TWI714245B - Probe card for electrical test and probe head for probe card - Google Patents
Probe card for electrical test and probe head for probe card Download PDFInfo
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- 239000000523 sample Substances 0.000 title claims abstract description 317
- 238000012360 testing method Methods 0.000 title description 9
- 238000007689 inspection Methods 0.000 claims abstract description 29
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- 239000000758 substrate Substances 0.000 claims description 12
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- 239000011295 pitch Substances 0.000 description 21
- 239000004065 semiconductor Substances 0.000 description 11
- 230000014509 gene expression Effects 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
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- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
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- 238000013459 approach Methods 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
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- 229920002379 silicone rubber Polymers 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
本發明提供一種於以可導電之方式連接於檢查裝置之電路基板組裝體固定與被檢查器件接觸之複數個探針的探針頭。探針頭包含第1板、第2板、螺母構件及第1螺栓構件。第1板與第2板保持複數個探針。第2板配置於第1板之下方。螺母構件結合於第2板。第1螺栓構件藉由電路基板組裝體而於第1位置及第2位置螺合於螺母構件。第1螺栓構件於第1位置螺合於螺母構件,以便第1板與第2板密接。第1螺栓構件於第2位置螺合於螺母構件,以便第2板離開第1板。The invention provides a probe head for fixing a plurality of probes in contact with a device to be inspected on a circuit board assembly connected to an inspection device in a conductive manner. The probe head includes a first plate, a second plate, a nut member, and a first bolt member. The first board and the second board hold a plurality of probes. The second board is arranged below the first board. The nut member is coupled to the second plate. The first bolt member is screwed to the nut member at the first position and the second position by the circuit board assembly. The first bolt member is screwed to the nut member at the first position so that the first plate and the second plate are in close contact. The first bolt member is screwed to the nut member at the second position so that the second plate is separated from the first plate.
Description
本發明係關於一種用於電性檢查被檢查器件之探針卡及探針卡之探針頭。The present invention relates to a probe card used for electrical inspection of inspected devices and a probe head of the probe card.
為了電性檢查被檢查器件,對檢查裝置提供將被檢查器件與檢查裝置電性連接之連接器。被檢查器件與連接器接觸,連接器將檢查裝置之電性測試信號傳輸至被檢查器件,將被檢查器件之響應信號傳輸至檢查裝置。作為此種連接器之一例,為了電性檢查半導體晶圓之半導體元件而使用具有呈針形狀之複數個探針之探針卡。In order to electrically inspect the inspected device, the inspection device is provided with a connector that electrically connects the inspected device and the inspection device. The inspected device is in contact with the connector, and the connector transmits the electrical test signal of the inspecting device to the inspected device, and transmits the response signal of the inspected device to the inspecting device. As an example of such a connector, a probe card having a plurality of probes in the shape of a needle is used in order to electrically inspect the semiconductor element of the semiconductor wafer.
探針與半導體元件之端子接觸。探針藉由探針頭固定於探針卡且插入於探針頭。作為一例,探針頭可具有上部板、於中央穿設有四邊形開口之中間板、及下部板。探針可插入於上部板、中間板及下部板而由探針頭保持。The probe is in contact with the terminal of the semiconductor element. The probe is fixed to the probe card by the probe head and inserted into the probe head. As an example, the probe head may have an upper plate, a middle plate with a quadrangular opening in the center, and a lower plate. The probe can be inserted into the upper plate, middle plate and lower plate and held by the probe head.
作為藉由探針頭將探針固定於探針卡之一例,於韓國公開專利公報第10-2018-0059867號中提出將探針完全插入之上部板、中間板及下部板結合於探針卡。As an example of fixing the probe to the probe card by the probe head, it is proposed in Korean Patent Publication No. 10-2018-0059867 that the probe is completely inserted into the upper plate, the middle plate and the lower plate to be combined with the probe card .
作為藉由探針頭將探針固定於探針卡之另一例,於上端及下端偏移之探針之情形時,利用配置於中間板上之導膜,首先組裝下部板與中間板,之後藉由導膜插入探針。As another example of fixing the probe to the probe card by the probe head, when the upper and lower ends of the probe are offset, use the guide film arranged on the middle plate to first assemble the lower plate and the middle plate, and then Insert the probe through the guide film.
如上所述,藉由探針完全插入之探針頭結合於探針卡之方式而探針藉由探針頭固定於探針卡。特別是,於上部板、中間板及下部板均已組裝之狀態下,探針需完全插入於探針頭。因此,將探針插入至探針頭之製程非常精確且複雜,需視情形進行人工作業。As described above, the probe is fixed to the probe card by the probe head in a way that the probe head is fully inserted into the probe card. In particular, when the upper board, the middle board and the lower board are all assembled, the probe must be completely inserted into the probe head. Therefore, the process of inserting the probe into the probe head is very precise and complicated, and manual operations are required depending on the situation.
於為了實現較長之探針而中間板之厚度較大之情形時,上部板與下部板間之距離變大,因此非常難以進行探針之插入作業且插入作業之時間增大。需先組裝上部板、中間板及下部板之探針頭僅可應用於具有特定長度之探針。於一部分探針磨耗或更換一部分探針之情形時,探針頭需自探針卡分離後自各個板分解。In the case where the thickness of the middle plate is large in order to realize a longer probe, the distance between the upper plate and the lower plate becomes larger. Therefore, it is very difficult to insert the probe and the insertion time increases. The probe head that needs to assemble the upper board, the middle board and the lower board can only be used for probes with a specific length. When a part of the probe is worn out or a part of the probe is replaced, the probe head needs to be disassembled from each board after being separated from the probe card.
如上所述,以上所例示之探針頭於容易且迅速地插入探針、容易地更換探針、應用於各種探針等方面不利。 [先前技術文獻] [專利文獻]As described above, the probe head exemplified above is disadvantageous in easily and quickly inserting the probe, easily replacing the probe, and applying to various probes. [Prior Technical Literature] [Patent Literature]
韓國公開專利公報第10-2018-0059867號Korean Open Patent Publication No. 10-2018-0059867
[發明所欲解決之問題][The problem to be solved by the invention]
本發明之一實施例提供一種可容易且迅速地插入探針之探針頭。本發明之一實施例提供一種探針之保持位置可變之探針頭。本發明之一實施例提供一種可應用於各種長度之探針之探針頭。本發明之一實施例提供一種可容易地應對探針之磨耗、探針之損傷或探針的更換之探針頭。本發明之一實施例提供一種具有上述探針頭之探針卡。 [解決問題之技術手段]An embodiment of the present invention provides a probe head that can easily and quickly insert a probe. An embodiment of the present invention provides a probe head with a variable probe holding position. An embodiment of the present invention provides a probe head applicable to probes of various lengths. An embodiment of the present invention provides a probe head that can easily deal with probe wear, probe damage, or probe replacement. An embodiment of the present invention provides a probe card with the above-mentioned probe head. [Technical means to solve the problem]
本發明之實施例之一態樣係關於一種於以可導電之方式連接於檢查裝置的電路基板組裝體固定與被檢查器件接觸之複數個探針之探針頭。一實施例之探針頭包含第1板、第2板、螺母構件、及第1螺栓構件。第1板與第2板保持複數個探針。第2板配置於第1板之下方。螺母構件結合於第2板。第1螺栓構件藉由電路基板組裝體於第1位置及第2位置螺合於螺母構件。第1螺栓構件於第1位置螺合於螺母構件,以便第1板與第2板密接。第1螺栓構件於第2位置螺合於螺母構件,以便第2板離開第1板。One aspect of the embodiment of the present invention relates to a probe head that fixes a plurality of probes in contact with a device to be inspected on a circuit board assembly connected to an inspection device in a conductive manner. The probe head of an embodiment includes a first plate, a second plate, a nut member, and a first bolt member. The first board and the second board hold a plurality of probes. The second board is arranged below the first board. The nut member is coupled to the second plate. The first bolt member is screwed to the nut member at the first position and the second position by the circuit board assembly. The first bolt member is screwed to the nut member at the first position so that the first plate and the second plate are in close contact. The first bolt member is screwed to the nut member at the second position so that the second plate is separated from the first plate.
於一實施例中,在第1位置密接之第1板與第2板保持複數個探針,於第2位置隔開之第1板與第2板保持複數個探針。複數個探針分別具有於第1螺栓構件之第1位置自第2板突出之第1突出長度、及短於第1突出長度且於第1螺栓構件之第2位置自第2板突出之第2突出長度。In one embodiment, the first plate and the second plate that are in close contact at the first position hold a plurality of probes, and the first plate and the second plate that are spaced apart at the second position hold a plurality of probes. The plurality of probes respectively have a first protrusion length protruding from the second plate at the first position of the first bolt member, and a first protrusion length shorter than the first protrusion length and protruding from the second plate at the second position of the first bolt member 2Protruding length.
於一實施例中,螺母構件結合於第2板之上表面且貫通第1板。In one embodiment, the nut member is coupled to the upper surface of the second plate and penetrates the first plate.
於一實施例中,探針頭包含將第1螺栓構件固定於第2位置之擋止件。擋止件可於第2位置與第1螺栓構件接觸而固定於電路基板組裝體。In one embodiment, the probe head includes a stopper for fixing the first bolt member at the second position. The stopper can be fixed to the circuit board assembly by contacting with the first bolt member at the second position.
於一實施例中,探針頭包含與第1螺栓構件接觸且藉由第1螺栓構件螺合於螺母構件之第2螺栓構件。第2螺栓構件之旋轉藉由螺母構件而使第2板相對於第1板移動。In one embodiment, the probe head includes a second bolt member that is in contact with the first bolt member and is screwed to the nut member by the first bolt member. The rotation of the second bolt member moves the second plate relative to the first plate by the nut member.
於一實施例中,螺母構件具有與第1螺栓構件螺合之第1螺紋、及與第2螺栓構件螺合之第2螺紋。第2螺紋之螺紋間距可小於第1螺紋之螺紋間距。In one embodiment, the nut member has a first thread screwed with the first bolt member and a second thread screwed with the second bolt member. The thread pitch of the second thread can be smaller than the thread pitch of the first thread.
於一實施例中,螺母構件包含於外周面形成第1螺紋且於內周面形成有第2螺紋之中空之螺母主體。第1螺栓構件包含支持第2螺栓構件之中空之螺栓頭、及於內周面具有與螺母構件之第1螺紋螺合之母螺紋的中空之螺栓主體。In one embodiment, the nut member includes a nut body with a first thread formed on the outer peripheral surface and a second thread hollow on the inner peripheral surface. The first bolt member includes a bolt head supporting the hollow of the second bolt member, and a hollow bolt body having a female thread screwed with the first thread of the nut member on the inner peripheral surface.
於一實施例中,第2螺栓構件於第1螺栓構件之第2位置螺合於螺母構件。In one embodiment, the second bolt member is screwed to the nut member at the second position of the first bolt member.
本發明之實施例之又一態樣係關於一種用於電性檢查被檢查器件之探針卡。一實施例之探針卡包含:電路基板組裝體,其以可導電之方式連接於檢查裝置;複數個探針,其與被檢查器件接觸;及探針頭,其結合於電路基板組裝體,固定複數個探針。探針頭包含第1板、第2板、螺母構件、及第1螺栓構件。第1板與第2板保持複數個探針。第2板配置於第1板之下方。螺母構件結合於第2板。第1螺栓構件藉由電路基板組裝體而於第1位置及第2位置螺合於螺母構件。第1螺栓構件於第1位置螺合於螺母構件,以便第1板與第2板密接。第1螺栓構件於第2位置螺合於螺母構件,以便第2板離開第1板。Another aspect of the embodiments of the present invention relates to a probe card used for electrical inspection of an inspected device. The probe card of an embodiment includes: a circuit board assembly, which is connected to the inspection device in a conductive manner; a plurality of probes, which are in contact with the inspected device; and a probe head, which is coupled to the circuit board assembly, Fix multiple probes. The probe head includes a first plate, a second plate, a nut member, and a first bolt member. The first board and the second board hold a plurality of probes. The second board is arranged below the first board. The nut member is coupled to the second plate. The first bolt member is screwed to the nut member at the first position and the second position by the circuit board assembly. The first bolt member is screwed to the nut member at the first position so that the first plate and the second plate are in close contact. The first bolt member is screwed to the nut member at the second position so that the second plate is separated from the first plate.
於一實施例中,在第1位置密接之第1板與第2板保持複數個探針,於第2位置隔開之第1板與第2板保持複數個探針。In one embodiment, the first plate and the second plate that are in close contact at the first position hold a plurality of probes, and the first plate and the second plate that are spaced apart at the second position hold a plurality of probes.
於一實施例中,螺母構件結合於第2板之上表面且貫通第1板。In one embodiment, the nut member is coupled to the upper surface of the second plate and penetrates the first plate.
於一實施例中,探針頭包含與第1螺栓構件接觸而結合於電路基板組裝體且將第1螺栓構件固定於第2位置之擋止件。In one embodiment, the probe head includes a stopper that contacts the first bolt member, is coupled to the circuit board assembly, and fixes the first bolt member at the second position.
於一實施例中,探針頭包含與第1螺栓構件接觸且藉由第1螺栓構件螺合於螺母構件之第2螺栓構件。第2螺栓構件之旋轉藉由螺母構件而使第2板相對於第1板移動。In one embodiment, the probe head includes a second bolt member that is in contact with the first bolt member and is screwed to the nut member by the first bolt member. The rotation of the second bolt member moves the second plate relative to the first plate by the nut member.
於一實施例中,螺母構件包含於外周面形成與第1螺栓構件螺合之第1螺紋且於內周面形成有與第2螺栓構件螺合之第2螺紋的中空之螺母主體。第1螺栓構件包含支持第2螺栓構件之中空之螺栓頭、及於內周面具有與螺母構件之第1螺紋螺合之母螺紋的中空之螺栓主體。第2螺紋之螺紋間距可小於第1螺紋之螺紋間距。In one embodiment, the nut member includes a hollow nut body formed with a first thread screwed with the first bolt member on the outer circumferential surface and a second thread screwed with the second bolt member on the inner circumferential surface. The first bolt member includes a bolt head supporting the hollow of the second bolt member, and a hollow bolt body having a female thread screwed with the first thread of the nut member on the inner peripheral surface. The thread pitch of the second thread can be smaller than the thread pitch of the first thread.
於一實施例中,電路基板組裝體包含:第1電路基板組裝體,其以可導電之方式連接於檢查裝置;及第2電路基板組裝體,其以可導電之方式結合於第1電路基板組裝體,將第1電路基板組裝體之端子間之端子間距調整成複數個探針間之探針間距。 [發明之效果]In one embodiment, the circuit board assembly includes: a first circuit board assembly that is electrically conductively connected to the inspection device; and a second circuit board assembly that is electrically conductively coupled to the first circuit board For the assembly, the terminal pitch between the terminals of the first circuit board assembly is adjusted to the probe pitch between a plurality of probes. [Effects of Invention]
本發明之一實施例可提供一種具有以保持探針之狀態密接且隔開之第1板與第2板的探針頭。此種一實施例之探針頭可容易地插入探針、容易地保持探針、實現簡便且簡單之組裝、應對各種長度之探針。又,根據一實施例之探針頭,可不於被檢查器件之檢查現場另外使用修復治具而更換探針。本發明之一實施例之探針頭可藉由以保持探針之狀態相對於第1板移動的第2板而不分離及分解探針頭來應對磨耗之探針,從而可增大探針卡之壽命。本發明之一實施例之探針頭可藉由結合於一個螺母構件之第1螺栓構件與第2螺栓構件而將探針的插入狀態及第1板與第2板間之間隔精確地調整成較大之範圍及較小之範圍。於本發明之一實施例之探針頭中,在探針插入於密接之第1板與第2板後,隔開之第1板與第2板確保探針完全插入。藉此,一實施例之探針頭可實現自動探針插入裝置之開發。An embodiment of the present invention can provide a probe head having a first plate and a second plate which are closely connected and separated while keeping the probe. The probe head of this embodiment can easily insert the probe, easily hold the probe, realize simple and simple assembly, and handle probes of various lengths. Furthermore, according to the probe head of an embodiment, the probe can be replaced without using a repair jig at the inspection site of the inspected device. The probe head of an embodiment of the present invention can deal with the worn probe by keeping the state of the probe relative to the second plate moving relative to the first plate without separating and disassembling the probe head, thereby increasing the size of the probe Card life. The probe head of an embodiment of the present invention can accurately adjust the insertion state of the probe and the interval between the first plate and the second plate by combining the first bolt member and the second bolt member of a nut member Larger range and smaller range. In the probe head according to an embodiment of the present invention, after the probe is inserted into the closely connected first and second plates, the first and second plates are separated to ensure that the probe is fully inserted. Thereby, the probe head of an embodiment can realize the development of an automatic probe insertion device.
本發明之實施例係以說明本發明之技術思想為目的而例示。本發明之權利範圍並不限定於以下提出之實施例或該等實施例之具體說明。The embodiments of the present invention are illustrated for the purpose of explaining the technical idea of the present invention. The scope of rights of the present invention is not limited to the following embodiments or specific descriptions of these embodiments.
只要無其他定義,則本發明中使用之所有技術用語及科學用語具有於本發明所屬之技術領域內具有常識者通常理解之含義。本發明中使用之所有用語係以更明確地說明本發明為目的而選擇者,並非係為了限制本發明之權利範圍而選擇者。As long as there is no other definition, all technical terms and scientific terms used in the present invention have the meanings commonly understood by those with common sense in the technical field to which the present invention belongs. All the terms used in the present invention are selected for the purpose of describing the present invention more clearly, not for limiting the scope of rights of the present invention.
本發明中使用之如“包含”、“具備”、“具有”等之表達係只要未於包含相應之表達的語句或句子中提及其他含義,則應理解為具有包含其他實施例之可能性之開放型用語(open-ended terms)。The expression system used in the present invention such as "include", "have", "have", etc., as long as other meanings are not mentioned in the sentence or sentence containing the corresponding expression, it should be understood as having the possibility of including other embodiments The open-ended terms (open-ended terms).
只要未提及其他含義,則本發明中所記述之單數型表達可包含複數型含義,此種情形亦相同地適用於發明申請專利範圍中所記載之單數型表達。As long as no other meanings are mentioned, the singular expression described in the present invention may include the plural meaning, and this situation is equally applicable to the singular expression described in the scope of the invention application.
本發明中使用之“第1”、“第2”等表達用於相互區分複數個構成要素,並非限定相應構成要素之順序或重要度。The expressions such as "first" and "second" used in the present invention are used to distinguish plural constituent elements from each other, and do not limit the order or importance of corresponding constituent elements.
於本發明中,在記載為某個構成要素“連接”或“連結”於另一構成要素之情形時,應理解為上述某個構成要素可直接連接或連結於上述另一構成要素,或者能夠以嶄新之又一構成要素為媒介而連接或連結。In the present invention, when it is described that a certain component is “connected” or “connected” to another component, it should be understood that the certain component can be directly connected or connected to the other component, or can be Connect or link with another new component as a medium.
本發明中使用之“上方”之方向指示語係基於探針頭相對於被檢查器件而定位之方向,“下方”之方向指示語係指上方之相反方向。本發明中使用之“垂直方向”之方向指示語包含上方方向與下方方向,但應理解為並非係指上方方向與下方方向中之特定之一方向。The direction indicator of "above" used in the present invention is based on the direction in which the probe head is positioned relative to the inspected device, and the direction indicator of "below" refers to the opposite direction of the upper. The direction indicator of "vertical direction" used in the present invention includes an upper direction and a lower direction, but it should be understood as not referring to a specific one of the upper direction and the lower direction.
以下,參照隨附圖式,對實施例進行說明。於隨附圖式中,對相同或對應之構成要素賦予相同之參照符號。又,於以下之實施例之說明中,可省略重複記述相同或對應之構成要素。然而,即便省略構成要素之記述,亦不意味著此種構成要素不包含於某個實施例。Hereinafter, embodiments will be described with reference to the accompanying drawings. In the accompanying drawings, the same or corresponding components are given the same reference signs. In addition, in the description of the following embodiments, repeated description of the same or corresponding components may be omitted. However, even if the description of the constituent elements is omitted, it does not mean that such constituent elements are not included in a certain embodiment.
以下說明之實施例與隨附圖式所示之示例係關於一種用於電性檢查被檢查器件之探針卡及探針卡之探針頭。作為一例,實施例之探針卡及探針頭可於被檢查器件之製造製程中途用於電性檢查被檢查器件。The embodiments described below and the examples shown in the accompanying drawings relate to a probe card for electrical inspection of a device under inspection and a probe head for the probe card. As an example, the probe card and probe head of the embodiment can be used to electrically inspect the inspected device during the manufacturing process of the inspected device.
圖1係表示具備一實施例之探針頭之一實施例之探針卡。於圖1中,為了說明一實施例而概略性地表示探針卡、探針頭、被檢查器件及檢查裝置之形狀。Fig. 1 shows a probe card with one embodiment of the probe head of one embodiment. In FIG. 1, in order to describe an embodiment, the shapes of the probe card, the probe head, the inspected device, and the inspection apparatus are schematically shown.
一實施例之探針卡100可為了電性檢查被檢查器件10而配置於檢查裝置20。作為一例,檢查裝置20可包含探針儀21與測試機22。探針卡100能夠以可更換之方式配置於探針儀21。測試機22可與探針卡100電性連接。可於探針儀21之內部具備支持並移送被檢查器件10之搬送裝置23。被檢查器件10可配置於搬送裝置23之上表面。The
被檢查器件10可為形成於半導體晶圓上之多個半導體元件,但並不限定於此。又,上述半導體元件可為記憶體元件或非記憶體元件。因此,探針卡100可用於進行如下之檢查:於自半導體晶圓切割形成於半導體晶圓上之多個半導體元件前檢查半導體元件之電性功能及性能,確認半導體元件之不良。The inspected
探針卡100可包含電路基板組裝體101、複數個探針102、及將複數個探針102固定於電路基板組裝體101之一實施例之探針頭200。電路基板組裝體101可為探針卡100之本體。電路基板組裝體101以可導電之方式連接於檢查裝置20。詳細而言,電路基板組裝體101以可交換之方式配置於探針儀21,從而能夠以可導電之方式連接於測試機22,以便將來自測試機22之電性測試信號傳輸至被檢查器件10且將來自被檢查器件10之響應信號傳輸至測試機22。The
探針頭200保持複數個探針102且附著於電路基板組裝體101。因此,複數個探針102藉由探針頭200固定於電路基板組裝體101。複數個探針102於上端與電路基板組裝體101之端子接觸。又,複數個探針102於下端與被檢查器件10、詳細而言與被檢查器件10之端子11接觸。探針頭200包含第1板210與第2板220,第1板210與第2板220沿垂直方向保持複數個探針102。第2板220配置於第1板210之下方。一實施例之探針頭200以調整第1板210與第2板220間之間隔之方式構成。The
參照圖1,被檢查器件10可搭載於搬送裝置23上而與探針卡100密接。於探針卡100與被檢查器件10沿垂直方向密接之狀態下,藉由與被檢查器件10接觸之探針102而測試機22可對被檢查器件10輸出電性測試信號,來自被檢查器件10之響應信號可藉由探針102與電路基板組裝體101而傳輸至測試機22。藉此,可藉由探針卡100對被檢查器件10之電特性、功能特性、動作速度等執行電性檢查。1, the
參照圖2至圖11所示之示例,對一實施例之探針卡及一實施例之探針頭進行說明。Referring to the examples shown in FIGS. 2 to 11, the probe card of an embodiment and the probe head of an embodiment will be described.
圖2係一實施例之探針卡之下方立體圖。圖3係一實施例之探針卡之上方分解立體圖,圖4係一實施例之探針卡之下方分解立體圖。圖5係表示沿圖2之5-5線截取之剖面形狀。Fig. 2 is a bottom perspective view of a probe card of an embodiment. FIG. 3 is an exploded perspective view from above of the probe card of an embodiment, and FIG. 4 is an exploded perspective view from below of the probe card of an embodiment. Figure 5 shows the cross-sectional shape taken along line 5-5 of Figure 2;
參照圖2及圖3,於一實施例中,探針卡100之電路基板組裝體101包含第1電路基板組裝體110及第2電路基板組裝體120。第1電路基板組裝體110能夠以可導電之方式連接於檢查裝置(例如,圖1所示之檢查裝置20之測試機22)。第2電路基板組裝體120沿垂直方向VD附著於第1電路基板組裝體110,以可導電之方式結合於第1電路基板組裝體110。第2電路基板組裝體120可將第1電路基板組裝體110之端子間之端子間距調整成複數個探針102間之探針間距。此種第2電路基板組裝體120可作為空間變換器(space transformer)來參照。於另一實施例中,探針卡100之電路基板組裝體101可僅具備第1電路基板組裝體110。此種示例之探針卡100可用於電性檢查如記憶體元件之被檢查器件。2 and 3, in one embodiment, the
參照圖3,第1電路基板組裝體110可包含圓形的印刷電路基板111、附著於印刷電路基板111之上表面之第1加強件(stiffener)112、沿第1加強件112形成於印刷電路基板111之上表面之第2加強件113、及附著於印刷電路基板111之上表面之多個連接器114。3, the first
可於印刷電路基板111之下表面安裝供電性檢查信號及響應信號通過之多個信號線(未圖示)。第1加強件112位於第2加強件113內,附著於印刷電路基板111之上表面。第2加強件113呈環形狀,可發揮用以將探針卡100與檢查裝置間結合之功能。即,探針卡100可藉由第2加強件113對接於檢查裝置(例如,圖1所示之探針儀21之一部分)。為此,第2加強件113於其上表面具有用於對接之對接部。多個連接器114配置成放射狀,附著於印刷電路基板111之上表面。連接器114可結合於設置在檢查裝置之對應連接器(未圖示)。作為一例,可使用零插力(zero insertion force)連接器作為連接器114。A plurality of signal lines (not shown) through which power supply inspection signals and response signals pass can be mounted on the lower surface of the printed
參照圖4,第2電路基板組裝體120可藉由螺栓125附著於第1電路基板組裝體110之下表面。第2電路基板組裝體120可包含多層有機(multilayer organic)電路基板121、配置於印刷電路基板111與多層有機電路基板121之間之第3加強件122、插入於第3加強件122而與多層有機電路基板121接觸之內插器(interposer)123、及配置於多層有機電路基板121之下方之電路基板罩蓋124。4, the second
探針卡100之探針102可於其上端與多層有機電路基板121之端子接觸。於第3加強件122穿設有供內插器123插入之開口126。內插器123與印刷電路基板111之下表面及多層有機電路基板121之上表面接觸而以可導電之方式連接印刷電路基板111與多層有機電路基板121。內插器123可包含如下之導電片(conductive sheet):具有沿垂直方向配向之多個導電部及使導電部於水平方向上絕緣且隔開之絕緣部,包含聚矽氧橡膠材料。電路基板罩蓋124與多層有機電路基板121之下表面接觸,收容探針頭200之探針頭收容部127以開口之形狀貫通電路基板罩蓋124而形成。探針頭200插入於探針頭收容部127。螺栓125藉由印刷電路基板111緊固於第2電路基板組裝體120,從而將第2電路基板組裝體120固定於印刷電路基板111。The
參照圖2,一實施例之探針頭200將複數個探針102固定於電路基板組裝體101。參照圖3及圖4,探針頭200包含保持探針102之第1板210及第2板220。探針頭200能夠以可更換之方式結合於電路基板組裝體101。於圖3及圖4所示之示例中,探針頭200能夠以插入於電路基板罩蓋124之探針頭收容部127之方式配置於第2電路基板組裝體120。探針頭200之第1板210可固定於電路基板組裝體之第2電路基板組裝體120。作為一例,可於第1電路基板組裝體110及第2電路基板組裝體120沿垂直方向設置複數個貫通孔,可於第1板210沿邊緣設置與此類複數個貫通孔對應之螺絲孔或螺絲槽。螺絲藉由第1電路基板組裝體110及第2電路基板組裝體120之上述貫通孔而緊固至上述螺絲孔或螺絲槽,從而第1板210可固定於第2電路基板組裝體120。探針頭200之第2板220可相對於第1板210沿垂直方向VD移動。Referring to FIG. 2, the
參照圖3及圖4,第1板210及第2板220可呈尺寸相同之四邊平板形狀。於第1板210沿垂直方向VD貫通有分別插入探針102之複數個第1探針孔211。探針102可於上端部固定於第1板210。作為一例,於探針102之上端部設置可與第1探針孔211卡合之卡止部,從而可達成探針102與第1板210間之固定。第2板220配置於第1板210之下方。於第2板220沿垂直方向VD貫通有分別插入探針102且分別與第1探針孔211對應之第2探針孔221。3 and 4, the
於一實施例中,第1板210與第2板220可保持探針102而彼此密接。又,第1板210與第2板220可保持探針102而於其等之間沿垂直方向VD隔以規定之間隔(例如,圖1所示之間隔C)來沿垂直方向VD隔開。於第1板210與第2板220密接之狀態下,探針102可朝下方方向LD最初插入於第1板210及第2板220。於最初插入探針102之狀態下,第1板210及第2板220可同時保持探針102之上側部分。於第1板210及第2板220隔開上述規定間隔之狀態下,第1板210及第2板220可分別保持探針102之上側部分及下側部分。In one embodiment, the
探針頭200具備將保持探針102之第1板210及第2板220固定於電路基板組裝體101之固定裝置。於一實施例中,探針頭200包含結合於第2板220之螺母構件230及藉由電路基板組裝體101螺合於螺母構件230之第1螺栓構件240作為上述固定裝置。The
於一實施例中,螺母構件230可結合於第2板220之上表面,可沿垂直方向VD貫通第1板210。螺母構件230可藉由使用接著劑之接著或使用金屬材料之釺焊而結合於第2板220之上表面。圖3及圖4表示4個螺母構件230結合於第2板220之情形,但其僅為例示。探針頭200可使用至少兩個以上之螺母構件230。In one embodiment, the
參照圖3及圖4,螺母構件230可包含與第2板220結合之螺母頭231、及自螺母頭231朝上方方向UD延伸之套筒形狀之螺母主體232。第1螺栓構件240藉由第1電路基板組裝體110及第2電路基板組裝體120螺合於螺母構件230。探針頭200使用與螺母構件230之個數相同之個數之第1螺栓構件240。第1螺栓構件240可包含螺栓頭241、及自螺栓頭241朝下方垂直地延伸之螺栓主體242。3 and 4, the
參照圖3及圖4,於第1電路基板組裝體之第1加強件112形成有自上表面凹陷且大致呈長條四邊形形狀之複數個槽115。槽115之各角隅部以具有突起部(relief)之方式切割為圓弧形狀。對準孔116位於槽115之中央,對準孔116沿垂直方向貫通第1加強件112。又,沿對準孔116之外圍以較槽115之底面凹陷之方式形成有螺栓頭座(bolt head seat)117。於第1電路基板組裝體之印刷電路基板111沿垂直方向貫通有與對準孔116對應之對準孔118。於第2電路基板組裝體之第3加強件122及多層有機電路基板121分別沿垂直方向貫通有與對準孔116、118對應之對準孔128及對準孔129。對準孔116、118、128、129具有可插入螺母主體232及螺栓主體242之直徑。螺母主體232貫通多層有機電路基板121之對準孔129、第3加強件122之對準孔128及印刷電路基板111之對準孔118,其上端可定位至印刷電路基板111之上表面的高度。螺栓主體242貫通第1加強件112之對準孔116及印刷電路基板111之對準孔118,其下端可位於印刷電路基板111之對準孔118的中間。第1螺栓構件240係螺栓頭241與第1加強件112之上表面(詳細而言為螺栓頭座117)接觸而可限制該第1螺栓構件之位置。螺栓頭241可於其下表面與螺栓頭座117接觸。3 and 4, the first reinforcing
螺母主體232可呈中空之套筒形狀。螺栓主體242可呈中空之套筒形狀。於一實施例中,螺母主體232可插入於螺栓主體242之內部,並且第1螺栓構件240螺合於螺母構件230。與此相關,可於螺母主體232之外周面形成公螺紋之第1螺紋233,可於螺栓主體242之內周面形成與第1螺紋233螺合之母螺紋243。於另一實施例中,亦可於螺母主體232之內周面形成母螺紋且於螺栓主體242之外周面形成公螺紋而將螺栓主體插入於螺母主體之內部。The
於一實施例中,第1螺栓構件240可於第1位置及第2位置螺合於螺母構件230。第1螺栓構件240可於上述第1位置與螺母構件230螺合,以便第1板210與第2板220彼此密接。第1螺栓構件240可於上述第2位置與螺母構件230螺合,以便第2板220沿垂直方向離開第1板210。上述第2位置係朝上方方向UD離開上述第1位置之位置,且係確保藉由第1板210及第2板220完全保持探針102之位置。即,上述第2位置可為如下位置:以第1板210與第2板220不彼此密接而於其等之間形成上述規定間隔之方式第1螺栓構件240螺合於螺母構件230。In one embodiment, the
於一實施例中,探針頭200可包含將與螺母構件230螺合之第1螺栓構件240固定於上述第2位置之擋止件250。擋止件250可約束第1螺栓構件240之上方方向UD之移動而以第2板220離開第1板210之狀態保持第2板220。In an embodiment, the
參照圖3及圖4,能夠以覆蓋第1螺栓構件240之方式形成擋止件250。擋止件250可與螺栓頭241之上端接觸而將第1螺栓構件240固定於上述第2位置。擋止件250具有插入至槽115之尺寸。擋止件250可因設置於槽115之各角隅之突起部而精確地嵌入於槽115。如圖3所示,於擋止件250形成有一對貫通孔251,在槽115形成有自槽115之底面朝下方穿設之一對螺絲孔119。夾緊螺栓252貫通擋止件250而緊固於螺絲孔119,從而擋止件250可與第1螺栓構件240之螺栓頭241接觸而固定於第1電路基板組裝體之第1加強件112。即,擋止件250可於第1螺栓構件240之上述第2位置與第1螺栓構件240接觸而固定於電路基板組裝體101。3 and 4, the
如上所述,第1螺栓構件240於上述第2位置螺合於螺母構件230,因此第2板220可保持探針102之一部分而離開第1板210。因此,可分別藉由隔開之第1板210及第2板220保持探針102之上側部分及下側部分。As described above, the
於一實施例中,探針頭200可精確地調整第1板210與第2板220之上述規定間隔。與此相關,探針頭200可包含藉由第1螺栓構件240螺合於螺母構件230之第2螺栓構件260。螺合於螺母構件230之第2螺栓構件260可相對於螺母構件230正向或反向旋轉。此種第2螺栓構件260之旋轉可藉由螺母構件230而使第2板220相對於第1板210朝上方或下方微小地移動。因此,可精確地調整第1板210與第2板220之間隔,第2板220保持探針102之位置可發生變更。第2螺栓構件260可於第1螺栓構件240之上述第2位置螺合於螺母構件230。In one embodiment, the
於一實施例中,能夠以第2螺栓構件260沿垂直方向貫通第1螺栓構件240之方式形成第1螺栓構件240。參照圖3,第1螺栓構件240之螺栓頭241具有呈六邊形之凹陷之螺栓頭座244,於螺栓主體242自螺栓頭座244之底面沿垂直方向穿設有貫通孔245。第2螺栓構件260具有形成有六邊形之扳手孔之螺栓頭261、及自螺栓頭261延伸之圓柱形狀之螺栓主體262。螺栓主體262可藉由貫通孔245插入於第1螺栓構件240之內部。螺栓頭261之下表面與螺栓頭座244之底面接觸,從而第2螺栓構件260可與第1螺栓構件240接觸。因此,第1螺栓構件240之螺栓頭241可支持第2螺栓構件260。In one embodiment, the
於一實施例中,螺母構件230可具有與第1螺栓構件240螺合之第1螺紋233、及與第2螺栓構件260螺合且具有小於第1螺紋233之直徑之第2螺紋234。作為一例,第1螺紋233與第2螺紋234能夠以分別形成於套筒形狀之螺母主體232之外周面與內周面之方式提供至螺母構件230。作為又一例,第1螺紋233與第2螺紋234可形成於圓柱形狀之螺母主體之外周面。作為另一例,第1螺紋233與第2螺紋234可形成於套筒形狀之螺母主體之內周面。In one embodiment, the
圖6係表示第1螺栓構件螺合於螺母構件且第2螺栓構件螺合於螺母構件之情形之剖視圖。於一實施例中,參照圖6,於螺母構件230之螺母主體232之外周面形成與第1螺栓構件240之母螺紋243螺合的公螺紋之第1螺紋233,於螺母主體232之內周面形成與第2螺栓構件260之公螺紋263螺合之母螺紋的第2螺紋234。Fig. 6 is a cross-sectional view showing a state in which the first bolt member is screwed to the nut member and the second bolt member is screwed to the nut member. In one embodiment, referring to FIG. 6, a
於一實施例中,第2螺紋234之螺紋間距TP2小於第1螺紋233之螺紋間距TP1。於第2螺紋之螺紋間距TP2小於第1螺紋之螺紋間距TP1之情況下,能夠以可微小地調整第1板210與第2板220間之間隔之方式設定第1螺紋233之螺紋間距TP1與第2螺紋234的螺紋間距TP2間之比率。又,第2螺栓構件260之公螺紋263之螺紋間距小於第1螺栓構件240之母螺紋243的螺紋間距。參照圖3、圖5及圖6,第2螺栓構件260之螺栓頭261與螺栓頭座244接觸而限制第2螺栓構件260之垂直方向VD之移動,螺母構件230固定於第2板220。因此,隨著第2螺栓構件260相對於螺母構件230正向或反向旋轉,藉由此種旋轉引起之螺絲運動而螺母構件230可朝上方或下方微小地移動,可調整第1板210與第2板220間之間隔。In one embodiment, the thread pitch TP2 of the
參照圖7至圖11,對一實施例之探針頭組裝於探針卡之示例進行說明。Referring to FIGS. 7 to 11, an example in which the probe head of an embodiment is assembled on the probe card will be described.
參照圖7,第2電路基板組裝體120附著於第1電路基板組裝體110。參照圖8,於第2電路基板組裝體120組裝於第1電路基板組裝體110之狀態下,探針頭200裝設於第2電路基板組裝體120。詳細而言,以探針頭200之第1板210面向多層有機電路基板121之下表面之方式藉由電路基板罩蓋124之探針頭收容部127將探針頭200裝設於多層有機電路基板121之下表面。於圖8所示之示例中,第1板210與第2板220相互密接。如圖9所示,於第1板210與第2板220密接之狀態下,探針102可最初插入於第1板210及第2板220。作為一例,於最初插入探針102之狀態下,探針102之上端部可藉由卡合而結合於第1探針孔211,探針102之上端部可通過第2探針孔221。Referring to FIG. 7, the second
參照圖10及圖11,插入有探針102且相互密接之第1板210與第2板220裝設於第2電路基板組裝體120。第1板210可藉由貫通第1電路基板組裝體110及第2電路基板組裝體120而螺合於第1板210之螺絲來固定於第2電路基板組裝體120。於第1板210固定於第2電路基板組裝體120後,第1螺栓構件240可螺合於螺母構件230,第2螺栓構件260可螺合於螺母構件230。於第2螺栓構件260螺合於螺母構件230後,擋止件250可藉由夾緊螺栓252結合於第1電路基板組裝體110。10 and 11, the
如圖11所示,若將密接之第1板210與第2板220裝設於第2電路基板組裝體之多層有機電路基板121,則螺母構件230貫通對準孔129及對準孔128。第1螺栓構件240貫通對準孔116及對準孔118而螺合於螺母構件230。第1螺栓構件240與螺母構件230螺合而保持於上述第1位置,直至螺栓頭241之下表面與螺栓頭座117接觸為止。因此,第1螺栓構件240於上述第1位置螺合於螺母構件230,第1板210與第2板220沿垂直方向VD密接。As shown in FIG. 11, when the
如圖9所示,密接之第1板210與第2板220之各者之探針孔211、221沿垂直方向VD對準,探針102依序插入於第1板210與第2板220。因此,於將探針102最初插入於探針頭200時,可藉由密接之第1板210與第2板220而容易地插入探針102。探針102朝下方方向LD率先插入於第1板210,其上端部藉由上述卡合而固定於第1板210。因此,所插入之探針102之上端部可位於同一水平高度,可確保探針102與電路基板組裝體間之穩定之接觸。As shown in FIG. 9, the probe holes 211, 221 of each of the
圖12至圖16係表示藉由一實施例之探針頭而於探針卡保持探針之示例。圖12至圖16係並列示出藉由第1板及第2板保持探針之示例、及螺母構件與第1螺栓構件間之相對位置之示例。12 to 16 show examples of holding probes on the probe card by the probe head of an embodiment. FIGS. 12 to 16 side by side show an example of holding the probe by the first plate and the second plate, and an example of the relative position between the nut member and the first bolt member.
圖12係表示探針最初插入於探針頭而藉由探針頭保持之情形。又,圖12係表示圖11所示之狀態之下一狀態。如圖12所示,第1螺栓構件240可於第1位置P1螺合於螺母構件230。第1板210與第2板220於第1螺栓構件240之第1位置P1沿垂直方向VD密接,藉由密接之第1板210與第2板220保持探針102。於第1螺栓構件240之第1位置P1,探針102之上側部分由第1板210及第2板220保持,探針102具有自第2板220突出之第1突出長度L1。Fig. 12 shows a state where the probe is initially inserted into the probe head and held by the probe head. In addition, FIG. 12 shows a state below the state shown in FIG. 11. As shown in FIG. 12, the
圖13係與圖12相似之圖式,表示第1螺栓構件自螺母構件鬆解而於第2位置結合於螺母構件之情形。參照圖13,第1螺栓構件240於朝上方方向UD離開第1位置P1之第2位置P2與螺母構件230螺合。可根據探針102之長度適當地選擇第1位置P1與第2位置P2之高度差。自螺母構件230鬆解第1螺栓構件240,因此於螺栓頭241之下表面與螺栓頭座117之間形成間隔。藉此,第1螺栓構件240可與螺母構件230一併向下方移動,直至螺栓頭241之下表面與螺栓頭座117接觸為止。又,隨著第1螺栓構件240向下方移動,第2板220可離開第1板210。Fig. 13 is a drawing similar to Fig. 12, showing a state where the first bolt member is loosened from the nut member and is coupled to the nut member at the second position. 13, the
圖14係表示藉由探針頭保持探針之又一例,且表示第2板離開第1板之情形。參照圖13及圖14,第1螺栓構件240於第2位置P2螺合於螺母構件230。隨著第1螺栓構件240朝下方方向LD移動,第2板220朝下方方向LD離開第1板210。隨著第2板220向下方移動而由第1板210保持探針102之上側部分,由第2板220保持探針102之下側部分。因此,於第1螺栓構件240之第2位置P2由隔開之第1板210與第2板220保持探針102。又,於圖14所示之第1螺栓構件240之第2位置P2,探針102具有自第2板220突出之第2突出長度L2。第2突出長度L2短於第1突出長度L1。Fig. 14 shows another example of holding the probe by the probe head, and shows the situation where the second plate is separated from the first plate. 13 and 14, the
如圖14所示,第2板220離開第1板210而探針102之上側部分及其下側部分由第1板210及第2板220保持。因此,藉由第2板220離開第1板210而探針102可容易地組裝於探針頭200。又,可藉由調整第1螺栓構件240而使第2板220移動,因此實施例之探針頭可無需另外之裝置而藉由調整第1板210與第2板220間之間隔C來保持各種長度之探針。As shown in FIG. 14, the
根據實施例,亦可於圖14所示之第1板210與第2板220之位置及插入探針102之狀態下結束探針頭200與探針102的設置。於此種實施例中,擋止件250(參照圖3及圖4)與螺栓頭241接觸而結合於第1加強件112,藉此可將第1螺栓構件240固定於第2位置P2。擋止件約束第1螺栓構件240之上方移動,從而能夠以第2板220離開第1板210且探針102完全插入之狀態約束第2板220之移動。According to the embodiment, the setting of the
圖15係表示第2螺栓構件藉由第1螺栓構件螺合於螺母構件之情形。第2螺栓構件260於第1螺栓構件240之第2位置P2貫通第1螺栓構件240而螺合於螺母構件230。第2螺栓構件260可螺合於螺母構件230,直至螺栓頭261與螺栓頭座244接觸為止。第2螺栓構件260之公螺紋與螺母構件230之第2螺紋螺合,第1螺栓構件240之母螺紋與螺母構件230之第1螺紋螺合。如上所述,第2螺紋之螺紋間距TP2(參照圖6)小於第1螺紋之螺紋間距TP1(參照圖6)。因此,若使第2螺栓構件260相對於螺母構件230正向或反向旋轉,則藉由第2螺栓構件260與螺母構件230間之螺絲運動而第2板220朝上方方向UD接近第1板210、或進一步朝下方方向LD離開第1板210。藉此,可精確地調整確保於第1螺栓構件240之第2位置P2之第1板210與第2板220間之間隔C。於第2螺栓構件260旋轉時,第1螺栓構件240沿第2螺栓構件260之旋轉方向與第2螺栓構件260一併旋轉,從而可精確地移動螺母構件230及第2板220。Fig. 15 shows a state where the second bolt member is screwed to the nut member by the first bolt member. The
可藉由第2螺栓構件260之旋轉而微小且精確地調整安裝於第1螺栓構件240之第2位置P2之第1板210與第2板220的間隔C。例如,於探針102之下端磨耗而探針102之長度變短之情形時,第2板220能夠以藉由第2螺栓構件260之旋轉而間隔C變窄之方式移動。即,可不分解第1板210與第2板220而藉由使用第2螺栓構件260來調整第1板210與第2板220之間隔C。藉此,可提高探針卡之壽命。The interval C between the
圖16係表示藉由擋止件而第1螺栓構件固定於第2位置之情形。於第2螺栓構件260螺合於螺母構件230後,擋止件250可固定於第1電路基板組裝體。例如,藉由擋止件250將夾緊螺栓252緊固於第1加強件112,藉此,擋止件250能夠以與第1螺栓構件240接觸之狀態安裝於第1加強件112。安裝於第1加強件112之擋止件250約束第1螺栓構件240,從而可保持第1板210與第2板220間之間隔C。Fig. 16 shows a state where the first bolt member is fixed to the second position by the stopper. After the
螺母構件、第1螺栓構件及第2螺栓構件可呈與隨附圖式所示之形狀及配置不同之形狀及配置。作為一實施例,螺母主體可具有形成第1螺紋之第1部分、及直徑小於第1部分之直徑且自第1部分延伸而於外周面形成有第2螺紋之第2部分。於此種示例中,第2螺栓構件之螺栓主體可呈中空之圓筒形狀,可於其內周面具有與螺母主體之公螺紋的第2螺紋結合之母螺紋。作為一實施例,中空之螺母主體之內周面可具有母螺紋之第1螺紋、及小於第1螺紋之直徑的母螺紋之第2螺紋,第1螺栓構件之螺栓主體可於外周面具有與第1螺紋螺合之公螺紋,第2螺栓構件之螺栓主體可於外周面具有與第2螺紋螺合之公螺紋。The nut member, the first bolt member, and the second bolt member may have different shapes and arrangements from those shown in the accompanying drawings. As an embodiment, the nut body may have a first portion forming a first thread, and a second portion having a diameter smaller than the diameter of the first portion and extending from the first portion to form a second thread on the outer peripheral surface. In this example, the bolt body of the second bolt member may have a hollow cylindrical shape, and its inner peripheral surface may have a female thread combined with the second thread of the male thread of the nut body. As an embodiment, the inner peripheral surface of the hollow nut body may have a first thread of the female thread and a second thread of the female thread smaller than the diameter of the first thread, and the bolt body of the first bolt member may have the same The male thread of the first thread screwing, and the bolt body of the second bolt member may have a male thread screwing with the second thread on the outer peripheral surface.
作為一實施例,探針卡亦可僅具備上述第1電路基板組裝體。於此種示例中,可於第1電路基板組裝體之印刷電路基板具備可將探針頭固定於印刷電路基板之裝置。As an example, the probe card may include only the first circuit board assembly described above. In this example, the printed circuit board of the first circuit board assembly can be provided with a device capable of fixing the probe head to the printed circuit board.
於上述實施例中,擋止件之形狀、安裝擋止件之電路基板組裝體之位置僅為例示。擋止件只要可將第1螺栓構件固定於第2位置,則可呈各種形狀,可藉由各種裝置安裝於探針卡或探針頭。In the above embodiments, the shape of the stopper and the position of the circuit board assembly where the stopper is installed are only examples. The stopper can have various shapes as long as it can fix the first bolt member to the second position, and can be mounted on a probe card or a probe head by various devices.
圖中所示之探針之形狀僅為例示。於一實施例中,探針卡可採用彈簧針型探針、針型探針。於又一實施例中,探針卡可採用上端與下端偏移之探針。The shape of the probe shown in the figure is only an example. In one embodiment, the probe card can be a pogo pin probe or a needle probe. In another embodiment, the probe card may use probes with offset upper and lower ends.
以上,藉由一部分實施例及隨附圖式所示之示例對本發明之技術思想進行了說明,但應瞭解,可於不脫離於本發明所屬之技術領域內具有常識者可理解之本發明之技術思想及範圍的範圍內進行各種置換、變化及變更。又,此種置換、變化及變更應視為屬於隨附之發明申請專利範圍內。Above, the technical idea of the present invention has been explained by some embodiments and examples shown in the accompanying drawings. However, it should be understood that the present invention can be understood by those with common sense in the technical field to which the present invention belongs. Various replacements, changes and changes are made within the scope of technical ideas and scope. Moreover, such replacements, changes and changes shall be deemed to fall within the scope of the attached invention application patent.
10:被檢查器件 11:端子 20:檢查裝置 21:探針儀 22:測試機 23:搬送裝置 100:探針卡 101:電路基板組裝體 102:探針 110:第1電路基板組裝體 111:印刷電路基板 112:第1加強件 113:第2加強件 114:連接器 115:槽 116:對準孔 117:螺栓頭座 118:對準孔 119:螺絲孔 120:第2電路基板組裝體 121:多層有機電路基板 122:第3加強件 123:內插器 124:電路基板罩蓋 125:螺栓 126:開口 127:探針頭收容部 128:對準孔 129:對準孔 200:探針頭 210:第1板 211:第1探針孔 220:第2板 221:第2探針孔 230:螺母構件 231:螺母頭 232:螺母主體 233:第1螺紋 234:第2螺紋 240:第1螺栓構件 241:螺栓頭 242:螺栓主體 243:母螺紋 244:螺栓頭座 245:貫通孔 250:擋止件 251:貫通孔 252:夾緊螺栓 260:第2螺栓構件 261:螺栓頭 262:螺栓主體 263:公螺紋 C:間隔 L1:第1突出長度 L2:第2突出長度 LD:下方方向 P1:第1位置 P2:第2位置 TP1:第1螺紋之螺紋間距 TP2:第2螺紋之螺紋間距 UD:上方方向 VD:垂直方向10: Device under inspection 11: Terminal 20: Check the device 21: Probe instrument 22: Test machine 23: Conveying device 100: Probe card 101: Circuit board assembly 102: Probe 110: The first circuit board assembly 111: Printed Circuit Board 112: The first reinforcement 113: The second reinforcement 114: Connector 115: Slot 116: Alignment hole 117: Bolt head seat 118: Alignment hole 119: screw hole 120: The second circuit board assembly 121: Multilayer organic circuit substrate 122: third reinforcement 123: Interpolator 124: Circuit board cover 125: Bolt 126: opening 127: Probe head receiving part 128: Alignment hole 129: Alignment hole 200: Probe head 210: first board 211: 1st probe hole 220: second board 221: 2nd probe hole 230: nut member 231: Nut head 232: Nut body 233: 1st thread 234: 2nd thread 240: The first bolt member 241: Bolt head 242: Bolt body 243: Female thread 244: Bolt Head Seat 245: Through hole 250: stop 251: Through hole 252: clamping bolt 260: The second bolt member 261: Bolt head 262: Bolt body 263: male thread C: interval L1: The first protrusion length L2: 2nd protrusion length LD: downward direction P1: 1st position P2: 2nd position TP1: Thread pitch of the first thread TP2: Thread pitch of the second thread UD: up direction VD: vertical direction
圖1係概略性地表示具備一實施例之探針頭之一實施例之探針卡。 圖2係一實施例之探針卡之下方立體圖。 圖3係一實施例之探針卡之上方分解立體圖。 圖4係一實施例之探針卡之下方分解立體圖。 圖5係沿圖2之5-5線截取之剖視圖。 圖6係表示螺母構件、第1螺栓構件及第2螺栓構件之剖視圖。 圖7係表示未裝設探針頭之一實施例之探針卡之立體圖。 圖8係表示一實施例之探針卡之組裝例之立體圖,其表示電路基板組裝體與探針頭。 圖9係表示探針最初插入於相互密接之第1板與第2板之示例。 圖10係表示一實施例之探針卡之組裝例之立體圖,其表示裝設於電路基板組裝體之探針頭。 圖11係表示裝設於電路基板組裝體之探針頭之螺母構件與第1螺栓構件。 圖12係表示藉由一實施例之探針頭保持探針之一例,且表示第1螺栓構件於第1位置結合於螺母構件之情形。 圖13係與圖12相似之圖,其表示第1螺栓構件於第2位置結合於螺母構件之情形。 圖14係表示藉由一實施例之探針頭保持探針之又一例。 圖15係與圖14相似之圖,其表示第2螺栓構件結合於螺母構件之情形。 圖16係表示結合於電路基板組裝體之一實施例之探針頭。Fig. 1 schematically shows a probe card provided with an embodiment of a probe head. Fig. 2 is a bottom perspective view of a probe card of an embodiment. Fig. 3 is an exploded perspective view from above of the probe card of an embodiment. Fig. 4 is a bottom exploded perspective view of the probe card of an embodiment. Figure 5 is a cross-sectional view taken along line 5-5 of Figure 2; Fig. 6 is a cross-sectional view showing a nut member, a first bolt member, and a second bolt member. Fig. 7 is a perspective view showing an embodiment of a probe card without a probe head. Fig. 8 is a perspective view showing an assembly example of a probe card of an embodiment, which shows a circuit board assembly and a probe head. Fig. 9 shows an example in which the probe is initially inserted into the first and second plates that are in close contact with each other. Fig. 10 is a perspective view showing an assembly example of a probe card according to an embodiment, which shows a probe head mounted on a circuit board assembly. Fig. 11 shows the nut member and the first bolt member of the probe head mounted on the circuit board assembly. FIG. 12 shows an example of holding the probe by the probe head of an embodiment, and shows a situation where the first bolt member is coupled to the nut member at the first position. Fig. 13 is a view similar to Fig. 12, which shows a state where the first bolt member is coupled to the nut member at the second position. FIG. 14 shows another example of holding the probe by the probe head of an embodiment. Fig. 15 is a view similar to Fig. 14 and shows a state where the second bolt member is coupled to the nut member. Fig. 16 shows an embodiment of a probe head combined with a circuit board assembly.
102:探針 102: Probe
111:印刷電路基板 111: Printed Circuit Board
112:第1加強件 112: The first reinforcement
116:對準孔 116: Alignment hole
117:螺栓頭座 117: Bolt head seat
118:對準孔 118: Alignment hole
119:螺絲孔 119: screw hole
121:多層有機電路基板 121: Multilayer organic circuit substrate
122:第3加強件 122: third reinforcement
124:電路基板罩蓋 124: Circuit board cover
128:對準孔 128: Alignment hole
129:對準孔 129: Alignment hole
210:第1板 210: first board
220:第2板 220: second board
230:螺母構件 230: nut member
231:螺母頭 231: Nut head
232:螺母主體 232: Nut body
240:第1螺栓構件 240: The first bolt member
241:螺栓頭 241: Bolt head
242:螺栓主體 242: Bolt body
244:螺栓頭座 244: Bolt Head Seat
245:貫通孔 245: Through hole
250:擋止件 250: stop
251:貫通孔 251: Through hole
252:夾緊螺栓 252: clamping bolt
260:第2螺栓構件 260: The second bolt member
261:螺栓頭 261: Bolt head
262:螺栓主體 262: Bolt body
C:間隔 C: interval
L2:第2突出長度 L2: 2nd protrusion length
LD:下方方向 LD: downward direction
P2:第2位置 P2: 2nd position
UD:上方方向 UD: up direction
VD:垂直方向 VD: vertical direction
Claims (18)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180105800A KR102037657B1 (en) | 2018-09-05 | 2018-09-05 | Probe card for electrical test and probe head for probe card |
| KR10-2018-0105800 | 2018-09-05 |
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| Publication Number | Publication Date |
|---|---|
| TW202018306A TW202018306A (en) | 2020-05-16 |
| TWI714245B true TWI714245B (en) | 2020-12-21 |
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| TW108132074A TWI714245B (en) | 2018-09-05 | 2019-09-05 | Probe card for electrical test and probe head for probe card |
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| Country | Link |
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| KR (1) | KR102037657B1 (en) |
| TW (1) | TWI714245B (en) |
| WO (1) | WO2020050645A1 (en) |
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| US12092660B2 (en) | 2020-03-11 | 2024-09-17 | Nhk Spring Co., Ltd. | Probe card |
| KR102673349B1 (en) * | 2022-02-25 | 2024-06-07 | (주)티에스이 | Lower Friction Probe Head |
| KR102742433B1 (en) * | 2022-04-27 | 2024-12-16 | (주)티에스이 | Probe head with adjustable protrusion length of probe |
| CN116626345A (en) * | 2023-06-16 | 2023-08-22 | 昆山沪光汽车电器股份有限公司 | A conduction module for wiring harness testing circuit |
| KR102725789B1 (en) * | 2024-01-29 | 2024-11-04 | 주식회사 디오리진 | Socket for testing semiconductor device and assembly method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2531042Y2 (en) * | 1990-09-28 | 1997-04-02 | アンリツ株式会社 | Probe head |
| KR20100023448A (en) * | 2008-08-22 | 2010-03-04 | (주) 미코티엔 | Probe card |
| KR20130009359A (en) * | 2011-07-15 | 2013-01-23 | 주식회사 세디콘 | Mounting device for fixing probing needle and producting method of probe card |
| TWI401437B (en) * | 2008-05-16 | 2013-07-11 | Probe card | |
| JP2018128301A (en) * | 2017-02-07 | 2018-08-16 | 株式会社日本マイクロニクス | jig |
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|---|---|---|---|---|
| JP6890921B2 (en) | 2015-10-21 | 2021-06-18 | 株式会社日本マイクロニクス | Probe card and contact inspection device |
| KR101766265B1 (en) * | 2015-11-18 | 2017-08-09 | (주)엠투엔 | Probe card |
-
2018
- 2018-09-05 KR KR1020180105800A patent/KR102037657B1/en active Active
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2019
- 2019-09-05 WO PCT/KR2019/011475 patent/WO2020050645A1/en not_active Ceased
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2531042Y2 (en) * | 1990-09-28 | 1997-04-02 | アンリツ株式会社 | Probe head |
| TWI401437B (en) * | 2008-05-16 | 2013-07-11 | Probe card | |
| KR20100023448A (en) * | 2008-08-22 | 2010-03-04 | (주) 미코티엔 | Probe card |
| KR20130009359A (en) * | 2011-07-15 | 2013-01-23 | 주식회사 세디콘 | Mounting device for fixing probing needle and producting method of probe card |
| JP2018128301A (en) * | 2017-02-07 | 2018-08-16 | 株式会社日本マイクロニクス | jig |
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| WO2020050645A1 (en) | 2020-03-12 |
| TW202018306A (en) | 2020-05-16 |
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