TWI714281B - Display panel - Google Patents
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- TWI714281B TWI714281B TW108134847A TW108134847A TWI714281B TW I714281 B TWI714281 B TW I714281B TW 108134847 A TW108134847 A TW 108134847A TW 108134847 A TW108134847 A TW 108134847A TW I714281 B TWI714281 B TW I714281B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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Abstract
Description
本發明是有關於一種顯示面板,且特別是有關於一種包括感測裝置的顯示面板。The present invention relates to a display panel, and more particularly to a display panel including a sensing device.
目前,為了增加產品的使用便利性,許多廠商會於產品中裝設感測裝置。舉例來說,現有的手機內時常附載有指紋辨識的感測裝置。在現有的指紋辨識技術中,感測裝置偵測手指指紋所反射之光線,指紋的高低起伏會有不同強度的反射光,因此不同的指紋樣貌會被感測裝置所分辨出來。At present, in order to increase the convenience of use of products, many manufacturers install sensing devices in their products. For example, existing mobile phones often carry fingerprint recognition sensing devices. In the existing fingerprint recognition technology, the sensor device detects the light reflected by the fingerprint of the finger. The height of the fingerprint will have different intensities of reflected light, so different fingerprint appearances will be distinguished by the sensor device.
然而,當光線不足或指紋凹痕不明顯時,感測裝置容易偵測錯誤。導致使用者需要重複感應才能成功辨識指紋。因此,目前亟需一種可以解決前述問題的方法。However, when the light is insufficient or the fingerprint dent is not obvious, the sensing device is easy to detect errors. As a result, the user needs to repeat the induction to successfully recognize the fingerprint. Therefore, there is an urgent need for a method that can solve the aforementioned problems.
本發明的至少一實施例提供一種顯示面板,可以降低資料線的極性對感測裝置造成的影響,藉此提升感測裝置辨識指紋的能力。At least one embodiment of the present invention provides a display panel that can reduce the influence of the polarity of the data line on the sensing device, thereby improving the ability of the sensing device to recognize fingerprints.
本發明的至少一實施例提供一種顯示面板。顯示面板包括第一基板、畫素陣列、第一輸出線、第二輸出線、第一感測裝置以及第二感測裝置。畫素陣列位於第一基板上。畫素陣列以行反轉的方式驅動,且包括多條掃描線、多條資料線以及多個畫素。資料線交錯於掃描線。各畫素包括多個子畫素,且各子畫素電性連接至對應的一條掃描線以及對應的一條資料線。第一輸出線以及第二輸出線實質上平行於資料線。資料線中與第一輸出線最相鄰的一者以及資料線中與第二輸出線最相鄰的另一者具有相同的極性(polarity)。第一感測裝置以及第二感測裝置分別電性連接至第一輸出線以及第二輸出線。At least one embodiment of the present invention provides a display panel. The display panel includes a first substrate, a pixel array, a first output line, a second output line, a first sensing device, and a second sensing device. The pixel array is located on the first substrate. The pixel array is driven in a row-reversal manner, and includes multiple scan lines, multiple data lines, and multiple pixels. The data lines are interleaved with the scan lines. Each pixel includes a plurality of sub-pixels, and each sub-pixel is electrically connected to a corresponding scan line and a corresponding data line. The first output line and the second output line are substantially parallel to the data line. One of the data lines closest to the first output line and the other one of the data lines closest to the second output line have the same polarity. The first sensing device and the second sensing device are electrically connected to the first output line and the second output line, respectively.
本發明的至少一實施例提供一種顯示面板。顯示面板包括第一基板、畫素陣列、第一輸出線、第二輸出線、第一感測裝置、第二感測裝置、系統電壓線、第一參考電壓線以及第二參考電壓線。畫素陣列位於第一基板上,且包括多條掃描線、多條資料線以及多個畫素。資料線交錯於掃描線。各畫素包括多個子畫素,且各子畫素電性連接至對應的一條掃描線以及對應的一條資料線。第一輸出線以及第二輸出線實質上平行於資料線。第一感測裝置以及第二感測裝置分別電性連接至第一輸出線以及第二輸出線,且第一感測裝置以及第二感測裝置分別包括第一感光元件以及第二感光元件。系統電壓線位於第一感測裝置與第二感測裝置之間以及第一輸出線與第二輸出線之間,且電性連接至第一感測裝置以及第二感測裝置。第一參考電壓線以及第二參考電壓線分別位於第一感光元件以及第二感光元件的兩側。第一參考電壓線以及第二參考電壓線分別電性連接至第一感測裝置以及第二感測裝置。At least one embodiment of the present invention provides a display panel. The display panel includes a first substrate, a pixel array, a first output line, a second output line, a first sensing device, a second sensing device, a system voltage line, a first reference voltage line, and a second reference voltage line. The pixel array is located on the first substrate and includes a plurality of scan lines, a plurality of data lines, and a plurality of pixels. The data lines are interleaved with the scan lines. Each pixel includes a plurality of sub-pixels, and each sub-pixel is electrically connected to a corresponding scan line and a corresponding data line. The first output line and the second output line are substantially parallel to the data line. The first sensing device and the second sensing device are electrically connected to the first output line and the second output line, respectively, and the first sensing device and the second sensing device respectively include a first photosensitive element and a second photosensitive element. The system voltage line is located between the first sensing device and the second sensing device and between the first output line and the second output line, and is electrically connected to the first sensing device and the second sensing device. The first reference voltage line and the second reference voltage line are respectively located on both sides of the first photosensitive element and the second photosensitive element. The first reference voltage line and the second reference voltage line are electrically connected to the first sensing device and the second sensing device, respectively.
圖1是依照本發明的一實施例的一種顯示面板的剖面示意圖。為了方便說明,圖1省略繪示了感測元件基板以及畫素陣列基板的部分構件。FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention. For the convenience of description, FIG. 1 omits some components of the sensing element substrate and the pixel array substrate.
請參考圖1,顯示面板1包括感測元件基板20、畫素陣列基板10以及顯示介質層LC。感測元件基板20面對畫素陣列基板10。顯示介質層LC位於畫素陣列基板10與感測元件基板20之間。在本實施例中,顯示面板1還包括背光模組BL,背光模組BL設置於畫素陣列基板10的下方,換句話說,畫素陣列基板10位於背光模組BL以及感測元件基板20之間。Please refer to FIG. 1, the
在本實施例中,畫素陣列基板10包括第一基板100以及畫素陣列110。畫素陣列110位於第一基板100上。In this embodiment, the
在本實施例中,感測元件基板20包括第二基板200以及多個感測裝置(圖1中以感測裝置中的感光元件LS示意)。感測裝置位於第二基板200上。在一些實施例中,感測元件基板20還包括系統電壓線、參考電壓線以及輸出線。關於系統電壓線、參考電壓線以及輸出線的設置方式可見於圖2A的實施例。In this embodiment, the
在本實施例中,感光元件LS包括導電層C1、光感測層R以及電極層C2。光感測層R位於導電層C1以及電極層C2之間。In this embodiment, the photosensitive element LS includes a conductive layer C1, a light sensing layer R, and an electrode layer C2. The light sensing layer R is located between the conductive layer C1 and the electrode layer C2.
在本實施例中,當手指F靠近感測元件基板20時,背光模組BL所發出的光線LR會被手指F反射至光感測層R。In this embodiment, when the finger F approaches the
圖2A是依照本發明的一實施例的一種畫素陣列基板的俯視示意圖。圖2B是沿著圖2A的剖面線aa’的剖面示意圖。圖3A是依照本發明的一實施例的一種感測元件基板的仰視示意圖。圖3B是沿著圖3A的剖面線bb’的剖面示意圖。需注意的是,為了使圖式清晰,圖2A、圖2B、圖3A以及圖3B並非以等比例繪示2A is a schematic top view of a pixel array substrate according to an embodiment of the invention. Fig. 2B is a schematic cross-sectional view taken along the section line aa' of Fig. 2A. 3A is a schematic bottom view of a sensing device substrate according to an embodiment of the invention. Fig. 3B is a schematic cross-sectional view taken along the section line bb' of Fig. 3A. It should be noted that, in order to make the drawings clear, Figures 2A, 2B, 3A, and 3B are not drawn to scale
在此必須說明的是,圖2A至圖3B的實施例沿用圖1的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,在此不贅述。It must be noted here that the embodiment of FIGS. 2A to 3B follows the element numbers and part of the content of the embodiment of FIG. 1, wherein the same or similar numbers are used to represent the same or similar elements, and the same technical content is omitted. Description. For the description of the omitted parts, please refer to the foregoing embodiment, which is not repeated here.
在本實施例中,顯示面板具有透光區OR以及遮光區CR。在一些實施例中,遮光區CR重疊於黑矩陣(圖2B以及圖3B省略繪出)。在一些實施例中,黑矩陣位於感測元件基板20中。在其他實施例中,黑矩陣位於畫素陣列基板10中。In this embodiment, the display panel has a light transmission area OR and a light shielding area CR. In some embodiments, the light shielding region CR overlaps the black matrix (illustration omitted in FIGS. 2B and 3B). In some embodiments, the black matrix is located in the
請參考圖2A與圖2B,畫素陣列110位於第一基板100上,且包括多條掃描線SL、多條資料線DL以及多個畫素PX。資料線DL可為鋸齒狀(zigzag)、直線形或其他形狀。2A and 2B, the
資料線DL交錯於掃描線SL。各畫素PX包括多個子畫素SP,且各子畫素SP電性連接至對應的一條掃描線SL以及對應的一條資料線DL。The data line DL is interlaced with the scan line SL. Each pixel PX includes a plurality of sub-pixels SP, and each sub-pixel SP is electrically connected to a corresponding scan line SL and a corresponding data line DL.
在本實施例中,各子畫素SP包括開關元件T以及電性連接至開關元件T的畫素電極PE。在本實施例中,開關元件T、掃描線SL以及資料線DL位於遮光區CR,且至少部分畫素電極PE位於透光區OR。In this embodiment, each sub-pixel SP includes a switching element T and a pixel electrode PE electrically connected to the switching element T. In this embodiment, the switching element T, the scan line SL and the data line DL are located in the light-shielding area CR, and at least part of the pixel electrode PE is located in the light-transmitting area OR.
開關元件T例如位於絕緣層I1上。在一些實施例中,開關元件T與第一基板100之間夾有遮光層M。開關元件T包括閘極G、源極S、汲極D以及半導體通道層CH。半導體通道層CH位於絕緣層I1上。閘極G與半導體通道層CH重疊,且閘極G與半導體通道層CH之間夾有絕緣層I2。閘極G與掃描線SL電性連接。在本實施例中,閘極G與掃描線SL屬於同一導電膜層,但本發明不以此為限。絕緣層I3位於絕緣層I2上並覆蓋閘極G與掃描線SL。源極S以及汲極D位於絕緣層I3的上方,且源極S與資料線DL電性連接。在本實施例中,源極S以及資料線DL屬於同一導電膜層,但本發明不以此為限。源極S以及汲極D透過開口H1、H2而電性連接至半導體通道層CH,開口H1、H2例如位於絕緣層I3以及絕緣層I2中。絕緣層B1位於源極S以及汲極D的上方。The switching element T is located on the insulating layer I1, for example. In some embodiments, a light shielding layer M is sandwiched between the switching element T and the
上述之開關元件T是以頂部閘極型薄膜電晶體為例來說明,但本發明不限於此。根據其他實施例,上述之開關元件T也可是以底部閘極型薄膜電晶體。The above-mentioned switching element T is illustrated with a top gate type thin film transistor as an example, but the invention is not limited to this. According to other embodiments, the above-mentioned switching element T may also be a bottom gate type thin film transistor.
在本實施例中,畫素陣列基板10選擇性的包括共用電極線CL。In this embodiment, the
在本實施例中,共用電極線CL與資料線DL的延伸方向相同,且共用電極線CL與資料線DL屬於相同膜層,但本發明不以此為限。在其他實施例中,共用電極線CL與於資料線DL屬於不同膜層,且共用電極線CL於垂直第一基板100的方向上重疊於資料線DL,藉此可以提升顯示面板的開口率。In this embodiment, the common electrode line CL and the data line DL extend in the same direction, and the common electrode line CL and the data line DL belong to the same film layer, but the invention is not limited to this. In other embodiments, the common electrode line CL and the data line DL belong to different layers, and the common electrode line CL overlaps the data line DL in a direction perpendicular to the
共用電極CE位於絕緣層B1上,且透過絕緣層B1中的開口電性連接至共用電極線CL。在一些實施例中,共用電極CE包括觸控電極。The common electrode CE is located on the insulating layer B1 and is electrically connected to the common electrode line CL through the opening in the insulating layer B1. In some embodiments, the common electrode CE includes a touch electrode.
絕緣層I4位於共用電極CE上。畫素電極PE位於絕緣層I4上,畫素電極PE重疊於共用電極CE,畫素電極PE與共用電極CE分離。畫素電極PE透過開口OP而電性連接至開關元件T的汲極D。在本實施例中,開口OP穿過絕緣層B1、絕緣層I4以及共用電極CE,但本發明不以此為限。在一些實施例中,畫素陣列基板10可以採用邊緣場切換(Fringe Field Switching,FFS)技術或橫向電場(In-Plane-Switching,IPS)技術驅動液晶。The insulating layer I4 is located on the common electrode CE. The pixel electrode PE is located on the insulating layer I4, the pixel electrode PE overlaps the common electrode CE, and the pixel electrode PE is separated from the common electrode CE. The pixel electrode PE is electrically connected to the drain D of the switching element T through the opening OP. In this embodiment, the opening OP passes through the insulating layer B1, the insulating
在本實施例中,畫素陣列110以行反轉(Column inversion)的方式驅動,舉例來說,相鄰的資料線DL具有不同的極性。在本實施例中,資料線DL的極性會隨著操作時間而不斷反轉。In this embodiment, the
請參考圖3A與圖3B,第一輸出線212、第二輸出線214、第一感測裝置222、第二感測裝置224、第一系統電壓線232、第一參考電壓線242、第二參考電壓線244、第一控制訊號線252與第二控制訊號線254位於第二基板200上。在本實施例中,第一輸出線212、第二輸出線214、第一感測裝置222、第二感測裝置224、第一系統電壓線232、第一參考電壓線242、第二參考電壓線244、第一控制訊號線252與第二控制訊號線254位於遮光區CR。3A and 3B, the
在本實施例中,第一輸出線212、第二輸出線214、第一系統電壓線232、第一參考電壓線242以及第二參考電壓線244重疊且實質上平行於第一基板100上的資料線DL,藉此能避免顯示面板的開口率下降。在一些實施例中,第一輸出線212、第二輸出線214、第一系統電壓線232、第一參考電壓線242以及第二參考電壓線244可為鋸齒狀(zigzag)、直線形或其他形狀。In this embodiment, the
在本實施例中,第一感測裝置222電性連接至第一輸出線212、第一參考電壓線242、第一控制訊號線252以及第一系統電壓線232。第一感測裝置222包括第一開關元件T1、第二開關元件T2以及第一感光元件LS1。In this embodiment, the
在本實施例中,第一開關元件T1包括閘極G1、源極S1、汲極D1以及半導體通道層CH1。在本實施例中,第一開關元件T1與第二基板200之間還包括遮光層M1,但本發明不以此為限。In this embodiment, the first switching element T1 includes a gate G1, a source S1, a drain D1, and a semiconductor channel layer CH1. In this embodiment, the light shielding layer M1 is further included between the first switching element T1 and the
半導體通道層CH1位於絕緣層I1’上。閘極G1與半導體通道層CH1重疊,且閘極G1與半導體通道層CH1之間夾有絕緣層I2’。閘極G1與第一控制訊號線252電性連接。絕緣層I3’位於絕緣層I2’上且覆蓋閘極G1、第一控制訊號線252與第二控制訊號線254。源極S1以及汲極D1位於絕緣層I3’的上方,且源極S1與第一參考電壓線242電性連接,其中第一參考電壓線242例如電性連接至電壓VSS。源極S1以及汲極D1分別透過開口H1a、H2a而電性連接至半導體通道層CH1,開口H1a、H2a例如位於絕緣層I3’以及絕緣層I2’中。The semiconductor channel layer CH1 is located on the insulating layer I1'. The gate electrode G1 overlaps the semiconductor channel layer CH1, and an insulating layer I2' is sandwiched between the gate electrode G1 and the semiconductor channel layer CH1. The gate G1 is electrically connected to the first
第二開關元件T2包括閘極G2、源極S2、汲極D2以及半導體通道層CH2。在本實施例中,第二開關元件T2與第二基板200之間還包括遮光層M2,但本發明不以此為限。The second switching element T2 includes a gate electrode G2, a source electrode S2, a drain electrode D2, and a semiconductor channel layer CH2. In this embodiment, the light shielding layer M2 is further included between the second switching element T2 and the
半導體通道層CH2位於絕緣層I1’上。閘極G2與半導體通道層CH2重疊,且閘極G2與半導體通道層CH2之間夾有絕緣層I2’。絕緣層I3’覆蓋閘極G2。閘極G2與第一開關元件T1電性連接。舉例來說,第一開關元件T1的汲極D1透過開口H3a而電性連接至閘極G2,開口H3a例如位於絕緣層I3’中。源極S2以及汲極D2位於絕緣層I3’的上方,且源極S2與第一系統電壓線232電性連接,其中第一系統電壓線232例如電性連接至電壓VDD。汲極D2與第一輸出線212電性連接。源極S2以及汲極D2透過開口H2b、H1b而電性連接至半導體通道層CH2,開口H1b、H2b例如位於絕緣層I3’以及絕緣層I2’中。藉此設計使訊號更佳。The semiconductor channel layer CH2 is located on the insulating layer I1'. The gate electrode G2 overlaps the semiconductor channel layer CH2, and an insulating layer I2' is sandwiched between the gate electrode G2 and the semiconductor channel layer CH2. The insulating layer I3' covers the gate G2. The gate G2 is electrically connected to the first switching element T1. For example, the drain D1 of the first switching element T1 is electrically connected to the gate G2 through the opening H3a, and the opening H3a is located in the insulating layer I3', for example. The source S2 and the drain D2 are located above the insulating layer I3', and the source S2 is electrically connected to the first
第一感光元件LS1包括導電層C1、光感測層R1以及電極層C2。光感測層R1位於導電層C1以及電極層C2之間。The first photosensitive element LS1 includes a conductive layer C1, a light sensing layer R1, and an electrode layer C2. The light sensing layer R1 is located between the conductive layer C1 and the electrode layer C2.
導電層C1位於絕緣層B1’上。第一感光元件LS1的導電層C1電性連接至第二控制訊號線254。The conductive layer C1 is located on the insulating layer B1'. The conductive layer C1 of the first photosensitive element LS1 is electrically connected to the second
電極層C2位於絕緣層B1’上。第一感光元件LS1的電極層C2電性連接至第一開關元件T1的汲極D1以及第二開關元件T2的閘極G2。舉例來說,電極層C2透過開口TH1而電性連接至第一開關元件T1的汲極D1,開口TH1例如位於絕緣層B1’中。在一些實施例中,電極層C2與汲極D1之間選擇性地夾有轉接電極層(未繪出),轉接電極層例如與導電層C1屬於同一膜層。The electrode layer C2 is located on the insulating layer B1'. The electrode layer C2 of the first photosensitive element LS1 is electrically connected to the drain D1 of the first switching element T1 and the gate G2 of the second switching element T2. For example, the electrode layer C2 is electrically connected to the drain D1 of the first switching element T1 through the opening TH1, and the opening TH1 is located in the insulating layer B1', for example. In some embodiments, a transfer electrode layer (not shown) is selectively sandwiched between the electrode layer C2 and the drain electrode D1, and the transfer electrode layer, for example, belongs to the same film layer as the conductive layer C1.
在本實施例中,第二感測裝置224電性連接至第二輸出線214、第二參考電壓線244、第一控制訊號線252以及第一系統電壓線232。在本實施例中,第一感測裝置222以及第二感測裝置224共用同一條第一系統電壓線232。第二感測裝置224包括第三開關元件T3、第四開關元件T4以及第二感光元件LS2。In this embodiment, the
在本實施例中,第三開關元件T3包括閘極G3、源極S3、汲極D3以及半導體通道層CH3。在本實施例中,第三開關元件T3與第二基板200之間還包括遮光層M3,但本發明不以此為限。In this embodiment, the third switching element T3 includes a gate electrode G3, a source electrode S3, a drain electrode D3, and a semiconductor channel layer CH3. In this embodiment, the light shielding layer M3 is further included between the third switching element T3 and the
半導體通道層CH3位於絕緣層I1’上。閘極G3與半導體通道層CH3重疊,且閘極G3與半導體通道層CH3之間夾有絕緣層I2’。閘極G3與第一控制訊號線252電性連接。絕緣層I3’覆蓋閘極G3。源極S3以及汲極D3位於絕緣層I3’的上方,且源極S3與第二參考電壓線244電性連接,其中第二參考電壓線244例如電性連接至電壓VSS。源極S3以及汲極D3分別透過開口H1c、H2c而電性連接至半導體通道層CH3,開口H1c、H2c例如位於絕緣層I3’以及絕緣層I2’中。The semiconductor channel layer CH3 is located on the insulating layer I1'. The gate electrode G3 overlaps with the semiconductor channel layer CH3, and an insulating layer I2' is sandwiched between the gate electrode G3 and the semiconductor channel layer CH3. The gate G3 is electrically connected to the first
第四開關元件T4包括閘極G4、源極S4、汲極D4以及半導體通道層CH4。在本實施例中,第四開關元件T4與第二基板200之間還包括遮光層M4,但本發明不以此為限。The fourth switching element T4 includes a gate electrode G4, a source electrode S4, a drain electrode D4, and a semiconductor channel layer CH4. In this embodiment, the light shielding layer M4 is further included between the fourth switching element T4 and the
半導體通道層CH4位於絕緣層I1’上。閘極G4與半導體通道層CH4重疊,且閘極G4與半導體通道層CH4之間夾有絕緣層I2’。絕緣層I3’覆蓋閘極G4。閘極G4與第三開關元件T3電性連接。舉例來說,第三開關元件T3的汲極D3透過開口H3b而電性連接至閘極G4,開口H3b例如位於絕緣層I3’中。源極S4以及汲極D4位於絕緣層I3’的上方,且源極S4與第一系統電壓線232電性連接。汲極D4與第二輸出線214電性連接。源極S4以及汲極D4透過開口H2b、H1d而電性連接至半導體通道層CH4,開口H1d例如位於絕緣層I3’以及絕緣層I2’中。藉此設計使訊號更佳。The semiconductor channel layer CH4 is located on the insulating layer I1'. The gate electrode G4 overlaps the semiconductor channel layer CH4, and an insulating layer I2' is sandwiched between the gate electrode G4 and the semiconductor channel layer CH4. The insulating layer I3' covers the gate G4. The gate G4 is electrically connected to the third switching element T3. For example, the drain D3 of the third switching element T3 is electrically connected to the gate G4 through the opening H3b, and the opening H3b is located in the insulating layer I3', for example. The source S4 and the drain D4 are located above the insulating layer I3', and the source S4 is electrically connected to the first
在本實施例中,半導體通道層CH4與半導體通道層CH2連成一體,且源極S4與源極S2連成一體,藉此能減小感測裝置的尺寸。In this embodiment, the semiconductor channel layer CH4 and the semiconductor channel layer CH2 are connected as one body, and the source electrode S4 and the source electrode S2 are connected as one body, thereby reducing the size of the sensing device.
在一些實施例中,閘極G2與閘極G4的形狀互為鏡像對稱,且汲極D1與汲極D3的形狀互為鏡像對稱。In some embodiments, the shapes of the gate electrode G2 and the gate electrode G4 are mirror symmetry with each other, and the shapes of the drain electrode D1 and the drain electrode D3 are mirror symmetry with each other.
在本實施例中,閘極G1、閘極G2、閘極G3、閘極G4、第一控制訊號線252與第二控制訊號線254屬於同一導電膜層,但本發明不以此為限。在本實施例中,源極S1、汲極D1、源極S2、汲極D2、源極S3、汲極D3、源極S4、汲極D4、第一參考電壓線242、第二參考電壓線244、第一輸出線212、第二輸出線214以及第一系統電壓線232屬於同一導電膜層,但本發明不以此為限。In this embodiment, the gate G1, the gate G2, the gate G3, the gate G4, the first
在本實施例中,第一開關元件T1、第二開關元件T2、第三開關元件T3以及第四開關元件T4是以頂部閘極型薄膜電晶體為例來說明,但本發明不限於此。在其他實施例中,第一開關元件T1、第二開關元件T2、第三開關元件T3以及第四開關元件T4也可是以底部閘極型薄膜電晶體或其他適合之薄膜電晶體。In this embodiment, the first switching element T1, the second switching element T2, the third switching element T3, and the fourth switching element T4 are illustrated by taking the top gate type thin film transistor as an example, but the invention is not limited to this. In other embodiments, the first switching element T1, the second switching element T2, the third switching element T3, and the fourth switching element T4 may also be bottom gate type thin film transistors or other suitable thin film transistors.
第二感光元件LS2包括導電層C3、光感測層R2以及電極層C4。光感測層R2位於導電層C3以及電極層C4之間。The second photosensitive element LS2 includes a conductive layer C3, a light sensing layer R2, and an electrode layer C4. The light sensing layer R2 is located between the conductive layer C3 and the electrode layer C4.
導電層C3位於絕緣層B1’上。導電層C3電性連接至第二控制訊號線254。在本實施例中,導電層C1以及導電層C3連成一體,且導電層C1以及導電層C3透過開口O1而電性連接至轉接電極TE,轉接電極TE透過開口O2而電性連接至第二控制訊號線254。開口O1例如位於絕緣層B1’中。開口O2例如位於絕緣層I3’中。在一些實施例中,轉接電極TE與第一系統電壓線232屬於同一導電膜層,但本發明不以此為限。The conductive layer C3 is located on the insulating layer B1'. The conductive layer C3 is electrically connected to the second
電極層C4位於絕緣層B1’上。電極層C4電性連接至第三開關元件T3的汲極D3以及第四開關元件T4的閘極G4。舉例來說,電極層C4透過開口TH2而電性連接至第三開關元件T3的汲極D3,開口TH2例如位於絕緣層B1’中。在一些實施例中,電極層C4與汲極D3之間選擇性地夾有轉接電極層(未繪出),轉接電極層例如與導電層C3屬於同一膜層。The electrode layer C4 is located on the insulating layer B1'. The electrode layer C4 is electrically connected to the drain D3 of the third switching element T3 and the gate G4 of the fourth switching element T4. For example, the electrode layer C4 is electrically connected to the drain D3 of the third switching element T3 through the opening TH2, and the opening TH2 is located in the insulating layer B1', for example. In some embodiments, a transfer electrode layer (not shown) is selectively sandwiched between the electrode layer C4 and the drain electrode D3, and the transfer electrode layer, for example, belongs to the same film layer as the conductive layer C3.
在本實施例中,導電層C1以及導電層C3的材質較佳為透明導電材料,例如是銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物、銦鎵鋅氧化物或其他合適的氧化物或者是上述至少二者之堆疊層。In this embodiment, the materials of the conductive layer C1 and the conductive layer C3 are preferably transparent conductive materials, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium gallium zinc oxide or Other suitable oxides or stacked layers of at least two of the above.
在本實施例中,電極層C2以及電極層C4的材質例如是鉬、鋁、鈦、銅、金、銀或其他導電材料或上述兩種以上之材料的堆疊。在一些實施例中,電極層C2以及電極層C4可作為反射層使用,藉此增加光感測層R1以及光感測層R2所能接收到的光線。In this embodiment, the material of the electrode layer C2 and the electrode layer C4 is, for example, molybdenum, aluminum, titanium, copper, gold, silver or other conductive materials or a stack of two or more of the foregoing materials. In some embodiments, the electrode layer C2 and the electrode layer C4 can be used as reflective layers, thereby increasing the light that the light sensing layer R1 and the light sensing layer R2 can receive.
在本實施例中,光感測層R1以及光感測層R2的材質例如是富矽氧化物(Silicon-rich oxide, SRO)或其他合適的材料。In this embodiment, the materials of the light sensing layer R1 and the light sensing layer R2 are, for example, silicon-rich oxide (SRO) or other suitable materials.
在本實施例中,感測元件基板20還包括遮蔽層SM。In this embodiment, the
遮蔽層SM位於第一輸出線212與畫素陣列基板10之間、第二輸出線214與畫素陣列基板10之間、第一系統電壓線232與畫素陣列基板10之間、第一參考電壓線242與畫素陣列基板10之間、第二參考電壓線244與畫素陣列基板10之間、第一控制訊號線252與畫素陣列基板10之間以及第二控制訊號線254與畫素陣列基板10之間。The shielding layer SM is located between the
在一些實施例中,遮蔽層SM、導電層C1以及導電層C3為同一導電膜層。遮蔽層SM與導電層C1(或導電層C3)電性連接至不同的訊號源。藉由遮蔽層SM來改善感測元件基板20所產生之電場影響顯示介質層中液晶分子的問題,能夠提升顯示裝置的顯示品質。In some embodiments, the shielding layer SM, the conductive layer C1 and the conductive layer C3 are the same conductive film layer. The shielding layer SM and the conductive layer C1 (or the conductive layer C3) are electrically connected to different signal sources. The shielding layer SM can improve the problem that the electric field generated by the
在一些實施例中,共用電極CE與遮蔽層SM電性連接至相同訊號源。也可以說共用電極CE與遮蔽層SM上施有相同的訊號,藉此進一步改善感測元件基板20所產生之電場影響顯示品質的問題。In some embodiments, the common electrode CE and the shielding layer SM are electrically connected to the same signal source. It can also be said that the same signal is applied to the common electrode CE and the shielding layer SM, thereby further improving the problem that the electric field generated by the
在本實施例中,感測元件基板20更包括鈍化層B2。鈍化層B2覆蓋導電層C1、電極層C2、遮蔽層SM以及絕緣層B1’。In this embodiment, the
在本實施例中,第一系統電壓線232位於第一感測裝置222與第二感測裝置224之間以及第一輸出線212與第二輸出線214之間,且第一參考電壓線242以及第二參考電壓線244分別位於第一感光元件222以及第二感光元件224的兩側,因此,與第一輸出線212最相鄰的一條資料線DL以及與第二輸出線214最相鄰的另一條資料線DL具有相同的極性(例如在同一時間同為正極或同為負極)。舉例來說,重疊於第一輸出線212的一條資料線DL與重疊於第二輸出線214的另一條資料線DL具有相同的極性,藉此可以降低資料線DL的極性對第一感測裝置222以及第二感測裝置224造成的影響,並且提升第一感測裝置222以及第二感測裝置224辨識指紋的能力。In this embodiment, the first
圖4A是依照本發明的一實施例的一種畫素陣列基板的俯視示意圖。圖4B是依照本發明的一實施例的一種感測元件基板的仰視示意圖。圖4C是依照本發明的一實施例的顯示面板的立體示意圖。4A is a schematic top view of a pixel array substrate according to an embodiment of the invention. 4B is a schematic bottom view of a sensing device substrate according to an embodiment of the invention. 4C is a three-dimensional schematic diagram of a display panel according to an embodiment of the invention.
在此必須說明的是,圖4A至圖4C的實施例沿用圖2A至圖3B的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,在此不贅述。It must be noted here that the embodiment of FIGS. 4A to 4C follows the element numbers and part of the content of the embodiment of FIGS. 2A to 3B, wherein the same or similar numbers are used to denote the same or similar elements, and the same is omitted. Description of technical content. For the description of the omitted parts, please refer to the foregoing embodiment, which is not repeated here.
請參考圖4A、圖4B以及圖4C,顯示裝置2包括感測元件基板20以及畫素陣列基板10。Referring to FIGS. 4A, 4B, and 4C, the
畫素陣列基板10包括第一基板100以及畫素陣列110。畫素陣列110位於第一基板100上。畫素陣列110包括多條掃描線SL、多條資料線DL以及多個畫素PX。各畫素PX包括多個子畫素SP,且各子畫素SP電性連接至對應的一條掃描線SL以及對應的一條資料線DL。在本實施例中,各子畫素SP包括開關元件T以及電性連接至開關元件T的畫素電極PE。The
在本實施例中,感測元件基板20包括第二基板200、第一感測裝置222、第二感測裝置224、第三感測裝置222a、第四感測裝置224a、第五感測裝置222b、第六感測裝置224b、第七感測裝置222c、第八感測裝置224c、第一系統電壓線232、第二系統電壓線234、第一輸出線212、第二輸出線214、第三輸出線216、第四輸出線218、第一參考電壓線242、第二參考電壓線244、第三參考電壓線246、第一控制訊號線252、第二控制訊號線254、第三控制訊號線256以及第四控制訊號線258。In this embodiment, the
第一感測裝置222電性連接至第一系統電壓線232、第一輸出線212、第一控制訊號線252、第二控制訊號線254以及第一參考電壓線242。第二感測裝置224電性連接至第一系統電壓線232、第二輸出線214、第一控制訊號線252、第二控制訊號線254以及第二參考電壓線244。The
第三感測裝置222a以及第四感測裝置224a的結構分別類似於前述實施例中的第一感測裝置222以及第二感測裝置224。第三感測裝置222a電性連接至第二系統電壓線234、第三輸出線216、第一控制訊號線252、第二控制訊號線254以及第二參考電壓線244。第四感測裝置224a電性連接至第二系統電壓線234、第四輸出線218、第一控制訊號線252、第二控制訊號線254以及第三參考電壓線246。The structures of the
第五感測裝置222b以及第六感測裝置224b的結構分別類似於前述實施例中的第一感測裝置222以及第二感測裝置224。第五感測裝置222b電性連接至第一系統電壓線232、第一輸出線212、第三控制訊號線256、第四控制訊號線258以及第一參考電壓線242。第六感測裝置224b電性連接至第一系統電壓線232、第二輸出線214、第三控制訊號線256、第四控制訊號線258以及第二參考電壓線244。The structures of the
第七感測裝置222c以及第八感測裝置224c的結構分別類似於前述實施例中的第一感測裝置222以及第二感測裝置224。第七感測裝置222c電性連接至第二系統電壓線234、第三輸出線216、第三控制訊號線256、第四控制訊號線258以及第二參考電壓線244。第八感測裝置224c電性連接至第二系統電壓線234、第四輸出線218、第三控制訊號線256、第四控制訊號線258以及第三參考電壓線246。The structures of the
在本實施例中,與第一輸出線212最相鄰的資料線DL、與第二輸出線214最相鄰的資料線DL、與第三輸出線216最相鄰的資料線DL以及與第四輸出線218最相鄰的資料線DL具有相同的極性,因此,可以降低資料線DL的極性對感測裝置造成的影響,藉此提升感測裝置辨識指紋的能力。In this embodiment, the data line DL nearest to the
在本實施例中,第一感測裝置222、第二感測裝置224、第三感測裝置222a、第四感測裝置224a、第五感測裝置222b、第六感測裝置224b、第七感測裝置222c以及第八感測裝置224c分別包括第一感光元件LS1、第二感光元件LS2、第三感光元件LS1a、第四感光元件LS2a、第五感光元件LS1b、第六感光元件LS2b、第七感光元件LS1c以及第八感光元件LS2c。In this embodiment, the
在本實施例中,感光元件之間的節距等於畫素PX之間的節距。舉例來說,第一感光元件LS1以及第二感光元件LS2之間的節距P1等於畫素PX之間的節距P2,第一感光元件LS1以及第五感光元件LS1b之間的節距P3約等於畫素PX之間的節距P4。在本實施例中,節距P1等於節距P3,且節距P2等於節距P4。In this embodiment, the pitch between photosensitive elements is equal to the pitch between pixels PX. For example, the pitch P1 between the first photosensitive element LS1 and the second photosensitive element LS2 is equal to the pitch P2 between the pixels PX, and the pitch P3 between the first photosensitive element LS1 and the fifth photosensitive element LS1b is about It is equal to the pitch P4 between pixels PX. In this embodiment, the pitch P1 is equal to the pitch P3, and the pitch P2 is equal to the pitch P4.
雖然在本實施例中,第一感測裝置222、第二感測裝置224、第三感測裝置222a、第四感測裝置224a、第五感測裝置222b、第六感測裝置224b、第七感測裝置222c、第八感測裝置224c、第一系統電壓線232、第二系統電壓線234、第一輸出線212、第二輸出線214、第三輸出線216、第四輸出線218、第一參考電壓線242、第二參考電壓線244、第三參考電壓線246、第一控制訊號線252、第二控制訊號線254、第三控制訊號線256以及第四控制訊號線258位於第二基板200上,但本發明不以此為限。在其他實施例中,第一感測裝置222、第二感測裝置224、第三感測裝置222a、第四感測裝置224a、第五感測裝置222b、第六感測裝置224b、第七感測裝置222c、第八感測裝置224c、第一系統電壓線232、第二系統電壓線234、第一輸出線212、第二輸出線214、第三輸出線216、第四輸出線218、第一參考電壓線242、第二參考電壓線244、第三參考電壓線246、第一控制訊號線252、第二控制訊號線254、第三控制訊號線256以及第四控制訊號線258位於第一基板100上。Although in this embodiment, the
綜上所述,由於第一系統電壓線位於第一感測裝置與第二感測裝置之間以及第一輸出線與第二輸出線之間,且第一參考電壓線以及第二參考電壓線分別位於第一感光元件以及第二感光元件的兩側,與第一輸出線最相鄰的一條資料線以及與第二輸出線最相鄰的另一條資料線具有相同的極性(例如在同一時間同為正極或同為負極)。舉例來說,重疊於第一輸出線的一條資料線與重疊於第二輸出線的另一條資料線具有相同的極性,因此,可以降低資料線的極性對第一感測裝置以及第二感測裝置造成的影響,藉此提升第一感測裝置以及第二感測裝置辨識指紋的能力。In summary, because the first system voltage line is located between the first sensing device and the second sensing device and between the first output line and the second output line, and the first reference voltage line and the second reference voltage line Located on both sides of the first photosensitive element and the second photosensitive element, the data line closest to the first output line and the other data line closest to the second output line have the same polarity (for example, at the same time Both are positive or both are negative). For example, one data line overlapping the first output line has the same polarity as another data line overlapping the second output line. Therefore, the polarity of the data line can be reduced for the first sensing device and the second sensing device. The influence caused by the device can improve the fingerprint recognition ability of the first sensing device and the second sensing device.
1、2:顯示面板 10:畫素陣列基板 100:第一基板 110:畫素陣列 20:感測元件基板 200:第二基板 212:第一輸出線 214:第二輸出線 216:第三輸出線 218:第四輸出線 222:第一感測裝置 224:第二感測裝置 222a:第三感測裝置 224a:第四感測裝置 222b:第五感測裝置 224b:第六感測裝置 222c:第七感測裝置 224c:第八感測裝置 232:第一系統電壓線 234:第二系統電壓線 242:第一參考電壓線 244:第二參考電壓線 246:第三參考電壓線 252:第一控制訊號線 254:第二控制訊號線 256:第三控制訊號線 258:第四控制訊號線 BL:背光模組 B1、B1’、I1、I1’、I2、I2’、I3、I3’、I4:絕緣層 B2:鈍化層 CE:共用電極 CL:共用電極線 C1、C3:導電層 C2、C4:電極層 D、D1、D2:汲極 CH、CH1、CH2:半導體通道層 CR:遮光區 DL:資料線 F:手指 G、G1、G2:閘極 LC:顯示介質層 LR:光線 LS:感光元件 LS1:第一感光元件 LS2:第一感光元件 LS1a:第三感光元件 LS2a:第四感光元件 LS1b:第五感光元件 LS2b:第六感光元件 LS1c:第七感光元件 LS2c:第八感光元件 OR:透光區 PE:畫素電極 PX:畫素 P1、P2、P3、P4:節距 R1、R2:光感測層 H1、H2、H1a、H2a、H1b、H2b、H1c、H2c、H1d、H3a、H3b、O1、O2、OP、TH1、TH2:開口 S、S1、S2:源極 SL:掃描線 SM:遮蔽層 SP:子畫素 TE:轉接電極 T:開關元件 T1:第一開關元件 T2:第二開關元件 T3:第三開關元件 T4:第四開關元件 1, 2: Display panel 10: Pixel array substrate 100: first substrate 110: pixel array 20: Sensing component substrate 200: second substrate 212: The first output line 214: second output line 216: Third output line 218: Fourth output line 222: The first sensing device 224: second sensing device 222a: third sensing device 224a: Fourth sensing device 222b: Fifth sensing device 224b: The sixth sensing device 222c: seventh sensing device 224c: Eighth sensing device 232: The first system voltage line 234: Second system voltage line 242: The first reference voltage line 244: second reference voltage line 246: third reference voltage line 252: The first control signal line 254: second control signal line 256: Third control signal line 258: The fourth control signal line BL: Backlight module B1, B1’, I1, I1’, I2, I2’, I3, I3’, I4: insulating layer B2: Passivation layer CE: Common electrode CL: Common electrode line C1, C3: conductive layer C2, C4: electrode layer D, D1, D2: drain CH, CH1, CH2: semiconductor channel layer CR: shading zone DL: Data line F: Finger G, G1, G2: gate LC: display medium layer LR: light LS: photosensitive element LS1: The first photosensitive element LS2: The first photosensitive element LS1a: The third photosensitive element LS2a: Fourth photosensitive element LS1b: Fifth photosensitive element LS2b: The sixth photosensitive element LS1c: seventh photosensitive element LS2c: Eighth photosensitive element OR: light transmission area PE: pixel electrode PX: pixel P1, P2, P3, P4: pitch R1, R2: light sensing layer H1, H2, H1a, H2a, H1b, H2b, H1c, H2c, H1d, H3a, H3b, O1, O2, OP, TH1, TH2: opening S, S1, S2: source SL: scan line SM: Masking layer SP: Sub-pixel TE: transfer electrode T: switching element T1: the first switching element T2: second switching element T3: third switching element T4: Fourth switching element
圖1是依照本發明的一實施例的一種顯示面板的剖面示意圖。 圖2A是依照本發明的一實施例的一種畫素陣列基板的俯視示意圖。 圖2B是沿著圖2A的剖面線aa’的剖面示意圖。 圖3A是依照本發明的一實施例的一種感測元件基板的仰視示意圖。 圖3B是沿著圖3A的剖面線bb’的剖面示意圖。 圖4A是依照本發明的一實施例的一種畫素陣列基板的俯視示意圖。 圖4B是依照本發明的一實施例的一種感測元件基板的仰視示意圖。 圖4C是依照本發明的一實施例的顯示面板的立體示意圖。 FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention. 2A is a schematic top view of a pixel array substrate according to an embodiment of the invention. Fig. 2B is a schematic cross-sectional view taken along the section line aa' of Fig. 2A. 3A is a schematic bottom view of a sensing device substrate according to an embodiment of the invention. Fig. 3B is a schematic cross-sectional view taken along the section line bb' of Fig. 3A. 4A is a schematic top view of a pixel array substrate according to an embodiment of the invention. 4B is a schematic bottom view of a sensing device substrate according to an embodiment of the invention. 4C is a three-dimensional schematic diagram of a display panel according to an embodiment of the invention.
20:感測元件基板 20: Sensing component substrate
200:第二基板 200: second substrate
212:第一輸出線 212: The first output line
214:第二輸出線 214: second output line
216:第三輸出線 216: Third output line
218:第四輸出線 218: Fourth output line
222:第一感測裝置 222: The first sensing device
224:第二感測裝置 224: second sensing device
222a:第三感測裝置 222a: third sensing device
224a:第四感測裝置 224a: Fourth sensing device
222b:第五感測裝置 222b: Fifth sensing device
224b:第六感測裝置 224b: The sixth sensing device
222c:第七感測裝置 222c: seventh sensing device
224c:第八感測裝置 224c: Eighth sensing device
232:第一系統電壓線 232: The first system voltage line
234:第二系統電壓線 234: Second system voltage line
242:第一參考電壓線 242: The first reference voltage line
244:第二參考電壓線 244: second reference voltage line
246:第三參考電壓線 246: third reference voltage line
252:第一控制訊號線 252: The first control signal line
254:第二控制訊號線 254: second control signal line
256:第三控制訊號線 256: Third control signal line
258:第四控制訊號線 258: The fourth control signal line
LS1:第一感光元件 LS1: The first photosensitive element
LS2:第一感光元件 LS2: The first photosensitive element
LS1a:第三感光元件 LS1a: The third photosensitive element
LS2a:第四感光元件 LS2a: Fourth photosensitive element
LS1b:第五感光元件 LS1b: Fifth photosensitive element
LS2b:第六感光元件 LS2b: The sixth photosensitive element
LS1c:第七感光元件 LS1c: seventh photosensitive element
LS2c:第八感光元件 LS2c: Eighth photosensitive element
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| TWI225232B (en) * | 2002-07-12 | 2004-12-11 | Toshiba Matsushita Display Tec | Display device |
| CN103762263A (en) * | 2013-12-31 | 2014-04-30 | 深圳市华星光电技术有限公司 | Photosensitive unit, array substrate of display panel and manufacturing method of array substrate |
| CN106605169A (en) * | 2014-09-05 | 2017-04-26 | 凸版印刷株式会社 | Liquid crystal display device and display device substrate |
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