TWI704651B - Method for forming surrounding wall on ceramic substrate with circuit layout and the substrate - Google Patents

Abstract

A method for forming a surrounding wall on a ceramic substrate on which a circuit is arranged and the substrate. The method forms at least one insulating surrounding wall on a ceramic substrate, the ceramic substrate having a ceramic substrate body and a metal circuit layer, and the ceramic substrate body Comprising an upper surface and a lower surface, the metal circuit layer is arranged on at least the upper surface for arranging at least one electronic component, wherein the metal circuit layer includes at least a plurality of mutually independent metal pads/wires, and the aforementioned mutually independent pads /There is a gap between the wires; through the heating and pressing of the upper and lower molds, the above-mentioned adhesive base material is at least partially filled into the above-mentioned gap, so that the pads/wires that are sandwiched to form the above-mentioned gap are insulated from each other. After the adhesive base material is cured At least one insulating surrounding wall surrounding at least part of the metal circuit layer is formed.

Description

Method for forming surrounding wall on ceramic substrate with circuit layout and the substrate

The invention relates to a ceramic substrate and a manufacturing method, and more particularly to a method for forming a surrounding wall on a ceramic substrate on which circuits are laid out and the substrate.

With the continuous and rapid evolution of technology, optical products such as mobile phone flashes, identification systems, car headlights, fishing lights, engineering lighting or landscape lighting are all developing in the direction of high efficiency and miniaturization, of which optical products are most commonly used The technology of LED (Light Emitting Diode) and VCSEL (Vertical Resonance Cavity Surface-emitting Laser), but currently due to the limitation of the process technology, the miniaturization of the component size has reached the bottleneck, and the barrier between the wall and the ceramic substrate The adhesion is extremely poor, resulting in a significant drop in product yield.

Generally, the packaging structure of optical components includes a substrate and a surrounding wall connecting the substrates. The die is arranged in the accommodating space formed by the substrate and the surrounding wall. Finally, the packaging is completed by colloid, plastic sheet, or glass sheet. The luminous efficacy and color temperature uniformity of optical products have a great influence. The most common manufacturing process nowadays is to connect the metal surrounding wall to the substrate by welding, electroplating or aluminum plate bonding. However, due to the conductive property of the metal surrounding wall, the circuit planning is restricted. In addition to the process technology, the use of metal The substrate surrounding the wall can only be reduced to a size of 35mm square at most, which is difficult to achieve the goal of miniaturization; on the other hand, if the surrounding wall is formed on the substrate using high-precision photoresist film exposure and development technology, the process is complicated and time-consuming. So that the cost of production is greatly increased. In addition, all of the above methods have the problem of high process temperature, which leads to The phenomenon that materials with different growth coefficients are deformed under thermal stress, which greatly reduces the yield of the process.

Therefore, how to propose a method of forming a surrounding wall on a ceramic substrate and on a ceramic substrate, so that the process temperature can be reduced, the overall manufacturing yield can be improved, and the luminous efficiency and color temperature uniformity can be improved, and the circuit configuration should be avoided. The subject of effort.

In view of the above shortcomings, the main purpose of the present invention is to provide a method for forming a surrounding wall on a ceramic substrate with circuit layout, which can greatly reduce the process temperature and reduce the thermal deformation of the structure, thereby improving the manufacturing yield of the ceramic substrate.

Another object of the present invention is to provide a ceramic substrate with surrounding walls and circuit layout, which can effectively improve the luminous efficiency and color temperature uniformity of the crystal grains disposed on the ceramic substrate.

Another object of the present invention is to provide a ceramic substrate with surrounding walls on which circuits are laid out, which can additionally ensure that the metal pads/wires of the metal circuit layer are insulated from each other.

Another object of the present invention is to provide a ceramic substrate with a surrounding wall and circuit layout, which can further form a through port in the surrounding wall, thereby increasing the flexibility of the circuit layout of the product.

To achieve the above objective, the present invention provides a ceramic substrate with a surrounding wall and a circuit layout. The substrate includes: a ceramic substrate body including an upper surface and a lower surface opposite to the upper surface; a layout on at least the upper surface The metal circuit layer is provided with at least one electronic component, wherein the metal circuit layer includes at least a plurality of mutually independent metal pads/wires, and there is a space between the aforementioned mutually independent pads/wires; at least one surrounds at least part of the metal The insulating surrounding wall of the circuit layer, the insulating surrounding wall is made of a glue base material, and the insulating surrounding wall extends from the upper surface toward the metal circuit layer and is higher than the metal circuit layer, so that the insulating The rim surrounding wall and the ceramic substrate body together form an accommodating space that partially surrounds the electronic components; and the glue base material is at least partially filled with the gap, so that the pads/wires sandwiched to form the gap are insulated from each other.

To achieve the above objective, the present invention also provides a method for forming a surrounding wall on a ceramic substrate on which circuits are laid out, so that at least one insulating surrounding wall is formed on a ceramic substrate having a ceramic substrate body and a metal circuit layer, The ceramic substrate body includes an upper surface and a lower surface opposite to the upper surface. The metal circuit layer is arranged on at least the upper surface for arranging at least one electronic component, wherein the metal circuit layer includes at least a plurality of mutually independent metal pads /Wire, and the aforementioned independent pads/wires are separated from each other. The method includes the following steps: a) Step 1: Set the ceramic substrate body on an upper mold, and set a release mold on the lower mold, Wherein the metal circuit layer is set toward the lower mold; b) Step 2: Inject a liquid-like adhesive substrate into the release mold on the side close to the upper mold; c) Step 3: The upper mold and the upper mold The lower molds are close to each other, the ceramic substrate body and the colloidal base material are heated and pressed together, so that the colloidal base material at least partially fills the gap, so that the pads/wires that are sandwiched to form the gap are insulated from each other, and The adhesive substrate is cured to form at least one insulating surrounding wall surrounding at least part of the metal circuit layer; d) Step 4: The upper mold and the lower mold are separated from each other, so that the ceramic substrate body is separated from the release mold, wherein The insulating surrounding wall extends from the upper surface toward the metal circuit layer and is higher than the metal circuit layer, so that the insulating surrounding wall and the ceramic substrate body together form an accommodating space that partially surrounds the electronic component.

Compared with the prior art, the present invention discloses a method for forming a surrounding wall on a ceramic substrate with circuit layout and the substrate uses a colloidal base material as the insulating surrounding wall and transmits The low-temperature heating and pressing method forms the insulating surrounding wall on the ceramic substrate, which greatly reduces the process temperature and reduces the thermal deformation of the structure. At the same time, part of the colloidal substrate will be filled in the metal circuit layer with independent pad/wire spacing to ensure The metal pads/wires are insulated from each other; in addition, with different characteristics of the adhesive substrate, you can choose to reflect the light of the mounted die as much as possible to improve the luminous efficiency, or absorb the wide-angle light to avoid the light source between different die Mutual interference makes each surrounding wall more miniaturized when used as the light source of face recognition or vehicle recognition system, which reduces the overall volume or obtains higher resolution. Moreover, when additional conductive ports are provided in the surrounding wall, it can also be used to conduct other components and devices, which further provides better circuit layout flexibility.

1~4‧‧‧step

10, 10’, 10”‧‧‧ceramic substrate

11, 11’, 51‧‧‧ceramic substrate body

12, 12’, 52‧‧‧Metal circuit layer

13, 13’‧‧‧ interval

14,14’,14”,54,74‧‧‧Insulation surrounding wall

15, 15’‧‧‧accommodating space

21‧‧‧Upper mold

22‧‧‧Lower mold

23‧‧‧Release mold

24‧‧‧Adhesive substrate

111、111’‧‧‧Upper surface

112, 112’‧‧‧ lower surface

121, 121’, 521, 721‧‧‧Metal pad

122, 122’, 522, 722‧‧‧Metal contacts

123, 123’, 523, 723‧‧‧metal wire

221‧‧‧Groove

222‧‧‧Protrusion

141‧‧‧Dividing groove

30、40‧‧‧Light-emitting diode

31, 41‧‧‧grain

32, 42, 73‧‧‧Wire

33‧‧‧Lens

43‧‧‧Lens

A, B‧‧‧dotted line

520, 720‧‧‧Metal port

55、75‧‧‧through hole

71‧‧‧Electronic components

FIG. 1 is a flowchart of a first preferred embodiment of a method for forming a surrounding wall on a ceramic substrate on which circuits are laid out according to the present invention.

FIG. 2 is a schematic diagram of the steps of the first preferred embodiment of FIG. 1. FIG.

3 is a schematic diagram of another step of the first preferred embodiment in FIG. 1.

4 is a partial enlarged view of the insulating surrounding wall of FIG. 3 formed on the ceramic substrate.

Fig. 5 is the ceramic substrate before cutting in Fig. 4.

FIG. 6 is a three-dimensional structural view of the first preferred embodiment of the ceramic substrate with circuit layout with surrounding walls according to the present invention.

FIG. 7 is a three-dimensional structure diagram of the embodiment of FIG. 6 as a light-emitting diode.

FIG. 8 is a cross-sectional view of the light-emitting diode in FIG. 7.

9 is a cross-sectional view of a second preferred embodiment of a ceramic substrate with a surrounding wall and a circuit layout of the present invention.

Fig. 10 is a cross-sectional view of the embodiment in Fig. 7 as a light emitting diode.

11 is a three-dimensional structural view of a third preferred embodiment of a ceramic substrate with a surrounding wall and a circuit layout of the present invention.

Fig. 12 is a cross-sectional view of the embodiment in Fig. 11.

FIG. 13 is a three-dimensional structural view of a fourth preferred embodiment of the ceramic substrate with circuit layout with surrounding walls according to the present invention.

FIG. 14 is a cross-sectional view of a fourth preferred embodiment of a ceramic substrate with a circuit layout with surrounding walls according to the present invention.

The following specific examples illustrate the implementation of the present invention. Those familiar with the art can easily understand the advantages and effects of the present invention from the content disclosed in this specification.

The structure, ratio, size, etc. shown in the drawings in this specification are only used to match the disclosure content of the specification for the understanding and reading of those familiar with the art, and are not used to limit the implementation of the present invention. Any structural modification, size adjustment, or change in the proportional relationship, without substantial changes to the technical content, shall be regarded as the scope of the present invention.

The first preferred embodiment of the method of forming a surrounding wall on a ceramic substrate with circuits of the present invention is shown in FIG. 1. First, in step 1, as shown in FIG. 2, the ceramic substrate body 11 is combined to the upper mold 21 by suction, for example, under negative pressure. Below, make the side of the surrounding wall to be formed face the lower mold 22, and then set the release mold 23 on the lower mold 22; then, as shown in step 2, inject the adhesive substrate 24 into the release mold 23 close to the upper mold 21 Side. In this example, the colloidal substrate 24 is a liquid and thermosetting silicone rubber. Of course, those with ordinary knowledge in the technical field of the present invention can also choose arbitrarily, for example, epoxy resin, or other resins that have cooling or UV curing properties. Adhesive substrate, or composite adhesive substrate made of functional materials such as fluorescent powder, light-absorbing material, reflective material, etc. It will not hinder the implementation of this case.

Through the method in this example, the insulating surrounding wall can be formed on the ceramic substrate. Referring to the enlarged schematic diagram of FIG. 4, the ceramic substrate 10 in this example mainly includes a ceramic substrate body 11 and a metal circuit that has been laid on the ceramic substrate body 11. Layer 12, the ceramic substrate body 11 includes an upper surface 111 and a lower surface 112 opposite to the upper surface 111. The metal circuit layer 12 includes metal pads 121 arranged on the upper surface 111, circuits (not shown), and penetrating the ceramic substrate body The metal wire 123 of 11 and the metal contact 122 arranged on the lower surface 112. Because the metal wire 123 connects the metal pad 121 and the metal contact 122, the LED chips that will be mounted on the metal pad 121 in the future Electronic components can obtain enabling current or electrical signals through metal contacts 122.

Next, as described in step 3, the upper mold 21 and the lower mold 22 are close to each other, and the ceramic substrate body 11 and the adhesive substrate 24 are heated and pressed at a temperature lower than 300 degrees. At this time, the adhesive substrate 24 is mainly Extrusion fills the cavity of the lower mold 22 and is gradually bonded to the ceramic substrate body 11 during the pressurization process. Especially after the mold is closed, due to the influence of pressure and temperature, the colloidal substrate will be as shown in Figure 4, not only When the cavity is filled, it will be squeezed into the gap 13 between the metal pads 121 of tens to hundreds of micrometers (μm), so that the metal pads 121 are insulated from each other. At the same time, the glue substrate 24 filled in the groove 221 of the lower mold 22 will gradually solidify on the ceramic substrate body 11 to form an insulating surrounding wall 14 surrounding a part of the metal circuit layer 12.

As shown in Figure 3, Figure 4 and Step 4, when demolding, the upper mold 21 and the lower mold 22 gradually move away from each other. Due to the release mold 23, the formed insulating surrounding wall 14 will not stick to the lower mold at all 22, and firmly bonded to the ceramic substrate body 11, extending from the upper surface 111 toward the metal circuit layer 12 and higher than the metal circuit layer 12, so that the insulating surrounding wall 14 and the ceramic substrate body 11 together form for installing electronic components The accommodation space 15. The size of the accommodating space 15 here The height and size of the insulating surrounding wall 14 are determined by the spacing and shape of the groove 221 of the lower mold 22. A protrusion 222 may also be formed in the groove 221, so that the insulating surrounding wall 14 is formed with a dividing groove 141 corresponding to the protrusion 222, so that the ceramic substrate 10 can be easily divided into smaller units; of course, it can also be based on the conditions of the cutting instrument It is determined whether a protrusion 222 is formed in the groove 221 or a protrusion 222 of a different shape is formed.

Fig. 5 is the ceramic substrate 10 before cutting in Fig. 4, the dashed line in Fig. 5 is the cutting path of the ceramic substrate 10. The ceramic substrate 10 can be cut into 25 smaller cells, and the insulating surrounding wall 14 of each cell The accommodating space 15 surrounded by it can be used as a space for arranging LED dies; of course, as those skilled in the art can easily understand, if the ceramic substrate is to be used to manufacture a multi-cell VCSEL, it does not need to be divided Instead, use it directly. The first preferred embodiment of the ceramic substrate with circuit layout with surrounding walls of the present invention is shown in FIG. 6. In this example, the ceramic substrate 10' is divided into a single unit by the entire ceramic substrate 10 in the previous example. The ceramic substrate 10 'Includes a ceramic substrate body 11', a metal circuit layer 12', and an insulating surrounding wall 14', wherein the metal circuit layer 12' includes metal pads 121' arranged on the upper surface 111', and metal contacts 122' on the lower surface 112' And the metal wire 123' electrically conducting both.

7 and 8 are the use of the ceramic substrate 10' of FIG. 6, a light-emitting diode die 31 is welded on the metal pad 121', and the wire 32 is electrically struck from the upper surface of the light-emitting diode die 31 Connect to another metal pad 121', then fill the accommodating space with light-transmitting glue for packaging, and finally install a lens 33 above the light-transmitting glue to form a complete light-emitting diode 30, which is shown in Figure 8 It is a cross-sectional view of the light emitting diode 30 in FIG. 7 cut along the broken line A. The die 31 is a metal pad 121' disposed on the upper surface 111' by mounting or spot welding, and then electrically conductively connected to another metal pad 121' on the upper surface 111' by a wire 32, whereby the die 31 can penetrate the two metals on the lower surface 112' The contact 122' is connected to the external power source and emits light. The space 13' between the two metal pads 121' on the upper surface 111' has a cured adhesive base material, so it can prevent the two metal pads 121' from being deformed due to high temperature or short-circuiting during welding, causing damage to electronic parts . Especially in the process of continuous miniaturization of electronic components, better insulation protection is provided, thereby increasing the yield of products.

When the packaging glue is filled into the accommodating space 15' during the manufacturing process, the insulating surrounding wall 14' can not only prevent the packaging glue from overflowing, but also by adding materials with different characteristics to the glue base material or using different materials of the glue base Material, so that the formed insulating surrounding wall 14' can have different functions. For example, when using a colloidal substrate with high light transmittance, the light-emitting angle of the light-emitting diode can be increased; when a highly reflective material is added, the light can be concentrated to prevent the light from interfering with adjacent light-emitting elements; if the phosphor is added, the color can be matched , Improve color temperature uniformity or adjust color rendering. Of course, even in an accommodating space, for example, three or more pairs of metal pads are formed, and at least one red, green, and blue crystal grain is arranged in a surrounding wall, and a white light with good color rendering can be made. LED.

Of course, those with ordinary knowledge in the technical field of the present invention can also apply the ceramic substrate with surrounding walls and circuit layout in this example to VCSEL fields such as 3D sensing, gesture recognition, or face recognition, by setting the VCSEL with infrared crystal grains. One of the metal pads and the other metal pad are selectively provided with sensing die, and then a diffuser is placed on the surrounding wall to complete a VCSEL device with excellent adhesion between the surrounding wall and the ceramic substrate. It must be noted here that the above-mentioned lens 33 is not limited to glass material. When installed in the surrounding wall is an optical element, whether it is light emitting or receiving light in a broad sense, as long as it can allow the required wavelength to pass through, whether it is infrared or ultraviolet. , The lens here does not necessarily need to allow visible light transmission.

The second preferred embodiment of the ceramic substrate with circuit layout around the wall of this case is shown in Figure 9 and Figure 10. The same parts as the previous example will not be repeated in this example, and only the differences will be mentioned. Bright. The structure of the surrounding wall is not limited to the rectangular structure in the foregoing embodiment, and different structures can also be used to form the insulating surrounding wall on the ceramic substrate. FIG. 10 is a light-emitting diode 40 composed of a light-emitting diode crystal grain 41, a wire 42 and a lens 43 provided on the ceramic substrate 10" in FIG. 9, where FIG. 10 is the ceramic substrate 10" in FIG. A cross-sectional view of the light emitting diode 40 cut along the broken line B afterwards. In this example, the insulating surrounding wall 14" is formed on the ceramic substrate 10" in a circular ring structure, so that a circular lens 43 can be arranged above the insulating surrounding wall 14", which means that in accordance with the technology disclosed in the present invention, It has great flexibility, and it can manufacture products of different shapes in response to different market needs.

The third preferred embodiment of the ceramic substrate with circuit layout around the wall of this case is shown in Figures 11 and 12. This example has the same structure as the first embodiment in Figure 6, and the ceramic substrate further includes two walls. Shaped metal guide port 520. The metal conductive port 520 is formed on the ceramic substrate body 51 by molding before the insulating surrounding wall 54 is formed. The ceramic substrate body 51 is formed with at least one through hole 55 in the area where the insulating surrounding wall 54 is scheduled to be formed, the metal conductive port 520 is conductively penetrated and provided at the through hole 55, and the metal conductive port 520 and the metal circuit layer 52 are formed by A space formed by the insulating surrounding wall can be selected to be electrically insulated from the metal circuit layer 52 or to be conducted by forming a line in the metal circuit layer through the insulating surrounding wall, thereby increasing the flexibility of the circuit layout. The metal conductive port 520 can be formed to the required height at one time, or a part of the height can be formed first, and then thickened to the required height by plating. For example, in addition to being mounted on the metal pad 521, the electronic component can also be connected to the metal conductive port 520, and is electrically connected to the metal contact 522 through the metal wire 523.

In addition to the wall-shaped metal conductive port in the foregoing embodiment, the metal conductive port 720 may also be columnar as shown in the embodiments in FIG. 13 and FIG. 14; of course, the metal conductive port 720 may also be provided on an insulating surrounding wall Any position in 74, such as the four corners and four sides of the insulating surrounding wall 74 Any position, and the exposed part may be above or on the side of the insulating surrounding wall 74 as a connection point for connecting wires or electronic components. The metal conductive port 720 is formed by forming at least one through hole 75 in the area where the insulating surrounding wall 74 is scheduled to be formed, and when the insulating surrounding wall 74 is formed, at least one through hole 75 remains at the insulating surrounding wall 74 by a mold. A plug hole corresponding to the through hole 75, and after the insulating surrounding wall 74 is formed, the plug hole is filled with a metal conductive material. The electronic component 71 can be mounted on the metal pad 721, and is electrically conductively connected to the lower metal contact 722 through the metal wire 723. At the same time, the wire 73 is connected to the metal conductive port 720 in the insulating surrounding wall 74 to make the circuit layout flexible Can be greatly improved. Of course, as those skilled in the art can easily understand, the through hole 75 and the plug hole here can also be cut through, for example, a laser beam after the insulating surrounding wall is completely formed. Implementation.

In the method of forming a surrounding wall on a ceramic substrate with circuits and the substrate of the present invention, a liquid gel base material is formed on the ceramic substrate into a solidified insulating surrounding wall through a compression molding method. There is a high-temperature environment in the process to prevent the ceramic substrate from causing thermal stress and expansion and contraction due to high temperature to reduce the product yield; in addition, it can also improve the position accuracy of the insulating surrounding wall forming on the ceramic substrate to avoid errors or misalignment during the electric welding process , You can also simplify the work process at the same time. On the other hand, the liquid adhesive substrate will also fill the gaps in the metal pads or wires in the metal circuit layer. After the adhesive substrate is cured, it can ensure that the metal pads or wires that should be independent of each other are insulated from each other. In addition, the method proposed by the present invention is more suitable for forming various shapes of insulating surrounding walls on the ceramic substrate, which meets various market demands.

However, the above are only the preferred embodiments of the present invention, and cannot be used to limit the scope of implementation of the present invention. All simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the contents of the specification should remain It falls within the scope of the present invention. After the present invention is better After the description of the examples, those familiar with this technical field should be able to understand that this case is indeed a novel, progressive and industrially applicable invention, which has deep development value.

11’‧‧‧Ceramic substrate body

12’‧‧‧Metal circuit layer

13’‧‧‧ interval

14’‧‧‧Insulation surrounding wall

15’‧‧‧accommodating space

30‧‧‧Light Emitting Diode

31‧‧‧grain

32‧‧‧Wire

33‧‧‧Lens

111’‧‧‧Upper surface

112’‧‧‧Lower surface

121’‧‧‧Metal pad

122’‧‧‧Metal contact

123’‧‧‧Metal wire

Claims (5)

A method for forming a surrounding wall on a ceramic substrate on which a circuit is laid out. At least one insulating surrounding wall is formed on a ceramic substrate. The ceramic substrate has a ceramic substrate body and a metal circuit layer. The ceramic substrate body includes an upper surface and Contrary to the lower surface of the upper surface, the metal circuit layer is arranged on at least the upper surface for arranging at least one electronic component, wherein the metal circuit layer includes at least a plurality of mutually independent metal pads/wires, and the aforementioned mutually independent connections There is a gap between the pads/wires, and the method includes the following steps: a) setting the ceramic substrate body on an upper mold, and setting a release mold on the lower mold, wherein the metal circuit layer is set toward the lower mold; b) Inject a liquid-like glue base material into the side of the release mold close to the upper mold; c) the upper mold and the lower mold are close to each other, and the ceramic substrate body and the glue base material are heated and pressed The adhesive substrate is at least partially filled into the gap, so that the pads/wires that are sandwiched to form the gap are insulated from each other, and the adhesive substrate is cured to form at least one surrounding at least part of the metal circuit layer Insulating surrounding wall; d) The upper mold and the lower mold are separated from each other, so that the ceramic substrate body is separated from the release mold, wherein the insulating surrounding wall extends from the upper surface toward the metal circuit layer and is higher than the metal circuit Layer, so that the insulating surrounding wall and the ceramic substrate body together form an accommodating space that partially surrounds the electronic component. The method for forming a surrounding wall on a ceramic substrate on which circuits are laid out as described in the first item of the scope of the patent application, wherein the ceramic substrate body is formed with at least one through hole in the range where the insulating surrounding wall is scheduled to be formed, and the method is more It includes a step e) before the above step a), forming at least one conductive metal conductive through the through hole at the corresponding through hole. The port is such that after the insulating surrounding wall is formed, the metal conductive port will form a gap with the metal circuit layer. The method for forming a surrounding wall on a ceramic substrate on which circuits are laid out as described in the first item of the scope of patent application, wherein the ceramic substrate body is formed with at least one through hole in the range where the insulating surrounding wall is scheduled to be formed, and in the above step c) When forming the insulating surrounding wall, the insulating surrounding wall retains at least one plug hole corresponding to the through hole; and the above method further includes a step f) after the above step d), filling the above with a metal conductive material Plug hole. As described in item 1, 2 or 3 of the scope of patent application, the method for forming a surrounding wall on a ceramic substrate with circuit layout, wherein the insulating surrounding wall is formed at a temperature below 300 degrees. A ceramic substrate with a surrounding wall and a circuit layout. The substrate includes: a ceramic substrate body including an upper surface and a lower surface opposite to the upper surface; and a metal circuit layer arranged on at least the upper surface for installing at least An electronic component, wherein the metal circuit layer includes at least a plurality of mutually independent metal pads/wires, and the aforementioned mutually independent pads/wires have spaces; at least one insulating surrounding wall surrounding at least part of the metal circuit layer, the above The insulating surrounding wall is made of a glue base material, and the insulating surrounding wall extends from the upper surface toward the metal circuit layer and is higher than the metal circuit layer, so that the insulating surrounding wall and the ceramic substrate body are formed together One part surrounds the accommodating space of the above-mentioned electronic component; and the above-mentioned colloidal substrate at least partly fills the above-mentioned space, so that the above-mentioned pads/wires sandwiched to form the above-mentioned space are insulated from each other; and at least one is arranged in the above-mentioned insulating surrounding wall And run through the above ceramic base version body The metal conductive port is formed with a gap between the metal conductive port and the metal circuit layer.

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