TWI798610B - Statistical data generating method, cutting device and system - Google Patents

Abstract

The problem to be solved by the present invention is to provide a method for generating statistical data, a cutting device and a system for realizing high-level production management in the subsequent steps. The solution of the present invention is a method for generating statistical data, including the following steps: collecting inspection data, the inspection data including the result information of inspection of package parts produced by cutting the package substrate; And, generating statistics based on the assembled inspection data.

Description

Statistical data generating method, cutting device and system

The invention relates to a method for generating statistical data, a cutting device and a system.

Japanese Patent Laid-Open No. 2008-4806 (Patent Document 1) discloses a wafer processing result management method. In the method, the cutting grooves formed during the processing of the wafer are photographed by means of photographing, and the data of the cutting grooves are generated based on the generated image information. The cutting groove data is additionally associated with image information and position information, and stored in the memory means in a cumulative manner. The memorized cutting groove data and image information are displayed on the display panel (refer to Patent Document 1).

[Prior Art Literature] (patent documents) Patent Document 1: Japanese Patent Laid-Open No. 2008-4806.

(Problem to be solved by the invention) As disclosed in the aforementioned Patent Document 1, a high degree of production control is performed in the wafer manufacturing process among the production steps of semiconductors. On the other hand, high-level production management is not performed in the subsequent steps of the production steps of semiconductors. However, due to factors such as miniaturization of package parts, even in the back-end steps, a high degree of production management is required compared to the prior art.

The present invention is made to solve such problems, and an object thereof is to provide a statistical data generating method, a cutting device, and a system for achieving a higher level of production management in the latter step than in the prior art.

(means used to solve a problem) A statistical data generating method according to one aspect of the present invention includes the step of: collecting inspection data including result information of inspection of package parts produced by cutting a package substrate and, generating statistical data based on the assembled inspection data.

Also, a cutting device according to another aspect of the present invention includes a cutting mechanism, an inspection mechanism, and a calculation unit. The cutting mechanism is configured to produce a plurality of package parts by cutting the package substrate. The inspection mechanism is configured to inspect each of the plurality of package parts. The calculation unit is configured to be able to perform calculations using inspection data, and the inspection data includes information on the results of inspections performed by inspection agencies. The calculation unit is configured to collect inspection data and generate statistical data based on the collected inspection data.

Also, a system according to another aspect of the present invention includes the above-mentioned cutting device and an external memory device of the cutting device. The memory device is configured to memorize examination data.

(effect of invention) According to the present invention, it is possible to provide a statistical data generating method, a cutting device, and a system for achieving a higher level of production management in a subsequent step than in the prior art.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or equivalent part in a figure, and this description is not repeated.

[1. System configuration] Fig. 1 is a diagram schematically showing a system 100 according to this embodiment. As shown in FIG. 1 , the system 100 includes a cutting device 1 and a memory device 30 .

The cutting device 1 is configured to be able to singulate the package substrate into a plurality of package parts by cutting the package substrate (object to be cut). In the package substrate, a substrate on which a semiconductor chip is mounted or a lead frame is sealed with resin.

Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Scale Package) package substrates, and LED (Light Emitting Diode) package substrates. Package substrate, QFN (Quad Flat No Leads) package substrate.

Furthermore, the cutting device 1 is configured to be able to inspect each of a plurality of package components that have been singulated. In the cutting device 1 , an image of each package component is captured, and inspection of each package component is performed based on the image. Inspection data is generated through this inspection, and each package part is classified as "good product" or "defective product".

The memory device 30 is configured to memorize inspection data generated through inspection in the cutting device 1 . In the memory device 30, test data are sequentially stored. In addition, the inspection data does not have to be stored in the memory device 30, and may be stored in a memory in the cutting device 1, for example.

In general, a high degree of production control is performed in the wafer manufacturing process among the production steps of semiconductors. On the other hand, advanced production management is not performed in the post-stage steps among the production steps of semiconductors. However, due to factors such as miniaturization of package parts, high production control is required even in the back-end steps.

The cutting device 1 according to this embodiment is configured to collect inspection data including inspection result information of package parts, and to generate statistical data based on the collected inspection data. By using the statistical data of the inspection data including the result information of the inspection of the package parts, for example, it is possible to facilitate early detection of problems occurring in later steps. That is, according to the cutting device 1 , it is possible to generate data (statistical data) that can be used for a higher level of production management in a subsequent step than in the prior art. Hereinafter, the cutting device 1 according to this embodiment will be described in detail.

[2. Configuration of cutting device] (2-1. The overall structure of the cutting device) Fig. 2 is a plan view schematically showing a cutting device 1 according to this embodiment. In this embodiment, the package substrate P1 is used as the object to be cut, and the package substrate P1 is singulated into a plurality of semiconductor packages S1 by the cutting device 1 . Hereinafter, among both surfaces of the package substrate P1, the surface sealed with resin is referred to as a molding surface, and the surface opposite to the molding surface is referred to as a solder ball/lead surface.

As shown in FIG. 2 , the cutting device 1 includes a cutting module A1 and an inspection and storage module B1 as components. The cutting module A1 is configured to produce a plurality of semiconductor packages S1 by cutting the package substrate P1. The inspection and storage module B1 is configured to inspect a plurality of produced semiconductor packages S1 and then store the semiconductor packages S1 in a tray. In the cutting device 1, each component is detachable and replaceable with respect to other components.

The cutting module A1 mainly includes: a substrate supply part 3 , a positioning part 4 , a cutting platform 5 , a rotating shaft part 6 and a conveying part 7 .

The substrate supply unit 3 pushes out the package substrates P1 one at a time from the substrate magazine M1 accommodating a plurality of package substrates P1 , thereby supplying the package substrates P1 to the positioning unit 4 one at a time. At this time, the package substrate P1 is arranged such that the solder balls/leads face upward.

The positioning part 4 arranges the package substrate P1 pushed out from the substrate supply part 3 on the rail part 4a, thereby positioning the package substrate P1. Then, the positioning unit 4 transports the positioned package substrate P1 to the cutting stage 5 .

The cutting table 5 holds the package substrate P1 to be cut. In the present embodiment, the cutting device 1 having a double cutting stage structure including two cutting stages 5 is exemplified. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5 a sucks the package substrate P1 conveyed by the positioning unit 4 from below, thereby holding the package substrate P1 . The rotation mechanism 5b can rotate the holding member 5a in the θ direction in the drawing. The moving mechanism 5c can move the holding member 5a along the Y-axis in the figure.

The shaft portion 6 separates the package substrate P1 into a plurality of semiconductor packages S1 by cutting the package substrate P1. In this embodiment, the cutting device 1 having a double-shaft configuration having two shaft parts 6 is exemplified. The rotating shaft part 6 can move along the X-axis and Z-axis in the figure. In addition, the cutting device 1 may also be configured as a single-shaft structure having one shaft portion 6 .

FIG. 3 is a side view schematically showing the shaft portion 6 . As shown in FIG. 3, the shaft portion 6 includes a blade 6a, a rotating shaft 6c, a first flange 6d, a second flange 6e, and a fastening member 6f.

The blade 6a cuts the package substrate P1 by rotating at a high speed, so as to singulate the package substrate P1 into a plurality of semiconductor packages S1. The blade 6a is attached to the rotating shaft 6c in a state sandwiched between one flange (first flange) 6d and the other flange (second flange) 6e. The first flange 6d and the second flange 6e are fixed to the rotation shaft 6c by fastening members 6f such as nuts. The first flange 6d is also referred to as an inner flange. The second flange 6e is arranged on the fastening member 6f side with the blade 6a interposed therebetween, and is also referred to as an outer flange.

The shaft portion 6 is provided with nozzles for cutting water, nozzles for cooling water, nozzles for washing water (none of which are shown in the figure), etc., and the nozzles for cutting water spray cutting water toward the blade 6a rotating at high speed. Cooling water is sprayed toward the cutting edge 6a, and the cleaning water is sprayed from nozzles to the cutting edge 6a for cleaning cutting chips and the like.

Referring to FIG. 2 again, after the cutting platform 5 absorbs the package substrate P1, the package substrate P1 is photographed by the first position confirmation camera 5d to confirm the position of the package substrate P1. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the package substrate P1. This mark indicates, for example, the cutting position of the package substrate P1.

Then, the cutting platform 5 is moved toward the rotating shaft portion 6 along the Y axis in the figure. After the cutting platform 5 moves below the rotating shaft part 6 , the package substrate P1 is cut by relatively moving the cutting platform 5 and the rotating shaft part 6 . Then, if necessary, the package substrate P1 is photographed by the second position confirmation camera 6 b to confirm the position of the package substrate P1 and the like. The confirmation using the second position confirmation camera 6 b is, for example, confirmation of the cutting position and cutting width of the package substrate P1 .

After the cutting of the package substrate P1 is completed, the cutting stage 5 moves away from the shaft portion 6 along the Y-axis in the figure while holding the plurality of semiconductor packages S1 that have been separated into pieces. During this movement, the upper surface (solder ball/lead surface) of the semiconductor package S1 is cleaned and dried by the first cleaner 5e.

The transfer unit 7 absorbs the semiconductor package S1 held on the cutting table 5 from above, and transfers the semiconductor package S1 to the inspection table 11 of the inspection and storage module B1. During this conveyance, the lower surface (molding surface) of the semiconductor package S1 is cleaned and dried by the second cleaner 7a.

The inspection and storage module B1 mainly includes: an inspection platform 11 , a first optical inspection camera 12 , a second optical inspection camera 13 , an arrangement unit 14 and an extraction unit 15 .

The inspection table 11 holds the semiconductor package S1 for optical inspection of the semiconductor package S1. The inspection platform 11 can move along the X axis in the figure. Also, the inspection platform 11 can be turned upside down. A holding member for holding the semiconductor package S1 by sucking the semiconductor package S1 is provided in the inspection platform 11 .

The first optical inspection camera 12 and the second optical inspection camera 13 take images of both surfaces (solder ball/lead surface and molding surface) of the semiconductor package S1. Various inspections of the semiconductor package S1 are performed based on image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 . Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged so as to photograph the upper side in the vicinity of the inspection platform 11 . Each of the first optical inspection camera 12 and the second optical inspection camera 13 is provided with an illumination device (not shown) capable of irradiating light during inspection. In addition, the first optical inspection camera 12 may also be installed in the cutting module A1.

The first optical inspection camera 12 images the molded surface of the semiconductor package S1 conveyed to the inspection table 11 by the conveyance unit 7 . Then, the transport unit 7 places the semiconductor package S1 on the holding member of the inspection platform 11 . After the holding member has absorbed the semiconductor package S1, the inspection platform 11 is turned upside down. The inspection platform 11 moves above the second optical inspection camera 13 , and the second optical inspection camera 13 takes pictures of the solder ball/lead surface of the semiconductor package S1 . As described above, various inspections of the semiconductor package S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 . The inspection items in this inspection will be described in detail later.

The inspected semiconductor package S1 is placed in the arrangement unit 14 . The placement unit 14 is movable along the Y axis in the figure. The inspection platform 11 arranges the inspected semiconductor package S1 on the placement unit 14 .

The extraction part 15 transfers the semiconductor package S1 arrange|positioned in the arrangement|positioning part 14 to a tray. The semiconductor package S1 is classified into "good product" or "defective product" based on inspection results using the first optical inspection camera 12 and the second optical inspection camera 13 . The extraction part 15 moves each semiconductor package S1 to the tray 15a for good products or the tray 15b for defective products based on the result of classification. That is, good products are accommodated in the tray 15a for good products, and defective products are accommodated in the tray 15b for defective products. Each of the tray 15a for good products and the tray 15b for defective products is replaced with a new tray once the semiconductor packages S1 are filled.

The cutting device 1 further includes a computer 50 . The computer 50 controls the operations of each part of the cutting module A1 and the inspection and storage module B1. According to the computer 50, for example, the operation of the following parts is controlled: the substrate supply unit 3, the positioning unit 4, the cutting platform 5, the rotating shaft unit 6, the conveying unit 7, the inspection platform 11, the first optical inspection camera 12, and the second optical inspection camera 13 , the arrangement part 14 and the extraction part 15 .

Moreover, the computer 50 performs various inspections of the semiconductor package S1 based on, for example, image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 . The computer 50 collects test data generated through various tests into the memory device 30 (FIG. 1), and generates statistical data based on the collected test data. Next, the computer 50 will be described in detail.

(2－2. Computer hardware configuration) FIG. 4 is a diagram schematically showing the hardware configuration of the computer 50 . As shown in FIG. 4 , the computer 50 includes a computing unit 70 , an input/output interface 90 , a communication interface 91 and a memory unit 80 , and each component is electrically connected via a bus bar.

The calculation unit 70 includes: a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, and the like. The calculation unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in accordance with information processing.

The input/output interface 90 is configured to be able to communicate with each component included in the cutting device 1 via a signal line. The input/output interface 90 is used for transmitting data from the computer 50 to each component in the cutting device 1 and receiving data transmitted from each component in the cutting device 1 to the computer 50 .

The communication interface 91 is configured to be able to communicate with an external device (for example, the memory device 30 in FIG. 1 ) provided outside the cutting device 1 via the Internet. The communication interface 91 is constituted by, for example, a wired LAN (Local Area Network) module or a wireless LAN module.

The memory unit 80 is, for example, an auxiliary memory device such as a hard disk drive or a solid state hard disk drive. The storage unit 80 is configured to store, for example, a control program 81 . The memory unit 80 may store inspection data generated by inspection using the first optical inspection camera 12 and the second optical inspection camera 13 .

(2-3. Software configuration related to inspection of packaged parts) FIG. 5 is a diagram showing the relationship between functions realized by the computer 50 . The calculation unit 70 expands the control program 81 stored in the storage unit 80 in the RAM 74 . And, the control program 81 that the calculation unit 70 has expanded in the RAM 74 is compiled and executed by the CPU 72, so that the computer 50 controls each component in the cutting device 1. As shown in FIG. 5 , the computer 50 operates as an image acquisition unit 52 , an inspection unit 54 , a statistical data generation unit 56 , and an image generation unit 58 .

The image acquisition unit 52 transmits an imaging instruction to the first optical inspection camera 12 and the second optical inspection camera 13 . The imaging instruction includes, for example, information specifying the imaging range on the package substrate P1. In addition, the video acquisition unit 52 sequentially changes the shooting range. Thereby, both sides of all the semiconductor packages S1 included in the package substrate P1 can be photographed. The image acquisition unit 52 acquires image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 through the input/output interface 90 .

The inspection unit 54 analyzes the image data acquired by the image acquisition unit 52 to perform various inspections of the respective semiconductor packages S1 included in the image data. Examples of inspection items include "Lead Pad Number", "Die Pad Defect", and "Mark Angle" in QFN.

Fig. 6 is a diagram for explaining the inspection of the number of terminals in the QFN. Referring to FIG. 6 , an image ID1 is an image included in an image captured by the second optical inspection camera 13 . That is, the image ID1 is an image showing the surface (solder ball/lead surface) opposite to the molding surface of the package component 60 . A die pad 61 is arranged at the center of the package component 60 , and a plurality of terminals (electrode pads) 62 are arranged around the package component 60 .

In the inspection of the number of terminals of the package component 60 , the inspection unit 54 detects the number of terminals (number of lead pads) on each side through video analysis. The inspection unit 54 judges whether or not the number of terminals on each side is a predetermined number. The inspection unit 54 determines that the package part 60 is a good product in terms of the "number of terminals" if the number of terminals on each side is a predetermined number, and judges that the package part 60 is a good product in terms of the "number of terminals" if the number of terminals in each side is not the predetermined number. It is said that the package part 60 is a defective product. The inspection unit 54 associates the detected number of terminals on each side and the judgment result of good/defective with the position information of the package component 60 on the package substrate, and stores it in the memory device 30 . That is, the inspection unit 54 can not only memorize the determination result of good/defective product according to the inspection item, but also store the measurement value of the measurement object (in this example, the "number of terminals") obtained through image analysis and the number of terminals in the package substrate. The position information of the package part 60 is associated and stored in the memory device 30 .

FIG. 7 is a diagram for explaining inspection of die pad defects in QFN. Referring to FIG. 7 , an image ID2 is an image included in an image captured by the second optical inspection camera 13 . That is, the image ID2 is an image showing the surface (solder ball/lead surface) opposite to the molding surface of the package component 60 .

In the inspection of the die pad defect of the package component 60 , the inspection unit 54 detects foreign matter on the die pad 61 through image analysis. In addition, the inspection unit 54 further determines whether the level of foreign matter existing on the die pad 61 is within a predetermined range. The inspection unit 54 judges that the package part 60 is a good product in terms of a die pad defect if the level of foreign matter present on the die pad 61 is within a predetermined range, and if the level of foreign matter present on the die pad 61 is not within a predetermined range , it is determined that the package component 60 is a defective product in terms of a die pad defect. The inspection unit 54 associates the good/defective product determination result with the position information of the package component 60 on the package substrate and stores it in the memory device 30 .

Fig. 8 is a diagram for explaining inspection of mark angles in QFN. Referring to FIG. 8 , an image ID3 is an image included in an image captured by the first optical inspection camera 12 . That is, the image ID3 is an image showing the molding surface of the package component 60 .

On the molding surface of the package component 60 , for example, a brand mark of the package component 60 and the like are printed. In the inspection of the mark angle of the package component 60 , the inspection unit 54 determines whether the degree of inclination of the mark Mk1 printed on the surface of the package component 60 is within a predetermined range through video analysis. The inspection unit 54 determines that the package part 60 is a good product in terms of the marking angle if the degree of inclination of the mark Mk1 is within a predetermined range, and judges that the package part 60 is good in terms of the marking angle if the degree of inclination of the mark Mk1 is outside the predetermined range. Part 60 is a defective product. The inspection unit 54 associates the good/defective product determination result with the position information of the package component 60 on the package substrate and stores it in the memory device 30 .

The inspection unit 54 can also perform inspections of various inspection items. An example of inspection items that can be inspected by the inspection unit 54 is shown in Table 1 below.

[Table 1] type Check item Measurement/judgment content BGA (solder ball/lead side) Package Size Measure the length of each side and determine whether the length of each side is within the specified range. Corner Angle Measure the angle of each corner and judge whether the angle of each corner is within the specified range. Ball Offset Measure the deviation of each solder ball from the specified position, and determine whether the deviation is within the specified range. Bad Mark Determine whether there is a bad mark. Ball Number (Extra Ball) Determine if the number of solder balls is more than specified. Ball Number (Missing Ball) Determine if the number of solder balls is less than specified. Extra & Missing Ball It is judged whether there are solder balls that do not exist at the predetermined positions and whether there are solder balls that are not at the predetermined positions. Ball Pitch Measure the length between solder balls and determine whether the length is within the specified range. Ball Position It is determined whether or not the position of the solder ball deviates from a predetermined position by a predetermined level or more. Ball Size Determine whether the size of the solder ball is within the specified range. Ball Shape It is determined whether or not the shape of the solder ball is a predetermined shape. Double Ball It is judged whether two adjacent solder balls are bonded together. QFN (solder ball/lead side) Package Size Measure the length of each side and determine whether the length of each side is within the specified range. Corner Angle Measure the angle of each corner and judge whether the angle of each corner is within the specified range. Lead Pad Offset Measure the deviation of the terminal (lead wire) from the specified position, and determine whether the deviation is within the specified range. Bad Mark Determine whether there is a bad mark. Lead Pad Number Determine whether the number of terminals is as specified. Lead Pad Size Determine whether the size of the terminal is within the specified range. Lead Pad Pitch Determine whether the length between terminals is within the specified range. Lead Pad Defect Determine whether there are foreign objects on the terminals. Die Pad Size It is judged whether the size of the die pad exposed to the outside is within a predetermined range. Die Pad Defect Determine whether there are foreign objects on the die pad. Die Pad Number Determine whether the number of die pads is as specified. Lead Pad Side Determine whether the state of the cut surface of the terminal is appropriate. Common (molding surface) Package Size Measure the length of each side and determine whether the length of each side is within the specified range. Corner Angle Measure the angle of each corner and judge whether the angle of each corner is within the specified range. Mark Offset Measures the amount of deviation of the mark (brand mark, etc.) from the specified position, and determines whether the amount of deviation is within the specified range. No Marking No markers were detected that should be present. Mark Angle Determine whether the degree of inclination of the mark on the package part is within the specified range. Broken Mark It is judged whether a part of characters constituting the mark is missing. Broken Charater It was detected that part of the text constituting the mark was not fully printed. Splash Charater It is judged whether part of the characters constituting the mark bleeds out within a predetermined range. Wrong Charater It was detected that part of the text constituting the mark changed to a different text. PKG Scratches Determine whether the level of damage on package parts is within the specified range. PKG Crack Determine if cracks in packaged parts are within specification. In Table 1, inspection items corresponding to BGAs indicate inspection items on the solder ball/lead surface of BGAs. In addition, the inspection items corresponding to QFN indicate the inspection items on the solder ball/lead surface of QFN. In addition, inspection items corresponding to common ones indicate inspection items on the molding surface of BGA and QFN.

Among the various inspection items included in Table 1, examples of inspections specific to packaged parts include "Lead Pad Offset", "Lead Pad Number", "Lead Pad Size", "Lead Pad Pitch", and "Lead Pad Defect" , "Die Pad Size", "Die Pad Defect", "Die Pad Number", "Lead Pad Side", "Mark Offset", "No Marking", "Mark Angle", "Broken Mark", "Broken Character", "Splash Character", "Wrong Character".

In "Lead Pad Offset", the inspection unit 54 measures the deviation amount of each terminal (lead wire) 62 from a predetermined position, and determines whether the deviation is within a predetermined range. In "Lead Pad Number", the inspection unit 54 determines whether the number of terminals 62 is as specified. In "Lead Pad Size", the inspection unit 54 judges whether or not the size of each terminal 62 is within a predetermined range. In "Lead Pad Pitch", the inspection unit 54 determines whether or not the length between the terminals 62 is within a predetermined range. In "Lead Pad Defect", the inspection unit 54 determines whether or not there is a foreign object on the terminal 62 . In "Die Pad Size", the inspection unit 54 judges whether or not the size of the die pad 61 exposed to the outside is within a predetermined range. In “Die Pad Defect”, the inspection unit 54 determines whether there is a foreign object on the die pad 61 . In "Die Pad Number", the inspection unit 54 determines whether the number of die pads 61 is as specified. In "Lead Pad Side", the inspection unit 54 determines whether the state of the cut surface of the terminal (the side surface of the package component 60 ) is appropriate. In "Mark Offset", the inspection unit 54 measures the amount of deviation of the mark Mk1 (brand mark, etc.) from a predetermined position, and determines whether the amount of deviation is within a predetermined range. In "No Marking", the inspection unit 54 detects that there is no mark Mk1 that should exist originally. In "Mark Angle", the inspection unit 54 judges whether or not the degree of inclination of the mark Mk1 on the package part is within a predetermined range. In "Broken Mark", the inspection unit 54 determines whether or not part of the characters constituting the mark Mk1 are missing. In "Broken Character", the inspection unit 54 detects that part of the characters constituting the mark Mk1 are not completely printed. In "Splash Character", the inspection unit 54 judges whether or not part of the characters constituting the mark Mk1 bleed out within a predetermined range. In "Wrong Character", the inspection unit 54 detects that some of the characters constituting the mark Mk1 are different characters.

Referring again to FIG. 5 , the test data including the result information of the test performed by the test unit 54 is stored in the memory device 30 . In the memory device 30, a plurality of test data are collected and managed on the database DB1.

Fig. 9 is a diagram showing an example of the database DB1. Referring to FIG. 9 , each row in database DB1 indicates inspection data of each package part 60 . Correspondence is added to the result information of each item of "lot", "number", "frame number", "position" and "inspection item" in each row.

For example, the package part 60 whose "number" is "2" is "2" on the X coordinate and "1" on the Y coordinate in the package substrate (frame) P1 whose "frame number" is "1". "s position. The frame including the package part 60 is included in the "lot" of "0000". A "lot" is a unit including a plurality of frames (package substrate P1). Regarding this package part 60, the result of the inspection item "0" is "1 (for example, defective product)", the result of the inspection item "1" is "0 (for example, good product)", and the result of the inspection item "2" is "5.005 (measured value)".

A user of the system 100 (FIG. 1 ) can obtain statistical data from the system 100 regarding the production status of the semiconductor package S1. The statistical data are generated based on the data stored in the database DB1. For example, the user can analyze problems related to the production of the semiconductor package S1 by referring to statistical data. The user specifies the range of data to be used to generate statistical data corresponding to the statistical data desired to be obtained. For example, the user designates a data range by inputting via an image 200 ( FIG. 10 ) described later. In system 100, statistical data is generated using data within specified ranges.

Referring again to FIG. 5 , the statistical data generation unit 56 acquires inspection data from the memory device 30 in accordance with the instruction from the user, and generates statistical data by collecting the obtained inspection data. The statistical data generating unit 56 generates, for example, statistical data in which each position in the package substrate P1 and the good/failure status of the semiconductor package S1 are associated with each other. In addition, the statistical data generating unit 56 generates, for example, data indicating the good/failure status of the semiconductor package S1 at each of the plurality of package substrates P1 included in the specific lot, indicating the status of the package substrate. Statistics of adverse incidence rate for each position of P1.

The image generating unit 58 generates image data that visualizes the statistical data generated by the statistical data generating unit 56 .

FIG. 10 is a diagram showing an example of an image 200 generated by the image generating unit 58 . As shown in FIG. 10 , the image 200 includes: a category selection unit 202 , an indication unit 214 , an area T1 and an area T2 . The user selects whether the type of the package substrate to be analyzed is BGA or QFN via the type selection unit 202 . In addition, the user performs an output instruction of statistical data by pressing the designation indicator 214 with a cursor (mouse pointer) or the like. Region T1 is a region for displaying an image that visualizes statistical data on a specific package substrate (frame). Area T2 is an area for displaying an image in which statistical data in a specific batch is visualized.

Area T1 includes: an input unit 204 , a selection unit 206 and result output units 208 , 218 , 212 . The user inputs the "frame number" of the package substrate (frame) P1 to be analyzed via the input unit 204 . In addition, the user selects an "inspection item" to be analyzed via the selection unit 206 .

The result output unit 208 outputs an overall rectangular video. The rectangular image includes a plurality of blocks. The rectangular image corresponds to the package substrate P1, and each of the plurality of blocks corresponds to the semiconductor package S1. In this example, the upper left block of the rectangular image represents coordinates (1,1). The X coordinates have "1" to "14" from the left to the right, and the Y coordinates have "1" to "48" from the top to the bottom. In this example, for example, according to the degree of defect of each package part 60, the color distinction corresponding to each block is performed. The user can visually recognize the occurrence of defects at each position in the package substrate by referring to the image output by the result output unit 208 .

The result output unit 210 outputs, for example, the total number of semiconductor packages S1 contained in the package substrate P1 to be analyzed, the number of good products, and the number of defective products. The result output unit 212 outputs, for example, the number of defective products and the occurrence rate of defective products.

Area T2 includes: result output units 220 , 224 , 226 and selection unit 222 . The user selects the "inspection item" to be analyzed via the selection unit 222 .

The result output unit 224 outputs an image showing the aggregation result of defective product occurrence positions among the plurality of package substrates P1 included in the lot. In this image, the meanings indicated by the X-coordinate and the Y-coordinate are the same as those of the image output by the result output unit 208 . The Z coordinate represents the total number of defective products that occurred in that position. By referring to the image output by the result output unit 224 , the user can visually recognize the occurrence of defects at each position in the package substrate.

The result output unit 220 outputs, for example, the total number of package substrates P1 , the total number of semiconductor packages S1 , the number of good products, and the number of defective products included in the analysis target lot. The result output unit 226 outputs, for example, the number of defective products and the occurrence rate of defective products.

Referring to FIG. 5 again, the image generated by the image generating unit 58 is displayed on the monitor 20 included in the cutting device 1 . The user can statistically grasp the production status of the semiconductor package S1 by referring to the image displayed on the monitor 20 .

[3. Action] (3-1. Accumulation operation of inspection results) FIG. 11 is a flowchart showing a method of storing the inspection results of the semiconductor package S1 in the memory device 30 . The processing shown in this flowchart is executed by the computer 50 every predetermined cycle.

Referring to FIG. 11 , the computer 50 instructs the first optical inspection camera 12 and the second optical inspection camera 13 to sequentially photograph a predetermined range of the package substrate P1 on the inspection platform 11 (step S100 ). The computer 50 sequentially acquires the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 (step S110 ). The computer 50 performs various inspections on each semiconductor package S1 by analyzing the acquired image data (step S120 ). The computer 50 updates the database DB1 by adding inspection data generated through the inspection (step S130).

By repeatedly performing steps S100-S130, the inspection data of each semiconductor package S1 is sequentially added to the database DB1.

(3-2. Output operation of statistical data) Fig. 12 is a flowchart showing a method of outputting statistical data. The processing shown in this flowchart is executed by the computer 50 every predetermined cycle.

Referring to FIG. 12, the computer 50 determines whether there is an output instruction of statistical data from the user (step S200). For example, the computer 50 determines whether or not the user has pressed the instruction part 214 (FIG. 10). If it is determined that there is no output instruction of statistical data ("No" in step S200), the process will shift to "Return".

On the other hand, if it is determined that there is an output instruction of statistical data ("Yes" in step S200), the computer 50 reads out the inspection data that matches the instruction content from the user from the memory device 30 (database DB1) (step S200). S210). The computer 50 generates statistical data by collecting the read-out inspection data (step S220). The computer 50 generates image data visually representing statistical data (step S230). The computer 50 controls the monitor 20 (FIG. 5) to display the generated image (step S240).

The user can statistically grasp the production status of the semiconductor package S1 by referring to the image displayed on the monitor 20 .

[4. Features] As described above, the cutting device 1 according to this embodiment is configured to collect inspection data including inspection result information of package parts, and to generate statistical data based on the collected inspection data. By using the statistics of the inspection data including the result information of the inspection of the package parts, for example, early detection of problems arising in later steps can be facilitated. That is, according to the cutting device 1 , it is possible to generate data (statistical data) to be used for higher production management in the latter step than in the prior art.

In addition, in the cutting device 1 , the inspection data includes positional information on the package substrate P1 of the semiconductor package S1 to be inspected. Therefore, according to the cutting device 1 , the result information of the inspection of the semiconductor package S1 and the position information of the semiconductor package S1 on the package substrate P1 can be associated and managed, so that more useful statistical data can be generated.

[5. Other implementation types] The idea of the above-mentioned embodiment is not limited to the above-described embodiment. Hereinafter, an example of other embodiments to which the idea of the above embodiments can be applied will be described.

(5－1) In the above-mentioned embodiment, the whole cutting device 1 is controlled by the computer 50 . However, the control of the cutting device 1 does not necessarily have to be performed by one computer. For example, the control of the cutting device 1 may also be performed by a plurality of computers. In this case, the control of the cutting device 1 by a plurality of computers is realized by communicating among the plurality of computers.

(5－2) In the above-mentioned embodiment, the image representing the generated statistical data is displayed on the monitor 20 . However, the statistics generated do not have to be displayed on the monitor 20 . For example, the statistics generated can also be transmitted to other devices.

(5-3) In the above embodiment, the cutting of the package substrate P1, the inspection of the semiconductor package S1, and the generation of statistical data based on the inspection data are performed in the same cutting device 1 . However, these operations do not have to be performed on the same device. For example, they may be executed by different devices respectively.

(5-4) In the above-mentioned embodiment, the position information of the semiconductor package S1 on the package substrate P1 is managed on the database DB1 by adding a corresponding relationship with the result information of each inspection item. However, the database DB1 does not necessarily include the location information of the semiconductor package S1 on the package substrate P1.

(5-5) In the above-mentioned embodiment, the cutting device 1 includes the first optical inspection camera 12 and the second optical inspection camera 13, and these cameras respectively photograph the molding surface and the solder ball/lead surface of the semiconductor package S1. However, the optical inspection cameras included in the cutting device 1 are not limited to the first optical inspection camera 12 and the second optical inspection camera 13 . For example, the cutting device 1 may further include an optical inspection camera for inspecting the cut surface of the terminal (the side surface of the package component 60 ). At this time, the optical inspection camera for inspection of the cut surface is installed, for example, between the placement unit 14 and the tray 15 a for good products.

The embodiments of the present invention have been exemplarily described above. That is, the detailed description and accompanying drawings are disclosed for illustrative purposes. Therefore, in the detailed description and the constituent elements described in the attached drawings, constituent elements that are not essential for solving the problem may be included. Therefore, even if such non-essential constituent elements are described in the detailed description and the accompanying drawings, it should not be immediately assumed that such non-essential constituent elements are essential.

In addition, the above-mentioned embodiment is only an illustration of the present invention from any point of view. Various improvements and changes can be made within the scope of the present invention to the above-mentioned embodiments. That is, when implementing the present invention, specific configurations can be appropriately adopted in accordance with the implementation mode.

1: cutting device 3: Substrate supply part 4: Positioning department 4a: track part 5: Cut off the platform 5a: Holding member 5b: Rotary mechanism 5c: Mobile Mechanism 5d: 1st position confirmation camera 5e: 1st cleaner 6: shaft part 6a: blade 6b: The second position confirmation camera 6c: axis of rotation 6d: 1st flange 6e: 2nd flange 6f: fastening member 7:Transportation department 7a: 2nd cleaner 11: Check the platform 12: The first optical inspection camera 13: The second optical inspection camera 14:Configuration Department 15: Extraction part 15a: Trays for good products 15b: Tray for defective products 20: Monitor 30: memory device 50: computer 52: Image Acquisition Department 54: Inspection Department 56: Department of Statistical Data Generation 58: Image Production Department 60:Package parts 61: Die Pad 62: terminal 70: Calculation Department 72:CPU 74: RAM 76:ROM 80: memory department 81: Control program 90: Input and output interface 91: Communication interface 100: system 200: Image 202: Category selection department 204: input part 206: Selection Department 208: Result output unit 210: Result output unit 212: Result output unit 214: Instruction Department 220: Result output unit 222: Selection Department 224:Result output unit 226: Result output unit A1: cut off module B1: Inspection and storage module DB1: database ID1: Image ID2: Image ID3: Image M1: substrate box Mk1: mark P1: Package substrate S1: Semiconductor package S100~S130: steps S200~S240: steps T1: area T2: area

Fig. 1 is a diagram schematically showing the system. Fig. 2 is a plan view schematically showing a cutting device. Fig. 3 is a side view schematically showing a shaft portion. Fig. 4 is a diagram schematically showing a hardware configuration of a computer. Fig. 5 is a diagram showing the relationship between functions realized by the computer. FIG. 6 is a diagram for explaining inspection of package dimensions in QFN. Fig. 7 is a diagram for explaining inspection of corner angles in QFN. Fig. 8 is a diagram for explaining inspection of defective marks in the QFN. Fig. 9 is a diagram showing an example of a database. Fig. 10 is a diagram showing an example of an image generated by the image generating unit. FIG. 11 is a flowchart showing a method of storing inspection results of semiconductor packages in a memory device. Fig. 12 is a flowchart showing a method of outputting statistical data.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

1: cutting device

30: memory device

100: system

Claims (6)

A statistical data generating method comprising the steps of: collecting inspection data including result information of inspection of package parts produced by cutting off a package substrate; based on the collected inspection and, displaying an image representing the aforementioned statistical data; the aforementioned inspection includes at least: an inspection of terminals of the aforementioned package parts, and an inspection of marks formed on the surface of the aforementioned package parts The aforementioned statistical data at least include: among the plurality of aforementioned package substrates, the position information of each of the aforementioned package parts constituting each of the aforementioned package substrates and information about the aforementioned inspection results; and, in the aforementioned images, the aforementioned package parts The position on the package substrate is associated with the result of the inspection of the package parts. The method for generating statistical data according to Claim 1, wherein the aforementioned statistical data includes quality data of the aforementioned plurality of package parts included in the batch. The statistical data generation method as described in Claim 1 or 2, further comprising the following steps: for a plurality of packages produced by cutting the aforementioned package substrate Each of the parts is inspected. The statistical data generation method as described in Claim 3, wherein the aforementioned inspection is related to the inspection of the die pads of the aforementioned package parts. A cutting device, comprising: a cutting mechanism configured to produce a plurality of package parts by cutting a package substrate; an inspection mechanism configured to inspect each of the plurality of package parts; A calculation unit configured to perform calculations using inspection data, and the inspection data includes information on the results of inspections conducted by the inspection agency; and, a display unit; wherein the calculation unit collects the inspection data , and generate statistical data based on the collected aforementioned inspection data; the aforementioned display unit displays an image representing the aforementioned statistical data, and in the aforementioned image, the position of the aforementioned package component in the aforementioned package substrate, and the aforementioned package Corresponding relationship is attached to the results of the inspection of the body parts; the aforementioned inspections include at least: the inspection of the terminals of the aforementioned package parts, and the inspection of the marks formed on the surface of the aforementioned package parts; the aforementioned statistics include: Among the plurality of package substrates, the position information and quality data of each package component that constitutes each package substrate. A system for cutting package substrates, comprising: the cutting device according to Claim 5; and a memory device which is external to the cutting device and configured to store the inspection data.

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