TWI799617B - 半導體元件檢查方法及半導體元件檢查裝置 - Google Patents

半導體元件檢查方法及半導體元件檢查裝置 Download PDF

Info

Publication number: TWI799617B
Authority: TW; Taiwan
Prior art keywords: semiconductor element; element inspection; inspection apparatus; inspection method; semiconductor
Prior art date: 2018-09-26

Application number

TW108125021A

Other languages

English (en)

Other versions

TW202029369A (zh

Inventor

鈴木信介

Original Assignee

日商濱松赫德尼古斯股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-09-26

Filing date

2019-07-16

Publication date

2023-04-21

2019-07-16 Application filed by 日商濱松赫德尼古斯股份有限公司 filed Critical 日商濱松赫德尼古斯股份有限公司

2020-08-01 Publication of TW202029369A publication Critical patent/TW202029369A/zh

2023-04-21 Application granted granted Critical

2023-04-21 Publication of TWI799617B publication Critical patent/TWI799617B/zh

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/265—Contactless testing
- G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/303—Contactless testing of integrated circuits
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31728—Optical aspects, e.g. opto-electronics used for testing, optical signal transmission for testing electronic circuits, electro-optic components to be tested in combination with electronic circuits, measuring light emission of digital circuits

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
General Physics & Mathematics (AREA)
Health & Medical Sciences (AREA)
General Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Computer Vision & Pattern Recognition (AREA)
Toxicology (AREA)
Electromagnetism (AREA)
Biochemistry (AREA)
General Health & Medical Sciences (AREA)
Immunology (AREA)
Pathology (AREA)
Analytical Chemistry (AREA)
Chemical & Material Sciences (AREA)
Life Sciences & Earth Sciences (AREA)
Computer Hardware Design (AREA)
Signal Processing (AREA)
Tests Of Electronic Circuits (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)
Testing Of Individual Semiconductor Devices (AREA)

TW108125021A 2018-09-26 2019-07-16 半導體元件檢查方法及半導體元件檢查裝置 TWI799617B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2018180647A JP7158224B2 (ja)	2018-09-26	2018-09-26	半導体デバイス検査方法及び半導体デバイス検査装置
JP2018-180647		2018-09-26

Publications (2)

Publication Number	Publication Date
TW202029369A TW202029369A (zh)	2020-08-01
TWI799617B true TWI799617B (zh)	2023-04-21

Family

ID=69953013

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW108125021A TWI799617B (zh)	2018-09-26	2019-07-16	半導體元件檢查方法及半導體元件檢查裝置

Country Status (7)

Country	Link
US (1)	US11971364B2 (zh)
EP (1)	EP3859360A4 (zh)
JP (1)	JP7158224B2 (zh)
KR (1)	KR102698426B1 (zh)
CN (1)	CN112752980B (zh)
TW (1)	TWI799617B (zh)
WO (1)	WO2020066177A1 (zh)

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* Cited by examiner, † Cited by third party
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EP4131350A4 (en) *	2020-06-08	2024-05-08	Hamamatsu Photonics K.K.	SEMICONDUCTOR INSPECTION METHOD AND SEMICONDUCTOR INSPECTION APPARATUS
JP7374937B2 (ja) *	2021-01-13	2023-11-07	株式会社アドバンテスト	試験装置、試験方法およびプログラム
JP7386190B2 (ja)	2021-01-21	2023-11-24	株式会社アドバンテスト	試験装置、試験方法およびプログラム
JP7355773B2 (ja)	2021-02-26	2023-10-03	株式会社アドバンテスト	試験装置、試験方法およびプログラム
KR102637850B1 (ko) *	2021-11-18	2024-02-19	와이아이케이 주식회사	반도체 디바이스 테스트 장치 및 그것의 리던던시 분석 방법
TWI809730B (zh) *	2021-12-09	2023-07-21	南亞科技股份有限公司	待測元件的多重測試裝置及其測試方法
US12181515B2 (en)	2021-12-09	2024-12-31	Nanya Technology Corporation	Apparatus for performing multiple tests on a device under test

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TW200616060A (en) *	2004-08-02	2006-05-16	Matsushita Electric Industrial Co Ltd	Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks
TW200703409A (en) *	2005-03-03	2007-01-16	Ebara Corp	Mapping projection type electron beam apparatus and defects inspection system using such apparatus
US20090040512A1 (en) *	2004-04-13	2009-02-12	Komatsu Electronic Metals Co., Ltd.	Semiconductor wafer inspection device and method
TW200921126A (en) *	2007-06-29	2009-05-16	Nec Electronics Corp	Method and device for inspection and failure analysis
US20150024520A1 (en) *	2012-04-27	2015-01-22	Fuji Electric Co., Ltd.	Semiconductor device manufacturing method and manufacturing device
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US20170200658A1 (en) *	2016-01-08	2017-07-13	Samsung Electronics Co., Ltd.	Methods of inspecting substrates and semiconductor fabrication methods incorporating the same

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JP3875383B2 (ja)	1997-12-02	2007-01-31	株式会社トプコン	表面検査装置
US6104481A (en) *	1997-11-11	2000-08-15	Kabushiki Kaisha Topcon	Surface inspection apparatus
JP3698904B2 (ja) *	1999-01-11	2005-09-21	沖電気工業株式会社	半導体評価方法及び欠陥位置特定装置
CN1685220B (zh) *	2002-09-30	2010-04-28	应用材料以色列股份有限公司	暗场检测系统
JP2004327858A (ja) *	2003-04-25	2004-11-18	Toshiba Corp	半導体装置の検査方法および検査装置
JP2007127499A (ja) *	2005-11-02	2007-05-24	Nec Electronics Corp	非破壊検査装置および非破壊検査方法
JP2009300202A (ja) *	2008-06-12	2009-12-24	Toshiba Corp	半導体装置の検査方法及び半導体装置の検査装置
JP2010103320A (ja) *	2008-10-23	2010-05-06	Topcon Corp	半導体検査装置
JP2012222263A (ja) *	2011-04-13	2012-11-12	Renesas Electronics Corp	半導体装置の不良解析方法、チップ状半導体装置の不良解析方法及び半導体装置の動的不良解析装置
JP5894745B2 (ja) *	2011-05-31	2016-03-30	浜松ホトニクス株式会社	集積回路検査装置
JP2015032686A (ja) *	2013-08-02	2015-02-16	信越半導体株式会社	半導体素子の評価方法及び半導体素子の評価装置
JP5996687B2 (ja) *	2015-02-10	2016-09-21	浜松ホトニクス株式会社	検査装置及び検査方法

2018
- 2018-09-26 JP JP2018180647A patent/JP7158224B2/ja active Active
2019
- 2019-06-25 US US17/278,683 patent/US11971364B2/en active Active
- 2019-06-25 KR KR1020217001671A patent/KR102698426B1/ko active Active
- 2019-06-25 EP EP19866090.4A patent/EP3859360A4/en active Pending
- 2019-06-25 WO PCT/JP2019/025249 patent/WO2020066177A1/ja not_active Ceased
- 2019-06-25 CN CN201980063019.1A patent/CN112752980B/zh active Active
- 2019-07-16 TW TW108125021A patent/TWI799617B/zh not_active IP Right Cessation

Patent Citations (7)

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US20090040512A1 (en) *	2004-04-13	2009-02-12	Komatsu Electronic Metals Co., Ltd.	Semiconductor wafer inspection device and method
TW200616060A (en) *	2004-08-02	2006-05-16	Matsushita Electric Industrial Co Ltd	Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks
TW200703409A (en) *	2005-03-03	2007-01-16	Ebara Corp	Mapping projection type electron beam apparatus and defects inspection system using such apparatus
TW200921126A (en) *	2007-06-29	2009-05-16	Nec Electronics Corp	Method and device for inspection and failure analysis
US20150024520A1 (en) *	2012-04-27	2015-01-22	Fuji Electric Co., Ltd.	Semiconductor device manufacturing method and manufacturing device
TW201705325A (zh) *	2015-07-31	2017-02-01	台灣積體電路製造股份有限公司	檢測基材中之缺陷之存在與位置的方法與晶圓
US20170200658A1 (en) *	2016-01-08	2017-07-13	Samsung Electronics Co., Ltd.	Methods of inspecting substrates and semiconductor fabrication methods incorporating the same

Also Published As

Publication number	Publication date
WO2020066177A1 (ja)	2020-04-02
TW202029369A (zh)	2020-08-01
EP3859360A4 (en)	2022-06-15
JP7158224B2 (ja)	2022-10-21
JP2020051858A (ja)	2020-04-02
US11971364B2 (en)	2024-04-30
CN112752980B (zh)	2024-12-03
EP3859360A1 (en)	2021-08-04
KR20210062623A (ko)	2021-05-31
US20210270752A1 (en)	2021-09-02
KR102698426B1 (ko)	2024-08-26
CN112752980A (zh)	2021-05-04

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EP3849254A4 (en)	2021-11-10	POSITIONING PROCESS AND APPARATUS
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EP3809391A4 (en)	2022-02-23	CALCULATION DEVICE AND CALCULATION METHOD
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EP3916429A4 (en)	2022-10-19	MEASURING DEVICE AND METHOD OF MEASURING

Legal Events

Date	Code	Title	Description
2026-01-21	MM4A	Annulment or lapse of patent due to non-payment of fees