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TWI795162B - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
TWI795162B
TWI795162B TW111100472A TW111100472A TWI795162B TW I795162 B TWI795162 B TW I795162B TW 111100472 A TW111100472 A TW 111100472A TW 111100472 A TW111100472 A TW 111100472A TW I795162 B TWI795162 B TW I795162B
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light
emitting
shielding layer
secondary lens
light emitting
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TW111100472A
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Chinese (zh)
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TW202328782A (en
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張裕政
黃郁明
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達運精密工業股份有限公司
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Abstract

A light emitting device includes a secondary lens, a substrate, a light emitting unit and a shading layer. The secondary lens includes a light emitting surface and a bottom surface opposite to the light emitting surface. The light emitting surface and the bottom surface define a first thickness therebetween. The secondary lens has a through hole. The through hole communicates with the light emitting surface and the bottom surface. The substrate is disposed on the bottom surface and covers the through hole. The light emitting unit is disposed on the substrate and is at least partially located inside the through hole. The shading layer is disposed on the light emitting surface and covers the through hole. A shortest vertical distance of the shading layer relative to the bottom surface is equal to the first thickness.

Description

發光元件Light emitting element

本發明是關於一種發光元件。The invention relates to a light emitting element.

在現有的平面顯示裝置中,液晶模組需要搭配背光模組所提供的面光源以讓液晶顯示裝置顯示清楚的影像。基本上,現有的背光模組可以區分為側入光式(edge-lite)以及直下式(direct)兩種,其中直下式背光模組所提供的面光源亮度較均勻,又可以提供區域點亮的功能,因此一直被廣為運用在家用及商用之顯示裝置。而且,區域調光技術的中高階液晶顯示裝置近來更被廣泛應用,這種中高階液晶顯示裝置可以將影像對比提高至接近有機發光二極體顯示裝置的影像對比,是液晶顯示裝置目前的發展趨勢之一。In the existing flat panel display device, the liquid crystal module needs to cooperate with the surface light source provided by the backlight module so that the liquid crystal display device can display clear images. Basically, the existing backlight modules can be divided into two types: edge-lite and direct. Among them, the direct-lit backlight module provides a more uniform surface light source brightness and can provide area lighting. function, so it has been widely used in household and commercial display devices. Moreover, mid-to-high-end liquid crystal display devices with local dimming technology have been widely used recently. This mid-to-high-end liquid crystal display device can improve the image contrast to that close to that of organic light-emitting diode display devices, which is the current development of liquid crystal display devices. one of the trends.

然而,在上述液晶顯示裝置所用的直下式背光模組中,例如是發光二極體(Light-Emitting Diode, LED)的發光元件需要分布在液晶面板後方。現有技術中的直下式背光模組還會設置透鏡於發光二極體以及液晶面板之間,同時還需要額外的混光空間,因此顯示裝置的體積難以降低。換句話說,由於直下式背光模組需要的光程(Optical Distance, OD)較長,再加上發光元件本身以及透鏡的體積,導致顯示裝置的厚度無法降低。因此,如何進一步維持面光源的均勻度並降低顯示裝置的厚度,無疑是業界相當關注的重要課題。However, in the above-mentioned direct-lit backlight module used in the liquid crystal display device, light-emitting elements such as light-emitting diodes (Light-Emitting Diode, LED) need to be distributed behind the liquid crystal panel. The direct-lit backlight module in the prior art also arranges a lens between the light-emitting diode and the liquid crystal panel, and also requires an additional light mixing space, so it is difficult to reduce the size of the display device. In other words, due to the longer optical distance (Optical Distance, OD) required by the direct-lit backlight module, and the volume of the light-emitting element itself and the lens, the thickness of the display device cannot be reduced. Therefore, how to further maintain the uniformity of the surface light source and reduce the thickness of the display device is undoubtedly an important issue that the industry pays close attention to.

本發明之目的之一在於提供一種發光元件,其提供的亮度具有良好的均勻性。One of the objectives of the present invention is to provide a light-emitting element that provides good uniformity in brightness.

根據本發明的一實施方式,一種發光元件包含二次透鏡、基板、發光單元以及遮光層。二次透鏡包含相對之出光面以及底面,出光面與底面之間定義第一厚度,二次透鏡具有穿孔,穿孔連通出光面與底面。基板設置於底面並覆蓋穿孔。發光單元設置於基板並至少部分位於穿孔內。遮光層設置於出光面並覆蓋穿孔,遮光層相對底面之最短垂直距離相同於第一厚度。According to an embodiment of the present invention, a light emitting element includes a secondary lens, a substrate, a light emitting unit, and a light shielding layer. The secondary lens includes an opposite light-emitting surface and a bottom surface, a first thickness is defined between the light-emitting surface and the bottom surface, the secondary lens has a perforation, and the perforation connects the light-emitting surface and the bottom surface. The substrate is arranged on the bottom surface and covers the through hole. The light emitting unit is disposed on the substrate and at least partially located in the through hole. The light-shielding layer is arranged on the light-emitting surface and covers the perforation, and the shortest vertical distance between the light-shielding layer and the bottom surface is the same as the first thickness.

在本發明一或多個實施方式中,上述之發光單元具有若干高度,此高度小於第一厚度之1.5倍而大於50微米。In one or more embodiments of the present invention, the above-mentioned light-emitting unit has a certain height, which is less than 1.5 times the first thickness and greater than 50 microns.

在本發明一或多個實施方式中,上述之遮光層具有第二厚度,第二厚度為常數。In one or more embodiments of the present invention, the above-mentioned light-shielding layer has a second thickness, and the second thickness is constant.

在本發明一或多個實施方式中,上述之發光單元包含發光晶片以及封裝膠。發光晶片設置於基板。封裝膠覆蓋發光晶片並至少部分位於發光晶片與遮光層之間,發光晶片至少部分位於封裝膠與基板之間。In one or more embodiments of the present invention, the above-mentioned light-emitting unit includes a light-emitting chip and encapsulant. The light emitting chip is arranged on the substrate. The encapsulation adhesive covers the light-emitting chip and is at least partially located between the light-emitting chip and the light-shielding layer, and the light-emitting chip is at least partially located between the encapsulation adhesive and the substrate.

在本發明一或多個實施方式中,上述之發光單元與二次透鏡彼此分隔。In one or more embodiments of the present invention, the above-mentioned light emitting unit and the secondary lens are separated from each other.

在本發明一或多個實施方式中,上述之封裝膠具有第一寬度,二次透鏡具有第二寬度,第二寬度相對第一寬度之比例範圍為5倍與10倍之間。In one or more embodiments of the present invention, the above-mentioned encapsulant has a first width, the secondary lens has a second width, and the ratio of the second width to the first width ranges from 5 times to 10 times.

在本發明一或多個實施方式中,上述之遮光層為軟性材質。In one or more embodiments of the present invention, the above-mentioned light-shielding layer is made of soft material.

在本發明一或多個實施方式中,上述之二次透鏡包含透鏡主體以及反射層。出光面位於透鏡主體。反射層設置於透鏡主體遠離出光面之一側,底面位於反射層遠離透鏡主體之一側。In one or more embodiments of the present invention, the above-mentioned secondary lens includes a lens body and a reflective layer. The light emitting surface is located on the lens body. The reflection layer is arranged on the side of the lens body away from the light-emitting surface, and the bottom surface is located on the side of the reflection layer away from the lens body.

在本發明一或多個實施方式中,上述之反射層為反射塗層。In one or more embodiments of the present invention, the aforementioned reflective layer is a reflective coating.

在本發明一或多個實施方式中,上述之反射層為反射片結構。In one or more embodiments of the present invention, the above-mentioned reflective layer is a reflective sheet structure.

本發明上述實施方式至少具有以下優點:The foregoing embodiments of the present invention have at least the following advantages:

(1)由於發光元件僅包含單一層的遮光層,且遮光層的第二厚度為常數,因此,藉由簡單容易地設定遮光層的穿透率,使用者便可準確地控制發光元件通過遮光層所射出光線的亮度,有利於使發光元件提供的亮度具有良好的均勻性。(1) Since the light-emitting element only includes a single layer of light-shielding layer, and the second thickness of the light-shielding layer is constant, by simply and easily setting the transmittance of the light-shielding layer, the user can accurately control the light-emitting element to pass through the light-shielding layer The brightness of the light emitted by the layer is beneficial to make the brightness provided by the light-emitting element have good uniformity.

(2)由於遮光層不位於二次透鏡的穿孔內,且遮光層只要設置於二次透鏡的出光面便可,因此發光元件的製程簡單容易,有利於降低製作成本,同時也能有效提升發光元件的良率。(2) Since the light-shielding layer is not located in the perforation of the secondary lens, and the light-shielding layer only needs to be placed on the light-emitting surface of the secondary lens, the manufacturing process of the light-emitting element is simple and easy, which is beneficial to reduce the production cost, and can also effectively improve the light emission. component yield.

(3)由於二次透鏡的第二寬度相對發光單元的第一寬度之比例範圍為5倍與10倍之間,因此,發光元件自出光面提供的亮度具有良好的均勻性。(3) Since the ratio of the second width of the secondary lens to the first width of the light-emitting unit is between 5 times and 10 times, the brightness provided by the light-emitting element from the light-emitting surface has good uniformity.

以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之,而在所有圖式中,相同的標號將用於表示相同或相似的元件。且若實施上為可能,不同實施例的特徵係可以交互應用。Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some commonly used structures and elements will be shown in a simple schematic way in the drawings, and in all the drawings, the same reference numerals will be used to represent the same or similar elements . And if possible in practice, the features of different embodiments can be used interchangeably.

除非另有定義,本文所使用的所有詞彙(包括技術和科學術語)具有其通常的意涵,其意涵係能夠被熟悉此領域者所理解。更進一步的說,上述之詞彙在普遍常用之字典中之定義,在本說明書的內容中應被解讀為與本發明相關領域一致的意涵。除非有特別明確定義,這些詞彙將不被解釋為理想化的或過於正式的意涵。Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings that can be understood by those skilled in the art. Furthermore, the definitions of the above-mentioned words in the commonly used dictionaries should be interpreted in the content of this specification as meanings consistent with the relevant fields of the present invention. Unless specifically defined, these terms are not to be interpreted in an idealized or overly formal sense.

請參照第1~2圖。第1圖為繪示依照本發明一實施方式之發光元件100的立體示意圖。第2圖為繪示第1圖之範圍A的局部放大示意圖,其中遮光層140被省略。在本實施方式中,如第1~2圖所示,發光元件100包含二次透鏡110、發光單元130以及遮光層140。二次透鏡110包含出光面111,且二次透鏡110具有穿孔P,穿孔P連通出光面111。發光單元130至少部分位於二次透鏡110的穿孔P內,而遮光層140根據實際狀況可為軟性材質或硬性材質,並設置於二次透鏡110的出光面111且覆蓋穿孔P。Please refer to Figures 1 and 2. FIG. 1 is a schematic perspective view showing a light emitting device 100 according to an embodiment of the present invention. FIG. 2 is a partially enlarged schematic diagram showing the area A in FIG. 1 , where the light-shielding layer 140 is omitted. In this embodiment, as shown in FIGS. 1 to 2 , the light emitting element 100 includes a secondary lens 110 , a light emitting unit 130 , and a light shielding layer 140 . The secondary lens 110 includes a light-emitting surface 111 , and the secondary lens 110 has a perforation P, and the perforation P communicates with the light-emitting surface 111 . The light emitting unit 130 is at least partly located in the perforation P of the secondary lens 110 , and the light-shielding layer 140 can be made of soft material or hard material according to the actual situation, and is disposed on the light-emitting surface 111 of the secondary lens 110 and covers the perforation P.

具體而言,如第2圖所示,二次透鏡110包含內表面113,內表面113鄰接出光面111,且圍繞而定義穿孔P。根據實際狀況,二次透鏡110的內表面113可為光滑表面、粗糙表面或是帶有微結構的表面。當發光元件100運作時,發光單元130會朝向二次透鏡110的內表面113及遮光層140(請見第1、3~4圖)射出光線。朝向內表面113射出的光線,會通過內表面113而進入二次透鏡110內。朝向遮光層140射出的光線,除了部分會穿越遮光層140外,其餘部分則會受到遮光層140的反射,繼而亦通過內表面113而進入二次透鏡110內。進一步而言,進入二次透鏡110內的光線,會通過出光面111而從二次透鏡110射出。Specifically, as shown in FIG. 2 , the secondary lens 110 includes an inner surface 113 , the inner surface 113 is adjacent to the light-emitting surface 111 , and defines a through hole P around it. According to actual conditions, the inner surface 113 of the secondary lens 110 can be a smooth surface, a rough surface or a surface with microstructures. When the light-emitting element 100 is in operation, the light-emitting unit 130 emits light toward the inner surface 113 of the secondary lens 110 and the light-shielding layer 140 (see FIGS. 1 , 3-4 ). The light emitted toward the inner surface 113 enters the secondary lens 110 through the inner surface 113 . Except for part of the light emitted towards the light shielding layer 140 passing through the light shielding layer 140 , the rest is reflected by the light shielding layer 140 , and then enters into the secondary lens 110 through the inner surface 113 . Furthermore, the light entering the secondary lens 110 will pass through the light-emitting surface 111 and exit the secondary lens 110 .

請參照第3~4圖。第3圖為繪示第1圖沿線段B-B的剖面示意圖。第4圖為繪示第3圖之範圍C的局部放大示意圖。在本實施方式中,如第3~4圖所示,二次透鏡110更包含底面112,底面112與出光面111相對,且出光面111與底面112之間定義第一厚度TK1,亦即二次透鏡110的厚度。再者,發光元件100更包含基板120,基板120設置於二次透鏡110的底面112並覆蓋穿孔P,亦即穿孔P位於遮光層140、二次透鏡110的內表面113及基板120之間,而發光單元130設置於基板120並位於穿孔P內。值得注意的是,遮光層140相對底面112之最短垂直距離DS相同於二次透鏡110的第一厚度TK1。換句話說,在本實施方式中,遮光層140朝向二次透鏡110的一面與二次透鏡110的出光面111共平面,亦即遮光層140位於二次透鏡110的穿孔P外而不位於穿孔P內。Please refer to Figures 3 and 4. Fig. 3 is a schematic cross-sectional view along line B-B in Fig. 1 . FIG. 4 is a partially enlarged schematic diagram showing the area C in FIG. 3 . In this embodiment, as shown in Figures 3 to 4, the secondary lens 110 further includes a bottom surface 112, the bottom surface 112 is opposite to the light-emitting surface 111, and a first thickness TK1 is defined between the light-emitting surface 111 and the bottom surface 112, that is, two The thickness of the secondary lens 110. Moreover, the light-emitting element 100 further includes a substrate 120, the substrate 120 is disposed on the bottom surface 112 of the secondary lens 110 and covers the perforation P, that is, the perforation P is located between the light shielding layer 140, the inner surface 113 of the secondary lens 110 and the substrate 120, The light emitting unit 130 is disposed on the substrate 120 and located in the through hole P. As shown in FIG. It should be noted that the shortest vertical distance DS of the light shielding layer 140 relative to the bottom surface 112 is the same as the first thickness TK1 of the secondary lens 110 . In other words, in this embodiment, the side of the light-shielding layer 140 facing the secondary lens 110 is coplanar with the light-emitting surface 111 of the secondary lens 110 , that is, the light-shielding layer 140 is located outside the perforation P of the secondary lens 110 but not outside the perforation P. Inside P.

在本實施方式中,如第4圖所示,發光單元130具有高度H,而發光單元130的高度H大於50微米。再者,舉例而言,如第4圖所示,發光單元130的高度H小於出光面111與底面112之間的第一厚度TK1,因此發光單元130與遮光層140彼此分隔,亦即發光單元130不會接觸遮光層140。在其他實施方式中,發光單元130的高度H可相同於出光面111與底面112之間的第一厚度TK1,使得發光單元130與遮光層140彼此接觸。再者,如第4圖所示,發光單元130與二次透鏡110的內表面113彼此分隔,亦即發光單元130不會接觸二次透鏡110。In this embodiment, as shown in FIG. 4 , the light emitting unit 130 has a height H, and the height H of the light emitting unit 130 is greater than 50 micrometers. Furthermore, for example, as shown in FIG. 4, the height H of the light-emitting unit 130 is smaller than the first thickness TK1 between the light-emitting surface 111 and the bottom surface 112, so the light-emitting unit 130 and the light-shielding layer 140 are separated from each other, that is, the light-emitting unit 130 does not touch the light-shielding layer 140 . In other embodiments, the height H of the light emitting unit 130 may be the same as the first thickness TK1 between the light emitting surface 111 and the bottom surface 112 , so that the light emitting unit 130 and the light shielding layer 140 are in contact with each other. Furthermore, as shown in FIG. 4 , the light emitting unit 130 is separated from the inner surface 113 of the secondary lens 110 , that is, the light emitting unit 130 does not contact the secondary lens 110 .

由於遮光層140不位於二次透鏡110的穿孔P內,且遮光層140只要設置於二次透鏡110的出光面111便可,因此發光元件100的製程簡單容易,有利於降低製作成本,同時也能有效提升發光元件100的良率。Since the light-shielding layer 140 is not located in the perforation P of the secondary lens 110, and the light-shielding layer 140 only needs to be disposed on the light-emitting surface 111 of the secondary lens 110, the manufacturing process of the light-emitting element 100 is simple and easy, which is beneficial to reduce the production cost, and also The yield rate of the light emitting element 100 can be effectively improved.

另外,如第4圖所示,遮光層140具有第二厚度TK2。在本實施方式中,第二厚度TK2為常數,亦即遮光層140的第二厚度TK2不會變化而具有單一的數值。由於發光元件100僅包含單一層的遮光層140,且遮光層140的第二厚度TK2為常數,因此,藉由簡單容易地設定遮光層140的穿透率,使用者便可準確地控制發光元件100通過遮光層140所射出光線的亮度,有利於使發光元件100提供的亮度具有良好的均勻性。舉例而言,遮光層140的穿透率範圍為20%與80%之間,較佳地為40%與55%之間,但本發明並不以此為限。In addition, as shown in FIG. 4 , the light shielding layer 140 has a second thickness TK2. In this embodiment, the second thickness TK2 is constant, that is, the second thickness TK2 of the light shielding layer 140 does not change and has a single value. Since the light-emitting element 100 only includes a single layer of light-shielding layer 140, and the second thickness TK2 of the light-shielding layer 140 is constant, the user can accurately control the light-emitting element by simply and easily setting the transmittance of the light-shielding layer 140. The brightness of the light emitted by the 100 through the light-shielding layer 140 is beneficial to make the brightness provided by the light-emitting element 100 have good uniformity. For example, the transmittance range of the light shielding layer 140 is between 20% and 80%, preferably between 40% and 55%, but the present invention is not limited thereto.

另一方面,舉例而言,如第2圖所示,發光單元130具有方柱體的外形。在其他實施方式中,根據實際狀況,發光單元130的外形則可為圓柱體或其他多角柱體。On the other hand, for example, as shown in FIG. 2 , the light emitting unit 130 has a shape of a square cylinder. In other embodiments, according to actual conditions, the shape of the light emitting unit 130 may be a cylinder or other polygonal prisms.

再者,在本實施方式中,如第1、3~4圖所示,二次透鏡110包含透鏡主體114以及反射層115。出光面111位於透鏡主體114,而反射層115設置於透鏡主體114遠離出光面111之一側,底面112位於反射層115遠離透鏡主體114之一側。在實務的應用中,反射層115可為反射塗層或是反射片結構,而反射層115反射光線的方式可為鏡面式反射或擴散式反射。Furthermore, in this embodiment, as shown in FIGS. 1 , 3 and 4 , the secondary lens 110 includes a lens body 114 and a reflective layer 115 . The light emitting surface 111 is located on the lens body 114 , the reflective layer 115 is disposed on a side of the lens body 114 away from the light emitting surface 111 , and the bottom surface 112 is located on a side of the reflective layer 115 away from the lens main body 114 . In practical applications, the reflective layer 115 can be a reflective coating or a reflective sheet structure, and the light reflection method of the reflective layer 115 can be specular reflection or diffuse reflection.

另外,在實務的應用中,透鏡主體114的材質例如包括聚碳酸酯(Polycarbonate, PC)或聚甲基丙烯酸甲酯(poly(methyl methacrylate), PMMA),但本發明並不以此為限。在其他實施方式中,根據實際狀況,透鏡主體114的材質可包括其他透光材料。In addition, in practical application, the material of the lens body 114 includes, for example, polycarbonate (PC) or poly(methyl methacrylate), PMMA), but the present invention is not limited thereto. In other implementations, according to actual conditions, the material of the lens body 114 may include other transparent materials.

具體而言,如第3圖所示,當發光元件100運作時,發光單元130朝向內表面113射出光線L1,而光線L1通過內表面113而進入二次透鏡110的透鏡主體114內。同時,發光單元130朝向遮光層140射出光線L2,部分的光線L2會穿越遮光層140而成為光線L3,光線L2的其餘部分則會受到遮光層140的反射而成為光線L4,光線L4繼而亦通過內表面113而進入二次透鏡110的透鏡主體114內。進入透鏡主體114內的光線L1及光線L4,會受到反射層115及出光面111(當光線L1,L4相對出光面111的入射角較大時)的反射而在透鏡主體114內傳遞,最後再從二次透鏡110的出光面111射出而成為光線L5。應了解到,光線L5從出光面111射出的位置,可以遠離二次透鏡110的內表面113,因此發光元件100自出光面111提供的亮度具有良好的均勻性。而且,在本實施方式中,由於發光元件100僅包含單一層的遮光層140,因此使用者能簡單容易地藉由調整遮光層140的穿透率而讓光線L3及光線L5的亮度相若,進一步使發光元件100所提供的亮度具有良好的均勻性。Specifically, as shown in FIG. 3 , when the light-emitting element 100 operates, the light-emitting unit 130 emits light L1 toward the inner surface 113 , and the light L1 enters the lens body 114 of the secondary lens 110 through the inner surface 113 . At the same time, the light emitting unit 130 emits light L2 toward the light-shielding layer 140, part of the light L2 will pass through the light-shielding layer 140 to become light L3, and the rest of the light L2 will be reflected by the light-shielding layer 140 to become light L4, and the light L4 will then pass through The inner surface 113 enters into the lens body 114 of the secondary lens 110 . The light L1 and light L4 entering the lens main body 114 will be reflected by the reflective layer 115 and the light-emitting surface 111 (when the incident angles of the light rays L1 and L4 relative to the light-emitting surface 111 are relatively large) and transmitted in the lens main body 114, and finally The light is emitted from the light emitting surface 111 of the secondary lens 110 to become light L5. It should be understood that the position where light L5 emerges from the light-emitting surface 111 may be far away from the inner surface 113 of the secondary lens 110 , so the brightness provided by the light-emitting element 100 from the light-emitting surface 111 has good uniformity. Moreover, in this embodiment, since the light-emitting element 100 only includes a single layer of light-shielding layer 140, the user can simply and easily adjust the transmittance of the light-shielding layer 140 to make the brightness of light L3 and light L5 similar. Further, the brightness provided by the light emitting element 100 has good uniformity.

在實務的應用中,為提升光線L5從出光面111射出的出光效果,二次透鏡110的出光面111可為粗糙表面或是帶有微結構的表面。舉例而言,出光面111上的微結構可為圍繞穿孔P的同心圓凹凸結構、不規則分布的雷射網點、規則分布的雷射網點或是沿著某一方向排列的微結構,但本發明並不以此為限。In practical applications, in order to improve the light emitting effect of the light L5 emitted from the light emitting surface 111 , the light emitting surface 111 of the secondary lens 110 may be a rough surface or a surface with microstructures. For example, the microstructure on the light-emitting surface 111 can be a concentric concavo-convex structure surrounding the perforation P, irregularly distributed laser dots, regularly distributed laser dots, or microstructures arranged along a certain direction, but this The invention is not limited thereto.

進一步而言,如第3圖所示,發光單元130具有第一寬度W1,二次透鏡110則具有第二寬度W2。如上所述,由於光線L5從出光面111射出的位置可以遠離二次透鏡110的內表面113,以使發光元件100自出光面111提供的亮度具有良好的均勻性,較佳地,二次透鏡110的第二寬度W2相對發光單元130的第一寬度W1之比例範圍為5倍與10倍之間。例如,二次透鏡110的第二寬度W2相對發光單元130的第一寬度W1之比例範圍,可為5倍、6倍、7倍、8倍、9倍或10倍等。舉例而言,當發光單元130的外形為長方形柱體時,則發光單元130的最大寬度被視為第一寬度W1。Further, as shown in FIG. 3 , the light emitting unit 130 has a first width W1, and the secondary lens 110 has a second width W2. As mentioned above, since the position where light L5 emerges from the light-emitting surface 111 can be far away from the inner surface 113 of the secondary lens 110, so that the brightness provided by the light-emitting element 100 from the light-emitting surface 111 has good uniformity, preferably, the secondary lens The ratio of the second width W2 of 110 to the first width W1 of the light emitting unit 130 ranges from 5 times to 10 times. For example, the ratio range of the second width W2 of the secondary lens 110 to the first width W1 of the light emitting unit 130 may be 5 times, 6 times, 7 times, 8 times, 9 times or 10 times. For example, when the shape of the light emitting unit 130 is a rectangular cylinder, the maximum width of the light emitting unit 130 is regarded as the first width W1.

請參照第5圖。第5圖為繪示依照本發明另一實施方式之發光元件100的局部放大示意圖。在本實施方式中,如第5圖所示,發光單元130包含發光晶片131以及封裝膠132。發光晶片131設置於基板120,封裝膠132覆蓋發光晶片131並至少部分位於發光晶片131與遮光層140之間,而發光晶片131則至少部分位於封裝膠132與基板120之間。因此,從發光晶片131射出的光線,會穿越封裝膠132而射向遮光層140及二次透鏡110的內表面113。在本實施方式中,發光單元130的第一寬度W1為封裝膠132的寬度。Please refer to Figure 5. FIG. 5 is a partially enlarged schematic diagram illustrating a light emitting device 100 according to another embodiment of the present invention. In this embodiment, as shown in FIG. 5 , the light emitting unit 130 includes a light emitting chip 131 and an encapsulant 132 . The light-emitting chip 131 is disposed on the substrate 120 , the encapsulant 132 covers the light-emitting chip 131 and is at least partially located between the light-emitting chip 131 and the light-shielding layer 140 , and the light-emitting chip 131 is at least partially located between the encapsulant 132 and the substrate 120 . Therefore, the light emitted from the light-emitting chip 131 passes through the encapsulant 132 and is directed toward the light-shielding layer 140 and the inner surface 113 of the secondary lens 110 . In this embodiment, the first width W1 of the light emitting unit 130 is the width of the encapsulant 132 .

在實務的應用中,發光晶片131例如包括發光二極體晶片,如覆晶式(flip chip)發光二極體晶片,但本發明並不以此為限。在其他實施方式中,根據實際狀況,發光晶片131可包括其他種類的固態光源。另一方面,封裝膠132例如包括透光樹脂以及螢光粉(phosphor),其中螢光粉是用以提供波長轉換的功能,但本發明並不以此為限。In practical applications, the light emitting chip 131 includes, for example, a light emitting diode chip, such as a flip chip (flip chip) light emitting diode chip, but the present invention is not limited thereto. In other implementations, according to actual conditions, the light emitting chip 131 may include other types of solid-state light sources. On the other hand, the encapsulant 132 includes, for example, light-transmitting resin and phosphor, wherein the phosphor is used to provide the function of wavelength conversion, but the present invention is not limited thereto.

請參照第6圖。第6圖為繪示依照本發明再一實施方式之發光元件100的局部放大示意圖。在本實施方式中,如第6圖所示,發光單元130至少部分位於二次透鏡110的穿孔P內,且發光單元130的高度H大於出光面111與底面112之間的第一厚度TK1而小於第一厚度TK1之1.5倍。也就是說,發光單元130凸出於二次透鏡110。如上所述,由於遮光層140可為軟性材質,因此遮光層140能覆蓋凸出於二次透鏡110的發光單元130並同時設置於二次透鏡110的出光面111上。遮光層140接觸出光面111的部分與底面112之間定義最短垂直距離DS,因此最短垂直距離DS相同於二次透鏡110的第一厚度TK1,而遮光層140位於二次透鏡110的穿孔P外而不位於穿孔P內。在本實施方式中,遮光層140的第二厚度TK2亦為常數,即遮光層140的第二厚度TK2不會變化而具有單一的數值。Please refer to Figure 6. FIG. 6 is a partially enlarged schematic view of a light emitting device 100 according to still another embodiment of the present invention. In this embodiment, as shown in FIG. 6, the light-emitting unit 130 is at least partially located in the through hole P of the secondary lens 110, and the height H of the light-emitting unit 130 is greater than the first thickness TK1 between the light-emitting surface 111 and the bottom surface 112. Less than 1.5 times of the first thickness TK1. That is, the light emitting unit 130 protrudes from the secondary lens 110 . As mentioned above, since the light-shielding layer 140 can be made of a soft material, the light-shielding layer 140 can cover the light-emitting unit 130 protruding from the secondary lens 110 and be disposed on the light-emitting surface 111 of the secondary lens 110 at the same time. The shortest vertical distance DS is defined between the part of the light-shielding layer 140 contacting the light-emitting surface 111 and the bottom surface 112, so the shortest vertical distance DS is the same as the first thickness TK1 of the secondary lens 110, and the light-shielding layer 140 is located outside the perforation P of the secondary lens 110 And not in the perforation P. In this embodiment, the second thickness TK2 of the light shielding layer 140 is also constant, that is, the second thickness TK2 of the light shielding layer 140 does not change and has a single value.

綜上所述,本發明上述實施方式所揭露的技術方案至少具有以下優點:In summary, the technical solutions disclosed in the above embodiments of the present invention have at least the following advantages:

(1)由於發光元件僅包含單一層的遮光層,且遮光層的第二厚度為常數,因此,藉由簡單容易地設定遮光層的穿透率,使用者便可準確地控制發光元件通過遮光層所射出光線的亮度,有利於使發光元件提供的亮度具有良好的均勻性。(1) Since the light-emitting element only includes a single layer of light-shielding layer, and the second thickness of the light-shielding layer is constant, by simply and easily setting the transmittance of the light-shielding layer, the user can accurately control the light-emitting element to pass through the light-shielding layer The brightness of the light emitted by the layer is beneficial to make the brightness provided by the light-emitting element have good uniformity.

(2)由於遮光層不位於二次透鏡的穿孔內,且遮光層只要設置於二次透鏡的出光面便可,因此發光元件的製程簡單容易,有利於降低製作成本,同時也能有效提升發光元件的良率。(2) Since the light-shielding layer is not located in the perforation of the secondary lens, and the light-shielding layer only needs to be placed on the light-emitting surface of the secondary lens, the manufacturing process of the light-emitting element is simple and easy, which is beneficial to reduce the production cost, and can also effectively improve the light emission. component yield.

(3)由於二次透鏡的第二寬度相對發光單元的第一寬度之比例範圍為5倍與10倍之間,因此,發光元件自出光面提供的亮度具有良好的均勻性。(3) Since the ratio of the second width of the secondary lens to the first width of the light-emitting unit is between 5 times and 10 times, the brightness provided by the light-emitting element from the light-emitting surface has good uniformity.

雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Anyone skilled in this art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be defined by the appended patent application scope.

100:發光元件 110:二次透鏡 111:出光面 112:底面 113:內表面 114:透鏡主體 115:反射層 120:基板 130:發光單元 131:發光晶片 132:封裝膠 140:遮光層 A:範圍 B-B:線段 C:範圍 DS:最短垂直距離 H:高度 L1,L2,L3,L4,L5:光線 P:穿孔 TK1:第一厚度 TK2:第二厚度 W1:第一寬度 W2:第二寬度 100: light emitting element 110: secondary lens 111: light emitting surface 112: bottom surface 113: inner surface 114: Lens body 115: reflective layer 120: Substrate 130: Lighting unit 131: Light emitting chip 132: Packaging glue 140: shading layer A: Range B-B: line segment C: range DS: shortest vertical distance H: height L1, L2, L3, L4, L5: Rays P: perforation TK1: first thickness TK2: second thickness W1: first width W2: second width

第1圖為繪示依照本發明一實施方式之發光元件的立體示意圖。 第2圖為繪示第1圖之範圍A的局部放大示意圖,其中遮光層被省略。 第3圖為繪示第1圖沿線段B-B的剖面示意圖。 第4圖為繪示第3圖之範圍C的局部放大示意圖。 第5圖為繪示依照本發明另一實施方式之發光元件的局部放大示意圖。 第6圖為繪示依照本發明再一實施方式之發光元件的局部放大示意圖。 FIG. 1 is a schematic perspective view showing a light emitting device according to an embodiment of the present invention. Fig. 2 is a partially enlarged schematic diagram showing the area A in Fig. 1, in which the light-shielding layer is omitted. Fig. 3 is a schematic cross-sectional view along line B-B in Fig. 1 . FIG. 4 is a partially enlarged schematic diagram showing the area C in FIG. 3 . FIG. 5 is a partially enlarged schematic view showing a light emitting device according to another embodiment of the present invention. FIG. 6 is a partially enlarged schematic diagram showing a light emitting device according to still another embodiment of the present invention.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

100:發光元件 100: light emitting element

110:二次透鏡 110: secondary lens

111:出光面 111: light emitting surface

112:底面 112: bottom surface

113:內表面 113: inner surface

114:透鏡主體 114: Lens body

115:反射層 115: reflective layer

120:基板 120: Substrate

130:發光單元 130: Lighting unit

140:遮光層 140: shading layer

C:範圍 C: range

DS:最短垂直距離 DS: shortest vertical distance

H:高度 H: height

P:穿孔 P: perforation

TK1:第一厚度 TK1: first thickness

TK2:第二厚度 TK2: second thickness

Claims (9)

一種發光元件,包含:一二次透鏡,包含相對之一出光面以及一底面,該出光面與該底面之間定義一第一厚度,該二次透鏡具有一穿孔,該穿孔連通該出光面與該底面;一基板,設置於該底面並覆蓋該穿孔;一發光單元,至少部分位於該穿孔內,該發光單元包含:一發光晶片,設置於該基板;以及一封裝膠,覆蓋該發光晶片,該發光晶片至少部分位於該封裝膠與該基板之間;以及一遮光層,設置於該出光面並覆蓋該穿孔,該遮光層相對該底面之一最短垂直距離相同於該第一厚度,該封裝膠至少部分位於該發光晶片與該遮光層之間,且該封裝膠與該遮光層彼此分隔。 A light-emitting element, comprising: a secondary lens, including an opposite light-emitting surface and a bottom surface, a first thickness is defined between the light-emitting surface and the bottom surface, the secondary lens has a perforation, and the perforation communicates the light-emitting surface and the bottom surface The bottom surface; a substrate, arranged on the bottom surface and covering the through hole; a light-emitting unit, at least partially located in the through hole, the light-emitting unit includes: a light-emitting chip, arranged on the substrate; and a packaging glue, covering the light-emitting chip, The light-emitting chip is at least partially located between the encapsulant and the substrate; and a light-shielding layer is arranged on the light-emitting surface and covers the through hole, and the shortest vertical distance of the light-shielding layer relative to the bottom surface is the same as the first thickness. The glue is at least partly located between the light-emitting chip and the light-shielding layer, and the packaging glue and the light-shielding layer are separated from each other. 如請求項1所述之發光元件,其中該發光單元具有一高度,該高度小於該第一厚度之1.5倍而大於50微米。 The light-emitting device according to claim 1, wherein the light-emitting unit has a height which is less than 1.5 times the first thickness and greater than 50 microns. 如請求項1所述之發光元件,其中該遮光層具有一第二厚度,該第二厚度為常數。 The light-emitting device according to claim 1, wherein the light-shielding layer has a second thickness, and the second thickness is constant. 如請求項1所述之發光元件,其中該發光單元與該二次透鏡彼此分隔。 The light emitting device according to claim 1, wherein the light emitting unit and the secondary lens are separated from each other. 如請求項1所述之發光元件,其中該發光單元具有一第一寬度,該二次透鏡具有一第二寬度,該第二寬度相對該第一寬度之比例範圍為5倍與10倍之間。 The light-emitting element according to claim 1, wherein the light-emitting unit has a first width, the secondary lens has a second width, and the ratio of the second width to the first width is between 5 times and 10 times . 如請求項1所述之發光元件,其中該遮光層為軟性材質。 The light-emitting device according to claim 1, wherein the light-shielding layer is made of soft material. 如請求項1所述之發光元件,其中該二次透鏡包含:一透鏡主體,該出光面位於該透鏡主體;以及一反射層,設置於該透鏡主體遠離該出光面之一側,該底面位於該反射層遠離該透鏡主體之一側。 The light-emitting element according to claim 1, wherein the secondary lens comprises: a lens body, the light-emitting surface is located on the lens body; and a reflective layer is arranged on the side of the lens body away from the light-emitting surface, and the bottom surface is located on the lens body. The reflective layer is away from one side of the lens body. 如請求項7所述之發光元件,其中該反射層為反射塗層。 The light-emitting device according to claim 7, wherein the reflective layer is a reflective coating. 如請求項7所述之發光元件,其中該反射層為反射片結構。 The light-emitting device according to claim 7, wherein the reflective layer is a reflective sheet structure.
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