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TWI710420B - Laser processing device - Google Patents

Laser processing device Download PDF

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Publication number
TWI710420B
TWI710420B TW106118733A TW106118733A TWI710420B TW I710420 B TWI710420 B TW I710420B TW 106118733 A TW106118733 A TW 106118733A TW 106118733 A TW106118733 A TW 106118733A TW I710420 B TWI710420 B TW I710420B
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Taiwan
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frame
workpiece
interval
fixing
clamping
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TW106118733A
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Chinese (zh)
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TW201800169A (en
Inventor
時田大作
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日商維亞機械股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0426Fixtures for other work
    • B23K37/0435Clamps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

本發明提供一種雷射加工裝置,即使在工件的尺寸不同的情況下,工件也不會浮起而可以確實地將工件固定於工作台。雷射加工裝置包括:矩形的工件夾持部,由第一至第四框架所組成,設置在工作台上,用於將工件固定在工作台上;夾持驅動部,用以改變矩形的開口範圍以及工件夾持部與工作台之間的間隔;以及控制部,用於控制夾持驅動部,以在加大開口範圍時加大間隔,並且在縮小開口範圍時縮小間隔。The present invention provides a laser processing device, even when the size of the workpiece is different, the workpiece does not float, and the workpiece can be reliably fixed to the worktable. The laser processing device includes: a rectangular workpiece clamping part, composed of first to fourth frames, and arranged on the worktable for fixing the work on the worktable; a clamping drive part for changing the rectangular opening The range and the interval between the workpiece clamping part and the worktable; and the control part for controlling the clamping driving part to increase the interval when the opening range is enlarged, and to reduce the interval when the opening range is reduced.

Description

雷射加工裝置Laser processing device

本發明涉及對固定於工作台的印刷基板等的工件進行鑽孔加工的雷射加工裝置,以及有關於用於固定工件的技術。The present invention relates to a laser processing device for drilling a workpiece such as a printed circuit board fixed on a workbench, and a technique for fixing the workpiece.

以往,在利用雷射加工裝置的加工處理中,將作為工件的印刷基板吸附固定在工作台上是已知的。然而,由於僅僅吸附並不足夠,還進一步利用夾持裝置固定印刷基板的端部後進行鑽孔加工。(專利文獻1)。 [現有技術文獻]Conventionally, in the processing using a laser processing device, it has been known to suck and fix a printed circuit board as a work on a table. However, since only suction is not enough, the end of the printed circuit board is further fixed with a clamping device and then drilled. (Patent Document 1). [Prior Art Literature]

[專利文獻1]日本專利申請公開 平成10-328863號[Patent Document 1] Japanese Patent Application Publication Heisei 10-328863

在上述的現有技術中,夾持裝置的印刷基板加壓部件的長度是固定的,不能對應印刷基板的尺寸變化作出應對,有無法加壓印刷基板的端部的四個邊的情況。因此,有印刷基板從工作台浮起的部分發生、讀取附著在印刷基板端部附近的對準標記時發生誤差等,有加工精度低的缺點。In the above-mentioned prior art, the length of the printed circuit board pressing member of the clamping device is fixed, and it cannot respond to changes in the size of the printed circuit board, and it may not be possible to press the four sides of the end of the printed circuit board. Therefore, there are disadvantages such as occurrence of a portion where the printed circuit board floats from the table, an error in reading the alignment mark attached to the vicinity of the end of the printed circuit board, and the like, and the processing accuracy is low.

本發明的目的在於,提供一種雷射加工裝置,即使在工件的尺寸不同的情況下,工件也不會浮起而可以確實將工件固定於工作台。 [解決問題的手段]The object of the present invention is to provide a laser processing device which can reliably fix the workpiece to a table without floating even when the size of the workpiece is different. [Means to solve the problem]

為了解決上述問題,在本發明的雷射加工裝置包括:工件夾持部,具備:第一框架,設置於工作台上用於將工件固定在該工作台上,並且安裝有用於固定在該工件的端部側的第一邊的第一夾持器;第二框架,安裝有用於固定與在該工件的端部側的該第一邊形成垂直方向的第二邊的第二夾持器;第三框架,平行於該第一框架;第四框架,平行於該第二框架;第一構件,平行於該第一框架並且可在垂直於該第一框架的方向上移動,安裝有用於固定平行於在該工件的端部側的該第一邊的第三邊的第三夾持器;第二構件,平行於該第二框架並且可在垂直於該第二框架的方向上移動,安裝有用於固定平行於在該工件的端部側的該第二邊的第四邊的第四夾持器;第一固定部,將該第一框架的端部以及該第四框架的端部彼此固定;以及第二固定部,將該第二框架的端部以及該第三框架的端部彼此固定;夾持驅動部,用於改變該第一固定部與該第二固定部之間的第一間隔以及該工件夾持部與該工作台之間的第二間隔;以及控制部,控制該夾持驅動部,以在加大該第一間隔時加大該第二間隔,在縮小該第一間隔時縮小該第二間隔。 [發明的效果]In order to solve the above-mentioned problems, the laser processing device of the present invention includes: a workpiece holding part, including: a first frame provided on a worktable for fixing the work on the worktable, and installed for fixing the work on the worktable A first clamper on the first side of the end side; a second frame installed with a second clamper for fixing a second side perpendicular to the first side on the end side of the workpiece; The third frame, parallel to the first frame; the fourth frame, parallel to the second frame; the first member, parallel to the first frame and movable in the direction perpendicular to the first frame, is installed for fixing A third holder parallel to the third side of the first side on the end side of the workpiece; a second member, parallel to the second frame and movable in a direction perpendicular to the second frame, installed There is a fourth holder for fixing the fourth side parallel to the second side on the end side of the workpiece; the first fixing part, the end of the first frame and the end of the fourth frame are mutually Fixed; and a second fixing part for fixing the end of the second frame and the end of the third frame to each other; a clamping driving part for changing the first fixing part and the second fixing part An interval and a second interval between the workpiece clamping portion and the worktable; and a control portion, which controls the clamping driving portion to increase the second interval when the first interval is increased, and to reduce the first interval At one interval, the second interval is reduced. [Effects of the invention]

根據本發明,即使在工件的尺寸不同的情況下,可以使工件不浮起而確實地將工件固定於工作台。According to the present invention, even when the size of the workpiece is different, the workpiece can be reliably fixed to the table without lifting the workpiece.

圖4為根據本發明的實施態樣的雷射加工裝置的示意圖。雷射單元1,將從雷射光源射出的雷射光照射在工件4的表面上。XY工作台5,使工件4在X方向(相對於紙張表面的垂直方向)以及Y方向(相對於紙張表面的左右方向)上移動。工件夾持部6,將工件4固定在XY工作台5上。照相機2拍攝工件4的對準標記。夾持桿驅動部8,使夾持桿7在Z方向(相對於紙張表面的上下方向)以及後述的P方向上移動。整體控制部3,控制雷射單元1、照相機2、XY工作台5、工件夾持部6,夾持桿驅動部8等。夾持桿驅動部8設置在XY工作台5內。Fig. 4 is a schematic diagram of a laser processing apparatus according to an embodiment of the present invention. The laser unit 1 irradiates the surface of the workpiece 4 with laser light emitted from the laser light source. The XY table 5 moves the workpiece 4 in the X direction (the vertical direction with respect to the paper surface) and the Y direction (the left-right direction with respect to the paper surface). The workpiece clamping part 6 fixes the workpiece 4 on the XY table 5. The camera 2 photographs the alignment mark of the workpiece 4. The grip lever drive unit 8 moves the grip lever 7 in the Z direction (up and down direction with respect to the surface of the paper) and the P direction described later. The overall control unit 3 controls the laser unit 1, the camera 2, the XY table 5, the workpiece clamping unit 6, the clamping rod driving unit 8, and the like. The clamping rod driving part 8 is provided in the XY table 5.

圖1~3顯示出圖4的工件夾持部6的細節的圖。各夾持框架21、22、23、24分別構成矩形的工件夾持部6的四邊。夾持框架21以及24彼此在一端處利用固定部29固定成直角而具有L形。另外,同樣地,夾持框架22以及23彼此在一端處利用固定部30固定成直角而具有L形。夾持框架21~24上分別形成導向槽31~34。夾持棒25可滑動地裝配在導向槽31以及導向槽33,以能夠在紙張表面Y方向上移動。夾持棒26的一端可滑動地裝配在導向槽32,而另一端穿過設置在夾持棒25的導向槽35,並且可滑動地裝配在形成於夾持框架24上的導向槽34,以能夠在紙張表面X方向上移動。1 to 3 show the details of the work holding portion 6 of FIG. 4. The respective clamping frames 21, 22, 23, and 24 respectively constitute four sides of the rectangular workpiece clamping portion 6. The clamping frames 21 and 24 are fixed to each other at a right angle by a fixing portion 29 at one end, and have an L shape. In addition, similarly, the clamping frames 22 and 23 are fixed to each other at a right angle by the fixing portion 30 at one end, and have an L shape. Guide grooves 31 to 34 are formed on the clamping frames 21 to 24, respectively. The clamping rod 25 is slidably fitted to the guide groove 31 and the guide groove 33 so as to be movable in the Y direction of the paper surface. One end of the clamping rod 26 is slidably fitted in the guide groove 32, and the other end passes through the guide groove 35 provided on the clamping rod 25, and is slidably fitted in the guide groove 34 formed on the clamping frame 24 to Able to move in the X direction on the paper surface.

夾持器36以及37分別安裝於夾持框架21以及22的下側,並且夾持器38以及39分別安裝於夾持棒25以及26的下側。分別準備有多種長度的夾持器38以及39,使操作者可以根據工件4的尺寸適當地更換。夾持框架21以及24的固定部29以及夾持框架22以及23的固定部30,通過安裝於它們下方的夾持桿7與設置在XY工作台5中的夾持桿驅動部8相結合。The clampers 36 and 37 are installed on the lower sides of the clamp frames 21 and 22, respectively, and the clampers 38 and 39 are installed on the lower sides of the clamp bars 25 and 26, respectively. The holders 38 and 39 of various lengths are prepared respectively, so that the operator can appropriately replace them according to the size of the workpiece 4. The fixing parts 29 of the clamping frames 21 and 24 and the fixing parts 30 of the clamping frames 22 and 23 are combined with the clamping rod driving part 8 provided in the XY table 5 through the clamping rod 7 installed below them.

固定部29以及30,位於由夾持框架21~24所圍成的矩形的對角線上。夾持桿驅動部8,藉由來自整體控制部3的控制訊號9控制,將夾持桿7驅動到P方向,即對角線的方向,以可以改變固定部29以及30之間的間隔。另外,夾持框架21以及22的另一端藉由活塞以及氣缸所組合成的連接部27彼此連接,並且夾持框架23以及24的另一端同樣地藉由活塞以及氣缸所組合成的連接部28彼此連接。連接部27以及28,藉由來自整體控制部3的控制訊號10控制,進而可以改變連接部分的間隔。The fixing portions 29 and 30 are located on the diagonals of the rectangle surrounded by the clamping frames 21-24. The clamping rod driving part 8 is controlled by the control signal 9 from the overall control part 3 to drive the clamping rod 7 to the P direction, that is, the diagonal direction, so that the interval between the fixing parts 29 and 30 can be changed. In addition, the other ends of the clamping frames 21 and 22 are connected to each other by the connecting portion 27 formed by the piston and the cylinder, and the other ends of the clamping frames 23 and 24 are similarly connected by the connecting portion 28 formed by the piston and the cylinder. Connect to each other. The connecting parts 27 and 28 are controlled by the control signal 10 from the overall control part 3, so that the interval between the connecting parts can be changed.

當由夾持框架21和22以及夾持棒25和26所圍成的矩形的窗口40的開口範圍加大的情況下,加大固定部29與30之間的間隔,同時也加大連接部27、28的連接部分的間隔。相反地,縮小窗口40的開口範圍的情況下,縮小固定部29與30之間的間隔,同時也縮小連接部分27、28的連接部分的間隔。When the opening range of the rectangular window 40 surrounded by the clamping frames 21 and 22 and the clamping rods 25 and 26 is enlarged, the interval between the fixing parts 29 and 30 is enlarged, and the connecting part is also enlarged. The interval between the connecting part of 27 and 28. Conversely, when the opening range of the window 40 is reduced, the interval between the fixing portions 29 and 30 is reduced, and the interval between the connecting portions 27 and 28 is also reduced.

此外,夾持桿驅動部8,藉由來自整體控制部3的控制訊號9控制,可以從XY工作台5側在Z方向(相對於紙張表面的上下方向)驅動夾持桿7。即,縮小窗口40的開口範圍的情況下,將夾持桿7朝Z方向的下方驅動,使工件夾持部6下降來夾持工件4。相反地,加大窗口40的開口範圍的情況下,將夾持桿7朝Z方向的上方驅動,使工件夾持部6上升以解除對工件4的夾持。In addition, the gripping lever drive unit 8 is controlled by the control signal 9 from the overall control unit 3 to drive the gripping lever 7 in the Z direction (up and down direction with respect to the paper surface) from the XY table 5 side. That is, when the opening range of the window 40 is reduced, the clamping lever 7 is driven downward in the Z direction, and the work clamping portion 6 is lowered to clamp the work 4. Conversely, when the opening range of the window 40 is enlarged, the clamping rod 7 is driven upward in the Z direction to raise the work clamping portion 6 to release the clamping of the work 4.

工件4送入XY工作台5上時,首先,使XY工作台5在X方向上移動到工件夾持部6與雷射單元1彼此不相對的位置。之後,藉由設置於XY工作台5內的夾持桿驅動部8將夾持桿7朝Z方向的上方推動,使工件夾持部6上升,同時加大窗口40的開口範圍。此狀態下,藉由未圖示的專用的工件搬送機件將工件4從工件夾持部6的上側通過窗口40插入。此狀態(未夾持狀態)如圖2所示。在圖中以斜線所示的部分為工件4。之後,縮小窗口40的開口範圍的同時,將夾持桿7朝Z方向的下方驅動,使工件夾持部6下降。藉此,工件4固定於工件夾持部6與XY工作台5之間。此狀態(夾持狀態)如圖3所示。由雷射單元1對工件4的加工是從讓XY工作台5在X方向上移動到工件夾持部6與雷射單元1彼此相對的位置之後進行。When the workpiece 4 is fed onto the XY table 5, first, the XY table 5 is moved in the X direction to a position where the workpiece holder 6 and the laser unit 1 are not opposed to each other. After that, the clamping rod 7 is pushed upward in the Z direction by the clamping rod driving part 8 provided in the XY table 5 to raise the workpiece clamping part 6 and at the same time increase the opening range of the window 40. In this state, the workpiece 4 is inserted from the upper side of the workpiece holding portion 6 through the window 40 by a dedicated workpiece conveying mechanism not shown. This state (unclamped state) is shown in Figure 2. The part shown by diagonal lines in the figure is the work 4. After that, while narrowing the opening range of the window 40, the clamping rod 7 is driven downward in the Z direction to lower the workpiece clamping portion 6. Thereby, the workpiece 4 is fixed between the workpiece clamping portion 6 and the XY table 5. This state (clamping state) is shown in Figure 3. The processing of the workpiece 4 by the laser unit 1 is performed after the XY table 5 is moved in the X direction to a position where the workpiece holding portion 6 and the laser unit 1 are opposed to each other.

工件4從XY工作台5送出時,首先,使XY工作台5在X方向上移動到工件夾持部6與雷射單元1彼此不相對的位置。之後,成為上述的未夾持狀態,藉由專用的工件搬送機件從上側通過窗口40取出工件4。When the workpiece 4 is sent out from the XY table 5, first, the XY table 5 is moved in the X direction to a position where the workpiece holder 6 and the laser unit 1 are not opposed to each other. After that, it becomes the above-mentioned unclamped state, and the workpiece 4 is taken out from the upper side through the window 40 by a dedicated workpiece transport mechanism.

另外,當處理尺寸不同的工件4的情形時,對應該尺寸使夾持棒25、26分別在Y、X方向上移動,同時將對應該尺寸的夾持器38、39分別安裝在各夾持棒25、26。這是在沒有工件4的狀態的上述未夾持狀態,且加大窗口40的開口範圍的狀態下進行。In addition, when handling workpieces 4 of different sizes, the clamping rods 25 and 26 are moved in the Y and X directions to correspond to the size, and the clamps 38 and 39 of the corresponding size are installed in each clamping Sticks 25, 26. This is performed in the above-mentioned unclamped state where there is no workpiece 4 and the opening range of the window 40 is enlarged.

根據以上的實施例,因為印刷基板等的工件4的端部的四邊可以確實固定,工件4沒有從XY工作台5的上面浮起的部分,能夠防止因工件4的端部的浮起導致的加工精度下降。另外,對應工件4的尺寸,使夾持棒25、26分別在Y、X方向上移動同時交換夾持器38、39,可以將各種尺寸的工件4固定在XY工作台5上。According to the above embodiment, since the four sides of the end of the workpiece 4 such as a printed circuit board can be reliably fixed, the workpiece 4 does not float from the upper surface of the XY table 5, which can prevent the end of the workpiece 4 from floating. The machining accuracy is reduced. In addition, corresponding to the size of the workpiece 4, the clamping rods 25 and 26 are moved in the Y and X directions while exchanging the grippers 38 and 39, so that the workpiece 4 of various sizes can be fixed on the XY table 5.

再者,上述實施例中,雖然夾持桿驅動部8驅動固定部29以及30兩者,但在僅驅動固定部29或30的其中一者就可以調整窗口40的開口範圍的情況下,沒有一定要驅動兩者的必要。Furthermore, in the above-mentioned embodiment, although the clamp lever driving portion 8 drives both the fixing portions 29 and 30, when only one of the fixing portions 29 or 30 is driven, the opening range of the window 40 can be adjusted. It must be necessary to drive both.

再者,上述實施例中,雖然連接部27、28藉由整體控制部3控制以控制連接部分的間隔,在僅利用驅動固定部29以及30就可以調整窗口40的開口範圍的情況下,連接部27、28可以僅是可滑動地裝配在框架的端部,而不由整體控制部3控制的結構。Furthermore, in the above-mentioned embodiment, although the connecting parts 27 and 28 are controlled by the overall control part 3 to control the interval of the connecting parts, when the opening range of the window 40 can be adjusted only by the drive fixing parts 29 and 30, the connection The parts 27 and 28 may only be slidably fitted to the ends of the frame, and not controlled by the overall control part 3.

另外,上述實施例中,雖然說明了一片工件4固定在XY工作台5上,但是也可以藉由設置複數個雷射單元1以及複數片工件4、設置與工件4相同數量的工件夾持部6,來同時固定複數片工件4並加工。In addition, in the above embodiment, although one piece of work 4 is fixed on the XY table 5, it is also possible to install a plurality of laser units 1 and multiple pieces of work 4, and to provide the same number of work holding parts as the work 4. 6. To fix and process multiple pieces of workpiece 4 at the same time.

另外,本發明不限於上述的實施例,還有各種變化的可能。包括專利申請範圍的所記載的技術思想的技術事項,其全部皆為本發明所要保護的對象。In addition, the present invention is not limited to the above-mentioned embodiments, and various changes are possible. All of the technical matters including the technical ideas recorded in the scope of the patent application are the objects to be protected by the present invention.

1‧‧‧雷射單元2‧‧‧照相機3‧‧‧整體控制部4‧‧‧工件5‧‧‧XY工作台6‧‧‧工件夾持部7‧‧‧夾持桿8‧‧‧夾持桿驅動部9、10‧‧‧控制訊號21~24‧‧‧夾持框架25、26‧‧‧夾持棒27、28‧‧‧連接部29、30‧‧‧固定部31~35‧‧‧導向槽36~39‧‧‧夾持器40‧‧‧窗口P‧‧‧方向X‧‧‧方向Y‧‧‧方向Z‧‧‧方向1‧‧‧Laser unit2‧‧‧Camera3‧‧‧Integral control part4‧‧‧Workpiece5‧‧‧XY table6‧‧‧Workpiece clamping part7‧‧‧Clamping rod8‧‧‧ Clamping lever drive part 9, 10‧‧‧Control signal 21~24‧‧‧Clamping frame 25, 26‧‧‧Clamping rod 27, 28‧‧‧Connecting part 29, 30‧‧‧Fixed part 31~35 ‧‧‧Guide groove 36~39‧‧‧Gripper 40‧‧‧Window P‧‧‧Direction X‧‧‧Direction Y‧‧‧Direction Z‧‧‧Direction

圖1為根據本發明的雷射加工裝置的工件夾持部的立體圖。 圖2為表示圖1的工件夾持部的未夾持狀態的圖。 圖3為表示圖1的工件夾持部的夾持狀態的圖。 圖4為根據本發明的雷射加工裝置的示意圖。Fig. 1 is a perspective view of a workpiece clamping part of a laser processing device according to the present invention. Fig. 2 is a diagram showing an unclamped state of the work holding portion of Fig. 1. Fig. 3 is a diagram showing a clamping state of the work clamping portion of Fig. 1. Fig. 4 is a schematic diagram of a laser processing device according to the present invention.

6‧‧‧工件夾持部 6‧‧‧Workholding part

8‧‧‧夾持桿驅動部 8‧‧‧Clamping lever drive

21~24‧‧‧夾持框架 21~24‧‧‧Clamping frame

25、26‧‧‧夾持棒 25、26‧‧‧Clamping rod

27、28‧‧‧連接部 27, 28‧‧‧Connecting part

29、30‧‧‧固定部 29, 30‧‧‧Fixed part

31~35‧‧‧導向槽 31~35‧‧‧Guide groove

37、39‧‧‧夾持器 37、39‧‧‧Gripper

40‧‧‧窗口 40‧‧‧Window

X‧‧‧方向 X‧‧‧direction

Y‧‧‧方向 Y‧‧‧ direction

Claims (2)

一種雷射加工裝置,包括:工件夾持部,具備:第一框架,設置於工作台上用於將工件固定在該工作台上,並且安裝有用於固定在該工件的端部側的第一邊的第一夾持器;第二框架,安裝有用於固定與在該工件的端部側的該第一邊形成垂直方向的第二邊的第二夾持器;第三框架,平行於該第一框架;第四框架,平行於該第二框架;第一構件,平行於該第一框架並且可在垂直於該第一框架的方向上移動,安裝有用於固定平行於在該工件的端部側的該第一邊的第三邊的第三夾持器;第二構件,平行於該第二框架並且可在垂直於該第二框架的方向上移動,安裝有用於固定平行於在該工件的端部側的該第二邊的第四邊的第四夾持器;第一固定部,將該第一框架的端部以及該第四框架的端部彼此固定;以及第二固定部,將該第二框架的端部以及該第三框架的端部彼此固定;夾持驅動部,用於改變該第一固定部與該第二固定部之間的第一間隔以及該工件夾持部與該工作台之間的第二間隔;以及控制部,控制該夾持驅動部,以在加大該第一間隔時加大該第二間隔,在縮小該第一間隔時縮小該第二間隔;該工件夾持部包括:第一連接部,將該第一框架的另一端與該第二框架的另一端彼此連接,並且可以改變在該第一連接部的連接部分的第三間隔;以及第二連接部,將該第三框架的另一端與該第四框架的另一端彼此連接,並且可以改變在該第二連接部的連接部分的第四間隔; 且其中,該控制部控制該第一連接部以及該第二連接部,使得在加大該第一間隔時,加大該第三間隔以及第四間隔,並且在縮小該第一間隔時,縮小該第三間隔以及第四間隔。 A laser processing device includes: a workpiece holding part, including: a first frame, which is provided on a work table for fixing the work on the work table, and is equipped with a first frame for fixing on the end side of the work A second holder for the first side of the workpiece; a second frame installed with a second holder for fixing a second side perpendicular to the first side of the workpiece; a third frame, parallel to the The first frame; the fourth frame, parallel to the second frame; the first member, parallel to the first frame and movable in the direction perpendicular to the first frame, is installed for fixing the end parallel to the workpiece Part side of the third side of the first side of the third side of the third holder; a second member, parallel to the second frame and movable in the direction perpendicular to the second frame, is installed for fixing parallel to the A fourth clamper on the fourth side of the second side on the end side of the workpiece; a first fixing portion for fixing the end of the first frame and the end of the fourth frame to each other; and a second fixing portion , The end of the second frame and the end of the third frame are fixed to each other; a clamping drive part for changing the first interval between the first fixing part and the second fixing part and clamping the workpiece And a control part that controls the clamping drive part to increase the second interval when the first interval is increased, and to decrease the second interval when the first interval is reduced Interval; the workpiece clamping portion includes: a first connecting portion, the other end of the first frame and the other end of the second frame are connected to each other, and the third interval in the connecting portion of the first connecting portion can be changed; And a second connecting part, connecting the other end of the third frame and the other end of the fourth frame to each other, and the fourth interval at the connecting part of the second connecting part can be changed; And wherein, the control unit controls the first connection portion and the second connection portion so that when the first interval is increased, the third interval and the fourth interval are increased, and when the first interval is decreased, the The third interval and the fourth interval. 根據申請專利範圍第1項所述的雷射加工裝置,其中,該夾持驅動部設置在該工作台的內部,並配置成經由固定在該第一固定部以及該第二固定部上的構件驅動該第一固定部以及該第二固定部。 The laser processing device according to claim 1, wherein the clamping drive part is provided inside the worktable and is configured to pass through a member fixed on the first fixing part and the second fixing part The first fixing part and the second fixing part are driven.
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108705211A (en) * 2018-07-19 2018-10-26 安徽美诺福科技有限公司 A kind of laser cutting system and steel plate system of processing
CN111570958B (en) * 2019-02-15 2022-06-21 上海炫邦电子科技有限公司 Precision welding machine
CN111761288A (en) * 2020-08-07 2020-10-13 珠海格力智能装备有限公司 Welding positioning auxiliary device
RU205266U1 (en) * 2020-12-30 2021-07-06 Общество с ограниченной ответственностью "НПК Морсвязьавтоматика" TABLE FOR INSTALLATION OF WORKED PARTS
CN116604206A (en) * 2023-05-18 2023-08-18 哈尔滨工业大学 High-uniformity micron-sized micro-group Kong Fenchen vibrating screen processing clamp and processing method
CN116984761B (en) * 2023-07-31 2025-12-09 江西创科新材料科技有限公司 Equipment and method for processing micropores of aluminum nitride substrate by laser

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0623449B1 (en) * 1993-05-04 1998-07-01 Georg Geiss Maschinenfabrik Clamping frame for deep-drawing machine
CN2580727Y (en) * 2002-11-08 2003-10-15 华硕电脑股份有限公司 Bilateral adjustable circuit board frame fixture
CN200983722Y (en) * 2006-12-15 2007-11-28 捷营精密有限公司 An adjustable PCB board carrier

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550617B2 (en) 1997-06-03 2004-08-04 日立ビアメカニクス株式会社 Laser processing equipment
JP3196927B2 (en) * 1997-10-24 2001-08-06 住友重機械工業株式会社 Sheet Clamping Equipment of Sheet Forming Machine
JP4251745B2 (en) 2000-02-23 2009-04-08 日立ビアメカニクス株式会社 Laser processing machine
CN2569519Y (en) * 2002-09-23 2003-08-27 华为技术有限公司 Welding general tray for print circuit board
KR100599490B1 (en) 2004-09-02 2006-07-12 강삼태 Jig for LCD Inspection Line
KR100930871B1 (en) * 2007-10-04 2009-12-10 주식회사 성우하이텍 Conduction laser welding device of aluminum blank
JP5615636B2 (en) 2010-09-13 2014-10-29 倉敷レーザー株式会社 Welding jig
CN104148767A (en) * 2014-07-14 2014-11-19 天津中电达人电子科技有限公司 Wave soldering fixture
KR101572640B1 (en) 2015-05-22 2015-11-27 한주훈 Jig for apparatus inspecting covered display panel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0623449B1 (en) * 1993-05-04 1998-07-01 Georg Geiss Maschinenfabrik Clamping frame for deep-drawing machine
CN2580727Y (en) * 2002-11-08 2003-10-15 华硕电脑股份有限公司 Bilateral adjustable circuit board frame fixture
CN200983722Y (en) * 2006-12-15 2007-11-28 捷营精密有限公司 An adjustable PCB board carrier

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