TWI794980B - Rack temperature controlling method and system - Google Patents

Abstract

A rack temperature controlling method includes performing the following operations through a controller: obtaining a rack temperature data, calculating a temperature variation according to the rack temperature data, calculating a temperature error according to the temperature variation and a reference temperature, and calculating a target speed according to the temperature error, and adjusting a speed of a fan to the target speed. A rack temperature controlling system including a thermometer and a controller is further provided. The thermometer measures and outputs a rack temperature data. The controller receives the rack temperature data, and calculates a temperature variation according to the rack temperature data. The controller further calculates a temperature error according to the temperature variation and a reference temperature, calculates a target speed according to the temperature error, and adjusts a speed of a fan to the target speed.

Description

Cabinet temperature control method and system

The invention relates to a cabinet temperature control method and system.

After the general server room is built, due to the inherent structural design, it is difficult to achieve complete cold and heat isolation, so it is easy to generate local hot spots (local hot spots) in specific places during the operation of the server room. For example, the temperature at the air inlet of a certain cabinet in the computer room or a certain server in the cabinet is too high, thus causing a local hot spot in the temperature of the cabinet/server system. Take Figure 1 as an example, the white (unfilled) arrows in the figure are cold air flow, while the gray arrows are hot air flow. Usually, the cause of local hot spots is insufficient airflow at the air inlet of the cabinet. The pressure Pc will be smaller than the hot aisle pressure Ph, so that the hot air from the air outlet of the third server S3 flows back to the air inlet. Under such circulation, a local hot spot HS will be formed at the air inlet of the third server S3, which is hot air recirculation.

When the server dissipates heat through the fan, the operation of the fan will cause a partial negative pressure at the air inlet of the server, and such negative pressure can easily make the hot air from the air outlet of the server flow back, making the cabinet Air intake temperature is too high. When the flow rate of the air inlet of the cabinet is insufficient, the pressure of the cold aisle (that is, the side where the server receives the fan airflow) is lower than the pressure of the hot aisle (that is, the side of the air outlet of the server), so that the hot air from the air outlet will flow back to the air intake of the cabinet At the mouth, such a circulation will generate a local hot spot there, which is called hot air recirculation.

The solution to hot air backflow includes adopting a raised floor RF structure, and increasing the speed of the blower (blower) of the computer room air conditioner (CRAC) in the computer room to strengthen the flow circulation in the computer room. As shown in Figures 2a and 2b, Figure 2a is a top view of a plurality of cabinets, and Figure 2b is a side view of two of the cabinets. The reason for the hot spots in cabinets C2 and C9 may be configuration problems in the equipment room (such as structural configuration, wiring interference, etc.), resulting in excessive resistance to airflow to cabinets C2 and C9. That is, while the hot spots in cabinets C2 and C9 may not be eliminated despite the continuous increase in blower speed through the raised floor and computer room air conditioning unit CRAC, other cabinets (such as cabinets C1, C3 to C8, and C10 to C12) may not be able to eliminate the hot spots. May be overcooled due to increased blower speed.

The way to solve the hot air backflow can also be to use active ventilation raised floor RF design. As shown in Figures 3a and 3b, by installing a fan F under the raised floor RF, more cool air can be sent to the servers/racks that generate hot spots. However, the fan control method is complex, usually based on the hottest state of high load (that is, the worst case), and the fan F of the active ventilation raised floor RF is controlled at the maximum speed, which may easily cause excessive operation of the cooling system and increase the Necessary electricity expenses.

In view of the above, the present invention provides a cabinet temperature control method and system to meet the above requirements.

A cabinet temperature control method according to an embodiment of the present invention includes performing the following operations through a controller: obtaining a cabinet temperature data; calculating a temperature variation according to the cabinet temperature data; calculating a temperature variation according to the temperature variation and a reference temperature an error temperature; and calculating a target fan speed according to the error temperature, and adjusting a fan speed to the target fan speed.

A cabinet temperature control system according to an embodiment of the present invention includes: a temperature measuring instrument for measuring and outputting temperature data of a cabinet; and a controller connected to the temperature measuring instrument in a signal transmission manner, the The controller receives the cabinet temperature data, and calculates a temperature variation according to the cabinet temperature data, wherein the controller further calculates an error temperature based on the temperature variation and a reference temperature, so as to calculate a target fan speed according to the error temperature, and Adjust the speed of a fan to the target fan speed.

To sum up, according to the rack temperature control method shown in one or more embodiments of the present invention, the intake air temperature of each server on the rack can be maintained at an ideal temperature by feeding back rack data. Moreover, in a computer room where multiple cabinets are placed, through the cabinet temperature control method shown in the present invention, the controller does not need to regulate the speed of all the fans in the computer room, but can only regulate the fan speed of the cabinets with hot spots. Efficiently control the fan speed and reduce the power consumption of the computer room cooling system. In addition, this case can effectively prevent hot spots on the cabinet by locally enhancing the air flow.

The above description of the disclosure and the following description of the implementation are used to demonstrate and explain the spirit and principle of the present invention, and provide a further explanation of the patent application scope of the present invention.

The detailed features and advantages of the present invention are described in detail below in the implementation mode, and its content is enough to make any person familiar with the related art understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of the patent application and the drawings , anyone skilled in the art can easily understand the purpose and advantages of the present invention. The following examples are to further describe the concept of the present invention in detail, but not to limit the scope of the present invention in any way.

Please refer to FIG. 4 . FIG. 4 is a cabinet temperature control system according to an embodiment of the present invention. The cabinet temperature control system of the present invention includes a temperature measuring device 10 and a controller 20 . The temperature measuring instrument 10 is connected to the controller 20 through signal transmission. That is, the temperature measuring meter 10 may be electrically connected to the controller 20 , but the temperature measuring meter 10 may also be connected to the controller 20 in a wireless communication manner. In addition, the controller 20 can be connected to a fan F in a signal-transmittable manner, so as to control the rotation speed of the fan F based on the measurement result of the temperature measuring device 10 . The controller 20 in this case may be a microcontroller or a proportional-integral-derivative (PID) controller, and the present invention does not limit the type of the controller 20 .

The temperature measuring device 10 of the present invention is arranged at the air inlet of the cabinet, preferably at the air inlet of each server corresponding to the cabinet, so as to measure the inlet temperature at the air inlet. Specifically, the temperature measuring instrument 10 of the present invention may include a first temperature measuring instrument 101, a second temperature measuring instrument 102, a third temperature measuring instrument 103 and a fourth temperature measuring instrument 104, and one cabinet is preferably There are multiple air inlets, and one air inlet is aimed at one server (that is, each of the first server S1, the second server S2, the third server S3 and the fourth server S4 in FIG. 4 ), and the first temperature measuring gauge 101 to the fourth temperature measuring gauge 104 are respectively arranged at the air inlet of each server.

Therefore, taking FIG. 4 as an example, the first temperature measuring meter 101 can be arranged at the air inlet corresponding to the first server S1 to measure the intake air temperature at the air inlet of the first server S1; the second temperature The measuring meter 102 can be arranged at the air inlet corresponding to the second server S2 to measure the intake air temperature at the air inlet of the second server S2; the third temperature measuring meter 103 can be arranged corresponding to the third At the air inlet of the server S3, to measure the intake air temperature at the air inlet of the third server S3; and the fourth temperature measuring meter 104 can be arranged at the air inlet of the corresponding fourth server S4, to measure Measure the intake air temperature at the air inlet of the fourth server S4. It should also be noted that FIG. 4 shows four servers in an exemplary manner, but the present invention does not limit the number of servers. This embodiment can be applied to an active ventilation raised floor (active tile) design, but the present invention is not limited thereto.

Please refer to FIG. 4 and FIG. 5 together, wherein FIG. 5 shows a cabinet temperature control method according to an embodiment of the present invention.

Please refer to step S01: measure the temperature data of the cabinet with the temperature measuring device 10 . As mentioned above, the temperature measuring gauge 10 includes the first temperature measuring gauge 101 to the fourth temperature measuring gauge 104, and the cabinet temperature data includes each of the first temperature measuring gauge 101 to the fourth temperature measuring gauge 104 The measured intake air temperature.

—公式（1） 其中

為溫度變異數；

為每一該些進氣溫度；

為該些進氣溫度的平均溫度；

為該些進氣溫度的資料數量。 Please refer to step S02: using the controller 20 to calculate the temperature variation according to the cabinet temperature data. The cabinet temperature data includes the intake air temperature measured by each temperature measuring device, and the temperature variation represents the average distance between all the intake air temperatures and an average temperature, wherein the average temperature is the average of the intake air temperatures. The temperature variation is calculated according to the following formula:

— Formula (1) where

is the temperature variation;

for each of these intake air temperatures;

is the average temperature of these intake air temperatures;

is the data quantity of these intake air temperatures.

即為第一溫度量測計101到第四溫度量測計104每一者所量到的溫度；

即為伺服器或溫度量測計的數量（在圖4的示例中，

）；

即為

的總合除以伺服器或溫度量測計總數（

）的平均值。 For example, in the example in Figure 4,

That is, the temperature measured by each of the first temperature measuring instrument 101 to the fourth temperature measuring instrument 104;

is the number of servos or temperature gauges (in the example in Figure 4,

);

that is

total divided by the total number of servers or temperature gauges (

)average of.

接近氣流AF的參考溫度（風扇F送出的預設冷空氣溫度）；而當機櫃上的某一伺服器產生如圖1所示的熱點HS時，則溫度變異數

便隨之上升。據此，控制器20即可判得機櫃的溫度分佈狀態與預設冷空氣溫度之間的差異，以於後續根據誤差溫度調控氣流AF的流量。 Specifically, the temperature variation is used to represent the distribution state of the intake air temperature of the first servo S1 to the fourth servo S4. The purpose of calculating the temperature variation is that, under ideal conditions, when the flow rate of the airflow AF sent by the fan F is sufficient without hot spots, the average temperature

is close to the reference temperature of the airflow AF (the preset cold air temperature sent by the fan F); and when a certain server on the cabinet produces a hot spot HS as shown in Figure 1, the temperature variation

It will rise accordingly. Accordingly, the controller 20 can determine the difference between the temperature distribution state of the cabinet and the preset cold air temperature, so as to subsequently regulate the flow of the airflow AF according to the temperature error.

—公式（2） 其中

為該誤差溫度；

為該參考溫度（或稱參考變異數）；

為透過公式（1）算出的溫度變異數。 Please refer to step S03: using the controller 20 to calculate the error temperature according to the temperature variation and the reference temperature. The error temperature is the difference between the reference temperature and the temperature variation, wherein the reference temperature is the preset cold air temperature sent by the fan F. The error temperature system is calculated according to the following formula:

— Formula (2) where

is the error temperature;

is the reference temperature (or reference variance);

is the temperature variation calculated by formula (1).

近似於零；而當機櫃上的某一伺服器產生如圖1所示的熱點HS時，則溫度變異數

改變，誤差溫度

亦隨之增大。 Similar to the above description, when the flow rate of the airflow AF sent by the fan F is sufficient without hot spots, the error temperature

is close to zero; and when a certain server on the cabinet produces a hot spot HS as shown in Figure 1, the temperature variation

change, error temperature

also increased.

—公式（3） 其中

為該目標風扇轉速；

、

及

為控制參數；

為透過公式（2）算出的誤差溫度。 Please refer to step S04: the controller 20 calculates the target fan speed according to the error temperature, and adjusts the fan F to the target fan speed. The target fan speed is calculated according to the following formula:

— formula (3) where

is the target fan speed;

,

and

is the control parameter;

is the error temperature calculated by formula (2).

即會上升，而從公式（3）可以推導出，當誤差溫度

上升時，目標風扇轉速

亦會上升。據此，即可藉由調整風扇F的轉速，而達到增加氣流AF的流量。 Therefore, when the cabinet has uneven temperature distribution due to hot spots, the error temperature

that will rise, and from equation (3) it can be deduced that when the error temperature

When ramping up, the target fan speed

will also rise. Accordingly, the flow rate of the airflow AF can be increased by adjusting the rotation speed of the fan F.

後，控制器20根據進氣溫度

計算出溫度變異數

（為便於理解，圖6係將溫度變異數

繪示為來自溫度量測計10），控制器20再根據溫度變異數

及參考溫度

為計算出目標風扇轉速

。據此，即可根據目標風扇轉速

控制風扇F的轉速，進而控制流向機櫃R（機櫃R即包含第一伺服器S1到第四伺服器S4）的氣流AF流速。並且，溫度量測計10還可以繼續量測以目標風扇轉速

控制風扇F後的伺服器的溫度，進而對機櫃R的溫度進行持續性地監控，以即時地調控機櫃R的溫度，並避免熱點的產生。 In general, please refer to FIG. 6 . FIG. 6 is a schematic diagram of feedback of a cabinet temperature control method according to an embodiment of the present invention. The intake air temperature is measured by the temperature gauge 10

After that, the controller 20 according to the intake air temperature

Calculate the temperature variation

(For ease of understanding, Figure 6 shows the temperature variation

shown as coming from the temperature gauge 10), the controller 20 then according to the temperature variation

and reference temperature

To calculate the target fan speed

. Accordingly, according to the target fan speed

The rotation speed of the fan F is controlled, thereby controlling the flow rate of the airflow AF flowing to the rack R (the rack R includes the first server S1 to the fourth server S4 ). Moreover, the temperature measuring device 10 can also continue to measure the fan speed with the target fan speed

The temperature of the server behind the fan F is controlled, and then the temperature of the rack R is continuously monitored, so as to adjust the temperature of the rack R in real time and avoid hot spots.

To sum up, according to the cabinet temperature control method shown in one or more embodiments of the present invention, the intake air temperature of each server on the cabinet can be maintained at an ideal temperature by feeding back the status data of the cabinet. Moreover, in a computer room where multiple cabinets are placed, through the cabinet temperature control method shown in the present invention, the controller does not need to regulate the speed of all the fans in the computer room, but can only regulate the fan speed of the cabinets with hot spots. Efficiently control the fan speed and reduce the power consumption of the computer room cooling system. In addition, this case can effectively prevent hot spots on the cabinet by locally enhancing the air flow.

In one embodiment of the present invention, the cabinet temperature control method and system of the present invention can solve the problem of local hot spots of the server, maintain the operating performance of the server, and make the server suitable for artificial intelligence (AI) calculations , Edge Computing, and can also be used as a 5G server, cloud server or Internet of Vehicles server.

Although the present invention is disclosed by the aforementioned embodiments, they are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, all changes and modifications are within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the appended scope of patent application.

Pc: cold aisle pressure

Ph: hot aisle pressure

HS: Hotspot

C1～C12, R: cabinet

CRAC: computer room air conditioning unit

RF: Raised Floor

10: Temperature measuring gauge

101: The first temperature measuring instrument

102: Second temperature measuring gauge

103: The third temperature measuring gauge

104: The fourth temperature measuring gauge

20: Controller

S1: First server

S2: Second server

S3: The third server

S4: Fourth server

F: fan

AF: Airflow

S01, S02, S03, S04: steps

FIG. 1 is a schematic diagram illustrating local hot spots generated on a cabinet. Figures 2a and 2b illustrate the conventional technology of solving hot air return by using raised floor and computer room air-conditioning unit. Figures 3a and 3b illustrate the conventional technology for solving hot air backflow by using an active ventilated raised floor. FIG. 4 shows a cabinet temperature control system according to an embodiment of the present invention. FIG. 5 shows a cabinet temperature control method according to an embodiment of the present invention. FIG. 6 is a feedback diagram of a cabinet temperature control method according to an embodiment of the present invention.

S01, S02, S03, S04: steps

Claims (6)

A cabinet temperature control method, including performing the following operations through a controller: obtaining a cabinet temperature data, wherein the cabinet temperature data includes a plurality of intake temperatures; calculating a temperature variation according to the cabinet temperature data; according to the temperature variation and An error temperature is calculated from a reference temperature; and a target fan speed is calculated according to the error temperature, and a fan speed is adjusted to the target fan speed; wherein, the temperature variation is calculated according to the following formula:

Wherein Var( T _i ) is the temperature variation; T _i is each of the intake air temperatures; v is an average temperature of the intake air temperatures; n is a quantity of the intake air temperatures. The cabinet temperature control method as described in claim 1, wherein the target fan speed is calculated according to the following formula:

Where u is the target fan speed; K _P , K _I and K _D are control parameters; e is the error temperature. The cabinet temperature control method according to claim 1, wherein the error temperature is a difference between the reference temperature and the temperature variation. A cabinet temperature control system, comprising: a temperature measuring instrument for measuring and outputting a cabinet temperature data, wherein the cabinet temperature data includes a plurality of intake air temperatures; and a controller connected to the temperature in a signal transmittable manner The controller receives the cabinet temperature data and calculates a temperature variation according to the cabinet temperature data, wherein the controller further calculates an error temperature based on the temperature variation and a reference temperature, so as to calculate an error temperature based on the error temperature target fan speed, and adjust the speed of a fan to the target fan speed; wherein, the temperature variation is calculated according to the following formula:

Wherein Var( T _i ) is the temperature variation; T _i is each of the intake air temperatures; v is an average temperature of the intake air temperatures; n is a quantity of the intake air temperatures. The cabinet temperature control system as described in claim item 4, wherein the target fan speed is calculated according to the following formula:

Where u is the target fan speed; K _P , K _I and K _D are control parameters; e is the error temperature. The cabinet temperature control system as claimed in claim 4, wherein the error temperature is a difference between the reference temperature and the temperature variation.

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