[go: up one dir, main page]

TWI797801B - Method for examining gluing quality of overlaying member - Google Patents

Method for examining gluing quality of overlaying member Download PDF

Info

Publication number
TWI797801B
TWI797801B TW110140244A TW110140244A TWI797801B TW I797801 B TWI797801 B TW I797801B TW 110140244 A TW110140244 A TW 110140244A TW 110140244 A TW110140244 A TW 110140244A TW I797801 B TWI797801 B TW I797801B
Authority
TW
Taiwan
Prior art keywords
glue
dispensing
area
colloid
plate
Prior art date
Application number
TW110140244A
Other languages
Chinese (zh)
Other versions
TW202317276A (en
Inventor
徐源樂
古宇榮
裴澤華
Original Assignee
鴻騏新技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鴻騏新技股份有限公司 filed Critical 鴻騏新技股份有限公司
Priority to TW110140244A priority Critical patent/TWI797801B/en
Application granted granted Critical
Publication of TWI797801B publication Critical patent/TWI797801B/en
Publication of TW202317276A publication Critical patent/TW202317276A/en

Links

Images

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

A method for examining gluing quality of overlaying member includes at least one step as follows, providing a carrying platform to support an examining overlaying member, wherein the overlaying member has a first board, a second board overlaid on the first board, and a gluing area on a periphery of the overlaying member, and the first board is transparent, setting a predetermined threshold depth of the gluing area, photographing a plurality of glue images of the gluing area through the first board, measuring a glue permeating depth of the glue images, and comparing each glue permeating depth with the predetermined threshold depth. If the glue permeating depth is smaller than the predetermined threshold depth, a warning message is alerted.

Description

疊合件的點膠品質的檢測方法Inspection method of dispensing quality of laminated parts

本發明涉及一種疊合件的點膠品質的檢測方法,特別是涉及一種檢測疊合件(例如是晶圓組合件)的點膠品質的方法,能檢查疊合件的點膠區域在未點膠前的狀況、以及點膠後的點膠滲透率是否符合預期的。 The invention relates to a method for detecting the glue dispensing quality of a laminate, in particular to a method for detecting the glue dispensing quality of a laminate (such as a wafer assembly), which can check whether the glue dispensing area of the laminate is not dispensing Whether the condition before glue and the dispensing penetration rate after dispensing meet expectations.

按,利用立體堆疊技術來製造三維晶片(3D IC),其中,晶片之間的堆疊(Stacking)技術非常關鍵。當兩片晶圓接合後,通常需要利用點膠機將兩片晶圓的周圍縫隙封住以進行下一步的製程。 According to, the three-dimensional chip (3D IC) is manufactured by using the three-dimensional stacking technology, and the stacking technology between the chips is very critical. After the two wafers are bonded, it is usually necessary to use a glue dispenser to seal the gap around the two wafers for the next step of the process.

接合後的兩片晶圓,可以稱為晶圓組件,晶圓組件的待膠合處位於兩片晶圓之間,其縫隙小。點膠的過程通常是將晶圓水平置放,待膠合處呈水平向外的狀態,並正向朝向晶圓組件側面的待膠合處點膠。 The bonded two wafers can be called a wafer assembly, and the joint of the wafer assembly is located between the two wafers with a small gap. The process of dispensing is usually to place the wafer horizontally, with the part to be glued horizontally outward, and to dispense glue towards the part to be glued on the side of the wafer assembly.

本案的申請人針對晶圓組件的點膠方法及裝置,已提出相關的中華民國專利,例如,中華民國專利公告號I558470『自動微調點膠路徑的水平點膠裝置及其方法』、中華民國專利公告號I566841,『點膠狀況的檢測方法及點膠狀況的檢測機構』。該些前案提供了水平點膠的方法,以及檢測晶圓組件的周圍是否都有點上膠體。 The applicant of this case has proposed related ROC patents for the dispensing method and device of wafer components, for example, ROC Patent Publication No. I558470 "Horizontal Dispensing Device and Method for Automatically Fine-tuning the Dispensing Path", and ROC Patent Bulletin No. I566841, "Detection method of dispensing status and detection mechanism of dispensing status". These prior documents provide methods for dispensing glue horizontally and detecting whether there are glue spots all around the wafer assembly.

然而,晶圓組件周圍的膠體可能無法都良好地進入兩片晶圓之間的夾縫。膠體可能只在晶圓組件邊緣的表面。 However, the glue around the wafer assembly may not all be able to get into the gap between the two wafers well. Glue may only be on the surface of the wafer assembly edge.

故,如何通過結構設計的改良,來提升晶圓組件的點膠後檢測效果,進一步檢測疊合件的點膠滲透率,以克服上述的缺陷,已成為該項技術領域所欲解決的重要課題之一。 Therefore, how to improve the inspection effect of the wafer assembly after dispensing through the improvement of the structural design, and further inspect the dispensing penetration rate of the stacked parts, so as to overcome the above-mentioned defects, has become an important issue to be solved in this technical field. one.

本發明所要解決的技術問題在於,針對現有技術的不足提供一種疊合件的點膠品質的檢測方法,以檢測晶圓組件周圍的膠體是否良好地進入兩片晶圓之間的夾縫,達到預期滲透的深度。 The technical problem to be solved by the present invention is to provide a method for detecting the glue dispensing quality of laminated parts in view of the deficiencies in the prior art, so as to detect whether the glue around the wafer assembly enters the gap between the two wafers well and achieves the desired result. depth of penetration.

為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種疊合件的點膠品質的檢測方法,係應用於一待檢測的疊合件,該疊合件具有一透明的第一板體、及一疊合於該第一板體的第二板體,該疊合件周圍具有多個點膠區域,該檢測方法包括至少下列步驟:提供一承載平台以承載該疊合件;膠體取像步驟,透過該第一板體擷取每一該點膠區域的膠體影像;檢測每一該膠體影像中的膠體面積與該點膠區域未點膠體前的空白面積,其中該膠體面積與該空白面積的比例定義為一滲透率;以及比較步驟,比較每一該膠體影像與該點膠區域未點膠體前的空白面積的誤差是否超過一預定誤差門檻值,若是,就發出一異常訊息。 In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a method for detecting the dispensing quality of laminated parts, which is applied to a laminated part to be inspected, and the laminated part has a transparent The first plate body and a second plate body stacked on the first plate body, there are multiple dispensing areas around the stacked piece, the detection method includes at least the following steps: providing a carrying platform to carry the stacked Colloid imaging step, capture the colloid image of each of the dispensing area through the first plate body; detect the area of the colloid in each of the colloid images and the blank area before the dispensing area is not dispensed, wherein the The ratio of the colloid area to the blank area is defined as a permeability; and the comparison step is to compare whether the error of each of the colloid image and the blank area before the dispensing area exceeds a predetermined error threshold value, and if so, send An exception message.

本發明的其中一有益效果在於,本發明所提供的疊合件的點膠品質的檢測方法,其至少能檢查,疊合件周圍的點膠區域點膠後的膠體滲透到點膠區域內部的狀況是否符合所預期。 One of the beneficial effects of the present invention is that the detection method of the dispensing quality of the laminate provided by the present invention can at least check whether the glue in the dispensing area around the laminate penetrates into the interior of the dispensing area. Is the condition as expected.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

100:點膠暨檢測機台 100: Dispensing and testing machine

10:底座 10: base

12:人機界面模組 12: Man-machine interface module

121:顯示器 121: Display

122:鍵盤 122: keyboard

123:滑鼠 123: mouse

124:記錄暨控制裝置 124: Recording and control device

20:承載平台 20: Bearing platform

31:第一攝像鏡頭 31: The first camera lens

32:第二攝像鏡頭 32: Second camera lens

33:第三攝像鏡頭 33: The third camera lens

40:噴射點膠頭 40: jet dispensing head

8:S晶圓傳送機 8:S wafer conveyor

9:疊合件 9: Composite

90:點膠區域 90: Dispensing area

901:凹槽 901: Groove

91:第一板體 91: The first plate body

92:第二板體 92: The second board body

G:膠體 G: colloid

R:機械手臂 R: mechanical arm

D0:預定深度門檻值 D0: predetermined depth threshold

D1:空白深度值 D1: blank depth value

圖1為本發明的點膠暨檢測機台及載入晶圓組件的立體圖。 FIG. 1 is a perspective view of a dispensing and inspection machine and a loading wafer assembly of the present invention.

圖2為本發明的點膠暨檢測機台的前視圖。 Fig. 2 is a front view of the dispensing and testing machine of the present invention.

圖3為本發明的點膠暨檢測機台的俯視圖。 FIG. 3 is a top view of the dispensing and testing machine of the present invention.

圖4為本發明的點膠前檢測流程的示意圖。 Fig. 4 is a schematic diagram of the detection process before dispensing of the present invention.

圖5為本發明的點膠前檢測流程的步驟流程圖。 Fig. 5 is a flow chart of the steps of the detection process before dispensing of the present invention.

圖6A為比對參考的疊合件的點膠區域(未點膠)的局部放大圖。 FIG. 6A is a partially enlarged view of the glue dispensing area (not glue dispensing) of the comparison reference laminate.

圖6B為舉例的疊合件的點膠區域(未點膠)的局部放大圖。 FIG. 6B is a partially enlarged view of the dispensing area (undispensed) of an exemplary laminate.

圖7為本發明的點膠後檢測品質的示意圖。 Fig. 7 is a schematic diagram of detecting quality after dispensing of the present invention.

圖8為本發明的點膠後檢測品質的步驟流程圖。 Fig. 8 is a flow chart of the steps of detecting the quality after dispensing of the present invention.

圖9A為比對參考的疊合件的點膠區域(已點膠)的局部放大圖。 FIG. 9A is a partial enlarged view of the dispensing area (dispensed glue) of the laminate for comparison and reference.

圖9B為舉例的疊合件的點膠區域(已點膠)的局部放大圖。 FIG. 9B is a partially enlarged view of the dispensing area (dispensed) of an exemplary laminate.

以下是通過特定的具體實施例來說明本發明所公開的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following is an illustration of the disclosed embodiments of the present invention through specific specific examples, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信 號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one signal from another Number. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

本發明提供一種疊合件的點膠品質的檢測方法,其應用於具有點膠區域90(或稱縫隙)的疊合件9(參圖1)。其中疊合件9所要達到的狀況,不僅疊合件9的點膠區域90確實需要點上膠體,更進一步還要檢測疊合件9的點膠區域90內的膠點是否向疊合件9的內部滲透達一定的深度,以達到確定的密封效果。 The present invention provides a method for detecting glue dispensing quality of laminated parts, which is applied to laminated parts 9 having glue dispensing areas 90 (or called gaps) (refer to FIG. 1 ). Wherein the situation to be achieved by the laminate 9, not only the glue dispensing area 90 of the laminate 9 really needs to be glued, but also to detect whether the glue point in the glue dispensing area 90 of the laminate 9 is toward the laminate 9 The internal penetration of the seal reaches a certain depth to achieve a certain sealing effect.

本實施例的疊合件9是一種晶圓組件,其具有一第一板體91、以及疊合於第一板體91的第二板體92。具體的說,疊合件9的第一板體91是透明玻璃載板,第二板體92是半導體晶圓。此外,第一板體91的直徑略大於第二板體92的直徑。接合後的疊合件9的周圍縫隙需要進行膠合,包括晶圓的凹槽(notch)901或平邊(Flat)。然而本發明的應用對象並不限制於此。本發明也可以應用於其他需要側面膠合的加工件。 The stacked component 9 of this embodiment is a wafer assembly, which has a first board 91 and a second board 92 stacked on the first board 91 . Specifically, the first plate body 91 of the laminated component 9 is a transparent glass carrier, and the second plate body 92 is a semiconductor wafer. In addition, the diameter of the first plate body 91 is slightly larger than the diameter of the second plate body 92 . The surrounding gaps of the bonded laminate 9 need to be glued, including the notch 901 or the flat edge of the wafer. However, the application object of the present invention is not limited thereto. The present invention can also be applied to other workpieces that require side gluing.

如圖1至圖3所示,本發明提供一點膠暨檢測機台100以達成相關的點膠及檢測流程。點膠暨檢測機台100具有一底座10、人機界面模組12、承載平台20、多個攝像鏡頭(31、32、33)、及噴射點膠頭40。人機界面模組12包括顯示器121、鍵盤122及滑鼠123,但不限制於此。例如也可以是觸控螢幕。人機界面模組12可以設置在底座10內,或在點膠暨檢測機台100的外面。承載平台20可以轉動該疊合件9。第一攝像鏡頭31(或稱俯視鏡頭)垂直設置在承載平台20的上方,以擷取該些點膠區域90的俯視影像資訊。第二攝像鏡頭32(或側視鏡頭)設置於該疊合件9的側面,擷取該些點膠區域90側面位置的資訊。擷取影像的過程包括在承載平台20上旋轉該疊合件9一圈並且記錄於一記錄暨控制裝置124。第三攝像鏡頭33(或稱仰視鏡頭)垂直設置在承載平台20的側邊,以擷取該些點膠區域90的仰視影像資訊。多個攝像鏡頭(31、32、33) 還配置一環狀光源,以提供照明光線,所述照明光線較佳是能被膠體反射或折射。 As shown in FIGS. 1 to 3 , the present invention provides a dispensing and testing machine 100 to achieve related dispensing and testing procedures. The dispensing and testing machine 100 has a base 10 , a man-machine interface module 12 , a carrying platform 20 , a plurality of camera lenses ( 31 , 32 , 33 ), and a dispensing head 40 . The man-machine interface module 12 includes a display 121 , a keyboard 122 and a mouse 123 , but is not limited thereto. For example, a touch screen is also possible. The man-machine interface module 12 can be set inside the base 10 or outside the dispensing and testing machine 100 . The carrying platform 20 can rotate the laminated part 9 . The first camera lens 31 (or top-view lens) is vertically arranged above the carrying platform 20 to capture top-view image information of the glue dispensing areas 90 . The second camera lens 32 (or side-view lens) is disposed on the side of the laminated component 9 to capture information on the side positions of the dispensing areas 90 . The process of capturing images includes rotating the lamination 9 on the carrying platform 20 one turn and recording in a recording and control device 124 . The third camera lens 33 (or referred to as the upward-looking lens) is vertically arranged on the side of the carrying platform 20 to capture the upward-looking image information of the dispensing areas 90 . Multiple camera lenses (31, 32, 33) A ring-shaped light source is also configured to provide illuminating light, and the illuminating light can preferably be reflected or refracted by the colloid.

本發明提供一種疊合件的點膠品質的檢測方法,其包括兩個主要的流程,第一流程,如圖4至圖5所示的點膠前檢測流程,以及第二流程,如圖7至圖8所示的,點膠後檢測滲透率流程。 The present invention provides a method for detecting the glue dispensing quality of laminated parts, which includes two main processes, the first process, the detection process before dispensing as shown in Figure 4 to Figure 5, and the second process, as shown in Figure 7 As shown in Figure 8, the process of detecting the permeability after dispensing.

如圖4至圖5所示的第一流程,點膠前檢測流程,主要目的在於,第一板體91與第二板體92的疊合後的所有點膠區域90是否具有相等的徑向距離。換句話說,第一板體91與第二板體92兩者的圓心是否對準而沒有偏移,或者說,偏移的程度是可以接受的。假設第一板體91與第二板體92兩者的圓心並沒有對準,將產生偏移的狀況。具體的說,疊合件9的圓周邊緣將產生不同的距離,其中一側的點膠區域可能太短,另一側的點膠區域可能太長。其中某些地方太短的點膠區域,點膠後的膠體滲透深度可能無法滿足密封的要求。 The first process shown in Figures 4 to 5, the pre-dispensing detection process, the main purpose is to determine whether all dispensing areas 90 of the first plate body 91 and the second plate body 92 have the same radial direction. distance. In other words, whether the centers of circles of the first plate body 91 and the second plate body 92 are aligned without deviation, or in other words, the degree of deviation is acceptable. Assuming that the centers of circles of the first plate 91 and the second plate 92 are not aligned, an offset will occur. In particular, the circumferential edges of the laminate 9 will produce different distances, where the dispensing area may be too short on one side and too long on the other side. Some places where the dispensing area is too short, the penetration depth of the colloid after dispensing may not meet the sealing requirements.

請參閱圖5並配合圖4,點膠前檢測流程包括多個步驟如下:首先,步驟S10「開始」,可視為已完成下列動作。將疊合件9搬到點膠暨檢測機台100的承載平台20(參圖1至圖3)。疊合件9可以是透過晶圓傳送設備,例如機械手臂R,傳送到點膠暨檢測機台100的承載平台20上。 Please refer to FIG. 5 and FIG. 4 , the pre-dispensing detection process includes multiple steps as follows: First, step S10 "Start", which can be regarded as having completed the following actions. Move the composite part 9 to the carrying platform 20 of the dispensing and testing machine 100 (refer to FIGS. 1 to 3 ). The lamination 9 can be transferred to the carrier platform 20 of the dispensing and inspection machine 100 through a wafer transfer device, such as a robot arm R.

接著,步驟S11,啟動一攝影鏡頭及轉動承載平台一圈,以針對該疊合件9進行視覺掃描。具體的說,承載平台20轉動疊合件9,本實施例的攝影鏡頭是透過第三攝像鏡頭33(或稱仰視鏡頭)擷取該些點膠區域90的仰視影像資訊。目的是為了在點膠之前取得疊合件9的點膠區域90的位置資訊、及疊合狀況。 Next, in step S11 , a photographic lens is activated and the carrying platform is rotated for one turn, so as to visually scan the laminated part 9 . Specifically, the carrying platform 20 rotates the laminate 9, and the photographic lens of this embodiment captures the upward-looking image information of the dispensing areas 90 through the third photographic lens 33 (or called an upward-looking lens). The purpose is to obtain the position information of the glue dispensing area 90 of the laminate 9 and the lamination status before dispensing.

在擷取該第一板體91與該第二板體92的該些點膠區域90的影像中,是利用朝上的第三攝像鏡頭33向上拍攝疊合件9的邊緣。第三攝像鏡頭33 設置於第一板體91的下方,且朝向第一板體91的邊緣,第三攝像鏡頭33沿著一垂直於所述第一板體91的方向擷取膠體影像,並紀錄膠體影像的位置座標。具體舉例,第三攝像鏡頭33的感應器區域,或稱視野(FOV),可以是14.1mm(長)×10.3mm(寬),其中14.1mm(長)沿著疊合件9的切線方向,其中10.3mm寬度的一半(5.15mm)落在疊合件9的垂直投影範圍內,而一半在外面,如此一次的影像可以檢測的面積為14.1mm x 5.15mm。本實施例的疊合件9每轉動3度角作為一個點膠區域90並拍攝一張影像,共可取得120張影像。然而,本發明不限制於此,每一張影像涵蓋的角度依攝像鏡頭的視野而決定,此外,也考量每一張影像的分析運算時間。原則上,每一點膠區域90的待點膠面積是相同的。此外,第三攝像鏡頭33還配置一環狀光源,以提供拍照的光源。環狀光源的光線較佳是對於膠體產生較大的折射或反射,例如以波長較短的光線,依據膠體的材料所有差異。 In capturing the images of the dispensing areas 90 of the first plate 91 and the second plate 92 , the edge of the laminate 9 is photographed upward by the third camera lens 33 facing upward. The third camera lens 33 The third camera lens 33 captures the colloidal image along a direction perpendicular to the first plate 91 and records the position of the colloidal image. coordinate. For example, the sensor area of the third camera lens 33, or the field of view (FOV), can be 14.1mm (length) × 10.3mm (width), wherein 14.1mm (length) is along the tangential direction of the laminated part 9, Half of the 10.3mm width (5.15mm) falls within the vertical projection range of the laminated part 9, and half is outside, so the area that can be detected by such an image is 14.1mm x 5.15mm. In this embodiment, every rotation of the laminated part 9 at an angle of 3 degrees is used as a dispensing area 90 and an image is taken, and a total of 120 images can be obtained. However, the present invention is not limited thereto, and the angle covered by each image is determined according to the field of view of the camera lens. In addition, the analysis and calculation time of each image is also considered. In principle, each glue dispensing area 90 has the same area to be glued. In addition, the third camera lens 33 is also configured with a ring-shaped light source to provide a light source for taking pictures. The light of the ring light source preferably produces greater refraction or reflection on the colloid, such as light with a shorter wavelength, depending on the difference in the material of the colloid.

步驟S12,影像分析,也就是說,針對上述取得的影像,透過電腦的影像辨識機制以分析影像。其進一步的說,也就是檢測疊合件9(也就是晶圓組件)邊緣的空白深度值是否符合預定深度門檻值。步驟S12更具體的說,其包括至少下列步驟,取得每一影像並量測每一個該些點膠區域90的空白深度值。比對每一個該空白深度值與所述預定深度門檻值的誤差值是否在一允許範圍內;若該誤差值超過所述允許範圍,顯示一待確認訊息。 Step S12, image analysis, that is to say, analyzing the image through the image recognition mechanism of the computer for the obtained image. To put it further, it is to detect whether the blank depth value at the edge of the stack 9 (that is, the wafer assembly) meets the predetermined depth threshold. More specifically, the step S12 includes at least the following steps of obtaining each image and measuring the blank depth value of each of the dispensing regions 90 . Comparing whether the error value between each blank depth value and the predetermined depth threshold value is within an allowable range; if the error value exceeds the allowable range, displaying a message to be confirmed.

舉例說明步驟S14,請參圖6A及圖6B,圖6A是疊合件9的其中一張參考的影像,第一板體91的右側為拍攝的背景,通常是模糊且較深。第二板體92略小於第一板體91。第二板體92往內為點膠區域90,其中D0為預定深度門檻值,假設為3000微米±1000微米(μm,micrometer)。依序取一張拍攝後的影像,如圖6B所示,量測點膠區域90的寬度,也就是空白深度值D1,例如為2900微米(μm,micrometer)。比較D1與D0,若是D1-D0的誤差值是否 超過一允許範圍,例如誤差允許範圍為正負100微米,2900微米-3000微米等於負100微米,位於誤差允許範圍的100微米,意即圖6B的影像所代表點膠區域90是合格的。假設,D1-D0的誤差值超過允許範圍的100微米,代表點膠區域90是不合格的。接著,可以透過電腦的影像辨識機制自動儲存該張不合格的影像(例如圖6B),並記錄其位置資訊,也就是座標。例如記錄到記錄暨控制裝置124。 To illustrate step S14, please refer to FIG. 6A and FIG. 6B. FIG. 6A is one of the reference images of the stacked part 9, and the right side of the first plate 91 is the background of the shooting, which is usually blurred and dark. The second board body 92 is slightly smaller than the first board body 91 . Inside the second plate body 92 is a dispensing area 90 , where D0 is a predetermined depth threshold, which is assumed to be 3000 μm±1000 μm (μm, micrometer). Sequentially take a captured image, as shown in FIG. 6B , measure the width of the glue dispensing area 90 , that is, the blank depth D1 , for example, 2900 microns (μm, micrometer). Compare D1 and D0, if the error value of D1-D0 is Exceeding a tolerance range, for example, the tolerance range of error is plus or minus 100 microns, 2900 microns-3000 microns is equal to minus 100 microns, which is within 100 microns of the tolerance range, which means that the dispensing area 90 represented by the image in FIG. 6B is qualified. Assume that the error value of D1-D0 exceeds the allowable range of 100 microns, which means that the dispensing area 90 is unqualified. Then, the unqualified image (such as FIG. 6B ) can be automatically stored through the image recognition mechanism of the computer, and its location information, that is, the coordinates, can be recorded. For example, it is recorded to the recording and control device 124 .

步驟S14,是否自動檢測影像正常。也就是說,針對該些不合格的影像自動檢測影像正常,若是,就進到下一製程,步驟S140。在本實施例,可以是接到點膠製程,如圖4右下角所示意的。若否,如步驟S15所示,待確認是否複檢,也就是複檢不合格的影像,複檢可以是透過人力進行。若要複檢,如步驟S17所示,檢查異常位置的影像,此步驟可以透過人力一一點閱,待確認如何處理該些不合格的影像。 Step S14, whether to automatically detect whether the image is normal. That is to say, for these unqualified images, it is automatically detected that the images are normal, and if so, the process proceeds to the next process, step S140. In this embodiment, it may be connected to the dispensing process, as shown in the lower right corner of FIG. 4 . If not, as shown in step S15, it is to be confirmed whether to re-inspect, that is, to re-inspect unqualified images, and the re-inspection can be performed manually. For re-inspection, as shown in step S17, check the images of abnormal positions. This step can be reviewed one by one manually, and it is to be confirmed how to deal with these unqualified images.

複檢後,進到另一詢問步驟S18,是否放行,也就是確認該疊合件9可以進行下一製程(步驟S140)。其中,複檢過程以及完成後,如步驟S16所示,輸出異常報表及儲存異常位置的影像,例如儲存到記錄暨控制裝置124。若不要複檢,如步驟S19所示,退出晶圓組件(也就是疊合件9)。 After the re-inspection, proceed to another inquiry step S18, whether to let it go, that is, to confirm that the laminated part 9 can go to the next manufacturing process (step S140). Wherein, after the re-inspection process and completion, as shown in step S16 , an abnormal report is output and an image of the abnormal location is stored, for example, stored in the recording and control device 124 . If re-inspection is not required, as shown in step S19, the wafer assembly (that is, the laminated part 9) is withdrawn.

請參閱圖8並配合圖7,點膠後檢測滲透率流程包括多個步驟如下: Please refer to Figure 8 and cooperate with Figure 7, the process of detecting permeability after dispensing includes multiple steps as follows:

步驟S20,開始,此步驟是在疊合件9(晶圓組件)點膠完成後。若不啟動點膠後檢測滲透率流程,可以將疊合件9(晶圓組件)取回,例如透過晶圓傳送機(EFEM)8。關於點膠的製程可以參考本發明的申請人的中華民國專利公告號I558470『自動微調點膠路徑的水平點膠裝置及其方法』。此外,點膠以後,可以進一步確認是否疊合件9周圍的點膠區域是否都已有膠體,此方法可以參考本發明的申請人另一件中華民國專利公告號I566841,『點膠狀況 的檢測方法及點膠狀況的檢測機構』。然後,接著才是本發明的第二流程,點膠後檢測滲透率流程。 Step S20, start, this step is after the laminate 9 (wafer assembly) is dispensed. If the post-dispensing permeability detection process is not started, the laminate 9 (wafer assembly) can be retrieved, for example via the wafer conveyor (EFEM) 8 . For the process of dispensing, please refer to the applicant's ROC Patent Publication No. I558470 "Horizontal dispensing device and method for automatically fine-tuning the dispensing path". In addition, after dispensing, it can be further confirmed whether there is glue in the dispensing area around the laminated part 9. This method can refer to another ROC patent announcement number I566841 of the applicant of the present invention, "Glue Dispensing Status" The detection method and the detection mechanism of the dispensing status". Then, it is the second process of the present invention, the process of detecting the permeability after dispensing.

檢測的第一步驟為,步驟S21,攝影鏡頭啟動及轉動承載平台(20)一圈,以針對該疊合件9進行視覺掃描。也就是說,提供一承載平台20以承載一待檢測的疊合件9,該疊合件9具有一位於該疊合件9周圍的點膠區域90。藉由攝影鏡頭(第三攝像鏡頭33)進行膠體取像步驟,透過該第一板體91擷取該點膠區域90的多個膠體影像,如上面流程,例如取得225張影像。 The first step of detection is, step S21 , the camera lens is activated and the carrying platform ( 20 ) is rotated for a circle, so as to visually scan the laminated part 9 . That is to say, a carrying platform 20 is provided to carry a laminated part 9 to be inspected, and the laminated part 9 has a dispensing area 90 around the laminated part 9 . The colloid imaging step is performed by the photographic lens (the third camera lens 33 ), and a plurality of colloid images of the glue dispensing area 90 are captured through the first plate 91 , as in the above process, for example, 225 images are obtained.

步驟S22,影像分析,具體的說,也就是,檢測晶圓組件(疊合件9)邊緣膠體滲透深度的滲透率。舉例說明,其包括下列步驟,設定門檻步驟,設定該點膠區域90的預定誤差門檻值。 Step S22 , image analysis, specifically, detecting the penetration rate of the colloid penetration depth at the edge of the wafer component (stack 9 ). For example, it includes the following steps, the threshold setting step is to set a predetermined error threshold of the glue dispensing area 90 .

一種比較方法是比較點膠前後影像之間差異。檢測每一該膠體影像中的膠體面積與該點膠區域未點膠體前的空白面積,其中該膠體面積與該空白面積的比例定義為一滲透率。最後,比較步驟,比較每一該膠體影像與該點膠區域未點膠體前的空白面積的誤差是否超過一預定誤差門檻值,若是,就發出一異常訊息。 One way to compare is to compare the difference between the before and after dispensing images. Detecting the colloid area in each colloid image and the blank area of the dispensing area before dispensing the colloid, wherein the ratio of the colloid area to the blank area is defined as a permeability. Finally, the comparison step is to compare whether the error between each colloid image and the blank area of the glue dispensing area before dispensing glue exceeds a predetermined error threshold, and if so, send an abnormal message.

舉例說明,參考圖9A及圖9B,圖9A為點膠區域90理想化的膠體滲透狀況示意圖,其中膠體G完全滲透到點膠區域90內。圖9B為舉例膠體可能滲透狀況的影像,其中膠體G並未完全充滿,略為偏向下方,導致上方有空白處。 For example, referring to FIG. 9A and FIG. 9B , FIG. 9A is a schematic diagram of an idealized colloid penetration in the dispensing area 90 , wherein the colloid G completely penetrates into the dispensing area 90 . FIG. 9B is an example of the possible penetration of the colloid, in which the colloid G is not completely filled, and is slightly biased downward, resulting in a blank space above.

關於比較點膠前後影像之間差異的作法,例如重疊圖9B於對照的圖9A,比較圖9B的膠體是否完全向左滲透到點膠區域90的內邊緣。若與圖9A有差異,可以透過電腦的影像辨識機制自動儲存該張不合格的影像(例如圖9B),並記錄其位置資訊,也就是座標。例如記錄到記錄暨控制裝置124。 Regarding the method of comparing the difference between the images before and after dispensing, for example, overlay FIG. 9B on the contrasting FIG. 9A , and compare whether the glue in FIG. 9B completely penetrates to the left to the inner edge of the dispensing area 90 . If there is a difference from Figure 9A, the unqualified image (such as Figure 9B) can be automatically stored through the computer's image recognition mechanism, and its location information, that is, the coordinates, can be recorded. For example, it is recorded to the recording and control device 124 .

另一種方法是比較多處的滲透深度的誤差值。量測膠體步驟, 判別並量測每一該些膠體影像的膠體滲透深度,其中所述膠體滲透深度是由所述第二板體92的邊緣沿著直徑的方向朝向圓心的徑向距離。最後,比較步驟,比較每一該膠體滲透深度是否小於該預定誤差門檻值,若是,就發出一異常訊息。 Another method is to compare the error values for the penetration depths at multiple locations. Measure the colloid step, Discriminating and measuring the colloid penetration depth of each of the colloid images, wherein the colloid penetration depth is the radial distance from the edge of the second plate 92 to the center of the circle along the diameter direction. Finally, the comparison step is to compare whether each colloid penetration depth is less than the predetermined error threshold, and if so, send an abnormal message.

透過電腦的影像辨識機制以分析影像,例如,可以是掃描圖9B的該膠體多個位置的膠體滲透深度,再與一預定誤差門檻值比較,也就是圖9A的理想化的膠體滲透深度,進行一比較步驟。比較每一該膠體滲透深度是否小於該預定誤差門檻值,若是,就發出一異常訊息。 The image is analyzed through the image recognition mechanism of the computer. For example, the colloid penetration depth of multiple positions of the colloid in FIG. 9B can be scanned, and then compared with a predetermined error threshold value, that is, the idealized colloid penetration depth of FIG. 9A . a comparison step. Comparing whether each colloid penetration depth is less than the predetermined error threshold, if so, sending an abnormal message.

當發出所述異常訊息時,其中處理該些不合格的影像,先是步驟S24,是否自動檢測影像正常?若是,檢測後,不再複檢,直接進到下項製程,如步驟S290所示的。若否,進入是否人工複檢的詢問步驟S25。 When the abnormal message is sent out, the unqualified images are processed first in step S24, whether to automatically detect whether the images are normal? If so, after the detection, no re-inspection is required, and the next process is directly entered, as shown in step S290. If not, enter the inquiry step S25 of whether to manually re-inspect.

關於是否人工複檢的步驟S25,若是,意即要人工複檢該些異常位置的膠體滲透影像,就進到步驟S27,檢查異常位置影像。步驟S27,具體的說,電腦直接依據異常位置的膠體滲透影像的座標資料,藉由承載平台20轉動疊合件9到異常膠體滲透影像的位置,再透過第三攝像鏡頭33再取得該處異常膠體滲透影像。步驟S271,是否手動補膠,若是,意即要手動補膠,則進入手動補膠的步驟S272。若否,意即不手動補膠,可當作檢查人員認為可以不用補膠,就進到步驟S29,詢問是否放行。步驟S29,若是,意即放行該疊合件9進行下項製程,如步驟S290所示。步驟S29,若否,不放行,就重新回到開始的S20步驟。 Regarding the step S25 of manual re-inspection, if yes, it means manual re-examination of the colloid infiltration images of the abnormal positions, then proceed to step S27 to check the abnormal position images. Step S27, specifically, the computer directly rotates the stacked part 9 to the position of the abnormal colloid infiltration image through the carrying platform 20 according to the coordinate data of the colloid infiltration image at the abnormal position, and obtains the abnormality at the location through the third camera lens 33 Colloid penetration image. Step S271, whether to manually replenish the glue, if yes, means to manually replenish the glue, then enter the step S272 of manually replenishing the glue. If not, it means that the glue is not manually replenished, and it can be regarded as that the inspector thinks that the glue can not be replenished, so it goes to step S29 and asks whether to let it go. In step S29, if yes, it means that the laminated part 9 is released for the next process, as shown in step S290. Step S29, if not, do not release, and return to the initial step S20.

其中手動補膠的步驟S272,補膠後,可以再檢測該點膠處的滲透狀況。具體的說,再轉動所述疊合件9以重新擷取已補膠後的該點膠區域90的補膠後影像,將所述補膠後影像顯示於一顯示設備(例如人機界面模組12的顯示器121)供確認。最後,等候操作者確認完成,或者重覆該補膠流程。 In step S272 of manually replenishing the glue, after the glue is replenished, the penetration condition of the glue point can be detected again. Specifically, the laminated part 9 is rotated to recapture the glue-replenishment image of the dispensing area 90 after the glue-replenishment, and the image after the glue-replenishment is displayed on a display device (such as a man-machine interface module). Display 121) of group 12 for confirmation. Finally, wait for the operator to confirm the completion, or repeat the glue replenishing process.

關於是否人工複檢的步驟S25,若否,就進到步驟S28,詢問是否自動補膠?若是,要自動補膠,則進到自動補膠的步驟S281,補膠完成後,進到步驟S29,詢問是否放行?若否,而不自動補膠,則直接進到步驟S29,詢問是否放行? Regarding the step S25 of manual re-inspection, if no, just go to step S28 and ask whether to automatically replenish the glue? If it is necessary to automatically replenish the glue, then enter the step S281 of automatic glue replenishment. After the glue replenishment is completed, proceed to step S29 and ask whether to release it? If not, without automatic glue replenishment, then directly go to step S29 to ask whether to release?

自動補膠的流程舉例說明如下,其可以包括至少下列步驟,轉動所述疊合件90到相對應的該點膠區域90到點膠裝置40。進行補膠步驟,將膠體補充到異常的該點膠區域90。自動補膠後,詢問「是否放行」疊合件9的步驟S29,若是,意即疊合件9進入下項製程;若否,再重新回到開始的S20步驟。 The process of automatic glue replenishment is illustrated as follows, which may include at least the following steps, rotating the laminated part 90 to the corresponding glue dispensing area 90 to the glue dispensing device 40 . Carry out the step of replenishing glue, and replenish the glue to the abnormal glue dispensing area 90 . After the automatic glue filling, ask "whether to release" the step S29 of the laminated part 9, if yes, it means that the laminated part 9 enters the next process; if not, return to the initial step S20.

在詢問是否人工複檢的步驟S25中,可以同時進行步驟S26,輸出異常報表及儲存異常位置影像。具體的說,可以儲存到記錄暨控制裝置124,可以是包括保存該些異常位置的膠體影像,以及所述補膠後影像。 In the step S25 of inquiring whether to manually re-inspect, step S26 can be performed at the same time to output an abnormality report and store abnormality location images. Specifically, it can be stored in the recording and control device 124 , including saving the colloid images of the abnormal positions and the post-glue images.

補充說明,本發明的疊合件的點膠品質的檢測方法,其兩個主要的流程,可以是在同一機台完成。或者,為著提高稼動率,第一流程,點膠前檢測流程(如圖4至圖5所示)可以是在一個機台,第二流程,點膠後檢測滲透率流程(如圖7至圖8所示)可以是在另一機台。換句話說,此外,本發明的疊合件的點膠品質的檢測方法也可以是只包括第二流程「點膠後檢測滲透率流程」。 As a supplementary note, the two main processes of the method for detecting the dispensing quality of laminated parts according to the present invention can be completed on the same machine. Or, in order to improve the utilization rate, the first process, the detection process before dispensing (as shown in Figure 4 to Figure 5) can be in a machine, the second process, the detection of permeability after dispensing process (as shown in Figure 7 to Figure 5) Shown in Figure 8) can be in another machine platform. In other words, in addition, the method for detecting the glue dispensing quality of the laminated part of the present invention may also only include the second process "the process of detecting the permeability after dispensing".

[實施例的有益效果] [Advantageous Effects of Embodiment]

本發明的其中一有益效果在於,本發明所提供的疊合件的點膠品質的檢測方法,其能通過點膠後檢測滲透率流程,以檢查疊合件9(也就是晶圓組件)周圍的點膠區域90。第一流程可檢查,疊合件9周圍的點膠區域90是否有因為疊合異常而不適合點膠的狀況。第二流程可檢查,疊合件9周圍的點膠區域90點膠後的膠體滲透到點膠區域90內部的狀況是否符合所預期。 One of the beneficial effects of the present invention is that the method for detecting the dispensing quality of the laminate provided by the present invention can pass through the process of detecting the permeability after dispensing to check the periphery of the laminate 9 (that is, the wafer assembly). The dispensing area 90. The first process can check whether the glue dispensing area 90 around the laminated part 9 is unsuitable for dispensing due to abnormal lamination. The second process can check whether the glue in the glue dispensing area 90 around the laminate 9 penetrates into the glue dispensing area 90 as expected.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。 The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

9:疊合件 9: Composite

90:點膠區域 90: Dispensing area

901:凹槽 901: Groove

91:第一板體 91: The first plate body

92:第二板體 92: The second board body

G:膠體 G: colloid

33:第三攝像鏡頭 33: The third camera lens

40:噴射點膠頭 40: jet dispensing head

124:記錄暨控制裝置 124: Recording and control device

D0:預定深度門檻值 D0: predetermined depth threshold

Claims (9)

一種疊合件的點膠品質的檢測方法,係應用於一待檢測的疊合件,該疊合件具有一透明的第一板體、及一疊合於該第一板體的第二板體,該疊合件周圍具有多個點膠區域,該檢測方法包括至少下列步驟:提供一承載平台以承載該疊合件;膠體取像步驟,透過該第一板體擷取每一該點膠區域的膠體影像;檢測每一該膠體影像中的膠體面積與該點膠區域未點膠體前的空白面積,其中該膠體面積與該空白面積的比例定義為一滲透率;及比較步驟,比較每一該膠體影像與該點膠區域未點膠體前的空白面積的誤差是否超過一預定誤差門檻值,若是,就發出一異常訊息。 A method for detecting the glue dispensing quality of laminated parts is applied to a laminated part to be inspected, and the laminated part has a transparent first plate body and a second plate laminated on the first plate body There are a plurality of dispensing areas around the lamination, and the detection method includes at least the following steps: providing a carrying platform to carry the lamination; a glue imaging step, capturing each point through the first plate The colloid image of the glue area; Detect the colloid area in each of the colloid images and the blank area before the dispensing area of the glue, wherein the ratio of the colloid area to the blank area is defined as a permeability; and a comparison step, comparing Whether the error between each colloid image and the blank area of the glue dispensing area before dispensing glue exceeds a predetermined error threshold, if so, send an abnormal message. 如請求項1所述的疊合件的點膠品質的檢測方法,還包括一點膠前檢測流程,包括下列步驟:在點膠前,擷取該第一板體與該第二板體的該些點膠區域的影像;量測每一個該些點膠區域的空白深度值;比對每一個該空白深度值與所述預定深度門檻值的誤差值是否在一允許範圍內;以及若該誤差值超過所述允許範圍,顯示一待確認訊息。 The method for inspecting the dispensing quality of laminated parts as described in claim 1 further includes a pre-dispensing inspection process, including the following steps: before dispensing, capture the first plate and the second plate The images of the dispensing areas; measuring the blank depth value of each of the dispensing areas; comparing each error value between the blank depth value and the predetermined depth threshold value within an allowable range; and if the If the error value exceeds the allowable range, a confirmation message is displayed. 如請求項2所述的疊合件的點膠品質的檢測方法,其中所述待確認訊息包括一是否複檢的選項。 The method for inspecting the dispensing quality of laminated parts according to claim 2, wherein the message to be confirmed includes an option of whether to re-inspect. 如請求項2所述的疊合件的點膠品質的檢測方法,其中所述誤 差值為正負20微米。 The detection method of the glue dispensing quality of laminated parts as described in claim item 2, wherein said error The difference is plus or minus 20 microns. 如請求項1所述的疊合件的點膠品質的檢測方法,其中所述第一板體為一透明玻璃,所述第二板體為一半導體晶圓,其中所述第一板體的直徑大於所述第二板體的直徑,其中每一該點膠區域內由所述第二板體的邊緣沿著直徑的方向朝向圓心的徑向距離定義為一膠體滲透深度。 The method for detecting the dispensing quality of laminated parts as described in claim 1, wherein the first plate is a transparent glass, and the second plate is a semiconductor wafer, wherein the first plate is The diameter is greater than the diameter of the second plate, wherein the radial distance from the edge of the second plate to the center of the circle along the diameter direction in each glue dispensing area is defined as a glue penetration depth. 如請求項1所述的疊合件的點膠品質的檢測方法,其中所述膠體取像步驟是透過一攝影鏡頭,所述攝影鏡頭設置於所述第一板體的下方,且朝向所述第一板體的邊緣,所述攝影鏡頭沿著一垂直於所述第一板體的方向擷取所述膠體影像,並紀錄所述膠體影像的位置座標。 The method for detecting glue dispensing quality of laminated parts as described in claim 1, wherein the colloid imaging step is through a photographic lens, and the photographic lens is arranged below the first plate and faces the On the edge of the first board, the photographic lens captures the colloidal image along a direction perpendicular to the first board, and records the position coordinates of the colloidal image. 如請求項1所述的疊合件的點膠品質的檢測方法,其中當發出所述異常訊息時,還包括補膠流程,包括至少下列步驟:轉動所述疊合件到異常的該點膠區域到點膠裝置;進行補膠步驟,將膠體補充到異常的該點膠區域;轉動所述疊合件以重新擷取已補膠後的該點膠區域的補膠後影像;將所述補膠後影像顯示於一顯示設備供確認;以及等候操作者確認完成,或者重覆該補膠流程。 The method for detecting glue dispensing quality of laminated parts as described in claim 1, wherein when the abnormal message is sent, it also includes a glue replenishing process, including at least the following steps: rotating the laminated part to the abnormal glue dispensing area to the glue dispensing device; carry out the glue replenishing step, and the glue is added to the abnormal glue dispensing area; rotate the laminate to recapture the image after glue replenishment of the glue dispensing area after the glue has been replenished; The image after glue filling is displayed on a display device for confirmation; and the operator waits for the confirmation to be completed, or repeats the glue filling process. 如請求項7所述的疊合件的點膠品質的檢測方法,還包括保存該些膠體影像,以及所述補膠後影像。 The method for detecting glue dispensing quality of laminated parts according to claim 7 further includes saving the glue images and the image after glue replenishment. 如請求項1所述的疊合件的點膠品質的檢測方法,其中所述膠體取像步驟還包括提供照明光線,所述照明光線能被膠體反射或折射。 The method for detecting glue dispensing quality of laminated parts as claimed in item 1, wherein the colloid imaging step further includes providing illuminating light, and the illuminating light can be reflected or refracted by the colloid.
TW110140244A 2021-10-29 2021-10-29 Method for examining gluing quality of overlaying member TWI797801B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110140244A TWI797801B (en) 2021-10-29 2021-10-29 Method for examining gluing quality of overlaying member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110140244A TWI797801B (en) 2021-10-29 2021-10-29 Method for examining gluing quality of overlaying member

Publications (2)

Publication Number Publication Date
TWI797801B true TWI797801B (en) 2023-04-01
TW202317276A TW202317276A (en) 2023-05-01

Family

ID=86945138

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140244A TWI797801B (en) 2021-10-29 2021-10-29 Method for examining gluing quality of overlaying member

Country Status (1)

Country Link
TW (1) TWI797801B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200724237A (en) * 2005-12-22 2007-07-01 Ind Tech Res Inst Diagnostic system for gel dispensing condition and method thereof
TW200827040A (en) * 2006-12-29 2008-07-01 Ind Tech Res Inst Real-time dispenser fault detection and classification method
CN113210217A (en) * 2021-04-26 2021-08-06 深圳市世宗自动化设备有限公司 Assembly line dispensing curing control method, device and equipment and storage medium thereof
CN113251925A (en) * 2021-05-26 2021-08-13 飓蜂科技(苏州)有限公司 Glue amount detection method and device based on area array laser

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200724237A (en) * 2005-12-22 2007-07-01 Ind Tech Res Inst Diagnostic system for gel dispensing condition and method thereof
TW200827040A (en) * 2006-12-29 2008-07-01 Ind Tech Res Inst Real-time dispenser fault detection and classification method
CN113210217A (en) * 2021-04-26 2021-08-06 深圳市世宗自动化设备有限公司 Assembly line dispensing curing control method, device and equipment and storage medium thereof
CN113251925A (en) * 2021-05-26 2021-08-13 飓蜂科技(苏州)有限公司 Glue amount detection method and device based on area array laser

Also Published As

Publication number Publication date
TW202317276A (en) 2023-05-01

Similar Documents

Publication Publication Date Title
CN102439708B (en) Method of inspecting bonding structure of substrate and bonding structure inspection apparatus
US10161881B2 (en) System and method for inspecting a wafer
US20100189339A1 (en) System and method for inspecting a wafer
CN103376259A (en) Device and method for detecting internal defects of element
CN109564172A (en) Defect detecting device, defect inspection method, chip, semiconductor chip, semiconductor device, bare die jointing machine, joint method, semiconductor making method and manufacturing method for semiconductor device
US20250290869A1 (en) Semiconductor inspection tool system and method for wafer edge inspection
KR20170025394A (en) Method for detecting glue-dispensing condition and detecting mechanism for glue-dispensing condition
US12315206B2 (en) Inspection system for edge and bevel inspection of semiconductor structures
TWI894328B (en) Methods and systems for inspecting integrated circuits based on x-rays and computer-readable non-transitory storage media
CN216261704U (en) Horizontal dispensing and detecting machine table capable of detecting colloid permeation state
EP1679504A1 (en) Appearance inspector
TWI797801B (en) Method for examining gluing quality of overlaying member
TWM606479U (en) Wafer box inspection device
US10598607B2 (en) Objective lens
KR20210059585A (en) Defect detection method for sensor package structure
CN116137233A (en) Method for detecting glue dispensing quality of laminated parts
CN112834528A (en) 3D defect detection system and method
TWM623386U (en) Horizontal dispensing and detecting machine capable of detecting glue penetration condition
TWI833534B (en) System and method for defect inspection in wafer grinding process
CN119585608A (en) Semiconductor inspection tool system and method for wafer edge inspection
CN115808427A (en) End state confirmation device
JPH10253547A (en) Board appearance inspection system
TW202514104A (en) Wafer inspection method
CN118279224A (en) Defect detection system and method for wafer grinding process
SG185301A1 (en) System and method for inspecting a wafer