TWI704016B - Ink coating device and ink coating method - Google Patents
Ink coating device and ink coating method Download PDFInfo
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- TWI704016B TWI704016B TW108113693A TW108113693A TWI704016B TW I704016 B TWI704016 B TW I704016B TW 108113693 A TW108113693 A TW 108113693A TW 108113693 A TW108113693 A TW 108113693A TW I704016 B TWI704016 B TW I704016B
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- 238000000576 coating method Methods 0.000 title claims abstract description 75
- 239000011248 coating agent Substances 0.000 title claims abstract description 66
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000004904 shortening Methods 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 190
- 238000010586 diagram Methods 0.000 description 25
- 239000010408 film Substances 0.000 description 15
- 238000009792 diffusion process Methods 0.000 description 13
- 238000009826 distribution Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000003892 spreading Methods 0.000 description 4
- 230000007480 spreading Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Ink Jet (AREA)
Abstract
本發明提供一種能夠縮短油墨塗佈時的處理時間之油墨塗佈裝置。移動機構使塗佈對象物和噴墨頭中的一個相對於另一個移動,以使對塗佈對象物的油墨的滴落點在塗佈對象物的表面上移動。控制裝置控制噴墨頭及移動機構。使塗佈對象物和噴墨頭中的一個相對於另一個移動的同時,使油墨滴落在沿著待塗佈之區域的邊緣之邊緣區域而在邊緣區域形成由油墨組成之邊緣部。此外,形成邊緣部之後,使塗佈對象物和噴墨頭中的一個相對於另一個以比形成邊緣部時的移動速度快的移動速度移動的同時,將油墨塗佈於被邊緣部包圍之內部區域。The present invention provides an ink coating device capable of shortening the processing time during ink coating. The moving mechanism moves one of the coating object and the inkjet head relative to the other so that the drop point of the ink on the coating object moves on the surface of the coating object. The control device controls the inkjet head and the moving mechanism. While moving one of the coating object and the inkjet head relative to the other, the ink drops on the edge area along the edge of the area to be coated to form an edge portion composed of ink in the edge area. In addition, after the edge portion is formed, one of the coating object and the inkjet head is moved relative to the other at a moving speed faster than the moving speed when the edge portion is formed, and the ink is applied to the edge surrounded by the edge portion. Internal area.
Description
本發明係關於一種油墨塗佈裝置及油墨塗佈方法。The invention relates to an ink coating device and an ink coating method.
在印刷基板製造時的蝕刻用遮罩所使用之抗蝕劑圖案的形成、印刷基板的阻焊劑的形成等中使用噴墨頭之油墨塗佈技術備受矚目。在下述專利文獻1中,揭示有如下方法:將待形成薄膜之區域分為實體區域和邊緣區域,使實體區域的像素稀疏而提取油墨的滴落點。藉此,實體區域內的滴落點的分佈密度降低,但藉由增大液滴的體積能夠將實體區域的膜設為所期望的厚度。
(先前技術文獻)
(專利文獻)The ink coating technology using inkjet heads is attracting attention in the formation of the resist pattern used in the etching mask during the manufacture of the printed circuit board and the formation of the solder resist of the printed circuit board. In the following
專利文獻1:國際公開第2013/11775號Patent Document 1: International Publication No. 2013/11775
(本發明所欲解決之課題)(Problems to be solved by the present invention)
使實體區域的像素稀疏而提取油墨的滴落點之方法中,構成圖像資料之像素的個數並不會減少。因此,若著眼於所有噴嘴孔而不是噴墨頭的一個噴嘴孔,則控制噴墨頭之吐出頻率並不會降低。因此,難以加快掃描速度。In the method of thinning the pixels in the solid area and extracting the ink drop points, the number of pixels constituting the image data will not decrease. Therefore, if you focus on all nozzle holes instead of one nozzle hole of the inkjet head, controlling the discharge frequency of the inkjet head will not decrease. Therefore, it is difficult to increase the scanning speed.
本發明的目的在於提供一種能夠縮短油墨塗佈的處理時間之油墨塗佈裝置及油墨塗佈方法。 (用以解決課題之手段)The object of the present invention is to provide an ink coating device and an ink coating method that can shorten the processing time of ink coating. (Means to solve the problem)
依本發明的一觀點,提供一種油墨塗佈裝置,其具有: 噴墨頭,朝向支承於工作台之塗佈對象物吐出油墨; 移動機構,使前述塗佈對象物和前述噴墨頭中的一個相對於另一個移動,以使對前述塗佈對象物的油墨的滴落點在前述塗佈對象物的表面上移動;及 控制裝置,控制前述噴墨頭及前述移動機構, 前述控制裝置控制前述噴墨頭及前述移動機構, 使前述塗佈對象物和前述噴墨頭中的一個相對於另一個移動的同時,使油墨滴落於沿著待塗佈之區域的邊緣之邊緣區域而在前述邊緣區域形成由油墨組成之邊緣部, 形成前述邊緣部之後,使前述塗佈對象物和前述噴墨頭中的一個相對於另一個以比形成前述邊緣部時的移動速度快的移動速度移動的同時,將油墨塗佈於被前述邊緣部包圍之內部區域。According to an aspect of the present invention, an ink coating device is provided, which has: The inkjet head ejects ink toward the coating object supported on the worktable; A moving mechanism for moving one of the coating object and the inkjet head relative to the other, so that the ink drop point on the coating object moves on the surface of the coating object; and The control device controls the inkjet head and the moving mechanism, The aforementioned control device controls the aforementioned inkjet head and the aforementioned moving mechanism, While moving one of the coating object and the inkjet head relative to the other, the ink is dropped on the edge area along the edge of the area to be coated to form an edge composed of ink in the edge area unit, After the edge portion is formed, one of the coating object and the inkjet head is moved relative to the other at a moving speed faster than the moving speed when the edge portion is formed, and the ink is applied to the edge. The internal area enclosed by the Ministry.
依本發明的另一觀點,提供一種油墨塗佈方法, 在塗佈對象物的表面的、沿著待塗佈油墨之區域的邊緣之邊緣區域,使油墨的滴落點移動的同時,滴落油墨的液滴而形成由油墨組成之邊緣部, 形成前述邊緣部之後,在被前述邊緣部包圍之內部區域,使滴落點以比形成前述邊緣部時的滴落點的移動速度快的移動速度移動的同時,滴落油墨的液滴而將油墨塗佈於前述內部區域。According to another aspect of the present invention, an ink coating method is provided, In the edge area of the surface of the coating object along the edge of the area to be coated with the ink, the ink drop point is moved while the ink droplets are dropped to form an edge portion composed of ink, After the edge portion is formed, in the inner region surrounded by the edge portion, the drop point is moved at a moving speed faster than the movement speed of the drop point when the edge portion is formed. The ink is applied to the aforementioned inner area.
依本發明的又一觀點,提供一種油墨塗佈裝置,其具有: 噴墨頭,將油墨液滴化並朝向支承於工作台之塗佈對象物吐出; 移動機構,使前述塗佈對象物和前述噴墨頭中的一個相對於另一個移動,以使對前述塗佈對象物的油墨的滴落點在前述塗佈對象物的表面上移動;及 控制裝置,控制前述噴墨頭及前述移動機構, 前述控制裝置控制前述噴墨頭及前述移動機構, 使前述塗佈對象物和前述噴墨頭中的一個相對於另一個移動的同時,使油墨滴落於沿著待塗佈油墨之區域之邊緣的邊緣區域的複數個滴落點而形成由油墨組成之邊緣部, 形成前述邊緣部之後,使前述塗佈對象物和前述噴墨頭中的一個相對於另一個移動的同時,使油墨滴落於被前述邊緣部包圍之內部區域的複數個滴落點而將油墨塗佈於前述內部區域, 沿著與前述塗佈對象物和前述噴墨頭的相對移動方向平行之第1方向及與前述第1方向正交之第2方向週期性地配置前述邊緣區域的複數個滴落點,並且以比前述邊緣區域的滴落點的間距寬的間距,沿前述第1方向及前述第2方向週期性地配置作為整體的前述內部區域的複數個滴落點。According to another aspect of the present invention, an ink coating device is provided, which has: The inkjet head transforms ink droplets and ejects them toward the coating object supported on the worktable; A moving mechanism for moving one of the coating object and the inkjet head relative to the other, so that the ink drop point on the coating object moves on the surface of the coating object; and The control device controls the inkjet head and the moving mechanism, The aforementioned control device controls the aforementioned inkjet head and the aforementioned moving mechanism, While moving one of the object to be coated and the inkjet head relative to the other, the ink is dropped on a plurality of drop points along the edge of the area where the ink is to be applied. The edge of the composition, After forming the edge portion, while moving one of the coating object and the inkjet head relative to the other, the ink is dropped on a plurality of drop points in the inner region surrounded by the edge portion to remove the ink Coated on the aforementioned internal area, A plurality of dripping points of the edge region are periodically arranged along a first direction parallel to the relative movement direction of the coating target and the inkjet head and a second direction orthogonal to the first direction, and With a pitch wider than the pitch of the dripping points of the edge region, a plurality of dripping points of the inner region as a whole are periodically arranged in the first direction and the second direction.
依本發明的又一觀點,提供一種油墨塗佈方法, 在塗佈對象物的表面的、沿著待塗佈油墨之區域的邊緣之邊緣區域,使油墨的滴落點移動的同時,滴落油墨的液滴而形成由油墨組成之邊緣部, 形成前述邊緣部之後,在被前述邊緣部包圍之內部區域,使油墨的滴落點移動的同時,滴落油墨的液滴而將油墨塗佈於前述內部區域, 沿著相互正交之第1方向及第2方向週期性地配置前述邊緣區域的複數個滴落點,並以比前述邊緣區域的滴落點的間距寬的間距沿前述第1方向及前述第2方向週期性地配置作為整體的前述內部區域的複數個滴落點。 (發明之效果)According to another aspect of the present invention, an ink coating method is provided, In the edge area of the surface of the coating object along the edge of the area to be coated with the ink, the ink drop point is moved while the ink droplets are dropped to form an edge portion composed of ink, After the edge portion is formed, while moving the ink drop point in the inner region surrounded by the edge portion, droplets of ink are dropped to apply the ink to the inner region, A plurality of dripping points in the edge area are periodically arranged along the first direction and the second direction orthogonal to each other, and along the first direction and the second direction at a pitch wider than the pitch of the dripping points in the edge area A plurality of dripping points of the aforementioned inner region as a whole are periodically arranged in two directions. (Effect of Invention)
為了在分開的製程中將油墨塗佈於邊緣區域和內部區域,能夠在適合於每個區域之條件下塗佈油墨。例如,能夠以相對較高的解析度將油墨塗佈於邊緣區域,並能夠以相對較快的掃描速度將油墨塗佈於內部區域。In order to apply ink to the edge area and the inner area in a separate process, the ink can be applied under conditions suitable for each area. For example, the ink can be applied to the edge area with a relatively high resolution, and the ink can be applied to the inner area with a relatively fast scanning speed.
參閱圖1A~圖3,對基於實施例之油墨塗佈裝置進行說明。
圖1A係基於實施例之油墨塗佈裝置的概要圖。支架10上經由XY載台11及θ載台12支承有工作台15。在工作台15的支承面上支承有塗佈對象物50。塗佈對象物50例如為印刷基板等基板。例如,工作台15包括真空卡盤機構,塗佈對象物50真空吸附並固定於支承面上。支承面例如相對於水平面為平行,並且朝向鉛錘上方。1A to 3, the ink coating device based on the embodiment will be described.
Fig. 1A is a schematic diagram of an ink coating device based on an embodiment. The
XY載台11使工作台15相對於支架10沿著與支承面平行且相互正交之兩個方向平移移動。θ載台12改變以相對於支承面垂直之旋轉軸為中心之工作台15的旋轉方向的姿勢。The
在工作台15的上方,藉由框架17支承有噴墨頭16。噴墨頭16的朝向工作台15之面設置有複數個噴嘴孔。循環系統18與噴墨頭16一同構成油墨的循環路徑19,並使油墨在該循環路徑19中循環。Above the table 15, an
噴墨頭16將油墨液滴化並朝向支承於工作台15之塗佈對象物50吐出。控制裝置40儲存著定義待形成之膜圖案的平面形狀之圖像資料。該圖像資料例如為複數個像素沿行方向和列方向排列之光柵掃描形式的資料。控制裝置40依據該圖像資料控制XY載台11及噴墨頭16,藉此在塗佈對象物50的上表面形成由油墨組成之膜圖案。此外,控制裝置40控制循環系統18及θ載台12。The
圖1B係基於實施例之油墨塗佈裝置的工作台15的平面圖。在工作台15的支承面上支承有塗佈對象物50。在塗佈對象物50的上方支承有噴墨頭16。在噴墨頭16的每一個朝向下方之面設置有複數個噴嘴孔20。噴墨頭16將油墨液滴化並從噴嘴孔20朝向支承於工作台15之塗佈對象物50吐出。FIG. 1B is a plan view of the
此外,在噴墨頭16的兩側(在圖1B中為上側和下側)安裝有用於使油墨硬化之硬化用光源21。例如,油墨為紫外線硬化型,硬化用光源21為發射紫外線之LED。In addition, curing
對將與工作台15的支承面平行且相互正交之兩個方向設為x方向及y方向,並將支承面的法線方向設為z方向之xyz直角座標系進行定義。複數個噴嘴孔20沿x方向以等間隔排列。控制裝置40(圖1A)使工作台15朝y方向(掃描方向)移動的同時,在依據圖像資料之時刻從噴嘴孔20吐出油墨。藉此,能夠將油墨滴落在支承於工作台15之塗佈對象物50的表面的規定位置(滴落點)。The x-direction and the y-direction are defined as the two directions parallel to and orthogonal to the support surface of the table 15 and the normal direction of the support surface is the z-direction. The plurality of
藉由圖像資料的y方向的像素間距來確定工作台15的掃描速度與從噴嘴孔20吐出油墨之時間間隔。吐出油墨之時間間隔(油墨吐出間隔)的最小值作為噴墨頭16的額定值而確定。工作台15的掃描速度藉由y方向的像素間距和噴墨頭16的油墨吐出間隔的額定值來設定。The time interval between the scanning speed of the table 15 and the ink discharge from the
x方向的像素間距依賴於噴嘴孔20的x方向的間距。所期望的像素間距比噴嘴孔20的間距窄時,將噴墨頭16沿x方向錯開像素間距而進行複數次掃描。藉此,關於x方向,能夠以圖像資料中設定之像素間距塗佈油墨。The pixel pitch in the x direction depends on the pitch in the x direction of the
圖1A中,由XY載台11構成之移動機構使塗佈對象物50相對於噴墨頭16移動,藉此使滴落點在塗佈對象物50的表面上移動。與此相反地,移動機構亦可以使噴墨頭16相對於塗佈對象物50移動,藉此使滴落點移動。亦即,使塗佈對象物50與噴墨頭16中的一個相對於另一個移動,以使滴落點在塗佈對象物50的表面上移動即可。塗佈對象物50與噴墨頭16的相對移動方向相當於掃描方向(y方向)。In FIG. 1A, the moving mechanism constituted by the
圖2A係表示待塗佈油墨之區域51之平面圖。在塗佈對象物50的表面定義待塗佈油墨之區域51。圖2A中,對待塗佈油墨之區域51施加陰影。在本實施例中,將待塗佈油墨之區域51區分為沿著邊緣之邊緣區域52和被邊緣區域52包圍之內部區域53,將油墨塗佈於邊緣區域52之後,再將油墨塗佈於內部區域53。邊緣區域52的油墨的塗佈條件與內部區域53的油墨的塗佈條件不同。Fig. 2A is a plan view showing the
圖2B係表示待塗佈油墨之區域51為長方形時的邊緣區域52的像素30的配置之圖。在圖2B所示之例子中,邊緣區域52的寬度相當於一個像素30的大小。像素30的各中心點相當於油墨的滴落點CE。滴落點CE沿x方向及y方向以等間距週期性地配置。由PEx表示邊緣區域52的滴落點CE的x方向的間距,由PEy表示y方向的間距。間距PEx與間距PEy相等。另外,亦可沿邊緣區域52的寬度方向配置複數個像素30,放大邊緣區域52的寬度。FIG. 2B is a diagram showing the arrangement of the
圖2C係表示待塗佈油墨之區域51為長方形時的內部區域53的像素31的配置之圖。內部區域53的像素31大於邊緣區域52的像素30。作為一例,內部區域53的一個像素31的大小相當於邊緣區域52的4個量的像素30的大小。像素31的各中心點相當於油墨的滴落點CI。滴落點CI沿x方向及y方向以等間距週期性地配置。由PIx表示內部區域53的滴落點CI的x方向的間距,由PIy表示y方向的間距。間距PIx與間距PIy相等。並且,間距PIx及間距PIy比間距PEx及間距PEy寬。FIG. 2C is a diagram showing the arrangement of the
接著,參閱圖3~圖4C,對基於實施例之油墨塗佈方法進行說明。
圖3係基於實施例之油墨塗佈方法的流程圖。首先,使塗佈對象物50支承於工作台15(步驟S1)。然後,控制裝置40控制XY載台11(圖1A)使塗佈對象物50朝y方向移動的同時,控制噴墨頭16而使油墨滴落在邊緣區域52(圖2A)的滴落點CE(圖2B)(步驟S2)。此時,預先從硬化用光源21向塗佈對象物50照射硬化用光。因此,滴落在塗佈對象物50之油墨在滴落後立即硬化。Next, referring to FIGS. 3 to 4C, the ink coating method based on the embodiment will be described.
Fig. 3 is a flow chart of the ink coating method based on the embodiment. First, the
圖4A係滴落於邊緣區域52之油墨硬化後形成邊緣部55之塗佈對象物50的、沿寬度方向切割邊緣部55之剖面圖。在塗佈對象物50的邊緣區域52形成有邊緣部55。在內部區域53未塗佈有油墨。FIG. 4A is a cross-sectional view of the
形成邊緣部55之後,控制裝置40控制XY載台11(圖1A)使塗佈對象物50朝y方向移動的同時,控制噴墨頭16使油墨滴落在內部區域53(圖2A)的滴落點CI(圖2C)(步驟S3)。此時,以比形成邊緣部55時的塗佈對象物50的移動速度(掃描速度)快的速度使塗佈對象物50朝y方向移動。內部區域53的滴落點CI的y方向的間距PIy(圖2C)比邊緣區域52的滴落點CE的y方向的間距PEy(圖2B)寬,因此,即使加快掃描速度,亦能夠使油墨滴落在滴落點CI。將油墨塗佈於內部區域53時,從硬化用光源21不進行硬化用光的照射。After the
圖4B係將油墨塗佈於內部區域53之後的塗佈對象物50的剖面圖。由於不進行硬化用光的照射,因此滴落在內部區域53之油墨在面內方向擴散,油墨的複數個液滴彼此一體化。其結果,塗佈於內部區域53之油墨的表面變得平坦,形成液態的油墨的膜56。此時,邊緣部55發揮阻擋液態的油墨流出之作用。FIG. 4B is a cross-sectional view of the
將油墨塗佈於內部區域53之後使塗佈對象物50移動的同時,從硬化用光源21(圖1B)向液態的油墨的膜56照射硬化用光,藉此使內部區域53的油墨硬化(步驟S4)。After the ink is applied to the
圖4C係使塗佈於內部區域53之油墨硬化之後的塗佈對象物50的剖面圖。在內部區域53形成有表面平坦的膜57。4C is a cross-sectional view of the
接著,參閱圖2C及圖5,對本實施例的優異之效果進行說明。
圖5係表示藉由基於比較例之方法將油墨塗佈於內部區域53(圖2A)時的滴落點CI的分佈之圖。內部區域53的y方向的像素31的間距與邊緣區域52的像素30的y方向的間距PEy(圖2B)相等。比較例中,將從4個像素31提取之一個像素31的中心點設為滴落點CI。Next, referring to FIGS. 2C and 5, the excellent effects of this embodiment will be described.
FIG. 5 is a diagram showing the distribution of drop points CI when ink is applied to the inner region 53 (FIG. 2A) by a method based on a comparative example. The pitch of the
滴落點CI的分佈密度在實施例(圖2C)的情況和比較例(圖5)的情況下相同。然而,圖5所示之比較例的情況下,滴落點CI的y方向的間距的最小值與邊緣區域52的滴落點CE的y方向的間距PEy相同。因此,難以使將油墨塗佈於內部區域53時的掃描速度比起將油墨塗佈於邊緣區域52時的掃描速度更快。The distribution density of the dropping point CI is the same in the case of the example (FIG. 2C) and the case of the comparative example (FIG. 5 ). However, in the case of the comparative example shown in FIG. 5, the minimum value of the pitch in the y direction of the dropping point CI is the same as the pitch PEy in the y direction of the dropping point CE of the
例如,在圖5所示之例子中,若著眼於一個列,則滴落點CI的掃描方向的間距成為間距PEy的2倍。然而,作為內部區域53整體,滴落點CI的掃描方向的間距等於間距PEy。相對於此,在本實施例中,內部區域53的滴落點CI的y方向的間距PIy(圖2C)作為整體比邊緣區域52的滴落點CE的y方向的間距PEy寬,例如為2倍。在此,“作為整體”係指不僅為滴落點CI的一個列,而是將所有列作為對象。For example, in the example shown in FIG. 5, if one row is focused on, the pitch of the drop points CI in the scanning direction becomes twice the pitch PEy. However, as a whole of the
因此,能夠使將油墨塗佈於內部區域53時的掃描速度比起將油墨塗佈於邊緣區域52時的掃描速度更快。藉由加快將油墨塗佈於內部區域53時的掃描速度,能夠縮短塗佈油墨所需之時間。Therefore, the scanning speed when the ink is applied to the
並且,在本實施例中,如圖4B及圖4C所示,能夠將形成於內部區域之油墨的膜的表面平坦化。因此,能夠提高膜的設計性。將該膜用作蝕刻遮罩時,膜的厚度均勻,因此與表面形成有凹凸之膜相比,就蝕刻耐性的觀點而言,能夠提高可靠性。Furthermore, in this embodiment, as shown in FIGS. 4B and 4C, the surface of the ink film formed in the inner region can be flattened. Therefore, the design of the film can be improved. When the film is used as an etching mask, the thickness of the film is uniform, and therefore, the reliability can be improved from the viewpoint of etching resistance compared to a film with unevenness formed on the surface.
接著,參閱圖6A~圖6E,對其他實施例進行說明。以下,關於與圖1A~圖4C所示之實施例共同的結構省略說明。Next, referring to Figs. 6A to 6E, other embodiments will be described. Hereinafter, a description of the structure common to the embodiment shown in FIGS. 1A to 4C will be omitted.
圖6A係表示邊緣區域52的一部分的複數個像素30的配置之圖。並列配置有複數個像素30,像素30的各中心相當於滴落點CE。圖6B係表示塗佈於邊緣區域52之油墨的平面形狀之圖。滴落於塗佈對象物50之油墨大致以圓形擴散,滴落在相鄰之2個滴落點CE之油墨彼此連續而形成邊緣部55。FIG. 6A is a diagram showing the arrangement of a plurality of
圖6C係表示內部區域53的一部分的複數個像素31的配置之圖。複數個像素31沿x方向及y方向二維分佈。像素31大於邊緣區域52的像素30(圖6A)。因此,內部區域53的滴落點CI的間距比邊緣區域52的滴落點CE的間距寬。FIG. 6C is a diagram showing the arrangement of a plurality of
圖6D係表示塗佈於內部區域53之液態的擴散之平面圖。滴落於塗佈對象物50之油墨大致以圓形擴散。將油墨擴散之區域稱為擴散區域58。依滴落點CI的間距和油墨的液滴的體積,油墨的擴散區域58不會完全覆蓋內部區域53的整個區域,有時會產生塗佈疏漏。FIG. 6D is a plan view showing the diffusion of the liquid applied to the
圖6E係表示藉由能夠防止產生塗佈疏漏之本實施例之方法塗佈油墨時的油墨的擴散區域之平面圖。在本實施例中,使滴落在內部區域53的滴落點CI之油墨的液滴的體積大於滴落在邊緣區域52的滴落點CE(圖6A)之油墨的液滴的體積。液滴的體積設定為油墨的擴散區域58會完全覆蓋內部區域53的整個區域之大小。6E is a plan view showing the diffusion area of the ink when the ink is applied by the method of the present embodiment that can prevent the occurrence of coating omissions. In this embodiment, the volume of the ink droplet that falls on the drop point CI of the
接著,對本實施例的優異的效果進行說明。在本實施例中,藉由使滴落在內部區域53的滴落點CI之油墨的液滴的體積大於滴落在邊緣區域52的滴落點CE之油墨的液滴的體積,能夠抑制在內部區域53產生油墨的塗佈疏漏。作為增大滴落在滴落點CI之油墨的液滴的體積之方法,可以增大一個液滴的體積,亦可以藉由增加滴落於一個滴落點CI之液滴的個數來增大液滴的總體積。Next, the excellent effects of this embodiment will be described. In the present embodiment, by making the volume of the ink droplet at the drop point CI of the
接著,參閱圖7A~圖8B,進一步對其他實施例進行說明。以下,關於與圖1A~圖4及圖6E所示之實施例共同的結構省略說明。Next, referring to FIGS. 7A to 8B, other embodiments are further described. Hereinafter, a description of the structure common to the embodiment shown in FIGS. 1A to 4 and 6E is omitted.
圖7A係表示滴落在內部區域53的滴落點CI之油墨的擴散區域58的一例之圖。若增大滴落在滴落點CI之油墨的液滴的體積,則擴散區域58亦變大,有時會超過邊緣部55而擴散至外側。FIG. 7A is a diagram showing an example of the
圖7B係表示採用基於本實施例之油墨塗佈裝置及油墨塗佈方法時的油墨的擴散區域58之圖。在本實施例中,為了防止滴落在內部區域53的滴落點CI之油墨的擴散區域58超過邊緣部55而擴散至外側,與圖7A的結構相比,使內部區域53的最外側的滴落點CI遠離邊緣部55。FIG. 7B is a diagram showing an
圖8A係表示圖1A~圖4及圖6E所示之實施例中所使用之圖像資料的像素及滴落點的分佈之圖。邊緣區域52的滴落點CE沿x方向及y方向以間距PE配置。內部區域53的滴落點CI沿x方向及y方向以間距PI配置。以Gx表示內部區域53的最外周的滴落點CI與相對於該滴落點CI沿x方向相鄰之邊緣區域52的滴落點CE的x方向的間隔。位於內部區域53的最外周之像素31與邊緣區域52的像素30接觸,因此間隔Gx等於間距PE的1/2與間距PI的1/2之和。關於y方向亦相同。FIG. 8A is a diagram showing the distribution of pixels and drop points of the image data used in the embodiment shown in FIGS. 1A to 4 and 6E. The drop points CE of the
圖8B係表示本實施例中使用之圖像資料的像素及滴落點的分佈之圖。在本實施例中,在x方向及y方向上縮小由構成內部區域53之複數個像素31佔據之區域。因此,在位於內部區域53的最外周之像素31與邊緣區域52的像素30之間形成有間隙32。因此,間隔Gx比間距PE的1/2與間距PI的1/2之和寬。除了最外周以外的內側的像素31的位置按照最外周的像素31的位移調整為像素31均勻地分佈。關於y方向亦相同。控制裝置40依據調整後的像素31的位置進行油墨的吐出時刻及待吐出油墨之噴嘴孔20的控制。FIG. 8B is a diagram showing the distribution of pixels and drop points of the image data used in this embodiment. In this embodiment, the area occupied by the plurality of
在本實施例中,藉由在x方向及y方向上縮小構成內部區域53的圖像資料之複數個像素31,使位於內部區域53的最外周之滴落點CI的位置朝遠離邊緣區域52之方向位移。藉此,如圖7B所示,能夠抑制滴落在內部區域53之油墨擴散至邊緣部55的外側。In this embodiment, by reducing the plurality of
為了抑制油墨擴散至邊緣部55的外側,將間隔Gx設為滴落在內部區域53之油墨的一個液滴擴散之圓形區域的半徑以上為較佳。並且,若過於擴大間隔Gx,則會導致在邊緣區域52與內部區域53之間的邊界產生未塗佈油墨之區域。間隔Gx的上限值設為不產生未塗佈油墨之區域之程度為較佳。In order to prevent the ink from spreading to the outside of the
接著,參閱圖9A及圖9B,進一步對其他實施例進行說明。以下,關於與圖8B所示之實施例共同的結構省略說明。Next, referring to FIGS. 9A and 9B, other embodiments are further described. Hereinafter, the description of the structure common to the embodiment shown in FIG. 8B is omitted.
圖9A係表示本實施例中使用之圖像資料的像素的分佈之圖。在圖8B所示之實施例中,在x方向及y方向這兩個方向上縮小了由構成內部區域53之複數個像素31佔據之區域。在本實施例中,將由構成內部區域53之複數個像素31佔據之區域在x方向(相對於掃描方向正交之方向)上縮小,但在y方向(掃描方向)上不縮小。因此,位於內部區域53的最外周之像素31與相對於該像素在y方向上相鄰之邊緣區域52的像素30接觸。FIG. 9A is a diagram showing the distribution of pixels of the image data used in this embodiment. In the embodiment shown in FIG. 8B, the area occupied by the plurality of
圖9B係表示從噴嘴孔20(圖1B)吐出油墨的時刻之時序圖。以下,對滴落點朝向圖9A的y軸的正方向移動,並將油墨滴落在沿y方向排成一列之7個像素31時的掃描的例子進行說明。7個像素31的兩端的像素31位於內部區域53的最外周。對排成一列之7個像素31朝向y軸的正方向附加1至7的編號。由C(i)表示第i個像素31的中心位置,由CI(i)表示與第i個像素31對應之滴落點。FIG. 9B is a timing chart showing the timing when ink is discharged from the nozzle hole 20 (FIG. 1B ). Hereinafter, an example of scanning when the drop point moves in the positive direction of the y-axis in FIG. 9A and ink drops on 7
圖9B的上段的時序圖表示與圖像資料對應之吐出時刻,下段的時序圖表示實際的吐出時刻。使滴落點CI(1)的吐出時刻比與像素31的中心位置C(1)對應之吐出時刻慢。並且,使滴落點CI(7)的吐出時刻比與像素31的中心位置C(7)對應之吐出時刻快。關於除了兩端的滴落點CI(1)及CI(7)以外的內側的滴落點CI(2)~CI(6)的吐出時刻,從與中心位置C(2)~C(6)對應之吐出時刻錯開,以使實際的吐出時刻的時間間隔成為恆定。The upper timing chart of FIG. 9B shows the discharge time corresponding to the image data, and the lower timing chart shows the actual discharge time. The discharge time of the drop point CI(1) is made slower than the discharge time corresponding to the center position C(1) of the
如此,藉由錯開實際的吐出時刻,能夠使位於內部區域53的最外周之滴落點CI(1)、CI(7)遠離邊緣區域52。其結果,與圖8B所示之實施例同樣地,能夠抑制滴落在內部區域53之油墨擴散至邊緣部55的外側。In this way, by shifting the actual discharge time, the drop points CI(1) and CI(7) located at the outermost periphery of the
接著,參閱圖10A~圖10D,進一步對其他實施例進行說明。以下,關於與圖1A~圖4C所示之實施例共同的結構省略說明。Next, referring to FIGS. 10A to 10D, other embodiments will be further described. Hereinafter, a description of the structure common to the embodiment shown in FIGS. 1A to 4C will be omitted.
圖10A係表示本實施例中所使用之邊緣區域52的像素30的分佈之圖。在圖2B所示之實施例中,邊緣區域52的各邊的寬度為一個像素30的量。在本實施例中,沿邊緣區域52的各邊的寬度方向排列有複數個像素30,例如3個像素30。亦即,沿邊緣區域52的各邊的寬度方向排列有複數個滴落點CE。對沿寬度方向排列之3個滴落點CE從外側朝向內側附加編號。內部區域53被邊緣區域52包圍。FIG. 10A is a diagram showing the distribution of
接著,參閱圖10B~圖10D,對將油墨滴落在沿邊緣區域52的各邊的寬度方向排列之複數個滴落點CE之順序進行說明。Next, referring to FIGS. 10B to 10D, the order in which ink is dropped on the plurality of drop points CE arranged along the width direction of each side of the
圖10B係圖10A的單點鏈線10B-10B上的塗佈對象物50的剖面圖,表示將油墨滴落在邊緣區域52的最外側的滴落點CE(1)之狀態。滴落在滴落點CE(1)之油墨61在硬化之前的期間沿面內方向擴散,並且到達至超過相鄰的滴落點CE(2)之位置。因此,形成以滴落點CE(1)的位置為中心之油墨的凸部。相鄰的滴落點CE(2)位於與由油墨61形成之凸部的斜面對應之部位。10B is a cross-sectional view of the
圖10C表示將油墨62滴落在從邊緣區域52的外側起第2個滴落點CE(2)時的狀態。滴落在滴落點CE(2)之油墨沿著由剛吐出之油墨61形成之凸部的斜面朝向內部區域53流動,並且到達至超過相鄰的滴落點CE(3)之位置。FIG. 10C shows a state when the
圖10D表示將油墨63滴落在邊緣區域52的最內側的滴落點CE(3)時的狀態。滴落在滴落點CE(3)之油墨沿著剛吐出並硬化之油墨62的斜面朝向內部區域53流動。藉由使滴落在滴落點CE(1)~CE(3)之油墨61、62、63硬化而形成邊緣部55。FIG. 10D shows a state when the
接著,對本實施例的優異的效果進行說明。在本實施例中,關於邊緣區域52的各邊的寬度方向,從外側的滴落點CE(1)朝向內側的滴落點CE(3)依次滴落油墨。隨後滴落之油墨沿著先前滴落而硬化之油墨的斜面朝向內部區域53(圖10A)流動,因此邊緣部55(圖10D)的內部區域53側的斜面的傾斜度比外側的斜面的傾斜度平緩。換言之,能夠使邊緣部55的外側的斜面的傾斜度變得陡峭。Next, the excellent effects of this embodiment will be described. In this embodiment, with respect to the width direction of each side of the
圖10B~圖10D中,對與x方向平行之邊(相對於掃描方向正交之邊)進行說明。關於與y方向(掃描方向)平行的邊,也是從外側朝向內側將油墨依次滴落在沿寬度方向排列之複數個滴落點CE為佳。例如,藉由複數次掃描將油墨滴落在邊緣區域52的滴落點CE時,在第1次的掃描中將油墨滴落在最外側的滴落點CE,藉由之後的掃描將油墨依次滴落在內側的滴落點CE為佳。In FIGS. 10B to 10D, the side parallel to the x direction (the side orthogonal to the scanning direction) will be described. Regarding the side parallel to the y direction (scanning direction), it is also preferable to sequentially drop the ink on a plurality of drop points CE arranged in the width direction from the outside to the inside. For example, when the ink is dropped on the drop point CE of the
接著,參閱圖11A及圖11B,進一步對其他實施例進行說明。以下,關於與圖1A~圖4C所示之實施例共同的結構省略說明。在圖1A~圖4C所示之實施例中,為了將油墨塗佈於邊緣區域52及內部區域53(圖2A),使用共同的噴墨頭16(圖1B)。在本實施例中,設置用於將油墨塗佈於邊緣區域之噴墨頭及用於將油墨塗佈於內部區域之噴墨頭。Next, referring to FIGS. 11A and 11B, other embodiments are further described. Hereinafter, a description of the structure common to the embodiment shown in FIGS. 1A to 4C will be omitted. In the embodiment shown in FIGS. 1A to 4C, in order to apply ink to the
圖11A係邊緣區域用噴墨頭16E的仰視圖,圖11B係內部區域用噴墨頭16I的仰視圖。在邊緣區域用噴墨頭16E的底面設置有沿x方向排列之複數個噴嘴孔20E,在內部區域用噴墨頭16I的底面設置有沿x方向排列之複數個噴嘴孔20I。噴嘴孔20I的x方向的間距比噴嘴孔20E的x方向的間距寬。並且,內部區域用噴墨頭16I所吐出之油墨的液滴的體積大於邊緣區域用噴墨頭16E所吐出之油墨的液滴的體積。FIG. 11A is a bottom view of the
在邊緣區域用噴墨頭16E的兩側分別配置有硬化用光源21E。在內部區域用噴墨頭16I的兩側分別配置有硬化用光源21I。硬化用光源21E、21I朝向塗佈對象物50照射使油墨硬化之硬化用光。Curing
內部區域用噴墨頭16I的噴嘴孔20I與硬化用光源21I的y方向的間隔WIy比邊緣區域用噴墨頭16E的噴嘴孔20E與硬化用光源21E的y方向的間隔WEy寬。The distance WIy between the nozzle hole 20I of the inkjet head 16I for inner area and the curing light source 21I in the y direction is wider than the distance WEy between the
在圖3所示之實施例中,在步驟S3中進行將油墨塗佈於內部區域53之掃描之後,在步驟S4中使內部區域53的油墨硬化。在本實施例中,使用內部區域用噴墨頭16I進行將油墨塗佈於內部區域53之掃描時,從硬化用光源21I向塗佈對象物50照射硬化用光。In the embodiment shown in FIG. 3, after scanning to apply ink to the
接著,對本實施例的優異的效果進行說明。
間隔WIy比間隔WEy寬,因此從油墨滴落到內部區域53直至硬化為止的時間比油墨滴落到邊緣區域52直至硬化為止的時間長。藉此,能夠使滴落於內部區域53之油墨擴散,油墨的膜的上表面變得大致平坦,然後使油墨硬化。其結果,與圖4A~圖4C所示之實施例同樣地,能夠使內部區域53的油墨的膜57的表面平坦化。在本實施例中,無需單獨進行用於油墨的硬化的處理,因此能夠縮短處理時間。Next, the excellent effects of this embodiment will be described.
The interval WIy is wider than the interval WEy, and therefore the time from the ink dripping to the
從內部區域用噴墨頭16I吐出之油墨的液滴的體積大於從邊緣區域用噴墨頭16E吐出之油墨的液滴的體積,因此能夠防止內部區域53(圖2A)的漏塗。The volume of the ink droplets discharged from the inkjet head 16I for the inner area is larger than the volume of ink droplets discharged from the
上述各實施例為例示,當然能夠進行不同的實施例中所示之結構的局部置換或組合。針對基於複數個實施例的相同的結構的相同的作用效果,並未在每個實施例中依次提及。此外,本發明並不限制於上述實施例。本領域的技術人員應當清楚例如能夠進行各種變更、改良、組合等。The foregoing embodiments are examples, and it is of course possible to perform partial replacement or combination of the structures shown in different embodiments. Regarding the same effects based on the same structure of a plurality of embodiments, they are not mentioned in turn in each embodiment. In addition, the present invention is not limited to the above-mentioned embodiment. It should be clear to those skilled in the art that, for example, various changes, improvements, and combinations can be made.
10‧‧‧支架
11‧‧‧XY載台
12‧‧‧θ載台
15‧‧‧工作台
16‧‧‧噴墨頭
16E‧‧‧邊緣區域用噴墨頭
16I‧‧‧內部區域用噴墨頭
17‧‧‧框架
18‧‧‧循環系統
19‧‧‧循環路徑
20、20E、20I‧‧‧噴嘴孔
21、21E、21I‧‧‧硬化用光源
30‧‧‧邊緣區域的像素
31‧‧‧內部區域的像素
32‧‧‧間隙
40‧‧‧控制裝置
50‧‧‧塗佈對象物
51‧‧‧待塗佈油墨之區域
52‧‧‧邊緣區域
53‧‧‧內部區域
55‧‧‧邊緣部
56‧‧‧塗佈於內部區域之液態油墨的膜
57‧‧‧硬化之油墨的膜
58‧‧‧油墨的擴散區域
61、62、63‧‧‧滴落於邊緣區域之油墨10‧‧‧
圖1A係基於實施例之油墨塗佈裝置的概要圖,圖1B係基於實施例之油墨塗佈裝置的工作台的平面圖。
圖2A係表示待塗佈油墨之區域之平面圖,圖2B係表示待塗佈油墨之區域為長方形時的邊緣區域的像素的配置之圖,圖2C係表示待塗佈油墨之區域為長方形時的內部區域的像素的配置之圖。
圖3係基於實施例之油墨塗佈方法的流程圖。
圖4A係形成有邊緣部之塗佈對象物的、沿寬度方向切割邊緣部之剖面圖,圖4B係將油墨塗佈於內部區域之後的塗佈對象物的剖面圖,圖4C係使塗佈於內部區域之油墨硬化之後的塗佈對象物的剖面圖。
圖5係表示藉由基於比較例之方法將油墨塗佈於內部區域(圖2A)時的滴落點的分佈之圖。
圖6A係表示邊緣區域的複數個像素的配置之圖,圖6B係表示塗佈於邊緣區域之油墨的平面形狀之圖,圖6C係表示內部區域的複數個像素的配置之圖,圖6D係表示塗佈於內部區域之液態的擴散之平面圖,圖6E係表示藉由基於能夠防止塗佈疏漏的產生之實施例之方法塗佈油墨時的油墨的擴散區域之平面圖。
圖7A係表示滴落在內部區域的滴落點之油墨的擴散區域的一例之圖,圖7B係表示採用基於實施例之油墨塗佈裝置及油墨塗佈方法時的油墨的擴散區域之圖。
圖8A係表示圖1A~圖4及圖6E所示之實施例中所使用之圖像資料的像素及滴落點的分佈之圖,圖8B係表示其他實施例中使用之圖像資料的像素及滴落點的分佈之圖。
圖9A係表示實施例中所使用之圖像資料的像素的分佈之圖,圖9B係表示從噴嘴孔吐出油墨的時刻之時序圖。
圖10A係表示實施例中所使用之邊緣區域的像素的分佈之圖,圖10B係圖10A的單點鏈線10B-10B上的塗佈對象物的剖面圖,並表示將油墨滴落在邊緣區域的最外側的滴落點時的狀態,圖10C係表示將油墨滴落在從邊緣區域的外側開始第2個滴落點時的狀態之剖面圖,圖10D係表示將油墨滴落在邊緣區域的最內側的滴落點時的狀態之剖面圖。
圖11A係邊緣區域用噴墨頭的仰視圖,圖11B係內部區域用噴墨頭的仰視圖。FIG. 1A is a schematic view of the ink coating device based on the embodiment, and FIG. 1B is a plan view of the workbench of the ink coating device based on the embodiment.
Figure 2A is a plan view of the area to be coated with ink, Figure 2B is a diagram showing the arrangement of pixels in the edge area when the area to be coated with ink is rectangular, and Figure 2C is a diagram showing the area to be coated with ink is rectangular The layout of the pixels in the inner area.
Fig. 3 is a flow chart of the ink coating method based on the embodiment.
Fig. 4A is a cross-sectional view of the coated object formed with the edge portion, cutting the edge portion in the width direction, Fig. 4B is a cross-sectional view of the coated object after ink is applied to the inner area, and Fig. 4C is the coated Cross-sectional view of the object to be coated after the ink in the inner area has cured.
FIG. 5 is a diagram showing the distribution of dripping points when ink is applied to the inner region (FIG. 2A) by the method based on the comparative example.
Fig. 6A is a diagram showing the arrangement of a plurality of pixels in the edge area, Fig. 6B is a diagram showing the plane shape of the ink applied to the edge area, Fig. 6C is a diagram showing the arrangement of a plurality of pixels in the inner area, and Fig. 6D is 6E is a plan view showing the diffusion area of the ink when the ink is applied by the method based on the embodiment capable of preventing the occurrence of coating omissions.
FIG. 7A is a diagram showing an example of the diffusion area of the ink at the drop point of the inner region, and FIG. 7B is a diagram showing the diffusion area of the ink when the ink application device and ink application method based on the embodiment are used.
8A is a diagram showing the distribution of pixels and drop points of the image data used in the embodiment shown in FIGS. 1A to 4 and 6E, and FIG. 8B shows the pixels of the image data used in other embodiments And the distribution of the drop points.
FIG. 9A is a diagram showing the distribution of pixels of the image data used in the embodiment, and FIG. 9B is a timing diagram showing the timing when ink is discharged from the nozzle hole.
10A is a diagram showing the distribution of pixels in the edge area used in the embodiment, and FIG. 10B is a cross-sectional view of the coating object on the one-
Claims (6)
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| JP7464378B2 (en) * | 2019-11-22 | 2024-04-09 | 住友重機械工業株式会社 | Ink application control device and ink application method |
| JP7428541B2 (en) * | 2020-03-02 | 2024-02-06 | 住友重機械工業株式会社 | Ink coating device, ink coating device control device, and ink coating method |
| JP7488108B2 (en) * | 2020-05-19 | 2024-05-21 | 住友重機械工業株式会社 | Ink application device, control device thereof, and ink application method |
| JP7495276B2 (en) * | 2020-06-01 | 2024-06-04 | 住友重機械工業株式会社 | Printing data generating device and ink application device control device |
| KR102468359B1 (en) | 2020-11-30 | 2022-11-17 | (주)에스티아이 | Inkjet ejection control method and inkjet print system using the same |
| KR102473638B1 (en) | 2020-12-29 | 2022-12-02 | (주)에스티아이 | Inkjet print system |
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| JP2004104104A (en) * | 2003-08-04 | 2004-04-02 | Ricoh Co Ltd | Liquid resin injection device and resin structure |
| TW201208888A (en) * | 2010-06-30 | 2012-03-01 | Fujifilm Corp | Liquid application device, liquid application method, and nanoimprint system |
| TW201309135A (en) * | 2011-07-15 | 2013-02-16 | Sumitomo Heavy Industries | Thin film forming method and thin film forming apparatus |
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| TWI528470B (en) * | 2013-07-25 | 2016-04-01 | 住友重機械工業股份有限公司 | Film forming method and thin film forming apparatus |
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| TW201946697A (en) | 2019-12-16 |
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