TWI790835B - Immersion-type heat dissipation structure and method for manufacturing the same - Google Patents

Abstract

An immersion-type heat dissipation structure and method for manufacturing the same are provided. The immersion-type heat dissipation structure includes a first heat dissipation element and a second heat dissipation element that is disposed on the first heat dissipation element and has a plurality of heat dissipation pin fins. The second heat dissipation element is a porous heat dissipation element, the first heat dissipation is a solid heat dissipation element, and the thermal conductivity of the first heat dissipation is higher than that of the second heat dissipation element. The shortest distance between the bottoms of any two adjacent heat dissipation pin fins ranges from 0.2 to 1.2 mm. The minimum diameter of top surface of any heat dissipation pin fin ranges from 0.2 to 1.2 mm. The draft angle of sidewall of any heat dissipation pin fin ranges from 1 to 5°.

Description

Immersion heat dissipation structure and manufacturing method thereof

The invention relates to a heat dissipation structure and a manufacturing method thereof, in particular to an immersion heat dissipation structure and a manufacturing method thereof.

The immersion cooling technology is to immerse the heating element (such as server, disk array, etc.) directly in the non-conductive cooling liquid, so as to take away the heat energy generated by the heating element through the heat absorption and vaporization of the cooling liquid. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem to be solved in the industry.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide an immersion heat dissipation structure and a manufacturing method thereof in view of the deficiencies of the prior art.

An embodiment of the present invention provides an immersion heat dissipation structure, comprising: a first heat dissipation element and a second heat dissipation element having a plurality of heat dissipation columns formed on the first heat dissipation element; the second heat dissipation element and At least a part of the first heat dissipation element is in contact with each other; the second heat dissipation element is a porous heat dissipation element with a porous structure, the first heat dissipation element is a solid heat dissipation element with a solid structure, and the thermal conductivity of the first heat dissipation element is higher than the thermal conductivity of the second heat sink; the shortest distance between the bottoms of any two adjacent heat sinks is in the range of 0.2 to 1.2mm, and the diameter of the top surface of any of the heat sinks The minimum is in the range of 0.2-1.2mm, and the draft angle formed by the side of any one of the cooling columns is 1-5°.

In a preferred embodiment, the first heat dissipation element is a solid heat dissipation element composed of at least one solid metal, and the second heat dissipation element is a porous heat dissipation element formed by metal injection molding and contacting the first heat dissipation element. pieces.

In a preferred embodiment, the heat dissipation column is at least one of a cylinder, a square column, a rhombus column, and an ellipse column.

In a preferred embodiment, the first heat sink is a solid heat sink composed of a plurality of solid metals, the second heat sink is formed by metal injection molding and completely covers the first heat sink Porous heat sink.

In a preferred embodiment, the multiple solid metals are made of different solid metal materials.

An embodiment of the present invention further provides an immersion heat dissipation structure, comprising: a first heat dissipation element and a second heat dissipation element having a plurality of heat dissipation columns, which are formed on the first heat dissipation element; the second heat dissipation element At least a part of the first heat dissipation element is mutually bonded with a medium; the second heat dissipation element is a porous heat dissipation element with a porous structure, the first heat dissipation element is a solid heat dissipation element with a solid structure, and the first heat dissipation element is a solid heat dissipation element with a solid structure. The thermal conductivity of the heat sink is higher than that of the second heat sink; the shortest distance between the bottoms of any two adjacent heat sinks is in the range of 0.2 to 1.2mm, any of the heat sinks The minimum diameter of the top surface of the column is in the range of 0.2-1.2mm, and the draft angle formed by the side of any of the cooling columns is 1-5°.

In a preferred embodiment, the medium is one of copper-containing solder and thermal interface material.

An embodiment of the present invention further provides a method for manufacturing an immersion heat dissipation structure, including: providing a first material; performing chemical microetching on the surface of the first material to form a microetched surface on the surface of the first material; The first material after chemical micro-etching is put into the metal injection mold; the second material is provided; the second material is injected into the metal injection mold through the metal injection molding process to form an immersion heat dissipation structure.

In a preferred embodiment, the first material is at least one solid metal, and the second material is a mixture of metal powder and binder.

In a preferred embodiment, the manufacturing method of the immersion heat dissipation structure further includes: performing a post-treatment process on the immersion heat dissipation structure; the post-treatment process includes a wax removal process, a sintering process, and a secondary processing process. at least one.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

Please refer to FIGS. 1A and 1B , which are one embodiment of the present invention. The embodiment of the present invention provides an immersion heat dissipation structure, which can be used to contact heating elements. As shown in FIG. 1A , the immersion heat dissipation structure provided according to the embodiment of the present invention basically includes a first heat dissipation element 10 and a second heat dissipation element 20 .

In this embodiment, the second heat dissipation element 20 has a plurality of heat dissipation columns 21 , it can also be said that the second heat dissipation element 20 is composed of a plurality of heat dissipation columns 21 . The shape of the heat dissipation column 21 is not limited to a cylinder, and may also be a square column, a diamond-shaped column, an elliptical column, and the like. Moreover, a plurality of heat dissipation columns 21 are vertically formed on the upper surface 11 of the first heat dissipation element 10 by metal injection molding and immersed in a two-phase cooling liquid (such as electronic fluorinated liquid), while the lower surface of the first heat dissipation element 10 The surface 12 can be used to contact the heating element.

Furthermore, the second heat dissipation element 20 of this embodiment is a porous heat dissipation element, that is to say, the second heat dissipation element 20 of this embodiment is a porous heat dissipation element composed of a plurality of porous metal heat dissipation columns. In this embodiment, the second heat dissipation element 20 is preferably a porous heat dissipation element composed of a plurality of porous copper heat dissipation columns. It should be noted that Fig. 1 shows the porous structure exaggerated or enlarged for better understanding of the present invention.

Moreover, the first heat sink 10 of this embodiment is a solid heat sink with a solid structure, that is to say, the first heat sink 10 of this embodiment is a solid heat sink made of a solid metal. In this embodiment, the first heat sink 10 is preferably a solid copper heat sink. Moreover, the thermal conductivity of the first heat sink 10 is higher than that of the second heat sink 20 . Therefore, in this embodiment, the second heat dissipation element 20 is a porous heat dissipation element composed of a plurality of porous metal heat dissipation columns to increase the generation of air bubbles, and the first heat dissipation element 10 is a solid heat dissipation element made of a solid metal. The thermal conductivity of the heat sink and the first heat sink 10 is higher than that of the second heat sink 20 to increase the heat transfer efficiency, thereby improving the overall immersion heat dissipation effect.

Furthermore, as shown in FIG. 1B , the shortest distance G between the bottoms of any two adjacent heat dissipation columns 21 of the second heat dissipation element 20 of this embodiment is in the range of 0.2-1.2 mm, and any heat dissipation column 21 The minimum diameter D of the top surface is in the range of 0.2~1.2mm, and the draft angle θ formed by the side of any cooling column 21 is 1~5°, so as to increase the diameter and spacing of the cooling column 21 by reducing The contact area between the second heat sink 20 and the two-phase cooling liquid further enhances the overall immersion heat dissipation effect.

[Second embodiment]

Please refer to FIG. 2 , which is the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the second heat dissipation element 20 has a porous heat dissipation base 22 and a plurality of heat dissipation columns 21 integrally formed on the upper surface 221 of the porous heat dissipation base 22 . Furthermore, the plurality of heat dissipation columns 21 and the porous heat dissipation base 22 are formed on the upper surface 11 of the first heat dissipation element 10 by metal injection molding and immersed in the two-phase cooling liquid, so as to increase the two-phase cooling through the porous heat dissipation base 22 The contact area of the liquid and the amount of bubbles generated, and through the first heat sink 10 is a solid heat sink made of a solid metal and the thermal conductivity of the first heat sink 10 is higher than the thermal conductivity of the second heat sink 20 , so as to increase the heat transfer efficiency, thereby improving the overall immersion heat dissipation effect.

[Third embodiment]

Please refer to FIG. 3 , which is the third embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the second heat dissipation element 20 has a porous heat dissipation base 22 and a plurality of heat dissipation columns 21 integrally formed on the upper surface 221 of the porous heat dissipation base 22, and the lower surface 222 of the porous heat dissipation base 22 is formed with an inner concave portion 223 is in contact with the upper surface 11 and the side surface 13 of the first heat sink 10 . Furthermore, the plurality of heat dissipation columns 21 and the porous heat dissipation base 22 are in contact with the upper surface 11 and the side surface 13 of the first heat dissipation element 10 by metal injection molding and immersed in the two-phase cooling liquid, so as to increase the heat dissipation with the two phases through the porous heat dissipation base 22. The contact area of the cooling liquid and the generation amount of air bubbles, and through the first heat sink 10 is a solid heat sink made of a solid metal and the thermal conductivity of the first heat sink 10 is higher than that of the second heat sink 20 Conductivity to increase heat transfer efficiency, thereby improving the overall immersion heat dissipation effect.

[Fourth embodiment]

Please refer to FIG. 4 , which is the fourth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the first heat sink 10 has a plurality of solid metals 101 , it can also be said that the first heat sink 10 is composed of a plurality of solid metals 101 . The first heat sink 10 may be composed of a plurality of solid copper metals, but the first heat sink 10 may also be composed of a plurality of solid metals 101 made of different solid metal materials, such as cutting gold blocks or aluminum blocks . The second heat dissipation element 20 has a porous heat dissipation base 22 and a plurality of heat dissipation columns 21 integrally formed on the upper surface 221 of the porous heat dissipation base 22, and the porous heat dissipation base 22 is a first material composed of a plurality of solid metals 101 completely covered. Heat sink 10. Furthermore, the plurality of heat dissipation columns 21 and the porous heat dissipation base 22 completely cover the plurality of solid metals 101 by metal injection molding and are immersed in the two-phase cooling liquid, so as to increase the contact with the two-phase cooling liquid through the porous heat dissipation base 22 The area and the amount of bubbles generated, and through the solid heat dissipation element composed of a plurality of solid metals 101 inside the porous heat dissipation substrate 22 , have high thermal conductivity to increase heat transfer efficiency, thereby improving the overall immersion heat dissipation effect.

[Fifth Embodiment]

Please refer to FIG. 5 , which is the fifth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the bottoms of the plurality of heat dissipation columns 21 of the second heat dissipation element 20 may be bonded to the upper surface 101 of the first heat dissipation element 10 by at least one medium 30 . Furthermore, the medium 30 can be solder containing copper or a thermal interface material (such as thermally conductive silicone).

[Sixth embodiment]

Please refer to FIG. 6 , which is the sixth embodiment of the present invention. This embodiment is substantially the same as the second embodiment, and the differences are described as follows.

In this embodiment, the lower surface 222 of the porous heat dissipation substrate 22 of the second heat dissipation element 20 may be bonded to the upper surface 11 of the first heat dissipation element 10 by the medium 30 . Furthermore, the dielectric 30 can be copper-containing solder or thermal interface material.

[Seventh embodiment]

Please refer to FIG. 7 , which is the seventh embodiment of the present invention. This embodiment is substantially the same as the third embodiment, and the differences are described as follows.

In this embodiment, the concave portion 223 formed by the porous heat dissipation base 22 of the second heat dissipation element 20 may be bonded to the upper surface 11 and the side surface 13 of the first heat dissipation element 10 by the medium 30 . Furthermore, the dielectric 30 can be copper-containing solder or thermal interface material.

[Eighth embodiment]

Please refer to FIG. 8, which is the eighth embodiment of the present invention. This embodiment is substantially the same as the fourth embodiment, and the differences are described as follows.

In this embodiment, the porous heat dissipation base 22 of the second heat dissipation element 20 may be the first heat dissipation element 10 composed of at least one medium 30 bonded to a plurality of solid metals 101 . Furthermore, the dielectric 30 can be copper-containing solder or thermal interface material.

[Ninth Embodiment]

The immersion heat dissipation structure shown in FIG. 1A , FIG. 2 , FIG. 3 and FIG. 4 of the present invention can be fabricated in the following manner.

First, a first material is provided. The first material may be solid metal as shown in FIG. 1A , FIG. 2 , FIG. 3 , or FIG. 4 .

Carrying out chemical micro-etching; that is, performing chemical micro-etching on the surface of the first material, so that the surface of the first material is formed into a micro-etched surface, so as to increase the bite property of the surface of the first material. Then put the first material after chemical microetching into the metal injection mold. The cavity shape of the metal injection mold may correspond to the submerged heat dissipation structure shown in FIG. 1A , FIG. 2 , FIG. 3 , or FIG. 4 .

A second material is provided. The second material may be a mixture of metal powder and binder. The metal powder can be selected from copper powder, for example, and the binder can be selected from paraffin wax, for example.

Carrying out the metal injection molding process; that is, injecting the second material into the metal injection mold by the metal injection molding process to form the immersion heat dissipation structure as shown in FIG. 1A , FIG. 2 , FIG. 3 , or FIG. 4 .

In addition, a post-processing process can be performed on the submerged heat dissipation structure shown in FIG. 1A , FIG. 2 , FIG. 3 , or FIG. 4 according to actual needs. The post-processing process may include but not limited to wax removal process, sintering process, or secondary processing (such as hole processing) and other processes.

Based on the above, the submerged heat dissipation structure provided by the present invention can be formed on the first heat dissipation element through "a first heat dissipation element and a second heat dissipation element having a plurality of heat dissipation columns, and the The second heat sink is a porous heat sink with a porous structure, the first heat sink is a solid heat sink with a solid structure, and the thermal conductivity of the first heat sink is higher than that of the second heat sink. The technical solution can increase the heat transfer efficiency while increasing the amount of air bubbles generated, thereby improving the overall immersion heat dissipation effect, and can pass "the shortest distance between the bottoms of any two adjacent heat dissipation columns is the medium In the range of 0.2~1.2mm, the minimum diameter of the top surface of any of the cooling columns is in the range of 0.2~1.2mm, and the draft angle formed by the side of any of the cooling columns is 1~5°. The technical solution is to increase the contact area with the two-phase coolant by reducing the diameter and spacing of the heat dissipation columns, thereby further improving the overall immersion heat dissipation effect.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: first heat dissipation element 101: solid metal 11: upper surface 12: lower surface 13: side surface 20: second heat dissipation element 21: heat dissipation column 22: porous heat dissipation base 221: upper surface 222: lower surface 223: inner recess 30: Medium G: shortest distance D: top surface diameter θ : draft angle

FIG. 1A is a schematic side view of the structure of the first embodiment of the present invention.

Fig. 1B is an enlarged schematic view of part II in Fig. 1A.

Fig. 2 is a schematic side view of the structure of the second embodiment of the present invention.

Fig. 3 is a schematic side view of the structure of the third embodiment of the present invention.

Fig. 4 is a schematic side view of the structure of the fourth embodiment of the present invention.

Fig. 5 is a schematic side view of the structure of the fifth embodiment of the present invention.

Fig. 6 is a schematic side view of the structure of the sixth embodiment of the present invention.

Fig. 7 is a schematic side view of the structure of the seventh embodiment of the present invention.

Fig. 8 is a schematic side view of the structure of the eighth embodiment of the present invention.

10: The first radiator

11: Upper surface

12: Lower surface

20: Second radiator

21: cooling column

Claims (10)

A submerged heat dissipation structure, comprising: a first heat dissipation element and a second heat dissipation element having a plurality of heat dissipation columns formed on the first heat dissipation element; the second heat dissipation element and the first heat dissipation element At least a part of the heat sink is in contact with each other; the second heat sink is a porous heat sink with a porous structure, the first heat sink is a solid heat sink with a solid structure, and the thermal conductivity of the first heat sink is higher than that of the The thermal conductivity of the second heat sink: the shortest distance between the bottoms of any two adjacent heat dissipation columns is in the range of 0.2-1.2mm, and the minimum diameter of the top surface of any of the heat dissipation columns is between 0.2mm The range of ~1.2mm, and the draft angle formed by the side of any one of the heat dissipation columns is 1~5°; wherein, the first heat dissipation element is the solid heat dissipation element composed of a plurality of solid metals, so The second heat dissipation element is formed by metal injection molding and completely covers the porous heat dissipation element of the first heat dissipation element. The submerged heat dissipation structure according to claim 1, wherein the heat dissipation column is at least one of a cylinder, a square column, a rhombus column, and an ellipse column. The submerged heat dissipation structure according to claim 1, wherein the multiple solid metals are made of different solid metal materials. A submerged heat dissipation structure, comprising: a first heat dissipation element and a second heat dissipation element having a plurality of heat dissipation columns formed on the first heat dissipation element; the second heat dissipation element and the first heat dissipation element At least a part of the parts is mutually bonded by a medium; the second heat sink is a porous heat sink with a porous structure, the first heat sink is a solid heat sink with a solid structure, and the thermal conductivity of the first heat sink is Higher than the thermal conductivity of the second heat dissipation element; the shortest distance between the bottoms of any two adjacent heat dissipation columns is in the range of 0.2-1.2mm, any of the heat dissipation The minimum diameter of the top surface of the thermal column is in the range of 0.2 to 1.2mm, and the draft angle formed by the side of any of the thermal columns is 1 to 5°; wherein, the first heat sink is made of a plurality of solid The solid heat dissipation element is composed of metal, and the second heat dissipation element is formed by metal injection molding and completely covers the porous heat dissipation element of the first heat dissipation element. The immersion heat dissipation structure according to claim 4, wherein the medium is one of copper-containing solder and thermal interface material. The submerged heat dissipation structure according to claim 4, wherein the heat dissipation column is at least one of a cylinder, a square column, a rhombus column, and an ellipse column. The submerged heat dissipation structure according to claim 4, wherein the plurality of solid metals are made of different solid metal materials. A method for manufacturing an immersion heat dissipation structure, comprising: providing a first material; performing chemical microetching on the surface of the first material to form the surface of the first material into a microetched surface; The first material is put into the metal injection mold; the second material is provided; the second material is injected into the metal injection mold through the metal injection molding process to form the immersion heat dissipation structure as described in claim 1. The method for manufacturing an immersion heat dissipation structure according to claim 8, wherein the first material is at least one solid metal, and the second material is a mixture of metal powder and a binder. The method for manufacturing an immersion heat dissipation structure as described in Claim 8, further comprising: The submerged heat dissipation structure described in claim 1 is subjected to a post-processing process; the post-processing process includes at least one of a wax removal process, a sintering process, and a secondary processing process.

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