TWI710420B - Laser processing device - Google Patents
Laser processing device Download PDFInfo
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- TWI710420B TWI710420B TW106118733A TW106118733A TWI710420B TW I710420 B TWI710420 B TW I710420B TW 106118733 A TW106118733 A TW 106118733A TW 106118733 A TW106118733 A TW 106118733A TW I710420 B TWI710420 B TW I710420B
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- 230000003247 decreasing effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
本發明提供一種雷射加工裝置,即使在工件的尺寸不同的情況下,工件也不會浮起而可以確實地將工件固定於工作台。雷射加工裝置包括:矩形的工件夾持部,由第一至第四框架所組成,設置在工作台上,用於將工件固定在工作台上;夾持驅動部,用以改變矩形的開口範圍以及工件夾持部與工作台之間的間隔;以及控制部,用於控制夾持驅動部,以在加大開口範圍時加大間隔,並且在縮小開口範圍時縮小間隔。The present invention provides a laser processing device, even when the size of the workpiece is different, the workpiece does not float, and the workpiece can be reliably fixed to the worktable. The laser processing device includes: a rectangular workpiece clamping part, composed of first to fourth frames, and arranged on the worktable for fixing the work on the worktable; a clamping drive part for changing the rectangular opening The range and the interval between the workpiece clamping part and the worktable; and the control part for controlling the clamping driving part to increase the interval when the opening range is enlarged, and to reduce the interval when the opening range is reduced.
Description
本發明涉及對固定於工作台的印刷基板等的工件進行鑽孔加工的雷射加工裝置,以及有關於用於固定工件的技術。The present invention relates to a laser processing device for drilling a workpiece such as a printed circuit board fixed on a workbench, and a technique for fixing the workpiece.
以往,在利用雷射加工裝置的加工處理中,將作為工件的印刷基板吸附固定在工作台上是已知的。然而,由於僅僅吸附並不足夠,還進一步利用夾持裝置固定印刷基板的端部後進行鑽孔加工。(專利文獻1)。 [現有技術文獻]Conventionally, in the processing using a laser processing device, it has been known to suck and fix a printed circuit board as a work on a table. However, since only suction is not enough, the end of the printed circuit board is further fixed with a clamping device and then drilled. (Patent Document 1). [Prior Art Literature]
[專利文獻1]日本專利申請公開 平成10-328863號[Patent Document 1] Japanese Patent Application Publication Heisei 10-328863
在上述的現有技術中,夾持裝置的印刷基板加壓部件的長度是固定的,不能對應印刷基板的尺寸變化作出應對,有無法加壓印刷基板的端部的四個邊的情況。因此,有印刷基板從工作台浮起的部分發生、讀取附著在印刷基板端部附近的對準標記時發生誤差等,有加工精度低的缺點。In the above-mentioned prior art, the length of the printed circuit board pressing member of the clamping device is fixed, and it cannot respond to changes in the size of the printed circuit board, and it may not be possible to press the four sides of the end of the printed circuit board. Therefore, there are disadvantages such as occurrence of a portion where the printed circuit board floats from the table, an error in reading the alignment mark attached to the vicinity of the end of the printed circuit board, and the like, and the processing accuracy is low.
本發明的目的在於,提供一種雷射加工裝置,即使在工件的尺寸不同的情況下,工件也不會浮起而可以確實將工件固定於工作台。 [解決問題的手段]The object of the present invention is to provide a laser processing device which can reliably fix the workpiece to a table without floating even when the size of the workpiece is different. [Means to solve the problem]
為了解決上述問題,在本發明的雷射加工裝置包括:工件夾持部,具備:第一框架,設置於工作台上用於將工件固定在該工作台上,並且安裝有用於固定在該工件的端部側的第一邊的第一夾持器;第二框架,安裝有用於固定與在該工件的端部側的該第一邊形成垂直方向的第二邊的第二夾持器;第三框架,平行於該第一框架;第四框架,平行於該第二框架;第一構件,平行於該第一框架並且可在垂直於該第一框架的方向上移動,安裝有用於固定平行於在該工件的端部側的該第一邊的第三邊的第三夾持器;第二構件,平行於該第二框架並且可在垂直於該第二框架的方向上移動,安裝有用於固定平行於在該工件的端部側的該第二邊的第四邊的第四夾持器;第一固定部,將該第一框架的端部以及該第四框架的端部彼此固定;以及第二固定部,將該第二框架的端部以及該第三框架的端部彼此固定;夾持驅動部,用於改變該第一固定部與該第二固定部之間的第一間隔以及該工件夾持部與該工作台之間的第二間隔;以及控制部,控制該夾持驅動部,以在加大該第一間隔時加大該第二間隔,在縮小該第一間隔時縮小該第二間隔。 [發明的效果]In order to solve the above-mentioned problems, the laser processing device of the present invention includes: a workpiece holding part, including: a first frame provided on a worktable for fixing the work on the worktable, and installed for fixing the work on the worktable A first clamper on the first side of the end side; a second frame installed with a second clamper for fixing a second side perpendicular to the first side on the end side of the workpiece; The third frame, parallel to the first frame; the fourth frame, parallel to the second frame; the first member, parallel to the first frame and movable in the direction perpendicular to the first frame, is installed for fixing A third holder parallel to the third side of the first side on the end side of the workpiece; a second member, parallel to the second frame and movable in a direction perpendicular to the second frame, installed There is a fourth holder for fixing the fourth side parallel to the second side on the end side of the workpiece; the first fixing part, the end of the first frame and the end of the fourth frame are mutually Fixed; and a second fixing part for fixing the end of the second frame and the end of the third frame to each other; a clamping driving part for changing the first fixing part and the second fixing part An interval and a second interval between the workpiece clamping portion and the worktable; and a control portion, which controls the clamping driving portion to increase the second interval when the first interval is increased, and to reduce the first interval At one interval, the second interval is reduced. [Effects of the invention]
根據本發明,即使在工件的尺寸不同的情況下,可以使工件不浮起而確實地將工件固定於工作台。According to the present invention, even when the size of the workpiece is different, the workpiece can be reliably fixed to the table without lifting the workpiece.
圖4為根據本發明的實施態樣的雷射加工裝置的示意圖。雷射單元1,將從雷射光源射出的雷射光照射在工件4的表面上。XY工作台5,使工件4在X方向(相對於紙張表面的垂直方向)以及Y方向(相對於紙張表面的左右方向)上移動。工件夾持部6,將工件4固定在XY工作台5上。照相機2拍攝工件4的對準標記。夾持桿驅動部8,使夾持桿7在Z方向(相對於紙張表面的上下方向)以及後述的P方向上移動。整體控制部3,控制雷射單元1、照相機2、XY工作台5、工件夾持部6,夾持桿驅動部8等。夾持桿驅動部8設置在XY工作台5內。Fig. 4 is a schematic diagram of a laser processing apparatus according to an embodiment of the present invention. The
圖1~3顯示出圖4的工件夾持部6的細節的圖。各夾持框架21、22、23、24分別構成矩形的工件夾持部6的四邊。夾持框架21以及24彼此在一端處利用固定部29固定成直角而具有L形。另外,同樣地,夾持框架22以及23彼此在一端處利用固定部30固定成直角而具有L形。夾持框架21~24上分別形成導向槽31~34。夾持棒25可滑動地裝配在導向槽31以及導向槽33,以能夠在紙張表面Y方向上移動。夾持棒26的一端可滑動地裝配在導向槽32,而另一端穿過設置在夾持棒25的導向槽35,並且可滑動地裝配在形成於夾持框架24上的導向槽34,以能夠在紙張表面X方向上移動。1 to 3 show the details of the
夾持器36以及37分別安裝於夾持框架21以及22的下側,並且夾持器38以及39分別安裝於夾持棒25以及26的下側。分別準備有多種長度的夾持器38以及39,使操作者可以根據工件4的尺寸適當地更換。夾持框架21以及24的固定部29以及夾持框架22以及23的固定部30,通過安裝於它們下方的夾持桿7與設置在XY工作台5中的夾持桿驅動部8相結合。The
固定部29以及30,位於由夾持框架21~24所圍成的矩形的對角線上。夾持桿驅動部8,藉由來自整體控制部3的控制訊號9控制,將夾持桿7驅動到P方向,即對角線的方向,以可以改變固定部29以及30之間的間隔。另外,夾持框架21以及22的另一端藉由活塞以及氣缸所組合成的連接部27彼此連接,並且夾持框架23以及24的另一端同樣地藉由活塞以及氣缸所組合成的連接部28彼此連接。連接部27以及28,藉由來自整體控制部3的控制訊號10控制,進而可以改變連接部分的間隔。The
當由夾持框架21和22以及夾持棒25和26所圍成的矩形的窗口40的開口範圍加大的情況下,加大固定部29與30之間的間隔,同時也加大連接部27、28的連接部分的間隔。相反地,縮小窗口40的開口範圍的情況下,縮小固定部29與30之間的間隔,同時也縮小連接部分27、28的連接部分的間隔。When the opening range of the
此外,夾持桿驅動部8,藉由來自整體控制部3的控制訊號9控制,可以從XY工作台5側在Z方向(相對於紙張表面的上下方向)驅動夾持桿7。即,縮小窗口40的開口範圍的情況下,將夾持桿7朝Z方向的下方驅動,使工件夾持部6下降來夾持工件4。相反地,加大窗口40的開口範圍的情況下,將夾持桿7朝Z方向的上方驅動,使工件夾持部6上升以解除對工件4的夾持。In addition, the gripping
工件4送入XY工作台5上時,首先,使XY工作台5在X方向上移動到工件夾持部6與雷射單元1彼此不相對的位置。之後,藉由設置於XY工作台5內的夾持桿驅動部8將夾持桿7朝Z方向的上方推動,使工件夾持部6上升,同時加大窗口40的開口範圍。此狀態下,藉由未圖示的專用的工件搬送機件將工件4從工件夾持部6的上側通過窗口40插入。此狀態(未夾持狀態)如圖2所示。在圖中以斜線所示的部分為工件4。之後,縮小窗口40的開口範圍的同時,將夾持桿7朝Z方向的下方驅動,使工件夾持部6下降。藉此,工件4固定於工件夾持部6與XY工作台5之間。此狀態(夾持狀態)如圖3所示。由雷射單元1對工件4的加工是從讓XY工作台5在X方向上移動到工件夾持部6與雷射單元1彼此相對的位置之後進行。When the
工件4從XY工作台5送出時,首先,使XY工作台5在X方向上移動到工件夾持部6與雷射單元1彼此不相對的位置。之後,成為上述的未夾持狀態,藉由專用的工件搬送機件從上側通過窗口40取出工件4。When the
另外,當處理尺寸不同的工件4的情形時,對應該尺寸使夾持棒25、26分別在Y、X方向上移動,同時將對應該尺寸的夾持器38、39分別安裝在各夾持棒25、26。這是在沒有工件4的狀態的上述未夾持狀態,且加大窗口40的開口範圍的狀態下進行。In addition, when handling
根據以上的實施例,因為印刷基板等的工件4的端部的四邊可以確實固定,工件4沒有從XY工作台5的上面浮起的部分,能夠防止因工件4的端部的浮起導致的加工精度下降。另外,對應工件4的尺寸,使夾持棒25、26分別在Y、X方向上移動同時交換夾持器38、39,可以將各種尺寸的工件4固定在XY工作台5上。According to the above embodiment, since the four sides of the end of the
再者,上述實施例中,雖然夾持桿驅動部8驅動固定部29以及30兩者,但在僅驅動固定部29或30的其中一者就可以調整窗口40的開口範圍的情況下,沒有一定要驅動兩者的必要。Furthermore, in the above-mentioned embodiment, although the clamp
再者,上述實施例中,雖然連接部27、28藉由整體控制部3控制以控制連接部分的間隔,在僅利用驅動固定部29以及30就可以調整窗口40的開口範圍的情況下,連接部27、28可以僅是可滑動地裝配在框架的端部,而不由整體控制部3控制的結構。Furthermore, in the above-mentioned embodiment, although the connecting
另外,上述實施例中,雖然說明了一片工件4固定在XY工作台5上,但是也可以藉由設置複數個雷射單元1以及複數片工件4、設置與工件4相同數量的工件夾持部6,來同時固定複數片工件4並加工。In addition, in the above embodiment, although one piece of
另外,本發明不限於上述的實施例,還有各種變化的可能。包括專利申請範圍的所記載的技術思想的技術事項,其全部皆為本發明所要保護的對象。In addition, the present invention is not limited to the above-mentioned embodiments, and various changes are possible. All of the technical matters including the technical ideas recorded in the scope of the patent application are the objects to be protected by the present invention.
1‧‧‧雷射單元2‧‧‧照相機3‧‧‧整體控制部4‧‧‧工件5‧‧‧XY工作台6‧‧‧工件夾持部7‧‧‧夾持桿8‧‧‧夾持桿驅動部9、10‧‧‧控制訊號21~24‧‧‧夾持框架25、26‧‧‧夾持棒27、28‧‧‧連接部29、30‧‧‧固定部31~35‧‧‧導向槽36~39‧‧‧夾持器40‧‧‧窗口P‧‧‧方向X‧‧‧方向Y‧‧‧方向Z‧‧‧方向1‧‧‧Laser unit2‧‧‧Camera3‧‧‧Integral control part4‧‧‧Workpiece5‧‧‧XY table6‧‧‧Workpiece clamping part7‧‧‧Clamping rod8‧‧‧ Clamping
圖1為根據本發明的雷射加工裝置的工件夾持部的立體圖。 圖2為表示圖1的工件夾持部的未夾持狀態的圖。 圖3為表示圖1的工件夾持部的夾持狀態的圖。 圖4為根據本發明的雷射加工裝置的示意圖。Fig. 1 is a perspective view of a workpiece clamping part of a laser processing device according to the present invention. Fig. 2 is a diagram showing an unclamped state of the work holding portion of Fig. 1. Fig. 3 is a diagram showing a clamping state of the work clamping portion of Fig. 1. Fig. 4 is a schematic diagram of a laser processing device according to the present invention.
6‧‧‧工件夾持部 6‧‧‧Workholding part
8‧‧‧夾持桿驅動部 8‧‧‧Clamping lever drive
21~24‧‧‧夾持框架 21~24‧‧‧Clamping frame
25、26‧‧‧夾持棒 25、26‧‧‧Clamping rod
27、28‧‧‧連接部 27, 28‧‧‧Connecting part
29、30‧‧‧固定部 29, 30‧‧‧Fixed part
31~35‧‧‧導向槽 31~35‧‧‧Guide groove
37、39‧‧‧夾持器 37、39‧‧‧Gripper
40‧‧‧窗口 40‧‧‧Window
X‧‧‧方向 X‧‧‧direction
Y‧‧‧方向 Y‧‧‧ direction
Claims (2)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-126352 | 2016-06-27 | ||
| JP2016126352 | 2016-06-27 | ||
| JP2017095154A JP6806625B2 (en) | 2016-06-27 | 2017-05-12 | Laser processing equipment |
| JP2017-095154 | 2017-05-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201800169A TW201800169A (en) | 2018-01-01 |
| TWI710420B true TWI710420B (en) | 2020-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106118733A TWI710420B (en) | 2016-06-27 | 2017-06-06 | Laser processing device |
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|---|---|
| JP (1) | JP6806625B2 (en) |
| KR (1) | KR102304688B1 (en) |
| CN (1) | CN107538138B (en) |
| TW (1) | TWI710420B (en) |
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| CN108705211A (en) * | 2018-07-19 | 2018-10-26 | 安徽美诺福科技有限公司 | A kind of laser cutting system and steel plate system of processing |
| CN111570958B (en) * | 2019-02-15 | 2022-06-21 | 上海炫邦电子科技有限公司 | Precision welding machine |
| CN111761288A (en) * | 2020-08-07 | 2020-10-13 | 珠海格力智能装备有限公司 | Welding positioning auxiliary device |
| RU205266U1 (en) * | 2020-12-30 | 2021-07-06 | Общество с ограниченной ответственностью "НПК Морсвязьавтоматика" | TABLE FOR INSTALLATION OF WORKED PARTS |
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| CN116984761B (en) * | 2023-07-31 | 2025-12-09 | 江西创科新材料科技有限公司 | Equipment and method for processing micropores of aluminum nitride substrate by laser |
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- 2017-06-06 TW TW106118733A patent/TWI710420B/en active
- 2017-06-09 KR KR1020170072651A patent/KR102304688B1/en active Active
- 2017-06-26 CN CN201710494389.3A patent/CN107538138B/en active Active
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| EP0623449B1 (en) * | 1993-05-04 | 1998-07-01 | Georg Geiss Maschinenfabrik | Clamping frame for deep-drawing machine |
| CN2580727Y (en) * | 2002-11-08 | 2003-10-15 | 华硕电脑股份有限公司 | Bilateral adjustable circuit board frame fixture |
| CN200983722Y (en) * | 2006-12-15 | 2007-11-28 | 捷营精密有限公司 | An adjustable PCB board carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102304688B1 (en) | 2021-09-24 |
| CN107538138B (en) | 2020-09-01 |
| JP2018001273A (en) | 2018-01-11 |
| JP6806625B2 (en) | 2021-01-06 |
| KR20180001449A (en) | 2018-01-04 |
| CN107538138A (en) | 2018-01-05 |
| TW201800169A (en) | 2018-01-01 |
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