TWI789768B - Antenna module and manufacturing method thereof and electronic device - Google Patents

Abstract

An antenna module in which an electronic element and an antenna element are separately arranged on an upper side of a supporting structure, wherein the electronic element and the antenna element are covered with an encapsulation layer, and an antenna portion communicatively connected with the antenna element is combined on the surface of the encapsulation layer; moreover, a reflector that is communicatively connected to the antenna element is arranged on the underside of the supporting structure, such that a design of distance between the antenna element and the reflector can be facilitated by arranging the reflector on the underside of the supporting structure. The invention further provides an electronic device equipped with the antenna module.

Description

Antenna module and its manufacturing method and electronic device

The invention relates to an antenna module, especially an antenna module with a reflector and its manufacturing method and electronic device.

With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless transmission communication technology has been widely used in various consumer electronic products. In existing electronic products equipped with antennas, in order to improve the directivity of the antennas, reflectors are usually configured.

FIG. 1 is a schematic cross-sectional view of a conventional electronic device 1 . The electronic device 1 includes a circuit board (PCB) 1b configured with a reflector 15 , and an antenna module 1a mounted on the circuit board 1b via a plurality of solder balls 16 . The antenna module 1a includes a circuit structure 10 combined with these solder balls 16, a radio frequency chip (not shown) that is disposed on the circuit structure 10 and electrically connected to the circuit structure 10, and a radio frequency chip (not shown) that covers the radio frequency chip. The encapsulation layer 13 and the patch antenna (Patch antenna) 14 arranged on the outer surface of the encapsulation layer 13 . The position of the reflector 15 is corresponding to the position of the patch antenna 14, and the circuit structure 10 is wired using a redistribution layer (Redistribution Layer, RDL) process, which is provided with a coplanar waveguide (Coplanar waveguide, CPW for short) and provide antenna grounding function.

In the conventional electronic device 1, since the reflector 15 is arranged on the upper surface of the circuit board 1b below the patch antenna 14, the relevant parameters of the patch antenna 14 (such as impedance matching, bandwidth, and directional characteristics) etc.) need to match the distance D between the patch antenna 14 and the reflector 15 and the height h between the coplanar waveguide and the reflector 15 (that is, the reliable height h of the solder ball 16).

However, in the process of installing the antenna module 1a to the circuit board 1b, it is often difficult to control the height of the solder ball 16, resulting in the inability to effectively control the distance D, so the electrical properties of the patch antenna 14 The error of parameters often exceeds the reasonable range.

Furthermore, the antenna module 1a is fixed on the circuit board 1b through the solder ball 16, which is limited by the reliability of the solder ball 16, that is, the reliable height h of the solder ball 16 limits the distance D. For example, it is not easy to control the average value and tolerance of the volume and height of the solder balls 16 . Specifically, when the average volume of the solder ball 16 is too small or the average height is low, it is not conducive to supporting the antenna module 1a; on the contrary, when the average volume of the solder ball 16 is too large or the average height When it is high, two adjacent solder balls 16 are prone to bridging (bridge) phenomenon to cause a short circuit, and the grid array (grid array) formed by the solder balls 16 is likely to have poor co-planarity (co-planarity), resulting in poor connection. Unbalanced point stress easily causes damage to the antenna module 1a. Therefore, the size of the solder ball 16 is not easy to control, so the bandwidth of the patch antenna 14 is limited by the reliable height h of the solder ball 16 , making it difficult to design other bandwidths.

Also, because the layout space of the circuit board 1b is limited, disposing the reflector 15 on the circuit board 1b will limit the layout space of other functional components, which is not conducive to increasing the function of the electronic device 1, resulting in the electronic device 1 It is difficult to meet the needs of multi-function.

Therefore, how to overcome the various problems of the above-mentioned conventional technologies has become a problem to be urgently overcome in the industry.

In view of the problems in the prior art, the present invention provides an antenna module, which includes: a load-bearing structure with opposite first and second sides; electronic components are arranged on the first side of the load-bearing structure and Electrically connecting the carrying structure; the antenna element is arranged on the first side of the carrying structure; the encapsulation layer is arranged on the first side of the carrying structure to cover the electronic element and the antenna element ; the antenna part is arranged on the encapsulation layer and communicated with the antenna element; and the reflector is arranged on the second side of the supporting structure and communicated with the antenna element.

The present invention also provides a method for manufacturing an antenna module, the steps include: providing a load-bearing structure, the load-bearing structure has a first side and a second side opposite to each other; placing electronic components and antenna elements on the first side of the load-bearing structure , and the electronic component and the antenna element are electrically connected to the carrying structure; an encapsulation layer is formed on the first side of the carrying structure, wherein the encapsulation layer covers the electronic component and the antenna element; on the carrying structure An antenna part is arranged on the encapsulation layer, and the antenna part is connected to the antenna element in communication; and a reflector connected to the antenna element in communication is arranged on the second side of the carrying structure.

In the aforementioned antenna module and its manufacturing method, the antenna element has an antenna layer electrically connected to the load-bearing structure and communicatively connected to the antenna portion, the antenna portion includes an antenna body communicatively connected to the antenna element, and the antenna The position of the body and the position of the reflector correspond to the position of the antenna element, and the carrying structure is configured with a coplanar waveguide.

In the aforementioned antenna module and its manufacturing method, the reflector is formed by bonding layers to the second side of the load-bearing structure.

In the aforementioned antenna module and its manufacturing method, the reflector is disposed on the intermediary board, and the intermediary board is combined with the second side of the carrying structure.

The present invention further provides an electronic device, which includes: a circuit board; and the aforementioned antenna module, wherein the second side of the carrying structure of the antenna module is stacked on the circuit board through a plurality of conductive elements.

It can be seen from the above that the antenna module and its manufacturing method and electronic device of the present invention mainly set the reflector on the second side of the supporting structure so that the distance of the antenna parameters can be determined by the packaging process of the antenna module , without considering the size of the height of the conventional solder ball (or the conductive element of the present invention), so compared with the conventional technology, the error of the electrical parameters of the antenna portion of the present invention can be controlled within a reasonable range.

Furthermore, since the bandwidth of the antenna part of the present invention depends on the distance between the antenna element and the reflector, compared to the conventional technology, even the conventional solder ball (or the conductive element of the present invention) If the height changes, the bandwidth of the antenna will not change accordingly.

Also, based on the limited layout space of the circuit board, by placing the reflector on the second side of the carrying structure, the circuit board does not need to consider the configuration of the reflector, so compared with the prior art, this The circuit board of the electronic device of the invention can be provided with additional space for the arrangement of other functional components as required, so as to increase the functions of the electronic device and make the electronic device meet the multi-functional requirements.

1, 3a, 3b: Electronic devices

1a, 2, 3: Antenna module

1b, 2b: circuit board

10: Line structure

13, 23: encapsulation layer

14: Patch type antenna

15, 25: reflector

16: Solder ball

2a: Antenna structure

20: Bearing structure

20a: First side

20b: Second side

200: insulating layer

201: line layer

21: Electronic components

21a: Action surface

21b: Non-active surface

210, 220, 350: conductive bumps

22: Antenna element

22a: Antenna layer

24: Antenna

24a: Antenna body

24b: Inclusion

240: dielectric layer

242: insulating protective layer

250: bonding layer

26: Conductive element

35:Intermediate board

35a: first surface

35b: second surface

9: Support

90: Adhesive layer

A: The first area

B: the second area

D, H: distance

h: height

P1, P2: vertical projected area

T1, T2: Thickness

FIG. 1 is a schematic cross-sectional view of a conventional electronic device.

FIG. 2 is a schematic cross-sectional view of the antenna module according to an embodiment of the present invention.

3A to 3E are schematic cross-sectional views of a manufacturing method of an antenna module according to an embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of an antenna module according to another embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention.

The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "above", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the present invention. The change or adjustment of the relative relationship shall also be regarded as the applicable scope of the present invention if there is no substantial change in the technical content.

FIG. 2 is a schematic cross-sectional view of the antenna module according to an embodiment of the present invention. As shown in FIG. 2 , the antenna module 2 at least includes: a carrier chip 20 , an electronic component 21 , an antenna element 22 , a packaging layer 23 , an antenna portion 24 and a reflector 25 .

The carrying structure 20 has a first side 20a and a second side 20b opposite to each other.

The electronic component 21 is disposed on the first side 20 a of the carrying structure 20 and is electrically connected to the carrying structure 20 .

The antenna element 22 is also disposed on the first side 20 a of the carrying structure 20 , and the antenna element 22 is configured separately from the electronic element 21 .

The packaging layer 23 is disposed on the first side 20 a of the carrying structure 20 and covers the electronic component 21 and the antenna component 22 .

The antenna part 24 has an antenna body 24 a covered by an insulating material, disposed on the encapsulation layer 23 , and communicated with the antenna element 22 .

The reflector 25 is disposed on the second side 20 b of the carrying structure 20 and communicated with the antenna element 22 .

According to an embodiment of the present invention, the antenna module 2 of the present invention mainly sets the reflector 25 on the second side 20b of the supporting structure 20 so that the distance of the antenna parameters (that is, the antenna element 22 and the reflector The distance H) between 25 can be determined by the packaging process of the antenna module 2 without considering the size of the height h of the conventional solder ball (conductive element 26 as shown in FIG. 2 ), so compared with the conventional technology, The errors of the electrical parameters of the antenna body 24a of the antenna part 24 of the present invention can be controlled within a reasonable range.

Furthermore, since the bandwidth of the antenna body 24a of the antenna part 24 depends on the distance H between the antenna element 22 and the reflector 25, compared to the conventional technology, even if the solder ball If the height h of the antenna body 24a changes, the bandwidth of the antenna body 24a will not change accordingly.

3A to 3E are schematic cross-sectional views of a manufacturing method of an antenna module according to an embodiment of the present invention.

As shown in FIG. 3A , a carrying structure 20 is disposed on a supporting member 9 . The bearing structure 20 has opposite first side 20a and second side 20b, the bearing structure 20 is combined with the support member 9 by the second side 20b, and the first side 20a is defined with adjacent first Area A and the second area B. In addition, at least one electronic component 21 is disposed on the first area A of the first side 20a of the carrying structure 20, and at least one antenna element 22 is disposed on the second area B of the first side 20a of the carrying structure 20, The antenna element 22 is arranged separately from the electronic element 21 .

In this embodiment, the carrier structure 20 further includes an insulating layer 200 and at least one circuit layer 201 formed on the insulating layer 200, such as at least one fan-out (fan out) redistribution layer (redistribution layer, RDL for short) ). In addition, the wiring layer 201 is made of copper, and the insulating layer 200 can be made of polybenzoxazole (PBO for short), polyimide (PI for short), prepreg (Prepreg, Referred to as PP) and other dielectric materials.

Furthermore, the supporting member 9 can be a plate made of semiconductor material (such as silicon or glass), and an adhesive layer 90 is formed on it, so that the carrying structure 20 is pasted on the adhesive layer 90 .

Moreover, the electronic component 21 can be an active component (such as a semiconductor chip, etc.), a passive component (such as a resistor, a capacitor, and an inductor, etc.) or a combination thereof. For example, when the electronic component 21 is a semiconductor chip (such as a radio frequency chip (Radio Frequency Integrated Circuits, referred to as RFID)), it has a relative active surface 21a and a non-active surface 21b. The electronic component 21 A plurality of conductive bumps 210 such as solder materials are flip-chip disposed on the circuit layer 201 and electrically connected to the circuit layer 201; or, the electronic component 21 can also be connected to the circuit layer 201 by a plurality of bonding wires (not shown). The circuit layer 201 is electrically connected by wire bonding; or, the electronic component 21 can directly contact the circuit layer 201 . However, the manner in which the electronic component 21 is electrically connected to the carrying structure 20 is not limited to the above.

In addition, this antenna element 22 is a semiconductor element and has an antenna layer 22a. For example, when the antenna element 22 is a chip specification, the antenna layer 22a is provided on the circuit layer 201 in a flip-chip manner by a plurality of conductive bumps 220 such as solder materials and is electrically connected to the circuit layer 201; or, the The antenna layer 22a of the antenna element 22 can be electrically connected to the circuit layer 201 by a plurality of bonding wires (not shown); or, the antenna layer 22a of the antenna element 22 can directly contact the circuit layer 201 . However, the manner in which the antenna layer 22a of the antenna element 22 is electrically connected to the carrying structure 20 is not limited to the above.

As shown in FIG. 3B , an encapsulation layer 23 is formed on the first side 20 a of the carrying structure 20 , and the encapsulation layer 23 covers the electronic component 21 and the antenna element 22 .

In this embodiment, the packaging layer 23 is an insulating dielectric material, such as ABF (Ajinomoto Build-up Film), photosensitive resin, polyimide (polyimide, referred to as PI), bismaleimide triazine (Bismaleimide Triazine, referred to as BT), FR5 prepreg (Prepreg, referred to as PP), dry film (dry film), epoxy resin (epoxy), molding resin (molding compound), molding epoxy resin (Epoxy Molding Compound, EMC for short) or other suitable materials can be formed on the first side 20a of the carrying structure 20 by lamination or molding.

As shown in FIG. 3C, an antenna part 24 is formed on the encapsulation layer 23, and the antenna The line portion 24 includes a dielectric layer 240 formed on the encapsulation layer 23 and an antenna body 24 a formed on the dielectric layer 240 .

In this embodiment, the antenna body 24 a can be a patch antenna (Patch antenna), which is pasted on the dielectric layer 240 . In other embodiments, a metal layer may also be formed by electroplating, chemical coating, physical vapor deposition, sputtering or other suitable methods to serve as the antenna body 24a.

Furthermore, the antenna body 24a and the antenna layer 22a are connected in communication with each other (such as signal inductive coupling). For example, the position of the antenna body 24a corresponds to the position of the antenna element 22, that is, the two are aligned up and down in the second region B of the first side 20a.

Moreover, the encapsulation layer 23 and the dielectric layer 240 can be made of the same or different materials, and there is no special limitation.

As shown in FIG. 3D, the antenna part 24 can include an insulating protective layer 242 covering the antenna body 24a as required, and remove the support member 9 and the adhesive layer 90 on it to expose the second part of the carrying structure 20. side 20b.

In this embodiment, the adhesive layer 90 can be a release film to facilitate removal of the support member 9 .

Furthermore, the insulating protection layer 242 is a dielectric material, which is formed on the dielectric layer 240, so the insulating protection layer 242 and the dielectric layer 240 can be regarded as a whole, and can be used as a covering body 24b to cover Cover the antenna body 24a.

As shown in FIG. 3E, at least one reflector (reflector) 25 communicatively connected to the antenna element 22 is arranged on the second side 20b of the carrier structure 20, so that the antenna element 22, the antenna portion 24 and the reflector 25 serve as an antenna structure 2a, and make the part of the load-bearing structure 20 The circuit layer 201 is used as a coplanar waveguide (CPW) of the antenna structure 2a, and part of the circuit layer 201 is a ground circuit connecting the electronic component 21 and the antenna layer 22a to provide the grounding function of the antenna structure 2a.

In this embodiment, the reflector 25 and the antenna layer 22a are inductively coupled to each other. For example, the position of the reflector 25 corresponds to the position of the antenna element 22, that is, the two are vertically aligned with respect to the first side 20a.

Furthermore, the reflector 25 is bonded to the second side 20b of the carrying structure 20 through a bonding layer 250 . For example, the reflector 25 is a metal sheet, and the bonding layer 250 is an adhesive film, such as a die attach film (DAF for short).

Or, in the antenna module 3 as shown in FIG. The element 25 is arranged on the second side 20b of the carrying structure 20 . For example, the interposer 35 has opposite first surface 35a and second surface 35b, the interposer 35 is stacked on the second side 20b of the carrier structure 20 by a plurality of conductive bumps 350 such as solder material, and the interposer 35 The reflector 25 can be formed on the second surface 35b of the interposer 35 by electroplating, chemical coating, physical vapor deposition, sputtering or other suitable methods. It should be understood that by disposing the reflector 25 on the second surface 35b of the interposer 35, the distance between the reflector 25 and the carrier structure 20 provided with the coplanar waveguide is longer, thereby obtaining Better resonance effect.

Preferably, the interposer 35 is a semiconductor structure, such as a silicon wafer, and its size and structure can adopt the size and structure of the antenna element 22 according to requirements, that is, both are chip specifications, so as to facilitate the manufacture of the interposer 35 and Save production cost. It should be understood that the reflector 25 can be electrically connected or not electrically connected to the circuit in the interposer 35 as required.

Since the reflector 25 is arranged on the second side 20b of the load-carrying structure 20 below the antenna element 22, the relevant parameters (such as impedance matching, bandwidth, directional characteristics, etc.) of the antenna structure 2a (or the antenna body 24a) are Match the distance between the antenna element 22 and the coplanar waveguide and the reflector 25 .

Also, as shown in FIG. 3E, since the vertical projected area P1 of the reflector 25 relative to the first side 20a of the carrying structure 20 is greater than the vertical projected area of the antenna body 24a relative to the first side 20a of the carrying structure 20 P2, so that the reflector 25 can effectively reflect the signal from the antenna body 24a passing through the antenna element 22, so that the signal directivity of the antenna body 24a can be improved, so that the radiation direction of the antenna body 24a can face the desired direction.

In addition, a plurality of conductive elements 26 such as solder balls can be planted on the second side 20b of the carrying structure 20, which are electrically connected to the circuit layer 201 of the carrying structure 20, so that the antenna module 2 can pass through these conductive elements. The component 26 is externally connected to other objects. For example, following the manufacturing process shown in FIG. 3E, the antenna module 2 is bonded to a circuit board 2b via a conductive element 26 to obtain an electronic device 3a as shown in FIG. 4, wherein the reflector 25 is located on the carrier Between the second side 20b of the structure 20 and the circuit board 2b, and the reflector 25 is not in contact with the circuit board 2b. It should be understood that if the process shown in FIG. 5 is continued, the electronic device 3 b shown in FIG. 6 will be obtained.

Therefore, the electronic devices 3a, 3b of the present invention mainly set the reflector 25 on the second side 20b of the supporting structure 20, so that the distance H used to match the antenna parameters can be controlled by the antenna modules 2, 3 The packaging process is determined without considering the height h of the conductive element 26 (that is, without considering the process of installing the antenna modules 2, 3 on the circuit board 2b). Further, during the manufacturing process of the antenna modules 2 and 3 of the present invention, because the carrying structure 20 and the encapsulation layer 23 are not easily deformed, it is very easy to control the thicknesses T1 and T2 of the two, so that the antenna element 22 and the reflector can be effectively controlled. The distance H between the radiation elements 25, so compared with the conventional technology, the error of the electrical parameters of the antenna structure 2a (or the antenna body 24a) will not exceed a reasonable range.

It should be understood that since the thicknesses of the dielectric layer 240 and the bonding layer 250 are easy to control, and the interposer 35 has a rigid structure and is not easily deformed, and even the conductive bumps 220, 350 are extremely small, the interposer The electrical layer 240 , the bonding layer 250 , the intermediate board 35 and the conductive bumps 220 , 350 are difficult to change the distance H between the antenna element 22 and the reflector 25 .

Moreover, since the bandwidth of the antenna structure 2a (or the antenna body 24a) is determined by the distance H between the antenna element 22 and the reflector 25, by setting the reflector 25 on the carrying structure 20 On the second side 20b, even if the antenna modules 2 and 3 are fixed on the circuit board 2b through the conductive element 26 (such as solder material), the solder structure characteristics of the conductive element 26 will not change the antenna element 22 and the distance H between the reflector 25. Therefore, no matter whether the height h of the conductive element 26 is designed to meet a reliable height, the conductive element 26 will not limit the design of the bandwidth of the antenna structure 2a (or the antenna body 24a).

Also, based on the limited layout space of the circuit board 2b, by placing the reflector 25 on the second side 20b of the carrying structure 20, the circuit board 2b does not need to consider the configuration of the reflector 25, so compared with In the prior art, the circuit board 2b of the electronic device 3a, 3b of the present invention can increase the layout space of other functional components according to the demand, so as to increase the function of the electronic device 3a, 3b, so that the electronic device 3a, 3b can meet multiple requirements. Functional requirements.

In addition, the present invention further provides an electronic device 3a, 3b, which includes: a circuit board 2b and an antenna module 2, 3 stacked on the circuit board 2b

The antenna modules 2 and 3 are stacked on the circuit board 2b with the second side 20b of the carrying structure 20 via a plurality of conductive elements 26, and the reflector 25 is not in contact with the circuit board 2b.

In one embodiment, the plurality of conductive elements 26 are solder balls.

In one embodiment, the plurality of conductive elements 26 are electrically connected to the circuit board 2 b and the circuit layer 201 of the carrying structure 20 .

To sum up, the antenna module and its manufacturing method and electronic device of the present invention are designed by placing the reflector on the second side of the load-bearing structure to increase the reflector and the load-bearing structure with coplanar waveguide. And the distance between the antenna elements, so better resonance effect can be obtained.

Furthermore, since the present invention does not need to arrange the reflector on the circuit board, it can avoid restricting the layout design of the circuit board, so the application of the electronic device of the present invention can be more extensive.

The above-mentioned embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of the patent application described later.

2: Antenna module

20: Bearing structure

20a: First side

20b: Second side

21: Electronic components

22: Antenna element

22a: Antenna layer

23: Encapsulation layer

24: Antenna

24a: Antenna body

25: reflector

250: bonding layer

26: Conductive element

h: height

H: distance

Claims (10)

An antenna module, comprising: a load-bearing structure having opposite first and second sides; an electronic element arranged on the first side of the load-bearing structure and electrically connected to the load-bearing structure; an antenna element is Set on the first side of the carrying structure; the encapsulation layer is set on the first side of the carrying structure to cover the electronic component and the antenna element; the antenna part is set on the encapsulation layer and communicatively connected to the antenna element; and a reflector disposed on the second side of the supporting structure and communicatively connected to the antenna element. The antenna module according to claim 1, wherein the antenna element has an antenna layer electrically connected to the carrying structure and communicatively connected to the antenna portion, and the carrying structure is configured with a coplanar waveguide. The antenna module as described in Claim 1, wherein the antenna part includes an antenna body communicatively connected to the antenna element, and the position of the antenna body and the position of the reflector overlap with the position of the antenna element on the vertical projection . The antenna module as claimed in claim 1, wherein the reflector is bonded to the second side of the carrying structure through a bonding layer. The antenna module as claimed in claim 1, wherein the reflector is disposed on an intermediary board by combining the intermediary board to the second side of the carrying structure. A method of manufacturing an antenna module, the steps include: providing a load-bearing structure, the load-bearing structure has a first side and a second side opposite to each other; An electronic element and an antenna element are arranged on the first side of the carrying structure, and the electronic element and the antenna element are electrically connected to the carrying structure; an encapsulation layer is formed on the first side of the carrying structure, wherein the encapsulation A layer covers the electronic component and the antenna element; an antenna part is arranged on the packaging layer of the carrier structure, and the antenna part is communicatively connected to the antenna element; and a communication connection is arranged on the second side of the carrier structure. The reflector of the antenna element. The manufacturing method of the antenna module according to claim 6, wherein the antenna element has an antenna layer electrically connected to the load-carrying structure and communicatively connected to the antenna part, and the antenna part includes an antenna body communicatively connected to the antenna element , and the position of the antenna body and the position of the reflector overlap with the position of the antenna element on the vertical projection, and the carrying structure is configured with a coplanar waveguide. The manufacturing method of the antenna module according to claim 6, wherein the reflector is bonded to the second side of the carrying structure through a bonding layer. The manufacturing method of the antenna module as claimed in claim 6, wherein the reflector is disposed on an intermediary board, and the intermediary board is bonded to the second side of the supporting structure. An electronic device, comprising: a circuit board; and the antenna module as described in any one of claims 1 to 5, wherein the second side of the carrying structure of the antenna module is stacked on the on this circuit board.

Images