TWI713991B - Die bonding device and manufacturing method of semiconductor device - Google Patents

Abstract

The subject of the present invention is to provide a die bonding device capable of washing the back surface of a substrate. The solution is that the die bonding device has: A conveying part, which conveys the substrate with a plurality of rows of areas where the crystal grains are placed in the first direction; The first foreign matter removing device, which removes foreign matter on the first surface of the aforementioned substrate; A second foreign matter removing device that removes foreign matter on the second surface of the substrate opposite to the first surface; and Bonding head, which bonds the picked up die to the aforementioned substrate. The first foreign matter removing device includes a plate at a position away from the substrate, and a gas flows between the substrate and the plate to remove foreign matter on the first surface of the substrate.

Description

Die bonding device and manufacturing method of semiconductor device

This case relates to a die-bonding device, which can be applied to, for example, a die-bonding device equipped with a device for cleaning substrates.

As part of the manufacturing process of semiconductor devices, there is a process in which a semiconductor chip (hereinafter referred to as a die) is mounted on a wiring board or a lead frame (hereinafter referred to as a substrate) to be assembled and packaged, and part of the process in a package package is A process of dividing a die from a semiconductor wafer (hereinafter referred to as a wafer) (dicing process) and a bonding process of mounting the divided die on a substrate. The semiconductor manufacturing equipment used in the bonding process is a die bonder or other die bonder.

Although an adhesive is used for the bonding of the die to the substrate, when the die is adhered to the substrate, once the garbage adheres to the surface of the substrate, the adhesive force of the adhesive will be reduced, so the garbage on the substrate (hereinafter referred to as foreign matter) is removed. It is extremely important to install the die. In Patent Document 1, it is proposed to move a foreign matter removing device having a washing nozzle in which an air blowing hole and a suction hole are integrated to move in a direction orthogonal to the moving direction of the substrate to remove foreign matter on the substrate. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2012-199458 A

(The problem to be solved by the invention)

However, in Patent Document 1, although foreign matter on the surface of the substrate can be removed, foreign matter on the back surface cannot be removed. The subject of this case is to provide a die bonding device that can clean the back of the substrate. Other issues and novel features can be clearly understood from the description of this specification and the drawings. (Means to solve the problem)

If you briefly explain the outline of the representative person in this case, it is as follows. That is, the die bonding device has: A conveying part, which conveys the substrate with a plurality of rows of areas where the crystal grains are placed in the first direction; The first foreign matter removing device, which removes foreign matter on the first surface of the aforementioned substrate; A second foreign matter removing device that removes foreign matter on the second surface of the substrate opposite to the first surface; and Bonding head, which bonds the picked up die to the aforementioned substrate. The first foreign matter removing device includes a plate at a position away from the substrate, and a gas flows between the substrate and the plate to remove foreign matter on the first surface of the substrate. [Effects of the invention]

According to the above die bonding device, the back surface of the substrate can be cleaned.

Hereinafter, the embodiments, modified examples, comparative examples, and examples will be explained using the drawings. However, in the following description, the same reference numerals may be attached to the same constituent elements to omit overlapping descriptions. In addition, in order to make the description clearer, the drawings show the width, thickness, shape, etc. of each part in a schematic manner compared to the actual form, but it is only an example after all, and does not limit the interpreter of the present invention.

With reference to FIGS. 1 and 2, the technique (comparative example) that the inventors of the present application examined for the cleaning of both the front and back surfaces of the substrate will be explained. Fig. 1 is a diagram illustrating a method of cleaning the surface of a substrate of a comparative example, Fig. 1(A) is a cross-sectional view showing a state where the substrate is separated from an adsorption platform, and Fig. 1(B) is a view showing a state where the substrate is in contact with the adsorption platform Sectional view. FIG. 2 is a diagram illustrating the curvature of the substrate, FIG. 2(A) is a cross-sectional view when the surface of the upper curved substrate is washed, and FIG. 2(B) is a cross-sectional view when the back surface of the lower curved substrate is washed.

The foreign matter removing device 9 of the comparative example is provided with a washing nozzle 91. The washing nozzle 91 is equipped with an air supply pipe 91a and an air discharge pipe 91b. The air discharge pipe 91b is as shown in FIG. 1(B), and the pipe diameter is larger than the air supply pipe 91a. This is because the air discharge pipe 91b is used for the conveyance of foreign objects. The surface closest to the substrate S is the nozzle surface 91c as shown in FIG. 1(B).

This nozzle surface 91c has a rectangular shape in plan view, a plurality of circular air blowing ports 91d are provided in the center, and a plurality of air suction ports 91e are provided so as to surround the air blowing port 91d annularly.

Thereby, the foreign matter blown away by the air discharged from the air blowing port 91d is immediately sucked by the air suction port 91e as shown by the arrow in FIG. 1(B), and is finally discarded.

The cleaning nozzle 91 is operated up and down. Usually, the cleaning nozzle 91 is lowered to a proper position of the substrate S (for example, a position of 2 mm on the substrate S), and rises when the substrate S is moved or replaced. Moreover, as shown in FIG. 1(B), the washing nozzle 91 moves in the width direction (Y direction) of the substrate S as shown by an arrow C to perform a foreign matter removal operation.

As shown in Fig. 1(A), the substrate S supported by the conveying guides (slide path, conveyance path) 52 at both ends by the clamp (substrate conveying claw) 51 is conveyed to X Direction to the adsorption platform AS. The suction platform AS is raised to be in contact with the substrate S and sucked from the suction holes AH, thereby fixing the substrate S to the suction platform AS.

The cleaning nozzle 91 is lowered, and the substrate S is moved in a direction (Y direction) perpendicular to the conveyance direction (X direction) of the substrate S to clean the surface of the substrate S.

Since the tip of the cleaning nozzle 91 approaches the surface side of the substrate S, it is necessary to flatten the substrate. However, as shown in FIG. 2(A), the substrate S may be bent upward or downward, so the substrate S is fixed to the suction platform AS by vacuum suction.

When cleaning the back surface of the substrate S, if the cleaning nozzle 91 is also provided on the back side of the substrate S, since the nozzle tip will approach, the substrate must be flattened. As shown in Figure 2(B), the substrate S may be bent downward or upward. Therefore, we reviewed the vacuum adsorption to fix the substrate S on the adsorption platform AS. However, there are crystal grains or crystals on the surface side of the substrate S. In the place where the grains are installed, there is a possibility that the grains may be damaged, and there is a possibility that foreign matter may adhere to the place where the grains are installed. Therefore, it is difficult to directly contact and adsorb the surface of the substrate S to the adsorption platform AS to flatten the substrate.

In addition, when the substrate S is curved, it is difficult to clean both surfaces in an appropriate positional relationship at the same time with an appropriate positional relationship with the washing nozzle 91.

Therefore, in the embodiment, a plate is provided at a position away from the substrate, and gas flows between the substrate and the plate to clean the back surface of the substrate. Hereinafter, some embodiments will be described.

<The first embodiment> The cleaning of the substrate according to the first embodiment will be described with reference to FIGS. 3 and 4. Fig. 3 is a diagram illustrating the foreign matter removing device for the back surface of the substrate of the first embodiment, Fig. 3(A) is a plan view, Fig. 3(B) is a cross-sectional view taken along line B1-B2 of Fig. 3(A), and Fig. 3( C) is a cross-sectional view taken along the line C1-C2 of FIG. 3(A). 4 is a diagram illustrating the foreign matter removing device for the substrate surface and the foreign matter removing device for the back surface of the first embodiment. FIG. 4(A) is a plan view, and FIG. 4(B) is a line B1-B2 of FIG. 4(A) Fig. 4(C) is a cross-sectional view taken along the line C1-C2 in Fig. 4(A).

The foreign matter removing device (first foreign matter removing device) 100 for the back surface of the substrate is provided with a plate 101 which can be brought into contact with the back (first surface) side of the substrate S. The plate 101 is provided with a groove 102 extending along the substrate width direction (Y direction) on its upper surface side. The plate 101 is provided with a supply pipe 103 for supplying gas from below at one end of the groove 102 and a discharge port 104 for discharging gas at the other end of the groove 102. The supply pipe 103 is bent in the groove 102 to discharge gas in the Y direction. As shown by the arrow in FIG. 3, the foreign matter removing device 100 supplies high-speed gas flowing to narrow the flow path from the supply pipe 103 at one end of the plate 101 to the discharge port 104 at the other end (by the Bernoulli effect ( Bernoulli effect)) to generate attraction to the substrate S, and the back side of the substrate S is cleaned by the flow of the gas. Since the contact position on the back surface of the substrate S is the narrow boundary portion of the groove, the contact area can be reduced as much as possible.

In addition, the part where the substrate is in contact with the part of the border of the groove is transported at a pitch different from the part of the border of the groove, so that the substrate can be washed.

In parallel with the cleaning of the back surface of the substrate S, as shown in FIG. 4, the cleaning nozzle 91 of the foreign matter removing device 9 is used to clean the surface (second surface) of the substrate S in the same manner as in FIG. 1. Here, the foreign matter removing apparatus 100 assumes the task of the adsorption platform AS of FIG. 1.

As shown in FIG. 4, the substrate S is provided with a package area P arranged in a lattice shape on the surface thereof, and the package area P is a region (die installation location) containing bonded die. Here, the packaging areas arranged in a row in the substrate width direction (Y direction) correspond to one substrate washing area. In FIG. 4, the substrate S has eight substrate washing regions, and one substrate washing region includes four packaging regions P. The substrate S is transported in the X direction for each substrate cleaning area.

The length (Lp) of the board 101 in the X direction is shorter than the length (Ls) of the substrate S in the X direction, and in FIG. 4 is the length of the three-row substrate washing area (three-row package area).

The width of the groove 102 (the length (Wt) in the X direction) is constituted by a width (pitch) different from the width (Wp) of the package region P. In Fig. 4, Wt>Wp. Thereby, the part at the boundary of the groove 102 of the substrate S can be cleaned when the substrate S is transported to the next substrate cleaning area. In the case of a plate (rear surface suction cleaning area) longer than the substrate cleaning area (substrate conveying pitch), an ON and OFF function that can supply gas for each groove is provided. Thereby, the supply of gas to the groove where the substrate S is not located on the groove can be stopped.

Next, the cleaning operation on the front and back surfaces of the substrate S will be described using FIG. 5. Fig. 5 is a flowchart illustrating the washing operation of the foreign matter removing apparatus of the first embodiment.

First, the substrate S supported by the conveying guide 52 at both ends is conveyed to the board 101 in the X direction (step S31).

Next, the plate 101 is raised to be in contact with the substrate S, gas is supplied to the groove 102 of the plate 101, and the substrate S is adsorbed while washing the back surface of the substrate S (step S32).

Next, use an area sensor or a non-contact displacement sensor to confirm that the substrate S is adsorbed and the warping disappears (step S33). When the substrate S is not warped, it is the same as the comparative example in FIG. The nozzle 91 descends to a position of 2 mm on the substrate S, operates in a direction (Y direction) perpendicular to the transport direction (X direction) of the substrate S, and cleans the surface of the substrate S (step S34).

Next, it is judged whether the cleaning of the surface of the substrate S is completed (step S35). When the cleaning is completed, the air flow to the groove 102 is stopped, the suction is released, the plate 101 is lowered, the cleaning nozzle 91 is raised, and the substrate S is transferred to the next substrate The area is washed (step S36). Repeat steps S32 to S36 to wash to the last substrate washing area (the eighth substrate washing area in FIG. 4).

When the cleaning of the surface of the substrate S in the last substrate cleaning area is completed, the air flow to the groove 102 is stopped, the suction is released, the plate 101 is lowered, the cleaning nozzle 91 is raised, and the substrate S is transferred to the bonding platform (step S37).

In the first embodiment, the back surface of the substrate can be cleaned by the air flow on the back surface of the substrate while sucking the substrate to correct the curvature of the substrate by flowing a gas on the back surface of the substrate.

<Modifications of the first embodiment> Hereinafter, a few examples will be given for representative modifications of the first embodiment. In the description of the following modification examples, the same reference numerals as those of the first embodiment described above may be used for parts having the same configuration and functions as those described in the first embodiment described above. In addition, the description of such a part is that the description of the above-mentioned first embodiment can be appropriately used within the range of technically not contradictory. In addition, part of the above-mentioned embodiment and all or part of the plural modified examples can be suitably applied in a complex manner within a range that is not technically contradictory.

(First modification) The foreign matter removing device according to the first modified example will be described with reference to FIG. 5. Fig. 6 is a diagram illustrating a foreign matter removing device for the back surface of a substrate of a first modification. Fig. 5(A) is a plan view, Fig. 5(B) is a cross-sectional view taken along the line B1-B2 of Fig. 6(A), and Fig. 6( C) is a cross-sectional view taken along the line C1-C2 of Fig. 6(A).

The foreign matter removing apparatus 100A of the first modification includes a plate 101A that can be in contact with the back surface of the substrate S. The length of the board 101A in the X direction is the same as that of the board 101. The plate 101A is provided with grooves 102A extending in the substrate width direction (Y direction) on the upper surface side. The groove 102A has a structure in which the width gradually expands from one end to the other end, and the groove 102A is arranged alternately on the left and right. The plate 101 is provided with a supply pipe 103A for supplying gas from below at one end of the groove 102A, and a discharge port 104A for discharging gas from below at the other end of the groove 102A. As shown by the arrow in FIG. 5, the groove 102A is supplied with gas from the narrow side to flow to the wide side, so that the attraction force based on Bernoulli's effect is generated, and the substrate S is processed by this air flow. Washing on the back. Although the adsorption force on the back side is unbalanced depending on the width, area, depth, etc. of the place where the gas flows, by alternately arranging the left and right directions from the gas supply side to the exhaust side, the imbalance can be eliminated and the substrate can be maintained The balance of attraction between the left and right.

With the cleaning device of this modification, the front and back surfaces of the substrate S are cleaned in the same manner as in the first embodiment.

(Second Modification) The foreign matter removing device according to the second modified example will be described with reference to FIG. 7. Fig. 7 is a diagram illustrating a foreign matter removing apparatus for the back surface of a substrate of a second modification. Fig. 7(A) is a plan view, Fig. 7(B) is a cross-sectional view taken along the line B1-B2 of Fig. 7(A), and Fig. 7( C) is a cross-sectional view taken along the line C1-C2 of Fig. 7(A).

The foreign matter removing device 100B of the second modification example is provided with a triangular protrusion 105 in plan view near the supply pipe 103A of the groove 102A of the foreign body removing device 100A of the first modification example, and the suction efficiency is improved by the Coandă effect By.

With the foreign matter removing apparatus of this modification, the front and back surfaces of the substrate S are cleaned in the same manner as in the first embodiment.

(Third modification) The foreign matter removing device according to the third modification will be explained with reference to FIG. 8. FIG. 8 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a third modification, FIG. 8(A) is a plan view, FIG. 8(B) is a cross-sectional view taken along the line B1-B2 of FIG. 8(A), and FIG. 8( C) is a cross-sectional view taken along the line C1-C2 of FIG. 8(A).

The foreign matter removing device 100C of the third modification example is provided with a plurality of pins (protrusions) 106 having a height of 0.1 to 0.2 mm on the contact surface side of the board 101A of the foreign matter removing device 100A of the first modification example with the substrate S. The flatness of the substrate can be maintained during the suction of the substrate. In this example, five pins 106 are provided at both ends in the width direction of the substrate, seven are provided at the center, and three are provided between the two ends and the center. In the Bernoulli suction of the embodiment including this modification, even if there is a gap between the substrate and the suction part, the suction force will act. Therefore, it is possible to hold the substrate while holding the substrate by the point contact at the close interval. The flatness of S keeps the contact portion with the back surface of the substrate S to a minimum (reduces the contact area), and minimizes the adhesion of foreign matter from the contact portion (reduces the potential for foreign matter adhesion).

With the foreign matter removing apparatus of this modification, the front and back surfaces of the substrate S are cleaned in the same manner as in the first embodiment.

(Fourth modification) The cleaning of the substrate related to the fourth modification example will be described with reference to FIG. 9. Fig. 9 is a diagram illustrating a foreign matter removing device for the back surface of a substrate of a fourth modification. Fig. 9(A) is a plan view, Fig. 9(B) is a cross-sectional view taken along the line B1-B2 of Fig. 9(A), and Fig. 9( C) is a cross-sectional view taken along the line C1-C2 of FIG. 9(A).

The foreign matter removing apparatus 100D of the fourth modification includes a plate 101D that can be in contact with the back surface of the substrate S. The plate 101D is provided with a groove 102D extending along the substrate width direction (Y direction) on its upper surface side. Here, the lengths of the X direction and the Y direction of the board 101D are the same as the lengths of the X direction and the Y direction of the board 101A. The groove 102D has a constant width (length in the X direction) and a structure in which the depth is gradually increased from one end to the other end. The groove 102D is arranged alternately on the left and right. The plate 101D is provided with a supply pipe 103D for supplying gas from below at one end of the groove 102D, and a discharge port 104D for discharging gas from below at the other end of the groove 102D. As shown by the arrow in FIG. 8, the groove 102D supplies gas from the shallower side and flows toward the deeper side, thereby generating suction and washing the back surface of the substrate S. The groove 102D is arranged alternately on the left and right, so that the balance of the left and right suction forces of the substrate can be maintained.

Thereby, the width of the groove is uniformized, and it is easy to freely set the width of the washing area according to the setting width of the die. In addition, the strength of the suction force can be adjusted by the depth of the groove and the strength of the air flow regardless of the groove width (washing area).

With the foreign matter removing apparatus of this modification, the front and back surfaces of the substrate S are cleaned in the same manner as in the first embodiment.

(Fifth Modification) The cleaning of the substrate related to the fifth modification example will be described with reference to FIG. 10. Fig. 10 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a fifth modification, Fig. 10(A) is a plan view, Fig. 10(B) is a cross-sectional view taken along line B1-B2 of Fig. 10(A), and Fig. 10( C) is a cross-sectional view taken along the line C1-C2 of FIG. 10(A), and FIG. 10(D) is a cross-sectional view of the Bernoulli sucker.

The foreign matter removing apparatus 100E of the fifth modification includes a plate 101E on the back side of the substrate S. Here, the lengths of the board 101E in the X direction and the Y direction are the same as the lengths of the board 101A in the X direction and the Y direction. The board 101E is provided with: Bernoulli suckers 107 staggered arranged on the upper surface side of the circular shape in plan view, and pins arranged staggered between the Bernoulli suckers 107 and 0.1 to 0.2mm higher than the upper surface of the Bernoulli suckers 107 (Protrusion) 106E, and the supply port 103E for supplying gas to the Bernoulli pad 107, and the discharge port 104E for discharging the gas ejected from the Bernoulli pad 107. The height of the pin 106E is set so that the substrate S is in contact with the pin 106E and not in contact with the Bernoulli sucker 107. That is, the substrate S is held by the pins 106E. The Bernoulli chuck 107 ejects gas from below the center, and the suction is generated by the negative pressure of the Bernoulli effect caused by the high-speed airflow flowing in the gap between the upper surface of the Bernoulli chuck 107 and the substrate S. At the same time, the back side of the substrate S is washed. The pin (protrusion) 106E can maintain the flatness of the substrate S when the substrate S is attracted.

Using the foreign matter removing apparatus of this modification example, the front and back surfaces of the substrate S are cleaned in the same manner as in the first embodiment. In this case, washing is performed by the part where the airflow on the outer circumference of the Bernoulli sucker 107 flows, but the first suction is generated near the center of the Bernoulli sucker 107 or the part where the airflow collides between the Bernoulli suckers 107. The weak part (it becomes a localized air flow, a place where the washing efficiency is poor, and the place where the flowing foreign matter is released also becomes disordered), but the substrate S is moved every time the substrate S is adsorbed and washed. The suction cups 107 are randomly arranged, so that parts with weak washing power can be eliminated.

(Sixth Modification) The cleaning of the substrate related to the sixth modification example will be described with reference to FIG. 11. FIG. 11 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a sixth modification. FIG. 11(A) is a plan view, FIG. 11(B) is a cross-sectional view taken along the line B1-B2 of FIG. 11(A), and FIG. 11( C) is a cross-sectional view taken along the line C1-C2 of FIG. 11(A).

The foreign matter removing apparatus 100F of the sixth modification does not use the pins 106E of the foreign matter removing apparatus 100E of the fifth modification. With the Bernoulli sucker 107, the plate 101E and the substrate S are cleaned in a non-contact state. In addition, both ends in the width direction of the substrate S are held by the conveying guide 52.

As shown in FIG. 10(D), the Bernoulli chuck 107 has a nozzle 107a that ejects gas from below the center portion, and has a plurality of recesses 107b around the nozzle 107a. As shown in the references, when the gap between the upper surface (acting surface) 107c of the Bernoulli chuck 107 and the substrate S is large, the gap between the nozzle 107a, the recess 107b, and the working surface 107c and the substrate S is to realize the execution nozzle and the vacuum chamber respectively. Since it functions as a diffuser, a negative pressure is generated in the recess 107b, and the substrate S is sucked. Once the substrate S is sucked and the gap with the operating surface 107c becomes smaller, the recess 107b realizes the function of a pressure chamber type air cushion (air cushion), the pressure of the recess 107b rises sharply, and the substrate S is pulled apart. The distance between the operating surface 107c that maintains the uniform pressure of the recess 107b and the substrate S can be maintained in a non-contact state at a distance that is automatically maintained. [Reference] "Using the "Vertical Gas Jet Method" to reduce the friction loss of the gas flow. "Branuli Sucker" "Floating Suction Cup SA-C (SAN) Type" Theoretical Analysis", URL http://www.solarlab. co.jp/sacr Thereby, the substrate S can be kept in a fixed state, so that the plate 101E with the Bernoulli suction cups 107 alternately arranged can be moved forward and backward (X direction) with a width greater than the pitch of the crystal grains (substrate washing area). Wash evenly in the state. In addition, by rotating the plate with a circular configuration, washing can be performed evenly in a non-contact state.

With the cleaning device of this modification, the front and back surfaces of the substrate S are cleaned in the same manner as in the first embodiment. However, in step S2 or step S3 of the washing operation of the first embodiment, the plate 101E is moved as described above.

(Seventh modification) The cleaning of the substrate related to the seventh modification will be described with reference to FIG. 12. FIG. 12 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a seventh modification. FIG. 12(A) is a plan view, FIG. 12(B) is a cross-sectional view taken along the line B1-B2 of FIG. 12(A), and FIG. 12( C) is a cross-sectional view taken along the line C1-C2 of FIG. 11(A).

The foreign matter removing device 100G of the seventh modification example is provided with: a plate 101G with a suction port 101a provided at places other than the Bernoulli suction cup 107 of the plate 101E of the foreign matter removing device 100F of the sixth modification example, and the side and bottom surfaces of the cover plate 101G The funnel-shaped cover (cover) 108. Here, the lengths of the board 101G in the X direction and the Y direction are the same as the lengths of the board 101E in the X direction and the Y direction. The foreign matter removed by the air flow is sucked from the discharge port of the cover 108.

With the foreign matter removing apparatus of this modification example, the front and back surfaces of the substrate S are cleaned in the same manner as in the first embodiment. However, in step S2 or step S3 of the washing operation of the first embodiment, the suction mechanism sucks foreign objects through the suction port 101a as described above.

It is also possible to provide a mechanism for installing a suction port in a place other than the Bernoulli suction cup 107 of the plate 101E of the foreign matter removing device 100E of the fifth modification to suck the foreign matter removed by the airflow.

According to the first embodiment and its modification, the back surface of the substrate can be cleaned in a state where the curvature of the substrate is corrected. In addition, both the front surface and the back surface of the substrate can be cleaned at the same time. When washing both sides of the substrate, the washing time can be shortened. Moreover, no new mechanism is required for the correction of the curvature of the substrate, and the cost can be reduced. In addition, since the vacuum suction stage is not used when cleaning the surface of the substrate, it is possible to reduce the adhesion of foreign matter to the back surface of the substrate. Furthermore, it is possible to clean the back surface of the substrate, and it is possible to reduce the occurrence of voids during bonding caused by foreign matter on the back surface of the substrate. And, the processing capacity can be expected to increase.

<The second embodiment> In the first embodiment, washing is performed while adsorbing the substrate by the Bernoulli effect, but the second embodiment is not by adsorbing the substrate by the Bernoulli effect, but by air blow.

The cleaning of the substrate according to the second embodiment will be described with reference to FIGS. 13 to 15. 13 is a diagram illustrating the surface side of the substrate of the foreign matter removing apparatus of the second embodiment, FIG. 13(A) is a plan view, FIG. 13(B) is a cross-sectional view taken along the line B1-B2 of FIG. 13(A), and FIG. 13 (C) is a cross-sectional view taken along the line C1-C2 of FIG. 13(A). 14 is a diagram illustrating the back side of the substrate of the foreign matter removing device of the second embodiment, FIG. 14(A) is a plan view, FIG. 14(B) is a cross-sectional view taken along the line B1-B2 of FIG. 14(A), and FIG. 14 (C) is a cross-sectional view taken along the line C1-C2 of Fig. 14(A). 15 is a diagram illustrating the front side and back side of the substrate of the foreign matter removing apparatus of the second embodiment, FIG. 15(A) is a plan view, and FIG. 15(B) is a cross-sectional view taken along the line B1-B2 of FIG. 15(A) , Fig. 15(C) is a cross-sectional view taken along the line C1-C2 of Fig. 15(A).

As shown in FIG. 13, the foreign matter removing apparatus 200 of the second embodiment is provided with: an upper cover (plate) 201U covering the upper surface of the substrate S conveyed on the conveying guide device 52, and the upper cover 201U and the substrate S The nozzle 203U in which gas flows in the Y direction from the vicinity of the conveyance guide 52 therebetween. The nozzle 203U extends from the upper side of the upper cover 201U to the side of the substrate S, and is curved to blow the gas in parallel with the substrate S. The distance between the substrate conveying position (height) and the upper cover 201U is set to be about 2 to 5 mm, and the length of the upper cover in the X direction, that is, the length (Lc) of the passage portion of the substrate S is longer than the substrate length (Ls), the most It is the same width as the maximum width of the substrate used.

As shown in FIG. 14, the foreign matter removing apparatus 200 of the second embodiment includes: a lower cover (plate) 201L that covers the lower surface of the substrate S conveyed on the conveying guide 52, and a lower cover (plate) 201L for connecting the lower cover 201L and the substrate S The gas flows from the vicinity of the conveyance guide 52 to the nozzle 203L in the Y direction. The nozzle 203L extends from below the lower cover 201L to the side of the substrate S, and is curved to blow the gas in parallel with the substrate S. The distance between the substrate conveying position (height) and the lower cover 201L is set to about 2 to 5 mm. The length of the lower cover in the X direction, that is, the length (Lc) of the passage portion of the substrate S is longer than the substrate length (Ls). It is the same width as the maximum width of the substrate used.

As shown in FIG. 15, between the upper cover 201U and the lower cover 201L of the foreign matter removal device 200, while the substrate S is being conveyed in the X direction, gas is blown from the nozzle 203U and the nozzle 203L in the vicinity of the conveying guide 52. , The gas flows in the Y direction, and the front and back surfaces of the substrate S are cleaned by blowing air sucked from the vicinity of the conveying guide 52 on the opposite side.

<Modifications of the second embodiment> Hereinafter, a few examples will be given for representative modifications of the second embodiment. In the description of the following modification examples, the same reference numerals as those of the second embodiment described above can be used for parts having the same configuration and functions as those described in the second embodiment described above. In addition, the description of such a part is that the description of the above-mentioned second embodiment can be appropriately used within a range that is not technically contradictory. In addition, part of the first embodiment or the second embodiment described above, and all or part of the plural modification examples of the first embodiment or the second embodiment can be appropriately combined and applied within a range that is not technically contradictory. .

(Eighth Modification) 16 is a cross-sectional view illustrating the front side and the back side of the substrate of the foreign matter removing apparatus of the eighth modification.

In the second embodiment, the curved nozzles 203U, 203L are used to introduce gas from above or below, and the gas is blown out parallel to the substrate. However, the foreign matter removing apparatus 200A of the eighth modification replaces the nozzles 203U, 203L. The gas is blown out with the following configuration.

In the foreign matter removing device 200A, the gas is blown out from the gas blowing port 203a of the gas supply unit 203UA provided above the one of the conveying guides 52 to between the upper cover 201U and the substrate S, from the conveying guides 52 provided The gas blowing port 203b of the lower gas supply part 203LA blows gas between the lower cover 201L and the substrate S. The foreign matter removed from both surfaces of the substrate S by blowing air is discharged from the exhaust part 204 provided with the suction port 204a provided above the other conveying guide 52 and the suction port 204b provided below. The port 204c exhausts air.

(Ninth modification) FIG. 17 is a cross-sectional view illustrating the front side and the back side of the substrate of the foreign matter removing device of the ninth modification.

The foreign matter removing device 200B of the ninth modification example is provided on the surface of the upper cover 201U and the lower cover 201L on the substrate S side of the foreign body removing device 200A of the eighth modification example. power enhanced. It may be a groove instead of the protrusion 205.

(Tenth Modification) 18 is a diagram illustrating the front side and the back side of the substrate of the foreign material removal device of the tenth modification. FIG. 18(A) is a cross-sectional view when the substrate is curved upward, and FIG. 18(B) is the substrate curved downward Fig. 18(C) is a cross-sectional view of the case where the substrate is not bent.

In the second embodiment, gas is blown from the vicinity of the conveyance guide 52 on one side, and the gas flows in the Y direction, and the surface and back of the substrate S are cleaned by blowing air sucked from the vicinity of the conveyance guide 52 on the opposite side. However, the foreign matter removing device 200C of the tenth modification is configured to blow air from the blower outlet 201a at the center of the upper cover 201U and the blower outlet 201b at the center of the lower cover 201L, and the air is blown from the position of the conveying guide 52 Exhaust at both ends of the side. By blowing air from both surfaces of the central portion of the substrate, while adjusting (correcting) the curvature of the substrate S and conveying it in a flat state, both surfaces of the substrate S are washed simultaneously.

As shown in FIG. 18(A), when the substrate S is bent upward, the amount of air blowing on the side of the upper cover 201U is increased, and the amount of air blowing on the side of the lower cover 201L is reduced. As shown in FIG. 18(B), when the substrate S is bent downward, the amount of air blowing on the side of the upper cover 201U is reduced, and the amount of air blowing on the side of the lower cover 201L is increased. As shown in FIG. 18(C), when the substrate S is not bent, the air blowing volume on the upper cover 201U side and the air blowing volume on the lower cover 201L side are made the same.

(Eleventh Modification) 19 is a cross-sectional view illustrating the front side and the back side of the substrate of the foreign matter removing device of the eleventh modification.

The foreign matter removing device 200D of the eleventh modification is provided with a non-contact displacement sensor 206 at the blowing outlets 201a and 201b of the foreign matter removing device 200C of the tenth modification, and the distance to the substrate S is measured to determine whether the upper cover is bent. 201U and the lower cover 201L and the substrate S are maintained at a predetermined distance by adjusting the air volume for control. In addition, the height (position) of the upper cover 201U and the lower cover 201L can also be set to be automatically adjusted, and the upper cover 201U and the lower cover 201L can be reduced while checking the distance from the substrate S with the non-contact displacement sensor 206 The location improves the washing efficiency.

In the second embodiment and its modification, a cover (cover) is provided on the upper and lower sides of the substrate conveying path, gas flows between the substrate and the substrate is sucked from the end side of the substrate, and the substrate being conveyed is cleaned. Thereby, a quiet area can be provided in the space of the transfer area, and the back side and the front side of the substrate can be separated by the substrate itself. In addition, the entire substrate can be washed at one time, the washing time per area can be lengthened, and the foreign matter removal rate can be improved. In addition, both the front surface and the back surface of the substrate can be cleaned simultaneously during transportation. The washing can be carried out during conveyance, and the time for the washing nozzle to move can be reduced, so the washing time can be shortened. In addition, the diffusion of the removed foreign matter during washing is prevented, and the foreign matter can be prevented from reattaching to the substrate being transported after washing. In addition, since the back surface of the substrate is washed, it is possible to reduce the occurrence of voids during bonding caused by foreign matter on the back surface of the substrate. In addition, the space where the quiet air flows can be maintained in an appropriate positional relationship, and the optimum foreign matter removal state can be stably maintained. In addition, bending of the substrate during transportation is also prevented, and the distance between the upper cover and the lower cover and the substrate can be appropriately maintained, and contact, etc., can be prevented, so that transportation failures can be reduced. [Example]

Fig. 20 is a schematic plan view showing the die bonder of the embodiment. Fig. 21 is a diagram illustrating the actions of the pickup head and the bonding head when viewed from the direction of arrow A in Fig. 20.

The die bonder 10 roughly has: a die supply part 1, a pickup part 2, an intermediate stage part 3, a bonding part 4, a conveying part 5, a substrate supply part 6, and a substrate unloading part for supplying the die D mounted on the substrate S 7 and a control unit 8 that monitors and controls the operation of each unit. The substrate S is a product area (hereinafter referred to as a package area P) printed with one or a plurality of products that eventually become one package. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply part 1 will be arranged on the front side of the die bonder 10, and the bonding part 4 will be arranged on the rear side.

First, the die supply unit 1 supplies the die D mounted on the package area P of the substrate S. The die supply unit 1 has a wafer holding table 12 that holds a wafer 11, and an ejection unit 13 shown by dotted lines that ejects the die D from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving means not shown, and the picked-up die D is moved to the position of the lifting unit 13.

The pick-up unit 2 has: a pick-up head 21 for picking up the die D, a Y-drive unit 23 for the pick-up head that moves the pick-up head 21 in the Y direction, and a not-shown that moves the chuck 22 up, down, rotation, and X direction Each drive unit. The pick-up head 21 has a chuck 22 (also refer to FIG. 21) for sucking and holding the raised die D at the front end, and picks up the die D from the die supply unit 1 and places it on the intermediate platform 31. The pick-up head 21 has each drive part which is not shown in figure which raises and lowers, rotates, and moves the chuck 22 in the X direction.

The intermediate platform portion 3 has an intermediate platform 31 on which the die D is temporarily placed, and a platform recognition camera 32 for recognizing the die D on the intermediate platform 31.

The bonding part 4 picks up the die D from the intermediate platform 31 and bonds it to the package area P of the substrate S that is transported to the bonding platform BS, or is laminated on the die that has been bonded to the package area P of the substrate S Form engagement. The bonding part 4 is a bonding head 41 having a chuck 42 (also referred to in FIG. 21) for sucking and holding the die D at the tip similar to the pickup head 21, and a Y driving part 43 that moves the bonding head 41 in the Y direction , And a substrate recognition camera 44 that picks up the position recognition mark (not shown) of the package area P of the substrate S and recognizes the bonding position. With such a configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the platform recognition camera 32, picks up the die D from the intermediate platform 31, and bonds the die D to the substrate based on the imaging data of the substrate recognition camera 44 S.

The conveying unit 5 has a substrate conveying claw 51 that grips and conveys the substrate S, and a conveying guide device 52 that the substrate S is moved. The substrate S is a ball screw (not shown) provided along the transport guide device 52 to drive a nut (not shown) provided on the substrate transport claw 51 of the transport guide device 52 to move in the X direction. With such a configuration, the substrate S is moved from the substrate supply unit 6 to the bonding position along the conveyance guide 52, and after bonding, it moves to the substrate unloading section 7 and delivers the substrate S to the substrate unloading section 7.

The control unit 8 is a memory that stores a program (software) that monitors and controls the operation of each part of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory.

The foreign matter removing device 9 has a washing nozzle 91 that performs air blowing and air suction, and a driving unit 93 that drives the washing nozzle 91 in the Y direction and the Z direction.

Next, the structure of the crystal grain supply unit 1 will be described using FIGS. 22 and 23. Fig. 22 is a diagram showing an external perspective view of a crystal grain supply part. FIG. 23 is a schematic cross-sectional view showing the main part of the crystal grain supply part.

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction), and a lift unit 13 that moves in the vertical direction. The wafer holding table 12 has: The expansion ring 15 holding the wafer ring 14; and The dicing tape 16 holding the wafer ring 14 with the plural die D adhered thereto is positioned on the horizontal support ring 17. The jacking unit 13 is arranged inside the support ring 17.

The die supply unit 1 lowers the expansion ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is stretched, and the gap between the die D is enlarged. The lifting unit 13 lifts the die D from below the die D, so that the die D is picked up. Sexual improvement. In addition, with the thinning, the adhesive that adheres the die to the substrate has changed from a liquid state to a film state, and a so-called die attach film (DAF; Die Attach Film) 18 is attached between the wafer 11 and the dicing tape 16 The film-like adhesive material. In the wafer 11 with the die bonding film 18, dicing is performed on the wafer 11 and the die bonding film 18. Therefore, in the peeling process, the wafer 11 and the die bonding film 18 are peeled from the dicing tape 16. The die bonding film 18 is hardened by heating.

The die bonder 10 has: a wafer recognition camera 24 that recognizes the posture of the die D on the wafer 11, a platform recognition camera 32 that recognizes the posture of the die D placed on the intermediate platform 31, and a recognition bonding platform The board recognition camera 44 of the mounting position on the BS. It is necessary to correct the posture deviation between the recognition cameras is the platform recognition camera 32 that participates in the pickup of the bonding head 41 and the substrate recognition camera 44 that participates in the bonding of the bonding head 41 to the mounting position.

FIG. 24 is a flowchart illustrating the die bonding process of the die bonding machine of FIG. 20. In the die bonding process of the embodiment, first, the control unit 8 takes out the wafer ring 14 holding the wafer 11 from the wafer cassette and places it on the wafer holding table 12, and transfers the wafer holding table 12 to the die. D's picking reference position (wafer loading). Next, the control unit 8 performs fine adjustments from the image obtained by the wafer recognition camera 24 so that the arrangement position of the wafer 11 will exactly match the reference position.

Next, the control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed at a predetermined pitch and holds it horizontally, thereby arranging the die D picked up at the pickup position (die transfer). The wafer 11 is inspected for each die by an inspection device such as a probe in advance, and map data showing good and bad for each die is generated and stored in the memory device of the control unit 8. The determination of whether the die D to be picked up is a good product or a defective product is based on map data. The control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed at a predetermined pitch when the die D is defective, and then arranges the picked die D at the pickup position, skipping the defective die.粒 D.

The control unit 8 captures the main surface (upper surface) of the die D to be picked up by the wafer recognition camera 24, and calculates the displacement amount of the die D to be picked up from the pickup position from the obtained image. The control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed based on this displacement, and accurately arranges the pick-up target die D at the pick-up position (die check (step S1)).

The control unit 8 is the substrate supply unit 6 to place the substrate S on the transport guide 52 (substrate loading). The control unit 8 moves the substrate S to the bonding position (substrate transport).

The control unit 8 cleans the substrate S in order to remove foreign substances on the substrate (substrate washing (step S3)). The substrate cleaning is performed using the foreign material removing device 9 on the front surface and the foreign material removing device of any one of the first embodiment and the first modification to the seventh modification on the back surface, and is performed as described above in the embodiment.

The control unit 8 picks up the board with the board recognition camera 44 before bonding for bonding, recognizes the position of the package area P of the board S, and performs positioning (substrate recognition (step S4)).

After the control unit 8 correctly arranges the die D to be picked up at the pickup position, the die D is picked up from the dicing tape 16 by the bonding head 41 including the chuck 42 (step S2), and according to the substrate recognition result of step S4 To bond the die to the package area P or the die that has been bonded to the package area P (step S5).

After the control unit 8 bonds the die D, it checks whether the bonding position is correct. In order to check the bonding and mounting result, the control unit 8 captures the package area P of the substrate S with the substrate recognition camera 44 again to recognize the position of the package area P of the substrate S (step S6). The control unit 8 picks up the die D by the substrate recognition camera 44 to perform position recognition of the die D (step S7), and checks the position of the die D after bonding based on the results of the substrate recognition and die recognition. The control unit 8 compares with the previously registered joining position, and performs numerical output and inspection/judgment.

From now on, the die D will be bonded to the package area P of the substrate S one by one according to the same procedure. Once the bonding of one substrate is completed, the substrate S is moved to the substrate unloading section 7 (substrate transfer), and the substrate S is delivered to the substrate unloading section 7 (substrate unloading).

In addition, according to the same procedure, the die D1 is peeled from the dicing tape 16 one by one. If the defective product is removed and all the dies D are picked up, the dicing tape 16 and the wafer ring 14 that hold the dies D in the shape of the wafer 11 are unloaded to the wafer cassette.

In the foregoing, the invention developed by the inventors has been specifically explained based on the embodiment, modification, and embodiment. However, the present invention is not limited to the above embodiment, modification, and embodiment. Of course, various modifications can be implemented.

For example, in the first embodiment and its modified examples, it is also possible to provide protrusions such as turbulent flow formed by the air flow in the area where the air flow of the plate flows, thereby improving the washing efficiency.

In the first embodiment and its modified examples, an example in which the foreign matter removal device 9 is used for the cleaning of the surface of the substrate is described, but the cleaning of the surface of the substrate can also use the first embodiment and its A foreign matter removal device of a modified example. In this case, the suction force of the plate of the foreign matter removing device on the front side of the substrate is set to be weaker than the plate of the foreign matter removing device on the back side of the substrate. For example, the air flow to the plate of the foreign material removal device on the surface side of the substrate is reduced, the expansion of the groove is slowed, or the change in the depth of the groove is slowed.

In the second embodiment, an example was described in which the foreign matter removing device cleans both the front and back surfaces of the substrate, but it is also possible to clean only either the front surface or the back surface of the substrate.

In addition, in the embodiment, the foreign matter removing device 9 is used on the surface of the substrate, and the foreign matter removing device of any one of the first embodiment and its modification is used on the back surface. However, the surface may also use the first embodiment and A foreign matter removing device of any one of its modifications. In addition, the front surface and the back surface are foreign matter removing devices of the second embodiment and its modification examples. In addition, the foreign matter removing device of any one of the second embodiment and its modification may be used on the surface, and the foreign matter removing device of any of the first embodiment and its modification may be used on the back.

Furthermore, in the second embodiment, the upper cover and the lower cover may be provided with air blowing ports and suction ports, and washing may be performed for each crystal grain installation area.

In addition, in the embodiment, in order to shorten the moving distance of the bonding head 41 and shorten the processing time, an intermediate stage 31 is provided. However, the intermediate stage 31 may not be provided, and the bonding head 41 is directly used to pick up the die D from the wafer.

In addition, a driving part of the rotating chuck may be provided as a reversing head capable of reversing the up and down of the picked-up die.

In addition, it may also be a die bonder equipped with a plurality of mounting parts including a picking part, an alignment part, and a joining part, and a conveying guide device, or it may be equipped with a multiple mounting part including a picking part, an aligning part, and a joining part , Equipped with a conveying guide device.

In addition, in the second embodiment, the cleaning is performed during substrate transport, but it is not limited to this. For example, the cleaning may be performed while the standby position in the die bonding to the preceding substrate is stopped.

5‧‧‧Transportation Department 52‧‧‧Transport guide device 9‧‧‧Foreign body removal device 91‧‧‧Washing nozzle 100‧‧‧Foreign body removal device 101‧‧‧Board 102‧‧‧ditch 103‧‧‧Supply pipe 104‧‧‧Exhaust outlet S‧‧‧Substrate P‧‧‧Package area

Fig. 1 is a diagram illustrating a method of cleaning the surface of a substrate of a comparative example. Fig. 2 is a diagram illustrating the bending of the substrate. Fig. 3 is a diagram illustrating the foreign matter removing device for the back surface of the substrate according to the first embodiment. 4 is a diagram illustrating the foreign matter removing device for the front surface of the substrate and the foreign matter removing device for the back surface of the substrate according to the first embodiment. Fig. 5 is a flowchart illustrating the washing operation of the foreign matter removing apparatus of the first embodiment. Fig. 6 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a first modification. Fig. 7 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a second modification. Fig. 8 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a third modification. Fig. 9 is a diagram illustrating a foreign matter removing device for a substrate back surface of a fourth modification. Fig. 10 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a fifth modification. FIG. 11 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a sixth modification. FIG. 12 is a diagram illustrating a foreign matter removing device for the back surface of a substrate according to a seventh modification. Fig. 13 is a diagram illustrating the surface side of the substrate of the foreign matter removing apparatus of the second embodiment. Fig. 14 is a view explaining the back surface side of the substrate of the foreign matter removing apparatus of the second embodiment. Fig. 15 is a view for explaining the front side and the back side of the substrate of the foreign matter removing device of the second embodiment. 16 is a cross-sectional view illustrating the front surface side and the back surface side of the substrate of the foreign matter removing device of the eighth modification. FIG. 17 is a cross-sectional view illustrating the front side and the back side of the substrate of the foreign matter removing device of the ninth modification. 18 is a cross-sectional view illustrating the front surface side and the back surface side of the substrate of the foreign matter removing apparatus of the tenth modification. 19 is a cross-sectional view illustrating the front side and the back side of the substrate of a foreign matter removing apparatus according to an eleventh modification. Fig. 20 is a schematic plan view showing the die bonder of the embodiment. Fig. 21 is a schematic side view seen from arrow A in Fig. 20. Fig. 22 is a diagram showing an external perspective view of the crystal grain supply part of Fig. 20. Fig. 23 is a schematic cross-sectional view showing the main part of the crystal grain supply part of Fig. 20. FIG. 24 is a flowchart illustrating the die bonding process of the die bonding machine of FIG. 20.

9‧‧‧Foreign body removal device

52‧‧‧Transport guide device

91‧‧‧Washing nozzle

100‧‧‧Foreign body removal device

101‧‧‧Board

103‧‧‧Supply pipe

104‧‧‧Exhaust outlet

S‧‧‧Substrate

P‧‧‧Package area

Claims (23)

A die-bonding device, characterized by comprising: a conveying part that conveys a substrate having a plurality of rows of regions where crystal grains are placed in a first direction; and a first foreign matter removing device that removes foreign matter on the first surface of the substrate A second foreign matter removing device, which removes foreign matter on a second surface opposite to the first surface of the substrate; and a bonding head, which bonds the picked up die to the substrate, the first foreign matter removing device A plate is provided at a position away from the substrate, and gas flows in a second direction different from the first direction between the substrate and the plate from one end to the other end of the substrate to remove the first Foreign matter on the surface. For example, the chip bonding device of the first item of the patent application, wherein the first foreign matter removing device is configured to flow the gas between the substrate and the plate to adsorb the substrate. For example, the wafer bonding device of the second item of the patent application, wherein the plate has a first groove and a second groove adjacent to the first groove, and the first foreign matter removing device is connected to the first groove and the second groove. In the groove, the gas flows in a second direction different from the first direction. For example, in the die bonding device of claim 3, in the first groove and the second groove, the gas flows in the second direction from one end side to the other end side of the substrate. A die-bonding device, characterized by comprising: a conveying part that conveys a substrate having a plurality of rows of regions where crystal grains are placed in a first direction; and a first foreign matter removing device that removes foreign matter on the first surface of the substrate A second foreign matter removing device, which removes foreign matter on a second surface opposite to the first surface of the substrate; and a bonding head, which bonds the picked up die to the substrate, the first foreign matter removing device A plate having a first groove and a second groove adjacent to the first groove is provided at a position away from the substrate, and the width of the first groove changes from one end of the substrate to the other end of the substrate The width of the second groove system increases from the other end side to the one end side, and the first foreign matter removing device is configured to adsorb the gas by flowing gas between the substrate and the plate Substrate, and in the first groove and the second groove, the gas flows from the narrow side of the groove to the wider side along a second direction different from the first direction, and the first groove of the substrate is removed Foreign body on one side. For example, the die bonding device of the 5th patent application, wherein each of the first groove and the second groove has a triangular protrusion on the narrow side of the groove. For example, the die bonding device of item 5 of the patent application, wherein the first foreign matter removing device is located on the periphery of the plate and between the first groove and the second groove and the surface opposite to the substrate has The first surface abuts the protrusion. A die-bonding device, characterized by comprising: a conveying section that conveys a substrate having a plurality of rows of regions where crystal grains are placed in a first direction; and a first foreign matter removing device that removes foreign matter on the first surface of the substrate A second foreign matter removing device, which removes foreign matter on a second surface opposite to the first surface of the substrate; and a bonding head, which bonds the picked up die to the substrate, the first foreign matter removing device A plate having a first groove and a second groove adjacent to the first groove is provided at a position away from the substrate, and the depth of the first groove changes from one end of the substrate to the other end of the substrate Deep, the depth of the second groove system increases from the other end side to the one end side, The first foreign matter removing device is configured to adsorb the substrate by flowing gas between the substrate and the plate, and in the first groove and the second groove along a direction different from the first direction In the second direction, the gas flows from the shallow side of the groove to the deep side to remove foreign matter on the first surface of the substrate. A die-bonding device, characterized by comprising: a conveying part that conveys a substrate having a plurality of rows of regions where crystal grains are placed in a first direction; and a first foreign matter removing device that removes foreign matter on the first surface of the substrate A second foreign matter removing device, which removes foreign matter on a second surface opposite to the first surface of the substrate; and a bonding head, which bonds the picked up die to the substrate, the first foreign matter removing device , Is provided with a plate having a plurality of Bernoulli suction cups staggeredly arranged on the side facing the substrate at a position away from the substrate, and the first foreign matter removing device is configured to connect the substrate and The gas flows between the plates to adsorb the substrate and remove foreign matter on the first surface of the substrate. For example, the die bonding device of claim 9, wherein the first foreign matter removing device has protrusions arranged between the plurality of Bernoulli chucks on the side of the board facing the substrate . For example, the die bonding device of the ninth patent application, wherein the first foreign matter removing device has a suction port arranged between the plurality of Bernoulli suckers on the side of the board opposite to the substrate . The die bonding device described in any one of items 1 to 11 in the scope of the patent application, wherein the second foreign matter removing device is provided with a washing nozzle formed with a blowing hole and surrounding the blowing hole In this way, a suction hole is formed to move the washing nozzle in a third direction different from the first direction. For example, in the chip bonding device of item 12 of the scope of patent application, the length of the first direction of the plate is shorter than the length of the substrate in the first direction. For example, the die bonding device of the first patent application, wherein the second foreign matter removing device is provided with a second plate at a position away from the substrate, and gas flows between the substrate and the second plate to remove the substrate Foreign matter on the second side. For example, the chip bonding device of the 14th patent application, wherein the second foreign matter removing device is configured to flow the gas in the second direction from one end side to the other end side of the substrate. A die-bonding device, characterized by comprising: a conveying part that conveys a substrate having a plurality of rows of regions where crystal grains are placed in a first direction; and a first foreign matter removing device that removes foreign matter on the first surface of the substrate A second foreign matter removing device, which removes foreign matter on a second surface opposite to the first surface of the substrate; and a bonding head, which bonds the picked up die to the substrate, the first foreign matter removing device It is provided with: a plate arranged at a position away from the substrate, and a non-contact displacement sensor for confirming the distance between the plate and the substrate at the center of the plate, and the first foreign matter removing device is configured to Gas flows between the substrate and the plate from the center side to the end side of the substrate to remove foreign matter on the first surface of the substrate. For example, the chip bonding device of the 16th patent application, wherein the second foreign matter removing device is provided with a second plate at a position away from the substrate, and gas flows between the substrate and the second plate to remove the substrate Foreign matter on the second side. For example, the die bonding device in the scope of the patent application, wherein the second foreign matter removing device is provided with a non-contact displacement sensor that confirms the distance between the substrate and the substrate in the center of the substrate, from the center of the substrate to Ends On the other hand, the gas flows in a second direction different from the first direction. The die bonding device described in any one of the 14th to 18th patent applications, wherein the second foreign matter removing device is in the standby position during the transfer of the substrate or the die bonding to the preceding substrate Washing while stopping. A method of manufacturing a semiconductor device, which is characterized by: (a) loading a wafer ring jig holding a dicing tape with die attached; (b) loading a substrate; (c) transferring the aforementioned substrate The process in the first direction; (d) the process of washing the aforementioned substrate; (e) the process of picking up the aforementioned die; and (f) the process of bonding the picked-up die to the aforementioned substrate or the bonded die Process, the aforementioned (d) process includes: (d1) the process of flowing gas between the aforementioned substrate and the plate, adsorbing the back surface of the aforementioned substrate with the aforementioned plate, and cleaning the back surface of the aforementioned substrate; (d2) for the surface of the aforementioned substrate , The process of moving the cleaning nozzle formed with the blowing hole and the suction hole formed so as to surround the blowing hole in a second direction different from the first direction to wash the cleaning area on the surface of the substrate; and (d3) The process of transporting the aforementioned substrates. For example, the method for manufacturing a semiconductor device according to claim 20, wherein the step (d3) is to transport the substrate to the washing area next to the washing area, and perform the step (d1) and the step (d2). A method of manufacturing a semiconductor device, which is characterized by: (a) loading a wafer ring jig holding a dicing tape with die attached; (b) loading a substrate; (c) transferring the aforementioned substrate The process in the first direction; (d) the process of washing the aforementioned substrate; (e) the process of picking up the aforementioned die; and (f) the process of bonding the picked-up die to the aforementioned substrate or the bonded die Process, the aforementioned (d) process system includes: (d1) while conveying the aforementioned substrate, between the aforementioned substrate and the first plate from one end of the aforementioned substrate to the other end, in a second direction different from the aforementioned first direction The process of cleaning the back surface of the substrate by flowing gas. (d2) While conveying the substrate, between the substrate and the second plate from one end side to the other end side of the substrate in the first direction different from the first direction. The process of flowing gas in two directions to clean the surface of the aforementioned substrate. A method of manufacturing a semiconductor device is characterized by: (a) loading a wafer ring jig holding a dicing tape with die attached into it Process; (b) Process of loading the substrate; (c) Process of transporting the aforementioned substrate in the first direction; (d) Process of washing the aforementioned substrate; (e) Process of picking up the aforementioned die; and (f) Picking up The subsequent process of bonding the aforementioned die to the aforementioned substrate or the bonded die, the aforementioned (d) process system includes: (d1) while transporting the aforementioned substrate, while transferring the aforementioned substrate between the aforementioned substrate and the first plate The process of cleaning the back of the substrate by flowing gas from the center side to the end side. (d2) While transporting the substrate, the gas flows between the substrate and the second plate from the center side to the end side of the substrate, and The process of cleaning the surface of the aforementioned substrate.

Images