TWI791580B - How to set the alignment pattern - Google Patents

Abstract

[Problem] To provide a method of setting an alignment pattern that can suppress a decrease in alignment accuracy even if the alignment pattern does not include a characteristic portion. [Solution] The setting method of the alignment pattern includes: a step of capturing an image including the intersection of the dicing lines of the wafer; and specifying two or more images including the intersection on the operation screen of the device displaying the image including the intersection. The step of specifying the area of the boundary line between the dicing line and the different devices; the step of making the overall map including all the designated areas; the covering step of covering the area outside the designated area in the overall drawing; the covering step The overall image setting is a step of setting the alignment pattern; and a storage step of storing the distance between the alignment pattern and the center of the width direction of the scribe line.

Description

How to set the alignment pattern

Field of the Invention The present invention relates to a setting method of an alignment pattern, which is an alignment pattern used for setting and detecting processing positions when a wafer is divided.

Background of the Invention In wafers such as disc-shaped semiconductor wafers or optical device wafers, which use silicon, sapphire, gallium, etc. device. A wafer is divided into individual devices along planned dividing lines by a processing device such as a laser processing device or a dicing device (for example, refer to Patent Document 1).

The processing apparatuses shown in Patent Document 1 etc. perform pattern matching on a preset alignment pattern and an image of a wafer to be processed when dividing the above-mentioned wafer by fully automatic processing. ) and other image processing, and perform alignment of the position integration of the processing mechanism for the wafer, and perform a kerf check (kerf check) to determine whether the processing position processed by the processing mechanism is appropriate. Prior Art Documents Patent Documents

Patent Document 1: Japanese Patent Laid-Open No. 2014-203836

SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION In order to perform the above-mentioned alignment and kerf inspection, the wafer to be processed in the processing apparatus shown in Patent Document 1 etc. has an alignment pattern formed on each device, and in order to avoid being mistaken as a For other parts, the alignment pattern preferably includes features that are not found in other parts.

The present invention was made in view of this problem, and an object of the present invention is to provide a method for setting an alignment pattern that can suppress a decrease in alignment accuracy even if the alignment pattern does not include a characteristic portion. means to solve problems

In order to solve the above-mentioned problems and achieve the purpose, the setting method of the alignment pattern of the present invention is to divide the wafer with the devices partitioned into a lattice shape by a plurality of dicing lines on the front side, and use A method for setting an alignment pattern for detecting the position of the scribe line, characterized in that the method for setting the alignment pattern includes: a step of photographing an image including an intersection of the scribe line; In the operation screen of the image device, specifying at least two or more regions including the boundary between the scribe line and the device; the step of making a general diagram including all the designated regions; in the general diagram , the masking step of covering outside the designated area; the setting step of setting the covered overall image as the alignment pattern; and storing the distance between any area of the alignment pattern and the center of the width direction of the cutting line storage steps.

In the method for setting the aforementioned alignment pattern, the specifying step may also specify a position avoiding the member or the processing mark formed in the scribe line as the region.

In the method for setting the aforementioned alignment pattern, the specifying step may also specify the region by drawing and displaying an operation screen of a device including the image including the intersection. Invention effect

Even if the alignment pattern does not include a feature portion, the alignment pattern setting method of the present invention has an effect of suppressing a reduction in alignment accuracy.

Modes for Carrying Out the Invention Modes for carrying out the present invention (embodiments) will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily imagined by those skilled in the art or are substantially the same. In addition, the configurations described below can be appropriately combined. In addition, omissions, substitutions, or changes of various configurations can be made without departing from the gist of the present invention.

[Embodiment 1] A method of setting an alignment pattern according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus for carrying out a method of setting an alignment pattern according to Embodiment 1. FIG. FIG. 2 is a perspective view of a wafer to be processed by the laser processing apparatus shown in FIG. 1 .

The alignment pattern setting method of Embodiment 1 is a method implemented when the wafer 100 shown in FIGS. 1 and 2 is divided by a processing device used in a semiconductor process or the like. The processing device is the laser processing device 1 shown in FIG. 1 that divides the wafer 100 by laser processing, or a dicing device that cuts the wafer 100 for division.

The wafer 100 is a disk-shaped semiconductor wafer and an optical device wafer with silicon, sapphire, gallium, etc. as base materials. As shown in FIG. 2 , on the front side 101 of the wafer 100 , there are devices 103 partitioned into a grid by a plurality of dicing lines 102 . Further, on the wafer 100 , a member, that is, a TEG (Test Element Group, test element group) 104 is formed on the dicing line 102 . The TEG 104 is formed of metal or the like, and is a test pattern for detecting problems in the design and manufacture of the device 103 . The TEG 104 is arranged at a predetermined predetermined position on the dicing line 102 of the wafer 100 .

Also, in Embodiment 1, although the arrangement position of TEG 104 is different from that of each dicing line 102 , the wafer 100 of the present invention may include a plurality of dicing lines 102 at the same arrangement position as TEG 104 . Furthermore, FIG. 2 shows the TEG 104 disposed on a part of the scribe lines 102 , and the TEG 104 disposed on other scribe lines 102 is omitted. Also, in Embodiment 1, although the wafer 100 is formed on the dicing line 102, that is, the TEG 104, the present invention is not limited to the TEG 104, and a dummy (chemical mechanical polishing) for CMP (Chemical Mechanical Polishing) may also be formed. dummy) pattern as a building block. The dummy pattern of CMP is a pattern formed on the dicing line 102 in order to uniformly grind the wafer 100 to suppress thickness inconsistency during CMP polishing, and the pattern is made of metal, oxide film, or resin. Also, in Embodiment 1, the wafer 100 is bonded to the annular frame 100 by attaching the adhesive tape 110 to the rear surface 105 on the rear side of the front surface 101, and attaching the annular frame 111 to the outer periphery of the adhesive tape 110. The frame 111 is integrated.

As shown in FIG. 1 , a laser processing device 1 as an example of a processing device is provided with: a work chuck 10, which attracts and holds a wafer 100 through a holding surface 11, and is rotatable around an axis by a rotating drive source; The laser light irradiation unit 20 irradiates the laser light with an absorbing wavelength to the wafer 100 held on the work clamp 10 on the wafer 100; the X-axis moving unit not shown in the figure makes the work clamp 10 moves in the X-axis direction; and a Y-axis moving unit not shown in the figure moves the work clamping table 10 in the Y-axis direction. In addition, the laser processing device 1 is provided with: a cassette 30 for storing wafers 100 before and after laser processing, and a cassette lifter 40 for lifting the cassette 30 in the Z-axis direction; A transfer unit (not shown) that transfers the wafer 100 between the tables 10; an imaging unit 50 that photographs the wafer 100 held on the chuck table 10; and a computer that controls each component, that is, the control unit 60.

The laser beam irradiation unit 20 includes a processing head 21 that faces the wafer 100 held on the work chuck 10 and irradiates laser beams. The imaging unit 50 is mounted on the processing head 21 of the laser beam irradiation unit 20 . The imaging unit 50 includes a CCD (Charge Coupled Device) imaging element and the like for imaging the front surface 101 of the wafer 100 held on the chuck 10 . The shooting unit 50 outputs the captured image to the control unit 60 .

The control unit 60 is a unit that individually controls the above-mentioned constituent elements of the laser processing apparatus 1 and causes the laser processing apparatus 1 to perform processing operations on the wafer 100 . Furthermore, the control unit 60 is a computer. The control unit 60 has a computing processing device, a storage device, and an input-output interface device. The computing processing device has a microprocessor such as a CPU (central processing unit, central processing unit), and the storage device has a ROM (read only memory, only Read memory) or RAM (random access memory, random access memory) memory.

The arithmetic processing device of the control unit 60 implements arithmetic processing according to the computer program stored in the storage device, and outputs the control signal for controlling the laser processing device 1 to the laser processing device 1 through the input and output interface device. essentials. In addition, the control unit 60 is connected to a display unit 70 and an input unit 80. The display unit 70 displays the status or images of processing operations, and the input unit 80 is used when the operator registers processing content information.

The display unit 70 includes a display device such as a liquid crystal display (liquid crystal display), an organic EL display (organic electro-luminescence display), or an inorganic EL display (Inorganic electro-luminescence display). The screen 71 of the display device is the operation screen. The display unit 70 displays characters, images, symbols, graphics, etc. on the screen. Moreover, the display unit 70 displays the image captured by the photographing unit 50 .

The input unit 80 includes a touch panel 81 superimposed on the screen 71 of the display device constituting the display unit 70 , and an unshown external input device such as a keyboard. The touch panel 81 detects the contact or approach of a finger, a pen, or a stylus. The touch panel 81 can detect the position on the touch panel 81 when a plurality of fingers, pens or stylus touch or approach. In the following description, the position at which a plurality of fingers, pens, stylus, etc. are touched or approached by the touch panel 81 is represented as a "detection position". The input unit 80 outputs the contact or approach and detected position of a finger or the like to the control unit 60 .

The laser processing device 1 irradiates laser light on the wafer 100 from the processing head 21 of the laser light irradiation unit 20, and makes the work chuck 10 and The processing head 21 moves relatively along the cutting line 102 and performs ablation processing to form a laser processing groove on the cutting line 102 . In Embodiment 1, the wafer 100 with laser processing grooves formed on the dicing lines 102 by the laser processing apparatus 1 is cut along the laser processing grooves, etc., and divided into individual devices 103 .

In addition, in the laser processing device 1 , the control unit 60 outputs the image captured by the imaging unit 50 to the display unit 70 and displays it on the display unit 70 . Before the laser processing of the wafer 100, the control unit 60 performs the alignment of the wafer 100 and the processing head 21, and performs a notch inspection during the laser processing of the wafer 100. The aforementioned notch inspection is used to determine Whether the position of the laser processing groove actually formed on the scribe line 102 and the size of the fragments formed on both sides of the laser processing groove in the width direction can be tolerated. When the laser processing device 1 performs alignment, the control unit 60 performs image processing such as pattern matching on the alignment pattern 200 stored in the storage device and the image captured by the imaging unit 50 .

Next, the setting method of the alignment pattern of Embodiment 1 is demonstrated. Fig. 3 is a flow chart showing the flow of the alignment pattern setting method in the first embodiment. FIG. 4 is a diagram showing an example of an image obtained in an imaging step of the alignment pattern setting method shown in FIG. 3 . FIG. 5 is a diagram showing an example of a specified procedure for implementing the alignment pattern setting method shown in FIG. 3 on the image shown in FIG. 4 . Fig. 6 is an enlarged view showing a main part of the image shown in Fig. 5 . FIG. 7 is a diagram showing an example of an overall image creation procedure for implementing the alignment pattern setting method shown in FIG. 3 on the image shown in FIG. 5 . FIG. 8 is a diagram showing an example of a masking step for implementing the alignment pattern setting method shown in FIG. 3 on the image shown in FIG. 7 . 9 is a diagram showing an example of the distance between the alignment pattern and the scribe line and the like stored in the storage step of the alignment pattern setting method.

The setting method of the alignment pattern of Embodiment 1 (hereinafter referred to simply as the setting method) is to form a laser processing groove on the dicing line 102 of the wafer 100, and divide the wafer 100 into individual pieces along the dicing line 102. When the device 103 is used, the method of setting the alignment pattern 200 for detecting the position of the dicing line 102 is set. The alignment pattern 200 is an image of pattern matching used when the control unit 60 of the laser processing apparatus 1 detects the position (coordinate information) of processing the laser processing groove on the scribe line 102 (that is, performs alignment). The information is set by the setting method of Embodiment 1 and stored in the storage device. Furthermore, in Embodiment 1, the position (coordinate information) indicates the coordinates in the X-axis direction and the Y-axis direction from the preset reference position of the wafer 100 .

The setting method is firstly that the operator places the cassette 30 containing the wafer 100 integrated with the ring frame 111 on the cassette lifter 40 of the laser processing device 1, and then the operator operates the input unit 80, and The position of the front side 101 of the wafer 100 captured by the imaging unit 50 during alignment is registered in the control unit 60 . Furthermore, in Embodiment 1, the position of the front side 101 of the wafer 100 to be photographed during alignment is the position where the intersection 106 (as shown in FIG. 2 ) where each scribe line 102 intersects can be photographed. As shown in FIG. 3 , the setting method includes a photographing step ST1 , a designation step ST2 , an overall image creation step ST3 , a masking step ST4 , a setting step ST5 , and a storage step ST6 .

The photographing step ST1 is a step of photographing an image 300 (as shown in FIG. 4 ) including the intersection portion 106 of the dicing line 102 of the wafer 100 . In the photographing step ST1, when the operator operates the input unit 80 and inputs an instruction to start setting the alignment pattern 200, the control unit 60 takes out one pre-laser processed wafer 100 from the cassette 30 in the transfer unit, and The wafer 100 is attracted and held on the holding surface 11 of the work chuck 10 by being placed on the holding surface 11 of the work chuck 10 .

Next, the control unit 60 uses the X-axis moving unit to move the work clamp table 10 toward the lower side of the processing head 21 of the laser light irradiation unit 20, and arrange the work clamp table 10 at the position of the imaging unit 50 installed on the processing head 21. Below and at the position where the wafer 100 held on the chuck 10 is photographed during alignment, the photographing unit 50 photographs the front surface 101 of the wafer 100 . As shown in FIG. 4 , the control unit 60 displays an image 300 on the operation screen of the display unit 70, that is, on the screen 71. The image 300 includes the dicing lines 102 of the front side 101 of the wafer 100 captured by the imaging unit 50. intersection 106 . Moreover, since the image 300 is an image captured by the photographing unit 50 , it is an image with intensity of light displayed in a predetermined gray scale, that is, an image with shades. The setting method is that when the image 300 is displayed on the screen 71 of the display unit 70 , then enter into the designation step ST2.

The specifying step ST2 is a step of specifying at least two or more areas 400 in the device displaying the image 300 including the intersection 106 , that is, in the screen 71 of the display unit 70 , and the areas 400 include the scribe line 102 and the different device 103 the boundary between. In the embodiment, in the specifying step ST2, the operator touches the stylus 90 on the image 300 displayed on the screen 71 of the display unit 70 and moves it on the outer edge of the area 400 to draw with the stylus 90 , the aforementioned area 400 includes the boundary between the scribe line 102 and each device 103 , and surrounds the position avoiding the TEG 104 disposed on the scribe line 102 .

In specifying step ST2, the control unit 60 detects the track of the stylus 90 moving on the screen 71 from the detected position of the stylus 90 on the touch panel 81 of the input unit 80 as the position of the outer edge of the area 400 , and stored in storage. Furthermore, although in the first embodiment, the stylus 90 is used to draw in the specifying step ST2, the present invention is not limited to the stylus 90, and may be drawn with a finger or a pen.

Moreover, when the control unit 60 detects and stores the position of the outer edge of the area 400, the touch panel 81 of the input unit 80 detects the position of the stylus 90 in units of pixels (pixel) of the screen 71 of the display unit 70, and The pixel at the detection position of the stylus 90 of the touch panel 81 is digitized, for example, as "1", and the pixels other than the detection position are digitized, for example, as "0". The control unit 60 calculates the position of the outer edge of the area 400 from the positions of the aforementioned digitized pixels, and the position of the front side 101 of the wafer 100 captured by the imaging unit 50 when performing alignment after registration, etc., and specifies as Area 400. Also, in the specifying step ST2, as shown in FIG. 5 , the control unit 60 displays the specified area 400 on the screen 71 of the display unit 70 . Also, in Embodiment 1, four regions 400 are designated in the designation step ST2, but the present invention is not limited to four, and two or more regions 400 may be designated.

Furthermore, if the outer edge of the area 400 is disconnected as shown in FIG. 6, as shown by the dotted line in FIG. to calculate the position of the outer edge of the area 400 . In this way, in the designation step ST2, the operator designates the boundary between the scribe line 102 and the device 103 in the image 300 displayed on the screen 71 of the display unit 70 and avoids the position of the TEG 104 arranged on the scribe line 102 as an area. 400, and specify at least two or more areas of 400. In addition, in the designation step ST2 , the operator designates the area 400 by drawing the screen 71 on which the image 300 of the display unit 70 is displayed with the stylus 90 . The setting method is that when the operator operates the input unit 80 and inputs an instruction that the designation of the area 400 has been completed, it proceeds to the overall map creation step ST3.

The overall map creating step ST3 is a step of creating an overall map 500 including all the areas 400 specified in the specifying step ST2. In the overall map creation step ST3, the control unit 60 calculates the largest coordinate and the smallest coordinate among the coordinates in the X-axis direction and the Y-axis direction of each designated area 400 . The control unit 60 calculates the maximum X-axis direction coordinate 501 among the plural maximum coordinates in the X-axis direction of all the regions 400, and the minimum X-axis direction coordinate 502 among the plural minimum coordinates, and calculates the Y coordinates in all the regions 400 The largest Y-axis direction coordinate 503 among the plurality of largest coordinates in the axial direction, and the smallest Y-axis direction coordinate 504 among the plurality of smallest coordinates.

The control unit 60 makes an overall map 500 of the area surrounded by the maximum X-axis direction coordinate 501 , the minimum X-axis direction coordinate 502 , the maximum Y-axis direction coordinate 503 and the minimum Y-axis direction coordinate 504 . In the overall view creation step ST3 , the control unit 60 displays the overall view 500 on the screen 71 of the display unit 70 as shown in FIG. 7 . The setting method is that when the control unit 60 creates the overall view 500, it enters into the masking step ST4.

The masking step ST4 is a step of masking other than the designated area 400 in the overall view 500 . In the masking step ST4, the control unit 60 performs blackening image processing on the outside of all the regions 400 displayed on the overall view 500 of the display unit 70 as shown in the grid of FIG. 8 to form a mask 510. . That is, in the masking step ST4 , the control unit 60 forms the outside of all the regions 400 in the overall view 500 as a mask 510 . Furthermore, in the masking step ST4 of the present invention, the control unit 60 may also perform image processing to whiten the outside of all the regions 400 displayed on the overall view 500 of the display unit 70 to form a mask 510 . The setting method is that when the control unit 60 forms the mask 510, then enter into the setting step ST5.

The setting step ST5 is a step of setting the overall map 500 on which the mask 510 is formed as the alignment pattern 200 . In the setting step ST5, the control unit 60 sets the overall image 500 including the areas 400 and the mask 510 displayed with the intensity of light in a predetermined gray scale as the alignment pattern 200, and stores it in the storage device. The setting method is that when the control unit 60 stores the alignment pattern 200, it enters into the storing step ST6.

The storing step ST6 is a step of storing any region 400 of the alignment pattern 200 and the distance 201 (as shown in FIG. 9 ) from the center 107 in the width direction of the dicing line 102 . Furthermore, in the storage step ST6 of the present invention, the distance between any region 400 and the end of the cutting road 102 can also be stored. In short, the distance between any region 400 and any position of the cutting road 102 can be stored. distance. In the storing step ST6, the operator operates the input unit 80, and inputs the distance 201 between any one of the plurality of areas 400 of the alignment pattern 200 and the center 107 in the width direction of the scribe line 102, and the control unit 60 inputs The distance 201 is stored in the storage device, and as shown in FIG. 9 , the center 107 of the cutting line 102 is displayed on the screen 71 of the display unit 70 . The setting method ends when the control unit 60 stores the distance 201 .

As described above, the control unit 60 of the laser processing apparatus 1 with the alignment pattern 200 set therein causes the imaging unit 50 to photograph the pre-registered alignment on the front side 101 of the wafer 100 during alignment execution. Location. When performing alignment, the control unit 60 performs image processing such as pattern matching on the image captured by the imaging unit 50 and the image of the region 400 of the alignment pattern 200 . The control unit 60 calculates the position of the scribe line 102 from the image captured by the imaging unit 50 and the like based on the result of the image processing.

The control unit 60 rotates the work clamp table 10 around the axis, so that one of the mutually orthogonal cutting lines 102 is parallel to the X-axis direction, and makes the wafer 100 and the processing head 21 of the laser beam irradiation unit 20 be aligned. Alignment, so that the laser light is irradiated from the area 400 to the position of the distance 201 stored in the storage step ST6. Then, the control unit 60 instructs the rotary driving source to rotate the wafer 100 around the axis by 90 degrees, and performs the alignment of the other one of the mutually orthogonal scribe lines 102 in the same manner as one of them. Then, the control unit 60 moves the processing head 21 of the laser light irradiation unit 20 and the wafer 100 along the dicing road 102 relative to each other through the X-axis moving unit, the Y-axis moving unit and the rotational driving source according to the processing conditions. , and a laser processing groove is formed on the scribe line 102 .

The setting method in Embodiment 1 is to designate four regions 400 including the boundaries between the dicing lines 102 and the different devices 103 in the designating step ST2. Therefore, the setting method includes the region 400 including the boundaries between the plurality of dicing lines 102 and the device 103 in the alignment pattern 200 . As a result, since the setting method can use a plurality of areas 400 including boundaries between the plurality of dicing lines 102 and the device 103 to perform alignment, even if the areas 400, that is, the alignment pattern 200 does not include a feature portion, the alignment can be suppressed. decrease in accuracy.

In addition, in the setting method of Embodiment 1, in the specifying step ST2, a position avoiding the TEG 104 disposed on the scribe line 102 is specified as the region 400, and in the masking step ST4, the outside of the region 400 of the overall map 500 is formed. is mask 510 . Therefore, the alignment pattern 200 set by the setting method can be prevented from including the TEG 104 disposed on the scribe line 102 . As a result, since the setting method can prevent the alignment pattern 200 from including the TEG 104 of reflected light, it is possible to suppress a reduction in alignment accuracy.

Also, in the setting method of the first embodiment, since the area 400 is specified by drawing the screen 71 of the display unit 70, the area 400 can be easily specified and the alignment pattern 200 can be easily set.

[Embodiment 2] A method of setting an alignment pattern according to Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 10 is a diagram showing an example of an image showing a designated step in the method of setting an alignment pattern according to the second embodiment. Fig. 11 is a diagram showing an example of an image after carrying out a designated step in the setting method of the alignment pattern according to the second embodiment. In addition, in Fig. 10 and Fig. 11, the same reference numerals are assigned to the same parts as those in the first embodiment, and description thereof will be omitted.

The setting method of the alignment pattern of the second embodiment (hereinafter, simply referred to as the setting method) is the same as the setting method of the first embodiment except that the specifying step ST2 is different from that of the first embodiment.

In the specifying step ST2 of the setting method of Embodiment 2, as shown in FIG. operation to move the designated area 600 on the image 300 . When the operator inputs an operation to determine the position of the designated area 600 from the input unit 80, as shown in FIG. edge position and store). Furthermore, in Embodiment 2, although the planar shape of the designated area 600 is rectangular, and only the corners 601 of the designated area 600 are displayed on the image 300, in the present invention, the shape and display method of the designated area 600 are not the same. It is not limited to what was shown in Embodiment 2.

The setting method of Embodiment 2 is to designate four regions 400 including the boundaries between the dicing lines 102 and the different devices 103 in the designating step ST2. Therefore, the setting method will be to include a plurality of regions 400 including the boundaries between the plurality of scribe lines 102 and the devices 103 in the alignment pattern 200, and similarly to Embodiment 1, even if the regions 400, that is, the alignment pattern 200 Even if the feature portion is not included, the reduction in alignment accuracy can be suppressed.

[Embodiment 3] A method of setting an alignment pattern according to Embodiment 3 of the present invention will be described with reference to the drawings. Fig. 12 is a diagram showing an example of an image obtained in a photographing step of the alignment pattern setting method according to the third embodiment. Fig. 13 is a diagram showing an example after carrying out a predetermined step in the image obtained in the imaging step of the alignment pattern setting method according to the third embodiment. In addition, in Fig. 12 and Fig. 13, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 12 , the setting method of the alignment pattern of Embodiment 3 (hereinafter referred to simply as the setting method), except that laser grooving (laser grooving) is arranged on each dicing line 102 of the wafer 100 as a processing mark. Except for the marks, other setting methods are the same as those in Embodiment 1. In the case where a low-dielectric value insulator film (Low-k film) is formed on the front surface 101 of the wafer 100, in order to suppress the peeling of the low-dielectric value insulator film due to dicing, etc., in the width direction of each dicing line 102, The two ends of the laser grooves 108 are respectively formed. The laser grooving marks 108 are formed as so-called laser processed grooves parallel to the scribe lines 102 by performing ablation processing using laser light on both ends of the width direction of each scribe line 102 . Furthermore, the low dielectric value insulator film is made of an inorganic film such as SiOF or BSG (SiOB), and a polymer film such as polyimide or parylene. That is, it is composed of an organic film.

In the designation step ST2 of the setting method of Embodiment 3, the operator draws the outer edge of the area 400 with the stylus 90, and the control unit 60 calculates the position of the outer edge of the area 400, and designates it as the area 400. The aforementioned area 400 is The following position: the boundary between the scribe line 102 and each device 103 including the image 300 displayed on the screen 71 of the display unit 70 , and surrounds and avoids the TEG 104 and the laser grooving 108 arranged on the scribe line 102 . Also, in the designation step ST2, the control unit 60 displays the designated area 400 on the screen 71 of the display unit 70 as shown in FIG. 13 . In this way, although in the specifying step ST2 of the setting method of the third embodiment, the position avoiding the TEG 104 and the laser grooving 108 is specified as the area 400, but the present invention does not arrange the TEG 104 on the scribe line 102, but only In the case where laser grooving 108 is arranged, it is preferable to designate a position avoiding laser grooving 108 as region 400 in the specifying step ST2. That is, in the present invention, in the specifying step ST2, the position of at least one of the member avoiding the TEG 104 or the dummy pattern for CMP, and the laser grooving 108 of the processing mark is specified as the region 400 .

The setting method of the third embodiment is to designate four regions 400 including the boundaries between the dicing lines 102 and the different devices 103 in the designating step ST2. Therefore, the setting method is the same as that of the first embodiment, and even if the region 400 , that is, the alignment pattern 200 does not include a characteristic portion, it is possible to suppress a decrease in alignment accuracy.

Also, in the setting method of the third embodiment, in the specifying step ST2, a position avoiding the TEG 104 and the laser grooving 108 arranged on the scribe line 102 is specified as the region 400 . As a result, the setting method can prevent the alignment pattern 200 from including the TEG 104 and the laser grooving 108 of reflected light, and thus can suppress a decrease in alignment accuracy.

In addition, this invention is not limited to the said embodiment. That is, various deformation|transformation can be added and implemented in the range which does not deviate from the summary of this invention. Furthermore, in the above-mentioned Embodiment 1 and Embodiment 2, although the laser processing device 1 was disclosed as an example of the processing device, the setting method of the alignment pattern of the present invention can also be used in a cutting device.

1‧‧‧Laser processing device 10‧‧‧Work clamp 11‧‧‧Holding surface 100‧‧‧Wafer 101‧‧‧Front side 102‧‧‧Cutting line 103‧‧‧Device 104‧‧‧TEG (component ) 105‧‧‧back 106‧‧‧intersection 107‧‧‧center 108‧‧‧laser notch 110‧‧‧adhesive tape 111‧‧‧ring frame 20‧‧‧laser light irradiation unit 21‧​‧‧‧Shooting unit 500‧‧‧Overall image 501‧‧‧Maximum X-axis direction coordinate 502‧‧‧Minimum X-axis direction coordinate 503‧‧‧Maximum Y-axis direction coordinate 504‧‧‧Minimum Y-axis direction coordinate 510‧‧ ‧Masking 60‧‧‧Control unit 600‧‧‧Designated area 601‧‧‧Corner 70‧‧‧Display unit (device) 71‧‧‧Screen (operation screen) 80‧‧‧Input unit 81‧‧‧Touch Control panel 90‧‧‧stylus X, Y, Z‧‧‧direction ST1‧‧‧photographing step ST2‧‧‧designated step ST3‧‧‧whole map making step ST4‧‧‧covering step ST5‧‧‧setting step ST6‧‧‧Store steps

FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus for carrying out a method of setting an alignment pattern according to Embodiment 1. FIG. FIG. 2 is a perspective view of a wafer to be processed by the laser processing apparatus shown in FIG. 1 . Fig. 3 is a flow chart showing the flow of the alignment pattern setting method in the first embodiment. FIG. 4 is a diagram showing an example of an image obtained in an imaging step of the alignment pattern setting method shown in FIG. 3 . FIG. 5 is a diagram showing an example of specifying steps in which the alignment pattern setting method shown in FIG. 3 is implemented on the image shown in FIG. 4 . FIG. 6 is a diagram showing an enlarged main part of the image shown in FIG. 5 . FIG. 7 is a diagram showing an example of an overall image creation procedure in which the alignment pattern setting method shown in FIG. 3 is implemented on the image shown in FIG. 5 . FIG. 8 is a diagram showing an example of a masking step in which the alignment pattern setting method shown in FIG. 3 is implemented on the image shown in FIG. 7 . 9 is a diagram showing an example of the distance between the alignment pattern and the scribe line and the like stored in the storage step of the alignment pattern setting method. Fig. 10 is a diagram showing an example of an image showing a designated step in the method of setting an alignment pattern according to the second embodiment. Fig. 11 is a diagram showing an example of an image after carrying out a designated step in the setting method of the alignment pattern according to the second embodiment. Fig. 12 is a diagram showing an example of an image obtained in the imaging step of the alignment pattern setting method according to the third embodiment. Fig. 13 is a diagram showing an example of an image obtained in the imaging step of the method for setting the alignment pattern according to the third embodiment, after carrying out a predetermined step.

ST1‧‧‧Shooting steps

ST2‧‧‧designated steps

ST3‧‧‧Overall drawing making steps

ST4‧‧‧covering steps

ST5‧‧‧Setting steps

ST6‧‧‧Store steps

Claims (6)

A method for setting an alignment pattern is to detect the position of the dicing line when a wafer with a device that is partitioned into a grid by a plurality of dicing lines is formed on the front surface, and is divided along the dicing line. The method for setting a quasi-pattern is characterized by comprising: a photographing step of photographing an image of the intersection including the slit; a specifying step of specifying at least two of them on the operation screen of the device displaying the image including the intersection. The area above includes the boundary between the dicing line and the device; the overall map making step, making an overall map including all designated areas; the covering step, forming the outside of the designated area in the overall map as a mask; the setting step, Setting the overall image including the specified regions and the mask as an alignment pattern; and storing the distance between any one of the regions of the alignment pattern and the scribe line. The method for setting an alignment pattern as claimed in claim 1, wherein the image obtained by photographing the wafer and the image of the region of the alignment pattern are subjected to image processing, and based on the results of the image processing, to calculate The location of the cut lane. The setting method of the alignment pattern as claimed in claim 1, wherein in the step of making the overall map, the largest coordinate and the smallest of the respective coordinates of the X-axis direction and the Y-axis direction of the area designated in the designation step are used. The area surrounded by the coordinates of , is made into a whole map. The method for setting an alignment pattern according to claim 1, 2 or 3, wherein the specifying step is to specify a position avoiding a member or a processing mark formed in the slit as the area. The method for setting an alignment pattern according to claim 1, 2 or 3, wherein the specifying step specifies the region by drawing an operation screen of a device displaying an image including the intersection. The method for setting an alignment pattern according to claim 4, wherein the specifying step is to specify the area by drawing and displaying an operation screen of a device including the image including the intersection.

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