TWI704355B - Suitable for probe modules with multiple units to be tested with inclined conductive contacts - Google Patents
Suitable for probe modules with multiple units to be tested with inclined conductive contacts Download PDFInfo
- Publication number
- TWI704355B TWI704355B TW108125850A TW108125850A TWI704355B TW I704355 B TWI704355 B TW I704355B TW 108125850 A TW108125850 A TW 108125850A TW 108125850 A TW108125850 A TW 108125850A TW I704355 B TWI704355 B TW I704355B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- probes
- tested
- conductive contacts
- junction
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 462
- 239000000758 substrate Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
一種探針模組,係用以同時檢測側邊緣相鄰之第一、二待測單元,第一、二待測單元分別具有鄰近其第一主邊緣及相鄰側邊緣之第一、二交界接點;該探針模組包含有一探針座,以及設於該探針座之不同高度的第一、二交界探針,當該探針模組檢測第一、二待測單元時,各該待測單元之第一主邊緣較第二主邊緣更靠近該探針座,第一、二交界探針係以其懸臂段分別經過第一、二待測單元之第一主邊緣上方而分別延伸至第一、二交界接點上方進而以其點觸段點觸第一、二交界接點;藉此,第一、二交界探針可避免相互干涉。A probe module is used to simultaneously detect first and second units to be tested adjacent to side edges. The first and second units to be tested respectively have first and second boundaries adjacent to their first main edge and adjacent side edges Contact; the probe module includes a probe holder, and the first and second junction probes at different heights of the probe holder, when the probe module detects the first and second units to be tested, each The first main edge of the unit to be tested is closer to the probe holder than the second main edge, and the first and second junction probes are separated by their cantilever sections passing over the first main edge of the first and second units to be tested. Extend to the top of the first and second junction contacts and then touch the first and second junction contacts with its point contact section; thereby, the first and second junction probes can avoid mutual interference.
Description
本發明係與探針卡之探針模組有關,特別是關於一種適用於具有傾斜導電接點之多待測單元(multi-UUT)的探針模組。 The present invention relates to the probe module of the probe card, and particularly relates to a probe module suitable for multi-UUT with inclined conductive contacts.
請參閱圖1,其中顯示一具有傾斜導電接點之待測單元10(unit under test;簡稱UUT),該待測單元10可為未封裝之晶片(die)或已封裝之晶片(chip),該待測單元10具有排成一或多行之複數用於輸出訊號之第一導電接點11,以及排成一行之複數用於輸入訊號之第二導電接點12,例如圖1所示之待測單元10具有由其一基板13之一第一長邊131朝向一第二長邊132排列之三行第一導電接點11,以及沿該基板13之第二長邊132設置的一行第二導電接點12,該等第一、二導電接點11、12排成多列,每一列之排列方向係平行於一垂直於第一、二長邊131、132之分界軸線L,且靠近該分界軸線L之列,例如圖1中一中間區塊14所包含者,其中之第一、二導電接點11、12的長邊111、121係平行於該分界軸線L,而距離該分界軸線L較遠之列的第一、二導電接點11、12則為傾斜導電接點,其較靠近基板13第一長邊131之一端亦較靠近該分界軸線L,較遠離基板13第一長邊131之一端則亦較遠離該分界軸線L,亦即傾斜導電接點以圖1之方向來看是由上而下且由內而外地傾斜,且距離該分界軸線L越遠之第一、二導電接點11、12相對於該分界軸線L之角度越大,例如圖1中二外側區塊15、16所包含之第一、二導電接點11、12之長邊111、121相對於該分界軸線L之角度θ1、θ2最大。
Please refer to FIG. 1, which shows a unit under test (UUT) with inclined conductive contacts. The unit under
前述之待測單元10可利用具有懸臂式探針的探針卡進行檢測,為簡化圖式,圖1中僅示意性地顯示一對應最左邊之第二導電接點12的探針17,實際上每一導電接點11、12皆對應一探針,該探針17之懸臂段171可自一位於該待測單元10之第二長邊132外側上方的探針座18延伸至導電接點12上方,使得探針17之一自其懸臂段171末端向下延伸的點觸段(圖中未示)可點觸對應之導電接點12。
The aforementioned unit under
然而,由於該待測單元10具有傾斜角度不一致之傾斜導電接點,其檢測所需之探針難以配置於探針座上,尤其對於多待測單元之檢測,亦即同時檢測至少二該待測單元10,將會有探針17相互干涉之疑慮,因此目前仍未有適用之檢測裝置。
However, because the unit under
有鑑於上述缺失,本發明之主要目的在於提供一種探針模組,係適用於類同上述之具有傾斜導電接點之多待測單元的檢測,以避免探針相互干涉。 In view of the above-mentioned shortcomings, the main purpose of the present invention is to provide a probe module, which is suitable for the detection of multiple units under test with inclined conductive contacts similar to the above-mentioned, so as to avoid mutual interference of probes.
為達成上述目的,本發明所提供之探針模組係用以同時檢測複數待測單元,各該待測單元具有一第一主邊緣、一第二主邊緣、連接該第一主邊緣及該第二主邊緣之一第一側邊緣及一第二側邊緣,以及複數導電接點,該複數待測單元中包含一第一待測單元及一第二待測單元,該第一待測單元之第二側邊緣係與該第二待測單元之第一側邊緣相鄰,該第一待測單元之導電接點中包含一鄰近該第一待測單元之第一主邊緣及第二側邊緣的第一交界接點,該第二待測單元之導電接點中包含一鄰近該第二待測單元之第一主邊緣及第一側邊緣的第二交界接點。 In order to achieve the above object, the probe module provided by the present invention is used to simultaneously detect a plurality of units to be tested. Each unit to be tested has a first main edge, a second main edge, connecting the first main edge and the A first side edge and a second side edge of the second main edge, and a plurality of conductive contacts. The plurality of units under test includes a first unit under test and a second unit under test, the first unit under test The second side edge is adjacent to the first side edge of the second unit under test, and the conductive contacts of the first unit under test include a first main edge and a second side adjacent to the first unit under test The first boundary contact of the edge, and the conductive contact of the second unit to be tested includes a second boundary contact adjacent to the first main edge and the first side edge of the second unit to be tested.
該探針模組包含有至少一探針座,以及複數探針,各該探針包含有一懸臂段及一點觸段,該懸臂段具有一與該探針座固接之固定部,以及一連接於該固定部且自該探針座一內側面延伸而出之外露部,該點觸段係連接於該外露部。其中,該至少一探針座中包含一第一探針座,該複數探針中包含設置於該第一探針座且位於不同高度之一第一交界探針及一第二交界探針,當該探針模組檢測該等待測單元時,各該待測單元之第一主邊緣係較第二主邊緣更靠近該第一探針座,該第一交界探針及該第二交界探針係以其懸臂段分別經過該第一待測單元及該第二待測單元之第一主邊緣上方而分別延伸至該第一交界接點及該第二交界接點上方進而以其點觸段分別點觸該第一交界接點及該第二交界接點。 The probe module includes at least one probe holder and a plurality of probes. Each probe includes a cantilever section and a one-point contact section. The cantilever section has a fixed portion fixedly connected to the probe holder and a connection At the fixing portion and extending from an inner side surface of the probe base, the exposed portion is exposed, and the point contact section is connected to the exposed portion. Wherein, the at least one probe holder includes a first probe holder, and the plurality of probes includes a first junction probe and a second junction probe that are arranged on the first probe holder and are located at different heights, When the probe module detects the waiting unit, the first main edge of each unit to be tested is closer to the first probe holder than the second main edge, the first junction probe and the second junction probe The cantilever section of the needle passes over the first main edge of the first unit to be tested and the second unit to be tested, and extends to the first junction contact and the second junction contact respectively, and then touches with its point. The segments respectively touch the first junction contact and the second junction contact.
換言之,本發明主要係針對相鄰待測單元之相鄰側邊緣鄰近第一主邊緣之處的導電接點,亦即第一、二交界接點,本發明之探針模組係藉由鄰近待測單元之第一主邊緣的第一探針座從不同高度延伸而出之第一、二交界探針分別點觸第一、二交界接點。該探針模組用以點觸該等待測單元之其他導電接點的探針配置則無限制。 In other words, the present invention is mainly aimed at the conductive contacts where the adjacent side edges of adjacent units under test are adjacent to the first main edge, that is, the first and second junction contacts. The probe module of the present invention is based on the proximity The first and second junction probes of the first probe holders extending from different heights of the first main edge of the unit to be tested touch the first and second junction contacts respectively. There is no limit to the probe configuration of the probe module used to touch other conductive contacts of the waiting unit.
由於第一、二交界探針係位於不同高度,即使第一、二交界接點朝向第一主邊緣之延伸方向係相互靠近,第一、二交界探針之懸臂段的外露部自第一探針座延伸而出之方向仍可配合第一、二交界接點之延伸方向,以避免探針在點測時意外滑動至非對應的導電接點上,亦即,第一、二交界探針之懸臂段的外露部可自第一探針座傾斜延伸而逐漸朝對應之交界接點靠近,即使所需之傾斜角度很大,使得第一、二交界探針的懸臂段彼此相當靠近或甚至必須部分位於同一垂直面上,第一、二交界探針因位於不同高度而可避免相互干涉。 Since the first and second junction probes are located at different heights, even if the first and second junction points are close to each other in the extension direction of the first main edge, the exposed part of the cantilever section of the first and second junction probes is from the first probe The direction in which the needle holder extends can still be matched with the extension direction of the first and second junction contacts to prevent the probe from accidentally sliding onto the non-corresponding conductive contacts during point measurement, that is, the first and second junction probes The exposed part of the cantilever section can extend obliquely from the first probe holder and gradually approach the corresponding junction point, even if the required inclination angle is large, so that the cantilever sections of the first and second junction probes are quite close to each other or even The parts must be located on the same vertical plane, and the first and second junction probes are located at different heights to avoid mutual interference.
事實上,由第一探針座之不同高度延伸而出的探針,不限於用以點觸如前述之鄰近第一主邊緣的第一、二交界接點,而可適用於任何位置之可能造成同高度之探針過於靠近或相互干涉的導電接點,以藉由將可能造成前述問題之導電接點所對應之探針(在本發明中皆稱為第一、二交界探針)設置於不同高度而達到避免探針干涉之功效。 In fact, the probes extending from the different heights of the first probe holder are not limited to touch the first and second junction points adjacent to the first main edge as mentioned above, but can be applied to any position possible Conductive contacts that cause probes of the same height to be too close or interfere with each other, so that the probes corresponding to the conductive contacts that may cause the aforementioned problems (both referred to as the first and second junction probes in the present invention) are arranged It can avoid probe interference at different heights.
有關本發明所提供之具有傾斜導電接點之多待測單元的探針模組的詳細構造、特點、組裝或使用方式,將於後續的實施方式詳細說明中予以描述。然而,在本發明領域中具有通常知識者應能瞭解,該等詳細說明以及實施本發明所列舉的特定實施例,僅係用於說明本發明,並非用以限制本發明之專利申請範圍。 The detailed structure, characteristics, assembly or use of the probe module with multiple units to be tested with inclined conductive contacts provided by the present invention will be described in the detailed description of the subsequent embodiments. However, those with ordinary knowledge in the field of the present invention should be able to understand that these detailed descriptions and specific examples for implementing the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the patent application of the present invention.
[先前技術] [Prior Art]
10:待測單元 10: Unit to be tested
11:第一導電接點 11: The first conductive contact
111:長邊 111: long side
12:第二導電接點 12: The second conductive contact
121:長邊 121: long side
13:基板 13: substrate
131:第一長邊 131: The first long side
132:第二長邊 132: second long side
14:中間區塊 14: Middle block
15、16:外側區塊 15, 16: Outer block
17:探針 17: Probe
171:懸臂段 171: Cantilever section
18:探針座 18: Probe holder
L:分界軸線 L: Demarcation axis
θ1、θ2:角度 θ1, θ2: angle
[實施例] [Example]
20、20’:探針模組 20, 20’: Probe module
21:(第一)探針座 21: (first) probe holder
211:內側面 211: inside
212:外側面 212: outer side
22:(第二)探針座 22: (second) probe holder
221:內側面 221: inside
222:外側面 222: outer side
30a:(第一)探針 30a: (first) probe
30b:(第二)探針 30b: (second) probe
30c~i:(第三)探針 30c~i: (third) probe
31:懸臂段 31: Cantilever section
311:固定部 311: Fixed part
311a:內側區段 311a: inner section
311b:外側區段 311b: Outer section
312:外露部 312: Exposed
32:點觸段 32: Touch segment
40:電路板 40: circuit board
41:底面 41: Bottom
50A~D:第一~第四待測單元 50A~D: 1st~4th unit to be tested
51:第一主邊緣 51: First Main Edge
52:第二主邊緣 52: Second Main Edge
53:第一側邊緣 53: first side edge
54:第二側邊緣 54: second side edge
55a:(第一)導電接點 55a: (first) conductive contact
55b~d:(第二)導電接點 55b~d: (second) conductive contact
551:第一端 551: first end
552:第二端 552: second end
56:上表面 56: upper surface
57:中間區塊 57: middle block
58:左側區塊 58: Left block
59:右側區塊 59: right block
61:第一交界接點 61: The first junction
62:第二交界接點 62: second junction
63:第一交界探針 63: The first junction probe
64:第二交界探針 64: second junction probe
A1:分界軸線 A1: Demarcation axis
A2:水平軸線 A2: Horizontal axis
D1:點觸方向 D1: Touch direction
D2:延伸方向 D2: Extension direction
d:垂直距離 d: vertical distance
L1~L3:第一~第三行 L1~L3: first to third line
L4:分界軸線 L4: Demarcation axis
L5:第一分界線 L5: First dividing line
L6:第二分界線 L6: Second dividing line
P1~P5:第一~第五針層 P1~P5: the first to fifth needle layers
圖1為一具有傾斜導電接點之待測單元、一探針及一探針座之頂視示意圖。 Figure 1 is a schematic top view of a unit under test with inclined conductive contacts, a probe and a probe holder.
圖2為本發明一第一較佳實施例所提供之探針模組、一第一待測單元及一第二待測單元之頂視示意圖,惟未顯示出該探針模組之第三探針。 2 is a schematic top view of a probe module, a first unit under test, and a second unit under test provided by a first preferred embodiment of the present invention, but the third of the probe module is not shown Probe.
圖3概為圖2之右視圖,惟其中更顯示出該探針模組之第三探針以及一電路板。 Fig. 3 is the right side view of Fig. 2, but it also shows the third probe of the probe module and a circuit board.
圖4係類同於圖2,惟其中顯示之探針僅為一部份之第三探針。 Fig. 4 is similar to Fig. 2, except that the probe shown therein is only a part of the third probe.
圖5係類同於圖4,惟其中顯示之探針僅為另一部份之第三探針。 Fig. 5 is similar to Fig. 4, except that the probe shown therein is only another part of the third probe.
圖6係類同於圖5,惟其中顯示之探針僅為又一部份之第三探針。 Figure 6 is similar to Figure 5, except that the probe shown therein is only another part of the third probe.
圖7係類同於圖2,惟圖7中探針之固定部與外露部呈一直線。 Fig. 7 is similar to Fig. 2, except that the fixed part and the exposed part of the probe in Fig. 7 are in a straight line.
圖8概為本發明一第二較佳實施例所提供之探針模組以及第一至第四待測單元之頂視示意圖,惟其中顯示之探針僅為一部份之第三探針。 8 is a schematic top view of the probe module and the first to fourth units under test provided by a second preferred embodiment of the present invention, but the probe shown in it is only a part of the third probe .
圖9概為圖8之右視圖,惟其中更顯示出該探針模組之其他探針。 Fig. 9 is the right side view of Fig. 8, but it shows other probes of the probe module.
申請人首先在此說明,在以下將要介紹之實施例以及圖式中,相同之參考號碼,表示相同或類似之元件或其結構特徵。需注意的是,圖式中的各元件及構造為例示方便並非依據真實比例及數量繪製,且若實施上為可能,不同實施例的特徵係可以交互應用。 The applicant first explains here that in the following embodiments and drawings, the same reference numbers indicate the same or similar elements or structural features. It should be noted that the various elements and structures in the drawings are for illustrative purposes and are not drawn based on actual proportions and quantities, and if possible in implementation, the features of different embodiments can be applied interactively.
請參閱圖2至圖6,本發明一第一較佳實施例所提供之探針模組20主要包含有一第一探針座21、一第二探針座22,以及複數探針30a~e。
2-6, the
各該探針30a~e係由導電材料(例如金屬)製成之直線針藉由機械加工彎曲而成,如圖3所示,各該探針30a~e包含有一懸臂段31及一點觸段32,該懸臂段31具有一與該第一探針座21或第二探針座22固接之固定部311,以及一連接於該固定部311且自該第一探針座21之一內側面211或第二探針座22之一內側面221延伸而出之外露部312。如圖2及4~6所示,部分之探針30a~e的懸臂段31未經彎折而使其固定部311與外露部312呈一直線,而另一部分之探針30a~e的懸臂段31則經由彎折而使其固定部311與外露部312非呈一直線。如圖3所示,各該探針30a~e之點觸段32係自外露部312末端向下延伸。
Each of the
該第一探針座21及該第二探針座22係由絕緣材料(例如黑膠)製成,該第一、二探針座21、22係以其內側面211、221相面對地設置,且通常係固定於一電路板40之底面41(如圖3所示),使得該電路板40、該第一、二探針座21、22以及該等探針30a~e結合成一探針卡。
The
在本發明之實施例中,各該探針30a~e之固定部311係位於第一或第二探針座21、22內,其固定方式係利用黑膠同時將同一針層(詳述於下文)之探針設置於探針座上的預定位置,再將黑膠烤乾而使探針固定於探針座上。然而,各該探針30a~e之固定部311亦可藉由黏膠固定於第一或第二探針座21、22之外表面。各該探針30a~e可更具有一自該第一探針座21之一外側面212或第二探針座22之一外側面222延伸而出之連接段(圖中未示),以藉由該連接段電性連接於該電路板40底面41的導電接點(圖中未示)。
In the embodiment of the present invention, the fixing
詳而言之,本實施例中的傾斜探針30a~e(外露部312呈傾斜者)之固定部311包含有一與外露部312連接的內側區段311a,以及一自內側區段311a延伸至探針座外側面而與前述之連接段連接之外側區段311b,該內側區段311a係與外露部312成一直線而呈傾斜,該外側區段311b則與前述之連接段成一直線且垂直於探針座之內、外側面(亦即平行於未傾斜之探針),如此之探針形成傾斜之方式,係先根據所對應之導電接點的延伸方向D2(詳述於下文)將直線針擺放於探針座上並以黑膠固定其固定部311之內側區段311a,以將探針之外露部312固定於所需之角度(亦即平行於對應之導電接點的延伸方向D2),此時探針已固定於探針座上,再彎折其固定部311而使其外側區段311b連同該連接段垂直於探針座之內、外側面,然後再以黑膠固定外側區段311b,如此之方式可利於彎折作業之進行,並可使探針之彎折角度固定良好而不易回彈。
In detail, the fixing
本發明之探針模組係用以進行多待測單元之檢測,亦即同時檢測複數待測單元,例如,本實施例之探針模組20係用以同時檢測一第一待測單元50A及一第二待測單元50B。本發明之實施例中的待測單元係與先前技術中所述之待測單元10(如圖1所示)相同,惟為了更明確地描述本發明之特徵,
在實施例中以不同的描述方式搭配與圖1中不同的元件標號而更進一步地說明該待測單元。
The probe module of the present invention is used to detect multiple units to be tested, that is, to detect a plurality of units to be tested at the same time. For example, the
如圖2及圖3所示,各該待測單元50A、50B之一上表面56具有朝向相反方向之第一、二主邊緣51、52(通常為長邊)、連接第一、二主邊緣51、52且朝向相反方向之第一、二側邊緣53、54(通常為短邊),以及複數導電接點55a~d,該第一待測單元50A之第二側邊緣54係與該第二待測單元50B之第一側邊緣53相鄰。當該探針模組20檢測該等待測單元50A、50B時,該第一、二探針座21、22係分別位於待測單元50A、50B之第一主邊緣51外側上方及第二主邊緣52外側上方,換言之,各該待測單元50A、50B之第一主邊緣51係較第二主邊緣52更靠近該第一探針座21,各該待測單元50A、50B之第二主邊緣52係較第一主邊緣51更靠近該第二探針座22,該探針模組20係整體(連同前述之電路板40)向下移動進而以該等探針30a~e點觸該等導電接點55a~d。
As shown in FIGS. 2 and 3, an
在此須先說明的是,本發明係將探針30a~e之點觸方向D1(如圖3所示)定義為向下,並以此為基準描述其他特徵之方向性(例如上、下、頂、底等用語),例如,前述各該待測單元50A、50B設有導電接點55a~d之該上表面56即為面向該點觸方向D1之相反方向的表面,前述該電路板40固設第一、二探針座21、22之該底面41即為面向該點觸方向D1之表面。然而,前述之方向性只是描述各特徵是趨於該點觸方向D1(例如向下)或該點觸方向D1之相反方向(例如向上),而非毫無誤差地符合該點觸方向D1或該點觸方向D1之相反方向,例如,前述各該探針30a~e之點觸段32係自外露部312末端向下延伸,其意思可包含該點觸段32係朝該點觸方向D1延伸,或者,該點觸段32係如圖3所示地趨於該點觸方向D1地相對該點觸方向D1呈傾斜。
It should be noted here that the present invention defines the touch direction D1 of the
在各該待測單元50A、50B中,各該導電接點55a~d具有一朝向該第一主邊緣51之第一端551以及一朝向該第二主邊緣52之第二端552,為簡化圖式,僅在圖4中的三導電接點上標示出其第一端551及第二端552,各該導電接點55a~d能定義出一自其第二端552往第一端551之延伸方向D2。如圖2所示,在本實施例中,各該待測單元50A、50B能定義出一分界軸線A1,各該待測單元50A、50B之分界軸線A1與第一側邊緣53之間的導電接點55a~d之延伸方向D2係平行於該分界軸線A1(例如位於圖4所標示之中間區塊57的導電接點)或朝該第一側邊緣53靠近地相對於該分界軸線A1呈傾斜(例如位於圖4所標示之左側區塊58的導電接點),各該待測單元50A、50B之分界軸線A1與第二側邊緣54之間的導電接點55a~d之延伸方向D2係平行於該分界軸線A1(例如位於圖4所標示之中間區塊57的導電接點)或朝該第二側邊緣54靠近地相對於該分界軸線A1呈傾斜(例如位於圖4所標示之右側區塊59的導電接點)。更明確地說,在該分界軸線A1附近的導電接點55a~d(位於中間區塊57者)之延伸方向D2係平行於該分界軸線A1,距離該分界軸線A1越遠的導電接點55a~d,其相對於該分界軸線A1傾斜的程度越大。
In each of the units under
如圖2及圖4至圖6所示,在各該待測單元50A、50B中,該等導電接點55a~d係區分為鄰近於第一主邊緣51的第一導電接點55a,以及鄰近於第二主邊緣52的第二導電接點55b~d,其中,第二導電接點55b係平行於一水平軸線A2地沿該第二主邊緣52排成一第一行L1(如圖4所示),第二導電接點55c係平行於該水平軸線A2地排成一緊鄰該第一行L1之第二行L2(如圖5所示),第二導電接點55d係平行於該水平軸線A2地排成一緊鄰該第二行L2之第三行L3(如圖6所示),該第一至第三行L1~L3係依序自該第二主邊緣52朝該第一主邊緣51之方向排列。如圖2所示,各該待測單元50A、50B之第一導電接點55a係平行於該水平軸線A2地沿該第一主邊緣51排成一行,該第一待測單
元50A之第一導電接點55a中包含一鄰近該第一待測單元50A之第二側邊緣54的第一交界接點61,該第二待測單元50B之第一導電接點55a中包含一鄰近該第二待測單元50B之第一側邊緣53的第二交界接點62。
As shown in FIGS. 2 and 4 to 6, in each of the units under
該探針模組20之探針30a~e係區分為設置於第一探針座21之左半部的第一探針30a(如圖2所示)、設置於第一探針座21之右半部的第二探針30b(如圖2所示),以及設置於第二探針座22之第三探針30c~e(如圖4至圖6所示),該等第一探針30a係分別用以點觸該第一待測單元50A之第一導電接點55a,該等第二探針30b係分別用以點觸該第二待測單元50B之第一導電接點55a,該等第三探針30c~e係分別用以點觸該等第二導電接點55b~d。
The
如圖2及圖3所示,該等第一探針30a係以對應該第一待測單元50A之第一導電接點55a的排列方式排成一行而在該第一探針座21形成一第一針層P1,該等第二探針30b係以對應該第二待測單元50B之第一導電接點55a的排列方式排成一行而在該第一探針座21形成一高度低於該第一針層P1之第二針層P2。如圖3及圖4所示,該等第三探針30c係以對應該等第二導電接點55b之排列方式排成一行而在該第二探針座22形成一第三針層P3。如圖3及圖5所示,該等第三探針30d係以對應該等第二導電接點55c之排列方式排成一行而在該第二探針座22形成一高度高於該第三針層P3之第四針層P4。如圖3及圖6所示,該等第三探針30e係以對應該等第二導電接點55d之排列方式排成一行而在該第二探針座22形成一高度高於該第四針層P4之第五針層P5。
As shown in FIGS. 2 and 3, the
換言之,該等第三探針30c~e係排成三行(與第二導電接點55b~d行數相同),其順序係由下而上地對應第二導電接點55b~d之第一至第三行L1~L3的順序,位置越高之針層的第三探針係用以點觸距離該第二探針座22越遠的導電接點,且位置越高之針層的第三探針之懸臂段越長。而該等第一、二探針30a、30b在如圖2所示之頂視圖中看起來是排成一行,但實際上是
如圖3所示地在不同高度排成兩行,惟此兩行第一、二探針30a、30b係延伸至排成同一行之第一導電接點55a,因此該等第一、二探針30a、30b之點觸段32末端與該第一探針座21內側面211的垂直距離d係相同。
In other words, the
當該探針模組20檢測該等待測單元50A、50B時,該等第一探針30a係以其懸臂段31經過第一待測單元50A之第一主邊緣51上方而分別延伸至該第一待測單元50A之第一導電接點55a上方(如圖2所示)進而以其點觸段分別點觸該第一待測單元50A之第一導電接點55a,該等第二探針30b係以其懸臂段31經過第二待測單元50B之第一主邊緣51上方而分別延伸至該第二待測單元50B之第一導電接點55a上方(如圖2所示)進而以其點觸段分別點觸該第一待測單元50B之第一導電接點55a,該等第三探針30c係以其懸臂段31經過該等待測單元50A、50B之第二主邊緣52上方而延伸至該等第二導電接點55b上方(如圖4所示)進而以其點觸段32點觸該等第二導電接點55b,該等第三探針30d係以其懸臂段31經過該等待測單元50A、50B之第二主邊緣52上方而延伸至該等第二導電接點55c上方(如圖5所示)進而以其點觸段32點觸該等第二導電接點55c,該等第三探針30e係以其懸臂段31經過該等待測單元50A、50B之第二主邊緣52上方而延伸至該等第二導電接點55d上方(如圖6所示)進而以其點觸段32點觸該等第二導電接點55d。
When the
在本實施例中,各該探針30a~e之外露部312自探針座21、22延伸而出之方向係對應其所屬探針30a~e將點觸之導電接點55a~d的延伸方向D2,此處所稱「對應」,係指外露部312自探針座21、22延伸而出之方向不一定要與對應之導電接點55a~d的延伸方向D2相同或相反,而是從上往下看時(亦即圖2及4~6之方向),外露部312係概與其對應之導電接點55a~d的延伸方向D2平行,如此可避免探針30a~e之點觸段32在進行點觸時偏離至對應的導
電接點55a~d之外而產生點觸不確實之問題。換言之,該等探針30a~e之外露部312的傾斜角度配置係類同於該等導電接點55a~d之傾斜角度配置。
In this embodiment, the direction in which the exposed
詳而言之,該第二探針座22能定義出垂直於其內側面221之一分界軸線L4,以及分別位於該分界軸線L4之一第一側(左側)及一第二側(右側)之一第一分界線L5(與第一待測單元50A之分界軸線A1重合)及一第二分界線L6(與第二待測單元50B之分界軸線A1重合),對於設置在第二探針座22之左半部的探針,其外露部312自內側面221延伸而出之方向係平行於該第一分界線L5(例如對應圖4所標示之中間區塊57的探針)或遠離該第一分界線L5地相對於該第一分界線L5呈傾斜(例如對應圖4所標示之左、右側區塊58、59的探針);對於設置在第二探針座22之右半部的探針,其外露部312自內側面221延伸而出之方向係平行於該第二分界線L6(例如對應圖4所標示之中間區塊57的探針)或遠離該第二分界線L6地相對於該第二分界線L6呈傾斜(例如對應圖4所標示之左、右側區塊58、59的探針)。對於該第一探針座21,該第一針層P1能定義出一垂直於該第一探針座21之內側面211的第一分界線(與第二探針座22之第一分界線L5重合),該等第一探針30a之外露部312自該內側面211延伸而出之方向係平行於該第一分界線L5(例如對應圖4所標示之中間區塊57的探針)或朝該第一分界線L5靠近地相對於該第一分界線L5呈傾斜(例如對應圖4所標示之左、右側區塊58、59的探針);該第二針層P2能定義出一垂直於該第一探針座21之內側面211的第二分界線(與第二探針座22之第二分界線L6重合),該等第二探針30b之外露部312自該內側面211延伸而出之方向係平行於該第二分界線L6(例如對應圖4所標示之中間區塊57的探針)或朝該第二分界線L6靠近地相對於該第二分界線L6呈傾斜(例如對應圖4所標示之左、右側區塊58、59的探針)。
In detail, the
藉由本發明之探針模組的探針配置,可在將如此繁多之探針以適當間距配置於探針座的前提下,仍可達到前述之確保探針點觸確實之功效。此外,在本實施例中,該等探針30a~e之固定部311的外側區段311b係相互平行,如此係較方便於將探針配置於探針座;然而,藉由本發明之探針模組的探針配置,亦可便於將固定部311與外露部312呈一直線之探針(例如圖7所示之探針30a)配置於探針座,如此更可簡化探針之彎折加工程序。
With the probe configuration of the probe module of the present invention, under the premise that so many probes are arranged in the probe holder at an appropriate interval, the aforementioned effect of ensuring the touch of the probe can still be achieved. In addition, in this embodiment, the
更重要的是,如圖2所示,雖然該第一交界接點61之延伸方向D2係朝該第一待測單元50A之第二側邊緣54靠近地呈相當程度之傾斜,該第二交界接點62之延伸方向D2亦朝該第二待測單元50B之第一側邊緣53靠近地呈相當程度之傾斜,但本發明之探針模組20係藉由第一針層P1最右邊之第一探針30a點觸第一交界接點61,並藉由第二針層P2最左邊之第二探針30b點觸第二交界接點62,而第一針層P1與第二針層P2位於不同高度,因此,即使用以點觸第一、二交界接點61、62之第一、二探針30a、30b(分別定義為第一、二交界探針63、64)的外露部312自第一探針座21延伸而出之方向係配合第一、二交界接點61、62之延伸方向D2,第一、二交界探針63、64因位於不同高度而可避免相互干涉。
More importantly, as shown in FIG. 2, although the extension direction D2 of the
由圖2可得知,若第一、二交界探針63、64係設置於同一高度,其固定部311或甚至外露部312都會有彼此過於靠近之問題,甚至,在第一、二交界接點61、62之傾斜角度比本實施例所提供者更大的情況下,為了使第一、二交界探針63、64之外露部312的傾斜角度對應第一、二交界接點61、62之傾斜角度,第一交界探針63之固定部311需設置得更右邊,而第二交界探針64之固定部311需設置得更左邊,如此一來,第一、二交界探針63、64之固定部311或甚至外露部312都可能有相互干涉之問題,本發明之第一、二交界探針63、64因位於不同高度而可避免前述問題。可想而知,在該第一待測單元
50A之第一側邊緣53及第二待測單元50B之第二側邊緣54亦與其他待測單元相鄰的情況下(亦即有四個並排之待測單元),最左邊的第一探針30a及最右邊的第二探針30b亦可發揮前述之功效。
It can be seen from Figure 2 that if the first and second junction probes 63 and 64 are set at the same height, the
在本實施例中,由於第一探針30a皆與第二探針30b位於不同高度,因此,不論第一導電接點55a的傾斜角度多大,第一、二探針30a、30b的傾斜角度皆可對應其點觸之第一導電接點55a的傾斜角度,而不會產生干涉問題。然而,本發明之探針模組並不限於該等第一探針30a都位於同一高度,亦不限於該等第二探針30b都位於同一高度,只要最右邊之一或數個第一探針30a與最左邊之一或數個第二探針30b位於不同高度,即可避免探針干涉問題,亦即,第一探針30a中可包含一或數個第一交界探針63,第二探針30b中可包含一或數個第二交界探針64,只要第一交界探針63與第二交界探針64位於不同高度(不同針層)即可避免相互干涉,其餘之第一探針30a及第二探針30b的高度則無限制,例如,該等第一探針30a及第二探針30b中可僅第一交界探針63位於較高之第一針層P1,其餘之第一探針30a及第二探針30b皆位於較低之第二針層P2,而第一、二交界探針63、64之數量則取決於鄰近第一、二待測單元50A、50B之相鄰側邊緣的第一導電接點55a之傾斜角度。詳而言之,對於本實施例之第一、二待測單元50A、50B而言,各待測單元50A、50B之最靠近其相鄰側邊緣的一個第一導電接點55a會使對應之同高度的探針有過於靠近的問題,因此第一、二交界接點61、62僅各有一個,第一、二交界探針63、64則對應地僅各有一個,只要此二探針位於不同高度即可避免探針干涉問題。在鄰近待測單元50A、50B之相鄰側邊緣的第一導電接點55a傾斜角度更大的情況下,第一、二交界接點61、62(亦即可能使同高度之探針過於靠近或干涉之導電接點)的數量則會設定得更多,第一、二交界探針63、64的數量亦隨之增加。
In this embodiment, since the
請參閱圖8及圖9,本發明一第二較佳實施例所提供之探針模組20’係用以同時檢測呈矩陣排列之第一至第四待測單元50A~D,其中,針對圖8中左下及右下之第一、二待測單元50A、50B,該探針模組20’係採用如同第一較佳實施例之探針模組20的探針配置,為簡化圖式,圖8中未顯示此部分之探針。而對於圖8中左上及右上之第三、四待測單元50C、50D,由於該第三待測單元50C之第一主邊緣51係與該第一待測單元50A之第二主邊緣52相鄰,該第四待測單元50D之第一主邊緣51係與該第二待測單元50B之第二主邊緣52相鄰,第三、四待測單元50C、50D之導電接點55a~d全部都較第一、二待測單元50A、50B之第一導電接點55a更靠近第二探針座22,因此,第三、四待測單元50C、50D之導電接點55a~d可全部皆由設置於該第二探針座22之第三探針30f~i點觸,亦即可在第二探針座22增設四行第三探針30f~i,如圖9所示,該四行第三探針30f~i係位於用以點觸第一、二待測單元50A、50B之第三探針30c~e下方,且依由上而下之順序係分別用以點觸第三、四待測單元50C、50D之第一導電接點55a以及第二導電接點55b~d之第三至第一行L3~L1。為了簡化圖式,圖8中僅顯示用以點觸第三、四待測單元50C、50D之第一導電接點55a的第三探針30f。
Please refer to FIGS. 8 and 9, the probe module 20' provided by a second preferred embodiment of the present invention is used to simultaneously detect the first to fourth units under
最後,必須再次說明,本發明於前揭實施例中所揭露的構成元件,僅為舉例說明,並非用來限制本案之範圍,其他等效元件的替代或變化,亦應為本案之申請專利範圍所涵蓋。 Finally, it must be explained again that the constituent elements disclosed in the previously disclosed embodiments of the present invention are merely examples and are not intended to limit the scope of the case. Alternatives or changes to other equivalent elements should also be the scope of the patent application for this case. Covered.
20:探針模組 20: Probe module
21:(第一)探針座 21: (first) probe holder
211:內側面 211: inside
212:外側面 212: outer side
22:(第二)探針座 22: (second) probe holder
221:內側面 221: inside
222:外側面 222: outer side
30a:(第一)探針 30a: (first) probe
30b:(第二)探針 30b: (second) probe
30c~e:(第三)探針 30c~e: (third) probe
31:懸臂段 31: Cantilever section
311:固定部 311: Fixed part
312:外露部 312: Exposed
32:點觸段 32: Touch segment
40:電路板 40: circuit board
41:底面 41: Bottom
50A、50B:第一、二待測單元 50A, 50B: the first and second units to be tested
56:上表面 56: upper surface
D1:點觸方向 D1: Touch direction
d:垂直距離 d: vertical distance
P1~P5:第一~第五針層 P1~P5: the first to fifth needle layers
Claims (21)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108125850A TWI704355B (en) | 2019-07-22 | 2019-07-22 | Suitable for probe modules with multiple units to be tested with inclined conductive contacts |
| CN202010336493.1A CN112285394B (en) | 2019-07-22 | 2020-04-26 | Probe module for multiple UUTs with tilted conductive contacts |
| KR1020200051307A KR102292880B1 (en) | 2019-07-22 | 2020-04-28 | Probing Module Adapted for Testing Multi-units Having Inclined Conductive Contacts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108125850A TWI704355B (en) | 2019-07-22 | 2019-07-22 | Suitable for probe modules with multiple units to be tested with inclined conductive contacts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI704355B true TWI704355B (en) | 2020-09-11 |
| TW202104904A TW202104904A (en) | 2021-02-01 |
Family
ID=73644172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108125850A TWI704355B (en) | 2019-07-22 | 2019-07-22 | Suitable for probe modules with multiple units to be tested with inclined conductive contacts |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102292880B1 (en) |
| CN (1) | CN112285394B (en) |
| TW (1) | TWI704355B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102854722B1 (en) * | 2024-01-30 | 2025-09-02 | 경북대학교 산학협력단 | Scrub prevention type MIMS pin for semiconductor device inspection |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1178320B1 (en) * | 2000-08-04 | 2005-04-20 | Technoprobe S.r.l | Testing head having cantilever probes |
| TWM457875U (en) * | 2013-01-21 | 2013-07-21 | Mpi Corp | Cantilever probe card |
| WO2014082742A1 (en) * | 2012-11-28 | 2014-06-05 | Technoprobe S.P.A. | Cantilever contact probe for a testing head |
| TW201441629A (en) * | 2013-04-26 | 2014-11-01 | Mpi Corp | Probe needle module |
| TWI612312B (en) * | 2017-05-03 | 2018-01-21 | 創意電子股份有限公司 | Probe card system, probe loader device and manufacturing method of the probe loader device |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6471538B2 (en) * | 1998-11-30 | 2002-10-29 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
| KR100823879B1 (en) * | 2001-12-05 | 2008-04-21 | 주식회사 파이컴 | Manufacturing method of probe card |
| CA2570886A1 (en) * | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| DE102005005752A1 (en) * | 2005-02-07 | 2006-08-31 | Bourns, Inc., Riverside | potentiometer |
| JP2008082912A (en) * | 2006-09-28 | 2008-04-10 | Micronics Japan Co Ltd | Electrical connection device |
| JP2008216206A (en) * | 2007-03-07 | 2008-09-18 | Tokyo Cathode Laboratory Co Ltd | Contactor, probe card, and method of manufacturing probe card |
| CN101308163A (en) * | 2007-05-15 | 2008-11-19 | 旺矽科技股份有限公司 | Probe card with electrical shielding structure |
| CN101881787A (en) * | 2009-05-07 | 2010-11-10 | 旺矽科技股份有限公司 | Multi-chip test probe device |
| JP5788767B2 (en) * | 2011-11-07 | 2015-10-07 | 株式会社日本マイクロニクス | Probe block, probe card including the same, and probe device |
| JP2013130400A (en) * | 2011-12-20 | 2013-07-04 | Micronics Japan Co Ltd | Probe assembly, probe card including the same and manufacturing method thereof |
| CN103185819B (en) * | 2011-12-27 | 2016-08-17 | 联咏科技股份有限公司 | Probe card and manufacturing method thereof |
| KR101544845B1 (en) * | 2013-06-07 | 2015-08-18 | 주식회사 에이엠에스티 | Method for making of probe and one body type probe |
| JP6357002B2 (en) * | 2014-04-16 | 2018-07-11 | 株式会社日本マイクロニクス | Probes and probe cards |
| TWI564568B (en) * | 2015-03-26 | 2017-01-01 | Use a coaxial pin with a cantilever probe card | |
| CN108802443B (en) * | 2017-05-03 | 2021-03-12 | 创意电子股份有限公司 | Probe card system, probe carrier device and method for manufacturing probe carrier device |
-
2019
- 2019-07-22 TW TW108125850A patent/TWI704355B/en active
-
2020
- 2020-04-26 CN CN202010336493.1A patent/CN112285394B/en active Active
- 2020-04-28 KR KR1020200051307A patent/KR102292880B1/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1178320B1 (en) * | 2000-08-04 | 2005-04-20 | Technoprobe S.r.l | Testing head having cantilever probes |
| WO2014082742A1 (en) * | 2012-11-28 | 2014-06-05 | Technoprobe S.P.A. | Cantilever contact probe for a testing head |
| TWM457875U (en) * | 2013-01-21 | 2013-07-21 | Mpi Corp | Cantilever probe card |
| TW201441629A (en) * | 2013-04-26 | 2014-11-01 | Mpi Corp | Probe needle module |
| TWI612312B (en) * | 2017-05-03 | 2018-01-21 | 創意電子股份有限公司 | Probe card system, probe loader device and manufacturing method of the probe loader device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112285394B (en) | 2024-12-24 |
| CN112285394A (en) | 2021-01-29 |
| KR20210011871A (en) | 2021-02-02 |
| TW202104904A (en) | 2021-02-01 |
| KR102292880B1 (en) | 2021-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102725646B (en) | Loading printed circuit board test fixture and method of manufacturing the same | |
| TWI620938B (en) | Probe device | |
| TW201339604A (en) | High-precision semiconductor device probing apparatus and system thereof | |
| TWI435400B (en) | Probe method and probe program | |
| TWI681195B (en) | Probe card device and impedance adjustable probe thereof | |
| TWI704355B (en) | Suitable for probe modules with multiple units to be tested with inclined conductive contacts | |
| CN203720216U (en) | Probe module | |
| CN103197227A (en) | Wafer testing method used for design analysis purpose | |
| TWI704357B (en) | Suitable for probe modules with multiple units to be tested with inclined conductive contacts | |
| CN206096201U (en) | System for semiconductor wafer test, tangent probe card and probe assembly thereof | |
| US6292005B1 (en) | Probe card for IC testing apparatus | |
| TWI704358B (en) | Suitable for probe modules with multiple units to be tested with inclined conductive contacts | |
| TW200413740A (en) | Adapter for testing one or more conductor assemblies | |
| CN111141938B (en) | Probe module for multiple units under test with inclined conductive contacts | |
| CN101881787A (en) | Multi-chip test probe device | |
| JP3245917U (en) | Probe module applicable to a measurement target unit with inclined conductive contacts, measurement target unit, and its measurement system | |
| KR102257740B1 (en) | Insulation film for test socket and test socket having the same | |
| TW202424496A (en) | Probe module and test method for unit under test with inclined conductive contacts, and unit under test, and test system conducive to providing a fixing device to effectively fix the probe during the installation process of the probe | |
| TWM457875U (en) | Cantilever probe card | |
| CN118169440A (en) | Probe module and test method as well as unit under test and test system | |
| CN217360012U (en) | Probe card for high-density wafer test | |
| CN201548623U (en) | Testing device for display panel driving chip | |
| TW201042265A (en) | Flat head probe test socket | |
| JP5055149B2 (en) | Electrical connection device | |
| TWI520290B (en) | Package substrate and testing method therefor |