TWI702491B - Main board and detachable module thereof - Google Patents
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Abstract
Description
本揭露關於一種主機板。This disclosure relates to a motherboard.
目前電腦的主機板通常具有介面模組,用以與外部電子裝置連接。輸入輸出介面具有多種輸入輸出埠(input/output ports,I/O ports),例如通用序列匯流排(USB)輸入輸出埠、區域網路(LAN)輸入輸出埠、無線相容認證(WiFi)輸入輸出埠等,這些輸入輸出埠的插槽位置對應於電腦機殼上的開口,因此使用者可插入相對應的接頭。傳統上,這些輸入輸出埠係直接焊接於主機板上,也因此這些輸入輸出埠的位置係固定不變的。然而,當輸入輸出埠壞掉時,壞掉的輸入輸出埠並無法進行更換;又或者當某種規格的輸入輸出埠的數量不符合需求時(例如需要更多USB輸入輸出埠而不需要LAN輸入輸出埠時),使用者亦無法更換主機板上的輸入輸出埠,因此在使用上仍有需多不便之處,並且閒置的輸入輸出埠也會造成資源的浪費。The motherboard of the current computer usually has an interface module for connecting with external electronic devices. The input and output interface has a variety of input and output ports (input/output ports, I/O ports), such as universal serial bus (USB) input and output ports, local area network (LAN) input and output ports, wireless compatible certification (WiFi) input Output ports, etc. The slot positions of these input and output ports correspond to the openings on the computer case, so users can insert the corresponding connectors. Traditionally, these input and output ports are directly soldered on the motherboard, and therefore the positions of these input and output ports are fixed. However, when the input and output ports are broken, the broken input and output ports cannot be replaced; or when the number of input and output ports of a certain specification does not meet the requirements (for example, more USB input and output ports are required without LAN In the case of input and output ports), the user cannot replace the input and output ports on the motherboard, so there are still many inconveniences in use, and the idle input and output ports will also cause waste of resources.
本揭露提供一種主機板,包含:訊號發送端及多數個連接器。連接器分別連接至訊號發送端;其中,每個連接器支援多種連接規格,以提供可拆式模組進行組裝,且可拆式模組包含金手指連接元件以及輸入輸出埠。The disclosure provides a motherboard, which includes a signal transmitter and a plurality of connectors. The connectors are respectively connected to the signal sending end; among them, each connector supports a variety of connection specifications to provide a detachable module for assembly, and the detachable module includes golden finger connection elements and input and output ports.
本揭露另提供一種可拆式模組,可安裝於主機板上,其中主機板包含訊號發送端及多數個連接器。連接器分別連接至訊號發送端,且每一連接器支援多種連接規格,以提供可拆式模組進行組裝,其中可拆式模組包含: 金手指連接元件以及輸入輸出埠。The disclosure also provides a detachable module that can be installed on a motherboard, where the motherboard includes a signal transmitter and a plurality of connectors. The connectors are respectively connected to the signal sending end, and each connector supports a variety of connection specifications to provide a detachable module for assembly. The detachable module includes: golden finger connection components and input and output ports.
以下將透過多個實施例說明本揭露的主機板或可拆式模組的實施態樣及運作原理,而所屬技術領域中具有通常知識者,透過實施例可理解本揭露的特徵及功效,並且可基於本揭露的精神,進行組合、修飾、置換或轉用。The following will illustrate the implementation aspects and operating principles of the motherboard or detachable module of the disclosure through a number of embodiments. Those skilled in the art can understand the features and effects of the disclosure through the embodiments, and Based on the spirit of the present disclosure, it can be combined, modified, replaced or converted.
在本揭露中,「固設」或「卡合」定義為二元件固定設置在一起,二元件並不會相對彼此而轉動或移動,並且不排除當達成特定施力條件時二元件仍可拆除的情形,其中「固設」或「卡合」的實現方式並沒有限定;「樞接」定義為二元件可相對彼此軸向轉動,且轉動方向並沒有限定,此外二元件之間不以軸套之設置為限;而「連接」則定義為二元件之間可為固設關係或樞接關係,在此先行敘明。此外,本揭露中關於「連接」、 「電性連接」或「耦接」等詞,若無特別強調,則表示包括了直接連接與間接連接之態樣。另外,在本揭露中關於「包含」、「包括」、「具有」、「具備」等用語是表示為開放式之描述。In this disclosure, "fixed" or "locked" is defined as the two elements are fixedly arranged together, the two elements will not rotate or move relative to each other, and it does not rule out that the two elements can still be removed when a specific force is reached In the case of “fixed” or “locking”, there is no limitation; “pivot” is defined as two elements that can rotate axially relative to each other, and the direction of rotation is not limited, and there is no axis between the two elements. The setting of the set is limited; and the "connection" is defined as a fixed relationship or a pivotal relationship between the two components, which is explained here first. In addition, the terms "connection", "electrical connection" or "coupling" in this disclosure, if not particularly emphasized, mean that they include direct connection and indirect connection. In addition, the terms "include", "include", "have", "have" and other terms in this disclosure are expressed as open-ended descriptions.
再者,本揭露中關於“當…”或“…時”等描述表示”當下、之前或之後”等態樣,而不限定為同時發生之情形,在此先行敘明。另外,本揭露記載多個功效(或多個元件)時,若在功效(或元件)之間使用“或”一詞,係表示功效(或元件)可獨立存在,但不排除多個功效(或元件)可同時存在。Furthermore, the description of "when..." or "...when" in this disclosure means "now, before, or after", etc., and is not limited to situations that occur simultaneously, which is described here first. In addition, when the present disclosure records multiple functions (or multiple elements), if the word "or" is used between the functions (or elements), it means that the functions (or elements) can exist independently, but multiple functions (or elements) are not excluded ( Or components) can exist at the same time.
圖1係本揭露一實施例的主機板1及可拆式模組2的示意圖。如圖1所示,主機板1可包括一模組設置區域10、一訊號發送端12及多數個連接器14,其中連接器14可設置於模組設置區域10中。每一連接器14皆可支援多種連接規格,以提供可拆式模組2進行組裝,因此這些可拆式模組2相互之間係具有相同連接規格或不同連接 規格,本案並不受限。可拆式模組2包括一金手指連接元件22及一輸入輸出埠24。FIG. 1 is a schematic diagram of a
連接器14分別連接至訊號發送端12,因此訊號發送端12可發送訊號至每個連接器14。連接器14可用於與可拆式模組2連接,例如每個連接器14可具備一連接器插槽141,連接器插槽141可包括多數個接腳(pins),而金手指連接元件22亦可包括多數個對應連接器插槽141的接腳,故可拆式模組2可藉由金手指連接元件22而插入至連接器14的連接器插槽141之中,並相互卡合。在一實施例中,每個連接器14一次可與一個可拆式模組2連接。在一實施例中,連接器14係一次世代型式規格(next generation form factor,NGFF)連接器(以下簡稱NGFF連接器),例如NGFF B-KEY連接器、NGFF E-KEY連接器、NGFF M-KEY連接器、或其它M2規格連接器等,且不限於此。The
本揭露的特色之一在於,每個可拆式模組2可具備至少一輸入輸出埠24,其中輸入輸出埠24可以是一插槽設備,用於與其它電子裝置的一接頭連接。每個可拆式模組2的輸入輸出埠24可以係不同連接規格,在一實施例中,輸入輸出埠24的類型可包括一通用序列匯流排(USB)輸入輸出埠(以下簡稱USB輸入輸出埠)、一區域網路(LAN)輸入輸出埠(以下簡稱LAN輸入輸出埠)、一無線相容認證(WiFi)輸入輸出埠(以下簡稱WiFi輸入輸出埠)或一音訊輸入輸出埠,且不限於此。在一實施例中,只要可拆式模組2內部的電子電路能被實現,可拆式模組2亦可包括二個以上的輸入輸出埠24,例如一個可拆式模組2可能包括二個USB輸入輸出埠。One of the features of the present disclosure is that each
本揭露的另一特色在於,連接器14可支援不同連接規格,意即同一個連接器14可供不同的可拆式模組2連接,因此這些可拆式模組2相互之間係具有相同連接規格或不同連接規格,本案並不受限。Another feature of the present disclosure is that the
上述本揭露特色可單獨或同時存在,並且本揭露的特色不限於此。The above-mentioned features of the present disclosure may exist alone or at the same time, and the features of the present disclosure are not limited thereto.
接著將詳細說明各元件。Next, each element will be described in detail.
首先針對主機板1的細節進行說明。主機板1可供各種電子裝置使用,其中電子裝置可例如桌上型電腦、筆記型電腦、平板電腦或其它具備主機板1的電子產品,且不限於此;為方便說明,以下皆以主機板1為桌上型電腦的主機板來舉例。模組設置區域10可為輸入輸出埠的設置區域,其中輸入輸出埠為各種與電腦外部的電子裝置連接的插槽設備。模組設置區域10通常位於主機板1上的外圍區域,以利插槽設備的設置;因此當主機板1安裝於電腦內部時,模組設置區域10可鄰近於電腦的外殼,而電腦的外殼可具備開口,各種輸入輸出埠可顯露於開口處。First, the details of the
傳統上,各種輸入輸出埠係直接焊接於模組設置區域10上,因此無法被移除;相較之下,本揭露的模組設置區域10則設置有連接器14,而可拆式模組2具備與連接器14相對應的金手指連接元件22,因此可拆式模組2可與連接器14卡合,而無需焊接於模組設置區域10上,並且可拆式模組2可隨時被拆除。由此可知,本揭露可讓使用者依照需求而任意更換可拆式模組2的類型。Traditionally, various input and output ports are directly welded to the
在一實施例中,模組設置區域10所設置的多個連接器14為相同規格,例如皆為NGFF KEY-E連接器,但並非限定。在一實施例中,訊號發送端12可傳送相同規格的一原始訊號至每個連接器14。在一實施例中,原始訊號為通用序列匯流排訊號(以下簡稱USB訊號)或快捷外設互聯標準(PCIE)訊號(以下簡稱PCIE訊號),但並非限定。在一實施例中,訊號發送端12可例如係主機板1上的中央處理器(central processing unit,CPU)、南橋晶片(south-bridge chip)或者係時脈產生器,但並非限定。在一實施例中,連接器14係自主機板1上取得運作時所需的電量,但並非限定。In one embodiment, the
接著以圖2(A)至2(C)說明可拆式模組2的細節,並請同時參考圖1。Next, the details of the
圖2(A)係本揭露一實施例的可拆式模組2的分解圖,其顯示可拆式模組2為USB規格的情況。如圖2(A)所示,可拆式模組2包括金手指連接元件22、一電路板23、輸入輸出埠24、一第一殼體25及一第二殼體26,其中該輸入輸出埠24係USB輸入輸出埠(例如USB插槽),且USB插槽的數量不限於一個。此外,電路板23可具備一控制晶片231。第一殼體25可具備一開口251。FIG. 2(A) is an exploded view of the
在一實施例中,金手指連接元件22可設置於電路板23上,例如設置於電路板23的一邊緣。輸入輸出埠24可設置於電路板23上,並可與金手指連接元件22電性連接,其中電性連接可透過但不限於以電路佈線(layout wire)的方式進行電性連接。又如圖1及圖2(A)所示,由於金手指連接元件22可對應並插入於連接器14的連接器插槽141,因此金手指連接元件22的接腳數量必須小於或等於連接器插槽141的接腳數量,金手指連接元件22的接腳位置必須對應連接器插槽141的接腳位置。藉此,來自主機板1的訊號可透過連接器14及金手指連接元件22而傳送至電路板23,並可透過控制晶片231處理後傳送至輸入輸出埠24;或者,輸入輸出埠24所接收到的外部訊號可透過連接器14及金手指連接元件22而傳送至主機板1。在一實施例中,控制晶片231是一積體電路,並可包含電阻、電容或電感等被動元件。In an embodiment, the golden
在一實施例中,電路板23與第一殼體25彼此可具有相對應的連接元件,進而組裝在一起,例如電路板23與第一殼體25的一相對應位置上可具備螺絲孔27,並透過螺絲28鎖固,但並非限定。在一實施例中,第一殼體25與第二殼體26彼此可具有相對應的連接元件,進而組裝在一起,例如第一殼體25與第二殼體26的相對位置上可具備螺絲孔,並可透過螺絲鎖固,但並非限定。在一實施例中,當電路板23與第一殼體25組裝,且第一殼體25與第二殼體26組裝時,第一殼體25及第二殼體26可將大部分的電路板23包覆,而金手指連接元件22可露出於第一殼體25及第二殼體26之外。在一實施例中,當電路板23與第一殼體25組裝時,第一殼體25的開口251的位置可與輸入輸出埠24相對應,使得輸入輸出埠24可顯露於開口251處。In an embodiment, the
圖2(B)係本揭露一實施例的可拆式模組2的分解圖,其係用於說明可拆式模組2係LAN規格的情況。如圖2(A)所示,可拆式模組2包括金手指連接元件22、電路板23、輸入輸出埠24、第一殼體25及第二殼體26,其中該輸入輸出埠24係LAN輸入輸出埠(例如LAN插槽),且LAN插槽的數量不限於一個。此外,電路板23亦可具備控制晶片231。第一殼體25亦可具備開口251。FIG. 2(B) is an exploded view of the
圖2(B)中各元件的細節可適用於圖2(A)的說明,故不再進行詳述。The details of each element in FIG. 2(B) can be applied to the description of FIG. 2(A), so the detailed description is omitted.
圖2(C)係本揭露一實施例的可拆式模組2的分解圖,其係用於說明可拆式模組2係WiFi規格的情況。如圖2(A)所示,可拆式模組2包括金手指連接元件22、電路板23、輸入輸出埠24、第一殼體25及一第二殼體26,其中該輸入輸出埠24係WiFi輸入輸出埠(例如WiFi接頭),且WiFi接頭的數量不限於一個。此外,電路板23亦可具備控制晶片231。第一殼體25亦可具備開口251。FIG. 2(C) is an exploded view of the
圖2(C)中各元件的細節可適用於圖2(A)的說明,故不再進行詳述。The details of each element in FIG. 2(C) can be applied to the description of FIG. 2(A), so the detailed description is omitted.
此外,請再次參考圖1至2(C)。在一實施例中,主機板1上的連接器14可採用NGFF KEY-E連接器(例如NGFF KEY-E 67P G/F 5.3H S/T connector),且NGFF KEY-E連接器的部分接腳可被重新定義。由於現有產品的NGFF KEY-E連接器多數可供WiFi接頭使用,其各接腳的定義已適用於WiFi接頭的規格。但實際上,當WiFi接頭與NGFF KEY-E連接器組合時(並可能焊接在一起),NGFF KEY-E連接器的部分接腳係仍屬於閒置狀態,亦即未被WiFi接頭使用,因此這些未被使用的接腳可以重新被定義。又由於其它規格的輸入輸出埠(例如USB插槽、LAN插槽)可能需要更多個電量或頻寬,因此這些未被使用的接腳將可被重新定義,使得NGFF KEY-E連接器能夠適用於其它規格的輸入輸出埠。在一實施例中,NGFF KEY-E連接器的部分接腳被「重新定義」的態樣可包括增加電量、增加訊號頻寬或增加重置控制(reset)等,且不限於此。In addition, please refer to Figures 1 to 2(C) again. In one embodiment, the
接著將以圖3(A)及圖3(B)說明控制晶片231的細節,並請同時參考圖1至圖2(C)。Next, the details of the
圖3(A)係本揭露一實施例的可拆式模組2的控制晶片231的運作情形示意圖,其以可拆式模組2分別為USB規格的可拆式模組2(a)、LAN規格的可拆式模組2(b)及WiFi規格的可拆式模組2(c)來舉例。3(A) is a schematic diagram of the operation of the
在一實施例中,USB規格的可拆式模組2(a)包括第一控制晶片231(a)。第一控制晶片231(a)可具備訊號轉換器的功能,此功能至少可透過第一控制晶片231(a)內部的電子電路設計來達成。第一控制晶片231(a)用於將來自訊號發送端12的原始訊號S1(PCIE訊號或USB訊號)轉換為輸入輸出埠24所適用的一特定規格訊號S2,例如將USB訊號或PCIE訊號轉換為USB2.0、USB3.0(例如USB3.2 GEN1或USB3.2 GEN2),甚至之後更新一代USB等規格的訊號,且不限於此。此外,在一實施例中,第一控制晶片231(a)亦可用於將輸入輸出埠24所接收的外部訊號轉換為主機板1上的元件(例如中央處理器)所適用的訊號。In one embodiment, the detachable module 2(a) of the USB specification includes the first control chip 231(a). The first control chip 231(a) can have the function of a signal converter, and this function can be achieved at least through the electronic circuit design inside the first control chip 231(a). The first control chip 231(a) is used to convert the original signal S1 (PCIE signal or USB signal) from the
在一實施例中,LAN規格的可拆式模組2(b)包括第二控制晶片231(b)。第二控制晶片231(b)可具備訊號轉換器的功能,此功能至少可透過第二控制晶片231(b)內部的電子電路設計來達成。第二控制晶片231(b)可用於將來自訊號發送端12的原始訊號S1轉換為輸入輸出埠24所適用的特定規格訊號S2,例如將USB訊號或PCIE訊號轉換為LAN 1G、LAN 2.5G、LAN 5G或LAN 10G等規格的訊號,且不限於此。在一實施例中,第二控制晶片231(b)亦可用於將輸入輸出埠24所接收的外部訊號轉換為主機板1上的元件(例如中央處理器)所適用的訊號。In one embodiment, the detachable module 2(b) of the LAN specification includes the second control chip 231(b). The second control chip 231(b) can have the function of a signal converter, and this function can be achieved at least through the electronic circuit design inside the second control chip 231(b). The second control chip 231(b) can be used to convert the original signal S1 from the
在一實施例中,WiFi規格的可拆式模組2(c)包括第三控制晶片231(b)。第三控制晶片231(c)可具備訊號轉換器的功能,此功能至少可透過第三控制晶片231(c)內部的電子電路設計來達成。第三控制晶片231(c)可用於將來自訊號發送端12的原始訊號S1轉換為輸入輸出埠24所適用的特定規格訊號S2,例如將USB訊號或PCIE訊號轉換為WiFi規格的訊號,例如WiFi 1/2/3/4/5/6 (基於 802.11)規格等,且不限於此。在一實施例中,第三控制晶片231(c)亦可用於將輸入輸出埠24所接收的外部訊號轉換為主機板1上的元件(例如中央處理器)所適用的訊號。In one embodiment, the detachable module 2(c) of WiFi specification includes a third control chip 231(b). The third control chip 231(c) can have the function of a signal converter, and this function can be achieved at least through the electronic circuit design inside the third control chip 231(c). The third control chip 231(c) can be used to convert the original signal S1 from the
因主機板1上的每一連接器14皆可支援多種連接規格,藉此,每一個連接器14可供不同的可拆式模組2連接,而這些可拆式模組2相互之間係具有相同連接規格或不同連接規格,本案並不受限。此外,上述輸入輸出埠24並不限於前述內容,例如亦可以其它常見的輸入輸出接頭或插槽,例如音訊接頭亦可依照前述設計而形成本揭露的可拆式模組2。Because each
此外,控制晶片231亦可具備不同態樣。圖3(B)係本揭露另一實施例的可拆式模組2的控制晶片231的運作情形示意圖,其可拆式模組2的控制晶片231可改為具備多工器的功能,以接收該原始訊號S1(PCIE訊號/USB訊號/音訊訊號),並輸出多數個原始訊號S1(PCIE訊號/USB訊號/音訊訊號)。在一實施例中,控制晶片231的多工器功能至少可透過其內部的電子電路設計的設計來達成。本揭露不限於此。In addition, the
圖4(A)係本揭露一實施例的主機板1與可拆式模組2的組裝示意圖,並請同時參考圖1。如圖1及圖4所示,可拆式模組2可隨時組裝於主機板1或從主機板1上拆除,因此當目前主機板1上的輸入輸出埠類型不符合使用者的需求時,使用者可隨時對主機板1上的可拆式模組2進行更換。藉此,本揭露可避免現有產品不符需求或損壞時所衍生的問題。FIG. 4(A) is a schematic diagram of the assembly of the
圖4(B)係本揭露一實施例的主機板1與可拆式模組2的組裝示意圖,其係圖4(A)結構的一實施例的仰視圖。如圖4(B)所示,可拆式模組2與主機板1可具備相對應的固定元件,例如螺絲孔29,並可透過螺絲而固設在一起,且不限於此。FIG. 4(B) is a schematic diagram of the assembly of the
藉此,本揭露的產品可依照使用者的需求進行變更,而目前不需要或損壞的接頭可隨時替換,因此使得主機板更有效地被利用。In this way, the product of the present disclosure can be changed according to the needs of users, and the currently unnecessary or damaged connectors can be replaced at any time, so that the motherboard can be used more effectively.
上述實施例僅係為了方便說明而舉例而已,本揭露所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。The above-mentioned embodiments are merely examples for the convenience of description, and the scope of rights claimed in this disclosure should be subject to the scope of the patent application, not limited to the above-mentioned embodiments.
1:主機板1: Motherboard
2:可拆式模組2: Detachable module
10:模組設置區域10: Module setting area
12:訊號發送端12: Signal sender
14:連接器14: Connector
141:連接器插槽141: connector slot
22:金手指連接元件22: Golden finger connection element
24:輸入輸出埠24: Input and output port
23:電路板23: circuit board
231:控制晶片231: control chip
25:第一殼體25: The first shell
251:開口251: open
26:第二殼體26: second shell
27、29:螺絲孔27, 29: screw holes
28、30:螺絲28, 30: Screw
2(a):USB規格的可拆式模組2(a): Detachable module of USB specification
2(b):LAN規格的可拆式模組2(b): Detachable module of LAN specification
2(c):WiFi規格的可拆式模組2(c): Detachable module of WiFi specification
231(a):控制晶片231(a): control chip
231(b):控制晶片231(b): control chip
231(c):控制晶片231(c): control chip
S1:原始訊號S1: Original signal
S2:特定規格訊號S2: Specific specification signal
圖1係本揭露一實施例的主機板及可拆式模組的示意圖。FIG. 1 is a schematic diagram of a motherboard and a detachable module according to an embodiment of the disclosure.
圖2(A)係本揭露一實施例的可拆式模組的分解圖。FIG. 2(A) is an exploded view of the detachable module according to an embodiment of the disclosure.
圖2(B)係本揭露另一實施例的可拆式模組的分解圖。FIG. 2(B) is an exploded view of a detachable module according to another embodiment of the present disclosure.
圖2(C)係本揭露另一實施例的可拆式模組的分解圖。FIG. 2(C) is an exploded view of a detachable module according to another embodiment of the present disclosure.
圖3(A)係本揭露一實施例的可拆式模組的控制晶片的運作情形示意圖。FIG. 3(A) is a schematic diagram of the operation of the control chip of the detachable module according to an embodiment of the disclosure.
圖3(B)係本揭露另一實施例的可拆式模組的控制晶片的運作情形示意圖。FIG. 3(B) is a schematic diagram of the operation of the control chip of the detachable module according to another embodiment of the disclosure.
圖4(A)係本揭露一實施例的可拆式模組組裝於主機板的側視圖。FIG. 4(A) is a side view of the detachable module assembled on the motherboard of an embodiment of the present disclosure.
圖4(B)係本揭露一實施例的可拆式模組組裝於主機板的底視圖。FIG. 4(B) is a bottom view of the detachable module assembled on the motherboard of an embodiment of the disclosure.
1:主機板 1: Motherboard
2:可拆式模組 2: Detachable module
10:模組設置區域 10: Module setting area
12:訊號發送端 12: Signal sender
14:連接器 14: Connector
141:連接器插槽 141: connector slot
22:金手指連接元件 22: Golden finger connection element
24:輸入輸出埠 24: Input and output port
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108135086A TWI702491B (en) | 2019-09-27 | 2019-09-27 | Main board and detachable module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108135086A TWI702491B (en) | 2019-09-27 | 2019-09-27 | Main board and detachable module thereof |
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| Publication Number | Publication Date |
|---|---|
| TWI702491B true TWI702491B (en) | 2020-08-21 |
| TW202113539A TW202113539A (en) | 2021-04-01 |
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|---|---|---|---|
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| TW (1) | TWI702491B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM303598U (en) * | 2006-04-27 | 2006-12-21 | Shuttle Inc | Computer mainframe with replaceable input/output module |
| TWM327099U (en) * | 2007-07-05 | 2008-02-11 | June On Co Ltd | Detachable connector |
-
2019
- 2019-09-27 TW TW108135086A patent/TWI702491B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM303598U (en) * | 2006-04-27 | 2006-12-21 | Shuttle Inc | Computer mainframe with replaceable input/output module |
| TWM327099U (en) * | 2007-07-05 | 2008-02-11 | June On Co Ltd | Detachable connector |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202113539A (en) | 2021-04-01 |
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