TWI790052B - Radio frequency switch - Google Patents
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- TWI790052B TWI790052B TW110147316A TW110147316A TWI790052B TW I790052 B TWI790052 B TW I790052B TW 110147316 A TW110147316 A TW 110147316A TW 110147316 A TW110147316 A TW 110147316A TW I790052 B TWI790052 B TW I790052B
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
- H04B1/1607—Supply circuits
- H04B1/1615—Switching on; Switching off, e.g. remotely
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
- H04B1/18—Input circuits, e.g. for coupling to an antenna or a transmission line
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/44—Transmit/receive switching
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Abstract
Description
本發明關於射頻電路,特別是一種射頻電路中的射頻開關。 The invention relates to a radio frequency circuit, in particular to a radio frequency switch in the radio frequency circuit.
射頻(Radio Frequency,RF)開關能引導射頻訊號通過一或多條傳送路徑,且廣泛應用於電視、行動電話、無線通訊裝置無線網路(Wi-Fi)、藍芽及全球定位系統(global positioning system,GPS)。 Radio Frequency (RF) switches can guide radio frequency signals through one or more transmission paths, and are widely used in televisions, mobile phones, wireless communication devices, wireless networks (Wi-Fi), Bluetooth and global positioning systems (global positioning system, GPS).
然而,在相關技術中,當射頻開關截止時,射頻訊號會產生反射而使射頻開關無法正常運作。 However, in the related art, when the RF switch is turned off, the RF signal will be reflected and the RF switch cannot work normally.
本發明實施例提供一種射頻開關,包含有訊號端、參考電壓端、及分流開關路徑、分流開關路徑耦接於訊號端及參考電壓端。分流開關路徑包含有第一分流子電路及第二分流子電路。第二分流子電路,包含有並聯之第一電晶體及第二電晶體。當射頻開關切換至第一狀態時,其具有第一阻抗,當射頻開關切換至第二狀態時,其具有第二阻抗,當射頻開關切換至第三狀態時,其具有第三阻抗。第一阻抗、第二阻抗、及第三阻抗相異。 An embodiment of the present invention provides a radio frequency switch, including a signal terminal, a reference voltage terminal, and a shunt switch path, and the shunt switch path is coupled to the signal terminal and the reference voltage terminal. The shunt switch path includes a first shunt sub-circuit and a second shunt sub-circuit. The second shunt sub-circuit includes a first transistor and a second transistor connected in parallel. When the radio frequency switch is switched to a first state, it has a first impedance, when the radio frequency switch is switched to a second state, it has a second impedance, and when the radio frequency switch is switched to a third state, it has a third impedance. The first impedance, the second impedance, and the third impedance are different.
1至7:射頻開關 1 to 7: RF switch
10,18,181,182:訊號端 10,18,181,182: signal terminal
12,22,32,221,222:分流開關路徑 12,22,32,221,222: shunt switch path
14,16,26,261,141,262,142:分流子電路 14,16,26,261,141,262,142: shunt sub-circuit
40,401,402:串聯開關路徑 40, 401, 402: Series switch paths
42:天線 42: Antenna
44:射頻電路 44: RF circuit
GND:參考電壓端 GND: reference voltage terminal
Srf:射頻訊號 Srf: radio frequency signal
Tsh,T1,T2,Tsr:電晶體 Tsh, T1, T2, Tsr: Transistor
Rsh,Rsr,R1,R2:電阻 Rsh, Rsr, R1, R2: resistance
Vcsh,Vc1,Vc2,Vsr,Vc11,Vc21,Vcsh1,Vcsr1,Vc12,Vc22,Vcsh2,Vcsr2:控制電壓 Vcsh, Vc1, Vc2, Vsr, Vc11, Vc21, Vcsh1, Vcsr1, Vc12, Vc22, Vcsh2, Vcsr2: control voltage
第1圖係為本發明實施例中之一種射頻開關之電路示意圖。 Figure 1 is a schematic circuit diagram of a radio frequency switch in an embodiment of the present invention.
第2圖係為本發明實施例中之另一種射頻開關之電路示意圖。 Figure 2 is a schematic circuit diagram of another radio frequency switch in the embodiment of the present invention.
第3圖係為本發明實施例中之另一種射頻開關之電路示意圖。 Fig. 3 is a schematic circuit diagram of another radio frequency switch in the embodiment of the present invention.
第4圖係為本發明實施例中之另一種射頻開關之電路示意圖。 Fig. 4 is a schematic circuit diagram of another radio frequency switch in the embodiment of the present invention.
第5圖係為本發明實施例中之另一種射頻開關之電路示意圖。 Fig. 5 is a schematic circuit diagram of another radio frequency switch in the embodiment of the present invention.
第6圖係為本發明實施例中之另一種射頻開關之電路示意圖。 Fig. 6 is a schematic circuit diagram of another radio frequency switch in the embodiment of the present invention.
第7圖係為本發明實施例中之另一種射頻開關之電路示意圖。 Fig. 7 is a schematic circuit diagram of another radio frequency switch in the embodiment of the present invention.
第1圖係為本發明實施例中之一種射頻開關1之電路示意圖。射頻開關1可傳送或接收射頻訊號Srf。
Fig. 1 is a schematic circuit diagram of a
射頻開關1包含有訊號端10、參考電壓端GND、分流(shunt)開關路徑12、及訊號端18。分流開關路徑12耦接於訊號端10及參考電壓端GND。訊號端10可耦接於天線及射頻電路中之一者,訊號端18可耦接於天線及射頻電路中之另一者。參考電壓端GND可提供參考電壓,例如0V。當射頻開關1導通,此時分流開關路徑12截止,分流開關路徑12可切斷訊號端10及參考電壓端GND之間的耦接以將射頻訊號Srf在訊號端10及訊號端18之間傳送;當射頻開關1截止,此時分流開關路徑12導通,分流開關路徑12可建立訊號端10及參考電壓端GND之間的耦接以將射頻訊號Srf引導至參考電壓端GND。本發明之射頻開關1可在對應的狀態選擇性地提供實質上等於負載電阻之等效電阻。負載電阻可為天線及射頻電路的等效電阻,例如50歐姆或75歐姆。
The
分流開關路徑12包含有分流子電路14及分流子電路16。分流子電路14包含第一端,耦接於訊號端10及訊號端18、第二端、及控制端,用以接收控
制電壓Vcsh,藉以控制分流子電路14。分流子電路16包含第一端,耦接於分流子電路14的第二端、第二端,耦接於參考電壓端GND。分流子電路14可包含有N個疊接的電晶體Tsh,N為正整數。每個電晶體Tsh的尺寸可相等,及可由控制電壓Vcsh控制其導通狀態。分流子電路14中電晶體Tsh的數量N可由射頻訊號Srf的功率決定。舉例來說,射頻訊號Srf的功率越大,則分流子電路14需要配置越多個電晶體Tsh,以在傳送或接收射頻訊號Srf時提供足夠的隔絕能力。在一些實施例中,電晶體Tsh的數量N可為24。分流子電路14可另包含有N個電阻Rsh,每個電阻Rsh耦接於相應疊接電晶體Tsh的第一端及第二端,且每個電阻Rsh的電阻值可相等。分流開關路徑12截止時,N個疊接的電晶體Tsh皆截止,此時每個電晶體Tsh可等效為一電容。分流開關路徑12導通時,N個疊接的電晶體Tsh皆導通,此時每個電晶體Tsh在導通時電性可等效為一電阻,此電阻的值很小趨近於0歐姆,24個電晶體Tsh導通時可等於48歐姆,此時分流開關路徑12可以等效為50毆姆的電阻。舉例來說,電阻Rsh可於分流開關路徑12導通時作為偏壓電阻用來固定電晶體Tsh第一端與第二端的電位,電阻Rsh其電阻值可介於10K歐姆至50K歐姆之間。在一些實施例中,可選藉由選定電阻Rsh使得分流子電路14電晶體Tsh截止時其等效電容的阻抗遠小於電阻Rsh之阻抗。
The
分流子電路16包含有並聯之電晶體T1及電晶體T2。電晶體T1可包含第一端,其係耦接於分流子電路16的第一端、第二端,其係耦接於分流子電路16的第二端、以及及控制端,其係用以接收控制電壓Vc1,藉以控制電晶體T1的導通狀態。電晶體T2可包含第一端,其係耦接於分流子電路16的第一端、第二端,其係耦接於分流子電路16的第二端、以及控制端,其係用以接收控制電壓Vc2,藉以控制電晶體T2的導通狀態。電晶體T1的尺寸、電晶體T2的尺寸及電晶體Tsh的尺寸可相異。例如,在一些實施例中,電晶體Tsh的尺寸可大於電晶
體T1的尺寸,而電晶體T1的尺寸可大於電晶體T2的尺寸。在一些實施例中,電晶體Tsh的尺寸可等於電晶體T1的尺寸及電晶體T2的尺寸之總和。在一些實施例中,電晶體T2的尺寸可被選定,以於電晶體T2導通時,使得分流開關路徑12此時的等效電阻趨近於負載電阻的導通電阻。例如,可選定電晶體T2的導通電阻在30歐姆到48歐姆之間,使得分流開關路徑12此時的等效電阻約等於50歐姆。在一些實施例中,電晶體T1及電晶體T2的尺寸比可介於70:30至99:1之間。例如,電晶體Tsh、電晶體T1的及電晶體T2的尺寸比可為100:99:1。由於此時電晶體Tsh的尺寸及電晶體T1的尺寸皆遠大於電晶體T2的尺寸,當電晶體Tsh或電晶體T1導通時可視為短路。在一些實施例中,於分流開關路徑12導通時,射頻訊號Srf可經由24個電晶體Tsh(0歐姆)及電晶體T2(50歐姆)而被引導至參考電壓端GND,因此不會產生訊號反射而降低訊號品質。在另一些實施例中,於分流開關路徑12導通時,射頻訊號Srf可經由24個電晶體Tsh(0歐姆)及電晶體T1(0歐姆)而被引導至參考電壓端GND。電晶體Tsh、電晶體T1及電晶體T2皆可為N型金屬氧化物半導體場效電晶體(metal-oxide-semiconductor field-effect transistor,MOSFET)。
The
在一些實施例中,電晶體Tsh、T1、及T2的尺寸可分別正相關於每個電晶體Tsh、T1、及T2的指節(finger)寬度。例如,在電晶體Tsh、電晶體T1的及電晶體T2的尺寸比為100:99:1的實施例中,電晶體Tsh的指節寬度可為10微米,指節數量為100,電晶體T1的指節寬度可為9.9微米,指節數量為100,且電晶體T2的指節寬度可為0.1微米,指節數量為100。因此,電晶體Tsh的尺寸可為10微米*100指節,電晶體T1的尺寸可為9.9微米*100指節,且電晶體T2的尺寸可為0.1微米*100指節。在另一些實施例中,電晶體Tsh、T1、及T2的尺寸可分別正相關於每個電晶體Tsh、T1、及T2的指節數量,藉以提供簡潔的電路布局及較佳的靜 電放電(electrostatic discharge,ESD)特性。例如,電晶體Tsh的指節寬度為10微米,指節數量為100指節,電晶體T1的指節寬度為10微米,指節數量為99指節,且電晶體T2的指節寬度為10微米,指節數量為1指節。因此電晶體Tsh的尺寸可為10微米*100指節,電晶體T1的尺寸可為10微米*99指節,且電晶體T2的尺寸可為10微米*1指節。 In some embodiments, the size of the transistors Tsh, T1, and T2 may be directly related to the finger width of each transistor Tsh, T1, and T2, respectively. For example, in an embodiment where the size ratio of transistor Tsh, transistor T1 and transistor T2 is 100:99:1, the knuckle width of transistor Tsh can be 10 microns, the number of knuckles is 100, and transistor T1 The knuckle width of T2 may be 9.9 microns and the number of knuckles is 100, and the knuckle width of transistor T2 may be 0.1 microns and the number of knuckles is 100. Therefore, the size of transistor Tsh may be 10 microns*100 knuckles, the size of transistor T1 may be 9.9 microns*100 knuckles, and the size of transistor T2 may be 0.1 microns*100 knuckles. In some other embodiments, the size of transistors Tsh, T1, and T2 can be directly related to the number of fingers of each transistor Tsh, T1, and T2, so as to provide simple circuit layout and better static Electrostatic discharge (ESD) characteristics. For example, transistor Tsh has a knuckle width of 10 microns and a knuckle count of 100 knuckles, transistor T1 has a knuckle width of 10 microns and a knuckle count of 99 knuckles, and transistor T2 has a knuckle width of 10 micron, the number of knuckles is 1 knuckle. Therefore, the size of transistor Tsh may be 10 microns*100 knuckles, the size of transistor T1 may be 10 microns*99 knuckles, and the size of transistor T2 may be 10 microns*1 knuckle.
射頻開關1可切換至狀態S0至S3中之一者,如表1所示:
如表1所示,當射頻開關1切換至狀態S0時,分流子電路14接收-2.5V以被截止,且電晶體T1及電晶體T2亦接收2.5V以被導通,以使射頻開關1具有阻抗Z0,其可等於1/jw(Coff/N),Coff為每個電晶體Tsh截止時的等效電容值,N為電晶體Tsh的數量。當射頻開關1切換至狀態S1時,分流子電路14接收-2.5V以被截止,且電晶體T1及電晶體T2亦接收-2.5V以被截止,以使射頻開關1具有阻抗Z1,其可等於1/jw(Coff/(N+1))。當射頻開關1切換至狀態S2時,分流子電路14接收2.5V以被導通,且電晶體T1及電晶體T2接收2.5V以被導通,以使射頻開關1具有阻抗Z2,其可等於0歐姆。當射頻開關1切換至狀態S3時,分流子電路14接收2.5V以被導通,電晶體T1接收-2.5V以被截止,且電晶體T2接收2.5V以被導通,
以使射頻開關1具有阻抗Z3,其可等於50歐姆,即阻抗Z0至Z3皆相異,且其中之一者可等於50歐姆。阻抗Z3可和負載電阻匹配。例如,阻抗Z3可趨近於50歐姆或75歐姆。阻抗Z1可大於阻抗Z3,且阻抗Z3可大於阻抗Z2。狀態S0,S1可適用於射頻開關1導通時,狀態S2,S3可適用於射頻開關1截止時。當射頻開關1切換至狀態S3以截止時,由於射頻訊號Srf會經由與負載電阻匹配的阻抗Z3而被引導至參考電壓端GND,因此不會產生訊號反射而降低訊號品質。
As shown in Table 1, when the
雖然表1顯示-2.5V用於截止分流子電路14、電晶體T1、及/或電晶體T2,熟習此技藝者可知可使用其他小於-2.5V的電壓來截止分流子電路14、電晶體T1、及/或電晶體T2。此外,雖然表1顯示2.5V用於導通分流子電路14、電晶體T1、及/或電晶體T2,熟習此技藝者可知可使用其他超過電晶體Tsh、電晶體T1、及/或電晶體T2之相應臨界電壓的電壓來導通分流子電路14、電晶體T1、及/或電晶體T2。在一些實施例中,亦可藉由改變控制電壓Vc1,Vc2而使電晶體T1,T2產生狀態S0至S3的阻抗。
Although Table 1 shows that -2.5V is used to cut off the
射頻開關1可於導通或截止時皆提供實質上等於負載電阻之等效電阻,藉以提升訊號品質同時不增加電路面積。
The
第2圖係為本發明實施例中之另一種射頻開關2之電路示意圖。射頻開關2及射頻開關1的差異在於分流開關路徑22之分流子電路26的電晶體T1及電晶體T2各自並聯電阻R1及電阻R2。於分流開關路徑22截止時,電阻1可作為偏壓電阻用來固定電晶體T1第一端與第二端的電位,且電阻2可作為偏壓電阻用來固定電晶體T2第一端與第二端的電位。射頻開關2的運作方式和射頻開關1相似,在此不再贅述。
Fig. 2 is a schematic circuit diagram of another
第3圖係為本發明實施例中之另一種射頻開關3之電路示意圖。射頻開關3及射頻開關1的差異在於分流開關路徑32之分流子電路14及分流子電路16互換位置。分流子電路16的第一端耦接於訊號端10及訊號端18。分流子電路14的第一端耦接於分流子電路16的第二端,且分流子電路14的第二端耦接於參考電壓端GND。射頻開關3的運作方式和射頻開關1相似,在此不再贅述。
Fig. 3 is a schematic circuit diagram of another
第4圖係為本發明實施例中之另一種射頻開關4之電路示意圖。射頻開關4及射頻開關2的差異在於射頻開關4另包含串聯開關路徑40。串聯開關路徑40包含第一端,耦接於訊號端10,及第二端,耦接於訊號端18。訊號端10耦接於天線42,且訊號端18耦接於射頻電路44。射頻電路44可為匹配電路、功率放大器、或其他電路。當串聯開關路徑40導通時,串聯開關路徑40可建立訊號端10及訊號端18之間的耦接以將射頻訊號Srf在訊號端10及訊號端18之間傳送;當串聯開關路徑40截止時,串聯開關路徑40可切斷訊號端10及訊號端18之間的耦接以禁止將射頻訊號Srf在訊號端10及訊號端18之間傳送。天線42的等效電阻及射頻電路44的等效電阻可為實質上相等。串聯開關路徑40可包含並聯之電晶體Tsr及電阻Rsr。電晶體Tsr包含第一端,耦接於訊號端10、第二端,耦接於分流開關路徑22及訊號端18、及控制端,用以接收控制電壓Vcsr,藉以控制電晶體Tsr。電阻Rsh包含第一端,耦接於電晶體Tsr的第一端、及第二端,耦接於電晶體Tsr的第二端。電晶體Tsr可為N型MOSFET。雖然第4圖顯示串聯開關路徑40僅包含1個電晶體Tsr及1個電阻Rsr,在其他實施例中,串聯開關路徑40亦可包含M個電晶體Tsr及M個電阻Rsr,M個電晶體Tsr依序疊接,且每個電阻Rsr耦接於相應疊接電晶體Tsr的第一端及第二端,M為正整數。射頻開關4的運作方式和射頻開關2相似,在此不再贅述。
FIG. 4 is a schematic circuit diagram of another
第5圖係為本發明實施例中之另一種射頻開關5之電路示意圖。射頻開關5及射頻開關4的差異在於串聯開關路徑40的第一端耦接於訊號端18,且串聯開關路徑40的第二端耦接於訊號端10。射頻開關5的運作方式和射頻開關4相似,在此不再贅述。
Fig. 5 is a schematic circuit diagram of another
第6圖係為本發明實施例中之另一種射頻開關6之電路示意圖。射頻開關6係為單軸雙切(single-pole double-throw,SPDT)開關。射頻開關6及射頻開關4的差異在於射頻開關6包含串聯開關路徑401及402、分流開關路徑221及222、及訊號端181及182。串聯開關路徑401及402的電路設置及運作方式和串聯開關路徑40相似,分流開關路徑221及222的電路設置及運作方式和分流開關路徑22相似,在此不再贅述。射頻開關6可接收控制電壓Vc11、Vc21、Vcsh1、Vcsr1、Vc12、Vc22、Vcsh2、Vcsr2以於訊號端10與訊號端181及182中之一者之間形成通路以傳送或接收射頻訊號Srf。當射頻開關6於訊號端10與訊號端181之間形成通路時,串聯開關路徑401導通,分流開關路徑221截止,串聯開關路徑402截止,及分流開關路徑222導通。當射頻開關6於訊號端10與訊號端182之間形成通路時,串聯開關路徑401截止,分流開關路徑221導通,串聯開關路徑402導通,及分流開關路徑222截止。
Fig. 6 is a schematic circuit diagram of another
第7圖係為本發明實施例中之另一種射頻開關7之電路示意圖。射頻開關7及射頻開關5的差異在於射頻開關7包含串聯開關路徑401及402、及訊號端181及182。串聯開關路徑401及402的電路設置及運作方式和串聯開關路徑40相似,在此不再贅述。射頻開關7可接收控制電壓Vc1、Vc2、Vcsh、Vcsr1、Vcsr2以於訊號端10與訊號端181及182中之一者之間形成通路以傳送或接收射頻訊號
Srf,或失能射頻開關7以中斷訊號端10與訊號端181,及中斷訊號端10與訊號端182之間的耦接。當射頻開關7於訊號端10與訊號端181之間形成通路時,串聯開關路徑401導通,串聯開關路徑402截止,且分流開關路徑22截止。當射頻開關7於訊號端10與訊號端182之間形成通路時,串聯開關路徑401截止,串聯開關路徑402導通,且分流開關路徑22截止。當射頻開關7被失能時,串聯開關路徑401截止,串聯開關路徑402截止,且分流開關路徑22導通。
Fig. 7 is a schematic circuit diagram of another
射頻開關1至7可於導通或截止時皆提供實質上等於負載電阻之等效電阻,藉以提升訊號品質同時不增加電路面積。以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The RF switches 1 to 7 can provide an equivalent resistance substantially equal to the load resistance when they are turned on or off, so as to improve the signal quality without increasing the circuit area. The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.
1:射頻開關 1: RF switch
10,18:訊號端 10,18: signal terminal
12:分流開關路徑 12: Shunt switch path
14,16:分流子電路 14,16: shunt sub-circuit
GND:參考電壓端 GND: reference voltage terminal
Srf:射頻訊號 Srf: radio frequency signal
Tsh,T1,T2:電晶體 Tsh, T1, T2: Transistor
Rsh:電阻 Rsh: resistance
Vcsh,Vc1,Vc2:控制電壓 Vcsh, Vc1, Vc2: control voltage
Claims (20)
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| TW110147316A TWI790052B (en) | 2021-12-17 | 2021-12-17 | Radio frequency switch |
| CN202111668799.8A CN116266755A (en) | 2021-12-17 | 2021-12-30 | RF switch |
| US17/688,916 US12184318B2 (en) | 2021-12-17 | 2022-03-08 | Radio frequency switch |
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| TW110147316A TWI790052B (en) | 2021-12-17 | 2021-12-17 | Radio frequency switch |
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| US20250210979A1 (en) * | 2023-12-20 | 2025-06-26 | Richwave Technology Corp. | Electrical overstress protection device and communication system |
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| US20200358427A1 (en) * | 2019-05-08 | 2020-11-12 | Semiconductor Components Industries, Llc | Radio frequency switch |
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| JP3616343B2 (en) | 2001-03-27 | 2005-02-02 | 松下電器産業株式会社 | High frequency switch circuit and communication terminal device using the same |
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| US10320381B2 (en) * | 2015-03-27 | 2019-06-11 | Integrated Device Technology, Inc. | Reduced VSWR switching |
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| CN108736866B (en) | 2017-04-24 | 2021-12-28 | 深圳市中兴微电子技术有限公司 | CMOS SOI radio frequency switch circuit |
| KR102348686B1 (en) * | 2017-08-04 | 2022-01-06 | 삼성전기주식회사 | Radio frequency switch apparatus with integrated shunt and bias |
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| CN113285697B (en) | 2021-05-31 | 2023-04-18 | 电子科技大学 | Matching reconfigurable ultra-wideband single-pole multi-throw radio frequency switch |
| CN113595542B (en) | 2021-09-30 | 2022-01-04 | 成都明夷电子科技有限公司 | Single-pole double-throw radio frequency switch |
| CN115021737A (en) | 2022-05-06 | 2022-09-06 | 夏芯微电子(上海)有限公司 | Radio frequency switch circuit and electronic communication equipment |
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|---|---|---|---|---|
| TWM355469U (en) * | 2008-11-26 | 2009-04-21 | Bcom Electronics Inc | Multi-band-integrated vehicle antenna module in flexible-printed type |
| TWI693742B (en) * | 2018-11-05 | 2020-05-11 | 財團法人工業技術研究院 | Antenna module and surrounding detection radar having the same |
| US20200358427A1 (en) * | 2019-05-08 | 2020-11-12 | Semiconductor Components Industries, Llc | Radio frequency switch |
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| CN116266755A (en) | 2023-06-20 |
| US12184318B2 (en) | 2024-12-31 |
| TW202327289A (en) | 2023-07-01 |
| US20230198565A1 (en) | 2023-06-22 |
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