TWI708213B - Apparatus for detecting error of surface - Google Patents
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- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
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- G—PHYSICS
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Abstract
本發明是用於檢測測量物表面的缺陷的檢測裝置,涉及一種薄膜表面的缺陷檢測裝置,其係通過生成光並將生成的光向測量物表面入射的照明部和獲取通過入射的光而生成的圖案的圖案獲取部來分析所述獲取的圖案,檢測薄膜表面的缺陷,並且,所述照明部的中心軸與所述圖案獲取部的中心軸一致。 The present invention is a detection device for detecting defects on the surface of a measurement object, and relates to a defect detection device on the surface of a thin film, which is generated by generating light and incident the generated light on the surface of the measurement object and acquiring the incident light The pattern acquisition section of the pattern analyzes the acquired pattern and detects defects on the surface of the film, and the central axis of the illumination section is consistent with the central axis of the pattern acquisition section.
Description
本發明涉及薄膜表面的缺陷檢測裝置,尤其,涉及一種向作為檢測物件的測量物照射傾斜照明,以便檢測在所述測量物的表面生成的缺陷的薄膜表面的缺陷檢測裝置。 The present invention relates to a defect detection device for the surface of a thin film, and more particularly, to a defect detection device for irradiating a measurement object as a detection object with oblique illumination to detect defects generated on the surface of the measurement object.
一般而言,在要測量的物體的薄膜表面發生的缺陷的種類有突出、凹陷、刮痕等,以往為了確認上述的缺陷使用了各種缺陷檢測系統。 Generally speaking, the types of defects that occur on the film surface of the object to be measured include protrusions, depressions, scratches, etc. In the past, various defect detection systems have been used to confirm the above-mentioned defects.
上述的檢測系統為了檢測缺陷,在檢測裝置安裝環形照明,從各種角度向物體的表面照射光,以測量缺陷。 In order to detect defects, the above-mentioned inspection system installs ring-shaped illumination in the inspection device, and illuminates the surface of the object from various angles to measure the defects.
但,上述的缺陷檢測可適用於尺寸較大的測量物,但尺寸較小的測量物,由於無法安裝環形照明,而無法使用環形照明。 However, the above-mentioned defect detection can be applied to large-sized measuring objects, but for small-sized measuring objects, ring-shaped illumination cannot be installed because it cannot be installed.
並且,對於表面形成較低的傾斜角度的測量物,由垂直方向入射光線的通常的同軸光學系技術無法檢測其缺陷。 In addition, for the measurement object whose surface forms a low inclination angle, the defects of the normal coaxial optical system technology in which light is incident in the vertical direction cannot be detected.
<先行技術文獻> <Advanced Technical Literature>
<專利文獻> <Patent Literature>
(專利文獻1)韓國公開專利公報公開號第10-2007-0024393號 (Patent Document 1) Korean Patent Publication Publication No. 10-2007-0024393
為了解決上述的問題,本發明提供一種替代用於測量較大尺寸的測量物的薄膜表面的缺陷的環形照明,而具有與所述環形照明相同的效果的照明。 In order to solve the above-mentioned problems, the present invention provides an illumination that has the same effect as the annular illumination instead of the ring illumination used to measure defects on the surface of the thin film of the measurement object of larger size.
從而,本發明提供一種檢測測量物表面的缺陷的檢測裝置,其通過生成光並將所述生成的光向測量物表面入射的照明部和獲取通過所述入射的光生成的圖案的圖案獲取部而分析獲取的圖案,檢測薄膜表面的缺陷,並且,在所述照明部與所述測量物之間,安裝將由所述照明部生成的光進行分離的光分離部,以使由所述照明部生成的光向所述測量物表面入射時能夠傾斜地入射,由此,使得從各種角度入射傾斜光,而能夠看清所述測量物的缺陷。 Therefore, the present invention provides a detection device for detecting defects on the surface of a measurement object, which is provided by an illuminating unit that generates light and makes the generated light incident on the surface of the measurement object and a pattern acquisition portion that acquires a pattern generated by the incident light The obtained pattern is analyzed to detect defects on the surface of the film, and a light separation unit that separates the light generated by the illumination unit is installed between the illumination unit and the measurement object, so that the illumination unit When the generated light is incident on the surface of the measurement object, it can be incident obliquely, so that oblique light is incident from various angles, and defects of the measurement object can be clearly seen.
但,本發明的目的並非局限於上述涉及的目的,本發明的技術領域的技術人員應當理解未涉及的其他目的。 However, the object of the present invention is not limited to the above-mentioned objects, and those skilled in the technical field of the present invention should understand other objects that are not referred to.
為了實現上述目的,本發明作為檢測測量物表面的缺陷的檢測裝置,通過生成光並將所述生成的光向所述測量物表面入射的照明部和獲取通過所述入射的光而生成的圖案的圖案獲取部分析所述獲取的圖案,檢測薄膜表面的缺陷,並且,在所述測量物的上部形成有物鏡。 In order to achieve the above-mentioned object, the present invention is used as a detection device for detecting defects on the surface of a measurement object by generating light and incident the generated light on the surface of the measurement object through an illumination unit and acquiring a pattern generated by the incident light The pattern acquisition section analyzes the acquired pattern to detect defects on the surface of the film, and an objective lens is formed on the upper part of the measurement object.
此時,通過所述圖案獲取部的中心及所述物鏡的中心的垂直中心軸與通過所述照明部的中心的水準中心軸在所述圖案獲取部與所述物鏡之間相遇,還形成有通過所述水準中心軸與所述垂直中心軸相遇的地點而使得反射面傾斜45°地配置的分束器,由所述照明部生成的光通過所述分束器反射,向所述測量物的表面入射,從所述測量物反射的光透過所述分束器向所述圖案獲取部入射。 At this time, the vertical center axis passing through the center of the pattern acquisition section and the center of the objective lens and the horizontal center axis passing through the center of the illumination section meet between the pattern acquisition section and the objective lens, and there is also formed A beam splitter is arranged such that the reflecting surface is inclined at 45° by the point where the horizontal central axis meets the vertical central axis, and the light generated by the illuminating unit is reflected by the beam splitter and directed toward the measurement object The light reflected from the measurement object passes through the beam splitter and enters the pattern acquisition part.
並且,在所述照明部與所述測量物之間形成有光分離部,其將由所述照明部生成的光進行分離,使得由所述照明部生成的光向所述測量物表面入射時能夠傾斜地入射。 In addition, a light separation unit is formed between the illumination unit and the measurement object, which separates the light generated by the illumination unit so that the light generated by the illumination unit can be incident on the surface of the measurement object. Inclined obliquely.
此時,所述光分離部由圓形狹縫片形成,所述圓形狹縫片的中心軸與所述照明部的中心軸一致。 At this time, the light separation part is formed by a circular slit sheet, and the central axis of the circular slit sheet coincides with the central axis of the illuminating part.
並且,在所述圓形狹縫片形成有使得所述照明部的光通過的光通過部,並且,所述光通過部形成於以所述圓形狹縫片的中心軸為基準形成的外周面與內周面之間,所述內周面的內側和所述外周面的外側形成堵塞的結構。 In addition, the circular slit sheet is formed with a light passing portion through which the light of the illuminating part passes, and the light passing portion is formed on an outer periphery formed on the basis of the central axis of the circular slit sheet Between the surface and the inner peripheral surface, the inside of the inner peripheral surface and the outside of the outer peripheral surface form a clogging structure.
並且,通過所述光通過部的光的波前形成具有內周面和外周面的甜甜圈形狀,所述甜甜圈形狀的光通過物鏡向所述測量物的表面入射時,具有所述甜甜圈形狀的光的內周面和外周面的直徑逐漸變小入射,而使得所述甜甜圈形狀的光的成像傾斜地向測量物的表面入射。 In addition, the wavefront of the light passing through the light passing portion forms a donut shape having an inner peripheral surface and an outer peripheral surface, and when the donut-shaped light enters the surface of the measurement object through the objective lens, the The diameter of the inner peripheral surface and the outer peripheral surface of the donut-shaped light gradually decreases and enters, so that the image of the donut-shaped light obliquely enters the surface of the measurement object.
並且,在所述測量物與所述圖案獲取部之間配置有光圈,所述光圈能夠調整使得光通過的光圈口徑。 In addition, an aperture is arranged between the measurement object and the pattern acquisition unit, and the aperture can adjust the aperture diameter through which light passes.
並且,所述照明部由光源和照明透鏡形成,所述圖案獲取部由攝像頭和成像透鏡形成。 In addition, the illumination part is formed by a light source and an illumination lens, and the pattern acquisition part is formed by a camera and an imaging lens.
本發明的特徵及益處將通過如下參照圖式的詳細說明而更加明確。 The features and benefits of the present invention will be more clarified by the following detailed description with reference to the drawings.
並且,在本說明書及權利要去書中使用的術語和詞語不能以詞典性的意義解釋,要立足於發明者為了以最優選的方法說明其自身的發明而可以適當地定義術語的概念的原則,以符合本發明的技術性思想的意義和概念進行解釋。 In addition, the terms and words used in this specification and the entitlement book cannot be interpreted in a lexicographical sense, and must be based on the principle that the inventor can appropriately define the concept of terms in order to explain his own invention in the most preferable way. , To explain in accordance with the meaning and concept of the technical idea of the present invention.
10:物體 10: Object
11:攝像頭 11: camera
12:成像透鏡 12: imaging lens
20:物鏡 20: Objective
30:分束器 30: beam splitter
40:照明 40: lighting
41:照明透鏡 41: Illumination lens
110:圖案獲取部 110: Pattern Acquisition Department
111:攝像頭 111: camera
112:成像透鏡 112: imaging lens
120:物鏡 120: Objective
130:分束器 130: beam splitter
140:光圈 140: Aperture
200:照明部 200: Lighting Department
210:光源 210: light source
220:照明透鏡 220: Illumination lens
230:圓形狹縫片 230: circular slit sheet
231:光分離部 231: Optical separation part
240:光通過部 240: Light Passing Department
241:內周面 241: inner circumference
242:外周面 242: Outer peripheral surface
300:測量物 300: Measured object
CA1:垂直中心軸 CA1: vertical center axis
CA2:水準中心軸 CA2: Horizontal central axis
r1、r2:距離 r1, r2: distance
L1、L2:長度 L1, L2: length
圖1為示出習知的薄膜表面的缺陷檢測裝置之示意圖; 圖2為示出本發明的實施例的檢測裝置之示意圖; 圖3為示出本發明的實施例的檢測裝置之示意圖; 圖4為示出形成於本發明的實施例的檢測裝置的圓形狹縫片之示意圖;且 圖5為示出形成於本發明的實施例的檢測裝置的光圈之示意圖。 Figure 1 is a schematic diagram showing a conventional defect detection device on the surface of a film; Figure 2 is a schematic diagram showing a detection device according to an embodiment of the present invention; Figure 3 is a schematic diagram showing a detection device according to an embodiment of the present invention; 4 is a schematic diagram showing the circular slit sheet formed in the detection device of the embodiment of the present invention; and Fig. 5 is a schematic diagram showing an aperture formed in the detection device of the embodiment of the present invention.
以下,參照附圖說明本發明的優選實施例。該過程中在圖式中圖示的線的厚度或構成要素的大小等可誇張地示出,以便明確便利地說明。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In this process, the thickness of the line or the size of the constituent element illustrated in the drawing can be exaggeratedly shown for clear and convenient explanation.
並且,後述的術語是根據本發明中的功能而定義的術語,其可根據運用者的意圖或慣例而不同。因此,對於上述的術語要基於整篇說明的內容而下定義。 In addition, the terms described later are terms defined according to the functions of the present invention, and they may be different according to the intention or convention of the user. Therefore, the above terms should be defined based on the content of the entire description.
從而,下述的實施例並非限定本發明的申請專利範圍,其只是在本發明的申請專利範圍中提出的構成要素的示例性的事項,包含於在本發明的整篇說明書的技術思想,並包含可置換申請專利範圍的構成要素的均等物的構成要素的實施例,均屬於本發明的申請專利範圍。 Therefore, the following embodiments do not limit the scope of the patent application of the present invention, but are merely exemplary matters of the constituent elements proposed in the scope of the patent application of the present invention, and are included in the technical idea of the entire specification of the present invention, and Examples of constituent elements that include equivalents of constituent elements that can be substituted for the scope of the patent application all belong to the scope of patent application of the present invention.
以下參照圖式詳細說明本發明的優選實施例的薄膜表面的缺陷檢測裝置,但本發明並不限於以下實施例。 The following describes in detail the defect detection device on the film surface of the preferred embodiment of the present invention with reference to the drawings, but the present invention is not limited to the following embodiments.
圖1為示出習知的薄膜表面的缺陷檢測裝置之示意圖;圖2為示出本發明的實施例的檢測裝置之示意圖;圖3為示出本發明的實施例的檢測裝置之示意圖;圖4為示出形成於本發明的實施例的檢測裝置的圓形狹縫片之示意圖;且圖5為示出形成於本發明的實施例的檢測裝置的光圈之示意圖。 Fig. 1 is a schematic diagram showing a conventional defect detection device on a film surface; Fig. 2 is a schematic diagram showing a detection device according to an embodiment of the present invention; Fig. 3 is a schematic diagram showing a detection device according to an embodiment of the present invention; 4 is a schematic diagram showing the circular slit sheet formed in the detection device of the embodiment of the present invention; and FIG. 5 is a schematic diagram showing the aperture formed in the detection device of the embodiment of the present invention.
參照圖1,傳統上使用的表面的缺陷檢測裝置,由攝像頭11、成像透鏡12、分束器30、照明透鏡41、發生光源的照明40及位於物體的上部的物鏡20形成,觀測物體10的表面的缺陷。
1, the conventionally used surface defect detection device is formed by a
但,以往使用的檢測裝置的光源只由垂直方向入射,因此,不宜適合檢測具有較低角度的缺陷。 However, the light source of the detection device used in the past is only incident from the vertical direction, so it is not suitable for detecting defects with a lower angle.
為了解決上述的問題,本發明的薄膜表面的缺陷檢測裝置如下形成。 In order to solve the above-mentioned problems, the defect detection device on the film surface of the present invention is formed as follows.
參照圖2及圖3,作為檢測測量物表面的缺陷的檢測裝置,通過生成光並將生成的光向測量物表面入射的照明部200和獲取通過入射的光而生成的圖案的圖案獲取部110來分析所述獲取的圖案,檢測薄膜表面的缺陷,並且,在所述測量物的上部形成有物鏡。
2 and 3, as a detection device for detecting defects on the surface of a measurement object, an
此時,所述薄膜表面是形成於要檢測的測量物300的表面的薄膜,所述照明部200由光源210和照明透鏡220構成,所述圖案獲取部110由攝像頭111和成像透鏡112構成。
At this time, the film surface is a film formed on the surface of the
並且,通過圖案獲取部110的中心及物鏡120的中心的垂直中心軸CA1與通過照明部200的中心的水準中心軸CA2在圖案獲取部110與物鏡120之間相交。
In addition, a vertical central axis CA1 passing through the center of the
並且,還形成有分束器130,其通過水準中心軸CA2與垂直中心軸CA1相交處,並使得反射面傾斜45°,由照明部200生成的光從分束器130反射,向測量物300的表面入射,從測量物300反射的光透過分束器130,向圖案獲取部110入射。
In addition, a
此時,在照明部200與測量物300之間形成有光分離部231,其將由照明部200生成的光進行分離,以使由照明部200生成的光向測量物300的表面射入時傾斜地射入。
At this time, a
光分離部231由圓形狹縫片230構成,圓形狹縫片230的中心軸與照明部200的中心軸一致。
The
並且,在圓形狹縫片230形成有使得照明部200的光通過的光通過部240,光通過部240位於述圓形狹縫片230的中心軸為基準形成的外周面242與內周面241之間,內周面241的內側與外周面242的外側形成堵塞的結構。
In addition, the
此時,光分離部231的大小可進行調整。
At this time, the size of the
在圖2中形成的光分離部的距離r1和圓形狹縫的長度L1不同於在圖3中圖示的光分離部的距離r2和圓形狹縫的長度L2。 The distance r1 of the light separation part and the length L1 of the circular slit formed in FIG. 2 are different from the distance r2 of the light separation part and the length L2 of the circular slit illustrated in FIG. 3.
此時,光分離部的距離r1、r2根據圓形狹縫片的長度L1、L2而不同,隨著光分離部的距離r1、r2的不同,通過分束器130反射向物鏡120入射的光的傾斜度不同。
At this time, the distances r1 and r2 of the light splitting part differ according to the lengths L1 and L2 of the circular slit sheet. With the difference in the distances r1 and r2 of the light splitting part, the light incident on the
從而,通過調整光分離部231的距離長度,使得通過照明透鏡220而述測量物300入射的光源的角度不同地形成,而能夠從各種角度觀察所述薄膜表面,以準確地測定形成於表面的缺陷。
Therefore, by adjusting the distance length of the
並且,如果從所述薄膜表面的缺陷檢測裝置去除圓形狹縫片230,可以同軸照明使用,如果形成有圓形狹縫片230,可以傾斜照明使用,而根據需要以同軸照明或傾斜照明使用。
In addition, if the
參照圖4,通過光通過部240的光的波前形成具有內周面241和外周面242的甜甜圈形狀,所述甜甜圈形狀的光在通過物鏡120向測量物300的表面
射入時,具有所述甜甜圈形狀的光的內周面241和外周面242的直徑逐漸縮小入射,而使得所述甜甜圈形狀的光的成像向測量物300的表面傾斜地入射。
4, the wavefront of the light passing through the
並且,通過調整光分離部231的距離長度,所述內周面241及外周面242的大小發生變換,而能夠調整通過光通過部240的光源的量。
In addition, by adjusting the distance length of the
並且,在測量物300與圖案獲取部110之間配置光圈140,光圈140能夠調整通過光的光圈140口徑。
In addition, an
參照圖5,通過調整光圈140的大小,而變更焦深,由此,能夠調整使得物體模糊或鮮明。
5, by adjusting the size of the
此時,光圈140的大小越小,焦深越深。
At this time, the smaller the size of the
由此,通過本發明的薄膜表面的缺陷檢測裝置,調整光圈140和傾斜角的大小及角度,而能夠更加準確細緻地檢測形成於所述測量物的表面的缺陷。
Thus, by adjusting the size and angle of the
以上通過詳細的實施例詳細說明了本發明,但,其只是為了詳細地說明本發明,本發明並不限於此,本發明所屬技術領域中具有通常知識者在本發明的技術思想的範圍內可對其進行變更或改良。 The present invention has been explained in detail through detailed embodiments above, but it is only for explaining the present invention in detail, and the present invention is not limited thereto. Those with ordinary knowledge in the technical field to which the present invention belongs can be within the scope of the technical idea of the present invention. Change or improve it.
本發明的單純的變形至變更均屬於本發明的範疇,本發明的詳細的保護範圍通過參照所附的申請專利範圍而更加明確。 Simple modifications to changes of the present invention belong to the scope of the present invention, and the detailed protection scope of the present invention will be more clarified by referring to the appended patent scope.
根據如上述的本發明,具有如下效果:在檢測形成於測量物表面的缺陷時,使得從照明部生成的光傾斜地入射,而能夠檢測形成於測量物表面的缺陷。 According to the present invention as described above, there is an effect that when detecting a defect formed on the surface of the measurement object, the light generated from the illuminating unit is incident obliquely, and the defect formed on the surface of the measurement object can be detected.
並且,能夠自由地調整從照明部生成的光傾斜地向測量物入射的光分離部的長度,從而,能夠以各種角度入射光。 In addition, it is possible to freely adjust the length of the light separation portion in which the light generated from the illuminating unit obliquely enters the measurement object, so that the light can be incident at various angles.
並且,還形成有根據大小使得焦深發生變換的光圈,而能夠調整物體模糊或清晰,調整光圈和傾斜角的大小及角度,而能夠更清楚細密地檢測形成於測量物表面的缺陷。 In addition, an aperture that changes the depth of focus according to the size is also formed, so that the blur or sharpness of the object can be adjusted, the size and angle of the aperture and the tilt angle can be adjusted, and the defects formed on the surface of the measurement object can be detected more clearly and precisely.
110:圖案獲取部 110: Pattern Acquisition Department
111:攝像頭 111: camera
112:成像透鏡 112: imaging lens
120:物鏡 120: Objective
130:分束器 130: beam splitter
140:光圈 140: Aperture
200:照明部 200: Lighting Department
210:光源 210: light source
220:照明透鏡 220: Illumination lens
230:圓形狹縫片 230: circular slit sheet
231:光分離部 231: Optical separation part
300:測量物 300: Measured object
CA1:垂直中心軸 CA1: vertical center axis
CA2:水準中心軸 CA2: Horizontal central axis
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| CN110508499B (en) * | 2019-08-29 | 2021-08-13 | 江苏盛矽电子科技有限公司 | Automatic separation type silk screen printing plate detection device and detection method thereof |
| KR102741984B1 (en) * | 2022-02-07 | 2024-12-13 | 한국표준과학연구원 | Reflective Fourier ptychographic microscopy using flexible LED array |
| KR20250079620A (en) | 2023-11-27 | 2025-06-04 | 성균관대학교산학협력단 | Method and device for detecting of film defect, film inspection system including the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8040502B2 (en) * | 2004-09-17 | 2011-10-18 | Wdi Wise Device Inc. | Optical inspection of flat media using direct image technology |
| US8248592B2 (en) * | 2007-12-19 | 2012-08-21 | Hitachi High-Technologies Corporation | Defect inspection system |
| TW201428274A (en) * | 2012-09-28 | 2014-07-16 | Rudolph Technologies Inc | Inspection of substrates using calibration and imaging |
| TW201546442A (en) * | 2014-03-17 | 2015-12-16 | Kla Tencor Corp | Image sensor, detection system and method for detecting object |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62179642A (en) * | 1986-01-31 | 1987-08-06 | Kobe Steel Ltd | Surface defect detector |
| US5581346A (en) * | 1993-05-10 | 1996-12-03 | Midwest Research Institute | System for characterizing semiconductor materials and photovoltaic device |
| US5447810A (en) * | 1994-02-09 | 1995-09-05 | Microunity Systems Engineering, Inc. | Masks for improved lithographic patterning for off-axis illumination lithography |
| US6738201B2 (en) * | 2001-03-30 | 2004-05-18 | Intel Corporation | Combined on-axis and off-axis illumination |
| US6927847B2 (en) * | 2001-09-13 | 2005-08-09 | Hitachi High-Technologies Corporation | Method and apparatus for inspecting pattern defects |
| JP2004101406A (en) * | 2002-09-11 | 2004-04-02 | Tokyo Seimitsu Co Ltd | Visual inspection device |
| JP2004233163A (en) * | 2003-01-29 | 2004-08-19 | Hitachi High-Technologies Corp | Pattern defect inspection method and apparatus |
| JP4480009B2 (en) * | 2004-12-06 | 2010-06-16 | Hoya株式会社 | Defect inspection apparatus and method, and photomask manufacturing method |
| JP2006258472A (en) * | 2005-03-15 | 2006-09-28 | Nikon Corp | Defect inspection equipment |
| KR100663323B1 (en) | 2005-11-07 | 2007-01-02 | (주) 인텍플러스 | 3D shape measuring device and 3D shape measuring method using the same |
| WO2008015973A1 (en) * | 2006-08-02 | 2008-02-07 | Nikon Corporation | Defect detecting apparatus and defect detecting method |
| JP5332632B2 (en) | 2009-01-16 | 2013-11-06 | 株式会社日立製作所 | Spectroscopic detection method and apparatus, and defect inspection method and apparatus using the same |
| CN101953676B (en) * | 2010-08-22 | 2012-10-03 | 中山联合光电科技有限公司 | High-resolution coaxial illumination retina imaging optical system |
| KR101246958B1 (en) * | 2011-05-20 | 2013-03-25 | 주식회사 에이치비테크놀러지 | Specimen inspecting apparatus using multi-line senser camera and multi-light |
| KR101245097B1 (en) * | 2011-07-25 | 2013-03-25 | 에스엔유 프리시젼 주식회사 | Device for measuring thickness of thin film |
-
2017
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-
2018
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8040502B2 (en) * | 2004-09-17 | 2011-10-18 | Wdi Wise Device Inc. | Optical inspection of flat media using direct image technology |
| US8248592B2 (en) * | 2007-12-19 | 2012-08-21 | Hitachi High-Technologies Corporation | Defect inspection system |
| TW201428274A (en) * | 2012-09-28 | 2014-07-16 | Rudolph Technologies Inc | Inspection of substrates using calibration and imaging |
| TW201546442A (en) * | 2014-03-17 | 2015-12-16 | Kla Tencor Corp | Image sensor, detection system and method for detecting object |
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