TWI716783B - Resin molding device and resin molded product manufacturing method - Google Patents

Abstract

The present invention provides a resin molding device capable of improving the production efficiency of resin molded products. The resin molding apparatus 10 uses a molding die provided with a cavity on at least one of a first mold (upper mold 151) and a second mold (lower mold 152) facing each other, and holds the molded object S on the second mold. A device for performing resin molding with a mold, and includes: a hole forming part 18, which is provided on the outside of the mold and forms a hole H on the release film FU; and a conveying part 17, which forms a hole H The mold release film FU is transported between the first mold and the second mold; and the holding portion 16 is passed through the hole H of the mold release film FU from the suction port provided in the first mold 162 sucks gas to hold the molded object S.

Description

Resin molding device and resin molded product manufacturing method

The present invention relates to a resin molding device and a method for manufacturing a resin molded product.

In order to protect electronic parts from the environment such as light, heat, moisture, etc., electronic parts are usually sealed with resin and resin molded. As the resin molding method, a compression molding method, a transfer molding method, or the like is generally used. In a resin molding apparatus that performs resin molding by these methods, a molding die having a first mold and a second mold is used, the first mold is provided with a cavity, and the second mold and the first mold are arranged facing each other , A holding portion that holds a molded object (for example, a substrate on which electronic components are mounted) is provided on the surface facing the cavity. In many cases, a suction port for sucking air is provided in the holding portion, and air is sucked from the suction port, thereby holding the molded object in the holding portion.

When resin molding is performed on the molding object held by the holding portion, there is a concern that the resin oozes out of the molding object and adheres to the second mold. Therefore, in the resin molding apparatuses described in Patent Document 1 and Patent Document 2, by laying a release film on the surface of the second mold around the holding portion and the surroundings, the resin is prevented from adhering to the surface of the second mold. However, if the release film is interposed between the suction port and the molded object, the suction port cannot suck gas and the molded object cannot be retained. Therefore, Patent Literature 1 and Patent Literature 2 describe the use of The needle or pin perforates the part corresponding to the suction port in the release film. [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2013-153146 [Patent Document 2] Japanese Patent Application Publication No. 2013-162041

[Problems to be Solved by the Invention] In the resin molding apparatus described in Patent Document 1 and Patent Document 2, the structure of the mold is complicated by perforating the release film at the position of the mold, or the mold is not made Damaged and required precision, etc., will become the main cause of the decline in production efficiency.

The problem to be solved by the present invention is to provide a resin molding apparatus and a resin molded product manufacturing method capable of improving the production efficiency of resin molded products. [Technical means to solve the problem]

The first aspect of the resin molding apparatus of the present invention to solve the above-mentioned problems is to use a molding die provided with a cavity in at least one of a first mold and a second mold facing each other, and to hold the molded object in The first mold performs resin molding, and the resin molding device includes: a) a hole forming part, which is provided on the outside of the mold and forms a hole on the release film; b) a conveying part, The release film formed with the hole portion is transported between the first mold and the second mold; and c) a holding portion that passes through the hole portion of the release film and is removed from the mold. The suction port provided in the first mold sucks gas to hold the molded object.

The second aspect of the resin molding apparatus of the present invention uses a molding die provided with a cavity in at least one of the first mold and the second mold facing each other, and the molding object is held in the first mold to perform resin Molding, and the resin molding device includes: a) a conveying part that conveys the release film formed with a hole part between the first mold and the second mold; and b) a holding part, by A gas is sucked from a suction port provided in the first mold through the hole of the release film to hold the molded object.

The method of manufacturing a resin molded product of the present invention uses a molding die provided with a cavity in at least one of a first mold and a second mold facing each other, and resin molding is performed by holding the molded object in the first mold, and And the method for manufacturing a resin molded product includes: a conveying step of conveying a release film formed with a hole between the first mold and the second mold; and a holding step, by passing through the release film The hole portion sucks gas from a suction port provided in the first mold to hold the molded object; and a resin molding step of clamping the first mold and the second mold together The molding object held in the first mold is resin molded. [Effects of the invention]

According to the present invention, the production efficiency of resin molded products can be improved. .

In the resin molding apparatus and the resin molded product manufacturing method of the present invention, the release film in which the hole is formed is transported between the first mold and the second mold. That is, with regard to the release film, before being transported between the first mold and the second mold, a hole is formed on the outside of the forming mold. By sucking gas from the suction port provided in the first mold through the hole, the molded object is held in the holding portion.

Regarding the method and apparatus for forming the hole on the outside of the forming mold, either or both of the following two forms can be used. In the first aspect, a hole forming part is provided in advance in the resin molding apparatus and outside the mold, and the hole forming part is used to form the hole in the release film. As the hole forming part, a slit (elongated hole, cut) is formed on the release film with a knife, or a needle is pressed to perforate the release film, and it is formed by irradiating the release film with plasma Those with tiny holes etc. In the second aspect, (without providing the hole forming portion in the resin molding device), a release film in which holes are formed in advance outside the resin molding device is used. Examples of the release film for forming pores on the outside of the resin molding apparatus include: a release film in which pores are formed on the outside of the resin molding apparatus by the same method as in the first embodiment, or a porous film or non-reinforced film. A release film containing a material having air permeability like a woven fabric.

As long as the hole can pass gas, the shape and size are not particularly limited. A through hole obtained by removing a part of the material of the release film, a slit of the release film, a hole of a porous material, a gap between fibers of a nonwoven fabric, etc. can be used as the hole.

When the release film is transported between the first mold and the second mold, it is not necessary to align the suction port of the holding portion with the position of the hole formed in the release film. Even if the positions of these suction ports and the holes are not aligned, gas can be sucked from the holes through the gap between the holding portion and the release film. The gas sucked from the suction port is usually air. However, when an inert gas such as nitrogen or argon, or other gas other than air is introduced around the molding die, the gas may be sucked.

According to the resin molding apparatus and resin molded product manufacturing method of the present invention, there are no cases where the structure of the molding die is complicated by perforating the release film at the position of the molding die, or accuracy is required to prevent damage to the molding die. Thereby, the production efficiency can be improved.

In addition, since the step of perforating the release film which is performed after the release film is transported between the first mold and the second mold is unnecessary, the production efficiency can be improved.

Furthermore, since the release film is not perforated in the molding die, it is possible to prevent the dross of the release film from being mixed into the resin, thereby improving the quality of the resin molded product.

In recent years, a method called overmold (overmold) in which resin molding is performed to the outside of the molded object has been used. Overmolding is when the production of a fan-out wafer level package (Funout-Wafer Level Package, FO-WLP) or a fan-out panel level package ( Funout-Panel LeveL Package, FO-PLP) and other resin molded products. If secondary molding is performed, the area to the outside of the molding object becomes the molding range intentionally. According to the resin molding apparatus and resin molded product manufacturing method of the present invention, the resin around the molded object does not adhere to the molding die, and the resin molded product using secondary molding can be produced with high production efficiency and high quality.

The resin molding apparatus of the present invention may further include a position detection sensor that detects the position of the position detection mark provided on the release film. In addition, in the resin molded product manufacturing method of the present invention, a configuration may be adopted: detecting the position of the position detection mark provided on the release film, and based on the position of the position detection mark, In the conveying step, the position where the hole portion of the release film is formed is aligned with the position where the molded object is held. As a result, it is possible to suppress the placement of the hole in the molding die other than the position where the molded object is held, and it is more difficult to cause the resin to adhere to the molding die.

In the resin molding apparatus and the resin molded product manufacturing method of the present invention, an adhesive may be applied to the surface of the release film in contact with the molded object. Thereby, the molded object and the mold release film are bonded by the adhesive, and the molded object can be held in the holding portion.

Hereinafter, more specific embodiments of the resin molding apparatus and resin molded product manufacturing method of the present invention will be described using FIGS. 1 to 11.

(1) Configuration of the resin molding apparatus of the present embodiment Fig. 1 shows a resin molding apparatus 10 of the present embodiment. The resin molding device 10 is a device for performing compression molding, and includes a substrate 111, four (only two are shown in FIG. 1) tie bars 112 vertically arranged on the substrate 111, so as to be able to perform up and down The movable platen 121 is held by the tie bar 112, the fixed platen 122 fixed to the upper end of the tie bar 112, and the crank connecting rod 113 provided on the substrate 111 for moving the movable platen 121 up and down. A forming mold 15 having an upper mold (first mold) 151 and a lower mold (second mold) 152 is arranged between the upper surface of the movable platen 121 and the lower surface of the fixed platen 122. Between the upper mold 151 and the lower surface of the fixed platen 122, a heater 141 is provided near the upper mold 151, and a heat insulating material 142 is provided near the fixed platen 122. Similarly, between the lower mold 152 and the upper surface of the movable platen 121, a heater 141 is provided near the lower mold 152, and a heat insulating material 142 is provided near the movable platen 121.

In addition, a pair of plate-shaped members, namely, hold frames (registered trademarks), which are arranged upright on the substrate 111 may be used instead of the tie rods 112 (bars).

The lower surface of the upper mold 151 is provided with a holding portion 16 for holding a molded object. The holding portion 16 has a molded object contact surface 161 as a plane in contact with the molded object S, and a suction port 162 provided on the molded object contact surface 161. The suction port 162 is connected to a first suction mechanism (not shown) via a gas suction pipe 163. As the first suction mechanism, for example, a vacuum pump can be used.

In addition, a preliminary suction system 165 is provided in the upper mold 151. The preliminary suction system 165 is provided independently of the suction port 162 and the gas suction pipe 163, and uses a second suction mechanism (not shown) that is different from the first suction mechanism from an opening provided on the molded object contact surface 161 Show) Suction gas. As the second suction mechanism, for example, a vacuum ejector or a vacuum pump (installed separately from the first suction mechanism) can be used.

The lower mold 152 has a side member 1521 including a rectangular frame in plan shape (when viewed from the top), and a rectangular bottom member 1522 fitted into the frame of the side member 1521, and an elastic member 1523 provided on the lower surface of the side member 1521 . The space surrounded by the side member 1521 and the bottom surface member 1522 becomes a cavity C where the resin material is supplied. In addition, the planar shape of the side member 1521 and the bottom surface member 1522 can be made into a shape, such as a circle other than a rectangle, according to the shape of the resin molded product manufactured.

Conveying parts 17 for conveying the upper mold release film FU (corresponding to the mold release film) between the upper mold 151 and the lower mold 152 are arranged on both sides of the outer mold 15 with the upper mold 151 interposed therebetween. The conveying unit 17 has a first reel 171 arranged on one of the two sides, a second reel 172 arranged on the other side, and a rotating mechanism (not shown) that rotates the reel. The long upper mold release film FU is attached to the conveyance part 17. The upper mold release film FU is wound on the first reel 171, drawn out from the first reel 171 and passed directly under the holding part 16, and the hollow core connected to the end of the upper mold release film FU is fixed to the second The reel 172 is thus mounted on the conveying unit 17. Viewed from the direction shown in FIG. 1, the rotation mechanism applies a torque T ₁ to the first reel 171 clockwise, and applies a torque T ₂ to the second reel 172 counterclockwise. The torque T _{2 is} greater than the torque T ₁ . As a result, the upper mold release film FU is gradually wound around the second reel 172 in a state where tension is applied, and the unused part is drawn out from the hole forming portion 18 to directly below the holding portion 16. The conveyance amount of the upper mold release film FU can be controlled based on the rotation amount of the second reel 172 or the rotation amount of the rotation mechanism that rotates the second reel 172.

The upper mold release film FU is formed with a hole (slit, elongated opening, cut) directly above the part where the upper mold release film FU is drawn out from the first reel 171 (slit formation). Device) 18. The hole forming portion 18 is provided with a knife 181 facing the direction in which the upper mold release film FU is drawn out, and is provided with a knife moving mechanism 182 that moves the knife up and down.

A lower mold release film conveying part (not shown) is provided on the side of the lower mold 152. The lower mold release film conveying part matches the inner surface of the cavity C of the side member 1521 and the bottom member 1522 and the side member 1521 The release film (lower mold release film) cut by the size of the upper surface is transported to the lower mold 152. The gas can be sucked from the gap between the side member 1521 of the lower mold 152 and the bottom surface member 1522 by the first suction mechanism. By the suction of the gas, the inner surface of the side member 1521 and the upper surface of the bottom surface member 1522, That is, the inner surface of the cavity C is covered by the lower mold release film. In addition, the said lower mold release film is different from the release film which formed the hole part of this invention.

(2) The operation of the resin molding apparatus of this embodiment and the resin molded product manufacturing method of this embodiment The operation of the resin molding apparatus 10 and the resin molded product manufacturing method of this embodiment are demonstrated using FIGS. 2-7.

First, in the mold opening state in which the upper mold 151 and the lower mold 152 are vertically separated, a clockwise torque T ₁ is applied to the first reel 171 of the conveying section 17 and a counterclockwise torque T ₂ is applied to the second reel 172 ( > T ₁ ), in a state where tension is applied to the upper mold release film FU, the upper mold release film FU is drawn out from the first reel 171, and is formed on the upper mold release film FU by the hole forming portion 18孔部H. Then, the conveyance part 17 conveys the upper mold release film FU formed with the hole part H between the upper mold 151 and the lower mold 152, and lays it on the holding part 16 of the upper mold 151 and its periphery (FIG. 2). Regarding the hole forming portion 18, when the portion of the upper mold release film FU placed on the holding portion 16 passes directly below the knife 181, the knife 181 is lowered by the knife moving mechanism 182. In contact with the upper mold release film FU, after the part has passed, the knife 181 is raised by the knife moving mechanism 182. Thereby, the slit-shaped hole part H (FIG. 3) extended in the direction which draws out the upper mold release film FU is formed. In FIG. 3, an example in which three (three) holes H are formed by providing three knives 181 in the hole forming portion 18 is shown, but the number of holes H is not limited to this.

The upper mold release film FU is laid on the upper mold 151, and at the same time (and not necessarily at the same time), the inner surface and side members of the cavity C of the side member 1521 and the bottom member 1522 are matched by the lower mold release film conveying part The lower mold release film FD cut by the size of the upper surface of 1521 is transported to the lower mold 152. In this state, gas (air) is sucked from the gap between the side member 1521 and the bottom surface member 1522, and thereby, as shown in FIG. 2, the inner surface of the cavity C is covered by the lower mold release film FD.

Next, with regard to the molded object S, the molded object S is moved from the outside of the molding die 15 to the molded object contact surface 161 of the holding portion 16, and comes into contact with the molded object contact surface 161 via the upper mold release film FU. Here, in the present embodiment, the molded object S is a substrate whose mounting surface on which a plurality of electronic components are mounted faces downward. In the process of moving the molded object S, a molded object transport mechanism (not shown) that moves the molded object S in the horizontal direction and the vertical direction is used. In this state, the gas (air) between the molded object S and the upper mold release film FU is sucked from the suction port 162 through the hole H using the first suction mechanism, thereby releasing the mold through the upper mold The film FU holds the molded object S in the holding portion 16 (FIG. 4 ). At the same time, gas is also sucked from the preliminary suction system 165 using the second suction mechanism. Thereby, even if either of the first suction mechanism and the second suction mechanism is stopped due to a failure or the like, the other can be used to continue to suck the gas, thereby preventing the molded object S from falling from the holding portion 16. In addition, when the molded object S is held by the holding section 16, the upper mold release film FU is in a state of being laid by the conveying section 17.

In addition, a resin material transport mechanism (not shown) is arranged directly above the cavity C, and the resin material P is supplied into the cavity C (FIG. 4 ). Alternatively, it is also possible to use an integrated molding object conveying mechanism and a resin material conveying mechanism, and simultaneously hold the molded object S in the holding portion 16 and the lower mold release film FD and the resin material P into the cavity C. Supply.

The upper mold 151 and the lower mold 152 are heated by a heater 141 in advance. The resin material P supplied into the cavity C is melted or softened by the heat of the lower mold 152.

Next, the movable platen 121 is raised by the crank connecting rod 113. Thus, first, the upper mold 151 and the lower mold 152 abut against each other. Furthermore, by using the crank connecting rod 113 to raise the movable platen 121, the lower mold 152 is strongly pressed against the upper mold 151 and the mold is clamped (FIG. 5 ). While the state is maintained, the resin material P is hardened by heat to form a resin molded product (resin sealing product) PM.

After that, the movable platen 121 is lowered by the crank connecting rod 113, and the forming mold 15 is opened. As a result, the resin molded product PM is released from the lower mold 152 while being held by the holding portion 16 (FIG. 6 ). At this time, the inner surface of the cavity C is covered with the lower mold release film FD, so that the resin molded product PM can be smoothly released from the lower mold 152.

Then, the suction of gas from the suction port 162 and the preliminary suction system 165 is stopped, and the resin molded product PM is removed from the holding portion 16. Here, as in the case of secondary molding, even if the resin of the resin molded product PM is molded to the outside of the molded object (substrate) S, the upper mold release film FU is laid on the holding portion 16 and its surroundings. The resin does not adhere to the upper mold 151, so that the resin molded product PM can be smoothly taken out. Through the above operations, the manufacture of a resin molded product PM is completed.

According to the resin molding apparatus 10 and the resin molded product manufacturing method of this embodiment, in the operation of conveying the upper mold release film FU between the upper mold 151 and the lower mold 152, the upper mold is released from the outside of the forming mold 15 The hole H is formed in the mold film FU, and the step of forming the hole H after the release film is laid is not required, so that the production efficiency can be improved. In addition, by forming the hole H on the outside of the molding die 15, it is possible to prevent the dross of the upper mold release film FU from falling into the cavity C and mixing into the resin molded product PM, thereby improving the quality of the resin molded product PM.

(3) Modified example In the resin molding apparatus 10, as the hole forming portion 18, a slit-shaped hole H is used, but a circular hole H formed in the upper mold release film FU may also be used ( Refer to the hole forming part of FIG. 8) instead of the hole forming part 18. The hole forming portion may be provided with a needle instead of the knife 181, and a needle moving mechanism for moving the needle up and down instead of the knife moving mechanism 182 is provided. During the period when the part of the upper mold release film FU that is laid on the holding part 16 passes through the needle directly below the holding part 16, the needle moving mechanism is used to repeatedly move the needle up and down to produce multiple The upper mold release film FU of each hole H. The number of needles provided in the hole forming part and the number of holes H formed in the upper mold release film FU are not particularly limited.

A plasma irradiation device is known that irradiates a resin film with plasma to modify the film into a porous film. For example, by irradiating a membrane made of polytetrafluoroethylene, which is a fluororesin, with argon plasma from a plasma irradiation device, it is possible to produce a gas with a plurality of circular pores with a pore diameter of about 0.5 μm to 2 μm. Permeable porous membrane. In the present invention, such a plasma irradiation device can be used as the hole forming portion. Specifically, in the resin molding apparatus 10 of the above-mentioned embodiment, such a plasma irradiation device (hole forming portion) 18A (FIG. 9) is arranged instead of the hole forming portion 18. In addition, when the upper mold release film FU is laid on the holding portion 16 and its surroundings, the part of the upper mold release film FU that is placed on the holding portion 16 when laid on the holding portion 16 is passed through the plasma irradiation device. During the period of 18A, by irradiating the upper mold release film FU with the plasma PL from the plasma irradiation device 18A, a plurality of holes can be formed in the portion.

Alternatively, instead of providing the hole forming portion in the resin molding device, a release film in which a hole portion such as a slit shape or a circular shape is formed outside the resin molding device may be used. Alternatively, for example, a film containing a raw material having air permeability such as a nonwoven fabric may be used as the release film used in the present invention. In the above case, it is different from the previous resin molding apparatus and resin molded product manufacturing method in the following point, that is, in the resin molding apparatus, not only the outside of the molding die 15 but also the hole forming portion does not exist in the molding die 15 .

In the case of using a release film in which holes are formed in the outside of the resin molding apparatus in advance, it is desirable that no holes are formed other than the region where the molded object S is held by the mold. In this way, in the case of using the release film FA in which holes are not formed outside of the suction area, the position is provided at a location having a predetermined positional relationship with the hole forming area HA where the holes are formed in the release film FA The detection mark MK (FIG. 10(a)), and the position detection sensor 19 (FIG. 10(b)) which detects the position detection mark MK may be provided in the resin molding apparatus. According to this configuration, by detecting the position detection mark MK with the position detection sensor 19, the control section of the resin molding apparatus can recognize the position of the hole forming area HA in the release film FA, thereby making the hole The mold release film FA is conveyed so that the position of the formation area HA is aligned with the area|region where the molding object S is hold|maintained by a molding die.

The shape of the position detection mark MK is not particularly limited. In addition, the position of the position detection mark MK (as long as it has a predetermined positional relationship with the hole formation area HA) is not particularly limited, and may be inside the hole formation area HA or outside the hole formation area HA. In the example shown in FIG. 10(b), the position of the position detection sensor 19 is arranged in front of conveying the release film FA to the forming mold 15 (only the upper mold 151 is shown in FIG. 10(b)). It is closer to the first reel 171 than the forming die 15, but it may be arranged closer to the second reel 172 than the forming die 15.

As the position detection sensor 19, for example, an optical sensor including a light-emitting element and a light-receiving element that receives light emitted from the light-emitting element can be used. As such an optical sensor, a reflective optical sensor or a transmissive optical sensor can be used. The reflective optical sensor uses a light receiving element to receive light emitted from a light emitting element and reflected by a release film. The transmissive optical sensor uses a light receiving element to receive light emitted from the light emitting element and transmitted through the release film.

Furthermore, instead of using the position detection sensor 19, the position of the release film FA may be detected based on the operation of the conveying unit 17, and the length of the release film FA conveyed by the conveying unit 17 may be controlled by the conveying control unit. Specifically, when the release film FA is mounted on the first reel 171 and the second reel 172, after the positioning with respect to the forming die 15 is performed, based on the rotation amount of the second reel 172 or the rotation amount of the rotating mechanism, The conveyance control part is used to detect and control the conveyance amount of the release film FA. Thereby, the control part can recognize the position of the hole formation area HA of the mold release film FA, and can convey the mold release film FA so that the position of the hole formation area HA may be aligned with the area|region where the molded object S is held by a mold.

The surface of the upper mold release film FU or the release film FA used in the resin molding apparatus 10 and the resin molded product manufacturing method of the present embodiment that is in contact with the molded object S may be coated with an adhesive. Thus, when the molded object S is held in the holding portion 16 via the upper mold release film FU (or release film FA), the upper mold release film FU (same as above) and the molded object S are bonded by the adhesive , Thereby holding the molded object S in the holding portion 16.

In the resin molding apparatus 10 and the resin molded product manufacturing method of this embodiment, the upper mold release film FU wound on the first reel 171 is drawn out from the first reel 171 for use, but it may be used instead of the upper The mold release film FU is used on the outside of the forming mold 15 to cut the film into a size matching the range of the holding portion 16 of the upper mold 151 and its surroundings, and then form the upper mold release film of the gas passage portion; or The upper mold release film formed by cutting the film in which the gas passage portion is formed or the film containing a material having air permeability is cut into the above-mentioned size. In this case, in the state where the cut release film of the upper mold is placed on the molded object, the molded object is transported to the holding portion 16 by the molded object transport mechanism, and the molded object is transported from the suction port 162 sucks the gas, so that the upper mold release film and the molded object are adsorbed on the molded object contact surface 161, whereby the molded object can be held in the holding portion 16 via the upper mold release film. In this case, an upper mold release film having a planar shape such as a circle other than a rectangle can be used.

In the resin molding apparatus 10 of this embodiment, the molding die 15 for compression molding is used. However, in the molding die for transfer molding, the same upper mold 151 and the conveying section having the holding portion 16 as the resin molding apparatus 10 may be used. 17 and the hole forming portion (including the plasma irradiation device 18A) 18.

The resin molding unit 50 provided with the resin molding apparatus of this embodiment is shown in FIG. The resin molding unit 50 includes one molding object carry-in/out module 51, one or more molding modules 52, and one resin material supply module 53. The molded object carry-out and carry-in module 51 is an apparatus for carrying in the molded object S from the outside and the resin molded product PM to the outside, and has a molded object receiving portion 511 and a resin molded product holding portion 512. Regarding the molding modules 52, each of them includes a set of the resin molding apparatus 10 described above. Although three molding modules 52 are shown in FIG. 11, any number of molding modules 52 can be installed in the resin molding unit 50. In addition, even after the resin molding unit 50 has been constituted and used, the molding modules 52 can be added or removed. The resin material supply module 53 has a resin material supply device 531 that supplies a resin material for resin molding to a resin material transfer tray 58 for transferring from the resin material supply module 53 to the molding module 52.

The resin molding unit 50 is provided with a molding object S, a resin material transfer tray 58, and a resin molded product so as to penetrate through the molding object carry-in/out module 51, one or more molding modules 52, and the resin material supply module 53. The main conveying device 56 for conveying. In each module, a sub-conveying device 57 for conveying the molded object S, the resin material transfer tray 58 and the resin molded product PM is provided between the main conveying device 56 and the devices in the module.

In the case where the upper mold release film FU is transported between the upper mold 151 and the lower mold 152 using the conveying unit 17, the long upper mold release film FU is arranged on the upper mold release provided in each molding module 52. In the first reel 171 of the film laying device 17, the hollow core for winding is arranged on the second reel 172, and the used upper mold release film FU is wound on the second reel 172. On the other hand, when the cut upper mold release film is transported between the upper mold 151 and the lower mold 152, the main transport device 56 and the sub transport device 57 are used to remove the upper mold release film from the molded object. The carry-out and carry-in module 51 is supplied to each molding module 52, and the used upper mold release film is transferred to the resin material supply module 53.

In addition, the resin molding unit 50 has a power supply and a control unit (none of which are shown) for operating the modules.

Hereinafter, the operation of the resin molding unit 50 will be described. The molded object S is held by an operator in the molded object receiving section 511 of the molded object carry-in/out module 51. In addition, the upper mold release film FU is arranged on the upper mold release film laying device 17 by the operator in the manner described above.

First, on one of the molding modules 52, the upper mold release film FU is conveyed between the upper mold 151 and the lower mold 152 by the conveying unit 17 of the resin molding apparatus 10. In addition, the inner surface of the cavity C is covered with the lower mold release film FD. Next, by the main conveying device 56 and the sub-conveying device 57, the molded object S is conveyed from the molded object receiving portion 511 to the resin molding apparatus 10 located in one of the molding modules 52, and is placed in the resin molding Directly below the holder 16 of the device 10. Then, the molded object S is held in the holding portion 16 as described above. Then, the resin material is supplied from the resin material supply device 531 to the resin material transfer tray 58, and the main transfer device 56 and the sub transfer device 57 are used to move the resin material transfer tray 58 until the molding object S is held in the holding portion 16. Module 52, and the resin material P is supplied from the resin material transfer tray 58 to the cavity C of the lower mold 152 of the molding module 52.

After that, in the molding module 52 in which the resin material P has been supplied to the cavity C, the upper mold 151 and the lower mold 152 are clamped to perform resin molding. During the above-mentioned resin molding, the other molding modules 52 are placed with a release film, the molding object S is mounted, and the resin material is supplied to the cavity C, thereby preparing the molding module 52 for resin molding .

In the resin molding apparatus 10 of a molding module 52, after the resin material P is cured, the upper mold 151 and the lower mold 152 are opened, and the resin molded product PM is released from the cavity C. Furthermore, the resin molded product PM is removed from the holding part 16, and the resin molded product PM is conveyed to the resin molded product holding part 512 of the molded object carrying-in module 53 by the main conveying device 56 and the sub-conveying device 57. The operator appropriately takes out the resin molded product PM from the resin molded product holding portion 512.

10‧‧‧Resin molding equipment 15‧‧‧Forming mold 16‧‧‧Holding part 17‧‧‧Transfer part (upper mold release film laying device) 18‧‧‧Hole forming part 18A‧‧‧Plasma irradiation device (Hole forming part) 19‧‧‧Position detection sensor 50‧‧‧ Resin molding unit 51‧‧‧ Molding object loading/unloading module 52‧‧‧ Molding module 53‧‧‧Resin material supply module 56‧‧‧ Main conveyor 57‧‧‧Sub conveyor 58‧‧‧Resin material transfer tray 111‧‧‧Substrate 112‧‧‧Tie rod 113‧‧‧Crank connecting rod 121‧‧‧Movable platen 122‧‧‧Fixed table Plate 141‧‧‧Heater 142‧‧‧Insulation material 151‧‧‧Upper mold (first mold) 152‧‧‧Lower mold (second mold) 161‧‧‧Forming object contact surface 162‧‧‧Drawing Suction port 163‧‧‧Gas suction pipe 165‧‧‧Preparation suction system 171‧‧‧First scroll 172‧‧‧Second scroll 181‧‧Knife 182‧‧‧Knife moving mechanism 511‧‧‧Shaped object Object receiving part 512‧‧‧Resin molded product holding part 531‧‧‧Resin material supply device 1521‧‧‧Side member 1522‧‧‧Bottom member 1523‧‧‧Elastic member C‧‧‧Cavity FA‧‧‧Release Membrane FD‧‧‧Lower mold release film FU‧‧‧Upper mold release film (release film) H‧‧‧Hole HA‧‧‧Hole forming area MK‧‧‧Mark for position detection P‧‧‧ Resin material PL‧‧‧Plasma PM‧‧‧Resin molded product S‧‧‧Molding object T ₁ , T ₂ ‧‧‧Torque

Fig. 1 is a schematic configuration diagram of a resin molding apparatus of the present invention. It is a figure explaining the operation|movement of the resin molding apparatus of this embodiment, and is a figure which shows the process of laying a release film in an upper mold and a lower mold. Fig. 3 is a plan view showing an example of a release film in which a slit as a gas passage portion is formed. 4 is a diagram explaining the operation of the resin molding apparatus of the present embodiment, and is a diagram showing a state in which the molding object is held in the holding portion of the upper mold and the resin material is supplied to the cavity of the lower mold. Fig. 5 is a diagram illustrating the operation of the resin molding apparatus of the present embodiment, and is a diagram showing a state where mold clamping is performed. FIG. 6 is a diagram explaining the operation of the resin molding apparatus of the present embodiment, and is a diagram showing a state in which mold opening is performed. Fig. 7 is a diagram explaining the operation of the resin molding apparatus of the present embodiment, and is a diagram showing a state where the resin molded product is removed from the holding portion. Fig. 8 is a plan view showing an example of a release film formed with a hole as a gas passage portion. Fig. 9 is a partially enlarged view showing an example of a resin molding apparatus using a plasma irradiation apparatus as a gas passage portion forming mechanism. Fig. 10 (a) is a plan view showing an example of a release film provided with a position detection mark, and Fig. 10 (b) is a partial enlarged view showing an example of a resin molding apparatus having a position detection sensor. FIG. 11 is a schematic diagram showing the configuration of a resin molding unit including the resin molding apparatus of this embodiment.

15‧‧‧Forming die

16‧‧‧Retention Department

17‧‧‧Conveying part (upper mold release film laying device)

18‧‧‧Hole forming part

111‧‧‧Substrate

112‧‧‧Tie rod

113‧‧‧Crank connecting rod

121‧‧‧movable table

122‧‧‧Fixed platen

141‧‧‧Heater

142‧‧‧Insulation material

151‧‧‧Upper mold (1st mold)

152‧‧‧Lower die (2nd die)

161‧‧‧Shaped object contact surface

162‧‧‧Suction port

163‧‧‧Gas Suction Pipe

165‧‧‧Preparation suction system

171‧‧‧Volume 1

172‧‧‧Volume 2

181‧‧‧Knife

182‧‧‧Knife moving mechanism

1521‧‧‧Side members

1522‧‧‧Bottom member

1523‧‧‧Elastic member

C‧‧‧ Chamber

FU‧‧‧Upper mold release film (release film)

Claims (11)

A resin molding apparatus that uses a molding die provided with a cavity in at least one of a first mold and a second mold facing each other, holds a molded object in the first mold to perform resin molding, and The resin molding device includes: a) a hole forming portion, which is provided outside the mold and forms a hole on the release film, wherein the hole is obtained by forming a slit on the release film , Or obtained by perforating the mold release film; b) a conveying section, which conveys the mold release film formed with the hole portion between the first mold and the second mold; and c) The holding portion holds the molded object by sucking gas from a suction port provided in the first mold through the hole of the release film. A resin molding apparatus that uses a molding die provided with a cavity in at least one of a first mold and a second mold facing each other, holds a molded object in the first mold to perform resin molding, and The resin molding apparatus includes: a) a conveying section that conveys the release film with a hole formed between the first mold and the second mold, wherein the hole is on the release film Those obtained by forming slits, or those obtained by perforating the release film; and b) a holding portion, which is drawn from the first mold provided by the hole portion of the release film The suction port sucks gas to hold the molded object. The resin molding apparatus according to the second item of the patent application, wherein the release film contains a raw material having air permeability. The resin molding device as described in item 2 of the scope of patent application, which also includes position detection A sensor for detecting the position of a mark for position detection provided on the release film. The resin molding apparatus described in claim 2 includes a conveying control unit that detects the position of the release film based on the movement of the conveying unit and conveys the conveying unit The length of the release film is controlled. The resin molding apparatus described in the second claim, wherein an adhesive is applied to the surface of the release film that is in contact with the molded object. A method of manufacturing a resin molded product using a molding die provided with a cavity in at least one of a first mold and a second mold facing each other, and resin molding is performed by holding a molded object in the first mold, and The method for manufacturing a resin molded product includes a conveying step of conveying a release film formed with a hole portion between the first mold and the second mold, wherein the hole portion is on the mold release film Those obtained by forming slits, or those obtained by perforating the release film; in the holding step, sucking from a suction port provided in the first mold through the hole of the release film Inhaling air to hold the molded object; and a resin molding step of clamping the first mold and the second mold to resin-mold the molded object held by the first mold. The method for manufacturing a resin molded article as described in claim 7, wherein the release film contains a raw material having air permeability. The method for manufacturing a resin molded product as described in claim 7 or 8, wherein the position of the position detection mark provided on the release film is detected, and based on the position of the position detection mark, In the conveying step, the part of the release film forming the hole Position alignment maintains the position of the shaped object. The method of manufacturing a resin molded product according to claim 7 or 8, wherein in the conveying step, the position of the release film is performed based on the operation of the conveying section that conveys the release film Detect and control the length of the release film conveyed by the conveying unit. The method of manufacturing a resin molded article according to the scope of patent application item 7 or 8, wherein an adhesive is applied to the surface of the release film that contacts the molded object.

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