also realize the force sensor of the present invention.

3 again, in one embodiment, the first substrate 31 further includes at least one reference electrode 314, and the second substrate 32 includes at least one reference element 324, which corresponds to the reference electrode 314 of the first substrate 31 to Form a reference capacitor. The reference capacitor and the sensing capacitor can form a differential capacitor pair, which can improve the accuracy of the measurement. It should be noted that the reference element 324 of the second substrate 32 may be a fixed element, as shown in FIG. 3. But not limited to this, the reference element 324 of the second substrate 32 may also be a movable element. For example, referring to FIG. 5, the MEMS component 323 and the reference component 324 of the second substrate 32 use the second connecting portion 321 as an anchor point to form a structure similar to a seesaw. According to this structure, when the MEMS element 323 moves downward under the pressing stress, the reference element 324 will move upward. Therefore, the micro-movement of the MEMS element 323 can be measured by the change in capacitance and the change in the reference capacitance. The difference is measured to improve the accuracy of the measurement.

Please refer to FIG. 6, in one embodiment, the package body 36 includes a protrusion 361. The protrusion 361 corresponds to the MEMS element 323. In other words, the protruding portion 361 corresponds to the third substrate 33, and more precisely, the protruding portion 361 corresponds to the protrusion 332 of the third substrate 33. According to this structure, when the assembly tolerance results in different offsets, the protrusion 361 can concentrate the pressing stress on the protrusion 361, so that the force sensor of the present invention can still output more under the assembly conditions of different offsets. Consistent detection signal.

Please refer to FIG. 7, in one embodiment, the force sensor of the present invention includes a protruding member 38 disposed on the package body 36. The protruding member 38 includes a bump 381 corresponding to the MEMS element 323. Similar to the protruding portion 361 of the package body 36, the bump 381 is more protruding relative to the package body 36, so the bump 381 can concentrate the pressing stress on the bump 381, so that the force sensor of the present invention can tolerate a larger Assembly tolerance. In the embodiment shown in FIG. 7, a top surface of the bump 381 is a flat surface, but it is not limited to this. Please refer to FIG. 8, in one embodiment, the top surface of the bump 381 may be a curved surface. It can be understood that the bumps 381 can be adhered to the package body 36 by the glue 39.

Please refer to FIG. 9, in one embodiment, the protruding member 38 includes a bump 381 and a flat plate 382, wherein the flat plate 382 is disposed between the bump 381 and the package body 36. For example, the protruding member 38 may be an integrally formed element, that is, the bump 381 and the flat plate 382 are a single element, and the material thereof may be metal. A projection area of the flat plate 382 may be equal to or smaller than the third substrate 33. In the embodiment shown in FIG. 9, the flat plate 382 corresponds to the deformation area of the third substrate 33. In one embodiment, referring to FIG. 10, a projection area of the flat plate 382 may be larger than the third substrate 33 and cover the upper surface of the package body 36. Similarly, a top surface of the bump 381 can be a flat surface (as shown in FIG. 9) or a curved surface (as shown in FIG. 10). It should be noted that by adjusting the thickness of the plate 382, the measurement range of the force sensor of the present invention can also be controlled.

In one embodiment, referring to FIG. 11 and FIG. 12, the flat plate 382 may be disposed on the bump 381, that is, the bump 381 is located between the package body 36 and the flat plate 382. According to this structure, when pressing on the plate 382, the stress can be concentrated to the bump 381. Therefore, the allowable assembly tolerance of the force sensor of the present invention can be improved. One step increase. In one embodiment, the plate 382 includes at least one connecting pin 383 connected to the package body 36, so as to prevent the plate 382 from tilting due to pressing.

Please refer to FIG. 13, in one embodiment, the bumps 381 can be glued, and the bumps 381 made of glue are provided on the package body 36. It can be understood that the material of the bump 381 is a high molecular polymer.

Please refer to FIGS. 14a to 14j to illustrate the manufacturing method of the force sensor of the present invention shown in FIG. 3. Although these cross-sectional views only show a single device, it is understandable that multiple dies can be manufactured on a single substrate. Therefore, the single device shown in these figures is only a representative, and is not intended to limit the manufacturing method of the present invention to a single device. In this specification, a more complete description will be given to fabricate multiple dies or devices on a substrate using a wafer-level process. After the device is manufactured, dicing and singulation technologies are then used to produce individual device packages for use in various applications.

Please refer to FIG. 14a. First, a third substrate 33 is provided, and at least one first connecting portion 331 and a protrusion 332 are defined. For example, a suitable groove 333 can be etched on the third substrate 33 to define the protruding first connecting portion 331 and the protrusion 332.

Next, a second substrate 32 is provided, which includes a first surface 32a and an opposite second surface 32b. The second substrate 32 faces the third substrate 33 with the second surface 32b, and is bonded to the first substrate 33. A connecting portion 331 and a protrusion 332 are as shown in FIG. 14b. For example, the second substrate 32 and the third substrate 33 can be joined by a fusion bond. In one embodiment, after the second substrate 32 is bonded to the third substrate 33, the second substrate 32 may be thinned. For example, the thickness of the thinned second substrate 32 is equal to or less than 30 μm.

Next, at least one second connecting portion 321 is defined on the first surface 32a of the second substrate 32, as shown in FIG. 14c. In one embodiment, a suitable bonding material can be formed on the second connecting portion 321 according to the bonding method used for subsequently bonding the second substrate 32 and the first substrate 31. For example, the bonding material can be a conductive material 322, as shown in FIG. 14d.

Next, referring to FIG. 14e, a MEMS component 323 is defined on the second substrate 32. It should be emphasized that the MEMS element 323 of the second substrate 32 needs to be connected to the protrusion 332 of the third substrate 33. In one embodiment, when the MEMS element 323 is defined, at least one reference element 324 can also be defined on the second substrate 32 at the same time.

Next, referring to FIG. 14f, a first substrate 31 is provided, which includes a fixed electrode 311, at least one first conductive contact 312, and at least one second conductive contact 313. In one embodiment, the first substrate 31 further includes a reference electrode 314.

Next, referring to FIG. 14g, the second substrate 32 is joined to the first substrate 31, wherein the first conductive contact 312 of the first substrate 31 and the second connection portion 321 of the second substrate 32 are electrically connected through the conductive material 322. And the MEMS element 323 corresponds to the fixed electrode 311. In one embodiment, the bonding of the second substrate 32 and the first substrate 31 can be achieved by at least one of eutectic bonding, welding, welding, and bonding.

Next, referring to FIG. 14h, thin the third substrate 33 to an appropriate thickness. Then, a part of the third substrate 33 is removed to expose the second conductive contacts 313 of the first substrate 31, as shown in FIG. 14i. Next, the first substrate 31 is cut to perform the subsequent packaging process. For example, referring to FIG. 14j, the singulated first substrate 31 is disposed on the packaging substrate 34, and the second conductive contacts 313 of the first substrate 31 and the packaging substrate 34 are electrically connected by leads 35a. Finally, the third substrate 33 is covered with a package 36 to form the force sensor as shown in FIG. 3. It can be understood that by molding with a suitable mold, a protrusion 361 can be formed on the package body 36, as shown in FIG. 6.

The force sensors of different package designs are implemented in different package procedures. For example, when the force sensor shown in FIG. 4 is packaged, the first substrate 31 needs to be placed on the application-specific integrated circuit chip 37, and then the leads 35a are electrically connected to at least one second substrate 31 of the first substrate 31. The conductive contacts 313 and the integrated circuit chip 37 for specific applications are finally packaged with the package body 36. It is understandable that the present invention The force sensor can also be arranged on the package substrate in parallel with the integrated circuit chip of the specific application, and then the package can be completed through the process of wire bonding and molding.

In one embodiment, the manufacturing method of the force sensor of the present invention further includes disposing a protrusion 38 including a bump 381 on the package body 36, as shown in FIGS. 7-12. Alternatively, the bumps 381 are formed on the package body 36 by a glue dispensing method, as shown in FIG. 13.

In summary, in the force sensor of the present invention, a third substrate is arranged between a package body and a MEMS device as the cover of the MEMS device, so that the MEMS device and the package body are separated in space. And the cover body is connected with the MEMS element, so that the MEMS element generates a corresponding amount of movement along with the deformation of the cover body. According to this structure, the leads in the force sensor of the present invention can be far away from the stress source caused by pressing, and the MEMS components are not easily damaged by repeated pressing, so the reliability of the device can be greatly improved. In addition, force sensors of different specifications can be controlled by adjusting the thickness of the third substrate, so force sensors of different measurement ranges can be packaged with the same assembly process.

The above-mentioned embodiments are only to illustrate the technical ideas and features of the present invention, and their purpose is to enable those who are familiar with the art to understand the content of the present invention and implement them accordingly. When they cannot be used to limit the patent scope of the present invention, That is, all equal changes or modifications made in accordance with the spirit of the present invention should still be covered by the patent scope of the present invention.

31: The first substrate

311: fixed electrode

312: The first conductive contact

313: second conductive contact

314: Reference electrode

32: second substrate

321: second connecting part

322: conductive material

323: MEMS components

324: Reference Components

33: third substrate

331: first connection part

332: Convex Column

34: Package substrate

341: External conductive contact

35a: Lead

36: Package body

Claims (25)

A force sensor, comprising: a packaging substrate; a first substrate located on the packaging substrate, which includes a fixed electrode, at least one first conductive contact, at least one reference electrode, and at least one second conductive contact; A second substrate includes a first surface, an opposite second surface, at least one reference element, and a MEMS element, and the second substrate is disposed on the first substrate with the first surface facing the first substrate On and electrically connected to at least the first conductive contact, wherein the MEMS element corresponds to the fixed electrode to form a sensing capacitor, and at least the reference element corresponds to at least the reference electrode to form a reference capacitor , The reference capacitor and the sensing capacitor form a differential capacitor pair; a third substrate, which is disposed on the second surface of the second substrate, wherein the third substrate includes a protrusion, the protrusion and the micro The electromechanical system component corresponds to and is joined to the microelectromechanical system component; a package body that covers the first substrate, the second substrate, and the third substrate and is disposed on the package substrate; and a protruding member located on the package substrate On the package body and corresponding to the protruding pillar. The force sensor according to claim 1, wherein the reference element is a fixed element or a movable element. The force sensor according to claim 1, wherein the first substrate includes a complementary metal oxide semiconductor substrate. The force sensor according to claim 1, wherein the first substrate further includes an application-specific integrated circuit. The force sensor according to claim 4, further comprising an application-specific integrated circuit chip and a lead, wherein the application-specific integrated circuit chip and the lead are covered by the package; the lead is electrically connected to the specific application Integrated circuit chip and the second conductive contact of the first substrate; and the application-specific integrated circuit chip is stacked between the first substrate and the packaging substrate, or the first substrate and the specific application The integrated circuit chips are arranged side by side on the packaging substrate. The force sensor according to claim 1, wherein the protruding member includes a metal or polymer bump, and a top surface of the metal or polymer bump is flat or curved. The force sensor according to claim 1, wherein the protruding member includes a bump and a flat plate disposed between the bump and the package or on the bump, and the bump and the third substrate The convex post corresponds to it. The force sensor according to claim 7, wherein a projection area of the flat plate is equal to or smaller than the third substrate. The force sensor according to claim 7, wherein the plate is disposed between the bump and the package body and covers the package body; or the plate is disposed on the bump, and the plate includes At least one connecting pin of the package body. A force sensor includes: a first substrate including a fixed electrode, at least one reference electrode, at least one first conductive contact and at least one second conductive contact; a second substrate including a first Surface, an opposite second surface, a microelectromechanical system element, at least one reference element, and at least one second connecting portion, wherein The second substrate is disposed on the first substrate with the first surface facing the first substrate; the second connecting portion is electrically connected to the first conductive contact; the MEMS element and the fixed electrode correspond to A sensing capacitor is formed; the reference element corresponds to the reference electrode to form a reference capacitor, the reference capacitor and the sensing capacitor form a differential capacitor pair; and the MEMS element and the reference element are formed with the second A seesaw structure with the connecting portion as an anchor point; a third substrate, which is disposed on the second surface of the second substrate, wherein the third substrate includes a protruding pillar, the protruding pillar is corresponding to the microelectromechanical system element Corresponding and bonding with the MEMS element; and a package body covering the first substrate, the second substrate and the third substrate. The force sensor according to claim 10, wherein the package body includes a protrusion protruding outside the package body and corresponding to the microelectromechanical system element. The force sensor according to claim 10, further comprising a protruding member disposed on the package body, wherein the protruding member includes a bump corresponding to the bump and the microelectromechanical system element, and A top surface of the bump is flat or curved. The force sensor according to claim 10, further comprising a protruding member disposed on the package body, wherein the protruding member includes a bump corresponding to the bump and the microelectromechanical system element, and The material of the bump is metal or high molecular polymer. The force sensor according to claim 10, further comprising a protruding member disposed on the package body, wherein: The protruding member includes a bump and a flat plate, the bump corresponding to the protrusion and the micro-electromechanical system element, and the flat plate is disposed between the bump and the package or on the bump, and the flat plate A projection area of the third substrate is equal to or smaller than the third substrate; or the protrusion includes a protrusion and a flat plate, the protrusion corresponds to the protrusion and the MEMS element, and the flat plate is disposed on the protrusion and Between the package body and cover the package body; or the protruding member includes a bump and a flat plate provided on the bump and having at least one connecting leg, wherein the bump and the bump and the microelectromechanical system Corresponding to the component, the connecting pin is connected to the package body. The force sensor according to claim 10, wherein the first substrate further includes an application-specific integrated circuit. The force sensor according to claim 15, further comprising an application-specific integrated circuit chip and a lead, wherein the application-specific integrated circuit chip and the lead are covered by the package; the lead is electrically connected to the specific application The integrated circuit chip is electrically connected to the second conductive contact of the first substrate; and the first substrate is stacked on the specific application integrated circuit chip, or the first substrate is connected to the specific application product. The bulk circuit chips are arranged side by side. A method for manufacturing a force sensor includes: providing a third substrate, defining at least one first connecting portion and a protrusion; providing a second substrate, which includes a first surface and an opposite second surface ; With the second surface facing the third substrate, joining the second substrate to the first connection portion of the third substrate and the protrusion; at least one second connection is defined on the first surface of the second substrate unit; A microelectromechanical system element and at least one reference element are defined on the second substrate, wherein the microelectromechanical system element corresponds to and is connected to the protrusion; a first substrate is provided, which includes a fixed electrode, at least one reference electrode, At least one first conductive contact and at least one second conductive contact; joining the first substrate and the second substrate, wherein the at least one first conductive contact is electrically connected to the at least one second connecting portion, and the The MEMS element corresponds to the fixed electrode to form a sensing capacitor, at least the reference element corresponds to at least the reference electrode to form a reference capacitor, and the reference capacitor and the sensing capacitor form a differential capacitor pair; and A package body covers the third substrate, the second substrate and the first substrate. The manufacturing method of the force sensor according to claim 17, further comprising thinning at least one of the second substrate and the third substrate. The manufacturing method of the force sensor according to claim 17, further comprising providing the first substrate of an integrated circuit for a specific application. The manufacturing method of the force sensor according to claim 17, further comprising providing a specific application integrated circuit chip and electrically connecting the at least one second conductive contact of the first substrate and the specific application product by a lead. The bulk circuit chip, wherein the first substrate is located on the application-specific integrated circuit chip or in parallel with the application-specific integrated circuit chip. The manufacturing method of the force sensor according to claim 17, wherein the package body includes a protrusion, and the protrusion corresponds to the protrusion and the MEMS element. The manufacturing method of the force sensor according to claim 17, further comprising disposing a protruding member on the package body, wherein: the protruding member includes a bump corresponding to the protruding pillar and the MEMS element; or Yes The protruding member includes a bump and a flat plate, the bump is located on the package body and corresponds to the bump and the MEMS element, and the flat plate is disposed between the bump and the package body or the bump Block, and a projection area of the flat plate is equal to or smaller than the third substrate; or the protruding piece includes a bump and a flat plate, the bump corresponds to the protrusion and the MEMS element, and the flat plate Is disposed between the bump and the package body and covers the package body; or the protruding member includes a bump and a flat plate provided on the bump and having at least one connecting leg, wherein the bump and the bump The column corresponds to the MEMS element, and the connecting pin is connected to the package body. A force sensor includes: a packaging substrate; a first substrate is located on the packaging substrate, and includes a fixed electrode, at least one reference electrode, at least one first conductive contact, and at least one second conductive contact; A second substrate includes a first surface, an opposite second surface, at least one reference element, and a MEMS element, and the second substrate is disposed on the first substrate with the first surface facing the first substrate On and electrically connected to at least the first conductive contact, wherein the MEMS element corresponds to the fixed electrode to form a sensing capacitor, and at least the reference element corresponds to at least the reference electrode to form a reference capacitor , The reference capacitor and the sensing capacitor form a differential capacitor pair; a third substrate, which is disposed on the second surface of the second substrate, wherein the third substrate includes a protruding pillar, the protruding pillar and the MEMS The system element corresponds to and is connected to the MEMS element; A package body covering the package substrate, the first substrate, the second substrate and the third substrate, wherein the package body includes a protruding portion protruding from the package body and corresponding to the protruding pillar. The force sensor according to claim 23, wherein the first substrate includes an application-specific integrated circuit. The force sensor according to claim 23, further comprising an application-specific integrated circuit chip and a lead wire electrically connected to the second conductive contact of the first substrate and the application-specific integrated circuit chip, The first substrate is stacked on the application-specific integrated circuit chip or arranged in parallel with the application-specific integrated circuit chip.

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