TWI708235B - Pixel sensor circuit - Google Patents
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Description
本揭示文件係關於一種畫素感測電路,特別是一種能夠感測隨時間改變振幅的交流訊號之畫素感測電路。 This disclosure relates to a pixel sensing circuit, especially a pixel sensing circuit capable of sensing AC signals whose amplitude changes with time.
超音波辨識技術為現在指紋辨識技術的主流趨勢,許多高階智慧型電子裝置都陸續搭載超音波指紋辨識技術,例如屏下指紋辨識功能。各大科技公司都在發展能夠快速且正確的指紋辨識技術,例如手指潮濕的條件下依然能夠成功辨識。超音波訊號類似於一交流訊號,有別於直流訊號,超音波訊號之振幅大小會隨著時間改變。因此需要設計一種能夠正確辨識超音波訊號的感測技術。 Ultrasonic recognition technology is the mainstream trend of fingerprint recognition technology. Many high-end smart electronic devices are successively equipped with ultrasonic fingerprint recognition technology, such as under-screen fingerprint recognition. Major technology companies are developing fast and accurate fingerprint recognition technology, such as successful recognition even when the fingers are wet. An ultrasonic signal is similar to an AC signal, and is different from a DC signal. The amplitude of the ultrasonic signal changes with time. Therefore, it is necessary to design a sensing technology that can correctly recognize ultrasonic signals.
本揭示文件的一實施例中,一種畫素感測電路包含壓電材料、振幅感測電路及讀取電路。壓電材料用以根據輸入電壓產生震動訊號,震動訊號在接收時間內改變振幅。振幅感測電路用以接收震動訊號,並獲取接收時間內振幅的最大值及最小值。讀取電路用以根據振幅的最大值及最小值輸出一輸出電流。 In an embodiment of the present disclosure, a pixel sensing circuit includes a piezoelectric material, an amplitude sensing circuit, and a reading circuit. The piezoelectric material is used to generate a vibration signal according to the input voltage, and the vibration signal changes its amplitude during the receiving time. The amplitude sensing circuit is used to receive the vibration signal and obtain the maximum and minimum amplitudes within the receiving time. The reading circuit is used for outputting an output current according to the maximum value and the minimum value of the amplitude.
綜上所述,壓電材料特殊的特性而產生類似於交流訊號的震動訊號,振幅感測電路獲取震動訊號的振幅之最大值及最小值,讀取電路的輸出電流的大小根據震動訊號的最大值及最小值而改變。 To sum up, the special characteristics of piezoelectric materials produce vibration signals similar to AC signals. The amplitude sensing circuit obtains the maximum and minimum amplitudes of the vibration signal. The output current of the reading circuit is based on the maximum value of the vibration signal. Value and minimum value.
100、100a、100b、100c、100d、100e‧‧‧畫素感測電路 100, 100a, 100b, 100c, 100d, 100e‧‧‧Pixel sensing circuit
110‧‧‧壓電材料 110‧‧‧Piezoelectric material
120、120b、120c、120d‧‧‧振幅感測電路 120, 120b, 120c, 120d‧‧‧Amplitude sensing circuit
130、130b、130c、130d、130e‧‧‧讀取電路 130, 130b, 130c, 130d, 130e‧‧‧Reading circuit
VBIAS‧‧‧輸入電壓 V BIAS ‧‧‧Input voltage
A、G、B、H‧‧‧節點 A, G, B, H‧‧‧node
T1~T7‧‧‧電晶體 T1~T7‧‧‧Transistor
FVDD、FVSS、VP、VN‧‧‧電壓 FVDD, FVSS, V P , V N ‧‧‧Voltage
SH、SINT‧‧‧輸入訊號 S H , S INT ‧‧‧input signal
VINT‧‧‧初始電壓 V INT ‧‧‧Initial voltage
VREF‧‧‧參考電壓 V REF ‧‧‧Reference voltage
SREAD‧‧‧讀取訊號 S READ ‧‧‧Read signal
D1、D2‧‧‧二極體 D1, D2‧‧‧Diode
C1、C2‧‧‧電容 C1, C2‧‧‧Capacitor
TP1‧‧‧重置時間 TP1‧‧‧Reset time
TP1a‧‧‧發送時間 TP1a‧‧‧Send time
TP2‧‧‧接收時間 TP2‧‧‧Receiving time
TP3‧‧‧讀取時間 TP3‧‧‧Read time
第1圖繪示根據本揭示文件之一實施例的畫素感測電路功能方塊圖。 FIG. 1 is a functional block diagram of a pixel sensing circuit according to an embodiment of the disclosure.
第2圖繪示根據本揭示文件之一實施例的畫素感測電路部分電路圖。 FIG. 2 is a partial circuit diagram of a pixel sensing circuit according to an embodiment of the disclosure.
第3圖繪示根據本揭示文件之一實施例的訊號時序圖。 FIG. 3 shows a signal timing diagram according to an embodiment of the present disclosure.
第4圖繪示根據本揭示文件之一實施例的畫素感測電路操作示意圖。 FIG. 4 is a schematic diagram illustrating the operation of the pixel sensing circuit according to an embodiment of the present disclosure.
第5圖繪示根據本揭示文件之一實施例的畫素感測電路操作示意圖。 FIG. 5 is a schematic diagram illustrating the operation of the pixel sensing circuit according to an embodiment of the present disclosure.
第6圖繪示根據本揭示文件之一實施例的畫素感測電路操作示意圖。 FIG. 6 is a schematic diagram illustrating the operation of the pixel sensing circuit according to an embodiment of the present disclosure.
第7圖繪示根據本揭示文件之一實施例的畫素感測電路圖。 FIG. 7 is a pixel sensing circuit diagram according to an embodiment of the disclosure.
第8a圖繪示根據本揭示文件之一實施例的振幅感測電路圖。 FIG. 8a shows an amplitude sensing circuit diagram according to an embodiment of the present disclosure.
第8b圖繪示根據本揭示文件之一實施例的振幅感測電路圖。 FIG. 8b shows an amplitude sensing circuit diagram according to an embodiment of the present disclosure.
第8c圖繪示根據本揭示文件之一實施例的振幅感測電路圖。 FIG. 8c is a circuit diagram of an amplitude sensing circuit according to an embodiment of the present disclosure.
第9圖繪示根據本揭示文件之一實施例的訊號時序圖。 FIG. 9 shows a signal timing diagram according to an embodiment of the present disclosure.
第10圖繪示根據本揭示文件之一實施例的畫素感測電路操作示意圖。 FIG. 10 is a schematic diagram illustrating the operation of the pixel sensing circuit according to an embodiment of the present disclosure.
第11a圖繪示根據本揭示文件之一實施例的畫素感測電路圖。 FIG. 11a shows a pixel sensing circuit diagram according to an embodiment of the present disclosure.
第11b圖繪示根據本揭示文件之一實施例的畫素感測電路圖。 FIG. 11b shows a pixel sensing circuit diagram according to an embodiment of the disclosure.
第12a圖繪示根據本揭示文件之一實施例的畫素感測電路圖。 FIG. 12a shows a pixel sensing circuit diagram according to an embodiment of the present disclosure.
第12b圖繪示根據本揭示文件之一實施例的畫素感測電路圖。 FIG. 12b is a circuit diagram of a pixel sensing circuit according to an embodiment of the present disclosure.
在本文中所使用的用詞「包含」、「具有」等等,均為開放性的用語,即意指「包含但不限於」。此外,本文中所使用之「及/或」,包含相關列舉項目中一或多個項目的任意一個以及其所有組合。 The terms "include", "have" and so on used in this article are all open terms, meaning "including but not limited to". In addition, the "and/or" used in this article includes any one of one or more of the related listed items and all combinations thereof.
於本文中,當一元件被稱為「連結」或「耦接」時,可指「電性連接」或「電性耦接」。「連結」或「耦接」亦可用以表示二或多個元件間相互搭配操作或互動。此外,雖然本文中使用「第一」、「第二」、...等用語描述不同元件,該用語僅是用以區別以相同技術用語描述的元件或操作。除非上下文清楚指明,否則該用語並非特別指稱或暗示次序或順位,亦非用以限定本揭示文件。 In this text, when an element is referred to as "connected" or "coupled", it can be referred to as "electrical connection" or "electrical coupling." "Link" or "coupling" can also be used to indicate the coordinated operation or interaction between two or more components. In addition, although terms such as "first", "second", ... are used herein to describe different elements, the terms are only used to distinguish elements or operations described in the same technical terms. Unless the context clearly indicates, the terms do not specifically refer to or imply the order or sequence, nor are they used to limit this disclosure.
請參考第1圖,第1圖繪示根據本揭示文件之一實施例的畫素感測電路100功能方塊圖。畫素感測電路100包含壓電材料110、振幅感測電路120及讀取電路130。壓電材料110用以根據輸入電壓VBIAS產生震動訊號,震動訊號在致能時間內改變振幅。振幅感測電路120用以接收震動訊號,並獲取致能時間內振幅的最大值及最小值。讀取電路130用以根據振幅的最大值及最小值輸出一輸出電流。於一實施例,震動訊號可以是超音波訊號。
Please refer to FIG. 1, which illustrates a functional block diagram of the
壓電材料110輸入震動訊號到振幅感測電路120中的節點A(描繪於第4圖中),振幅感測電路120藉由節點A接收震動訊號。
The
請參考第2圖,第2圖繪示根據本揭示文件之一實施例的畫素感測電路100部分電路圖。讀取電路130包含電晶體T1及電晶體T2,電晶體T1及電晶體T2各自包含第一端、第二端及控制端。電晶體T1的第一端用以接收電壓FVDD,電晶體T1的第二端耦接於電晶體T2的第一端,電晶體T1的控制端耦接於節點G,電晶體T1根據節點G的電壓選擇性地導通,電壓FVDD可以是一系統高電壓。
Please refer to FIG. 2. FIG. 2 illustrates a partial circuit diagram of the
電晶體T2的第一端耦接於電晶體T1的第二端,電晶體T2的第二端耦接於畫素感測電路100的讀取端,電晶體T2的控制端用以接收讀取訊號SREAD,電晶體T2根據讀取訊號SREAD選擇性地導通。
The first end of the transistor T2 is coupled to the second end of the transistor T1, the second end of the transistor T2 is coupled to the reading end of the
請參考第3圖,第3圖繪示根據本揭示文件之一實施例的訊號時序圖。畫素感測電路100操作於第一操作模式中,第一操作模式包含重置時間TP1、接收時間TP2及讀取時間TP3。第3圖包含輸入訊號SH、輸入訊號SINT、節點A的電壓以及讀取訊號SREAD在重置時間TP1、接收時間TP2及讀取時間TP3的時序。
Please refer to FIG. 3. FIG. 3 shows a signal timing diagram according to an embodiment of the present disclosure. The
請參考第4圖,第4圖繪示根據本揭示文件之一實施例的畫素感測電路100操作示意圖,振幅感測電路120包含電晶體T3、電晶體T4、電晶體T5、電晶體T6、電晶體T7、二極體D1、二極體D2、電容C1及電容C2。
Please refer to FIG. 4. FIG. 4 shows a schematic diagram of the operation of the
電晶體T3、電晶體T4、電晶體T5、電晶體T6及電晶體T7各自包含第一端、第二端及控制端。電晶體T3的第一端耦接於振幅感測電路120的節點H,電晶體T3的第二端用以接收初始電壓VINT,電晶體T3的控制端用以接收輸入訊號SH,並根據輸入訊號SH選擇性地導通。
Transistor T3, Transistor T4, Transistor T5, Transistor T6, and Transistor T7 each include a first terminal, a second terminal, and a control terminal. The first end of the transistor T3 is coupled to the node H of the
電晶體T4的第一端耦接於節點B,電晶體T4的第二端用以接收參考電壓VREF,電晶體T4的控制端用以接收讀取訊號SREAD,並根據讀取訊號SREAD選擇性地導通。 The first end of the transistor T4 is coupled to the node B, the second end of the transistor T4 is used to receive the reference voltage V REF , and the control end of the transistor T4 is used to receive the read signal S READ , and according to the read signal S READ Selectively turn on.
電晶體T5的第一端耦接於節點A,電晶體T5的第二端耦接於節點G,電晶體T5的控制端用以接收輸入訊號SINT,並根據輸入訊號SINT選擇性地導通。 The first end of the transistor T5 is coupled to the node A, the second end of the transistor T5 is coupled to the node G, and the control end of the transistor T5 is used to receive the input signal S INT and is selectively turned on according to the input signal S INT .
電晶體T6的第一端耦接於節點A,電晶體T6的第二端耦接於節點B,電晶體T6的控制端用以接收輸入訊號SINT,並根據輸入訊號SINT選擇性地導通。 The first end of the transistor T6 is coupled to node A, the second end of the transistor T6 is coupled to node B, and the control end of the transistor T6 is used to receive the input signal S INT and is selectively turned on according to the input signal S INT .
電晶體T7的第一端耦接於節點A,電晶體T7的第二端用以接收初始電壓VINT,電晶體T7的控制端用以接收輸入訊號SINT,並根據輸入訊號SINT選擇性地導通。 The first end of the transistor T7 is coupled to the node A, the second end of the transistor T7 is used to receive the initial voltage V INT , the control end of the transistor T7 is used to receive the input signal S INT , and is selectively based on the input signal S INT地转通.
電容C1及電容C2各自包含第一端及第二端,電容C1的第一端耦接於節點G,電容C1的第二端耦接於節點H。電容C2的第一端耦接於節點H,電容C2的第二端耦接於節點B。 The capacitor C1 and the capacitor C2 each include a first terminal and a second terminal. The first terminal of the capacitor C1 is coupled to the node G, and the second terminal of the capacitor C1 is coupled to the node H. The first end of the capacitor C2 is coupled to the node H, and the second end of the capacitor C2 is coupled to the node B.
二極體D1用以獲取震動訊號的振幅之最大值,二極體D1包含第一端及第二端,二極體D1的第一端耦接於節點A,二極體D1的第二端耦接於振幅感測電路120的節點G。二極體D1的第一端用以接收震動訊號,二極體D1根據震動訊號及節點G的電壓選擇性地導通。
The diode D1 is used to obtain the maximum amplitude of the vibration signal. The diode D1 includes a first end and a second end. The first end of the diode D1 is coupled to the node A, and the second end of the diode D1 It is coupled to the node G of the
例如,當震動訊號的振幅達到最大值電壓VP時,當電壓VP大於節點G的電壓,二極體D1導通,節點G的電壓變為電壓VP。 For example, when the amplitude of the vibration signal reaches the maximum voltage V P , when the voltage V P is greater than the voltage of the node G, the diode D1 is turned on, and the voltage of the node G becomes the voltage V P.
二極體D2用以獲取震動訊號的振幅之最小值,二極體D2包含第一端及第二端,二極體D2的第一端耦接於節點A,二極體D2的第二端耦接於節點B。二極體D2的第一端用以接收震動訊號,二極體D2根據震動訊號及該節點B的電壓選擇性地導通。例如,當震動訊號的振幅達到最小值電壓VN時,電壓VN小於節點B的電壓時,二極體D2導通,節點B的電壓變為電壓VN。 The diode D2 is used to obtain the minimum amplitude of the vibration signal. The diode D2 includes a first end and a second end. The first end of the diode D2 is coupled to the node A, and the second end of the diode D2 Coupled to node B. The first end of the diode D2 is used to receive the vibration signal, and the diode D2 is selectively turned on according to the vibration signal and the voltage of the node B. For example, when the amplitude of the vibration signal reaches the minimum voltage V N and the voltage V N is less than the voltage of the node B, the diode D2 is turned on and the voltage of the node B becomes the voltage V N.
請同時參考第3圖及第4圖,第4圖中畫素感測電路100操作於重置時間TP1,輸入訊號SINT及輸入訊號SH為低電位,使電晶體T5、電晶體T6、電晶體T7及電晶體T3導通,將節點A、節點G、節點B及節點H的電壓重置為初始電壓VINT。
Please refer to FIG. 3, while the second 4, FIG. 4 of the
請同時參考第3圖及第5圖,第5圖繪示根據本揭示文件之一實施例的畫素感測電路100操作示意圖。畫素感測電路操作於接收時間TP2,輸入訊號SINT為高電位,輸入訊號SH為低電位,二極體D1獲取震動訊號的振幅使節點G的電壓為振幅的最大值電壓VP,二極體D2獲取震動訊號的振幅使節點B的電壓為振幅的最小值電壓VN。
Please refer to FIG. 3 and FIG. 5 at the same time. FIG. 5 is a schematic diagram of the operation of the
於實際操作時,由於二極體D1及二極體D2具有導通所需的導通電壓(turn-on voltage),因此二極體D1及二極體D2導通而進入順向偏壓區,節點G的電壓變為電壓VP減去二極體D1的臨界電壓,例如節點G的電壓變為電壓VP減去0.7V。節點B的電壓變為電壓VN加上二極體D2的臨界電壓,例如節點B的電壓變為電壓VN加上0.7V。 In actual operation, since the diode D1 and the diode D2 have the turn-on voltage required for conduction, the diode D1 and the diode D2 are turned on and enter the forward bias region, and the node G The voltage of V becomes the voltage V P minus the critical voltage of the diode D1, for example, the voltage of the node G becomes the voltage V P minus 0.7V. The voltage of the node B becomes the voltage V N plus the critical voltage of the diode D2. For example, the voltage of the node B becomes the voltage V N plus 0.7V.
請同時參考第3圖及第6圖,第6圖繪示根據本揭示文件之一實施例的畫素感測電路100操作示意圖。畫素感測電路操作於讀取時間TP3,輸入訊號SINT及輸入訊號SH為高電位,讀取訊號SREAD為低電位,電晶體T4導通使節點B的電壓由震動訊號的振幅之最小值(電壓VN)變為參考電壓VREF,使節點G的電壓由震動訊號的振幅之最大值(電壓VP)變為振幅的最大值加上一變動電壓(電壓VP+△V),變動電壓為參考電壓減去震動訊號的振幅之最小值(△
V=VREF-VN)。由於節點G耦接於電晶體T1的控制端,節點G的電壓變動一變動電壓值時,根據電晶體電流公式,流過電晶體T1及電晶體T2之輸出電流IOUT的大小也會根據變動
電壓而改變。
Please refer to FIGS. 3 and 6 at the same time. FIG. 6 is a schematic diagram illustrating the operation of the
請參考第7圖,第7圖繪示根據本揭示文件之一實施例的畫素感測電路100a電路圖。畫素感測電路100a包含振幅感測電路100a,振幅感測電路100a與振幅感測電路100不同的地方在於將二極體D1的第一端及第二端交換,二極體D2的第一端及第二端交換,使二極體D1用以獲取震動訊號的振幅之最小值,使二極體D2用以獲取震動訊號的振幅的最大值。畫素感測電路100a具有與第4圖~第6圖的畫素感測電路100同樣的壓電材料110及讀取電路130,在此不再贅述。於此實施例,輸出電流與振幅感測電路100之輸出電流不同的地方在於輸出電流的公式中變動電壓相差一負
號。
Please refer to FIG. 7, which is a circuit diagram of the
振幅感測電路120根據內部電晶體的耦接方法不同而有不同的實施方式。於重置時間TP1時,振幅感測電路120因為不同的實施方式而有不同的重置方式。請同時參考第8a圖、第8b圖及第8c圖,第8a圖繪示根據本揭示文件之一實施例的振幅感測電路120b電路圖,第8b圖繪示根據本揭示文件之一實施例的振幅感測電路120c電路圖,第8c圖繪示根據本揭示文件之一實施例的振幅感測電路120d電
路圖。
The
振幅感測電路120b與振幅感測電路120不同的地方在於改變電晶體T5及電晶體T6的耦接方式。電晶體T5的第一端用以接收初始電壓VINT,電晶體T6的第一端耦接於電晶體T7的第二端,電晶體T6的第二端耦接於電晶體T4的第一端。於重置時間TP1時,電晶體T5導通使節點G變為初始電壓VINT,電晶體T6導通使節點B的電壓變為初始電壓VINT,其他操作與第4圖相同,在此不再贅述。
The difference between the
振幅感測電路120c與振幅感測電路120不同的地方在於改變電晶體T7的耦接方式。電晶體T7的第一端用以接收初始電壓VINT,電晶體T7的第二端耦接於節點G。於重置時間TP1時,電晶體T7導通使節點G的電壓變為初始電壓VINT,其他操作與第4圖相同,在此不再贅述。
The difference between the
振幅感測電路120d與振幅感測電路120不同的地方在於改變電晶體T7的耦接方式。電晶體T7的第一端耦接於節點B,電晶體T7的第二端耦接於電晶體T3的第二端。於重置時間TP1時,電晶體T7導通使節點B的電壓變為初始電壓VINT,其他操作與第4圖相同,在此不再贅述。
The difference between the
請參考第9圖,第9圖繪示根據本揭示文件之一實施例的訊號時序圖。畫素感測電路100操作於第二操作模式中,第二操作模式包含發送時間TP1a、接收時間TP2及讀取時間TP3。第9圖包含輸入電壓VBIAS,輸入訊號SH、輸入訊號SINT、節點A的電壓以及讀取訊號SREAD在發送時間TP1a、接收時間TP2及讀取時間TP3的時序。
Please refer to FIG. 9, which illustrates a signal timing diagram according to an embodiment of the present disclosure. The
請同時參考第9圖及第10圖,第10圖繪示根據本揭示文件之一實施例的畫素感測電路100操作示意圖。畫素感測電路100操作於發送時間TP1a時,節點A的電壓由於電晶體T7導通而變為初始電壓VINT,使壓電材料110的另一端輸入電壓VBIAS變為連續脈波。有別於接收時間TP2的操作,畫素感測電路100於發送時間TP1a的操作類似於做為一發送端。
Please refer to FIG. 9 and FIG. 10 at the same time. FIG. 10 is a schematic diagram of the operation of the
讀取電路130根據內部電晶體的耦接方法及使用不同電晶體元件而有不同的實施方式。請同時參考第11a圖及第11b圖,第11a圖繪示根據本揭示文件之一實施例的畫素感測電路100b電路圖,第11b圖繪示根據本揭示文件之一實施例的畫素感測電路100c電路圖。
The
第11a圖的畫素感測電路100b包含讀取電路130b。讀取電路130b中將第4圖~第6圖中的電晶體T1的第一端改為耦接於輸出端,電晶體T1的第二端改為接收一電壓FVSS,電壓FVSS可以是一系統低電壓。為了方便說明,第11a圖及第11b圖中將其他與第4圖~第6圖相同的電晶體元件以開關符號取代,在此不再贅述。
The
第11b圖的畫素感測電路100c包含讀取電路130c。讀取電路130c中將第4圖~第6圖中的電晶體T1改用N型電晶體。其他元件與第4圖~第6圖相同,在此不再贅述。
The
請同時參考第12a圖及第12b圖,第12a圖繪示根據本揭示文件之一實施例的畫素感測電路100d電路圖,第12b圖繪示根據本揭示文件之一實施例的畫素感測電路
100e電路圖。第12a圖的畫素感測電路100d包含讀取電路130d。第12b圖的畫素感測電路100e包含讀取電路130e。
Please refer to FIG. 12a and FIG. 12b at the same time. FIG. 12a shows a circuit diagram of a
綜上所述,壓電材料特殊的特性而產生類似於交流訊號的震動訊號,畫素感測電路藉由兩個不同方向的二極體分別獲取震動訊號的最大值及最小值,使讀取電路的輸出電流的大小根據震動訊號的最大值及最小值而改變。使畫素感測電路能夠正確感測超音波訊號等振幅隨著時間而改變的輸入訊號。 To sum up, the special characteristics of piezoelectric materials generate vibration signals similar to AC signals. The pixel sensing circuit uses two diodes in different directions to obtain the maximum and minimum values of the vibration signal, so that it can be read. The output current of the circuit changes according to the maximum and minimum values of the vibration signal. The pixel sensing circuit can correctly sense the input signal whose amplitude changes with time, such as ultrasonic signal.
100‧‧‧畫素感測電路 100‧‧‧Pixel sensing circuit
110‧‧‧壓電材料 110‧‧‧Piezoelectric material
120‧‧‧振幅感測電路 120‧‧‧Amplitude sensing circuit
130‧‧‧讀取電路 130‧‧‧Reading circuit
VBIAS‧‧‧輸入電壓 V BIAS ‧‧‧Input voltage
Claims (10)
Priority Applications (1)
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|---|---|---|---|
| TW108137767A TWI708235B (en) | 2019-10-18 | 2019-10-18 | Pixel sensor circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108137767A TWI708235B (en) | 2019-10-18 | 2019-10-18 | Pixel sensor circuit |
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| TWI708235B true TWI708235B (en) | 2020-10-21 |
| TW202117696A TW202117696A (en) | 2021-05-01 |
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Citations (5)
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|---|---|---|---|---|
| US20150016223A1 (en) * | 2013-07-15 | 2015-01-15 | Qualcomm Incorporated | Sensor array with receiver bias electrode |
| CN106794487A (en) * | 2014-10-15 | 2017-05-31 | 高通股份有限公司 | For the active beam forming technique of piezoelectric ultrasonic transducer array |
| TW201740262A (en) * | 2016-05-02 | 2017-11-16 | 指紋卡公司 | Capacitive fingerprint sensing device and method for capturing a fingerprint using the sensing device |
| CN108140115A (en) * | 2015-10-14 | 2018-06-08 | 高通股份有限公司 | Integrated piezoelectricity micromachined ultrasonic transducer pixel and array |
| WO2019062932A1 (en) * | 2017-09-30 | 2019-04-04 | 苏州迈瑞微电子有限公司 | Fingerprint sensor and driving method therefor |
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| US20150016223A1 (en) * | 2013-07-15 | 2015-01-15 | Qualcomm Incorporated | Sensor array with receiver bias electrode |
| CN106794487A (en) * | 2014-10-15 | 2017-05-31 | 高通股份有限公司 | For the active beam forming technique of piezoelectric ultrasonic transducer array |
| CN108140115A (en) * | 2015-10-14 | 2018-06-08 | 高通股份有限公司 | Integrated piezoelectricity micromachined ultrasonic transducer pixel and array |
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