TWI700322B - 樹脂組合物及由其製成的物品 - Google Patents
樹脂組合物及由其製成的物品 Download PDFInfo
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- TWI700322B TWI700322B TW108104902A TW108104902A TWI700322B TW I700322 B TWI700322 B TW I700322B TW 108104902 A TW108104902 A TW 108104902A TW 108104902 A TW108104902 A TW 108104902A TW I700322 B TWI700322 B TW I700322B
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- resin composition
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- maleimide
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- 239000011342 resin composition Substances 0.000 title claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 130
- 239000011347 resin Substances 0.000 claims abstract description 130
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 30
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 30
- 230000001588 bifunctional effect Effects 0.000 claims abstract description 22
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 9
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 26
- 239000003822 epoxy resin Substances 0.000 claims description 23
- 229920000647 polyepoxide Polymers 0.000 claims description 23
- 239000004643 cyanate ester Substances 0.000 claims description 22
- 230000009477 glass transition Effects 0.000 claims description 21
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 230000008859 change Effects 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 229920001955 polyphenylene ether Polymers 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims description 13
- 239000005011 phenolic resin Substances 0.000 claims description 10
- HGTDVVTWYKXXMI-UHFFFAOYSA-N pyrrole-2,5-dione;triazine Chemical compound C1=CN=NN=C1.O=C1NC(=O)C=C1 HGTDVVTWYKXXMI-UHFFFAOYSA-N 0.000 claims description 10
- 229920000728 polyester Polymers 0.000 claims description 9
- 230000000930 thermomechanical effect Effects 0.000 claims description 9
- 239000003063 flame retardant Substances 0.000 claims description 8
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims description 7
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims description 7
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
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- 239000012745 toughening agent Substances 0.000 claims description 4
- YUAYXCGERFHZJE-UHFFFAOYSA-N 1-(1-phenylprop-2-enoxy)prop-2-enylbenzene Chemical compound C=1C=CC=CC=1C(C=C)OC(C=C)C1=CC=CC=C1 YUAYXCGERFHZJE-UHFFFAOYSA-N 0.000 claims description 3
- FAPKAHJYPAALBJ-UHFFFAOYSA-N 1-ethenyl-2-[1-(2-ethenylphenyl)ethyl]benzene Chemical compound C=1C=CC=C(C=C)C=1C(C)C1=CC=CC=C1C=C FAPKAHJYPAALBJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
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- HXBPYFMVGFDZFT-UHFFFAOYSA-N allyl isocyanate Chemical compound C=CCN=C=O HXBPYFMVGFDZFT-UHFFFAOYSA-N 0.000 claims 1
- -1 allyl modified benzoxazine Chemical class 0.000 description 33
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 21
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- 239000004843 novolac epoxy resin Substances 0.000 description 18
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 16
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 11
- 229940106691 bisphenol a Drugs 0.000 description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
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- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 8
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- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 6
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 6
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
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- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
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- 239000011888 foil Substances 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
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- 229910000077 silane Inorganic materials 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
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- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
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- 150000004985 diamines Chemical class 0.000 description 3
- WOLATMHLPFJRGC-UHFFFAOYSA-N furan-2,5-dione;styrene Chemical compound O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 WOLATMHLPFJRGC-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
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- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
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- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 2
- BQPNUOYXSVUVMY-UHFFFAOYSA-N [4-[2-(4-diphenoxyphosphoryloxyphenyl)propan-2-yl]phenyl] diphenyl phosphate Chemical compound C=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 BQPNUOYXSVUVMY-UHFFFAOYSA-N 0.000 description 2
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- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
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- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 2
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- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 1
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- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- QMAQLCVJIYANPZ-UHFFFAOYSA-N 2-propoxyethyl acetate Chemical compound CCCOCCOC(C)=O QMAQLCVJIYANPZ-UHFFFAOYSA-N 0.000 description 1
- LQTNRRPIJHJSFG-UHFFFAOYSA-N 2H-1,2-benzoxazine diphenylmethanediamine Chemical compound O1NC=CC2=C1C=CC=C2.NC(C2=CC=CC=C2)(C2=CC=CC=C2)N LQTNRRPIJHJSFG-UHFFFAOYSA-N 0.000 description 1
- BCHZICNRHXRCHY-UHFFFAOYSA-N 2h-oxazine Chemical compound N1OC=CC=C1 BCHZICNRHXRCHY-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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Abstract
本發明主要提供一種樹脂組合物,其包含:1至10重量份的雙官能脂肪族長鏈丙烯酸酯;以及30至50重量份的熱固性樹脂。此外,本發明亦提供一種由前述樹脂組合物製成的物品,其包括半固化片、樹脂膜、積層板或印刷電路板。
Description
本發明係關於一種樹脂組合物,特別係關於包含雙官能脂肪族長鏈丙烯酸酯以及熱固性樹脂的樹脂組合物,其可用於製備半固化片、樹脂膜、積層板或印刷電路板等物品。
先前技術曾使用氰酸酯樹脂和馬來醯亞胺樹脂,或是使用馬來醯亞胺三嗪樹脂製作高尺寸安定性的電路板材料,然而藉由氰酸酯樹脂和馬來醯亞胺樹脂或是馬來醯亞胺三嗪樹脂製備的不含銅基板的Z軸熱膨脹係數(alpha 1)一般介於45至55 ppm/°C之間,並無法滿足新一代更高尺寸安定性(Z軸熱膨脹係數(alpha 1)低於30 ppm/°C)規格要求的電路板材料所需。
另一方面,電路板的絕緣層與銅箔層之間的剝離強度亦為電路板的重要特性之一,剝離強度低的電路板容易因為碰撞而造成表面線路脫落或短路而造成電路板失效。
本申請案發明人發現在樹脂組合物中添加丙烯酸酯可有效提升樹脂組合物製作的銅箔基板的絕緣層與銅箔層之間的剝離強度。然而,發明人也發現提升剝離強度的同時會明顯的降低玻璃轉化溫度、增大熱膨脹係數及增大熱膨脹率,造成負面效果。
為求進一步改善樹脂材料的特性,特別是現有材料無法滿足低尺寸變化率、低熱膨脹係數、高玻璃轉化溫度及低吸水率等一或多種技術問題,本發明的主要目的在於提供一種能克服上述技術問題的樹脂組合物,以及使用該樹脂組合物製成的物品。
為了達到本發明的上述目的,本發明公開一種樹脂組合物,其包含:1至10重量份的雙官能脂肪族長鏈丙烯酸酯;以及30至50重量份的熱固性樹脂。
舉例而言,n可以是大於或等於5且小於或等於20之整數,或較佳為大於或等於6且小於或等於12之整數。
於一實施例中,前述雙官能脂肪族長鏈丙烯酸酯的n值可為但不限於6、8、10、12、14、16、18、20。若無特別指明,於本發明中,長鏈係指n值大於或等於5。
於一實施例中,熱固性樹脂代表受熱後可發生固化現象的樹脂,例如但不限於氰酸酯樹脂、馬來醯亞胺樹脂、馬來醯亞胺三嗪樹脂或其組合。
於一實施例中,本發明公開的樹脂組合物可進一步包含:環氧樹脂、酚樹脂、苯并噁嗪樹脂、苯乙烯馬來酸酐、聚酯、胺類固化劑、聚烯烴、聚苯醚樹脂、三烯丙基異氰酸酯、三烯丙基氰酸酯、二乙烯基苯、二(乙烯苄基)醚、二(乙烯苯基)乙烷、聚醯胺、聚醯亞胺或其組合。
於一實施例中,本發明公開的樹脂組合物可進一步包含:阻燃劑、無機填充物、硬化促進劑、溶劑、增韌劑、矽烷偶合劑或其組合。
本發明公開的樹脂組合物可加工製成各類物品,例如半固化片、樹脂膜、積層板或印刷電路板。前述物品在以下幾個方面之至少一者取得優異的功效:Z軸熱膨脹係數較低、玻璃轉化溫度較高、Z軸尺寸變化率較低以及吸水率較低。
具體而言,本發明公開一種樹脂組合物,其特徵在於包含1至10重量份的雙官能脂肪族長鏈丙烯酸酯以及30至50重量份的熱固性樹脂。相較於採用其他組成或比例的樹脂組合物(例如使用雙官能脂肪族非長鏈丙烯酸酯、使用單官能丙烯酸酯或使用單官能脂肪族長鏈丙烯酸酯等等),本發明之樹脂組合物或由其製成的物品具有以下一種、多種或全部功效: 1. 以熱機械分析儀參照IPC-TM-650 2.4.24.5所述方法測量而得的Z軸熱膨脹係數小於或等於30 ppm/°C; 2. 以熱機械分析儀參照IPC-TM-650 2.4.24.5所述方法測量而得的玻璃轉化溫度大於或等於208°C; 3. 以動態機械分析儀參照IPC-TM-650 2.4.24.4所述方法測量而得的玻璃轉化溫度大於或等於240°C; 4. 以熱機械分析儀參照IPC-TM-650 2.4.24.5所述方法測量而得的Z軸尺寸變化率小於或等於1.60%;以及 5. 吸水率小於或等於0.30%。
為使本領域具有通常知識者可瞭解本發明之特點及功效,以下謹就說明書及申請專利範圍中提及之術語及用語進行一般性之說明及定義。除非另有指明,否則文中使用的所有技術及科學上的字詞,皆具有本領域技術人員對於本發明所瞭解的通常意義,當有衝突情形時,應以本說明書之定義為準。
於本文中,用語「包含」、「包括」、「具有」、「含有」或其他任何類似用語均屬於開放性連接詞(open-ended transitional phrase),其意欲涵蓋非排他性的包括物。舉例而言,含有複數要素的一組合物或製品並不僅限於本文所列出的此等要素而已,而是還可包括未明確列出但卻是該組合物或製品通常固有的其他要素。除此之外,除非有相反的明確說明,否則用語「或」是指涵括性的「或」,而不是指排他性的「或」。例如,以下任何一種情況均滿足條件「A或B」:A為真(或存在)且B為偽(或不存在)、A為偽(或不存在)且B 為真(或存在)、A 和 B均為真(或存在)。此外,於本文中,用語「包含」、「包括」、「具有」、「含有」之解讀應視為已具體揭示並同時涵蓋「由…所組成」及「實質上由…所組成」等封閉式或半封閉式連接詞。
於本文中,所有以數值範圍或百分比範圍形式界定之特徵或條件僅是為了簡潔及方便。據此,數值範圍或百分比範圍的描述應視為已涵蓋且具體揭示所有可能的次範圍及範圍內的個別數值,特別是整數數值。舉例而言,「1至8」的範圍描述應視為已經具體揭示如1至7、2至8、2至6、3至6、4至8、3至8等等所有次範圍,特別是由所有整數數值所界定之次範圍,且應視為已經具體揭示範圍內如1、2、3、4、5、6、7、8等個別數值。同理,「介於1及8之間」的範圍描述應視為已經具體揭示如1至8、1至7、2至8、2至6、3至6、4至8、3至8等等所有範圍,且應視為涵蓋端點值。除非另有指明,否則前述解釋方法適用於本發明全文之所有內容,不論範圍廣泛與否。
若數量或其他數值或參數是以範圍、較佳範圍或一系列上限與下限表示,則其應理解成是本文已特定揭示了由任一對該範圍的上限或較佳值與該範圍的下限或較佳值構成的所有範圍,不論該等範圍是否有分別揭示。此外,本文中若提到數值的範圍時,除非另有說明,否則該範圍應包括其端點以及範圍內的所有整數與分數。
於本文中,在可達成發明目的之前提下,數值應理解成具有該數值有效位數的精確度。舉例來說,數字40.0則應理解成涵蓋從39.50至40.49的範圍。
於本文中,對於使用馬庫西群組(Markush group)或選項式用語以描述本發明特徵或實例之情形,本領域技術人員應瞭解馬庫西群組或選項列表內所有成員的次群組或任何個別成員亦可用於描述本發明。舉例而言,若X描述成「選自於由X
1、X
2及X
3所組成的群組」,亦表示已經完全描述出X為X
1的主張與X為X
1及/或X
2及/或X
3的主張。再者,對於使用馬庫西群組或選項式用語以描述本發明之特徵或實例者,本領域技術人員應瞭解馬庫西群組或選項列表內所有成員的次群組或個別成員的任何組合亦可用於描述本發明。據此,舉例而言,若X描述成「選自於由X
1、X
2及X
3所組成的群組」,且Y描述成「選自於由Y
1、Y
2及Y
3所組成的群組」,則表示已經完全描述出X為X
1或X
2或X
3而Y為Y
1或Y
2或Y
3的主張。
以下具體實施方式本質上僅是例示性,且並不欲限制本發明及其用途。此外,本文並不受前述先前技術或發明內容或以下具體實施方式或實施例中所描述之任何理論的限制。
承前所述,本發明之主要目的在於提供一種樹脂組合物,包含:1至10重量份的雙官能脂肪族長鏈丙烯酸酯;以及30至50重量份的熱固性樹脂。
若無特別指明,雙官能脂肪族長鏈丙烯酸酯係指具有碳數5以上之脂肪族長鏈的雙官能丙烯酸酯。
舉例而言,n可以是大於或等於5且小於或等於20之整數,或較佳為大於或等於6且小於或等於12之整數。
於一實施例中,前述雙官能脂肪族長鏈丙烯酸酯的n值可為但不限於6、8、10、12、14、16、18、20。若無特別指明,於本發明中,長鏈係指n值大於或等於5,而雙官能代表存在兩個丙烯酸酯基團。
舉例而言,本發明使用的雙官能脂肪族長鏈丙烯酸酯可包括但不限於1,6-己烷二丙烯酸酯(或稱1,6-己二醇二丙烯酸酯,1,6-hexanediol diacrylate)、1,6-己烷二(甲基丙烯酸酯)(或稱1,6-己二醇二(甲基丙烯酸酯),1,6-hexanediol dimethacrylate)、1,12-十二烷二(甲基丙烯酸酯)(或稱1,12-十二烷二醇二(甲基丙烯酸酯),1,12-dodecanediol dimethacrylate)或其組合。
舉例而言,本發明使用的雙官能脂肪族長鏈丙烯酸酯可為商品名SR-238NS、SR-239及/或SR-262等由Sartomer公司生產的雙官能脂肪族長鏈丙烯酸酯。
於本文中,熱固性樹脂的種類並不特別限制,且可包括氰酸酯樹脂、馬來醯亞胺樹脂、馬來醯亞胺三嗪樹脂或其組合。
舉例而言,前述氰酸酯樹脂並無特別限制,任何具有Ar-O-C≡N結構的氰酸酯皆可,其中Ar可為經取代或未經取代的芳香族、酚醛、雙酚A、雙酚A酚醛、雙酚F、雙酚F酚醛或酚酞。上述氰酸酯樹脂可為例如商品名為primaset PT-15、PT-30S、PT-60S、BA-200、BA-230S、BA-3000S、BTP-2500、BTP-6020S、DT-4000、DT-7000、ULL950S、HTL-300、CE-320、LVT-50或LeCy等由Lonza生產的氰酸酯樹脂,且不以此為限。
舉例而言,前述馬來醯亞胺樹脂是指分子中具有一個以上馬來醯亞胺官能團的化合物、單體、混合物或聚合物(包含寡聚物)。若未特別指明,本發明採用的馬來醯亞胺樹脂並不特別限制,且可為任一種或多種適用於半固化片、樹脂膜、積層板或印刷電路板製作的馬來醯亞胺樹脂。具體實例包括但不限於4,4’-二苯甲烷雙馬來醯亞胺、苯甲烷馬來醯亞胺寡聚物(或稱聚苯甲烷馬來醯亞胺)、間-伸苯基雙馬來醯亞胺、雙酚A二苯基醚雙馬來醯亞胺、3,3’-二甲基-5,5’-二乙基-4,4’-二苯基甲烷雙馬來醯亞胺、4-甲基-1,3-伸苯基雙馬來醯亞胺、1,6-雙馬來醯亞胺-(2,2,4-三甲基)己烷、2,3-二甲基苯馬來醯亞胺、2,6-二甲基苯馬來醯亞胺、N-苯基馬來醯亞胺、含脂肪族長鏈結構的馬來醯亞胺類化合物或其組合。此外,若無特別指明,本發明所述之馬來醯亞胺樹脂也涵蓋前述化合物的預聚物,例如可為二烯丙基化合物與馬來醯亞胺類化合物的預聚物、二胺與馬來醯亞胺類化合物的預聚物、多官能胺與馬來醯亞胺類化合物的預聚物或酸性酚化合物與馬來醯亞胺類化合物的預聚物等,且不以此為限。
舉例而言,本發明所述之馬來醯亞胺樹脂可為商品名BMI-1000、BMI-1000H、BMI-1100、BMI-1100H、BMI-2000、BMI-2300、BMI-3000、BMI-3000H、BMI-4000H、BMI-5000、BMI-5100、BMI-7000及BMI-7000H等由Daiwakasei公司生產的馬來醯亞胺樹脂,或商品名BMI-70、BMI-80等由K.I化學公司生產的馬來醯亞胺樹脂。
舉例而言,含脂肪族長鏈結構的馬來醯亞胺樹脂可為商品名BMI-689、BMI-1400、BMI-1500、BMI-1700、BMI-2500、BMI-3000、BMI-5000及BMI-6000等由設計者分子公司生產的馬來醯亞胺樹脂。
舉例而言,若未特別指明,本發明採用的馬來醯亞胺三嗪樹脂並不特別限制,且可為任一種或多種適用於半固化片、樹脂膜、積層板或印刷電路板製作的馬來醯亞胺三嗪樹脂。舉例而言,所述馬來醯亞胺三嗪樹脂可由前述氰酸酯樹脂與前述馬來醯亞胺樹脂聚合而得。馬來醯亞胺三嗪樹脂可為例如但不限於,雙酚A氰酸酯與馬來醯亞胺聚合而得、雙酚F氰酸酯與馬來醯亞胺聚合而得、苯酚酚醛型氰酸酯與馬來醯亞胺聚合而得或含雙環戊二烯型氰酸酯與馬來醯亞胺聚合而得。
舉例而言,所述馬來醯亞胺三嗪樹脂可為任意莫耳比的氰酸酯樹脂與馬來醯亞胺樹脂聚合而得。舉例而言,相對於1莫耳的馬來醯亞胺樹脂,氰酸酯可為1至10莫耳。例如但不限於,相對於1莫耳的馬來醯亞胺樹脂,氰酸酯為1、2、4或6莫耳。
除前述成分外,本發明的樹脂組合物還可視需要進一步包含:環氧樹脂、酚樹脂、苯并噁嗪樹脂、苯乙烯馬來酸酐、聚酯、胺類固化劑、聚烯烴、聚苯醚樹脂、三烯丙基異氰酸酯、三烯丙基氰酸酯、二乙烯基苯、二(乙烯苄基)醚、二(乙烯苯基)乙烷、聚醯胺、聚醯亞胺或其組合。
舉例而言,所述環氧樹脂可為本領域已知的各類環氧樹脂,包含但不限於例如雙酚A環氧樹脂、雙酚F環氧樹脂、雙酚S環氧樹脂、雙酚AD環氧樹脂、酚醛(novolac)環氧樹脂、三官能(trifunctional)環氧樹脂、四官能(tetrafunctional)環氧樹脂、多官能(multifunctional)酚醛環氧樹脂、二環戊二烯(dicyclopentadiene,DCPD)環氧樹脂、含磷環氧樹脂、對二甲苯(p-xylene)環氧樹脂、萘型(naphthalene)環氧樹脂(例如萘酚型環氧樹脂)、苯并呋喃(benzofuran)型環氧樹脂以及異氰酸酯改性(isocyanate-modified)環氧樹脂,且不以此為限。
其中,酚醛環氧樹脂可為苯酚酚醛(phenol novolac)環氧樹脂、雙酚A酚醛(bisphenol A novolac)環氧樹脂、雙酚F酚醛(bisphenol F novolac)環氧樹脂、聯苯型酚醛(biphenyl novolac)環氧樹脂、酚苯甲醛(phenol benzaldehyde)環氧樹脂、酚基芳烷基酚醛(phenol aralkyl novolac)環氧樹脂或鄰甲基酚酚醛(o-cresol novolac)環氧樹脂。
其中,含磷環氧樹脂可為DOPO(9,10-dihydro-9-oxa-10- phosphaphenanthrene-10-oxide)環氧樹脂、DOPO-HQ環氧樹脂或其組合。前述DOPO環氧樹脂可選自含DOPO苯酚酚醛環氧樹脂(DOPO-containing phenolic novolac epoxy resin)、含DOPO鄰甲基酚酚醛環氧樹脂(DOPO-containing cresol novolac epoxy resin)以及含DOPO雙酚A酚醛環氧樹脂(DOPO-containing bisphenol-A novolac epoxy resin)中的一種、兩種或兩種以上。前述DOPO-HQ環氧樹脂可選自含DOPO-HQ苯酚酚醛環氧樹脂(DOPO-HQ-containing phenolic novolac epoxy resin)、含DOPO-HQ鄰甲基酚酚醛環氧樹脂(DOPO-HQ-containing cresol novolac epoxy resin)以及含DOPO-HQ雙酚A酚醛環氧樹脂(DOPO-HQ-containing bisphenol-A novolac epoxy resin)中的一種、兩種或兩種以上。
舉例而言,所述酚樹脂可為本領域已知的各類酚樹脂,具體實例包括但不限於酚醛樹脂或苯氧樹脂,酚醛樹脂包括苯酚酚醛樹脂、萘酚酚醛樹脂、聯苯酚醛樹脂及雙環戊二烯酚樹脂,且不以此為限。
舉例而言,所述苯并噁嗪樹脂可為本領域已知的各類苯并噁嗪樹脂。具體實例包括但不限於雙酚A型苯并噁嗪樹脂、雙酚F型苯并噁嗪樹脂、酚酞型苯并噁嗪樹脂、雙環戊二烯型苯并噁嗪樹脂、含磷苯并噁嗪樹脂、二胺型苯并噁嗪樹脂及苯基、乙烯基或烯丙基改性的苯并噁嗪樹脂。適用的市售商品包括如Huntsman銷售的商品名LZ-8270(酚酞型苯并噁嗪樹脂)、LZ-8298(酚酞型苯并噁嗪樹脂)、LZ-8280(雙酚F型苯并噁嗪樹脂)、LZ-8290(雙酚A型苯并噁嗪樹脂),或如韓國Kolon Industries銷售的商品名KZH-5031(乙烯基改性的苯并噁嗪樹脂)、KZH-5032(苯基改性的苯并噁嗪樹脂)。其中,二胺型苯并噁嗪樹脂可為二胺基二苯甲烷苯并噁嗪樹脂、二胺基二苯醚型苯并噁嗪樹脂、二胺基二苯碸苯并噁嗪樹脂、二胺基二苯硫醚苯并噁嗪樹脂或其組合,且不以此為限。
舉例而言,所述苯乙烯馬來酸酐可為本領域已知的各類苯乙烯馬來酸酐,其中,苯乙烯(S)與馬來酸酐(MA)的比例可為1/1、2/1、3/1、4/1、6/1、8/1或12/1,具體實例包括Cray Valley銷售的商品名SMA-1000、SMA-2000、SMA-3000、EF-30、EF-40、EF-60及EF-80等苯乙烯馬來酸酐共聚物,或是Polyscope銷售的商品名C400、C500、C700、C900等苯乙烯馬來酸酐共聚物,且不以此為限。
舉例而言,所述聚酯可為本領域已知的各類聚酯。具體實例包括但不限於含雙環戊二烯結構的聚酯以及含萘環結構的聚酯。具體實例包括但不限於大日本油墨化學出售的商品名HPC-8000或HPC-8150。
舉例而言,所述胺類固化劑可為本領域已知的各類胺類固化劑。具體實例包括但不限於二胺基二苯碸、二胺基二苯基甲烷、二胺基二苯醚、二胺基二苯硫醚及雙氰胺的至少一種或其組合。
舉例而言,所述聚烯烴可為本領域已知的各類聚烯烴,具體實例包括但不限於:苯乙烯-丁二烯-二乙烯基苯三元聚合物、苯乙烯-丁二烯-馬來酸酐三元聚合物、乙烯基-聚丁二烯-尿酯寡聚物、苯乙烯-丁二烯共聚物、氫化苯乙烯-丁二烯共聚物、苯乙烯-異戊二烯共聚物、氫化苯乙烯-異戊二烯共聚物、氫化苯乙烯-丁二烯-二乙烯基苯共聚物、聚丁二烯(丁二烯之均聚物)、馬來酸酐-丁二烯共聚物、甲基苯乙烯共聚物或其組合。
舉例而言,所述聚苯醚樹脂可為本領域已知的各類聚苯醚樹脂,具體實例包括但不限於羥基聚苯醚、乙烯基聚苯醚樹脂。乙烯基聚苯醚樹脂為乙烯基封端的聚苯醚樹脂。具體實施例包括但不限於乙烯苄基聚苯醚樹脂(例如OPE-2st,可購自三菱瓦斯化學公司)、甲基丙烯酸酯聚苯醚樹脂(例如SA-9000,可購自Sabic公司)、乙烯苄基改質雙酚A聚苯醚樹脂、乙烯基擴鏈聚苯醚樹脂或其組合,且不以此為限。
除前述成分外,本發明的樹脂組合物還可視需要進一步包含:阻燃劑、無機填充物、硬化促進劑、溶劑、增韌劑、矽烷偶合劑或其組合。
舉例而言,所述阻燃劑可為本領域已知的各類阻燃劑,具體實例包括但不限於含磷阻燃劑,較佳可選自下列群組中至少一種、兩種或兩種以上的組合:多磷酸銨(ammonium polyphosphate)、對苯二酚-雙-(二苯基磷酸酯)(hydroquinone bis-(diphenyl phosphate))、雙酚A雙-(二苯基磷酸酯)(bisphenol A bis-(diphenylphosphate))、三(2-羧乙基)膦(tri(2-carboxyethyl) phosphine,TCEP)、磷酸三(氯異丙)酯、磷酸三甲酯(trimethyl phosphate,TMP)、甲基膦酸二甲酯(dimethyl methyl phosphonate,DMMP)、間苯二酚雙-(二甲苯基磷酸酯)(resorcinol bis(dixylenyl phosphate),RDXP,如PX-200、PX-201、PX-202等市售産品)、磷腈化合物(phosphazene,如SPB-100、SPH-100、SPV-100等市售産品)、多磷酸三聚氰胺(melamine polyphosphate)、DOPO及其衍生物或樹脂、DPPO (diphenylphosphine oxide)及其衍生物或樹脂、三聚氰胺氰脲酸酯(melamine cyanurate)及三羥乙基異氰脲酸酯(tri-hydroxy ethyl isocyanurate)或磷酸鋁鹽 (例如OP-930、OP-935等産品)。
舉例而言,阻燃劑可爲DPPO化合物(如雙DPPO化合物)、DOPO化合物(如雙DOPO化合物)、DOPO樹脂(如DOPO-HQ、DOPO-NQ、DOPO-PN、DOPO-BPN)、DOPO鍵結的環氧樹脂等,其中DOPO-PN爲DOPO苯酚酚醛化合物、DOPO-BPN可爲DOPO-BPAN(DOPO-bisphenol A novolac)、DOPO-BPFN(DOPO-bisphenol F novolac)或DOPO-BPSN(DOPO-bisphenol S novolac)等雙酚酚醛類化合物。
舉例而言,相較於1至10重量份的雙官能脂肪族長鏈丙烯酸酯以及30至50重量份的熱固性樹脂的總量而言,本發明採用的阻燃劑其用量並不特別限制,例如可以是1重量份至100重量份,亦可以是10重量份至90重量份,亦可以是20重量份至80重量份,亦可以是30重量份至70重量份,亦可以是40重量份至60重量份。
舉例而言,所述無機填充物可為本領域已知的各類無機填充物,具體實例包括但不限於:二氧化矽(熔融態、非熔融態、多孔質或中空型)、氧化鋁、氫氧化鋁、氧化鎂、氫氧化鎂、碳酸鈣、氮化鋁、氮化硼、碳化鋁矽、碳化矽、二氧化鈦、氧化鋅、氧化鋯、雲母、勃姆石(boehmite,AlOOH)、煆燒滑石、滑石、氮化矽、煆燒高嶺土或其組合所組成之群組。此外,無機填充物可爲球型、纖維狀、板狀、粒狀、片狀或針鬚狀,並可選擇性經過矽烷偶合劑預處理。
舉例而言,所述硬化促進劑(包括硬化起始劑)可為本領域已知的各類硬化促進劑。具體實例包括但不限於:路易斯鹼、路易斯酸等催化劑或其組合所組成之群組。其中,路易斯鹼可包括咪唑(imidazole)、三氟化硼胺複合物、氯化乙基三苯基鏻(ethyltriphenyl phosphonium chloride)、2-甲基咪唑(2-methylimidazole,2MI)、2-苯基咪唑(2-phenyl-1H-imidazole,2PZ)、2-乙基-4-甲基咪唑(2-ethyl-4-methylimidazole,2E4MI)、三苯基膦(triphenylphosphine,TPP)與4-二甲基胺基吡啶(4-dimethylaminopyridine,DMAP)中的一種或多種。路易斯酸可包括金屬鹽類化合物,如錳、鐵、鈷、鎳、銅、鋅等金屬鹽化合物,如辛酸鋅、辛酸鈷等金屬催化劑。硬化促進劑亦包括硬化起始劑,例如可產生自由基的過氧化物,硬化起始劑包括但不限於:過氧化二異丙苯、過氧苯甲酸叔丁酯、二苯甲醯過氧化物(dibenzoyl peroxide,BPO)、2,5-二甲基-2,5-二(叔丁基過氧基)-3-己炔(25B)及雙(叔丁基過氧異丙基)苯或其組合所組成之群組。
舉例而言,所述溶劑可包括但不限於甲醇、乙醇、乙二醇單甲醚、丙酮、丁酮(又稱為甲基乙基酮)、甲基異丁基酮、環己酮、甲苯、二甲苯、甲氧基乙基乙酸酯、乙氧基乙基乙酸酯、丙氧基乙基乙酸酯、乙酸乙酯、二甲基甲醯胺、二甲基乙醯胺、丙二醇甲基醚等溶劑或其混合溶劑。
舉例而言,所述增韌劑可包括但不限於橡膠(rubber)樹脂、端羧基丁腈橡膠(carboxyl-terminated butadiene acrylonitrile rubber,CTBN)、核殼橡膠(core-shell rubber)等化合物或其組合所組成之群組。
舉例而言,所述矽烷偶合劑可包括矽烷化合物(silane,例如但不限於矽氧烷化合物(siloxane)),依官能基種類又可分為胺基矽烷化合物(amino silane)、環氧基矽烷化合物(epoxide silane)、乙烯基矽烷化合物、丙烯酸酯基矽烷化合物、甲基丙烯酸酯基矽烷化合物、羥基矽烷化合物、異氰酸酯基矽烷化合物、甲基丙烯醯氧基矽烷化合物及丙烯醯氧基矽烷化合物。
本發明的另一目的在於提供一種由前述樹脂組合物製成的物品,其包括半固化片、樹脂膜、積層板或印刷電路板,但不限於此。
由樹脂組合物製成的物品可為半固化片,其包括一補強材及設置於補強材上之層狀物。該層狀物係由該樹脂組合物經高溫加熱形成半固化態(B-stage)而得。製作半固化片的烘烤溫度為80
oC至170
oC之間。該補強材可為纖維材料、織布、不織布中的任何一種,且織布較佳包括玻璃纖維布。玻璃纖維布的種類並無特別限制,可為市售可用於各種印刷電路板的玻璃纖維布,例如E型玻璃纖維布、D型玻璃纖維布、S型玻璃纖維布、T型玻璃纖維布、L型玻璃纖維布或Q玻璃纖維布,其中纖維的種類包括紗和粗紗等,形式則可包括開纖或不開纖。前述不織布較佳包括液晶樹脂不織布,例如聚酯不織布、聚氨酯不織布等,且不限於此。前述織布亦可包括液晶樹脂織布,例如聚酯織布或聚氨酯織布等,且不限於此。此補強材可增加該半固化片的機械強度。於一較佳實施例中,該補強材亦可選擇性經由矽烷偶合劑進行預處理。所述半固化片後續加熱進行固化(C-stage)後會形成一絕緣層。
由樹脂組合物製成的物品可為樹脂膜,其係由該樹脂組合物經烘烤加熱後形成半固化而得到。該樹脂組合物可選擇性地塗佈於聚對苯二甲酸乙二酯膜(PET膜)、聚醯亞胺膜(PI膜)、銅箔或背膠銅箔(RCC),再經由烘烤加熱後形成半固化態,使該樹脂組合物形成樹脂膜。
由樹脂組合物製成的物品可為積層板,其包括二片金屬箔及一設置於該等金屬箔之間的絕緣層,該絕緣層可由前述樹脂組合物於高溫、高壓條件下所固化(C-stage)而得,其中適合之固化溫度可介於150
oC至220
oC之間,較佳為190°C至210°C之間,固化時間為90至180分鐘,較佳為120至150分鐘。該絕緣層可為前述半固化片或樹脂膜固化而得。該金屬箔可包括銅、鋁、鎳、鉑、銀、金或其合金,例如金屬箔可為銅箔。
較佳的,該積層板為銅箔基板(copper clad laminate, CCL)。
所述積層板可進一步經由線路製程加工後製成一電路板(或稱印刷電路板)。
具體而言,本發明之樹脂組合物或由其製成的物品具有以下一種、多種或全部功效: 1. 以熱機械分析儀參照IPC-TM-650 2.4.24.5所述方法測量而得的Z軸熱膨脹係數小於或等於30 ppm/°C(例如介於25.2 ppm/°C及28.6 ppm/°C之間); 2. 以熱機械分析儀參照IPC-TM-650 2.4.24.5所述方法測量而得的玻璃轉化溫度大於或等於208°C(例如介於208°C及220°C之間); 3. 以動態機械分析儀參照IPC-TM-650 2.4.24.4所述方法測量而得的玻璃轉化溫度大於或等於240°C(例如介於240°C及256°C之間); 4. 以熱機械分析儀參照IPC-TM-650 2.4.24.5所述方法測量而得的Z軸尺寸變化率小於或等於1.60%(例如介於1.29%及1.52%之間);以及 5. 吸水率小於或等於0.30%(例如介於0.22%及0.30%之間)。
本發明製備例、實施例及比較例所使用的化學原料如下: PT-30S:苯酚酚醛型氰酸酯,購自Lonza。 BA-230S:雙酚A型氰酸酯,購自Lonza。 BMI-70:雙(3-乙基-5-甲基-4-馬來醯亞胺苯基)甲烷,購自K.I化學。 BMI-2300:聚苯甲烷馬來醯亞胺,購自大和化成。 BT樹脂1:將PT-30S與BMI-70依莫耳比為2:1聚合而成,使用習知方法自製。 BT樹脂2:將PT-30S與BMI-70依莫耳比為4:1聚合而成,使用習知方法自製。 BT樹脂3:將PT-30S與BMI-2300依莫耳比為2:1聚合而成,使用習知方法自製。 BT樹脂4:將BA-230S與BMI-70依莫耳比為2:1聚合而成,使用習知方法自製。 SR-238NS:1,6-己烷二丙烯酸酯,同式(I),購自Sartomer。 SR-239:1,6-己烷二(甲基丙烯酸酯),同式(II),購自Sartomer。 SR-262:1,12-十二烷二(甲基丙烯酸酯),同式(III),購自Sartomer。 SR-833:三環癸烷二(甲基丙烯酸酯),購自Sartomer。 SR-349:乙氧基雙酚A二丙烯酸酯,購自Sartomer。 SR-231:二乙烷二(甲基丙烯酸酯),購自Sartomer。 SR-297:1,3-丁烷二(甲基丙烯酸酯),購自Sartomer。 SR-423NS:甲基丙烯酸酯異冰片酯,購自Sartomer。 SR-313:十二烷甲基丙烯酸酯,購自Sartomer。 SR-324:十八烷甲基丙烯酸酯,購自Sartomer。 B-1000:聚丁二烯,購自日本曹達。 OPE-2St:末端乙烯苄基聚苯醚,購自三菱瓦斯。 25B:過氧化物,購自日油株式會社。 SC-2500:球型二氧化矽,購自Admatechs。 甲苯及丁酮:市售可得。
參照以下方式製備待測物(樣品),再根據具體條件進行特性分析。
半固化片
分批將列於表1至表4不同的實施例(E1至E15)及比較例(C1至C12)中的樹脂組合物分別加入一攪拌槽中混合均勻並攪拌至完全溶解為成膠(varnish),再將樹脂組合物置入一含浸槽中。將玻璃纖維布(例如規格為2116的E-玻璃纖維布)通過上述含浸槽,使樹脂組合物附著於玻璃纖維布上,於120
oC至150
oC下進行加熱成半固化態(B-Stage),得到半固化片(樹脂含量約52%)。
銅箔基板(八張半固化片壓合而成)
分批準備兩張厚度為18微米之反轉銅箔(reverse treatment foil,RTF)以及八張由各樹脂組合物所製得之半固化片(使用2116 E-玻璃纖維布)。每一張半固化片之樹脂含量約52%。依銅箔、八張半固化片及銅箔的順序進行疊合,於真空條件、200
oC下壓合2小時形成各銅箔基板。其中,八張相互疊合之半固化片係固化(C-stage)形成兩銅箔間的絕緣層,絕緣層的樹脂含量約52%。
不含銅基板(八張半固化片壓合而成)
將上述銅箔基板經蝕刻去除兩面的銅箔,以獲得不含銅基板,其由八張半固化片所壓合而成,且具有樹脂含量約52%。
各測試方法及其特性分析項目說明如下。
玻璃轉化溫度(TMA Tg)
於玻璃轉化溫度的測試中,選用不含銅基板(八張半固化片壓合而成)作為待測樣品進行熱機械分析(thermal mechanical analysis,TMA)。以溫升速率每分鐘10
oC加熱樣品,由50
oC升溫至260
oC的溫度區間,參照IPC-TM-650 2.4.24.5所述方法測量各待測樣品的玻璃轉化溫度(單位為
oC),玻璃轉化溫度越高越佳。
玻璃轉化溫度(DMA Tg)
於玻璃轉化溫度的測試中,選用不含銅基板(八張半固化片壓合而成)作為待測樣品進行動態機械分析(dynamic mechanical analysis,DMA)。以溫升速率每分鐘2
oC加熱樣品,由35
oC升溫至300
oC的溫度區間,參照IPC-TM-650 2.4.24.4所述方法測量各待測樣品的玻璃轉化溫度(單位為
oC),玻璃轉化溫度越高越佳。
尺寸變化率 (ratio of dimensional change)
在尺寸變化率(或稱熱膨脹率,ratio of thermal expansion)的量測中,選用不含銅基板(八張半固化片壓合而成)作為待測樣品進行熱機械分析(thermal mechanical analysis,TMA)。以溫升速率每分鐘10
oC加熱樣品,由50
oC升溫至260
oC的溫度區間,參照IPC-TM-650 2.4.24.5所述方法測量各待測樣品的Z軸尺寸變化率(50~260°C溫度區間,單位為%),其尺寸變化率百分比越低越佳,尺寸變化率差異大於或等於0.1%時為顯著差異。
熱膨脹係數 (coefficient of thermal expansion, CTE)
於熱膨脹係數的量測中(量測Z軸方向),係選用不含銅基板(八張半固化片壓合而成)爲待測樣品。於50°C升溫至260°C的溫度區間內,使用熱機械分析儀(thermal mechanical analyzer, TMA),依IPC-TM-650 2.4.24.5所述方法測量各待測樣品的Z軸 alpha 1(50~110°C溫度區間)的熱膨脹係數,其單位爲ppm/°C。熱膨脹係數越低代表待測樣品的受熱後膨脹的比例越小,即該樹脂組合物應用於印刷電路板中能具有較佳的特性。熱膨脹係數越低越佳,一般而言,熱膨脹係數若差異達0.5 ppm/°C則為顯著差異。
吸水率
於吸水率量測中,選用不含銅基板(八張半固化片壓合而成)爲待測樣品,將樣品裁成長與寬皆為2英吋的樣品,將樣品平放於鋁盤上並置入105°C的烤箱內烘烤1小時後取出,放入乾燥皿內冷卻至室溫(約25°C),取出冷卻後的樣品,量測其重量為W1。再將樣品完全浸入注水的燒杯中,靜置於室溫下24小時後,取出樣品並擦乾表面的水,量測其重量為W2,並計算其吸水率W(%) = ((W2-W1)/W1)*100%。
實施例及比較例的樹脂組合物組成及特性測試結果如下表所示(單位皆為重量份): [表1] 實施例樹脂組合物的組成(單位:重量份)與特性測試結果
[表2] 實施例樹脂組合物的組成(單位:重量份)與特性測試結果
[表3] 比較例樹脂組合物的組成(單位:重量份)與特性測試結果
[表4] 比較例樹脂組合物的組成(單位:重量份)與特性測試結果
| 組份 | 名稱 | E1 | E2 | E3 | E4 | E5 | E6 | E7 | E8 |
| 氰酸酯 | PT-30S | 10 | 10 | 10 | 20 | ||||
| BA-230S | |||||||||
| 馬來醯亞胺樹脂 | BMI-70 | 20 | 20 | 20 | 15 | 15 | 15 | 15 | 20 |
| BT樹脂 | BT樹脂1 | 15 | 30 | ||||||
| BT樹脂2 | 15 | ||||||||
| BT樹脂3 | 15 | ||||||||
| BT樹脂4 | |||||||||
| 雙官能脂肪族長鏈丙烯酸酯 | SR-238NS | 5 | 1 | 10 | 5 | 5 | 5 | 5 | 5 |
| SR-239 | |||||||||
| SR-262 | |||||||||
| 聚丁二烯 | B-1000 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 乙烯苄基聚苯醚 | OPE-2St | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 過氧化物 | 25B | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
| 球型二氧化矽 | SC-2500 | 70 | 70 | 70 | 70 | 70 | 70 | 70 | 70 |
| 甲苯 | 25 | 25 | 25 | 25 | 25 | 25 | 25 | 25 | |
| 丁酮 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | |
| 特性 | 單位 | E1 | E2 | E3 | E4 | E5 | E6 | E7 | E8 |
| Tg (TMA) | (℃) | 215 | 210 | 215 | 219 | 217 | 218 | 218 | 219 |
| Tg (DMA) | (℃) | 250 | 246 | 248 | 252 | 254 | 253 | 251 | 253 |
| 尺寸變化率 | (%) | 1.32 | 1.48 | 1.45 | 1.36 | 1.32 | 1.37 | 1.52 | 1.29 |
| 熱膨脹係數 | (ppm/℃) | 26.1 | 28.6 | 28.3 | 26.2 | 26.0 | 26.6 | 28.6 | 25.4 |
| 吸水率 | (%) | 0.23 | 0.27 | 0.26 | 0.23 | 0.22 | 0.26 | 0.27 | 0.26 |
| 組份 | 名稱 | E9 | E10 | E11 | E12 | E13 | E14 | E15 |
| 氰酸酯 | PT-30S | 10 | 10 | 10 | 20 | 20 | ||
| BA-230S | 10 | |||||||
| 馬來醯亞胺樹脂 | BMI-70 | 30 | 20 | 20 | 30 | 20 | 15 | 30 |
| BT 樹脂 | BT樹脂1 | |||||||
| BT樹脂2 | ||||||||
| BT樹脂3 | ||||||||
| BT樹脂4 | 15 | |||||||
| 雙官能脂肪族長鏈丙烯酸酯 | SR-238NS | 5 | 6 | 5 | 5 | 3 | ||
| SR-239 | 5 | |||||||
| SR-262 | 5 | |||||||
| 聚丁二烯 | B-1000 | 4 | 4 | 4 | 2 | 4 | 4 | 8 |
| 乙烯苄基聚苯醚 | OPE-2St | 30 | 30 | 30 | 30 | 30 | 30 | 50 |
| 過氧化物 | 25B | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
| 球型二氧化矽 | SC-2500 | 70 | 70 | 70 | 70 | 70 | 70 | 70 |
| 甲苯 | 25 | 25 | 25 | 25 | 25 | 25 | 25 | |
| 丁酮 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | |
| 特性 | 單位 | E9 | E10 | E11 | E12 | E13 | E14 | E15 |
| Tg (TMA) | (℃) | 217 | 216 | 212 | 220 | 212 | 208 | 214 |
| Tg (DMA) | (℃) | 255 | 247 | 245 | 256 | 240 | 243 | 242 |
| 尺寸變化率 | (%) | 1.30 | 1.38 | 1.42 | 1.31 | 1.46 | 1.52 | 1.45 |
| 熱膨脹係數 | (ppm/℃) | 25.8 | 26.8 | 27.2 | 25.2 | 26.8 | 26.9 | 26.2 |
| 吸水率 | (%) | 0.22 | 0.25 | 0.27 | 0.22 | 0.30 | 0.27 | 0.25 |
| 組份 | 名稱 | C1 | C2 | C3 | C4 | C5 | C6 |
| 氰酸酯 | PT-30S | 10 | 10 | 10 | 10 | 10 | 10 |
| BA-230S | |||||||
| 馬來醯亞胺樹脂 | BMI-70 | 20 | 20 | 20 | 20 | 20 | 20 |
| 雙官能脂肪族長鏈丙烯酸酯 | SR-238NS | 0.5 | 20 | ||||
| SR-239 | |||||||
| SR-262 | |||||||
| 雙官能脂肪族非長鏈丙烯酸酯 | SR-833 | 5 | |||||
| SR-349 | 5 | ||||||
| SR-231 | 5 | ||||||
| SR-297 | |||||||
| 單官能丙烯酸酯 | SR-423NS | 5 | |||||
| 單官能脂肪族長鏈丙烯酸酯 | SR-313 | ||||||
| SR-324 | |||||||
| 聚丁二烯 | B-1000 | 4 | 4 | 4 | 4 | 4 | 4 |
| 乙烯苄基聚苯醚 | OPE-2St | 30 | 30 | 30 | 30 | 30 | 30 |
| 過氧化物 | 25B | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
| 球型二氧化矽 | SC-2500 | 70 | 70 | 70 | 70 | 70 | 70 |
| 甲苯 | 25 | 25 | 25 | 25 | 25 | 25 | |
| 丁酮 | 50 | 50 | 50 | 50 | 50 | 50 | |
| 特性 | 單位 | C1 | C2 | C3 | C4 | C5 | C6 |
| Tg (TMA) | (℃) | 208 | 198 | 202 | 204 | 208 | 200 |
| Tg (DMA) | (℃) | 245 | 232 | 236 | 240 | 239 | 235 |
| 尺寸變化率 | (%) | 1.52 | 1.82 | 1.76 | 1.72 | 1.65 | 1.68 |
| 熱膨脹係數 | (ppm/℃) | 30.3 | 32.3 | 33.4 | 34.2 | 32.6 | 31.6 |
| 吸水率 | (%) | 0.31 | 0.23 | 0.33 | 0.32 | 0.29 | 0.35 |
| 組份 | 名稱 | C7 | C8 | C9 | C10 | C11 | C12 |
| 氰酸酯 | PT-30S | 10 | 10 | 10 | 10 | 10 | 10 |
| BA-230S | |||||||
| 馬來醯亞胺樹脂 | BMI-70 | 20 | 20 | 20 | 20 | 20 | 20 |
| 雙官能脂肪族非長鏈丙烯酸酯 | SR-833 | 5 | 5 | 10 | |||
| SR-349 | |||||||
| SR-231 | |||||||
| SR-297 | 5 | ||||||
| 單官能丙烯酸酯 | SR-423NS | 5 | |||||
| 單官能脂肪族長鏈丙烯酸酯 | SR-313 | 5 | 5 | ||||
| SR-324 | 5 | ||||||
| 聚丁二烯 | B-1000 | 4 | 4 | 4 | 4 | 4 | 4 |
| 乙烯苄基聚苯醚 | OPE-2St | 30 | 30 | 30 | 30 | 30 | 30 |
| 過氧化物 | 25B | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |
| 球型二氧化矽 | SC-2500 | 70 | 70 | 70 | 70 | 70 | 70 |
| 甲苯 | 25 | 25 | 25 | 25 | 25 | 25 | |
| 丁酮 | 50 | 50 | 50 | 50 | 50 | 50 | |
| 特性 | 單位 | C7 | C8 | C9 | C10 | C11 | C12 |
| Tg (TMA) | (℃) | 204 | 206 | 202 | 200 | 203 | 198 |
| Tg (DMA) | (℃) | 236 | 240 | 239 | 232 | 235 | 228 |
| 尺寸變化率 | (%) | 1.62 | 1.76 | 1.83 | 1.82 | 1.78 | 2.06 |
| 熱膨脹係數 | (ppm/℃) | 31.1 | 33.6 | 34.2 | 34.6 | 33.5 | 35.8 |
| 吸水率 | (%) | 0.36 | 0.34 | 0.38 | 0.35 | 0.33 | 0.34 |
根據以上測試結果,可以觀察到以下現象:
實施例E1~E3相較於比較例C1~C2,其中,實施例E1~E3使用了1至10重量份範圍內的雙官能脂肪族長鏈丙烯酸酯而可達到較佳(較高)的TMA及DMA量測的玻璃轉化溫度,且同時具備較佳(較低)的熱膨脹係數(Z軸熱膨脹係數小於或等於30 ppm/°C)。反之,比較例C1~C2使用1至10重量份範圍外的雙官能脂肪族長鏈丙烯酸酯,則造成較低的玻璃轉化溫度及較差的熱膨脹係數。
實施例E1~E3、E8~E13以及E15相較於比較例C3~C12,其中,實施例E1~E3、E8~E13以及E15能達到TMA測試的玻璃轉化溫度大於或等於208°C、DMA測試的玻璃轉化溫度大於或等於240°C、Z軸尺寸變化率小於或等於1.60%、Z軸熱膨脹係數小於或等於30 ppm/°C以及吸水率小於或等於0.30%的一種、多種或全部功效。反之,比較例C3~C12則無法達到前述功效。
以上實施方式本質上僅為輔助說明,且並不欲用以限制申請標的之實施例或該等實施例的應用或用途。於本文中,用語「例示性」代表「作為一實例、範例或說明」。本文中任一種例示性的實施態樣並不必然可解讀為相對於其他實施態樣而言為較佳或較有利者。
此外,儘管已於前述實施方式中提出至少一例示性實施例或比較例,但應瞭解本發明仍可存在大量的變化。同樣應瞭解的是,本文所述之實施例並不欲用以透過任何方式限制所請求之申請標的之範圍、用途或組態。相反的,前述實施方式將可提供本領域具有通常知識者一種簡便的指引以實施所述之一或多種實施例。再者,可對元件之功能與排列進行各種變化而不脫離申請專利範圍所界定的範圍,且申請專利範圍包含已知的均等物及在本專利申請案提出申請時的所有可預見均等物。
無
Claims (11)
- 如請求項1所述之樹脂組合物,其中n介於6至12之間。
- 如請求項1所述之樹脂組合物,其中該馬來醯亞胺三嗪樹脂為氰酸酯樹脂與馬來醯亞胺樹脂的聚合物。
- 如請求項1所述之樹脂組合物,進一步包含:環氧樹脂、酚樹脂、苯并噁嗪樹脂、苯乙烯馬來酸酐、聚酯、胺類固化劑、聚烯烴、聚苯醚樹脂、三烯丙基異氰酸酯、三烯丙基氰酸酯、二乙烯基苯、二(乙烯苄基)醚、二(乙烯苯基)乙烷、聚醯胺、聚醯亞胺或其組合。
- 如請求項1所述之樹脂組合物,進一步包含:阻燃劑、無機填充物、硬化促進劑、溶劑、增韌劑、矽烷偶合劑或其組合。
- 一種由請求項1所述之樹脂組合物製成的物品,其包括半固化片、樹脂膜、積層板或印刷電路板。
- 如請求項6所述之物品,其以熱機械分析儀參照IPC-TM-650 2.4.24.5所述方法測量而得的Z軸熱膨脹係數小於或等於30ppm/℃。
- 如請求項6所述之物品,其以熱機械分析儀參照IPC-TM-650 2.4.24.5所述方法測量而得的玻璃轉化溫度大於或等於208℃。
- 如請求項6所述之物品,其以動態機械分析儀參照IPC-TM-650 2.4.24.4所述方法測量而得的玻璃轉化溫度大於或等於240℃。
- 如請求項6所述之物品,其以熱機械分析儀參照IPC-TM-650 2.4.24.5所述方法測量而得的Z軸尺寸變化率小於或等於1.60%。
- 如請求項6所述之物品,其吸水率小於或等於0.30%。
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