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TWI706555B - Light emitting device - Google Patents

Light emitting device Download PDF

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TWI706555B
TWI706555B TW108101892A TW108101892A TWI706555B TW I706555 B TWI706555 B TW I706555B TW 108101892 A TW108101892 A TW 108101892A TW 108101892 A TW108101892 A TW 108101892A TW I706555 B TWI706555 B TW I706555B
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light
layer
electrode
opening
emitting device
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TW108101892A
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Chinese (zh)
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TW202029492A (en
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江啟聖
蔡庭瑋
詹鈞翔
李欣浤
范鐸正
蔡旻錦
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友達光電股份有限公司
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Priority to TW108101892A priority Critical patent/TWI706555B/en
Priority to CN201910740063.3A priority patent/CN110459567B/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes

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  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A light emitting device includes a substrate, an active component, a first blocking layer, a light conversion layer, a transparent electrode, a second blocking layer, an electroluminescence component, a top electrode, and a light sensing component. The first blocking layer is on the active component and includes a first opening. The light conversion layer is in the first opening. The transparent electrode is on the first blocking layer and the light conversion layer and is electrically connected to the active component. The second blocking layer is on the transparent electrode and includes a second opening corresponding to the first opening. The electroluminescence component is in the second opening. The transparent electrode is between the first opening and the second opening. The electroluminescence component is between the top electrode and the transparent electrode. The light sensing component includes a first electrode, a second electrode, and a light sensing layer. The light sensing layer is positioned corresponding to the first opening. The first electrode and the second electrode are respectively electrically connected to the light sensing layer.

Description

發光裝置Light-emitting device

本發明是關於一種,且特別是關於一種發光裝置,且特別是關於一種用於顯示面板的發光裝置。 The present invention relates to a light-emitting device, and more particularly, to a light-emitting device for a display panel.

現有一種顯示面板,此顯示面板具有多個發光裝置,每個發光裝置包括量子點與對應的主動元件,每個量子點的出光開口可形成一個像素,且這些量子點的出光開口會排列而形成像素陣列,而此像素陣列可用以顯示影像。其中每個量子點填有電致發光材料與光轉換材料,且每個量子點中的電致發光元件會電性連接至對應的主動元件。顯示面板的控制模組可控制每個主動元件,並以主動元件驅動對應的量子點中的電致發光元件,使電致發光材料發光。對應的光轉換材料會將電致發光材料所發出的光轉換為特定顏色的光,而此特定顏色的光會由對應的出光開口射出。當顯示面板的控制模組在同一幀畫面給予每個主動元件相同的電壓或電流時,每個電致發光材料的出光亮度應該是相同的,而每個光轉換材料的出光亮度也應該是相同的,且像素陣列在這一幀畫面所呈現的亮度或顏色,整體而言應該是一致的。 There is a display panel. The display panel has a plurality of light-emitting devices. Each light-emitting device includes quantum dots and corresponding active elements. The light-emitting opening of each quantum dot can form a pixel, and the light-emitting openings of these quantum dots are arranged to form Pixel array, and this pixel array can be used to display images. Each quantum dot is filled with electroluminescent material and light conversion material, and the electroluminescent element in each quantum dot is electrically connected to the corresponding active element. The control module of the display panel can control each active element, and use the active element to drive the electroluminescent element in the corresponding quantum dot to make the electroluminescent material emit light. The corresponding light conversion material converts the light emitted by the electroluminescent material into light of a specific color, and the light of the specific color is emitted from the corresponding light exit opening. When the control module of the display panel gives each active element the same voltage or current in the same frame, the brightness of each electroluminescent material should be the same, and the brightness of each light conversion material should also be the same Yes, and the brightness or color of the pixel array in this frame should be consistent overall.

根據現有的此種顯示面板,即使每個量子點中的電致發光材料接收到的電壓或電流是相同的,但對應各量子點的各像素的亮度卻可能 不一致。原因之一在於製程上的誤差與元件本身的公差,導致量子點中的電致發光元件的效率或光轉換材料的厚度無法完全相同,因此在相同電壓或電流下,各個量子點中的電致發光材料的出光亮度可能略有差異,且各個量子點中的光轉換材料的出光亮度亦可能略有差異。此外,光轉換材料需要將電致發光元件提供的入射光轉換特定波長的光,使得由出光開口射出的光會具有特定顏色。但因為光轉換材料的厚度有一定限制,原本該被轉換的入射光仍會有一定比率漏出。並且,由於各量子點的光轉換材料的厚度無法完全相同,因而每個量子點的漏光率亦有差異,這也會造成各像素所發出的光的亮度與色純度無法完全一致。由此可知,現有顯示面板的發光裝置會導致色不均(mura)的現象。 According to the existing display panel of this kind, even if the voltage or current received by the electroluminescent material in each quantum dot is the same, the brightness of each pixel corresponding to each quantum dot may be Inconsistent. One of the reasons is the error in the manufacturing process and the tolerance of the device itself, resulting in that the efficiency of the electroluminescent device in the quantum dots or the thickness of the light conversion material cannot be exactly the same. Therefore, under the same voltage or current, the electroluminescence in each quantum dot The light-emitting brightness of the luminescent material may be slightly different, and the light-emitting brightness of the light conversion material in each quantum dot may also be slightly different. In addition, the light conversion material needs to convert the incident light provided by the electroluminescent element into light of a specific wavelength, so that the light emitted from the light exit opening will have a specific color. However, because the thickness of the light conversion material is limited, the incident light that should be converted will still leak out at a certain rate. Moreover, since the thickness of the light conversion material of each quantum dot cannot be exactly the same, the light leakage rate of each quantum dot is also different, which will also cause the brightness and color purity of the light emitted by each pixel to not be completely consistent. It can be seen that the light emitting device of the existing display panel will cause the phenomenon of color unevenness (mura).

本發明的至少一實施例提出一種發光裝置,以確保發光裝置的出光亮度可符合預期,並降低色不均的現象。 At least one embodiment of the present invention provides a light-emitting device to ensure that the brightness of the light-emitting device can meet expectations and reduce the phenomenon of color unevenness.

本發明的至少一實施例提出一種發光裝置,其包括基板、主動元件、第一遮光層、光轉換層、透明電極、第二遮光層、電致發光元件、頂電極與光感測元件。主動元件位於基板上,第一遮光層位於主動元件上且包括第一開口,光轉換層位於第一開口中,透明電極位於第一遮光層與光轉換層上且電性連接主動元件,第二遮光層位於透明電極上且包括對應第一開口的第二開口,且電致發光元件位於第二開口中。其中透明電極位於第一開口與第二開口之間,電致發光元件位於頂電極與透明電極之間。光感測元件包括第一電極、第二電極與光感測層,光感測層對應第一開口設置,且第一電極與第二電極分別電性連接光感測層。 At least one embodiment of the present invention provides a light-emitting device, which includes a substrate, an active element, a first light-shielding layer, a light conversion layer, a transparent electrode, a second light-shielding layer, an electroluminescent element, a top electrode, and a light sensing element. The active device is located on the substrate, the first light shielding layer is located on the active device and includes a first opening, the light conversion layer is located in the first opening, and the transparent electrode is located on the first light shielding layer and the light conversion layer and is electrically connected to the active device. The light shielding layer is located on the transparent electrode and includes a second opening corresponding to the first opening, and the electroluminescent element is located in the second opening. The transparent electrode is located between the first opening and the second opening, and the electroluminescent element is located between the top electrode and the transparent electrode. The light sensing element includes a first electrode, a second electrode, and a light sensing layer. The light sensing layer is disposed corresponding to the first opening, and the first electrode and the second electrode are electrically connected to the light sensing layer, respectively.

綜上所述,根據本發明至少一實施例的發光裝置,其可藉由 光感測元件感測到第一開口的出光亮度,以利於根據此亮度維持或調整主動元件用來驅動電致發光元件的電壓或電流,從而確保發光裝置的出光亮度可符合預期,並降低色不均的現象。 In summary, according to at least one embodiment of the light-emitting device of the present invention, it can be The light-sensing element senses the light-emitting brightness of the first opening to facilitate maintaining or adjusting the voltage or current used by the active element to drive the electroluminescent element according to the brightness, thereby ensuring that the light-emitting device's light-emitting brightness can meet expectations and reducing color Uneven phenomenon.

以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟悉相關技術者暸解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技術者可輕易地理解本發明相關之目的及優點。 The detailed features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient to enable anyone familiar with the relevant technology to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings Anyone familiar with related technologies can easily understand the related objectives and advantages of the present invention.

100:發光裝置 100: Light-emitting device

110:基板 110: substrate

120:主動元件 120: Active component

121:通道層 121: Channel layer

122:閘極絕緣層 122: gate insulating layer

123:層間絕緣層 123: Interlayer insulation layer

124:第一導體層 124: first conductor layer

125:第二導體層 125: second conductor layer

130:第一遮光層 130: first shading layer

131:第一開口 131: First opening

132:第一部分 132: Part One

133:第二部分 133: Part Two

140:光轉換層 140: light conversion layer

141:色阻層 141: color resist layer

150:透明電極 150: Transparent electrode

160:第二遮光層 160: second shading layer

161:第二開口 161: second opening

170:電致發光元件 170: Electroluminescent element

171:第一傳輸層 171: The first transport layer

172:第二傳輸層 172: second transport layer

173:發光層 173: light-emitting layer

180:頂電極 180: top electrode

190:光感測元件 190: light sensing element

191:第一電極 191: first electrode

192:第二電極 192: second electrode

193:光感測層 193: light sensing layer

210:第三遮光層 210: third shading layer

211:第三開口 211: Third Opening

220:第一絕緣層 220: first insulating layer

230:第二絕緣層 230: second insulating layer

240:封裝層 240: encapsulation layer

250:第二光感測元件 250: second light sensing element

251:第一電極 251: first electrode

252:第二電極 252: second electrode

253:光感測層 253: light sensing layer

300:控制模組 300: control module

D:汲極 D: Dip pole

G:閘極 G: Gate

ND:法線方向 ND: Normal direction

S:源極 S: source

W11、W12、W21、W22:寬度 W11, W12, W21, W22: width

圖1所示為本發明第一實施例的發光裝置的底視示意圖;圖2所示為圖1的2-2線段處的剖面示意圖;圖3所示為圖1的發光裝置的系統方塊示意圖;圖4所示為本發明第二實施例的發光裝置的剖面示意圖;圖5所示為本發明第三實施例的發光裝置的剖面示意圖;圖6所示為本發明第四實施例的發光裝置的剖面示意圖;圖7所示為本發明第五實施例的發光裝置的剖面示意圖;以及圖8所示為本發明第六實施例的發光裝置的剖面示意圖。 Fig. 1 is a schematic bottom view of the light-emitting device according to the first embodiment of the present invention; Fig. 2 is a schematic cross-sectional view at the line 2-2 of Fig. 1; Fig. 3 is a system block diagram of the light-emitting device of Fig. 1 4 is a schematic cross-sectional view of a light-emitting device according to a second embodiment of the present invention; FIG. 5 is a schematic cross-sectional view of a light-emitting device according to a third embodiment of the present invention; Fig. 7 is a schematic cross-sectional view of a light-emitting device according to a fifth embodiment of the present invention; and Fig. 8 is a schematic cross-sectional view of a light-emitting device according to a sixth embodiment of the present invention.

請參照圖1與圖2,圖1為本發明第一實施例的發光裝置100的底視示意圖,圖2為圖1的2-2線段處的剖面示意圖。如圖1與圖2所示,在本實施例中,發光裝置100包括基板110、主動元件120、第一遮光層130、光轉換層140、透明電極150、第二遮光層160、電致發光元件170、 頂電極180與光感測元件190。主動元件120位於基板110上,且第一遮光層130位於主動元件120上。第一遮光層130包括第一開口131,且光轉換層140位於第一開口131中。透明電極150位於第一遮光層130與光轉換層140上,且透明電極150是電性連接主動元件120。第二遮光層160位於透明電極150上,且第二遮光層160包括第二開口161,且電致發光元件170位於第二開口161中。第二開口161是對應第一開口131,例如第一開口131與第二開口161是在基板110的法線方向ND上彼此對齊。透明電極150是位於第一遮光層130上,且透明電極150是位於第一開口131與第二開口161之間。頂電極180位於第二開口161遠離透明電極150的一側,電致發光元件170位於頂電極180與透明電極150之間,且電致發光元件170的兩端分別電性連接透明電極150與頂電極180。在一些實施例中,頂電極180亦可位於第二遮光層160上,且頂電極180延伸進入第二開口161中以電性連接電致發光元件170。 Please refer to FIGS. 1 and 2. FIG. 1 is a schematic bottom view of a light emitting device 100 according to a first embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view at the line 2-2 of FIG. As shown in FIGS. 1 and 2, in this embodiment, the light-emitting device 100 includes a substrate 110, an active element 120, a first light-shielding layer 130, a light conversion layer 140, a transparent electrode 150, a second light-shielding layer 160, and electroluminescence. Element 170, The top electrode 180 and the light sensing element 190. The active device 120 is located on the substrate 110, and the first light shielding layer 130 is located on the active device 120. The first light shielding layer 130 includes a first opening 131, and the light conversion layer 140 is located in the first opening 131. The transparent electrode 150 is located on the first light shielding layer 130 and the light conversion layer 140, and the transparent electrode 150 is electrically connected to the active device 120. The second light shielding layer 160 is located on the transparent electrode 150, and the second light shielding layer 160 includes a second opening 161, and the electroluminescent element 170 is located in the second opening 161. The second opening 161 corresponds to the first opening 131, for example, the first opening 131 and the second opening 161 are aligned with each other in the normal direction ND of the substrate 110. The transparent electrode 150 is located on the first light shielding layer 130, and the transparent electrode 150 is located between the first opening 131 and the second opening 161. The top electrode 180 is located on the side of the second opening 161 away from the transparent electrode 150, the electroluminescent element 170 is located between the top electrode 180 and the transparent electrode 150, and both ends of the electroluminescent element 170 are electrically connected to the transparent electrode 150 and the top Electrodes 180. In some embodiments, the top electrode 180 may also be located on the second light-shielding layer 160, and the top electrode 180 extends into the second opening 161 to be electrically connected to the electroluminescent element 170.

如圖2所示,在本實施例中,主動元件120包括通道層121、閘極絕緣層122、層間絕緣層123、第一導體層124的閘極G與第二導體層125的源極S與汲極D。通道層121位於基板110上,閘極絕緣層122位於通道層121上,閘極G位於閘極絕緣層122上,而閘極絕緣層122位於閘極G與通道層121之間。層間絕緣層123位於閘極G與閘極緣層上,源極S與汲極D位於層間絕緣層123上,且層間絕緣層123位於源極S與閘極G之間以及汲極D與閘極G之間。閘極G是由第一導體層124形成,例如在第一導體層124形成於閘極絕緣層122上之後,進一步使第一導體層124圖案化而形成閘極G。源極S與汲極D是由第二導體層125形成,例如在第二導體層125 形成於層間絕緣層123上之後,進一步使第二導體層125圖案化而形成源極S與汲極D。閘極G與通道層121是被閘極絕緣層122隔開,源極S與汲極D則是分別穿過層間絕緣層123與閘極絕緣層122而電性連接至通道層121。 As shown in FIG. 2, in this embodiment, the active device 120 includes a channel layer 121, a gate insulating layer 122, an interlayer insulating layer 123, a gate G of the first conductor layer 124, and a source S of the second conductor layer 125. And drain D. The channel layer 121 is located on the substrate 110, the gate insulating layer 122 is located on the channel layer 121, the gate G is located on the gate insulating layer 122, and the gate insulating layer 122 is located between the gate G and the channel layer 121. The interlayer insulating layer 123 is located on the gate G and the gate edge layer, the source S and the drain D are located on the interlayer insulating layer 123, and the interlayer insulating layer 123 is located between the source S and the gate G, and the drain D and the gate Between extremely G. The gate G is formed by the first conductive layer 124. For example, after the first conductive layer 124 is formed on the gate insulating layer 122, the first conductive layer 124 is further patterned to form the gate G. The source S and the drain D are formed by the second conductor layer 125, for example, on the second conductor layer 125 After being formed on the interlayer insulating layer 123, the second conductive layer 125 is further patterned to form a source S and a drain D. The gate G and the channel layer 121 are separated by the gate insulating layer 122, and the source S and the drain D pass through the interlayer insulating layer 123 and the gate insulating layer 122, respectively, and are electrically connected to the channel layer 121.

如圖2所示,在本實施例中,第一遮光層130包括第一部分132與第二部分133,第一部分132與第二部分133是彼此連接。第一部分132實質上覆蓋主動元件120,而第二部分133是延伸至層間絕緣層123與閘極絕緣層122中,且第一開口131是貫穿第一遮光層130的第二部分133。透明電極150是穿過第一遮光層130的第一部分132並電性連接汲極D。在本實施例中,第二部分133是貫穿層間絕緣層123與閘極絕緣層122。 As shown in FIG. 2, in this embodiment, the first light shielding layer 130 includes a first portion 132 and a second portion 133, and the first portion 132 and the second portion 133 are connected to each other. The first part 132 substantially covers the active device 120, the second part 133 extends into the interlayer insulating layer 123 and the gate insulating layer 122, and the first opening 131 penetrates the second part 133 of the first light shielding layer 130. The transparent electrode 150 passes through the first portion 132 of the first light shielding layer 130 and is electrically connected to the drain electrode D. In this embodiment, the second portion 133 penetrates the interlayer insulating layer 123 and the gate insulating layer 122.

如圖1與圖2所示,在本實施例中,發光裝置100更包括第三遮光層210。第三遮光層210位於基板110與主動元件120之間,且第三遮光層210包括第三開口211。第三開口211是對應第一開口131,例如第一開口131與第三開口211是在基板110的法線方向ND上彼此對齊。 As shown in FIGS. 1 and 2, in this embodiment, the light-emitting device 100 further includes a third light shielding layer 210. The third light shielding layer 210 is located between the substrate 110 and the active device 120, and the third light shielding layer 210 includes a third opening 211. The third opening 211 corresponds to the first opening 131, for example, the first opening 131 and the third opening 211 are aligned with each other in the normal direction ND of the substrate 110.

如圖2所示,在本實施例中,主動元件120用以驅動電致發光元件170。例如主動元件120是以特定電壓或電流驅動電致發光元件170,使電致發光元件170發光。並且,第一遮光層130、第二遮光層160、第三遮光層210與頂電極180是不透明的,而基板110是透明的。電致發光元件170發出的光會自第二開口161穿過透明電極150而進入第一開口131中,而第一開口131中的光轉換層140會將來自於電致發光元件170的光轉換為特定顏色。例如電致發光元件170發出的光是藍光,而光轉換層140會將藍光轉換成特定波長的光,使藍光轉成綠光、紅光或特定顏色的光。 經由光轉換層140轉換的特定顏色的光會自第二開口161朝第三開口211射出,自第二開口161射出的光會進一步穿過第三開口211與基板110射出。在本實施例中,自第二開口161射出的光可能以球面的型態擴散,第三遮光層210可阻擋擴散的光,並限制光只能自第三開口211射出,從而使穿過基板110的光會集中在對應於第三開口211的範圍。在一些實施例中,發光裝置100亦可不包括第三遮光層210,因而穿過基板110的光會集中在對應於第一開口131的範圍。 As shown in FIG. 2, in this embodiment, the active device 120 is used to drive the electroluminescent device 170. For example, the active device 120 drives the electroluminescent device 170 with a specific voltage or current to make the electroluminescent device 170 emit light. In addition, the first light shielding layer 130, the second light shielding layer 160, the third light shielding layer 210, and the top electrode 180 are opaque, and the substrate 110 is transparent. The light emitted by the electroluminescent element 170 will pass through the transparent electrode 150 from the second opening 161 and enter the first opening 131, and the light conversion layer 140 in the first opening 131 will convert the light from the electroluminescent element 170 For a specific color. For example, the light emitted by the electroluminescent element 170 is blue light, and the light conversion layer 140 converts the blue light into light of a specific wavelength, and converts the blue light into green light, red light or light of a specific color. The light of a specific color converted by the light conversion layer 140 is emitted from the second opening 161 toward the third opening 211, and the light emitted from the second opening 161 is further emitted through the third opening 211 and the substrate 110. In this embodiment, the light emitted from the second opening 161 may diffuse in the form of a spherical surface. The third light shielding layer 210 can block the diffused light and restrict the light from only emitting from the third opening 211, so as to pass through the substrate. The light of 110 will be concentrated in a range corresponding to the third opening 211. In some embodiments, the light emitting device 100 may not include the third light shielding layer 210, so the light passing through the substrate 110 will be concentrated in the area corresponding to the first opening 131.

如圖2所示,在本實施例中,光轉換層140包括色阻層141,色阻層141位於第一開口131遠離透明電極150的一側。色阻層141可吸收漏光,例如電致發光元件170發出的光是藍光,而光轉換層140會將藍光轉成紅光,則色阻層141可包括紅色色阻材料,以吸收漏出的藍光,使光轉換層140射出的光都是紅光。在一些實施例中,光轉換層140包括量子點材料,如鈣鈦礦材料、硒化鎘、磷化銦等,但不限於此。在一些實施例中,色阻層141包括濾光材料,如染料、色素、螢光材料等,但不限於此。 As shown in FIG. 2, in this embodiment, the light conversion layer 140 includes a color resist layer 141, and the color resist layer 141 is located on the side of the first opening 131 away from the transparent electrode 150. The color resist layer 141 can absorb light leakage. For example, the light emitted by the electroluminescent element 170 is blue light, and the light conversion layer 140 converts blue light into red light. The color resist layer 141 may include a red color resist material to absorb the leaked blue light. , The light emitted from the light conversion layer 140 is red light. In some embodiments, the light conversion layer 140 includes quantum dot materials, such as perovskite materials, cadmium selenide, indium phosphide, etc., but is not limited thereto. In some embodiments, the color resist layer 141 includes filter materials, such as dyes, pigments, fluorescent materials, etc., but is not limited thereto.

如圖2所示,在本實施例中,電致發光元件170包括第一傳輸層171、發光層173與第二傳輸層172。發光層173於第一傳輸層171與第二傳輸層172之間,第一傳輸層171連接透明電極150,且第二傳輸層172連接頂電極180。第一傳輸層171與第二傳輸層172的其中一者為電子傳輸層,另一者為電洞傳輸層。在一些實施例中,第一傳輸層171料可包括氧化鎳,而第二傳輸層172可包括氧化鋅,但不限於此。在一些實施例中,發光層173可包括有機發光材料或量子點材料,如鈣鈦礦,但不限於此。 As shown in FIG. 2, in this embodiment, the electroluminescent element 170 includes a first transmission layer 171, a light emitting layer 173 and a second transmission layer 172. The light-emitting layer 173 is between the first transmission layer 171 and the second transmission layer 172, the first transmission layer 171 is connected to the transparent electrode 150, and the second transmission layer 172 is connected to the top electrode 180. One of the first transport layer 171 and the second transport layer 172 is an electron transport layer, and the other is a hole transport layer. In some embodiments, the first transmission layer 171 may include nickel oxide, and the second transmission layer 172 may include zinc oxide, but is not limited thereto. In some embodiments, the light-emitting layer 173 may include organic light-emitting materials or quantum dot materials, such as perovskite, but is not limited thereto.

如圖2所示,在本實施例中,第一開口131是呈倒錐形,而 第二開口161是呈錐形。第一開口131遠離透明電極150的一側的寬度W11是小於第一開口131靠近透明電極150的一側的寬度W12,且第一開口131是自遠離透明電極150的一側至靠近透明電極150的一側漸寬。第二開口161遠離透明電極150的一側的寬度W22是小於第二開口161靠近透明電極150的一側的寬度W21,且第二開口161是自遠離透明電極150的一側至靠近透明電極150的一側漸寬。在本實施例中,第二開口161靠近透明電極150的一側的寬度W21是大於或等於第一開口131靠近透明電極150的一側的寬度W12,但不限於此。在一些實施例中,第二開口161亦可呈倒錐形,即第二開口161遠離透明電極150的一側的寬度W22是大於第二開口161靠近透明電極150的一側的寬度W21。在一些實施例中,第二開口161亦可呈柱形,即第二開口161遠離透明電極150的一側的寬度W22是等於第二開口161靠近透明電極150的一側的寬度W21。 As shown in Figure 2, in this embodiment, the first opening 131 is inverted cone shape, and The second opening 161 is tapered. The width W11 of the side of the first opening 131 away from the transparent electrode 150 is smaller than the width W12 of the side of the first opening 131 close to the transparent electrode 150, and the first opening 131 is from the side away from the transparent electrode 150 to the side close to the transparent electrode 150 One side becomes wider. The width W22 of the side of the second opening 161 away from the transparent electrode 150 is smaller than the width W21 of the side of the second opening 161 close to the transparent electrode 150, and the second opening 161 is from the side away from the transparent electrode 150 to the side close to the transparent electrode 150 One side becomes wider. In this embodiment, the width W21 of the side of the second opening 161 close to the transparent electrode 150 is greater than or equal to the width W12 of the side of the first opening 131 close to the transparent electrode 150, but is not limited thereto. In some embodiments, the second opening 161 may also have an inverted cone shape, that is, the width W22 of the second opening 161 away from the transparent electrode 150 is greater than the width W21 of the second opening 161 near the transparent electrode 150. In some embodiments, the second opening 161 may also be cylindrical, that is, the width W22 of the side of the second opening 161 away from the transparent electrode 150 is equal to the width W21 of the side of the second opening 161 close to the transparent electrode 150.

在一些實施例中,發光裝置100可應用於主動式發光的顯示面板,而主動元件120可包括多組源極S、汲極D、通道層121與閘極G,且第一遮光層130、第二遮光層160與第三遮光層210可分別包括多個第一開口131、多個第二開口161與多個第三開口211。各組源極S、汲極D、通道層121與閘極G中的汲極D是透過對應的透明電極150電性連接對應的第二開口161中的電致發光元件170,且各第二開口161是在基板110的法線方向ND上對齊對應的第一開口131與第三開口211。如圖1所示,第三遮光層210的多個第三開口211是以矩陣方式排列,但不限於此。如圖2所示,每一第三開口211是對齊一組對應的電致發光元件170與光轉換層140。每一組源極S、汲極D、通道層121與閘極G可獨立驅動對應的電致 發光元件170發光,且電致發光元件170所發出的光會由對應的第三開口211射出。換言之,各第三開口211分別為顯示面板的像素陣列的各個像素發光口。 In some embodiments, the light emitting device 100 can be applied to an active light emitting display panel, and the active device 120 can include multiple sets of source S, drain D, channel layer 121 and gate G, and the first light shielding layer 130, The second light shielding layer 160 and the third light shielding layer 210 may include a plurality of first openings 131, a plurality of second openings 161, and a plurality of third openings 211, respectively. The source electrode S, the drain electrode D, the drain electrode D in the channel layer 121 and the gate electrode G of each group are electrically connected to the electroluminescent element 170 in the corresponding second opening 161 through the corresponding transparent electrode 150, and each second The opening 161 is aligned with the corresponding first opening 131 and the third opening 211 in the normal direction ND of the substrate 110. As shown in FIG. 1, the plurality of third openings 211 of the third light shielding layer 210 are arranged in a matrix, but it is not limited thereto. As shown in FIG. 2, each third opening 211 is aligned with a set of corresponding electroluminescent element 170 and light conversion layer 140. Each group of source S, drain D, channel layer 121 and gate G can independently drive the corresponding electro-induced The light emitting element 170 emits light, and the light emitted by the electroluminescent element 170 will be emitted from the corresponding third opening 211. In other words, each third opening 211 is each pixel light-emitting port of the pixel array of the display panel.

如圖2所示,在本實施例中,光感測元件190包括第一電極191、第二電極192與光感測層193。光感測層193是對應第一開口131設置,以接收通過第一開口131的光或自第一開口131射出的光。第一電極191與第二電極192分別電性連接光感測層193,以在光感測層193接收光之後產生光電流。第一電極191是位於基板110與主動元件120之間,且第二電極192是位於主動元件120與第一遮光層130之間。在本實施例中,當電致發光元件170發出的光被光轉換層140轉換並自第一開口131射出,光感測元件190可用來感測第一開口131的出光亮度。在一些實施例中,光感測層193包括光電二極體(photodiode),但不限於此。 As shown in FIG. 2, in this embodiment, the light sensing element 190 includes a first electrode 191, a second electrode 192 and a light sensing layer 193. The light sensing layer 193 is disposed corresponding to the first opening 131 to receive the light passing through the first opening 131 or the light emitted from the first opening 131. The first electrode 191 and the second electrode 192 are respectively electrically connected to the light sensing layer 193 to generate a photocurrent after the light sensing layer 193 receives light. The first electrode 191 is located between the substrate 110 and the active device 120, and the second electrode 192 is located between the active device 120 and the first light shielding layer 130. In this embodiment, when the light emitted by the electroluminescent element 170 is converted by the light conversion layer 140 and emitted from the first opening 131, the light sensing element 190 can be used to sense the brightness of the light emitted by the first opening 131. In some embodiments, the light sensing layer 193 includes a photodiode, but is not limited thereto.

如圖2所示,在本實施例中,第三遮光層210為金屬層。光感測元件190的第一電極191是與第三遮光層210整合為一體,也就是說,第三遮光層210除了遮光外,還可作為光感測元件190的第一電極191。光感測層193是接觸第三遮光層210且鄰近第三開口211,而第二電極192是位在層間絕緣層123與第一遮光層130之間。在本實施例中,層間絕緣層123與閘極絕緣層122位於第二電極192與光感測層193之間,且源極S、汲極D與第二電極192是同時成形。換言之,第二導體層125是經由圖案化而同時形成源極S、汲極D與第二電極192,第二電極192是穿過層間絕緣層123與閘極絕緣層122而連接光感測層193。在一些實施例中,第三遮光層210會反射由第一開口131擴散的光,光感測元件190亦可感測來自第三遮 光層210的反射光。 As shown in FIG. 2, in this embodiment, the third light shielding layer 210 is a metal layer. The first electrode 191 of the light sensing element 190 is integrated with the third light shielding layer 210. That is, the third light shielding layer 210 can also serve as the first electrode 191 of the light sensing element 190 in addition to shielding light. The light sensing layer 193 is in contact with the third light shielding layer 210 and is adjacent to the third opening 211, and the second electrode 192 is located between the interlayer insulating layer 123 and the first light shielding layer 130. In this embodiment, the interlayer insulating layer 123 and the gate insulating layer 122 are located between the second electrode 192 and the light sensing layer 193, and the source S, the drain D, and the second electrode 192 are formed at the same time. In other words, the second conductive layer 125 is patterned to form the source S, the drain D, and the second electrode 192 at the same time. The second electrode 192 penetrates the interlayer insulating layer 123 and the gate insulating layer 122 to connect to the light sensing layer. 193. In some embodiments, the third light shielding layer 210 reflects the light diffused by the first opening 131, and the light sensing element 190 can also sense the light from the third shielding layer. Light reflected by the optical layer 210.

如圖2所示,在本實施例中,發光裝置100更包括第一絕緣層220與第二絕緣層230。第一絕緣層220位於第三遮光層210上,且第一絕緣層220透過第三開口211接觸基板110。第二絕緣層230位在第一絕緣層220上,且第二絕緣層230是位於主動元件120與第一絕緣層220之間、第一遮光層130的第二部分133與第一絕緣層220之間以及光轉換層140與第一絕緣層220之間。在一些實施例中,第一遮光層130的第二部分133還可貫穿第一絕緣層220與第二絕緣層230的至少一層。 As shown in FIG. 2, in this embodiment, the light emitting device 100 further includes a first insulating layer 220 and a second insulating layer 230. The first insulating layer 220 is located on the third light shielding layer 210, and the first insulating layer 220 contacts the substrate 110 through the third opening 211. The second insulating layer 230 is located on the first insulating layer 220, and the second insulating layer 230 is located between the active device 120 and the first insulating layer 220, the second portion 133 of the first light shielding layer 130 and the first insulating layer 220 And between the light conversion layer 140 and the first insulating layer 220. In some embodiments, the second portion 133 of the first light shielding layer 130 may also penetrate at least one layer of the first insulating layer 220 and the second insulating layer 230.

如圖2所示,在本實施例中,發光裝置100更包括封裝層240。封裝層240位於第二遮光元件與頂電極180上,且封裝層240可包括玻璃基板、絕緣材料等,但不限於此。 As shown in FIG. 2, in this embodiment, the light-emitting device 100 further includes an encapsulation layer 240. The encapsulation layer 240 is located on the second shading element and the top electrode 180, and the encapsulation layer 240 may include a glass substrate, an insulating material, etc., but is not limited thereto.

在一些實施例中,第三遮光層210的厚度大於50奈米。在一些實施例中,透明電極150的厚度小於139奈米。在一些實施例中,光轉換層140的厚度大於5微米,且色阻層141的厚度小於1微米。 In some embodiments, the thickness of the third light shielding layer 210 is greater than 50 nanometers. In some embodiments, the thickness of the transparent electrode 150 is less than 139 nm. In some embodiments, the thickness of the light conversion layer 140 is greater than 5 micrometers, and the thickness of the color resist layer 141 is less than 1 micrometer.

請參照圖3,圖3為圖1的發光裝置100的系統方塊示意圖。如圖3所示,在本實施例中,發光裝置100更包括控制模組300,控制模組300是電性連接光感測元件190與主動元件120,且控制模組300可控制主動元件120以驅動電致發光元件170發光。在圖3中,控制模組300、主動元件120、電致發光元件170與光感測元件190之間的實線箭頭表示為電性連接,而光感測元件190、光轉換層140與電致發光元件170之間的虛線箭頭表示為光學性連接。 Please refer to FIG. 3, which is a system block diagram of the light emitting device 100 of FIG. 1. As shown in FIG. 3, in this embodiment, the light emitting device 100 further includes a control module 300. The control module 300 is electrically connected to the light sensing element 190 and the active element 120, and the control module 300 can control the active element 120 To drive the electroluminescent element 170 to emit light. In FIG. 3, the solid arrows between the control module 300, the active element 120, the electroluminescent element 170, and the light sensing element 190 represent electrical connections, and the light sensing element 190, the light conversion layer 140 and the electrical The dotted arrows between the electroluminescent elements 170 indicate optical connections.

在一些實施例中,控制模組300可控制閘極G電壓,使通道 層121形成電性導通或斷開。當通道層121導通時,控制模組300可透過源極S、通道層121、汲極D與透明電極150對電致發光元件170施加電壓或電流,使電致發光元件170發光。舉例來說,當控制模組300控制主動元件120對電致發光元件170施加第一電壓,電致發光元件170是相應於第一電壓發光,且電致發光元件170所發的光具有第一亮度。電致發光元件170所發的光會自第二開口161進入第一開口131,並經過光轉換層140的轉換,接著自第一開口131朝向第三開口211射出。此時,光轉換層140射出的光會有一部份投射到光感測層193,且第一電極191與第二電極192之間會相應產生光電流,此光電流會迴授至控制模組300,且經過控制模組300運算而轉換為亮度,也就是說,光感測元件190迴授的光電流可視為一種亮度訊號或對應亮度的參考訊號。控制模組300會根據亮度訊號所轉換的亮度,對應控制主動元件120並對電致發光元件170施加第二電壓,以驅動電致發光元件170發出具有第二亮度的光。根據此亮度訊號,第二電壓可以等於、大於或小於第一電壓,相應地,第二亮度會等於、大於或小於第一亮度。換句話說,控制模組300可根據光感測元件190所感測到的亮度來決定是否維持或是調整主動元件120所施加於電致發光元件170的電壓,以維持或補償電致發光元件170的出光亮度。 In some embodiments, the control module 300 can control the gate G voltage so that the channel The layer 121 is electrically connected or disconnected. When the channel layer 121 is turned on, the control module 300 can apply a voltage or current to the electroluminescent element 170 through the source S, the channel layer 121, the drain D, and the transparent electrode 150 to make the electroluminescent element 170 emit light. For example, when the control module 300 controls the active device 120 to apply a first voltage to the electroluminescent device 170, the electroluminescent device 170 emits light corresponding to the first voltage, and the light emitted by the electroluminescent device 170 has the first voltage. brightness. The light emitted by the electroluminescent element 170 enters the first opening 131 from the second opening 161, is converted by the light conversion layer 140, and then exits from the first opening 131 toward the third opening 211. At this time, a part of the light emitted from the light conversion layer 140 is projected to the light sensing layer 193, and a photocurrent is generated between the first electrode 191 and the second electrode 192, and this photocurrent is fed back to the control module 300, and converted to brightness by the control module 300, that is, the photocurrent feedback from the light sensing element 190 can be regarded as a brightness signal or a reference signal corresponding to the brightness. The control module 300 correspondingly controls the active device 120 and applies the second voltage to the electroluminescent device 170 according to the brightness converted by the brightness signal, so as to drive the electroluminescent device 170 to emit light with the second brightness. According to the brightness signal, the second voltage can be equal to, greater than or less than the first voltage, and accordingly, the second brightness can be equal to, greater than or less than the first brightness. In other words, the control module 300 can determine whether to maintain or adjust the voltage applied to the electroluminescent device 170 by the active device 120 according to the brightness sensed by the light sensing device 190 to maintain or compensate the electroluminescent device 170 The brightness of the light.

舉例來說,當控制模組300控制主動元件120對電致發光元件170施加3伏特電壓,而電致發光元件170的出光亮度為2流明。控制模組300會比對光感測層193感測到的亮度與預期亮度,此預期亮度是對應於在施加第一電壓於電致發光元件170的情況下,光轉換層140應有的出光亮度。假設預期亮度為1.8流明,而光感測層193所感測的亮度為1.5流 明,其低於預期亮度(例如光轉換層140的厚度與設計標準值之間有誤差而造成光轉換層140的出光損失),則控制模組300會將施加於電致發光元件170的電壓增加為3.5伏特,使電致發光元件170的出光亮度增加,而光轉換層140的出光亮度也會相應增加,此時光感測元件190所感測到的亮度達到預期亮度1.8流明。若光感測層193感測到的亮度為1.9流明,其高於預期亮度(例如光轉換層140的厚度與設計標準值之間有誤差而造成光轉換層140的漏光率增加),則控制模組300會將施加於電致發光元件170的電壓減少為2.8伏特,光轉換層140的出光亮度會相應減少,使光感測元件190所感測到的亮度達到預期亮度1.8流明。在一些實施例中,控制模組300亦可藉由調整電流來改變電致發光元件170的出光亮度。 For example, when the control module 300 controls the active device 120 to apply a voltage of 3 volts to the electroluminescent device 170, the light emitting brightness of the electroluminescent device 170 is 2 lumens. The control module 300 compares the brightness sensed by the light sensing layer 193 with the expected brightness. The expected brightness corresponds to the light output of the light conversion layer 140 when the first voltage is applied to the electroluminescent element 170. brightness. Assume that the expected brightness is 1.8 lumens, and the brightness sensed by the light sensing layer 193 is 1.5 lumens If the brightness is lower than the expected brightness (for example, there is an error between the thickness of the light conversion layer 140 and the design standard value, which causes the light output loss of the light conversion layer 140), the control module 300 will apply the voltage applied to the electroluminescent element 170 Increasing to 3.5 volts increases the brightness of the electroluminescent element 170 and the brightness of the light conversion layer 140 correspondingly. At this time, the brightness sensed by the light sensing element 190 reaches the expected brightness of 1.8 lumens. If the brightness sensed by the light sensing layer 193 is 1.9 lumens, which is higher than the expected brightness (for example, there is an error between the thickness of the light conversion layer 140 and the design standard value, which causes the light leakage rate of the light conversion layer 140 to increase), then control The module 300 reduces the voltage applied to the electroluminescent element 170 to 2.8 volts, and the light-emitting brightness of the light conversion layer 140 is correspondingly reduced, so that the brightness sensed by the light sensing element 190 reaches the expected brightness of 1.8 lumens. In some embodiments, the control module 300 can also adjust the current to change the brightness of the electroluminescent element 170.

在一些實施例中,發光裝置100是應用於顯示面板,且在各電致發光元件170被施加相同電壓的情況下,各光轉換層140的出光的預期亮度是相同的,而顯示面板的各像素的亮度也應該是相同的。但基於上述各種誤差,顯示面板的各像素的亮度可能略有差異而產生色不均的現象。因此,藉由各光感測元件190分別對各光轉換層140的出光亮度進行感測並迴授亮度訊號,控制模組300可透過主動元件120即時且分別調整施加於各電致發光元件170的電壓,使顯示面板的各像素的亮度皆達到預期亮度,從而避免色不均的現象。 In some embodiments, the light-emitting device 100 is applied to a display panel, and when the same voltage is applied to each electroluminescent element 170, the expected brightness of the light from each light conversion layer 140 is the same, and each display panel The brightness of the pixels should also be the same. However, based on the above-mentioned various errors, the brightness of each pixel of the display panel may be slightly different, resulting in uneven color. Therefore, by each light sensing element 190 respectively sensing the light output brightness of each light conversion layer 140 and feedback the brightness signal, the control module 300 can adjust the application to each electroluminescent element 170 through the active element 120 in real time and respectively. The voltage makes the brightness of each pixel of the display panel reach the expected brightness, thereby avoiding the phenomenon of uneven color.

請參照圖4,圖4為本發明第二實施例的發光裝置100的剖面示意圖。圖4與圖2的實施例的差異在於圖4的光感測元件190的第二電極192的位置。在本實施例中,第二電極192是位在光感測層193與層間絕緣層123之間,閘極絕緣層122是位在第二電極192與光感測層193之間,且 第二電極192與閘極G同時成形。第一導體層124是經由圖案化而同時形成閘極G與第二電極192,且第二電極192是穿過閘極絕緣層122而連接光感測層193。 Please refer to FIG. 4, which is a schematic cross-sectional view of a light emitting device 100 according to a second embodiment of the present invention. The difference between the embodiment of FIG. 4 and FIG. 2 lies in the position of the second electrode 192 of the light sensing element 190 of FIG. 4. In this embodiment, the second electrode 192 is located between the light sensing layer 193 and the interlayer insulating layer 123, and the gate insulating layer 122 is located between the second electrode 192 and the light sensing layer 193, and The second electrode 192 and the gate G are formed at the same time. The first conductive layer 124 is patterned to form the gate G and the second electrode 192 at the same time, and the second electrode 192 passes through the gate insulating layer 122 to connect to the light sensing layer 193.

請參照圖5,圖5所示為本發明第三實施例的發光裝置100的剖面示意圖。圖5與圖2的實施例的差異在於,圖5的發光裝置100更包括第二光感測元件250。在本實施例中,第二光感測元件250包括第一電極251、第二電極252與光感測層253。第二光感測元件250的光感測層253是位於透明電極150與層間絕緣層123之間,且光感測層253是對應第二開口161設置,而第二光感測元件250的第一電極251與第二電極252是分別電性連接光感測層253。由於電致發光元件170的發光效率與設計標準值之間亦可能存在誤差而造成出光亮度與預期亮度不符,因此光感測層253可用來感測電致發光元件170的出光亮度,且第二光感測元件250會將對應的亮度訊號迴授給如圖3所示的控制模組300,且控制模組300可根據亮度訊號維持或調整主動元件120施加於電致發光元件170的電壓或電流。 Please refer to FIG. 5, which is a schematic cross-sectional view of a light emitting device 100 according to a third embodiment of the present invention. The difference between the embodiment of FIG. 5 and FIG. 2 is that the light emitting device 100 of FIG. 5 further includes a second light sensing element 250. In this embodiment, the second light sensing element 250 includes a first electrode 251, a second electrode 252 and a light sensing layer 253. The light sensing layer 253 of the second light sensing element 250 is located between the transparent electrode 150 and the interlayer insulating layer 123, and the light sensing layer 253 is provided corresponding to the second opening 161, and the second light sensing element 250 The first electrode 251 and the second electrode 252 are electrically connected to the light sensing layer 253 respectively. Since there may also be an error between the luminous efficiency of the electroluminescent element 170 and the design standard value, the light output brightness may not match the expected brightness, so the light sensing layer 253 can be used to sense the light output brightness of the electroluminescent element 170, and the second The light sensing element 250 will feedback the corresponding brightness signal to the control module 300 as shown in FIG. 3, and the control module 300 can maintain or adjust the voltage or voltage applied by the active element 120 to the electroluminescent element 170 according to the brightness signal. Current.

如圖5所示,在本實施例中,第二光感測元件250的第一電極251位於層間絕緣層123與第一遮光層130之間,且源極S、汲極D、光感測元件190的第二電極192與第二光感測元件250的第一電極251是同時成形,亦即第二導體層125是經由圖案化而同時形成源極S、汲極D、光感測元件190的第二電極192與第二光感測元件250的第一電極251。在本實施例中,第二光感測元件250的第二電極252位於第一遮光層130與第二遮光層160之間,且第二光感測元件250的第二電極252與透明電極150是同時成形。在一些實施例中,透明電極150是由氧化銦錫薄膜製成,此氧化銦 錫薄膜是先形成於第一遮光層130與光轉換層140上,且氧化銦錫薄膜是再經由圖案化而同時形成第二光感測元件250的第二電極252與透明電極150。 As shown in FIG. 5, in this embodiment, the first electrode 251 of the second light sensing element 250 is located between the interlayer insulating layer 123 and the first light shielding layer 130, and the source S, drain D, and light sensing The second electrode 192 of the element 190 and the first electrode 251 of the second light sensing element 250 are simultaneously formed, that is, the second conductive layer 125 is patterned to form the source S, the drain D, and the light sensing element at the same time. The second electrode 192 of 190 and the first electrode 251 of the second light sensing element 250. In this embodiment, the second electrode 252 of the second light sensing element 250 is located between the first light shielding layer 130 and the second light shielding layer 160, and the second electrode 252 of the second light sensing element 250 and the transparent electrode 150 It is simultaneously formed. In some embodiments, the transparent electrode 150 is made of indium tin oxide film. The tin film is first formed on the first light shielding layer 130 and the light conversion layer 140, and the indium tin oxide film is patterned to form the second electrode 252 and the transparent electrode 150 of the second light sensing element 250 at the same time.

請參照圖6,圖6所示為本發明第四實施例的發光裝置100的剖面示意圖。圖6與圖2的實施例的差異在於圖6的光感測元件190的位置。在本實施例中,光感測層193是鄰近第一開口131遠離透明電極150的一側。舉例來說,光感測層193與色阻層141在基板110的法線方向ND上未重疊。在本實施例中,光感測層193與通道層121是同時成形,且光感測層193與通道層121包括相同的材料,如多晶矽,但不限於此。在本實施例中,第一電極191是位於光感測層193與層間絕緣層123之間,且第二電極192是位於層間絕緣層123與第一遮光層130之間。第一電極191與閘極G是同時成形,而第二電極192、源極S與汲極D是同時成形。第一導體層124是經由圖案化而同時形成閘極G與第一電極191,而第二導體層125是經由圖案化而同時形成源極S、汲極D與第二電極192。在本實施例中,光感測層193與層間絕緣層123之間可不存在閘極絕緣層122,亦即此處的閘極絕緣層122會在製程中先被移除,再依序形成第一導體層124的閘極G與第一電極191、層間絕緣層123與第二導體層125的源極S、汲極D與第二電極192,且第一電極191直接連接光感測層193,而第二電極192是貫穿層間絕緣層123而連接光感測層193。 Please refer to FIG. 6, which is a schematic cross-sectional view of a light emitting device 100 according to a fourth embodiment of the present invention. The difference between the embodiment of FIG. 6 and FIG. 2 lies in the position of the light sensing element 190 in FIG. 6. In this embodiment, the light sensing layer 193 is adjacent to the side of the first opening 131 away from the transparent electrode 150. For example, the light sensing layer 193 and the color resist layer 141 do not overlap in the normal direction ND of the substrate 110. In this embodiment, the light sensing layer 193 and the channel layer 121 are formed at the same time, and the light sensing layer 193 and the channel layer 121 include the same material, such as polysilicon, but it is not limited thereto. In this embodiment, the first electrode 191 is located between the light sensing layer 193 and the interlayer insulating layer 123, and the second electrode 192 is located between the interlayer insulating layer 123 and the first light shielding layer 130. The first electrode 191 and the gate G are formed at the same time, and the second electrode 192, the source S and the drain D are formed at the same time. The first conductive layer 124 is patterned to form the gate G and the first electrode 191 at the same time, and the second conductive layer 125 is patterned to form the source S, the drain D, and the second electrode 192 at the same time. In this embodiment, the gate insulating layer 122 may not exist between the photo-sensing layer 193 and the interlayer insulating layer 123, that is, the gate insulating layer 122 here will be removed during the manufacturing process, and then the first The gate G of a conductive layer 124 and the first electrode 191, the source S, drain D, and the second electrode 192 of the interlayer insulating layer 123 and the second conductive layer 125, and the first electrode 191 is directly connected to the light sensing layer 193 , And the second electrode 192 penetrates the interlayer insulating layer 123 to connect to the light sensing layer 193.

請參照圖7,圖7所示為本發明第五實施例的發光裝置100的剖面示意圖。圖7與圖6的實施例的差異在於圖7的光感測層193的位置。在本實施例中,光感測層193與光轉換層140在基板110的法線方向ND上 重疊,例如色阻層141與光感測層193在基板110的法線方向ND上重疊且彼此接觸。並且,光感測層193與通道層121是同時成形,且光感測層193與通道層121包括相同的材料。在本實施例中,第一電極191與第二電極192位於第一開口131的相對兩側,第一電極191與閘極G是同時成形,而第二電極192、源極S與汲極D是同時成形,且第二電極192是貫穿層間絕緣層123與閘極絕緣層122而連接光感測層193。 Please refer to FIG. 7, which is a schematic cross-sectional view of a light emitting device 100 according to a fifth embodiment of the present invention. The difference between the embodiment of FIG. 7 and FIG. 6 lies in the position of the light sensing layer 193 of FIG. 7. In this embodiment, the light sensing layer 193 and the light conversion layer 140 are in the normal direction ND of the substrate 110 Overlap, for example, the color resist layer 141 and the light sensing layer 193 overlap in the normal direction ND of the substrate 110 and contact each other. In addition, the light sensing layer 193 and the channel layer 121 are simultaneously formed, and the light sensing layer 193 and the channel layer 121 include the same material. In this embodiment, the first electrode 191 and the second electrode 192 are located on opposite sides of the first opening 131, the first electrode 191 and the gate electrode G are formed at the same time, and the second electrode 192, the source electrode S and the drain electrode D It is formed at the same time, and the second electrode 192 penetrates the interlayer insulating layer 123 and the gate insulating layer 122 to connect to the photo sensing layer 193.

如圖7所示,在本實施例中,光感測層193可允許光轉換層140的光通過,且可感測來自光轉換層140的所有光線,因此光感測元件190迴授的亮度訊號具有更高的精確度。不過,光感測層193會吸收一部分的光,使得第三開口211的出光亮度減低。為了兼顧透光與光感測的效果,光感測層193的厚度需控制在一定範圍內。在本實施例中,光感測層193的厚度介於20奈米至500奈米之間。在一些實施例中,光感測層193的厚度為430奈米。 As shown in FIG. 7, in this embodiment, the light sensing layer 193 can allow the light of the light conversion layer 140 to pass through, and can sense all the light from the light conversion layer 140, so the brightness returned by the light sensing element 190 is The signal has higher accuracy. However, the light sensing layer 193 absorbs part of the light, so that the brightness of the light emitted by the third opening 211 is reduced. In order to take into account the effects of light transmission and light sensing, the thickness of the light sensing layer 193 needs to be controlled within a certain range. In this embodiment, the thickness of the light sensing layer 193 is between 20 nanometers and 500 nanometers. In some embodiments, the thickness of the light sensing layer 193 is 430 nm.

請參照圖8,圖8所示為本發明第六實施例的發光裝置100的剖面示意圖。圖8與圖2的實施例的差異在於圖8的光感測層193的位置。在本實施例中,光感測層193是位於第一開口131中,且光感測層193與光轉換層140是整合為一體,換句話說,光轉換層140本身亦可作為光感測材料。在本實施例中,第一電極191與閘極G是同時成形,而第二電極192、源極S與汲極D是同時成形。並且,第一電極191是位於閘極絕緣層122與層間絕緣層123之間,且第一電極191貫穿第一開口131而接觸光轉換層140的一側。第二電極192是位於閘極絕緣層122與第一遮光層130之間,且第二電極192貫穿層間絕緣層123與第一開口131而接觸光轉換層140遠 離第一電極191的另一側。在本實施例中,在光轉換層140接收來自於電致發光元件170的光之後,第一電極191與第二電極192之間會產生光電流,此光電流可視為一種亮度訊號或對應亮度的參考訊號,且亮度訊號會迴授給如圖3所示的控制模組300,而控制模組300可根據亮度訊號維持或調整主動元件120施加於電致發光元件170的電壓或電流。 Please refer to FIG. 8, which is a schematic cross-sectional view of a light emitting device 100 according to a sixth embodiment of the present invention. The difference between the embodiment of FIG. 8 and FIG. 2 lies in the position of the light sensing layer 193 of FIG. 8. In this embodiment, the light sensing layer 193 is located in the first opening 131, and the light sensing layer 193 and the light conversion layer 140 are integrated as a whole. In other words, the light conversion layer 140 itself can also serve as a light sensing layer. material. In this embodiment, the first electrode 191 and the gate G are formed at the same time, and the second electrode 192, the source S and the drain D are formed at the same time. In addition, the first electrode 191 is located between the gate insulating layer 122 and the interlayer insulating layer 123, and the first electrode 191 penetrates the first opening 131 to contact one side of the light conversion layer 140. The second electrode 192 is located between the gate insulating layer 122 and the first light shielding layer 130, and the second electrode 192 penetrates the interlayer insulating layer 123 and the first opening 131 and contacts the light conversion layer 140 far away. From the other side of the first electrode 191. In this embodiment, after the light conversion layer 140 receives light from the electroluminescent element 170, a photocurrent is generated between the first electrode 191 and the second electrode 192, and this photocurrent can be regarded as a kind of brightness signal or corresponding brightness. The reference signal and the brightness signal will be fed back to the control module 300 shown in FIG. 3, and the control module 300 can maintain or adjust the voltage or current applied by the active device 120 to the electroluminescent device 170 according to the brightness signal.

綜上所述,根據本發明至少一實施例的發光裝置,其可藉由光感測元件感測到第一開口的出光亮度,以利於根據此亮度維持或調整主動元件用來驅動電致發光元件的電壓或電流,從而確保發光裝置的出光亮度可符合預期。在發光裝置應用於顯示面板的情況下,可藉由各光感測元件感測對應的第一開口的出光亮度,從而確保顯示面板的每個像素的亮度或顏色符合預期,以避免色不均的現象。 In summary, according to the light-emitting device of at least one embodiment of the present invention, the light-emitting luminance of the first opening can be sensed by the light-sensing element, so as to facilitate maintaining or adjusting the active element to drive the electroluminescence according to the luminance. The voltage or current of the element ensures that the brightness of the light-emitting device can meet expectations. When the light-emitting device is applied to a display panel, the light-emitting brightness of the corresponding first opening can be sensed by each light sensing element, so as to ensure that the brightness or color of each pixel of the display panel meets expectations, and to avoid color unevenness The phenomenon.

雖然本發明的技術內容已經以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技術者,在不脫離本發明之精神所作些許之更動與潤飾,皆應涵蓋於本發明的範疇內,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the technical content of the present invention has been disclosed in preferred embodiments as above, it is not intended to limit the present invention. Anyone who is familiar with this technique and makes some changes and modifications without departing from the spirit of the present invention should be covered by the present invention Therefore, the scope of protection of the present invention shall be subject to the scope of the attached patent application.

100        發光裝置 110        基板 120        主動元件 121        通道層 122        閘極絕緣層 123        層間絕緣層 124        第一導體層 125        第二導體層 130        第一遮光層 131        第一開口 132        第一部分 133        第二部分 140        光轉換層 141        色阻層 150        透明電極 160        第二遮光層 161        第二開口 170        電致發光元件 171        第一傳輸層 172        第二傳輸層 173        發光層 180        頂電極 190        光感測元件 191        第一電極 192        第二電極 193        光感測層 210        第三遮光層 211        第三開口 220        第一絕緣層 230        第二絕緣層 240        封裝層 D           汲極 G           閘極 ND         法線方向 S            源極 W11、W12、W21、W22     寬度 100 Light-emitting device 110 Substrate 120 Active components 121 Channel layer 122 Gate insulation layer 123 Interlayer insulation layer 124 First conductor layer 125 Second conductor layer 130 First light-shielding layer 131 First opening 132 Part One 133 Part Two 140 Light conversion layer 141 Color resist layer 150 Transparent electrode 160 Second light-shielding layer 161 Second opening 170 Electroluminescent element 171 First transmission layer 172 The second transmission layer 173 Light-emitting layer 180 Top electrode 190 Light sensing element 191 First electrode 192 Second electrode 193 Light sensing layer 210 Third shading layer 211 The third opening 220 First insulation layer 230 Second insulating layer 240 Encapsulation layer D Dip pole G Gate ND Normal direction S Source W11, W12, W21, W22 width

Claims (20)

一種發光裝置,包括:一基板;一主動元件,位於該基板上;一第一遮光層,位於該主動元件上且包括一第一開口;一光轉換層,位於該第一開口中;一透明電極,位於該第一遮光層與該光轉換層上且電性連接該主動元件;一第二遮光層,位於該透明電極上且包括對應該第一開口的一第二開口;一電致發光元件,位於該第二開口中,其中該透明電極位於該第一開口與該第二開口之間;一頂電極,其中該電致發光元件位於該頂電極與該透明電極之間;以及一光感測元件,包括一第一電極、一第二電極與一光感測層,該光感測層對應該第一開口設置,且該第一電極與該第二電極分別電性連接該光感測層。 A light-emitting device includes: a substrate; an active element on the substrate; a first light shielding layer on the active element and including a first opening; a light conversion layer located in the first opening; and a transparent An electrode located on the first light-shielding layer and the light conversion layer and electrically connected to the active element; a second light-shielding layer located on the transparent electrode and including a second opening corresponding to the first opening; an electroluminescence Element located in the second opening, wherein the transparent electrode is located between the first opening and the second opening; a top electrode, wherein the electroluminescent element is located between the top electrode and the transparent electrode; and a light The sensing element includes a first electrode, a second electrode, and a light sensing layer. The light sensing layer is disposed corresponding to the first opening, and the first electrode and the second electrode are electrically connected to the light sensing layer. Measured layer. 如請求項1所述的發光裝置,其中該第一電極位於該基板與該主動元件之間,且該第二電極位於該主動元件與該第一遮光層之間。 The light-emitting device according to claim 1, wherein the first electrode is located between the substrate and the active device, and the second electrode is located between the active device and the first light shielding layer. 如請求項1所述的發光裝置,更包括一第三遮光層,其中該第三遮光層位於該基板與該主動元件之間且包括對應該第一開口的一第三開 口,該第一電極與該第三遮光層整合為一體,且該光感測層接觸該第三遮光層且鄰近該第三開口。 The light-emitting device according to claim 1, further comprising a third light-shielding layer, wherein the third light-shielding layer is located between the substrate and the active device and includes a third opening corresponding to the first opening 口, the first electrode and the third light shielding layer are integrated into one body, and the light sensing layer contacts the third light shielding layer and is adjacent to the third opening. 如請求項3所述的發光裝置,其中該第三遮光層的厚度大於50nm。 The light-emitting device according to claim 3, wherein the thickness of the third light shielding layer is greater than 50 nm. 如請求項1所述的發光裝置,其中該主動元件包括:一通道層,位於該基板上;一閘極,位於該通道層上;一閘極絕緣層,位於該閘極與該通道層之間;一源極與一汲極,分別電性連接至該通道層;以及一層間絕緣層,位於該源極與該閘極之間以及該汲極與該閘極之間,其中該第一遮光層包括:一第一部分,實質上覆蓋該主動元件;以及一第二部分,連接該第一部分,該第二部分穿入該層間絕緣層與該閘極絕緣層,且該第一開口貫穿該第二部分。 The light-emitting device according to claim 1, wherein the active device includes: a channel layer on the substrate; a gate electrode on the channel layer; and a gate insulating layer on the gate electrode and the channel layer Between; a source and a drain, respectively, electrically connected to the channel layer; and an interlayer insulating layer located between the source and the gate and between the drain and the gate, wherein the first The light shielding layer includes: a first part substantially covering the active device; and a second part connecting the first part, the second part penetrating the interlayer insulating layer and the gate insulating layer, and the first opening penetrating the the second part. 如請求項5所述的發光裝置,其中該第一電極位於該光感測層與該層間絕緣層之間。 The light emitting device according to claim 5, wherein the first electrode is located between the light sensing layer and the interlayer insulating layer. 如請求項5所述的發光裝置,其中該層間絕緣層與該閘極絕緣層位於該第二電極與該光感測層之間。 The light-emitting device according to claim 5, wherein the interlayer insulating layer and the gate insulating layer are located between the second electrode and the photo sensing layer. 如請求項5所述的發光裝置,其中該第二電極位於該光感測層與該層間絕緣層之間。 The light-emitting device according to claim 5, wherein the second electrode is located between the light sensing layer and the interlayer insulating layer. 如請求項5所述的發光裝置,更包括一第二光感測元件,該第二光感測元件包括一第一電極、一第二電極與一光感測層,該第二光感測元件的該光感測層位於該透明電極與該層間絕緣層之間且對應該第二開口設置,且該第二光感測元件的該第一電極與該第二電極分別電性連接該第二光感測元件的該光感測層。 The light-emitting device according to claim 5, further comprising a second light sensing element, the second light sensing element including a first electrode, a second electrode and a light sensing layer, the second light sensing element The light sensing layer of the device is located between the transparent electrode and the interlayer insulating layer and is disposed corresponding to the second opening, and the first electrode and the second electrode of the second light sensing device are electrically connected to the first electrode, respectively The light sensing layer of two light sensing elements. 如請求項9所述的發光裝置,其中該第二光感測元件的該第一電極位於該層間絕緣層與該第一遮光層之間。 The light-emitting device according to claim 9, wherein the first electrode of the second light sensing element is located between the interlayer insulating layer and the first light shielding layer. 如請求項9所述的發光裝置,其中該第二光感測元件的該第二電極位於該第一遮光層與該第二遮光層之間。 The light-emitting device according to claim 9, wherein the second electrode of the second light sensing element is located between the first light-shielding layer and the second light-shielding layer. 如請求項5所述的發光裝置,其中該光感測層鄰近該第一開口遠離該透明電極的一側。 The light emitting device according to claim 5, wherein the light sensing layer is adjacent to a side of the first opening away from the transparent electrode. 如請求項12所述的發光裝置,其中該光感測層與該光轉換層在該基板的法線方向上重疊。 The light emitting device according to claim 12, wherein the light sensing layer and the light conversion layer overlap in the normal direction of the substrate. 如請求項13所述的發光裝置,其中該光感測層的厚度介於20奈米至500奈米之間。 The light emitting device according to claim 13, wherein the thickness of the light sensing layer is between 20 nanometers and 500 nanometers. 如請求項1所述的發光裝置,其中該光感測層位於該第一開口中,且該光感測層與該光轉換層整合為一體。 The light emitting device according to claim 1, wherein the light sensing layer is located in the first opening, and the light sensing layer and the light conversion layer are integrated as a whole. 如請求項1所述的發光裝置,其中該光轉換層包括一色阻層,該色阻層位於該第一開口遠離該透明電極的一側。 The light-emitting device according to claim 1, wherein the light conversion layer includes a color resist layer, and the color resist layer is located on a side of the first opening away from the transparent electrode. 如請求項16所述的發光裝置,其中該光轉換層的厚度大於5微米,且該色阻層的厚度小於1微米。 The light emitting device according to claim 16, wherein the thickness of the light conversion layer is greater than 5 micrometers, and the thickness of the color resist layer is less than 1 micrometer. 如請求項1所述的發光裝置,其中該第二開口遠離該透明電極的一側的寬度小於該第二開口靠近該透明電極的一側的寬度,且該第二開口靠近該透明電極的一側的寬度大於或等於該第一開口靠近該透明電極的一側的寬度。 The light emitting device according to claim 1, wherein the width of the side of the second opening away from the transparent electrode is smaller than the width of the side of the second opening close to the transparent electrode, and the second opening is close to a side of the transparent electrode The width of the side is greater than or equal to the width of the side of the first opening close to the transparent electrode. 如請求項1所述的發光裝置,其中該透明電極的厚度小於139奈米。 The light-emitting device according to claim 1, wherein the thickness of the transparent electrode is less than 139 nm. 如請求項1所述的發光裝置,更包括一控制模組,其中該控制模組電性連接該光感測元件與該主動元件,該控制模組控制該主動元件以驅動該電致發光元件產生具有一第一亮度的光,該光感測元件感測自該光轉換層射出的光而產生一亮度訊號,且該控制模組根據該亮度訊號控制該主動元件以驅動該電致發光元件產生一第二亮度。 The light-emitting device according to claim 1, further comprising a control module, wherein the control module is electrically connected to the light sensing element and the active element, and the control module controls the active element to drive the electroluminescent element Generate light with a first brightness, the light sensing element senses the light emitted from the light conversion layer to generate a brightness signal, and the control module controls the active element according to the brightness signal to drive the electroluminescent element Generate a second brightness.
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