TWI707364B - Memory storage apparatus and an operating method thereof - Google Patents
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Description
本發明是有關於一種電子裝置及其操作方法,且特別是有關於一種記憶體儲存裝置及其操作方法。The present invention relates to an electronic device and an operation method thereof, and particularly relates to a memory storage device and an operation method thereof.
記憶體儲存裝置,例如非揮發性記憶體,其與記憶體控制器之間的訊號傳輸介面主要是以時脈為基礎(clock-based)來進行訊號傳遞的操作。因此,利用時脈的依賴性(clock dependency) 記憶體儲存裝置可與記憶體控制器之間訊號傳遞操作更加協調。並且,為了降低成本,晶片封裝的腳位數較少(less pin count),記憶體儲存裝置也需要以時脈為基礎與控制器進行訊號傳遞操作。For memory storage devices, such as non-volatile memory, the signal transmission interface between the memory controller and the memory controller is mainly clock-based for signal transmission. Therefore, the signal transfer operation between the memory storage device and the memory controller can be more coordinated by using the clock dependency. In addition, in order to reduce costs, the chip package has a less pin count, and the memory storage device also needs to perform signal transmission operations with the controller based on the clock pulse.
隨著記憶體儲存裝置的發展與使用者需求,時脈速度(clock rate)也愈來愈快。然而,記憶體儲存裝置的讀取速度若無法相對地提昇,將會使得時脈速度的發展遭遇瓶頸。在現有技術中,為了完成讀取操作必須花費較多的時間來對位元線進行預充電操作,因此,讀取速度無法提昇,從而限制了時脈速度。With the development of memory storage devices and user requirements, the clock rate is getting faster and faster. However, if the reading speed of the memory storage device cannot be increased relatively, the development of the clock speed will encounter a bottleneck. In the prior art, in order to complete the read operation, it takes more time to precharge the bit line. Therefore, the read speed cannot be increased, thereby limiting the clock speed.
本發明提供一種記憶體儲存裝置以及記憶體儲存裝置的操作方法,其讀取速度快,可操作在較高的時脈速度。The present invention provides a memory storage device and an operating method of the memory storage device, which have a fast reading speed and can be operated at a higher clock speed.
本發明的記憶體儲存裝置包括多條字元線、多條位元線、記憶體晶胞陣列(cell array)以及記憶體控制器。記憶體晶胞陣列包括多個記憶體晶胞。記憶體晶胞用以儲存資料。各記憶體晶胞耦接至對應的字元線以及位元線。記憶體控制器用以對記憶體晶胞陣列進行讀取操作。在記憶體控制器致能字元線之同時,記憶體控制器對位元線的一部分或全部的位元線進行預充電操作。The memory storage device of the present invention includes a plurality of word lines, a plurality of bit lines, a memory cell array and a memory controller. The memory cell array includes a plurality of memory cells. The memory cell is used to store data. Each memory cell is coupled to the corresponding word line and bit line. The memory controller is used for reading the memory cell array. While the memory controller enables the word lines, the memory controller performs a precharge operation on part or all of the bit lines.
本發明的記憶體儲存裝置的操作方法包括:接收並解碼區段訊號,以對記憶體晶胞陣列當中的區段進行讀取操作;以及致能字元線,並且在致能字元線之同時,對位元線的一部分或全部的位元線進行預充電操作。The operating method of the memory storage device of the present invention includes: receiving and decoding segment signals to perform read operations on the segments in the memory cell array; and enabling word lines, and between the enabling word lines At the same time, a precharge operation is performed on a part or all of the bit lines.
基於上述,在本發明的示範實施例中,在記憶體控制器致能字元線之同時,記憶體控制器對一部分或全部的位元線進行預充電操作,以加快記憶體儲存裝置的讀取速度。Based on the above, in the exemplary embodiment of the present invention, while the memory controller enables the word lines, the memory controller precharges part or all of the bit lines to speed up the reading of the memory storage device. Take the speed.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
以下提出多個實施例來說明本發明,然而本發明不僅限於所例示的多個實施例。又實施例之間也允許有適當的結合。在本申請說明書全文(包括申請專利範圍)中所使用的「耦接」一詞可指任何直接或間接的連接手段。舉例而言,若文中描述第一裝置耦接於第二裝置,則應該被解釋成該第一裝置可以直接連接於該第二裝置,或者該第一裝置可以透過其他裝置或某種連接手段而間接地連接至該第二裝置。此外,「訊號」一詞可指至少一電流、電壓、電荷、溫度、資料、電磁波或任何其他一或多個訊號。Several embodiments are presented below to illustrate the present invention, but the present invention is not limited to the exemplified embodiments. The embodiments also allow proper combination. The term "coupled" used in the entire specification of this application (including the scope of the patent application) can refer to any direct or indirect connection means. For example, if the text describes that the first device is coupled to the second device, it should be interpreted as that the first device can be directly connected to the second device, or the first device can be connected through other devices or some kind of connection means. Indirectly connected to the second device. In addition, the term "signal" can refer to at least one current, voltage, charge, temperature, data, electromagnetic wave or any other one or more signals.
圖1繪示本發明一實施例之記憶體儲存裝置的概要示意圖。圖2繪示圖1實施例之位元線與通道閘門電晶體之組合的概要電路圖,其包括多個預充電路徑。請參考圖1及圖2,本實施例之記憶體儲存裝置100包括多條字元線WL、多條位元線BL、記憶體晶胞陣列110、記憶體控制器120、字元線解碼器130以及位元線解碼器140。在本實施例中,記憶體晶胞陣列110包括多個記憶體晶胞112。記憶體晶胞112用以儲存資料。各記憶體晶胞112耦接至對應的字元線WL以及位元線BL。記憶體控制器120用以對記憶體晶胞陣列110進行讀取操作。在本實施例中,記憶體控制器120接收並解碼區段訊號S,以據此選取記憶體晶胞陣列110中的目標區段(sector),以進行讀取操作。FIG. 1 is a schematic diagram of a memory storage device according to an embodiment of the invention. 2 is a schematic circuit diagram of the combination of the bit line and the channel gate transistor of the embodiment of FIG. 1, which includes a plurality of precharge paths. 1 and 2, the memory storage device 100 of this embodiment includes a plurality of word lines WL, a plurality of bit lines BL, a
在本實施例中,記憶體儲存裝置100可包括其他用來協同控制資料存取之適合的電路,例如區段解碼器以及感測放大器電路等。在本實施例中,記憶體儲存裝置100當中的各種電路可分別由所屬技術領域的任一種適合的電路結構來加以實施,本發明並不加以限制,其電路結構及操作方法可以由所屬技術領域的通常知識獲致足夠的教示、建議與實施說明。In this embodiment, the memory storage device 100 may include other suitable circuits for cooperatively controlling data access, such as a segment decoder and a sense amplifier circuit. In this embodiment, the various circuits in the memory storage device 100 can be implemented by any suitable circuit structure in the technical field. The present invention is not limited. The circuit structure and operation method can be implemented by the technical field. The general knowledge of the students is sufficient to teach, suggest and implement.
一般而言,在記憶體控制器120對記憶體晶胞陣列110進行讀取操作時,通常可以區分成多個階段,例如包括指令輸入、字元線位址輸入以及位元線位址輸入等階段。在記憶體控制器120對記憶體晶胞陣列110進行讀取操作之後,儲存在記憶體晶胞112中的資料可依序被讀出。位元線位址輸入的階段通常包括預充電操作、感測操作以及資料輸出操作。Generally speaking, when the
請參考圖2,在本實施例中,在記憶體控制器120對記憶體晶胞陣列110進行預充電操作時,記憶體控制器120控制位元線解碼器140對位元線位址訊號YSC<3:0>、YSB<3:0>及YSA<3:0>進行解碼,以選取目標位元線進行預充電操作。在本實施例中,位元線包括多條區域(local)位元線LBL以及多條全域(global)位元線GBL。資料線包括多條區域資料線LDL以及多條全域資料線GDL。在各位元線及資料線上設置有通道閘門電晶體200。在本實施例中,記憶體控制器120例如是以分層(hierarchical)的方式來選擇導通或不導通通道閘門電晶體200,以選擇要預充電的目標位元線。舉例而言,在本實施例中,位元線位址訊號YSC<3:0>、YSB<3:0>及YSA<3:0>例如依序被解碼。因此,受控於位元線位址訊號YSC<3:0>的通道閘門電晶體(例如位元線位址訊號YSC[0]控制的電晶體)可能導通或不導通。接著,受控於位元線位址訊號YSB<3:0>的通道閘門電晶體(例如位元線位址訊號YSB[0]、YSB[1]、YSB[2]、YSB[3]控制的電晶體)可能導通或不導通。繼之,受控於位元線位址訊號YSA<3:0>的通道閘門電晶體(例如位元線位址訊號YSA[0]、YSA[1]、YSA[2]、YSA[3]控制的電晶體)可能導通或不導通。因此,藉由上述解碼次序,對應的通道閘門電晶體會被導通,從而包括全域資料線GDL、區域資料線LDL、全域位元線GBL以及區域位元線LBL的預充電路徑可被建立,並且要預充電的目標位元線可被選取。目標位元線例如是區域位元線LBL當中的任一個。在一實施例中,另一種分層方式例如是位元線位址訊號YSA<3:0>、YSB<3:0>及YSC<3:0>依序被解碼。因此,通道閘門電晶體200從區域位元線LBL、全域位元線GBL以及區域資料線LDL依序被導通,從而建立預充電路徑。在預充電路徑建立後,目標位元線被充電。因此,在進行資料讀取時,晶胞電流可在感測放大器電路(未繪示)的輸入端建立預設的電壓,以與參考電壓進行比較,從而感測放大器電路可判斷出晶胞所儲存的資料是位元0或位元1。Please refer to FIG. 2, in this embodiment, when the
在圖1及圖2中,字元線、位元線、資料線、記憶體晶胞以及通道閘門電晶體的數量及其設置方式僅用以例示說明並不用以限定本發明。In FIG. 1 and FIG. 2, the number of word lines, bit lines, data lines, memory cells, and channel gate transistors and their arrangement manners are only used for illustration and not to limit the present invention.
一般而言,無論採用哪一種分層方式,在對位元線位址訊號進行解碼時,預充電操作都會占用相當多的時間,從而限制了記憶體儲存裝置100的讀取速度。因此,在本實施例中,在記憶體控制器120致能字元線WL之同時,或者在記憶體控制器120對區段訊號進行解碼之同時,記憶體控制器120對位元線的一部分或全部的位元線先進行預充電操作,以減少在對位元線位址訊號進行解碼時位元線的預充電時間,從而提高記憶體儲存裝置100的讀取速度。以下將舉多個示範實施例來說明本發明的記憶體儲存裝置的操作方法。Generally speaking, no matter which layering method is adopted, the precharging operation will take a lot of time when decoding the bit line address signal, which limits the reading speed of the memory storage device 100. Therefore, in the present embodiment, while the
圖3繪示本發明一實施例之記憶體儲存裝置在進行讀取操作時各訊號的時序示意圖。請參考圖1至圖3,圖3繪示的訊號包括時脈訊號CLK、輸入訊號DI以及輸出訊號DO。在本實施例中,記憶體控制器120接收到讀取指令以對記憶體晶胞陣列110進行讀取操作。3 is a schematic diagram showing the timing of each signal during a read operation of the memory storage device according to an embodiment of the present invention. Please refer to FIGS. 1 to 3. The signals shown in FIG. 3 include a clock signal CLK, an input signal DI, and an output signal DO. In this embodiment, the
在本實施例中,在解碼期間T1,記憶體控制器120對區段訊號S (例如包括區段位址Aa、Ab)進行解碼以取得目標區段的位址,從而選取記憶體晶胞陣列110中要進行讀取操作的目標區段。在解碼期間T2,記憶體控制器120控制字元線解碼器130對字元線位址Ac、Ad進行解碼以選取目標字元線。解碼期間T3包括解碼期間T4、T5。在解碼期間T4,記憶體控制器120控制位元線解碼器140對位元線位址Ae、Af進行解碼以選取目標位元線。在解碼期間T5,記憶體控制器120對感測器位址Ag進行解碼以選取目標感測器來感測晶胞電流,以判斷晶胞所儲存的資料位元狀態。In this embodiment, during the decoding period T1, the
在本實施例中,記憶體控制器120在起始時點t_Y-Line開始對全部的位元線進行預充電操作,並且在解碼期間T2結束之時,完成預充電操作,因此第一預充電期間tPRE_1包括解碼期間T1、T2。換句話說,在本實施例中,記憶體控制器120在對區段訊號S進行解碼之同時以及在致能字元線WL之同時,同時對區域位元線LBL、全域位元線GBL、區域資料線LDL以及全域資料線GDL進行預充電操作。接著,在第二預充電期間tPRE_2,依據位元線位址Ae、Af的解碼結果,未被選擇的位元線及資料線被放電,並且選擇的位元線(例如目標區域位元線)的電壓在感測期間之前被保持且被驅動。因此,在解碼期間T1、T2先對全部的位元線進行預充電操作,相較現有技術,可減少第二預充電期間tPRE_2的時間長度,加快讀取速度。In this embodiment, the
在本實施例中,記憶體控制器120在對區段訊號S進行解碼之同時以及在致能字元線WL之同時,是同時對全部的位元線進行預充電操作,惟本發明並不限於此。在一實施例中,在第一預充電期間tPRE_1,記憶體控制器120例如對一部份的位元線進行預充電操作。舉例而言,記憶體控制器120在對區段訊號S進行解碼之同時以及在致能字元線WL之同時,同時對全域位元線GBL、區域資料線LDL以及全域資料線GDL進行預充電。也就是說,除了區域位元線LBL之外,全域位元線GBL、區域資料線LDL以及全域資料線GDL在第一預充電期間tPRE_1都被預充電。因此,在解碼期間T1、T2先對除了區域位元線LBL之外的一部份的位元線進行預充電操作,相較現有技術,可減少第二預充電期間tPRE_2的時間長度,加快讀取速度。In this embodiment, the
圖4繪示本發明另一實施例之記憶體儲存裝置在進行讀取操作時各訊號的時序示意圖。請參考圖1、圖2及圖4,本實施例之預充電操作方法類似於圖3實施例的預充電操作方法,惟兩者之間主要的差異例如在於,記憶體控制器120在致能字元線WL之同時對全部的位元線進行預充電操作。4 is a schematic diagram showing the timing of each signal during a read operation of the memory storage device according to another embodiment of the present invention. Please refer to FIG. 1, FIG. 2 and FIG. 4. The precharge operation method of this embodiment is similar to the precharge operation method of the embodiment of FIG. 3, but the main difference between the two is that, for example, the
具體而言,在本實施例中,記憶體控制器120在起始時點t_Y-Line開始對全部的位元線進行預充電操作,並且在解碼期間T2結束時,完成預充電操作,因此第一預充電期間tPRE_1包括解碼期間T2。換句話說,在本實施例中,記憶體控制器120在致能字元線WL之同時,同時對區域位元線LBL、全域位元線GBL、區域資料線LDL以及全域資料線GDL進行預充電操作。接著,在第二預充電期間tPRE_2,依據位元線位址Ae、Af的解碼結果,未被選擇的位元線及資料線被放電,並且選擇的位元線(例如目標區域位元線)的電壓在感測期間之前被保持且被驅動。因此,在致能字元線WL之同時(解碼期間T2)先對全部的位元線進行預充電操作,相較現有技術,可減少第二預充電期間tPRE_2的時間長度,加快讀取速度。Specifically, in this embodiment, the
在本實施例中,記憶體控制器120在致能字元線WL之同時,是同時對全部的位元線進行預充電操作,惟本發明並不限於此。在一實施例中,在第一預充電期間tPRE_1,記憶體控制器120例如對一部份的位元線進行預充電操作。舉例而言,記憶體控制器120在致能字元線WL之同時,同時對全域位元線GBL、區域資料線LDL以及全域資料線GDL進行預充電。也就是說,除了區域位元線LBL之外,全域位元線GBL、區域資料線LDL以及全域資料線GDL在第一預充電期間tPRE_1都被預充電。因此,在致能字元線WL之同時(解碼期間T2)先對除了區域位元線LBL之外的一部份的位元線進行預充電操作,相較現有技術,可減少第二預充電期間tPRE_2的時間長度,加快讀取速度。In this embodiment, the
圖5繪示本發明另一實施例之記憶體儲存裝置在進行讀取操作時各訊號的時序示意圖。請參考圖1、圖2及圖5,在本實施例中,除了區域位元線LBL之外,全域位元線GBL、區域資料線LDL以及全域資料線GDL在解碼期間T1、T2都被預充電。並且,在解碼期間T2,區域位元線LBL被隔離。舉例而言,在本實施例中,在致能字元線WL之同時(解碼期間T2),受控於位元線位址訊號YSA<3:0>的通道閘門電晶體例如不導通,以將區域位元線LBL與全域位元線GBL等訊號線隔離。接著,在第三預充電期間tPRE_3,未被選擇的位元線及資料線被放電,並且在第四預充電期間tPRE_4,選擇的位元線(例如目標區域位元線)被預充電。5 is a schematic diagram showing the timing of each signal during a read operation of the memory storage device according to another embodiment of the present invention. Please refer to FIG. 1, FIG. 2 and FIG. 5. In this embodiment, in addition to the regional bit line LBL, the global bit line GBL, the regional data line LDL, and the global data line GDL are all preset during the decoding period T1 and T2. Recharge. In addition, during the decoding period T2, the local bit line LBL is isolated. For example, in this embodiment, at the same time that the word line WL is enabled (decoding period T2), the channel gate transistor controlled by the bit line address signal YSA<3:0> is for example not conducting, so that Isolate the regional bit line LBL from the global bit line GBL and other signal lines. Then, in the third precharge period tPRE_3, the unselected bit lines and data lines are discharged, and in the fourth precharge period tPRE_4, the selected bit lines (for example, the target area bit lines) are precharged.
因此,在本實施例中,在解碼期間T1、T2先對除了區域位元線LBL之外的一部份的位元線進行預充電操作,相較現有技術,可減少第三預充電期間tPRE_3與第四預充電期間tPRE_4的時間長度的總和,加快讀取速度。Therefore, in this embodiment, during the decoding periods T1 and T2, a part of the bit lines except for the regional bit line LBL is precharged. Compared with the prior art, the third precharge period tPRE_3 can be reduced. The sum of the time length of the fourth pre-charge period tPRE_4 speeds up the reading speed.
圖6繪示本發明另一實施例之記憶體儲存裝置在進行讀取操作時各訊號的時序示意圖。請參考圖1、圖2及圖6,本實施例之預充電操作方法類似於圖5實施例的預充電操作方法,惟兩者之間主要的差異例如在於,記憶體控制器120在第一預充電期間tPRE_1對一部份的位元線進行預充電操作。並且,在本實施例中,第一預充電期間tPRE_1包括解碼期間T1及與其鄰接的一部分的解碼期間T2。6 is a schematic diagram showing the timing of each signal during a read operation of the memory storage device according to another embodiment of the present invention. Please refer to FIG. 1, FIG. 2 and FIG. 6, the precharge operation method of this embodiment is similar to the precharge operation method of the embodiment of FIG. 5, but the main difference between the two is that the
具體而言,在本實施例中,除了區域位元線LBL之外,全域位元線GBL、區域資料線LDL以及全域資料線GDL在第一預充電期間tPRE_1都被預充電。並且,在第二預充電期間tPRE_2,區域位元線LBL被隔離。其中,第二預充電期間tPRE_2包括另一部分的解碼期間T2。舉例而言,在本實施例中,在致能字元線WL之同時(第二預充電期間tPRE_2),受控於位元線位址訊號YSA<3:0>的通道閘門電晶體例如不導通,以將區域位元線LBL與全域位元線GBL等訊號線隔離。接著,在第三預充電期間tPRE_3,未被選擇的位元線及資料線被放電,並且在第四預充電期間tPRE_4,選擇的位元線(例如目標區域位元線)被預充電。Specifically, in this embodiment, in addition to the regional bit line LBL, the global bit line GBL, the regional data line LDL, and the global data line GDL are all precharged during the first precharge period tPRE_1. In addition, during the second precharge period tPRE_2, the regional bit line LBL is isolated. The second precharge period tPRE_2 includes another part of the decoding period T2. For example, in this embodiment, while the word line WL is enabled (the second precharge period tPRE_2), the channel gate transistor controlled by the bit line address signal YSA<3:0> is not Turn on to isolate signal lines such as the regional bit line LBL from the global bit line GBL. Then, in the third precharge period tPRE_3, the unselected bit lines and data lines are discharged, and in the fourth precharge period tPRE_4, the selected bit lines (for example, the target area bit lines) are precharged.
因此,在本實施例中,在第一預充電期間tPRE_1先對除了區域位元線LBL之外的一部份的位元線進行預充電操作,相較現有技術,可減少第三預充電期間tPRE_3與第四預充電期間tPRE_4的時間長度的總和,加快讀取速度。Therefore, in this embodiment, during the first precharge period tPRE_1, a part of the bit lines except the local bit line LBL is precharged. Compared with the prior art, the third precharge period can be reduced. The sum of the time length of tPRE_3 and the fourth precharge period tPRE_4, speeds up the reading speed.
圖7繪示本發明一實施例之預充電電路的概要示意圖。請參考圖2及圖7,在本實施例中,預充電電路700包括多個通道閘門電晶體電路710_1、710_2至710_N、多個感測放大器電路720_1、720_2至720_N以及預充電電晶體電路730,其中N為大於2的正整數。在本實施例中,每一通道閘門電晶體電路受控於位址訊號YSA、YSB、YSC,並且包括多個通道閘門電晶體200。當通道閘門電晶體電路中的電晶體被導通時,可建立預充電路徑,因此,晶胞電流可從預充電路徑流至對應的區域位元線。FIG. 7 is a schematic diagram of a precharge circuit according to an embodiment of the invention. 2 and 7, in this embodiment, the
在本實施例中,預充電電晶體電路730包括第一電晶體731以及第二電晶體732。第一電晶體731的第一端耦接至系統電壓VCC。第一電晶體731的第二端耦接至第二電晶體732的第二端。第一電晶體731的控制端耦接至預充電訊號Vpre。第二電晶體732的第二端耦接至對應的通道閘門電晶體電路。第二電晶體732的控制端耦接至電壓訊號。在本實施例中,在解碼期間T3,預充電訊號Vpre用來截止(cut off)預充電路徑。電壓訊號Vb為一特定的電壓用來將第二電晶體732的源極端限制到位元線的充電電位。在一實施例中,預充電電晶體電路730也可實施在感測放大器電路當中,本發明並不加以限制。In this embodiment, the
圖8繪示本發明一實施例之記憶體儲存裝置的操作方法的步驟流程圖。請參考圖1、圖2及圖8,本實施例之記憶體儲存裝置的操作方法至少適用於圖1、圖2的記憶體儲存裝置100,惟本發明並不加以限制。以圖1、圖2的記憶體儲存裝置100為例,在步驟S100中,記憶體儲存裝置100接收並解碼區段訊號S,以對記憶體晶胞陣列110當中的目標區段進行讀取操作。在步驟S110中,記憶體儲存裝置100致能字元線WL,並且在致能字元線WL之同時,對一部分或全部的位元線進行預充電操作。另外,本發明之實施例的記憶體儲存裝置的操作方法可以由圖1至圖7實施例之敘述中獲致足夠的教示、建議與實施說明,因此不再贅述。FIG. 8 shows a flowchart of steps of a method of operating a memory storage device according to an embodiment of the present invention. Please refer to FIG. 1, FIG. 2 and FIG. 8. The operation method of the memory storage device of this embodiment is at least applicable to the memory storage device 100 of FIG. 1 and FIG. 2, but the present invention is not limited. Taking the memory storage device 100 of FIGS. 1 and 2 as an example, in step S100, the memory storage device 100 receives and decodes the segment signal S to perform a read operation on the target segment in the
綜上所述,在本發明的示範實施例中,記憶體控制器在致能字元線之同時及/或在解碼區段訊號之同時,會同時對一部分或全部的位元線、資料線進行預充電操作,以加快記憶體儲存裝置的讀取速度。To sum up, in the exemplary embodiment of the present invention, the memory controller will simultaneously activate part or all of the bit lines and data lines while enabling the word lines and/or while decoding the segment signals. Perform a pre-charge operation to speed up the reading speed of the memory storage device.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.
100‧‧‧記憶體儲存裝置110‧‧‧記憶體晶胞陣列120‧‧‧記憶體控制器130‧‧‧字元線解碼器140‧‧‧位元線解碼器200‧‧‧通道閘門電晶體700‧‧‧預充電電路710_1、710_2、710_N‧‧‧通道閘門電晶體電路720_1、720_2、720_N‧‧‧感測放大器電路730‧‧‧預充電電晶體電路731、732‧‧‧電晶體WL‧‧‧字元線BL‧‧‧位元線LBL‧‧‧區域位元線GBL‧‧‧全域位元線LDL‧‧‧區域資料線GDL‧‧‧全域資料線S‧‧‧區段訊號YSA、YSA<3 0>、YSA[0]、YSA[1]、YSA[2]、YSA[3]、YSB、YSB<3 0>、YSB[0]、YSB[1]、YSB[2]、YSB[3]、YSC、YSC<3 0>、YSC[0]‧‧‧位元線位址訊號CLK‧‧‧時脈訊號DI‧‧‧輸入訊號DO‧‧‧輸出訊號D0、D1、D2‧‧‧輸出資料Vb‧‧‧電壓訊號Vpre‧‧‧預充電訊號Vref‧‧‧參考電壓VCC‧‧‧系統電壓Aa、Ab‧‧‧區段位址Ac、Ad‧‧‧字元線位址Ae、Af‧‧‧位元線位址Ag‧‧‧感測器位址t_Y-Line‧‧‧起始時點100‧‧‧Memory storage device 110‧‧‧Memory cell array 120‧‧‧Memory controller 130‧‧‧Character line decoder 140‧‧‧Bitline decoder 200‧‧‧Channel gate Crystal 700‧‧‧Precharge circuit 710_1, 710_2, 710_N‧‧‧Channel gate transistor circuit 720_1, 720_2, 720_N‧‧‧Sense amplifier circuit 730‧‧‧Precharge transistor circuit 731,732‧‧‧Transistor WL‧‧‧Character line BL‧‧‧Bit line LBL‧‧‧Regional bit line GBL‧‧‧Global bit line LDL‧‧‧Regional data line GDL‧‧‧Global data line S‧‧‧Segment Signal YSA, YSA<3 0>, YSA[0], YSA[1], YSA[2], YSA[3], YSB, YSB<3 0>, YSB[0], YSB[1], YSB[2 ], YSB[3], YSC, YSC<3 0>, YSC[0]‧‧‧Bit line address signal CLK‧‧‧Clock signal DI‧‧‧Input signal DO‧‧‧Output signal D0, D1 ,D2‧‧‧Output data Vb‧‧‧Voltage signal Vpre‧‧‧Precharge signal Vref‧‧‧Reference voltage VCC‧‧‧System voltage Aa, Ab‧‧‧Segment address Ac, Ad‧‧‧Character line Address Ae, Af‧‧‧Bit line address Ag‧‧‧Sensor address t_Y-Line‧‧‧Start time
T1、T2、T3、T4、T5:解碼期間 T1, T2, T3, T4, T5: during decoding
tPRE_1:第一預充電期間 tPRE_1: The first precharge period
tPRE_2:第二預充電期間 tPRE_2: The second precharge period
tPRE_3:第三預充電期間 tPRE_3: The third precharge period
tPRE_4:第四預充電期間 tPRE_4: The fourth precharge period
S100、S110:方法步驟 S100, S110: method steps
圖1繪示本發明一實施例之記憶體儲存裝置的概要示意圖。 圖2繪示圖1實施例之位元線與通道閘門電晶體之組合的概要電路圖。 圖3繪示本發明一實施例之記憶體儲存裝置在進行讀取操作時各訊號的時序示意圖。 圖4繪示本發明另一實施例之記憶體儲存裝置在進行讀取操作時各訊號的時序示意圖。 圖5繪示本發明另一實施例之記憶體儲存裝置在進行讀取操作時各訊號的時序示意圖。 圖6繪示本發明另一實施例之記憶體儲存裝置在進行讀取操作時各訊號的時序示意圖。 圖7繪示本發明一實施例之預充電電路的概要示意圖。 圖8繪示本發明一實施例之記憶體儲存裝置的操作方法的步驟流程圖。FIG. 1 is a schematic diagram of a memory storage device according to an embodiment of the invention. FIG. 2 is a schematic circuit diagram of the combination of the bit line and the channel gate transistor in the embodiment of FIG. 1. FIG. 3 is a schematic diagram showing the timing of each signal during a read operation of the memory storage device according to an embodiment of the present invention. 4 is a schematic diagram showing the timing of each signal during a read operation of the memory storage device according to another embodiment of the present invention. 5 is a schematic diagram showing the timing of each signal during a read operation of the memory storage device according to another embodiment of the present invention. 6 is a schematic diagram showing the timing of each signal during a read operation of the memory storage device according to another embodiment of the present invention. FIG. 7 is a schematic diagram of a precharge circuit according to an embodiment of the invention. FIG. 8 shows a flowchart of steps of a method of operating a memory storage device according to an embodiment of the present invention.
S100、S110‧‧‧方法步驟 S100, S110‧‧‧Method steps
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