TWI707064B - Substrate holder, plating device, and manufacturing method of substrate holder - Google Patents

Abstract

The substrate holder of the present invention is provided with first and second holding members for holding a substrate. The first holding member has: a supporting base; a movable base for supporting the substrate; and a force applying mechanism, which is arranged at Between the support base and the movable base, a force is applied to the movable base in a direction away from the support base; the second holding member has a protruding part, which is used to abut against the substrate and seal the Substrate, The force applied by the force applying mechanism is different in a part of the area or position of the movable base from other areas or positions.

Description

Substrate holder, plating device, and manufacturing method of substrate holder

The invention relates to a substrate holder, a plating device, and a manufacturing method of the substrate holder.

In the past, wiring or bumps (protruding electrodes) were formed on the surface of a substrate such as a semiconductor wafer or a printed circuit board. An electrolytic plating method is conventionally known as a method of forming the wiring and bumps.

The plating device used in the electrolytic plating method is equipped with a substrate holder, which seals the end surface of a circular or polygonal substrate, and exposes the surface (surface to be plated) to hold the substrate. In such a plating apparatus, when the plating process is performed on the surface of the substrate, the substrate holder holding the substrate is immersed in the plating solution.

Patent Document 1 describes a structure that is opposed to the support base 80 of the substrate holder 18, the movable base 82 is supported by the compression spring 86, the substrate is loaded on the movable base 82, and the movable base 82 and the seal holder 62 clamps the outer periphery of the substrate W. In this configuration, the movement of the movable base 82 absorbs the change in the thickness of the substrate W, and the substrate holder 18 can hold the substrate W with different thicknesses while maintaining the compressed size of the substrate sealing member 66 within a certain range.

Patent Document 2 is in the plating device, by arranging the anode holder 28, the adjustment plate 134 and the substrate holder 24 in the positioning holding portion 182 which is the same member, the opening of the anode 26, the adjustment plate 134, and The center of the substrate W is indeed consistent.

Patent Document 3 describes that the first holding member 22 and the second holding member 24 are clamped A substrate holder 8 holding a substrate W. The substrate holder 8 presses the outer periphery of the substrate W with the substrate sealing member 28. In addition, a conductor block 60 urged by a spring 63 is provided in the holder hanger 34 of the substrate holder 8, and the conductor block 60 is contacted and separated from a plurality of external contacts 42. When the substrate W is held in the substrate holder 8 and the conductor block 60 is separated from the external contacts 42, the external contacts 42 are energized to detect whether at least one of the internal contacts 45 and the conductive film of the substrate W is abnormal . In addition, by making the conductor block 60 contact the external contact 42, uniform current can be supplied to the plurality of internal contacts 45.

【Prior Technical Literature】 【Patent Literature】

[Patent Document 1] Japanese Invention Patent No. 5643239 Specification

[Patent Document 2] Japanese Patent Application Publication No. 2015-145537

[Patent Document 3] JP 2016-3376 A

In recent years, in substrate processing apparatuses such as plating apparatuses, the substrate size has become larger. When the size of the substrate becomes larger, the size of the substrate holder also becomes larger. At the same time, the immersion plating device that immerses the substrate holder longitudinally is affected by the hydraulic pressure of the plating solution (hereinafter also referred to as hydraulic pressure), resulting in the substrate holder The pressure difference between the upper part and the lower part becomes larger. Due to this pressure difference, the compressed size of the substrate sealing member sometimes fluctuates between the upper and lower parts, which may cause leakage of the plating solution. In addition, the substrate may also be inclined due to changes in the compressed dimensions of the upper and lower parts of the substrate sealing member, which may affect the plating quality. However, the structures described in the above-mentioned Patent Documents 1 to 3 do not take into account the influence of the hydraulic pressure difference of the plating liquid in the substrate holder.

The purpose of the present invention is to solve at least part of the above-mentioned problems.

One aspect of the present invention is to provide a substrate holder, which is provided with first and second holding members for holding the substrate. The first holding member has: a supporting base; and a movable base for supporting the substrate And a force applying mechanism, which is disposed between the support base and the movable base, and applies force to the movable base in a direction away from the support base; the second holding member has a protrusion, which is It is used to abut against the aforementioned substrate to seal the aforementioned substrate; the force applied by the aforementioned force applying mechanism is different in a part of the area or position of the movable base from other areas or positions. Here, some positions include one or more positions.

Another aspect of the present invention is a method of manufacturing a substrate holder for clamping a substrate, which prepares a supporting base, a movable base, and a force applying mechanism, and is used in a partial area or position of the movable base with other The method of applying force to the movable base in different areas or positions is a combination of the supporting base, the movable base, and the force applying mechanism.

1, 1a: substrate holder

25: Box table

25a: box

27: Substrate transfer device

28: Marching mechanism

29: Substrate loading and unloading mechanism

30: temporary storage box

32: Pre-wet tank

33: prepreg tank

34: Pre-rinsing tank

35: blowing slot

36: flush tank

37: substrate holder transfer device

38: overflow trough

39: plating tank

50: Washing device

50a: Washing department

100: Plating device

110: Loading and unloading department

120: Processing Department

120A: Pre-treatment and post-treatment department

120B: Plating treatment department

175: Controller

175A: CPU

175B: Memory

175C: Control Department

300: front panel

301: front

302: Back

303: Opening

310: Front panel body

311: Wiring buffer

311a: Wiring hole

312: working face

313: Thickening

320: Installation Department

330: support arm

331: Connector

340: Fixture

340a: meshing part

342: Leverage

350: fixed component

361: Internal seal

362: External seal

363: Seal holder

363a: Wiring trench

364: Seal holder

365: Cable Channel

370: contact

390: positioning pin

400: rear panel

401: front

402: Back

410: Rear panel body

411: Support base

411a: recess

411b: bottom surface

411c: recess

411d: bottom surface

411e: protrusion

412: Movable Base

412a: Perimeter

412b: Groove

412c: substrate support surface

412d: recess

412e: recess

412f: shim

412g: shim

413: elastomer

413a: elastomer

413b: elastomer

413c: elastomer

414: Guiding Organization

420: Platen

421: Pressure Plate

421a: Claw

421b: Long hole

421c: round hole

422: Torsion Spring

422a: Feet

422b: feet

422c: winding part

423: fixed part

423a: control surface

423b: Guide surface

424: fixed shaft

430: Meshing receiving part

430a: protrusion

470: Button

471: force part

472: Elastic part

473: Installation Department

474: Compression member

475: Fastening member

490: positioning film

501: O-ring

511: Screw

601: conductive thread

602: Cover

701: first holding member

702: second holding member

702a: Protruding part (seal)

702b: Ontology

703: Support base

704: movable base

705: elastomer

706: guide member

706a: flange

4121: top

4122: bottom

4123: right

4124: left

331a1, 331a2: external connection contacts

C1~C18: contact area

da, db: deformation

ha, hb: depth

L1~L18: Cable

S: substrate

The first figure is an overall layout diagram of a plating device using a substrate holder according to an embodiment of the present invention.

Figure 2A is a schematic front view of a substrate holder according to an embodiment.

The second figure B is a schematic side view of the substrate holder.

The second figure C is a schematic rear view of the substrate holder.

The third diagram A is a front perspective view of the substrate holder.

The third figure B is a rear perspective view of the substrate holder.

The fourth diagram A is the front view of the substrate holder.

The fourth figure B is a rear view of the substrate holder.

Figure 5A is the front view of the rear panel.

Figure 5B is a rear view of the rear panel.

Figure 6A is a partially enlarged rear view of the substrate holder showing the mounting state of the rear plate.

Figure 6B is a partially enlarged perspective view of the substrate holder showing the mounting state of the rear panel.

The seventh figure is a perspective view showing the relationship between the clamp and the connecting member.

Figure 8A is a perspective view of the clamp in the clamped state.

Figure 8B is a side view of the clamp in the clamped state.

Figure 9A is a cross-sectional perspective view of the clamp in the clamped state.

Figure 9B is a cross-sectional view of the clamp in the clamped state.

Figure 10A is a perspective view showing the structure of the clamp in an unclamped state.

Figure 10B is a side view of the clamp in an unclamped state.

Figure 11A is a cross-sectional perspective view of the clamp in an unclamped state.

Fig. 11B is a sectional view showing the structure of the clamp in the unclamped state.

Figure 12A is a side view showing a partial cutout of the clip of the rear plate.

Figure 12B is a partially enlarged perspective view showing the pressing plate of the rear plate.

Figure 13A is a partially notched perspective view showing the state of the pressing plate when locked.

Figure 13B is a partial cutaway cross-sectional view showing the state of the pressing plate when locked.

Figure 14A is a partially notched perspective view showing the state of the pressing plate when it is opened.

Figure 14B is a partial cutaway sectional view showing the state of the pressing plate when it is opened.

Figure 15 is a cross-sectional view showing the internal sealing part of the front plate.

The sixteenth figure is a cross-sectional view showing the inner and outer sealing parts of the front plate.

Figure 17 is a rear view of the front panel body.

Figure 18 is a partial enlarged top view of the front panel including the connector area.

Figure 19A is a cutaway perspective view of the front panel.

Figure 19B is a sectional view of the front panel.

Figure 19C is an enlarged perspective view of a part of the panel before the cable configuration.

Fig. 20A is a perspective view of the vicinity of the cable introduction position of the face part when the illustration of the wiring buffer part is omitted.

Figure 20B is a plan view of the vicinity of the cable introduction position on the work face when the wiring buffer is omitted.

Figure 20C is an enlarged view of the plan view near the cable introduction position of the working face when the wiring buffer is omitted.

Figure 21A is a rear view near the corner of the working face near the connector.

Figure 21B is a further enlarged rear view near the corner of the working face on the connector side.

Figure 21C is a cross-sectional view taken along line C-C of Figure 21A.

Figure 21D is a perspective view of the part where the cable is covered.

Figure 22 is an explanatory diagram illustrating the connection relationship between the cable and the external connection point.

Figure 23 is a front view showing the cut positions corresponding to each section of the substrate holder.

Figure 24 is a cross-sectional view of the substrate holder of Figure 23 at XXIV-XXIV.

Figure 25 is a cross-sectional view of the substrate holder in Figure 23 at XXV-XXV.

Figure 26 is a cross-sectional view of the substrate holder of Figure 23, which is cut near XXV-XXV and at a position including the elastic body in the longitudinal direction.

The twenty-seventh picture is the rear view of the movable base.

Figure 28A shows the force applying mechanism of the first modification.

Figure 28B shows the force applying mechanism of the second modification.

Figure 28C shows the force applying mechanism of the third modification.

Figure 28D shows the force applying mechanism of the fourth modification.

Figure 29A shows the force applying mechanism of the fifth modification.

Figure 29B shows the force applying mechanism of the sixth modification.

Figure 29C shows an example of an elastomer whose diameter changes continuously.

Figure 30 is an explanatory diagram illustrating the hydraulic pressure acting on the substrate holder disposed in the plating tank.

Figure 31 shows the measurement results of the amount of crushing of the seal in the substrate holder of the comparative example.

Figure 32 is an explanatory diagram showing the angular position of the substrate holder.

Figure 33 is a schematic cross-sectional view of the substrate holder.

Figure 34 shows the measurement result of the amount of crushing of the seal in the substrate holder equipped with the urging mechanism of this embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the following various embodiments, the same or equivalent members are given the same reference numerals, and repeated descriptions are omitted. In addition, the expressions of "front", "back", "front", "rear", "up", "down", "left", "right" are used in this manual, but these are for convenience of explanation The position and direction of the illustrated drawing on the paper may be different from the actual configuration when the device is used.

The first figure is an overall layout diagram of a plating device using a substrate holder according to an embodiment of the present invention. As shown in the first figure, the plating device 100 is roughly divided into: The substrate (equivalent to an example of the object to be processed) is loaded on the device 1, or the loading and unloading section 110 for unloading the substrate from the substrate holder 1; the processing section 120 for processing the substrate; and the cleaning section 50a. The processing section 120 further includes: a pre-processing and post-processing section 120A that performs substrate pre-processing and post-processing; and a plating processing section 120B that performs plating processing on the substrate. In addition, the substrates processed by the plating apparatus 100 include square substrates and circular substrates. In addition, the square substrate includes a polygonal glass substrate such as a rectangle, a liquid crystal substrate, a printed circuit board, and other polygonal plating objects. Circular substrates include semiconductor wafers, glass substrates, and other circular plating objects.

The loading and unloading unit 110 has two cassette tables 25 and a substrate loading and unloading mechanism 29. The cassette table 25 mounts a cassette 25a storing substrates such as semiconductor wafers, glass substrates, liquid crystal substrates, and printed circuit boards. The substrate attaching and detaching mechanism 29 is configured to attach and detach the substrate on the substrate holder 1 (described later in the second diagram A). In addition, a temporary storage box 30 for accommodating the substrate holder 1 is provided near (for example, below) the substrate loading and unloading mechanism 29. In the centers of these units 25, 29, and 30, a substrate transfer device 27 composed of a transfer robot for transferring substrates between these units is arranged. The substrate transport device 27 is configured to be able to travel by the travel mechanism 28.

The cleaning section 50a has a cleaning device 50 that cleans and dries the plated substrate. The substrate transport device 27 is configured to transport the plated substrate to the cleaning device 50 and take out the cleaned substrate from the cleaning device 50.

The pre-processing post-processing part 120A has a pre-wetting tank 32, a pre-soak tank 33, a pre-rinse tank 34, a spray tank 35, and a rinse tank 36. The pre-wetting tank 32 immerses the substrate in pure water. The prepreg tank 33 etches and removes the oxide film formed on the surface of the conductive layer such as the seed layer on the surface of the substrate. The pre-rinsing tank 34 uses a cleaning solution (pure water, etc.) to clean the pre-soaked substrate and the substrate holder together. The spray tank 35 discharges the substrate after washing. The washing tank 36 is used to clean the plated substrate Wash together with the substrate holder. The pre-wetting tank 32, the prepreg tank 33, the pre-wash tank 34, the spray tank 35, and the washing tank 36 are arranged in this order. In addition, the structure of the pre-processing and post-processing section 120A of the plating apparatus 100 is an example, and is not limited to the structure of the pre-processing and post-processing section 120A of the plating apparatus 100, and other structures may be adopted.

The plating treatment part 120B has a plurality of plating tanks 39 provided with an overflow tank 38. Each plating tank 39 accommodates a substrate inside, immerses the substrate in a plating solution held inside, and performs plating such as copper plating on the surface of the substrate. Here, the type of plating solution is not particularly limited, and various plating solutions can be used according to the application.

The plating apparatus 100 has, for example, a substrate holder conveying device 37 using a linear motor method that is located on the side of each of these devices, and conveys the substrate holder together with the substrate between these devices. The substrate holder transport device 37 is configured to transport the substrate holder between the substrate loading and unloading mechanism 29, the pre-wetting tank 32, the prepreg tank 33, the pre-rinsing tank 34, the spray tank 35, the rinse tank 36, and the plating tank 39 .

The plating processing system including the plating apparatus 100 configured as above has a controller 175 configured to control the above-mentioned various parts. The controller 175 has: a memory 175B storing a designated program; a CPU (Central Processing Unit) 175A executing a program in the memory 175B; and a control unit 175C implemented by the CPU 175A executing the program. The control unit 175C can perform, for example, the transfer control of the substrate transfer device 27, the transfer control of the substrate to the substrate holder in the substrate loading and unloading mechanism 29, the transfer control of the substrate holder transfer device 37, the plating current and the plating current in each plating tank 39. Control of the coating time, and control of the aperture of the anode mask (not shown) and the aperture of the adjustment plate (not shown) arranged in each plating tank 39, etc. In addition, the controller 175 is configured to communicate with an upper-level controller not shown in the figure that uniformly controls the plating device 100 and other related devices. Access data between databases. Here, the memory medium constituting the memory 175B stores various programs such as various setting data and the plating process program described later. The storage medium can be readable by a computer such as ROM and RAM, as well as hard disks, CD-ROMs, DVD-ROMs, and floppy disks and other disc-shaped storage media.

[Substrate Holder]

Figure 2A is a schematic front view of a substrate holder according to an embodiment. The second figure B is a schematic side view of the substrate holder. The second figure C is a schematic rear view of the substrate holder. The third diagram A is a front perspective view of the substrate holder. The third figure B is a rear perspective view of the substrate holder. The fourth diagram A is the front view of the substrate holder. The fourth figure B is a rear view of the substrate holder.

The substrate holder 1 includes a front plate 300 and a rear plate 400. The substrate S is held between the front plate 300 and the rear plate 400. The substrate holder 1 of this embodiment holds the substrate S in a state where one surface of the substrate S is exposed. The substrate S can be a semiconductor wafer, a glass substrate, a liquid crystal substrate, a printed substrate, and other coated objects. The substrate S has any shape such as a circle or a square. In addition, the following description is based on a square substrate as an example. However, when the shape of the opening of the substrate holder 1 is changed, it is possible to maintain circular and other shapes of substrates.

The front plate 300 includes a front plate main body 310 and an arm part 330. The support arm portion 330 is a holding part held by the substrate holder conveying device 37 and is a part supported when the support arm part is disposed in the plating tank 39. The substrate holder 1 is conveyed in a state of being vertically erected to the installation surface of the plating apparatus 100, and is arranged in the plating tank 39 in a vertically standing state.

The front panel body 310 is roughly rectangular, and has a wiring buffer portion 311 and a working surface 312, and has a front surface 301 and a back surface 302. The front plate main body 310 is mounted on the arm portion 330 at two places by the mounting portion 320. The front plate body 310 is provided with an opening 303, and the plated surface of the substrate S is from The opening 303 is exposed. The opening 303 of this embodiment is formed in a rectangular shape corresponding to the rectangular substrate S. In addition, when the substrate S is a circular semiconductor wafer, the shape of the opening 303 is also circular.

A wiring buffer portion 311 is provided on the side of the front plate body 310 close to the arm portion 330. The wiring buffer portion 311 is an area where cables are distributed to the front panel main body 310 via the arm portion 330, and is an area where cables of a preliminary length are accommodated. The wiring buffer portion 311 is formed to be slightly thicker than the other portion (working surface portion 312) of the front plate body 310 (refer to the second figure B). In this embodiment, the wiring buffer portion 311 is formed separately from the other part of the front panel main body 310 (working surface portion 312), and is installed on the working surface portion 312. A connector 331 for electrical connection with external wiring is provided on one end side of the arm portion 330 (refer to Figure 3A, etc.). The rear plate 400 is fixed to the back surface 302 (second C, third B, and fourth B diagrams) of the front plate body 310 (more specifically, the working surface 312) by a clamp 340.

(Installation structure of rear panel to front panel)

Figure 5A is the front view of the rear panel. Figure 5B is a rear view of the rear panel. Figure 6A is a partially enlarged rear view of the substrate holder showing the mounting state of the rear plate. Fig. 6B is an enlarged perspective view of the substrate holder part showing the mounting state of the rear plate. The seventh figure is a perspective view showing the relationship between the clamp and the connecting member.

The rear plate 400 includes a rear plate main body 410, which is roughly rectangular, but has a smaller size than the front plate main body 310 of the front plate 300 (3rd B and 4th B drawings). The rear panel body 410 has a front surface 401 (fifth view A) and a back surface 402 (fifth view B). In addition, the rear plate 400 includes a supporting base 411 and a movable base 412 (Figure 5A).

The front surface 401 of the back plate body 410 is the loading surface of the substrate S, and is installed on the back surface 302 of the front plate body 310. On the front face 401 of the back plate body 410, a total of Eight pressing plate parts 420 for holding (fixing) the substrate S. In this example, the pressing plate portion 420 is arranged on the upper side and the lower side of the substrate S, respectively, and three on the left and right sides. In addition, the number and arrangement of the pressing plate portions 420 are appropriately selected according to the size and shape of the substrate S, and are not limited to the number and arrangement shown in the figure.

Three of the four corners of the rear plate body 410 are provided with positioning pieces 490. A through hole 490a is formed in the positioning piece 490. The positioning piece 490 may also be integrally formed with the rear plate body 410, may be formed separately from the rear plate body 410, or be installed on the rear plate body 410. On the back 302 of the front panel main body 310, positioning pins 390 are provided at positions corresponding to the positioning pieces 490 (Figure 6A and Figure 6B). The positioning pin 390 may also be integrally formed with the front plate body 310, may be formed separately from the front plate body 310, or be installed on the front plate body 310. When the rear plate 400 is mounted on the front plate 300, the positioning pin 390 is inserted into the through hole 490a of the positioning piece 490 of the rear plate 400 to align the two.

On the back surface 302 of the front plate 300, as shown in FIG. 4B, fixing members 350 are arranged on each side corresponding to the four sides of the rear plate 400. Two fixing members 350 are provided on one side of the rear plate 400 and arranged side by side along one side of the rear plate 400. As shown in FIG. 6A, FIG. 6B, and FIG. 7, two clamps 340 are attached to each fixing member 350. Therefore, four clamps 340 are provided on each side. In addition, a lever 342 for simultaneously operating the four clamps 340 is installed between the two fixing members 350 on each side. In addition, the number of clamps per one side is not limited to 4, and may be 3 or less, or 5 or more.

Two fixing members 350 including each side are mounted with a rotating shaft 341. The rotating shaft 341 is rotatably attached to the fixed member 350 (the seventh figure). Each clamp 340 and lever 342 are attached to the rotating shaft 341 (8th A, 8B, 9th A, 9th B) by key coupling (key and keyway). The four clamps 340 are installed on the rotating shaft 341 with the same phase, but the lever 342 is installed on the rotating shaft 341 with a different phase from the four clamps 340. With this configuration, the lever 342 rotates When rotating, the four clamps 340 rotate synchronously with them. In addition, here is a structure in which the clamp 340 rotates around a rotating shaft 341 parallel to the faces 301 and 302 of the front plate body 310, but it can also move back and forth in a direction perpendicular to the faces 301 and 302 of the front plate body 310 , And the manner of clamping the rear plate 400 constitutes a clamp 340.

The jig 340 has an engaging portion 340a bent into a hook shape at its front end. A through hole is provided on the base end side of the jig 340, and the rotating shaft 341 is inserted through the through hole, and is fixed in a non-rotatable manner by a key and a key groove (refer to FIG. 9A). When the lever 342 is not subjected to external force, as shown in FIG. 7, it is urged by the compression spring 343 to rise from the back surface 302 of the front plate 300, and the clamps 340 are then urged in the closing direction. In other words, the clamp 340 is constructed of a normally closed type. In addition, the lever 342 constitutes a force receiving portion that can receive a pressing force from the outside. The lever 342 can receive a pressing force from an actuator provided in the substrate attaching and detaching mechanism 29, for example. Figure 10B schematically shows the actuator AR1. The actuator AR1 includes, for example, a drive unit DRV such as an air cylinder and a motor, and a rod-shaped member RD that is driven by the drive unit DRV. When the lever 342 receives the pressing force from the actuator AR1, it rotates in the direction in which it falls toward the back surface 302 of the front plate 300, and accordingly the clamp 340 rotates in the opening direction. In this example, there are four actuators AR1 corresponding to the levers 342 on each side. And it is advisable to simultaneously drive 4 actuators AR1 while pressing the lever 342. However, the four actuators AR1 can also be driven individually, and are not limited to being driven simultaneously.

On the back surface 402 of the rear plate 400, an engagement receiving portion 430 is provided at a position corresponding to the clamp 340. As shown in this embodiment, the engagement receiving portion 430 may also be formed of a different member from the rear plate body 410 of the rear plate 400, and it may be installed on the rear plate body 410 or may be formed integrally with the rear plate body 410. The engaging receiving portion 430 is formed with a protrusion 430a having a shape that the hook-shaped engaging portion 340a of the clamp 340 can catch and engage. The protruding portion 430a has a size longer than the engaging portion 340a in order to reliably receive the engagement of the engaging portion 340a of the clamp 340.

Hereinafter, the mounting structure of the rear plate 400 to the front plate 300 will be described with reference to the drawings.

Figure 8A is a perspective view of the clamp in the clamped state. Figure 8B is a side view of the clamp in the clamped state. Figure 9A is a cross-sectional perspective view of the clamp in the clamped state. Figure 9B is a cross-sectional view of the clamp in the clamped state. Figure 10A is a perspective view showing the structure of the clamp in an unclamped state. Figure 10B is a side view of the clamp in an unclamped state. Figure 11A is a cross-sectional perspective view of the clamp in an unclamped state. Fig. 11B is a sectional view showing the structure of the clamp in the unclamped state.

As mentioned above, the clamp 340 is a normally closed type, and the lever 342 is in a closed state as shown in Figures 8A, 8B, 9A, and 9B when the lever 342 is not under pressure. When the rear plate 400 is installed on the front plate 300, first, the lever 342 of the front plate 300 is pressed by the actuator AR1 (10th B), as shown in the tenth A, tenth B and tenth As shown in Fig. 1A and Fig. 11B, the force of the compression spring 343 is resisted to rotate in the direction of opening the clamp 340. With the clamp 340 opened, the rear plate 400 is arranged at a designated position on the back surface 302 of the front plate 300. At this time, the positioning pin 390 of the front plate 300 engages with the through hole 490a of the positioning piece 490 of the rear plate 400, and the position of the rear plate 400 is aligned with the designated position of the front plate 300.

Next, the pressing force of the actuator AR1 is removed from the lever 342 of the front plate 300. Thereby, the lever 342 is rotated toward the restoration position by the force of the compression spring 343, and each clamp 340 is rotated in the closing direction. As a result, the engaging portion 340a of the clamp 340 engages with the engaging receiving portion 430 of the rear plate 400, and the rear plate 400 is fixed to the front plate 300 (Figure 8A, Figure 8B, Figure 9A, and Figure 9B).

When the rear plate 400 is removed, as described above, an actuator (not shown) applies a pressing force to the lever 342 of the front plate 300 to resist the force of the compression spring 343 to rotate in the direction of opening the clamp 340 (No. Figure 10A, Figure 10B, Figure 11A, Figure 11B). Results from The clamping receiving portion 430 releases the clamp 340, and the rear plate 400 can be detached from the front plate 300.

(Mounting structure of base plate to rear plate)

Figure 12A is a side view showing a partial notch of the pressure plate of the rear plate. Figure 12B is a partially enlarged perspective view showing the pressing plate of the rear plate. Figure 13A is a partially notched perspective view showing the state of the pressing plate when locked. Figure 13B is a partial cutaway cross-sectional view showing the state of the pressing plate when locked. Figure 14A is a partially notched perspective view showing the state of the pressing plate when it is opened. Figure 14B is a partial cutaway sectional view showing the state of the pressing plate when it is opened.

On the front surface 401 of the rear plate 400, a total of eight pressing plate portions 420 are provided corresponding to each side of the substrate S (refer to FIG. 5A). In addition, on the back surface 402 of the rear plate 400, buttons 470 are provided at positions corresponding to the respective pressing plate portions 420 (refer to FIG. 5B). When no force is applied to the button 470, the button 470 is arranged on the surface on the front 401 side and the base end portions of the two pressure plates 421 at a predetermined interval (13th B). The button 470 has: a force receiving portion 471; an elastic portion 472 capable of displacing the rear plate body 410 to support the force receiving portion 471; and a mounting portion 473 on the outer periphery of the elastic portion 472. The button 470 is fixed in the mounting portion 473 by the pressing member 474 and the fastening member 475. The fastening member 475 is a stud, a bolt, etc., for example.

As shown in Figures 12A and 12B, each pressing plate portion 420 is provided with: a fixing portion 423 fixed to the front surface 401 of the rear plate body 410; a fixing shaft 424 fixed to the fixing portion 423 so as not to rotate; The shaft 424 is translated and rotatably supported by two pressure plates 421; and a torsion spring 422 provided on each pressure plate 421 to force the pressure plate 421 in the locking direction.

The pressing plate 421 has a claw portion 421a at its tip end, and a long hole 421b and two circular holes 421c are formed on the base end side. The pressing plate 421 is attached by inserting the fixed shaft 424 into the long hole 421b. As shown in Figure 13B, the torsion spring 422 has a winding portion 422c and a leg portion extending from the winding portion 422c 422a, 422b. The torsion spring 422 is designed to design the winding portion 422c by winding iron wires and the like into a plurality of circles, and leaving the legs 422a and 422b of specified length. The leg portion 422a has a bent portion bent at a substantially right angle at the tip, and the bent portion is inserted and fitted into the round hole 421c on the proximal side of the two round holes 421c of the pressing plate 421. The other leg portion 422b is not attached to the pressing plate 421, and has a bent portion bent at a substantially right angle at its front end, and the bent portion is supported in a state of abutting against the regulating surface 423a provided on the fixing portion 423. In addition, the leg portion 422a is guided by the guide surface 423b provided on the fixing portion 423 (13th B and 14th B).

With this structure, the pressing plate 421 can move in the direction away from the rear plate main body 410 and rotate toward the outside of the rear plate main body 410 (Figure 13B to Figure 14B). As a result, the pressing plate 421 becomes an open state (Figure 14A and Figure 14B). In addition, on the contrary, the pressing plate 421 can move in the direction approaching the rear plate body 410 and rotate toward the inner side of the rear plate body 410 (Figure 14B to Figure 13B). As a result, the pressing plate 421 becomes the locked state (Figure 13A and Figure 13B). In addition, in the present embodiment, the pressure plate 421 is a normally closed type in which a torsion spring 422 urges the pressure plate 421 in the locking direction (Figure 13A and Figure B) by a torsion spring 422. In addition, Figure 14B shows the undisplaced state of the force receiving portion 471 of the button 470 in order to avoid the complexity of the diagram. However, in fact, the force receiving portion 471 is displaced toward the pressing plate 421 to press the pressing plate 421. 421 becomes open by this pressing.

When the substrate S is mounted on the rear plate 400, the eight buttons 470 (force receiving portion 471) of the rear plate 400 are pressed from the outside by the actuator AR2 (Figure 14B). As a result, as shown in FIGS. 14A and 14B, the force receiving portion 471 is displaced to the front 401 side, and abuts against the base end portions of the two pressure plates 421. The pressing plate 421 moves in the direction away from the rear plate body 410 by the force received from the force receiving portion 471 as shown in Figure 14B, and rotates outside the pressing plate portion 420 into an open shape State (Figure 14B). As shown schematically in FIG. 14B, the actuator AR2 includes, for example, a driving part DRV such as an air cylinder and a motor, and a rod-shaped member RD driven by the driving part DRV. There are eight actuators AR2 corresponding to eight buttons 470. Eight actuators AR2 should be driven simultaneously while pressing the button 470. However, the eight actuators AR2 can also be driven separately, not limited to simultaneous driving.

In the open state of the pressing plate 421, the substrate S is loaded at a designated position on the front surface 401 of the rear plate 400, and then the pressing force of the actuator AR2 is released from the button 470. As a result, the pressing plate 421 moves in a direction approaching the rear plate body 410 by the force of the torsion spring 422, and rotates inside the rear plate body 410 into a locked state (Figure 14B to Figure 13B). At this time, the claw portion 421 a at the front end of the pressing plate 421 engages with the peripheral edge portion of the substrate S, and the substrate S can be fixed to the front surface 401 of the rear plate 400.

As illustrated in the fifth to thirteenth figures, when the board 400 is mounted on the front board 300 after the substrate S is mounted in this way, the mounting of the board S to the substrate holder 1 is completed. When removing the substrate S from the rear plate 400, as described above, the eight buttons 470 (force receiving portion 471) of the rear plate 400 are applied, and the pressing force is applied from the outside by the actuator AR2 (Figure 14A, 14 B).

In addition, here is the structure that the pressing plate 421 rotates around a fixed shaft 424 parallel to the surfaces 401, 402 of the rear plate body 410, but it can also move back and forth in a direction perpendicular to the surfaces 401, 402 of the rear plate body 410 to clamp The way of the substrate S constitutes a pressing plate 421.

(The composition of the sealing part)

Figure 15 is a cross-sectional view showing the internal sealing part of the front plate. The sixteenth figure is a cross-sectional view showing the inner and outer sealing parts of the front plate.

On the back surface 302 of the front plate 300, an internal seal 361 is provided adjacent to the opening 303. The inner seal 361 is installed on the back surface 302 of the front plate 300 by the seal holder 363. Inside The part seal 361 seals between the substrate S and the front plate 300 to prevent the plating solution from intruding into the end of the substrate S. A contact 370 for supplying potential to the substrate S is also installed in the seal holder 363.

In addition, as shown in FIG. 16, on the back surface 302 of the front plate 300 and outside the inner seal 361, an outer seal 362 is installed by the seal holder 364. The outer sealing member 362 abuts against the rear plate 400 and seals between the front plate 300 and the rear plate 400.

In this embodiment, since the seal holders 363 and 364 to which the inner seal 361 and the outer seal 362 are installed are composed of different components, the inner seal 361 and the outer seal 362 can be replaced individually.

(Current wiring)

Figure 17 is a rear view of the front panel body. Figure 18 is a partial enlarged top view of the front panel including the connector area. Figure 19A is a cutaway perspective view of the front panel. Figure 19B is a sectional view of the front panel. Figure 19C is an enlarged perspective view of a part of the panel before the cable configuration. Figure 20A is a perspective view of the vicinity of the cable introduction position of the working face when the wiring buffer is omitted. Figure 20B is a plan view of the vicinity of the cable introduction position on the work face when the wiring buffer is omitted. Figure 20C is an enlarged view of the plan view near the cable introduction position of the working face when the wiring buffer is omitted.

The back surface 302 of the front body 310 has 18 contact areas C1 to C18. The contact areas C1-C7, C17, C18 are arranged in the working face 312 on the connector 331 side half area (the first area, the right half of the seventeenth figure), the contact areas C8~C16 are arranged in the working face 312 from the connection The half area on the far side of the device 331 (the second area, the left half area in Figure 17). In the following description, expediently, the cables arranged in the first area are sometimes referred to as the first group of cables, and the cables arranged in the second area are sometimes referred to as the second group of cables.

Each contact area C1 to C18 includes a contact (contact member) 370 for feeding power to the substrate S shown in FIG. 15 and FIG. 16. The contacts 370 of the contact areas C1 to C18 are fed from the outside via cables L1 to L18, respectively. In addition, in the following description, when there is no need to distinguish the cables, the cables L1 to L18 may be combined and collectively referred to as the cable L. In addition, an arbitrary cable is sometimes referred to as the cable L.

The first ends of the cables L1 to L18 are connected to a connector 331 provided at one end of the arm portion 330. In more detail, the connector 331 is electrically connected to individual contacts or a plurality of common contacts. Click (illustration omitted). The cables L1 to L18 can be electrically connected to an external power source (power circuit, power device, etc.) via the contacts of the connector 331.

Figure 22 is an explanatory diagram illustrating the connection relationship between the cable and the external connection point.

The connector 331 connects the cables L1 to L18 to the external connection contacts 331a1, 331a2 (Figure 22). The external connection contacts 331a1 and 331a2 are connected to the feeding terminal from the external power source. For example, connect 3 cables (L1~L7, L17, L18) of the first group to the common external connection point 331a1 on the first side, and connect 3 cables (L8~L16) of the second group The cables are connected to the common second side external connection contact 331a2, and the first side external connection contact 331a1 and the second side external connection contact 331a2 are set as a pair of external connection contacts 331a. Here, the first side and the second side correspond to the sides when the contacts of the connector 331 are arranged in two rows. For example, in Figure 17, when viewing the connector 331 of the substrate holder 1 from the right side, the right side is the first side, and the left side is the second side.

Specifically, the external connection contacts are configured as follows.

Connect the cables L17, L18, and L1 to the common external connection contact 331a1 on the first side, and Connect the cables L8, L9, and L10 to the common external connection contact 331a2 on the second side, and make a pair of the external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side (referred to as the first One pair, or the first external connection contact pair 331a).

Connect the cables L2, L3, and L4 to the external connection contact 331a1 of the other first side, and connect the cables L11, L12, and L13 to the external connection contact 331a2 of the other second side, and these first The external connection contact 331a1 on one side and the external connection contact 331a2 on the second side form a pair (referred to as the second pair, or the second external connection contact pair 331a).

Connect the cables L5, L6, and L7 to the external connection point 331a1 on the other first side, and connect the cables L14, L15, and L16 to the external connection point 331a2 on the other second side. The external connection contact 331a1 on one side and the external connection contact 331a2 on the second side form a pair (referred to as a third pair, or third external connection contact pair 331a).

In the connector 331, the external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side of each external connection contact pair 331a are arranged opposite to each other. The external connection contact 331a1 on the first side of the first external connection contact pair 331a and the external connection contact 331a2 on the second side are arranged opposite to each other, and the external connection contact 331a1 on the first side of the second external connection contact pair 331a The external connection contacts 331a2 on the second side are arranged opposite to each other, and the external connection contacts 331a1 on the first side and the external connection contacts 331a2 on the second side of the third external connection contact pair 331a are arranged opposite to each other.

The energization confirmation process is executed in the substrate attachment/detachment mechanism 29. Specifically, after the substrate S is held in the substrate holder 1 (after the clamp 340 of the front panel 300 fixes the rear panel 400), the first to fifth pairs of the connector 331 are connected to a resistance measuring device (not shown), and A designated inspection voltage is applied between the first external connection contact and the second external connection contact of each pair. Thereby, the resistance between the first external connection contact and the second external connection contact in each pair is measured. Then, the resistance of each pair is lower than the specified When the value is within the specified range (the resistance of each pair does not change, and there is no abnormality such as disconnection), it is determined that the energization of the substrate holder 1 is good (the energization confirmation process). The energization confirmation process is executed by the control unit 175C of the controller 175, and may be included in the aforementioned "control of the substrate to the substrate holder in the substrate loading and unloading mechanism 29".

The cables L1 to L18 serve as the second ends of the other ends, which are electrically connected to the contacts 370 in the contact areas C1 to C18, as described later. Each of the cables L1 to L18 passes through the arm portion 330 from the connector 331, and enters the wiring buffer portion 311 through one mounting portion 320 (Figure 18). In the wiring buffer 311, the cables L17, L18, and L1 to L7 of the cables L1 to L18 face the first area (the area on the connector side), and the cables L8 to L16 face the second area (the side from the connector leaving area). The eighteenth figure mainly shows the cables L17, L18, L1~L7 of the first group arranged in the first area. As shown in FIG. 18, the cables L17, L18, and L1 to L7 of the first group are introduced into the cable passage 365 between the seal holders 363 and 364 in the working surface 312 through the wiring buffer 311. The cables L8 to L16 of the second group also pass through the second area of the wiring buffer portion 311 (area on the side away from the connector), and lead into the cable passage 365 in the second area of the working surface 312, but the drawing is omitted. In addition, in the eighteenth figure, a part of the cable length is omitted to avoid complicating the figure. In addition, the arrangement of the cables L1 to L18 in the wiring buffer portion 311 can be arbitrarily arranged to buffer a part of the length of the cables L1 to L18.

A thickened portion 313 is provided on the working surface 312 side of the wiring buffer portion 311 (Figure 19A and Figure B). In the thickened portion 313 of the wiring buffer portion 311 and the working surface 312, the cable passage 365 between the seal holders 363 and 364 is provided with wiring holes 311a corresponding to the respective cables L1 to L18 (Figure 19A, Nineteenth Panel B). Here, the wiring hole 311a is a tapered hole having a diameter through which the cable can pass. Fig. 19A shows only one wiring hole 311a, but in fact, as shown in Fig. 19C, a plurality of wiring holes 311a are provided corresponding to each cable. And at least have wiring holes for the number of cables 311a.

In this embodiment, as shown in FIG. 19A and FIG. 19B, the wiring buffer portion 311 is provided separately from the working surface 312 of the front panel body 310 and installed on the working surface 312. At the boundary between the wiring buffer portion 311 and the working surface 312, an O-ring 511 for sealing the wiring hole 311a and the cable L is arranged around the cable. Thereby, the wiring hole 311a and the cable L can be protected to prevent the plating solution or foreign matter from intruding from the outside.

Figure 21A is a rear view near the corner of the working face near the connector. Figure 21B is a further enlarged rear view near the corner of the working face on the connector side. Figure 21C is a cross-sectional view taken along line C-C of Figure 21A. Figure 21D is a perspective view of the part where the cable is covered.

The cables L1 to L7 are arranged in the same plane as shown in FIG. 21A and FIG. 21B, are guided into the cable passage 365, and are arranged along the connector 331 side of the opening 303. The cables do not overlap in the thickness direction of the working surface 312. Therefore, the thickness of the working face 312 and the front plate 300 can be suppressed.

As shown in FIG. 21A and FIG. 21B, along each side of the opening 303, each contact area C1 to C18 is provided with a contact 370 made of a conductor. The contacts 370 are not in contact with the inner seal 361 but are arranged adjacently. The contact 370 is disposed on the seal holder 363 and fixed to the seal holder with a plurality of screws 511. In the seal holder 363, a wiring groove 363a for introducing a cable is provided in each contact area from the cable passage 365 to the connection position (the position of the screw 511). As shown in FIG. 21D, the cable L includes: a core wire or conductive wire 601 composed of an electrical conductor; and a coating 602 for insulating the conductive wire 601. In the cable L, the coating 602 is removed at the front end (second end) to expose the core wire or the conductive wire 601. Then, the core wire 601 of the cable L is introduced into the wiring groove 363a. In addition, The cable L introduced in the contact area of the distribution is terminated with its contact area.

For example, the contact area C1 is formed with a wiring groove 363a (figure 21C) that opens toward the cable path 365 near the contact area C1. The wiring groove 363a is passed through four screws (fastening) provided in the contact area C1. The member) 511 extends below and serves as a terminal (Figure 21A). Similarly, the contact area C2 forms a wiring groove 363a that opens toward the cable path 365 near the contact area C2, and the wiring groove 363a extends through the four screws 511 provided in the contact area C2 and serves as a terminal. The positional relationship between the screw 511 and the wiring groove 363a is shown in Fig. 21C. When the cable L (L1 in Figure 21C) is arranged in the wiring groove 363a, the flange portion 511a of the screw 511 presses the contact 370 and the cable (core wire).

The electrical connection between the cable L and the contact 370 in each contact area is performed as follows. In the case of the cable L1 as an example, the front end (second end) of the cable L1 removes the coating 602 to expose the core wire (conductive wire) 601 (Figure 21 A to D). The front end of the cable L1 is introduced into the wiring groove 363a of the seal holder 363 near the contact C1, and is pressed together with the contact 370 by four screws (fastening members) 511 in the contact area C1. In other words, the screw (fastening member) 511 and the seal holder 363 clamp the core wire 601 of the cable L1 and the contact 370 together. As a result, as shown in FIG. 21C, the cable L1 is electrically connected to the contact 370. When the substrate holder 1 holds the substrate S, the contact 370 contacts the substrate S, and the substrate S is fed from an external power source via the cable L1 and the contact 370. The other contact areas C2 to C18 are also formed in the same way, and the substrate S is fed from the 18 contacts 370.

Since the cables L2 to L7 are not introduced into the contact area C1, the cables L2 to L7 are arranged in parallel between the contact area C1 and the contact area C2. In the contact area C2, similar to the contact area C1, the cable L2 is introduced into the wiring groove 363a of the seal holder 363, and is pressed together with the contact 370 by the screws 511 at 4 locations, and is electrically connected to the contact 370. As a result, in the contact area C2 and the contact area Cables L3 to L7 are arranged in parallel between domains C3. Similarly, the cables L3 to L7 are electrically connected to the contacts 370 in the contact areas C3 to C7, respectively. As a result, the cables L4 to L7 are arranged in parallel between the contact areas C3 and C4, the cables L5 to L7 are arranged in parallel between the contact areas C4 and C5, and the cables L6 to L7 are arranged in parallel between the contact areas C5 and C6. The cable L7 is arranged in parallel between the contact areas C6 and C7.

The cables L17 and L18 are also electrically connected to the contacts 370 in the contact areas C17 and C18, respectively. In addition, even in the area on the side away from the connector (the second area), the cables L8 to L16 are still electrically connected to the contacts 370 in the contact areas C8 to C16 in the same way as the cables in the first area.

This embodiment describes the case where the cable L and the contact 370 are clamped together, and the cable L and the contact 370 are directly electrically connected. However, another conductive member may be interposed between the cable L and the contact 370 (Second conductive member).

(Effects of the implementation form)

When the substrate holder 1 of this embodiment is used, it is clamped by a clamp 340 that can rotate around an axis parallel to the surface of the front plate body 310 or can move back and forth in a direction crossing the surface of the front plate body 310 The front plate 300 and the rear plate 400 are fixed to each other for holding the substrate, so that the force in the rotation direction can be suppressed or even prevented from being applied to the substrate. In the case of a large and thin substrate, the substrate may bend when a force in the direction of rotation is applied to the substrate. However, when the substrate holder 1 is used, even if a large and thin substrate is held, the bending can be suppressed or prevented. It happened.

In addition, because the clamp 340 is a normally closed type, when the back plate body 410 is abutted against the front plate body 310 to open the clamp, there is no need to apply force from the outside by an actuator or the like in the clamped state, which can reduce energy consumption .

In addition, since the rear plate 400 can be clamped by the clamps 340 at a plurality of places, in addition, each The action of the clamp 340 is synchronized by the connecting member (rotating shaft 341), so the clamping action can be effectively performed. In addition, the actuator AR1 that applies force from the outside can be simply constructed. Since the lever 342 receives the force from the external first actuator AR1 and can move the clamps 340 via the rotating shaft 341, it is easy to automate the fixing of the clamps 340.

In addition, by providing the engagement receiving portion 430 in the shape of the engagement portion 340a of the holding fixture 340 in the rear plate 400, the engagement of the fixture can be improved. It is easy to appropriately select the size, shape, number, etc. of the engagement receiving portion 430 by attaching the separately formed engagement receiving portion 430 to the rear plate main body 410 by the configuration.

In addition, because the substrate is fixed to the rear plate 400 by the pressing plate 421 that can rotate around the shaft 424 parallel to the surface of the rear plate body 410 or can move back and forth in the direction crossing the surface of the rear plate body 410, It can suppress or even prevent the force in the direction of rotation applied to the substrate. In the case of a large and thin substrate, the substrate may be deflected when a force in the direction of rotation is applied to the substrate. However, when the substrate holder is used, even if a large and thin substrate is maintained, the deflection can be suppressed or even prevented. occur.

Since the pressure plate 421 is a normally closed type, when the substrate is abutted against the rear plate body 410 and the pressure plate 421 is opened, there is no need to apply force from the outside by an actuator or the like in a clamped state, and energy consumption can be suppressed.

Since the button 470 that receives force from the surface opposite to the substrate abutting surface is provided, the actuator AR2 can be arranged on the opposite side to the substrate abutting surface, and the board 400 moves and changes the posture after the substrate is fixed. easy.

Since the button 470 can be forced from the external second actuator AR2 to move the pressing plate 421, it is easy to automate the fixing of the pressing plate 421.

Since the seal holders 363 and 364 for holding the inner seal 361 and the outer seal 362 are respectively provided, each seal can be replaced separately.

In addition, the substrate holder of this embodiment removes the coating 602 at one end of the cable L, and clamps the core wire 601 of the cable L and the contact 370 together, so that the cable L and the contact 370 can be easily constructed. Electrical connection between. In other words, the connection between the cable L and the contact 370 can still be made without providing a connector or the like at the end of the cable. When the contacts 370 are brought into contact with a plurality of places of the substrate S to feed power, it is necessary to pull back several cables L in the substrate holder for electrical connection. When the substrate holder is used, the cable L can be easily constructed and established. The electrical connection with the contact 370 can suppress the enlargement of the substrate holder. In addition, when feeding a large substrate or when the current value supplied to the substrate is large, the number of cables will increase and the cable diameter will also increase. For example, in this case, the simple cable connection of the substrate holder is effective.

In addition, the substrate holder of the present embodiment is simply constructed by fastening members 511 such as bolts and screws, and the electrical connection between the cable L and the contact 370 can be established with simple operations.

In addition, in the substrate holder of this embodiment, since the cable L and the contact 370 can be clamped by the sealing member holder 363, the existing structure can be utilized, and the substrate holder can be prevented from increasing in size and cost.

In addition, in the substrate holder of this embodiment, since the seal holders 363, 364 of the seals 361, 362 are independent, it is easy to replace the seals individually. In addition, it is easy to replace the seal holders 363 and 364 individually.

In addition, in the substrate holder of this embodiment, since the cable L does not overlap in the thickness direction of the substrate holder, the increase in the thickness of the substrate holder can be suppressed. Especially when a large substrate or a large amount of current is used, the number of cables and the diameter of the cables may increase, but this configuration can suppress The substrate holder increases in the thickness direction.

In addition, in the substrate holder of this embodiment, since the cables L with the front end cover 602 removed are sequentially introduced into the positions of the contacts 370 to be connected, the insulation between the cables can be ensured to the connection position and can be easily connected. The structure connects the cable to the conductive member.

When the substrate holder of the present embodiment is applied to a plating device, since the substrate holder can be prevented from increasing in size, the plating device can also be prevented from increasing in size.

The manufacturing method of the substrate holder of this embodiment is to remove the coating 602 from one end of the cable L, and clamp the core wire 601 of the cable L together with the contact 370, so that the cable L and the contact can be easily constructed. 370 electrical connections. In other words, the connection between the cable L and the contact 370 can still be made without providing a connector or the like at the end of the cable. When the contacts 370 are brought into contact with a plurality of places of the substrate S to feed power, it is necessary to pull back several cables L in the substrate holder for electrical connection. When the substrate holder is used, the cable L can be easily constructed and established. The electrical connection with the contact 370 can suppress the enlargement of the substrate holder. In addition, when feeding a large substrate or when the current value supplied to the substrate is large, the number of cables will increase and the cable diameter will also increase. For example, in this case, the simple cable connection of the substrate holder is effective.

In addition, when the substrate holder 1 is used to plate the substrate, even when feeding a large substrate or when the current value supplied to the substrate is large, because of the electrical properties between the cable and the conductive member in the substrate holder The connection has a simple structure, so it is possible to use a substrate holder that suppresses or even prevents enlargement for plating.

In addition, in the above-mentioned embodiment, the resistance between the first and second side contacts of each pair of external connection contacts is measured before the plating process, and the energization confirmation process is performed to confirm whether the resistance of the plurality of pairs of external connection contacts changes. Therefore, it is possible to confirm in advance whether there are multiple external connection points The variation between the resistances caused problems in the uniformity of the plating film thickness before plating. As a result, the reliability of the plating process can be improved.

(Substrate support structure)

Figure 23 is a front view showing the cut positions corresponding to each section of the substrate holder. Figure 24 is a cross-sectional view of the substrate holder of Figure 23 at XXIV-XXIV. Figure 25 is a cross-sectional view of the substrate holder in Figure 23 at XXV-XXV. Figure 26 is a cross-sectional view of the substrate holder of Figure 23, which is cut near XXV-XXV and at a position including the elastic body in the longitudinal direction. The twenty-seventh picture is the rear view of the movable base.

As shown in FIG. 5A, FIG. 5B, and FIG. 24, the rear plate body 410 includes: a supporting base 411, a movable base 412 movably installed on the supporting base 411, and a movable base 412 disposed on the supporting base The elastic body 413 between the seat 411 and the movable base 412. The movable base 412 can move in the direction of approaching or leaving the supporting base 411. The movable base 412 applies force in the direction away from the supporting base 411 by the elastic body 413a. The substrate S is loaded on the movable base 412. By pressing the outer periphery of the substrate S against the sealing member 361 of the front plate 300, the outer periphery of the substrate S is sealed to the plating solution. The movable base 412 is pressed by the sealing member 361 of the front plate 300 through the substrate S, and can move closer to the support base 411 according to the thickness of the substrate S.

As shown in FIG. 5A, the supporting base 411 and the movable base 412 are roughly rectangular plate-shaped members viewed from above, and the movable base 412 has a size smaller than that of the supporting base 411. A recess 411a (Figure 24) is provided on the front surface of the support base 411, and a movable base 412 is movably installed in the recess 411a. A recess 411c is provided in the recess 411a of the support base 411. The bottom surface 411d of the recess 411c is located deeper than the bottom surface 411b of the recess 411a. A step is provided between the bottom surface 411d and the bottom surface 411b. In addition, as shown in Figure 23, a plurality of guide mechanisms are provided on the movable base 412 414. The movement of the movable base 412 is guided by the guide mechanism 414 and regulates the moving range from the supporting base 411 toward the departure direction. The guide mechanism 414 is arranged in a portion sandwiched between the thin portion of the movable base 412 (the concave portion 412d and the concave portion 412e shown in FIG. 24). The thin portion forms a cross shape along the arrangement of the guide mechanism 414 in Figure 23. The guide mechanism 414 includes, for example, a shaft provided with a flange. The shaft is inserted into a through hole (not shown) provided in a thin portion of the movable base 412 from the front end side, and the front end is fixed to the bottom surface 411d of the recess 411c. The movable base 412 is guided along the shaft, and the flange of the shaft abuts against the bottom surface of the recess 412d of the movable base 412 to regulate the moving range of the movable base 412. In addition, the movable base 412 has a peripheral edge portion 412a whose thickness is larger than the central side (Figure 24). A groove 412b is provided on the back surface of the peripheral portion 412a, and an elastic body 413 is arranged in the groove 412b. A substrate support surface 412c protruding from the center side area of the front surface is provided on the entire circumference including the outer peripheral side of the front surface of the peripheral edge portion 412a. And the substrate S is supported on the substrate supporting portion 412c.

The elastic body 413 constitutes a force applying mechanism for applying force to the movable base 412. In more detail, the elastic body 413 and the part of the elastic body 413 contacting the movable base 412 and the supporting base 411 constitute a force applying mechanism. As shown in Figure 27, the groove 412b is provided on the entire circumference including the outer periphery of the back surface of the movable base 412, and the elastic body 413 (in this example, the elastic bodies 413a, 413b, 413c) is roughly the entire circumference including the groove 412b ( Substantially include the whole week) and configure. The elastic body 413 of this example has three rod-shaped elastic bodies 413a, 413b, and 413c. The elastic body 413a is arranged across the right part of the upper side 4121 of the movable base 412 and the upper part of the right side 4123. The elastic body 413b is arranged over the left part of the upper side 4121 of the movable base 412 and the upper part of the left 4124. The elastic body 413c is arranged over the entire length of the lower side 4122 of the movable base 412, the lower part of the right side 4123, and the lower part of the left side 4124. In addition, the upper side is the side of the movable base 412 on the upper side (arm portion 330 side) when the substrate holder 1 is arranged in the plating tank 39, and the lower side is the side where the substrate holder 1 is immersed in the plating tank. At 39 o'clock, it becomes the lower side (from the arm 330 Away from the side).

The number of individual elastomers constituting the elastomer 413 is not limited to three, and may be two or less or four or more. There may also be a gap g between the elastic bodies 413a, 413b, and 413c (Figure 26). However, in order to apply a uniform force to the entire circumference of the movable base 412, it is preferable to substantially include a plurality of elastic bodies arranged around the circumference. One example is that it is advisable to arrange a plurality of elastic bodies on more than 90% of the entire circumference of the movable base 412 (the entire circumference of the groove 412b). In other words, the total length of the gap g between the plurality of elastic bodies should be less than 10% of the entire circumference of the movable base 412 (the entire circumference of the groove 412b). In addition, in the following description, when no particular distinction is required, each elastic body is sometimes referred to as an elastic body 413, and a plurality of elastic bodies are sometimes collectively referred to as an elastic body 413.

As the elastic body 413, for example, an O-ring made of fluorine rubber or urethane rubber, or a compression ring can be used. When the elastic body 413 is composed of a plurality of elastic bodies, for example, a plurality of O-rings can be cut or tightened to be arranged in the groove 412b. In addition, the elastic body 413 may be formed of one ring-shaped elastic body. For example, an O-ring having approximately the same length as the entire circumference of the groove 412b may be arranged or tightly arranged in the groove 412b. The cross section of the elastic body 413 can be any shape such as a circular shape, an elliptical shape, and a polygonal shape. In addition, the elastic body 413 only needs to be suitable for applying force to the movable base 412, and does not need to have sealing properties.

The force applied by the elastic body 413 to the movable base 412 can be adjusted according to the diameter and the hardness (elasticity) of the elastic body 413. In addition, when a plurality of elastic bodies 413 are overlapped and arranged in the groove portion 412b, the applied force can be adjusted according to the number of the elastic bodies 413. Therefore, the force applied by the elastic body 413 to the movable base 412 can be adjusted by adjusting at least one of the diameter, the hardness (elasticity), and the number of the elastic body 413.

As shown in FIG. 25 and FIG. 26, the depth of the groove 412b is set according to the position of the substrate holder 1 in the vertical direction. When the substrate holder 1 is arranged in the plating tank 39, the upper side 4121 of the movable base 412 is arranged at the shallow depth of the plating solution, and the lower side 4122 of the movable base 412 The side is arranged at the deep water depth of the plating solution. The depth hb of the groove 412b at the lower end of the movable base 412 is smaller than the depth ha of the groove 412b at the upper end of the movable base 412 (hb<ha). In other words, as shown in Figures 25 and 26, the depth hb of the groove 412b along the lower side 4122 of the movable base 412 is smaller than the depth ha of the groove 412b along the upper side 4121 of the movable base 412 . In addition, the depth of the groove 412b along the right side 4123 and the left side 4124 of the movable base 412, as shown in Figures 25 and 26, is continuously reduced from the depth ha to the depth from the upper side 4121 to the lower side 4122 hb. In other words, the depth of the groove 412b is set in a decreasing manner corresponding to the water depth of the plating solution. For example, the depth of the groove 412b can be set in such a way that it changes (linearly decreases) in proportion to the water depth (the distance from the upper side 4121).

In addition, here is described the case where the depth of the groove 412b changes continuously and linearly according to the water depth, but the depth of the groove 412b may also change curvilinearly according to the water depth. In addition, the depth of the groove 412b can also be changed stepwise according to the water depth, and the depth of the groove 412b in the area (or location) of the movable base 412 where the water depth has a large influence can be smaller than the depth of other areas (or locations). The area (or position) of the movable base 412 where the water depth has a large influence can be determined in advance through experiments or the like. For example, by placing the substrate holder 1 with the substrate S installed in the plating solution and measuring the relationship between the depth of water and the amount of crushing of the sealing member 361, the depth of the groove 412b corresponding to the water depth of the larger amount of crushing can be greater than that of other regions The depth of the groove 412b (or position) is small.

As shown in Figures 25 and 26, the smaller the depth of the groove 412b (the deeper the depth hb side), the greater the deformation of the elastic body 413 when the movable base 412 is installed on the support base 411 ( The amount of deformation db in Figure 25), the greater the force applied by the elastic body 413 (the force applied in the direction in which the movable base 412 is separated from the supporting base 411). In addition, the greater the depth of the groove 412b (the deeper the depth ha side), the smaller the deformation of the elastic body 413 when the movable base 412 is mounted on the support base 411 (No. The amount of deformation da in Figure 25), the smaller the applied force of the elastic body 413 (the applied force in the direction in which the movable base 412 separates from the supporting base 411). When the substrate holder 1 is put into the plating solution, the area (or position) with deeper water depth is the elastic body 413, which exerts greater force against the greater hydraulic pressure, and the area (or position) with shallower water depth is the elastic body 413 exerts less force against smaller hydraulic pressure. As a result, the sum of the force applied by the elastic body 413 (the force in the direction that moves the movable base 412 away from the support base 411) and the hydraulic pressure (the force in the direction that the movable base 412 approaches the support base 411) is applied to the entire movable base 412. The area remains constant, and the working force of the movable base 412 in the direction away from the supporting base 411 is constant regardless of the depth of the water. Thereby, when the back plate 400 clamps the substrate S on the movable base 412, the crushing amount of the sealing member 361 of the back plate 400 is kept constant regardless of the depth of water. As a result, the leakage of the plating solution can be suppressed or even prevented. In addition, the tilt of the substrate can be suppressed or even prevented. In addition, the substrate and the contact 370 can be in good contact throughout the entire circumference. Thereby, when the substrate is plated with the substrate holder, the thickness of the metal formed on the substrate, that is, the in-plane unevenness of the plating thickness can be suppressed. That is, when the substrate is electrolytically plated using the substrate holder, the thickness of the metal formed on the substrate can be kept substantially uniform in the plane.

(Modification of substrate support structure)

In addition, the above described the configuration in which the depth of the groove 412b of the movable base 412 is changed to suppress the influence of the hydraulic pressure. However, other configurations may be adopted as long as the force of the elastic body 413 can be adjusted according to the depth of the water. Figure 28A ~ Figure 28D show other examples of the configuration of changing the distance between the movable base 412 and the support base 411 of the elastic body 413 according to the location (area or position on the movable base) . The twenty-ninth figure and the twenty-ninth figure B are structural examples in which the force applied by the elastic body 413 itself is changed according to the area or position on the movable base 412.

(First modification)

Figure 28A shows the force applying mechanism of the first modification. In this modification, the depth of the groove 412b of the movable base 412 is kept constant, and a protrusion 411e of varying height is provided at a position opposite to the groove 412b of the support base 411. For example, when the substrate holder 1 is immersed in a plating solution, the height of the protrusion 411e is increased in a region (or position) with a deeper water depth, so that the amount of crushing of the elastic body 413 is greater. In the example of Figure 28A, the height of the protrusion 411e on the upper side is hc, and the height of the protrusion 411e on the lower side is hd (>hc). In addition, the height of the protrusion 411e can also be changed in a curve shape, a step shape, or a local change in an area (or position) where the hydraulic pressure is greatly affected.

(Second Modification)

Figure 28B shows the force applying mechanism of the second modification. In this modification, the depth of the groove 412b of the movable base 412 is made shallow in the deep water depth area (or position), and the height of the protrusion 411e of the supporting base 411 is increased in the deep water depth area (or position). As a result, the amount of crushing of the elastic body 413 in the region (or position) of the deep water depth increases, and the applied force of the elastic body 413 increases. In the example of Figure 28B, the depth of the groove 412b on the upper side is he, the depth of the groove 412b on the lower side is hf(<he), the height of the protrusion 411e on the upper side is hg, and the height of the protrusion 411e on the lower side Department hh(>hg). In addition, the depth of the groove 412b may also be shallower stepwise, or may be locally shallower in an area (or location) where the hydraulic pressure is greatly affected. In addition, the height of the protrusion 411e can also be changed in a curve shape, a step shape, or a local change in a region (or position) where the hydraulic pressure is greatly affected.

(Third modification)

Figure 28C shows the force applying mechanism of the third modification. In this modification, a shim 412f as a size adjustment member made of a plate-shaped member with varying thickness is attached to the bottom surface of the groove 412b of the movable base 412. For example, when the substrate holder 1 is immersed in the plating solution, the higher the depth of the area (or position), the higher the height of the shim 412f (to make the groove 412b The actual depth becomes shallower). In addition, in this example, the depth of the groove 412b is kept constant, but when the shim 412f is installed in the groove 412b, the actual depth of the groove 412b may be a desired value, and the depth of the groove 412b may not be necessary. In the example of Figure 28C, the height of the shim 412f on the upper side is hi, and the height of the shim 412f on the lower side is hj (>hi). In addition, the height of the shim 412f may also be changed in a curve shape, a step shape, or a local change in an area (or position) where the hydraulic pressure is greatly affected. In addition, shims can also be installed locally in areas (or locations) where the hydraulic pressure is large. In Figure 26, Figure 28 A, Figure 28 B, the groove 412b of a certain depth is first formed, and then the actual depth of the groove 412b can be changed by installing the shim 412f. In addition, the position adjustment member here is an example of a plate-shaped member, but the position adjustment member may be a rod-shaped member whose diameter changes.

(Fourth modification)

Figure 28D shows the force applying mechanism of the fourth modification. In this modification, a shim 412g as a size adjustment member made of a plate-shaped member with varying thickness is attached to the end surface of the protrusion 411e of the support base 411. For example, when the substrate holder 1 is immersed in the plating solution, the height of the shim 412g is increased as the area (or position) of the deep water depth position is higher. In addition, in this example, the height of the protrusion 411e is kept constant, but when the shim 412f is installed in the groove 412b, the actual depth of the groove 412b may be a desired value, and the depth of the groove 412b may not be necessary. In the example of Figure 28D, the height of the shim 412g on the upper side is hk, and the height of the shim 412g on the lower side is hl (>hk). In addition, the height of the shim 412g can also be changed in a curve shape, a step shape, or a local change in a region (or position) where the hydraulic pressure is greatly affected. In addition, shims can also be installed locally in areas (or locations) that have a large impact on hydraulic pressure. In Figure 28A and Figure 28B, a protrusion 411e of a certain height is formed first, and the protrusion 411e can be changed by installing a shim 412g The substantial height. In addition, the position adjustment member here is an example of a plate-shaped member, but the position adjustment member may be a rod-shaped member whose diameter changes.

In addition, the above description describes the case where the groove is provided in the movable base 412 and the protrusion is provided in the support base 411, but the groove may be provided in the support base 411 and the protrusion is provided in the movable base 412.

(Fifth Modification)

Figure 29A shows the force applying mechanism of the fifth modification. In this modification, the diameter of the elastic body 413 is changed according to the area (or position) on the movable base 412. And the diameter of the elastic body 413 arranged in the deep water depth area (or position) is larger than the diameter of the elastic body 413 arranged in the shallow water depth position. The diameter of the elastic body 413 may also continuously change linearly or curvilinearly (refer to Figure 29C), it may also change stepwise, or it may change locally in an area (or position) where the hydraulic pressure is large. The example of Fig. 29A is in the plural elastic bodies 413a, 413b, 413c shown in Fig. 27, the diameter of the elastic bodies 413a, 413b on the shallow water side is set to da=db, and the deep The diameter of the elastic body 413c on the water depth side is set to a larger diameter dc (>da=db). As a result, the elastic body 413c at the deep water depth position exerts greater force and can resist high hydraulic pressure.

In addition, it is also possible to obtain the desired applied force according to the position on the movable base 412 by combining the configuration of the twenty-sixth figure, the twenty-eighth figure A~D, and the diameter of the elastic body 413 of the fifth modification. .

(Sixth Modification)

Figure 29B shows the force applying mechanism of the sixth modification. In this modification, the hardness (elasticity) of the elastic body 413 is changed according to the area (or position) on the movable base 412. The hardness of the elastic body 413 arranged in the deep water depth area (or position) is greater than the hardness of the elastic body 413 arranged in the shallow water depth area (or position). The hardness of the elastomer 413 can also be continuous in a straight line or a curve The change can also change stepwise, or locally change in an area (or location) where the hydraulic pressure has a large influence. The example of Figure 29B is that in the elastic bodies 413a, 413b, and 413c shown in Figure 27, the hardness of the elastic bodies 413a and 413b on the shallow water depth side is set to Ha=Hb, and the The hardness of the elastic body 413c is set to a larger hardness Hc (>Ha=Hb). As a result, the elastic body 413c at the deep water depth position exerts greater force and can resist high hydraulic pressure.

In addition, by combining the diameter change of the elastic body 413 of the fifth modification and the hardness change of the elastic body 413 of the sixth modification, the desired applied force of the elastic body 413 can be obtained. For example, based on factors such as restricted installation space and limited increase in the diameter of the elastomer, the increase in the diameter and the hardness of the elastomer can be combined to obtain the desired applied force. In addition, by combining the structure of the twenty-sixth figure, the twenty-eighth figure A~D, and at least one of the fifth modification and the sixth modification, the hope can be obtained according to the position on the movable base 412 The applied force.

(Seventh modification)

The force applying mechanism of the seventh modification will be described with reference to Figures 30 to 32.

Figure 30 is an explanatory diagram illustrating the hydraulic pressure acting on the substrate holder disposed in the plating tank. The substrate holder 1a is held by sandwiching the substrate S by the first holding member 701 and the second holding member 702. The second holding member 702 has an opening that exposes the plated surface of the substrate S. As shown in Figure 30, the deeper the water, the greater the hydraulic pressure acting on the coated surface of the substrate S (P1<P2<P3<P4<P5). At the same time, the plated surface of the substrate S is pressed against the side of the first holding member 701 by hydraulic pressure with a greater depth of water. In more detail, the hydraulic pressure of the greater the depth of the water is to press the substrate S and the movable base 704 toward the support base 703. As a result, at the deep water depth position, the amount of seal crush of the second holding member 702 pressing the substrate S on the side of the first holding member 701 becomes smaller. Here, the substrate holder 1a that holds a circular substrate (wafer) is shown as an example, but it holds the aforementioned The same applies to the substrate holder 1 for a rectangular substrate or the like. In addition, the indications of P1~P5 are exemplified in order to understand the hydraulic pressure according to the depth of the water. In fact, the hydraulic system changes continuously according to the water depth.

Figure 31 shows the measurement results of the amount of crushing of the seal in the substrate holder of the comparative example. Figure 32 is an explanatory diagram showing the angular position of the substrate holder. The horizontal axis of the graph in Figure 31 is the angular position of the substrate (the position of the circular substrate in the rotation direction), and corresponds to the angular position shown in Figure 31. The longitudinal axis of the graph is the amount of crushing of the seal. In addition, this graph is to illustrate the influence of hydraulic pressure on the amount of seal collapse, and shows the change in the amount of seal collapse at each angular position when the amount of seal collapse at the angular position 0° is used as a reference. The substrate holder of the comparative example is in the substrate holder 1a shown in Figure 33. The spring constants of a plurality of elastic bodies (spring) 705 are the same, and the arrangement density of the elastic bodies (spring) 705 is at all angular positions ( 0°~360°) is uniform. It can be understood from the graph that at an angle of 90°~270°, the amount of seal collapse affected by hydraulic pressure is greatly reduced.

Figure 33 is a schematic cross-sectional view of the substrate holder. The substrate holder 1 a is held by sandwiching the substrate S by the first holding member 701 and the second holding member 702. The first holding member 701 includes: a support base 703; a movable base 704 that supports the substrate S; an elastic body 705 that biases the movable base 704 in a direction away from the support base 703; and guides the movement of the movable base 704 And the guide member 706 that limits its moving range. The guide member 706 of this example has a flange 706, and the front end side is fixed to the support base 703. The movement of the movable base 704 is restricted by the flange 706. The elastic body 705 in this example is a spring, and a plurality of springs 705 are provided between the movable base 704 and the supporting base 703. The second holding member 702 is an annular member, and holds the outer periphery of the substrate S and exposes the plating surface of the substrate S. The second holding member 702 is attached to the first holding member 701 to be freely opened and closed by a hinge or the like. The second holding member 702 has a protrusion (seal) 702a at a portion that contacts the outer peripheral portion of the substrate S. The seal 702a may also be a member different from the body 702b of the second holding member 702, or may be integrated with the body 702b of the second holding member 702. The protrusion (seal) 702a of the second holding member 702 presses the substrate S on the movable base 704 toward the support base 703, and seals the outer periphery of the substrate S from the plating solution. In order to cope with the influence of hydraulic pressure, the substrate holder 1a adopts a structure in which the spring constant kb of the spring 705 in the deep water depth area (or position) with large hydraulic pressure is larger than the spring constant ka of other areas (or positions).

Figure 34 shows the measurement result of the amount of crushing of the seal in the substrate holder equipped with the urging mechanism of this embodiment. The inventor of the present application made the angle position in the thirty-second figure, especially the area where the hydraulic influence is greater than 120° and less than 240°, to make the spring constant higher than other areas (0° or more and less than 120°, greater than 240° and Less than 360°) in the experiment of 20~30% increase, as shown in Figure 34, the result of suppressing the reduction in the amount of collapse of the seal was obtained. From the experimental results, it is understood that including the entire circumference of the substrate holder can suppress the variation of the amount of crushing of the sealing member, and it can be closed within the specified range.

In addition, instead of increasing the spring constant of the spring 705, the density of the spring 705 can be increased in a region (or position) where the hydraulic pressure is large. In addition, the change of the spring constant of the spring 705 and the change of the setting density of the spring 705 may be combined to obtain the desired applied force. In addition, as in the above-mentioned embodiment, instead of changing at least one of the spring constant and the setting density of the spring in a partial area (or position) of the movable base, the greater the hydraulic pressure in the entire area of the movable base, the greater the spring application At least one of the spring constant and the setting density of the spring is changed in a way that the force continuity or the steppedness becomes larger. In addition, it is also possible to change at least one of the spring constant and the spring installation density in a partial area (or position) of the movable base in such a way that the greater the hydraulic pressure, the greater the continuity or the steppedness of the applied force of the spring. An example is to increase the spring constant of only a single spring arranged at the deepest water depth position.

In addition, the substrate holder system of the above-mentioned embodiment can be manufactured as follows. First, prepare the support base, the movable base, and the force application mechanism, and combine the support base by applying force to the movable base in a different area (or position) of the movable base than other areas (or positions). Seat, movable base and force applying mechanism. When the manufacturing method is adopted, the force applying mechanism of the force applying mechanism is different according to the position on the movable base, and the substrate holder can be easily manufactured to suppress or even prevent the influence of hydraulic pressure difference. In addition, when a part of the area (or position) of the movable base and other areas (or positions) are constructed by applying force to the movable base, it can be set in the above-mentioned various manners with reference to FIGS. 23 to 34.

[1] When the above-mentioned present embodiment is adopted, it is possible to apply force to the substrate relative to the protruding part (seal) according to the different area (or position) on the movable base. In the part where the hydraulic pressure is large, by setting the applied force of the force applying mechanism to increase, the applied force can be applied to the movable base in the direction away from the supporting base according to the magnitude of the hydraulic pressure. As a result, it is possible to suppress the fluctuation of the hydraulic pressure seal collapse amount. As a result, the leakage of the plating solution can be suppressed or even prevented. In addition, it is possible to suppress or even prevent the tilt of the movable base (substrate tilt) caused by hydraulic pressure. In addition, the substrate and the contact 370 can be in good contact throughout the entire circumference. Thereby, the unevenness of the plating thickness can be suppressed. That is, by using the substrate holder to electrolytically plate the substrate, the thickness of the metal formed on the substrate can be substantially uniform in the plane.

[2] In the above embodiment, when the substrate holder is arranged in the plating tank, the force of the force applying mechanism in the area (or position) below the movable base is greater than the area (or position) above, so The lower area (or position) resists large hydraulic pressure and exerts force on the movable base. Thereby, it is possible to suppress or even prevent the amount of crushing of the sealing member from becoming small in the lower area (or position), and it is possible to suppress or even prevent the tilting of the movable base (substrate tilting).

[3] An example is to set the force applying mechanism according to the distance from one end of the movable base The applied force. For example, when the shallow water depth side and the deep water depth side of the movable base are set as the first end and the second end respectively, if it is set so that the deeper the water, the greater the force applied by the force applying mechanism. Set the applied force more accurately according to the hydraulic pressure.

[4] An example is to change the applied force by changing the spring constant of the spring according to the area (or position) on the movable base. Therefore, the increase in the installation space of the spring is suppressed or even prevented, and the applied force can be changed according to the area (or position) on the movable base. When the spring constant of the deep water depth area (or position) is larger than the spring constant of the shallow water depth area (or position), a spring can be used to apply force according to the hydraulic pressure.

[5] An example can be to change the applied force by changing the setting density of the spring according to the area (or position) on the movable base. Therefore, by using the same kind of spring to change the setting density, the applied force can also be changed according to the area (or position) on the movable base.

[6] One example can be to change the applied force by combining the spring constant and spring setting density according to the area (or position) on the movable base. For example, when the installation space of the spring is restricted, the installation density of the spring can be increased within the allowable range of the installation space, or the spring constant can be increased to compensate for the insufficient applied force. In this way, it is possible to suppress design changes due to an increase in installation space, and to suppress an increase in the difference in spring constant.

[7] An example is to clamp a rod-shaped elastic body between at least one of grooves and protrusions provided on at least one of the movable base and the supporting base, and change according to the area (or position) on the movable base The size of grooves and protrusions can change the amount of crushing of the elastomer. The greater the amount of compression of the elastomer, the greater the force applied to the movable base. Therefore, for example, if the deep water position is set such that the distance between the movable base and the supporting base becomes smaller, when the substrate is clamped by the first and second holding members, the amount of crushing of the elastic body between the movable base and the supporting base becomes larger. Generate greater applied force. Thus, in In the deep water position of the movable base, the force corresponding to the hydraulic pressure can be applied, which can suppress or even prevent the reduction, variation, and tilt of the movable base due to the influence of hydraulic pressure.

In addition, the use of rod-shaped elastic bodies compared with the use of springs can reduce the thickness for installation, and can maintain the continuity of the applied force along the sealing area. Therefore, the thickness of the substrate holder can be reduced, and the continuity of applied force is also improved. Therefore, the substrate holder of this embodiment can be suitably used for thin and large square substrates.

[8] An example is to change the size of at least one of the groove and the protrusion according to the position on the movable base by making at least one of the groove and the protrusion inclined. At this time, it is also easy to continuously change the size of at least one of the groove and the protrusion according to the hydraulic pressure.

[9] An example is to arrange a size adjustment member on at least one of the bottom surface of the groove and the end surface of the protrusion to change the depth of the groove according to the position on the movable base. At this time, after at least one of a groove and a protrusion is formed on at least one of the movable base and the supporting base, the size of the groove can be easily changed by hydraulic pressure.

[10] An example can change the applied force by changing at least one of the diameter, hardness and quantity of the elastic body according to the area (or position) on the movable base. At this time, even if the size of at least one of the grooves and protrusions provided on at least one of the movable base and the supporting base is not changed, by adjusting at least one of the diameter, hardness and quantity of the elastic body, it can still be moved The area (or position) on the base changes to apply force. In addition, by preparing elastomers (such as O-rings) with at least one of different diameter, hardness, and quantity, at least one of the diameter, hardness, and quantity of the elastic body is different according to the area (or position) on the movable base. The elastic body can easily change the applied force.

[11] An example is the adjustment of the size of at least one of the grooves and protrusions of at least one of the movable base and the supporting base, and the diameter, hardness and quantity of the elastic body At least one of the adjustments to achieve the applied force according to the area (or position) of the movable base. At this time, for example, based on the constraints of the size of the substrate holder in the thickness direction and ensuring the mechanical strength, and the adjustment range of the size of at least one of the grooves and protrusions, the diameter and hardness of the elastomer can be adjusted And at least one of the number to make up for the insufficient applied force. At this time, the increase in the thickness of the substrate holder can be suppressed, the mechanical strength can be ensured, and the adjustment of insufficient applied force can be flexibly compensated by adjusting at least one of the diameter, hardness and number.

[12] When the plating device of this embodiment is used, it is possible to suppress or even prevent the substrate holder from being affected by the hydraulic pressure difference, and the plating process is performed on the substrate.

At least the following technical ideas are grasped from the above-mentioned embodiments.

[1] Form 1 provides a substrate holder including first and second holding members for holding a substrate. The first holding member has a supporting base and a movable base for supporting the substrate; And a force applying mechanism, which is arranged between the support base and the movable base, and applies force to the movable base in a direction away from the support base; the second holding member has a protrusion, which is used When abutting against the substrate, the substrate is sealed; the force applied by the force applying mechanism is different in a part of the area or position of the movable base from other areas or positions. Here, some positions include one or more positions.

In the first form, different application forces can be applied to the substrate relative to the protruding part (seal) according to the position on the movable base. For example, when the substrate holder is arranged in a plating tank in a roughly vertical posture for plating treatment, the hydraulic pressure (water pressure) applied to each part of the substrate holder varies according to the depth in the plating solution. In other words, the hydraulic pressure is different depending on the position on the movable base. The hydraulic pressure of pressing the movable base toward the supporting base at a deep water depth is large, and the hydraulic pressure of pressing the movable base toward the supporting base at a shallow water depth is small. In addition, the movable base passes through the base exposed from the second holding member The plated surface receives hydraulic pressure from the plating liquid. At this time, under the condition that the force exerted by the force applying mechanism in the entire movable base area is constant, in the deep water position, the movable base is closer to the supporting base due to hydraulic pressure, and the crushing amount (crushing margin) of the seal becomes smaller . The reduction and variation of the amount of crushing of the seal may cause the plating solution to leak. In addition, in the case of increasing the crushing amount of the seal in the entire movable base area, the substrate may be damaged. Furthermore, the tilting (or bending) of the movable base due to the difference in hydraulic pressure may cause the substrate on the movable base to also tilt. In addition, poor contact between the substrate and the contact may also occur in the portion where the amount of seal collapse is reduced, and uneven plating thickness may occur.

In the first form, in the part with large hydraulic pressure (the part with large force in the direction that the movable base approaches the supporting base), by setting the force of the force applying mechanism to increase, the force can be applied to the movable base according to the hydraulic pressure. Apply force in the direction away from the support base. As a result, it is possible to suppress fluctuations in the amount of seal collapse due to the hydraulic pressure difference. As a result, the leakage of the plating solution can be suppressed or even prevented. In addition, it is possible to suppress or even prevent tilting of the movable base (substrate tilt) due to hydraulic pressure. In addition, good contact between the substrate and the contacts can be achieved throughout the entire circumference. Thereby, the unevenness of the plating thickness can be suppressed.

[2] The form 2 is the substrate holder of form 1. The substrate holder is used in the plating tank in a roughly vertical posture, and the force applied by the force applying mechanism to the lower area or position in the plating tank is higher The area or location exerts a large force.

Form 2 When the substrate holder is arranged in the plating tank, because the force of the force applying mechanism is greater in the area or position below the movable base than in the upper area or position, it can be applied against the large hydraulic pressure in the lower area or position Power on the movable base. Thereby, it is possible to suppress or even prevent the amount of crushing of the sealing member from being reduced in the lower area or position, and it is possible to suppress or even prevent the tilting of the movable base (the tilting of the substrate).

[3] The form 3 is the substrate holder of form 1 or form 2, the movable base has first and second ends, and the force applied by the force applying mechanism complies with the first of the movable base The distance from the end to the direction of the aforementioned second end increases.

The applied force of the form 3 force applying mechanism is set according to the distance from one end of the movable base. For example, when the shallow water depth side and the deep water depth side of the movable base are set as the first end and the second end, respectively, if the depth of the water is set to be greater, the force applied by the force applying mechanism can be The hydraulic pressure sets the applied force more accurately.

[4] Mode 4 is the substrate holder of any one of Modes 1 to 3, wherein the force applying mechanism is configured to have a plurality of springs, and the spring constants of the springs are adjusted to make the force different.

Form 4 can change the applied force by changing the spring constant of the spring according to the position on the movable base. Therefore, it is possible to suppress or even prevent an increase in the installation space of the spring, and to change the applied force according to the position on the movable base. For example, when the spring constant of a deep water depth area or position is larger than that of a shallow water depth area or position, a spring can be used to apply force according to the hydraulic pressure.

[5] The form 5 is the substrate holder of any one of form 1 to form 3, wherein the force applying mechanism is configured to have a plurality of springs, and the applied force is different by adjusting the density of the springs.

Form 5 can change the applied force by changing the setting density of the spring according to the position on the movable base. Therefore, by using the same type of spring to change the setting density, the applied force can also be changed according to the position on the movable base. For example, if the spring setting density in a deep water depth area or location is greater than that in a shallow water depth area or location, the spring can be used to apply force depending on the hydraulic pressure.

[6] Mode 6 is the substrate holder of any one of Modes 1 to 3, wherein the force applying mechanism is configured to have a plurality of springs, and the spring constants of the plurality of springs and the density of the springs are adjusted to make the The applied force is different.

Form 6 can apply force according to the position on the movable base by changing the combined spring constant and spring setting density. For example, when the installation space of the spring is restricted, the installation density of the spring can be increased within the allowable range of the installation space, and the increase in the spring constant can compensate for the insufficient applied force. In this way, it is possible to suppress design changes due to increased installation space, and to suppress an increase in the difference in spring constant. In addition, by changing the combined spring constant and spring setting density, the adjustment range of the applied force can be expanded.

[7] The form 7 is the substrate holder of any one of form 1 to form 3, wherein the force applying mechanism constitutes the movable base having one or more rod-shaped elastic bodies, and the part of the elastic body is disposed and the aforementioned movable base At least one of the supporting base is provided with at least one of a groove and a protrusion, and the size of at least one of the groove and the protrusion is adjusted according to the position on the movable base to make the applied force different.

In form 7, the rod-shaped elastic body is clamped between at least one of the grooves and protrusions provided on at least one of the movable base and the supporting base, and the dimensions of the grooves and protrusions are changed according to the position on the movable base ( The depth of the groove, the height of the protrusion), and the amount of crushing of the elastic body is changed. The greater the amount of compression of the elastomer, the greater the force applied to the movable base. Therefore, for example, in a deep water position, if the distance between the movable base and the supporting base is set to be smaller, when the substrate is clamped by the first and second holding members, the elastic body between the movable base and the supporting base is crushed The amount becomes larger, and a greater applied force is generated. Therefore, the force corresponding to the hydraulic pressure can be applied to the deep water depth position of the movable base, which can suppress or even prevent the reduction, fluctuation, and tilting of the sealing element caused by the hydraulic pressure.

In addition, the use of rod-shaped elastic bodies compared with the use of springs can reduce the thickness for installation, and can maintain the continuity of the applied force along the sealing area. Therefore, the thickness of the substrate holder can be reduced, and the continuity of applied force is also improved. The structure using the rod-shaped elastic body can be suitably used for thin and large square substrates.

[8] Form 8 is the substrate holder of form 7, wherein at least one of the grooves and protrusions provided on at least one of the movable base and the supporting base is inclined.

Form 8 is that at least one of the groove and the protrusion is inclined, and the size of at least one of the groove and the protrusion is changed according to the position on the movable base. At this time, it is also easy to continuously change the size of at least one of the groove and the protrusion according to the hydraulic pressure.

[9] The form 9 is the substrate holder of form 7 or form 8, in which at least one of the bottom surface of the groove and the end surface of the protrusion provided on at least one of the movable base and the support base is provided with a size adjusting member . The size adjustment member may be a plate-shaped member or a rod-shaped member with a constant or variable cross-sectional size (thickness, diameter).

Form 9 is that by arranging a size adjustment member on at least one of the bottom surface of the groove and the end surface of the protrusion, the depth of the groove and the height of at least one of the protrusion are changed according to the position on the movable base. At this time, after at least one of a groove and a protrusion is formed on at least one of the movable base and the supporting base, the size of the groove can be easily changed by hydraulic pressure.

[10] The form 10 is the substrate holder of any one of form 1 to form 3, the force applying mechanism is constituted with one or more rod-shaped elastic bodies, by adjusting the elastic body according to the position on the movable base At least one of the diameter, hardness, and quantity, and the aforementioned applied force is different.

In form 10, the applied force can be changed by changing at least one of the diameter, hardness (elasticity), and number of the elastic body according to the position on the movable base. At this time, even if the dimensions of at least one of the grooves and protrusions provided on at least one of the movable base and the supporting base are not changed, at least one of the diameter, hardness, and quantity of the elastic body can still be adjusted, and The force applied is changed according to the position on the movable base. In addition, it is possible to prepare elastomers (for example, O Type ring), according to the position on the movable base, the elastic body with at least one of different diameter, hardness and quantity is arranged, and the applied force can be easily changed.

[11] The form 11 is the substrate holder of any one of form 1 to form 3, wherein the force applying mechanism constitutes the movable base having one or more rod-shaped elastic bodies, the part of which the elastic bodies are arranged, and the At least one of the supporting base is provided with at least one of a groove and a protrusion, the size of at least one of the groove and the protrusion is adjusted according to the position on the movable base, and the elastic body is adjusted according to the position on the movable base At least one of the diameter, hardness, and quantity, and the aforementioned applied force is different.

Form 11 is achieved by combining and adjusting the size of at least one of the grooves and protrusions of at least one of the movable base and the supporting base, and adjusting at least one of the diameter, hardness, and quantity of the elastic body, so as to realize the movable base The applied force depends on the area or position of the seat. At this time, for example, due to the constraints of the size of the substrate holder in the thickness direction and ensuring the mechanical strength, and the adjustment range of at least one of the grooves and protrusions is restricted, the diameter and hardness of the elastic body can be adjusted. , And at least one of the number to make up for the insufficient applied force. At this time, the increase in the thickness of the substrate holder can be suppressed, the mechanical strength can be ensured, and the adjustment of insufficient applied force can be flexibly compensated by adjusting at least one of the diameter, hardness, and number.

[12] Form 12 is a substrate holder of any one of Form 1 to Form 11, which constitutes a square-shaped substrate.

Form 12 can achieve the same effect as form 1. Especially in recent years, the square substrate has become thinner and larger, and because the size in the vertical direction is large, the hydraulic pressure difference between the upper part and the lower part of the substrate holder tends to increase. In addition, because the substrate holder is also thin, it is easily affected by hydraulic pressure. When Form 12 is applied to a substrate holder holding such a square substrate, it can effectively suppress even To prevent the possible impact of the hydraulic pressure on the substrate holder.

[13] Form 13 The substrate holder of any one of Form 1 to Form 11 constitutes a substrate that maintains a circular shape.

Form 13 can achieve the same effect as form 1. In recent years, the diameter of semiconductor wafers has become larger, and due to the increase in the size in the vertical direction, the hydraulic pressure difference between the upper and lower parts of the substrate holder has become larger. Form 13 can effectively suppress or even prevent the possible influence of the hydraulic pressure difference on the substrate holder.

[14] Aspect 14 provides a substrate processing apparatus having a plating tank for installing a substrate holder in any one of aspect 1 to aspect 13. The substrate processing device can suppress or even prevent the influence of the hydraulic pressure difference borne by the substrate holder, and can perform plating processing on the substrate.

[15] Form 15 is a method for manufacturing a substrate holder for holding a substrate. It prepares a supporting base, a movable base, and a force applying mechanism, and is used to set a part or position of the movable base or other areas or The way of applying force to the movable base at different positions is to combine the supporting base, the movable base, and the force applying mechanism.

In Form 15, the force applying mechanism is made in such a way that the force of the force applying mechanism is different depending on the position on the movable base, so that the substrate holder can be easily manufactured to suppress or even prevent the influence of the hydraulic pressure difference.

Above, the embodiments of the present invention have been described based on several examples, but the above embodiments of the present invention are for the sake of easy understanding of the inventors, and do not limit the present inventors. The present invention can be modified and improved without departing from its spirit, and the present invention certainly includes its equivalents. In addition, within the scope of solving at least a part of the above-mentioned problems or achieving at least a part of the effect, the various elements described in the scope of the patent application and the specification can be combined or omitted arbitrarily.

This application claims priority based on the Japanese Invention Patent Application No. 2016-234169 dated December 1, 2016. Contains the Japanese invention patent application number dated December 1, 2016 All the disclosures including the specification, scope of patent application, drawings and abstract of the invention of No. 2016-234169 are incorporated into this application by reference.

Contains the specification, scope of patent application, and drawings of Japanese Patent Application No. 5643239 (Patent Document 1), Japanese Patent Application Publication No. 2015-145537 (Patent Document 2), Japanese Patent Application Publication No. 2016-3376 (Patent Document 3) All disclosures including the abstract of the invention are incorporated into this application by reference.

411: Support base

411a: recess

411b: bottom surface

412: Movable Base

412b: Groove

413: elastomer

413a: elastomer

413c: elastomer

4121: top

4122: bottom

4123: right

4124: left

da, db: deformation

ha, hb: depth

Claims (14)

A substrate holder is provided with first and second holding members for holding a substrate. The first holding member has: a supporting base; a movable base for supporting the substrate; and a force applying mechanism, which Is arranged between the support base and the movable base, and applies force to the movable base in a direction away from the support base; the second holding member has a protrusion that is used to abut against the substrate , Sealing the aforementioned substrate; the force of the aforementioned force applying mechanism is different in a part of the area or position of the aforementioned movable base from other areas or positions; the aforementioned substrate holder is used in the plating tank in a roughly vertical attitude, and the aforementioned force applying mechanism is The applied force in the lower area or position in the aforementioned plating tank is greater than the applied force in the upper area or position. The substrate holder according to claim 1, wherein the movable base has a first end and a second end, and the force applied by the force applying mechanism follows the first end of the movable base toward the second The distance in the direction of the end becomes larger. In the substrate holder described in the first item of the patent application, the force applying mechanism is configured to have a plurality of springs, and the spring constants of the plurality of springs are adjusted to make the applied force different. The substrate holder as described in item 1 of the scope of patent application, wherein the aforementioned force applying mechanism constitutes There are a plurality of springs, and the applied force is different by adjusting the density of the springs. In the substrate holder described in the first item of the patent application, the force applying mechanism is configured to have a plurality of springs, and the force applied is different by adjusting the spring constant of the plurality of springs and the density of the springs. The substrate holder according to the first item of the scope of patent application, wherein the force applying mechanism is configured to have one or more rod-shaped elastic bodies, and at least one of the movable base and the supporting base configured with the elastic body One side is provided with at least one of a groove and a protrusion, and the size of at least one of the groove and the protrusion is adjusted according to the position on the movable base so that the applied force is different. According to the substrate holder described in item 6 of the scope of patent application, at least one of the grooves and protrusions provided on at least one of the movable base and the supporting base is inclined. The substrate holder according to the scope of patent application claim 6, wherein a size adjustment member is arranged on at least one of the bottom surface of the groove and the end surface of the protrusion provided on at least one of the movable base and the support base. According to the substrate holder described in the first item of the scope of patent application, the force applying mechanism is constituted with one or more rod-shaped elastic bodies, and the diameter, hardness, and hardness of the elastic bodies are adjusted according to the position on the movable base. And the number is at least one, and the aforementioned applied force is different. The substrate holder according to the first item of the scope of patent application, wherein the force applying mechanism is configured to have one or more rod-shaped elastic bodies, and at least one of the movable base and the supporting base configured with the elastic body One side is provided with at least one of grooves and protrusions, the size of at least one of the grooves and protrusions is adjusted according to the position on the movable base, and the diameter, hardness, and number of the elastic body are adjusted according to the position on the movable base At least 1 while making The aforementioned applied force is different. The substrate holder according to the first item of the scope of patent application, wherein the aforementioned substrate holder is configured to clamp a square substrate. The substrate holder according to the first item of the scope of patent application, wherein the aforementioned substrate holder is configured to clamp a circular substrate. A substrate processing device is provided with a plating tank for setting the substrate holder described in item 1 of the scope of patent application. A method for manufacturing a substrate holder, the substrate holder is used to clamp a substrate, the substrate holder is used in a plating tank in a roughly vertical posture, and the method for manufacturing the substrate holder includes: preparing a supporting base and a movable base , And a force applying mechanism, and combine the support base, the movable base, and the foregoing movable base by applying force to the movable base in a partial area or position of the movable base that is different from other areas or positions The force applying mechanism, wherein the force applied by the force applying mechanism in the lower area or position in the plating tank is greater than the force applied in the upper area or position.

Images