TWI700026B - Device casing - Google Patents

Abstract

A device casing includes a first casing part and a second casing part. The first casing part includes a connection portion and a heat dissipation portion joined with the connection portion. The first casing part joins the second casing part through the connection portion to form an accommodating space. Therein, the connection portion and the heat dissipation portion are made of different thermoplastic materials, which facilitate the joining design of the connection portion and the second casing part. It also facilitates a relatively efficient dissipation of heat from device components accommodated in the accommodating space through the heat dissipation portion.

Description

Device housing

The present invention relates to a combined device casing, in particular to a combined device casing that can provide heat dissipation.

Many electronic devices generate considerable heat during operation, so the device casing must be able to dissipate heat. For example, when the output power of the power adapter is higher, the heat generated during operation is also higher in principle. If the device housing of the power adapter cannot dissipate heat in time, the heat generated during operation will accumulate in the device housing, causing the operating temperature of the power adapter to remain high, affecting the power conversion efficiency and also affecting its service life. As the size of the power adapter becomes smaller and smaller, this problem will become more serious. In addition, the device casing of the general power adapter adopts a combined design, and each component casing is usually made of a plastic material of a general single material for ease of assembly, for example, combined by ultrasonic welding to form the casing. However, general plastic materials have poor thermal conductivity, and the accumulated heat is difficult to dissipate. If the component shell is made of a material with better thermal conductivity, the component shell may not be conducive to ultrasonic welding, creating a dilemma.

In view of the problems in the prior art, one object of the present invention is to provide a device casing with a combined structure. One of the component shells includes two parts that are combined with each other with different materials, so as to realize heat dissipation and easy combination with other component shells.

The device casing according to the present invention includes a first casing and a second casing. The first shell includes a connecting portion and a heat dissipation portion combined with the connecting portion, and the connecting portion and the heat dissipation portion are made of different thermoplastic materials. The first shell is combined with the second shell via the connecting portion to form an accommodating space. Thereby, in principle, the design of the combination of the connecting portion and the second shell can eliminate the need to consider the dispersion of the heat dissipation portion. Heat function, and the material of the heat dissipating part can focus on the heat dissipating function, without considering the combination design of the connecting part and the second shell. In addition, the connecting portion and the heat dissipating portion are made of thermoplastic materials, which can be easily formed into any shape, which also facilitates the combination between the two. Therefore, the device housing according to the present invention can have both a housing combination design and a heat dissipation function, effectively solving the dilemma in the prior art.

The advantages and spirit of the present invention can be further understood from the following detailed description of the invention and the accompanying drawings.

1, 3, 5: electronic device

14: Electronic components

12, 32, 52: device housing

120: accommodation space

120a: opening

122: first shell

1222: The first connection part

1222a: first side

1222b: second side

1224: The first heat sink

1224a: Perimeter

1224b: Sawtooth

1224c: Through hole

1224d: groove

12242: Flat part

12244: side wall

124: second shell

1242: second connection part

1244: second heat sink

322: first shell

3224: The first heat sink

32242: Thermal contact part

32244: Fin structure

522: first shell

5222: The first connecting part

5222a: opening

5224: The first heat sink

5224a: groove

524: second shell

5242: The second connecting part

FIG. 1 is a schematic diagram of an electronic device according to an embodiment.

Figure 2 is an exploded view of the electronic device in Figure 1;

3 is a cross-sectional view of the electronic device in FIG. 1 along the line X-X.

FIG. 4 is an enlarged view of the first heat dissipation portion at the circle A in FIG. 3 according to an embodiment.

FIG. 5 is an enlarged view of the first heat dissipating portion at the circle A in FIG. 3 according to an embodiment.

Fig. 6 is an enlarged view of the first heat dissipating portion at the circle A in Fig. 3 according to an embodiment.

FIG. 7 is a schematic diagram of an electronic device according to another embodiment.

Fig. 8 is a cross-sectional view of the electronic device in Fig. 7 along the line Y-Y.

Fig. 9 is an exploded view of an electronic device according to another embodiment.

10 is a cross-sectional view of the electronic device in FIG. 9.

Please refer to Figure 1 to Figure 3. An electronic device 1 according to an embodiment, such as but not limited to a power adapter, includes a device housing 12 and at least one electronic component 14 accommodated therein (for example but not limited to a circuit board module implementation) To simplify the diagram, it is represented by a single entity in Figure 3). The device housing 12 includes a first shell 122 and a second shell 124. The first shell 122 and the second shell 124 are combined to form an accommodating space 120 for accommodating the at least one electronic component 14. The first shell 122 includes a first connecting portion 1222 And a first heat dissipation portion 1224 combined with the first connection portion 1222. The first connection portion 1222 and the first heat dissipation portion 1224 are made of different thermoplastic materials. Therefore, in practice, the first connection portion 1222 and the first heat dissipation The portion 1224 may be formed by injection, for example, the first heat dissipation portion 1224 is injection molded first, and then the first connection portion 1222 integrally molded with the first heat dissipation portion 1224 is formed by embedding and emitting.

The second shell 124 includes a second connecting portion 1242 and a second heat dissipation portion 1244 combined with the second connecting portion 1242. The second connecting portion 1242 and the second heat dissipation portion 1244 are made of different thermoplastic materials. Similarly, in practice, the second connecting portion 1242 and the second heat dissipation portion 1244 can be formed by injection molding, for example, the second heat dissipation portion 1244 is formed by injection molding first, and then formed by embedding and exiting and forming integrally with the second heat dissipation portion 1244 The second connecting portion 1242. The first shell 122 and the second shell 124 are combined with the second connecting portion 1242 through the first connecting portion 1222. In addition, in this embodiment, the device housing 12 further has two openings 120a (the other side opening is not shown in FIG. 1, for example but not limited to being formed by the first connecting portion 1222 and the second connecting portion 1242), For the electronic component 14 to be connected with an external device; for example, a socket is provided at the opening 120a (for example, fixed on the circuit board of the electronic component 14 and engaged with the opening 120a), and a cable (for example, with The circuit board of the electronic component 14 is connected with the other opening through a grommet).

In this embodiment, in the first housing 122, the first connecting portion 1222 is used for structural connection with the second housing 124, and the first heat dissipation portion 1224 is used for dissipating heat to the electronic component 14. Due to the different materials of the first connection portion 1222 and the first heat dissipation portion 1224, the first connection portion 1222 and the first heat dissipation portion 1224 can be made of suitable materials to perform their respective functions. This feature can also increase the design flexibility of the first shell 122, including material selection and structural design. For example, the material of the first connecting portion 1222 may be a thermoplastic material (such as but not limited to ABS, PC, PC/ABS glue, etc.), which is convenient for shaping and can be easily combined with the first heat dissipation portion 1224 (for example, through the buried input). For another example, the material of the first heat dissipation portion 1224 is a thermoplastic material containing a plurality of thermally conductive particles (such as but not limited to AlN, SiC, Al ₂ O ₃ , graphite, fibrous high thermal conductivity carbon powder, scaly high thermal conductivity carbon powder, etc.) ( Such as but not limited to PPS, PA6/PA66 glue, LCP, TPE, PC, PP, PPA, PEEK, etc.). Generally speaking, both the first connecting portion 1222 and the first heat dissipating portion 1224 are electrically insulated, the first heat dissipating portion 1224 is harder than the first connecting portion 1222, and the first connecting portion 1222 is easier to mold than the first heat dissipating portion 1224. shape. In addition, the first heat dissipation portion 1224 is also beneficial to improve the structural strength of the device housing 12. In the same way, in the second shell 124, through the different materials of the second connecting portion 1242 and the second heat dissipation portion 1244, the second connecting portion 1242 and the second heat dissipation portion 1244 can be made of suitable materials to play The respective functions. For other descriptions of the second connecting portion 1242 and the second heat dissipation portion 1244, you can directly refer to the related description of the first housing member 122, and will not be repeated.

In addition, in practice, the contact area and interference structure between the first connecting portion 1222 and the first heat dissipating portion 1224 can be increased to increase the bonding strength between each other after the embedding process. The first heat dissipating portion 1224 has a peripheral edge 1224a and an engaging structure disposed on the peripheral edge 1224a. The first heat sink 1224 is coupled to the first connecting portion 1222 via the peripheral edge 1224a, so that the first connecting portion 1222 and the engaging structure are closely coupled to each other. For example, in one embodiment, the occlusal structure is implemented by a plurality of (triangular) serrations 1224b (or can be implemented by a plurality of square or dovetail serrations), as shown in FIG. 4. For another example, in one embodiment, the occlusal structure is implemented by a plurality of through holes 1224c (or can be implemented by blind holes, and is not limited to circular holes), as shown in FIG. 5. For another example, in an embodiment, the occlusal structure is implemented by a groove 1224d extending along the peripheral edge 1224a, as shown in FIG. 6. Alternatively, the occlusal structure can be implemented by a score surface, a plurality of protrusions protruding in different directions (for example, perpendicular to the direction in which the peripheral edge 1224a extends), or a structure that combines multiple occlusal structures, without further description. In the same way, the foregoing description can also be applied to the combination between the second connecting portion 1242 and the second heat dissipation portion 1244, and will not be repeated.

In addition, in practice, the combination of the first connecting portion 1222 and the second connecting portion 1242 can be achieved through structural engagement, adhesive bonding, or ultrasonic welding. Wherein, in practice, a plurality of welding bumps (shown in dashed lines in FIG. 2) can be formed on the connecting surface of one of the first connecting portion 1222 and the second connecting portion 1242 to facilitate ultrasonic welding. Since the first connecting portion 1222 and the second connecting portion 1242 are of different materials from the first heat dissipation portion 1224 and the second heat dissipation portion 1244, respectively, the first connection portion 1222 and the second connection portion 1242 are optional Using appropriate materials, such as plastic of the same material, is good for ultrasonic welding; but the invention is not limited to this.

In addition, in this embodiment, the first heat dissipation portion 1224 includes a flat portion 12242 and two sidewall portions 12244 bent and extended from opposite sides of the flat portion 12242 toward the edge of the second shell 124, so that the first heat dissipation portion 1224 is integral The upper part has a U-shaped structure, which is also beneficial to improve the structural strength of the first heat dissipation portion 1224 itself and the entire first housing 122, and can also increase the heat dissipation efficiency of the first heat dissipation portion 1224.

In this embodiment, the first shell member 122 and the second shell member 124 are substantially symmetrical in structure, but the implementation is not limited thereto. Please refer to Figure 7 and Figure 8. In one embodiment, an electronic device 3 has substantially the same structure as the aforementioned electronic device 1, so the electronic device 3 uses the component symbols of the electronic device 1 in principle. For other descriptions of the electronic device 3, please directly refer to the related descriptions of the electronic device 1 And its changes will not be repeated. In the device housing 32 of the electronic device 3, the first heat dissipation portion 3224 of the first housing 322 includes a thermally conductive contact portion 32242 and a fin structure 32244 (including at least one fin). The thermally conductive contact portion 32242 protrudes toward the accommodating space 120 (that is, protrudes inward), and can contact the electronic components 14 (such as control chips, coil transformers) to increase heat conduction efficiency; in practice, the thermally conductive contact portion 32242 can contact the electronic components The thermal conductive glue is filled between the components 14 to increase the heat transfer efficiency. The fin structure 32244 extends outward, which can increase the heat dissipation efficiency; in practice, the fin is not limited to a plate shape, for example, a column shape may also be used.

In addition, referring to FIG. 2, in the electronic device 1, the first connecting portion 1222 is in a ring shape and has a first side 1222a and a second side 1222b opposite to the first side 1222a. The first heat dissipation portion 1224 is coupled to On the first side 1222a, the second shell 124 is coupled to the second side 1222b. Wherein, the first shell member 122 and the second shell member 124 are only combined through the first connecting portion 1222 and the second connecting portion 1242, but the invention is not limited thereto. Please refer to Figure 9 and Figure 10. In one embodiment, an electronic device 5 has substantially the same structure as the aforementioned electronic device 1, so the electronic device 5 uses the component symbols of the electronic device 1 in principle. For other descriptions of the electronic device 5, please refer to the related description of the electronic device 1 directly And its changes will not be repeated. The appearance of the electronic device 5 can be directly referred to in FIG. 1, and the cross-sectional position of FIG. 10 corresponds to the line X-X in FIG. 1. In the electronic device 5, The first connecting portion 5222 has an opening 5222a, and the first heat dissipation portion 5224 has a groove 5224a aligned with the opening 5222a, so that the groove 5224a can be exposed from the opening 5222a before the first housing part 522 and the second housing part 524 are combined . When the first shell 522 and the second shell 524 are combined, the second connecting portion 5242 can contact the groove 5224a through the opening 5222a; in other words, after the first shell 522 and the second shell 524 are combined, the second connecting portion The 5242 is combined with the first connecting portion 5222 and the first heat dissipating portion 5224 at the same time, and the existence of the opening 5222a and the groove 5224a increases the combined contact area of the first shell 522 and the second shell 524, and also increases the structure of both The effect of restraint. In this embodiment, the opening 5222a and the groove 5224a have the same contour, but the invention is not limited thereto. For example, the contour of the opening 5222a is smaller than the contour of (the opening of) the groove 5224a, which can increase the degree of structural interference between the second connecting portion 5242 and the first connecting portion 5222 after the first shell 522 and the second shell 524 are combined.

The foregoing descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.

1: Electronic device

14: Electronic components

1222: The first connection part

1222a: first side

1222b: second side

1224: The first heat sink

1224a: Perimeter

12242: Flat part

12244: side wall

1242: second connection part

1244: second heat sink

Claims (9)

A device casing, comprising: a first shell, comprising a first connecting portion and a first heat dissipation portion combined with the first connection portion, the first connection portion and the first heat dissipation portion are of different materials A thermoplastic material, the first connecting portion is annular and has a first side and a second side opposite to the first side, the first heat dissipation portion is coupled to the first side; and a second shell member, The first shell is combined with the second shell via the first connecting portion to form an accommodating space, and the second shell is combined with the second side. The device housing according to claim 1, wherein the second housing includes a second connecting portion and a second heat dissipation portion combined with the second connecting portion, and the second connecting portion and the second heat dissipation portion are made of Being different thermoplastic materials, the first shell member and the second shell member are combined with the second connecting portion via the first connecting portion. The device casing according to claim 2, wherein the first connection portion has an opening, the first heat dissipation portion has a groove aligned with the opening, and the second connection portion contacts the groove through the opening. The device housing according to claim 3, wherein the opening and the groove have the same outline. The device housing according to claim 1, wherein the first heat dissipation portion has a peripheral edge and an engaging structure disposed on the peripheral edge, and the first connecting portion and the engaging structure are tightly combined with each other. The device housing according to claim 1, wherein the material of the first heat dissipation portion is a thermoplastic material containing a plurality of thermally conductive particles. The device housing according to claim 1, wherein the first heat dissipation portion includes a heat conduction contact portion protruding toward the accommodating space. The device housing according to claim 1, wherein the first heat dissipation portion includes a fin structure extending outward. The device casing according to claim 1, wherein the first heat dissipation portion has a flat plate portion and One side of the flat plate portion is bent to extend a side wall portion.

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