TWI793123B - Stripping device - Google Patents

Abstract

The protective member is properly peeled off from the wafer without resin remaining on the outer peripheral portion of the wafer. The peeling device (1) is for peeling the protective member (P) formed by fixing a film on one surface of the wafer (W) through a resin (R) from the wafer. The peeling device includes outer peripheral peeling means (4) for peeling the protective member from the wafer to leave a part of the outer periphery of the protective member, and overall peeling means (5) for peeling the entire protective member from the wafer. The whole peeling means includes a holding part (50) for holding a part of the outer periphery that has not been peeled off by the outer peripheral peeling means, and a roller part (52b) for pressing the central part of the lower surface of the protective member. The whole peeling means completely peels off the protective member while pushing the central part of the protective member on the roller portion toward the wafer.

Description

Stripping device

The present invention relates to a peeling device for peeling off a film attached to the surface of a wafer.

Undulations are formed on the surface of wafers cut out from an ingot of silicon or the like and sliced. In order to remove waviness, a sheet (referred to as a film in the present invention) is attached as a protective member on the surface of the wafer through a liquid resin. The surface shape of the wafer is transferred to the liquid resin, and after the liquid resin is cured, the undulations are removed by grinding the opposite side of the wafer. After grinding, the hardened resin and flakes are peeled off from the wafer.

However, when the liquid resin is supplied to the surface of the wafer to attach the sheet, the liquid resin is squeezed and spread, whereby the liquid resin overflows from the outer periphery (edge) of the wafer. The liquid resin is irradiated with ultraviolet rays to be hardened, and the resin and the sheet become a protective member. As an apparatus for peeling the resin and the sheet (protective member) protruding from the outer periphery of the wafer in this way, a peeling apparatus described in Patent Document 1, for example, has been proposed.

In Patent Document 1, an external force is applied in the thickness direction to the resin protruding from the outer periphery of the wafer, thereby forming a local gap between the edge of the wafer and the resin, and creating a starting point for peeling off the chip and the resin. [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Unexamined Patent Publication No. 2012-151275

However, even with the peeling device described in Patent Document 1, it is expected that resin remains on the outer peripheral portion of the wafer, and the protective member cannot be properly peeled off. In this case, the thickness of the outer peripheral portion may not become uniform in the subsequent grinding process.

The present invention was made in view of this point, and one object of the present invention is to provide a peeling device capable of properly peeling a protective member from a wafer without resin remaining on the outer peripheral portion of the wafer.

In the peeling device according to one aspect of the present invention, the film is fixed on one side of the wafer with a resin interposed therebetween in the state where an overflow portion where the film overflows from the outer periphery of the wafer is formed, and the film formed by the resin and the film is fixed to one surface of the wafer. A peeling device for peeling a protective member from a wafer, characterized by comprising: holding means having a holding surface for attracting and holding the other surface of the upper wafer with the protective member facing downward; The peeling means grasps the overflow part, and peels the outer peripheral part of the protective member from the wafer to leave a part of the outer periphery; Wafer peeling; the whole peeling means is equipped with: a first holding part that holds a part of the overflow part of the outer periphery that has not been peeled off by the outer peripheral peeling means; The central part of the protection member of the wafer is pushed; and the moving means moves the first holding part and the holding means relative to the direction of the holding surface; the protection member of the central part of the wafer held by the holding means on one side by means of rollers While pushing against the wafer, the protective member is completely peeled off from the wafer.

According to this configuration, the overflow portion protruding from the outer periphery of the wafer is stretched horizontally and vertically by the peripheral peeling means. As a result, a gap is formed between the resin and the wafer except for a part of the outer periphery of the wafer. Then, starting from this gap, the protective member can be peeled off from the wafer by the whole peeling means. At this time, since the first gripping portion is moved while the central portion of the protective member is pushed by the roller, it is possible to prevent incomplete peeling from occurring at the outer peripheral portion of the wafer. That is, the protective member can be properly peeled off from the wafer without resin remaining on the outer peripheral portion of the wafer.

In addition, in the above peeling device according to one aspect of the present invention, the peripheral peeling means includes: a plurality of first peripheral peeling means arranged at predetermined angular intervals around the center of the wafer; a plurality of second peripheral peeling means , arranged between the first peripheral peeling means; the first peripheral peeling means and the second peripheral peeling means have: a second holding part, holding the overflow part; and a horizontal movement part, so that the second holding part faces in the direction of the holding surface Move in a direction away from the outer periphery of the wafer; and the descending portion moves by the horizontal moving portion The second gripping portion that has been placed descends in a vertical direction that is perpendicular to the holding surface.

In addition, in the above peeling device according to one aspect of the present invention, the peripheral peeling means includes: a second gripping part that grips the overflow part; and a horizontal movement part that moves the second gripping part away from the outer periphery of the wafer in the direction of the holding surface. direction; and the descending part, which moves the second holding part moved by the horizontal moving part in the vertical direction perpendicular to the holding surface; and the outer peripheral moving means, which makes the second holding part and the second holding part move horizontally The lower portion and the descending portion rotate and move along the outer periphery of the wafer with a rotation axis about the center of the wafer.

According to the present invention, the protective member can be properly peeled off from the wafer without resin remaining on the outer peripheral portion of the wafer.

The peeling device of this embodiment will be described below with reference to the attached drawings. Fig. 1 is an overall perspective view of a peeling device according to this embodiment. In addition, the stripping device of the present embodiment is not limited to the configuration of a dedicated stripping device as shown in FIG. type of processing device. In addition, in Fig. 1, the side facing the X-axis direction is defined as the front side of the stripping device, the back side of the X-axis direction is defined as the rear side of the stripping device, the side facing the Y-axis direction is defined as the left side of the stripping device, and the back side of the Y-axis direction is defined as is the right side of the stripper. In addition, the size of the wafer shown in FIG. 1 is exaggerated for convenience of description.

As shown in FIG. 1 , the peeling device 1 is configured to peel the protective member P attached to the circular wafer W. As shown in FIG. Wafer W, for example of shape The as-sliced wafer before patterning is formed by slicing a cylindrical ingot with a wire saw.

The wafer W is not limited to workpieces such as silicon, gallium arsenide, and silicon carbide. For example, ceramics, glass, sapphire-based inorganic material substrates, sheet metal or resin ductile materials, and various processing materials that require flatness (TTV: Total Thickness Variation) from the micrometer scale to the submicrometer scale can also be ordered as wafers. W. The flatness here means, for example, the difference between the maximum value and the minimum value among the heights measured in the thickness direction with the surface to be ground of the wafer W as a reference plane.

The protective member P is formed by coating, for example, a photocurable resin R on the entire surface of the film F having an outer diameter equal to or larger than the outer diameter of the wafer W. That is, the protective member P includes: a film F having an area wider than the wafer W and an overflow portion E overflowing from the outer periphery of the wafer W; and a resin R formed on the lower surface of the film F and the wafer W (one side). face) between (refer to Figure 2).

The resin R is cured by, for example, being irradiated with ultraviolet light, and the film F is fixed on the lower surface of the wafer W through the resin R. Thereby, the lower surface of the wafer W is entirely covered and protected by the sheet-shaped protective member P. As shown in FIG. In addition, on the outer peripheral side of the wafer W, on the upper surface of the overflow portion E, a part of the resin R overflows. In addition, the material of resin R is not specifically limited, It can change suitably.

In addition, undulations are formed on the surface of wafer W after dicing. These undulations are removed in advance by subjecting the upper surface of the wafer W to a grinding process with the protective member P attached thereto.

As described above, the peeling device 1 is configured to peel the protective member P made of the resin R and the film F from the wafer W, and to discard the peeled protective member P into the trash can 9 inside the device. Specifically, the peeling device 1 is configured such that a holding means 2 for holding and transporting a wafer W and a holding means 2 for holding and transporting a wafer W are provided on a side surface of a vertical wall portion 11 standing in the Z-axis direction from the upper surface of a rectangular base 10 in plan view, and Peeling means 3 for peeling the protective member P. The holding means 2 is disposed above the standing wall portion 11 , and the peeling means 3 is disposed below the holding means 2 .

The holding means 2 is configured to hold the upper surface (the other surface) of the wafer W with the protection member P facing downward. Specifically, the holding means 2 sucks and holds the upper surface of the wafer W with a transfer pad 20 having a diameter substantially the same as that of the wafer W. The transfer pad 20 is a porous chuck for sucking and holding the wafer W, and a holding surface 21 made of a porous material such as ceramics is formed on the lower surface of a disk-shaped frame (see FIG. 2 ). The wafer W can be sucked and held by the negative pressure generated on the holding surface 21 .

The transfer pad 20 is supported by being suspended from the tip (left end) of an arm 22 extending in the Y-axis direction. The holding means 2 is configured to be movable in the Z-axis direction by the lifting means 23 , and is configured to be movable in the X-axis direction by the horizontal movement means 24 . The lifting means 23 moves the Z-axis table 25 supporting the base end of the arm 22 in the Z-axis direction by a motor-driven guide actuator.

The horizontal moving means 24 makes the X-axis table 26 supporting the Z-axis table 25 move in the X-axis direction by the motor-driven guide actuator. In addition, the elevating means 23 and the horizontal moving means 24 are not limited to motor-driven guide actuators, and may be constituted by air-driven guide cylinders, for example.

The peeling means 3 is composed of an outer peripheral peeling means 4 for peeling the outer peripheral portion of the protective member P from the wafer W, and a whole peeling means 5 for peeling the entire protective member P from the wafer W. The outer peripheral peeling means 4 and the whole peeling means 5 are arranged at approximately the same height, the outer peripheral peeling means 4 is arranged on the inner side (rear side) in the X-axis direction, and the whole peeling means 5 is arranged on the facing side (front side) in the X-axis direction. The detailed configuration of the peripheral peeling means 4 will be described later.

The entire peeling means 5 is configured to include a holding part 50 (first holding part) for holding the overflow part E, a moving means 51 for moving the holding part 50 in a predetermined direction, and a lower surface of the pressing film F to guide the protection member. The guide roller 52 for the peeling of P.

The holding part 50 is configured to hold a part of the overflow part E in the thickness direction by a pair of claw parts 50a. The pair of claws 50a are disposed facing each other, and are configured to be able to move away from and approach each other. The grip portion 50 is provided at the tip (left end) of an arm 53 extending in the Y-axis direction. The grip portion 50 is configured to be rotatable about the axis in which the arm 53 extends, and to be movable in the Z-axis direction and the X-axis direction by the moving means 51 .

The moving means 51 moves the X-axis table 54 supporting the base end of the arm 53 in the X-axis direction by a motor-driven guide actuator. Moreover, although not shown in figure, the arm 53 is comprised so that it can move up and down on the X-axis table 54. As shown in FIG. In addition, the moving means 51 is not limited to a motor-driven guide actuator, and may be constituted by an air-driven guide cylinder, for example.

The guide roller 52 is provided between the conveyance mat 20 and the moving means 51 . The guide roller 52 is configured such that a roller portion 52b extending by a predetermined length is attached to the tip of a shaft portion 52a protruding leftward in the Y-axis direction from the standing wall portion 11 . The roller portion 52b extends in the Y-axis direction below the transfer pad 20 and has a cylindrical shape sufficiently shorter than the diameter of the wafer W. As shown in FIG. In addition, the roller portion 52b is configured to be rotatable around an axis. The details will be described later, but in the overall peeling process, the roller portion 52b pushes the central portion of the protection member P (the lower surface of the film F) that has not been peeled off by the peripheral peeling means 4 and is fixed to the wafer W.

Below the peeling means 4, a trash can 9 for recovering the peeled protective member P is provided. The dustbin 9 has a top view square shape larger than the wafer W and open. In addition, the trash can 9 is provided with a pair of optical sensors 90 at the upper end portion of one side facing the X direction. One of the pair of optical sensors 90 is composed of a light-emitting part and the other is a light-receiving part. The optical sensor 90 is a light-receiving part that receives the light generated from the light-emitting part, and detects whether the protection member P recovered into the trash can 9 is full or not based on the change in the amount of light received by the light-receiving part.

In addition, above the trash can 9, a lamination means 6 for laminating the peeled protective member P in the trash can 9 is provided. The lamination means 6 is constituted by the first guide means 7 and the second guide means 8 for guiding the protection member P to the trash can 9 . The first guide means 7 is located at the bottom of the entire stripping means 5 at the rear and lower part of the trash can 9, and is formed by a pair of guide rails 70 inclined more downward as it goes forward.

The guide rail 70 is formed, for example, in the shape of a rod having a circular cross section, and has substantially the same length as the outer shape of the protective member P. As shown in FIG. In addition, the tip (lower end) portion of the guide rail 70 bends in the horizontal direction. This tip end portion is arranged at the upper end portion of one of the rear sides in the X direction of the trash can 9 . In addition, a pair of guide rails 70 are designed to face each other across the Y-direction centerline of the trash can 9, and are arranged in parallel at an interval sufficiently smaller than the outer diameter of the protective member P. As shown in FIG.

The second guide means 8 is constituted by a pair of guide rails 80 extending horizontally across the top of the trash can 9 back and forth. The guide rail 80 is formed in the shape of a rod having a circular cross section, for example, and extends longer than the outer diameter of the protective member P. As shown in FIG. One end (rear end) of the guide rail 80 is located at the upper end portion of one of the rear sides of the trash can 9 in the X direction, and the other end (tip) is located at the upper end portion of one of the front sides of the trash can 9 in the X direction. In addition, the pair of guide rails 80 are arranged in a figure-of-eight shape in a plan view (viewed with an upward arrow) such that the distance between them becomes larger as they go from the rear to the front.

In the peeling apparatus 1 thus constituted, the wafer W from which the waviness has been removed is sucked and held by the holding means 2 , and the wafer W with the protective member P attached thereto is first conveyed to the peripheral peeling means 4 . In the peripheral peeling means 4 , only the peripheral portion of the protective member P is peeled from the wafer W. As shown in FIG. However, the whole protection member P is peeled from the wafer W by the whole peeling means 5 . The peeled protective member P is guided by the first guide means 7 and the second guide means 8 constituting the stacking means 6, and falls into the trash can 9. As shown in FIG. Once a plurality of protective components P are stacked in the trash can 9 and the trash can 9 is filled with the protective components P, the operator will be notified in response to the output of the optical sensor 90 .

Next, referring to FIG. 1 and FIG. 2 , the peripheral peeling means of this embodiment will be described in detail. Fig. 2 is a model diagram of a peeling device according to this embodiment.

As shown in Fig. 1 and Fig. 2, the outer peripheral peeling means 4 is constituted such that, at the rear of the whole peeling means 5, on the upper surface of the base 40 protruding from the vertical wall part 11 toward the Y-axis direction, a set with a Z-axis direction as the central axis is provided. A cylindrical restricting ring 41 and a plurality of holding means 42 arranged around the restricting ring 41 . The restricting ring 41 is configured to have an outer diameter smaller than that of the wafer W or the transfer pad 20, and can be raised and lowered in the Z-axis direction. Details will be described later, but the restricting ring 41 functions to restrict the peeling margin of the protective member P in the peripheral peeling process.

The periphery of the restricting ring 41 is divided into eight areas at equal angular intervals, and one gripping means 42 is arranged in each of the seven areas except the one area on the inner side in the X-axis direction. That is, the seven holding means 42 are arranged at predetermined angular intervals around the center of the wafer W. Here, as shown in FIG. 1 , four holding means 42 arranged one by one from the area adjacent to the area on the inner side in the X-axis direction are defined as the first peeling group G1 (first peripheral peeling means), and The three gripping means 42 arrange|positioned between the gripping means 42 which comprise 1st peeling group G1 are defined as 2nd peeling group G2 (2nd peripheral peeling means). In addition, the seven holding means 42 are all represented by the same symbol for simplicity of description.

The holding means 42 is configured to include a holding part 43 (second holding part) for holding the overflow part E, a horizontal moving part 44 for moving the holding part 43 in the direction of the holding surface of the holding means 2 (horizontal direction), and a holding part 43 is a vertical moving portion (falling portion) that moves (falls) in a vertical direction relative to the holding surface 21 . The holding part 43 is constituted by the lower support part 45 supporting the lower surface of the overflow part E, and the upper support part 46 supporting the upper surface of the overflow part E. The upper support part 46 and the lower support part 45 are arranged facing each other. The upper support part 46 is configured so that it can move up and down in the Z-axis direction with respect to the lower support part 45 by, for example, an air cylinder. The overflow part E can be held by sandwiching the overflow part E with the upper support part 46 and the lower support part 45 .

The lower supporting part 45 is arranged on the upper end side of the L-shaped moving block 47 in side view, and the upper supporting part 46 and the lower supporting part 45 can move up and down along the moving block 47 by the vertical moving part (descending part) not shown in the figure. . In addition, the horizontal moving part 44 moves the moving block 47 in the horizontal direction (radial direction of the wafer W) by a motor-driven guide actuator. In addition, the vertical movement part and the horizontal movement part 44 are not limited to the guide actuator driven by a motor, For example, they may be comprised by the guide air cylinder driven by air.

On the other hand, in the known peeling device, there is a method of applying an external force in the thickness direction to the resin overflowing from the outer periphery of the wafer, whereby a local gap is formed between the edge of the wafer and the resin to produce a thin film. And the beginning of resin peeling. Then, the protective member corresponding to the portion of the opening is grasped, and the protective member is rolled up so that the protective member can be peeled off from the wafer. However, even with such a peeling device, it is expected that resin remains on the outer peripheral portion of the wafer, and the protective member cannot be properly peeled off. In this case, the thickness of the outer peripheral portion may not become uniform in the subsequent grinding process.

In view of this, the inventors of the present application thought of appropriately peeling the protective member from the wafer without leaving resin on the outer peripheral portion of the wafer. Specifically, in the present embodiment, the outer periphery of the protective member P is peeled off by the peripheral peeling means 4 to leave only a part, and the part of the protective member P is grasped by the whole peeling means 5 along the surface direction of the wafer W. By stretching toward the outer peripheral portion on the opposite side, the entire protective member is peeled off from the wafer W. At this time, the guide roller 52 (roller part 52b) which guides peeling of the protection member P presses only the center part in the Y direction with respect to the lower surface of the film F. As shown in FIG.

In this way, the length of the roller portion 52b in the Y-axis direction is designed so that only the central portion of the film F is in contact with, whereby the outer peripheral portion of the protective member P, which was peeled off by the peripheral peeling means 4, is then completely peeled off. When the means 5 peels off the whole protection member P, the peeling is not hindered by the roller part 52b. As a result, it is possible to prevent incomplete peeling from occurring in the outer peripheral portion of the wafer W. That is, the protective member P can be properly peeled off from the wafer W without the resin R remaining on the outer peripheral portion of the wafer W.

Next, the peeling method of the protective member of this embodiment is described in detail with reference to FIG. 2 to FIG. 7 . Fig. 3 is a schematic view showing an example of the holding process of the peeling device of the present embodiment. FIG. 3A shows a state before the protection member is held, and FIG. 3B shows a state after the protection member is held. Fig. 4 is a schematic view showing an example of the outer peripheral edge peeling process of the peeling device of the present embodiment. Fig. 5 is a schematic view showing an example of the outer peeling process of the peeling device of the present embodiment. Fig. 6 is a schematic diagram showing an example of the overall peeling process of the peeling device of the present embodiment. 6A to 6D show the operation transition of the whole peeling process. FIG. 7 is a schematic top model view of a series of processes of the peeling method of this embodiment. Fig. 7 A shows the situation that the outer periphery of the protective member that the 1st peeling group is done peels off, and Fig. 7 B shows the situation that the outer periphery of the protective member that the 2nd peeling group does is peeled off, and Fig. 7 C shows the situation of the protective member that whole peeling means does The case of overall stripping. In addition, in FIG. 3 to FIG. 5 , the peeling by the first peeling group is exemplified.

The peeling method of the protective member P of this embodiment is through the holding process of holding the outer periphery (overflow portion E) of the protective member P (refer to FIG. 3 ), and the peeling process of peeling the outer peripheral edge of the resin (refer to FIG. 4 ). , and the outer peeling process (see FIG. 5 ) of peeling the outer part of the resin and the film, and the overall peeling process (see FIG. 6 ) of peeling the entire protective member.

As shown in FIG. 2 , the holding means 2 attracts and holds the upper surface of the wafer W with the protection member P facing downward. The holding means 2 is positioned above the peripheral peeling means 4 so that the center of the confinement ring 41 coincides with the center of the wafer W. At this time, the tip (end in the radial direction) of the gripping portion 43 (the upper surface supporting portion 46 ) is positioned outside the outer periphery of the film F. As shown in FIG.

As shown in FIG. 3 , in the holding process, the wafer W is placed on the confinement ring 41 in a state where the confinement ring 41 is positioned at the rising end. That is, the lower surface of the film F is in contact with the upper surface of the confinement ring 41 , and the wafer W and the protection member P are sandwiched between the confinement ring 41 and the transfer pad 20 .

Then, as shown in FIG. 3A , each gripping portion 43 is moved by the horizontal moving portion 44 so that the radially inner ends of the upper supporting portion 46 and the lower supporting portion 45 overlap with the outer peripheral portion of the film F in the radial direction. . Moreover, the height of the holding part 50 is adjusted by a vertical movement part (not shown) so that the upper surface of the lower support part 45 and the upper surface of the restricting ring 41 are at the same height. Thereby, the lower surface of the outer peripheral portion of the film F abuts against the upper surface of the lower surface support portion 45 .

Then, as shown in FIG. 3B , the upper surface support part 46 descends, and the lower surface of the upper surface support part 46 abuts on the upper surface of the film F. As shown in FIG. Thereby, the gripping part 43 grips the outer peripheral edge (overflow part E) of the film F. As shown in FIG.

Next, the outer peripheral edge peeling process is implemented. As shown in FIG. 4 , in the outer peripheral edge peeling process, each gripping portion 43 moves toward the holding surface direction (outward in the radial direction of the wafer W) in a state where the gripping portion 43 grips the overflow portion E. Thereby, the protection member P is stretched in a direction away from the outer peripheral edge of the wafer W toward the outside. As a result, a slight gap is formed between the overflowed resin R and the outer peripheral edge of the wafer W from the outer periphery of the wafer W.

Next, the outer peeling process is carried out. In FIG. 4, after the holding portion 43 is moved outward in the radial direction (direction away from the outer periphery of the wafer W) by the horizontal moving portion 44, as shown in FIG. Move below. That is, the grasping portion 43 moves in a direction away from the holding surface 21 . Thereby, the resin R and the outer peripheral part (overflow part E) of the film F are pulled down downward. As a result, the gap between the resin R formed in FIG. 4 and the outer peripheral edge of the wafer W is enlarged, and the gap reaches below the outer peripheral portion of the wafer W.

At this time, the lower surface of the wafer W, that is, the lower surface of the film F is supported by the confinement ring 41 , so the expansion of the above-mentioned gap is restricted at the outer peripheral edge of the confinement ring 41 . In this way, the predetermined range of the lower surface of the film F is supported by the restricting ring 41, whereby the peeling amount of the protective member P, that is, the peeling margin can be restricted. As described above, only the predetermined range of the outer periphery of the protective member P can be peeled off from the wafer W.

In addition, in FIGS. 3 to 5, the gripping process, the outer peripheral edge peeling process, and the outer peeling process are implemented by the first peeling group G1. As shown in FIG. The specified stripping margin shall be stripped. In the second peeling group G2, as shown in Fig. 3 to Fig. 5, the holding process, the outer peripheral edge peeling process, and the outer peeling process are carried out, so that the 3 places between the 4 peeling places can also be separated by a predetermined Peel off the remaining edges to peel off. As a result, as shown in FIG. 7B , a part of the outer periphery of the protective member P remains and the protective member P is peeled off from the outer periphery of the wafer W. As shown in FIG.

Next, the whole stripping process is implemented. As shown in FIG. 6 , holding means 2 transports wafer W from peripheral peeling means 4 to overall peeling means 5 . In the overall peeling process, first, as shown in FIG. 6A , a part of the outer periphery of the protective member P (overflow portion E) remaining without peeling in the outer peripheral edge peeling process is gripped by the gripping portion 50 . At this time, the holding means 2 is positioned such that the roller portion 52b is located on one end side of the wafer W (the side to be gripped by the gripping portion 50). Further, the roller portion 52b comes into contact with the lower surface of the film F, and the wafer W and the protection member P are sandwiched between the transfer pad 20 and the roller portion 52b.

Then, the holding means 2 is moved in a direction away from the holding part 50, and as shown in FIG. Edge peeled off. Next, the gripping part 50 moves downward while rotating, using the position that is translated backward from the gripping position of the film F as a fulcrum. As a result, as shown in FIG. 6C , the protection member P adjacent to the holding portion 50 is peeled off from the outer periphery of the wafer W, and the protection member P is bent at a substantially right angle while abutting against (guided) the roller portion 52b.

Furthermore, as shown in FIG. 6D , while adjusting the rotation angle and height of the holding portion 50, the holding portion 50 is moved forward, that is, the outer periphery on the opposite side from the outer periphery of the wafer W with the center as the reference, and the The holding means 2 also moves toward the rear. In this way, the entire protection member P can be peeled off from the wafer W by relatively moving the holding portion 50 and the wafer W along the surface direction of the holding surface 21 .

In addition, as shown in FIG. 7C , during peeling, the protective member P is bent while being guided by the roller portion 52b, but the roller portion 52b only pushes the lower central part of the film F, so the peeled protective member P The outer peripheral portion of the wafer W is not pushed toward the wafer W side by the roller portion 52b. Therefore, peeling of the protective member P is not hindered. As a result, the protective member P can be properly peeled off from the wafer W without the resin R remaining on the outer peripheral portion of the wafer W.

In addition, the protective member P after peeling is laminated|stacked in the trash can 9 by the lamination means 6 (refer FIG. 1). In addition, in FIG. 6, although the protection member P is peeled off by making the grip part 50 face forward, it is designed, but it is not limited to this structure. For example, the grip part 50 may be continuously moved downward instead of forwardly, and the protective member P may be bent at right angles to peel off the entirety.

As described above, according to the present embodiment, the overflow portion E overflowing from the outer peripheral edge of the wafer W is stretched horizontally and vertically by the outer peripheral peeling means 4 . As a result, a gap is formed between the resin R and the wafer W on the outer periphery of the wafer W except for a part. Then, starting from this gap, the protective member P can be peeled off from the wafer W by the whole peeling means 5 . At this time, since the holding part 50 is moved while the central part of the protection member P is pushed by the roller part 52b, it is possible to prevent incomplete peeling from occurring at the outer peripheral part of the wafer W. That is, the protective member P can be properly peeled off from the wafer W without resin remaining on the outer peripheral portion of the wafer W.

For example, in the above embodiment, in the holding process shown in FIG. 3 , the wafer W is placed on the confining ring 41 and then the overflow portion E is held by the holding portion 43. However, it is not limited to this structure. . For example, after the overflow part E is grasped by the holding part 43, the restricting ring 41 may be lifted up so that the upper surface of the restricting ring 41 abuts against the lower surface of the film F. FIG.

In addition, in the said embodiment, the peripheral peeling means 4 was divided into the 1st peeling group G1 and the 2nd peeling group G2, and the structure which provided seven holding means 42 was designed, but it is not limited to this structure. The number of holding means 42 can be changed appropriately. For example, it may also be configured such that four holding means 42 are arranged at equal angular intervals, and after the outer periphery of the protective member P is peeled off at predetermined four places, the wafer W and the holding means 42 are aligned with the center of the wafer W as an axis. By relative rotation at a predetermined angle (for example, 45 degrees), the protective member P at three locations between the four peeled locations that were peeled off earlier is peeled off. In this case, the transfer pad 20 may be rotated around the central axis, and the four holding means 42 may be rotated around the central axis of the wafer W (or the confining ring 41 ).

Here, a peeling device according to a modified example will be described with reference to FIGS. 8 to 13 . Fig. 8 is an overall perspective view of a peeling device according to a modified example. 9 to 12 are schematic action transition diagrams of the entire peeling process of the peeling device of the modified example. Fig. 13 is a schematic diagram of a disposal process of a peeling device according to a modified example.

As shown in FIG. 8 , the peeling device 1 of the modified example is slightly different from the present embodiment in the configuration of the peripheral peeling means 4 and the whole peeling means 5 . Specifically, the peripheral peeling means 4 is provided with a turntable 40a on the upper surface of the base 40, and a restricting ring 41 is provided at the center of the upper surface of the turntable 40a. Two holding means 42 are provided so as to face each other across the center (restriction ring 41 ) of the turntable 40a. The turntable 40a can be rotated around the center of the turntable 40a by means of a rotating means 40b composed of an electric motor or the like. Thereby, the gripping means 42 is configured to be rotatable with the center of the wafer W placed on the confinement ring 41 as an axis. That is, the turntable 40a and the rotating means 40b constitute the outer circumference moving means, and the holding means 42 is rotated and moved along the outer circumference of the wafer W by the rotation axis whose axis is the center of the wafer W.

In the outer peripheral peeling means 4 thus constituted, after the outer periphery of the protective member P is gripped and peeled at two predetermined places by the two gripping means 42, the turntable 40a is rotated by a predetermined angle, and the protective member P is gripped by the gripping means 42. stripped away. By repeating this several times, the outer periphery of the protective member P can be peeled off from the wafer W except at predetermined points.

In addition, the entire peeling means 5 of the modified example is different from the present embodiment in that it is not rotatable but fixed in the direction in which the arm 53 extends. In addition, the arm 53 and the holding part 50 can be raised and lowered by the lifting means 53a constituted by a motor-driven guide actuator. The lifting means 53a is arranged on the X-axis table 54 .

In the overall peeling means 5 thus constituted, as shown in FIG. At this time, the holding means 2 is positioned such that the roller portion 52b is located on one end side of the wafer W (the side to be gripped by the gripping portion 50). Further, the roller portion 52b comes into contact with the lower surface of the film F, and the wafer W and the protection member P are sandwiched between the transfer pad 20 and the roller portion 52b.

Then, the holding means 2 is slightly moved in a direction away from the holding portion 50 , and the remaining outer peripheral portion of the protection member P is slightly peeled off from the wafer W. Thereafter, as shown in FIG. 10 , the protection member P is gradually peeled off by moving the holding means 2 horizontally while moving the gripping portion 50 downward by the elevating means 53 a. Then, as shown in FIG. 11 , the holding part 50 is moved downward, and the holding means 2 is moved until the roller part 52b passes over the other end of the wafer W, and the entire protection member P is peeled off from the wafer W.

As shown in FIG. 12 , immediately after the protective member P is peeled off from the wafer W, one end of the overflow portion E is held by the gripping portion 50 , and the other end side of the protective member P hangs down by its own weight. In this state, the holding part 50 is raised by the elevating means 53 a and moved horizontally by the moving means 51 (see FIG. 8 ), and the holding part 50 is positioned near the guide rail 70 .

As shown in FIG. 13 , once the grasping portion 50 moves to the upper end of the guide rails 70 , the film F side of the protection member P abuts against the inclined surfaces of the pair of guide rails 70 . Thereby, the protection member P inclines slightly with respect to the vertical direction along a pair of guide rail 70. As shown in FIG. When the pair of claw portions 50 a are separated from each other in a state where the protection member P is moved along the pair of guide rails 70 , the grasping of the overflow portion E is released.

The protection member P falls obliquely downward along the pair of guide rails 70 by its own weight, and on the top of the trash can 9, its moving direction is guided to a horizontal direction by the pair of guide rails 80, and falls to the trash can on the one hand. 9 inside. Thereby, the protective member P after peeling is discarded in the trash can 9. As shown in FIG.

In addition, in the above-mentioned embodiment, in the outer peripheral edge peeling process and the outer peeling process shown in FIG. 4 and FIG. Although it moves downward in a vertical direction and peels off the outer periphery of the protection member P step by step, it is not limited to this. It is also possible to perform the outer peripheral peeling process and the outer peeling process in a series of processes. For example, the outer circumference of the protective member P may be peeled off by rotating the gripping portion 43 to move the gripping portion 43 in a circular arc, thereby performing radially outward movement and downward movement in a series of procedures.

In addition, in the above-mentioned embodiment, the protection member P is peeled off by the peripheral peeling means 4, and only a part of outer periphery remains, but it is not limited to this structure. The entire periphery of the protective member P may also be peeled off by the peripheral peeling means 4 . That is, although the peripheral peeling by the 1st peeling group G1 and the peripheral peeling and the whole peeling by the 2nd peeling group G2 were implemented separately, what is necessary is just to peel off the whole after peeling off the outer peripheral part. Therefore, the first peeling group G1, the second peeling group G2, and the gripping parts 43 and 50 of the entire peeling means 5 grip the overflow part E and simultaneously peel the outer peripheral part.

In addition, in this embodiment, although the structure of a peeling apparatus single body was demonstrated, it is not limited to this structure. The present invention can also be applied to various processing devices for performing various processing such as grinding, lapping, and cutting, for example.

In addition, as the workpiece to be processed, semiconductor element wafers, optical element wafers, packaging substrates, semiconductor substrates, inorganic material substrates, oxide wafers, bare ceramic substrates, piezoelectric substrates, etc. can also be used depending on the type of processing. Various artifacts. As the semiconductor element wafer, a silicon wafer or a compound semiconductor wafer after element formation may be used. As the optical element wafer, a sapphire wafer or a silicon carbide wafer after element formation can also be used. In addition, a CSP (Chip Size Package) substrate can also be used as a packaging substrate, silicon or gallium arsenide can be used as a semiconductor substrate, and sapphire, ceramics, glass, etc. can be used as an inorganic material substrate. In addition, lithium tantalate and lithium niobate after element formation or before element formation can also be used as the oxide wafer.

In addition, in the above-mentioned embodiment, the configuration in which the guide rails 70 and 80 are formed in the shape of a rod having a circular cross section is designed, but the configuration is not limited to this configuration. The guide rails 70 and 80 may be formed, for example, as a plate-shaped body formed by bending a metal plate.

In addition, in the said embodiment, the guide roller 52 provided with the columnar roller part 52b was mentioned as an example and demonstrated as the roller which presses the center part of the protection member P. As shown in FIG. In this case, during the entire peeling process, the lower surface of the film F is in line contact or surface contact with the cylindrical surface of the roller portion 52b, and the peeling of the protective member P is guided. However, it is not limited to this structure, It can change suitably. The roller may have any configuration as long as it presses the central portion of the protective member P, and may be configured by, for example, a spherical roller provided with a spherical surface. In this case, during the entire peeling process, the lower surface of the film F is in point contact with the spherical surface of the roller, and the peeling of the protective member P is guided.

In addition, although each embodiment of this invention was described, as another embodiment of this invention, what combined the above-mentioned embodiment and modification in whole or in part may be sufficient.

In addition, the embodiments of the present invention are not limited to the above-mentioned embodiments, and various changes, substitutions, and deformations are possible without departing from the scope of the technical idea of the present invention. Even, if the technical idea of the present invention can be realized in other ways due to technical progress or other derived technologies, then this method can also be used for implementation. Therefore, the scope of the patent application includes all possible implementation aspects within the scope of the technical idea of the present invention. [Industrial Utilization]

As described above, the present invention has the effect that the protective member can be properly peeled off from the wafer without resin remaining on the outer peripheral portion of the wafer. Especially useful for devices.

W‧‧‧wafer P‧‧‧protective member R‧‧‧resin F‧‧‧film E‧‧‧overflow part 1‧‧‧peeling device 2‧‧‧holding means 21‧‧‧holding surface 4‧‧‧ Peripheral peeling means 42‧‧‧holding means (first peripheral peeling means, second peripheral peeling means) 43‧‧‧holding part (second holding part) 44‧‧‧horizontal movement part G1‧‧‧first peeling group (1st peripheral peeling means) G2 ‧‧‧2nd peeling group (2nd peripheral peeling means) 5‧‧‧whole peeling means 50‧‧‧holding part (first holding part) 51‧‧‧moving means 52b‧ ‧‧Roller (Roller)

[ Fig. 1 ] An overall perspective view of a peeling device according to this embodiment.

[ Fig. 2 ] A schematic diagram of a peeling device according to this embodiment.

[ Fig. 3 ] A schematic diagram showing an example of the holding process of the peeling device of the present embodiment. FIG. 3A shows a state before the protection member is held, and FIG. 3B shows a state after the protection member is held.

[ Fig. 4 ] A schematic diagram showing an example of the outer peripheral edge peeling process of the peeling device of the present embodiment.

[Fig. 5] An example of the outer peeling process of the peeling device of this embodiment schematic diagram.

[ Fig. 6 ] A schematic diagram showing an example of the whole peeling process of the peeling device of the present embodiment. 6A to 6D show the operation transition of the whole peeling process.

[ Fig. 7 ] A schematic plan view of a series of processes of the peeling method of the present embodiment. Fig. 7 A shows the situation that the outer periphery of the protective member that the 1st peeling group is done peels off, and Fig. 7 B shows the situation that the outer periphery of the protective member that the 2nd peeling group does is peeled off, and Fig. 7 C shows the situation of the protective member that whole peeling means does The case of overall stripping.

[ Fig. 8 ] An overall perspective view of a peeling device according to a modified example.

[ Fig. 9 ] A schematic diagram of the whole peeling process of the peeling device of the modified example.

[ Fig. 10 ] A schematic diagram of the whole peeling process of the peeling device of the modified example.

[ Fig. 11 ] A schematic diagram of the whole peeling process of the peeling device of the modified example.

[ Fig. 12 ] A schematic diagram of the whole peeling process of the peeling device of the modified example.

[ Fig. 13 ] Schematic diagram of a disposal process of a peeling device according to a modified example.

50‧‧‧Control Department (1st Control Department)

50a‧‧‧claw

52‧‧‧Guide roller

52b‧‧‧roller part (roller)

E‧‧‧overflow

F‧‧‧film

P‧‧‧protection components

R‧‧‧resin

W‧‧‧Wafer

Claims (2)

A peeling device that fixes the film on one side of the wafer through a resin in the state where the film overflows from the outer peripheral edge of the wafer is formed, and puts the protective member made of the resin and the film A peeling device for peeling off from a wafer is provided with: a holding means having a holding surface for attracting and holding the other surface of the wafer that will become the upper surface of the protective member facing downward; and a peripheral peeling means for holding the protective member. The overflow part peels the outer peripheral part of the protective member from the wafer to leave a part of the outer periphery; and the whole peeling means grasps the overflow part of the remaining part of the outer periphery, and the entire protective member is removed from the outer peripheral part side of the protective member. Peeling from the wafer; the overall peeling means is equipped with: a first holding part that holds the overflow part of the part of the outer periphery that has not been peeled off by the outer peripheral peeling means; The central part of the protective member that is peeled off and fixed to the wafer is pushed; and the moving means moves the first holding part and the holding means in the direction of the holding surface relative to the holding means; the outer peripheral peeling means has: a plurality of The first peripheral peeling means is arranged at predetermined angular intervals around the center of the wafer; the plurality of second peripheral peeling means is arranged on the first peripheral peeling means Between; the first outer peripheral peeling means and the second outer peripheral peeling means are equipped with: a second holding part, which holds the overflow part; The outer periphery moves away from the direction; and the descending part makes the second holding part moved by the horizontal moving part descend in the vertical direction perpendicular to the holding surface; by the roller, the The protective member at the central portion of the wafer held by the holding means is pushed toward the wafer, and the protective member is completely peeled off from the wafer. A peeling device that fixes the film on one side of the wafer through a resin in the state where the film overflows from the outer peripheral edge of the wafer is formed, and puts the protective member made of the resin and the film A peeling device for peeling off from a wafer is provided with: a holding means having a holding surface for attracting and holding the other surface of the wafer that will become the upper surface of the protective member facing downward; and a peripheral peeling means for holding the protective member. The overflow part peels the outer peripheral part of the protective member from the wafer to leave a part of the outer periphery; and the whole peeling means grasps the overflow part of the remaining part of the outer periphery, and the entire protective member is removed from the outer peripheral part side of the protective member. Peeling from the wafer; the overall peeling means is equipped with: a first gripping part that holds the remaining parts that are not peeled off by the peripheral peeling means the overflow part leaving a part of the outer periphery; and the roller, which is not peeled off by the outer periphery peeling means and is fixed to the central part of the protection member of the wafer; and the moving means makes the first holding The part moves relative to the holding means in the direction of the holding surface; the outer peripheral peeling means is provided with: a second holding part, which holds the overflow part; and a horizontal movement part, which makes the second holding part face the wafer from the holding surface. and the descending part makes the second holding part moved by the horizontal moving part move in the vertical direction perpendicular to the holding surface; and the outer peripheral moving means makes the The second gripping part, the horizontal moving part, and the descending part rotate and move along the outer periphery of the wafer with a rotation axis centered on the wafer center; The protective member at the central portion of the circle is pushed toward the wafer, and the protective member is completely peeled off from the wafer.

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