TWI790086B - Non-contact semiconductor element measuring device and operation method thereof - Google Patents

Abstract

The invention provides a non-contact semiconductor manufacturing process part measuring device and an operation method thereof. The measuring device includes a housing, an optical module and a control unit. The housing has an accommodation space for accommodating the optical module, and the control unit controls the optical module to measure the semiconductor manufacturing process part under test and obtain its measurement information. Before measuring the semiconductor manufacturing process part under test, the optical module needs to be calibrated. A surface topography information of a standard element is measured through the optical module, and the measured surface topography information is compared with a preset information so as to obtain a compensation information used to calibrate the optical module.

Description

Non-contact semiconductor process equipment spare parts measuring device and operating method thereof

The invention belongs to the field of measurement technology, in particular to a measurement device and an operation method for the surface topography information of spare parts of semiconductor process equipment.

With the development of high technology, the number of chips required in electronic devices is increasing. The volume of chips can be continuously reduced through advanced semiconductor manufacturing processes. While the volume of chips is becoming more and more miniaturized, there must be a A more convenient surface topography measurement device for semiconductor process equipment parts, such as CMP polishing pads or other workpiece surface features and size information.

Therefore, the main purpose of the present invention is to provide a non-contact measuring device and method for semiconductor process equipment spare parts, so as to solve the above problems.

The content disclosed in the background description paragraph above is only to enhance the understanding of the background technology of the present invention. Therefore, the above content contains prior art that does not constitute an obstacle to the present invention, and should be well known to those skilled in the art.

The purpose of the present invention is to provide a non-contact measuring device for spare parts of semiconductor process equipment, which can realize non-destructive measurement.

Another object of the present invention is to provide an operating method for operating the above-mentioned non-contact semiconductor process equipment component measuring device.

An embodiment of the present invention provides a non-contact measuring device for parts of semiconductor manufacturing equipment, including a housing, an upper cover, a lower cover, an optical module, and a control unit. The upper cover has a measurement window. The housing has an upper opening and a lower opening, and the upper cover and the lower cover are respectively arranged on the upper opening and the lower opening of the housing to form an accommodating space. The optical module is arranged in the accommodating space, and measures the object to be measured through the measuring window. The control unit is electrically connected to the optical module to control the optical module to measure the object under test and obtain its measurement information.

Another embodiment of the present invention proposes an operation method of a non-contact semiconductor process equipment spare parts measurement device, the measurement device has an optical module, and the operation method includes the following steps: (a) focusing and measuring the optical module Measure the standard component; (b) obtain the surface topography measurement information of the standard component; (c) compare the surface topography measurement information with the surface topography default information of the standard component, thereby obtaining compensation information; (d) Correcting the optical module according to the compensation information; and (e) measuring the semiconductor DUT through the corrected optical module.

Therefore, using the non-contact semiconductor process equipment spare parts measuring device and its operation method provided by the present invention, the optical module can be used to measure the standard component to obtain compensation information to calibrate the optical module, and after calibration Semiconductor process equipment parts and components under test are measured in a non-contact manner. By observing the surface morphology of the measured semiconductor process equipment parts and components under test, it is judged whether its size meets the expected value.

The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, it can be implemented according to the contents of the description, and in order to make the above and other aspects of the present invention Other purposes, features and advantages can be more obvious and understandable, and the preferred embodiments are specially cited below, together with the drawings, and detailed descriptions are as follows.

100, 200: Measuring components for non-contact semiconductor process equipment spare parts

101: Human-machine interface

20: shell

21: Upper cover

22: Lower cover

23:Optical module

24: The object to be tested

25: Centric card platform

201: upper opening

202: Lower opening

211: Visual screen

2021: Measurement window

2022: Embedded magnets

301~305, 401~403, 501, 601~602: steps

The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation of the present application, and explain the principle of the present application together with the text description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative efforts. In the drawings: Figure 1 is a schematic structural view of a non-contact semiconductor process equipment spare parts measurement device according to an embodiment of the present invention; Figure 2 is a non-contact semiconductor process equipment spare parts measurement device according to an embodiment of the present invention Exploded diagram; FIG. 3 is an operation flowchart of a non-contact semiconductor process equipment spare parts measuring device according to an embodiment of the present invention; FIG. 4 is a non-contact semiconductor process equipment spare part measurement device according to another embodiment of the present invention Operation flow chart; FIG. 5 is an operation flow chart of a non-contact semiconductor process equipment spare parts measuring device according to another embodiment of the present invention; and FIG. 6 is a non-contact semiconductor process equipment spare part quantity according to another embodiment of the present invention Flow chart of the operation of the measuring device.

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

The advantages and features of the present invention and methods for achieving them will be more easily understood by describing in more detail with reference to exemplary embodiments and accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. On the contrary, for those skilled in the art, these embodiments provided will make this disclosure more thorough, comprehensive and completely convey the scope of the present invention, and the present invention will only be the appended claims defined. In the drawings, the dimensions and relative dimensions of elements are exaggerated for clarity. Throughout the specification, some different reference numerals may refer to the same component. Specific structural and functional details disclosed herein are representative only and are for purposes of describing example embodiments of the invention. This invention may, however, be embodied in many alternative forms and should not be construed as limited to only the embodiments set forth herein.

Unless otherwise defined, all terms (including technical and scientific terms) used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be more understandable that, for example, those terms defined in commonly used dictionaries should be understood as having meanings consistent with the content of the relevant field, and unless clearly defined in the following, will be understood by those with ordinary knowledge in the technical field understood in the general sense understood.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a flexible connection. Detachable connection, or integral connection; it can be mechanical connection or electrical connection; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components. for the field Those of ordinary skill can understand the specific meanings of the above terms in the present invention in specific situations.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the exemplary embodiments. As used herein, the singular forms "a", "an" and "an" are also intended to include the plural unless the context clearly dictates otherwise. It should also be understood that the term "comprises" and/or "comprises" as used herein specifies the presence of stated features, integers, steps, operations, units and/or components and does not exclude the presence or addition of one or more Other features, integers, steps, operations, units, components and/or combinations thereof.

Exemplary embodiments will be described in detail below with reference to the drawings. However, these embodiments may be included in different forms, and should not be construed as limiting the scope of the present invention. These embodiments are provided to make the disclosure of the present invention complete and clear, and those skilled in the art will be able to understand the scope of the present invention through these embodiments.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a non-contact semiconductor process equipment component measuring device according to an embodiment of the present invention. As shown in FIG. 1, the non-contact semiconductor process equipment spare parts measuring device 100 is electrically connected to the man-machine interface 101. In this embodiment, the man-machine interface 101 is equipped with, for example, a desktop computer, a notebook computer, or an industrial computer. The electronic device with graphic computing and display capabilities also provides a user operation interface, and the user can perform operations such as calibration and measurement on the non-contact semiconductor process equipment spare parts measurement device 100 through the man-machine interface 101, and at the same time through The man-machine interface 101 observes the measurement results of the object under test. The measurement method is described later.

Please refer to FIG. 2 . FIG. 2 is an exploded view of a non-contact semiconductor process equipment component measuring device according to an embodiment of the present invention. As shown in FIG. 2 , the non-contact semiconductor process equipment component measuring device 200 includes a housing 20 , an upper cover 21 , a lower cover 22 , an optical module 23 and a control unit (not shown). The casing 20 has an upper opening 201 and a lower opening 202 . The upper cover 21 is disposed on the upper opening 201 , and the lower cover 22 is disposed on the lower opening 202 . The lower opening 202 has a measurement window 2021 . The housing 20 , the upper cover 21 and the lower cover 22 form an accommodating space. Light The learning module 23 is disposed in the containing space to measure the object 24 through the measurement window 2021 . The control unit is electrically connected to the optical module 23 to control the optical module 23 to measure the object under test 24 and obtain measurement information of the object under test 24 .

Please continue to refer to FIG. 2 , the upper cover 21 is provided with a visible screen 211 for the user to observe the surface topography of the object 24 to be tested. In this embodiment, the visible screen 211 is an LCD liquid crystal screen, and the image observed by the optical module 23 is displayed on the visible screen 211 through the CCD lens. Through the visible screen 211, the user can observe whether the light spot (spot) emitted by the optical module 211 falls in the correct measurement area.

Please continue to refer to FIG. 2 , the accommodating space further includes a micrometer platform 25 for optically focusing the optical module 23 . In this embodiment, the centroid platform 25 is a commercial standard component, and the actuation method is to control the micrometer platform 25 by rotating the knob on the centroid platform 25 (similar to the coarse adjustment or fine adjustment knob of an optical microscope). The movement, and because the optical module 23 is locked on the micrometer platform 25, it can be moved up and down by adjusting the knob of the micrometer platform 25 to achieve the purpose of focusing. Among them, due to the weight of the optical module 23 itself, the centric card platform 25 will sag due to its own weight. In this embodiment, the spring force of the spring (not shown) enables it to control the focusing plane of the optical module 23, and it does not depend on its own weight. Drooping improves the accuracy of focusing.

Please continue to refer to FIG. 2 , the lower cover 22 further includes an embedded magnet 2022 . In this embodiment, the function of the embedded magnet 2022 is to attract another counterpart (not shown in the figure), which is a precision block gauge with a groove of known thickness after precision machining, and After the groove is tested by a third-party calibration agency, a report will be issued to prove the size. The casing 20 can be quickly combined with or separated from the precision block gauge by magnetic attraction.

Please continue to refer to FIG. 2 , the control unit includes an industrial computer human-machine interface. In this embodiment, the control unit can be directly integrated on the non-contact semiconductor process equipment spare parts measurement device 200, or can be electrically connected to the optical module 23 through a signal line and then connected to the semiconductor process equipment spare parts measurement device. The device 200 is provided separately.

FIG. 3 is an operation flowchart of a non-contact measuring device for semiconductor process equipment parts according to an embodiment of the present invention. As shown in FIG. 3 , the process includes steps 301-305. Step 301: Focus the optical module and measure standard components. Step 302: Obtain surface topography measurement information of the standard component. Step 303 : Comparing the surface topography measurement information with the surface topography default information of the standard device, so as to obtain compensation information. Step 304: Calibrate the optical module according to the compensation information. Step 305: Measure the components under test of semiconductor process equipment components through the calibrated optical module. In the foregoing steps, the standard components and the components under test of semiconductor process equipment components are both the aforementioned objects under test 24 . The standard component has preset surface topography information, which means that the surface topography information of the standard component (such as physical characteristics such as groove depth and size) is known, so after measuring the standard component through the optical module, it will Obtain the measured value and preset value of the surface topography information of the standard component, and compare the measured value with the predicted value to know the difference between the two, and then use this difference to adjust the optical module Calibration can increase the measurement accuracy of the optical module, and the optical module after calibration can then be formally measured for the component to be measured.

FIG. 4 is an operation flowchart of a non-contact measuring device for semiconductor process equipment parts according to another embodiment of the present invention. As shown in FIG. 4, the process includes steps 401-403. Step 401: Perform horizontal correction after obtaining the depth map of the standard component. Step 402: Obtain the two-point groove plane value and the two-point groove bottom value of the standard component through the system interface, and obtain the average value of the two-point groove plane value and the two-point groove bottom value respectively. Step 403: Calculate the difference between the average value of the groove plane and the average value of the groove bottom. In the preceding steps, the system interface may be the aforementioned man-machine interface. After the man-machine interface successfully displays the image in focus of the optical module, the user can fix (fix) the image through the operating software installed in the man-machine interface and Ready to fetch values. Ideally, the image is a horizontal line with ups and downs, but the horizontal line may be skewed at a specific angle due to the placement of the optical module or the device under test. At this time, the line can be adjusted back to the horizontal through the operating software state, this process is called leveling. The specific content is that the system automatically judges that the line segment is from the left To the right slope, and automatically compensate (offset) according to this slope to keep the line segment horizontal (slope=0). The difference between the arithmetic mean of the groove plane and the bottom of the groove means the depth of the groove in a sense. The purpose of this invention is to assist users to accurately obtain the "groove depth" or "level difference" without damaging the sample surface. "The data.

FIG. 5 is an operation flowchart of a non-contact semiconductor process equipment component measuring device according to another embodiment of the present invention. As shown in FIG. 5 , the process includes step 501 . Step 501: Use the calibrated optical module to measure the standard component and perform repeated calibration until the surface topography measurement information of the standard component conforms to the surface topography preset information of the standard component. In this step, the user can improve the accuracy of the calibration by repeatedly measuring the standard components.

FIG. 6 is an operation flowchart of a non-contact semiconductor process equipment component measuring device according to another embodiment of the present invention. As shown in FIG. 6 , the process includes steps 601 and 602 . Step 601: Obtain and store the groove depth measurement data of the components under test of semiconductor process equipment components. Step 602: Comparing the measurement data of the groove depth of the component to be tested in the spare parts of the semiconductor process equipment with the reference data, or as a basis for adjusting the state of the spare parts at the equipment end. In this step, after the user measures the surface topography information of the semiconductor process equipment parts and components to be tested, it will be compared with the standard value (or normal value), where the standard value can be a specific range preset by the user. When comparing It is found that the surface topography of semiconductor process equipment parts and components to be tested exceeds this specific range, and it is judged as abnormal. Therefore, users can adjust the machine parameters of the process, or perform equipment maintenance or replacement. In this embodiment, the benchmark data is defined as the semiconductor process equipment spare parts that conform to the benchmark data, and conform to all the specifications of the production site during the wafer manufacturing process and production process, so the benchmark data is a set of data for different technology nodes The optimization data of different models and different passes of the process, rather than the data of a fixed absolute unit. According to the benchmark data and its corresponding deviation, the user can make replacement, fine-tuning, improvement, or further failure analysis of the corresponding semiconductor process equipment parts and components.

In summary, the amount of spare parts for non-contact semiconductor process equipment proposed by the present invention With the measuring device and operation method, the user can perform non-destructive measurement on the component to be tested, and the accuracy of the measurement can be improved through calibration. Compared with the existing destructive measurement, the present invention can provide more convenient, It is an instant and accurate method, and because it is a non-destructive measurement, the measurement can be repeated and the measurement results can be easily reproduced, thereby improving the error tolerance rate during the measurement process.

The above description is only a description of the preferred implementation or examples of the technical means used to solve the problems in the present invention, and is not intended to limit the scope of the patent implementation of the present invention. That is, all equivalent changes and modifications that are consistent with the scope of the patent application of the present invention, or made according to the scope of the patent of the present invention, are covered by the scope of the patent of the present invention.

Looking at the above, it can be seen that the present invention has indeed achieved the desired effect after breaking through the previous technology, and it is not obvious to those who are familiar with the technology. The application requirements, please file a patent application in accordance with the law, I urge your bureau to approve this application for a patent for invention, so as to encourage invention, and thank you for your convenience.

200: Non-contact semiconductor process equipment spare parts measuring device

20: shell

21: Upper cover

22: Lower cover

23:Optical module

24: The object to be tested

25: Centric card platform

201: upper opening

202: Lower opening

211: Visual screen

2021: Measurement window

2022: Embedded magnets

Claims (4)

A non-contact measuring device for spare parts of semiconductor process equipment, comprising: a housing with an upper opening and a lower opening; an upper cover disposed on the upper opening; a lower cover disposed on the lower opening, the lower cover having a A measurement window, the casing, the upper cover and the lower cover form an accommodating space; an optical module is arranged in the accommodating space to measure an object under test through the measurement window; and a control unit , electrically connected to the optical module to control the optical module to measure the object under test and obtain the measurement information of the object under test; wherein the upper cover is provided with a visible screen for a user to observe the object under test the surface morphology. According to the non-contact semiconductor process equipment spare parts measuring device according to claim 1, the accommodating space further includes a centimeter platform for optical focusing of the optical module, wherein the centimeter platform is passed through a Spring force rebound. According to the non-contact semiconductor process equipment spare parts measuring device according to claim 1, the lower cover further includes an embedded magnet. According to claim 1, the non-contact measuring device for spare parts of semiconductor process equipment, wherein the control unit includes an industrial computer human-machine interface.

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