TWI798070B - Under-wafer spin cleaning equipment and method - Google Patents

Abstract

A wafer-mounted rotary cleaning device and method, including a cavity, a wafer frame and a cover, the cavity is provided with a rotatable ring lining and a swingable liquid spray swing arm, and the liquid spray swing arm is provided with at least one movable The nozzle that sprays solvent; the wafer frame is glued to the inner area of the ring by the adhesive film, and the wafer frame is set on the inner lining of the ring with the wafer facing down; the inside of the cover is equipped with adsorption Seat and pressure frame, the power device is set on the cover body, and the power device is responsible for driving the adsorption seat and the pressure frame to rotate synchronously. The wafer is adsorbed, and the wafer frame is rotated synchronously when the power unit drives the press frame. During the process, the liquid spray swing arm swings and the solvent is sprayed on the wafer surface by the nozzle to remove the adhesive layer on the wafer surface.

Description

Under-wafer spin cleaning equipment and method

The invention relates to the technical field of wafer surface cleaning, in particular to an equipment and method for rotating a wafer to be placed under it.

When the wafer is being ground or processed, a wafer is bonded to the inner ring area of the wafer frame through an adhesive film. During the cleaning operation, the wafer is turned up and driven to rotate. During the process, the solvent or deionized water is sprayed downward by the liquid spray cantilever above to achieve the purpose of cleaning. However, with the change of semiconductor manufacturing process, some special processes will leave a layer of adhesive layer on the surface of the wafer. The adhesive layer must be removed with a special solvent. For example, the solvent is cyclopentanone, but this solvent also has the same effect on the viscosity of the adhesive film. Therefore, if the current cleaning method with the wafer facing up is adopted, the solvent will soak and submerge the wafer and the adhesive film during the cleaning process. When the adhesive layer on the surface of the wafer is removed, the wafer will also be detached from the adhesive film at the bottom simultaneously. , so that the follow-up process cannot be carried out, and the present invention is a solution for this reason.

The main purpose of the present invention is to provide a wafer bottom-mounted rotary cleaning equipment and method, mainly set the wafer facing down, and spray the solvent from bottom to top, remove the glue layer on the exposed surface of the wafer during the rotation process, and do not Affect the bonding effect on the back of the wafer, so as to meet the special needs of the actual manufacturing process.

To achieve the above object, the present invention adopts the following technical solutions: The present invention is a wafer-mounted rotary cleaning device, comprising: a cavity, a wafer frame and a cover, the cavity is provided with a rotatable ring lining and a swingable liquid spray swing arm, and the liquid spray swing arm is provided with at least A spray head that can spray solvent; the wafer frame is glued to a wafer in the inner area of the ring by an adhesive film, and the wafer frame can be set on the inner lining of the ring with the wafer facing down; the inside of the cover is leaned from the center to the outside The sequence is equipped with an adsorption seat and a pressure frame, and a power device is installed on the cover body. The power device is responsible for driving the adsorption seat and the pressure frame to rotate synchronously. When the operation cover is lowered and matched with the cavity, the pressure frame presses the wafer frame and The wafer is adsorbed by the suction seat, and the power unit drives the press frame and makes the wafer frame rotate synchronously. During the process, the liquid spray swing arm swings and the solvent is sprayed on the wafer surface by the nozzle to remove the glue layer on the wafer surface.

The present invention relates to a wafer-mounted rotary cleaning method. The wafer is fixed on the ring inner area of the wafer frame by an adhesive film. The steps of the method are as follows: the wafer faces downward, and the wafer frame is set on the rotatable ring lining. above; the pressure frame is operated to press the wafer frame and the wafer is adsorbed by the suction seat; and, the pressure frame is driven to make the wafer frame rotate synchronously, the liquid spray swing arm is operated to swing, and the nozzle of the liquid spray swing arm is directed against the surface of the wafer Spray the solvent to remove the adhesive layer on the wafer surface.

As one of the preferred embodiments, the ring lining has an inner circular wall, and the inner diameter of the inner circular wall is larger than the outer diameter of the wafer. In this way, when the wafer frame is placed on the inner lining of the ring, the wafer is located in the inner ring wall and only a small amount of downward adhesive film is exposed, which can prevent the solvent from contacting the adhesive film when spraying liquid.

As one of the preferred embodiments, the ring lining forms an upper cone surface on the top surface where the inner circular walls meet, and the upper cone surface is centered and inclined downward. In this way, when the suction seat absorbs the wafer through the adhesive film and the position of the wafer protrudes from the surface of the wafer frame, the adhesive film is in a tight state to avoid shaking during rotation.

As one of the preferred implementations, the ring lining forms a lower conical surface at the bottom of the junction of the inner circular walls, and there is a conical groove seat in the cavity, and there is a water outlet in the center of the bottom of the groove seat, so that the cleaning process can be recovered sprayed solvent.

As one of the preferred embodiments, the ring lining has at least one positioning recess, and a transmission frame is also provided in the cover and is located on the periphery of the pressure frame. The transmission frame has at least one positioning protrusion facing downward, and the transmission The frame is also driven by the power device. When the cover body descends and engages with the cavity, the transmission frame exerts pressure on the ring lining, and the positioning convex part is located in the positioning concave part. When the power device is driven, the transmission frame drives the ring lining to synchronize turn.

As one of the preferred embodiments, the adsorption seat is a porous ceramic suction cup seat, and the power device is a motor.

As one of the preferred embodiments, the liquid spray swing arm is provided with two spray heads, which are respectively the first spray head and the second spray head, the first spray head provides low-pressure solvent, and the second spray head provides high-pressure solvent. In this way, in the operation, the first nozzle sprays low-pressure solvent on the wafer to soften or gradually dissolve the adhesive layer on the wafer surface, then the first nozzle is closed, and the second nozzle sprays high-pressure solvent to make the adhesive Layers are peeled off from the wafer surface.

Compared with the prior art, the present invention has the following specific effects: 1. In the present invention, the wafer is set downwards, and the solvent is sprayed from bottom to top, so the solvent will only be distributed on the corresponding wafer surface and will not overflow. Flow to other areas to achieve the purpose of avoiding the contact between the solvent and the adhesive film of the present invention; 2. Because the wafer of the present invention is arranged downward, the adhesive layer on the surface of the wafer can be peeled off reliably and efficiently by using gravity during the liquid spraying process, achieving The purpose of removing the adhesive layer on the wafer surface.

10: Cavity

101: Bearing

102: Butt wall

11: ring lining

111: inner circular wall

112: Upper cone

113: lower cone surface

114: positioning recess

12: Liquid spray swing arm

121: The first nozzle

122: Second nozzle

13: slot seat

131: water outlet

20: Wafer frame

30: cover body

31: power unit

32: Adsorption seat

33: Press frame

34: Transmission frame

341: positioning convex part

40: Wafer

3001: step

3002: step

3003: step

FIG. 1 is an exploded schematic view of the wafer-mounted rotary cleaning device of the present invention.

FIG. 2 is a schematic cross-sectional view of the under-wafer rotary cleaning device of the present invention.

FIG. 3 is a schematic diagram of the steps of the under-wafer spin cleaning method of the present invention.

FIG. 4 is a schematic diagram of a wafer frame disposed on an inner ring lining in the under-wafer spin cleaning method of the present invention.

FIG. 5 is a schematic diagram of a wafer frame disposed in a cover and a cavity in the under-wafer spin cleaning method of the present invention.

FIG. 6 is a schematic diagram of the cleaning state in the under-wafer spin cleaning method of the present invention.

The technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments and accompanying drawings. It should be noted that when an element is referred to as being "mounted or fixed on" another element, it means that it may be directly on another element or there may be an intervening element. When an element is said to be "connected" to another element, it means that it may be directly connected to the other element or intervening elements may also be present. In the illustrated embodiment, the directions meaning up, down, left, right, front and rear, etc. are relative to explain that the structure and movement of the different components are relative in this case. These representations are pertinent when the components are in the positions shown in the figures. However, if the description of the location of elements changes, these representations are considered to change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in FIG. 1 , it is an exploded view of the under-wafer spin cleaning equipment of the present invention. The under-wafer rotary cleaning equipment of the present invention includes a cavity 10 and a cover 30, in which the wafer frame 20 holding the wafer 40 is placed, and the adhesive layer on the exposed surface of the wafer 40 facing downward is cleaned. The cavity 10 is provided with a rotatable ring lining 11 and a swingable liquid spray swing arm 12. The liquid spray swing arm 12 is provided with at least one spray head capable of spraying solvent. This embodiment has two spray heads, respectively the first spray head 121 and the second nozzle 122. The wafer frame 20 adheres a wafer 40 to the inner area of the ring by the adhesive film 21. The wafer frame 20 is set on the ring lining 11 during operation and allows the wafer to 40 face down. A power device 31 is arranged on the cover body 30, and an adsorption seat 32 and a pressure frame 33 are sequentially arranged in the cover body 30 from the center to the outside. The power device 31 is responsible for driving the adsorption seat 32 and the pressure frame 33 to rotate synchronously; When connecting with the cavity 10, the pressure frame 33 exerts pressure on the wafer frame 20, and the suction seat 32 adsorbs the wafer 40. When the power device 31 drives the pressure frame 33, the wafer frame 20 rotates synchronously. During the process, the liquid spray pendulum The arm 12 swings and sprays the solvent on the surface of the wafer 40 from the first spray head 121 or the second spray head 122 to remove the adhesive layer on the surface of the wafer 40 .

Next, the structure of each component will be described in detail: the wafer frame 20 is a standard specification for carrying wafers, and is generally also called an iron frame, iron ring or wafer ring. The wafer frame 20 is pasted with an adhesive film 21 on the upper surface, and the wafer 40 is adhered to the inner area of the wafer frame 20 by the adhesive film 21. In this embodiment, the adhesive layer attached to the exposed surface of the wafer 40 is removed. .

The chamber 10 is responsible for supplying and recovering the cleaning solvent and carrying the wafer frame 20 . Please also refer to FIG. 2 , the cavity 10 has a tapered tank seat 13 in the center, and a water outlet 131 is provided in the center of the tank base 13 to recover deionized water for dissolving or cleaning. The liquid spray swing arm 12 protrudes above the tank seat 13. The liquid spray swing arm 12 is provided with two spray heads, which are respectively the first spray head 121 and the second spray head 122. In this embodiment, the first spray head 121 and the second spray head The water output of 122 is not the same and the opening timing is also different. The first nozzle 121 provides a low-pressure solvent, and the second nozzle 122 provides a high-pressure solvent. The low-pressure solvent is used to wet the surface of the wafer 40 or dissolve the adhesive layer during cleaning. When the high-pressure solvent is sprayed out, the adhesive layer can be peeled off smoothly. In addition, the bottom of the cavity 10 is provided with a transmission device and a solvent supply device connected to the liquid spray swing arm 12 to smoothly control the swing and liquid spray of the liquid spray swing arm 12. This part of the structure is the same as the prior art, so it is not included in the figure. Not drawn.

The cavity 10 is provided with a rotatable ring liner 11 , and in this embodiment the ring liner 11 is mounted on the cavity 10 via a bearing 101 . The inner edge of the ring lining 11 forms an inner circular wall 111 , and the inner diameter of the inner circular wall 111 is close to but larger than the outer diameter of the wafer 40 . The main purpose of the inner circular wall 111 is to reduce solvent splashing to the exposed adhesive film 21 between the wafer 40 and the wafer frame 20 . The ring lining 11 further forms an upper conical surface 112 and a lower conical curved surface 113 at the inner circular wall 111 . The upper tapered surface 112 is inclined toward the center and downward. The lower conical surface 113 has a pore diameter gradually increasing from top to bottom, and the lower conical surface 113 facilitates the solvent or deionized flow into the tank seat 13 to be collected. ring liner 11 top surface At least one positioning recess 114 is also formed. In this embodiment, there are two positioning recesses 114 . The positioning recesses 114 are used for the cover body 30 to drive the ring liner 11 to rotate. In addition, the top of the cavity 10 has an abutment wall 102 with a smaller outer diameter, and the abutment wall 102 is for the cover body 30 to be abutted against.

The cover body 30 is provided with a power device 31 on the top, and the power device 31 is responsible for driving the internal components of the cover body 30 to rotate. In this embodiment, the cover body 30 is provided with an adsorption seat 32 , a pressure frame 33 and a transmission frame 34 sequentially from the center to the outside, and the aforementioned three components are all driven by the power device 31 . The adsorption seat 32 is a porous ceramic suction cup seat, which is a commonly used adsorption device in the semiconductor industry, so the figure only schematically shows and does not draw detailed air holes, air channels and gas supply equipment. However, it should be noted that the position of the adsorption contact surface (bottom surface) of the suction seat 32 is protruding from the bottom surface of the pressure frame 33. This purpose makes the position of the wafer 40 protrude when the suction seat 32 adsorbs the wafer 40 through the adhesive film 21. On the lower surface of the wafer frame 20 , the tapered surface of the above-mentioned upper tapered surface 112 is also to meet this requirement, so that the adhesive film 21 can be tightened under the adsorption state, and the wafer 40 can also be prevented from shaking during rotation. The pressure frame 33 is annular in shape and has a diameter close to that of the wafer frame 20 . The purpose of the pressure frame 33 is to press the wafer frame 20 on the ring lining 11 . The transmission frame 34 is mainly used to drive the ring liner 11 to rotate, and has at least one positioning protrusion 341 protruding downward. When the operating cover body 30 is lowered, the transmission frame 34 also exerts pressure on the ring liner 11 to allow the positioning protrusion to The part 341 is located in the positioning recess 114. When the power device 31 is driven, the transmission frame 34 drives the ring liner 11 to rotate synchronously, which also ensures that the wafer frame 20 and the wafer 40 rotate synchronously.

In this embodiment, although the pressure frame 33 and the transmission frame 34 are two rings, they are not limited thereto, and can also be integrated into a single component, so as to exert pressure on the wafer frame 20 and drive the inner ring 11 to rotate synchronously.

Next, an explanation is made on the method of the wafer-mounted rotary cleaning method of the present invention. FIG. 3 is a flow chart of the method of the present invention, and FIGS.

Step 3001 : the wafer 40 faces down, and the wafer frame 20 is placed on the rotating ring liner 11 . As shown in FIG. 4 , the wafer frame 20 is disposed on the ring lining 11 of the cavity 10 . In addition, the inner circular wall 111 is located outside the wafer 40 Around, use the ring liner 11 to cover most of the exposed adhesive film 21 to prevent the solvent from spraying to the adhesive film 21 during the subsequent liquid spraying process.

Step 3002 : Operate the pressure frame 33 to apply pressure to the wafer frame 20 and absorb the wafer 40 by the suction seat 32 . As shown in FIG. 5 , the operating cover 30 descends to join with the cavity 10 , the pressure frame 33 exerts pressure on the wafer frame 20 , and when the suction seat 32 absorbs the wafer 40 through the adhesive film 21 , the position of the wafer 40 is lowered synchronously. Make the adhesive film 21 in a taut state. In addition, the positioning convex portion 341 of the transmission frame 34 is also located in the positioning concave portion 14 of the ring lining 11 .

Step 3003: Drive the pressure frame 33 so that the wafer frame 20 rotates synchronously, operate the liquid spray swing arm 12 to swing, and spray the solvent on the surface of the wafer 40 from the spray head (such as the first spray head 121 or the second spray head 122) of the liquid spray swing arm 12 , removing the adhesive layer on the surface of the wafer 40 . As shown in Figure 6, driven by the power unit 31, the adsorption seat 32, the pressure frame 33 and the transmission frame 33 rotate synchronously, so that the wafer frame 20 rotates synchronously, and the liquid spraying swing arm 12 located below also swings synchronously during the rotation process. , the first spray head 121 or the second spray head 122 sprays liquid on the surface of the wafer 40, and then removes the adhesive layer on the surface of the wafer 40. In the process, it can also prevent the solvent from spraying onto the adhesive film 21, affecting the adhesive film 21 and the wafer 40. stickiness between them.

In the above-mentioned step 3003, the operation method of the first spray head 121 and the second spray head 122 may also include: first spraying the low-pressure solvent on the surface of the wafer 40 from the first spray head 121, thereby softening or gradually softening the adhesive layer on the surface of the wafer 40. Dissolving, the number of times can be multiple times, and this embodiment can be carried out three times. After that, the first nozzle 121 is closed, and the second nozzle 122 is used to spray the high-pressure solvent, and the high-pressure liquid column is used to make the adhesive layer peel off from the surface of the wafer 40. The adhesive layer on the surface of the wafer 40 is effectively removed.

To sum up the above, the present invention adopts the wafer 40 downward method, and the gravity can be used in the process of spraying the liquid to make the adhesive layer peel off more efficiently and reliably. In addition, the spray liquid is sprayed from bottom to top, and the position will only be in the position. The surface of the corresponding wafer 40 will not overflow to other areas, so as to achieve the purpose of preventing the contact between the solvent and the adhesive film 21 of the present invention, and meet the special requirements of a specific semiconductor manufacturing process.

The above are only preferred embodiments of the present invention, and are not intended to limit the scope of the embodiments of the present invention. That is, all equivalent changes and modifications made according to the patent scope of the present invention are covered by the patent scope of the present invention.

10: Cavity

102: Butt wall

11: ring lining

111: inner circular wall

112: Upper cone

114: positioning recess

12: Liquid spray swing arm

121: The first nozzle

122: Second nozzle

13: slot seat

20: Wafer frame

21: film

30: cover body

31: power unit

32: Adsorption seat

33: Press frame

34: Transmission frame

341: positioning convex part

40: Wafer

Claims (10)

An under-wafer rotary cleaning device, comprising: a cavity, provided with a rotatable ring lining and a swingable liquid spray swing arm, the liquid spray swing arm is provided with at least one nozzle capable of spraying solvent, the ring liner It has an inner circular wall, the ring lining forms a lower conical surface at the bottom surface where the inner circular wall meets; a wafer frame, a wafer is bonded to the inner area of the ring by an adhesive film, and the wafer frame can be placed on The ring is lined with the wafer facing down; a cover body is provided with an adsorption seat and a pressure frame in sequence from the center to the outside inside the cover body, and a power device is arranged on the cover body, and the power device is responsible for driving the The suction seat and the pressure frame rotate synchronously. When the cover is operated to descend and engage with the cavity, the pressure frame presses the wafer frame and the suction seat absorbs the wafer. The power device drives the pressure frame During this process, the wafer frame is rotated synchronously, during which the liquid spray swing arm swings and the spray head sprays solvent on the wafer surface to remove the adhesive layer on the wafer surface. The wafer under-mounted rotary cleaning device as described in Claim 1, the inner diameter of the inner circular wall is larger than the outer diameter of the wafer, the wafer frame is placed on the ring lining, and the wafer is located in the inner ring wall And only a small number of the adhesive films facing downwards are exposed. The under-wafer rotary cleaning device according to claim 1, wherein the ring lining forms an upper cone surface at the junction of the inner circular wall, and the upper cone surface is centered and inclined downward. In the under-wafer rotary cleaning device as described in claim 1, there is a tapered tank seat in the cavity, and a water outlet is provided at the center of the bottom of the tank seat. The under-wafer rotary cleaning equipment as described in Claim 1, wherein the ring lining has at least one positioning recess, and a transmission frame is also provided in the cover and is located on the periphery of the pressure frame. The transmission frame has at least one downward facing A positioning protrusion, the transmission frame is also driven by the power device, when the cover body descends and the When the cavities are engaged, the transmission frame exerts pressure on the ring lining, and the positioning convex part is located in the positioning concave part, and the transmission frame drives the ring lining to rotate synchronously when the power device is driven. In the under-wafer rotary cleaning device described in claim 1, the suction seat is a porous ceramic suction cup seat, and the power device is a motor. For the under-wafer rotary cleaning equipment described in claim 1, the liquid spray swing arm is provided with two nozzles, namely the first nozzle and the second nozzle, the first nozzle provides low pressure solvent, and the second nozzle provides high pressure solvent. A wafer-down spin cleaning method, the wafer is fixed on the ring area of the wafer frame by an adhesive film, the steps of this method are: the wafer faces downward, and the wafer frame is set on the rotatable ring lining , the suction seat absorbs the wafer through the adhesive film, and makes the wafer position protrude from the surface of the wafer frame, so that the adhesive film is in a tight state; the operating pressure frame presses the wafer frame and is absorbed by the wafer frame The seat absorbs the wafer; and drives the pressure frame so that the wafer frame rotates synchronously, operates the liquid spray swing arm to swing, and sprays solvent on the wafer surface from the nozzle of the liquid spray swing arm to remove the glue on the wafer surface layer. The wafer under-mounted spin cleaning method as described in Claim 8, wherein the ring lining has an inner ring wall, the inner diameter of the inner ring wall is larger than the outer diameter of the wafer, and the wafer frame is placed on the ring lining Above, the wafer is located in the inner ring wall and only a small amount of the adhesive film facing downward is exposed. The wafer under-mounted rotary cleaning method as described in Claim 8, wherein the liquid spray swing arm is provided with two spray heads, which are respectively the first spray head and the second spray head, and the low-pressure solvent is first sprayed from the first spray head during operation On the wafer, soften or dissolve the adhesive layer on the surface of the wafer, then close the first shower head, spray a high-pressure solvent from the second shower head, and use the ejected high-pressure solvent to peel off the adhesive layer on the wafer surface.

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