TWI704611B - Cutting device and manufacturing method of cut product - Google Patents

Abstract

The present invention provides a cutting device that has a strong holding force on a workbench even after a cutting object is cut. In order to achieve the above-mentioned object, the cutting device of the present invention is characterized by including a worktable (10), an air pressure holding mechanism, and a cutting mechanism (30), and the worktable (10) attracts and holds the cutting object (20) , The air pressure outside the table (10) holding the cut object (20) is maintained at a higher pressure than the atmospheric pressure by the air pressure holding mechanism, and the cutting mechanism (30) is cut and held on the table (10) The cutting object (20).

Description

Cutting device and manufacturing method of cut product

The present invention relates to a cutting device and a method of manufacturing a cut product.

The semiconductor package can be manufactured by cutting the package substrate, for example. In cutting the package substrate, for example, the substrate is held on a table by suction and cut (Patent Document 1, etc.).

[Prior Art Document] [Patent Document] Patent Document 1: JP 2011-114145 A.

[Problems to be solved by invention]

However, if the size of the semiconductor package (product) manufactured by cutting the package substrate is small, the force held on the table by suction may be insufficient. Specifically, the cut product may fall off the workbench, resulting in a decrease in yield and product failure.

Therefore, the object of the present invention is to provide a cutting device and a method of manufacturing a cut product that have a strong holding force on the workbench even after cutting the object to be cut.

[Means to solve the problem]

In order to achieve the object, the cutting device of the present invention is characterized in that it includes a table, an air pressure holding mechanism, and a cutting mechanism. The cutting object is sucked and held by the table, and the air pressure holding mechanism is used to hold the cutting object. The air pressure outside the table where the cutting object is located is maintained at an air pressure higher than the atmospheric pressure, and the cutting object held on the table is cut by the cutting mechanism.

The method for manufacturing a cut product of the present invention is characterized by including: a cutting object holding step, which sucks and holds the cutting object by a table; and an air pressure holding step, which holds the work of the cutting object The air pressure outside the table is maintained at an air pressure higher than the atmospheric pressure; in the cutting step, the cutting object held on the work table is cut.

[Invention Effect]

According to the present invention, it is possible to provide a cutting device and a method of manufacturing a cut product that have a strong holding force on the table even after cutting the cutting object.

Next, the present invention will be explained in more detail with examples. However, the present invention is not limited to the following description.

For example, the cutting device of the present invention may further include a cutting chamber in which the air pressure outside the table is maintained at a higher pressure than the atmospheric pressure by the air pressure maintaining mechanism. The cutting object on the table is cut by the cutting mechanism to produce a cutting device for cutting products.

For example, the cutting device of the present invention may further include a cutting chamber, a pressurizing chamber, and a decompression chamber, in which the cutting object is cut to produce a cut product, and the pressurizing chamber Is arranged on the cutting object carrying-in side of the cutting chamber, the decompression chamber is arranged on the cutting product carrying-out side of the cutting chamber, and the pressurizing chamber is connected to the cutting chamber and is located In a state where the inside of the pressurizing chamber and the cutting chamber are maintained at a pressure higher than atmospheric pressure, the cutting object is carried in from the pressurizing chamber to the cutting chamber, and the decompression chamber and In the state that the cutting chamber is connected, the cut product is carried out from the cutting chamber to the decompression chamber, and then the connection between the decompression chamber and the cutting chamber is disconnected, and in the A cutting device that carries the cut product from the inside of the decompression chamber to the outside in a state where the pressure inside the decompression chamber is reduced to a pressure lower than when the cut object is cut.

For the cutting device of the present invention, for example, the air pressure holding mechanism may include a storage chamber and an operation part, the workbench and the cutting mechanism may be stored in the storage chamber, and the operation part may A cutting device that maintains the air pressure inside the storage chamber at an air pressure higher than the atmospheric pressure.

The cutting device of the present invention can maintain the air pressure outside the table where the cutting object is held at 1.1×10 ⁵ Pa or more by the air pressure holding mechanism, for example.

The method of manufacturing a cut product of the present invention may be, for example, a method of manufacturing a cut product using a cutting chamber and performing the cutting step in the cutting chamber.

The method of manufacturing a cut product of the present invention may be, for example, using a cutting chamber, a pressurized chamber, or a decompression chamber, in which the cutting step is performed in the cutting chamber, and further includes a cutting object carrying-in step and cutting In the product carrying out step, the cutting object carrying in step is to carry out the pressure state in which the pressure chamber and the cutting chamber are connected and the pressure chamber and the cutting chamber are kept at a pressure higher than atmospheric pressure. The step of carrying the object to be cut from the pressurized chamber into the cutting chamber, and the step of carrying out the cut product is in the state where the decompression chamber and the cutting chamber are connected. In the cutting step, the cut product obtained by cutting the cutting object is carried out from the cutting chamber to the decompression chamber, and then the decompression chamber and the cutting chamber are disconnected After the connection of the decompression chamber, the step of carrying the cut product out of the decompression chamber to the outside in a state where the pressure in the decompression chamber is reduced to a pressure lower than when the cut object is cut The manufacturing method of cut products.

In the present invention, "air pressure higher than atmospheric pressure" may be, for example, a pressure higher than 1 atm (1.01325×10 ⁵ Pa). In addition, the "air pressure higher than atmospheric pressure" may be, for example, a pressure higher than the ambient air pressure (atmospheric pressure) when the cutting device of the present invention is used, or a pressure higher than the surrounding environment when the cutting device manufacturing method of the present invention is used. Atmospheric pressure (atmospheric pressure) High pressure. In addition, the "air pressure higher than atmospheric pressure" can obtain the effect of the present invention as long as the pressure is slightly higher than the atmospheric pressure, for example, it may be 1.1×10 ⁵ Pa or more, 1.2×10 ⁵ Pa or more, or 1.3×10 ⁵ Pa or more. , 1.4×10 ⁵ Pa or more, 1.5×10 ⁵ Pa or more, 2.0×10 ⁵ Pa or more, 3.0×10 ⁵ Pa or more, or 4.0×10 ⁵ Pa or more, for example, it may be 1.0×10 ⁶ Pa (10MPa) or less, 9.0×10 ⁵ Pa or less, 8.0×10 ⁵ Pa or less, 7.0×10 ⁵ Pa or less, 6.0×10 ⁵ Pa or less, or 5.0×10 ⁵ Pa or less.

In the present invention, the object to be cut is not particularly limited. For example, although the object to be cut may be a package substrate, it is not limited to this and may be arbitrary.

In the present invention, the cut product is not particularly limited, and may be, for example, a resin molded product. The resin molded product is not particularly limited. For example, it may be a resin molded product in which only resin is molded, or a resin molded product in which components such as a wafer are resin-encapsulated. In the present invention, the resin molded product may be, for example, an electronic component. In addition, in the present invention, the cut product may be, for example, a finished product or an unfinished semi-finished product.

In the present invention, the resin is not particularly limited. For example, it may be a thermosetting resin such as epoxy resin and silicone resin, or may be a thermoplastic resin. In addition, it may be a composite material partially containing thermosetting resin or thermoplastic resin.

In addition, generally speaking, "electronic components" include the case of a chip before resin encapsulation and the case of a state where the chip is resin encapsulated. However, in the present invention, when only "electronic components" are referred to, unless otherwise stated Specify, otherwise it refers to the electronic component (as a finished electronic component) where the chip is resin-encapsulated. In the present invention, "wafer" refers to a wafer before resin encapsulation. Specifically, for example, an integrated circuit (IC), a semiconductor wafer, a semiconductor element for power control, and the like can be exemplified. In the present invention, in order to distinguish a chip before resin encapsulation from an electronic component after resin encapsulation, it is referred to as a "chip" for convenience. However, the "wafer" of the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and it does not have to be a wafer shape.

In the present invention, for example, a semiconductor wafer (semiconductor wafer) in which circuit elements and functional elements such as microelectromechanical systems (MEMS) are arranged on a substrate such as silicon and compound semiconductors can be used as the cutting object, and This is cut (singulated) into a cut product. Furthermore, in the present invention, for example, ceramic substrates, glass substrates, etc., including functional elements such as resistors, capacitors, sensors, surface acoustic wave devices, etc., are used as objects to be cut and cut (singulated) to produce Chip resistors, chip capacitors, chip-type sensors, surface acoustic wave devices and other products (cut-off products). In addition, in the present invention, for example, a resin molded product can be used as a cutting object, and this can be cut (singulated) to manufacture optical components (cut products) such as lenses, optical modules, and light guide plates. Furthermore, in the present invention, for example, a resin molded product can be used as a cutting object, and this can be cut (sliced) to produce a product (cut product). Furthermore, in the present invention, for example, a glass plate is used as a cutting object, and this is cut (singulated) to produce glass plates (cut products) used as cover plates for various electronic devices. Furthermore, in the present invention, the object to be cut is not limited to this, and may be arbitrary as described above, and the cut product is not particularly limited as described above, and may be arbitrary.

In addition, in the present invention, the shapes of the cut object and the cut product are not particularly limited, and may be arbitrary. For example, the shape of the object to be cut may be a rectangle having a length direction and a width direction, or may be a square, a circle, or the like.

In addition, in the present invention, "mounting", "arrangement" or "setting" includes "fixing".

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For the convenience of description, the drawings are schematically described with appropriate omissions, exaggerations, etc.

[Example 1]

In this embodiment, an example of a molding die and a resin molding apparatus and an example of a method of manufacturing a resin molded product using the same will be described.

The step sectional views of FIGS. 1 to 6 schematically show a part of the structure of an example of the cutting device of the present invention and each step in the method of manufacturing a cut product using the cutting device.

First, as shown in FIG. 1, a workbench (fixture) 10 is prepared. Here, although the jig 10 illustrated in FIGS. 1 to 6 actually constitutes a part of the workbench, in the description with reference to FIGS. 1 to 6, it is described as "workbench 10" for convenience. The illustration of the entire workbench including the jig 10 is omitted. As shown in the figure, the upper part of the table 10 is provided with a groove 11, and at the same time, a through hole 12 penetrating from the upper surface (cut object holding surface) to the lower surface is provided. The groove 11 is a groove for passing a cutting blade inside the groove 11 as described later. In addition, as described later, the through hole 12 is a through hole for sucking and holding the cut object and the cut product manufactured by cutting the object on the upper surface of the table 10.

Next, as shown in FIG. 2, the package substrate (cutting object) 20 is placed on the upper surface of the table 10. As shown in the figure, in the case of the package substrate 20, one surface of the substrate 21 is resin-molded using a resin (cured resin) 22. The package substrate 20 can be molded from only the substrate 21 and the resin 22, but may further include other members (components). In addition, the other member can be encapsulated by resin 22 (resin encapsulation). The other members are not particularly limited, and may be, for example, ordinary members used for electronic components, semiconductor components, and the like. Specifically, for example, wafers, leads, and the like can be exemplified. In addition, in the same figure, the package substrate 20 is placed so that one side of the resin 22 contacts the upper surface of the table 10.

Next, as shown in FIG. 3, the air inside the table 10 is sucked in the arrow X1 direction (the inner direction of the table 10) by a suction mechanism (not shown), and the inside of the table 10 is decompressed. Thereby, the package substrate 20 is sucked and held on the upper surface of the table 10 (cut object holding step). In addition, the suction mechanism is not particularly limited, and may be, for example, a suction pump or a vacuum ejector. As further shown in the figure, the air pressure outside the table 10 holding the package substrate 20 is maintained at an air pressure higher than the atmospheric pressure by an air pressure holding mechanism (not shown) (air pressure holding step). Thereby, it is possible to apply pressure in the arrow Y1 direction (the direction of the table 10) to the package substrate 20 and press it against the table 10. With the pressure in the direction of the arrow Y1, the holding force of the package substrate 20 on the table 10 is further enhanced.

Next, as shown in FIG. 4, the rotary knife 30 is arranged at a position corresponding to the groove 11 above the package substrate 20. As shown in the figure, the rotary knife 30 is configured such that both surfaces of the knife body 31 are sandwiched by a pair of flanges (fixing members) 32. The rotating knife 30 is a part of the "cutting mechanism" in the cutting device of this embodiment. The rotating knife 30 is attached to the tip of a rotating shaft (not shown) provided in the cutting mechanism.

Next, as shown in FIG. 5, the package substrate 20 (the substrate 21 and the substrate 22) is cut by rotating the rotary knife 30 (cutting step). At this time, as shown in the figure, the package substrate 20 can be completely cut by making the blade body 31 penetrate the package substrate 20 and sink into the groove 11.

Then, as shown in FIG. 6, the package substrate 20 can be cut at all predetermined positions (the position of the groove 11 in the figure) to manufacture the package component (cut product) 20 b. As for the cut product 20b, as shown in the figure, one surface of the cut substrate 21b is resin-molded by the cut resin (cured resin) 22b. At this time, as shown in FIG. 6, the upper end of the through hole 12 is still blocked (sealed) by the cut 20b. Therefore, the suction force from the arrow X1 direction (the inner direction of the table 10) is still applied to the cut product 20b. Furthermore, a pressure in the direction of arrow Y1 (the direction of the table 10) is applied to the cut product 20b, and it is pressed against the table 10. Thereby, the holding force of the cut product 20b on the table 10 can be further enhanced, and the cut product 20b can be prevented or prevented from falling off the table 10.

In addition, the cut product 20b may be a product that can be directly distributed, or may be an unfinished semi-finished product. The semi-finished product can, for example, be further processed into a product. The product is not particularly limited, and examples thereof include electronic components, semiconductor components, and the like as described above.

In the conventional cutting method of package substrate (Patent Document 1, etc.), if the size of the cut product (part) after cutting is small (for example, the length of one side is 2mm or less), the workbench (fixture) The holding power (adsorption power) may be insufficient, and the cut product may fall off the table, resulting in a decrease in yield and product defects. Specifically, for example, splashing (scattering) of the cut product, chipping (notch) in the corner portion of the package substrate, etc., and these may cause a decrease in yield and product failure. In particular, if one cut product falls off the table, there is a possibility that the hole in the table that sucks the cut product may be opened. Then, in the case where the space in the workbench is connected into one, due to the opening of the hole, the pressure reduction of the space in the workbench is released, and it is possible that all other cut products are held on the workbench The force becomes smaller. In other words, even if only one cut product falls off the workbench, all other cut products may fall off the workbench as a result.

In this regard, according to the present invention, the air pressure outside the table where the cutting object is held is maintained at an air pressure higher than the atmospheric pressure. As a result, the holding force of the cut product on the table is strengthened, and even a small-sized cut product can be firmly held (fixed). Therefore, according to the present invention, it is possible to suppress or prevent the aforementioned problems such as a decrease in yield and product defects, and it is possible to improve the productivity of cut products.

In the foregoing, an example of the cutting device of the present invention and the method of manufacturing a cut product using the cutting device has been described. However, the present invention is not limited to this embodiment. For example, in this embodiment, an example in which products such as electronic components and semiconductor components or semi-finished products are manufactured by cutting a package substrate has been described. However, in the present invention, the object to be cut is not limited to the package substrate as described above, and can be applied to any object to be cut. In addition, the cut product is also as described above, and is not limited to electronic components, semiconductor components, etc., and may be arbitrary. Furthermore, for example, the cutting device of the present invention can be combined with a normal cutting device in addition to maintaining the air pressure outside the table where the cutting object is held by the air pressure maintaining mechanism at a pressure higher than the atmospheric pressure. The same or the structure based on it. The method of manufacturing a cut product of the present invention, for example, can be used with the package substrate in addition to the "air pressure maintaining step" in which the air pressure outside the table holding the cutting object is maintained at a pressure higher than atmospheric pressure. The usual cutting method is the same or performed according to it. As a general cutting method of the package substrate etc., for example, it may be the same as or based on the method described in JP 2016-143861 A and the like. The structure and method of the specific device for maintaining the air pressure outside the worktable on which the cutting object is held at a pressure higher than the atmospheric pressure is not particularly limited. For example, it may be as described in Example 2 or Example 3 below. As described in.

The present invention can be suitably used, for example, in the production of small-sized cut products having a side of 2 mm or less or 1 mm or less. However, the present invention is not limited to this, and can be used for the production of cut products of any size.

[Example 2]

Next, other embodiments of the present invention will be described.

In this embodiment, an example of the cutting device of the present invention and the method of manufacturing a cut product that is different from the embodiment 1 will be described.

Fig. 7 is a plan view schematically showing the structure of the cutting device of this embodiment. As shown in the figure, the cutting device 1000 includes three regions (regions) of A region, B region, and C region. Area A contains the pressurized chamber 1100. Area B contains the cutting room 1200. Area C contains the decompression chamber 1300. The pressurizing chamber 1100 is arranged on the cutting object carrying-in side of the cutting chamber 1200. The decompression chamber 1300 is arranged on the cut-out side of the cutting chamber 1200. Then, as described later, the cutting object is cut in the cutting chamber 1200 to produce a cut product. Furthermore, in a state where the pressurizing chamber 1100 and the cutting chamber 1200 are connected and the inside of the pressurizing chamber 1100 and the cutting chamber 1200 are maintained at a pressure higher than atmospheric pressure, the cutting object is carried in from the pressurizing chamber 1100 to the cutting chamber 1200 . Furthermore, in a state where the decompression chamber 1300 and the cutting chamber 1200 are connected, the cut object (cut product) to be cut is carried out from the cutting chamber 1200 to the decompression chamber 1300. Then, after the connection between the decompression chamber 1300 and the cut-off chamber 1200 is disconnected, the pressure in the decompression chamber 1300 is reduced to a lower pressure than when the cut object is cut. The cut object (cut product) is carried out from the inside of the decompression chamber 1300 to the outside. In addition, the air pressure when the cut product is carried out from the inside of the decompression chamber 1300 to the outside may be substantially the same as the atmospheric pressure, for example. The details will be described later. The cutting chamber 1200, the pressurizing chamber 1100, and the decompression chamber 1300 can use, for example, the same structure as a vacuum chamber of a film forming apparatus such as a sputtering device, a load lock chamber on the carry-in side, and a load lock chamber on the carry-out side. However, the shut-off chamber 1200, the pressurization chamber 1100, and the decompression chamber 1300 are designed such that the internal space can maintain a pressure higher than the atmospheric pressure.

In the cutting device 1000 of FIG. 7, the area A further includes a substrate supply mechanism (cutting object supply mechanism) 1010, a control unit 1020, and a gate valve 1030. The substrate supply mechanism 1010 stores a packaging substrate (cutting object) 20 and can supply the packaging substrate 20 to the pressurizing chamber 1100. In addition, the packaging substrate 20 may be the same as the packaging substrate 20 described in the first embodiment. The control unit 1020 can control the operation of the entire cutting device 1000. The control method performed by the control unit 1020 is not particularly limited, and, for example, a computer program can be used. The gate valve 1030 is arranged to connect the pressurizing chamber 1100 and the shutoff chamber 1200. By opening the gate valve 1030, the space in the pressurizing chamber 1100 and the space in the shutoff chamber 1200 can be connected. By closing the gate valve 1030, the space in the pressurizing chamber 1100 and the space in the shut-off chamber 1200 can be disconnected and separated.

Area B further includes a workbench 10, an air pressure regulator 1210, a drain pressure reducer 1220, a rotating shaft 1230, bellows 1241 and 1242, a receiving plate 1250, a drain flow portion 1260, and a discharge port 1270. The workbench 10 is the same as the workbench 10 described in Example 1 (FIGS. 1 to 6), and is connected to the aforementioned suction mechanism (not shown). The air pressure regulator 1210 includes, for example, an adjustment valve that can adjust the inflow of compressed air, which is connected to a pipe from an external air compression system, and an on-off valve used for pressure reduction. In addition, illustrations of the compression system, piping, adjustment valve, and on-off valve are omitted. The air pressure inside the pressurizing chamber 1100, the shut-off chamber 1200, and the decompression chamber 1300 are adjusted by the air pressure regulator 1210. With the air pressure regulator 1210, the air pressure outside the table 10 holding the package substrate (cutting object) 20 (the air pressure inside the cutting chamber 1200) can be maintained at a pressure higher than the atmospheric pressure as described later. In other words, the air pressure regulator 1210 and the cutting chamber 1200 correspond to the “air pressure maintaining mechanism” of the cutting device 1000. In addition, for example, at the time of decompression, the on-off valve for decompression can be opened, and exhaust can be performed from an exhaust pipe installed in a facility where the shutoff device 1000 is installed. The rotating knife 30 (not shown in FIG. 7) described in the first embodiment (FIGS. 1 to 6) is attached to the rotating shaft 1230. The rotating shaft 1230 can move forward, backward, left and right, and up and down together with the rotating knife 30. The rotating shaft 1230 can rotate the rotating knife 30 and cut the package substrate 20. In other words, the rotating shaft 1230 and the rotating knife 30 together constitute the “cutting mechanism” of the cutting device 1000. In addition, in order to remove the frictional heat caused by the rotating blade 30, a nozzle (not shown) can be used to spray cooling water on the rotating blade 30 while cooling, and the cutting step described later can be performed. The nozzle can be mounted on the rotating shaft 1230, for example. The cooling water may be room temperature (normal temperature) water, for example. The cooling water can be discharged out of the shut-off chamber 1200 as drainage after use. At this time, the pressure of the drain is reduced by the drain pressure reducer 1220. The left end of the bellows 1241 and the right end of the bellows 1242 are respectively fixed inside the cutting chamber 1200. The right end of the bellows 1241 and the left end of the bellows 1242 are connected to the receiving plate 1250 respectively. The receiving plate 1250 can place and transport the package substrate 20 and the cut product 20b. In addition, by expanding and contracting the bellows 1241 and 1242, the receiving plate 1250 can be moved in the left-right direction (direction perpendicular to the carrying-in direction of the cut object and the carrying-out direction of the cut product). The drainage flow part 1260 is a part where the drainage flows. The drainage can be discharged from the discharge port 1270 to the outside of the shut-off chamber 1200.

Area C further includes gate valve 1330, inspection table 1400, and tray 1500. The gate valve 1330 is arranged to connect the decompression chamber 1300 and the shutoff chamber 1200. By opening the gate valve 1330, the space in the decompression chamber 1300 and the space in the shut-off chamber 1200 can be connected. By closing the gate valve 1330, the space in the decompression chamber 1300 and the space in the shut-off chamber 1200 can be disconnected and separated. On the inspection table 1400, the packaged parts (cut products) 20b are inspected, and good products and defective products are separated. The good products among the cut products 20b are accommodated and stored (storage) on the tray 1500.

The manufacturing method of the cut product using the cutting device 1000 of FIG. 7 can be performed as follows, for example. First, the air pressure regulator 1210 is used to supply compressed air to the cutting chamber 1200 so that the inside of the cutting chamber 1200 has an air pressure higher than the atmospheric pressure. Thereafter, the inside of the cutting chamber 1200 is maintained at a pressure higher than the atmospheric pressure until the cutting step described later ends (air pressure maintaining step).

On the other hand, the packaging substrate 20 is carried into the pressurized chamber 1100 by the substrate supply mechanism 1010. At this time, since the pressurizing chamber 1100 is open and the inside and the outside are connected, the pressure inside the pressurizing chamber 1100 is the same as the atmospheric pressure.

Next, the pressurized chamber 1100 is brought into a sealed state. After that, the compressed air is supplied to and pressurized in the pressurizing chamber 1100 using the air pressure regulator 1210. Thereby, the air pressure inside the pressurizing chamber 1100 and the air pressure inside the cutting chamber 1200 are made substantially the same. When the air pressure inside the pressurizing chamber 1100 is substantially the same as the air pressure inside the cutting chamber 1200, the supply of compressed air through the air pressure regulator 1210 is stopped. In this state, the gate valve 1030 between the pressurizing chamber 1100 and the cutting chamber 1200 is opened, and the package substrate 20 is carried into the cutting chamber 1200 (cutting target object carrying step). Thereafter, the gate valve 1030 is closed, the connection between the inside of the pressurizing chamber 1100 and the inside of the shutoff chamber 1200 is disconnected and separated.

Next, the package substrate (cutting object) 20 carried in the cutting chamber 1200 is sucked and held by the table (clamp) 10 (cutting object holding step). After that, the package substrate 20 is cut by the rotating shaft 1230 and the rotary knife 30 (cutting mechanism) (cutting step). In this way, it is possible to manufacture a package component (cut product) 20 b in which the package substrate (cutting target object) 20 is cut to be individualized. These cutting object holding step and cutting step can be performed, for example, in the same manner as in Example 1 (FIGS. 1 to 6 ), and can also be performed in the same manner as or according to the cutting method of a normal package substrate.

In addition, the cutting step can be performed while cooling the rotary knife 30 by spraying cooling water with a nozzle (not shown) as described above. As described above after use, the cooling water can flow as drain water in the drain flow portion 1260 and be discharged from the discharge port 1270 to the outside of the shut-off chamber 1200.

On the other hand, the compressed air is supplied into the decompression chamber 1300 using the air pressure regulator 1210 and pressurized. Then, when the air pressure inside the decompression chamber 1300 is substantially the same as the air pressure inside the cut-off chamber 1200, the supply of compressed air by the air pressure regulator 1210 is stopped. This operation may be performed after the cutting step (cutting of the package substrate 20) ends, but if it is performed before the cutting step ends (for example, in parallel with the cutting step), the efficiency is high.

Then, the cutting step (cutting of the package substrate 20) ends, and the gate valve 1330 is opened in a state where the air pressure inside the decompression chamber 1300 and the air pressure inside the cutting chamber 1200 are substantially the same. In this state, the packaging component (cut product) 20 b is carried out from the cutting chamber 1200 and stored in the decompression chamber 1300. Thereafter, the gate valve 1330 is closed, and the connection between the space in the decompression chamber 1300 and the space in the shut-off chamber 1200 is disconnected and separated. Furthermore, the air pressure regulator 1210 is used to discharge the air in the decompression chamber 1300 to the outside and decompress. When the air pressure in the decompression chamber 1300 is substantially the same as the atmospheric pressure, the package member (cut product) 20b is carried out to the outside of the decompression chamber 1300 (cut product carrying out step). After that, the packaging component (cut product) 20 b is inspected using the inspection table 1400 and stored in the tray 1500.

In addition, as a modification of the present embodiment (Embodiment 2), for example, the cutting device 1000 in FIG. 7 can omit the compression chamber 1100 and the decompression chamber 1300. In this case, for example, by opening and closing the gate valve 1030 and the gate valve 1330, it is possible to communicate (connect) or separate the internal space of the shut-off chamber 1200 and the external space. In this case, the package substrate (cutting object) 20 is carried into the cutting chamber 1200 from the substrate supply mechanism (cutting object supply mechanism) 1010 without using the pressurized chamber 1100, and from the cutting chamber 1200 does not use the decompression chamber 1300 to carry out the packaging component (cut product) 20b to the outside. Therefore, in the cutting object carrying-in step, the package substrate (cutting object) 20 is carried in from the carrying-in part provided in the cutting chamber 1200 while the inside of the cutting chamber 1200 is at atmospheric pressure. After that, the cutting chamber 1200 is sealed, and compressed air is supplied into the cutting chamber 1200 using the air pressure regulator 1210, so that the air pressure in the cutting chamber 1200 is higher than the atmospheric pressure. The cutting step is performed in a state where the air pressure in the cutting chamber 1200 is higher than the atmospheric pressure. Regarding the cut-out step, after the cutting step, the air in the cutting chamber 1200 is discharged to the outside by using the air pressure regulator 1210 to reduce pressure. When the air pressure in the cutting chamber 1200 is approximately the same as the atmospheric pressure, The packaging component (cut product) 20b is carried out from the carry-out part provided in the cutting chamber 1200 to the outside. In addition, the cutting device 1000 in FIG. 7 omits the compression chamber 1100 and the decompression chamber 1300 in the modification of the cutting product manufacturing method can be compatible with the cutting product using the cutting device 1000 in FIG. 7 The manufacturing method is the same.

[Example 3]

Next, other different embodiments of the present invention will be described.

In this embodiment, an example of the cutting device and the method of manufacturing a cut product of the present invention, which is different from Embodiment 1 and Embodiment 2, will be described.

Fig. 8 is a plan view schematically showing the structure of the cutting device of this embodiment. As shown in the figure, this cutting device 1000b includes three regions (regions) of A region, B region, and C region similarly to the cutting device of Example 2 (FIG. 7). This cutting device 1000b does not include the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300, and the three areas of the A area, the B area, and the C area are connected into one. Therefore, the shutoff device 1000b does not include the gate valves 1030 and 1330. In addition, in the cutting device 1000b, the entire three areas of the A area, the B area, and the C area are stored in the storage chamber 2000. The air pressure regulator 1210 and the drain pressure reducer 1220 are arranged outside the storage chamber 2000. Furthermore, an operation part 2100 is arranged outside the storage chamber 2000. By the operation part 2100, the air pressure inside the storage chamber 2000 is maintained at a pressure higher than the atmospheric pressure. Therefore, the operation part 2100 and the storage chamber 2000 correspond to the "air pressure maintaining mechanism" in the cutting device 1000b. In addition, when the method of manufacturing a cut product is not implemented, for example, the operating unit 2100 can make the air pressure inside the storage chamber 2000 substantially the same as the atmospheric pressure. The storage room 2000 can be opened and closed. When the method of manufacturing a cut product is implemented, the storage chamber 2000 can be closed to separate the space inside the storage chamber 2000 from the external space. On the other hand, when the method of manufacturing a cut product is not implemented, the storage chamber 2000 can be opened to connect the space inside the storage chamber 2000 and the external space. Otherwise, the cutting device 1000b of Fig. 8 is the same as the cutting device 1000 of Fig. 7 (Example 2).

The storage chamber 2000 may be, for example, a size that ensures a space for internal maintenance work. Specifically, for example, it is possible to perform maintenance work of the cutting device 1000b by a person entering the storage chamber 2000. The structure of the storage chamber 2000 is not particularly limited, and for example, the same structure as a commercial refrigerator or freezer with high airtightness can be used. However, it is possible to omit heat insulating materials that are not used to maintain airtightness. In addition, the operation unit 2100 can operate the cutting device 1000b by wireless or wired communication with the inside of the storage room 2000, for example. Specifically, for example, the operation of the entire cutting device 1000b can be controlled by wireless or wired communication between the operation unit 2100 and the control unit 1020. In addition, the form of the operation unit 2100 is not particularly limited. For example, in FIG. 8, the operating part 2100 is illustrated as an operating panel installed on the outside of the wall of the storage chamber 2000. However, the operation unit 2100 is not limited to this, and may be, for example, a tablet terminal.

The method of manufacturing a cut product using the cutting device 1000b of FIG. 8 can be implemented in a state where the inside of the storage chamber 2000 is maintained at a pressure higher than the atmospheric pressure, for example, in all the steps described in Example 2. For example, an air pressure adjusting mechanism (not shown, for example, a compression pump, etc.) may be used to supply compressed air to the inside of the storage chamber 2000 to maintain the inside of the storage chamber 2000 at an air pressure higher than the atmospheric pressure. As described above, the cutting device 1000b does not include the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300, but three areas of the A area, the B area, and the C area are connected into one area. Therefore, when the packaging substrate (cutting object) 20 and the packaging component (cutting product) 20b are transported, the step of changing the air pressure of the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300 is not necessary. Otherwise, the method of manufacturing a cut product using the cutting device 1000b of FIG. 8 can be performed in the same manner as the method of manufacturing a cut product using the cutting device 1000 of FIG. 7 (Example 2).

In addition, the air pressure adjusting mechanism is not particularly limited, and for example, an existing air compression system installed in a facility (for example, a factory, etc.) where the shutoff device 1000b is installed can be used. In addition, for example, in addition to the existing air compression system, an air compression system including an air compressor and a storage tank may be provided. In this way, since the inside of the storage chamber 2000 can be quickly made high pressure, it is preferable.

Furthermore, as described above, when the method of manufacturing a cut product is not implemented, for example, the operating part 2100 can make the air pressure inside the storage chamber 2000 substantially the same as the atmospheric pressure. For example, when the shut-off device 1000b is maintained, the air pressure adjusting mechanism may be used to discharge the air inside the storage chamber 2000 to the outside and reduce the pressure inside the storage chamber 2000 to the same level as the atmospheric pressure. As a result, it is possible to prevent maintenance workers from working in the high-pressure chamber.

The method of manufacturing a cut product using the cutting device 1000 of Example 2 (FIG. 7) requires a step of changing the air pressure of the pressure chamber 1100, the cutting chamber 1200 and the decompression chamber 1300 each time as described above. In contrast, the method of manufacturing a cut product using the cutting device 1000b of the present embodiment (FIG. 8) does not require a step of changing the air pressure of the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300 as described above. Therefore, according to the cutting device 1000b of the present embodiment (FIG. 8), it is possible to implement the method of manufacturing a cut product more efficiently than the cutting device 1000 of the second embodiment (FIG. 7). On the other hand, the cutting device 1000b of this embodiment (FIG. 8) requires space for installing the storage chamber 2000.

In addition, as described above, the storage room 2000 in FIG. 8 illustrates the size of a space that can be used for internal maintenance work (for example, the entry of a maintenance worker), but it is not limited to this. That is, as a modification of this embodiment (Embodiment 3), for example, a cover portion covering the entire outside of the main body of the cutting device may be provided, and the cover portion may be used as a "storage chamber", and the inside can be made Airtight structure.

Furthermore, the present invention is not limited to the above-mentioned embodiments, and can be combined, changed, or selected arbitrarily and appropriately as needed within the scope not departing from the gist of the present invention.

This application claims priority based on Japanese Application Japanese Patent Application No. 2018-21300 filed on February 8, 2018, and the entire contents of the disclosure are incorporated herein.

10‧‧‧Working table (fixture) 11‧‧‧Slot 12‧‧‧Through hole 20‧‧‧Packaging substrate (cutting object) 20b‧‧‧Packaging component (cutting product) 21‧‧‧Substrate 21b‧ ‧‧Cut off substrate 22‧‧‧Resin (cured resin) 22b‧‧‧Cut off resin (cured resin) 30‧‧‧Rotary knife (cutting mechanism) 31‧‧‧Knife body 32‧‧‧ Flange (fixing member) 1000, 1000b‧‧‧Cutting device 1010‧‧‧Substrate supply mechanism (cutting object supply mechanism) 1020‧‧‧Control unit 1030‧‧‧Gate valve 1100‧‧‧Pressure chamber 1200‧ ‧‧Cutting chamber (air pressure maintaining mechanism) 1210‧‧‧Air pressure regulator (air pressure maintaining mechanism) 1220‧‧‧Drain pressure reducer 1230‧‧‧Rotary shaft (cutting mechanism) 1241, 1242‧‧‧Corrugated pipe 1250‧ ‧‧Receiving plate 1260‧‧‧Drain flow part 1270‧‧‧Exhaust outlet 1300‧‧‧Decompression chamber 1330‧‧‧Gate valve 1400‧‧‧Checking table 1500‧‧‧Tray 2000‧‧‧Storage room (air pressure maintaining mechanism ) 2100‧‧‧Operation part (air pressure maintaining mechanism) X1‧‧‧The arrow indicating the direction of suction generated by the table 10 Y1‧‧‧The arrow indicating the direction of pressure applied to the package substrate 20

Fig. 1 is a step cross-sectional view schematically showing one step in an example of a method for manufacturing a cut product of the present invention.

Fig. 2 is a step sectional view schematically showing another step in the method of manufacturing a cut product that is the same as that of Fig. 1.

Fig. 3 is a step cross-sectional view schematically showing another step in the method of manufacturing the cut product as in Fig. 1.

Fig. 4 is a step cross-sectional view schematically showing another step in the method of manufacturing the cut product as in Fig. 1.

Fig. 5 is a step sectional view schematically showing another step in the method of manufacturing a cut product that is the same as that of Fig. 1.

Fig. 6 is a step sectional view schematically showing another step in the method of manufacturing a cut product that is the same as that of Fig. 1.

Fig. 7 is a plan view schematically showing the structure of an example of the cutting device of the present invention.

Fig. 8 is a plan view schematically showing the structure of another example of the cutting device of the present invention.

10‧‧‧Working table (fixture)

11‧‧‧Slot

12‧‧‧Through hole

20‧‧‧Packaging substrate (cutting object)

21‧‧‧Substrate

22‧‧‧Resin (cured resin)

30‧‧‧Rotary knife (cutting mechanism)

31‧‧‧Knife body

32‧‧‧Flange (fixed component)

X1‧‧‧The arrow indicating the direction of attraction generated by the table 10

Y1‧‧‧The arrow indicating the direction of pressure applied to the package substrate 20

Claims (5)

A cutting device comprising a work table, an air pressure holding mechanism and a cutting mechanism; the work table attracts and holds the cutting object; the air pressure holding mechanism holds the outside of the work table holding the cutting object The air pressure is maintained at a pressure higher than the atmospheric pressure; the cutting object held on the table is cut by the cutting mechanism; wherein the cutting device further includes a cutting chamber, and in the cutting chamber, The air pressure holding mechanism maintains the air pressure outside the table to be higher than the atmospheric pressure, and the cutting object held on the table is cut by the cutting mechanism to produce a cut product. The cutting device described in claim 1, further comprising a pressurizing chamber and a decompression chamber; the pressurizing chamber is arranged on the cutting object carrying side of the cutting chamber; and the decompression chamber is arranged in the cutting chamber The cut product carrying out side; In the state where the pressurizing chamber and the cutting chamber are connected and the pressurizing chamber and the cutting chamber are maintained at a pressure higher than atmospheric pressure, the cutting object is removed from the pressurizing chamber Carried into the cutting chamber; in the state where the decompression chamber and the cutting chamber are connected, the cut product is carried out from the cutting chamber to the decompression chamber, and thereafter, the decompression chamber and the cutting chamber are disconnected The connection between the chambers is interrupted, and the cut product is carried out from the inside of the decompression chamber to the outside in a state where the pressure in the decompression chamber is lower than the air pressure when the cut object is cut. The cutting device described in claim 1 or 2, wherein the aforementioned air pressure maintaining mechanism It includes a storage chamber and an operating part; the working table and the cutting mechanism are stored inside the storage chamber; and the air pressure inside the storage chamber is maintained at a pressure higher than atmospheric pressure by the operating part. The cutting device according to claim 1 or 2, wherein the air pressure maintaining mechanism maintains the air pressure outside the worktable holding the cutting object to 1.1×10 ⁵ Pa or more. A method of manufacturing a cut product includes the following steps: a cutting object holding step, sucking and holding the cutting object by a table; an air pressure holding step, removing the air pressure outside the table holding the cutting object Maintained at a pressure higher than atmospheric pressure; and a cutting step, cutting the cutting object held on the table; wherein the manufacturing method uses a cutting chamber, and the cutting step is in the cutting chamber Wherein, the manufacturing method further uses a pressurized chamber and a decompression chamber, and further includes a cutting object carrying step and a cut product carrying out step; wherein the cutting object carrying step is: in the pressurizing chamber and In a state where the cutting chamber is connected and the pressurizing chamber and the cutting chamber are kept at a pressure higher than atmospheric pressure, the step of carrying the cutting object from the pressurizing chamber to the cutting chamber; and wherein, The cut product carrying out step is: in the state where the decompression chamber and the cutting chamber are connected, the cut product cut from the cutting object in the cutting step is carried out from the cutting chamber To the aforementioned decompression chamber, after that, before disconnecting After the decompression chamber and the cutting chamber are connected, the pressure in the decompression chamber is reduced to a state lower than the air pressure when the cut object is cut, and the cut product is carried out from the decompression chamber Steps to the outside.

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