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TWI799452B - 板狀物的分割裝置 - Google Patents

板狀物的分割裝置 Download PDF

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Publication number
TWI799452B
TWI799452B TW107135497A TW107135497A TWI799452B TW I799452 B TWI799452 B TW I799452B TW 107135497 A TW107135497 A TW 107135497A TW 107135497 A TW107135497 A TW 107135497A TW I799452 B TWI799452 B TW I799452B
Authority
TW
Taiwan
Prior art keywords
plates
separating device
separating
Prior art date
Application number
TW107135497A
Other languages
English (en)
Other versions
TW201914972A (zh
Inventor
克里斯 麥海
金岡和樹
高原拓士
平手誠
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201914972A publication Critical patent/TW201914972A/zh
Application granted granted Critical
Publication of TWI799452B publication Critical patent/TWI799452B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • H10P72/0428—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • H10P54/00—
    • H10P72/0442—
    • H10P72/53—
    • H10P72/76—
    • H10P72/7402—
    • H10P72/7416—
    • H10P72/742—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW107135497A 2017-10-11 2018-10-09 板狀物的分割裝置 TWI799452B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017197829A JP7015668B2 (ja) 2017-10-11 2017-10-11 板状物の分割装置
JP2017-197829 2017-10-11

Publications (2)

Publication Number Publication Date
TW201914972A TW201914972A (zh) 2019-04-16
TWI799452B true TWI799452B (zh) 2023-04-21

Family

ID=65816759

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107135497A TWI799452B (zh) 2017-10-11 2018-10-09 板狀物的分割裝置

Country Status (8)

Country Link
US (1) US10818523B2 (zh)
JP (1) JP7015668B2 (zh)
KR (1) KR102515300B1 (zh)
CN (1) CN109659253B (zh)
DE (1) DE102018217297B4 (zh)
MY (1) MY191251A (zh)
SG (1) SG10201808747SA (zh)
TW (1) TWI799452B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200075386A1 (en) * 2018-08-30 2020-03-05 Texas Instruments Incorporated Subring for semiconductor dies
JP7355618B2 (ja) * 2018-12-04 2023-10-03 株式会社ディスコ ウエーハ分割装置
CN110739261B (zh) * 2019-11-20 2024-09-27 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种石英舟硅片的顶升机构
JP7511975B2 (ja) * 2020-05-13 2024-07-08 株式会社ディスコ 切削装置
JP7737701B2 (ja) * 2021-09-28 2025-09-11 三星ダイヤモンド工業株式会社 分断装置
JP2023128800A (ja) 2022-03-04 2023-09-14 株式会社ディスコ 分割装置
JP2024027963A (ja) 2022-08-19 2024-03-01 株式会社ディスコ ブレーキング装置及びブレーキング方法
CN117533788B (zh) * 2023-11-10 2024-04-19 珠海诚锋电子科技有限公司 一种自动上下料的圆晶检测设备及其使用方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW502342B (en) * 2000-08-04 2002-09-11 Toshiba Corp Chip pickup device and manufacturing method for semiconductor device
TW200503125A (en) * 2003-03-31 2005-01-16 Renesas Tech Corp Method of manufacturing a semiconductor device
CN101123175A (zh) * 2006-08-08 2008-02-13 日东电工株式会社 半导体晶圆的保持方法及其装置与半导体晶圆保持结构体
CN100419996C (zh) * 2004-05-18 2008-09-17 株式会社迪斯科 晶片分割方法
TW201145372A (en) * 2010-01-19 2011-12-16 Sony Chemical & Inf Device Method for manufacturing electronic component provided with adhesive film and method for manufacturing mounting body
US20170098579A1 (en) * 2015-10-06 2017-04-06 Disco Corporation Optical device wafer processing method

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1218088B (it) 1988-06-16 1990-04-12 Aisa Spa Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi
JP2004055860A (ja) * 2002-07-22 2004-02-19 Renesas Technology Corp 半導体装置の製造方法
JP4256214B2 (ja) * 2003-06-27 2009-04-22 株式会社ディスコ 板状物の分割装置
JP2006114691A (ja) * 2004-10-14 2006-04-27 Disco Abrasive Syst Ltd ウエーハの分割方法
JP5054933B2 (ja) * 2006-05-23 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20080242052A1 (en) * 2007-03-30 2008-10-02 Tao Feng Method of forming ultra thin chips of power devices
JP2009148982A (ja) 2007-12-20 2009-07-09 Daitron Technology Co Ltd ブレーキング装置
JP5203744B2 (ja) * 2008-02-21 2013-06-05 株式会社ディスコ ウエーハの裏面に装着された接着フィルムの破断方法
JP5231136B2 (ja) * 2008-08-22 2013-07-10 株式会社ディスコ 光デバイスウエーハの加工方法
JP5308213B2 (ja) * 2009-03-31 2013-10-09 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置の製造方法
WO2011077962A1 (ja) * 2009-12-24 2011-06-30 株式会社 村田製作所 電子部品の製造方法
JP5508133B2 (ja) * 2010-05-19 2014-05-28 株式会社ディスコ 板状物の分割装置
JP2012209635A (ja) * 2011-03-29 2012-10-25 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP5806185B2 (ja) * 2012-09-07 2015-11-10 東京エレクトロン株式会社 剥離システム
KR102007042B1 (ko) * 2012-09-19 2019-08-02 도쿄엘렉트론가부시키가이샤 박리 장치
JP6047392B2 (ja) 2012-12-13 2016-12-21 株式会社ディスコ 分割装置および分割方法
JP6189700B2 (ja) * 2013-10-03 2017-08-30 株式会社ディスコ ウエーハの加工方法
JP2015233077A (ja) * 2014-06-10 2015-12-24 株式会社ディスコ ウエーハの加工方法
JP2016001677A (ja) * 2014-06-12 2016-01-07 株式会社ディスコ ウエーハの加工方法
JP6351490B2 (ja) * 2014-11-26 2018-07-04 株式会社ディスコ パッケージ基板の分割方法
JP2017038030A (ja) * 2015-08-14 2017-02-16 株式会社ディスコ ウエーハの加工方法及び電子デバイス

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW502342B (en) * 2000-08-04 2002-09-11 Toshiba Corp Chip pickup device and manufacturing method for semiconductor device
TW200503125A (en) * 2003-03-31 2005-01-16 Renesas Tech Corp Method of manufacturing a semiconductor device
CN100419996C (zh) * 2004-05-18 2008-09-17 株式会社迪斯科 晶片分割方法
CN101123175A (zh) * 2006-08-08 2008-02-13 日东电工株式会社 半导体晶圆的保持方法及其装置与半导体晶圆保持结构体
TW201145372A (en) * 2010-01-19 2011-12-16 Sony Chemical & Inf Device Method for manufacturing electronic component provided with adhesive film and method for manufacturing mounting body
US20170098579A1 (en) * 2015-10-06 2017-04-06 Disco Corporation Optical device wafer processing method

Also Published As

Publication number Publication date
JP2019071390A (ja) 2019-05-09
US10818523B2 (en) 2020-10-27
CN109659253B (zh) 2024-03-12
TW201914972A (zh) 2019-04-16
KR102515300B1 (ko) 2023-03-28
MY191251A (en) 2022-06-10
CN109659253A (zh) 2019-04-19
DE102018217297B4 (de) 2024-12-05
JP7015668B2 (ja) 2022-02-03
KR20190040904A (ko) 2019-04-19
DE102018217297A1 (de) 2019-04-11
US20190109023A1 (en) 2019-04-11
SG10201808747SA (en) 2019-05-30

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