TWI791549B - Evaporation hood - Google Patents

Abstract

The present invention provides a vapor deposition cover which optimizes the setting of the strength based on the cross-sectional shape of the frame, appropriately suppresses the deformation of the cover main body by the frame, prevents the cover main body from shifting from a correct position, and improves the efficiency of vapor deposition. precision. Forming the cross-sectional shape of the minimum width portion of the inner frame portion of the frame body 3 into a suitable relationship between the width and thickness can reliably impart bending rigidity to the minimum width portion. Sufficient strength is required, and other parts of the frame body 3 that are wider than the minimum width portion and have higher strength, together with the frame body 3 as a whole, can suppress the deviation of each part of the cover main body 2 from the position where it should exist, and can ensure The integrated state of the mask and the substrate to be vapor deposited in the vapor deposition step enables vapor deposition to be performed with high precision at an appropriate position of the substrate to be vapor deposited.

Description

Evaporation hood

The present invention relates to a vapor deposition mask used, for example, when forming a light-emitting layer of an organic EL element by a vapor deposition mask method.

As a method of forming a light-emitting layer of an organic EL (Electroluminescence) device, a vapor deposition mask method is often used. In this vapor deposition mask method, in order to vapor-deposit and form an organic luminescent substance at a desired position on a substrate made of a transparent material such as glass, a vapor deposition mask in which a portion corresponding to the vapor deposition portion of the substrate is perforated is used.

In the vapor deposition apparatus for performing vapor deposition, the vapor deposition mask is set in a state correctly aligned with respect to the substrate to be vapor deposited, and vapor deposition is performed. However, when vapor deposition is performed, heating is generally performed to make the vapor deposition environment possible in the vapor deposition apparatus. Therefore, when the thermal deformation states of the vapor deposition cover and the glass substrate are different, there is a problem that the vapor deposition cover and the substrate are different. The relative positional relationship changes, and it becomes impossible to meet the precision required for the formed light-emitting layer.

In recent years, the following vapor deposition cover has been proposed, which is equipped with a reinforcement made of a material having a thermal expansion coefficient equal to that of a substrate to be deposited such as glass or a material with a low thermal expansion coefficient on the outer peripheral edge of a relatively thin cover body. Even if a cover body made of a material with a thermal expansion coefficient different from that of the vapor-deposited substrate is used, the shape of the cover body changes according to the expansion of the frame having the same thermal expansion coefficient as the vapor-deposited substrate, or becomes The state of being suppressed by the frame with a low thermal expansion coefficient without shape change can ensure the integration accuracy of the cover body with respect to the evaporated substrate when the temperature rises in the evaporation device, and can form light emission on the evaporated substrate with high precision layer. As an example of such a conventional vapor deposition mask, the one disclosed in Japanese Patent Application Laid-Open No. 2005-15908 is exemplified. [Prior Art Document] [Patent Document]

Patent Document 1: Japanese Patent Laid-Open No. 2005-15908

[Problem to be Solved by the Invention]

The conventional vapor deposition cover has the structure shown in the aforementioned Patent Document 1, which can suppress the relative deformation between the cover and the substrate due to the difference in thermal expansion coefficient, and prevent significant deterioration of the positional accuracy of the vapor deposition formation. However, there is a demand in the market for higher precision of vapor-deposited products, and further suppression of offset due to displacement of the mask.

Regarding the combined structure of the conventional cover body and frame, in order to ensure the strength of the frame against the cover body to be displaced, it is easy to consider thickening the frame. During plating, vapor deposition materials such as organic light-emitting substances travel to the through holes of the cover main body due to adverse effects such as local obstruction by the frame, so the thickness cannot be simply increased. In addition, when the frame is thickened to a certain extent, the weight of the frame also increases, and the problem of deformation such as deflection caused by the weight of the frame itself occurs. deterioration. Therefore, in the method of improving the strength by increasing the thickness of the frame and improving the accuracy of the cover, there is a limit value of the applicable thickness, and it is not realistic to improve the strength beyond this limit value.

In addition, when the frame is formed from a commonly distributed and easily obtained metal plate material, such a plate material is manufactured through processing such as rolling, so a large amount of strain caused by the processing remains inside the plate material. The influence of the internal strain of the plate material produced in such a manufacturing process becomes more and more prominent as the thickness of the plate increases. Therefore, when the plate thickness of the frame is increased, that is, the thickness of the plate material used for the frame is increased, at the stage where the frame is finally obtained from the plate material through further processing such as cutting, the strain is based on a slight warpage of the frame, etc. The method shows that it is impossible to strictly pursue the shape that the frame should have, which has a negative impact on the accuracy of the cover. Considering this aspect, it can also be said that it is difficult to improve the strength simply by thickening the frame.

Furthermore, as the metal plate material used for the frame body, it is also possible to use a plate material without strain produced by special processing or a plate material that has been subjected to internal stress relief treatment in advance so that the frame body will not be affected by the strain. The cost of unstrained plate material or stress relief treatment is high, so the frame cannot be obtained economically.

As described above, the conventional cover structure has the following problems: In terms of frame strength, it is difficult to keep the displacement of the cover main body within the allowable range that becomes stricter with higher precision, and it is unavoidable to avoid the displacement caused by the vapor deposition formation. deterioration in productivity.

The present invention was made to solve the above-mentioned problems, and its object is to provide a vapor deposition cover that optimizes the setting of the strength of the frame based on the cross-sectional shape, appropriately suppresses the deformation of the cover main body by the frame, and prevents the cover main body from being corrected. The offset of the position improves the precision of evaporation. [Technical means to solve the problem]

The evaporation cover disclosed by the present invention has: a plurality of cover main bodies, which arrange a plurality of independent evaporation through holes in a specific pattern; and a frame, which is arranged around the cover main body; in the above-mentioned evaporation cover, the above-mentioned frame The body has: a rectangular or square outer frame portion located on the outermost periphery, and an inner frame portion that divides the inner side of the outer frame portion into a plurality of opening areas, and is formed in a lattice shape as a whole, and the above-mentioned cover main bodies are respectively located on the frame body. A plurality of open areas, and integrally formed with the frame body, the cross-sectional shape of the part with the narrowest width among the above-mentioned inner frame parts of the frame body is such that the ratio of the thickness dimension to the width dimension is 0.8/5 or more and 2/ Rectangular section below 5.

Therefore, according to the disclosure of the present invention, the bending rigidity (difficulty in bending deformation) of the minimum width portion can be reliably imparted to the minimum width portion by forming the cross-sectional shape of the minimum width portion of the inner frame portion of the frame so that the relationship between width and thickness is appropriate. , and give the required sufficient strength with respect to the force from the side of the cover main body, and other parts of the frame body that are wider than the minimum width portion and have high strength, together with the frame as a whole, restrain the various parts of the cover main body from the original. The offset of the position that should exist can ensure the integrated state of the cover and the substrate to be vapor deposited in the vapor deposition step, and vapor deposition can be performed with high precision at an appropriate position of the substrate to be vapor deposited. In addition, due to the difficulty of bending deformation of the minimum width part, the deflection of the minimum width part due to its own weight can also be suppressed, and the deformation of the frame and its influence on the cover main body can be suppressed.

In addition, in the vapor deposition cover disclosed in the present invention, if necessary, the cross-sectional shapes of the parts other than the parts with the narrowest width among the outer frame portion and the inner frame portion of the above-mentioned frame body are the ratio of the thickness dimension to the width dimension. The ratio is set to 0.8/90 or more, and the rectangular cross section is smaller than the ratio of the thickness dimension to the width dimension of the portion that becomes the narrowest width in the inner frame portion.

Therefore, according to the disclosure of the present invention, the parts other than the minimum width part of the frame body are also made into appropriate cross-sectional shapes, and the thickness dimension is set to a certain degree or more relative to the width dimension in each part of the frame body, so as to give the required minimum width that is difficult to bend. The maximum bending rigidity can fully ensure the strength of the frame relative to the force from the side of the cover body, suppress the deformation of the frame and its influence on the cover body, and improve the accuracy of the through hole position of the cover body. Performs high-precision vapor deposition relative to the vapor deposition target.

In addition, in the vapor deposition mask disclosed in the present invention, if necessary, the frame is formed such that the thickness of each part is 0.8 mm or more and 2 mm or less.

Thus, according to the disclosure of the present invention, by setting the thickness dimension in the cross-sectional shape so as not to become too large within the range of the actual width dimension of the cross-sectional shape that is difficult to bend in each part of the frame, In addition, it is possible to suppress the deflection due to its own weight or the deformation of the internal strain in each part of the frame to form a high-precision frame, and it is also possible to perform vapor deposition with high precision. In addition, by not increasing the thickness more than necessary, the increase in the weight of the frame can be suppressed, and the operability of the vapor deposition cover can be prevented from deteriorating.

In addition, in the vapor deposition cover disclosed in the present invention, if necessary, the frame body has a laminated structure in which a first frame member and a second frame member are overlapped and integrated, and the first frame member and the second frame The member is a warped frame member formed from a sheet metal material, and the respective warping directions are oriented in opposite directions.

Therefore, according to the disclosure of the present invention, the frame body is made into a laminated structure in which the first frame member and the second frame member made of metal sheet materials are overlapped and integrally bonded, and the warped first frame The member and the second frame member are laminated so that the respective warping directions are opposite to each other to form a frame. In this way, the warping is canceled out in the frame, and a flat state is obtained. A frame with improved flatness can be obtained at a lower cost. body, the shape accuracy of the cover can be improved, and evaporation can be performed efficiently. In addition, by making the frame body a combination of the first frame member and the second frame member, even when the thickness of the frame body reaches a thickness that may warp when a single sheet of thin plate material is used, the In a state where unnecessary deformation such as warping does not occur, and does not adversely affect the positional accuracy of the mask body, a mask structure with increased strength can be obtained, and vapor deposition can be performed with high precision using this mask.

In addition, in the vapor deposition mask disclosed in the present invention, the frame body is formed by changing the material of the inner frame portion and the material of the outer frame portion as needed.

Therefore, according to the disclosure of the present invention, by making the materials of the inner frame part and the outer frame part of the frame body different, different properties are given to the inner frame part and the outer frame part, and for example, the outer frame part is used with a stronger frame than the inner frame. In the case of a material with a high portion, the cover body can be efficiently reinforced by mainly utilizing the outer frame portion to suppress deformation due to force from the cover body side, and the positional accuracy of the cover body can be improved. In addition, for example, when using a material with a smaller coefficient of linear expansion than the outer frame for the inner frame of the frame, the inner frame adjacent to the cover main body can effectively suppress the heat loss caused by the cover in the state of temperature rise in the vapor deposition step or the like. The displacement of each position of the cover caused by the thermal deformation of the main body can reliably maintain the positional relationship between the cover and the substrate to be evaporated at room temperature even in a state of elevated temperature, and can perform evaporation with high precision.

Hereinafter, a vapor deposition cover according to an embodiment of the present invention will be described based on FIGS. 1 to 11 . In this embodiment, an example applied to a vapor deposition mask for an organic EL element will be described. In each of the above-mentioned figures, the vapor deposition cover 1 of this embodiment has a structure including a plurality of cover main bodies 2 in which a plurality of vapor deposition through-holes 8 are provided in a specific pattern, and a frame body 3 arranged around the cover main body 2 .

The above-mentioned cover main body 2 has the following configuration: using nickel alloys such as nickel or nickel-cobalt, and other electrodeposited metals as raw materials, it is formed into a sheet shape by electroforming, and a plurality of independent evaporation through holes for the evaporation material to pass through are formed. 8 set in a specific pattern.

The cover main body 2 includes a pattern forming region 2 a inside where a plurality of vapor deposition through holes 8 are provided, and an outer peripheral edge 2 b integrally joined to the frame body 3 via the metal layer 7 formed by plating. In the pattern forming region 2a, a plurality of vapor deposition through holes 8 are used for forming a light emitting layer, and a matrix is formed in which a plurality of through hole groups arranged in a straight line in the front-rear direction are used as a row and a plurality of rows are arranged side by side in the left-right direction. Evaporation pattern9. The thickness of the cover main body 2 is preferably set in the range of 5 to 20 μm, and is set to 8 μm in the present embodiment.

The above-mentioned frame body 3 is a plate-like body having a thicker wall than the cover main body 2 as a rectangular frame shape, and is configured to surround the outside of the cover main body 2 as a reinforcement of the cover main body 2, and is connected with the cover main body 2 to form a single body. change. Specifically, the frame body 3 has a rectangular outer frame portion 4 located on the outermost periphery, and an inner frame portion 5 that divides the inner side of the outer frame portion 4 into a plurality of opening regions 6, and is formed in a lattice shape as a whole. . In addition, the cover main bodies 2 are located in the respective opening regions 6 defined by the inner frame portion 5 of the frame body 3 , and are integrated with the frame body 3 via the metal layer 7 .

The frame body 3 is configured such that the cross-sectional shape of the narrowest part of the inner frame portion 5 is such that the ratio of the thickness dimension T to the width dimension W (aspect ratio) is 0.8/4 or more and 2/4 The following rectangular section. On the other hand, the ratio of the thickness dimension T to the width dimension W (aspect ratio) of each cross-sectional shape of the outer frame portion 4 or the inner frame portion 5 of the frame body 3 other than the narrowest portion is 0.8/90. The above rectangular section.

In addition, the outer frame part 4 and the inner frame part 5 of the frame body 3 are set to have the same thickness, and are formed so that the thickness dimension thereof is not less than 0.2 mm and not more than 6 mm, preferably not less than 0.8 mm and not more than 3 mm, More preferably, it is set to 2 mm. Here, the thickness dimension is preferably set at 0.8 mm or more because when the thickness dimension of each part of the frame body is less than 0.8 mm, the strength of the frame body cannot resist the tension (tensile stress) existing inside the cover body and deform The problem.

On the other hand, if the thickness of each part of the frame made in this way exceeds 2mm, the problem of so-called shadows may be caused during evaporation (the frame becomes an obstacle that hinders the progress of the evaporation material), or due to relative In the frame, since the thickness of the base material is usually set to 1 mm, it is difficult to perform operations after crimping of the frame, etc. Therefore, it is preferable to set the thickness dimension to 2 mm or less.

In this embodiment, the width dimension W ₁ of the narrowest part (minimum width part) of the inner frame part 5 is set to 4 mm, and the width dimension W ₂ of the widest part (maximum width part) is set to approximately 90 mm. When the width dimension of the minimum width portion is less than 4 mm, the strength of the frame may not be able to deform against the tension (tensile stress) existing inside the cover body. Therefore, the width dimension is preferably 4 mm or more.

In addition, when the width dimension of the maximum width portion exceeds 90 mm, the number (obtained number) of cover bodies that can be formed on one base material is excessively reduced, and the efficiency of cover production decreases, so the width dimension is preferably set to 90 mm or less. .

In this way, the frame body 3 is formed so that the rectangular cross-sectional shape of the minimum width portion of the inner frame portion satisfies the condition that the ratio of the thickness dimension T to the width dimension W of the minimum width portion is a value within the above range. In this way, the aspect ratio of the cross-sectional shape of the minimum width part is set within a specific range to ensure an appropriate thickness that is not too large relative to the width. It is difficult to generate the deflection of the minimum width part due to its own weight, and ensure the strength against the force to deform the frame body 3 from the cover body side, and suppress the deformation of the frame body 3 and the resulting force on the cover body 2 As a result, the accuracy of the position of the through hole of the cover main body 2 is improved, and high-precision vapor deposition on the vapor deposition target can be performed.

In addition, each part of the frame body 3 other than the minimum width part has a cross-sectional shape capable of imparting required bending rigidity, sufficiently secures strength against a force from the side of the cover main body, and appropriately sets a thickness relative to the width dimension. In this way, the increase in the weight of the frame body 3 caused by the thickness (cross-sectional area) being increased more than necessary is suppressed, and the warpage caused by the overall weight of the vapor deposition cover or its own weight is prevented from becoming large.

On the other hand, the frame body 3 has a laminated structure in which the first frame member 3 a and the second frame member 3 b of the same shape are overlapped and integrally bonded with an adhesive therebetween. The first frame member 3a and the second frame member 3b are frame members formed from metal sheet stock produced through the same sheet manufacturing step, and have warpage based on internal strain of the metal sheet stock derived from the sheet manufacturing step so that the respective The direction of warping faces the opposite direction, and it becomes a laminated structure as the frame body 3 .

In this way, the first frame member 3a and the second frame member 3b of the same shape are formed by processing the metal sheet raw material manufactured through the same sheet manufacturing step, specifically the rolling step, by cutting or the like, so that the respective The direction of the warping is in the opposite direction and is integrally joined with an adhesive, and the obtained frame body 3 is in a flat state in which the warping is canceled out (see FIG. 5 ). In addition, in FIG. 5, the magnitude|size of the warpage of the 1st frame member 3a and the 2nd frame member 3b is illustrated exaggeratedly for easy understanding, and actual warpage is extremely small. However, assuming that the size of the warpage appears directly on the frame body 3, it will affect the cover main body 2, degrade the accuracy related to its position, and become an obstacle to the high precision of the vapor deposition cover. Therefore, by the above-mentioned laminated structure Elimination of warpage is sought.

In the present embodiment, a sheet-shaped uncured photosensitive dry film resist is used as an adhesive agent so as to be interposed between the first frame member 3 a and the second frame member 3 b. After the first frame member 3a and the second frame member 3b are bonded, the unnecessary portion of the resist other than the portion to be the adhesive layer 3c between the first frame member 3a and the second frame member 3b is removed. In addition, as the adhesive agent, generally available various adhesive agents can also be used. Furthermore, if it can be in a flat state in which warping is canceled out by bonding, that is, a state in which the flatness or parallelism of the front and back surfaces of the frame in the stage of becoming the frame 3 converges within the allowable range, then the first frame member 3a The plane shape, the cross-sectional shape, and the magnitude of the warpage of the second frame member 3b may also be different.

The first frame member 3a and the second frame member 3b are integrally bonded so that the respective warping directions face opposite directions to form a flat frame body 3, so that even if the thickness of the frame body 3 is as high as that of a single thin plate Even when the thickness of the material is likely to cause warping, it is also formed in a state where unnecessary deformation such as warping does not occur, and does not adversely affect the positional accuracy of the cover body, and can be executed with high precision using this cover. Evaporation.

The frame body 3 is formed of a material with a low thermal expansion coefficient, such as a nickel-iron alloy constant steel material or a nickel-iron-cobalt alloy super constant steel material. Furthermore, the frame body 3 is integrally connected with the outer peripheral edge 2b of the pattern formation area 2a of the cover main body 2 by the metal layer 7 formed by electroforming so that they may not separate from each other.

When the frame body 3 is made of constant steel or super constant steel, its coefficient of thermal expansion is extremely small, so that the dimensional change of the cover body 2 caused by the thermal influence in the vapor deposition step can be well suppressed. That is, even if the cover main body 2 is made of a material having a thermal expansion coefficient greater than that of general glass as a substrate to be vapor-deposited (not shown), for example, nickel, etc., there will be no difference in thermal expansion coefficient due to the high temperature during vapor deposition. At room temperature, when the vapor deposition cover 1 is integrated with the substrate to be vapor deposited, there is a deviation between the through hole position relative to the substrate and the vapor deposition position of the vapor deposition material during actual vapor deposition. By holding the cover main body 2 The small thermal expansion coefficient of the frame body 3 can well suppress the size change and shape change caused by the expansion of the cover body 2 when the temperature rises, and can maintain the integration accuracy at room temperature well when the temperature rises during vapor deposition.

Furthermore, the material of the frame body 3 may also use a material with a low thermal expansion coefficient close to that of glass as the substrate to be vapor-deposited, for example, a material similar to glass or ceramics. In this case, conductivity is imparted to at least the surface of these materials.

The above-mentioned vapor deposition mask 1 is manufactured by the following method: After the primary pattern resist 14 is provided on the surface of the substrate 10 corresponding to the non-arranged portion of the primary electrodeposition layer 15, the substrate 10 is deposited by electrodepositing metal. The primary electrodeposition layer 15 is formed by electroforming, and the secondary pattern resist 18 covering the corresponding part of the pattern formation area 2a of the primary electrodeposition layer 15 is formed, and then the frame body 3 is arranged so as to surround the primary electrodeposition layer 15 The metal layer 7 is formed by electroforming in a manner covering the surface of the frame body 3 and the surface of the outer periphery 2b of the primary electrodeposited layer 15, and the primary electrodeposited layer 15 and the frame body 3 are not separated through the metal layer 7. In this state, the integrated primary electrodeposited layer 15 , frame body 3 and metal layer 7 are separated from the substrate 10 .

The above-mentioned base material 10 used in the manufacturing process of the vapor deposition cover 1 of this embodiment is formed of a conductive material such as stainless steel, brass, steel, etc., and is supported to form the cover body until it is separated in the manufacturing step of the vapor deposition cover. 2, the primary electrodeposition layer 15, and at each stage of the vapor deposition mask manufacturing steps, the primary pattern resist 14, the primary electrodeposition layer 15, the secondary pattern resist 18, and the metal layer 7 are formed on the surface side. When forming the primary electrodeposited layer 15 and the metal layer 7, conduct electricity through the base material 10, thereby, on the part of the surface of the base material 10 that is not covered by the resist, through electroforming (plating) ) to form the primary electrodeposited layer 15 or the metal layer 7 .

The base material 10 can also be made of materials with low thermal expansion coefficient such as 42 alloy (42% nickel-iron alloy) or constant steel (36% nickel-iron alloy), SUS430 and the like. In addition, the base material may be one in which a metal film made of conductive metal such as chromium or titanium is formed on the surface of an insulating substrate such as a glass plate or a resin plate.

In the manufacturing process of the vapor deposition cover 1, after the metal layer 7 is formed by plating on the base material 10 (see FIG. 11(B)), the base material 10 is separated and removed from them (see FIG. 11(C)) . When the base material 10 is made of stainless steel, it is preferable to use a method of physically peeling and removing it from the side of the evaporation cover by applying force. In addition, when the base material 10 is made of other metal materials, it is preferable to use a chemical solution. And the etching method of dissolution removal. In the case of etching, an etchant with selective etching properties that dissolves the base material 10 but does not damage the materials forming the primary electrodeposited layer 15 or the frame body 3 and the metal layer 7 is used.

The above-mentioned primary electrodeposited layer 15 is composed of a nickel alloy suitable for electroforming such as nickel and nickel-cobalt, and is formed by electroforming on a portion of the substrate 10 where the primary pattern resist 14 does not exist. In the vapor deposition cover 1, the primary electrodeposition layer 15 is used as the cover main body 2 covering the surface of the vapor deposition substrate except for the vapor deposition through hole 8 corresponding to the vapor deposition target portion such as the light emitting layer in the vapor deposition substrate. layer formed.

The above-mentioned primary pattern resist 14 is formed of an insulating material having dissolution resistance to the electrolytic solution used for electroforming of the primary electrodeposition layer 15, and is arranged so as to be incompatible with the primary electrodeposition layer 15 previously set on the base material 10. The configuration part corresponds and is removed after forming the primary electrodeposited layer 15 (refer to FIG. 6 and FIG. 7 ).

This primary pattern resist 14 is arranged on the base material 10 before forming the primary electrodeposited layer 15, and the photosensitive resist, such as a negative photosensitive dry film resist, is made into a specific thickness, such as about The thickness of 20 μm is arranged on the substrate 10, and the mask film 12 of a specific pattern corresponding to the position of the cover body 2 of the evaporation cover 1, that is, the position of the primary electrodeposited layer 15 is placed, by using Ultraviolet radiation is used to perform treatments such as hardening by exposure and development to remove the resist in the non-irradiated portion, and forms a shape corresponding to the non-arrangement portion of the primary electrodeposited layer 15 .

The above-mentioned secondary pattern resist 18 is formed of an insulating material having solubility resistance to the electrolytic solution used for plating the metal layer 7, preferably having a thickness in the range of 100 to 120 μm, so as to be compatible with the primary electrode set in advance. The non-arranged portion of the deposited layer 15 corresponding to the metal layer 7 is arranged before the formation of the metal layer 7 and removed after the formation of the metal layer 7 (see FIGS. 8 and 9 ).

For the secondary pattern resist 18, a photosensitive resist, such as a negative photosensitive dry film resist, is pasted and arranged on the substrate 10 and the configured primary electrodeposited layer 15, and a primary electrodeposition layer 15 is carried out. Or repeat a series of steps of exposing by ultraviolet irradiation in the state where the mask film 17 of a specific pattern corresponding to the position of the metal layer 7 of the vapor deposition mask 1 and the frame body 3 is placed, to form the desired resist. After the thickness is removed, the shape corresponding to the non-disposition portion of the metal layer 7 (pattern formation region 2 a of the cover main body 2 ) is formed through processing such as development of a photosensitive material that removes the non-irradiated portion during exposure.

The above-mentioned metal layer 7 is formed by plating, is made of nickel or nickel-cobalt alloy, etc., and has the following structure, that is, it is formed on the base material 10 and the primary electrodeposited layer 15 and the frame by plating. The exposed portion on the body 3 without the secondary patterning resist 18 disposed thereon.

This metal layer 7 is what joins the outer peripheral edge 2b of the pattern formation area 2a of the cover main body 2, and the frame body 3. As shown in FIG. The metal layer 7 is laminated|stacked on the upper surface of the cover main body 2 of the periphery 2b outside a pattern formation area by plating. Specifically, the metal layer 7 is formed on the upper surface of the outer peripheral edge 2b of the pattern forming region 2a, the upper surface of the frame body 3, the side surface of the pattern forming region 2a side, and the gap between the cover main body 2 and the frame body 3, thereby The outer peripheral edge 2b of the pattern forming region 2a and the opening peripheral edge of the frame body 3 are integrally connected so as not to be separated.

Next, the steps of forming the frame of the vapor deposition mask according to the present embodiment and the steps of manufacturing the entire vapor deposition mask including the frame will be described. First, the steps of forming the frame body 3 for reinforcing the use of the cover main body 2 will be described.

First, the first frame member 3a and the second frame member 3b of the same shape are formed by performing a cutting step by electrical discharge machining, laser machining, etc. from a general sheet metal material that has been processed by rolling or the like. When cutting the second frame member 3b from the sheet metal stock, the portion set as the second frame member 3b on the sheet metal stock is set in such a way that its direction is reversed relative to the portion of the first frame member 3a. In the first frame member 3a and the second frame member 3b, warpage due to strain is generated in opposite directions.

After dicing, opening regions 6 are provided on each of the cut members by etching, laser processing, etc., and the first frame member 3 a and the second frame member 3 b are completed. The obtained first frame member 3a and the second frame member 3b are interposed with an adhesive to be the adhesive layer 3c, and are integrally bonded in a state in which the direction of warpage is reversed, thereby obtaining a frame in which each part has a specific cross-sectional shape Body 3.

As an adhesive for integrating the first frame member 3a and the second frame member 3b, for example, a sheet-shaped photosensitive dry film resist having adhesiveness in an uncured state is used, and by using The same materials are used in the same, but can be prepared by diverting a part of the corresponding amount after uniform preparation and supplementation. It is not necessary to prepare additional commercially available adhesives for the purpose of setting the adhesive layer, so that there will be no special use. The cost of the adhesive can reduce the manufacturing cost of the evaporation mask accordingly, so it is preferable.

If necessary, a pair of pressurizing rollers, etc., can also be used to apply a clamping force to the laminated members, so that the first frame member 3a and the second frame member 3b that have been bonded into one body can be bonded. fixed steps.

After bonding, the unnecessary portion of the adhesive layer 3c, that is, the portion located outside the opening area 6 and the outer frame portion 4 is removed, thereby completing the frame body 3 . Furthermore, in the case where the adhesive is a thin film resist, it is removed by a developing step.

Another adhesive layer 19 for bonding it to the base material 10 is arranged on the completed frame body 3 . As the adhesive layer 19, for example, a photosensitive dry film resist that has adhesiveness in an uncured state can be attached and used, and after the thin film resist is attached to the frame body 3, the opening area 6 located in the frame body 3 is removed. The part or the part overflowing from the outer frame part 4 is thin-film resist, whereby the bonding layer 19 is obtained.

On the other hand, for the manufacturing steps of the vapor deposition cover, first, the vapor deposition through hole 8 of the cover main body 2 set on the substrate 10 in advance, that is, the non-arrangement part of the primary electrodeposition layer 15 is arranged on the substrate 10. A resist layer 11 is provided (see FIG. 6 ). Specifically, on the surface side of the substrate 10, for example, a negative-type photosensitive dry film resist is laminated in one or more sheets according to a specific thickness (for example, about 20 μm) required for the formation of the primary electrodeposition layer 15, by The resist layer 11 is formed by thermocompression bonding (see FIG. 6(A) ).

Next, the cover film (glass cover) 12 having a specific pattern corresponding to the light transmission hole 12a corresponding to the above-mentioned vapor deposition through hole 8 and the position corresponding to the arrangement position of the primary electrodeposition layer 15 is closely attached to the surface of the resist layer 11. Each treatment such as hardening by exposure by ultraviolet irradiation (see FIG. 6(B) and (C)), development and drying of the resist to remove the masked non-irradiated portion is performed. In this manner, the primary pattern resist 14 corresponding to the non-arranged portion of the primary electrodeposited layer 15 is formed on the substrate 10 (see FIG. 7(A) ). In addition, such a primary pattern resist 14 can be formed by lithography using a photoresist etc., and other arbitrary methods, and the formation method is not limited to the above.

Put the base material 10 with the primary pattern resist 14 into the electroforming bath under specific conditions initially, within the range of the thickness of the primary pattern resist 14, the substrate 10 that is not coated with the primary pattern resist The surface covered with 14 (exposed area) is formed by electroforming of an electrodeposited metal such as nickel alloy, for example, with a thickness of 8 μm, a primary electrodeposited layer 15 serving as the cover main body 2 (see FIG. 7(B)).

Thereafter, the primary pattern resist 14 is removed by dissolving to obtain the primary electrodeposition layer 15 which becomes the cover main body 2, and the cover main body 2 is provided with a plurality of independent vapor deposition through holes 8 ( Refer to FIG. 7(C)).

After the primary electrodeposition layer 15 is obtained, the resist layer 16 preferably having a thickness in the range of 50 to 60 μm is disposed on the entire surface of the substrate 10 including the portion where the primary electrodeposition layer 15 is formed. Specifically, a negative photosensitive dry film resist having a thickness of, for example, 56 μm is attached to the surface side of the substrate 10 , and the main part is cured by exposure. This step is repeated as many times as necessary so that the secondary pattern resist 18 finally obtained from the resist layer 16 becomes a preset specific thickness, and a single layer or a single layer composed of one or more thin film resists is formed. The resist layer 16 of the laminated structure.

Exposure of the thin film resist is performed every time one sheet is attached. Specifically, it is carried out as the following steps: after making the cover film 17 having the light transmission hole 17a corresponding to the pattern forming area 2a of the cover main body 2 adhere to the surface of the newly attached thin film resist, and then exposing it by ultraviolet radiation hardening (see FIG. 8(B), FIG. 9(A)). This step is repeated as necessary to obtain a resist layer 16a of a predetermined thickness hardened by exposure in the portion corresponding to the pattern formation region 2a, and to obtain a resist layer 16a of a predetermined thickness in other portions. The exposed resist layer 16b.

In this embodiment, the step of attaching a thin film resist and exposing is repeated twice to form a resist layer 16 with a double layer thickness of 56 μm. Thereafter, a process of dissolving and removing the unexposed resist layer 16 b exposed on the surface was performed to form a secondary pattern resist 18 covering the pattern forming region 2 a with a thickness of 112 μm (see FIG. 9(C) ).

After the secondary pattern resist 18 is formed in this way, on the lower surface side of the frame body 3 that has been formed through the above-mentioned frame body forming step, the adhesive layer 19 is preliminarily arranged on the primary electrodeposited layer 15 in a predetermined position. site (see Figure 9(C)). The frame body 3 in this state can be temporarily fixed on the primary electrodeposited layer 15 so as not to move easily by the adhesiveness of the adhesive layer 19 .

The temporarily fixed frame 3 is crimped by applying a load from above the frame 3 so that the frame 3 is not easily separated from the primary electrodeposited layer 15 (see FIG. 10 ). Specifically, first, as temporary pressure bonding, a static load is applied to the frame body 3 for a predetermined period of time to pressure bond it to the base material side. That is, a glass plate weighing 50 kg or more, eg, 105 kg, is placed on the frame body 3 and left to stand for 1 hour or more, for example, 4 hours. In this temporary pressure bonding, as the static load, as long as it can be placed on the frame body 3, an object other than a glass plate may be used.

Next, as final crimping, each part of the frame body 3 is uniformly pressed to be firmly fixed to the primary electrodeposited layer 15 . As a specific example, after removing the glass plate, etc., relatively move relative to the frame body 3, and at the same time press the pressure roller (laminator) with a pressure of 0.1 MPa or more, such as 0.6 MPa, on the frame body 3. Three times while performing the suppression.

As this final crimping, when pressing with a pressure roller, a rigid plate body that is not easily deformed, such as a plate made of SUS material, is interposed between the frame body 3 and the rollers. In the pressing of the rollers, the force from the rollers is dispersed by the plate and transmitted to the frame body 3, which is preferable because it is less likely to cause variations in the pressing force than the case of direct pressing with the rollers.

In addition, it is also possible to make a sheet made of an elastic system such as a high-rigidity plate body and rubber, which is interposed between the frame body 3 and the roller in a state where the side of the sheet material faces the frame body 3, and pass through the plate body and the sheet material. The material is pressed with a roller. In this case, the unevenness of the interval between the board and the frame caused by slight inclination, strain, unevenness, etc. on the surface of the board can be absorbed by the elastic deformation of the sheet between the board and the frame. The force of the roller is more evenly transmitted to the frame body 3 through the sheet close to the frame body 3, and the primary electrodeposition layer 15 can be further uniformly pressed against the frame body 3, which can suppress the Gaps are formed between the buildup layers 15 to prevent adverse effects such as abnormal growth of plating caused by the gaps during the formation of the metal layer 7 .

Furthermore, in addition to using a pressure roller (laminator) to press the frame body 3 as the final crimping, it is also possible to use a pressing type that can press the frame body 3 by moving the pressing part only in the thickness direction of the frame body 3. It is preferable that the device does not have the problem that the self-rolling roller erroneously applies a force in the direction of the roller tangential (lateral direction) to the frame, as in the case of pressing using a roller, causing the frame to shift laterally.

After such a crimping step, on the upper surface of the primary electrodeposited layer 15 that is not covered by the secondary pattern resist 18 but exposed on the surface of the outer periphery 2b of the pattern formation area 2a, the primary electrodeposited layer on the lower side of the frame body 3 The deposition layer 15a and the exposed surfaces of the base material 10 whose sides are exposed on the surface, and the surface of the frame 3 form the metal layer 7 by electro-deposited metal plating (see FIG. 11(B) ). With this metal layer 7, the primary electrodeposited layer 15 and the frame body 3 can be integrally connected without being separated.

In this case, the metal layer 7 is exposed to the upper surface of the primary electrodeposition layer 15 on the surface exposed on the outer peripheral edge 2b of the pattern formation region 2a or between the primary electrodeposition layer 15 and the frame body 3. The thickness of the surface of the substrate 10 and the thickness of the metal layer 7 on the surface of the frame body 3 are formed thinner. The difference in thickness is due to the fact that the metal layer 7 is stacked sequentially from the surface of the substrate 10 or the primary electrodeposition layer 15. When the height dimension of the next layer 19 is exceeded and the frame 3 is reached, the frame 3 begins to be in contact with the substrate. 10 or the state where the primary electrodeposited layer 15 is turned on, the metal layer 7 starts to be formed on the surface of the frame body 3 .

After the formation of the metal layer 7 is completed, as a final step, the integrated primary electrodeposition layer 15 , frame body 3 , and metal layer 7 are peeled off from the substrate 10 (see FIG. 11(C) ). Furthermore, the primary electrodeposited layer 15 a present on the lower side of the frame body 3 is removed together with the adhesive layer 19 , and then the secondary pattern resist 18 is removed, thereby completing the manufacture of the vapor deposition mask 1 . In addition, when the adhesive layer 19 remains on the lower side of the frame body 3, it removes it when the pattern resist 18 is removed twice.

In this way, the vapor deposition cover of this embodiment makes the cross-sectional shape of the minimum width part in the inner frame part 5 of the frame body 3 an appropriate relationship between the width and thickness, and reliably imparts bending rigidity to the minimum width part. The required and sufficient strength of the force from the side of the cover main body 2, together with other parts of the frame body 3 that are wider and stronger than the minimum width portion, together with the frame body 3 as a whole, prevents the parts of the cover main body 2 from existing. The offset of the position can ensure the integrated state of the cover and the substrate to be evaporated in the evaporation step, and can perform evaporation at an appropriate position of the substrate to be evaporated with high precision. In addition, due to the difficulty of bending deformation of the minimum width portion, the deflection caused by the weight of the minimum width portion can be suppressed, and the deformation of the frame body 3 and its influence on the cover main body 2 can be suppressed.

Furthermore, the vapor deposition cover of the above-mentioned embodiment is configured such that the cover main body 2 is arranged so as to be located in each opening area 6 of the frame body 3, and is formed so that only one with a plurality of vapor deposition through holes 8 is arranged inside. The pattern forming area 2a is not limited thereto, and as shown in FIG. 12 , the cover main body 2 may have a plurality of pattern forming areas 2a. In this case, in order to reliably suppress the displacement of the cover body 2, it is preferable to form the width of each part of the frame around the cover body larger than the allowable width dimension as the minimum width part to ensure sufficient rigidity. In addition, instead of providing only one cover main body 2 located in each opening area 6 of the frame body 3 , a plurality of cover main bodies 2 may be arranged in line in one opening area 6 . In this case, the outer peripheral edge of the cover main body 2 is divided into a portion adjacent to the frame body 3 and a portion adjacent to the cover main body. The case of integration is the same, and the cover main bodies are joined together by metal layers formed by plating.

In addition, the vapor deposition cover of the above-mentioned embodiment is configured such that the frame body 3 is formed by integrally joining the first frame member 3a and the second frame member 3b of the same shape, but it is not limited thereto, and may be configured so that the first frame The shapes of the member 3a and the second frame member 3b are different. For example, as shown in FIG. The opening is made larger, the width of each part of the second frame member 3b is made larger than that of the first frame member 3a, and the first frame member 3a and the second frame member 3b are integrally joined to form the frame body 3 . In this case, the opening area 6 of the frame body 3 is widened at a position away from the cover main body 2, and the peripheral portion surrounding the opening area 6 is in a receded state. The vapor deposition through hole 8 of the opening area 6 and the cover main body 2 faces the vapor deposition material of the vapor deposition target substrate, and the peripheral portion around the opening area 6 in the frame body 3 is difficult to become an obstacle hindering the progress of the vapor deposition material, and can be used for each The vapor deposition through hole 8 eliminates the influence of the frame 3, so that the vapor deposition material can travel smoothly, and the vapor deposition can be performed more properly.

In addition, the manufacturing structure of the vapor deposition cover of the above-mentioned embodiment is such that the metal layer 7 is formed in contact with the primary electrodeposited layer 15 and the frame body 3, and the primary electrodeposited layer 15 and the frame body 3 are integrated by the metal layer 7. However, it is not limited thereto. It may also be configured such that the frame body 3 is interposed and placed on the primary electrodeposited layer 15 on the lower side with an adhesive stronger than the unhardened film resist, and then the primary electrodeposited layer 15 is used. The electrodeposition layer 15 and the frame body 3 are integrated, and the electrodeposition layer, that is, the integration of the cover body 2 and the frame body 3 can be easily performed once, and the manufacturing efficiency of the cover can be improved. In this case, furthermore, by forming the metal layer so as to cover the surface of the cover main body 2 and the surface of the frame body 3, the joint state of the cover main body 2 and the frame body 3 can be made more favorable. In particular, by covering the surface (side) of the adhesive with the metal layer, deterioration of the adhesive due to cleaning or temperature rise can be effectively prevented, and the bonded state between the cover body 2 and the frame 3 can be maintained for a long period of time.

In addition, in the manufacture of the vapor deposition cover of the above-mentioned embodiment, after disposing the frame body 3 on the base material 10, the metal layer 7 is formed on the surface of the frame body 3, but it is not limited to this, and it may also be configured such that it is formed by plating. In front of the metal layer 7, a resist is provided on a part or the whole of the upper surface of the frame, so that the metal layer 7 is not formed on the entire upper surface of the frame, and the metal layer 7 is only placed on the upper surface of the frame except for the required parts. A part is provided, omitted, and a stress relieving part is provided on the surface of the frame body 3 .

In this case, on the upper surface of the frame body 3, the metal layer 7 is not uniformly continuous, but localized and incomplete, so that even if internal stress occurs in the metal layer, it will not act on the entire frame body 3, and Since it acts locally and intermittently, the frame body 3 is less likely to be affected by deformation or the like, and the planar shape can be ensured.

In addition, in the manufacture of the vapor deposition mask of the above-mentioned embodiment, after forming the primary electrodeposited layer 15, the metal layer 7 is formed on the primary electrodeposited layer without special surface treatment. After the layer 15 is deposited and before the metal layer 7 is formed, activation treatments such as acid leaching and electrolytic treatment are performed on the predetermined specific range where the metal layer is overlapped in the primary electrodeposition layer 15 .

In this case, compared with the case of no treatment, the bonding strength between the activation-treated portion of the primary electrodeposited layer 15 and the metal layer 7 thereon is greatly improved. In addition, instead of activation treatment, a thin layer of strike nickel, matte nickel, or the like may be formed on a specific range of the primary electrodeposition layer 15 . Thereby, the bonding strength between the thin layer forming portion of the primary electrodeposited layer 15 and the metal layer 7 thereon can also be improved.

In addition, the manufacturing configuration of the vapor deposition cover of the above-mentioned embodiment is such that the primary electrodeposition layer 15 or the overlapped portion of the frame body 3 and the metal layer 7 are simply in contact with each other on a plane. (Cover main body 2) A plurality of through-holes or recesses are provided around the outer periphery 2b of the pattern forming region 2a, and the metal layer 7 formed on the outer periphery 2b of the primary electrodeposited layer 15 is buried in the above-mentioned through-holes or recesses. The concave portion is formed in a state where the metal layer 7 partially sinks into the outer peripheral edge 2b.

In this case, the metal layer 7 exists not only on the upper surface of the outer peripheral edge 2b of the pattern forming region 2a, but also in each through hole or recess of the outer peripheral edge 2b relative to the primary electrodeposited layer 15. The bonding strength of the outer peripheral edge 2b is greater. Thereby, the cover main body 2 and the frame body 3 can be integrally connected more firmly through the metal layer 7, and the inadvertent fall-off or misalignment of the cover main body 2 relative to the frame body 3 can be reliably suppressed, and further improvement in vapor deposition accuracy and Reproducibility of vapor deposition formations.

In addition, in the manufacture of the vapor deposition mask of the above-mentioned embodiment, the structure of the primary electrodeposited layer 15 to be the mask main body 2 formed on the surface of the substrate 10 not covered by the primary pattern resist 14 is not specifically described in detail. However, the primary electrodeposited layer 15 may also have a two-layer structure of a matte nickel layer formed on the substrate 10 side and a glossy nickel layer formed on the matte nickel layer. Specifically, on the surface of the substrate 10 that is not covered with the primary pattern resist 14, after forming an electrodeposited layer made of matte nickel by electroforming, a layer made of glossy nickel is formed thereon by electroforming. electrodeposited layer to make the primary electrodeposited layer 15. Regarding the relationship between the thicknesses of the matte nickel layer and the glossy nickel layer, if the matte nickel layer is too thick, the tension generated in the completed cover main body 2 becomes excessively large, which may cause deformation of the frame body 3. Therefore, it is preferable that the ratio of the thickness of the glossy nickel layer to the matte nickel layer is about 5/7.

It is also possible to reverse the formation order of the matte nickel layer and the glossy nickel layer to form a two-layer structure in which the matte nickel layer is formed on the glossy nickel layer. However, in the case of the latter two-layer structure in which a matte nickel layer is formed on a glossy nickel layer, it is preferable to use the former in the case of a matte nickel layer, considering that the probability of interlayer delamination is higher than that of the former two-layer structure. A double-layer structure of a shiny nickel layer is formed on the nickel layer.

In this way, by adopting a two-layer structure in which the glossy nickel layer is disposed on the upper side of the matte nickel layer, and making the matte nickel layer moderately thicker than the glossy nickel layer, the desired orientation can be increased in the completed cover main body 2. The tension (tensile stress) of the inner contraction can provide the vapor deposition cover 1 with excellent heat resistance without deformation of the cover main body 2 even under the influence of expansion of each part due to heat.

Furthermore, in the case where only the primary electrodeposition layer is formed of matte nickel, the tension generated in the cover main body 2 after completion becomes excessively large, which may cause deformation of the frame body 3, and become a failure of the primary electrodeposition layer. The surface of the glossy nickel layer is rough, so the bonding force to the surface such as plating becomes large, and problems such as inability to separate the primary electrodeposited layer 15a and the metal layer 7 easily occur in the mask manufacturing step. This problem can also be avoided by the above-mentioned primary electrodeposited layer with a double-layer structure of a glossy nickel layer formed on a matte nickel layer. In the case where a two-layer structure of a glossy nickel layer is formed on the matte nickel layer, in the glossy nickel layer part of the primary electrodeposited layer, although the bonding force becomes smaller than that of the matte nickel layer, the primary electrodeposited layer 15 and the metal The layer 7 is correspondingly easy to separate, however, the bonding strength with the metal layer can be sufficiently ensured by forming a through hole to the primary electrodeposited layer, activation treatment, or forming a thin layer of impact nickel, matte nickel, or the like.

1‧‧‧evaporation cover 2‧‧‧cover main body 2a‧‧‧pattern forming area 2b‧‧‧outer peripheral edge 3‧‧‧frame body 3a‧‧‧first frame member 3b‧‧‧second frame member 3c‧ . Material 11‧‧‧resist layer 12‧‧‧cover film 12a‧‧‧opaque 14‧‧‧primary pattern resist 15, 15a‧‧‧primary electrodeposition layer 16‧‧‧resist layer 16a , 16b‧‧‧resist layer 17‧‧‧cover film 17a‧‧‧light-transmitting hole 18‧‧‧secondary pattern resist 19‧‧‧adhesion layer

FIG. 1 is a schematic plan view of a vapor deposition cover according to one embodiment of the present invention. FIG. 2 is an explanatory view showing the configuration of main parts of a vapor deposition cover according to an embodiment of the present invention. Fig. 3 is a schematic sectional view of main parts of a vapor deposition cover according to an embodiment of the present invention. FIG. 4 is a plan view of a frame of a vapor deposition cover according to an embodiment of the present invention. FIG. 5 is an explanatory diagram of steps of forming a frame of a vapor deposition cover according to an embodiment of the present invention. Fig. 6 is an explanatory diagram of a primary pattern resist formation process in the manufacture of the vapor deposition mask according to the embodiment of the present invention. Fig. 7 is an explanatory diagram of a step of forming a primary electrodeposited layer in the manufacture of a vapor deposition mask according to an embodiment of the present invention. FIG. 8 is an explanatory view of the first half of the secondary pattern resist formation process in the manufacture of the vapor deposition mask according to the embodiment of the present invention. FIG. 9 is an explanatory diagram of the second half of the second pattern resist formation process in the manufacture of the vapor deposition mask according to the embodiment of the present invention. FIG. 10 is an explanatory diagram of a crimping process of a frame in the manufacture of a vapor deposition cover according to an embodiment of the present invention. FIG. 11 is an explanatory diagram of a metal layer forming step and a separation state of the vapor deposition mask and the base material in the manufacture of the vapor deposition mask according to the embodiment of the present invention. Fig. 12 is a schematic plan view of another example of the vapor deposition cover according to the embodiment of the present invention. 13 is a plan view and a schematic cross-sectional view of another frame of the vapor deposition cover according to the embodiment of the present invention.

1‧‧‧Evaporation cover

2‧‧‧Cover main body

2a‧‧‧pattern formation area

2b‧‧‧outer periphery

3‧‧‧frame

Claims (6)

An evaporation cover, which includes: a plurality of cover main bodies, which arrange a plurality of independent evaporation through holes in a specific pattern; and a frame, which is arranged around the cover main body; the above-mentioned evaporation cover is characterized in that: the above-mentioned frame The body has: a rectangular or square outer frame portion located on the outermost periphery, and an inner frame portion that divides the inner side of the outer frame portion into a plurality of opening areas, and is formed in a lattice shape as a whole, and the above-mentioned cover main bodies are respectively located on the frame body. A plurality of opening areas are integrated with the above-mentioned frame body. Among the above-mentioned inner frame parts of the above-mentioned frame body, the cross-sectional shape of the part with the narrowest width in the thickness direction of the above-mentioned frame body is: thickness dimension relative to width dimension The ratio of 0.8/4 or more and 2/4 or less. The vapor deposition cover according to claim 1, wherein, among the above-mentioned outer frame portion and the above-mentioned inner frame portion of the above-mentioned frame body, the cross-sectional shape other than the portion having the narrowest width in the thickness direction of the frame body is: the thickness dimension is relative to The ratio of the width dimension is 0.8/90 or more, and is smaller than the ratio of the thickness dimension to the width dimension of the narrowest portion of the inner frame portion. The vapor deposition cover according to claim 1 is formed such that the thickness dimension of the frame is 0.8 mm or more and 2 mm or less. The vapor deposition cover according to claim 2 is formed such that the thickness dimension of the frame is 0.8 mm or more and 2 mm or less. The vapor deposition cover according to any one of claims 1 to 4, wherein the frame body is a laminated structure in which the first frame member and the second frame member are overlapped and integrated, and the first frame member and the second frame member are It is a warped frame member formed from a sheet metal material, and the respective warped directions are directed in opposite directions. The vapor deposition cover according to any one of claims 1 to 4, wherein the frame body is formed by making the material of the inner frame part and the material of the outer frame part different.

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