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TWI796335B - 卡盤板、具有該卡盤板的卡盤結構物及具有卡盤結構物的焊接裝置 - Google Patents

卡盤板、具有該卡盤板的卡盤結構物及具有卡盤結構物的焊接裝置 Download PDF

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Publication number
TWI796335B
TWI796335B TW107118330A TW107118330A TWI796335B TW I796335 B TWI796335 B TW I796335B TW 107118330 A TW107118330 A TW 107118330A TW 107118330 A TW107118330 A TW 107118330A TW I796335 B TWI796335 B TW I796335B
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TW
Taiwan
Prior art keywords
vacuum
plate
chuck
wafer
heating
Prior art date
Application number
TW107118330A
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English (en)
Chinese (zh)
Other versions
TW201919146A (zh
Inventor
南成龍
鄭仁榮
Original Assignee
南韓商美科陶瓷科技有限公司
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Publication of TW201919146A publication Critical patent/TW201919146A/zh
Application granted granted Critical
Publication of TWI796335B publication Critical patent/TWI796335B/zh

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    • H10P72/78—
    • H10P72/00—
    • H10P72/0432—
    • H10P72/70—
    • H10P72/74—
    • H10P72/76—
    • H10P72/7606—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Pencils And Projecting And Retracting Systems Therefor, And Multi-System Writing Instruments (AREA)
  • Adornments (AREA)
TW107118330A 2017-11-09 2018-05-29 卡盤板、具有該卡盤板的卡盤結構物及具有卡盤結構物的焊接裝置 TWI796335B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
??10-2017-0148537 2017-11-09
KR1020170148537A KR102454462B1 (ko) 2017-11-09 2017-11-09 척 플레이트, 상기 척 플레이트를 갖는 척 구조물 및 척 구조물을 갖는 본딩 장치
KR10-2017-0148537 2017-11-09

Publications (2)

Publication Number Publication Date
TW201919146A TW201919146A (zh) 2019-05-16
TWI796335B true TWI796335B (zh) 2023-03-21

Family

ID=66437854

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107118330A TWI796335B (zh) 2017-11-09 2018-05-29 卡盤板、具有該卡盤板的卡盤結構物及具有卡盤結構物的焊接裝置

Country Status (5)

Country Link
KR (1) KR102454462B1 (fr)
CN (1) CN111344855B (fr)
SG (1) SG11202004112PA (fr)
TW (1) TWI796335B (fr)
WO (1) WO2019093609A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102498914B1 (ko) * 2020-12-08 2023-02-13 주식회사 미코세라믹스 본딩 헤드 및 이를 갖는 본딩 장치
CN112563185B (zh) * 2021-02-20 2021-06-08 北京中硅泰克精密技术有限公司 静电卡盘及半导体加工设备
CN114407482A (zh) * 2021-12-07 2022-04-29 南方科技大学 一种用于低维层状材料快速转移的多真空吸附孔位加热台
CN114393468B (zh) * 2021-12-29 2023-03-10 江苏威森美微电子有限公司 一种半导体晶圆磨边加工用磨边机
CN115332129B (zh) * 2022-10-17 2023-02-21 宁波润华全芯微电子设备有限公司 一种晶圆增粘装置
CN115513115A (zh) * 2022-10-31 2022-12-23 上海华力微电子有限公司 真空吸盘装置及半导体工艺设备
WO2025021372A1 (fr) * 2023-07-25 2025-01-30 Asml Netherlands B.V. Porte-substrat
CN116666321B (zh) * 2023-07-25 2023-10-27 天津中科晶禾电子科技有限责任公司 一种温度保持装置
KR102747865B1 (ko) * 2023-11-22 2024-12-31 주식회사 파인솔루션 히터 장착형 웨이퍼 진공척

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW416117B (en) * 1997-03-06 2000-12-21 Applied Materials Inc Monocrystalline ceramic electrostatic chuck
TW200733295A (en) * 2006-02-21 2007-09-01 Sumitomo Electric Industries Wafer holder, and wafer prober provided therewith
TW201036099A (en) * 2009-03-31 2010-10-01 Psk Inc Substrate treating apparatus and method
TW201711118A (zh) * 2015-09-08 2017-03-16 東芝股份有限公司 半導體裝置之製造方法及製造裝置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
JP2001267403A (ja) * 2000-03-21 2001-09-28 Nhk Spring Co Ltd 半導体ウェハの加熱／冷却装置
JP2005279788A (ja) * 2004-03-26 2005-10-13 Ibiden Co Ltd 研削・研磨用真空チャック
KR101369437B1 (ko) * 2007-08-20 2014-03-04 세메스 주식회사 기판 가열 장치
US9022392B2 (en) * 2012-08-31 2015-05-05 United Microelectronics Corporation Chuck and semiconductor process using the same
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
KR101543864B1 (ko) * 2013-11-13 2015-08-11 세메스 주식회사 본딩 헤드 및 이를 포함하는 다이 본딩 장치
KR101593557B1 (ko) * 2014-03-25 2016-02-16 한국생산기술연구원 하이브리드 정전척 및 그 제조방법
KR101593833B1 (ko) * 2014-10-17 2016-02-12 세메스 주식회사 기판 히팅 유닛 및 이를 포함하는 다이 본딩 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW416117B (en) * 1997-03-06 2000-12-21 Applied Materials Inc Monocrystalline ceramic electrostatic chuck
TW200733295A (en) * 2006-02-21 2007-09-01 Sumitomo Electric Industries Wafer holder, and wafer prober provided therewith
TW201036099A (en) * 2009-03-31 2010-10-01 Psk Inc Substrate treating apparatus and method
TW201711118A (zh) * 2015-09-08 2017-03-16 東芝股份有限公司 半導體裝置之製造方法及製造裝置

Also Published As

Publication number Publication date
CN111344855B (zh) 2024-06-11
SG11202004112PA (en) 2020-06-29
KR102454462B1 (ko) 2022-10-14
TW201919146A (zh) 2019-05-16
WO2019093609A1 (fr) 2019-05-16
KR20190052802A (ko) 2019-05-17
CN111344855A (zh) 2020-06-26

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