TWI706764B - Endoscope device, and flexible printed circuit board assembly and flexible circuit board thereof - Google Patents
Endoscope device, and flexible printed circuit board assembly and flexible circuit board thereof Download PDFInfo
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Abstract
Description
本發明涉及一種內視鏡裝置、柔性電路板組件及其柔性電路板,特別是涉及一種能提升散熱效率的內視鏡裝置、柔性電路板組件及其柔性電路板。The invention relates to an endoscope device, a flexible circuit board assembly and a flexible circuit board, and in particular to an endoscope device, a flexible circuit board assembly and a flexible circuit board that can improve heat dissipation efficiency.
首先,隨著內視鏡的技術發展,其功能需求日益增加,所以,設置在內視鏡中的電子元件也會隨之增加。然而,一旦內視鏡中的電子元件數量較多時,不僅需要考慮到電子元件的配置位置、理線及焊接作業,也需要考慮到電子元件的散熱效率。First of all, with the technological development of the endoscope, its functional requirements are increasing day by day, so the electronic components installed in the endoscope will also increase accordingly. However, once the number of electronic components in the endoscope is large, not only the placement of the electronic components, wiring and soldering operations, but also the heat dissipation efficiency of the electronic components need to be considered.
因此,如何通過結構設計的改良,以克服上述的缺陷,已成為該項事業所欲解決的重要課題之一。Therefore, how to overcome the above-mentioned shortcomings through structural design improvements has become one of the important issues to be solved by this business.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種內視鏡裝置、柔性電路板組件及其柔性電路板。The technical problem to be solved by the present invention is to provide an endoscope device, a flexible circuit board assembly and a flexible circuit board for the disadvantages of the prior art.
為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種內視鏡裝置,其包括:一中空管體以及一柔性電路板組件。所述柔性電路板組件設置在所述中空管體中,所述柔性電路板組件包括一承載基座、一柔性電路板、一影像感測模組、一發光元件、一線纜模組以及一支撐架。其中,所述柔性電路板設置在所述承載基座上,所述影像感測模組耦接於所述柔性電路板且設置在所述柔性電路板的一感測模組承載部上,所述發光元件耦接於所述柔性電路板且設置在所述柔性電路板的一發光元件承載部上,所述線纜模組耦接於所述柔性電路板且設置在所述柔性電路板上,所述支撐架用於支撐所述承載基座及所述發光元件承載部。其中,所述柔性電路板呈繞曲狀地設置在所述承載基座上,且繞曲狀的所述柔性電路板與所述承載基座之間定義有一容置空間,所述線纜模組的一連接器耦接於所述柔性電路板且設置在所述容置空間中。其中,所述柔性電路板包括一感測模組承載部、一第一本體部、一第二本體部、一第三本體部、一第四本體部以及一發光元件承載部,所述第一本體部連接於所述感測模組承載部的其中一側,所述第二本體部連接於所述感測模組承載部的另外一側且對應於所述第一本體部,所述第三本體部連接於所述第一本體部,所述第四本體部連接於所述第二本體部,所述發光元件承載部連接於所述第三本體部。其中,所述第四本體部與所述承載基座之間定義有所述容置空間,且所述線纜模組的所述連接器設置於所述第四本體上且位於所述容置空間中。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide an endoscope device, which includes a hollow tube body and a flexible circuit board assembly. The flexible circuit board assembly is disposed in the hollow tube body, and the flexible circuit board assembly includes a carrier base, a flexible circuit board, an image sensing module, a light emitting element, a cable module, and A support frame. Wherein, the flexible circuit board is arranged on the carrying base, the image sensing module is coupled to the flexible circuit board and arranged on a sensing module carrying portion of the flexible circuit board, so The light-emitting element is coupled to the flexible circuit board and arranged on a light-emitting element carrying portion of the flexible circuit board, and the cable module is coupled to the flexible circuit board and arranged on the flexible circuit board , The support frame is used to support the bearing base and the light-emitting element bearing portion. Wherein, the flexible circuit board is arranged on the carrying base in a curved shape, and an accommodation space is defined between the curved flexible circuit board and the carrying base, and the cable mold A connector of the group is coupled to the flexible circuit board and arranged in the accommodating space. Wherein, the flexible circuit board includes a sensing module bearing portion, a first body portion, a second body portion, a third body portion, a fourth body portion, and a light emitting element bearing portion. The body portion is connected to one side of the sensing module bearing portion, the second body portion is connected to the other side of the sensing module bearing portion and corresponds to the first body portion, the first Three body parts are connected to the first body part, the fourth body part is connected to the second body part, and the light emitting element carrying part is connected to the third body part. Wherein, the accommodating space is defined between the fourth body portion and the bearing base, and the connector of the cable module is disposed on the fourth body and located in the accommodating space In space.
為了解決上述的技術問題,本發明所採用的另外一技術方案是,提供一種柔性電路板組件,其包括:一承載基座、一柔性電路板、一影像感測模組、一發光元件以及一線纜模組。所述柔性電路板設置在所述承載基座上,所述柔性電路板包括一感測模組承載部、一第一本體部、一第二本體部、一第三本體部以及一發光元件承載部,其中,所述第一本體部連接於所述感測模組承載部的其中一側,所述第二本體部連接於所述感測模組承載部的另外一側且對應於所述第一本體部,所述第三本體部連接於所述第一本體部,所述發光元件承載部連接於所述第三本體部。所述影像感測模組耦接於所述柔性電路板,且所述影像感測模組設置在所述感測模組承載部上。所述發光元件耦接於所述柔性電路板,且所述發光元件設置在所述發光元件承載部上。所述線纜模組耦接於所述柔性電路板,所述線纜模組包括一耦接於所述柔性電路板的連接器以及多條設置於所述連接器上的導線。其中,所述柔性電路板呈繞曲狀地設置在所述承載基座上,且繞曲狀的所述柔性電路板與所述承載基座之間定義有一容置空間,所述線纜模組的所述連接器設置在所述容置空間中。其中,所述柔性電路板還進一步包括一第四本體部,所述第四本體部連接於所述第二本體部,其中,所述第四本體部與所述承載基座之間定義有所述容置空間,且所述線纜模組的所述連接器設置於所述第四本體上且位於所述容置空間中。In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a flexible circuit board assembly, which includes: a carrier base, a flexible circuit board, an image sensing module, a light emitting element, and a Cable module. The flexible circuit board is arranged on the carrying base, and the flexible circuit board includes a sensing module carrying part, a first body part, a second body part, a third body part and a light emitting element carrying part Part, wherein the first body part is connected to one side of the sensing module carrying part, and the second body part is connected to the other side of the sensing module carrying part and corresponds to the A first body part, the third body part is connected to the first body part, and the light emitting element carrying part is connected to the third body part. The image sensing module is coupled to the flexible circuit board, and the image sensing module is disposed on the sensing module carrying part. The light-emitting element is coupled to the flexible circuit board, and the light-emitting element is disposed on the light-emitting element carrying portion. The cable module is coupled to the flexible circuit board, and the cable module includes a connector coupled to the flexible circuit board and a plurality of wires arranged on the connector. Wherein, the flexible circuit board is arranged on the carrying base in a curved shape, and an accommodation space is defined between the curved flexible circuit board and the carrying base, and the cable mold The connector of the group is arranged in the accommodating space. Wherein, the flexible circuit board further includes a fourth body portion, the fourth body portion is connected to the second body portion, wherein there is defined between the fourth body portion and the carrying base The accommodating space, and the connector of the cable module is disposed on the fourth body and located in the accommodating space.
為了解決上述的技術問題,本發明所採用的再一技術方案是,提供一種柔性電路板,其包括:一感測模組承載部、一第一本體部、一第二本體部、一第三本體部、一第四本體部以及一發光元件承載部。所述第一本體部連接於所述感測模組承載部的其中一側。所述第二本體部連接於所述感測模組承載部的另外一側且對應於所述第一本體部,其中,所述第一本體部及所述第二本體部分別位於所述感測模組承載部的兩相反側邊。所述第三本體部連接於所述第一本體部。所述發光元件承載部連接於所述第三本體部。所述第四本體部連接於所述第二本體部,且所述第三本體部及所述第四本體部分別位於所述感測模組承載部的兩相反側邊。其中,所述發光元件承載部包括一連接於所述第三本體部的第一承載端部以及一連接於所述第三本體部的第二承載端部,所述第一承載端部與所述第二承載端部彼此分離。其中,所述第一本體部及所述第二本體部相對於所述感測模組承載部的延伸方向與所述第三本體部及所述第四本體部相對於所述感測模組承載部的延伸方向呈大致垂直。In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a flexible circuit board, which includes: a sensing module carrying portion, a first body portion, a second body portion, and a third body portion. The main body, a fourth main body and a light-emitting element carrying portion. The first body part is connected to one side of the sensing module carrying part. The second body part is connected to the other side of the sensing module carrying part and corresponds to the first body part, wherein the first body part and the second body part are respectively located in the sensor module Two opposite sides of the test module carrying part. The third body part is connected to the first body part. The light-emitting element carrying portion is connected to the third body portion. The fourth body part is connected to the second body part, and the third body part and the fourth body part are respectively located on two opposite sides of the sensing module carrying part. Wherein, the light-emitting element bearing portion includes a first bearing end connected to the third body portion and a second bearing end connected to the third body portion, and the first bearing end is connected to the third body. The second bearing ends are separated from each other. Wherein, the extension direction of the first body portion and the second body portion relative to the sensing module carrying portion is the same as the third body portion and the fourth body portion relative to the sensing module The extending direction of the carrying portion is substantially vertical.
本發明的其中一有益效果在於,本發明實施例所提供的內視鏡裝置、柔性電路板組件及其柔性電路板,其能利用“柔性電路板呈繞曲狀地設置在承載基座上,且繞曲狀的柔性電路板與承載基座之間定義有一容置空間,線纜模組的連接器耦接於柔性電路板且設置在容置空間中”的技術方案,而能提高散熱效率,且能讓電子元件配置在適當的位置上。One of the beneficial effects of the present invention is that the endoscope device, the flexible circuit board assembly and the flexible circuit board provided by the embodiments of the present invention can be arranged on the supporting base in a curved shape by using the "flexible circuit board," And there is a accommodating space defined between the curved flexible circuit board and the carrying base, and the connector of the cable module is coupled to the flexible circuit board and arranged in the accommodating space, which can improve heat dissipation efficiency. , And allows the electronic components to be placed in the proper position.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“內視鏡裝置、柔性電路板組件及其柔性電路板”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is a specific embodiment to illustrate the implementation of the "endoscope device, flexible circuit board assembly and flexible circuit board" disclosed in the present invention. Those skilled in the art can understand the present invention from the content disclosed in this specification. Advantages and effects. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件,但這些元件不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.
[實施例][Example]
首先,請參閱圖1、圖2、圖6及圖7所示,圖1及圖2分別為本發明實施例的柔性電路板的立體展開示意圖,圖6及圖7分別為本發明實施例的內視鏡裝置的立體分解示意圖。本發明實施例提供一種內視鏡裝置U、柔性電路板組件3及其柔性電路板32。柔性電路板32可應用於柔性電路板組件3,柔性電路板組件3可應用於內視鏡裝置U,然本發明不以此為限。換句話說,柔性電路板32及柔性電路板組件3也可以應用於其他電子裝置,本發明不以柔性電路板組件3及柔性電路板32所應用的場合為限制。須說明的是,以下將先說明柔性電路板32的主要架構,後續再行介紹內視鏡裝置U及柔性電路板組件3的構件。First of all, please refer to Figure 1, Figure 2, Figure 6 and Figure 7. Figure 1 and Figure 2 are respectively a three-dimensional expansion diagram of a flexible circuit board according to an embodiment of the present invention, and Figures 6 and 7 are respectively an embodiment of the present invention The three-dimensional exploded schematic diagram of the endoscope device. The embodiment of the present invention provides an endoscope device U, a flexible
承上述,請復參閱圖1及圖2所示,並請一併參閱圖3所示,圖3為本發明實施例的柔性電路板的俯視展開示意圖。詳細來說,柔性電路板32可為一柔性印刷電路板(Flexible Printed Circuit Board,FPCB),且柔性電路板32可包括一感測模組承載部321、一發光元件承載部322、一第一本體部323、一第二本體部324以及一第三本體部325。第一本體部323可連接於感測模組承載部321的其中一側,第二本體部324可連接於感測模組承載部321的另外一側且對應於第一本體部323,換句話說,第一本體部323及第二本體部324分別位於感測模組承載部321的兩相反側邊。此外,第三本體部325可連接於第一本體部323,且發光元件承載部322可連接於第三本體部325。In view of the foregoing, please refer to FIGS. 1 and 2 again, and also refer to FIG. 3 together. FIG. 3 is a schematic top view of a flexible circuit board according to an embodiment of the present invention. In detail, the
承上述,優選地,以本發明實施例而言,發光元件承載部322可包括一連接於第三本體部325的第一承載端部3221以及一連接於第三本體部325的第二承載端部3222,且第一承載端部3221與第二承載端部3222彼此分離。此外,優選地,以本發明實施例而言,柔性電路板32還可進一步包括一第四本體部326,第四本體部326可連接於第二本體部324。另外,如圖1至圖3所示,第一本體部323及第二本體部324的延伸方向可以與第三本體部325及第四本體部326的延伸方向呈大致垂直。也就是說,第一本體部323及第二本體部324的延伸方向可沿著X方向,第三本體部325及第四本體部326的延伸方向可沿著Z方向,然本發明不以此為限。In view of the above, preferably, according to the embodiment of the present invention, the light-emitting
承上述,舉例來說,電子元件37及/或線纜模組36可設置在第一本體部323、第二本體部324、第三本體部325及/或第四本體部326上。此外,發光元件35可耦接於柔性電路板32且設置在發光元件承載部322上。進一步來說,以本發明實施例而言,可提供兩個發光元件,其中一個發光元件35可設置在第一承載端部3221上,且另外一個發光元件35可設置在第二承載端部3222上。此外,一個或多個電子元件37可設置在第一本體部323及/或第二本體部324上。第三本體部325可提供主要線路設置,且能夠協助發光元件35進行散熱。線纜模組36則可以設置在第四本體部326上,以使得第四本體部326作為線纜模組36的連接器361的焊接區域。藉此,通過將第四本體部326作為線纜模組36的連接器361的焊接區域,能提升焊接作業的便利性。然而,須說明的是,本發明不以上述所舉例子為限制。In view of the above, for example, the
承上述,請復參閱圖1至圖3所示,柔性電路板32還可進一步包括多個連接部327,多個連接部327中的其中一個連接部327可連接於感測模組承載部321與第一本體部323之間,多個連接部327中的另外一個連接部327可連接於感測模組承載部321與第二本體部324之間,多個連接部327中的再一個連接部327可連接於第一本體部323與第三本體部325之間,多個連接部327中的又一個連接部327可連接於第三本體部325與發光元件承載部322之間,多個連接部327中的又再一個連接部327可連接於第二本體部324與第四本體部326之間。藉此,在後續製造過程中,可彎曲柔性電路板32,以使得連接部327受到彎曲,而使得柔性電路板32能繞設在承載基座31上。In accordance with the above, please refer to FIGS. 1 to 3 again, the
承上述,請復參閱圖1至圖3所示,感測模組承載部321可包括一第一表面3211以及一對應於感測模組承載部321的第一表面3211的第二表面3212。發光元件承載部322可包括一第一表面3223以及一對應於發光元件承載部322的第一表面3223的第二表面3224。第一本體部323可包括一第一表面3231以及一對應於第一本體部323的第一表面3231的第二表面3232。第二本體部324可包括一第一表面3241以及一對應於第二本體部324的第一表面3241的第二表面3242。第三本體部325可包括一第一表面3251以及一對應於第三本體部325的第一表面3251的第二表面3252。第四本體部326可包括一第一表面3261以及一對應於第四本體部326的第一表面3261的第二表面3262。In view of the above, please refer to FIGS. 1 to 3 again. The sensing
承上述,以本發明實施例而言,柔性電路板32的其中一表面(例如上表面)可以由感測模組承載部321的第一表面3211、發光元件承載部322的第一表面3223、第一本體部323的第一表面3231、第二本體部324的第一表面3241、第三本體部325的第一表面3251及第四本體部326的第一表面3261所構成。另外,柔性電路板32的另外一表面(例如下表面)可以由感測模組承載部321的第二表面3212、發光元件承載部322的第二表面3224、第一本體部323的第二表面3232、第二本體部324的第二表面3242、第三本體部325的第二表面3252及第四本體部326的第二表面3262所構成。In view of the above, according to the embodiment of the present invention, one of the surfaces (for example, the upper surface) of the
接著,請參閱圖4至圖7所示,圖4及圖5分別為本發明實施例的內視鏡裝置的立體組合示意圖。以下將進一步說明本發明實施例所提供的內視鏡裝置U及柔性電路板組件3的構件。詳細來說,內視鏡裝置U可包括一中空管體1以及一柔性電路板組件3。另外,在一優選實施態樣中,內視鏡裝置U還可進一步包括一工作管道2(Working Channel)。進一步來說,柔性電路板組件3、線纜模組36的多條導線362及工作管道2可設置在中空管體1中,且線纜模組36可耦接於柔性電路板組件3。此外,工作管道2可用於供醫療器械進出操作進行治療。Next, please refer to FIGS. 4 to 7. FIGS. 4 and 5 are respectively a three-dimensional assembly schematic diagram of the endoscope device according to an embodiment of the present invention. The components of the endoscope device U and the flexible
接著,請參閱圖8至圖10所示,圖8至圖10分別為本發明實施例的柔性電路板組件的立體分解示意圖。柔性電路板組件3可包括一承載基座31、一柔性電路板32、一影像感測模組34、一發光元件35以及一線纜模組36。柔性電路板32可設置在承載基座31上,影像感測模組34可耦接於柔性電路板32且設置在柔性電路板32的一感測模組承載部321上,發光元件35可耦接於柔性電路板32且設置在柔性電路板32的一發光元件承載部322上,線纜模組36可耦接於柔性電路板32且設置在柔性電路板32上。Next, please refer to FIGS. 8-10. FIGS. 8-10 are respectively a three-dimensional exploded schematic view of a flexible circuit board assembly according to an embodiment of the present invention. The flexible
承上述,請復參閱圖8至圖10所示,並請一併參閱圖6及圖7所示,柔性電路板組件3還可包括一支撐架33,承載基座31及發光元件承載部322可設置在支撐架33上,支撐架33可用於支撐承載基座31及發光元件承載部322,以使得承載基座31及發光元件承載部322被支撐架33支撐。此外,支撐架33可包括一槽體330以及一抵靠部331。承載基座31可設置在槽體330中,且發光元件承載部322可抵靠在抵靠部331上。此外,柔性電路板組件3還可包括一線纜模組36,線纜模組36可耦接於柔性電路板32,線纜模組36可包括一耦接於柔性電路板32的連接器361以及多條設置於連接器361上的導線362。連接器361可耦接於柔性電路板組件3的柔性電路板32與多條導線362之間。此外,柔性電路板組件3還可進一步包括至少一電子元件37,至少一電子元件37可設置在柔性電路板32上且耦接於柔性電路板32。此外,柔性電路板組件3還可進一步包括:一支撐元件328(如圖1及圖2所示),支撐元件328可設置在感測模組承載部321上,以作為感測模組承載部321的支撐性結構。另外,值得說明的是,本發明全文中的耦接可以是直接連接或者是間接連接,抑或是直接電性連接或者是間接電性連接,本發明不以此為限。In view of the above, please refer to FIGS. 8-10, and also refer to FIGS. 6 and 7 together. The flexible
承上述,請復參閱圖8至圖10所示,並請一併參閱圖11所示,圖11為本發明實施例的柔性電路板組件的另一實施態樣的立體分解示意圖。舉例來說,影像感測模組34可包括一設置在感測模組承載部321上的承載座341以及一設置在承載座341上的影像感測器342。另外,由圖8至圖10與圖11的比較可知,圖8至圖10與圖9的實施態樣最大的差在於影像感測模組34的形式。如圖8至圖10與所示的影像感測模組34的影像感測器342,其可包括光學感測器(Sensor,圖中未示出)及光學元件(Lens,圖中未示出)。由於光學感測器及光學元件是兩個彼此分開的元件,因此,可將光學感測器及光學元件依序設置在承載座341上,並利用承載座341將光學感測器及光學元件相互對齊,以達到光學定位的需求。另外,如圖9所示的影像感測模組34的影像感測器342,其光學感測器(Sensor,圖中未示出)及光學元件(Lens,圖中未示出)為整合在一起的電子零件,因此,承載座341可以是選擇性地設置。換句話說,雖然圖9中的影像感測模組34是設置在承載座341上,但是,在其他實施態樣中,影像感測模組34可以不通過承載座341而直接設置在柔性電路板32上。另外,舉例來說,影像感測器342可例如但不限於感光耦合元件(Charge Coupled Device,CCD)或者是互補性氧化金屬半導體(Complementary Metal-Oxide Semiconductor,CMOS),本發明不以此為限。此外,值得說明的是,發光元件35可例如但不限於發光二極體(Light-emitting diode,LED),且發光元件35的數量也可以為一個或多個,本發明不以此為限。In view of the foregoing, please refer to FIGS. 8 to 10 again, and also refer to FIG. 11 together. FIG. 11 is a three-dimensional exploded schematic view of another implementation aspect of the flexible circuit board assembly according to the embodiment of the present invention. For example, the
接著,請復參閱圖1至圖3及圖8至圖10所示,以下將進一步舉例說明影像感測模組34、發光元件35、線纜模組36、電子元件37及支撐元件328的設置位置。詳細來說,影像感測模組34可設置在感測模組承載部321的第一表面3211上。發光元件35可設置在發光元件承載部322的第一表面3223上。支撐元件328可設置在感測模組承載部321的第二表面3212上。線纜模組36的連接器361可設置在第四本體部326的第一表面3261上。電子元件37可設置在第一本體部323的第一表面3231上及/或第二本體部324的第一表面3241上。支撐元件328可設置在感測模組承載部321的第二表面3212上。然而,須說明的是,本發明不以上述所舉的例子為限制。Next, please refer to FIGS. 1 to 3 and FIGS. 8 to 10 again. The following will further illustrate the arrangement of the
接著,請復參閱圖1至圖3及圖8至圖10所示,並請一併參閱圖12至圖14所示,圖12至圖14分別為本發明實施例的柔性電路板與承載基座的組合過程示意圖。詳細來說,以本發明實施例而言,承載基座31可包括一承載板311、一個或多個設置在承載板311上的定位柱312以及一設置在承載板311上的定位框架313。在將柔性電路板32設置在承載基座31的過程中,可先將柔性電路板32的感測模組承載部321抵靠在承載板311上。優選地,以本發明實施例而言,柔性電路板32的感測模組承載部321還可進一步包括一個或多個定位孔3210,承載基座31的定位柱312可穿設在柔性電路板32的定位孔3210中。藉此,以定位柔性電路板32與承載基座31之間的位置關係。此外,優選地,設置在感測模組承載部321的第二表面3212上的支撐元件328也可以包括一個或多個定位孔3280,且支撐元件328的定位孔3280可對應於柔性電路板32的定位孔3210,以使得承載基座31的定位柱312可穿設在柔性電路板32的定位孔3210及支撐元件328的定位孔3280中。Next, please refer to FIGS. 1 to 3 and FIGS. 8 to 10 again, and please also refer to FIGS. 12 to 14. FIGS. 12 to 14 are respectively the flexible circuit board and the carrier substrate according to the embodiment of the present invention. Block diagram of the assembly process. In detail, according to the embodiment of the present invention, the carrying
承上述,如圖12及圖13所示,當柔性電路板32的感測模組承載部321抵靠在承載板311上之後,可以將連接在感測模組承載部321側邊的第二本體部324向下彎折,以使得連接在感測模組承載部321與第二本體部324之間的連接部327產生彎曲。當柔性電路板32的第二本體部324向下彎折之後,可進一步將連接在第二本體部324上的第四本體部326向前彎折,以使得連接在第二本體部324與第四本體部326之間的連接部327產生彎曲且抵靠在定位框架313的另外一側邊上。藉此,設置在第四本體部326上的線纜模組36的連接器361可以位於容置空間30之中。In view of the above, as shown in FIGS. 12 and 13, after the sensing
接著,如圖13及圖14所示,當設置在第四本體部326上的線纜模組36的連接器361可以位於容置空間30之中之後,可以將連接在感測模組承載部321側邊的第一本體部323向下彎折,以使得連接在感測模組承載部321與第一本體部323之間的連接部327還有產生彎曲。藉此,以使得第一本體部323上的第一表面3231面對第二本體部324上的第一表面3241。接著,可以將連接在第一本體部323上的第三本體部325向後彎折,以使得連接在第一本體部323與第三本體部325之間的連接部327產生彎曲且抵靠在定位框架313的其中一側邊上。藉此,以使得第二本體部324位於第一本體部323與第三本體部325之間,且使得第三本體部325的第二表面3252面對第二本體部324上的第一表面3241。此外,第四本體部326可位於第一本體部323與第二本體部324之間,且使得第四本體部326的第一表面3261面對位於第一本體部323的第二表面3232。進一步來說,當第四本體部326向前彎折以使得第四本體部326位於第一本體部323與第二本體部324之間,且當第三本體部325向後彎折以使得第二本體部324位於第一本體部323與第三本體部325之間且之後,可以將連接在第三本體部325上的第一承載端部3221及第二承載端部3222向前彎折。藉此,柔性電路板32可呈繞曲狀地設置在承載基座31上,且繞曲狀的柔性電路板32與承載基座31之間可定義有一容置空間30,線纜模組36的連接器361可設置在容置空間30中。此外,影像感測模組34可位於其中一個發光元件35與另一發光元件35之間,且發光元件35的光線投射方向(Y方向)與影像感測模組34的影像擷取方向(Y方向)相同。Next, as shown in FIGS. 13 and 14, after the
[實施例的有益效果][Beneficial effects of the embodiment]
本發明的其中一有益效果在於,本發明實施例所提供的內視鏡裝置U、柔性電路板組件3及其柔性電路板32,其能利用“柔性電路板32呈繞曲狀地設置在承載基座31上,且繞曲狀的柔性電路板32與承載基座31之間定義有一容置空間30,線纜模組36的連接器361耦接於柔性電路板32且設置在容置空間30中”的技術方案,而能提高散熱效率,且能讓電子元件配置在適當的位置上。One of the beneficial effects of the present invention is that the endoscope device U, the flexible
更進一步地,通過將第四本體部326作為線纜模組36的連接器361的焊接區域,能提升焊接作業的便利性。Furthermore, by using the
更進一步地,承載基座31的定位柱312可穿設在柔性電路板32的定位孔3210中。藉此,可增加柔性電路板32與承載基座31之間的定位性。Furthermore, the
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.
U:內視鏡裝置 1:中空管體 2:工作管道 3:柔性電路板組件 30:容置空間 31:承載基座 311:承載板 312:定位柱 313:定位框架 32:柔性電路板 321:感測模組承載部 3211:第一表面 3212:第二表面 3210:定位孔 322:發光元件承載部 3221:第一承載端部 3222:第二承載端部 3223:第一表面 3224:第二表面 323:第一本體部 3231:第一表面 3232:第二表面 324:第二本體部 3241:第一表面 3242:第二表面 325:第三本體部 3251:第一表面 3252:第二表面 326:第四本體部 3261:第一表面 3262:第二表面 327:連接部 328:支撐元件 3280:定位孔 33:支撐架 330:槽體 331:抵靠部 34:影像感測模組 341:承載座 342:影像感測器 35:發光元件 36:線纜模組 361:連接器 362:導線 37:電子元件 X、Y、Z:方向 U: Endoscope device 1: Hollow tube body 2: Working pipeline 3: Flexible circuit board assembly 30: accommodation space 31: Carrying base 311: Carrier Board 312: Positioning column 313: positioning frame 32: flexible circuit board 321: Sensor module carrying part 3211: first surface 3212: second surface 3210: positioning hole 322: Light-emitting element carrying part 3221: The first bearing end 3222: second bearing end 3223: first surface 3224: second surface 323: The first body part 3231: first surface 3232: second surface 324: The second body part 3241: first surface 3242: second surface 325: Third Body 3251: first surface 3252: second surface 326: Fourth Body 3261: first surface 3262: second surface 327: Connection 328: support element 3280: positioning hole 33: Support frame 330: tank 331: Abutment 34: Image sensor module 341: Carrier 342: Image Sensor 35: Light-emitting element 36: cable module 361: Connector 362: Wire 37: Electronic components X, Y, Z: direction
圖1為本發明實施例的柔性電路板的其中一立體展開示意圖。FIG. 1 is one of the three-dimensional expanded schematic diagrams of the flexible circuit board according to the embodiment of the present invention.
圖2為本發明實施例的柔性電路板的另外一立體展開示意圖。2 is another three-dimensional unfolding schematic diagram of the flexible circuit board according to the embodiment of the present invention.
圖3為本發明實施例的柔性電路板的俯視展開示意圖。FIG. 3 is a top view and unfolded schematic diagram of a flexible circuit board according to an embodiment of the present invention.
圖4為本發明實施例的內視鏡裝置的其中一立體組合示意圖。4 is a schematic diagram of a three-dimensional assembly of the endoscope device according to the embodiment of the present invention.
圖5為本發明實施例的內視鏡裝置的另外一立體組合示意圖。5 is another three-dimensional assembly diagram of the endoscope device according to the embodiment of the present invention.
圖6為本發明實施例的內視鏡裝置的其中一立體分解示意圖。Fig. 6 is a three-dimensional exploded schematic view of the endoscope device according to the embodiment of the present invention.
圖7為本發明實施例的內視鏡裝置的另外一立體分解示意圖。FIG. 7 is another three-dimensional exploded schematic diagram of the endoscope device according to the embodiment of the present invention.
圖8為本發明實施例的柔性電路板組件的其中一立體分解示意圖。FIG. 8 is a three-dimensional exploded schematic view of the flexible circuit board assembly according to the embodiment of the present invention.
圖9為本發明實施例的柔性電路板組件的另外一立體分解示意圖。FIG. 9 is another three-dimensional exploded schematic diagram of the flexible circuit board assembly according to the embodiment of the present invention.
圖10為本發明實施例的柔性電路板組件的再一立體分解示意圖。FIG. 10 is another three-dimensional exploded schematic view of the flexible circuit board assembly according to the embodiment of the present invention.
圖11為本發明實施例的柔性電路板組件的另一實施態樣的立體分解示意圖。FIG. 11 is a three-dimensional exploded schematic diagram of another implementation aspect of the flexible circuit board assembly according to the embodiment of the present invention.
圖12為本發明實施例的柔性電路板與承載基座的其中一組合過程示意圖。FIG. 12 is a schematic diagram of one of the assembly processes of the flexible circuit board and the carrier base according to the embodiment of the present invention.
圖13為本發明實施例的柔性電路板與承載基座的另外一組合過程示意圖。FIG. 13 is a schematic diagram of another assembly process of the flexible circuit board and the carrier base according to the embodiment of the present invention.
圖14為本發明實施例的柔性電路板與承載基座的再一組合過程示意圖。FIG. 14 is a schematic diagram of another assembly process of the flexible circuit board and the carrier base according to the embodiment of the present invention.
U:內視鏡裝置 U: Endoscope device
1:中空管體 1: Hollow tube body
2:工作管道 2: Working pipeline
3:柔性電路板組件 3: Flexible circuit board assembly
X、Y、Z:方向 X, Y, Z: direction
Claims (16)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911127946.3A CN111315111B (en) | 2018-12-12 | 2019-11-18 | Endoscope device, flexible circuit board assembly and flexible circuit board thereof |
| US16/711,518 US20200196434A1 (en) | 2018-12-12 | 2019-12-12 | Endoscope device, and flexible printed circuit board assembly and flexible circuit board thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107144790 | 2018-12-12 | ||
| TW107144790 | 2018-12-12 |
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| TW202021524A TW202021524A (en) | 2020-06-16 |
| TWI706764B true TWI706764B (en) | 2020-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108140527A TWI706764B (en) | 2018-12-12 | 2019-11-07 | Endoscope device, and flexible printed circuit board assembly and flexible circuit board thereof |
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| Country | Link |
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| TW (1) | TWI706764B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI875307B (en) * | 2022-11-13 | 2025-03-01 | 榮晶生物科技股份有限公司 | Endoscopic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI855304B (en) * | 2022-03-22 | 2024-09-11 | 晉弘科技股份有限公司 | Image sensor package and endoscope |
| TWI836767B (en) * | 2022-12-02 | 2024-03-21 | 群光電子股份有限公司 | Endoscope module |
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| CN101548535A (en) * | 2007-01-16 | 2009-09-30 | 奥林巴斯医疗株式会社 | Imaging device, and endoscope |
| TW201105129A (en) * | 2009-07-21 | 2011-02-01 | Limit Optics Co Ltd | Camera module |
| CN103348470A (en) * | 2010-12-09 | 2013-10-09 | 恩多巧爱思创新中心有限公司 | Flexible electronic circuit board for multi-camera endoscopy |
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| CN101548535A (en) * | 2007-01-16 | 2009-09-30 | 奥林巴斯医疗株式会社 | Imaging device, and endoscope |
| TW201105129A (en) * | 2009-07-21 | 2011-02-01 | Limit Optics Co Ltd | Camera module |
| CN103348470A (en) * | 2010-12-09 | 2013-10-09 | 恩多巧爱思创新中心有限公司 | Flexible electronic circuit board for multi-camera endoscopy |
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| TWI875307B (en) * | 2022-11-13 | 2025-03-01 | 榮晶生物科技股份有限公司 | Endoscopic device |
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| TW202021524A (en) | 2020-06-16 |
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