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TWI799484B - 化學增幅型正型感光性樹脂組成物及其應用 - Google Patents

化學增幅型正型感光性樹脂組成物及其應用 Download PDF

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Publication number
TWI799484B
TWI799484B TW107147024A TW107147024A TWI799484B TW I799484 B TWI799484 B TW I799484B TW 107147024 A TW107147024 A TW 107147024A TW 107147024 A TW107147024 A TW 107147024A TW I799484 B TWI799484 B TW I799484B
Authority
TW
Taiwan
Prior art keywords
application
resin composition
photosensitive resin
chemically amplified
positive photosensitive
Prior art date
Application number
TW107147024A
Other languages
English (en)
Other versions
TW202024793A (zh
Inventor
劉騏銘
施俊安
Original Assignee
奇美實業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奇美實業股份有限公司 filed Critical 奇美實業股份有限公司
Priority to TW107147024A priority Critical patent/TWI799484B/zh
Priority to CN201911268402.9A priority patent/CN111381438B/zh
Publication of TW202024793A publication Critical patent/TW202024793A/zh
Application granted granted Critical
Publication of TWI799484B publication Critical patent/TWI799484B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
TW107147024A 2018-12-25 2018-12-25 化學增幅型正型感光性樹脂組成物及其應用 TWI799484B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW107147024A TWI799484B (zh) 2018-12-25 2018-12-25 化學增幅型正型感光性樹脂組成物及其應用
CN201911268402.9A CN111381438B (zh) 2018-12-25 2019-12-11 化学增幅型正型感光性树脂组成物及其应用

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107147024A TWI799484B (zh) 2018-12-25 2018-12-25 化學增幅型正型感光性樹脂組成物及其應用

Publications (2)

Publication Number Publication Date
TW202024793A TW202024793A (zh) 2020-07-01
TWI799484B true TWI799484B (zh) 2023-04-21

Family

ID=71215102

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107147024A TWI799484B (zh) 2018-12-25 2018-12-25 化學增幅型正型感光性樹脂組成物及其應用

Country Status (2)

Country Link
CN (1) CN111381438B (zh)
TW (1) TWI799484B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102834949B1 (ko) * 2021-03-10 2025-07-15 미쓰이 가가쿠 가부시키가이샤 유기 el 봉지재용 자외선 경화성 수지 조성물

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201523137A (zh) * 2013-10-30 2015-06-16 富士軟片股份有限公司 感光性樹脂組成物、硬化膜的製造方法、硬化膜、液晶顯示裝置、有機ｅｌ顯示裝置及觸控面板顯示裝置
TWI553404B (zh) * 2011-09-22 2016-10-11 富士軟片股份有限公司 正型感光性樹脂組成物、硬化膜及其製造方法、圖案、ｍｅｍｓ結構體製造方法、乾及濕蝕刻方法
TW201823861A (zh) * 2016-12-27 2018-07-01 奇美實業股份有限公司 化學增幅型正型感光性樹脂組成物、附有鑄模的基板的製造方法以及電鍍成形體的製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5538039B2 (ja) * 2009-05-01 2014-07-02 富士フイルム株式会社 ポジ型感光性樹脂組成物及びそれを用いた硬化膜形成方法
JP4591625B1 (ja) * 2010-04-01 2010-12-01 Ｊｓｒ株式会社 ポジ型感放射線性組成物、層間絶縁膜及びその形成方法
JP5625460B2 (ja) * 2010-04-15 2014-11-19 Jsr株式会社 ポジ型感放射線性組成物、層間絶縁膜及びその形成方法
JP5555732B2 (ja) * 2012-02-29 2014-07-23 富士フイルム株式会社 感光性樹脂組成物、これを用いた硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
JP6136491B2 (ja) * 2012-04-24 2017-05-31 Jsr株式会社 感放射線性樹脂組成物、表示素子用層間絶縁膜及びその形成方法
TWI541610B (zh) * 2013-07-25 2016-07-11 Chi Mei Corp Photosensitive polysiloxane compositions and their use
TWI524141B (zh) * 2014-06-27 2016-03-01 奇美實業股份有限公司 感光性樹脂組成物、保護膜及具有保護膜之元件
JP6318957B2 (ja) * 2014-07-31 2018-05-09 Jsr株式会社 感放射線性樹脂組成物、硬化膜及びその形成方法、並びに表示素子
JP6668888B2 (ja) * 2016-03-31 2020-03-18 Jsr株式会社 ポジ型感放射線性樹脂組成物、層間絶縁膜、層間絶縁膜の形成方法、半導体素子及び表示素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553404B (zh) * 2011-09-22 2016-10-11 富士軟片股份有限公司 正型感光性樹脂組成物、硬化膜及其製造方法、圖案、ｍｅｍｓ結構體製造方法、乾及濕蝕刻方法
TW201523137A (zh) * 2013-10-30 2015-06-16 富士軟片股份有限公司 感光性樹脂組成物、硬化膜的製造方法、硬化膜、液晶顯示裝置、有機ｅｌ顯示裝置及觸控面板顯示裝置
TW201823861A (zh) * 2016-12-27 2018-07-01 奇美實業股份有限公司 化學增幅型正型感光性樹脂組成物、附有鑄模的基板的製造方法以及電鍍成形體的製造方法

Also Published As

Publication number Publication date
CN111381438B (zh) 2023-06-20
TW202024793A (zh) 2020-07-01
CN111381438A (zh) 2020-07-07

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