TWI797801B - Method for examining gluing quality of overlaying member - Google Patents
Method for examining gluing quality of overlaying member Download PDFInfo
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- TWI797801B TWI797801B TW110140244A TW110140244A TWI797801B TW I797801 B TWI797801 B TW I797801B TW 110140244 A TW110140244 A TW 110140244A TW 110140244 A TW110140244 A TW 110140244A TW I797801 B TWI797801 B TW I797801B
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- 238000000034 method Methods 0.000 title claims abstract description 66
- 238000004026 adhesive bonding Methods 0.000 title abstract description 6
- 239000003292 glue Substances 0.000 claims abstract description 91
- 239000000084 colloidal system Substances 0.000 claims description 46
- 230000008569 process Effects 0.000 claims description 40
- 230000035515 penetration Effects 0.000 claims description 19
- 230000002159 abnormal effect Effects 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 18
- 238000007689 inspection Methods 0.000 claims description 12
- 230000035699 permeability Effects 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 5
- 238000012790 confirmation Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005429 filling process Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 30
- 238000012360 testing method Methods 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
Description
本發明涉及一種疊合件的點膠品質的檢測方法,特別是涉及一種檢測疊合件(例如是晶圓組合件)的點膠品質的方法,能檢查疊合件的點膠區域在未點膠前的狀況、以及點膠後的點膠滲透率是否符合預期的。 The invention relates to a method for detecting the glue dispensing quality of a laminate, in particular to a method for detecting the glue dispensing quality of a laminate (such as a wafer assembly), which can check whether the glue dispensing area of the laminate is not dispensing Whether the condition before glue and the dispensing penetration rate after dispensing meet expectations.
按,利用立體堆疊技術來製造三維晶片(3D IC),其中,晶片之間的堆疊(Stacking)技術非常關鍵。當兩片晶圓接合後,通常需要利用點膠機將兩片晶圓的周圍縫隙封住以進行下一步的製程。 According to, the three-dimensional chip (3D IC) is manufactured by using the three-dimensional stacking technology, and the stacking technology between the chips is very critical. After the two wafers are bonded, it is usually necessary to use a glue dispenser to seal the gap around the two wafers for the next step of the process.
接合後的兩片晶圓,可以稱為晶圓組件,晶圓組件的待膠合處位於兩片晶圓之間,其縫隙小。點膠的過程通常是將晶圓水平置放,待膠合處呈水平向外的狀態,並正向朝向晶圓組件側面的待膠合處點膠。 The bonded two wafers can be called a wafer assembly, and the joint of the wafer assembly is located between the two wafers with a small gap. The process of dispensing is usually to place the wafer horizontally, with the part to be glued horizontally outward, and to dispense glue towards the part to be glued on the side of the wafer assembly.
本案的申請人針對晶圓組件的點膠方法及裝置,已提出相關的中華民國專利,例如,中華民國專利公告號I558470『自動微調點膠路徑的水平點膠裝置及其方法』、中華民國專利公告號I566841,『點膠狀況的檢測方法及點膠狀況的檢測機構』。該些前案提供了水平點膠的方法,以及檢測晶圓組件的周圍是否都有點上膠體。 The applicant of this case has proposed related ROC patents for the dispensing method and device of wafer components, for example, ROC Patent Publication No. I558470 "Horizontal Dispensing Device and Method for Automatically Fine-tuning the Dispensing Path", and ROC Patent Bulletin No. I566841, "Detection method of dispensing status and detection mechanism of dispensing status". These prior documents provide methods for dispensing glue horizontally and detecting whether there are glue spots all around the wafer assembly.
然而,晶圓組件周圍的膠體可能無法都良好地進入兩片晶圓之間的夾縫。膠體可能只在晶圓組件邊緣的表面。 However, the glue around the wafer assembly may not all be able to get into the gap between the two wafers well. Glue may only be on the surface of the wafer assembly edge.
故,如何通過結構設計的改良,來提升晶圓組件的點膠後檢測效果,進一步檢測疊合件的點膠滲透率,以克服上述的缺陷,已成為該項技術領域所欲解決的重要課題之一。 Therefore, how to improve the inspection effect of the wafer assembly after dispensing through the improvement of the structural design, and further inspect the dispensing penetration rate of the stacked parts, so as to overcome the above-mentioned defects, has become an important issue to be solved in this technical field. one.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種疊合件的點膠品質的檢測方法,以檢測晶圓組件周圍的膠體是否良好地進入兩片晶圓之間的夾縫,達到預期滲透的深度。 The technical problem to be solved by the present invention is to provide a method for detecting the glue dispensing quality of laminated parts in view of the deficiencies in the prior art, so as to detect whether the glue around the wafer assembly enters the gap between the two wafers well and achieves the desired result. depth of penetration.
為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種疊合件的點膠品質的檢測方法,係應用於一待檢測的疊合件,該疊合件具有一透明的第一板體、及一疊合於該第一板體的第二板體,該疊合件周圍具有多個點膠區域,該檢測方法包括至少下列步驟:提供一承載平台以承載該疊合件;膠體取像步驟,透過該第一板體擷取每一該點膠區域的膠體影像;檢測每一該膠體影像中的膠體面積與該點膠區域未點膠體前的空白面積,其中該膠體面積與該空白面積的比例定義為一滲透率;以及比較步驟,比較每一該膠體影像與該點膠區域未點膠體前的空白面積的誤差是否超過一預定誤差門檻值,若是,就發出一異常訊息。 In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a method for detecting the dispensing quality of laminated parts, which is applied to a laminated part to be inspected, and the laminated part has a transparent The first plate body and a second plate body stacked on the first plate body, there are multiple dispensing areas around the stacked piece, the detection method includes at least the following steps: providing a carrying platform to carry the stacked Colloid imaging step, capture the colloid image of each of the dispensing area through the first plate body; detect the area of the colloid in each of the colloid images and the blank area before the dispensing area is not dispensed, wherein the The ratio of the colloid area to the blank area is defined as a permeability; and the comparison step is to compare whether the error of each of the colloid image and the blank area before the dispensing area exceeds a predetermined error threshold value, and if so, send An exception message.
本發明的其中一有益效果在於,本發明所提供的疊合件的點膠品質的檢測方法,其至少能檢查,疊合件周圍的點膠區域點膠後的膠體滲透到點膠區域內部的狀況是否符合所預期。 One of the beneficial effects of the present invention is that the detection method of the dispensing quality of the laminate provided by the present invention can at least check whether the glue in the dispensing area around the laminate penetrates into the interior of the dispensing area. Is the condition as expected.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.
100:點膠暨檢測機台 100: Dispensing and testing machine
10:底座 10: base
12:人機界面模組 12: Man-machine interface module
121:顯示器 121: Display
122:鍵盤 122: keyboard
123:滑鼠 123: mouse
124:記錄暨控制裝置 124: Recording and control device
20:承載平台 20: Bearing platform
31:第一攝像鏡頭 31: The first camera lens
32:第二攝像鏡頭 32: Second camera lens
33:第三攝像鏡頭 33: The third camera lens
40:噴射點膠頭 40: jet dispensing head
8:S晶圓傳送機 8:S wafer conveyor
9:疊合件 9: Composite
90:點膠區域 90: Dispensing area
901:凹槽 901: Groove
91:第一板體 91: The first plate body
92:第二板體 92: The second board body
G:膠體 G: colloid
R:機械手臂 R: mechanical arm
D0:預定深度門檻值 D0: predetermined depth threshold
D1:空白深度值 D1: blank depth value
圖1為本發明的點膠暨檢測機台及載入晶圓組件的立體圖。 FIG. 1 is a perspective view of a dispensing and inspection machine and a loading wafer assembly of the present invention.
圖2為本發明的點膠暨檢測機台的前視圖。 Fig. 2 is a front view of the dispensing and testing machine of the present invention.
圖3為本發明的點膠暨檢測機台的俯視圖。 FIG. 3 is a top view of the dispensing and testing machine of the present invention.
圖4為本發明的點膠前檢測流程的示意圖。 Fig. 4 is a schematic diagram of the detection process before dispensing of the present invention.
圖5為本發明的點膠前檢測流程的步驟流程圖。 Fig. 5 is a flow chart of the steps of the detection process before dispensing of the present invention.
圖6A為比對參考的疊合件的點膠區域(未點膠)的局部放大圖。 FIG. 6A is a partially enlarged view of the glue dispensing area (not glue dispensing) of the comparison reference laminate.
圖6B為舉例的疊合件的點膠區域(未點膠)的局部放大圖。 FIG. 6B is a partially enlarged view of the dispensing area (undispensed) of an exemplary laminate.
圖7為本發明的點膠後檢測品質的示意圖。 Fig. 7 is a schematic diagram of detecting quality after dispensing of the present invention.
圖8為本發明的點膠後檢測品質的步驟流程圖。 Fig. 8 is a flow chart of the steps of detecting the quality after dispensing of the present invention.
圖9A為比對參考的疊合件的點膠區域(已點膠)的局部放大圖。 FIG. 9A is a partial enlarged view of the dispensing area (dispensed glue) of the laminate for comparison and reference.
圖9B為舉例的疊合件的點膠區域(已點膠)的局部放大圖。 FIG. 9B is a partially enlarged view of the dispensing area (dispensed) of an exemplary laminate.
以下是通過特定的具體實施例來說明本發明所公開的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following is an illustration of the disclosed embodiments of the present invention through specific specific examples, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信 號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one signal from another Number. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.
本發明提供一種疊合件的點膠品質的檢測方法,其應用於具有點膠區域90(或稱縫隙)的疊合件9(參圖1)。其中疊合件9所要達到的狀況,不僅疊合件9的點膠區域90確實需要點上膠體,更進一步還要檢測疊合件9的點膠區域90內的膠點是否向疊合件9的內部滲透達一定的深度,以達到確定的密封效果。
The present invention provides a method for detecting glue dispensing quality of laminated parts, which is applied to
本實施例的疊合件9是一種晶圓組件,其具有一第一板體91、以及疊合於第一板體91的第二板體92。具體的說,疊合件9的第一板體91是透明玻璃載板,第二板體92是半導體晶圓。此外,第一板體91的直徑略大於第二板體92的直徑。接合後的疊合件9的周圍縫隙需要進行膠合,包括晶圓的凹槽(notch)901或平邊(Flat)。然而本發明的應用對象並不限制於此。本發明也可以應用於其他需要側面膠合的加工件。
The
如圖1至圖3所示,本發明提供一點膠暨檢測機台100以達成相關的點膠及檢測流程。點膠暨檢測機台100具有一底座10、人機界面模組12、承載平台20、多個攝像鏡頭(31、32、33)、及噴射點膠頭40。人機界面模組12包括顯示器121、鍵盤122及滑鼠123,但不限制於此。例如也可以是觸控螢幕。人機界面模組12可以設置在底座10內,或在點膠暨檢測機台100的外面。承載平台20可以轉動該疊合件9。第一攝像鏡頭31(或稱俯視鏡頭)垂直設置在承載平台20的上方,以擷取該些點膠區域90的俯視影像資訊。第二攝像鏡頭32(或側視鏡頭)設置於該疊合件9的側面,擷取該些點膠區域90側面位置的資訊。擷取影像的過程包括在承載平台20上旋轉該疊合件9一圈並且記錄於一記錄暨控制裝置124。第三攝像鏡頭33(或稱仰視鏡頭)垂直設置在承載平台20的側邊,以擷取該些點膠區域90的仰視影像資訊。多個攝像鏡頭(31、32、33)
還配置一環狀光源,以提供照明光線,所述照明光線較佳是能被膠體反射或折射。
As shown in FIGS. 1 to 3 , the present invention provides a dispensing and
本發明提供一種疊合件的點膠品質的檢測方法,其包括兩個主要的流程,第一流程,如圖4至圖5所示的點膠前檢測流程,以及第二流程,如圖7至圖8所示的,點膠後檢測滲透率流程。 The present invention provides a method for detecting the glue dispensing quality of laminated parts, which includes two main processes, the first process, the detection process before dispensing as shown in Figure 4 to Figure 5, and the second process, as shown in Figure 7 As shown in Figure 8, the process of detecting the permeability after dispensing.
如圖4至圖5所示的第一流程,點膠前檢測流程,主要目的在於,第一板體91與第二板體92的疊合後的所有點膠區域90是否具有相等的徑向距離。換句話說,第一板體91與第二板體92兩者的圓心是否對準而沒有偏移,或者說,偏移的程度是可以接受的。假設第一板體91與第二板體92兩者的圓心並沒有對準,將產生偏移的狀況。具體的說,疊合件9的圓周邊緣將產生不同的距離,其中一側的點膠區域可能太短,另一側的點膠區域可能太長。其中某些地方太短的點膠區域,點膠後的膠體滲透深度可能無法滿足密封的要求。
The first process shown in Figures 4 to 5, the pre-dispensing detection process, the main purpose is to determine whether all dispensing
請參閱圖5並配合圖4,點膠前檢測流程包括多個步驟如下:首先,步驟S10「開始」,可視為已完成下列動作。將疊合件9搬到點膠暨檢測機台100的承載平台20(參圖1至圖3)。疊合件9可以是透過晶圓傳送設備,例如機械手臂R,傳送到點膠暨檢測機台100的承載平台20上。
Please refer to FIG. 5 and FIG. 4 , the pre-dispensing detection process includes multiple steps as follows: First, step S10 "Start", which can be regarded as having completed the following actions. Move the
接著,步驟S11,啟動一攝影鏡頭及轉動承載平台一圈,以針對該疊合件9進行視覺掃描。具體的說,承載平台20轉動疊合件9,本實施例的攝影鏡頭是透過第三攝像鏡頭33(或稱仰視鏡頭)擷取該些點膠區域90的仰視影像資訊。目的是為了在點膠之前取得疊合件9的點膠區域90的位置資訊、及疊合狀況。
Next, in step S11 , a photographic lens is activated and the carrying platform is rotated for one turn, so as to visually scan the
在擷取該第一板體91與該第二板體92的該些點膠區域90的影像中,是利用朝上的第三攝像鏡頭33向上拍攝疊合件9的邊緣。第三攝像鏡頭33
設置於第一板體91的下方,且朝向第一板體91的邊緣,第三攝像鏡頭33沿著一垂直於所述第一板體91的方向擷取膠體影像,並紀錄膠體影像的位置座標。具體舉例,第三攝像鏡頭33的感應器區域,或稱視野(FOV),可以是14.1mm(長)×10.3mm(寬),其中14.1mm(長)沿著疊合件9的切線方向,其中10.3mm寬度的一半(5.15mm)落在疊合件9的垂直投影範圍內,而一半在外面,如此一次的影像可以檢測的面積為14.1mm x 5.15mm。本實施例的疊合件9每轉動3度角作為一個點膠區域90並拍攝一張影像,共可取得120張影像。然而,本發明不限制於此,每一張影像涵蓋的角度依攝像鏡頭的視野而決定,此外,也考量每一張影像的分析運算時間。原則上,每一點膠區域90的待點膠面積是相同的。此外,第三攝像鏡頭33還配置一環狀光源,以提供拍照的光源。環狀光源的光線較佳是對於膠體產生較大的折射或反射,例如以波長較短的光線,依據膠體的材料所有差異。
In capturing the images of the dispensing
步驟S12,影像分析,也就是說,針對上述取得的影像,透過電腦的影像辨識機制以分析影像。其進一步的說,也就是檢測疊合件9(也就是晶圓組件)邊緣的空白深度值是否符合預定深度門檻值。步驟S12更具體的說,其包括至少下列步驟,取得每一影像並量測每一個該些點膠區域90的空白深度值。比對每一個該空白深度值與所述預定深度門檻值的誤差值是否在一允許範圍內;若該誤差值超過所述允許範圍,顯示一待確認訊息。
Step S12, image analysis, that is to say, analyzing the image through the image recognition mechanism of the computer for the obtained image. To put it further, it is to detect whether the blank depth value at the edge of the stack 9 (that is, the wafer assembly) meets the predetermined depth threshold. More specifically, the step S12 includes at least the following steps of obtaining each image and measuring the blank depth value of each of the dispensing
舉例說明步驟S14,請參圖6A及圖6B,圖6A是疊合件9的其中一張參考的影像,第一板體91的右側為拍攝的背景,通常是模糊且較深。第二板體92略小於第一板體91。第二板體92往內為點膠區域90,其中D0為預定深度門檻值,假設為3000微米±1000微米(μm,micrometer)。依序取一張拍攝後的影像,如圖6B所示,量測點膠區域90的寬度,也就是空白深度值D1,例如為2900微米(μm,micrometer)。比較D1與D0,若是D1-D0的誤差值是否
超過一允許範圍,例如誤差允許範圍為正負100微米,2900微米-3000微米等於負100微米,位於誤差允許範圍的100微米,意即圖6B的影像所代表點膠區域90是合格的。假設,D1-D0的誤差值超過允許範圍的100微米,代表點膠區域90是不合格的。接著,可以透過電腦的影像辨識機制自動儲存該張不合格的影像(例如圖6B),並記錄其位置資訊,也就是座標。例如記錄到記錄暨控制裝置124。
To illustrate step S14, please refer to FIG. 6A and FIG. 6B. FIG. 6A is one of the reference images of the
步驟S14,是否自動檢測影像正常。也就是說,針對該些不合格的影像自動檢測影像正常,若是,就進到下一製程,步驟S140。在本實施例,可以是接到點膠製程,如圖4右下角所示意的。若否,如步驟S15所示,待確認是否複檢,也就是複檢不合格的影像,複檢可以是透過人力進行。若要複檢,如步驟S17所示,檢查異常位置的影像,此步驟可以透過人力一一點閱,待確認如何處理該些不合格的影像。 Step S14, whether to automatically detect whether the image is normal. That is to say, for these unqualified images, it is automatically detected that the images are normal, and if so, the process proceeds to the next process, step S140. In this embodiment, it may be connected to the dispensing process, as shown in the lower right corner of FIG. 4 . If not, as shown in step S15, it is to be confirmed whether to re-inspect, that is, to re-inspect unqualified images, and the re-inspection can be performed manually. For re-inspection, as shown in step S17, check the images of abnormal positions. This step can be reviewed one by one manually, and it is to be confirmed how to deal with these unqualified images.
複檢後,進到另一詢問步驟S18,是否放行,也就是確認該疊合件9可以進行下一製程(步驟S140)。其中,複檢過程以及完成後,如步驟S16所示,輸出異常報表及儲存異常位置的影像,例如儲存到記錄暨控制裝置124。若不要複檢,如步驟S19所示,退出晶圓組件(也就是疊合件9)。
After the re-inspection, proceed to another inquiry step S18, whether to let it go, that is, to confirm that the
請參閱圖8並配合圖7,點膠後檢測滲透率流程包括多個步驟如下: Please refer to Figure 8 and cooperate with Figure 7, the process of detecting permeability after dispensing includes multiple steps as follows:
步驟S20,開始,此步驟是在疊合件9(晶圓組件)點膠完成後。若不啟動點膠後檢測滲透率流程,可以將疊合件9(晶圓組件)取回,例如透過晶圓傳送機(EFEM)8。關於點膠的製程可以參考本發明的申請人的中華民國專利公告號I558470『自動微調點膠路徑的水平點膠裝置及其方法』。此外,點膠以後,可以進一步確認是否疊合件9周圍的點膠區域是否都已有膠體,此方法可以參考本發明的申請人另一件中華民國專利公告號I566841,『點膠狀況
的檢測方法及點膠狀況的檢測機構』。然後,接著才是本發明的第二流程,點膠後檢測滲透率流程。
Step S20, start, this step is after the laminate 9 (wafer assembly) is dispensed. If the post-dispensing permeability detection process is not started, the laminate 9 (wafer assembly) can be retrieved, for example via the wafer conveyor (EFEM) 8 . For the process of dispensing, please refer to the applicant's ROC Patent Publication No. I558470 "Horizontal dispensing device and method for automatically fine-tuning the dispensing path". In addition, after dispensing, it can be further confirmed whether there is glue in the dispensing area around the
檢測的第一步驟為,步驟S21,攝影鏡頭啟動及轉動承載平台(20)一圈,以針對該疊合件9進行視覺掃描。也就是說,提供一承載平台20以承載一待檢測的疊合件9,該疊合件9具有一位於該疊合件9周圍的點膠區域90。藉由攝影鏡頭(第三攝像鏡頭33)進行膠體取像步驟,透過該第一板體91擷取該點膠區域90的多個膠體影像,如上面流程,例如取得225張影像。
The first step of detection is, step S21 , the camera lens is activated and the carrying platform ( 20 ) is rotated for a circle, so as to visually scan the
步驟S22,影像分析,具體的說,也就是,檢測晶圓組件(疊合件9)邊緣膠體滲透深度的滲透率。舉例說明,其包括下列步驟,設定門檻步驟,設定該點膠區域90的預定誤差門檻值。
Step S22 , image analysis, specifically, detecting the penetration rate of the colloid penetration depth at the edge of the wafer component (stack 9 ). For example, it includes the following steps, the threshold setting step is to set a predetermined error threshold of the
一種比較方法是比較點膠前後影像之間差異。檢測每一該膠體影像中的膠體面積與該點膠區域未點膠體前的空白面積,其中該膠體面積與該空白面積的比例定義為一滲透率。最後,比較步驟,比較每一該膠體影像與該點膠區域未點膠體前的空白面積的誤差是否超過一預定誤差門檻值,若是,就發出一異常訊息。 One way to compare is to compare the difference between the before and after dispensing images. Detecting the colloid area in each colloid image and the blank area of the dispensing area before dispensing the colloid, wherein the ratio of the colloid area to the blank area is defined as a permeability. Finally, the comparison step is to compare whether the error between each colloid image and the blank area of the glue dispensing area before dispensing glue exceeds a predetermined error threshold, and if so, send an abnormal message.
舉例說明,參考圖9A及圖9B,圖9A為點膠區域90理想化的膠體滲透狀況示意圖,其中膠體G完全滲透到點膠區域90內。圖9B為舉例膠體可能滲透狀況的影像,其中膠體G並未完全充滿,略為偏向下方,導致上方有空白處。
For example, referring to FIG. 9A and FIG. 9B , FIG. 9A is a schematic diagram of an idealized colloid penetration in the dispensing
關於比較點膠前後影像之間差異的作法,例如重疊圖9B於對照的圖9A,比較圖9B的膠體是否完全向左滲透到點膠區域90的內邊緣。若與圖9A有差異,可以透過電腦的影像辨識機制自動儲存該張不合格的影像(例如圖9B),並記錄其位置資訊,也就是座標。例如記錄到記錄暨控制裝置124。
Regarding the method of comparing the difference between the images before and after dispensing, for example, overlay FIG. 9B on the contrasting FIG. 9A , and compare whether the glue in FIG. 9B completely penetrates to the left to the inner edge of the dispensing
另一種方法是比較多處的滲透深度的誤差值。量測膠體步驟,
判別並量測每一該些膠體影像的膠體滲透深度,其中所述膠體滲透深度是由所述第二板體92的邊緣沿著直徑的方向朝向圓心的徑向距離。最後,比較步驟,比較每一該膠體滲透深度是否小於該預定誤差門檻值,若是,就發出一異常訊息。
Another method is to compare the error values for the penetration depths at multiple locations. Measure the colloid step,
Discriminating and measuring the colloid penetration depth of each of the colloid images, wherein the colloid penetration depth is the radial distance from the edge of the
透過電腦的影像辨識機制以分析影像,例如,可以是掃描圖9B的該膠體多個位置的膠體滲透深度,再與一預定誤差門檻值比較,也就是圖9A的理想化的膠體滲透深度,進行一比較步驟。比較每一該膠體滲透深度是否小於該預定誤差門檻值,若是,就發出一異常訊息。 The image is analyzed through the image recognition mechanism of the computer. For example, the colloid penetration depth of multiple positions of the colloid in FIG. 9B can be scanned, and then compared with a predetermined error threshold value, that is, the idealized colloid penetration depth of FIG. 9A . a comparison step. Comparing whether each colloid penetration depth is less than the predetermined error threshold, if so, sending an abnormal message.
當發出所述異常訊息時,其中處理該些不合格的影像,先是步驟S24,是否自動檢測影像正常?若是,檢測後,不再複檢,直接進到下項製程,如步驟S290所示的。若否,進入是否人工複檢的詢問步驟S25。 When the abnormal message is sent out, the unqualified images are processed first in step S24, whether to automatically detect whether the images are normal? If so, after the detection, no re-inspection is required, and the next process is directly entered, as shown in step S290. If not, enter the inquiry step S25 of whether to manually re-inspect.
關於是否人工複檢的步驟S25,若是,意即要人工複檢該些異常位置的膠體滲透影像,就進到步驟S27,檢查異常位置影像。步驟S27,具體的說,電腦直接依據異常位置的膠體滲透影像的座標資料,藉由承載平台20轉動疊合件9到異常膠體滲透影像的位置,再透過第三攝像鏡頭33再取得該處異常膠體滲透影像。步驟S271,是否手動補膠,若是,意即要手動補膠,則進入手動補膠的步驟S272。若否,意即不手動補膠,可當作檢查人員認為可以不用補膠,就進到步驟S29,詢問是否放行。步驟S29,若是,意即放行該疊合件9進行下項製程,如步驟S290所示。步驟S29,若否,不放行,就重新回到開始的S20步驟。
Regarding the step S25 of manual re-inspection, if yes, it means manual re-examination of the colloid infiltration images of the abnormal positions, then proceed to step S27 to check the abnormal position images. Step S27, specifically, the computer directly rotates the
其中手動補膠的步驟S272,補膠後,可以再檢測該點膠處的滲透狀況。具體的說,再轉動所述疊合件9以重新擷取已補膠後的該點膠區域90的補膠後影像,將所述補膠後影像顯示於一顯示設備(例如人機界面模組12的顯示器121)供確認。最後,等候操作者確認完成,或者重覆該補膠流程。
In step S272 of manually replenishing the glue, after the glue is replenished, the penetration condition of the glue point can be detected again. Specifically, the
關於是否人工複檢的步驟S25,若否,就進到步驟S28,詢問是否自動補膠?若是,要自動補膠,則進到自動補膠的步驟S281,補膠完成後,進到步驟S29,詢問是否放行?若否,而不自動補膠,則直接進到步驟S29,詢問是否放行? Regarding the step S25 of manual re-inspection, if no, just go to step S28 and ask whether to automatically replenish the glue? If it is necessary to automatically replenish the glue, then enter the step S281 of automatic glue replenishment. After the glue replenishment is completed, proceed to step S29 and ask whether to release it? If not, without automatic glue replenishment, then directly go to step S29 to ask whether to release?
自動補膠的流程舉例說明如下,其可以包括至少下列步驟,轉動所述疊合件90到相對應的該點膠區域90到點膠裝置40。進行補膠步驟,將膠體補充到異常的該點膠區域90。自動補膠後,詢問「是否放行」疊合件9的步驟S29,若是,意即疊合件9進入下項製程;若否,再重新回到開始的S20步驟。
The process of automatic glue replenishment is illustrated as follows, which may include at least the following steps, rotating the
在詢問是否人工複檢的步驟S25中,可以同時進行步驟S26,輸出異常報表及儲存異常位置影像。具體的說,可以儲存到記錄暨控制裝置124,可以是包括保存該些異常位置的膠體影像,以及所述補膠後影像。
In the step S25 of inquiring whether to manually re-inspect, step S26 can be performed at the same time to output an abnormality report and store abnormality location images. Specifically, it can be stored in the recording and
補充說明,本發明的疊合件的點膠品質的檢測方法,其兩個主要的流程,可以是在同一機台完成。或者,為著提高稼動率,第一流程,點膠前檢測流程(如圖4至圖5所示)可以是在一個機台,第二流程,點膠後檢測滲透率流程(如圖7至圖8所示)可以是在另一機台。換句話說,此外,本發明的疊合件的點膠品質的檢測方法也可以是只包括第二流程「點膠後檢測滲透率流程」。 As a supplementary note, the two main processes of the method for detecting the dispensing quality of laminated parts according to the present invention can be completed on the same machine. Or, in order to improve the utilization rate, the first process, the detection process before dispensing (as shown in Figure 4 to Figure 5) can be in a machine, the second process, the detection of permeability after dispensing process (as shown in Figure 7 to Figure 5) Shown in Figure 8) can be in another machine platform. In other words, in addition, the method for detecting the glue dispensing quality of the laminated part of the present invention may also only include the second process "the process of detecting the permeability after dispensing".
本發明的其中一有益效果在於,本發明所提供的疊合件的點膠品質的檢測方法,其能通過點膠後檢測滲透率流程,以檢查疊合件9(也就是晶圓組件)周圍的點膠區域90。第一流程可檢查,疊合件9周圍的點膠區域90是否有因為疊合異常而不適合點膠的狀況。第二流程可檢查,疊合件9周圍的點膠區域90點膠後的膠體滲透到點膠區域90內部的狀況是否符合所預期。
One of the beneficial effects of the present invention is that the method for detecting the dispensing quality of the laminate provided by the present invention can pass through the process of detecting the permeability after dispensing to check the periphery of the laminate 9 (that is, the wafer assembly). The dispensing
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。 The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.
9:疊合件 9: Composite
90:點膠區域 90: Dispensing area
901:凹槽 901: Groove
91:第一板體 91: The first plate body
92:第二板體 92: The second board body
G:膠體 G: colloid
33:第三攝像鏡頭 33: The third camera lens
40:噴射點膠頭 40: jet dispensing head
124:記錄暨控制裝置 124: Recording and control device
D0:預定深度門檻值 D0: predetermined depth threshold
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| TW200724237A (en) * | 2005-12-22 | 2007-07-01 | Ind Tech Res Inst | Diagnostic system for gel dispensing condition and method thereof |
| TW200827040A (en) * | 2006-12-29 | 2008-07-01 | Ind Tech Res Inst | Real-time dispenser fault detection and classification method |
| CN113210217A (en) * | 2021-04-26 | 2021-08-06 | 深圳市世宗自动化设备有限公司 | Assembly line dispensing curing control method, device and equipment and storage medium thereof |
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