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TWI704355B - Suitable for probe modules with multiple units to be tested with inclined conductive contacts - Google Patents

Suitable for probe modules with multiple units to be tested with inclined conductive contacts Download PDF

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Publication number
TWI704355B
TWI704355B TW108125850A TW108125850A TWI704355B TW I704355 B TWI704355 B TW I704355B TW 108125850 A TW108125850 A TW 108125850A TW 108125850 A TW108125850 A TW 108125850A TW I704355 B TWI704355 B TW I704355B
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Taiwan
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probe
probes
tested
conductive contacts
junction
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TW108125850A
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Chinese (zh)
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TW202104904A (en
Inventor
張嘉泰
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旺矽科技股份有限公司
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Priority to TW108125850A priority Critical patent/TWI704355B/en
Priority to CN202010336493.1A priority patent/CN112285394B/en
Priority to KR1020200051307A priority patent/KR102292880B1/en
Application granted granted Critical
Publication of TWI704355B publication Critical patent/TWI704355B/en
Publication of TW202104904A publication Critical patent/TW202104904A/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06727Cantilever beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

一種探針模組,係用以同時檢測側邊緣相鄰之第一、二待測單元,第一、二待測單元分別具有鄰近其第一主邊緣及相鄰側邊緣之第一、二交界接點;該探針模組包含有一探針座,以及設於該探針座之不同高度的第一、二交界探針,當該探針模組檢測第一、二待測單元時,各該待測單元之第一主邊緣較第二主邊緣更靠近該探針座,第一、二交界探針係以其懸臂段分別經過第一、二待測單元之第一主邊緣上方而分別延伸至第一、二交界接點上方進而以其點觸段點觸第一、二交界接點;藉此,第一、二交界探針可避免相互干涉。A probe module is used to simultaneously detect first and second units to be tested adjacent to side edges. The first and second units to be tested respectively have first and second boundaries adjacent to their first main edge and adjacent side edges Contact; the probe module includes a probe holder, and the first and second junction probes at different heights of the probe holder, when the probe module detects the first and second units to be tested, each The first main edge of the unit to be tested is closer to the probe holder than the second main edge, and the first and second junction probes are separated by their cantilever sections passing over the first main edge of the first and second units to be tested. Extend to the top of the first and second junction contacts and then touch the first and second junction contacts with its point contact section; thereby, the first and second junction probes can avoid mutual interference.

Description

適用於具有傾斜導電接點之多待測單元的探針模組Suitable for probe modules with multiple units to be tested with inclined conductive contacts

本發明係與探針卡之探針模組有關,特別是關於一種適用於具有傾斜導電接點之多待測單元(multi-UUT)的探針模組。 The present invention relates to the probe module of the probe card, and particularly relates to a probe module suitable for multi-UUT with inclined conductive contacts.

請參閱圖1,其中顯示一具有傾斜導電接點之待測單元10(unit under test;簡稱UUT),該待測單元10可為未封裝之晶片(die)或已封裝之晶片(chip),該待測單元10具有排成一或多行之複數用於輸出訊號之第一導電接點11,以及排成一行之複數用於輸入訊號之第二導電接點12,例如圖1所示之待測單元10具有由其一基板13之一第一長邊131朝向一第二長邊132排列之三行第一導電接點11,以及沿該基板13之第二長邊132設置的一行第二導電接點12,該等第一、二導電接點11、12排成多列,每一列之排列方向係平行於一垂直於第一、二長邊131、132之分界軸線L,且靠近該分界軸線L之列,例如圖1中一中間區塊14所包含者,其中之第一、二導電接點11、12的長邊111、121係平行於該分界軸線L,而距離該分界軸線L較遠之列的第一、二導電接點11、12則為傾斜導電接點,其較靠近基板13第一長邊131之一端亦較靠近該分界軸線L,較遠離基板13第一長邊131之一端則亦較遠離該分界軸線L,亦即傾斜導電接點以圖1之方向來看是由上而下且由內而外地傾斜,且距離該分界軸線L越遠之第一、二導電接點11、12相對於該分界軸線L之角度越大,例如圖1中二外側區塊15、16所包含之第一、二導電接點11、12之長邊111、121相對於該分界軸線L之角度θ1、θ2最大。 Please refer to FIG. 1, which shows a unit under test (UUT) with inclined conductive contacts. The unit under test 10 can be an unpackaged die or a packaged chip. The unit under test 10 has a plurality of first conductive contacts 11 arranged in one or more rows for outputting signals, and a plurality of second conductive contacts 12 arranged in a row for inputting signals, such as the one shown in FIG. 1 The unit under test 10 has three rows of first conductive contacts 11 arranged from a first long side 131 of a substrate 13 toward a second long side 132, and a row of first conductive contacts 11 arranged along the second long side 132 of the substrate 13 Two conductive contacts 12, the first and second conductive contacts 11, 12 are arranged in multiple rows, and the arrangement direction of each row is parallel to a dividing axis L perpendicular to the first and second long sides 131, 132, and is close to The row of the demarcation axis L, such as that contained in a middle block 14 in FIG. 1, wherein the long sides 111, 121 of the first and second conductive contacts 11, 12 are parallel to the demarcation axis L, and are distant from the demarcation axis L The first and second conductive contacts 11 and 12 in the row farther from the axis L are inclined conductive contacts, which are closer to one end of the first long side 131 of the substrate 13 and also closer to the boundary axis L, and farther away from the substrate 13. One end of the long side 131 is also farther away from the demarcation axis L, that is, the inclined conductive contact is inclined from top to bottom and from the inside to the outside in the direction of FIG. 1, and the first one is farther from the demarcation axis L , The greater the angle between the two conductive contacts 11, 12 relative to the demarcation axis L, for example, the longer sides 111, 121 of the first and second conductive contacts 11, 12 included in the two outer blocks 15, 16 in FIG. The angles θ1 and θ2 at the boundary axis L are the largest.

前述之待測單元10可利用具有懸臂式探針的探針卡進行檢測,為簡化圖式,圖1中僅示意性地顯示一對應最左邊之第二導電接點12的探針17,實際上每一導電接點11、12皆對應一探針,該探針17之懸臂段171可自一位於該待測單元10之第二長邊132外側上方的探針座18延伸至導電接點12上方,使得探針17之一自其懸臂段171末端向下延伸的點觸段(圖中未示)可點觸對應之導電接點12。 The aforementioned unit under test 10 can be tested by using a probe card with a cantilever probe. To simplify the diagram, only a probe 17 corresponding to the second conductive contact 12 on the left is schematically shown in FIG. Each conductive contact 11, 12 corresponds to a probe, and the cantilever section 171 of the probe 17 can extend from a probe holder 18 above the second long side 132 of the unit under test 10 to the conductive contact Above 12, one of the touch sections (not shown in the figure) extending downward from the end of the cantilever section 171 of the probe 17 can touch the corresponding conductive contact 12.

然而,由於該待測單元10具有傾斜角度不一致之傾斜導電接點,其檢測所需之探針難以配置於探針座上,尤其對於多待測單元之檢測,亦即同時檢測至少二該待測單元10,將會有探針17相互干涉之疑慮,因此目前仍未有適用之檢測裝置。 However, because the unit under test 10 has inclined conductive contacts with inconsistent tilt angles, it is difficult to arrange the probes required for its detection on the probe holder, especially for the detection of multiple units under test, that is, at least two units to be tested at the same time. In the measurement unit 10, there will be doubts that the probes 17 interfere with each other, so there is still no suitable detection device.

有鑑於上述缺失,本發明之主要目的在於提供一種探針模組,係適用於類同上述之具有傾斜導電接點之多待測單元的檢測,以避免探針相互干涉。 In view of the above-mentioned shortcomings, the main purpose of the present invention is to provide a probe module, which is suitable for the detection of multiple units under test with inclined conductive contacts similar to the above-mentioned, so as to avoid mutual interference of probes.

為達成上述目的,本發明所提供之探針模組係用以同時檢測複數待測單元,各該待測單元具有一第一主邊緣、一第二主邊緣、連接該第一主邊緣及該第二主邊緣之一第一側邊緣及一第二側邊緣,以及複數導電接點,該複數待測單元中包含一第一待測單元及一第二待測單元,該第一待測單元之第二側邊緣係與該第二待測單元之第一側邊緣相鄰,該第一待測單元之導電接點中包含一鄰近該第一待測單元之第一主邊緣及第二側邊緣的第一交界接點,該第二待測單元之導電接點中包含一鄰近該第二待測單元之第一主邊緣及第一側邊緣的第二交界接點。 In order to achieve the above object, the probe module provided by the present invention is used to simultaneously detect a plurality of units to be tested. Each unit to be tested has a first main edge, a second main edge, connecting the first main edge and the A first side edge and a second side edge of the second main edge, and a plurality of conductive contacts. The plurality of units under test includes a first unit under test and a second unit under test, the first unit under test The second side edge is adjacent to the first side edge of the second unit under test, and the conductive contacts of the first unit under test include a first main edge and a second side adjacent to the first unit under test The first boundary contact of the edge, and the conductive contact of the second unit to be tested includes a second boundary contact adjacent to the first main edge and the first side edge of the second unit to be tested.

該探針模組包含有至少一探針座,以及複數探針,各該探針包含有一懸臂段及一點觸段,該懸臂段具有一與該探針座固接之固定部,以及一連接於該固定部且自該探針座一內側面延伸而出之外露部,該點觸段係連接於該外露部。其中,該至少一探針座中包含一第一探針座,該複數探針中包含設置於該第一探針座且位於不同高度之一第一交界探針及一第二交界探針,當該探針模組檢測該等待測單元時,各該待測單元之第一主邊緣係較第二主邊緣更靠近該第一探針座,該第一交界探針及該第二交界探針係以其懸臂段分別經過該第一待測單元及該第二待測單元之第一主邊緣上方而分別延伸至該第一交界接點及該第二交界接點上方進而以其點觸段分別點觸該第一交界接點及該第二交界接點。 The probe module includes at least one probe holder and a plurality of probes. Each probe includes a cantilever section and a one-point contact section. The cantilever section has a fixed portion fixedly connected to the probe holder and a connection At the fixing portion and extending from an inner side surface of the probe base, the exposed portion is exposed, and the point contact section is connected to the exposed portion. Wherein, the at least one probe holder includes a first probe holder, and the plurality of probes includes a first junction probe and a second junction probe that are arranged on the first probe holder and are located at different heights, When the probe module detects the waiting unit, the first main edge of each unit to be tested is closer to the first probe holder than the second main edge, the first junction probe and the second junction probe The cantilever section of the needle passes over the first main edge of the first unit to be tested and the second unit to be tested, and extends to the first junction contact and the second junction contact respectively, and then touches with its point. The segments respectively touch the first junction contact and the second junction contact.

換言之,本發明主要係針對相鄰待測單元之相鄰側邊緣鄰近第一主邊緣之處的導電接點,亦即第一、二交界接點,本發明之探針模組係藉由鄰近待測單元之第一主邊緣的第一探針座從不同高度延伸而出之第一、二交界探針分別點觸第一、二交界接點。該探針模組用以點觸該等待測單元之其他導電接點的探針配置則無限制。 In other words, the present invention is mainly aimed at the conductive contacts where the adjacent side edges of adjacent units under test are adjacent to the first main edge, that is, the first and second junction contacts. The probe module of the present invention is based on the proximity The first and second junction probes of the first probe holders extending from different heights of the first main edge of the unit to be tested touch the first and second junction contacts respectively. There is no limit to the probe configuration of the probe module used to touch other conductive contacts of the waiting unit.

由於第一、二交界探針係位於不同高度,即使第一、二交界接點朝向第一主邊緣之延伸方向係相互靠近,第一、二交界探針之懸臂段的外露部自第一探針座延伸而出之方向仍可配合第一、二交界接點之延伸方向,以避免探針在點測時意外滑動至非對應的導電接點上,亦即,第一、二交界探針之懸臂段的外露部可自第一探針座傾斜延伸而逐漸朝對應之交界接點靠近,即使所需之傾斜角度很大,使得第一、二交界探針的懸臂段彼此相當靠近或甚至必須部分位於同一垂直面上,第一、二交界探針因位於不同高度而可避免相互干涉。 Since the first and second junction probes are located at different heights, even if the first and second junction points are close to each other in the extension direction of the first main edge, the exposed part of the cantilever section of the first and second junction probes is from the first probe The direction in which the needle holder extends can still be matched with the extension direction of the first and second junction contacts to prevent the probe from accidentally sliding onto the non-corresponding conductive contacts during point measurement, that is, the first and second junction probes The exposed part of the cantilever section can extend obliquely from the first probe holder and gradually approach the corresponding junction point, even if the required inclination angle is large, so that the cantilever sections of the first and second junction probes are quite close to each other or even The parts must be located on the same vertical plane, and the first and second junction probes are located at different heights to avoid mutual interference.

事實上,由第一探針座之不同高度延伸而出的探針,不限於用以點觸如前述之鄰近第一主邊緣的第一、二交界接點,而可適用於任何位置之可能造成同高度之探針過於靠近或相互干涉的導電接點,以藉由將可能造成前述問題之導電接點所對應之探針(在本發明中皆稱為第一、二交界探針)設置於不同高度而達到避免探針干涉之功效。 In fact, the probes extending from the different heights of the first probe holder are not limited to touch the first and second junction points adjacent to the first main edge as mentioned above, but can be applied to any position possible Conductive contacts that cause probes of the same height to be too close or interfere with each other, so that the probes corresponding to the conductive contacts that may cause the aforementioned problems (both referred to as the first and second junction probes in the present invention) are arranged It can avoid probe interference at different heights.

有關本發明所提供之具有傾斜導電接點之多待測單元的探針模組的詳細構造、特點、組裝或使用方式,將於後續的實施方式詳細說明中予以描述。然而,在本發明領域中具有通常知識者應能瞭解,該等詳細說明以及實施本發明所列舉的特定實施例,僅係用於說明本發明,並非用以限制本發明之專利申請範圍。 The detailed structure, characteristics, assembly or use of the probe module with multiple units to be tested with inclined conductive contacts provided by the present invention will be described in the detailed description of the subsequent embodiments. However, those with ordinary knowledge in the field of the present invention should be able to understand that these detailed descriptions and specific examples for implementing the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the patent application of the present invention.

[先前技術] [Prior Art]

10:待測單元 10: Unit to be tested

11:第一導電接點 11: The first conductive contact

111:長邊 111: long side

12:第二導電接點 12: The second conductive contact

121:長邊 121: long side

13:基板 13: substrate

131:第一長邊 131: The first long side

132:第二長邊 132: second long side

14:中間區塊 14: Middle block

15、16:外側區塊 15, 16: Outer block

17:探針 17: Probe

171:懸臂段 171: Cantilever section

18:探針座 18: Probe holder

L:分界軸線 L: Demarcation axis

θ1、θ2:角度 θ1, θ2: angle

[實施例] [Example]

20、20’:探針模組 20, 20’: Probe module

21:(第一)探針座 21: (first) probe holder

211:內側面 211: inside

212:外側面 212: outer side

22:(第二)探針座 22: (second) probe holder

221:內側面 221: inside

222:外側面 222: outer side

30a:(第一)探針 30a: (first) probe

30b:(第二)探針 30b: (second) probe

30c~i:(第三)探針 30c~i: (third) probe

31:懸臂段 31: Cantilever section

311:固定部 311: Fixed part

311a:內側區段 311a: inner section

311b:外側區段 311b: Outer section

312:外露部 312: Exposed

32:點觸段 32: Touch segment

40:電路板 40: circuit board

41:底面 41: Bottom

50A~D:第一~第四待測單元 50A~D: 1st~4th unit to be tested

51:第一主邊緣 51: First Main Edge

52:第二主邊緣 52: Second Main Edge

53:第一側邊緣 53: first side edge

54:第二側邊緣 54: second side edge

55a:(第一)導電接點 55a: (first) conductive contact

55b~d:(第二)導電接點 55b~d: (second) conductive contact

551:第一端 551: first end

552:第二端 552: second end

56:上表面 56: upper surface

57:中間區塊 57: middle block

58:左側區塊 58: Left block

59:右側區塊 59: right block

61:第一交界接點 61: The first junction

62:第二交界接點 62: second junction

63:第一交界探針 63: The first junction probe

64:第二交界探針 64: second junction probe

A1:分界軸線 A1: Demarcation axis

A2:水平軸線 A2: Horizontal axis

D1:點觸方向 D1: Touch direction

D2:延伸方向 D2: Extension direction

d:垂直距離 d: vertical distance

L1~L3:第一~第三行 L1~L3: first to third line

L4:分界軸線 L4: Demarcation axis

L5:第一分界線 L5: First dividing line

L6:第二分界線 L6: Second dividing line

P1~P5:第一~第五針層 P1~P5: the first to fifth needle layers

圖1為一具有傾斜導電接點之待測單元、一探針及一探針座之頂視示意圖。 Figure 1 is a schematic top view of a unit under test with inclined conductive contacts, a probe and a probe holder.

圖2為本發明一第一較佳實施例所提供之探針模組、一第一待測單元及一第二待測單元之頂視示意圖,惟未顯示出該探針模組之第三探針。 2 is a schematic top view of a probe module, a first unit under test, and a second unit under test provided by a first preferred embodiment of the present invention, but the third of the probe module is not shown Probe.

圖3概為圖2之右視圖,惟其中更顯示出該探針模組之第三探針以及一電路板。 Fig. 3 is the right side view of Fig. 2, but it also shows the third probe of the probe module and a circuit board.

圖4係類同於圖2,惟其中顯示之探針僅為一部份之第三探針。 Fig. 4 is similar to Fig. 2, except that the probe shown therein is only a part of the third probe.

圖5係類同於圖4,惟其中顯示之探針僅為另一部份之第三探針。 Fig. 5 is similar to Fig. 4, except that the probe shown therein is only another part of the third probe.

圖6係類同於圖5,惟其中顯示之探針僅為又一部份之第三探針。 Figure 6 is similar to Figure 5, except that the probe shown therein is only another part of the third probe.

圖7係類同於圖2,惟圖7中探針之固定部與外露部呈一直線。 Fig. 7 is similar to Fig. 2, except that the fixed part and the exposed part of the probe in Fig. 7 are in a straight line.

圖8概為本發明一第二較佳實施例所提供之探針模組以及第一至第四待測單元之頂視示意圖,惟其中顯示之探針僅為一部份之第三探針。 8 is a schematic top view of the probe module and the first to fourth units under test provided by a second preferred embodiment of the present invention, but the probe shown in it is only a part of the third probe .

圖9概為圖8之右視圖,惟其中更顯示出該探針模組之其他探針。 Fig. 9 is the right side view of Fig. 8, but it shows other probes of the probe module.

申請人首先在此說明,在以下將要介紹之實施例以及圖式中,相同之參考號碼,表示相同或類似之元件或其結構特徵。需注意的是,圖式中的各元件及構造為例示方便並非依據真實比例及數量繪製,且若實施上為可能,不同實施例的特徵係可以交互應用。 The applicant first explains here that in the following embodiments and drawings, the same reference numbers indicate the same or similar elements or structural features. It should be noted that the various elements and structures in the drawings are for illustrative purposes and are not drawn based on actual proportions and quantities, and if possible in implementation, the features of different embodiments can be applied interactively.

請參閱圖2至圖6,本發明一第一較佳實施例所提供之探針模組20主要包含有一第一探針座21、一第二探針座22,以及複數探針30a~e。 2-6, the probe module 20 provided by a first preferred embodiment of the present invention mainly includes a first probe holder 21, a second probe holder 22, and a plurality of probes 30a~e .

各該探針30a~e係由導電材料(例如金屬)製成之直線針藉由機械加工彎曲而成,如圖3所示,各該探針30a~e包含有一懸臂段31及一點觸段32,該懸臂段31具有一與該第一探針座21或第二探針座22固接之固定部311,以及一連接於該固定部311且自該第一探針座21之一內側面211或第二探針座22之一內側面221延伸而出之外露部312。如圖2及4~6所示,部分之探針30a~e的懸臂段31未經彎折而使其固定部311與外露部312呈一直線,而另一部分之探針30a~e的懸臂段31則經由彎折而使其固定部311與外露部312非呈一直線。如圖3所示,各該探針30a~e之點觸段32係自外露部312末端向下延伸。 Each of the probes 30a~e is made of a conductive material (for example, metal) by bending a straight needle through machining, as shown in FIG. 3, each of the probes 30a~e includes a cantilever section 31 and a one-point contact section 32. The cantilever section 31 has a fixing part 311 fixedly connected to the first probe holder 21 or the second probe holder 22, and a fixing part 311 connected to the fixing part 311 and extending from one of the first probe holders 21 The side surface 211 or an inner side surface 221 of the second probe base 22 extends out of the exposed portion 312. As shown in Figures 2 and 4~6, the cantilever sections 31 of the probes 30a~e are not bent so that the fixed part 311 and the exposed part 312 are in line, while the cantilever sections of the probes 30a~e of the other part 31 is bent so that the fixed portion 311 and the exposed portion 312 are not in a straight line. As shown in FIG. 3, the touch section 32 of each probe 30a~e extends downward from the end of the exposed portion 312.

該第一探針座21及該第二探針座22係由絕緣材料(例如黑膠)製成,該第一、二探針座21、22係以其內側面211、221相面對地設置,且通常係固定於一電路板40之底面41(如圖3所示),使得該電路板40、該第一、二探針座21、22以及該等探針30a~e結合成一探針卡。 The first probe holder 21 and the second probe holder 22 are made of insulating material (for example, vinyl), and the first and second probe holders 21, 22 face each other with their inner sides 211, 221 Is arranged and usually fixed on the bottom surface 41 of a circuit board 40 (as shown in FIG. 3), so that the circuit board 40, the first and second probe holders 21, 22 and the probes 30a~e are combined into one probe Needle card.

在本發明之實施例中,各該探針30a~e之固定部311係位於第一或第二探針座21、22內,其固定方式係利用黑膠同時將同一針層(詳述於下文)之探針設置於探針座上的預定位置,再將黑膠烤乾而使探針固定於探針座上。然而,各該探針30a~e之固定部311亦可藉由黏膠固定於第一或第二探針座21、22之外表面。各該探針30a~e可更具有一自該第一探針座21之一外側面212或第二探針座22之一外側面222延伸而出之連接段(圖中未示),以藉由該連接段電性連接於該電路板40底面41的導電接點(圖中未示)。 In the embodiment of the present invention, the fixing portion 311 of each of the probes 30a~e is located in the first or second probe holder 21, 22, and the fixing method is to use vinyl to simultaneously apply the same needle layer (detailed in Below) the probe is set at a predetermined position on the probe base, and then the black glue is dried to fix the probe on the probe base. However, the fixing portion 311 of each probe 30a~e can also be fixed on the outer surface of the first or second probe holder 21, 22 by glue. Each of the probes 30a~e may further have a connecting section (not shown) extending from an outer surface 212 of the first probe holder 21 or an outer surface 222 of the second probe holder 22, to The connecting section is electrically connected to the conductive contacts (not shown in the figure) on the bottom surface 41 of the circuit board 40.

詳而言之,本實施例中的傾斜探針30a~e(外露部312呈傾斜者)之固定部311包含有一與外露部312連接的內側區段311a,以及一自內側區段311a延伸至探針座外側面而與前述之連接段連接之外側區段311b,該內側區段311a係與外露部312成一直線而呈傾斜,該外側區段311b則與前述之連接段成一直線且垂直於探針座之內、外側面(亦即平行於未傾斜之探針),如此之探針形成傾斜之方式,係先根據所對應之導電接點的延伸方向D2(詳述於下文)將直線針擺放於探針座上並以黑膠固定其固定部311之內側區段311a,以將探針之外露部312固定於所需之角度(亦即平行於對應之導電接點的延伸方向D2),此時探針已固定於探針座上,再彎折其固定部311而使其外側區段311b連同該連接段垂直於探針座之內、外側面,然後再以黑膠固定外側區段311b,如此之方式可利於彎折作業之進行,並可使探針之彎折角度固定良好而不易回彈。 In detail, the fixing portion 311 of the inclined probe 30a~e (where the exposed portion 312 is inclined) in this embodiment includes an inner section 311a connected to the exposed portion 312, and an inner section 311a extending from the inner section 311a to The outer surface of the probe holder is connected to the aforementioned connecting section with the outer section 311b. The inner section 311a is in line with the exposed portion 312 and is inclined, and the outer section 311b is in line with the aforementioned connecting section and perpendicular to The inner and outer sides of the probe holder (that is, parallel to the untilted probe). The way the probe is tilted is to first straighten the line according to the extension direction D2 of the corresponding conductive contact (detailed below) The needle is placed on the probe holder and the inner section 311a of the fixing portion 311 is fixed with black glue to fix the exposed portion 312 of the probe at a desired angle (that is, parallel to the extending direction of the corresponding conductive contact D2). At this time, the probe has been fixed on the probe holder, and then bend its fixing part 311 so that the outer section 311b and the connecting section are perpendicular to the inner and outer sides of the probe holder, and then fix it with vinyl The outer section 311b, in this way, can facilitate the bending operation, and can make the bending angle of the probe well fixed and not easy to rebound.

本發明之探針模組係用以進行多待測單元之檢測,亦即同時檢測複數待測單元,例如,本實施例之探針模組20係用以同時檢測一第一待測單元50A及一第二待測單元50B。本發明之實施例中的待測單元係與先前技術中所述之待測單元10(如圖1所示)相同,惟為了更明確地描述本發明之特徵, 在實施例中以不同的描述方式搭配與圖1中不同的元件標號而更進一步地說明該待測單元。 The probe module of the present invention is used to detect multiple units to be tested, that is, to detect a plurality of units to be tested at the same time. For example, the probe module 20 of this embodiment is used to detect a first unit to be tested 50A at the same time And a second unit under test 50B. The unit under test in the embodiment of the present invention is the same as the unit under test 10 (shown in FIG. 1) described in the prior art, but in order to describe the features of the present invention more clearly, In the embodiments, different description methods are used with different component numbers from FIG. 1 to further illustrate the unit under test.

如圖2及圖3所示,各該待測單元50A、50B之一上表面56具有朝向相反方向之第一、二主邊緣51、52(通常為長邊)、連接第一、二主邊緣51、52且朝向相反方向之第一、二側邊緣53、54(通常為短邊),以及複數導電接點55a~d,該第一待測單元50A之第二側邊緣54係與該第二待測單元50B之第一側邊緣53相鄰。當該探針模組20檢測該等待測單元50A、50B時,該第一、二探針座21、22係分別位於待測單元50A、50B之第一主邊緣51外側上方及第二主邊緣52外側上方,換言之,各該待測單元50A、50B之第一主邊緣51係較第二主邊緣52更靠近該第一探針座21,各該待測單元50A、50B之第二主邊緣52係較第一主邊緣51更靠近該第二探針座22,該探針模組20係整體(連同前述之電路板40)向下移動進而以該等探針30a~e點觸該等導電接點55a~d。 As shown in FIGS. 2 and 3, an upper surface 56 of each unit under test 50A, 50B has first and second main edges 51, 52 (usually long sides) facing opposite directions, connecting the first and second main edges 51, 52 and the first and second side edges 53, 54 (usually short sides) facing opposite directions, and a plurality of conductive contacts 55a~d. The second side edge 54 of the first unit under test 50A is connected to the first The first side edges 53 of the two test cells 50B are adjacent. When the probe module 20 detects the waiting units 50A, 50B, the first and second probe holders 21, 22 are respectively located on the outer side of the first main edge 51 and the second main edge of the units 50A, 50B to be tested 52 above the outer side, in other words, the first main edge 51 of each unit under test 50A, 50B is closer to the first probe holder 21 than the second main edge 52, and the second main edge of each unit under test 50A, 50B 52 is closer to the second probe holder 22 than the first main edge 51. The probe module 20 as a whole (together with the aforementioned circuit board 40) moves downwards to touch the probes 30a~e. Conductive contacts 55a~d.

在此須先說明的是,本發明係將探針30a~e之點觸方向D1(如圖3所示)定義為向下,並以此為基準描述其他特徵之方向性(例如上、下、頂、底等用語),例如,前述各該待測單元50A、50B設有導電接點55a~d之該上表面56即為面向該點觸方向D1之相反方向的表面,前述該電路板40固設第一、二探針座21、22之該底面41即為面向該點觸方向D1之表面。然而,前述之方向性只是描述各特徵是趨於該點觸方向D1(例如向下)或該點觸方向D1之相反方向(例如向上),而非毫無誤差地符合該點觸方向D1或該點觸方向D1之相反方向,例如,前述各該探針30a~e之點觸段32係自外露部312末端向下延伸,其意思可包含該點觸段32係朝該點觸方向D1延伸,或者,該點觸段32係如圖3所示地趨於該點觸方向D1地相對該點觸方向D1呈傾斜。 It should be noted here that the present invention defines the touch direction D1 of the probes 30a~e (as shown in FIG. 3) as downward, and uses this as a reference to describe the directionality of other features (such as up and down). , Top, bottom, etc.), for example, the upper surface 56 of each of the aforementioned units under test 50A, 50B provided with conductive contacts 55a~d is the surface facing the opposite direction of the touch direction D1, the aforementioned circuit board 40 The bottom surface 41 of the first and second probe holders 21 and 22 is the surface facing the touch direction D1. However, the aforementioned directionality only describes that each feature tends to the touch direction D1 (for example, downward) or the opposite direction of the touch direction D1 (for example, upward), rather than conforms to the touch direction D1 or D1 without error. The direction opposite to the touch direction D1. For example, the touch section 32 of each of the probes 30a~e extends downward from the end of the exposed portion 312, which means that the touch section 32 faces the touch direction D1 Extend, or, as shown in FIG. 3, the touch segment 32 is inclined toward the touch direction D1 with respect to the touch direction D1.

在各該待測單元50A、50B中,各該導電接點55a~d具有一朝向該第一主邊緣51之第一端551以及一朝向該第二主邊緣52之第二端552,為簡化圖式,僅在圖4中的三導電接點上標示出其第一端551及第二端552,各該導電接點55a~d能定義出一自其第二端552往第一端551之延伸方向D2。如圖2所示,在本實施例中,各該待測單元50A、50B能定義出一分界軸線A1,各該待測單元50A、50B之分界軸線A1與第一側邊緣53之間的導電接點55a~d之延伸方向D2係平行於該分界軸線A1(例如位於圖4所標示之中間區塊57的導電接點)或朝該第一側邊緣53靠近地相對於該分界軸線A1呈傾斜(例如位於圖4所標示之左側區塊58的導電接點),各該待測單元50A、50B之分界軸線A1與第二側邊緣54之間的導電接點55a~d之延伸方向D2係平行於該分界軸線A1(例如位於圖4所標示之中間區塊57的導電接點)或朝該第二側邊緣54靠近地相對於該分界軸線A1呈傾斜(例如位於圖4所標示之右側區塊59的導電接點)。更明確地說,在該分界軸線A1附近的導電接點55a~d(位於中間區塊57者)之延伸方向D2係平行於該分界軸線A1,距離該分界軸線A1越遠的導電接點55a~d,其相對於該分界軸線A1傾斜的程度越大。 In each of the units under test 50A, 50B, each of the conductive contacts 55a~d has a first end 551 facing the first main edge 51 and a second end 552 facing the second main edge 52, for simplicity In the diagram, only the first end 551 and the second end 552 of the three conductive contacts in FIG. 4 are marked. Each of the conductive contacts 55a~d can define a line from the second end 552 to the first end 551. The extension direction D2. As shown in Figure 2, in this embodiment, each of the units under test 50A, 50B can define a demarcation axis A1, and the conduction between the demarcation axis A1 of each unit under test 50A, 50B and the first side edge 53 The extension direction D2 of the contacts 55a~d is parallel to the demarcation axis A1 (for example, the conductive contact in the middle block 57 marked in FIG. 4) or is close to the demarcation axis A1 toward the first side edge 53 Inclined (for example, the conductive contacts located in the left block 58 marked in FIG. 4), the extending direction D2 of the conductive contacts 55a~d between the dividing axis A1 of each unit under test 50A, 50B and the second side edge 54 Is parallel to the demarcation axis A1 (for example, the conductive contact located in the middle area 57 marked in FIG. 4) or is inclined with respect to the demarcation axis A1 close to the second side edge 54 (for example, in the position marked in FIG. 4 The conductive contacts of the right block 59). More specifically, the extending direction D2 of the conductive contacts 55a~d (located in the middle block 57) near the demarcation axis A1 is parallel to the demarcation axis A1, and the conductive contact 55a farther from the demarcation axis A1 ~d, the greater the degree of inclination relative to the dividing axis A1.

如圖2及圖4至圖6所示,在各該待測單元50A、50B中,該等導電接點55a~d係區分為鄰近於第一主邊緣51的第一導電接點55a,以及鄰近於第二主邊緣52的第二導電接點55b~d,其中,第二導電接點55b係平行於一水平軸線A2地沿該第二主邊緣52排成一第一行L1(如圖4所示),第二導電接點55c係平行於該水平軸線A2地排成一緊鄰該第一行L1之第二行L2(如圖5所示),第二導電接點55d係平行於該水平軸線A2地排成一緊鄰該第二行L2之第三行L3(如圖6所示),該第一至第三行L1~L3係依序自該第二主邊緣52朝該第一主邊緣51之方向排列。如圖2所示,各該待測單元50A、50B之第一導電接點55a係平行於該水平軸線A2地沿該第一主邊緣51排成一行,該第一待測單 元50A之第一導電接點55a中包含一鄰近該第一待測單元50A之第二側邊緣54的第一交界接點61,該第二待測單元50B之第一導電接點55a中包含一鄰近該第二待測單元50B之第一側邊緣53的第二交界接點62。 As shown in FIGS. 2 and 4 to 6, in each of the units under test 50A, 50B, the conductive contacts 55a-d are divided into first conductive contacts 55a adjacent to the first main edge 51, and The second conductive contacts 55b~d adjacent to the second main edge 52, wherein the second conductive contacts 55b are parallel to a horizontal axis A2 and are arranged in a first row L1 along the second main edge 52 (as shown in FIG. 4), the second conductive contacts 55c are arranged parallel to the horizontal axis A2 in a second row L2 (as shown in Figure 5) next to the first row L1, and the second conductive contacts 55d are parallel to The horizontal axis A2 is arranged in a third row L3 (as shown in FIG. 6) next to the second row L2, and the first to third rows L1~L3 are in sequence from the second main edge 52 toward the first A main edge 51 is arranged in the direction. As shown in FIG. 2, the first conductive contacts 55a of each unit under test 50A, 50B are arranged in a row along the first main edge 51 parallel to the horizontal axis A2, and the first unit under test The first conductive contact 55a of the element 50A includes a first junction contact 61 adjacent to the second side edge 54 of the first unit under test 50A, and the first conductive contact 55a of the second unit under test 50B includes A second junction point 62 adjacent to the first side edge 53 of the second unit under test 50B.

該探針模組20之探針30a~e係區分為設置於第一探針座21之左半部的第一探針30a(如圖2所示)、設置於第一探針座21之右半部的第二探針30b(如圖2所示),以及設置於第二探針座22之第三探針30c~e(如圖4至圖6所示),該等第一探針30a係分別用以點觸該第一待測單元50A之第一導電接點55a,該等第二探針30b係分別用以點觸該第二待測單元50B之第一導電接點55a,該等第三探針30c~e係分別用以點觸該等第二導電接點55b~d。 The probes 30a~e of the probe module 20 are divided into a first probe 30a (as shown in FIG. 2) disposed on the left half of the first probe holder 21, and a first probe 30a disposed on the first probe holder 21. The second probe 30b (shown in Figure 2) on the right half, and the third probe 30c~e (shown in Figures 4 to 6) arranged on the second probe holder 22, the first probes The needles 30a are respectively used to touch the first conductive contact 55a of the first unit under test 50A, and the second probes 30b are respectively used to touch the first conductive contact 55a of the second unit under test 50B , The third probes 30c~e are used to touch the second conductive contacts 55b~d, respectively.

如圖2及圖3所示,該等第一探針30a係以對應該第一待測單元50A之第一導電接點55a的排列方式排成一行而在該第一探針座21形成一第一針層P1,該等第二探針30b係以對應該第二待測單元50B之第一導電接點55a的排列方式排成一行而在該第一探針座21形成一高度低於該第一針層P1之第二針層P2。如圖3及圖4所示,該等第三探針30c係以對應該等第二導電接點55b之排列方式排成一行而在該第二探針座22形成一第三針層P3。如圖3及圖5所示,該等第三探針30d係以對應該等第二導電接點55c之排列方式排成一行而在該第二探針座22形成一高度高於該第三針層P3之第四針層P4。如圖3及圖6所示,該等第三探針30e係以對應該等第二導電接點55d之排列方式排成一行而在該第二探針座22形成一高度高於該第四針層P4之第五針層P5。 As shown in FIGS. 2 and 3, the first probes 30a are arranged in a row in an arrangement corresponding to the first conductive contacts 55a of the first unit under test 50A to form a first probe base 21 In the first needle layer P1, the second probes 30b are arranged in a row in an arrangement corresponding to the first conductive contacts 55a of the second unit under test 50B, and form a height lower than The first needle layer P1 is the second needle layer P2. As shown in FIGS. 3 and 4, the third probes 30c are arranged in a row corresponding to the arrangement of the second conductive contacts 55b to form a third needle layer P3 on the second probe base 22. As shown in FIGS. 3 and 5, the third probes 30d are arranged in a row corresponding to the arrangement of the second conductive contacts 55c to form a height higher than the third probe base 22 on the second probe base. Needle layer P3 is the fourth needle layer P4. As shown in FIGS. 3 and 6, the third probes 30e are arranged in a row corresponding to the arrangement of the second conductive contacts 55d to form a height higher than the fourth probe base 22 on the second probe base. Needle layer P4 is the fifth needle layer P5.

換言之,該等第三探針30c~e係排成三行(與第二導電接點55b~d行數相同),其順序係由下而上地對應第二導電接點55b~d之第一至第三行L1~L3的順序,位置越高之針層的第三探針係用以點觸距離該第二探針座22越遠的導電接點,且位置越高之針層的第三探針之懸臂段越長。而該等第一、二探針30a、30b在如圖2所示之頂視圖中看起來是排成一行,但實際上是 如圖3所示地在不同高度排成兩行,惟此兩行第一、二探針30a、30b係延伸至排成同一行之第一導電接點55a,因此該等第一、二探針30a、30b之點觸段32末端與該第一探針座21內側面211的垂直距離d係相同。 In other words, the third probes 30c~e are arranged in three rows (the same number of rows as the second conductive contacts 55b~d), and the order is from bottom to top corresponding to the second conductive contacts 55b~d. From the first to the third row L1~L3, the third probe of the higher needle layer is used to touch the conductive contact that is farther from the second probe holder 22, and the higher the position of the needle layer The longer the cantilever section of the third probe. The first and second probes 30a, 30b appear to line up in a row in the top view shown in FIG. 2, but they are actually As shown in Figure 3, they are arranged in two rows at different heights, but the first and second probes 30a, 30b of the two rows extend to the first conductive contacts 55a arranged in the same row, so the first and second probes The vertical distance d between the end of the touch section 32 of the needles 30a and 30b and the inner surface 211 of the first probe holder 21 is the same.

當該探針模組20檢測該等待測單元50A、50B時,該等第一探針30a係以其懸臂段31經過第一待測單元50A之第一主邊緣51上方而分別延伸至該第一待測單元50A之第一導電接點55a上方(如圖2所示)進而以其點觸段分別點觸該第一待測單元50A之第一導電接點55a,該等第二探針30b係以其懸臂段31經過第二待測單元50B之第一主邊緣51上方而分別延伸至該第二待測單元50B之第一導電接點55a上方(如圖2所示)進而以其點觸段分別點觸該第一待測單元50B之第一導電接點55a,該等第三探針30c係以其懸臂段31經過該等待測單元50A、50B之第二主邊緣52上方而延伸至該等第二導電接點55b上方(如圖4所示)進而以其點觸段32點觸該等第二導電接點55b,該等第三探針30d係以其懸臂段31經過該等待測單元50A、50B之第二主邊緣52上方而延伸至該等第二導電接點55c上方(如圖5所示)進而以其點觸段32點觸該等第二導電接點55c,該等第三探針30e係以其懸臂段31經過該等待測單元50A、50B之第二主邊緣52上方而延伸至該等第二導電接點55d上方(如圖6所示)進而以其點觸段32點觸該等第二導電接點55d。 When the probe module 20 detects the waiting units 50A, 50B, the first probes 30a extend to the first probes 30a with their cantilever sections 31 passing over the first main edge 51 of the first unit 50A to be tested. Above the first conductive contact 55a of a unit under test 50A (as shown in FIG. 2), the touch segments respectively touch the first conductive contact 55a of the first unit under test 50A, and the second probes 30b is based on the cantilever section 31 passing over the first main edge 51 of the second unit under test 50B and respectively extending to above the first conductive contact 55a of the second unit under test 50B (as shown in FIG. 2), and then using the The touch segments respectively touch the first conductive contacts 55a of the first unit under test 50B, and the third probes 30c pass over the second main edges 52 of the units under test 50A, 50B with their cantilever segments 31 Extend above the second conductive contacts 55b (as shown in FIG. 4) to touch the second conductive contacts 55b with its point contact section 32, and the third probes 30d pass through the cantilever section 31 The second main edge 52 of the waiting unit 50A, 50B extends above the second conductive contacts 55c (as shown in FIG. 5), and then touches the second conductive contacts 55c with its point contact section 32 , The third probes 30e extend above the second conductive contacts 55d (as shown in FIG. 6) with their cantilever sections 31 passing over the second main edges 52 of the waiting units 50A, 50B to The touch section 32 touches the second conductive contacts 55d.

在本實施例中,各該探針30a~e之外露部312自探針座21、22延伸而出之方向係對應其所屬探針30a~e將點觸之導電接點55a~d的延伸方向D2,此處所稱「對應」,係指外露部312自探針座21、22延伸而出之方向不一定要與對應之導電接點55a~d的延伸方向D2相同或相反,而是從上往下看時(亦即圖2及4~6之方向),外露部312係概與其對應之導電接點55a~d的延伸方向D2平行,如此可避免探針30a~e之點觸段32在進行點觸時偏離至對應的導 電接點55a~d之外而產生點觸不確實之問題。換言之,該等探針30a~e之外露部312的傾斜角度配置係類同於該等導電接點55a~d之傾斜角度配置。 In this embodiment, the direction in which the exposed portion 312 of each probe 30a~e extends from the probe holder 21, 22 corresponds to the extension of the conductive contact 55a~d to be touched by the probe 30a~e. The direction D2, referred to here as "corresponding", means that the direction in which the exposed portion 312 extends from the probe holders 21 and 22 does not have to be the same or opposite to the extending direction D2 of the corresponding conductive contacts 55a~d, but from When looking from top to bottom (that is, the direction of Figures 2 and 4~6), the exposed portion 312 is almost parallel to the extending direction D2 of the corresponding conductive contacts 55a~d, so as to avoid the touch section of the probe 30a~e 32 Deviation to the corresponding guide when The problem of inaccurate touch occurs outside the electrical contacts 55a~d. In other words, the inclination angle configuration of the exposed portions 312 of the probes 30a~e is similar to the inclination angle configuration of the conductive contacts 55a~d.

詳而言之,該第二探針座22能定義出垂直於其內側面221之一分界軸線L4,以及分別位於該分界軸線L4之一第一側(左側)及一第二側(右側)之一第一分界線L5(與第一待測單元50A之分界軸線A1重合)及一第二分界線L6(與第二待測單元50B之分界軸線A1重合),對於設置在第二探針座22之左半部的探針,其外露部312自內側面221延伸而出之方向係平行於該第一分界線L5(例如對應圖4所標示之中間區塊57的探針)或遠離該第一分界線L5地相對於該第一分界線L5呈傾斜(例如對應圖4所標示之左、右側區塊58、59的探針);對於設置在第二探針座22之右半部的探針,其外露部312自內側面221延伸而出之方向係平行於該第二分界線L6(例如對應圖4所標示之中間區塊57的探針)或遠離該第二分界線L6地相對於該第二分界線L6呈傾斜(例如對應圖4所標示之左、右側區塊58、59的探針)。對於該第一探針座21,該第一針層P1能定義出一垂直於該第一探針座21之內側面211的第一分界線(與第二探針座22之第一分界線L5重合),該等第一探針30a之外露部312自該內側面211延伸而出之方向係平行於該第一分界線L5(例如對應圖4所標示之中間區塊57的探針)或朝該第一分界線L5靠近地相對於該第一分界線L5呈傾斜(例如對應圖4所標示之左、右側區塊58、59的探針);該第二針層P2能定義出一垂直於該第一探針座21之內側面211的第二分界線(與第二探針座22之第二分界線L6重合),該等第二探針30b之外露部312自該內側面211延伸而出之方向係平行於該第二分界線L6(例如對應圖4所標示之中間區塊57的探針)或朝該第二分界線L6靠近地相對於該第二分界線L6呈傾斜(例如對應圖4所標示之左、右側區塊58、59的探針)。 In detail, the second probe holder 22 can define a dividing axis L4 perpendicular to the inner side surface 221, and is located on a first side (left side) and a second side (right side) of the dividing axis L4. A first dividing line L5 (coincident with the dividing axis A1 of the first unit under test 50A) and a second dividing line L6 (coincident with the dividing axis A1 of the second unit under test 50B), for the second probe For the probe on the left half of the seat 22, the direction in which the exposed portion 312 extends from the inner side 221 is parallel to the first dividing line L5 (for example, the probe corresponding to the middle block 57 marked in FIG. 4) or far away The first dividing line L5 is inclined with respect to the first dividing line L5 (for example, the probes corresponding to the left and right blocks 58, 59 shown in FIG. 4); for the probes arranged on the right half of the second probe holder 22 The direction in which the exposed portion 312 extends from the inner side surface 221 is parallel to the second dividing line L6 (for example, the probe corresponding to the middle block 57 marked in FIG. 4) or away from the second dividing line The ground of L6 is inclined relative to the second dividing line L6 (for example, the probes corresponding to the left and right blocks 58, 59 marked in FIG. 4). For the first probe holder 21, the first needle layer P1 can define a first dividing line perpendicular to the inner side surface 211 of the first probe holder 21 (the first dividing line with the second probe holder 22) L5 coincides), the direction in which the exposed portions 312 of the first probes 30a extend from the inner side surface 211 is parallel to the first dividing line L5 (for example, the probe corresponding to the middle block 57 marked in FIG. 4) Or approach the first dividing line L5 and be inclined relative to the first dividing line L5 (for example, the probes corresponding to the left and right blocks 58, 59 shown in FIG. 4); the second needle layer P2 can define A second demarcation line perpendicular to the inner side surface 211 of the first probe holder 21 (coincident with the second demarcation line L6 of the second probe holder 22), and the exposed parts 312 of the second probe holders 30b extend from the inside The direction in which the side surface 211 extends is parallel to the second dividing line L6 (for example, the probe corresponding to the middle block 57 marked in FIG. 4) or is close to the second dividing line L6 relative to the second dividing line L6 It is inclined (for example, the probes corresponding to the left and right blocks 58, 59 shown in FIG. 4).

藉由本發明之探針模組的探針配置,可在將如此繁多之探針以適當間距配置於探針座的前提下,仍可達到前述之確保探針點觸確實之功效。此外,在本實施例中,該等探針30a~e之固定部311的外側區段311b係相互平行,如此係較方便於將探針配置於探針座;然而,藉由本發明之探針模組的探針配置,亦可便於將固定部311與外露部312呈一直線之探針(例如圖7所示之探針30a)配置於探針座,如此更可簡化探針之彎折加工程序。 With the probe configuration of the probe module of the present invention, under the premise that so many probes are arranged in the probe holder at an appropriate interval, the aforementioned effect of ensuring the touch of the probe can still be achieved. In addition, in this embodiment, the outer sections 311b of the fixing portions 311 of the probes 30a~e are parallel to each other, which makes it easier to arrange the probes on the probe holder; however, the probes of the present invention The probe configuration of the module can also facilitate the placement of probes with the fixed portion 311 and the exposed portion 312 in line (such as the probe 30a shown in FIG. 7) on the probe base, which simplifies the bending process of the probe. program.

更重要的是,如圖2所示,雖然該第一交界接點61之延伸方向D2係朝該第一待測單元50A之第二側邊緣54靠近地呈相當程度之傾斜,該第二交界接點62之延伸方向D2亦朝該第二待測單元50B之第一側邊緣53靠近地呈相當程度之傾斜,但本發明之探針模組20係藉由第一針層P1最右邊之第一探針30a點觸第一交界接點61,並藉由第二針層P2最左邊之第二探針30b點觸第二交界接點62,而第一針層P1與第二針層P2位於不同高度,因此,即使用以點觸第一、二交界接點61、62之第一、二探針30a、30b(分別定義為第一、二交界探針63、64)的外露部312自第一探針座21延伸而出之方向係配合第一、二交界接點61、62之延伸方向D2,第一、二交界探針63、64因位於不同高度而可避免相互干涉。 More importantly, as shown in FIG. 2, although the extension direction D2 of the first boundary contact 61 is close to the second side edge 54 of the first unit under test 50A and is inclined to a considerable extent, the second boundary The extension direction D2 of the contact 62 is also inclined to a considerable extent toward the first side edge 53 of the second unit under test 50B. However, the probe module 20 of the present invention uses the rightmost pin layer P1 The first probe 30a touches the first junction contact 61, and the second probe 30b on the leftmost side of the second needle layer P2 touches the second junction contact 62, and the first needle layer P1 and the second needle layer P2 is located at different heights, so even if it is used to touch the exposed parts of the first and second probes 30a, 30b (defined as the first and second junction probes 63, 64, respectively) of the first and second junction contacts 61, 62 The direction 312 extends from the first probe holder 21 is matched with the extending direction D2 of the first and second junction contacts 61 and 62. The first and second junction probes 63 and 64 are located at different heights to avoid mutual interference.

由圖2可得知,若第一、二交界探針63、64係設置於同一高度,其固定部311或甚至外露部312都會有彼此過於靠近之問題,甚至,在第一、二交界接點61、62之傾斜角度比本實施例所提供者更大的情況下,為了使第一、二交界探針63、64之外露部312的傾斜角度對應第一、二交界接點61、62之傾斜角度,第一交界探針63之固定部311需設置得更右邊,而第二交界探針64之固定部311需設置得更左邊,如此一來,第一、二交界探針63、64之固定部311或甚至外露部312都可能有相互干涉之問題,本發明之第一、二交界探針63、64因位於不同高度而可避免前述問題。可想而知,在該第一待測單元 50A之第一側邊緣53及第二待測單元50B之第二側邊緣54亦與其他待測單元相鄰的情況下(亦即有四個並排之待測單元),最左邊的第一探針30a及最右邊的第二探針30b亦可發揮前述之功效。 It can be seen from Figure 2 that if the first and second junction probes 63 and 64 are set at the same height, the fixed part 311 or even the exposed part 312 will have the problem of being too close to each other, and even if the first and second junctions are connected When the inclination angle of the points 61 and 62 is larger than that provided in this embodiment, in order to make the inclination angle of the exposed part 312 of the first and second junction probes 63 and 64 correspond to the first and second junction contacts 61 and 62 For the inclination angle, the fixing part 311 of the first junction probe 63 needs to be set further to the right, and the fixing part 311 of the second junction probe 64 needs to be set further to the left. In this way, the first and second junction probes 63, The fixed portion 311 or even the exposed portion 312 of the 64 may interfere with each other. The first and second boundary probes 63 and 64 of the present invention are located at different heights to avoid the aforementioned problems. It is conceivable that in the first unit to be tested When the first side edge 53 of 50A and the second side edge 54 of the second unit under test 50B are also adjacent to other units to be tested (that is, there are four units to be tested side by side), the leftmost first probe The needle 30a and the rightmost second probe 30b can also perform the aforementioned functions.

在本實施例中,由於第一探針30a皆與第二探針30b位於不同高度,因此,不論第一導電接點55a的傾斜角度多大,第一、二探針30a、30b的傾斜角度皆可對應其點觸之第一導電接點55a的傾斜角度,而不會產生干涉問題。然而,本發明之探針模組並不限於該等第一探針30a都位於同一高度,亦不限於該等第二探針30b都位於同一高度,只要最右邊之一或數個第一探針30a與最左邊之一或數個第二探針30b位於不同高度,即可避免探針干涉問題,亦即,第一探針30a中可包含一或數個第一交界探針63,第二探針30b中可包含一或數個第二交界探針64,只要第一交界探針63與第二交界探針64位於不同高度(不同針層)即可避免相互干涉,其餘之第一探針30a及第二探針30b的高度則無限制,例如,該等第一探針30a及第二探針30b中可僅第一交界探針63位於較高之第一針層P1,其餘之第一探針30a及第二探針30b皆位於較低之第二針層P2,而第一、二交界探針63、64之數量則取決於鄰近第一、二待測單元50A、50B之相鄰側邊緣的第一導電接點55a之傾斜角度。詳而言之,對於本實施例之第一、二待測單元50A、50B而言,各待測單元50A、50B之最靠近其相鄰側邊緣的一個第一導電接點55a會使對應之同高度的探針有過於靠近的問題,因此第一、二交界接點61、62僅各有一個,第一、二交界探針63、64則對應地僅各有一個,只要此二探針位於不同高度即可避免探針干涉問題。在鄰近待測單元50A、50B之相鄰側邊緣的第一導電接點55a傾斜角度更大的情況下,第一、二交界接點61、62(亦即可能使同高度之探針過於靠近或干涉之導電接點)的數量則會設定得更多,第一、二交界探針63、64的數量亦隨之增加。 In this embodiment, since the first probe 30a and the second probe 30b are located at different heights, no matter how large the inclination angle of the first conductive contact 55a is, the inclination angles of the first and second probes 30a and 30b are both It can correspond to the inclination angle of the first conductive contact 55a touched by it without interference. However, the probe module of the present invention is not limited to the first probes 30a being at the same height, nor is it limited to the second probes 30b being at the same height, as long as the rightmost one or several first probes The needle 30a and the leftmost one or several second probes 30b are located at different heights to avoid probe interference problems. That is, the first probe 30a may include one or several first junction probes 63, The two probes 30b can include one or several second junction probes 64, as long as the first junction probe 63 and the second junction probe 64 are located at different heights (different needle layers) to avoid mutual interference, the remaining first The heights of the probes 30a and the second probes 30b are not limited. For example, among the first probes 30a and the second probes 30b, only the first junction probe 63 may be located on the higher first needle layer P1, and the rest The first probe 30a and the second probe 30b are located in the lower second needle layer P2, and the number of the first and second junction probes 63, 64 depends on the neighboring first and second test units 50A, 50B The inclination angle of the first conductive contact 55a of the adjacent side edge. In detail, for the first and second units under test 50A, 50B of this embodiment, the first conductive contact 55a of each unit under test 50A, 50B closest to its adjacent side edge will correspond to The probes of the same height have the problem of being too close, so the first and second junction contacts 61 and 62 have only one each, and the first and second junction probes 63 and 64 respectively have only one each, as long as these two probes Located at different heights can avoid probe interference problems. In the case where the first conductive contact 55a adjacent to the adjacent side edge of the unit under test 50A, 50B has a greater inclination angle, the first and second junction contacts 61, 62 (that is, the probes of the same height may be too close The number of conductive contacts (or interfering conductive contacts) will be set more, and the number of first and second junction probes 63 and 64 will increase accordingly.

請參閱圖8及圖9,本發明一第二較佳實施例所提供之探針模組20’係用以同時檢測呈矩陣排列之第一至第四待測單元50A~D,其中,針對圖8中左下及右下之第一、二待測單元50A、50B,該探針模組20’係採用如同第一較佳實施例之探針模組20的探針配置,為簡化圖式,圖8中未顯示此部分之探針。而對於圖8中左上及右上之第三、四待測單元50C、50D,由於該第三待測單元50C之第一主邊緣51係與該第一待測單元50A之第二主邊緣52相鄰,該第四待測單元50D之第一主邊緣51係與該第二待測單元50B之第二主邊緣52相鄰,第三、四待測單元50C、50D之導電接點55a~d全部都較第一、二待測單元50A、50B之第一導電接點55a更靠近第二探針座22,因此,第三、四待測單元50C、50D之導電接點55a~d可全部皆由設置於該第二探針座22之第三探針30f~i點觸,亦即可在第二探針座22增設四行第三探針30f~i,如圖9所示,該四行第三探針30f~i係位於用以點觸第一、二待測單元50A、50B之第三探針30c~e下方,且依由上而下之順序係分別用以點觸第三、四待測單元50C、50D之第一導電接點55a以及第二導電接點55b~d之第三至第一行L3~L1。為了簡化圖式,圖8中僅顯示用以點觸第三、四待測單元50C、50D之第一導電接點55a的第三探針30f。 Please refer to FIGS. 8 and 9, the probe module 20' provided by a second preferred embodiment of the present invention is used to simultaneously detect the first to fourth units under test 50A~D arranged in a matrix. The first and second units under test 50A, 50B at the bottom left and bottom right in FIG. 8. The probe module 20' adopts the same probe configuration as the probe module 20 of the first preferred embodiment, which is a simplified diagram , Figure 8 does not show this part of the probe. As for the third and fourth test units 50C and 50D in the upper left and upper right of FIG. 8, the first main edge 51 of the third test unit 50C is opposite to the second main edge 52 of the first test unit 50A. Adjacent, the first main edge 51 of the fourth unit under test 50D is adjacent to the second main edge 52 of the second unit under test 50B, and the conductive contacts 55a~d of the third and fourth units under test 50C, 50D All of them are closer to the second probe holder 22 than the first conductive contacts 55a of the first and second test units 50A, 50B. Therefore, the third and fourth test units 50C, 50D have all of the conductive contacts 55a~d. All are touched by the third probes 30f~i arranged on the second probe holder 22, that is, four rows of third probes 30f~i can be added to the second probe holder 22, as shown in FIG. The four rows of third probes 30f~i are located below the third probes 30c~e used to touch the first and second test units 50A, 50B, and are used to touch the 3. The third to first rows L3~L1 of the first conductive contact 55a and the second conductive contact 55b~d of the cells under test 50C, 50D. To simplify the drawing, FIG. 8 only shows the third probe 30f used to touch the first conductive contact 55a of the third and fourth test cells 50C, 50D.

最後,必須再次說明,本發明於前揭實施例中所揭露的構成元件,僅為舉例說明,並非用來限制本案之範圍,其他等效元件的替代或變化,亦應為本案之申請專利範圍所涵蓋。 Finally, it must be explained again that the constituent elements disclosed in the previously disclosed embodiments of the present invention are merely examples and are not intended to limit the scope of the case. Alternatives or changes to other equivalent elements should also be the scope of the patent application for this case. Covered.

20:探針模組 20: Probe module

21:(第一)探針座 21: (first) probe holder

211:內側面 211: inside

212:外側面 212: outer side

22:(第二)探針座 22: (second) probe holder

221:內側面 221: inside

222:外側面 222: outer side

30a:(第一)探針 30a: (first) probe

30b:(第二)探針 30b: (second) probe

30c~e:(第三)探針 30c~e: (third) probe

31:懸臂段 31: Cantilever section

311:固定部 311: Fixed part

312:外露部 312: Exposed

32:點觸段 32: Touch segment

40:電路板 40: circuit board

41:底面 41: Bottom

50A、50B:第一、二待測單元 50A, 50B: the first and second units to be tested

56:上表面 56: upper surface

D1:點觸方向 D1: Touch direction

d:垂直距離 d: vertical distance

P1~P5:第一~第五針層 P1~P5: the first to fifth needle layers

Claims (21)

一種適用於具有傾斜導電接點之多待測單元的探針模組,係用以同時檢測複數待測單元,各該待測單元具有一第一主邊緣、一第二主邊緣、連接該第一主邊緣及該第二主邊緣之一第一側邊緣及一第二側邊緣,以及複數導電接點,該複數待測單元中包含一第一待測單元及一第二待測單元,該第一待測單元之第二側邊緣係與該第二待測單元之第一側邊緣相鄰,該第一待測單元之導電接點中包含一鄰近該第一待測單元之第一主邊緣及第二側邊緣的第一交界接點,該第二待測單元之導電接點中包含一鄰近該第二待測單元之第一主邊緣及第一側邊緣的第二交界接點;該探針模組包含有:至少一探針座;以及複數探針,各該探針包含有一懸臂段及一點觸段,該懸臂段具有一與該探針座固接之固定部,以及一連接於該固定部且自該探針座一內側面延伸而出之外露部,該點觸段係連接於該外露部;其中,該至少一探針座中包含一第一探針座,該複數探針中包含設置於該第一探針座且位於不同高度之一第一交界探針及一第二交界探針,當該探針模組檢測該等待測單元時,各該待測單元之第一主邊緣係較第二主邊緣更靠近該第一探針座,該第一交界探針及該第二交界探針係以其懸臂段分別經過該第一待測單元及該第二待測單元之第一主邊緣上方而分別延伸至該第一交界接點及該第二交界接點上方進而以其點觸段分別點觸該第一交界接點及該第二交界接點;其中各該待測單元之導電接點中包含複數鄰近於所屬待測單元之第二主邊緣的第二導電接點;該探針模組之至少一探針座中更包含一第二探針座,該探針模組之探針中包含複數設置於該第二探針座之第三探針,當該探針模組檢測該等待測單元時,各該待測單元之第二主邊緣係較第一主邊緣更靠近 該第二探針座,至少部分之第三探針係以其懸臂段經過該等待測單元之第二主邊緣上方而延伸至該等第二導電接點上方進而以其點觸段點觸該等第二導電接點。 A probe module suitable for multiple units to be tested with inclined conductive contacts is used to simultaneously detect a plurality of units to be tested. Each unit to be tested has a first main edge, a second main edge, and is connected to the first main edge. A main edge and a first side edge and a second side edge of the second main edge, and a plurality of conductive contacts. The plurality of units under test include a first unit under test and a second unit under test, the The second side edge of the first unit under test is adjacent to the first side edge of the second unit under test. The conductive contacts of the first unit under test include a first main body adjacent to the first unit under test. The first junction point of the edge and the second side edge, the conductive contact of the second unit under test includes a second junction point adjacent to the first main edge and the first side edge of the second unit under test; The probe module includes: at least one probe holder; and a plurality of probes, each of the probes includes a cantilever segment and a point contact segment, the cantilever segment has a fixed part fixed to the probe holder, and a Connected to the fixing part and extending from an inner side surface of the probe holder to protrude out of the exposed part, the point contact section is connected to the exposed part; wherein, the at least one probe holder includes a first probe holder, the The plurality of probes includes a first junction probe and a second junction probe that are arranged on the first probe holder and are located at different heights. When the probe module detects the waiting unit, each unit to be tested The first main edge is closer to the first probe holder than the second main edge, and the first junction probe and the second junction probe pass through the first unit to be tested and the second with their cantilever sections, respectively Above the first main edge of the unit to be tested, it extends above the first junction contact and the second junction contact respectively, and then touches the first junction contact and the second junction contact with its touch segments; The conductive contacts of each unit under test include a plurality of second conductive contacts adjacent to the second main edge of the unit to be tested; at least one probe holder of the probe module further includes a second probe Holder, the probes of the probe module include a plurality of third probes arranged on the second probe holder, when the probe module detects the waiting unit, the second main edge of each unit to be tested Is closer to the first main edge For the second probe holder, at least part of the third probe has its cantilever section passing over the second main edge of the waiting unit and extending above the second conductive contacts to touch the Wait for the second conductive contact. 如申請專利範圍第1項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中各該待測單元之導電接點中包含複數沿所屬待測單元之第一主邊緣排成一行之第一導電接點,該第一待測單元之第一導電接點中包含該第一交界接點,該第二待測單元之第一導電接點中包含該第二交界接點;該複數探針中包含設置於該第一探針座之複數第一探針及複數第二探針,該等第一探針在該第一探針座形成一第一針層,該等第二探針在該第一探針座形成一與該第一針層不同高度之第二針層,該等第一探針中包含該第一交界探針,該等第二探針中包含該第二交界探針;當該探針模組檢測該等待測單元時,該等第一探針係分別以其點觸段點觸該第一待測單元之第一導電接點,該等第二探針係分別以其點觸段點觸該第二待測單元之第一導電接點。 As described in item 1 of the scope of patent application, the probe module is suitable for multiple units to be tested with inclined conductive contacts, wherein the conductive contacts of each unit to be tested include the first master of the unit to be tested to which a plurality of edges belong A first conductive contact with edges in a row, the first conductive contact of the first unit under test includes the first junction contact, and the first conductive contact of the second unit under test includes the second junction Contacts; the plurality of probes include a plurality of first probes and a plurality of second probes arranged in the first probe holder, the first probes form a first needle layer in the first probe holder, The second probes form a second needle layer with a different height from the first needle layer on the first probe holder, the first probes include the first junction probe, and the second probes Includes the second junction probe; when the probe module detects the waiting unit, the first probes respectively touch the first conductive contact of the first unit to be tested with their touch segments, The second probes respectively touch the first conductive contacts of the second unit to be tested with their touch sections. 如申請專利範圍第1項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中各該待測單元之導電接點中包含複數沿所屬待測單元之第一主邊緣排成一行之第一導電接點,該第一待測單元之第一導電接點中包含該第一交界接點,該第二待測單元之第一導電接點中包含該第二交界接點;該複數探針中包含設置於該第一探針座之複數第一探針及複數第二探針,該等第一探針中包含該第一交界探針,該等第二探針中包含該第二交界探針,當該探針模組檢測該等待測單元時,該等第一探針係分別以其點觸段點觸該第一待測單元之第一導電接點,該等第二探針係分別以其點觸段點觸該第二待測單元之第一導電接點;該等第一探針及第二探針在該第一探針座 形成複數不同高度之針層,該第一交界探針係與該第二交界探針位於不同針層。 As described in item 1 of the scope of patent application, the probe module is suitable for multiple units to be tested with inclined conductive contacts, wherein the conductive contacts of each unit to be tested include the first master of the unit to be tested to which a plurality of edges belong A first conductive contact with edges in a row, the first conductive contact of the first unit under test includes the first junction contact, and the first conductive contact of the second unit under test includes the second junction Contacts; the plurality of probes include a plurality of first probes and a plurality of second probes arranged in the first probe holder, the first probes include the first junction probe, the second probe The needle includes the second junction probe, and when the probe module detects the waiting unit, the first probes respectively touch the first conductive contact of the first unit to be tested with their touch segments , The second probes respectively touch the first conductive contact of the second unit to be tested with their touch segments; A plurality of needle layers of different heights are formed, and the first boundary probe and the second boundary probe are located on different needle layers. 如申請專利範圍第3項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該第一探針座之針層中包含一第一針層,以及一低於該第一針層之第二針層,該第一交界探針及該第二交界探針其中之一係位於該第一針層,其餘之第一探針及第二探針係位於該第二針層。 As described in item 3 of the scope of patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the needle layer of the first probe holder includes a first needle layer and a lower The second needle layer of the first needle layer, one of the first border probe and the second border probe is located on the first needle layer, and the remaining first probes and second probes are located on the first needle layer. Two needle layer. 如申請專利範圍第2至4項中任一項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該等第一探針能定義出一垂直於該第一探針座之內側面的第一分界線,該等第一探針之外露部自該內側面延伸而出之方向係平行於該第一分界線或朝該第一分界線靠近地相對於該第一分界線呈傾斜;該等第二探針能定義出一垂直於該第一探針座之內側面的第二分界線,該等第二探針之外露部自該內側面延伸而出之方向係平行於該第二分界線或朝該第二分界線靠近地相對於該第二分界線呈傾斜。 As described in any one of items 2 to 4 of the scope of patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the first probes can define a first probe perpendicular to the first The first dividing line of the inner side surface of the probe holder, the direction in which the exposed portions of the first probes extend from the inner side surface is parallel to the first dividing line or close to the first dividing line relative to the The first dividing line is inclined; the second probes can define a second dividing line perpendicular to the inner surface of the first probe holder, and the exposed portions of the second probes extend from the inner surface The direction is parallel to the second demarcation line or is inclined with respect to the second demarcation line close to the second demarcation line. 如申請專利範圍第1項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中各該待測單元之第二導電接點係平行於一水平軸線地排成複數行,其順序係自該第二主邊緣朝該第一主邊緣之方向排列;該等第三探針係以對應該等第二導電接點之排列方式形成高度不同之複數針層,其順序係由下而上地對應第二導電接點之該複數行的順序。 As described in the first item of the scope of patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the second conductive contacts of each unit to be tested are arranged in plural parallel to a horizontal axis The order is arranged in the direction from the second main edge to the first main edge; the third probes are arranged in a manner corresponding to the second conductive contacts to form a plurality of needle layers with different heights, and the order It corresponds to the order of the plurality of rows of the second conductive contacts from bottom to top. 如申請專利範圍第1項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該複數待測單元中更包含一第三待測單元及一第四待測單元,該第三待測單元之第一主邊緣係與該第一待測單元之第二主邊緣相鄰,該第四待測單元之第一主邊緣係與該第二待測單元之第二主邊緣相鄰;當該探針模組檢測該等待測單元時,部分之第三探針係以其點觸段點觸該第三待測單元及第四待測單元之全部導電接點。 As described in item 1 of the scope of patent application, a probe module suitable for multiple units under test with inclined conductive contacts, wherein the plurality of units under test further include a third unit under test and a fourth unit under test , The first main edge of the third unit under test is adjacent to the second main edge of the first unit under test, and the first main edge of the fourth unit under test is the second main edge of the second unit under test The main edges are adjacent; when the probe module detects the waiting unit, part of the third probe touches all the conductive contacts of the third unit to be tested and the fourth unit to be tested with its touch section. 如申請專利範圍第1項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該等第三探針形成高度不同之複數針層,位置越高之針層的第三探針係用以點觸距離該第二探針座越遠的導電接點,且位置越高之針層的第三探針之懸臂段越長。 As described in item 1 of the scope of patent application, it is suitable for a probe module with multiple units to be tested with inclined conductive contacts, wherein the third probes form a plurality of needle layers with different heights, and the higher the position of the needle layer The third probe is used to touch the conductive contact that is farther from the second probe holder, and the cantilever section of the third probe of the higher needle layer is longer. 如申請專利範圍第1項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該第二探針座能定義出垂直於其內側面之一分界軸線、一第一分界線及一第二分界線,該第一分界線及該第二分界線係分別位於該分界軸線之一第一側及一第二側,位於該分界軸線第一側之探針的外露部自該內側面延伸而出之方向係平行於該第一分界線或遠離該第一分界線地相對於該第一分界線呈傾斜,位於該分界軸線第二側之探針的外露部自該內側面延伸而出之方向係平行於該第二分界線或遠離該第二分界線地相對於該第二分界線呈傾斜。 As described in item 1 of the scope of patent application, it is suitable for a probe module with multiple units to be tested with inclined conductive contacts, wherein the second probe holder can define a boundary axis perpendicular to the inner side of the A demarcation line and a second demarcation line, the first demarcation line and the second demarcation line are respectively located on a first side and a second side of the demarcation axis, and the probe on the first side of the demarcation axis is exposed The direction in which the portion extends from the inner side surface is parallel to the first boundary line or inclined relative to the first boundary line away from the first boundary line, and the exposed portion of the probe located on the second side of the boundary axis is from The direction in which the inner side surface extends is parallel to the second dividing line or inclined with respect to the second dividing line away from the second dividing line. 如申請專利範圍第1項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中各該探針之固定部與外露部係呈一直線。 As described in item 1 of the scope of patent application, the probe module is suitable for multiple units to be tested with inclined conductive contacts, wherein the fixed part and exposed part of each probe are in a straight line. 如申請專利範圍第1項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中各該探針之固定部包含有一內側區段及一外側區段,各該探針之固定部的內側區段係與外露部連接且與外露部呈一直線,該等探針之固定部的外側區段係相互平行。 As described in item 1 of the scope of patent application, the probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the fixing part of each probe includes an inner section and an outer section, and each probe module The inner section of the fixed part of the needle is connected with the exposed part and is in line with the exposed part, and the outer sections of the fixed part of the probes are parallel to each other. 一種適用於具有傾斜導電接點之多待測單元的探針模組,包含有:至少一探針座;以及複數探針,各該探針包含有一懸臂段及一點觸段,該懸臂段具有一與該探針座固接之固定部,以及一連接於該固定部且自該探針座一內側面延伸而出之外露部,該點觸段係連接於該外露部; 其中,該至少一探針座中包含一第一探針座,該複數探針中包含設置於該第一探針座且位於不同高度之一第一交界探針及一第二交界探針,分別用於點觸具有不同傾斜方向的導電接點,該第一交界探針及該第二交界探針之點觸段末端與該第一探針座內側面的垂直距離係相同。 A probe module suitable for multiple units to be tested with inclined conductive contacts, comprising: at least one probe holder; and a plurality of probes, each of the probes includes a cantilever segment and a point contact segment, the cantilever segment having A fixing part fixedly connected to the probe base, and an exposed part connected to the fixing part and extending from an inner side of the probe base, and the point contact section is connected to the exposed part; Wherein, the at least one probe holder includes a first probe holder, and the plurality of probes includes a first junction probe and a second junction probe that are arranged on the first probe holder and are located at different heights, They are respectively used to touch conductive contacts with different inclination directions, and the vertical distances between the end of the touch section of the first junction probe and the second junction probe and the inner surface of the first probe holder are the same. 如申請專利範圍第12項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該第一交界探針之外露部及該第二交界探針之外露部係非垂直於該第一探針座內側面地呈傾斜且其傾斜方向相互對稱。 As described in item 12 of the scope of patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the exposed part of the first junction probe and the exposed part of the second junction probe are not It is inclined perpendicular to the inner side surface of the first probe holder and the inclination directions are symmetrical to each other. 如申請專利範圍第12項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該複數探針中包含設置於該第一探針座之複數第一探針及複數第二探針,該等第一探針在該第一探針座形成一第一針層,該等第二探針在該第一探針座形成一與該第一針層不同高度之第二針層,該等第一探針中包含該第一交界探針,該等第二探針中包含該第二交界探針,該等第一探針及第二探針之點觸段末端與該第一探針座內側面的垂直距離係相同。 As described in item 12 of the scope of patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the plurality of probes includes a plurality of first probes arranged on the first probe holder and A plurality of second probes, the first probes form a first needle layer on the first probe base, and the second probes form a height different from the first needle layer on the first probe base The second needle layer, the first probes include the first junction probe, the second probes include the second junction probe, and the touch sections of the first probe and the second probe The vertical distance between the end and the inner surface of the first probe holder is the same. 如申請專利範圍第12項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該複數探針中包含設置於該第一探針座之複數第一探針及複數第二探針,該等第一探針及第二探針之點觸段末端與該第一探針座內側面的垂直距離係相同,該等第一探針中包含該第一交界探針,該等第二探針中包含該第二交界探針,該等第一探針及第二探針在該第一探針座形成複數不同高度之針層,該第一交界探針係與該第二交界探針位於不同針層。 As described in item 12 of the scope of patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the plurality of probes includes a plurality of first probes arranged on the first probe holder and A plurality of second probes. The vertical distances between the end of the touch section of the first probe and the second probe and the inner surface of the first probe holder are the same, and the first probes include the first junction probe Needles, the second probes include the second junction probe, the first probes and the second probes form a plurality of needle layers of different heights on the first probe seat, and the first junction probe is The second interface probe is located on a different needle layer. 如申請專利範圍第15項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該第一探針座之針層中包含一第一針層,以及一 低於該第一針層之第二針層,該第一交界探針及該第二交界探針其中之一係位於該第一針層,其餘之第一探針及第二探針係位於該第二針層。 As described in item 15 of the scope of patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the needle layer of the first probe holder includes a first needle layer and a A second needle layer lower than the first needle layer, one of the first boundary probe and the second boundary probe is located on the first needle layer, and the remaining first and second probes are located The second needle layer. 如申請專利範圍第14至16項中任一項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該等第一探針能定義出一垂直於該第一探針座之內側面的第一分界線,該等第一探針之外露部自該內側面延伸而出之方向係平行於該第一分界線或朝該第一分界線靠近地相對於該第一分界線呈傾斜;該等第二探針能定義出一垂直於該第一探針座之內側面的第二分界線,該等第二探針之外露部自該內側面延伸而出之方向係平行於該第二分界線或朝該第二分界線靠近地相對於該第二分界線呈傾斜。 As described in any one of items 14 to 16 in the scope of the patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the first probes can define a first probe that is perpendicular to the first The first dividing line of the inner side surface of the probe holder, the direction in which the exposed portions of the first probes extend from the inner side surface is parallel to the first dividing line or close to the first dividing line relative to the The first dividing line is inclined; the second probes can define a second dividing line perpendicular to the inner surface of the first probe holder, and the exposed portions of the second probes extend from the inner surface The direction is parallel to the second demarcation line or is inclined with respect to the second demarcation line close to the second demarcation line. 如申請專利範圍第12項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該探針模組之至少一探針座中更包含一第二探針座,該探針模組之探針中包含複數設置於該第二探針座之第三探針,該等第三探針在該第二探針座形成高度不同之複數針層,位置越高之針層的第三探針之懸臂段的外露部越長。 As described in item 12 of the scope of patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein at least one probe holder of the probe module further includes a second probe holder, The probes of the probe module include a plurality of third probes arranged on the second probe holder, and the third probes form a plurality of needle layers with different heights on the second probe holder, the higher the position The longer the exposed part of the cantilever section of the third probe of the needle layer. 如申請專利範圍第18項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中該第二探針座能定義出垂直於其內側面之一分界軸線、一第一分界線及一第二分界線,該第一分界線及該第二分界線係分別位於該分界軸線之一第一側及一第二側,位於該分界軸線第一側之探針的外露部自該內側面延伸而出之方向係平行於該第一分界線或遠離該第一分界線地相對於該第一分界線呈傾斜,位於該分界軸線第二側之探針的外露部自該內側面延伸而出之方向係平行於該第二分界線或遠離該第二分界線地相對於該第二分界線呈傾斜。 As described in item 18 of the scope of patent application, it is suitable for a probe module with multiple units to be tested with inclined conductive contacts, wherein the second probe holder can define a boundary axis perpendicular to the inner side of the probe module, and a second A demarcation line and a second demarcation line, the first demarcation line and the second demarcation line are respectively located on a first side and a second side of the demarcation axis, and the probe on the first side of the demarcation axis is exposed The direction in which the portion extends from the inner side surface is parallel to the first boundary line or inclined relative to the first boundary line away from the first boundary line, and the exposed portion of the probe located on the second side of the boundary axis is from The direction in which the inner side surface extends is parallel to the second dividing line or inclined with respect to the second dividing line away from the second dividing line. 如申請專利範圍第12項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中各該探針之固定部與外露部係呈一直線。 As described in item 12 of the scope of patent application, it is suitable for a probe module with multiple units under test with inclined conductive contacts, wherein the fixed part and exposed part of each probe are in a straight line. 如申請專利範圍第12項所述之適用於具有傾斜導電接點之多待測單元的探針模組,其中各該探針之固定部包含有一內側區段及一外側區段,各該探針之固定部的內側區段係與外露部連接且與外露部呈一直線,該等探針之固定部的外側區段係相互平行。 As described in item 12 of the scope of patent application, a probe module suitable for multiple units to be tested with inclined conductive contacts, wherein the fixing part of each probe includes an inner section and an outer section, and each probe module The inner section of the fixed part of the needle is connected with the exposed part and is in line with the exposed part, and the outer sections of the fixed part of the probes are parallel to each other.
TW108125850A 2019-07-22 2019-07-22 Suitable for probe modules with multiple units to be tested with inclined conductive contacts TWI704355B (en)

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KR102292880B1 (en) 2021-08-24

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