TWI797900B - Coating processing apparatus, coating processing method, and optical film forming apparatus - Google Patents

Abstract

[Problem] Appropriately apply a coating solution containing optical materials to a substrate at an arbitrary angle. [Solution] The coating processing device (10) has: a substrate moving part (12, 13) that holds the substrate and moves it in a horizontal direction, extends in a direction perpendicular to the moving direction of the substrate moving part, and The substrate of the substrate moving part is an elongated coating nozzle (14) that discharges the coating liquid from the substrate, and a coating nozzle moving part (16) that moves the coating nozzle (14) in the extending direction of the coating nozzle (14), A control unit (18) controls a coating direction of a substrate held by the substrate moving unit by controlling the moving speeds of the substrate moving unit and the coating nozzle moving unit.

Description

Coating processing apparatus, coating processing method, and optical film forming apparatus

The present invention relates to a coating processing device for coating a coating liquid containing an optical material on a substrate, a coating processing method using the coating processing device, and an optical film forming device using the coating processing device.

For example, in organic light emitting diodes (OLED: Organic Light Emitting Diode), circular polarizers are used to prevent reflection of external light. The circular polarizer is produced by laminating a linear polarizer and a wavelength plate (retardation plate) so that their polarization axes cross at 45 degrees. Also, in a liquid crystal display (LCD: Liquid Crystal Display), in order to control the optical rotation and birefringence of display, etc., such a linear polarizing plate and a wave plate are used.

Also, for example, only the wavelength plate may be formed such that its polarization axis is inclined at 15 degrees or 75 degrees. Therefore, it is necessary to form the polarizing plate and the wave plate at arbitrary angles. Furthermore, in order to make the polarization axes of the polarizing plate and the wave plate intersect at an arbitrary angle, it is necessary to separately form the polarizing plate and the wave plate.

Conventionally, such polarizing plates and wavelength plates have been produced using, for example, stretched films. A stretched film is one that aligns the molecules in the material in one direction by stretching and attaching the film in one direction.

In addition, in recent years, along with thinning of OLEDs, LCDs, and the like, thinning of polarizing plates and wavelength plates has also been demanded. However, when a stretched film is used in the production of a polarizing plate and a wavelength plate as in the past, there is a limit to reducing the film thickness of the stretched film itself, and a sufficient film cannot be obtained.

Therefore, by coating a coating liquid having a predetermined material on a substrate, a polarizing plate and a wavelength plate having a necessary film thickness are formed to achieve thinning. Specifically, for example, a coating liquid having liquid crystallinity as a predetermined material is applied to a substrate, and cast and aligned. The liquid crystal compound forms supramolecular aggregates in the coating liquid, and when the coating liquid is flowed while applying shear stress, the major axis direction of the supramolecular aggregates is aligned in the flow direction.

In order to be able to apply a coating liquid to a substrate in this way, various apparatuses have been proposed conventionally.

For example, the polarizing film printing apparatus described in Patent Document 1 includes a stage for holding a substrate, and a slit die for discharging ink onto the substrate. The platform is configured by inserting the fixed plate in the frame plate which hollows out a part of the fixed plate, so that the height of the periphery of the fixed plate is equal to the height of the surface of the substrate fixed to the fixed plate. The slot die extends so as to cover at least the platen. Next, fix the substrate with the platen arranged in the printing direction, rotate the platen, tilt the substrate at a predetermined angle with respect to the printing direction, move the slit die in the printing direction, and apply ink to the substrate .

Also, for example, in the coating device described in Patent Document 2, a coating liquid is supplied to a coating head provided with a strip-shaped slit that opens upward and extends in the horizontal direction, and the coating liquid is discharged from the slit to form Beads make the substrate to be coated with a rectangular planar shape move relatively upwards from the top of the coating head almost along one of its diagonal directions, from the gap formed between the coating head and the substrate to be coated. The beads allow the coating liquid to adhere to the coating surface of the substrate to be coated. [Prior Art Literature] [Patent Document]

[Patent Document 1] JP-A-2005-62502 [Patent Document 2] JP-A-10-5677

[Problem to be solved by the invention]

However, when using the polarizing film printing device described in Patent Document 1, since the slit mold extends at least to cover the platen, when ink is applied to the substrate, the ink liquid is ejected to the substrate fixed to the platen. , It will also spit out ink liquid and adhere to the frame plate around the fixed plate. Therefore, it is necessary to wash the frame plate with a single leaf every coating process on the substrate, which takes labor and time.

In addition, in the polarizing film printing apparatus of Patent Document 1, although the platen fixing the substrate is rotated, the rotation of the platen is to receive the substrate at a predetermined position (position parallel to the printing direction), not to to control the coating direction. In other words, the coating direction of the ink liquid on the substrate is fixed, and the coating direction cannot be freely controlled.

In addition, when using the coating device described in Patent Document 2, the coating liquid is coated on the substrate using surface tension. In a related case, it is necessary to adjust the coating conditions such as the discharge pressure of the coating liquid from the coating head according to the area where the coating liquid adheres to the substrate, that is, according to the angle at which the coating liquid is applied, and this control will become complicated.

Here, the shear stress (shear rate) during coating is a value obtained by dividing the coating speed by the distance (gap) between the substrate and the coating head. However, in the coating device of Patent Document 2, since surface tension is utilized, there is a limit to increasing the coating speed of the coating liquid on the substrate. Therefore, there is a possibility that sufficient shear stress cannot be obtained.

The present invention was made in view of the related points, and an object thereof is to properly apply a coating liquid containing an optical material to a substrate at an arbitrary angle. [means to solve the problem]

In order to achieve the aforementioned object, the present invention is a coating processing device, which is a coating processing device for coating a coating liquid containing an optical material on a substrate, and has: a substrate moving part that holds the substrate to move in a horizontal direction; Extending in a direction perpendicular to the moving direction of the substrate moving part, the elongated coating nozzle that discharges the coating liquid to the substrate held in the substrate moving part; A coating nozzle moving part for nozzle movement; a control part for controlling a coating direction of the substrate held by the substrate moving part by controlling the moving speeds of the substrate moving part and the coating nozzle moving part.

The present invention from another viewpoint is a coating treatment method, which is a coating treatment method for coating a coating liquid containing an optical material on a substrate, comprising: arranging a coating nozzle extending in a strip shape at one end of the substrate The first process; the second process of discharging the coating liquid from the coating nozzle; moving the coating nozzle that discharges the coating liquid in the extending direction of the coating nozzle, and simultaneously moving the substrate in the extending direction The third step is to move in the vertical direction and apply coating to the substrate.

In addition, the present invention from another viewpoint is an optical film forming apparatus for forming an optical film on a substrate, comprising: the aforementioned coating processing apparatus; A drying processing device for drying an optical film; a film fixing device for coating a fixing material of the aforementioned optical film on a predetermined area of the aforementioned optical film; device. [Effect of the invention]

According to the present invention, it is possible to appropriately and efficiently apply a coating liquid containing an optical material to a substrate at an arbitrary angle. Also, according to the present invention, an optical film can be suitably formed on a substrate.

Embodiments of the present invention will be described below.

First, the structure of the optical film forming apparatus concerning this embodiment is demonstrated. In this embodiment, when producing a circular polarizing plate for an OLED, as an optical film, a linear polarizing film (linear polarizing plate) and a λ/4 wavelength film (λ/4 wavelength plate) are formed on a rectangular glass substrate (later , expressed as the substrate G) as an example of the situation. In addition, on the substrate before forming the linear polarizing film and the λ/4 wavelength film, for example, a plurality of organic films (not shown) are laminated and formed.

As shown in FIG. 1 , the optical film forming apparatus 1 includes a coating processing apparatus 10 , a reduced pressure drying apparatus 100 , a heat processing apparatus 300 , a film fixing apparatus 400 , and a film removing apparatus 500 . In addition, the optical film forming apparatus 1 has a substrate conveying unit (not shown) for conveying the substrate, and can use the coating processing device 10, the reduced-pressure drying device 100, the heat processing device 300, the film fixing device 400, and the film removing device The order of 500 substrates is transported.

Moreover, the optical film forming apparatus 1 has the control part 18, and the control of the operation|movement of the optical film forming apparatus 1 is performed by the control part 18. The control unit 18 controls, for example, the operations of the coating treatment device 10 , the reduced-pressure drying device 100 , the heat treatment device 300 , the film fixing device 400 , the film removal device 500 , and a substrate transfer unit not shown.

＜Coating processing equipment＞ Next, the configuration of the coating processing device 10 will be described. In the coating processing apparatus 10, the coating process of the coating liquid is performed on the upper surface of the board|substrate G. As shown in FIG. FIG. 2 is a cross-sectional view schematically showing the configuration of the coating processing device 10 . FIG. 3 is a vertical cross-sectional view schematically showing the configuration of the coating processing device 10 .

The coating processing device 10 has a processing container 11 . On the side surface of the processing container 11, an inlet and outlet for the substrate G not shown in the figure are formed.

Inside the processing container 11, a stage 12 that is a holding portion for holding the substrate G is provided. The stage 12 holds the surface of the substrate G on which the coating liquid is applied facing upward. Moreover, the stage 12 has a shape smaller than the board|substrate G in planar view (XY plane).

The coating processing apparatus 10 has a stage driving part 13 for moving the stage 12 in the X-axis direction, and the stage driving part 13 is configured so that the stage 12 can reciprocate in the X-axis direction. The stage 12 moves between an end on the X-axis negative direction side (one end, substrate position A1 ) and an end on the X-axis positive direction side (the other end, substrate position A2 ). Furthermore, the stage 12 is configured to be able to move a distance longer than the length of the two substrates G, and the substrate G at the substrate position A1 and the substrate G at the substrate position A2 do not overlap in plan view. In addition, the stage 12 and the stage drive part 13 correspond to the board|substrate moving part which hold|maintains the board|substrate G and moves it horizontally and linearly.

Above the stage 12, a coating nozzle 14 for applying a coating liquid to the substrate G held on the stage 12 is provided. The coating nozzle 14 is a long slit nozzle extending in the Y-axis direction which is a direction perpendicular to the moving direction (X-axis direction) of the substrate G held on the stage 12 . On the lower end surface of the coating nozzle 14, a discharge port 15 for discharging the coating liquid to the substrate G is formed. As shown in FIG. 2 , the discharge port 15 is an elongated discharge port extending in the long side direction (Y-axis direction) of the coating nozzle 14 to be longer than the width of the substrate G in the Y-axis direction.

The coating processing device 10 has a nozzle drive unit 16 (corresponding to a coating nozzle moving unit) for moving the coating nozzle 14 in the direction in which the coating nozzle 14 extends (Y-axis direction). The coating nozzle 14 is configured to be freely movable back and forth in the direction in which the coating nozzle 14 extends (Y-axis direction) by the nozzle drive unit 16 . The coating nozzle 14 moves between an end (one end, nozzle position B1 ) on the Y-axis negative direction side and an end (the other end, nozzle position B2 ) on the Y-axis positive direction side.

As mentioned above, the stage 12 is movable in the X-axis direction, and the coating nozzle 14 is movable in the Y-axis direction, respectively, and the moving directions of the stage 12 and the coating nozzle 14 are perpendicular to each other. Next, by discharging the coating liquid from the coating nozzle 14 and moving the coating nozzle 14 and the stage 12 relatively, the coating liquid can be coated on the substrate G held on the stage 12 . Also, by controlling the moving speed of the stage 12 and the moving speed of the coating nozzle 14, the coating direction of the coating liquid applied to the substrate G (the relative moving direction of the stage 12 and the coating nozzle 14) can be arbitrarily controlled. ).

In addition, the coating liquid discharged from the discharge port 15 is a coating liquid containing an optical material. Specifically, it is a coating solution for a polarizing film for forming a linear polarizing film and a coating solution for a wavelength film for forming a λ/4 wavelength film, for example, as an optical material containing a liquid crystal compound or a thermotropic liquid crystal Compounds and other arbitrary liquid crystal compounds.

Below the stage 12 and the coating nozzle 14, a recovery unit 17 for recovering the coating liquid is provided. The coating liquid discharged from the coating nozzle 14 but not applied to the substrate G is recovered by the recovery unit 17 and reused for the substrate G to be processed later.

The operation of the coating processing device 10 is controlled by the aforementioned control unit 18 . The control unit 18 is, for example, a computer having a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and input and output terminals, and reads and executes a program stored in the ROM (program storage unit) , to control the coating process in the coating processing device 10 . The program is, for example, stored in a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magneto-optical disk (MO), memory card, etc. Alternatively, it may be installed to the control unit 18 from the storage medium.

Next, the coating method of the optical film by the coating processing apparatus 10 is demonstrated.

＜Coating Process (Process S1)＞ First, application of a linear polarizing film will be described. FIGS. 4A to 5B are explanatory diagrams showing the operation of the substrate G and the coating nozzle 14 in process S1, which is a coating process of a linear polarizing film.

As shown in FIG. 4A , the stage 12 is positioned at the substrate position A1 , and the substrate G is received and delivered to the stage 12 . Next, the coating nozzle 14 is positioned at the nozzle position B1. At this time, the coating nozzle 14 is located at one end of the substrate G. As shown in FIG. When the coating nozzle 14 is arranged at the nozzle position B1, the coating nozzle 14 is arranged at a height corresponding to a target film thickness of the coating liquid P1 described later.

Next, as shown in FIGS. 4B and 5A , the coating liquid P1 is discharged from the discharge port 15 , and the substrate G is moved in the X-axis positive direction. The substrate G moves from the substrate position A1 toward the substrate position A2. At this time, the position of the application nozzle 14 is maintained at the nozzle position B1. Next, the coating liquid P1 is applied on the upper surface of the substrate G. The coating liquid P1 at this time is the coating liquid for polarizing films for forming a linear polarizing film.

Next, as shown in FIGS. 4C and 5B , after the substrate G is moved to the substrate position A2 , the coating liquid P1 is applied to the entire surface of the substrate G.

At this time, the coating liquid P1 is coated while being applied with a shear stress (reverse white arrows in FIG. 4B and FIG. 4C ). Since the coating nozzle 14 is not moved and the substrate G is moved in the X-axis positive direction, shear stress is applied in the X-axis negative direction.

As described above, the shear stress (shear rate) is a value obtained by dividing the coating speed by the distance (gap) between the substrate G and the discharge port 15 of the coating nozzle 14 . Regarding the gap, since the coating nozzle 14 uses a slit nozzle, the substrate G can be brought sufficiently close to the coating nozzle 14 without damaging the substrate G, so the gap can be reduced. Next, by controlling the moving speed (=coating speed) of the substrate G, sufficient shear stress can be applied to the coating liquid P1. Also, as a result, the molecules in the coating liquid P1 can be aligned in one direction (X-axis direction).

In addition, although nozzles other than the slit nozzle can be used for the coating nozzle 14, the slit nozzle is suitable from the viewpoint of making the gap as small as possible as described above. Moreover, since the coating liquid P1 coated on the substrate G has a thin film thickness (for example, a film thickness of about 1 to 5 μm), the slit nozzle is also suitable from this point of view.

In addition, among the coating liquid P1 discharged from the coating nozzle 14 , the coating liquid P1 not applied to the substrate G is recovered in the recovery unit 17 . The recovered coating solution P1 is reused for the substrate G to be processed later. In addition, since the stage 12 is smaller than the substrate G, the coating liquid P1 does not adhere to the stage 12 either. Therefore, it is possible to control the cleaning of the stage 12 with each substrate G.

＜Coating Process (Process S6)＞ First, application of the λ/4 wavelength film will be described. 6A to 6C are explanatory diagrams showing the operation of the substrate G and the coating nozzle 14 in process S6, which is the coating process of the λ/4 wavelength film.

In process S6, the application|coating of a coating liquid is performed on the upper surface of the board|substrate G on which the linear polarizing film was formed in process S1. The coating liquid at this time is the coating liquid for wavelength films for forming a λ/4 wavelength film.

As shown in FIG. 6A , at the substrate position A1 , the substrate G on which the linear polarizing film has been formed is delivered to the stage 12 . Next, the coating nozzle 14 is positioned at the nozzle position B1. At this time, the coating nozzle 14 is located at one end of the substrate G. As shown in FIG. When the coating nozzle 14 is arranged at the nozzle position B1, the coating nozzle 14 is arranged at a height corresponding to a target film thickness of the coating liquid Q1 described later.

Next, as shown in FIG. 6B , the coating liquid Q1 is discharged from the coating nozzle 14 , and the substrate G is moved in the X-axis positive direction from the substrate position A1 toward the substrate position A2 . At the same time, the application nozzle 14 is moved in the Y-axis positive direction from the nozzle position B1 toward the nozzle position B2.

Next, as shown in FIG. 6C , while discharging the coating liquid Q1 from the coating nozzle 14 , the substrate G is moved to the substrate position A2 . At the same time, the coating nozzle 14 is moved to the nozzle position B2. Thereafter, the coating liquid Q1 is applied over the entire surface of the substrate G.

In this manner, the coating nozzle 14 is moved from the nozzle position B1 to the nozzle position B2 while the substrate G is moved from the substrate position A1 to the substrate position A2. Next, the moving speed of the substrate G and the moving speed of the coating nozzle 14 are controlled at predetermined speeds, respectively.

Next, the coating liquid Q1 is coated while being applied with a shear stress (reverse white arrows in FIG. 6B and FIG. 6C ). By controlling the moving speed of the substrate G and the moving speed of the coating nozzle 14 respectively at predetermined speeds, shearing stress is applied from the Y-axis positive direction and the X-axis positive direction to, for example, a direction inclined at 45 degrees.

Further, by controlling the moving speed of the substrate G and the moving speed of the coating nozzle 14, sufficient shearing stress can be applied to the coating liquid Q1. As a result, the molecules in the coating liquid Q1 can be aligned in one direction (the aforementioned 45-degree inclined direction).

In this way, in the coating processing apparatus 10, the coating liquid Q1 is coated on the board|substrate G, and a λ/4 wavelength film is coated.

By the coating method described above, the molecular direction of the λ/4 wavelength film is arranged in an oblique direction on the XY plane with respect to the molecular direction (arrangement direction) of the linear polarizing film. Next, make the coating direction of the coating liquid P1 and the coating direction of the coating liquid Q1 intersect in an oblique direction, for example, 45 degrees, and the linear polarizing film P1 and the λ/4 wavelength film Q1 can be formed with their polarization axes at 45 degrees. way cross formation.

In addition, the crossing angle of the polarization axes of the linear polarizing film P1 and the λ/4 wavelength film Q1 is not limited to 45 degrees, and the linear polarizing film and the λ/4 wavelength film may be coated at other angles.

<Other Embodiments of Coating Processing Equipment> Next, another embodiment of the coating processing device 10 will be described. FIG. 7 is a schematic cross-sectional view showing the configuration of another embodiment of the coating processing device 10 . FIG. 8 is a schematic longitudinal sectional view showing the configuration of another embodiment of the coating processing device 10 .

The coating processing device 10 further includes a second recovery unit 20 that recovers the coating liquid, as shown in FIGS. 7 and 8 .

The second recovery unit 20 recovers the coating liquid that was discharged from the coating nozzle 14 to the outside of the substrate G but was not coated on the substrate G. As shown in FIG. 7 , each second recovery unit 20 is arranged in an area other than the passage area of the substrate G in a plan view, specifically, at one end side of the elongated coating nozzle 14, for example, near the nozzle position B1, And the other end side of the coating nozzle 14, for example, near the nozzle position B2. The second recovery unit 20 has a shape extending in the Y-axis direction like the coating nozzle 14 . Next, the second recovery unit 20 is disposed at a position capable of recovering the coating liquid discharged from the coating nozzle 14 to the outside of the substrate G at the nozzle position B1 and the nozzle position B2 . Moreover, as shown in FIG. 8 , the second recovery unit 20 is located below the coating nozzle 14 .

Next, the second recovery unit 20 recovers the coating liquid discharged from the coating nozzle 14 to the outside of the substrate G, and the coating liquid recovered by the second recovery unit 20 is reused for the substrate G to be processed later.

Moreover, the coating processing apparatus 10 further has the board|substrate periphery processing part which performs predetermined processing on the periphery part of the board|substrate G. As shown in FIG. Here, as an example of the substrate peripheral processing part, the cleaning processing part 21 for cleaning the peripheral part of the substrate G will be described.

For example, the coating liquid discharged from the coating nozzle 14 may adhere to the inner peripheral edge of the substrate G. As shown in FIG. Here, as shown in FIGS. 7 and 8 , a cleaning treatment unit 21 is provided to remove the coating liquid adhering to the peripheral edge of the back surface of the substrate G. As shown in FIG.

The cleaning processing units 21 are arranged at positions where they can clean the peripheral parts of two sides parallel to the traveling direction of the rectangular substrate G (X-axis direction) and their vicinity.

In the present embodiment, the cleaning section is disposed on the downstream side of the substrate G in the traveling direction (the side in the positive X-axis direction) of the coating nozzle 14 and around a position where two sides parallel to the X-axis pass. twenty one.

FIG. 9 is a longitudinal sectional view schematically showing the cleaning treatment unit 21 . The cleaning processing unit 21 includes a cleaning solution discharge unit 22 that discharges a cleaning solution to the peripheral edge of the front and back of the substrate G, and a cleaning solution recovery unit 23 that sucks and recovers the cleaning solution after cleaning.

The cleaning liquid discharge unit 22 can discharge the cleaning liquid toward the front and rear peripheral edges of the substrate G from the top and bottom of the substrate G in a direction perpendicular to the front and back surfaces of the substrate G or in an oblique direction outward of the substrate G. In addition, the cleaning liquid recovery part 23 is located on the side of the substrate G, and can suck the used cleaning liquid with a negative pressure and recover it.

Next, the process of cleaning the periphery of the substrate G by the cleaning processing unit 21 will be described. The coating liquid is applied to the upper surface of the substrate G while moving the substrate G from the substrate position A1 to the substrate position A2. At this time, the coating liquid discharged from the coating nozzle 14 may wrap around the back of the periphery of the substrate G. As shown in FIG. Here, when the two sides of the substrate G in the coating process pass through the cleaning processing unit 21, the cleaning solution is discharged from the cleaning solution discharge unit 22 to clean the periphery of the substrate G, and the used cleaning solution is discharged from the cleaning solution discharge unit 22. The cleaning solution recovery unit 23 suctions and recovers.

In this way, by arranging the cleaning processing part 21, while the coating process is performed on the substrate G, the peripheral edge of the substrate G can also be cleaned at the same time, and the remaining coating liquid adhering to the peripheral edge of the substrate G can be removed. remove.

In addition, the structure of the cleaning processing part 21 is not limited to the said embodiment, Various modifications are possible. The position of the cleaning treatment unit 21 is merely an example, and it may be disposed at another position. Also, although the example in which the periphery of the front and back of the substrate G is sprayed and cleaned with cleaning solution is shown, only the cleaning solution discharge part 22 on the lower side of the substrate G is used to discharge and clean the periphery of the back of the substrate G only. Liquid may be used to clean the inside of the periphery of the substrate G.

In addition, in order to dry the excess cleaning liquid adhering to the substrate G, for example, a gas injection nozzle (not shown) may be added to the cleaning processing part 21 to inject gas to the periphery of the substrate G.

As an example of the substrate peripheral processing unit, the cleaning processing of the peripheral edge of the substrate G by the cleaning processing unit 21 will be described. However, the processing in the substrate peripheral processing section is not limited to cleaning processing, and peripheral film thickness adjustment processing for adjusting the film thickness of the coating film on the peripheral edge of the substrate G, for example, may also be used.

A peripheral film thickness adjustment unit (not shown) that performs the peripheral film thickness adjustment process includes, for example, a discharge nozzle that discharges the coating liquid, the solvent of the coating liquid, or the solvent atmosphere of the coating liquid only to the peripheral edge of the substrate G. Also, as other examples of the peripheral film thickness adjusting unit, there is a heating unit capable of heating only the peripheral edge of the substrate, or a cooling unit capable of cooling only the peripheral edge of the substrate. use.

There is a risk that the peripheral edge of the substrate G becomes a singular point of the film thickness such that the film thickness of the coating film becomes thicker or thinner compared with other regions of the substrate G. Here, the film thickness of the peripheral edge of the substrate G may be adjusted during the coating process so that the film thickness of the peripheral edge of the substrate G is equal to that of other regions of the substrate G by using the above-mentioned peripheral film thickness adjustment unit.

In addition, as the substrate peripheral processing part, either the cleaning processing part 21 or the peripheral film thickness adjusting part may be arranged. In addition, the processing performed by the substrate peripheral edge processing unit is not limited to cleaning processing and film thickness adjustment processing, and other processing may be used. A processing section for performing other processing may be arranged at the same position as the cleaning processing section 21, and other processing may be performed on the periphery of the substrate G.

In the present embodiment, as shown in FIGS. 7 and 8 , the coating processing apparatus 10 has a configuration in which a cleaning processing section 21 (=substrate peripheral edge processing section) can be easily arranged. Next, by providing the substrate peripheral edge processing section and applying the coating process, the substrate peripheral edge can be simultaneously processed on the peripheral edge of the substrate G during the coating process.

Also, as long as the substrate G can be moved from the substrate position A1 to the substrate position A2, the coating processing device is not limited to the above-mentioned configuration of the coating processing device 10, and can be applied to the present invention. For example, as described in Japanese Unexamined Patent Publication No. 2006-199483, etc., the coating nozzle 14, the second recovery unit 20, and the cleaning treatment unit 21 of the present invention are applied to a coating processing device capable of carrying out a coating process while floating and conveying the substrate G. wait.

In addition, although the first recovery unit 17 and the second recovery unit 20 are provided, the first recovery unit 17 may be omitted.

In this way, the linear polarizing film and the λ/4 wavelength film can be coated on the substrate G by the coating processing apparatus 10 .

Next, in the optical film forming apparatus 1 , the remaining apparatuses other than the coating processing apparatus 10 will be described.

＜Decompression drying device＞ Fig. 10 is a longitudinal sectional view schematically showing the configuration of a reduced-pressure drying device as the first drying device. In the reduced-pressure drying apparatus 100 shown in FIG. 10 , the optical films (linear polarizing film and λ/4 wavelength film) coated on the substrate G are dried under reduced pressure.

The reduced-pressure drying apparatus 100 has a processing container 101 . The processing container 101 has a cover 102 and a body 103 . The cover body 102 is configured to be able to move up and down freely by a lift mechanism not shown in the figure. When loading and unloading the substrate G into the processing container 101, the cover 102 is separated upward from the main body 103, and when the reduced-pressure drying process is performed inside the processing container 101, the cover 102 and the main body 103 are integrated to form a closed space.

Inside the processing container 101, a mounting table 110 on which the substrate G is mounted is provided. On the mounting table 110 , the substrate G is mounted such that the surface on which the optical film is formed faces upward. At the bottom of the processing container 101, a gas supply unit 120 and an exhaust unit 121 are provided. The gas supply unit 120 and the exhaust unit 121 are arranged to face each other across the mounting table 110 . The inert gas is supplied from the gas supply unit 120 , and the gas flow of the inert gas can pass through the gas flow direction parallel to the substrate G (X-axis direction) on the substrate G. In addition, by exhausting from the exhaust unit 121, the inside of the processing container 101 can be made into a reduced-pressure environment.

In addition, the structure of a vacuum drying apparatus is not limited to the structure of the vacuum drying apparatus 100 of this embodiment, The structure of a well-known vacuum drying apparatus may be sufficient.

＜Heat treatment device＞ Fig. 11 is a longitudinal sectional view schematically showing the configuration of a heat treatment device as a second drying device. In the heat treatment apparatus 300 , the optical films (linear polarizing film and λ/4 wavelength film) coated on the substrate G are heated and dried.

The heat treatment apparatus 300 has a treatment container 301 . The processing container 301 has a cover 302 and a body 303 . The cover body 302 is configured to be able to move up and down freely by a lift mechanism not shown in the figure. When loading and unloading the substrate G into the processing container 301 , the cover 302 is separated upward from the main body 303 , and when heat treatment is performed inside the processing container 301 , the cover 302 and the main body 303 are integrated to form a sealed space. An exhaust portion 304 is provided at the upper central portion of the cover body 302 . The inside of the processing container 301 is exhausted from the exhaust unit 304 .

Inside the processing container 301, a hot plate 310 for placing and heating the substrate G is provided. The hot plate 310 places the substrate G such that the surface on which the optical film is formed faces upward. The heating plate 310 incorporates a heater 311 that generates heat by supplying electricity.

In addition, the structure of the heat processing apparatus is not limited to the structure of the heat processing apparatus 300 of this embodiment, The structure of a well-known heat processing apparatus may be sufficient.

＜Film fixing device＞ Fig. 12 is a longitudinal sectional view schematically showing the configuration of the film fixing device. In the film fixing device 400 , the fixing material is applied to a predetermined area by an inkjet method, and in this embodiment, it is selectively applied to the pixel area of the substrate G.

The film fixing device 400 has a processing container 401 . An opening (not shown) for carrying in the substrate G is formed on the side surface of the processing container 401, and an opening and closing gate (not shown) is provided at the carrying in exit.

Inside the processing container 401, a stage 410 holding the substrate G is provided. The stage 410 suction-holds the inside of the substrate G so that the surface on which the fixing material is applied faces upward.

The stage 410 is attached to a pair of rails 411 and 411 provided on the lower surface side of the stage 410 and extending in the X-axis direction. The rail 411 is provided on a platform 412 extending in the X-axis direction. Next, stage 410 is configured to be able to move freely along rails 411 , 411 .

Moreover, the rail 411 surrounds the coating nozzle 420 mentioned later, and extends in the X-axis direction over the length of at least two board|substrates G. As shown in FIG. Thereby, the substrate G (solid line in the figure, substrate position C1) when the stage 410 is located at the end of the negative direction of the X-axis is different from the substrate G (the dotted line in the figure) when the stage 410 is located at the end of the positive direction of the X-axis. , the substrate positions C2) do not overlap when viewed from above.

A coating nozzle 420 for coating a fixing material on the substrate G held on the stage 410 is provided above the stage 410 . The coating nozzle 420 is, for example, an inkjet nozzle, and can selectively coat a predetermined area of the substrate G with the fixing material. Moreover, the coating nozzle 420 is comprised so that it can move freely also in a vertical direction by the moving mechanism not shown in figure.

In addition, as the fixing material discharged from the coating nozzle 420 , as long as it can fix the optical film in a predetermined region of the substrate G, any material can be used. For example, the optical film may be fixed by inactivating (insolubilizing) it by substituting a functional group at the end of the optical film or causing a shrinkage reaction to polymerize the optical film. Alternatively, the optical film may be cured to fix it.

In addition, the configuration of the film fixing device is not limited to the configuration of the film fixing device 400 of the present embodiment, and may be a device of a known inkjet system. Furthermore, the method of selectively applying the fixing material in the film fixing device is not limited to the inkjet method, and other methods may be used. As another method, for example, a mask may be provided in a region other than the predetermined region, and the fixing material may be ejected from the mask to selectively apply the fixing material only to the predetermined region.

＜Membrane removal device＞ Fig. 13 is a longitudinal sectional view schematically showing the configuration of a film removal device. In the film removing device 500 , a cleaning solution is supplied to the substrate G to remove the optical film not fixed by the film fixing device 400 (in this embodiment, the optical film in the region other than the pixel region).

The film removal device 500 has a processing container 501 . An inlet and outlet (not shown) for the substrate G is formed on the side surface of the processing container 501, and an opening and closing gate (not shown) is provided at the inlet and outlet.

Inside the processing container 501, a turntable 510 for holding and rotating the substrate G is provided. The turntable 510 suction-holds the inside of the substrate G so that the surface to which the cleaning solution is supplied faces upward. In addition, the turntable 510 is rotated at a predetermined speed by, for example, a chuck drive unit 511 such as a motor.

Around the turntable 510, there is provided a cup 520 that receives and collects the cleaning liquid scattered or dropped from the substrate G. As shown in FIG. A discharge pipe 521 for discharging the recovered fixing material and an exhaust pipe 522 for exhausting the inside of the cup 520 are connected to the lower surface of the cup 520 .

Above the turntable 510 is provided a cleaning nozzle 530 for supplying a cleaning liquid to the substrate G held on the turntable 510 . The cleaning nozzle 530 is configured to be movable also in the horizontal direction and the vertical direction by the moving mechanism 531 .

In addition, as the cleaning solution supplied from the cleaning nozzle 530 , a material corresponding to the solvent of the fixing material applied by the film fixing device 400 is used. For example, when the solvent of the fixing material is water, water is used as the cleaning solution, and when the solvent of the fixing material is an organic solvent, the organic solvent is used as the cleaning solution.

In addition, the configuration of the film removal device is not limited to the configuration of the film removal device 500 of the present embodiment, and may be a device of a known spin coating method. In addition, the method of selectively removing the optical film in the film removing device is not limited to the spin coating method, and other methods may be used. As another method, for example, the optical film may be selectively removed by immersing the substrate G in a cleaning tank storing a cleaning solution. In addition, the optical film may be selectively removed by laser lift-off, or the optical film may be selectively removed by photolithography and etching.

Next, the optical film forming method performed by the optical film forming apparatus 1 comprised as mentioned above is demonstrated. FIG. 14 is a flowchart showing an example of the main steps of the related optical film forming process.

In this embodiment, a linear polarizing film and a λ/4 wavelength film are laminated on the substrate G as an optical film such that their polarization axes intersect at 45 degrees as described above. Processes S1 to S5 are processes for forming a linear polarizing film, and processes S6 to S10 are processes for forming a λ/4 wavelength film.

＜Project S1＞ As mentioned above, in the coating processing apparatus 10, the coating liquid for polarizing films for forming the linear polarizing film P1 is coated on the whole surface of the board|substrate G (process S1).

＜Project S2＞ Next, the linear polarizing film P1 of the substrate G is dried under reduced pressure in the reduced-pressure drying apparatus 100 . Specifically, the substrate G is placed on the mounting table 110 , and the lid 102 is closed to form a sealed space inside the processing container 101 . Thereafter, while supplying an inert gas from the gas supply unit 120 , the inside of the processing container 101 is exhausted from the exhaust unit 121 to make the inside of the processing container 101 a depressurized environment. Next, the linear polarizing film P1 was dried.

After drying the linear polarizing film P1, the solvent in the film was removed. In the above process S1, although the molecules are aligned in one direction due to the application of shear stress, there is a risk that the alignment of the molecules will return to the original disordered alignment if left in this state. Therefore, the solvent in the film is removed by process S2, and the alignment state of the molecules is appropriately maintained.

In addition, from the viewpoint of appropriately maintaining the molecular alignment state, the substrate G is conveyed between the coating processing apparatus 10 and the reduced-pressure drying apparatus 100 in a state where there is no downward flow and no wind, for example. The molecular alignment state of the linear polarizing film P1 is not disturbed by the downward flow, and the substrate G is transferred from the coating processing apparatus 10 to the reduced-pressure drying apparatus 100 in a state where the molecules are aligned in one direction.

＜Project S3＞ Next, in the heat treatment apparatus 300 , the linear polarizing film P1 of the substrate G is heated and dried. Specifically, the substrate G is placed on the hot plate 310 , and the lid 302 is closed to form a sealed space inside the processing container 301 . Next, the linear polarizing film P1 is heated at a predetermined temperature, for example, 50° C., by the heater 311 of the hot plate 310 .

For example, even if the linear polarizing film P1 is dried under reduced pressure in process S2, the solvent may not be completely removed from the film. The heating of the linear polarizing film P1 in process S3 reliably removes the solvent remaining in the film in this way. In addition, when the solvent in the membrane can be completely removed in Step S2, Step S3 may be omitted.

＜Project S4＞ Next, in the film fixing device 400, a fixing material is applied to a predetermined region of the substrate G, which is a pixel region in this embodiment.

In the film fixing apparatus 400, the substrate G is held on the stage 410 at the substrate position C1. Next, the substrate G is moved from the substrate position C1 to the substrate position C2.

During the movement of the substrate G, the linear polarizing film P1 formed on the pixel region of the substrate G is coated with the fixing material F from the coating nozzle 420 as shown in FIG. 15A . At this time, since the film fixing device 400 adopts the inkjet method, the fixing material F can be accurately applied to the linear polarizing film P1 in the pixel area.

The fixing material F inactivates (insolubilizes) the linear polarizing film P1. Specifically, water-soluble terminals such as OH groups in the linear polarizing film P1 are substituted with other functional groups. Next, the deactivated linear polarizing film P1 is fixed on the substrate G. Hereinafter, the linear polarizing film applied and fixed by applying the fixing material F will be described as P2. That is, in regions other than the pixel region of the substrate G, the linear polarizing film P1 is not deactivated and is not fixed. On the other hand, in the pixel region, the linear polarizing film P2 is deactivated and fixed.

Next, as shown in FIGS. 15A and 15B , an inactivated linear polarizing film P2 can be formed in all pixel regions of the substrate G. In addition, for the convenience of illustration, the case where there are 20 pixel regions of the substrate G, that is, the linear polarizing film P2 is illustrated, but the number of pixel regions is not limited thereto. Actually, the pixel area is located at about 100 positions with respect to one substrate G.

＜Project S5＞ Next, in the film removing apparatus 500 , a cleaning solution is supplied to the substrate G to selectively remove the linear polarizing film P1 not fixed in step S4 .

In the film removal apparatus 500 , the substrate G is sucked and held on the turntable 510 . Thereafter, while the substrate G held by the turntable 510 is rotated, a cleaning solution is supplied from the cleaning nozzle 530 to the center of the substrate G. As shown in FIG. The supplied cleaning liquid spreads on the substrate G by centrifugal force. At this time, since the linear polarizing film P2 coated with the fixing material F is already fixed, it will not be removed by the cleaning solution. On the other hand, the linear polarizing film P1 to which the fixing material F is not applied is removed by the cleaning solution because it is not fixed. Thereby, as shown in FIG. 16A and FIG. 16B , only the linear polarizing film P1 is selectively removed, and only the linear polarizing film P2 is formed in the pixel region on the substrate G.

＜Project S6＞ After the linear polarizing film P2 is formed on the substrate G as above, a λ/4 wavelength film is further formed on the substrate G. As described above, in the coating processing apparatus 10 , the coating liquid is coated on the upper surface of the substrate G on which the linear polarizing film P2 is formed. The coating liquid at this time is the coating liquid for wavelength films for forming a λ/4 wavelength film.

＜Project S7＞ Next, the λ/4 wavelength film Q1 of the substrate G is dried under reduced pressure in the reduced-pressure drying apparatus 100 . Since the specific reduced-pressure drying process is the same as that of process S2, description thereof will be omitted. Therefore, the solvent of the λ/4 wavelength film Q1 is removed, and the alignment state of the molecules in the film is properly maintained.

＜Project S8＞ Next, in the heat treatment apparatus 300 , the λ/4 wavelength film Q1 of the substrate G is heated and dried. Since the specific heat treatment is the same as that of process S3, description thereof will be omitted. Therefore, the solvent of the λ/4 wavelength film Q1 is completely removed. In addition, when the solvent in the membrane can be completely removed in Step S7, Step S8 may be omitted.

＜Project S9＞ Next, in the film fixing device 400 , as shown in FIGS. 17A and 17B , the fixing material F is selectively applied to the λ/4 wavelength film Q1 formed in the pixel region of the substrate G from the coating nozzle 420 . The specific selective coating process of the fixing material F is the same as that of process S4, so the description thereof will be omitted.

The fixing material F inactivates (insolubilizes) the λ/4 wavelength film Q1, and the inactivated λ/4 wavelength film Q1 is fixed to the substrate G. Hereinafter, the λ/4 wavelength film applied and fixed by applying the fixing material F will be described as Q2. That is, in regions other than the pixel region of the substrate G, the λ/4 wavelength film Q1 is not deactivated and is not fixed. On the other hand, in the pixel region (linear polarizing film P2 ), the λ/4 wavelength film Q2 is deactivated and fixed.

＜Project S10＞ Next, in the film removal apparatus 500 , a cleaning solution is supplied to the substrate G to selectively remove the λ/4 wavelength film Q1 not fixed in step S9 . The specific selective removal process of the λ/4 wavelength film Q1 is the same as that of the process S5, so the description thereof will be omitted. Next, only the λ/4 wavelength film Q2 is formed on the substrate G in the pixel region as shown in FIGS. 18A and 18B . In this way, the linear polarizing film P2 and the λ/4 wavelength film Q2 are laminated on the substrate G in the pixel region, and formed.

According to the above embodiment, in the coating processing device 10, the coating direction of the coating liquid P1 in the process S1 and the coating direction of the coating liquid Q1 in the process S6 are intersected at 45 degrees, and the linear polarizing film can be P1 and λ/4 wavelength film Q1 are formed to intersect each other such that their polarization axes are at 45 degrees.

In addition, since the linear polarizing film P1 is dried under reduced pressure in the process S2, the alignment state of the molecules in the linear polarizing film P1 can be properly maintained. At the same time, since the λ/4 wavelength film Q1 is dried under reduced pressure in the process S7, the alignment state of the molecules in the λ/4 wavelength film Q1 can be properly maintained.

In addition, if process S2 and process S7 are processes of drying the linear polarizing film P1 and the λ/4 wavelength film Q1, it is not limited to drying under reduced pressure. For example, each of the linear polarizing film P1 and the λ/4 wavelength film Q1 may be naturally dried, may be dried by heat treatment, or may be dried by blowing gas.

However, drying under reduced pressure is preferable because it can be performed in a shorter time than natural drying. Also, for example, when heat treatment or gas blowing is performed, convection occurs in the solvent in the film, which may disturb the alignment state of molecules in the film. However, drying under reduced pressure is preferable because convection of the solvent in the film can be suppressed.

Also, since the linear polarizing film P1 in the pixel area is selectively coated with the fixing material F in process S4, and the linear polarizing film P1 that is not coated with the fixing material F and not fixed is selected and removed in process S5, only the linear polarizing film P1 in the pixel area The region forms a linear polarizing film P2. Similarly, by performing process S9 and process S10, the λ/4 wavelength film Q2 is formed only in the pixel area.

Among them, for example, when making a circular polarizing plate, the linear polarizing film and the λ/4 wavelength film can only be formed in the pixel area. If the film is formed in an area other than the pixel area, there is a risk that terminals and the like provided around the pixel area will not function properly. In this embodiment, since the film is formed only in the pixel area, the functions of the linear polarizing film P2 and the λ/4 wavelength film Q2 in the pixel area can be made to function, and the components around the pixel area can also be made to function.

Also, in steps S1 and S6, although the coating liquids P1 and Q1 are applied by applying shear stress, respectively, it is difficult to apply the coating liquids P1 and Q1 only to the pixel area at this time. Therefore, it is useful to perform steps S4, S5, S9, and S10 to selectively form the linear polarizing film P2 and the λ/4 wavelength film Q2 in the pixel area.

Furthermore, if the linear polarizing film P1 is formed by applying the coating liquid P1 to the substrate G in the process S1, and the selective coating of the fixing material F in the process S4 is omitted, the substrate G is coated in the following process S6. When the coating liquid Q1 is spread, the linear polarizing film P1 will dissolve in the coating liquid Q1, and there is a risk that the dissolved linear polarizing film P1 will mix with the coating liquid Q1. In this regard, as in the present embodiment, by performing step S4 to form the insoluble linear polarizing film P2, mixing of the linear polarizing film P2 and the coating liquid Q1 can be suppressed. As a result, the linear polarizing film P2 and the λ/4 wavelength film Q2 can be appropriately formed.

In addition, it is not necessarily necessary to perform the processes S4, S5, S9, and S10. As in this embodiment, when the substrate G has a plurality of pixel regions, it is useful to perform steps S4, S5, S9, and S10, but for example, when the linear polarizing film and the λ/4 wavelength film are formed on the entire surface of the substrate G, steps S4, S4, and S10 are omitted. S5, S9, S10 are also available.

Also, in Steps S4 and S9, the film fixing device 400 applies a fixing material to fix the linear polarizing film and the λ/4 wavelength film, but other methods may be used. As another method, for example, adding a material that reacts with light to the linear polarizing film and the λ/4 wavelength film in advance, and polymerizing the crystals of the linear polarizing film and the λ/4 wavelength film by light irradiation, it is possible to make the linear polarizing film and the λ/4 wavelength film The film does not dissolve but fixes.

In the above embodiments, when producing a circular polarizing plate for OLED, the case where a linear polarizing film (linear polarizing plate) and a λ/4 wavelength film (λ/4 wavelength plate) are formed on a glass substrate as an optical film is taken as an example. Examples are illustrated, but others are also applicable to the invention. For example, the present invention can also be applied to polarizing plates and wavelength plates used in LCDs. In addition, the wavelength plate is not limited to the λ/4 wavelength film, for example, other wavelength plates such as λ/2 wavelength film can also be applied to the present invention.

As above, although preferred embodiments of the present invention were described with reference to the attached drawings, the examples related to the present invention are not limited thereto, and various modified examples also belong to the technical scope of the present invention.

1: Optical film forming device 10: Coating treatment device 12: Stage (substrate moving part) 13: Stage driving part (substrate moving part) 14: coating nozzle 15: spit out 16: Nozzle driving part (coating nozzle moving part) 17:Recycling Department 18: Control Department 20: Second Recycling Department (Recycling Department) 21: Cleaning processing part (substrate peripheral processing part) 100: Reduced pressure drying device (first drying device) 300: heat treatment device (second drying device) 400: Membrane fixation device 500: Membrane removal device G: glass substrate P1: linear polarizing film (coating solution) P2: linear polarizing film Q1: λ/4 wavelength film (coating solution) Q2:λ/4 wavelength film

[ Fig. 1] Fig. 1 is a plan view schematically showing the configuration of an optical film forming apparatus according to the present embodiment. [ Fig. 2] Fig. 2 is a cross-sectional view schematically showing the configuration of a coating treatment device according to the present embodiment. [ Fig. 3] Fig. 3 is a longitudinal sectional view schematically showing the configuration of a coating treatment device according to the present embodiment. [ Fig. 4A] Fig. 4A is an explanatory view showing the operation of a glass substrate and a coating nozzle in process S1. [ Fig. 4B] Fig. 4B is an explanatory view showing the operation of the glass substrate and the coating nozzle in process S1. [ Fig. 4C] Fig. 4C is an explanatory view showing the operation of the glass substrate and the coating nozzle in process S1. [ Fig. 5A] Fig. 5A is an explanatory view showing the operation of the glass substrate and the coating nozzle in process S1. [ Fig. 5B] Fig. 5B is an explanatory view showing the operation of the glass substrate and the coating nozzle in process S1. [ Fig. 6A] Fig. 6A is an explanatory diagram showing the operation of the glass substrate and the coating nozzle in process S6. [ Fig. 6B] Fig. 6B is an explanatory view showing the operation of the glass substrate and the coating nozzle in process S6. [ Fig. 6C] Fig. 6C is an explanatory diagram showing the operation of the glass substrate and the coating nozzle in process S6. [ Fig. 7] Fig. 7 is a schematic cross-sectional view showing the configuration of a coating treatment device according to another embodiment. [ Fig. 8] Fig. 8 is a longitudinal sectional view schematically showing the configuration of a coating treatment device according to another embodiment. [ Fig. 9] Fig. 9 is a longitudinal sectional view schematically showing a cleaning processing unit in a coating processing device according to another embodiment. [ Fig. 10] Fig. 10 is a longitudinal sectional view showing a schematic configuration of a reduced-pressure drying device according to the present embodiment. [ Fig. 11] Fig. 11 is a longitudinal sectional view showing a schematic configuration of a heat treatment apparatus according to the present embodiment. [ Fig. 12] Fig. 12 is a longitudinal sectional view showing a schematic configuration of the film fixing device according to the present embodiment. [ Fig. 13] Fig. 13 is a vertical cross-sectional view showing a schematic configuration of a film removal device according to the present embodiment. [FIG. 14] FIG. 14 is a flowchart showing an example of the main process of the optical film formation process of this embodiment. [ Fig. 15A] Fig. 15A is an explanatory diagram showing a state in which a fixing material is applied to fix a linear polarizing film in process S4. [ Fig. 15B] Fig. 15B is an explanatory diagram showing a state in which a fixing material is applied to fix the linear polarizing film in process S4. [ Fig. 16A] Fig. 16A is an explanatory view showing a state in which an unfixed linear polarizing film is removed in process S5. [ Fig. 16B] Fig. 16B is an explanatory diagram showing a state in which an unfixed linear polarizing film is removed in process S5. [ Fig. 17A] Fig. 17A is an explanatory diagram showing a state in which a λ/4 wavelength film is fixed by applying a fixing material in process S9. [ Fig. 17B] Fig. 17B is an explanatory diagram showing a state in which a λ/4 wavelength film is fixed by applying a fixing material in process S9. [ Fig. 18A] Fig. 18A is an explanatory diagram showing a state in which an unfixed λ/4 wavelength film is removed in process S10. [FIG. 18B] FIG. 18B is an explanatory view showing how the unfixed λ/4 wavelength film is removed in process S10.

10: Coating treatment device

12: Stage (substrate moving part)

11: Disposal container

13: Stage driving part (substrate moving part)

14: coating nozzle

15: spit out

16: Nozzle driving part (coating nozzle moving part)

17:Recycling Department

18: Control Department

A1, A2: Substrate position

B1, B2: nozzle position

G: glass substrate

Claims (6)

A coating processing device, which is a coating processing device for coating a coating liquid containing an optical material on a substrate in such a manner that molecules in the coating liquid are aligned in one direction while applying a shear stress, comprising: A substrate moving part that moves the substrate in one horizontal direction; extends in a direction perpendicular to the moving direction of the substrate moving part, and discharges the elongated coating of the coating liquid to the substrate held by the substrate moving part Nozzle; a coating nozzle moving part that moves the coating nozzle in the extending direction of the coating nozzle; by controlling the moving speeds of the substrate moving part and the coating nozzle moving part, the The control unit of the coating direction of the substrate; the length of the coating nozzle in the vertical direction is longer than the width of the substrate in the vertical direction. The coating processing apparatus according to claim 1, wherein the control unit uses the substrate moving unit to move the substrate in the moving direction, and moves the coating nozzle in the vertical direction while discharging the coating on the substrate. Coating solution. The coating processing device according to claim 1 or 2, further comprising: arranged below the coating nozzle, and discharges the coating liquid from the coating nozzle to the outside of the substrate held by the substrate moving part. Recycling department for recycling. The coating treatment device according to claim 3, wherein the recovery unit is divided and disposed under one end and the other end of the elongated coating nozzle. A coating treatment method, which is a coating treatment method of coating a coating liquid containing an optical material on a substrate in such a manner that a shear stress is applied while molecules in the coating liquid are aligned in one direction, comprising: stretching The first process of disposing the elongated coating nozzle longer than the width of the substrate at one end of the substrate; the second process of discharging the coating liquid from the coating nozzle; discharging the coating liquid The third process of moving the coating nozzle in the extending direction of the coating nozzle, moving the substrate in a direction perpendicular to the extending direction, and performing a coating process on the substrate. An optical film forming apparatus, which is an optical film forming apparatus for forming an optical film on a substrate, comprising: applying a shear stress to a coating liquid containing an optical material on the substrate while aligning molecules in the coating liquid in one direction A coating processing device for coating by means of a coating processing device; a drying processing device for drying an optical film formed by the aforementioned coating liquid coated by the aforementioned coating processing device; a solid coating of the aforementioned optical film on a predetermined area of the aforementioned optical film The film fixing device of the material; the film removal film that removes the aforementioned optical film in the region that is not coated with the aforementioned fixing material The above-mentioned coating processing device has: a substrate moving part that holds the above-mentioned substrate to move in a horizontal direction; extends in a direction perpendicular to the moving direction of the aforementioned substrate moving part, for A strip-shaped coating nozzle that discharges the coating liquid from the substrate; a coating nozzle moving unit that moves the coating nozzle in the extending direction of the coating nozzle; by controlling the substrate moving unit and the coating nozzle moving unit The moving speed is used to control the control part for the coating direction of the aforementioned substrate held by the aforementioned substrate moving part.

Images