TWI793463B - Electronic component testing equipment - Google Patents

Abstract

The invention provides an electronic component testing equipment, comprising: a supply device, a conveying device, a detection device and a gas circulation device are provided in a detection chamber; a temperature control device is provided outside the detection chamber; the gas circulation device is equipped with There is a cooling part, a suction port and an exhaust port; the temperature control device is provided with a temperature control mechanism; there are two pipelines between the first temperature control mechanism and the refrigeration part, and the first temperature control mechanism The low-temperature liquid can be output to the refrigerating part through one of the pipelines, the low-temperature liquid passes through and cools the refrigerating part, and then flows back to the first temperature control mechanism through the other pipeline; the gas in the detection chamber flows from the suction After being inhaled by the air port, it is cooled by the refrigeration unit, and then discharged into the detection chamber through the exhaust port to control the temperature in the detection chamber to maintain a preset value; thereby reducing the inaccuracy of detection results.

Description

Electronic component testing equipment

The present invention relates to a detection device, in particular to a detection device for electronic components that transports electronic components to the detection device through an intermittent rotating flow path between the transfer devices.

Generally speaking, after the manufacture of electronic components such as LEDs or passive components, they usually need to be tested for subsequent sorting according to their characteristics. These devices for testing are often arranged on a base with a peripheral ring. A tray with equally spaced slots. Electronic components are accommodated in the slots and transported by the tray with an intermittent rotating flow path. Components are tested; for some electronic components that need to have good temperature characteristics in a special temperature environment, such as thermistors, the previous technology adopts a cover on the base to cover the carrier plate and the detection instrument, so that The carrier plate and the detection instrument are located in the inner space formed by the base and the cover, and a gas of a predetermined temperature is injected into the inner space to keep the temperature inside the cover different from that outside the cover; When testing, a feeding mechanism outside the cover sequentially supplies electronic components to the tray inside the cover, so that the electronic components are tested at a preset temperature.

The prior art adopts the method of setting a cover to detect electronic components that need to have good temperature characteristics in a special temperature environment. There will be a temperature difference between the outside of the cover and the inside of the cover, which will cause the electronic components to be separated from the outside of the cover. After the feeding mechanism is supplied into the cover, unexpected events such as moisture generation, component temperature being detected before reaching the preset temperature due to temperature difference, etc., all of the above unexpected events may lead to the failure of the test results allow.

Therefore, the purpose of the present invention is to provide an electronic component testing device that can reduce the inaccuracy of testing results.

The electronic component testing equipment according to the object of the present invention includes: a testing room formed between a machine table and a machine cover; a supply device provided with a supply mechanism and a vibrating feeding mechanism; a conveying device provided with There is a carrier plate and a carrier plate drive mechanism; a detection device with a detection mechanism; a gas circulation device with a cooling unit, a suction port and an exhaust port; a temperature control device to control the temperature in the detection chamber. temperature; the supply device, the conveying device, the detection device and the gas circulation device are all located in the detection chamber; the temperature control device is provided with a first temperature control mechanism and is located outside the detection chamber; There are two pipelines between a temperature control mechanism and the refrigerating part of the gas circulation device. The first temperature control mechanism can output low-temperature liquid and pass through one of the pipelines to the refrigerating part. The low-temperature liquid passes through and makes the After the refrigeration part is cooled, it flows back to the first temperature control mechanism through another pipeline; the gas in the detection chamber is sucked in from the suction port, cooled by the refrigeration part, and then discharged into the detection chamber through the exhaust port To control the temperature in the detection chamber to be kept at a preset value.

In the electronic component testing equipment of the embodiment of the present invention, the electronic components can be kept at the same preset temperature during the process of being transported between various devices, reducing the moisture caused by the temperature difference and the component temperature can be closer to the preset temperature temperature, thereby reducing the inaccuracy of test results.

A: Testing room

B: temperature control device

B1: The first temperature control mechanism

B2: The second temperature control mechanism

B3: The third temperature control mechanism

B4: The fourth temperature control mechanism

C: supply device

C1: supply organization

C11: Hopper

C12: Feed channel

C13: Degausser

C14: drive

C2: Vibration feeding mechanism

C21: Circular Shock Mechanism

C22: Direct shock mechanism

D: Conveyor

D1: carrier disk

D11: Load tank

D12: embedded hole

D2: Disk drive mechanism

D21: base

D211: exhaust pipe

D22: shell

D221: Shell cover

D222: Opening

D223: Intake pipe

D23: Shaft tube seat

D231: Seat

D232: Shaft Tube

D233: channel

D234: Annular groove

D235: Intake pipe

D236: Exhaust pipe

D24: drive

D241: Ontology

D242: Drive shaft

D25: linkage shaft

D251: step department

D252: Fixing parts

D26: shaft sleeve

D27: Coupling

D28: Bearing

D3: Transfer table

D31: refrigeration department

D32: Hollow out interval

D33: Open mouth

D4: outlet

D5: Restricted parts

D51: Containment area

E: detection device

E1: Testing agency

E11: Probe Holder

E12: first probe set

E121: First Probe

E122: First probe seat

E13: second probe set

E131: Second probe

E132:Second Probe Holder

E14: Drive frame

E15: drive

E16: shell

E161: Intake pipe

E162: exhaust pipe

E2: Detection instrument

F: gas circulation device

F1: refrigeration unit

F2: suction port

F3: exhaust port

G: collection device

G1: collection box

G2: Receiving tube

G3: Airflow Amplifier

H1: pipeline

H2: pipeline

H3: pipeline

H4: pipeline

T: machine frame

T1: machine table

U: machine cover

W: electronic components

W': sample element

d1: minimum inner diameter

d2: Maximum outer diameter

d3: Maximum outer diameter

Fig. 1 is a three-dimensional schematic diagram of the detection equipment in the embodiment of the present invention.

Fig. 2 is a schematic front view of Fig. 1 in an embodiment of the present invention.

Fig. 3 is a schematic diagram of the carrier disc and the detection mechanism in the embodiment of the present invention.

Fig. 4 is a schematic diagram of the configuration relationship between the supply mechanism and the vibrating feeding mechanism in the embodiment of the present invention.

FIG. 5 is a schematic diagram of the disposition relationship among the drive mechanism of the carrier, the transfer platform and the carrier in the embodiment of the present invention.

FIG. 6 is a three-dimensional exploded schematic view of the drive mechanism of the carrier disk in the embodiment of the present invention.

FIG. 7 is a schematic diagram of the drive mechanism of the carrier disk not in contact with the transfer platform in the embodiment of the present invention.

Fig. 8 is a perspective view of the detection mechanism in the embodiment of the present invention.

Fig. 9 is a schematic diagram of the arrangement relationship among the collection box, the material collection pipe and the airflow amplifier in the embodiment of the present invention.

Please refer to Fig. 1, the embodiment of the present invention can be described as an example with the detection equipment as shown in the figure, and this detection equipment is provided with: a detection chamber A; A temperature control device B, controls the temperature in this detection chamber A; Device C is set in the detection chamber A, the supply device C is provided with a supply mechanism C1 and a vibrating feeding mechanism C2; a conveying device D is disposed in the detection chamber A, and the conveying device D is provided with a tray D1 and A disk drive mechanism D2; a detection device E, located in the detection chamber A, the detection device E is provided with a detection mechanism E1.

Please refer to Figure 1, the testing equipment is provided with a machine frame T and a machine cover U, the machine frame T is provided with a horizontal machine table T1, and the machine cover U is set on the machine table T1 And cover the mechanism on the machine table T1, the detection chamber A is formed between the machine table T1 and the machine cover U.

Please refer to Figures 1 and 2, the temperature control device B is located in the frame T of the machine outside the detection chamber A, and the temperature control device B is provided with a first temperature control mechanism B1 such as a chiller, a first temperature control mechanism B1 such as a chiller The second temperature control mechanism B2, a third temperature control mechanism B3 such as a vortex tube, and a fourth temperature control mechanism B4 such as a vortex tube; a gas circulation device F is provided in the detection chamber A, and the gas circulation device F is provided with a consistent The cold part F1, a suction port F2 and an exhaust port F3; there are two pipelines H1 between the first temperature control mechanism B1 and the refrigeration part F1, the first temperature control mechanism B1 can output low-temperature liquid and Through one of the pipelines H1 to the refrigerating part F1, the low-temperature liquid passes through and cools the refrigerating part F1, and then flows back to the first temperature control mechanism B1 through the other pipeline H1, thus circulating Send low-temperature liquid; the gas in the detection chamber A is inhaled from the suction port F2, cooled by the refrigeration unit F1, and then discharged into the detection chamber A through the exhaust port F3, so that the detection chamber A has The cooling gas is circulated and the temperature in the detection chamber A is controlled to maintain a first temperature.

Please refer to Figures 1, 2, and 3, the transfer device D is provided with a transfer table D3 that is higher than the machine table T1 and keeps a distance from the machine table T1, and the carrier D1 is set on the transfer table D3 , the periphery of the carrier disc D1 is provided with a plurality of carrier slots D11, the carrier slots D11 can carry electronic components W; the transfer platform D3 is provided with a consistent cooling part D31, the second temperature control mechanism B2 and the cooling part There are two pipelines H2 between D31, the second temperature control mechanism B2 can output low-temperature liquid and pass through one of the pipelines H2 to the refrigerating part D31, the low-temperature liquid passes through and cools the refrigerating part D31 before passing through the other A pipeline H2 flows back to the second temperature control mechanism B2, so that the cryogenic liquid is circulated to control the temperature of the transfer table D3 to maintain a second temperature; between the third temperature control mechanism B3 and the plate drive mechanism D2 A pipeline H3 is provided, and the third temperature control mechanism B3 can deliver low-temperature gas through the pipeline H3 to the disk drive mechanism D2, so as to control the temperature of the disk drive mechanism D2 to maintain a third temperature; A pipeline H4 is provided between the fourth temperature control mechanism B4 and the detection mechanism E1, and the fourth temperature control mechanism B4 can deliver low-temperature gas to the detection mechanism E1 through the pipeline H4 to control the temperature of the detection mechanism E1 Keep at a fourth temperature; wherein, the first temperature, the second temperature, the third temperature are the same as the preset values of the fourth temperature, all of which are 25±0.05°C; the inspection room A can also be equipped with a sensor A thermostat (not shown in the figure) can independently adjust the temperature in the detection chamber A when the temperature is different from the preset value; the transfer platform D3, the detection mechanism E1 and the carrier disk drive mechanism D2 can also be adjusted at the same time. Different temperature sensors (not shown in the figure) are provided so that when the temperature is different from the preset value, the temperatures of the transfer platform D3, the detection mechanism E1 and the disc drive mechanism D2 can be independently adjusted.

Please refer to Figures 2 and 3, a collecting device G is installed in the frame T of the machine outside the testing room A below the table T1 of the machine, and the collecting device G can collect the electronic components W discharged from the tray D1; Should A plurality of discharge outlets D4 are provided outside the periphery of the tray D1, and the collection device F is provided with a plurality of collection boxes G1 corresponding to the number of the discharge outlets D4. Tube G2 is connected.

Please refer to Figures 3 and 4, the supply mechanism C1 and the vibrating feed mechanism C2 are all located on the machine table T1; the supply mechanism C1 is provided with a hopper C11, a feed channel C12, a degausser C13 and an electromagnetic Iron driver C14; the vibrating feeding mechanism C2 is provided with a circular vibration mechanism C21 and a straight vibration mechanism C22; the driver C14 can shake the hopper C11 and the feed channel C12, so that the electronic components W in the hopper C11 are released from the hopper C11 It falls to the feed channel C12 and enters the circular shock mechanism C21 after being degaussed by the degausser C13. C22 is supplied to the loading slot D11 of the loading disk D1.

Please refer to Figures 5, 6, and 7, the transfer platform D3 is provided with a circular hollow area D32, the carrier D1 is attached above the hollow area D32, and the carrier drive mechanism D2 passes through the hollow area D32. It is connected with the carrier D1 through the hollow area D32 and drives the carrier D1 to rotate intermittently on the transfer platform D3, wherein the carrier drive mechanism D2 is not in contact with the transfer platform D3; There is a C-shaped sheet-shaped limiting member D5 surrounding the periphery of the carrier D1 to prevent the electronic component W from being thrown out of the carrier slot D11 when the carrier D1 is intermittently rotated; the limiting member D5 is provided with a The accommodating area D51 is for accommodating a sample component W'; the discharge port D4 (FIG. 3) passes through the transfer table D3 and the restricting member D5 and corresponds to the loading slot D11, so that the electronic component W can pass through the discharge port D4 (Fig. 3). The outlet D4 discharges the tray D1; the tray drive mechanism D2 is provided with a base D21, a housing D22 and a shaft socket D23 outside, and the tray drive mechanism D2 is fixed on the machine table T1 with the base D21 ( 1), the housing D22 is connected between the base D21 and the shaft tube seat D23; the housing D22 is composed of four shell covers D221, and the upper and lower ends are respectively provided with openings D222; The shaft tube seat D23 is provided with a seat portion D231 and a shaft tube portion D232, and a channel D233 runs through both. The width of the seat portion D231 is wider than the shaft tube portion D232. The upper and lower ends of the housing D22 The opening is covered by the seat D231 of the shaft tube seat D23 and the base D21 respectively; the seat D231 is provided with an annular groove D234 on the outer periphery of the channel D233, and the seat D231 is provided with an air intake pipe D235 and An exhaust pipe D236 communicates with the annular groove D234 respectively; the periphery of the housing D22 is provided with a plurality of air intake pipes D223, and the bottom of the base D21 is provided with a plurality of air intake pipes D211, and the air intake pipe D223 and The exhaust pipe D211 is connected to the housing D22; the low-temperature gas system output by the third temperature control mechanism B3 (Fig. 2) is delivered to the annular groove D234 through the air inlet pipe D235 respectively, and is discharged from the exhaust pipe D236. It is discharged and transported into the casing D22 through the intake pipe D223 and discharged from the exhaust pipe D211; the disc drive mechanism D2 is provided with a driver D24 such as a motor, a connecting shaft D25 and a shaft sleeve D26; The driver D24 is fixed below the shaft tube seat D23 and is located in the housing D22. A body D241 of the driver D24 covers the lower end of the channel D233 and abuts against the annular groove D234. A drive shaft on the top of the driver D24 D242 extends into the channel D233, and is connected to the lower end of the linkage shaft D25 through a shaft coupling D27, so that the driver D24 can drive the linkage shaft D25 to rotate intermittently; the bottom of the driver D24 is kept at a distance from the base D21 and the The side edge of the driver D24 also keeps a distance from the housing D22, and the driver D24 does not contact the base D21 and the housing D22; the shaft sleeve D26 is embedded in the upper end of the channel D233, and the upper end of the linkage shaft D25 passes through the The shaft sleeve D26 and the hollowed-out area D32 are embedded in one of the embedded holes D12 of the carrier D1 to link the carrier D1, and a plurality of bearings D28 are arranged between the linkage shaft D25 and the shaft sleeve D26; The upper end is provided with a step portion D251 slightly wider than the outer diameter of the linkage shaft D25, and the carrier D1 is sandwiched between the step portion D251 and a fixed piece D252 and driven by the linkage shaft D25; the minimum inner diameter of the hollowed out section D32 d1 is respectively greater than the maximum outer diameter d2 of the linkage shaft D25 and the maximum outer diameter d3 of the shaft sleeve D26, and the upper end of the shaft tube part D232 is set at the bottom of the hollowed-out area D32 and maintains an appropriate distance from the transfer platform D3; The driver D24 of the disc drive mechanism D2 is arranged in the casing D22, and the driver D24 is only in contact with the shaft tube seat D23 from above, and the heat generated by the driver D24 can be controlled by the third temperature. Mechanism B3 (Fig. 2) is controlled to cool down to reduce the outward diffusion of heat; The contact of the conveying table D3 further reduces the occurrence of heat transfer to the conveying table D3 and further affecting the electronic components W.

Please refer to Figures 1, 5, and 8. The detection device E is provided with a detection instrument E2 located in the detection chamber A and beside the transfer platform D3. The detection instrument E2 is electrically connected with the detection mechanism E1 to analyze The information after the detection of the detection mechanism E1; the detection mechanism E1 is provided with a probe frame E11, a first probe group E12, a second probe group E13, a driving frame E14 and a driver E15 such as an electromagnet; The upper surface of the probe holder E11 can extend through a strip-shaped hollow D33 on the transfer table D3 to be exposed on the transfer table D3; the first probe group E12 is provided with four first probes E121 in a On the first probe seat E122, the second probe group E13 is provided with four second probes E131 on a second probe seat E132, and the first probe group E12 is used to detect the inside of the accommodation area D51 The sample component W', the second probe set E13 is used to detect the electronic component W transported by the carrier D1 in the carrier D11 of the carrier D1; the first probe seat E122 and the second probe Seats E132 are respectively arranged at one end of the driving frame E14 at intervals, and the driver E15 can act on the other end of the driving frame E14, so that the first probe seat E122 and the second probe seat E132 are driven to move up and down, so as to The first probe E121 and the second probe E131 can pass through a plurality of through holes E111 of the probe frame E11, respectively to detect the electronic component W and the sample component W'; the driver E15 is set in a In the three-dimensional rectangular housing E16, an air intake pipe E161 and an exhaust pipe E162 are arranged on the housing E16, and the low-temperature gas output by the fourth temperature control mechanism B4 (Fig. 2) passes through the air intake pipe E161 transported into the casing E16 and discharged from the exhaust pipe E162 to reduce the temperature inside the casing E16 and reduce the heat generated by the driver E15 from spreading outward to other mechanisms; wherein the sample element W' It is a component that has been tested at a temperature of 25±0.05°C in other testing equipment in advance and its detection information is known; in the embodiment of the present invention, the sample component W' with known detection information is placed almost the same as the electronic component W In the detection environment, and to detect both at the same time, in order to pass the The detection information of the sample component W' is converted into the detection information of the electronic component W, but this conversion method is not the key point of the present invention, and will not be described here.

Please refer to FIG. 8 , an airflow amplifier G3 is provided between each collection box G1 and each material collection tube G2 , which accelerates the discharge of the electronic components W ( FIG. 3 ) in the material collection tube G2 into the collection box G1 .

In the implementation of the embodiment of the present invention, the first temperature control mechanism B1, the second temperature control mechanism B2, the third temperature control mechanism B3 and the fourth temperature control mechanism B4 independently control the different The temperature of the area, so that the temperature control device B controls the temperature in the detection chamber A to maintain the preset temperature; the electronic component W is transported from the supply mechanism C1 to the loading slot D11 of the carrier plate D1 through the vibration feeding mechanism C2 , and transported by the carrier disc D1 to the detection mechanism E1 through the intermittent rotating flow path for detection, all of which are carried out at the preset temperature in the detection chamber A; the electronic components W detected by the detection mechanism E1 are then According to the physical characteristics, the electronic components W are discharged to the collection device G through the corresponding discharge port D4 for collection.

In the electronic component testing equipment of the embodiment of the present invention, the electronic component W can be kept at the same preset temperature during the process of being transported between various devices, reducing the moisture caused by the temperature difference and the component temperature can be closer to the preset temperature. Set the temperature to reduce the inaccuracy of the test results.

But what is described above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention with this, that is, all simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the description of the invention, All still belong to the scope covered by the patent of the present invention.

A: Testing room

B: temperature control device

C: supply device

C1: supply organization

C2: Vibration feeding mechanism

D: Conveyor

D1: carrier disk

D2: Disk drive mechanism

D3: Transfer table

E: detection device

E1: Testing agency

E2: Detection instrument

F: gas circulation device

F2: suction port

F3: exhaust port

T: machine frame

T1: machine table

U: machine cover

Claims (10)

An electronic component testing equipment, comprising: a testing room formed between a machine table and a machine cover; a supply device provided with a supply mechanism and a vibrating feeding mechanism; a conveying device provided with a carrier plate and A carrier drive mechanism; a detection device with a detection mechanism; a gas circulation device with a cooling unit, a suction port and an exhaust port; a temperature control device to control the temperature in the detection chamber; the supply The device, the conveying device, the detection device and the gas circulation device are all located in the detection chamber; the temperature control device is provided with a first temperature control mechanism and is located outside the detection chamber; the first temperature control mechanism of the temperature control device There are two pipelines between the refrigerating part of the gas circulation device, the first temperature control mechanism can output the low-temperature liquid and pass through one of the pipelines to the refrigerating part, the low-temperature liquid passes through and cools the refrigerating part Then flow back to the first temperature control mechanism through another pipeline; the gas in the detection chamber is sucked from the suction port, cooled by the refrigeration unit, and then discharged into the detection chamber through the exhaust port to control the detection The temperature in the room is kept at the preset value. The electronic component testing equipment as described in claim 1, wherein, the carrier is set on a transfer table and driven by a carrier drive mechanism, the transfer table frame is higher than the machine table and has a hollow section, the The carrier plate is pasted above the hollow area, and the carrier drive mechanism passes through the hollow area from below the hollow area and is connected with the carrier plate. The electronic component testing device as claimed in claim 2, wherein, the disk drive mechanism does not contact the conveying platform. The electronic component testing device as described in claim 2, wherein the carrier drive mechanism is provided with a base, a casing, a driver and a shaft socket; the driver is fixed below the shaft socket and is located in the casing, The driver does not contact the base and the casing, and low-temperature gas can be delivered into the casing. The electronic component testing device as claimed in claim 4, wherein the shaft socket is provided with an annular groove, and the driver abuts against the annular groove, and the low-temperature gas can be transported into the annular groove. Electronic component testing equipment as described in claim 2, wherein the temperature control device is provided with a second temperature control mechanism, a third temperature control mechanism and a fourth temperature control mechanism outside the detection chamber; the second temperature control mechanism controls The temperature of the conveying platform is kept at a preset value; the third temperature control mechanism controls the temperature of the plate driving mechanism to be kept at a preset value; the fourth temperature control mechanism controls the temperature of the detection mechanism to be kept at a preset value. The electronic component testing device as described in Claim 6, wherein the preset values of the temperature of the testing chamber, the temperature of the transfer platform, the temperature of the carrier driving mechanism, and the temperature of the testing mechanism are all the same. The electronic component testing device according to claim 6, wherein the second temperature control mechanism is for delivering low-temperature liquid, and the third temperature control mechanism and the fourth temperature control mechanism are for delivering low-temperature gas. The electronic component testing equipment as described in Claim 1, wherein the detection mechanism is provided with a driver, which can drive a plurality of probes to detect electronic components; in vivo. Electronic component testing equipment as described in Claim 9, wherein, the testing device is provided with a testing instrument beside the conveying platform in the testing room, and the testing instrument is electrically connected with the testing mechanism to analyze the detection mechanism detected by the testing mechanism. information later.

Images