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TWI799604B - 工件加工方法 - Google Patents

工件加工方法 Download PDF

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Publication number
TWI799604B
TWI799604B TW108121271A TW108121271A TWI799604B TW I799604 B TWI799604 B TW I799604B TW 108121271 A TW108121271 A TW 108121271A TW 108121271 A TW108121271 A TW 108121271A TW I799604 B TWI799604 B TW I799604B
Authority
TW
Taiwan
Prior art keywords
processing method
workpiece processing
workpiece
processing
Prior art date
Application number
TW108121271A
Other languages
English (en)
Other versions
TW202002093A (zh
Inventor
成田義智
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202002093A publication Critical patent/TW202002093A/zh
Application granted granted Critical
Publication of TWI799604B publication Critical patent/TWI799604B/zh

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Classifications

    • H10P54/00—
    • H10P52/00—
    • H10P90/123—
    • H10P90/128—
TW108121271A 2018-06-22 2019-06-19 工件加工方法 TWI799604B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018118692A JP7068064B2 (ja) 2018-06-22 2018-06-22 被加工物の加工方法
JP2018-118692 2018-06-22

Publications (2)

Publication Number Publication Date
TW202002093A TW202002093A (zh) 2020-01-01
TWI799604B true TWI799604B (zh) 2023-04-21

Family

ID=68968867

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108121271A TWI799604B (zh) 2018-06-22 2019-06-19 工件加工方法

Country Status (4)

Country Link
JP (1) JP7068064B2 (zh)
KR (1) KR102742368B1 (zh)
CN (1) CN110634736B (zh)
TW (1) TWI799604B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111403315B (zh) * 2020-03-03 2022-03-18 上海华力集成电路制造有限公司 晶圆切边装置和方法
USD969050S1 (en) * 2020-12-03 2022-11-08 Ralph Preston Kirtland Vehicle bumper brace
JP7687834B2 (ja) * 2021-03-12 2025-06-03 株式会社ディスコ 加工装置及び加工方法
CN115132568A (zh) * 2021-03-25 2022-09-30 三美电机株式会社 半导体装置的制造方法
CN113510609B (zh) * 2021-07-12 2023-09-08 长鑫存储技术有限公司 晶圆以及晶圆的处理方法
CN113510544A (zh) * 2021-07-14 2021-10-19 凯龙蓝烽新材料科技有限公司 一种蜂窝陶瓷载体的外圆磨装置
CN114597125A (zh) * 2022-02-28 2022-06-07 太极半导体（苏州）有限公司 一种晶圆研磨前半环切边加工工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6004405A (en) * 1997-03-11 1999-12-21 Super Silicon Crystal Research Institute Corp. Wafer having a laser mark on chamfered edge
TW200807600A (en) * 2006-06-09 2008-02-01 Disco Corp Sensing mechanism for crystal orientation indication mark of semiconductor wafer
TW200935575A (en) * 2007-09-04 2009-08-16 Disco Corp Wafer
JP2013115187A (ja) * 2011-11-28 2013-06-10 Disco Abrasive Syst Ltd ウェーハの加工方法
TWI496205B (zh) * 2009-04-15 2015-08-11 大都電子股份有限公司 晶圓斜角加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3515917B2 (ja) 1998-12-01 2004-04-05 シャープ株式会社 半導体装置の製造方法
JP4029975B2 (ja) 2002-12-18 2008-01-09 コバレントマテリアル株式会社 半導体ウェーハのノッチの肩円弧部半径の測定方法
JP4354769B2 (ja) * 2003-09-19 2009-10-28 株式会社ディスコ ウェーハの研磨方法
JP5343400B2 (ja) * 2008-05-22 2013-11-13 株式会社Ｓｕｍｃｏ 半導体ウェーハの製造方法
JP5881504B2 (ja) * 2012-03-30 2016-03-09 株式会社ディスコ ウエーハの加工方法
JP6093650B2 (ja) * 2013-05-20 2017-03-08 株式会社ディスコ ウェーハの加工方法
JP6479532B2 (ja) * 2015-03-30 2019-03-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6004405A (en) * 1997-03-11 1999-12-21 Super Silicon Crystal Research Institute Corp. Wafer having a laser mark on chamfered edge
TW200807600A (en) * 2006-06-09 2008-02-01 Disco Corp Sensing mechanism for crystal orientation indication mark of semiconductor wafer
TW200935575A (en) * 2007-09-04 2009-08-16 Disco Corp Wafer
TWI496205B (zh) * 2009-04-15 2015-08-11 大都電子股份有限公司 晶圓斜角加工方法
JP2013115187A (ja) * 2011-11-28 2013-06-10 Disco Abrasive Syst Ltd ウェーハの加工方法

Also Published As

Publication number Publication date
TW202002093A (zh) 2020-01-01
CN110634736B (zh) 2023-08-04
CN110634736A (zh) 2019-12-31
KR102742368B1 (ko) 2024-12-12
KR20200000337A (ko) 2020-01-02
JP2019220632A (ja) 2019-12-26
JP7068064B2 (ja) 2022-05-16

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