TWI790151B - Light guide member - Google Patents
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- TWI790151B TWI790151B TW111112179A TW111112179A TWI790151B TW I790151 B TWI790151 B TW I790151B TW 111112179 A TW111112179 A TW 111112179A TW 111112179 A TW111112179 A TW 111112179A TW I790151 B TWI790151 B TW I790151B
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- smt
- light guide
- contact
- surface mount
- mount technology
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- 238000005516 engineering process Methods 0.000 claims abstract description 44
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
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- Endoscopes (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Optical Couplings Of Light Guides (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
本發明係關於一種導光部件,特別是關於一種藉由表面黏著技術(Surface Mount Technology, SMT)固定於印刷電路板的導光柱。The present invention relates to a light guide component, in particular to a light guide column fixed on a printed circuit board by Surface Mount Technology (SMT).
一般而言,在將電子元件放置於印刷電路板上時,大多採用人工插件作業,也就是所謂的通孔插件,然而這樣的作業方式通常會耗費大量人力及工時。Generally speaking, when electronic components are placed on the printed circuit board, manual insertion is mostly used, which is the so-called through-hole insertion. However, such an operation usually consumes a lot of manpower and man-hours.
因此,如何提供一種導光柱等元件,可以有效率地將其放置於印刷電路板上又能降低人力及工時的需求,是一個值得思考的課題。Therefore, how to provide a component such as a light guide column, which can be efficiently placed on the printed circuit board and reduce the demand for manpower and working hours, is a topic worth considering.
鑒於上述內容,本揭露之第一態樣係提供本發明係一種導光部件,包含:一導光本體,該導光本體具有彼此連接之一第一支撐部、一第二支撐部以及一L型延伸部,而該第一支撐部之下表面設有一第一表面黏著技術(SMT)接點,該第二支撐部之下表面亦具有一第二表面黏著技術(SMT)接點;其中,該第一表面黏著技術(SMT)接點、該第二表面黏著技術(SMT)接點分別連接一印刷電路板上預先配置之一第一錫膏、一第二錫膏,而固定於該印刷電路板上。In view of the above, the first aspect of the present disclosure provides a light guide component, including: a light guide body, the light guide body has a first support portion connected to each other, a second support portion and a L Type extension part, and the lower surface of the first support part is provided with a first surface mount technology (SMT) contact, and the lower surface of the second support part is also provided with a second surface mount technology (SMT) contact; wherein, The first surface mount technology (SMT) contact and the second surface mount technology (SMT) contact are respectively connected to a first solder paste and a second solder paste pre-configured on a printed circuit board, and are fixed on the printed circuit board. circuit board.
在一實施方式中,其中該第一支撐部與該第二支撐部係一倒U型構造,而該L型延伸部係自該第一支撐部與該第二支撐部之連接部的中點向上延伸,且其中以俯視圖觀之,該L型延伸部垂直於該第一支撐部與該第二支撐部之該連接部。In one embodiment, the first support part and the second support part are an inverted U-shaped structure, and the L-shaped extension part is from the midpoint of the connection part between the first support part and the second support part Extending upwards, and wherein viewed from a plan view, the L-shaped extending portion is perpendicular to the connecting portion between the first supporting portion and the second supporting portion.
在一實施方式中,其中該第一表面黏著技術(SMT)接點、該第二表面黏著技術(SMT)接點為金屬片,該第一表面黏著技術(SMT)接點係部分嵌入該第一支撐部,而該第二表面黏著技術(SMT)接點係部分嵌入該第二支撐部。In one embodiment, wherein the first surface mount technology (SMT) contact and the second surface mount technology (SMT) contact are metal sheets, the first surface mount technology (SMT) contact is partially embedded in the second surface mount technology (SMT) contact A support portion, and the second surface mount technology (SMT) contact is partially embedded in the second support portion.
在一實施方式中,其中該導光本體之材料為塑膠,該第一支撐部係以塑膠射出成形部分包覆該第一表面黏著技術(SMT)接點,而該第二支撐部係以塑膠射出成形部分包覆該第二表面黏著技術(SMT)接點。In one embodiment, wherein the material of the light guide body is plastic, the first supporting part is made of plastic injection molding to partially cover the first surface mount technology (SMT) contact, and the second supporting part is made of plastic An injection molded portion encapsulates the second surface mount technology (SMT) contact.
在一實施方式中,其中該金屬片之材料為銅。In one embodiment, the metal sheet is made of copper.
以下揭露提供不同的實施例或示例,以建置所提供之標的物的不同特徵。以下敘述之成分以及排列方式的特定示例是為了簡化本公開,目的不在於構成限制;元件的尺寸和形狀亦不被揭露之範圍或數值所限制,但可以取決於元件之製程條件或所需的特性。例如,利用剖面圖描述本發明的技術特徵,這些剖面圖是理想化的實施例示意圖。因而,由於製造工藝和/公差而導致圖示之形狀不同是可以預見的,不應為此而限定。The following disclosure provides different embodiments or examples to implement different features of the provided subject matter. The specific examples of the components and arrangements described below are for the purpose of simplifying the present disclosure, and are not intended to be limiting; the size and shape of the elements are not limited by the disclosed range or numerical values, but may depend on the process conditions or required requirements of the elements. characteristic. For example, the technical features of the present invention are described using sectional views, which are schematic diagrams of idealized embodiments. Thus, variations in the shapes shown as a result of manufacturing processes and/or tolerances are foreseeable and should not be limiting.
再者,空間相對性用語,例如「下方」、「在…之下」、「低於」、「在…之上」以及「高於」等,是為了易於描述圖式中所繪示的元素或特徵之間的關係;此外,空間相對用語除了圖示中所描繪的方向,還包含元件在使用或操作時的不同方向。Furthermore, spatial relative terms such as "below", "below", "below", "above" and "above" are for ease of description of the elements depicted in the drawings or the relationship between features; moreover, spatially relative terms encompass different orientations of elements in use or operation in addition to the orientation depicted in the illustrations.
首先,請參考圖1,圖1係繪示本發明一實施例之導光部件的示意圖。如圖1所示,本發明一實施例之導光部件100包含:一導光本體10、第一表面黏著技術(SMT)接點20以及第二表面黏著技術(SMT)接點22。導光部件100用於導引下方一光源30的光線。第一表面黏著技術(SMT)接點20以及第二表面黏著技術(SMT)接點22係用於結合導光本體10與印刷電路板1(如圖2所示)。First, please refer to FIG. 1 . FIG. 1 is a schematic diagram of a light guide component according to an embodiment of the present invention. As shown in FIG. 1 , a
在此實施例中,導光本體10具有彼此連接之一第一支撐部10b、一第二支撐部10c以及一L型延伸部10a。第一支撐部10b之下表面設有一第一表面黏著技術(Surface Mount Technology, SMT)接點20;另外,第二支撐部10c之下表面亦設有一第二表面黏著技術(SMT)接點22。In this embodiment, the
接著,請參考圖2,圖2係繪示本發明一實施例之導光部件於印刷電路板的配置方式示意圖。如圖2所示,要特別說明的是,此圖繪示了本發明此實施例之導光部件100以及一對比例的導光部件200。也就是說,在此除了以圖2說明本發明此實施例之導光部件100配置於印刷電路板1的方式,亦在圖2之印刷電路板1上繪示與對比例之導光部件200卡扣的開孔50a、52a,以利用圖2比較並說明本發明此實施例之導光部件100與對比例之導光部件200配置於印刷電路板1上的差異。Next, please refer to FIG. 2 . FIG. 2 is a schematic diagram illustrating an arrangement of a light guide component on a printed circuit board according to an embodiment of the present invention. As shown in FIG. 2 , it should be noted that this figure shows the
關於本發明此實施例之導光部件100,如圖2所示,由於第一表面黏著技術(SMT)接點20連接印刷電路板1上預先配置之一第一錫膏20a,而第二表面黏著技術(SMT)接點22連接印刷電路板1上預先配置之一第二錫膏22a,導光部件100因而固定於印刷電路板1上。如此一來,並不需要在印刷電路板1上開孔即可將導光部件100固定於印刷電路板1上。Regarding the
關於對比例之導光部件200,如圖2所示,導光部件200包含:一導光本體40、一第一卡扣部50以及一第二卡扣部52。導光本體40具有彼此連接之一支撐部40b、一支撐部40c以及一L型延伸部40a。支撐部40b之下表面具有一卡扣部50;另外,支撐部40c之下表面亦具有一卡扣部52。卡扣部50對應插入開孔50a,而卡扣部52對應插入開孔52a,彼此結合後即完成導光部件200固定於印刷電路板1的步驟。要特別說明的是,如前所述,本發明之實施例的導光部件100均是利用表面黏著技術而固定於印刷電路板1上,無需在印刷電路板1開孔。Regarding the
另外,請參考圖3,圖3係繪示本發明一實施例之導光部件配置於印刷電路板的外觀示意圖。如圖2與圖3所示,在本發明之實施例中,在印刷電路板1上相應於導光部件100、102、104、106、108的位置,分別配置對應的光源開關60、62、64等等,以開關光源30以及對應的光源。在此要特別說明的是,圖2與圖3中有些對應的光源開關並未全數繪示。而且,導光部件102、104、106、108與導光部件100具有相同結構,皆不需要在印刷電路板1上開孔,即可利用與導光部件100相同方式固定於印刷電路板1上。In addition, please refer to FIG. 3 . FIG. 3 is a schematic view showing the appearance of a light guide component disposed on a printed circuit board according to an embodiment of the present invention. As shown in Fig. 2 and Fig. 3, in the embodiment of the present invention, corresponding
在此實施例中,第一支撐部10b與第二支撐部10c係一倒U型構造,而L型延伸部10a係自第一支撐部10b與第二支撐部10c之連接部的中點向上延伸,且其中以俯視圖觀之,L型延伸部10a垂直於第一支撐部10b與第二支撐部10c之所述連接部。In this embodiment, the
在此實施例中,第一表面黏著技術(SMT)接點20、第二表面黏著技術(SMT)接點22為金屬片,第一表面黏著技術(SMT)接點20係部分嵌入第一支撐部10b,而第二表面黏著技術(SMT)接點22係部分嵌入第二支撐部10c。In this embodiment, the first surface mount technology (SMT) contact 20 and the second surface mount technology (SMT)
在此實施例中,其中導光本體10之材料為塑膠,第一支撐部10b係以塑膠射出成形部分包覆第一表面黏著技術(SMT)接點20,而第二支撐部10c係以塑膠射出成形部分包覆第二表面黏著技術(SMT)接點22。In this embodiment, the material of the
在此實施例中,其中金屬片之材料為銅。In this embodiment, the material of the metal sheet is copper.
綜上所述,就對比例之導光部件200而言,採用卡扣方式與印刷電路板固定,須以人工方式作業,當所需數量多時易產生高作業成本,且印刷電路板須打孔,當空間不足或線路繁雜時不易佈線(LAYOUT)。相對地,為改善對比例之導光部件200的問題,開發出本發明此實施例之導光部件100等,將卡扣改為採用塑膠模內加金屬片射出方式,以達到可用表面黏著技術(SMT)打件方式生產,印刷電路板即不用開孔,亦增加佈線(LAYOUT)空間及活用。To sum up, as far as the
以上實施方式僅用以說明本發明的技術方案而非限制,儘管參照較佳實施方式對本發明進行了詳細說明,本領域的普通技術人員應當理解,可以對本發明的技術方案進行修改或等同替換,而不脫離本發明技術方案的精神和範圍。The above embodiments are only used to illustrate the technical solutions of the present invention without limitation. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced. Without departing from the spirit and scope of the technical solution of the present invention.
1:印刷電路板
10:導光本體
10a:L型延伸部
10b:第一支撐部
10c:第二支撐部
20:第一表面黏著技術(SMT)接點
20a:第一錫膏
22:第二表面黏著技術(SMT)接點
22a:第二錫膏
30:光源
40:導光本體
40a:L型延伸部
40b、40c:支撐部
50、52:卡扣部
50a、52a:開孔
60、62、64:光源開關
100、102、104、106、108、200:導光部件1: Printed circuit board
10:
為讓本發明的上述與其他目的、特徵、優點與實施例能更淺顯易懂,所附圖式之說明如下: 圖1係繪示本發明一實施例之導光部件的示意圖。 圖2係繪示本發明一實施例之導光部件於印刷電路板的配置方式示意圖。 圖3係繪示本發明一實施例之導光部件配置於印刷電路板的外觀示意圖。 In order to make the above and other objects, features, advantages and embodiments of the present invention more understandable, the accompanying drawings are described as follows: FIG. 1 is a schematic diagram illustrating a light guide component according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing the configuration of the light guide component on the printed circuit board according to an embodiment of the present invention. FIG. 3 is a schematic diagram showing the appearance of a light guide component disposed on a printed circuit board according to an embodiment of the present invention.
根據慣常的作業方式,圖中各種特徵與元件並未依實際比例繪製,其繪製方式是為了以最佳的方式呈現與本發明相關的具體特徵與元件。此外,在不同圖式間,以相同或相似的元件符號指稱相似的元件及部件。In accordance with common practice, the various features and elements in the drawings are not drawn to scale, but are drawn in order to best represent the specific features and elements relevant to the invention. In addition, the same or similar reference symbols refer to similar elements and parts in different drawings.
10:導光本體 10: Light guide body
10a:L型延伸部 10a: L-shaped extension
10b:第一支撐部 10b: the first support part
10c:第二支撐部 10c: the second support part
20:第一表面黏著技術(SMT)接點 20: The first surface mount technology (SMT) contacts
22:第二表面黏著技術(SMT)接點 22: Second surface mount technology (SMT) contacts
30:光源 30: light source
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111112179A TWI790151B (en) | 2022-03-30 | 2022-03-30 | Light guide member |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111112179A TWI790151B (en) | 2022-03-30 | 2022-03-30 | Light guide member |
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| Publication Number | Publication Date |
|---|---|
| TWI790151B true TWI790151B (en) | 2023-01-11 |
| TW202338034A TW202338034A (en) | 2023-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111112179A TWI790151B (en) | 2022-03-30 | 2022-03-30 | Light guide member |
Country Status (1)
| Country | Link |
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| TW (1) | TWI790151B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI559577B (en) * | 2014-11-06 | 2016-11-21 | 崇得電子股份有限公司 | SMT type LED package element, its manufacturing method and light emitting device |
| TW202127080A (en) * | 2019-12-31 | 2021-07-16 | 大陸商訊芯電子科技(中山)有限公司 | Optical device and manufacturing method of the optical device |
-
2022
- 2022-03-30 TW TW111112179A patent/TWI790151B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI559577B (en) * | 2014-11-06 | 2016-11-21 | 崇得電子股份有限公司 | SMT type LED package element, its manufacturing method and light emitting device |
| TW202127080A (en) * | 2019-12-31 | 2021-07-16 | 大陸商訊芯電子科技(中山)有限公司 | Optical device and manufacturing method of the optical device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202338034A (en) | 2023-10-01 |
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