TWI792441B - Electronic device testing apparatus having multi-layer testing module - Google Patents

Abstract

The present invention relates to an electronic component testing device with a multi-layer structure test module, which mainly includes a feeding and distributing module, a chip transfer module, a multi-layer structure testing module and a main controller, and the feeding and distributing module It is separated from the multi-layer structure test module and located around the chip transfer module. Among them, the wafer transfer module is controlled to transfer the electronic components to be tested from the feeding and distributing module to the multi-layer structure testing module, and is controlled to transfer the tested electronic components from the multi-layer structure testing module to the feeding and distributing module . Accordingly, the feeding and distributing module, the wafer transfer module and the multi-layer structure test module are three separate modules that can be flexibly configured, and the multi-layer structure test module presents a three-dimensional multi-layer structure configuration, thereby The detection capacity can be significantly improved, and diversified detection can be easily realized.

Description

Electronic component testing equipment with multi-layer structure test module

The invention relates to an electronic component testing device with a multi-layer structure testing module, especially an electronic component testing device for testing the quality of electronic components.

Existing semiconductor wafer inspection machines are configured in a planar configuration, that is, as shown in Figure 1, a wafer inspection area Zt is arranged on one side of the entire equipment, and a wafer feeding and unloading area Zc is arranged on the other side. At least one wafer pick and place device Dp for handling wafers.

To further illustrate, a plurality of wafer inspection modules 11 are arranged in the wafer inspection area Zt, which are used to actually perform wafer testing, such as system level testing (System Level Testing, SLT); A container for loading wafer extraction trays, which includes a feed box 12, a good product box 13, and a defective product box 14; wherein, the wafer extraction trays contained in the feed box 12 are all wafers to be tested, before being officially tested , the wafer extraction tray loaded with the wafers to be tested will be transferred to an extraction tray carrier 15 . Next, the wafer pick-and-place device Dp transports the wafer to be tested from the extraction tray stage 15 to the wafer inspection module 11 for testing. Finally, after the test is completed, the wafer pick-and-place device Dp will transfer the tested wafers from the wafer inspection module 11 to the wafer extraction tray on the good product box 13 or the defective product box 14 according to the test results.

However, as the function of the wafer to be tested becomes more and more powerful, and more and more items need to be inspected, the inspection time becomes longer and longer, that is, the time for the wafer to be inspected to stay on the wafer inspection module 11 is getting longer and longer. For example, the inspection time of a powerful graphics processing chip even needs to be as long as several hours. Accordingly, limited by the planar configuration of existing machines, the number of wafer inspection modules 11 is limited, so there will inevitably be a waiting time for the transfer device, and the optimal operating efficiency of the equipment cannot be fully utilized.

On the other hand, the configuration of existing wafer testing machines can detect only one type of wafer to be tested, that is to say, a single machine can detect a single wafer. Because of the limited number of wafer testing modules 11, it is impossible to test a single wafer in a single machine. Realize the effect of testing a variety of wafers to be tested. Furthermore, limited by the planar configuration of the existing machines, the utilization of space is poor, resulting in a relatively high cost of space and site.

It can be seen from this that an electronic component testing equipment that can greatly improve the testing efficiency and site space utilization, and can realize multi-purpose and multiple testing items, is really eagerly awaited by the industry and the general public.

The main purpose of the present invention is to provide an electronic component testing equipment with a multi-layer structure test module, which can greatly improve the detection capacity of electronic components, and can reduce the idle time of devices or equipment, which can significantly improve the detection efficiency, and The type of test object can be expanded to increase the test scale.

In order to achieve the above object, the present invention provides an electronic component testing device with a multi-layer structure test module, which mainly includes a feeding and distribution module, a chip transfer module, at least one multi-layer structure test module and a main Controller; the main controller is electrically connected to the feeding and distributing module, the chip transfer module and the multi-layer structure testing module; wherein, the feeding and distributing module is separated from at least one multi-layer structure testing module Around the wafer transfer module; the main controller controls the wafer transfer module to transfer an electronic component to be tested from the feeding and dispensing module to at least one multi-layer structure test module, and controls the wafer transfer module to transfer from at least one A multi-layer structure test module transfers a tested electronic component to the feeding and distributing module; wherein, at least one multi-layer structure test module includes a shelf and a plurality of test units; and the shelf includes a plurality of accommodating spaces, It is vertically arranged on the shelf; and the plurality of test units are respectively arranged in the plurality of accommodating spaces.

Accordingly, the wafer feeding and unloading area, the wafer inspection area and the wafer pick-and-place device of the conventional electronic component testing equipment are split into three separate modules, i.e. feeding and distributing module, wafer transfer module and The multi-layer structure test module is more convenient to flexibly configure the number of modules and the relative positions between each other according to actual needs; and the multi-layer structure test module presents a three-dimensional multi-layer structure configuration, thereby greatly increasing the number of test units In addition to significantly improving the detection capacity, the detection efficiency and production capacity can be improved, and it can be upgraded to a variety of detection with multiple test specifications.

Preferably, the multi-layer structure test module of the present invention can include at least one temperature control module, which can be arranged on one side of the shelf, and the temperature control module is connected to the crimping head, the test socket and the plurality of test units. At least one of the wafer shuttles; and the temperature control module can regulate the temperature of the electronic components to be tested through at least one of the crimping head, the test socket and the wafer shuttle, and maintain it at a specific temperature. In other words, the multi-layer structure test module of the present invention can be equipped with a temperature control module, and it can be installed on one side of the shelf, without occupying the test unit's accommodating space, which can achieve the optimization of space utilization.

In addition, the plurality of test units of the present invention may include a first test unit and a second test unit; when the first test unit detects the finished electronic component and judges it to be a defective product, the main controller can control the chip transfer module The group transfers it to the second test unit for testing; if the second test unit judges that the tested electronic component is a good product, the main controller marks the first test unit; when the first test unit is marked for the second time, the main controller The controller stops the operation of the first test unit. In other words, when the test result is a defective product, the present invention can transfer the defective product to another test unit for retesting, and repeat the test at least twice to ensure that the previous test unit is judged as correct; , if two misjudgments occur in the same test unit, the test unit will be marked as a failure, and the test operation of the test unit will be suspended immediately.

Furthermore, the feeding and distributing modules of the present invention may include an upper module and a lower module, and the upper module and the lower module are stacked up and down; and the upper module and the lower module may each include at least one supply Material box, at least one output box, and at least one empty material box, the feeding box can store the material tray to be tested, the output box can store the tested material tray, and the empty material box can store the empty material tray; The electronic components to be tested can be placed, and the tested electronic components can be placed on the finished test material tray. In other words, the feeding and distributing module of the present invention can also adopt a three-dimensional multi-layer structure, that is, multi-layer feeding and distributing, so as to increase the capacity of the electronic components to be tested and completed, so as to improve the operating life; It can also be used to expand the types of test objects to increase the test scale.

Before the detailed description of the electronic component testing device with the multi-layer structure testing module of the present invention, it should be noted that in the following description, similar components will be denoted by the same component symbols. Furthermore, the drawings of the present invention are for illustrative purposes only, and may not be drawn to scale, and not all details may be presented in the drawings.

Please refer to FIG. 2 first, which is a schematic diagram of a preferred embodiment of the electronic component testing equipment of the present invention. As shown in the figure, the electronic component testing equipment of this embodiment mainly includes a feeding and distributing module 2, a wafer transfer module 3, two multi-layer structure testing modules 4 and a main controller 5; The device 5 is electrically connected to the feeding and distributing module 2, the wafer transfer module 3 and the multi-layer structure testing module 4. Also, the two multi-layer structure test modules 4 are located on two corresponding sides of the wafer transfer module 3, and the feeding and distribution module 2 are arranged on the other side of the wafer transfer module 3, that is, they are located on the other side of the wafer transfer module 3. A U-shaped configuration is formed between one side of the two multi-layer structure test modules 42, that is, the chip transfer module 3 is arranged in the middle of the U-shaped configuration.

Please also refer to Fig. 3, which is a schematic diagram of a preferred embodiment of the multi-layer structure test module 4 of the present invention; in this embodiment, each multi-layer structure test module 4 includes a shelf 41, six test units 42 And the second temperature control module 6, please refer to FIG. 2 for the temperature control module 6. Wherein, the shelf 41 includes six accommodating spaces 40 , which are vertically arranged in pairs on the shelf 41 , and six test units 42 are respectively arranged in the six accommodating spaces 40 .

Please also refer to Fig. 4A and 4B together. Fig. 4A is a schematic diagram of a preferred embodiment of the multi-layer structure test module of the present invention where the wafer shuttle car is located at the first position. Fig. 4B is a preferred implementation of the multi-layer structure test module of the present invention A schematic diagram of an example of a wafer shuttle in the second position. In this embodiment, each test unit 42 includes a crimping head 421, a test seat 422 and a wafer shuttle car 423, the crimping head 421 is arranged above the test seat 422, and the wafer shuttle car 423 is optionally located on a first A position P1 or a second position P2. Wherein, the first position P1 refers to the position where the wafer shuttle car 423 is located between the crimping head 421 and the test seat 422, that is, the position where the crimping head 421 takes and places material, as shown in Figure 4A; and the second position P2 refers to the position where the wafer shuttle 423 is far away from the crimping head 421 and the test seat 422 and where the wafer transfer module 3 picks and places the electronic component IC1 to be tested and the electronic component IC2 to be tested, as shown in FIG. 4B .

To further illustrate, the crimping head 421 of the present embodiment includes a plurality of negative pressure suction nozzles 424; The nozzle 424 sucks the electronic component IC1 to be tested, or places the electronic component IC2 under test on the wafer shuttle car 423 with the negative pressure suction nozzle 424; Sliding, so that the crimping head 421 can absorb the electronic component IC1 to be tested.

Furthermore, after the crimping head 421 absorbs the electronic component IC1 to be tested, the wafer shuttle 423 is away from between the crimping head 421 and the test seat 422, which is the second position P2; at this time, the crimping head 421 descends and approaches the test seat 422 to place the electronic component IC1 to be tested in the test seat 422 and continuously press down the electronic component IC1 to detect the electronic component IC1 to be tested, as shown in FIG. 4B .

On the other hand, as shown in Figure 2, a temperature control module 6 is respectively arranged on both sides of the shelf 41, which is connected to the crimping joint 421 of each test unit 42; the temperature control module 6 provides high temperature or The low temperature temperature control fluid is supplied to the pressure joint 421 to regulate the temperature of the electronic component IC1 to be tested and maintain it at a specific temperature for high temperature test or low temperature test. Of course, the temperature control module 6 of the present invention is not limited to only providing the temperature control fluid to the pressure joint 421, but can also be provided to the test socket 422 simultaneously to create a complete temperature control environment; or, to provide the temperature control fluid to the The wafer shuttle 423 is used to raise or lower the temperature of the electronic component IC1 to be tested in advance, so as to reduce the waiting time for temperature control to the specific temperature only by the pressure connector 421 .

Please refer to Fig. 2 and Fig. 5 together, Fig. 5 is a schematic diagram of a preferred embodiment of the present invention's feeding and distributing module 2; the feeding and distributing module 2 of this embodiment includes an upper module 22 and a lower layer Module 23; that is to say, the feeding and distributing module 2 of this embodiment also adopts a three-dimensional multi-layer structure, that is, multi-layer feeding and distributing, so that the capacity of the electronic components to be tested and completed can be increased. , to increase the operating life; it can also be used to expand the types of objects to be tested to increase the test scale.

To further illustrate, the upper module 22 and the lower module 23 of the present embodiment each include a feeding box 24, six output boxes 25, an empty magazine 26, a transport shuttle platform 27, a material transfer unit 28 and A tray transfer unit 29; the supply box 24 is used to store the tray 241 to be tested, and the tray 241 to be tested is used to load the electronic component IC1 to be tested; the output box 25 is used to store the test material Tray 251, and the finished test material tray 251 is used for loading the tested electronic component IC2, that is to say, the six output magazines 25 can respectively store the tested electronic component IC2 according to different test results; again, the empty magazine 26 is used for An empty tray 261 is stored, that is, an empty tray 241 to be tested.

In addition, please continue to refer to Fig. 2 and Fig. 5, the transfer shuttle platform 27 of the present embodiment can be selectively moved between an internal position Pin and an external position Pout, and the internal position Pin is carried out inside the upper module 22 and the lower module 23. The position of feeding and distributing, and the external position Pout is that the transfer shuttle table 27 protrudes out of the body of the feeding and distributing module 2 for the chip transfer module 3 to pick and place the electronic component IC1 and the electronic component to be tested. The location of component IC2.

In detail, the transfer shuttle table 27 of this embodiment includes two chip accommodating slots 271 for respectively storing the electronic component IC1 to be tested and the electronic component IC2 to be tested. In addition, the material distribution and transfer unit 28 is used to transfer the electronic component IC1 to be tested between the tray 241 to be tested and the wafer storage tank 271 of the shuttle table 27 located at the inner position Pin, that is, the material supply operation. ; On the other hand, the material transfer unit 28 can be used to transfer the finished electronic component IC2 between the wafer storage groove 271 and the finished test tray 251 of the transfer shuttle table 27 located at the internal position Pin, that is, the divided material work.

As for, the tray transfer unit 29 is used to transfer the empty tray 241 to be tested from the supply magazine 24 to the empty magazine 26 as the empty tray 261; The magazine 26 transfers an empty tray 261 to the outlet magazine 25 as a finished tray 251 to replenish the full tray 251 . On the other hand, when the transport shuttle 27 slides to the external position Pout, the transport shuttle 27 is for the wafer transfer module 3 to pick and place the electronic component IC1 to be tested and the electronic component IC2 to be tested.

The following briefly describes the wafer transfer operation of this embodiment; first, the main controller 5 controls the material distribution and transfer unit 28 to transfer a test electronic component IC1 from the test tray 241 to the transfer shuttle platform 27 located at the internal position Pin Then, the dispensing and transferring unit 28 also picks up a tested electronic component IC2 from another wafer containing slot 271, and moves it to the corresponding IC2 according to the detection result of the tested electronic component IC2. Finished measuring material tray 251.

Simultaneously, the controller 5 controls the transport shuttle 27 to move to the external position Pout; then, the wafer transfer module 3 takes away the electronic component IC1 to be tested, and transfers it to one of the test units in the multi-layer structure test module 4 42. It is further explained that the wafer transfer module 3 places the electronic component IC1 to be tested on the wafer shuttle 423 at the second position P2, and then removes the electronic component IC2 under test from the wafer shuttle 423. Furthermore, the wafer transfer module 3 transfers the completed electronic component IC2 to the transfer unit 28 for distributing materials, that is, in the wafer receiving groove 271 of the transfer shuttle table 27 located at the external position Pout; The feeding and distributing operations are carried out in a cycle.

In addition, it is added that this embodiment also provides the function of self-inspection of the test unit, that is, repeats the test for the electronic component under test IC1 whose test result is a defective product, to determine whether it is a real test result or caused by a test equipment failure. For example, please refer to Fig. 3, among the six test units 42, a first test unit 42A and a second test unit 42B are temporarily designated; , the main controller 5 controls the wafer transfer module 3 to transfer it to the second test unit 42B for testing, which is the so-called retest; When it is a good product, the main controller 51 marks the first test unit 42A, that is, the first test unit 42A is marked; if the first test unit 42A is marked for the second time, that is, when the above-mentioned situation occurs repeatedly, the main controller 51 judges that the operation of the first test unit 42A is abnormal, and stops the operation of the first test unit 42A.

Moreover, in other embodiments of the present invention, in order to be more prudent, when the first test unit 42A and the second test unit 42B have different test results for the same electronic component IC1 under test, the test can be performed again. Another retest, that is, the third test unit 42C retests the completed electronic component IC2, so as to determine whether the first test unit 42A or the second test unit 42B is abnormal.

In addition, this embodiment also provides an automatic calibration method for the positions between different modules, that is, the positions of the feeding and distributing module 2, the wafer transfer module 3, and the two-layer structure testing module 4. Coordinate calibration. To further explain, for a long time, the position configuration and calibration of different components have always been very cumbersome tasks during machine installation, and once errors occur, it will cause the wafer transfer module 3 to fail to pick and place wafers smoothly, seriously Otherwise, the entire equipment will stop. However, the present embodiment provides the following automatic calibration mechanism, which will successfully solve the above problems.

Please refer to Fig. 2 and Fig. 6 at the same time, Fig. 6 is the perspective view of a preferred embodiment of the calibration element of the present invention, in the present embodiment, feeding and distributing module 2 and two multi-layer structure testing module 4 respectively comprise a calibration Component 7 is a flat plate with a circular boss 71 protruding upwards, and the wafer transfer module 3 includes a laser distance measuring unit 31, which uses the principle of emitting laser light to the object to be distance measured Pulse and start timing, and stop timing when receiving reflected light, so that this period of time can be converted into the distance between the laser ranging unit 31 and the target.

The specific implementation method is that the main controller 5 controls the laser ranging unit 31 of the wafer transfer module 3 to scan the circular protrusion on the calibration element 7 of the feeding and distributing module 2 and the two-layer structure testing module 4 respectively. The position coordinates of the platform 71, the main controller 5 uses these position coordinates as the calibration coordinates of the feeding and distributing module 2 and the two-layer structure testing module 4 respectively; wherein, the above-mentioned circular boss 71 The position coordinates are the center coordinates of the circular protrusions 71 , and the specific calculation method is described later.

First, the main controller 5 controls the wafer transfer module 3 to scan the circular boss 71 on the calibration element 7 with the laser distance measuring unit 31 along the first direction D1. When the boss is 71, record the initial position P11 of the first boss due to the sudden increase in height, and record the end position P12 of the first boss due to the sudden drop in height. Next, the control unit calculates and obtains a first midpoint position P1C between the first boss start position P11 and the first boss end position P12 extending along the first direction D1.

In addition, the main controller 5 controls the laser ranging unit 31 to scan the circular boss 71 on the calibration element 7 along the second direction D2; and when the laser ranging unit 31 scans to the circular boss 71, Record the initial position P21 of the second boss generated by the sudden increase in height, and the end position P22 of the second boss generated by the sudden drop in height. Furthermore, the main controller 5 calculates and obtains a second midpoint position P2C between the second boss start position P21 and the second boss end position P22 extending along the second direction D2. Finally, the main controller 5 obtains the intersection point of the line segment extending along the second direction D2 of the first midpoint position P1C and the line segment extending along the first direction D1 of the second midpoint position P2C as the center position Pc of the intersection point, that is, the circle The center coordinates of the shaped boss 71 are the calibration coordinates of the feeding and distributing module 2 and the two-layer structure testing module 4.

That is to say, the main controller 51 can use these calibration coordinates as the positioning origin coordinates of the feeding and distributing module 2 and the two-layer structure testing module 4, that is, for the wafer transfer module 3, feeding and distributing module 3 Calibration and positioning of the position between the material module 2 and the second multi-layer structure test module 4; and the control chip transfer module 3 can accurately transfer the wafer from the feeding and distributing module 2 according to the calibration coordinates. The electronic component IC1 to be tested to the multi-layer structure test module 4 can also precisely control the chip transfer module 3 to transfer the tested electronic component IC2 from the multi-layer structure test module 4 to the feeding and distributing module 2 . Accordingly, the above-mentioned automatic calibration mechanism can save the cumbersome alignment calibration process of each component during traditional equipment installation, not only can greatly improve the installation efficiency, but also provide quite accurate positioning and calibration, so that the wafer transfer module 3 can be carried out Quite precise retrieving and unloading.

The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be based on the scope of the patent application, rather than limited to the above-mentioned embodiments.

2: Feeding and distributing module 3: Chip transfer module 4: Multi-layer architecture test module 5: Main controller 6: Temperature control module 7: Calibration components 11: Wafer inspection module 12: Feed box 13: Good product box 14: Defective product box 15: Extraction tray carrier 22: Upper module 23: Lower module 24: Feed box 25: Output box 26: Empty Magazine 27: Transport shuttle table 28: Feeding and distributing transfer unit 29: Tray transfer unit 31:Laser ranging unit 40:Accommodating space 41: shelf 42:Test unit 42A: The first test unit 42B: The second test unit 42C: Second test unit 71: circular boss 241: Tray to be tested 251: Complete test tray 261: empty tray 271: Wafer holding tank 421: crimping head 422: Test seat 423: wafer shuttle car 424: Negative pressure nozzle D1: the first direction D2: Second direction Dp: wafer pick and place device IC1: electronic component under test IC2: Finished testing electronic components P1: first position P2: second position P11: The initial position of the first boss P12: End position of the first boss P1C: first midpoint position P21: The starting position of the second boss P22: End position of the second boss P2C: second midpoint position Pc: Center position of intersection point Pin: internal position Pout: external position Zc: Wafer in and out area Zt: Wafer detection zone

FIG. 1 is a three-dimensional schematic diagram of a conventional semiconductor wafer testing machine. Fig. 2 is a schematic diagram of a preferred embodiment of the electronic component testing equipment of the present invention. Fig. 3 is a schematic diagram of a preferred embodiment of the multi-layer structure test module of the present invention. FIG. 4A is a schematic diagram of a preferred embodiment of the multi-layer structure test module of the present invention where the wafer shuttle is located at the first position. FIG. 4B is a schematic diagram of a wafer shuttle in a second position of a preferred embodiment of the multi-layer structure testing module of the present invention. Fig. 5 is a schematic diagram of a preferred embodiment of the feeding and distributing module of the present invention. Fig. 6 is a perspective view of a preferred embodiment of the calibration element of the present invention.

2: Feeding and distributing module 3: Chip transfer module 4: Multi-layer architecture test module 5: Main controller 6: Temperature control module 7: Calibration components 24: Feed box 25: Output box 26: Empty Magazine 27: Transport shuttle table 31:Laser ranging unit 71: circular boss 241: Tray to be tested 251: Complete test tray 261: empty tray 271: Wafer holding tank Pin: internal position Pout: external position

Claims (9)

An electronic component testing device with a multi-layer structure test module, including: a feeding and distribution module; a chip transfer module; at least one multi-layer structure test module; and a main controller, which is electrically connected To the feeding and distributing module, the wafer transfer module and the multi-layer structure testing module; wherein, the feeding and distributing module and the at least one multi-layer structure testing module are separately arranged on the wafer transfer Around the module; the main controller controls the wafer transfer module to transfer an electronic component to be tested from the feeding and dispensing module to the at least one multi-layer structure test module, and controls the wafer transfer module A finished electronic component is transferred from the at least one multi-layer structure test module to the feeding and distribution module; wherein, the at least one multi-layer structure test module includes a shelf and a plurality of test units; the shelf includes a plurality of The accommodating space is vertically arranged on the shelf; the plurality of test units are respectively arranged in the plurality of accommodating spaces; wherein, the feeding and distributing module and the at least one multi-layer structure testing module each include a Calibration components, the main controller controls the wafer transfer module to scan the calibration components of the feeding and distribution module and the at least one multi-layer structure testing module, and obtains the position coordinates of the calibration components, the main controller The position coordinates of the device are respectively used as the calibration coordinates of the feeding and distributing module and the at least one multi-layer structure testing module; the main controller controls the wafer transfer module from the feeding and distributing module according to the calibration coordinates Material mold The group transfers the electronic component to be tested to the at least one multi-layer structure test module, and controls the chip transfer module to transfer the tested electronic component from the at least one multi-layer structure test module to the supply and distribution material mod. Such as the electronic component testing equipment of claim 1, wherein each test unit includes a crimping head, a test seat and a wafer shuttle, the crimping head is arranged above the test seat, and the wafer shuttle can be optionally located A first position or a second position, the first position refers to the position where the wafer shuttle is located between the crimping head and the test socket, the second position refers to the wafer shuttle is far away from the crimping head and the test socket between the seats and for the chip transfer module to pick and place the electronic component to be tested and the electronic component to be tested. The electronic component testing equipment according to claim 2, wherein the crimping head includes at least one negative pressure suction nozzle; when the wafer shuttle car is at the first position, the crimping head approaches the wafer shuttle car, and uses the at least one The negative pressure suction nozzle sucks the electronic component to be tested, or places the tested electronic component on the wafer shuttle with the at least one negative pressure suction nozzle; when the wafer shuttle is at the second position, the crimping head approaches the The test seat is used to place the electronic component under test on the test seat, and continuously press down the electronic component under test to detect the electronic component under test. The electronic component testing equipment according to claim 2, wherein the at least one multi-layer structure test module includes at least one temperature control module, which is arranged on one side of the shelf, and the temperature control module is connected to the plurality of At least one of the crimping head, the test socket and the wafer shuttle car of the test unit; the temperature control module controls the temperature of the electronic component to be tested through at least one of the crimping head, the test socket and the wafer shuttle car temperature. The electronic component testing equipment as claimed in claim 1, wherein the plurality of testing units include a first testing unit and a second testing unit; The main controller controls the wafer transfer module to transfer it to the second test unit for testing; if the second test unit judges that the tested electronic component is a good product, the main controller marks the first test unit ; When the first test unit is marked for the second time, the main controller stops the operation of the first test unit. The electronic component testing equipment according to claim 1, wherein the calibration element includes at least one circular boss; the wafer transfer module includes a laser ranging unit; the main controller controls the wafer transfer module respectively Scanning the at least one circular boss on the calibration element with the laser distance measuring unit along a first direction and a second direction, thereby obtaining the position of the center of intersection of the at least one circular boss, so as to As the calibration coordinates of the feeding and distributing module and the at least one multi-layer structure testing module. The electronic component testing device according to claim 6, wherein the main controller controls the wafer transfer module to scan the at least one circular boss on the calibration component along the first direction with the laser ranging unit , when the laser ranging unit scans to the at least one circular boss, record a first boss start position and a first boss end position generated by the height change; the control unit calculates the A first midpoint between the starting position of the first boss and the end position of the first boss extending in the first direction; the main controller controls the laser ranging unit to scan the calibration along the second direction The at least one circular boss on the component; when the laser ranging unit scans to the at least one circular boss, record the Generate a second boss start position and a second boss end position; the main controller calculates the relationship between the second boss start position and the second boss end position extending along the second direction A second midpoint position; the main controller calculates the intersection of the first midpoint along the second direction and the second midpoint along the first direction as the center of the intersection. Electronic component testing equipment as in claim 1, wherein the feeding and distributing module includes an upper module and a lower module, the upper module and the lower module are stacked up and down; the upper module and the lower module Each of the modules includes at least one supply box, at least one output box, and at least one empty box, the at least one supply box stores at least one tray to be tested, and the at least one output box stores at least one finished tray, The at least one empty magazine stores at least one empty tray; the electronic component to be tested is placed on the at least one tray to be tested, and the electronic component to be tested is placed on the at least one tested tray. Such as the electronic component testing equipment of claim 8, wherein each of the upper module and the lower module further includes a transfer shuttle, a material transfer unit and a tray transfer unit; the transfer shuttle can be Selectively moving between an internal position and an external position, the transfer shuttle table includes at least one wafer accommodating slot; the distributing and transferring unit is used to transfer the electronic component to be tested on the at least one tray to be tested and the Between the at least one wafer receiving slot of the transfer shuttle table located at the inner position, and the at least one wafer receiving slot and the at least one wafer receiving slot of the transfer shuttle table located at the inner position for transferring the tested electronic component Between at least one tested tray: the tray transfer unit is used to transfer the at least one tray to be tested between the at least one supply magazine and the at least one empty magazine, and to transfer the at least one empty magazine Once the tray is finished measuring Between the at least one empty magazine and the at least one output magazine; when the transfer shuttle table is located at the outer position, the transfer shuttle table is used for the wafer transfer module to pick and place the electronic component to be tested and the completed electronic device element.

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