[go: up one dir, main page]

TWI791041B - Exposure system alignment and calibration method - Google Patents

Exposure system alignment and calibration method Download PDF

Info

Publication number
TWI791041B
TWI791041B TW107129461A TW107129461A TWI791041B TW I791041 B TWI791041 B TW I791041B TW 107129461 A TW107129461 A TW 107129461A TW 107129461 A TW107129461 A TW 107129461A TW I791041 B TWI791041 B TW I791041B
Authority
TW
Taiwan
Prior art keywords
marks
model
positions
alignment
plate
Prior art date
Application number
TW107129461A
Other languages
Chinese (zh)
Other versions
TW201921142A (en
Inventor
塔梅爾 克斯古
鐘欽
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201921142A publication Critical patent/TW201921142A/en
Application granted granted Critical
Publication of TWI791041B publication Critical patent/TWI791041B/en

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019Calibration
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70783Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/707Chucks, e.g. chucking or un-chucking operations or structural details
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7084Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

Methods are provided that, in some embodiments that provide alignment of a first layer of a printing plate on a chuck. For example, in one embodiment, images of reference marks on a chuck are captured to determine the initial positions of the reference marks on the chuck. A reference model is created from those initial positions. Images of alignment marks on a reference plate are captured and the locations of the alignment marks are determined. A reference plate model is created from the positions of the alignment marks. A mapping model is then created from the reference model and the reference plate model.

Description

曝光系統對準及校正方法 Exposure system alignment and calibration method

本揭露之數個實施例一般是有關於微影,及更特別是有關於一夾持件上之一印刷層的校準對準。 Embodiments of the present disclosure relate generally to lithography, and more particularly to the calibration alignment of a printed layer on a holder.

光微影係廣泛地使用於半導體裝置及顯示器裝置(舉例為液晶顯示器(liquid crystal displays,LCDs)之製造中。然而,在微影曝光期間,夾持件(執行曝光之處)可能因重複使用、應力、及/或工具之機械及/或熱變化而移動。此些變化可能影響印刷於板材上之圖案的位置準確性。當從利用一工具所印刷之板材試圖重複印刷圖案於另一工具上時,印刷圖案的位置可能不正確。 Photolithography is widely used in the manufacture of semiconductor devices and display devices such as liquid crystal displays (LCDs). However, during lithography exposure, the holder (where the exposure is performed) may be damaged by repeated use , stress, and/or mechanical and/or thermal changes of the tool. These changes may affect the positional accuracy of the pattern printed on the plate. When trying to repeat the pattern printed on another tool from a plate printed with one tool When on, the position of the printed pattern may not be correct.

因此,需要校準用於工具上之對準印刷層。 Therefore, there is a need to calibrate the alignment printed layers used on the tool.

此處所述之數個實施例一般是有關於微影,及更特別是有關於一夾持件上之一印刷層之校準對準。舉例來說,於一實施例中,提出一種方法,擷取一夾持件上的數個參考記號的數個影像,以及決定此些參考記號的初始位置。一參考模型係從此些參考記號之此些初始位置產生。一參考板材上的數個對準記號 的數個影像係擷取。此些對準記號的數個位置係決定。一參考板材模型係從此些對準記號之此些位置產生。之後,一映射模型係從參考模型及參考板材模型產生。 The embodiments described herein relate generally to lithography, and more particularly to the calibration alignment of a printed layer on a holder. For example, in one embodiment, a method is provided for capturing images of reference marks on a holder and determining initial positions of the reference marks. A reference model is generated from the initial positions of the reference marks. Several alignment marks on a reference plate Several images of were acquired. Several positions of these alignment marks are determined. A reference plate model is generated from the positions of the alignment marks. Afterwards, a mapping model is generated from the reference model and the reference panel model.

於另一實施例中,提出一種方法,從一夾持件上之數個參考記號的數個初始位置產生一參考模型,從一第一參考板材上之數個對準記號之數個位置產生一參考板材模型,以及從參考模型及參考板材模型產生一映射模型。 In another embodiment, a method is proposed to generate a reference model from several initial positions of several reference marks on a clamping member and from several positions of several alignment marks on a first reference plate A reference plate model, and a mapping model is generated from the reference model and the reference plate model.

於再另一實施例中,提出一種方法,擷取一夾持件上之數個參考記號之數個影像,及決定夾持件上之此些參考記號之數個初始位置。之後,儲存此些參考記號之此些初始位置於記憶體中,擷取一參考板材上之數個對準記號之數個影像,以及參考板材上之此些對準記號之數個位置係決定及儲存於記憶體中。 In yet another embodiment, a method is provided for capturing a plurality of images of a plurality of reference marks on a holder, and determining a plurality of initial positions of the reference marks on the holder. Afterwards, storing the initial positions of the reference marks in memory, capturing images of the alignment marks on a reference plate, and determining the positions of the alignment marks on the reference plate and stored in memory.

本揭露之其他實施例係提供而包括具有類似於此處所述之方法的數個特徵的其他數個方法、設備、及系統。為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: Other embodiments of the disclosure are provided to include other methods, apparatuses, and systems having features similar to the methods described herein. In order to have a better understanding of the above-mentioned and other aspects of the present invention, the following specific examples are given in detail with the accompanying drawings as follows:

100:系統 100: system

110:底框 110: Bottom frame

112:被動空氣隔離器 112: Passive Air Isolator

120:板 120: board

122:支撐件 122: support

124、150:軌道 124, 150: track

126:編碼器 126: Encoder

128:內部牆 128: Internal wall

130、1301、1302:夾持件 130, 130 1 , 130 2 : clamping parts

1311、1312:平台 131 1 , 131 2 : platform

140:基板 140: Substrate

160:處理設備 160: Processing equipment

162:支撐件 162: support

164:處理單元 164: processing unit

165:盒 165: box

166:開孔 166: opening

2021、2022、2041、2042:對準區域 202 1 , 202 2 , 204 1 , 204 2 : alignment area

206:橋 206: bridge

2081、2084、2085、2089、20811:眼 208 1 , 208 4 , 208 5 , 208 9 , 208 11 : eyes

300:參考板材 300: Reference plate

3021、3025、3041、3044、3045、3081、3082、3088:參考記號 302 1 , 302 5 , 304 1 , 304 4 , 304 5 , 308 1 , 308 2 , 308 8 : Reference symbols

3061、3064:導引線 306 1 , 306 4 : guide wire

310、3101-3109:對準記號 310, 310 1 -310 9 : alignment mark

312、314:視場 312, 314: field of view

400:空白板材 400: blank sheet

500:角度 500: Angle

502、504、506、508:連線 502, 504, 506, 508: connection

702:輸入輸出電路 702: Input and output circuits

704:記憶體 704: Memory

706:程式 706: program

708:支援電路 708: Support circuit

710:處理器 710: Processor

712:第一層對準模組 712:First layer alignment module

800、900、1000:方法 800, 900, 1000: method

802、804、806、808、810、812、814、902、904、906、1002、1004、1006、1008、1010、1012:方塊 802, 804, 806, 808, 810, 812, 814, 902, 904, 906, 1002, 1004, 1006, 1008, 1010, 1012: block

為了使本揭露的上述特徵可詳細地瞭解,簡要摘錄於上之本揭露之更特有的說明可參照數個實施例。部份之實施例係繪示於所附之圖式中。然而,值得注意的是,針對本揭露可承認其他等效實施例來說,所附之圖式係僅繪示出本揭露之典型實施例及因而不視為為其範圍之限制。 In order that the above-mentioned features of the present disclosure may be understood in detail, the more specific description of the present disclosure, briefly summarized above, may refer to several embodiments. Some embodiments are shown in the attached drawings. It is to be noted, however, that the accompanying drawings depict only typical embodiments of the disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equivalent embodiments.

第1圖繪示可受益於此處所揭露實施例之系統的透視圖。 Figure 1 depicts a perspective view of a system that may benefit from embodiments disclosed herein.

第2圖繪示根據此處所揭露實施例之第1圖中所示的系統之上視圖。 Figure 2 illustrates a top view of the system shown in Figure 1 according to embodiments disclosed herein.

第3圖繪示根據此處所揭露實施例之夾持件及參考板材的上視圖,夾持件具有參考記號,參考板材包括對準記號。 FIG. 3 shows a top view of a clamping member having reference marks and a reference plate including alignment marks according to embodiments disclosed herein.

第4圖繪示根據此處所揭露實施例之夾持件及夾持件上之空白板材的上視圖。 Figure 4 shows a top view of a clamp and a blank sheet on the clamp according to embodiments disclosed herein.

第5A圖繪示根據此處所揭露實施例之夾持件上之參考板材的例子。 Figure 5A shows an example of a reference plate on a clamp according to embodiments disclosed herein.

第5B圖繪示根據此處所揭露實施例之利用基於第5A圖中所示之裝配之校正模型之板材的例子,板材印刷於夾持件上。 Figure 5B shows an example of a plate printed on a holder using a calibration model based on the assembly shown in Figure 5A, according to embodiments disclosed herein.

第6A圖繪示根據此處所揭露實施例之夾持件上之參考板材的例子。 Figure 6A shows an example of a reference plate on a clamp according to embodiments disclosed herein.

第6B圖繪示根據此處所揭露實施例之利用基於第6A圖中所示之裝配之校正模型之板材的例子,板材印刷於夾持件上。 Figure 6B shows an example of a plate printed on a holder using a calibration model based on the assembly shown in Figure 6A, according to embodiments disclosed herein.

第7圖繪示根據此處所揭露實施例之用於對準夾持件上之空白板材之處理單元之高階方塊圖的一實施例。 FIG. 7 illustrates one embodiment of a high level block diagram of a processing unit for aligning blank sheets on a holder according to embodiments disclosed herein.

第8圖繪示根據此處所揭露實施例之對準印刷板材上之第一層於夾持件的方法之一實施例。 FIG. 8 illustrates one embodiment of a method of aligning a first layer on a printed board to a holder according to embodiments disclosed herein.

第9圖繪示根據此處所揭露實施例之對準印刷板材上之第一層於夾持件的方法之一實施例。 FIG. 9 illustrates one embodiment of a method of aligning a first layer on a printed board to a clamp according to embodiments disclosed herein.

第10圖繪示根據此處所揭露實施例之對準印刷板材上之第一層於夾持件的方法之一實施例。 FIG. 10 illustrates one embodiment of a method of aligning a first layer on a printed board to a holder according to embodiments disclosed herein.

為了有助於了解,相同的參考編號係在可行處使用,以表示圖式中通用之相同的元件。 To facilitate understanding, like reference numbers have been used, where possible, to refer to like elements that are common to the drawings.

在下方的說明中,許多特定之細節係提出,以提供對本揭露之更通透的暸解。然而,如本技術領域中具有通常知識者將明瞭,利用不同裝配之數種改變可在不脫離本文之範疇下達成。於其他例子中,已知的特徵係不進行說明,以避免使本文模糊。因此,本揭露係不視為限於本說明書中所示之特定說明的實施例,及所有此些替代實施例係意欲包括於所附之申請專利範圍的範疇中。 In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present disclosure. However, as will be apparent to those of ordinary skill in the art, several changes using different assemblies can be made without departing from the scope of this document. In other instances, well-known features have not been described in order to avoid obscuring the text. Accordingly, the disclosure is not to be viewed as limited to the particular illustrated embodiments shown in this specification and all such alternative embodiments are intended to be included within the scope of the appended claims.

應用面板、基板及晶圓係在本文中可互換地說明。此處所揭露之數個實施例係利用平台上之參考記號及參考板材上之對準記號。此處所揭露之參考記號及對準記號可使用,以修正平台上之第一印刷層的未對準。 Application panels, substrates, and wafers are described interchangeably herein. Several embodiments disclosed herein utilize reference marks on the platform and alignment marks on the reference plate. The reference marks and alignment marks disclosed herein can be used to correct misalignment of the first printed layer on the platform.

簡言之,此處所述之數個實施例一般係有關於取得初始參考記號及接續測量之參考記號之間的差異、及/或初始對準記號及接續測量之對準記號之間的差異。 In short, several embodiments described herein are generally concerned with obtaining the difference between an initial reference mark and a subsequently measured reference mark, and/or a difference between an initial alignment mark and a subsequently measured alignment mark .

第1圖繪示可受益於此處所揭露實施例之系統100的透視圖。系統100包括底框110、板120、二或多個平台131(舉例為平台1311及1312)、及處理設備160。夾持件130(也就是夾持件 1301及1302)置於各個別之平台131上。底框110可置於製造設施之地板上及可支撐板120。被動空氣隔離器112可位於底框110及板120之間。板120可為整塊的花崗岩,此二或多個平台131可設置於板120上。夾持件130上之基板140可藉由此二或多個平台131之各者支撐。數個洞(未繪示)可形成於夾持件130中,用以讓數個升舉銷(未繪示)於其延伸通過。升舉銷可例如是從一或多個傳送機器人(未繪示)升起至延伸位置,以接收基板140。此一或多個傳送機器人可使用,以裝載及從此二或多個夾持件130卸載基板140。 FIG. 1 shows a perspective view of a system 100 that may benefit from embodiments disclosed herein. The system 100 includes a base frame 110 , a board 120 , two or more platforms 131 (such as platforms 131 1 and 131 2 ), and a processing device 160 . The clips 130 (ie clips 130 1 and 130 2 ) are placed on respective platforms 131 . The base frame 110 can be placed on the floor of the manufacturing facility and can support the board 120 . A passive air separator 112 may be located between the bottom frame 110 and the plate 120 . The board 120 can be a whole piece of granite, and the two or more platforms 131 can be set on the board 120 . The substrate 140 on the holder 130 may be supported by each of the two or more platforms 131 . A plurality of holes (not shown) may be formed in the clamping member 130 for a plurality of lift pins (not shown) to extend therethrough. The lift pins may be lifted, for example, from one or more transfer robots (not shown) to an extended position to receive the substrate 140 . The one or more transfer robots may be used to load and unload substrates 140 from the two or more grippers 130 .

基板140可舉例為以石英製成,及使用來作為平板面板顯示器之一部份。於其他實施例中,基板140可以其他材料製成,其他材料例如是玻璃。於一些實施例中,基板140可具有光阻層形成於其上。光阻劑係對光照射敏感(sensitive to radiation),光阻劑可為正光阻劑或負光阻劑。光阻劑為正光阻劑或負光阻劑係意味暴露於光照射之光阻劑的數個部份在圖案寫入光阻劑中之後,將對提供至光阻劑之光阻劑顯影劑分別為可溶解或不可溶解。光阻劑之化學成份決定光阻劑將為正光阻劑或負光阻劑。舉例來說,光阻劑可包括重氮萘醌(diazonaphthoquinone)、酚醛樹脂(phenol formaldehyde resin)、聚甲基丙烯酸甲酯(poly(methyl methacrylate))、聚甲基戊二酰亞胺(poly(methyl glutarimide))、及SU-8之至少一者。於此方式中,圖案可產生於基板140之一表面上,以形成電路。 The substrate 140 can be made of quartz, for example, and used as a part of a flat panel display. In other embodiments, the substrate 140 can be made of other materials, such as glass. In some embodiments, the substrate 140 may have a photoresist layer formed thereon. The photoresist is sensitive to radiation, and the photoresist can be a positive photoresist or a negative photoresist. A photoresist is a positive photoresist or a negative photoresist meaning that the portions of the photoresist that are exposed to light will, after the pattern is written in the photoresist, have a negative effect on the photoresist developer provided to the photoresist. soluble or insoluble, respectively. The chemical composition of the photoresist determines whether the photoresist will be a positive photoresist or a negative photoresist. For example, the photoresist may include diazonaphthoquinone, phenol formaldehyde resin, poly(methyl methacrylate), polymethylglutarimide (poly( methyl glutarimide)), and at least one of SU-8. In this manner, a pattern can be created on one surface of the substrate 140 to form a circuit.

系統100可更包括一對支撐件122及一對軌道124。此對支撐件122可設置於板120上。板120及此對支撐件122可為一件式材料。此對軌道124可由此對支撐件122支撐。此二或多個平台131可在X方向中沿著軌道124移動。於一實施例中,此對軌道124係為一對平行磁性通道。如圖所示,此對軌道124之各軌道124係為線性的。於其他實施例中,軌道124可具有非線性的形狀。編碼器126可耦接於各平台131,以提供位置資訊至控制器(未繪示)。 The system 100 may further include a pair of supports 122 and a pair of rails 124 . The pair of supports 122 can be disposed on the board 120 . The plate 120 and the pair of supports 122 may be a one-piece material. The pair of rails 124 may thereby be supported by the support 122 . The two or more platforms 131 can move along the track 124 in the X direction. In one embodiment, the pair of tracks 124 is a pair of parallel magnetic channels. As shown, each track 124 of the pair of tracks 124 is linear. In other embodiments, the track 124 may have a non-linear shape. The encoder 126 can be coupled to each platform 131 to provide position information to the controller (not shown).

處理設備160可包括支撐件162及處理單元164。支撐件162可設置於板120上,及可包括開孔166。開孔166用以讓此二或多個平台131在處理單元164之下方通過。處理單元164可由支撐件162支撐。於一實施例中,處理單元164係為圖案產生器,裝配以在光微影製程中曝光光阻劑。 The processing device 160 may include a support 162 and a processing unit 164 . The support 162 may be disposed on the board 120 and may include an opening 166 . The opening 166 is used for allowing the two or more platforms 131 to pass under the processing unit 164 . The processing unit 164 may be supported by the support 162 . In one embodiment, the processing unit 164 is a pattern generator configured to expose photoresist during photolithography.

於一些實施例中,圖案產生器可裝配,以執行無光罩微影製程(maskless lithography process)。處理單元164可包括數個影像投射設備(未繪示)。於一實施例中,處理單元164可包含84個影像投射設備。各影像投射設備係設置於盒165中。處理設備160可利用,以執行無光罩直接圖案化(maskless direct patterning)。 In some embodiments, the pattern generator can be configured to perform a maskless lithography process. The processing unit 164 may include several image projection devices (not shown). In one embodiment, the processing unit 164 may include 84 image projection devices. Each image projection device is arranged in the box 165 . The processing equipment 160 may be utilized to perform maskless direct patterning.

在操作期間,此二或多個平台131之其中一者係在X方向中從第1圖中所示之裝載位置移動至處理位置。當平台131在處理單元164之下方通過時,處理位置可意指平台131之一或多個 位置。在操作期間,此二或多個平台131可藉由數個空氣軸承(未繪示)升舉,及可從裝載位置沿著此對軌道124移動至處理位置。數個垂直導引空氣軸承(未繪示)可耦接於各平台131及位於相鄰各支撐件122之內部牆128的位置,以穩定平台131之移動。藉由沿著軌道150移動來處理及/或移動(indexing)基板140,此二或多個平台131之各者可亦在Y方向中移動。此二或多個平台131之各者係能夠獨立操作,及可於一方向中掃描基板140及於另一方向中步進(step)。於一些實施例中,當此二或多個平台131之一者係掃描基板140時,此二或多個平台131之另一者係卸載已曝光之基板及裝載下一個將曝光的基板。 During operation, one of the two or more platforms 131 is moved in the X direction from the loading position shown in FIG. 1 to the processing position. When the platform 131 passes under the processing unit 164, the processing location can mean one or more of the platforms 131 Location. During operation, the two or more platforms 131 can be lifted by several air bearings (not shown), and can move along the pair of rails 124 from a loading position to a processing position. Several vertical guiding air bearings (not shown) can be coupled to each platform 131 and adjacent to the inner wall 128 of each supporting member 122 to stabilize the movement of the platform 131 . Each of the two or more stages 131 may also move in the Y direction by moving along the track 150 to process and/or index the substrate 140 . Each of the two or more stages 131 is independently operable and can scan the substrate 140 in one direction and step in the other direction. In some embodiments, when one of the two or more platforms 131 is scanning the substrate 140, the other of the two or more platforms 131 is unloading the exposed substrate and loading the next substrate to be exposed.

測量系統即時測量此二或多個平台131之各者上的夾持件130的X及Y橫向位置座標,使得此些影像投影設備之各者可準確地定位圖案,圖案係寫入覆蓋基板之光阻劑中。測量系統亦即時測量在此二或多個平台131上之夾持件130之各者繞著垂直或Z軸的角位置。角位置測量可在藉由伺服機構掃描期間使用以保持角位置不變,或角位置測量可使用以供應對寫入基板140上之圖案的位置之修正。 The measurement system measures the X and Y lateral position coordinates of the clamping member 130 on each of the two or more platforms 131 in real time, so that each of these image projection devices can accurately locate the pattern, which is written on the cover substrate. in photoresist. The measurement system also measures in real time the angular position of each of the holders 130 on the two or more platforms 131 about the vertical or Z-axis. The angular position measurement can be used during scanning by the servo mechanism to keep the angular position constant, or the angular position measurement can be used to supply a correction to the position of the pattern written on the substrate 140 .

第2圖繪示根據此處所揭露之第1圖中所示之系統100的上視圖。在第2圖中,夾持件1301之各者包括多個對準區域。舉例來說,夾持件1302包括實質上平行於X軸的對準區域2021及2022(共同地稱為「對準區域202」)、及對準區域2041及2042(共 同地稱為「對準區域204」)係實質上平行於Y軸。對準區域202及204之各者包括數個參考記號(未繪示)。 FIG. 2 shows a top view of the system 100 shown in FIG. 1 according to the disclosure herein. In FIG. 2, each of clips 1301 includes a plurality of alignment regions. For example, clip 1302 includes alignment regions 2021 and 2022 (collectively "alignment regions 202") substantially parallel to the X-axis, and alignment regions 2041 and 2042 (collectively Referred to as "alignment region 204") is substantially parallel to the Y-axis. Each of the alignment areas 202 and 204 includes a number of reference marks (not shown).

在第2圖中,盒165係移除,以露出由橋206所支撐的眼208。為了說明之目的,三個橋206係繪示出來。然而,於其他實施例中,系統100包括不同數量之橋206。橋206係使用以支撐眼208。在各橋206之下方係為一行眼2081、...、2084、...、及20811(共同地稱為「眼208」)。第2圖繪示包括十一個眼208之行來僅用以說明之目的。於其他實施例中,在各橋206之下方的眼208之數量係為十一以外的數字。本文中,眼208亦可稱為「相機208」。 In FIG. 2 , box 165 is removed to reveal eye 208 supported by bridge 206 . For purposes of illustration, three bridges 206 are shown. However, in other embodiments, the system 100 includes a different number of bridges 206 . Bridge 206 is used to support eye 208 . Below each bridge 206 is a row of eyes 208 1 , . . . , 208 4 , . . . , and 208 11 (collectively "eyes 208"). Figure 2 shows a row including eleven eyes 208 for illustration purposes only. In other embodiments, the number of eyes 208 under each bridge 206 is a number other than eleven. Herein, eye 208 may also be referred to as "camera 208".

眼208係使用以擷取在對準區域202及204中之參考記號(未繪示)的影像,使得處理單元164可計算且儲存各參考記號之位置資訊。眼208亦使用以擷取「參考板材」(未繪示於第2圖中)上之對準記號的影像,使得處理單元164可計算且儲存各對準記號之位置資訊。眼208以「掃描及步進」方式擷取影像,或藉由直接地移動平台131至設計之參考記號304、308及對準記號310位置。舉例來說,在「掃描及步進」操作中,在夾持件130於X方向中移動時,眼208係掃描一連線,接著在Y方向中之「步進」係進行至相鄰眼208。相鄰眼208掃描相鄰於先前掃描之連線的一連線。 Eye 208 is used to capture images of reference marks (not shown) in alignment areas 202 and 204 so that processing unit 164 can calculate and store position information for each reference mark. The eye 208 is also used to capture images of the alignment marks on the "reference plate" (not shown in FIG. 2 ), so that the processing unit 164 can calculate and store the position information of each alignment mark. The eye 208 captures images in a "scan and step" manner, or by directly moving the stage 131 to the designed reference marks 304, 308 and alignment marks 310 positions. For example, in a "scan and step" operation, the eye 208 scans a line as the gripper 130 moves in the X direction, then a "step" in the Y direction is made to the adjacent eye 208. The adjacent eye 208 scans a link adjacent to the previously scanned link.

雖然對準區域202及204共包括四個區域,全部四個區域不必進行掃描。在數種實施例中,參考記號(未繪示於第2圖 中)係置於夾持件130上,使得僅有一個對準區域202及一個對準區域204係掃描,以取得此些參考記號之影像及位置資訊。 Although the alignment areas 202 and 204 include four areas in total, all four areas do not need to be scanned. In several embodiments, reference signs (not shown in Figure 2 Middle) is placed on the holder 130 such that only one alignment area 202 and one alignment area 204 are scanned to obtain images and position information of these reference marks.

第3圖繪示根據此處所揭露實施例之夾持件130及參考板材300的上視圖。夾持件130包括對準區域2021、2022、及2041。為了簡化,對準區域2042係未繪示於第3圖中。當夾持件130及參考板材300在X方向中移動時,夾持件130及參考板材300最終係通過眼208之下方。當夾持件130通過眼208之下方時,在對準區域2041中之參考記號308的影像係同時地擷取。對準區域2041繪示成具有九個參考記號係僅為了說明之目的。為了第3圖中之簡化,只有此些參考記號308之其中三個(也就是3081、3082、及3088)包括導引線及元件編號,僅三個眼208之視場(field of view,FOV)(也就是眼2081、2085、及2089)係繪示在參考記號308之上方。為了說明之目的,對準區域2021係繪示成包括五個參考記號302。然而,為了簡化,只有此些參考記號302之其中兩個(也就是3021及3025)包括導引線及元件編號。亦基於說明之目的,對準區域2022係繪示成包括五個參考記號304。然而,為了簡化,僅有此些參考記號304之其中三個(也就是3041、3044、及3045)包括導引線及元件編號。 FIG. 3 shows a top view of the clamping member 130 and the reference plate 300 according to the embodiments disclosed herein. The clip 130 includes alignment regions 202 1 , 202 2 , and 204 1 . For simplicity, the alignment area 2042 is not shown in FIG. 3 . When the gripper 130 and the reference sheet 300 move in the X direction, the gripper 130 and the reference sheet 300 eventually pass under the eye 208 . As the clip 130 passes under the eye 208, an image of the reference mark 308 in the alignment area 2041 is captured simultaneously. The alignment area 2041 is shown with nine reference marks for illustrative purposes only. For simplicity in FIG. 3, only three of these reference signs 308 (ie, 308 1 , 308 2 , and 308 8 ) include guidelines and component numbers, and only the field of view of the three eyes 208 view, FOV) (ie, eyes 208 1 , 208 5 , and 208 9 ) are depicted above reference numeral 308 . For illustration purposes, the alignment area 202 1 is shown as including five reference marks 302 . However, for simplicity, only two of these reference signs 302 (ie, 302 1 and 302 5 ) include guide lines and component numbers. Also for illustrative purposes, alignment area 202 2 is shown as including five reference marks 304 . However, for simplicity, only three of these reference numerals 304 (ie, 304 1 , 304 4 , and 304 5 ) include guidelines and component numbers.

於第3圖中,參考記號302、304、及308係繪示成數個「+」符號。為了說明之目的,參考記號302、304及308及眼208具有相同節距(pitch)。此處所使用之「節距」係定義成參考記號及眼208之間的間距。 In FIG. 3, reference marks 302, 304, and 308 are depicted as several "+" symbols. For purposes of illustration, reference numerals 302, 304, and 308 and eye 208 have the same pitch. As used herein, "pitch" is defined as the distance between the reference mark and the eye 208 .

僅為了說明之目的,擷取參考記號302、304及308之影像及位置係在擷取對準記號310之影像及位置之前說明。然而,參考記號302、304及308之影像擷取及位置決定並沒有在對準記號310之影像擷取及位置決定之前發生的時間限制。也就是說,參考記號302、304及308之影像擷取及位置決定可亦與對準記號310之影像擷取及位置決定同時發生,或參考記號302、304及308之影像擷取及位置決定可發生在對準記號310之影像擷取及位置決定之後。 For purposes of illustration only, capturing the images and positions of reference marks 302 , 304 , and 308 is illustrated prior to capturing the images and positions of alignment marks 310 . However, image capture and position determination of reference marks 302 , 304 , and 308 do not have a time limit that occurs before image capture and position determination of alignment mark 310 . That is, image capture and position determination of reference marks 302, 304, and 308 may also occur simultaneously with image capture and position determination of alignment mark 310, or image capture and position determination of reference marks 302, 304, and 308 This may occur after image capture and position determination of alignment marks 310 .

之後,於一實施例中,眼208掃描對準區域2021及/或2022。舉例來說,在對準區域2022通過眼208之下方時,眼208相繼地掃描參考記號304。當參考記號3041及3044通過眼208之下方時,導引線3061及3064繪示出眼208之FOV。 Then, in one embodiment, the eye 208 scans the alignment areas 202 1 and/or 202 2 . For example, the eye 208 sequentially scans the reference marks 304 as the alignment area 202 2 passes under the eye 208 . Guide lines 306 1 and 306 4 depict the FOV of eye 208 as reference marks 304 1 and 304 4 pass under eye 208 .

當夾持件130移動時,平台131之表面上的參考板材300係在X方向中移動。當夾持件130通過眼208之下方時,參考板材300亦通過眼208之下方。參考板材300包括至少一對準記號310。為了說明之目的,參考板材300包括對準記號3101、3102、3104、3103、3105、3106、3107、3108、及3109(於本文中共同地稱為「對準記號310」)。各對準記號310最終落入眼208之FOV 312中。FOV 314表示參考板材300通過眼208之下方及在FOV中沒有對準記號310時之眼208的FOV。 When the gripper 130 moves, the reference plate 300 on the surface of the platform 131 moves in the X direction. When the clamping member 130 passes under the eye 208 , the reference plate 300 also passes under the eye 208 . The reference plate 300 includes at least one alignment mark 310 . For purposes of illustration, reference sheet 300 includes alignment marks 310 1 , 310 2 , 310 4 , 310 3 , 310 5 , 310 6 , 310 7 , 310 8 , and 310 9 (collectively referred to herein as "alignment mark 310"). Each alignment mark 310 ultimately falls within the FOV 312 of the eye 208 . FOV 314 represents the FOV of eye 208 when reference sheet 300 passes under eye 208 and there is no alignment mark 310 in the FOV.

於一實施例中,為了後續使用之板材的使用,參考板材300係假設可接受用於校準夾持件130上之參考記號302、 304、及/或308之校準。藉由產生「參考板材模型」,參考板材300可用於校準參考記號304、308至參考板材300上之對準記號310。於另一實施例中,參考板材300係為一板材,已使用於(或預定使用於)一工具上,且可使用於在不同工具上印刷之板材的校正模型中。 In one embodiment, the reference plate 300 is assumed to be acceptable for use with reference marks 302 on the calibration fixture 130 for subsequent use of the plate. Calibration of 304, and/or 308. The reference plate 300 can be used to calibrate the reference marks 304 , 308 to the alignment marks 310 on the reference plate 300 by creating a “reference plate model”. In another embodiment, the reference plate 300 is a plate that has been used (or is intended to be used) on one tool and can be used in a calibration model of a plate printed on a different tool.

在參考記號304、308及對準記號310已經掃描及擷取之後,移除參考板材300。處理單元164計算參考記號304、308及對準及號310之位置,並產生校正模型(於下方更加詳細說明)。於一實施例中,藉由應用影像處理演算法來尋找FOV中參考記號304、308及對準記號310相對於FOV之中心的位置,處理單元164決定出參考記號304、308及對準記號310的位置。從FOV之中心的參考記號304、308及對準記號310之各中心的距離係提供從參考記號304、308及對準記號310之額定(nominal)位置的偏差。影像處理演算法之數個例子可包括「關聯法(correlation method)」、「邊緣偵測方法(edge detection method)」或邊緣偵測及關聯法之結合,但影像處理演算法係不以此些例子為限。參考記號304、308、對準記號310、及校正模型之位置可儲存於記憶體704中。 After the reference marks 304, 308 and alignment marks 310 have been scanned and captured, the reference sheet 300 is removed. The processing unit 164 calculates the locations of the reference marks 304, 308 and the alignment sum 310, and generates a calibration model (described in more detail below). In one embodiment, the processing unit 164 determines the reference marks 304, 308 and the alignment mark 310 by applying an image processing algorithm to find the positions of the reference marks 304, 308 and the alignment mark 310 in the FOV relative to the center of the FOV. s position. The distance from the center of each of the reference marks 304 , 308 and the alignment mark 310 from the center of the FOV provides the deviation from the nominal positions of the reference marks 304 , 308 and the alignment mark 310 . Several examples of image processing algorithms may include "correlation method", "edge detection method" or a combination of edge detection and correlation methods, but image processing algorithms do not use these Examples are limited. The locations of reference marks 304 , 308 , alignment marks 310 , and calibration models can be stored in memory 704 .

校正模型係在接續板材之印刷期間使用。第4圖繪示根據此處所揭露實施例之夾持件130上之空白板材(blank plate)400的上視圖。第4圖繪示出通過眼208之下方的夾持件130及空白板材400。在印刷第一層於空白板材400上之前、期間及/ 或之後,眼208可擷取參考記號304、308之新影像。在第一層已經印刷於預定數量之空白板材400(舉例為五個)上之後,參考記號304、308之位置(從參考記號304、308之新影像計算)可使用,以決定夾持件130之移動特性是否已經改變。 Calibration models are used during printing of successive panels. FIG. 4 shows a top view of a blank plate 400 on a clamp 130 according to embodiments disclosed herein. FIG. 4 shows the clamp 130 and blank sheet 400 passing under the eye 208 . Before, during and/or printing the first layer on blank sheet 400 Or later, eye 208 may capture new images of reference marks 304,308. After the first layer has been printed on a predetermined number of blank sheets 400 (five for example), the positions of the reference marks 304, 308 (calculated from new images of the reference marks 304, 308) can be used to determine the gripper 130 Whether its mobility characteristics have changed.

第5A圖繪示根據此處所揭露實施例之夾持件130上之參考板材300的例子。眼208擷取夾持件130上之參考記號304、308及參考板材300上之對準記號310。在藉由處理單元164的一些計算之後,通過對準記號310之連線504的定向不同於通過參考記號304之連線502的定向係決定出來。在節距之差異係說明性繪示成角度500,角度500從通過參考記號304之水平的連線502以及通過對準記號310之連線504形成。雖然參考記號304、308係適當地位於夾持件130上,對準記號310之位置表示參考板材300具有一些正交性(orthogonality)錯誤,因為連線504及連線508之間的角度並非九十度。通過參考記號308之連線506及通過對準記號310之連線508係實質上平行而表示相對於Y軸對準及有少許旋轉或沒有旋轉。 FIG. 5A shows an example of a reference plate 300 on a clamp 130 according to embodiments disclosed herein. The eye 208 picks up the reference marks 304 , 308 on the clamp 130 and the alignment mark 310 on the reference sheet 300 . After some calculations by the processing unit 164 , the orientation of the line 504 through the alignment mark 310 is different than the orientation of the line 502 through the reference mark 304 is determined. The difference in pitch is illustratively shown as an angle 500 formed from a horizontal line 502 through reference mark 304 and a line 504 through alignment mark 310 . Although the reference marks 304, 308 are properly located on the clamp 130, the position of the alignment mark 310 indicates that the reference sheet 300 has some orthogonality errors because the angle between the line 504 and the line 508 is not nine. Ten degrees. Line 506 through reference mark 308 and line 508 through alignment mark 310 are substantially parallel to indicate alignment and little or no rotation relative to the Y-axis.

第5B圖繪示根據此處所揭露實施例之利用基於第5A圖中所示之裝配之校正模型之板材的例子,板材印刷於夾持件130上。校正模型提供空白板材400之轉換。此處所使用之「轉換」係定義為藉由複製參考板材300之印刷特徵,從參考記號304、308及對準記號310(來自至少一參考板材300)至接續印刷之板材(也就是空白板材400)之轉換位置測量資料的處理。於第5B圖中,參 考記號304及對準記號310之影像表示參考記號304係適當地定位,適當的旋轉係應用於印刷之板材,且校正模型係為準確的。 FIG. 5B shows an example of a plate printed on a holder 130 using a calibration model based on the assembly shown in FIG. 5A according to embodiments disclosed herein. The calibration model provides the conversion of the blank sheet 400 . As used herein, "conversion" is defined as the transfer of reference marks 304, 308 and alignment marks 310 (from at least one reference sheet 300) to a subsequent printed sheet (i.e. blank sheet 400) by duplicating the printed features of the reference sheet 300. ) for the processing of converted position measurement data. In Figure 5B, see Images of reference marks 304 and alignment marks 310 indicate that reference marks 304 are properly positioned, proper rotation is applied to the printed sheet, and the calibration model is accurate.

第6A圖繪示根據此處所揭露實施例之夾持件130上之參考板材300的另一例子。眼208擷取夾持件130上之參考記號304、308及參考板材300上之對準記號310的影像。在藉由處理單元164之一些計算之後,對準記號310之節距不同於參考記號304、308之節距係決定。在節距之差異係說明性繪示成角度500,角度500從通過參考記號304之水平的連線及通過對準記號310的連線形成。對準記號310之位置表示參考板材300具有相對於X軸之一些旋轉。 FIG. 6A illustrates another example of a reference plate 300 on a clamp 130 according to embodiments disclosed herein. The eye 208 captures images of the reference marks 304 , 308 on the clamp 130 and the alignment mark 310 on the reference sheet 300 . After some calculations by the processing unit 164, it is determined that the pitch of the alignment marks 310 differs from the pitch of the reference marks 304, 308. The difference in pitch is illustratively shown as an angle 500 formed from a line connecting horizontally through reference mark 304 and a line passing through alignment mark 310 . The position of the alignment mark 310 indicates that the reference sheet 300 has some rotation relative to the X-axis.

第6B圖繪示根據此處所揭露實施例之利用基於第6A圖中所示之裝配之校正模型之板材的例子,印刷之板材於夾持件130上。在一些板材已經印刷之後,眼208擷取參考記號304、308及對準記號310之新影像。比較從新影像計算之位置及儲存於記憶體中之參考記號304、308及對準記號310之位置係透露出參考記號304已經從較早儲存之位置偏移。 FIG. 6B shows an example of a panel printed on a holder 130 using a calibration model based on the assembly shown in FIG. 6A according to embodiments disclosed herein. Eye 208 captures new images of reference marks 304, 308 and alignment marks 310 after some sheets have been printed. Comparing the position calculated from the new image with the positions of the reference marks 304, 308 and alignment mark 310 stored in memory reveals that the reference mark 304 has been shifted from an earlier stored position.

第7圖繪示根據此處所揭露實施例之用於對準夾持件130上之空白板材400之處理單元164之高階方塊圖的一實施例。舉例來說,處理單元164係適用於執行第8及9圖之方法。第7圖中之處理單元164包括處理器710及記憶體704。記憶體704用以儲存控制程式、測量資料及類似者。 FIG. 7 depicts one embodiment of a high level block diagram of a processing unit 164 for aligning a blank sheet 400 on a holder 130 according to embodiments disclosed herein. For example, the processing unit 164 is adapted to perform the methods of FIGS. 8 and 9 . The processing unit 164 in FIG. 7 includes a processor 710 and a memory 704 . The memory 704 is used to store control programs, measurement data and the like.

在數種實施例中,記憶體704亦包括程式(舉例為繪示成「第一層對準模組」712),用以藉由執行此處所述之實施例來產生校正模型。校正模型用以對準印刷之板材上的第一層於夾持件130。記憶體704包括用以遮罩設計之程式(未繪示)。於一實施例中,有關遮罩設計之檔案係儲存於圖形資料系統(graphic data system)檔案(舉例為「圖形資料系統(GDS)」)中。然而,檔案可為提供圖形資料之任何格式。基於校正模型,在指示此些程式時決定哪些鏡傳送未使用光至光轉儲器(light dump)及哪些鏡照射基板。 In various embodiments, memory 704 also includes programs (illustrated, for example, as "first layer alignment module" 712) for generating calibration models by executing the embodiments described herein. The calibration pattern is used to align the first layer on the printed board with the holder 130 . Memory 704 includes programs (not shown) for masking designs. In one embodiment, the files related to the mask design are stored in a graphic data system (graphic data system) file (eg, "graphical data system (GDS)"). However, the files may be in any format that provides graphical data. Based on the calibration model, it is determined which mirrors deliver unused light to the light dump and which mirrors illuminate the substrate when instructing such programs.

處理器710與支援電路708合作,支援電路708例如是電源、時脈電路(clock circuits)、快取記憶體(cache memory)及類似者以及儲存於記憶體704中之協助執行程式706之電路。於是,可預期的是,此處討論之作為軟體程序之一些處理步驟可從儲存裝置裝載(舉例為光學驅動機(optical drive)、軟碟機(floppy drive)、磁碟驅動器(disk drive)等)及於記憶體704中應用且由處理器710操作。因此,本文之數種步驟及方法可儲存於電腦可讀取媒體(computer readable medium)。處理單元164亦包含輸入輸出電路702,形成與處理單元164通訊之數種功能元件之間的介面。 Processor 710 cooperates with support circuits 708 such as power supplies, clock circuits, cache memory and the like, as well as circuits stored in memory 704 that assist in executing program 706 . Thus, it is contemplated that some of the process steps discussed herein as software programs may be loaded from a storage device (such as an optical drive, floppy drive, disk drive, etc. ) and applied in the memory 704 and operated by the processor 710. Therefore, several steps and methods herein can be stored on a computer readable medium. Processing unit 164 also includes input-output circuitry 702 that forms an interface between several functional elements that communicate with processing unit 164 .

雖然第7圖繪示根據本揭露之程式化以執行數種控制功能的處理單元164,名稱電腦係不限制為只在本領域中意指為電腦之該些整合電路,但廣泛地意指電腦、處理器、微控制器、 微電腦、可程式邏輯控制器、特殊應用積體電路(application specific integrated circuits)、及其他可程式電路,以及此些名稱係在此處可交換地使用。此外,雖然係繪示出一個處理單元164,此說明係為了簡潔之故。將理解的是,此處所述之各方法可在分離之電腦中應用。 Although FIG. 7 depicts a processing unit 164 programmed to perform several control functions according to the present disclosure, the name computer is not limited to meaning only those integrated circuits of a computer in the art, but broadly refers to a computer, processors, microcontrollers, Microcomputers, programmable logic controllers, application specific integrated circuits, and other programmable circuits, and such terms are used interchangeably herein. Additionally, although one processing unit 164 is shown, this illustration is for the sake of brevity. It will be appreciated that the methods described herein may be implemented on separate computers.

第8圖繪示根據此處所揭露實施例之對準印刷板材於夾持件130之方法800的一實施例。於方塊802,眼208擷取夾持件130上之參考記號304、308之影像。在方塊804,擷取之影像係藉由處理單元164使用,以決定參考記號304、308之初始位置。在方塊806,參考模型從參考記號304、308之初始位置產生。參考模型包括參考記號304、308相對於一軸(舉例為X軸)之旋轉及/或定向。舉例來說,如果參考記號304係相對於X軸旋轉五度,接著係提供反向(inverse)之旋轉。於此例子中,參考模型會包括負五度來作為校正。參考模型可亦包括其他變異,像是由此些參考記號304、308之間的間距及/或參考記號304及參考記號308之間的角度所定義之比例。 FIG. 8 illustrates an embodiment of a method 800 of aligning a printed board to the clamp 130 according to embodiments disclosed herein. At block 802 , the eye 208 captures an image of the reference marks 304 , 308 on the holder 130 . At block 804 , the captured image is used by the processing unit 164 to determine the initial location of the reference marks 304 , 308 . At block 806 , a reference model is generated from the initial positions of the reference markers 304 , 308 . The reference model includes the rotation and/or orientation of the reference markers 304, 308 relative to an axis, such as the X axis. For example, if reference mark 304 is rotated five degrees relative to the X axis, then an inverse rotation is provided. In this example, the reference model would include negative fifths as a correction. The reference model may also include other variations, such as a ratio defined by the spacing between these reference marks 304 , 308 and/or the angle between reference mark 304 and reference mark 308 .

在方塊808,眼208擷取參考板材300上之對準記號310之影像。在方塊810,處理單元164利用軟體,以決定參考板材300上之對準記號310的位置。在方塊812,參考板材模型係從對準記號310的位置產生。相對於參考記號304、308之參考板材300的旋轉及/或定向係納入參考板材模型之考量中。舉例來說,如果參考板材300係相對於X軸旋轉十度,參考板材模型包括相同 十度之旋轉來印刷其他板材。在方塊814,映射模型係基於參考模型及參考板材模型產生。 At block 808 , the eye 208 captures an image of the alignment marks 310 on the reference sheet 300 . At block 810 , the processing unit 164 utilizes software to determine the position of the alignment mark 310 on the reference sheet 300 . At block 812 , a reference panel model is generated from the locations of the alignment marks 310 . The rotation and/or orientation of the reference sheet 300 relative to the reference marks 304, 308 are taken into account in the reference sheet model. For example, if the reference plate 300 is rotated ten degrees relative to the X axis, the reference plate model includes the same Ten degree rotation to print other boards. At block 814, a mapping model is generated based on the reference model and the reference panel model.

舉例來說,第5A圖中,對準記號310的位置表示參考板材300相對於X軸有一些旋轉。參考記號304、308之位置表示參考記號304、308係適當地定位及實質上平行於X軸及Y軸。於第5A圖中,參考模型係為零。然而,參考板材300上之對準記號310係以跨越對準記號310之中心的連線504相對於X軸產生一角度的方式偏移。作為一例子來說,如果此角度係為一度時,映射模型包括(來自參考板材模型)相同的一度旋轉,用以印刷接續之板材來產生相同之記號偏移(如第5B圖中所示)。 For example, in FIG. 5A, the position of the alignment mark 310 indicates some rotation of the reference sheet 300 relative to the X-axis. The position of the reference marks 304, 308 indicates that the reference marks 304, 308 are properly positioned and substantially parallel to the X-axis and the Y-axis. In Figure 5A, the reference model is zero. However, the alignment marks 310 on the reference sheet 300 are offset in such a way that the line 504 spanning the centers of the alignment marks 310 creates an angle with respect to the X-axis. As an example, if the angle is one degree, the mapping model includes (from the reference plate model) the same one degree rotation for printing subsequent plates to produce the same mark offset (as shown in Figure 5B) .

第9圖繪示根據此處所揭露實施例之對準一印刷板材於夾持件130的方法900之一實施例。於方塊902,參考模型從夾持件130上之參考記號304、308的初始位置產生。參考記號304、308可從記憶體704取回及第一層對準模組712可使用以產生參考模型。 FIG. 9 illustrates an embodiment of a method 900 of aligning a printed board to the clamp 130 according to embodiments disclosed herein. At block 902 , a reference model is generated from the initial positions of the reference marks 304 , 308 on the holder 130 . The reference marks 304, 308 can be retrieved from the memory 704 and the first layer alignment module 712 can be used to generate the reference model.

在方塊904,參考板材模型從位於參考板材300上之對準記號310的位置產生。參考板材模型依循(仿效)參考板材300上之對準記號310之位置的旋轉、偏移、及/或畸變(distortion)。在方塊906,映射模型係從參考模型及參考板材模型產生。 At block 904 , a reference sheet model is generated from the locations of the alignment marks 310 located on the reference sheet 300 . The reference sheet model follows (emulates) the rotation, offset, and/or distortion of the position of the alignment marks 310 on the reference sheet 300 . At block 906, a mapping model is generated from the reference model and the reference panel model.

第10圖繪示根據此處所揭露實施例之對準印刷板材於夾持件130之方法1000的一實施例。在方塊1002,參考記號304、308之影像係從夾持件130擷取。在方塊1004,夾持件130 上之參考記號初始位置係決定。在方塊1006,參考記號304、308之初始位置係儲存於記憶體704中。 FIG. 10 illustrates an embodiment of a method 1000 of aligning a printed board to a clamp 130 according to embodiments disclosed herein. At block 1002 , images of reference marks 304 , 308 are captured from holder 130 . At block 1004, the clip 130 The initial position of the reference mark above is determined. At block 1006 , the initial positions of the reference marks 304 , 308 are stored in memory 704 .

在方塊1008,參考板材300上之對準記號310的影像係擷取。在方塊1010,對準記號310之位置係藉由處理單元164決定。之後,在方塊1012,對準記號310的位置係儲存於記憶體704中。 At block 1008, an image of the alignment marks 310 on the reference sheet 300 is captured. At block 1010 , the location of the alignment mark 310 is determined by the processing unit 164 . Thereafter, at block 1012 , the location of the alignment mark 310 is stored in the memory 704 .

方法800、900、及1000之替代實施例可包括儲存參考記號304、308及對準記號310之影像於記憶體704中,用以藉由處理單元164稍後決定此些記號的位置。此外,此處之數個實施例已經說明成包括在決定對準記號310的位置之前,決定參考記號304、308之初始位置。然而,其他實施例包括在決定參考記號304、308的位置之前,決定對準記號310之初始位置。 Alternative embodiments of methods 800 , 900 , and 1000 may include storing images of reference marks 304 , 308 and alignment marks 310 in memory 704 for later determination by processing unit 164 of the positions of these marks. Additionally, several embodiments herein have been described as including determining the initial positions of the reference marks 304 , 308 prior to determining the position of the alignment mark 310 . However, other embodiments include determining the initial position of the alignment mark 310 before determining the position of the reference marks 304 , 308 .

方法800及900之替代實施例可包括以下步驟:擷取夾持件上之第二參考板材上的對準記號,以決定主動參考記號位置,其中第二參考板材係設計以用於使用在一裝置上;基於主動參考記號位置及參考記號之初始位置之間的差異,產生一變異模型;基於變異模型及映射模型,產生一主動對準模型;以及提供主動對準模型之一反向(inverse)來作為一校正模型。 Alternative embodiments of methods 800 and 900 may include the step of capturing an alignment mark on a second reference plate on the gripper, wherein the second reference plate is designed for use in a on the device; generate a variation model based on the difference between the active reference mark position and the initial position of the reference mark; generate an active alignment model based on the variation model and the mapping model; and provide an inverse of the active alignment model ) as a calibration model.

方法900之替代實施例可包括以下步驟:擷取夾持件上之第二參考板材上之對準記號,以決定主動參考記號位置,其中第二參考板材係設計以用於使用在一裝置上;以及儲存來自第二參考板材之對準記號於記憶體中。 Alternative embodiments of method 900 may include the step of capturing alignment marks on a second reference plate on the holder, wherein the second reference plate is designed for use on a device, to determine active reference mark positions ; and storing the alignment marks from the second reference plate in memory.

方法1000之替代實施例可包括以下步驟:基於參考記號之初始位置及對準記號之位置產生參考工具模型;擷取另一板材上之對準記號,以決定主動參考記號位置;基於主動參考記號位置及參考記號之初始位置之間的差異,產生變異模型;基於變異模型及參考工具模型,產生主動對準模型;以及提供主動對準模型之一反向來作為一校正模型。 An alternative embodiment of the method 1000 may include the steps of: generating a reference tool model based on the initial position of the reference mark and the position of the alignment mark; retrieving the alignment mark on another sheet to determine the active reference mark position; The difference between the position and the initial position of the reference mark generates a variation model; based on the variation model and the reference tool model, an active alignment model is generated; and an inverse of the active alignment model is provided as a calibration model.

如此處所使用,名稱「具有(having)」、「包含(containing)」、「包括(including)」、「包括(comprising)」及類似者係為開放式名稱(open ended terms),表示陳述之元件或特徵之存在,但不排除額外的元件或特徵。除非內文另有清楚說明,冠詞「一(a)」、「一(an)」及「此(the)」係意欲包括複數及單數。 As used herein, the terms "having", "containing", "including", "comprising" and the like are open ended terms denoting elements of the statement or the presence of features, but does not preclude additional elements or features. Unless the context clearly dictates otherwise, the articles "a", "an" and "the" are intended to include both the plural and the singular.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 To sum up, although the present invention has been disclosed by the above embodiments, it is not intended to limit the present invention. Those skilled in the art of the present invention can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

800:方法 800: method

802、804、806、808、810、812、814:方塊 802, 804, 806, 808, 810, 812, 814: block

Claims (20)

一種曝光系統對準及校正之方法,包括:擷取一夾持件上的複數個參考記號的複數個影像;決定該夾持件上的該些參考記號之相對於複數個眼的複數個初始位置,該些眼係為複數個相機;從該些參考記號的該些初始位置產生一參考模型;擷取一參考板材上的複數個對準記號的複數個影像;決定該參考板材上的該些對準記號之相對於該些眼的複數個位置;移除該參考板材;從該些對準記號之該些位置產生一參考板材模型;以及從該參考模型及該參考板材模型產生一映射模型。 A method for aligning and correcting an exposure system, comprising: capturing a plurality of images of a plurality of reference marks on a holder; determining a plurality of initial positions of the reference marks on the holder relative to a plurality of eyes position, the eyes are a plurality of cameras; generate a reference model from the initial positions of the reference marks; capture a plurality of images of a plurality of alignment marks on a reference plate; determine the positions of the alignment marks relative to the eyes; removing the reference plate; generating a reference plate model from the positions of the alignment marks; and generating a mapping from the reference model and the reference plate model Model. 如請求項1所述之方法,其中產生該映射模型包括:提供複數個參考記號位置中之一偏移的一反向(inverse);以及基於該參考板材模型,提供該參考板材中之一偏移。 The method as claimed in claim 1, wherein generating the mapping model includes: providing an inverse (inverse) of an offset in a plurality of reference mark positions; and providing an offset in the reference plate based on the reference plate model shift. 如請求項1所述之方法,更包括:利用該映射模型印刷一第一層於至少一空白板材(blank plate)上;再擷取該些參考記號之複數個影像;決定該些參考記號之複數個接續位置;以及比較該些接續位置與該些參考記號之該些初始位置。 The method as described in claim 1, further comprising: using the mapping model to print a first layer on at least one blank plate (blank plate); and then capturing a plurality of images of the reference marks; determining the reference marks a plurality of consecutive positions; and comparing the consecutive positions with the initial positions of the reference marks. 如請求項1所述之方法,其中擷取該參考板材上之該些對準記號及該夾持件上之該些參考記號之該些影像包括: 在一X方向中掃描;移動至一相鄰連線上之一相鄰眼;以及重複該掃描及該移動,直到該些參考記號及該些對準記號之該些影像係擷取。 The method as described in claim 1, wherein capturing the images of the alignment marks on the reference plate and the reference marks on the holder includes: scanning in an X direction; moving to an adjacent eye on an adjacent line; and repeating the scanning and the moving until the images of the reference marks and the alignment marks are captured. 如請求項1所述之方法,其中該些參考記號從該夾持件係可移動的。 The method of claim 1, wherein the reference marks are movable from the holder. 如請求項1所述之方法,更包括:擷取該夾持件上之一第二參考板材上的複數個對準記號,以決定複數個主動參考記號位置,其中,該第二參考板材係設計以用於使用在一裝置上;基於該些主動參考記號位置及該些參考記號之該些初始位置之間的複數個差異,產生一變異模型;基於該變異模型及該映射模型,產生一主動對準模型;以及提供該主動對準模型之一反向(inverse)來作為一校正模型。 The method as described in claim 1, further comprising: capturing a plurality of alignment marks on a second reference plate on the clamping member to determine positions of a plurality of active reference marks, wherein the second reference plate is designed for use on a device; generating a variation model based on a plurality of differences between the active reference marker positions and the initial positions of the reference markers; generating a variation model based on the variation model and the mapping model an active alignment model; and providing an inverse of the active alignment model as a calibration model. 一種曝光系統對準及校正之方法,包括:從一夾持件上之複數個參考記號之相對於複數個眼的複數個初始位置產生一參考模型,該些眼係為複數個相機;從一第一參考板材上之複數個對準記號之相對於該些眼的複數個位置產生一參考板材模型;以及從該參考模型及該參考板材模型產生一映射模型。 A method for aligning and calibrating an exposure system, comprising: generating a reference model from a plurality of initial positions of a plurality of reference marks on a holder relative to a plurality of eyes, the eyes being a plurality of cameras; The positions of the alignment marks on the first reference plate relative to the eyes generate a reference plate model; and a mapping model is generated from the reference model and the reference plate model. 如請求項7所述之方法,其中該些參考記號係從該夾持件為可移動的。 The method of claim 7, wherein the reference marks are removable from the holder. 如請求項7所述之方法,更包括: 擷取該夾持件上之一第二參考板材上的複數個對準記號,以決定複數個主動參考記號位置,其中,該第二參考板材係設計以用於使用在一裝置上;基於該些主動參考記號位置及該些參考記號之該些初始位置之間的複數個差異,產生一變異模型;基於該變異模型及該映射模型,產生一主動對準模型;以及提供該主動對準模型之一反向(inverse)來作為一校正模型。 The method as described in Claim 7, further comprising: capturing alignment marks on a second reference plate on the fixture to determine active reference mark positions, wherein the second reference plate is designed for use with a device; based on the A plurality of differences between the positions of the active reference marks and the initial positions of the reference marks to generate a variation model; based on the variation model and the mapping model, generate an active alignment model; and provide the active alignment model One of the inverses is used as a calibration model. 如請求項7所述之方法,其中,產生該參考模型包括:擷取該夾持件上之該些參考記號之複數個影像;及決定該夾持件上之該些參考記號之該些初始位置;以及產生該參考板材模型包括:擷取該第一參考板材上之該些對準記號之複數個影像;決定該第一參考板材上之該些對準記號之該些位置。 The method as claimed in claim 7, wherein generating the reference model includes: capturing a plurality of images of the reference marks on the clamp; and determining the initial values of the reference marks on the clamp position; and generating the reference plate model includes: capturing a plurality of images of the alignment marks on the first reference plate; determining the positions of the alignment marks on the first reference plate. 如請求項7所述之方法,更包括:在利用該映射模型印刷於至少一空白板材(blank plate)上之後,再擷取該些參考記號之複數個影像;從再擷取之該些影像決定該些參考記號之複數個接續位置;以及比較該些接續位置與該些初始位置。 The method as described in claim 7, further comprising: recapturing a plurality of images of the reference marks after printing on at least one blank plate using the mapping model; from the recaptured images determining a plurality of consecutive positions of the reference marks; and comparing the consecutive positions with the initial positions. 如請求項7所述之方法,更包括:擷取該夾持件上之一第二參考板材上之複數個對準記號,以決定複數個主動參考記號位置,其中,該第二參考板材係設計以用於使用在一裝置上;以及 儲存來自該第二參考板材之該些對準記號於記憶體中。 The method as described in claim 7, further comprising: capturing a plurality of alignment marks on a second reference plate on the clamping member to determine positions of a plurality of active reference marks, wherein the second reference plate is designed for use on a device; and The alignment marks from the second reference plate are stored in memory. 如請求項7所述之方法,其中從該些參考記號之該些初始位置產生該參考模型包括:於一X方向中掃描該夾持件;擷取該些參考記號之複數個影像;移動至一相鄰眼;重複該掃描及該移動,直到該些參考記號之全部該些影像係擷取;計算該些參考記號之複數個位置;以及儲存該些參考記號之該些位置於記憶體中。 The method as described in claim 7, wherein generating the reference model from the initial positions of the reference marks comprises: scanning the holder in an X direction; capturing a plurality of images of the reference marks; moving to an adjacent eye; repeating the scanning and the moving until all the images of the reference marks are captured; calculating a plurality of positions of the reference marks; and storing the positions of the reference marks in memory . 如請求項7所述之方法,其中從該些對準記號之該些位置產生該參考板材模型包括:於一X方向中掃描該第一參考板材;擷取該些對準記號之複數個影像;移動至一相鄰眼;重複該掃描及該移動,直到該些對準記號之全部該些影像係擷取;計算該些對準記號之該些位置;以及儲存該些對準記號之該些位置於記憶體中。 The method as described in claim 7, wherein generating the reference plate model from the positions of the alignment marks comprises: scanning the first reference plate in an X direction; capturing a plurality of images of the alignment marks ; move to an adjacent eye; repeat the scanning and the moving until all the images of the alignment marks are captured; calculate the positions of the alignment marks; and store the alignment marks locations in memory. 如請求項14所述之方法,更包括:擷取該夾持件上之一第二參考板材上的複數個對準記號,以決定複數個主動參考記號位置,其中,該第二參考板材係設計以用於使用在一裝置上; 基於該些主動參考記號位置及該些參考記號之該些初始位置之間的複數個差異,產生一變異模型;基於該變異模型及該映射模型,產生一主動對準模型;以及提供該主動對準模型之一反向(inverse)來作為一校正模型。 The method as claimed in claim 14, further comprising: capturing a plurality of alignment marks on a second reference plate on the clamping member to determine positions of a plurality of active reference marks, wherein the second reference plate is designed for use on a device; generating a variation model based on the plurality of differences between the active reference mark positions and the initial positions of the reference marks; generating an active alignment model based on the variation model and the mapping model; and providing the active alignment The inverse of one of the quasi-models is used as a calibration model. 一種曝光系統對準及校正之方法,包括:擷取一夾持件上之複數個參考記號的複數個影像;決定該夾持件上之該些參考記號之相對於複數個眼的複數個初始位置,該些眼係為複數個相機;儲存該些參考記號之該些初始位置於一記憶體中;擷取一參考板材上之複數個對準記號的複數個影像;決定該參考板材上之該些對準記號之相對於該些眼的複數個位置;移除該參考板材;以及儲存該些對準記號之該些位置於該記憶體中。 A method for aligning and correcting an exposure system, comprising: capturing a plurality of images of a plurality of reference marks on a holder; determining a plurality of initial positions of the reference marks on the holder relative to a plurality of eyes position, the eyes are a plurality of cameras; store the initial positions of the reference marks in a memory; capture a plurality of images of a plurality of alignment marks on a reference plate; determine the alignment marks on the reference plate positions of the alignment marks relative to the eyes; removing the reference plate; and storing the positions of the alignment marks in the memory. 如請求項16所述之方法,更包括:印刷於至少一空白板材(blank plate)上;再擷取該夾持件上之該些參考記號之複數個影像;決定該些參考記號之複數個接續位置;以及比較該些參考記號之該些接續位置與該些參考記號之該些初始位置。 The method as described in claim 16, further comprising: printing on at least one blank plate; recapturing a plurality of images of the reference marks on the holder; determining a plurality of the reference marks continuation positions; and comparing the continuation positions of the reference marks with the initial positions of the reference marks. 如請求項17所述之方法,更包括:利用該些參考記號之該些接續位置取代該記憶體中之該些參考記號之該些初始位置;再擷取該參考板材上之該些對準記號之複數個影像; 從再擷取之該些影像決定該參考板材上之該些對準記號之複數個位置;以及儲存該些對準記號之該些位置於該記憶體中。 The method as described in claim 17, further comprising: replacing the initial positions of the reference marks in the memory with the continuous positions of the reference marks; retrieving the alignments on the reference plate plural images of signs; determining positions of the alignment marks on the reference plate from the re-captured images; and storing the positions of the alignment marks in the memory. 如請求項16所述之方法,更包括基於該些參考記號之該些初始位置及該些對準記號之該些位置產生一參考工具模型。 The method of claim 16, further comprising generating a reference tool model based on the initial positions of the reference marks and the positions of the alignment marks. 如請求項19所述之方法,更包括:擷取另一板材上之複數個對準記號,以決定複數個主動參考記號位置;基於該些主動參考記號位置及該些參考記號之該些初始位置之間的複數個差異,產生一變異模型;基於該變異模型及該參考工具模型,產生一主動對準模型;以及提供該主動對準模型之一反向(inverse)來作為一校正模型。 The method as described in claim 19, further comprising: capturing a plurality of alignment marks on another plate to determine the positions of a plurality of active reference marks; based on the positions of the active reference marks and the initial positions of the reference marks The plurality of differences between positions generates a variation model; based on the variation model and the reference tool model, an active alignment model is generated; and an inverse of the active alignment model is provided as a calibration model.
TW107129461A 2017-08-25 2018-08-23 Exposure system alignment and calibration method TWI791041B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/686,815 2017-08-25
US15/686,815 US10585360B2 (en) 2017-08-25 2017-08-25 Exposure system alignment and calibration method

Publications (2)

Publication Number Publication Date
TW201921142A TW201921142A (en) 2019-06-01
TWI791041B true TWI791041B (en) 2023-02-01

Family

ID=65437619

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107129461A TWI791041B (en) 2017-08-25 2018-08-23 Exposure system alignment and calibration method

Country Status (6)

Country Link
US (1) US10585360B2 (en)
JP (2) JP7362594B2 (en)
KR (1) KR102377041B1 (en)
CN (1) CN111033386B (en)
TW (1) TWI791041B (en)
WO (1) WO2019040299A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10684561B2 (en) * 2018-10-29 2020-06-16 Taiwan Semiconductor Manufacturing Co., Ltd. Lithography method
US10809637B1 (en) * 2019-05-30 2020-10-20 Applied Materials, Inc. Learning based digital corrections to compensate variations on lithography systems with multiple imaging units
JP7317579B2 (en) * 2019-06-07 2023-07-31 キヤノン株式会社 Alignment apparatus, alignment method, lithographic apparatus and method of manufacturing an article
US12372881B2 (en) * 2020-12-03 2025-07-29 Applied Materials, Inc. Deep learning based adaptive alignment precision metrology for digital overlay
US12326667B2 (en) 2022-12-15 2025-06-10 Applied Materials, Inc. Combination of inline metrology and on tool metrology for advanced packaging

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW546700B (en) * 2000-03-14 2003-08-11 Nikon Corp Alignment method, exposure method, exposure apparatus and device manufacturing method
TWI306567B (en) * 2002-06-07 2009-02-21 Cadence Design Systems Inc Characterization and reduction of variation for integrated circuits
US20090073403A1 (en) * 2007-09-19 2009-03-19 Asml Netherlands B.V. Methods of characterizing similarity or consistency in a set of entities
US20100271229A1 (en) * 2007-12-27 2010-10-28 Christine Allen-Blanchette Systems and methods for calibrating end effector alignment in a plasma processing system

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812661A (en) * 1986-08-20 1989-03-14 Hewlett-Packard Company Method and apparatus for hybrid I.C. lithography
US6151122A (en) * 1995-02-21 2000-11-21 Nikon Corporation Inspection method and apparatus for projection optical systems
SG88823A1 (en) * 1996-11-28 2002-05-21 Nikon Corp Projection exposure apparatus
JPH10209039A (en) * 1997-01-27 1998-08-07 Nikon Corp Projection exposure method and projection exposure apparatus
WO1999054922A1 (en) * 1998-04-22 1999-10-28 Nikon Corporation Exposure method and exposure system
JP2000124114A (en) * 1998-10-14 2000-04-28 Nikon Corp Charged particle beam projection exposure method, charged particle beam projection exposure apparatus, and reticle used therefor
JP2001274080A (en) * 2000-03-28 2001-10-05 Canon Inc Scanning projection exposure apparatus and alignment method thereof
JP4666747B2 (en) * 2000-11-06 2011-04-06 キヤノン株式会社 Exposure apparatus and device manufacturing method
US6699627B2 (en) * 2000-12-08 2004-03-02 Adlai Smith Reference wafer and process for manufacturing same
US7261983B2 (en) * 2000-12-08 2007-08-28 Litel Instruments Reference wafer and process for manufacturing same
KR100579603B1 (en) * 2001-01-15 2006-05-12 에이에스엠엘 네델란즈 비.브이. Lithographic Apparatus
JP2002353099A (en) * 2001-05-22 2002-12-06 Canon Inc Position detecting method and apparatus, exposure apparatus and device manufacturing method
JP4803901B2 (en) * 2001-05-22 2011-10-26 キヤノン株式会社 Alignment method, exposure apparatus, and semiconductor device manufacturing method
JP2003197504A (en) * 2001-12-27 2003-07-11 Nikon Corp Exposure method and device manufacturing method
TW594431B (en) 2002-03-01 2004-06-21 Asml Netherlands Bv Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
JPWO2005008753A1 (en) * 2003-05-23 2006-11-16 株式会社ニコン Template creation method and apparatus, pattern detection method, position detection method and apparatus, exposure method and apparatus, device manufacturing method, and template creation program
JP2005166785A (en) * 2003-12-01 2005-06-23 Canon Inc Position detection apparatus and method, and exposure apparatus
JP4844835B2 (en) * 2004-09-14 2011-12-28 株式会社ニコン Correction method and exposure apparatus
US7251018B2 (en) * 2004-11-29 2007-07-31 Asml Netherlands B.V. Substrate table, method of measuring a position of a substrate and a lithographic apparatus
US7442476B2 (en) * 2004-12-27 2008-10-28 Asml Netherlands B.V. Method and system for 3D alignment in wafer scale integration
JP2006259153A (en) * 2005-03-16 2006-09-28 Fuji Photo Film Co Ltd Method and device for evaluating alignment accuracy
WO2006126569A1 (en) * 2005-05-25 2006-11-30 Nikon Corporation Exposure method and lithography system
JP2007103658A (en) * 2005-10-04 2007-04-19 Canon Inc Exposure method and apparatus and device manufacturing method
US7463337B2 (en) * 2005-12-30 2008-12-09 Asml Netherlands B.V. Substrate table with windows, method of measuring a position of a substrate and a lithographic apparatus
JP4984038B2 (en) * 2006-07-27 2012-07-25 株式会社ニコン Management method
JP4850643B2 (en) * 2006-09-11 2012-01-11 キヤノン株式会社 Exposure equipment
JP2008166483A (en) * 2006-12-28 2008-07-17 Nikon Corp Grid matching method and exposure system
KR101045370B1 (en) 2009-08-21 2011-06-30 주식회사 나래나노텍 Apparatus and method for checking real-time alignment between a roll and a printed object, and a roll printing apparatus for pattern formation having the same
US8514395B2 (en) * 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
KR102047505B1 (en) * 2009-08-26 2019-12-02 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device manufacturing method
AU2009230797B2 (en) * 2009-10-28 2011-06-09 Canon Kabushiki Kaisha Focus finding and alignment using a split linear mask
US9196509B2 (en) 2010-02-16 2015-11-24 Deca Technologies Inc Semiconductor device and method of adaptive patterning for panelized packaging
KR101420223B1 (en) 2011-11-29 2014-07-17 주식회사 나래나노텍 Device and Method of Confirming Alignment of Printing Patterns, and Printing Apparatus and Method Having the Same
KR101902469B1 (en) * 2012-03-08 2018-09-28 마퍼 리쏘그라피 아이피 비.브이. Charged particle lithography system with alignment sensor and beam measurement sensor
US9760028B2 (en) * 2012-03-08 2017-09-12 Mapper Lithography Ip B.V. Lithography system and method for processing a target, such as a wafer
US9606442B2 (en) * 2012-07-30 2017-03-28 Asml Netherlands B.V. Position measuring apparatus, position measuring method, lithographic apparatus and device manufacturing method
WO2014064290A1 (en) 2012-10-26 2014-05-01 Mapper Lithography Ip B.V. Determining a position of a substrate in lithography
JP2015043390A (en) * 2013-08-26 2015-03-05 キヤノン株式会社 Lithographic apparatus and article manufacturing method
JP2016535299A (en) 2013-10-22 2016-11-10 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Maskless lithography for web-based processing
JP2015233107A (en) * 2014-06-11 2015-12-24 キヤノン株式会社 Exposure apparatus, exposure method, and device manufacturing method
US9891540B2 (en) * 2014-08-25 2018-02-13 Asml Holding N.V. Measuring method, measurement apparatus, lithographic apparatus and device manufacturing method
JP6344623B2 (en) * 2014-12-24 2018-06-20 株式会社ニコン MOBILE BODY CONTROL METHOD, EXPOSURE METHOD, DEVICE MANUFACTURING METHOD, MOBILE BODY DEVICE, AND EXPOSURE APPARATUS
TWI703402B (en) * 2015-03-25 2020-09-01 日商尼康股份有限公司 Layout method, mark detection method, exposure method, measurement device, exposure apparatus, and device manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW546700B (en) * 2000-03-14 2003-08-11 Nikon Corp Alignment method, exposure method, exposure apparatus and device manufacturing method
TWI306567B (en) * 2002-06-07 2009-02-21 Cadence Design Systems Inc Characterization and reduction of variation for integrated circuits
US20090073403A1 (en) * 2007-09-19 2009-03-19 Asml Netherlands B.V. Methods of characterizing similarity or consistency in a set of entities
US20100271229A1 (en) * 2007-12-27 2010-10-28 Christine Allen-Blanchette Systems and methods for calibrating end effector alignment in a plasma processing system

Also Published As

Publication number Publication date
KR102377041B1 (en) 2022-03-18
JP7362594B2 (en) 2023-10-17
TW201921142A (en) 2019-06-01
JP2020531900A (en) 2020-11-05
US20190064683A1 (en) 2019-02-28
JP2022078075A (en) 2022-05-24
US10585360B2 (en) 2020-03-10
KR20200032260A (en) 2020-03-25
WO2019040299A1 (en) 2019-02-28
CN111033386A (en) 2020-04-17
CN111033386B (en) 2022-10-28

Similar Documents

Publication Publication Date Title
TWI791041B (en) Exposure system alignment and calibration method
US12360467B2 (en) Dynamic generation of layout adaptive packaging
KR101651810B1 (en) Method and apparatus for overlay compensation between subsequently patterned layers on workpiece
CN106483773B (en) Projection exposure apparatus, projection exposure method, and mask blank
JP7653482B2 (en) Exposure equipment and systems
JP2000182934A (en) Semiconductor wafer alignment method
JP2022115887A (en) Freeform distortion correction
JP2023162226A (en) Self-alignment system and method for lithography systems
US10459341B2 (en) Multi-configuration digital lithography system
JP2020140070A (en) Exposure apparatus and exposure method
US20250284207A1 (en) Inspection of lithographic layers and dynamic data via inline metrology
KR102333943B1 (en) Exposure apparatus, stage calibration system, and stage calibration method
TW202548418A (en) Inspection of lithographic layers and dynamic data via inline metrology