TWI701145B - Reinforcing film with spacer - Google Patents

Abstract

The present invention provides a reinforcing film with a spacer, which has a reinforcing film and a spacer, and can suppress the peeling static electricity that may be generated when the spacer is peeled off, even if it is attached to an optical member or an electronic member in advance The spacer-attached reinforcement film on the exposed surface side peels off the spacer, which can also reduce damage to the optical component or the electronic component. The reinforcing film with a spacer of the present invention has a reinforcing film P and a spacer Q, and the reinforcing film P includes a base layer A1 and an adhesive layer A2, and the base layer A1 and the adhesive layer A conductive layer C1 and/or an antistatic layer C2 are arranged between A2, and the adhesive layer A2 and the spacer Q are directly laminated.

Description

Reinforcing film with spacer

The present invention relates to a reinforcing film with spacers.

In order to impart rigidity or impact resistance to an optical member, an electronic member, etc., a spacer-attached reinforcement film may be preliminarily bonded to the exposed surface side of the optical member, an electronic member, etc. for reinforcement (Patent Document 1). However, if the spacer is peeled from the spacer-attached reinforcement film bonded to the exposed surface side of an optical member or an electronic member, there is a problem that peeling static electricity is generated and the optical member or electronic member is damaged. [Prior Art Document] [Patent Document] Patent Document 1: Japanese Patent Laid-Open No. 2014-234460

[Problem to be solved by the invention] The problem of the present invention is to provide a reinforcing film with a spacer, which has a reinforcing film and a spacer, and can suppress peeling static electricity that may be generated when the spacer is peeled off The reinforcing film with the spacer, which is attached to the exposed surface side of the optical member or the electronic member in advance, peels off the spacer, and the damage to the optical member or the electronic member can also be reduced. [Technical Means for Solving the Problem] The spacer-attached reinforcing film of the present invention has a reinforcing film P and a spacer Q, and the reinforcing film P includes a base layer A1 and an adhesive layer A2 on the base A conductive layer C1 and/or an antistatic layer C2 are arranged between the layer A1 and the adhesive layer A2, and the adhesive layer A2 and the spacer Q are directly laminated. In one embodiment, the surface resistance of the conductive layer C1 is 1.0×10 ¹⁰ Ω/□ or less. In one embodiment, the surface resistance value of the antistatic layer C2 is 1.0×10 ¹⁰ Ω/□ or less. In one embodiment, the surface of the adhesive layer A2 when peeling off the spacer Q from the reinforcing film P at a temperature of 23°C and a humidity of 50%RH at a peeling angle of 150 degrees and a peeling speed of 10 m/min The peeling static voltage is below 10.0 kV. In one embodiment, the transmittance of the reinforcing film P is 70% or more. In one embodiment, the spacer Q is peeled from the reinforcing film P at a temperature of 23°C and a humidity of 50%RH at a peeling angle of 150° and a peeling speed of 10 m/min. At %RH, a peeling angle of 180 degrees, and a stretching speed of 300 mm/min, the initial adhesion of the adhesive layer A2 to the glass plate is 1.0 N/25 mm or more. In one embodiment, at a temperature of 23°C and a humidity of 50%RH, at a peeling angle of 180 degrees and a stretching speed of 300 mm/min, the peeling force when the spacer Q is peeled from the reinforcing film P is 0.30 N/ Below 25 mm. [Effects of the Invention] According to the present invention, it is possible to provide a spacer-attached reinforcing film, which has a reinforcing film and a spacer, and can suppress peeling static electricity that may be generated when the spacer is peeled off, even if it is attached beforehand By peeling off the spacer with the reinforcing film on the exposed surface side of the optical member or electronic member, etc., the damage to the optical member or electronic member can also be reduced.

[產業上之可利用性] 本發明之附隔件之補強用膜可用於貼合於半導體元件之基板之背面側等之補強用膜。In this manual, when there is the expression "mass", it can also be renamed as "weight", which is generally used as the unit of lightness and weight. On the contrary, in this manual, when there is the expression "weight" , Can also be renamed as "mass" which is used to express the weight of the SI system. In this manual, when there is the expression "(meth)acrylic acid", it means "acrylic acid and/or methacrylic acid"; when there is the expression "(meth)acrylate", it means Refers to "acrylate and/or methacrylate"; when there is the expression "(meth)allyl", it means "allyl and/or methallyl"; when there is " In the case of the expression "(meth)acrolein", it means "acrolein and/or methacrolein". ""Reinforcing film with spacer"" The reinforcing film with spacer of the present invention has a reinforcing film P and a spacer Q. As long as the reinforcing film with a spacer of the present invention has the reinforcing film P and the spacer Q, it may have any appropriate other layer within a range that does not impair the effects of the present invention. In the reinforcing film with a spacer of the present invention, the reinforcing film P includes a base layer A1 and an adhesive layer A2, and a conductive layer C1 and/or antistatic layer are arranged between the base layer A1 and the adhesive layer A2 Layer C2, adhesive layer A2 and spacer Q are directly laminated. As the thickness of the reinforcing film with a spacer of the present invention, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effect of the present invention. The thickness is preferably 9 μm to 1300 μm, more preferably 20 μm to 1050 μm, still more preferably 35 μm to 900 μm, and particularly preferably 45 μm to 750 μm. "Film P for Reinforcement" As the thickness of the film P for reinforcement, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effects of the present invention. The thickness is preferably 5 μm to 800 μm, more preferably 10 μm to 650 μm, still more preferably 20 μm to 550 μm, and particularly preferably 25 μm to 450 μm. The reinforcing film P includes a base layer A1 and an adhesive layer A2, and a conductive layer C1 and/or an antistatic layer C2 are arranged between the base layer A1 and the adhesive layer A2. As long as the reinforcing film P has such a structure as described above, any appropriate other layer may be included depending on the purpose within a range that does not impair the effect of the present invention. One embodiment of the reinforcing film P is shown in FIG. 1 and includes a base layer A1, a conductive layer C1, and an adhesive layer A2. Another embodiment of the reinforcing film P is shown in FIG. 2 and includes a base layer A1, an antistatic layer C2, and an adhesive layer A2. The reinforcing film P may have an antistatic layer A3 on the side opposite to the adhesive layer A2 of the base layer A1. However, the reinforcing film with spacers of the present invention has the conductive layer C1 and/or the antistatic layer C2 disposed between the base layer A1 and the adhesive layer A2, so even if it does not have the antistatic layer A3, it can be sufficient Show the effect of the present invention. <Base material layer A1> As the base material layer A1, a base material formed of any appropriate material can be used depending on the purpose within a range that does not impair the effects of the present invention. Examples of such materials include resin sheets, nonwoven fabrics, paper, metal foils, woven fabrics, rubber sheets, foamed sheets, and laminates of these (especially laminates containing resin sheets). Examples of the resin constituting the resin sheet include: polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), and polymethacrylic acid Acrylic resins such as methyl ester (PMMA), polycarbonate, triacetyl cellulose (TAC), polysulfide, polyarylate, polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene- Vinyl acetate copolymer (EVA), polyamide (nylon), fully aromatic polyamide (aromatic polyamide), polyimide (PI), polyvinyl chloride (PVC), polyvinyl acetate, Polyphenylene sulfide (PPS), fluororesin, polyether ether ketone (PEEK), cyclic olefin polymer, etc. Examples of non-woven fabrics include non-woven fabrics made of natural fibers having heat resistance such as non-woven fabrics containing manila hemp; synthetic resin non-woven fabrics such as polypropylene resin non-woven fabrics, polyethylene resin non-woven fabrics, and ester-based resin non-woven fabrics. The base material layer A1 may have only one layer, or two or more layers. As the thickness of the substrate layer A1, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effect of the present invention. The thickness is preferably 4 μm to 500 μm, more preferably 10 μm to 400 μm, still more preferably 15 μm to 350 μm, and particularly preferably 20 μm to 300 μm. The base material layer A1 may also contain an antistatic agent. As the base material layer A1 containing an antistatic agent, for example, a resin sheet kneaded with an antistatic agent can be used. Such a resin sheet can be formed of a composition for forming a base layer A1 containing a resin and an antistatic agent. The base material layer A1 itself can also function as an antistatic agent. For example, when metal foil is used as the material of the base layer A1, the base layer A1 itself can function as an antistatic agent. The substrate layer A1 may be surface-treated. Examples of surface treatments include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, and coating treatment with a primer. Examples of the organic coating material include materials described in Plastic Hard Coating Material II (CMC Publishing, (2004)). As such an organic coating material, a urethane-based polymer is preferably used, and more preferably, polyacrylate urethane, polyester urethane, or these precursors. The reason is that the coating and coating of the substrate layer A1 are relatively simple, and it is industrially selectable in many kinds and can be obtained inexpensively. Examples of such a urethane-based polymer include a polymer containing a reaction mixture of an isocyanate monomer and an alcoholic hydroxyl group-containing monomer (for example, a hydroxyl group-containing acrylic compound or a hydroxyl group-containing ester compound). The organic coating material may also contain chain extenders such as polyamines, anti-aging agents, oxidation stabilizers, etc. as optional additives. In the base material layer A1, within a range that does not impair the effect of the present invention, any appropriate other additives may be included depending on the purpose. <Adhesive layer A2> As the thickness of the adhesive layer A2, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effect of the present invention. The thickness is preferably 1 μm to 300 μm, more preferably 2 μm to 250 μm, still more preferably 4 μm to 200 μm, and particularly preferably 5 μm to 150 μm. The adhesive layer A2 may be only one layer, or two or more layers. The adhesive layer A2 is formed of the adhesive composition a2. As long as it is a method which can form the adhesive composition a2 into a layer, the adhesive layer A2 can be formed by any appropriate method. For example, the adhesive layer A2 can be formed by coating the adhesive composition a2 on any suitable substrate, and performing heating or the like, or irradiation with active energy rays (ultraviolet rays, etc.) as necessary. The adhesive composition a2 preferably contains an acrylic polymer. The acrylic polymer is preferably an acrylic polymer obtained by polymerizing the following monomer components, the monomer component being a (meth)acrylic acid alkyl group having 4 to 12 carbon atoms Ester (sometimes referred to as "(meth)acrylate C4-C12 alkyl ester") as the main component, and 1 part by weight to 10 parts by weight of the carboxyl group-containing monomer relative to 100 parts by weight of the total monomer component Monomer components. The content ratio of the acrylic polymer in the adhesive composition a2 is preferably 50% by weight or more in terms of solid content, more preferably 50% to 99.99% by weight, and still more preferably 55% to 99% by weight, It is particularly preferably 60% by weight to 95% by weight, and most preferably 70% by weight to 90% by weight. As the C4-C12 alkyl (meth)acrylate, as long as it is an alkyl (meth)acrylate (alkyl acrylate, alkyl methacrylate) with the alkyl group having 4 to 12 carbon atoms, it will not be damaged Within the scope of the effects of the present invention, any appropriate C4-C12 alkyl (meth)acrylate can be used depending on the purpose. As such C4-C12 (meth)acrylate alkyl esters, for example, n-butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, (meth)acrylate ) Tert-butyl acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate , Isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, ten (meth)acrylate Monoalkyl ester, dodecyl (meth)acrylate, etc. Among such C4-C12 alkyl (meth)acrylates, n-butyl (meth)acrylate is preferred. The C4-C12 (meth)acrylate C4-C12 alkyl ester as the main component of the monomer component may be only one type, or two or more types. The content ratio of C4-C12 alkyl (meth)acrylate in the total monomer component is preferably 50% by weight to 99% by weight, more preferably 80% by weight to 98% by weight, and still more preferably 90% by weight ~97% by weight. If the content ratio of the C4-C12 alkyl (meth)acrylate is within the above range, the effect of the present invention can be further exhibited. The monomer component includes a carboxyl group-containing monomer. Examples of such carboxyl group-containing monomers include (meth)acrylic acid (acrylic acid, methacrylic acid), itaconic acid, maleic acid, fumaric acid, crotonic acid, and the like. In addition, the acid anhydrides of the carboxyl group-containing monomers (for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride) can also be cited as carboxyl group-containing monomers. As such a carboxyl group-containing monomer, acrylic acid is preferred. The content ratio of the carboxyl group-containing monomer in the total monomer component is preferably 1% by weight to 10% by weight, more preferably 3% by weight to 10% by weight, and still more preferably 3% by weight to 5% by weight. If the content ratio of the carboxyl group-containing monomer in the total monomer component is within the above range, the effect of the present invention can be further exhibited. The monomer components used to obtain the acrylic polymer by polymerization may optionally include monomers capable of copolymerizing with C4-C12 alkyl (meth)acrylate or monomers containing carboxyl groups (copolymerizable monomers) ). The content ratio of such a copolymerizable monomer is preferably less than 50% by weight with respect to the total amount of monomer components. In order to exhibit good adhesiveness, the content ratio of such copolymerizable monomers is more preferably such that the glass transition temperature of the acrylic polymer obtained is -20°C or less, and more preferably -70°C～ -35℃ content ratio. As a copolymerizable monomer, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, etc. (meth)acrylic acid C1- C3 alkyl ester; tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, cetyl (meth)acrylate, ( Heptadecyl (meth)acrylate, stearyl (meth)acrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate, etc. (meth)acrylate C13- C20 alkyl ester; (meth)acrylic acid esters containing non-aromatic ring, such as cycloalkyl (meth)acrylate (cyclohexyl (meth)acrylate, etc.), or iso(meth)acrylate, etc. ; (Meth) aryl acrylate ((meth) phenyl acrylate, etc.), (meth) aryloxy alkyl acrylate ((meth) phenoxy ethyl, etc.), or (meth) Aryl alkyl acrylate ((meth)acrylate benzyl ester) and other aromatic ring-containing (meth)acrylates; glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, etc. Epoxy acrylic monomers; vinyl acetate, vinyl propionate and other vinyl ester monomers; styrene, α-methylstyrene and other styrene monomers; (meth) hydroxyethyl acrylate, ( Hydroxyl-containing monomers such as hydroxypropyl meth)acrylate and hydroxybutyl (meth)acrylate; (meth)acrylic acid such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate Alkoxyalkyl ester monomers; olefin monomers such as ethylene, propylene, isoprene, butadiene; vinyl ether monomers such as vinyl ether, etc. Examples of copolymerizable monomers include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl Glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, glycerol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, Dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester acrylate, urethane acrylate, divinylbenzene, butyl di(meth)acrylate, hexyl di(meth)acrylate, etc. Functional monomer. Examples of copolymerizable monomers include monomers containing nitrogen atoms (for example, aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and (meth)acrylic acid). (Meth)acrylic acid aminoalkyl ester monomers such as tertiary butylaminoethyl; (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-butyl (N-substituted) amide-based monomers such as (meth)acrylamide and N-hydroxy(meth)acrylamide; cyanoacrylate-based monomers such as acrylonitrile and methacrylonitrile; isocyanate 2 -Monomers containing isocyanate groups, such as methacryloxyethyl, etc.). However, since this nitrogen-containing monomer may cause yellowing of the adhesive under heating, it is better not to use it when it is not necessary to use it. The acrylic polymer can be prepared by any appropriate polymerization method within a range that does not impair the effects of the present invention. The polymerization method of acrylic polymer includes, for example, a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, and a polymerization method based on ultraviolet irradiation. In terms of transparency, water resistance, cost, etc., a solution is preferred. Polymerization method. Regarding the polymerization initiator, chain transfer agent, etc., which can be used in the polymerization of the acrylic polymer, any appropriate one can be used within the range that does not impair the effect of the present invention. The amount of the polymerization initiator used can be any appropriate amount within a range that does not impair the effects of the present invention. As such a usage amount, for example, 0.01% by weight to 1% by weight relative to the total amount of monomer components is preferable. The use amount of the chain transfer agent can be any appropriate amount within a range that does not impair the effect of the present invention. As such a usage amount, it is preferable that it is 0.01 weight%-15 weight% with respect to the total amount of monomer components, for example. In the solution polymerization method, various common solvents can be used. Examples of such solvents include: esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methylcyclohexane Alicyclic hydrocarbons such as alkanes; organic solvents such as ketones such as methyl ethyl ketone and methyl isobutyl ketone. The solvent may be only one type or two or more types. The weight average molecular weight of the acrylic polymer is preferably 500,000 to 900,000, more preferably 550,000 to 850,000, and still more preferably 600,000 to 800,000. If the weight average molecular weight of the acrylic polymer is within the above range, the effects of the present invention can be further exhibited. The weight average molecular weight of acrylic polymer can be controlled by the type of polymerization initiator or chain transfer agent or its usage, the temperature or time during polymerization, as well as the monomer concentration, monomer dropping rate, etc. Take control. The adhesive composition a2 may also contain an oligomer component. The oligomer component is preferably an oligomer component obtained by polymerizing the following monomer components, which have a glass transition temperature of 60°C to 190°C and a cyclic structure when forming a homopolymer The ethylenically unsaturated monomer (sometimes referred to as "ring-containing ethylenically unsaturated monomer with Tg of 60°C～190°C") as the main component, and contains 1 weight per 100 weight parts of the total monomer components Parts ~ 10 parts by weight of carboxyl group-containing monomer. The oligomer component may also be an oligomer component obtained by polymerizing an ethylenically unsaturated monomer whose glass transition temperature when forming a homopolymer is 60°C or higher, and Has a ring structure. In the oligomer component, as a ring-containing ethylenic unsaturated monomer with a Tg of 60°C to 190°C, as long as the glass transition temperature (Tg) when forming a homopolymer is 60°C to 190°C and within the molecule For the ethylenically unsaturated monomer having a cyclic structure, any appropriate monomer component can be used within the range that does not impair the effect of the present invention. The ring in the ring-containing ethylenically unsaturated monomer having a Tg of 60°C to 190°C may be either an aromatic ring or a non-aromatic ring, and a non-aromatic ring is preferred. As the aromatic ring, for example, an aromatic hydrocarbon ring (for example, a benzene ring or a condensed carbocyclic ring in naphthalene, etc.), various aromatic heterocyclic rings, and the like can be cited. Examples of the non-aromatic ring include: non-aromatic alicyclic rings (cycloalkane rings such as cyclopentane ring, cyclohexane ring, cycloheptane ring, and cyclooctane ring; cycloolefin rings such as cyclohexene ring Ring, etc.), non-aromatic bridged rings (for example, bicyclic hydrocarbon ring in pinane, pinene, quinane, noralane, norene, etc.; tricyclic hydrocarbon ring in adamantane, etc.; four Bridged hydrocarbon ring such as cyclic hydrocarbon ring, etc.). As a ring-containing ethylenically unsaturated monomer with a Tg of 60°C to 190°C, for example, the glass transition temperature when forming a homopolymer can be appropriately selected from the following ethylenically unsaturated monomers having a cyclic structure in the molecule Those at 60℃～190℃: Cycloalkyl (meth)acrylate such as cyclohexyl (meth)acrylate, or (meth)acrylic acid containing non-aromatic ring, such as iso(meth)acrylate Esters; aryl (meth)acrylates such as phenyl (meth)acrylate, aryloxyalkyl (meth)acrylates such as phenoxyethyl (meth)acrylate, or benzyl (meth)acrylate Aromatic ring-containing (meth)acrylates such as (meth)acrylic acid arylalkyl esters; styrene or α-methylstyrene and other styrene monomers. As the ring-containing ethylenically unsaturated monomer with a Tg of 60°C to 190°C, cyclohexyl methacrylate, iso-(meth)acrylate and other non-aromatic ring (a In terms of transparency, cyclohexyl methacrylate can be more preferably cited for the base) acrylate. The ring-containing ethylenically unsaturated monomer having a Tg of 60°C to 190°C may be only one type or two or more types. Regarding the content ratio of the ring-containing ethylenically unsaturated monomer with a Tg of 60°C to 190°C, relative to the total amount of monomer components, it is preferably 50% by weight or more, more preferably 80% to 99% by weight, and further It is preferably 90% by weight to 97% by weight. If the content ratio of the ring-containing ethylenically unsaturated monomer with Tg of 60°C to 190°C is within the above range, the effect of the present invention can be further exhibited. The oligomer component may also contain a carboxyl group-containing monomer as a monomer component. Such carboxyl group-containing monomers are the same as the carboxyl group-containing monomers that can constitute acrylic polymers, for example: (meth)acrylic acid, itaconic acid, maleic acid, and fumaric acid , Crotonic acid, etc. In addition, the acid anhydrides of the carboxyl group-containing monomers (for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride) can also be cited as carboxyl group-containing monomers. As such a carboxyl group-containing monomer, acrylic acid is preferred. Regarding the content ratio of the carboxyl group-containing monomer which can constitute the oligomer component, relative to 100 parts by weight of the total monomer component, it is preferably 1 part by weight to 10 parts by weight, preferably 3 parts by weight to 10 parts by weight, More preferably, it is 3 to 5 parts by weight. If the content ratio of the carboxyl group-containing monomer is within the above range, the effect of the present invention can be further exhibited. As a monomer component that can constitute an oligomer component, it may optionally include a monomer capable of copolymerizing with a ring-containing ethylenic unsaturated monomer or a carboxyl group-containing monomer with a Tg of 60°C to 190°C (copolymerizable monomer body). The content ratio of such a copolymerizable monomer is preferably less than 50% by weight with respect to 100 parts by weight of the total monomer component. In terms of exhibiting good adhesiveness, the content ratio of such copolymerizable monomers is preferably such that the glass transition temperature of the oligomer component is preferably 60°C or higher, and more preferably 65°C to 180°C. ℃ content ratio. As a copolymerizable monomer, the same thing as the said copolymerizable monomer can be used, and the said copolymerizable single system is demonstrated as what can be contained in the monomer component for obtaining an acrylic polymer by polymerization. The copolymerizable monomer may be one type or two or more types. The oligomer component can be prepared by any appropriate polymerization method within a range that does not impair the effects of the present invention. The polymerization method of acrylic polymer includes, for example, a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, and a polymerization method based on ultraviolet irradiation. In terms of transparency, water resistance, cost, etc., a solution is preferred. Polymerization method. Regarding the polymerization initiator, chain transfer agent, etc., which can be used in the polymerization of the oligomer component, any appropriate one can be adopted within the range that does not impair the effect of the present invention. The amount of the polymerization initiator used can be any appropriate amount within a range that does not impair the effects of the present invention. As such a usage amount, for example, 0.1% by weight to 15% by weight relative to the total amount of monomer components is preferable. The use amount of the chain transfer agent can be any appropriate amount within a range that does not impair the effect of the present invention. As such a usage amount, it is preferable that it is 0.01 weight%-15 weight% with respect to the total amount of monomer components, for example. In the solution polymerization method, various common solvents can be used. Examples of such solvents include: esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methylcyclohexane Alicyclic hydrocarbons such as alkanes; organic solvents such as ketones such as methyl ethyl ketone and methyl isobutyl ketone. The solvent may be only one type or two or more types. The weight average molecular weight of the oligomer component is preferably 3000 to 6000, more preferably 3300 to 5500, and still more preferably 3500 to 5000. If the weight average molecular weight of the oligomer component is within the above range, the effects of the present invention can be further exhibited. The weight average molecular weight of the oligomer component can be controlled by the type or amount of polymerization initiator or chain transfer agent, the temperature or time during polymerization, as well as the monomer concentration, monomer dropping rate, etc. Take control. The adhesive composition a2 preferably contains the above-mentioned acrylic polymer and the above-mentioned oligomer component. If the adhesive composition a2 contains acrylic polymer and oligomer components, it can exhibit excellent transparency, and can exhibit excellent anti-swelling and peeling properties (resistance to foaming and peeling) due to the fact that the interface is not prone to swelling or peeling Sex). When the adhesive composition a2 contains an acrylic polymer and an oligomer component, as the ratio of the acrylic polymer to the oligomer component, the oligomer component is preferably 10 relative to 100 parts by weight of the acrylic polymer Parts by weight to 35 parts by weight, more preferably 15 parts by weight to 30 parts by weight. When the adhesive composition a2 contains an acrylic polymer and an oligomer component, if the ratio of the acrylic polymer to the oligomer component is within the above range, the effect of the present invention can be further exhibited. In addition to the acrylic polymer and oligomer components, the adhesive composition a2 may optionally contain a crosslinking agent, a silane coupling agent, a solvent, an ultraviolet absorber, an antioxidant, a light stabilizer, an anti-aging agent, and an adhesion imparting agent. Agents, plasticizers, softeners, fillers, colorants (pigments or dyes, etc.), surfactants, conductive ingredients (ionic liquids, ion conductive polymers, ion conductive fillers, conductive polymers, etc.), antistatic agents And other well-known additives. These additives may be only one type or two or more types. As the ionic liquid, any appropriate ionic liquid can be used within a range that does not impair the effects of the present invention. As such an ionic liquid, the ionic liquid described in Unexamined-Japanese-Patent No. 2016-108442 can be mentioned, for example. As the ion conductive polymer, any appropriate ion conductive polymer can be used within a range that does not impair the effects of the present invention. As such an ion conductive polymer, for example, an ion conductive polymer obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium salt group; polythiophene, polyaniline, polypyrrole, polyethylene ethylene Conductive polymers such as amines and allylamine polymers. There may be only one type of ion conductive polymer, or two or more types. As the ion conductive filler, any appropriate ion conductive filler can be used within a range that does not impair the effects of the present invention. Examples of such ion conductive fillers include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, and iron. , Cobalt, copper iodide, ITO (indium oxide/tin oxide), ATO (antimony oxide/tin oxide), etc. There may be only one type of ion conductive filler, or two or more types. As the conductive polymer, any appropriate conductive polymer can be used within a range that does not impair the effects of the present invention. Examples of such conductive polymers include (3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid) and the like. In the adhesive composition a2, it is particularly preferable to include the crosslinking agent among the above additives. By using a crosslinking agent to crosslink the acrylic polymer or oligomer component, the cohesive force as an adhesive can be further increased. The crosslinking agent may be only one type or two or more types. As the crosslinking agent, in addition to isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, Linking agent, metal chelate crosslinking agent, metal salt crosslinking agent, carbodiimide crosslinking agent, azoline crosslinking agent, aziridine crosslinking agent, amine crosslinking agent Wait. Among them, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferred. The content of the isocyanate-based crosslinking agent can be set to any appropriate amount according to the required adhesive force, relative to 100 parts by weight of the acrylic polymer, preferably 0.01 part by weight to 20 parts by weight, more preferably 0.01 part by weight to 10 parts by weight Parts by weight, more preferably 0.03 parts by weight to 5 parts by weight. The content of the epoxy-based crosslinking agent can be set to any appropriate amount according to the required adhesive force, relative to 100 parts by weight of the acrylic polymer, preferably 0.01 part by weight to 20 parts by weight, more preferably 0.01 part by weight to 10 parts by weight, more preferably 0.03 parts by weight to 5 parts by weight. The adhesive composition a2 can be prepared, for example, by mixing other additives such as an acrylic polymer, an oligomer component as needed, and a crosslinking agent as needed. As a method of forming the adhesive layer A2 from the adhesive composition a2, any appropriate method can be adopted within the range that does not impair the effect of the present invention. For example, the adhesive composition a2 is coated on any suitable substrate (for example, a PET substrate, etc.), and heated, dried, etc., to form the adhesive layer A2. Preferably, the adhesive composition a2 is applied on the substrate layer A1 and heated, dried, etc., to form the adhesive layer A2. To apply the adhesive composition a2, for example, any appropriate coating method can be used. As such a coating method, for example, a coating method using the following conventional coaters: gravure roll coater, reverse roll coater, touch roll coater, dip roll coater, bar type Coater, knife coater, spray coater, chipped wheel coater, direct coater, etc. <Conductive layer C1> The conductive layer C1 can be arranged between the base material layer A1 and the adhesive layer A2. The conductive layer C1 may be only one layer, or two or more layers. The conductive layer C1 can be provided by being formed on any suitable substrate. As such a substrate, the substrate layer A1 is preferred. The conductive layer C1 can be formed by any suitable thin film forming method such as vacuum evaporation, sputtering, ion plating, spray thermal decomposition, electroless plating, electroplating, or a combination of these. A conductive film is formed on the substrate (preferably, the substrate layer A1). Among these thin film forming methods, the vacuum vapor deposition method or the sputtering method is preferable in terms of the formation speed of the conductive film, the formation of a large area film, and the productivity. As the material for forming the conductive film, for example, metal-based materials including gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, alloys of these, etc. can be used; including indium oxide , Tin oxide, titanium oxide, cadmium oxide, metal oxide materials such as mixtures of these; other metal compounds including copper iodide, etc. As the thickness of the conductive layer C1, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effect of the present invention. As such a thickness, for example, when it is formed of a metal-based material, it is preferably 30 Å to 600 Å, and when it is formed of a metal oxide-based material, it is preferably 80 Å to 5000 Å. The surface resistance of the conductive layer C1 is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 1.0×10 ⁹ Ω/□ or less, still more preferably 1.0×10 ⁸ Ω/□ or less, particularly preferably 1.0×10 Below ⁷ Ω/□. When the conductive film is formed on any suitable substrate (preferably the substrate layer A1), the surface of the substrate (preferably the substrate layer A1) can also be subjected to corona discharge treatment, ultraviolet radiation treatment, Any appropriate pretreatment such as plasma treatment, sputtering etching treatment, primer coating treatment, etc. improves the adhesion between the conductive film and the substrate (preferably the substrate layer A1). <Antistatic layer C2> The antistatic layer C2 can be arranged between the base material layer A1 and the adhesive layer A2. The antistatic layer C2 may be only one layer, or two or more layers. As the thickness of the antistatic layer C2, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effect of the present invention. The thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm. The surface resistance value of the antistatic layer C2 is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 8.0×10 ⁹ Ω/□ or less, further preferably 5.0×10 ⁹ Ω/□ or less, particularly preferably 1.0× 10 ⁹ Ω/□ or less. As the antistatic layer C2, as long as it is a layer that can exert an antistatic effect, any appropriate antistatic layer can be used within a range that does not impair the effect of the present invention. As such an antistatic layer, an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any suitable substrate layer is preferred. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the substrate layer A1. After coating, it is dried if necessary, and hardening treatment (heat treatment, ultraviolet treatment, etc.) is performed if necessary. As a specific coating method, a roll coating method, a bar coating method, a gravure coating method, etc. are mentioned. As the conductive coating liquid containing a conductive polymer, any appropriate conductive coating liquid can be used within a range that does not impair the effects of the present invention. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent, and a solvent. Since the solvent substantially disappears by volatilization or evaporation during the process of forming the antistatic layer C2, the antistatic layer C2 preferably includes a conductive polymer, a binder, and a crosslinking agent. Examples of the solvent include organic solvents, water, or mixed solvents of these. Examples of organic solvents include: esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone, and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; n-hexane and cyclohexane Aliphatic or alicyclic hydrocarbons; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; alkylene glycol Glycol ethers such as monoalkyl ether (for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether), dialkylene glycol monoalkyl ether, and the like. As the solvent, water or a mixed solvent containing water as the main component (for example, a mixed solvent of water and ethanol) is preferable. The content ratio of the conductive polymer in the antistatic layer C2 is preferably 3% by weight to 80% by weight, more preferably 5% to 60% by weight. As the conductive polymer, any appropriate conductive polymer can be used within a range that does not impair the effects of the present invention. As such a conductive polymer, for example, a π-conjugated conductive polymer is doped with a polyanion, and the like. Examples of the π-conjugated conductive polymer include chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of polyanions include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacrylic ethyl sulfonic acid, polymethacrylic acid, and the like. There may be only one type of conductive polymer, or two or more types. The content ratio of the binder in the antistatic layer C2 is preferably 50% by weight to 95% by weight, more preferably 60% by weight to 90% by weight. As the binder that can be included in the conductive coating liquid, any suitable binder can be used within the range that does not impair the effect of the present invention. The binder may be only one type, or two or more types. As such a binder, resin is preferable, and polyester resin is more preferable. The ratio of the polyester resin in the adhesive is preferably 90% by weight to 100% by weight, more preferably 98% by weight to 100% by weight. The polyester resin preferably contains polyester as a main component (preferably more than 50% by weight, more preferably more than 75% by weight, still more preferably more than 90% by weight, particularly preferably a component that accounts for substantially 100% by weight) . As the polyester, any appropriate polyester can be used within a range that does not impair the effects of the present invention. As such a polyester, it is preferable to have a structure selected from polycarboxylic acids having two or more carboxyl groups in one molecule (such as dicarboxylic acid compounds) and derivatives thereof (such as anhydrides of polycarboxylic acids). , Esters, halides, etc.), one or more compounds (polycarboxylic acid components), and one selected from polyols (e.g. diols) having two or more hydroxyl groups in one molecule Or two or more compounds (polyol components) condensed. As the polycarboxylic acid component, any appropriate polycarboxylic acid can be used within a range that does not impair the effects of the present invention. As such a polycarboxylic acid component, for example, oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)- Malic acid, mesotartaric acid, itaconic acid, maleic acid, methyl maleic acid, fumaric acid, methyl fumaric acid, acetylene dicarboxylic acid, glutaric acid, six Fluoroglutaric acid, methylglutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyl adipic acid, dimethyl adipic acid, tetramethyl adipic acid, methylene Adipic acid, muconic acid, galactaric acid, pimelic acid, suberic acid, perfluorosuccinic acid, 3,3,6,6-tetramethyl suberic acid, azelaic acid, sebacic acid, Aliphatic dicarboxylic acids such as perfluorosebacic acid, tridecane dicarboxylic acid, dodecyl dicarboxylic acid, tridecyl dicarboxylic acid, tetradecyl dicarboxylic acid; cycloalkyl dicarboxylic acid (for example 1,4-Cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4-(2-Norene) dicarboxylic acid, 5-Norene-2,3-dicarboxylate Acid (bicycloheptene dicarboxylic acid), adamantane dicarboxylic acid, spiroheptane dicarboxylic acid and other alicyclic dicarboxylic acids; phthalic acid, isophthalic acid, dithioisophthalic acid, methyl isophthalic acid Phthalic acid, dimethyl isophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methyl terephthalic acid, dimethyl terephthalic acid, chloroterephthalic acid , Bromoterephthalic acid, naphthalene dicarboxylic acid, pendant oxodicarboxylic acid, anthracene dicarboxylic acid, biphenyl dicarboxylic acid, biphenyl dicarboxylic acid, dimethyl biphenyl dicarboxylic acid, 4,4"-p-extended triphenyl dicarboxylic acid, 4,4"-p-extended tetraphenyl dicarboxylic acid, bibenzyl dicarboxylic acid, azobenzene dicarboxylic acid, high phthalic acid, Phenylene diacetic acid, phenylene dipropionic acid, naphthalenedicarboxylic acid, naphthalenedipropionic acid, biphenyl diacetic acid, biphenyl dipropionic acid, 3,3'-[4,4'-(methylene two Aromatics such as p-biphenyl)dipropionic acid, 4,4'-bibenzyl diacetic acid, 3,3'(4,4'-bibenzyl)dipropionic acid, oxydiparaphenylene diacetic acid, etc. Anhydrides of any of the above-mentioned polycarboxylic acids; esters of any of the above-mentioned polycarboxylic acids (such as alkyl esters, monoesters, diesters, etc.); and halides corresponding to any of the above-mentioned polycarboxylic acids (such as Dicarboxylic acid chloride) and so on. Examples of the polycarboxylic acid component include: aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid and their anhydrides; adipic acid, sebacic acid, azelaic acid, and succinic acid Aliphatic dicarboxylic acids such as acid, fumaric acid, maleic acid, bicycloheptene dicarboxylic acid, 1,4-cyclohexane dicarboxylic acid and their anhydrides; lower alkyl esters of these dicarboxylic acids (For example, esters with monoalcohols having 1 to 3 carbon atoms) and the like. As the polyol component, any appropriate polyol can be used within a range that does not impair the effects of the present invention. As such a polyol component, for example, ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentane Alcohol, 2-methyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, benzenedimethanol, hydrogenated bisphenol A. Diols such as bisphenol A; alkylene oxide adducts of these diols (for example, ethylene oxide adducts, propylene oxide adducts, etc.). Regarding the molecular weight of the polyester resin, as a weight average molecular weight (Mw) in terms of standard polystyrene measured by gel permeation chromatography (GPC), it is preferably 5×10 ³ to 1.5×10 ⁵ , more preferably It is 1×10 ⁴ ～6×10 ⁴ . The glass transition temperature (Tg) of the polyester resin is preferably 0°C to 120°C, more preferably 10°C to 80°C. As the polyester resin, for example, a commercially available brand name "Vylonal" manufactured by Toyobo Co., Ltd. can be used. The conductive coating liquid may further contain resins other than polyester resins (for example, selected from acrylic resins, acrylic urethane resins, acrylic styrene resins, acrylic polysiloxane resins, etc.) within the range that does not impair the effects of the present invention. , At least one of polysiloxane resin, polysilazane resin, polyurethane resin, fluororesin, and polyolefin resin) is used as an adhesive. As the crosslinking agent that can be contained in the conductive coating liquid, any appropriate crosslinking agent can be used within a range that does not impair the effects of the present invention. The crosslinking agent may be only one type or two or more types. As such a crosslinking agent, in addition to isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkane Oxide crosslinking agent, metal chelate crosslinking agent, metal salt crosslinking agent, carbodiimide crosslinking agent, azoline crosslinking agent, aziridine crosslinking agent, amine Department of crosslinking agent and so on. Among them, melamine-based crosslinking agents are preferred. The content ratio of the crosslinking agent in the antistatic layer C2 is preferably 1% by weight to 30% by weight, more preferably 2% by weight to 20% by weight. The antistatic layer C2 may contain any appropriate other components within a range that does not impair the effect of the present invention. <Antistatic layer A3> As the thickness of the antistatic layer A3, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effect of the present invention. The thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm. The antistatic layer A3 may be only one layer, or two or more layers. As the antistatic layer A3, as long as it is a layer that can exert an antistatic effect, any appropriate antistatic layer can be used within a range that does not impair the effect of the present invention. As a method of forming such an antistatic layer, the method described in the item of <Antistatic Layer C2> can be preferably cited. As the conductive polymer, any appropriate conductive polymer can be used within a range that does not impair the effects of the present invention. Examples of such a conductive polymer include the conductive polymers described in the item of <Antistatic Layer C2>. "Spacer Q" As the thickness of the spacer Q, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effect of the present invention. The thickness is preferably 4 μm to 500 μm, more preferably 10 μm to 400 μm, still more preferably 15 μm to 350 μm, and particularly preferably 20 μm to 300 μm. <Base material layer B1> It is preferable that the spacer Q contains the base material layer B1. As the base material layer B1, a base material formed of any appropriate material can be used depending on the purpose within a range that does not impair the effects of the present invention. Examples of such a material include those exemplified in the item of <base material layer A1>. The base material layer B1 may have only one layer, or two or more layers. As the thickness of the substrate layer B1, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effect of the present invention. The thickness is preferably 4 μm to 500 μm, more preferably 10 μm to 400 μm, still more preferably 15 μm to 350 μm, and particularly preferably 20 μm to 300 μm. The base material layer B1 may also contain the antistatic agent described later. As the base material layer B1 containing an antistatic agent, for example, a resin sheet kneaded with an antistatic agent can be used. Such a resin sheet can be formed of a composition for forming a base layer B1 containing a resin and an antistatic agent. The base layer B1 itself can also function as an antistatic agent. For example, when metal foil is used as the material of the base layer B1, the base layer B1 itself can function as an antistatic agent. The substrate layer B1 may be surface-treated. Examples of surface treatments include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, and coating treatment with a primer. Examples of the organic coating material include those exemplified in the item of <base material layer A1>. In the base material layer B1, within a range that does not impair the effects of the present invention, any appropriate other additives may be included depending on the purpose. The base material layer B1 may be subjected to mold release treatment. As the demolding treatment, any appropriate demolding treatment can be adopted within a range that does not impair the effects of the present invention. In this case, it is preferable that the surface subjected to the mold release treatment is the adhesive layer A2 side. <Release layer B2> The spacer Q may have a release layer B2. In this case, it is preferable that the release layer B2 is on the side of the adhesive layer A2. Preferably, a release layer B2 is provided to improve the releasability of the self-adhesive layer A2. Regarding the forming material of the release layer B2, any appropriate forming material can be used within a range that does not impair the effect of the present invention. Examples of such forming materials include silicone-based mold release agents, fluorine-based mold release agents, long-chain alkyl-based mold release agents, and fatty amide-based mold release agents. Among them, a silicone mold release agent is preferred. The release layer B2 can be formed in the form of a coating layer. As the thickness of the release layer B2, any appropriate thickness can be adopted depending on the purpose within a range that does not impair the effect of the present invention. The thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, still more preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm. The release layer B2 may be only one layer, or two or more layers. As a silicone mold release layer, an addition reaction type silicone resin is mentioned, for example. Examples include: KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-847T manufactured by Shin-Etsu Chemical Industry; TPR-6700, TPR-6710, TPR-6721 manufactured by Toshiba Silicone; Dow SD7220, SD7226, etc. manufactured by Corning Toray. The coating amount (after drying) of the silicone-based release layer is preferably 0.01 g/m ² ～2 g/m ² , more preferably 0.01 g/m ² ～1 g/m ² , and still more preferably 0.01 g/m ² ～0.5 g/m ² . The formation of the release layer B2 can be carried out, for example, by applying the above-mentioned forming material to any appropriate layer using a previously known coating method such as reverse gravure coating, bar coating, die nozzle coating, etc. After application, it is usually cured by heat treatment at about 120°C to 200°C. Furthermore, if necessary, heat treatment and active energy ray irradiation such as ultraviolet irradiation may be used in combination. <Other layers> The spacer Q includes any appropriate other layers for visual purposes within a range that does not impair the effect of the present invention. "Reinforcing film with spacer" The reinforcing film with spacer of the present invention can be obtained by directly laminating the reinforcing film P and the spacer Q to guide the adhesive layer A2 and the spacer Q. The way fits. Regarding one embodiment of the reinforcing film with spacer of the present invention, as shown in FIG. 3, a reinforcing film P including a base layer A1, a conductive layer C1, and an adhesive layer A2 is combined with a base layer B1. The spacer Q is a form in which the adhesive layer A2 and the spacer Q are directly laminated. Regarding another embodiment of the reinforcing film with spacer of the present invention, as shown in FIG. 4, a reinforcing film P including a base material layer A1, an antistatic layer C2, and an adhesive layer A2 is combined with a base material The spacer Q of the layer B1 is a form in which the adhesive layer A2 and the spacer Q are directly laminated. Regarding the reinforcing film with a spacer of the present invention, the adhesive layer when the spacer Q is peeled off by the self-reinforcing film P at a peeling angle of 150 degrees and a peeling speed of 10 m/min at a temperature of 23°C and a humidity of 50%RH The peeling static voltage on the surface of A2 is preferably 10.0 kV or less, more preferably 0.001 kV-9 kV, still more preferably 0.002 kV-8 kV, and particularly preferably 0.003 kV-7 kV. If the peeling static voltage of the surface of the adhesive layer A2 is within the above range, the peeling static electricity that may be generated when the separator Q is peeled off can be further suppressed, even if it is attached to the exposed surface of the optical member or electronic member in advance. The separation of the spacer-attached reinforcing film can further reduce the damage caused to the optical component or the electronic component. In the reinforcing film with a spacer of the present invention, the transmittance of the reinforcing film P is preferably 70% or more, more preferably 75% or more, still more preferably 80% or more, and particularly preferably 85% or more. If the transmittance of the reinforcing film P is within the above range, for example, when bonding to an optical member, it can be used without impairing the optical characteristics of the optical member. Regarding the reinforcing film with a spacer of the present invention, at a temperature of 23°C and a humidity of 50%RH, at a peeling angle of 150 degrees and a peeling speed of 10 m/min, the spacer Q is peeled from the reinforcing film P, and the temperature is 23 Under ℃, humidity 50%RH, peeling angle 180 degrees, and stretching speed 300 mm/min, the initial adhesion of the adhesive layer A2 to the glass plate is preferably 1.0 N/25 mm or more, more preferably 1.0 N/25 mm ～50 N/25 mm, more preferably 1.0 N/25 mm～45 N/25 mm, particularly preferably 1.0 N/25 mm～40 N/25 mm. If the initial adhesive force of the above-mentioned adhesive layer A2 to the glass plate is within the above-mentioned range, a good adhesive force can be obtained, thereby reducing poor adhesion to the adherend. Regarding the reinforcing film with spacer of the present invention, the peeling force when the spacer Q is peeled off by the self-reinforcing film P at a temperature of 23°C and a humidity of 50%RH at a peeling angle of 180 degrees and a stretching speed of 300 mm/min It is preferably 0.30 N/25 mm or less, more preferably 0.005 N/25 mm～0.30 N/25 mm, still more preferably 0.0075 N/25 mm～0.30 N/25 mm, particularly preferably 0.01 N/25 mm～ 0.30 N/25 mm. If the above-mentioned peeling force is within the above-mentioned range, when the spacer-attached reinforcing film is processed, it can reduce the erroneous separation of the spacer from the reinforcing film, and when the spacer is peeled off, the adhesive layer of the reinforcing film can be reduced The cohesive fracture or fixed fracture. [Examples] Hereinafter, the present invention will be specifically described with examples, but the present invention is not limited in any way by these examples. In addition, the test and evaluation methods in Examples etc. are as follows. In addition, when it is described as "parts", it means "parts by weight" as long as there is no special description, and when it is described as "%", it means "weight%" as long as there is no special description. . <Measurement of weight average molecular weight> The weight average molecular weight is measured by a gel permeation chromatography (GPC) method. Specifically, a brand name "HLC-8120GPC" (manufactured by Tosoh Co., Ltd.) was used as a GPC measuring device, and the measurement was carried out under the following conditions, and it was calculated from a standard polystyrene conversion value. (Molecular weight measurement conditions) ・Sample concentration: 0.2% by weight (tetrahydrofuran solution) ・Sample injection volume: 10 μL ・Column: Trade name "TSKguardcolumn SuperHZ-H (1) + TSKgel SuperHZM-H (2)" (Tosoh Co., Ltd.) ・Reference column: Trade name "TSKgel SuperH-RC (1 piece)" (Tosoh Co., Ltd.) ・Lluent: Tetrahydrofuran (THF) ・Flow rate: 0.6 mL/min ・Detector: Differential refractometer (RI) ・Column temperature (measurement temperature): 40°C <Measurement of surface resistance> At a temperature of 23°C and a humidity of 50%RH, use a resistivity meter (manufactured by Mitsubishi Chemical Analytech, Hiresta-UP MCP-HT450) ), measured in accordance with JIS-K-6911. <Measurement of transmittance> Using a haze meter (manufactured by Murakami Color Research Institute, trade name "HM-150"), the total light transmittance of the reinforcing film after peeling off the release liner is measured in accordance with JIS-K-7361 . <Measurement of the peeling static voltage on the surface of the adhesive layer> Cut the pre-destaticized reinforcing film with spacers into a size of 70 mm in width and 130 mm in length, and fix the electrostatic potential at a distance of 30 mm A measuring instrument (Shishido Electrostatic Co., Ltd., STATIRON DZ4) measures the potential of the adhesive layer surface 10 seconds after the separator is peeled off. The measurement is performed in an environment with a temperature of 23°C and a humidity of 50%RH. In addition, the separation of the separator was performed by fixing the separator on an automatic coiler, and peeling at a temperature of 23° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m/min. <Measurement of the initial adhesion of the adhesive layer to the glass plate> Cut the pre-destaticized reinforcing film with spacers into a width of 25 mm and a length of 150 mm to prepare a sample for evaluation. In an atmosphere of 23°C and 50%RH, the adhesive layer surface of the evaluation sample was attached to the glass plate (manufactured by Songlang Glass Industry Co., Ltd., trade name: MICRO SLIDE GLASS S). After curing for 30 minutes at a temperature of 23°C and a humidity of 50%RH, use a universal tensile testing machine (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) at a peeling angle of 180 degrees and a tensile speed of 300 mm/ Min to peel off and measure the adhesion. <Measurement of the peeling force of the separator> The reinforcing film with the separator, which has been destaticized in advance, is cut into a width of 25 mm and a length of 150 mm to prepare an evaluation sample. Fix the reinforcing film with the surface of the reinforcing base material contacting the acrylic resin board, and use a universal tensile testing machine (manufactured by Minebea Co., Ltd., product name: TCM) at a temperature of 23°C and a humidity of 50%RH. -1kNB), the separator was peeled at a peeling angle of 180 degrees and a tensile speed of 300 mm/min, and the separator peeling force was measured. [Production Example 1]: Production of the adhesive composition (1): n-butyl acrylate (BA) as a monomer component: 95 parts by weight, acrylic acid (AA): 5 parts by weight, and ethyl acetate as a polymerization solvent : 185.7 parts by weight was put into a separable flask and stirred for 1 hour while introducing nitrogen. After removing oxygen in the polymerization system in this way, the temperature was raised to 63° C. to react for 10 hours and toluene was added to obtain an acrylic polymer solution with a solid content of 25% by weight. The weight average molecular weight of the acrylic polymer in the obtained acrylic polymer solution was 600,000. Secondly, cyclohexyl methacrylate as a monomer component [Glass transition temperature of homopolymer (polycyclohexyl methacrylate): 66°C]: 95 parts by weight, acrylic acid: 5 parts by weight, as a chain transfer agent Α-methylstyrene dimer: 10 parts by weight, 2,2'-azobisisobutyronitrile as polymerization initiator: 10 parts by weight, and toluene as polymerization solvent: 120 parts by weight In the separable flask, stirring was performed for 1 hour while introducing nitrogen. After removing the oxygen in the polymerization system in this way, the temperature was raised to 85°C and reacted for 5 hours to obtain an acrylic oligomer solution with a solid content of 50% by weight. The weight average molecular weight of the acrylic oligomer in the obtained acrylic oligomer solution was 4000. Next, to the above-mentioned acrylic polymer solution, a silane coupling agent (γ-glycidoxypropane) is added so as to be 0.15 parts by weight based on 100 parts by weight of acrylic polymer (solid content) in terms of solid content. Trimethoxysilane, trade name "KBM403", manufactured by Shin-Etsu Chemical Co., Ltd.), added so as to be 0.075 parts by weight based on 100 parts by weight of acrylic polymer (solid content) in terms of solid content. Linking agent (epoxy-based crosslinking agent, trade name "TETRAD-C", manufactured by Mitsubishi Gas Chemical Co., Ltd.), further, calculated as solid content based on 100 parts by weight of acrylic polymer (solid content) The acrylic oligomer solution was added so that the amount of the acrylic oligomer was 25 parts by weight, and these were mixed, thereby manufacturing the adhesive composition (1). [Production Example 2]: Production of adhesive composition (2) The amount of silane coupling agent (γ-glycidoxypropyltrimethoxysilane, trade name "KBM403", manufactured by Shin-Etsu Chemical Co., Ltd.) Except having changed to 2 parts by weight in terms of solid content with respect to 100 parts by weight of the acrylic polymer (solid content), the same procedure as in Production Example 1 was carried out to produce the adhesive composition (2). [Manufacturing Example 3]: Manufacturing of base material with antistatic layer (1) The polyester resin "Vylonal MD-1480" (25% aqueous solution, manufactured by Toyobo Co., Ltd.) as a binder, and a conductive polymer containing poly (3,4-Ethylenedioxythiophene) (PEDOT) 0.5% and polystyrene sulfonic acid (weight average molecular weight 150,000) (PSS) 0.8% aqueous solution (Bytron P, manufactured by HCStark), according to solid content The amount of 100 parts by mass of the adhesive, 50 parts by mass of the conductive polymer in terms of the solid content, and the melamine-based crosslinking agent are added to the mixed solvent of water/ethanol (1/1), And stir for about 20 minutes to mix thoroughly. In this way, an aqueous solution for the antistatic layer is produced. On one side of a polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Corporation) with a thickness of 75 μm, the aqueous solution for the antistatic layer was coated so that the thickness after drying became 15 nm. The coating was heated at 130°C for 1 minute to dry, thereby manufacturing a base material (1) with an antistatic layer having an antistatic layer on one side of a PET film. The surface resistance of the antistatic layer is 4.3×10 ⁸ Ω/□. [Manufacturing Example 4]: The substrate with conductive layer (1) was manufactured in a sputtering device equipped with a calcined target containing 97% by weight of indium oxide and 3% by weight of tin oxide, in a polymer with a thickness of 75 μm. On one side of an ethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray), an indium tin oxide layer with a thickness of 25 nm was formed by a sputtering method. Next, heat treatment at 150° C. for 90 minutes to convert the indium tin oxide layer from amorphous to crystalline, thereby manufacturing a substrate with a conductive layer (1) with a conductive layer on one side of the PET film. The surface resistance of the conductive layer is 1.0×10 ³ Ω/□. [Example 1] The surface of the substrate (1) with an antistatic layer obtained in Production Example 3 on the side of the antistatic layer was coated with the surface obtained in Production Example 1 so that the thickness after drying became 25 μm The adhesive composition (1) was dried at 130°C for 3 minutes, and a spacer (PET (polyethylene terephthalate) film after mold release treatment) was attached to the surface of the formed adhesive layer, The trade name is "DIAFOIL MRF38", manufactured by Mitsubishi Plastics Corporation) to obtain a reinforcing film with spacers (1). The results are shown in Table 1. [Example 2] Except that the adhesive composition (2) obtained in Production Example 2 was used instead of the adhesive composition (1) obtained in Production Example 1, the same procedure as in Example 1 was carried out to obtain Reinforcement membrane with spacers (2). The results are shown in Table 1. [Example 3] The surface of the conductive layer side of the substrate with a conductive layer (1) obtained in Manufacturing Example 4 was coated with the adhesive obtained in Manufacturing Example 1 so that the thickness after drying became 25 μm The composition (1) was dried at 130°C for 3 minutes, and a spacer (PET (polyethylene terephthalate) film with mold release treatment, trade name) was attached to the surface of the formed adhesive layer "DIAFOIL MRF38", manufactured by Mitsubishi Plastics Corporation), to obtain a reinforcing film with spacers (3). The results are shown in Table 1. [Comparative Example 1] Polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Co., Ltd.) with a thickness of 75 μm was coated so that the thickness after drying became 25 μm. Manufacturing example The adhesive composition (1) obtained in 1 was dried at 130°C for 3 minutes, and a spacer (PET (polyethylene terephthalate) with release treatment) was attached to the surface of the formed adhesive layer Diester) film, trade name "DIAFOIL MRF38", manufactured by Mitsubishi Plastics Co., Ltd.), to obtain a spacer-attached reinforcing film (C1). The results are shown in Table 1. [Comparative Example 2] The adhesive composition (2) obtained in Production Example 2 was used instead of the adhesive composition (1) obtained in Production Example 1. The procedure was carried out in the same manner as in Comparative Example 1 to obtain Reinforcement film with spacer (C2). The results are shown in Table 1. [Table 1]

[Industrial Applicability] The spacer-attached reinforcing film of the present invention can be used as a reinforcing film attached to the back side of a substrate of a semiconductor element.

10‧‧‧Substrate layer A1 20‧‧‧Adhesive layer A2 30‧‧‧Conductive layer C1 40‧‧‧Antistatic layer C2 100‧‧‧Reinforcement film P 200‧‧‧Spacer Q 1000‧‧‧Reinforcement film with spacer

Fig. 1 is a schematic cross-sectional view of an embodiment of a reinforcing film P. Fig. 2 is a schematic cross-sectional view of another embodiment of the reinforcing film P. Fig. 3 is a schematic cross-sectional view of one embodiment of the reinforcing film with spacer of the present invention. 4 is a schematic cross-sectional view of another embodiment of the reinforcing film with spacers of the present invention.

10‧‧‧Substrate layer A1

20‧‧‧Adhesive layer A2

30‧‧‧Conductive layer C1

100‧‧‧Reinforcement film P

200‧‧‧Spacer Q

1000‧‧‧Reinforcement film with spacer

Claims (4)

A reinforcing film with spacers, which has a reinforcing film P and a spacer Q, and the reinforcing film P includes a substrate layer A1 and an adhesive layer A2, in the substrate layer A1 and the adhesive layer A conductive layer C1 and/or an antistatic layer C2 is arranged between A2. The adhesive layer A2 and the spacer Q are directly laminated. The surface resistance of the conductive layer C1 is 1.0×10 ¹⁰ Ω/□ or less. The antistatic layer The surface resistance value of C2 is 1.0×10 ¹⁰ Ω/□ or less, when the separator Q is peeled from the reinforcing film P at a peeling angle of 150 degrees and a peeling speed of 10m/min at a temperature of 23°C and a humidity of 50%RH The peeling static voltage of the surface of the adhesive layer A2 is 10.0kV or less. For example, the reinforcing film with spacer of claim 1, wherein the above-mentioned reinforcing film P has a transmittance of 70% or more. For example, the reinforcing film with spacer of claim 1, wherein the spacer Q is peeled from the reinforcing film P at a temperature of 23°C and a humidity of 50%RH at a peeling angle of 150 degrees and a peeling speed of 10m/min. At a temperature of 23°C, a humidity of 50%RH, a peeling angle of 180 degrees, and a stretching speed of 300mm/min, the initial adhesion of the adhesive layer A2 to the glass plate is 1.0N/25mm or more. Such as the reinforcing film with spacer of claim 1, where the temperature is 23℃, humidity is 50%RH Next, at a peeling angle of 180 degrees and a stretching speed of 300 mm/min, the peeling force when the separator Q is peeled from the reinforcing film P is 0.30 N/25 mm or less.

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