TWI797689B - Apparatus and method for performing internal defects inspection of an electronic component - Google Patents

Abstract

The present invention relates to an apparatus (1) and method (2) for performing internal defects inspection of an electronic component comprising of an image capturing unit (102) is arranged in a configuration whereby said electronic component (101) is within the field of view (FOV) of said image capturing unit (102); and at least one infrared (IR) light source (104, 106, 107); wherein said image capturing unit (102) and said IR light source (104, 106, 107) is positioned and tilted to an angle of 0° to 360° with reference to their respective horizontal plane (ICHP, IRHP) whereby said IR light source (104, 106, 107) is capable of illuminating at least one internal defect (108) of said electronic component (101); and said electronic component (101) is positioned to an angle of 0° with reference to its horizontal plane (ECHP).

Description

Device and method for inspecting internal defects of electronic components

The present invention relates to a device and method for inspecting internal defects of electronic components, which includes: an image capture unit, the electronic component is located in the field of view of the image capture unit; and at least one infrared light source; wherein, the The image capture unit and the infrared light source are arranged at an angle of 0 to 360 degrees with respect to their respective horizontal planes, so that the infrared light source can illuminate at least one internal defect of the electronic component, and the electronic component is placed at an angle relative to its horizontal plane The angle is 0 degrees.

Die backside chipping is a failure mechanism that occurs along the edge of the backside of the die after sawing the wafer. As a result, the back side of the die will have a rough edge caused by small nicks that physically break and come off in various places along the back side edge. This is an indirect indication that the sawing operation is stressful and may subsequently lead to grain cracking. Improper setup of the equipment may inadvertently land hard on the die and cut off a portion of it. Therefore, signs of backside chipping after wafer sawing must be addressed quickly.

Nikoonahad et al. disclosed in US5883710A a surface inspection system with high sensitivity and high throughput, which makes a focused beam incident on the surface to be inspected at a grazing angle. Relative motion is induced between the beam and the surface such that the beam scans a scan path substantially covering the entire surface, and light scattered along the path is collected for detecting anomalies. The scan path includes a plurality of arrays of rectilinear scan path segments. The focused beam illuminates the width of the With a surface area between 5-15 microns, the system is capable of inspecting more than about 40 wafers with a diameter of 150 mm (6-inch wafers), more than about 20 wafers with a diameter of 200 mm (8-inch wafers) per hour ) or more than about 10 300 mm diameter wafers (12-inch wafers). However, US5883710A is devoted to surface defect inspection, while the present invention is to detect the presence or absence of internal defects in a semiconductor device. Furthermore, the present invention is capable of identifying and distinguishing between surface defects and internal defects.

Another example is that John S. Batchelder discloses a system and method for inspecting the surface of a semiconductor wafer in US4740708A. The systems and methods are directed to determining that surfaces have been sufficiently cleaned of particulate contamination during the fabrication of integrated circuits. The wafer is advanced in a first direction and optically scanned in a second direction perpendicular to the first direction to record the intensity of light normally reflected from the wafer surface according to the position on the scan line. High intensity reflections indicate a smooth surface suitable for examining particles within it by the integrating hemisphere method and multiple light sensors. Weak reflections indicate areas of relief and patterning that are not conducive to particle inspection on the wafer surface. The second scan is offset laterally to compensate for wafer motion so that the same lines as the first scan are rescanned. During the second scan, the light sensors in the integrating sphere are switched on and off at the appropriate checkpoint locations determined from the first scan. This method is also limited by US5883710A because the system and method cannot inspect and detect the presence of internal defects such as microcracks.

Therefore, if there is a device and method for inspecting internal defects of electronic components that can inspect the electronic components by using infrared illumination projections at different angles, and allow the image capture unit to face the electronic components at different angles, it will help to alleviate these defects. The image capture unit and the infrared light source are arranged at an angle of 0 to 360 degrees relative to the respective horizontal planes.

Therefore, the main object of the present invention is to provide an apparatus and method for inspecting internal defects of electronic components, which are capable of distinguishing surface defects from internal defects.

Another object of the present invention is to provide an apparatus and method for inspecting internal defects of an electronic component capable of producing a significant contrast between defective and non-defective areas for image processing.

Another object of the present invention is to provide a device and method for inspecting internal defects of electronic components, which can reduce the rate of overkill.

Still another object of the present invention is to provide an apparatus and method for inspecting internal defects of electronic components, wherein the method can improve throughput.

Other further objects of the invention will become apparent upon understanding the following detailed description of the invention or by using the invention in practice.

The following is a detailed description according to a preferred embodiment of the present invention: a device for inspecting internal defects of electronic components, including: an image capture unit, the electronic component is located in the field of view of the image capture unit; and at least one infrared ray A light source; characterized in that: the image capture unit and the infrared light source are placed at an angle of 0 to 360 degrees with respect to the respective horizontal planes, so that the infrared light source can illuminate at least one internal defect of the electronic component; and the The angle between an electronic component and its horizontal plane is 0 degrees.

In another embodiment of the present invention, there is provided: a method for inspecting internal defects of electronic components, comprising the following steps: (i) transferring the electronic component from a first station to an inspection station; (ii) inspecting the first side of the electronic component through an image capture unit with at least one infrared light source; (iii) the image The capturing unit and the infrared light source are rotated along their respective horizontal planes, and after the infrared light source and the image capturing unit are rotated, the second side of the electronic component is inspected through the image capturing unit; (iv) repeating Step (iii) rotating the image capture unit and the infrared (IR) light source along their respective horizontal planes, and inspecting the electron through the image capture unit after the infrared light source and image capture unit are rotated the second side of the component to inspect the four sides of the electronic component; and (v) deliver the electronic component to a second station; it is characterized in that: the image capture unit and the infrared light source are placed relative to their respective The horizontal plane is inclined at an angle of 0 to 360 degrees, so that the infrared light source can illuminate at least one internal defect of the electronic component caused by the cutting and assembly process; and the angle between the electronic component and the horizontal plane is 0 degrees.

1: device

101: Electronic components

102: Image capture unit

104: Front side infrared light source

106: side infrared light source

107: side infrared light source

110: Back side infrared light source

112: Front side infrared light source

114: first surface

116: second surface

118: Mirror

2: method

3A: Image samples

301: Chipping on the back of the grain

BSHP: horizontal plane

IRHP: horizontal plane

ICHP: horizontal plane

X°: tilt angle

Y°: tilt angle

Other aspects of the present invention and its advantages will be appreciated after studying the detailed description in conjunction with the accompanying drawings, wherein: FIG. One surface, and the infrared light source is positioned on the side wall of the electronic component; Figure 1-B shows a schematic diagram of the present invention, wherein the image capture unit and the infrared light source face the first surface of the electronic component, and the infrared light source is located On the other side wall of the component; Figure 1-C shows another schematic view of the present invention, wherein the image capture unit and the infrared light source face the first surface of the electronic component, and a mirror faces the second surface of the electronic component; Figure 1-D shows the present invention Another schematic diagram, wherein the image capture unit is embedded with an embedded infrared light source facing the first surface of the electronic component, and a mirror faces the second surface of the electronic component; FIG. 1-E shows another embodiment of the present invention A schematic diagram, wherein the image capture unit and the infrared light source face the first surface of the electronic component, one of the infrared light sources is located at the front view of the electronic component, and the other two infrared light sources are respectively located on the left side wall and the right side wall of the electronic component , and a mirror faces the second surface of the electronic component; FIG. 2 shows a flow chart of the method for detecting internal defects in the electronic component of the present invention; FIG. 3-A shows a schematic diagram of the present invention for detecting surface defects in the electronic component.

FIG. 3-B shows another schematic diagram of detecting surface defects of electronic components according to the present invention; and FIG. 3-C shows a schematic diagram of high-magnification microscopic images of detecting surface defects of electronic components according to the present invention.

In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures and/or elements have not been described in detail so as not to obscure the present invention.

The invention will be more clearly understood from the following description of the embodiments, which are given by way of example only with reference to the accompanying drawings, which are not drawn to scale.

As used in this disclosure and in the claims appended hereto, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise or indicates otherwise.

Throughout the disclosure and claims of this specification, the word "comprise" and variations of that word, such as "comprises" and "comprising", means "including but not limited to" and is not intended to exclude, for example, other elements , an integer or a step. "Exemplary" means "example" and is not intended to convey an indication of a preferred or ideal embodiment, "such as" is not used in a limiting sense, but rather for purposes of explanation.

The present invention claims a device (1) for inspecting internal defects of an electronic component (101), comprising an image capture unit (102), and the electronic component (101) is located within the field of view of the image capture unit (102), The image capture unit (102) faces the first surface (114) of the electronic component (101) to capture the image of the internal defect (108). In addition, the device further comprises at least one infrared light source (104, 106, 107), wherein the image capture unit (102) and the infrared light source (104, 106, 107) are arranged relative to respective horizontal planes (ICHP, IRHP) tilt angle from 0 to 360 degrees (such as the tilt angle (X°) of the image capture unit (102) relative to the horizontal plane (ICHP) and the tilt of the infrared light source (104, 106, 107) relative to the horizontal plane (IRHP) angle (Y°)), so that the infrared light source (104, 106, 107) can illuminate at least one internal defect (108) of the electronic component (101). By having this arrangement, different layers of the electronic component (101) can be inspected and inspected. The electronic component (101) is placed at an angle of 0 degrees to its horizontal plane (ECHP). Please refer to FIG. 1-A to FIG. 1-E for different placements and configurations of the image capture unit (102) and the infrared light sources (104, 106, 107).

1-A and 1-B, which are schematic diagrams for detecting internal defects (108), such as microcracks or internal cracks, in electronic components (101). The image capture unit (102) and the infrared light source (104, 106, 107) face the first surface (114) of the electronic component (101), wherein the image capture unit (102) and the infrared light source ( 104, 106, 107) are arranged to be inclined at an angle of 0 to 360 degrees relative to the respective horizontal plane (ICHP, IRHP), so that the infrared light source (104, 106, 107) can illuminate at least one of the electronic components (101) Internal defects (108). The angle between the electronic component (101) and its horizontal plane (ECHP) is 0 degrees. The infrared light source (104, 106, 107) includes a front infrared light source (104), a side infrared light source (106, 107) or a combination thereof. The side infrared light source (106, 107) can be located on the right side of the electronic component (101), as shown in Figure 1-A, or can be located on the left side of the electronic component (101), as shown in Figure 1-B. The first surface (114) refers to the backside of the electronic component (101), and the second surface (116) includes the bump side of the electronic component (101).

Referring to FIG. 1-C, it is a schematic diagram of another arrangement of the image capture unit (102) and the front infrared light source (104) together with a reflector (118) and at least one rear infrared light source (110). Under this configuration, the image capture unit (102) and the front infrared light source (104) face the first surface (114) of the electronic component (101) and are placed relative to the respective horizontal planes (ICHP, IRHP) Tilt angle from 0 to 360 degrees. In addition, the reflector (118) and the backside infrared light source (110) face the second surface (116) of the electronic component (101), and the reflector (118) is parallel to the electronic component (101) and located on the electronic component (101). Between the element (101) and the backside infrared light source (110). The backside infrared light source (110) is inclined from 0 to 360 degrees relative to its horizontal plane (BSHP). The mirror (118) acts as a noise filtering tool to obtain better quality images for infrared inspection processing. Alternatively, an embedded front infrared light source (112) is embedded in the In the image capture unit (102), the image capture unit (102) and the embedded front infrared light source (112) work together as a single unit, as shown in FIG. 1-D.

Referring to Fig. 1-E, it is a schematic diagram of another configuration of the present invention. A front side infrared light source (104) and an image capture unit (102) face the first surface (114) of the electronic component (101), and a reflector (118) faces the second surface of the electronic component (101) (116). In addition, one side infrared light source (106) is located on the right side of the electronic component (101), and the other side infrared light source (107) is located on the left side of the electronic component (101). The front infrared light source (104), the image capturing unit (102) and the side infrared light sources (106, 107) are arranged at an angle of 0 to 360 degrees relative to the respective horizontal plane (ICHP, IRHP).

Referring to Fig. 2, it shows a method (2) of the present invention for inspecting internal defects of an electronic component (101). (i) transfer the electronic component (101) from a first station to an inspection station (step 201); (ii) the image capture unit (102) is then combined with at least one infrared light source (104, 106, 107) checking the first side of the electronic component (101) together (step 203); (iii) rotating the image capture unit (102) and the infrared light source (104, 106, 107) along their respective horizontal planes, and After the infrared light source (104, 106, 107) and the image capture unit (102) rotate, inspect the second side of the electronic component (101) through the image capture unit (102) (step 205); repeat Step (iii), that is, rotating the image capture unit (102) and the infrared light source (104, 106, 107) along their respective horizontal planes, and rotating the infrared light source (104, 106, 107) and the image After the capture unit (102) is rotated, inspect the second side of the electronic component (101) through the image capture unit (102) to check the four sides of the electronic component (101) (step 207); and (v ) transfer the electronic component (101) to a second station (step 209). The image capture unit (102) and the infrared light source (104, 106, 107) are placed relative to The respective horizontal planes (ICHP, IRHP) are inclined at an angle of 0 to 360 degrees, whereby the infrared light source (104, 106, 107) is able to illuminate at least one internal defect (108) of the electronic component (101), and the electronic component ( 101) is placed at an angle of 0 degrees to its horizontal plane (ECHP). Internal defects (108) are caused by the cutting and assembly process. The infrared light source (104, 106, 107) includes a front infrared light source (104), a side infrared light source (106, 107) or a combination thereof.

In addition, before (i) transferring the electronic component (101) from the first station to the inspection station (step 201), the method (2) further includes picking up the electronic component (101) by a pick-and-place module and then placing The step of placing the electronic component (101) at the inspection station for internal defect inspection. This first station may be a pick and place station, a laser marking station, a testing station, or the like. This second station includes reels, pallets, visual inspection stations, and the like. The step of filtering noise of the electronic component (101 ) through a mirror (118) is optionally included in the method (2).

Referring to Fig. 3-A, it is an image sample (3A) of the present invention when surface defects are detected using the device (1) and the above-mentioned configuration. The image shows a darker contrast to the upper white line, which represents a surface defect, ie, chipped backside of the die (301). Figure 3-B presents another image sample of the present invention detecting surface defects, while Figure 3-C shows a high magnification microscopic image that does not produce a darker contrast on the upper white line. As shown with reference to Figures 3-A and 3-B, the image samples produced by the device (1) are capable of producing significant contrast for image processing and subsequently distinguishing between surface and internal defects. Therefore, the false kill rate of the electronic component (101) can be reduced.

1: device

101: Electronic components

102: Image capture unit

106: side infrared light source

114: first surface

116: second surface

IRHP: horizontal plane

ICHP: horizontal plane

X°: tilt angle

Y°: tilt angle

Claims (10)

A device (1) for inspecting internal defects of an electronic component (101), comprising: an image capture unit (102), the electronic component (101) is located within the field of view of the image capture unit (102), the electronic The element (101) includes a first surface (114) and a second surface (116); and at least one infrared light source (104, 106, 107); it is characterized in that: the device (1) also includes a reflector (118 ), the mirror (118) faces the second surface (116) of the electronic component (101) and is parallel to the electronic component (101); the image capture unit (102) and the infrared light source (104, 106 , 107) are placed at an angle of 0 to 360 degrees inclined to the respective horizontal plane (ICHP, IRHP), so that the infrared light source (104, 106, 107) can illuminate at least one internal defect (108) of the electronic component (101) ); and the electronic component (101) is placed at an angle of 0 degrees to its horizontal plane (ECHP). The device (1) for inspecting internal defects of electronic components (101) according to claim 1, wherein the infrared light source (104, 106, 107) includes a front side infrared light source (104), a side infrared light source (106, 107) or its combination. The device (1) for inspecting internal defects of electronic components (101) as described in claim 1, wherein the device (1) further includes at least one backside infrared light source (110), and the backside infrared light source (110) is arranged as Inclined at an angle of 0 to 360 degrees relative to its horizontal plane (BSHP). The device (1) for inspecting internal defects of electronic components (101) as described in claim 1 or 2, wherein the image capture unit (102) includes an embedded front infrared light source (112) or an external front infrared light source ( 104). The device (1) for inspecting internal defects of an electronic component (101) according to claim 1, wherein the first surface (114) of the electronic component (101) includes the back surface of the electronic component (101), and the electronic component The second surface (116) of (101) includes the bump side of the electronic component (101). A method (2) for inspecting internal defects of an electronic component (101), comprising the steps of: (i) transferring the electronic component (101) from a first station to an inspection station; (ii) through an image capture unit (102) inspecting the first side of the electronic component (101) with at least one infrared light source (104, 106, 107); (iii) the image capture unit (102) and the infrared light source (104, 106, 107) rotate along their respective horizontal planes, and inspect the electronic component ( 101) on the second side; repeat the step (iii) to check the four sides of the electronic component (101); and (v) deliver the electronic component (101) to a second station; it is characterized in that: the method (2) It also includes the step of filtering the noise of the electronic component (101) through the reflector (118); the image capture unit (102) and the infrared light source (104, 106, 107) are arranged relative to The horizontal plane (ICHP, IRHP) is inclined at an angle of 0 to 360 degrees, so that the infrared light source (104, 106, 107) can illuminate at least one internal defect (108) of the electronic component (101), which is caused by cutting caused by the assembly process; and The angle between the electronic component (101) and its horizontal plane (ECHP) is 0 degrees. The method (2) for inspecting internal defects of an electronic component (101) according to claim 6, wherein the method (2) further includes picking up the electronic component (101) through a pick-and-place module before the step (i) and This is followed by the step of placing the electronic component (101) at the inspection station for internal defect inspection. The method (2) for inspecting internal defects of an electronic component (101) as claimed in Claim 6, wherein the first station includes a pick-and-place station, a laser marking station or a testing station. The method (2) for inspecting internal defects of an electronic component (101) as claimed in claim 6, wherein the second station includes a reel, tray or visual inspection station. The method (2) for inspecting internal defects of an electronic component (101) as claimed in item 6, wherein the infrared light source (104, 106, 107) includes a front side infrared light source (104), a side infrared light source (106, 107) or its combination.

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