TWI788970B - Probe card for integratedly inspecting different electrical characteristics - Google Patents

Abstract

A probe card capable of inspecting different electrical characteristics of a DUT comprises a plurality of probes comprising at least one impedance-matching probe and a plurality of cantilever probes and a probe base. The probe base having a DUT side and a tester side opposite to the DUT side comprises a PCB substrate having a first surface facing the DUT side, a second surface facing the tester side, and a first through hole passing through the first and second surfaces, and a supporting substrate having a third surface facing the DUT side, and a fourth surface facing the tester side and a second through hole passing through the third and fourth surfaces. The supporting substrate is arranged at the PCB substrate so that the fourth surface faces the first surfaces and the second through hole is corresponding to the first through hole, wherein the dimension of the first through hole is larger than the dimension of the second through hole. Each impedance-matching probe passes through the first through hole and is arranged at the fourth surface of the supporting substrate. A probing part of each impedance-matching probe passes through the second through hole, and one end of a cantilever segment of each cantilever probe is electrically connected to the first surface of the PCB substrate, wherein another end of the cantilever segment is correspondingly connected to a needle segment of each cantilever probe such that the needle segment of each cantilever is arranged at the DUT side of the second through hole.

Description

Integrate probe cards for different electrical tests

The present invention relates to a probe card, in particular to a probe card with layouts of impedance matching probes and cantilever probes for performing different electrical tests on objects to be tested.

Due to the miniaturization of electronic components, after the semiconductor manufacturing process, it is necessary to test whether there is any problem in signal transmission through testing to determine the quality of electronic components. Generally speaking, to test whether the electrical connection between the various electronic components in an electronic product is correct, or whether there is a problem with signal transmission, the probe card is usually used as the test interface between the test device and the electronic device under test, by Signal transmission and electrical signal analysis to obtain the test results of the electronic device under test.

With the improvement of communication technology, conventional probe cards to test single electrical characteristics of electronic components, such as: signal characteristics, such as: DC or AC, etc., or radio frequency (RF) characteristic testing, are no longer sufficient to cope with current communication components or RF components testing needs. Although there is equipment for testing communication components or radio frequency components in the conventional technology, the electrical test of the equipment for communication components or radio frequency components still separates the signal characteristic test from the radio frequency characteristic test, for example, the first probe is used for the signal characteristic test Card, the cantilever probe card is used for RF characteristic testing, so two probe cards must be used interchangeably, which increases the test time and affects the test efficiency of the production line.

In the prior art, the technology teaches integrating two kinds of probes on a probe card, so as to detect the electrical parameters and the radio frequency parameters of the radio frequency components at the same time. Although this technology teaches the integration of two kinds of probes, generally speaking, the probes have a depth specification, counting from the lower edge of the PCB circuit substrate, and there are also length requirements for the RF probes used in this technology. The problem of easily meeting the length specification of the probe. In addition, because the assembly method of the RF probe will make the length of the probe part longer, once the RF probe becomes longer, the position of the needle tip will be difficult to control, and the contact resistance between the RF probe and the object under test will also change. bad question.

In order to solve the above-mentioned problems, the present invention conceives a probe card, which has an impedance matching probe for testing radio frequency characteristics and a cantilever probe for supplying other signals to test the radio frequency characteristics of the object under test or simultaneously test the radio frequency characteristics and signal characteristics. At the same time, the perforation of the circuit substrate is set larger than the perforation of the fixed substrate, so that the impedance matching probe on the fixed substrate can pass through the perforation of the circuit substrate, and the fixed substrate (from bottom to top) is arranged on the lower surface of the circuit substrate, so that The upper surface of the fixed substrate provided with the impedance matching probe is lower than the upper surface of the circuit substrate.

The probe card of the present invention can test the signal characteristic contact and the radio frequency characteristic signal contact on the same side of the object under test, so as to speed up the test and improve the efficiency of testing the object under test. At the same time, the through hole of the circuit substrate is set larger than the through hole of the fixed substrate, so that the impedance matching probe on the fixed substrate can pass through the through hole of the circuit substrate, and the fixed substrate (from bottom to top) is arranged on the lower surface of the circuit substrate. Since the impedance matching probe (body) is placed on the upper surface of the fixed substrate, which is lower than the upper surface of the circuit substrate, the length of the probe part of the impedance matching probe can be made, because the circuit is less The thickness of the substrate can be shortened. Therefore, the position of the tip of the probe portion becomes easy to control, thereby improving the problem of poor contact resistance with the object under test. Therefore, it is easy to meet the probe length specification, and then it is easy to meet the requirement of impedance matching probe assembly.

In one embodiment, the present invention provides a probe card integrating different electrical tests for testing the electrical properties of the object under test. The probe card includes a plurality of probes and a probe base. The plurality of probes includes at least one impedance matching probe and a plurality of cantilever probes. The probe base has a side of the object under test and a testing machine side corresponding to the side of the object under test, and the probe base includes a circuit substrate and a fixed substrate. The circuit substrate has a first surface facing the object to be tested, a second surface facing the testing machine, and a first through hole passing through the first surface and the second surface. The fixed substrate has a third surface facing the object to be tested, a fourth surface facing the testing machine, and a second through hole passing through the third surface and the fourth surface. The fixed substrate is arranged on the circuit substrate with the fourth surface facing the first surface, the second through hole corresponds to the first through hole, and the aperture of the first through hole is larger than the aperture of the second through hole, and the at least one impedance matching probe The first through hole is arranged on the fourth surface of the fixed substrate, the probe portion of each impedance matching probe passes through the second through hole, and one end of the cantilever section of each cantilever probe is electrically connected to the first surface of the circuit substrate. The other end of the cantilever section of each cantilever probe is connected to the tip section of each cantilever probe, and the tip section of each cantilever probe is arranged on the side of the object to be tested in the second through hole.

Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which some exemplary embodiments are shown. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Like numbers indicate like elements throughout. The probe card integrating different electrical tests of the present invention will be described below with various embodiments and drawings, however, the following embodiments are not intended to limit the present invention.

Please refer to FIG. 1A and FIG. 1B , wherein FIG. 1A is an exploded perspective view of an embodiment of the probe card of the present invention, and FIG. 1B is a schematic top view of an embodiment of the probe card of the present invention. In this embodiment, the probe card 2 includes a probe base 20 , at least one set of anti-matching probes 21 a - 21 c and a plurality of cantilever probes. The probe base 20 has a test machine side A and a test object side B corresponding to the test machine side A. In this embodiment, the test machine side A is located above the probe base 20, and the test object side B is located on the probe base. 20 below. The probe base 20 includes a circuit substrate 201 , a fixed substrate 200 , and a positioning structure 202 . The circuit substrate 201 has a first surface 201e facing the test object side A, a second surface 201f facing the testing machine side, and a first through hole 201a passing through the first surface 201e and the second surface 201f.

The fixing substrate 200 is a substrate made of a metal material in this embodiment, but not limited to the metal material. The fixed substrate 200 has a third surface 200a on the side B of the test object, a fourth surface 200b on the side A of the testing machine, and a second through hole 200c passing through the first and fourth surfaces 200a and 200b. In this embodiment, the fourth surface 200b of the fixed substrate 200 is further provided with a plurality of reinforcing structures 200s and 200t, which are arranged between the impedance matching probes 21a-21c. In this embodiment, the reinforcing structures 200s and 200t extend radially from the position close to the first through hole 201a to the outer periphery of the fixed substrate 200, wherein the reinforcing structures 200s are a pair of rectangular parallelepiped structures, which are respectively arranged on the impedance matching probes. 21c, and the reinforcing structure 200t is a sector-like structure, which is arranged on one side of the impedance matching probes 21a and 21b, so that the impedance matching probes 21a and 21b are located between the reinforcing structures 200s and 200t. Since the fixed substrate 200 is disposed on the first surface 201e of the circuit substrate 201, the thickness of the fixed substrate 200 is limited in order to avoid too long impedance matching probes fixed on the fourth surface 200b, and the thinner the better. However, the thinner the fixed substrate 200 is, the easier it is to deform. Therefore, providing the reinforcing structures 200s and 200t on the fixed substrate 200 can increase the rigidity of the fixed substrate 200 itself and reduce the deformation rate of the fixed substrate 200 . The fixed substrate 200 is disposed on the circuit substrate 201 with the fourth surface 200b facing the first surface 201e, the second through hole 200c corresponds to the first through hole 201a, and the diameter of the first through hole 201a is larger than that of the second through hole 200c. In this embodiment, the fourth surface 200 b of the fixed substrate 200 is lower than the second surface 201 f of the circuit substrate 201 .

The probe base 20 has a plurality of bearing bases 200d-200f respectively disposed on the fourth surface 200b of the fixed substrate 200, and each bearing base 200d-200f corresponds to one of the impedance matching probes 21a-21c. There is at least one positioning plate 200g-200i around each bearing seat 200d-200f. In this embodiment, the positioning plate 200g-200i is arranged adjacent to each bearing seat 200d-200f, so as to limit the positioning on the bearing seat 200d-200f. One of the impedance matching probes 21a-21c. By using the positioning plates 200g-200i, it is possible to prevent the bearing seats 200d-200f from moving due to external forces. Each bearing seat 200d~200f is a T-shaped structure when viewed from above. Each of the bearing seats 200d-200f has a top surface 200j and sidewalls 200k-200r, and the sidewalls 200k-200r respectively surround the top surface 200j.

Wherein, the side wall portion 200k is corresponding to the probe portion 210 of the impedance matching probe disposed thereon, and the side wall portion 200l is located on the opposite side of the bearing seat 200d-200f relative to the side wall portion 200k, and is far away from the probe portion disposed thereon. The probe part 210 of the impedance matching probes 21a-21c. The side wall portions 200m, 200o, and 200q are located on the same side, and the side wall portions 200n, 200p, and 200r are located on one side. The side wall portions 200m, 200o, 200q, and the side wall portions 200n, 200p, and 200r are respectively located between the side wall portion 200k and the side wall portion 200l, and are adjacent to the side wall portion 200k, wherein at least one positioning plate 200g~200i is adjacent to the side wall portion 200l, At least one of the side wall portion 200m and the side wall portion 200n. The adjacent arrangement can be that at least one positioning plate 200g~200i is directly arranged on at least one of the side wall portion 200l, the side wall portion 200m, and the side wall portion 200n, or at least one positioning plate 200g~200i is indirectly arranged on the side wall portion 200l, the side wall portion 200m and at least one of the side wall portion 200n. The direct setting refers to the direct contact without gap between the positioning plate 200g and the side wall portion 200n, the direct contact without gap between the positioning plate 200h and the side wall portion 200m, and the direct contact without gap between the positioning plate 200i and the side wall portion 200l. Indirect setting means that each positioning plate 200g~200i is in indirect contact with the corresponding side wall portion 200l, side wall portion 200m, and side wall portion 200n through a spacer, such as a screw, so that there is a gap between the positioning plate 200g and the side wall portion 200n, and positioning There is a gap between the plate 200h and the side wall portion 200m, and there is a gap between the positioning plate 200i and the side wall portion 200l. In this embodiment, the side wall portions 200l-200n are all corresponding to the positioning plates 200g-200i.

In FIG. 1A, each positioning plate 200g-200i is higher than the top surface 200j of the corresponding bearing seat 200d-200f, so that the end surface TA of each positioning plate 200g-200i is set to protrude from the top surface 200j. After the bearing seats 200d-200f are installed and fixed to the fixed base plate 200, the bearing seats 200d-200f that have been positioned and fixed may be affected by external forces due to subsequent assembly processing or testing of the object to be tested. Therefore, positioning plates 200g-200i need to be set to limit the positions of the bearing seats 200d-200f, so as to prevent the bearing seats 200d-200f from being affected by external forces to cause position deviation. In this embodiment, there are a plurality of notches 201b~201d around the first through hole 201a corresponding to the bearing seats 200d~200f respectively. When the circuit substrate 201 is assembled on the fixed substrate 200, the bearing seats 200d~200f and the corresponding positioning The plates 200g~200i pass through the corresponding notches 201b~201d, respectively.

The positioning structure 202 is disposed on the side B of the object to be tested and connected to the third surface 200 a of the fixed substrate 200 , and the positioning structure 202 has a through hole 202 a. In this embodiment, the positioning structure 202 is a structure formed of an insulating material, such as a ceramic material. The through hole 202a is in the shape of a cross, which is determined according to the needs of users, and is not limited to the shape shown in the figure. When the positioning structure 202 is assembled on the third surface 200a of the fixed substrate 200, the through hole 202a corresponds to the first through hole 201a and the second through hole 200c. A plurality of impedance matching probes 21a~21c are respectively arranged on the bearing bases 200d~200f, wherein the impedance matching probes 21a are arranged on the bearing base 200f, the impedance matching probes 21b are arranged on the bearing base 200e, and the impedance matching probes 21c is disposed on the bearing seat 200d.

In this embodiment, each impedance matching probe 21 a - 21 c is disposed on the fourth surface 200 b of the fixed substrate 200 through the first through hole 201 a. Each of the impedance matching probes 21 a - 21 c has a probe portion 210 , a signal transmission portion 211 connected to the probe portion 210 , and a structural body 212 . The probe part 210 has at least two needle tip segments, the signal transmission part 211 has a probe central axis CL1, one end of the signal transmission part 211 is located on the testing machine side A of the circuit substrate 201 and is higher than the second surface 201f, and the signal transmission part 211 passes through The first through hole 201 a and the second through hole 200 c make at least two tip segments of the probe part 210 located on the side B of the fixed substrate 200 to be tested and lower than the third surface 200 a. Taking the probe base 21a as an example, the probe part 210 has at least two tip segments 2100. In one embodiment, the tip segment 2100 can be divided into one SG tip for signal and one ground, one GSG tip for signal and two ground, The two-signal and two-ground GSSG tip or the two-signal and three-ground GSGSG tip is determined according to the application requirements, and there is no certain limit. The probe part 210 is a structure formed by semiconductor manufacturing process, and is coupled to the signal transmission part 211 . In this embodiment, the probe part 210 has three sub-probes 210a, 210b and 210c. Each sub-probe 210a, 210b, and 210c has a tip section 2100 and a connection section 2101, wherein one end of the tip section 2100 is used to make electrical contact with the electrical contact of the object to be tested, and the other end of the tip section 2100 is connected to the connection section 2101. The segment 2101 is connected, and the connecting segment 2101 is coupled with the signal transmission part 211 . The tip segment 2100 is a structure formed by using a microelectromechanical systems (MEMS) process.

In this embodiment, the signal transmission part 211 includes an inner conductor, a dielectric layer covering the inner conductor, and an outer conductor 2110 covering the dielectric layer, wherein the signal transmission part 211 is a semi-rigid coaxial cable. The inner conductor and the outer conductor 2110 are respectively coupled to the connection section 2101 . One end of the signal transmission part 211 is located on the testing machine side A of the circuit substrate 201 and is higher than the second surface 201f. The signal transmission part 211 passes through the first through hole 201a and the second through hole 200c, so that the at least two tip segments of the probe part 210 are located on the side A of the fixed substrate 200 and lower than the third surface 200a.

The structural body 212 of each impedance matching probe 21 a - 21 c has a plurality of fixing through holes 2120 corresponding to the fixing through holes 2001 on the bearing seat 200 f. The fixing element 91 , such as a screw or a bolt, can pass through the fixing through hole 2001 and the fixing through hole 2120 to lock the structural body 212 on the corresponding bearing seat 200f. The structural body 212 has a signal connection connector 2121 electrically connected to the signal transmission part 211 . In addition, in other embodiments, when testing, the testing machine outputs signals to the object under test through probes other than impedance matching probes 21a-21c (such as cantilever probes 22-22g), and then transmits the test results through impedance matching probes 21a-21c. Match the probes 21a~21c to the testing machine for analysis.

Please refer to FIG. 1C and FIG. 1D , which are schematic diagrams of different impedance matching probes of the present invention. In FIG. 1C , the difference from the above is that the signal transmission part 211a is not a coaxial cable structure, but a structure composed of a circuit board (PCB) with impedance matching and signal transmission functions, and its front end has a probe part 210a. In FIG. 1D , the difference from the foregoing is that the probe portion 210 a includes a plurality of probes, each probe has a bending angle θ, and one end of each probe has a tip segment 2100 a. The probe part 210a has at least two tip segments 2100a. In this embodiment, the number of tip segments 2100a is 17, that is to say, the number of tip segments 2100 can be more than the aforementioned impedance matching probe of FIG. 1A. The signal transmission part 211a has a probe central axis CL1.

Please refer to FIG. 1A and FIG. 1B , the signal transmission part 211 of the impedance matching probes 21 a - 21 c is axisymmetric with the probe central axis CL1 as the center. In addition, the signal transmission part 211 a of the impedance matching probe shown in FIG. 1C is also bilaterally symmetrical with the probe central axis CL1 as the center. Specifically, in the present embodiment, when the signal transmission part 211 a of the impedance matching probe in FIG. 1C is an axisymmetric shape, its symmetric axis is used as the central axis CL1 of the probe.

Please refer to FIG. 1E and FIG. 1F , which are the connection diagrams of the signal transfer wires of the impedance matching probe of the present invention. In this embodiment, there are a signal adapter base 27 and a plurality of signal adapter wires 28, wherein the signal adapter base 27 has a plurality of telecommunication connections corresponding to the plurality of impedance matching probes 21a~21c respectively. Interfaces 27a~27c. One end of the signal transfer line 28 is electrically connected to the telecommunications connection interfaces 27a~27c, and the other end is connected to the signal connection connector 2121. The signal transfer line 28 is used for one-way transmission, that is, from the testing machine 5 to the probe part. 210 or back to the testing machine 5 from the probe part 210. When testing, the testing machine 5 transmits the test signal to the signal connection joint 2121 through the signal transfer line 28, then transmits the test signal to the probe part 210 through the signal transmission part 211, and then outputs the test signal to the object to be tested by the probe part 210.

In this embodiment, the signal adapter 27 further includes a support frame 270 and a board 271 . In this embodiment, one end of the support frame 270 is set on the fourth surface 200b of the fixed substrate 200 of the probe base 20, and the other end is connected to the board body 271 of the signal adapter 27. Further, one end of the support frame 270 is set on the fixed On the reinforcement structure 200t of the fourth surface 200b of the substrate 200 . In another embodiment, one end of the supporting frame 270 may also be disposed on the second surface 201 f of the circuit substrate 201 . In other embodiments, the second surface 201f of the circuit substrate 201 has a reinforcing ring (not shown in the figure), the reinforcing ring is a reinforcing structure made of metal material, and one end of the support frame 270 is arranged on the second surface 201f of the circuit substrate 201 on the reinforcing circle. The board body 271 is located at the testing machine side A of at least one impedance matching probe 21 a - 21 c and connected to the supporting frame 270 . The relative position of the board body 271 is higher than the impedance matching probes 21a-21c. The board body 271 has a connection surface 2710 and a connection surface 2711 , wherein the connection surface 2710 has the plurality of telecommunications connection interfaces 27 a - 27 c , penetrating through the connection surface 2711 . In another embodiment, the plate body 271 may be disposed on the reinforcement structure 200t of the fourth surface 200b of the fixed substrate 200 or the reinforcement ring of the second surface 201f of the circuit substrate 201 .

The board 271 of the signal adapter 27 further has a plurality of telecommunications connection interfaces 27a~27c, and a plurality of signal transfer lines 28 are arranged on the board 271 of the signal adapter 27 and the signals of the impedance matching probes 21a~21c. Between one end of the transmission part 211, one end of each signal transfer line 28 is coupled to the telecommunications connection interface 27a-27c, and the other end is electrically connected to the signal connection socket 2121 of the corresponding impedance matching probe 21a-21c. In addition, the height of the electrical connection interfaces 27 a - 27 c is higher than that of the signal connection seat 2121 . Through the setting of the signal transfer base 27, the testing machine 5 is electrically connected to the electrical connection interfaces 27a-27c through the signal transfer wire 28'. Through the setting of the signal adapter 27, when it is necessary to change or adjust the signal adapter 28', the user only needs to adjust the connection relationship between the tester 5 and the signal adapter 27. , it is not necessary to adjust the signal connection interfaces 27a-27c and the signal transfer wires 28 on the side of the impedance matching probes 21a-21c, so as to avoid the position change of the impedance matching probes, so that the positioning accuracy of the impedance matching probes can be ensured, and the adjustment of impedance can be reduced. Time spent matching probe positions to improve detection efficiency.

Please refer to Figure 1A and Figure 1B and Figure 2A to Figure 2C, wherein Figure 2A is a schematic top view of the configuration relationship between the impedance matching probe and the cantilever probe; Figure 2B is a perspective schematic diagram of the configuration of the impedance matching probe and the cantilever probe; 2C is a schematic bottom view of the probe card embodiment of the present invention viewed from the side of the object to be tested. In this embodiment, the signal transmission part 211 of the impedance matching probes 21 a - 21 c is inserted straight into the needle. The manner in which the impedance matching probes 21 a - 21 c are inserted straight into the needle will be described below. In this embodiment, viewed from the perspective of the XY plane, the positioning structure 202 has slots L5 and L7 on the first axis X, and has slots L6 and L8 on the second axis Y. The impedance matching probe 21a is arranged on the fourth surface 200b of the fixed substrate 200, and its signal transmission part 211 passes through the circuit substrate 201, the fixed substrate 200 from the fourth surface 200b along the Y axis, and then passes through the slot L8, and Insert the needle straight along the Y axis on the XY plane. The impedance matching probe 21b is arranged on the fourth surface 200b of the fixed substrate 200, and its signal transmission part 211 passes through the circuit substrate 201, the fixed substrate 200 from the fourth surface 200b, and then passes through the slot L6, along the XY plane. -Y-axis advances the needle straight. The impedance matching probe 21c is arranged on the fourth surface 200b of the fixed substrate 200, and its signal transmission part 211 passes through the circuit substrate 201 and the fixed substrate 200 from the fourth surface 200b, and then opens the groove L5, and on the XY plane along the - The X-axis goes straight into the needle. It should be noted that the slots corresponding to the impedance matching probes are determined according to the number and positions of the impedance matching probes 21 a - 21 c , and are not limited to three slots in this embodiment. It should be noted that the first axis X has a positive first axis (+X axis) and a negative first axis (−X axis). The second axis Y has a positive second axis (+Y axis) and a negative second axis (−Y axis).

At least one side of the impedance matching probes 21a to 21c has a cantilever probe. In the embodiment shown in FIGS. 2A-2C , the cantilever probes include cantilever probes 22-22g and cantilever probes 23-23f. There are cantilever probes 22 to 22g on both sides of the impedance matching probes 21a to 21c, respectively. Each cantilever probe 22 - 22g has a tip segment 220 and a cantilever segment 221 connected to the tip segment 220 , and the cantilever segment 221 extends toward and connects to the tip segment 220 . Each cantilever probe 22 - 22g has a central axis CL2 , which is the axial direction of each first probe 22 - 22g extending from the end surface of the sealant layer 24 along the tip section 220 of the first probe 22 - 22g. Each cantilever probe 23 - 23f has a central axis CL3 , which is the axial direction of each cantilever probe 23 - 23f extending from the end surface of the sealing layer 24 along the tip section 230 of the cantilever probe 23 - 23f. In this embodiment, one end of the cantilever section 221 of each cantilever probe 22-22g is electrically connected to the contact point on the first surface 201e of the circuit substrate 201, and the other end of the cantilever section 221 of each cantilever probe 22-22g One end is connected to a tip segment 220 corresponding to each cantilever probe 22-22g, and the tip segment 220 of each cantilever probe 22-22g is disposed on the side of the second through hole 200c to be tested.

In addition, a part of the cantilever segment 221 of each cantilever probe 22-22g is disposed on the positioning structure 202, and the two ends of the cantilever segment 221 extend toward the circuit substrate 201 and the tip segment 220 respectively. In this embodiment, each cantilever probe 22 - 22g further includes a knee 222 located between the tip section 220 and the cantilever section 221 . The needle tip section 220 extends along the Z-axis direction from a knee section (knee) 222 . In this embodiment, one end of the cantilever section 221 is electrically connected to the contact of the circuit substrate 201 , and the needle tip section 220 is correspondingly disposed in the through hole 202 a. One end of the cantilever section 221 and the contact of the circuit substrate 201 can be electrically connected by soldering, or two ends of an intermediary (such as a coaxial cable) are respectively welded to one end of the cantilever section 221 and the contact of the circuit substrate 201 .

In one embodiment, since the impedance matching probes 21a~21c have a certain volume and will occupy a certain space in the through hole 202a, in order to prevent the cantilever probes 22~22g from interfering with the impedance matching probes 21a~21c or The needle-entry area of the impedance-matching probes 21a~21c must be kept out of the way, and the cantilever probes 22~22g will not directly follow the X-axis or Y-axis from the slot L5~L7 corresponding to each impedance-matching probe 21a~21c. Instead, insert the needle obliquely below the through hole 202a along a direction that has an included angle with the needle-entry direction of the impedance-matching probes 21a-21c, so as to avoid the impedance-matching probes 21a-21c.

For example: for the impedance matching probe 21a, its corresponding slot L8 has sidewalls W1 and W2 corresponding to the two sides of the signal transmission part 211 on the XY plane; for the impedance matching probe 21b, its corresponding slot L6 is in There are sidewalls W3 and W4 corresponding to two sides of the signal transmission part 211 on the XY plane, and for the impedance matching probe 21c, the corresponding slot L5 has sidewalls W5 and W6 corresponding to both sides of the signal transmission part 211 on the XY plane. As shown in FIG. 2A, in this embodiment, the cantilever probes 22a or 22b-22d on at least one side of the impedance matching probe 21a are located below the side walls W5 and W8 of the X-axis from the slots L5 and L7 of the positioning structure 202. The sealing glue layer 24 goes out and enters obliquely toward the direction below the through hole 202a. For the impedance matching probe 21b, the cantilever probes 22 or 22e-22g on at least one side of it come out from the sealing layer 24 below the sidewalls W6 and W7 of the X-axis in the slots L5 and L7 of the positioning structure 202. The needle is inserted obliquely in the direction below the through hole 202a. For the impedance matching probe 21c, the cantilever probe 22d or 22e on at least one side of the positioning structure 202 exits from the slot L5 of the positioning structure 202 and the sealing layer 24 below the side walls W5 and W6 of the X-axis to the through hole. Insert the needle obliquely in the direction below 202a.

Furthermore, in this embodiment, the needle insertion direction of the cantilever probe 22a next to the impedance matching probe 21a is to move the cantilever section 221 toward the through hole 202a along the +X axis and the +Y axis. direction, that is, there is an included angle θ1 greater than zero between the central axis CL2 of the cantilever section 221 and the central axis CL1 of the impedance matching probe 21a, so that the cantilever section 221 of the cantilever probe 22a is sealed from the side wall W8. The layer 24 is obliquely inserted into the through hole 202a. The needle insertion direction of the cantilever probes 22b~22c next to the impedance matching probe 21a is to insert the cantilever section 221 obliquely along the -X and +Y axis toward the through hole 202a, and the cantilever probe 22b and The central axis CL2 of the cantilever section 221 of 22c and the central axis CL1 of the impedance matching probe 21a have an included angle θ2 and θ3 greater than zero degrees, so that the cantilever section 221 of the cantilever probes 22b~22c can be sealed from the side wall W5. The layer 24 is inserted into the needle obliquely in the direction below the through hole 202a.

For the impedance matching probe 21b, the cantilever probes 22 on both sides of the cantilever section 221 are inserted into the direction below the through hole 202a along the +X axis and the -Y axis, so that the cantilever probes 22 The cantilever section 221 enters obliquely from the sealing layer 24 below the side wall W7 to the direction below the through hole 202a, and the cantilever probes 22e~22g move the cantilever section 221 along the -X axis and -Y axis to the through hole. The needle is inserted obliquely below the hole 202a, so that the cantilever sections 221 of the cantilever probes 22e-22g are inserted obliquely below the through hole 202a from the sealant layer 24 below the side wall W6. For the impedance matching probe 21c, the cantilever probes 22e on both sides of the cantilever section 221 are inserted into the direction below the through hole 202a along the -X axis and the -Y axis, so that the cantilever probe 22e The cantilever section 221 enters the needle obliquely from the sealing layer 24 below the side wall W6 to the direction below the through hole 202a, and the cantilever probe 22d moves the cantilever section 221 toward the through hole along the -X axis and the +Y axis. The needle is inserted obliquely below the through hole 202a, so that the cantilever section 221 of the cantilever probe 22d is inserted obliquely from the sealing layer 24 below the side wall W5 to the direction below the through hole 202a.

It should be noted that, in one embodiment, because the needle tips of the probe part 210 of the impedance matching probes 21a-21c are short, considering the angle and cross-needle issues, the cantilever probes 22-22g can be used in addition to inserting the needle obliquely. , in the projected area below the through hole 202 a , the height in the -Z axis is relatively higher than at least a part of the cantilever section 221 corresponding to the signal transmission part 211 , so as not to interfere with the signal transmission part 211 . Further, the contact between the cantilever section 221 and the signal transmission part 211 or the probe part 210 can be avoided. In this embodiment, the positioning structure 202 has a connecting surface 202b and a fixing surface 202c, the connecting surface 202b is connected to the third surface 200a, and the fixing surface 202c further has a sealant layer 24, wherein the plurality of cantilever probes 22-22g is coated with a sealant layer 24 on the cantilever section 221 corresponding to the fixed surface 202c. It should be noted that the part of the cantilever section 221 of the cantilever probes 22~22g from the sealant layer 24 to the tip section 220 is set on the side B of the object to be tested, that is, it is not set on the through hole 202a below the through hole 202a Inside.

Please refer to FIG. 2A , the object under test S0 is a radio frequency component and has four sides L1-L4. In this embodiment, the impedance matching probes 21a-21c correspond to the sides L1-L3 respectively, and each side L1~L3 has a plurality of electrical contact pads _RF and a plurality of electrical contact pads arranged on at least one side of the electrical contact, so that at least one side can simultaneously allow the impedance matching probe and the cantilever probe to simultaneously Check electrical contacts. For example, in this embodiment, each of the impedance matching probes 21a~21c is used to test the electrical contact Pad _RF on one side, and the number of the electrical contact Pad _RF is at least two. A plurality of cantilever probes 22-22d on both sides of the needles 21a-21c are used to test the electrical contact pads on the same side. Under the aforementioned electrical contact layout of the object under test, the central axis CL1 of each impedance matching probe 21 a - 21 c has an included angle greater than zero with the central axis CL2 of the cantilever probes 22 - 22 g on both sides. In addition, the included angles between the central axis CL1 of each impedance-matching probe 21 a - 21 c and the central axis CL2 of any two cantilever probes 22 - 22 g on both sides or on the same side may be the same or different. For example, the included angle θ1 and the included angle θ2 located on both sides of the impedance matching probe 21a in FIG. 2A may be the same or different included angles, or the included angle θ2 and the included angle θ3 located on the same side of the impedance matching probe 21a may be the same angle or different angles.

In addition to the needle insertion method of impedance matching probes 21a~21c and cantilever probes 22~22g in the slots L5~L7, there are a plurality of cantilever probes 23~23f below the slot L8 of the through hole 202a, on the XY plane Insert the needle straight through hole 202a along +X. The cantilever probes 23 - 23 f are cantilever probes and also have a tip section 230 and a cantilever section 231 . In this embodiment, each of the cantilever probes 23 - 23f has a central axis CL3 parallel to each other. In another embodiment, there may also be an included angle between the central axes CL3 of any two cantilever probes 23-23f, which is determined according to the layout setting, and is not limited to the parallel arrangement as shown in the figure. In this embodiment, the two sides of the cantilever probes 23~23f respectively have the cantilever probes 22, 22a, wherein, because the cantilever probes 23~23f advance along the +X direction on the XY plane, the cantilever probes 23 The central axis CL3 of , and the central axis CL2 of the adjacent cantilever probe 22 a that is inserted between the +X axis and the +Y axis have an included angle θ4 greater than zero. Likewise, therefore, the central axis CL3 of the cantilever probe 23 has an included angle greater than zero with the central axis CL2 of the adjacent cantilever probe 22 that is inserted from between the +X axis and the −Y axis. It should be noted that the cantilever probe 23 is configured according to usage requirements, and is not a necessary element for realizing the present invention, so the presence or absence of the cantilever probe 23 is not a limitation.

The arrangement relationship between the cantilever probes 22 , 22 a and the cantilever probes 23 - 23 g is not limited by the foregoing embodiments. It is mainly determined according to the layout position of the electrical contact Pad of the object under test S0 projected below between the impedance matching probes 21 a and 21 b and the slot L7 . For example, the electrical contact Pad between the impedance matching probes 21a and 21b and the slot L7 corresponding to the object under test S0 in FIG. In this layout, the cantilever probe can be configured in combination with cantilever probes 22, 22a and 23~23g as shown in Figure 2A, or as shown in Figure 2D, all cantilever probes 23~23h test. In addition, as shown in FIG. 2E, if the object under test S0 is correspondingly located between the impedance matching probes 21a and 21b and the slot L7, in addition to a row of electrical contacts Pad along the side L4, there is also a row along the X-axis At least one electrical contact point disposed on the sides L1 and L3 of the object under test S0, as shown in FIG. 2E , must have a probe layout in which cantilever probes 22-22a and 23-23f coexist.

Please refer to FIG. 3A , which is a schematic diagram of an embodiment of the needle arrangement method of the cantilever probe of the present invention. What is shown in this embodiment is that the height distribution of the tip section of each cantilever probe is not the same. The tip segment 220 of the cantilever probe 22c has a height H2, and the tip segment 220 of the cantilever probe 22d has a height H3, wherein H2<H1<H3. Similarly, the tip segments 230 of the plurality of cantilever probes 23 also have different height differences. In an embodiment of the cantilever probe arrangement method as shown in FIG. The heights DA and DB of the needle tip section 220 between 23 and 23a have a height difference, and the heights DC and DD of the needle tip section 220 between the cantilever probes 23b and 23c have a height difference. In addition, the cantilever section 231 and the tip section 230 of each cantilever probe 23~23c respectively have included angles θ5~θ8, wherein, in this embodiment, θ5 is equal to θ6, θ7 is equal to θ8, θ5 is not equal to θ7, and θ6 is not equal to θ8 . Through the difference between the angles of the plurality of cantilever probes 23-23f and the heights of the tip segments, the density of the cantilever probe arrangement can be increased to cope with the high-density electrical connection points of the test object. It should be noted that the height difference of different needle layers of the cantilever probe in this embodiment is determined according to requirements, and is not limited by the height difference and included angle mentioned in this embodiment.

Returning back to FIG. 2A , the probe layout setting method of this embodiment is to perform a separate radio frequency characteristic test for a single object under test S0 or perform a radio frequency characteristic test and a signal characteristic test at the same time, and at least one of the impedance matching probes A cantilever probe with a needle-entry direction different from that of the impedance-matching probe on one side is used to perform a post-contact test on electrical contacts on the same side of the object under test at the same time. In another embodiment, the pendulum method of the present invention is not limited to a single DUT. For example, as shown in FIG. 4A to FIG. 4D , the pendulum layout in this embodiment can simultaneously test a plurality of DUTs. things. Wherein, the probe card 2a is basically similar to the aforementioned probe card 2 for a single object to be tested, the difference is the arrangement of the swing pins. The setting of the swing needle in this embodiment can test a plurality of objects under test at the same time, for example, test objects S1 and S4 at the same time. The probe card 2a has a probe module PC1 and a probe module PC2, wherein the probe module PC1 can include an impedance matching probe for radio frequency characteristic testing or an impedance matching probe and a cantilever probe for radio frequency characteristic testing at the same time. Test and signal characteristic test, such as: AC or DC signal characteristic test, but not limited thereto, and the probe module PC2 uses a cantilever probe to perform signal characteristic test.

In this embodiment, there are multiple objects under test, for example, a wafer with multiple objects under test. For the convenience of description, four objects under test S1 - S4 are used for illustration below. The DUT moves from the probe module PC2 side to the probe module PC1 side in sequence. For each DUT S1~S4, the signal characteristic test is performed by the probe module PC2 first, and then the probe module PC2 is used to test the signal characteristics. Module PC1 conducts RF characteristic test. During the testing process, as shown in FIG. 4A , the object under test S1 enters the probe module PC2 for signal characteristic testing. The objects under test S2-S3 are arranged behind, and have not yet entered the testing area of the probe module PC2. At this time, the probe module PC1 has no object to be tested entering the corresponding testing area. After the test of the object under test S1 is completed, the probe module PC2 relatively moves to the object under test S2 for signal characteristic testing. In this embodiment, the probe card 2a corresponds to the test area of the object to be tested, and there is an interval of two objects to be tested between the probe module PC1 and the probe module PC2. When the object to be tested S4 relatively moves to the probe module When the test area of PC2 is set, the object under test S1 will relatively move to the test area of probe module PC1, as shown in Figure 4B. At this time, the corresponding object under test between probe module PC1 and probe module PC2 The test area is the space between the objects under test S2 and S3. Although in this embodiment, there are two objects under test S2 - S3 between the probe module PC1 and the probe module PC2 , the number is not limited to two as shown in the figure, and more than one is acceptable. In another embodiment, the test area corresponding to the DUT between the probe module and the probe module is that the first DUT is adjacent to the second DUT, and no DUT exists between them. between. In this embodiment, the probe module PC1 is a combination of a plurality of impedance matching probes 21a~21c, cantilever probes 22~22g, and cantilever probes 23~23f. repeat.

The probe module PC2 in this embodiment is composed of a plurality of cantilever probes 25a-25i and a plurality of cantilever probes 26-26f. The cantilever probes 25 a - 25 i go straight along the +X axis on the XY plane from the sealant layer 24 below the side wall W9 of the slot L7 toward the direction below the through hole 202 a. In this embodiment, each cantilever probe 25 a - 25 i has a tip section 250 and a cantilever section 251 , wherein the tip section 250 is correspondingly disposed under the through hole 202 a, and one end of the cantilever section 251 is electrically connected to the circuit substrate 201 . As shown in FIGS. 4B and 4D , the cantilever probes 26 a - 26 f can be located on at least one side or both sides of the cantilever probes 25 a - 25 i , and this embodiment is an implementation of both sides. Wherein the cantilever probes 26a-26c are arranged on one side of the cantilever probe 25a, and the cantilever probes 26d-26f are arranged on one side of the cantilever probe 25i. In this embodiment, the cantilever sections 221 of the cantilever probes 26a~26c are inserted obliquely toward the through hole 202a along the X axis and the -Y axis. Further, the cantilever sections 26a~26c of the cantilever probes 221 from the sealant layer 24 below the side wall W7 to the direction below the through hole 202a obliquely, so that there is an angle θ9 between the central axis CL4 and the central axis CL5. Insert the needle obliquely in the direction below the through hole 202a along the X axis and the Y axis, and further, the cantilever section 221 of the cantilever probes 26d~26f goes from the sealant layer 24 below the side wall W8 to the bottom of the through hole 202a The needle is inserted in an oblique direction, so that there is an included angle between the central axis CL4 and the central axis CL5 of the cantilever probes 26d-26f. It should be noted that the part of the cantilever section 250 of the cantilever probes 25a~25i from the sealant layer 24 to the tip section 251 and the cantilever section 260 of the cantilever probes 26~26f from the sealant layer 24 to the tip section 261 are arranged in the The object side B, that is, below the through hole 202a is not arranged in the through hole 202a.

Please refer to FIG. 4E and FIG. 4F. This embodiment is basically similar to FIG. 4A to FIG. Cantilever probes for signal detection. In FIG. 4E , the probe module PC1 is used to touch the object under test S1 , and the probe module PC2 is used to touch the object under test S4 . From the side view, it can be seen that the layout relationship between the cantilever probes 23~23f and the cantilever probes 25a~25n, the tip section 230 of the cantilever probes 23~23f has a height H4, and the cantilever probes 25j~25n are used for point contact The test object S4 is close to the electrical contact on the first side SL1 of the test object S3, and its tip section 250 has a height H5, and the tip sections 250 of the cantilever probes 25a-25i are used to detect the test object S4 and the first side. A second side SL2 opposite to one side SL1 is electrically connected, and has a height H6. In order not to interfere with each other, the height of the needle tip segment has H4>H5>H6. In addition, the cantilever probes 23-23f from the end surface of the sealant layer 24 along the X-axis to the needle tip have a length LC1, and the cantilever probes 25j-25n extend from the end surface of the sealant layer 24 to the needle tip along the X-axis. The cantilever segment of the segment has a length LC2, and the cantilever segment of the cantilever probe 25a-25i from the end surface of the sealing layer 24 along the X-axis to the tip segment has a length LC3, wherein LC1>LC2>LC3. Cantilever probes 23~23f, cantilever probes 25j~25n, and cantilever probes 25a~25i extend from the end surface of the sealant layer 24 along the X axis to the tip section of the cantilever from the side A of the testing machine to the side B of the object to be tested. Arranged in layers.

To sum up the above, the probe card of the present invention can provide the radio frequency characteristic test of the object to be tested, and realize the pendulum structure with the impedance matching probe and the cantilever probe at the same time through the oblique insertion of the cantilever probe. In addition to inserting the needle obliquely through the cantilever probe, further, the tip section height of the cantilever probe is greater than that of the impedance matching probe, which can avoid the problem of mutual interference between the impedance matching probe and the cantilever probe. In addition, the present invention can detect two DUTs at the same time, for example: one DUT is tested for signal characteristics, and the other DUT is tested for RF characteristics or RF characteristics plus signal characteristics test, so as to speed up the test. , to improve the efficiency of testing the analyte.

It should be noted that the "needle entry" in the present invention refers to the direction of the signal transmission part of the impedance matching probe towards the tip section of the probe part, or the direction of the cantilever section of the cantilever probe from the sealant layer 24 towards the tip section. Direction, not action. Both the impedance matching probe and the tip section of the cantilever probe are arranged on the side of the object to be tested on the probe base.

As shown in Figures 2A to 2E, the probe card 2 of the present invention is used to test the electrical properties of the object under test. The probe card 2 includes a probe base 20, at least one impedance matching probe 21a-21c, and a plurality of cantilevers. Probe 22~22g. The probe holder 20 has a side B of the object under test and a side A of the testing machine corresponding to the side B of the object under test. Each impedance matching probe 21 a - 21 c has a probe part 210 and a signal transmission part 211 connected to the probe part 210 . One end of the signal transmission part 211 is disposed on the testing machine side A, and the signal transmission part 211 passes through the through hole 202 a on the probe base 20 , so that the probe part 210 is disposed on the DUT side B of the probe base 20 . The signal transmission part 211 has a probe central axis CL1. The plurality of cantilever probes 22 to 22g each have a tip section 220 and a cantilever section 221 connected to the tip section 220 . One end of the cantilever section 221 of each cantilever probe 22 - 22g is electrically connected to the probe base 20 . Please refer to FIG. 1A at the same time. More specifically, one end of the cantilever segment 221 of each cantilever probe 22 - 22g is electrically connected to the contact point on the third surface of the circuit substrate 201 of the probe holder 20 . The needle tip segment 220 is disposed on the side B of the through hole 202 a to be tested. The cantilever section 221 has a central axis CL2. Wherein, at least one side of each impedance-matching probe 21a-21c has at least one cantilever probe 22-22g, and the central axis CL1 of the probe and the central axis CL2 of at least one cantilever probe 22-22g have a first angle greater than zero. (the included angle θ1˜θ3, the included angle between the probe central axis CL1 of the impedance matching probe 21c and the central axis CL2 of at least one cantilever probe 22b˜22g), and the first included angle is less than 90 degrees. More specifically, the first included angle (the included angle θ1~θ3, the included angle between the probe center axis CL1 of the impedance matching probe 21c and the center axis CL2 of at least one cantilever probe 22b~22g) is preferably 35°~55° between.

The probe holder 20 further has a fixed substrate 200 , a circuit substrate 201 , a plurality of bearing seats 200 d - 200 f and a positioning structure 202 . Wherein, the fixed substrate 200 has a third surface 200a facing the side B of the object to be tested, a fourth surface 200b facing the side A of the testing machine, and a second through hole 200c passing through the first and fourth surfaces 200a and 200c, so that the through hole 202a Corresponding to the second through hole 200c. The circuit substrate 201 is disposed on the fourth surface 200b. The circuit substrate 201 has a first through hole 201a corresponding to the second through hole 200c. One end of the cantilever section 221 of the plurality of cantilever probes 22-22g is electrically connected to the circuit substrate 201. A plurality of bearing seats 200d~200f are arranged in the first through hole 201a and fixed on the fourth surface 200b, each bearing seat 200d~200f corresponds to one of the impedance matching probes 21a~21c, and each impedance matching probe The signal connection connectors 2121 on the 21a-21c are electrically connected to one end of the signal transmission part 211 of the corresponding impedance matching probes 21a-21c. There are a plurality of positioning plates 200g-200i around each bearing seat 200d-200f, and at least one positioning plate 200g-200i is used to limit the position of the bearing seat 200d-200f. The positioning structure 202 is disposed on the third surface 200 a of the fixed substrate 200 , and the positioning structure 202 has a through hole 202 a for the signal transmission part 211 to pass through.

The probe portion 210 of each impedance matching probe 21 a - 21 c further has a tip section 2100 and a connection section 2101 connected to the tip section 2100 . The connection section 2101 is coupled to the signal transmission part 211 , and the height of the tip section 2100 of each impedance matching probe 21 a - 21 c is smaller than the height of the tip section 220 of the adjacent cantilever probes 22 - 22 g .

The through hole 202a has a plurality of slots L5~L8, wherein each impedance matching probe 21a~21c corresponds to one of the slots L5, L6, L8, and the signal transmission part 211 of each impedance matching probe 21a~21c is respectively Pass through one of the slots L5 , L6 , L8 corresponding to the through hole 202 a, and insert the needle straight along the first axis X or the second axis Y into one of the slots L5 , L6 , L8 . One of the slots L5, L6, L8 has two sidewalls W5, W6 parallel to the first axis X, wherein at least one cantilever probe 22b-22g is from the sidewalls W5, W6 along the first axis X, and The sidewalls W5 and W6 have a direction with an included angle greater than zero degrees, and the needle is obliquely inserted toward the side of the through hole 202 a to be tested.

In addition, the probe card 2 further has a plurality of cantilever probes 23-23f corresponding to the other slot L7, and the plurality of cantilever probes 23-23f are directed along the first axis X toward the side of the through hole 202a to be tested. Needle insertion, wherein, the probe central axis CL1 of the impedance matching probe 21c in the slot L5 opposite to the other slot L7 corresponding to the plurality of cantilever probes 23~23f and the plurality of cantilever probes 23~23f The central axis CL3 is parallel to each other.

The slot L7 has two sidewalls W7 and W8 parallel to the first axis X. As shown in FIG. One of the slots L6, L8 has two sidewalls parallel to the second axis Y, so that the signal transmission portion 211 of one of the impedance matching probes 21a, 21b passes through the corresponding slot L6, L8 of the through hole 202a. At least one of the cantilever probes 22 , 22 a is inserted obliquely from the sidewalls W7 , W8 along the first axis X toward the side of the through hole 202 a to be tested. Furthermore, at least one cantilever probe 22 , 22 a extends obliquely toward the adjacent impedance matching probe 21 a , 21 b from the cantilever section 221 of the tip section 220 from the end surface of the sealant layer 24 . For example, the cantilever probe 22 from the end surface of the sealant layer 24 to the cantilever section 221 of the tip section 220 obliquely advances toward the adjacent impedance matching probe 21b. The cantilever probe 22a from the end surface of the sealant layer 24 to the cantilever section 221 of the tip section 220 obliquely advances toward the adjacent impedance matching probe 21a. In addition, the slot L7 further has a sidewall located between the two sidewalls W7 and W8 and perpendicular to the first axis X. As shown in FIG. The side wall of the slot L7 perpendicular to the first axis X is the side wall of the needle insertion of the cantilever probes 23-23f.

As shown in FIGS. 4A to 4E , the probe card 2 a of the present invention includes a probe base 20 , a probe module PC1 and a probe module PC2 . The probe holder 20 has a side B of the object under test and a side A of the testing machine corresponding to the side B of the object under test. The probe module PC1 is disposed on the probe base 20 . The probe module PC1 has at least one impedance matching probe 21 a - 21 c and a plurality of first cantilever probes (eg, a plurality of cantilever probes 22 - 22 g ). Each impedance matching probe 21 a - 21 c has a probe part 210 and a signal transmission part 211 . The probe part 210 has at least two needle tip segments 2100 . In this embodiment, as shown in FIG. 4C , the probe part 210 has three tip segments 2100 , which are respectively one signal and two ground GSG tips. But the tip segment 2100 can also be a SG tip with one signal and one ground, a GSSG tip with two signals and two grounds, or a GSGSG tip with two signals and three grounds. Therefore, the minimum number of tip segments of the probe part 210 is two, which is used for radio frequency (RF) characteristic testing, for example. The signal transmission part 211 is connected to the probe part 210 . Each first cantilever probe has a tip section 220 and a cantilever section 221 . The cantilever section 221 is connected to the needle tip section 220 . The tip segments 2100 of at least one impedance-matching probe 21a-21c and the tip segments 220 of the plurality of first cantilever probes form a first survey area. In this embodiment, as shown in FIG. 4B and FIG. 4C , the tip section 2100 of the impedance matching probes 21a-21c of the probe module PC1 and the tip section 220 of the first cantilever probe correspond to the The area surrounded by electrical contacts (Pad). The probe module PC2 is disposed on the probe base 20 and located at one side of the probe module PC1. In this embodiment, as shown in FIG. 4A , the probe module PC2 is located on the -X-axis direction side of the probe module PC1 on the XY plane. The probe module PC2 has a plurality of second cantilever probes (such as cantilever probes 25 a - 25 i , cantilever probes 26 a - 26 f ). Each second cantilever probe has a tip section 250, 260 and a cantilever section 251, 261 respectively. The cantilever sections 251 , 261 are connected to the needle tip sections 250 , 260 . The tip segments 250, 260 of the plurality of second cantilever probes form a second survey area. In this embodiment, as shown in FIG. 4B and FIG. 4C , the tip segments 250 of the cantilever probes 25a-25i and the tip segments 260 of the cantilever probes 26a-26f of the probe module PC2 correspond to the The area surrounded by electrical contacts (Pad). The distance between the first survey area and the second survey area is greater than the distance between any two tip segments 250 , 260 of the second cantilever probe. More specifically, on the XY plane, the distance between the first survey area and the second survey area on the X axis is greater than the tip of any two second cantilever probes (such as the cantilever probe 26a and the cantilever probe 26f) The distance of segment 260.

At least one impedance-matching probe 21a~21c of the probe module PC1 and the tip segments 2100, 220 of the plurality of first cantilever probes are used to point test an electrical contact of an object under test, as shown in Fig. 4B and Fig. As shown in 4C, in this embodiment, it is an electrical contact point used for spot testing the object under test S1. The needle tip sections 250 and 260 of the plurality of second cantilever probes of the probe module PC2 are used to spot-test the electrical contacts of another object to be tested, as shown in FIG. 4B and FIG. 4C. In this embodiment , is an electrical contact point used for spot testing the object under test S4. The definition of the distance between the first survey area and the second survey area, as shown in Figure 4B and Figure 4C, in this embodiment, means that on the first axis X, the first survey area is adjacent to the second survey area. The side of the survey area (that is, the side of the first survey area close to the -X axis) and the side of the second survey area adjacent to the first survey area (that is, the side of the second survey area near the X axis) distance between sides). More specifically, in this embodiment, the probe card 2a is used to test a plurality of DUTs (such as crystal grains) on the wafer, as shown in FIG. 4B and FIG. 4C, only the DUTs S1~ S4 as a representative. The size of each object to be tested and the relative position of the electrical contacts are the same. When the probe card 2a is used to measure the object to be tested, each needle tip segment in the first point measurement area or the second point measurement area must be able to Point measurement to the electrical contact corresponding to the object to be tested. Therefore, the first coverage area is roughly equivalent to the second coverage area. Here, "substantially equal" refers to a structure that considers the possible processing accuracy error of each probe in the first survey area and the second survey area, and the maintenance and adjustment of the position of the needle tip section of the probe card 2a. In this embodiment, the distance between the first surveying area and the second surveying area is greater than the width distance of an object under test on the first axis X. As shown in Figure 4B, Figure 4C, and Figure 4E, the distance between the first survey area and the second survey area is greater than the width distance of the object to be measured S2 and the object to be measured S3 on the first axis X, that is, the first The distance between the surveying area and the second surveying area is greater than the width distance of the two objects to be measured on the first axis X. Taking the object S4 as an example, the width distance of the object on the first axis X refers to the width between the first side SL1 and the second side SL2 of the object S4 on the first axis X distance. There are cutting lines between the objects S1-S4 to be tested (not shown in the figure). In this embodiment, as shown in FIG. 4B , FIG. 4C , and FIG. 4E , the width distance of the second survey area is less than or equal to the width distance of the corresponding object S4 on the first axis X. Therefore, the distance between the first survey area and the second survey area is greater than the width distance of a second survey area on the first axis X. The width distance of the second survey area on the first axis X refers to the width distance of the two opposite sides of the second survey area on the first axis X, that is, the second survey area is adjacent to the first survey area. The width distance from the side of the region to the side away from the first hit region. As shown in FIG. 4B , FIG. 4C , and FIG. 4E , the two opposite sides of the second survey area are respectively adjacent to the first side SL1 and the second side SL2 of the object under test S4 .

In the embodiment shown in FIGS. 4B-4E , one end of the signal transmission part 211 is arranged on the side A of the testing machine, and the signal transmission part 211 passes through the through hole 202a on the probe base 20, so that the probe part 210 is disposed on the probe base 20. The side B of the object to be measured, please refer to Fig. 2A ~ 2E together, the parts corresponding to the impedance matching probes 21a ~ 21c and the cantilever probes 22 ~ 22g, the signal transmission part 211 has the probe central axis CL1, a plurality of first cantilever The probe includes a plurality of cantilever probes 22-22g, and one end of the cantilever section 221 of each cantilever probe 22-22g is electrically connected to the probe base 20. Please refer to FIG. 1A at the same time. More specifically, one end of the cantilever segment 221 of each cantilever probe 22 - 22g is electrically connected to the contact point on the third surface of the circuit substrate 201 of the probe holder 20 . The tip section 220 of each cantilever probe 22~22g is arranged on the side B of the object to be tested in the through hole 202a, and the cantilever section 221 of each cantilever probe 22~22g has a central axis CL2, wherein each impedance matching probe 21a At least one side of ~21c has at least one cantilever probe 22~22g, and the central axis CL1 of the probe and the central axis CL2 of at least one cantilever probe 22~22g have a first included angle greater than zero (the included angle θ1~θ3, impedance matching probe The included angle between the probe central axis CL1 of the needle 21c and the central axis CL2 of at least one cantilever probe 22b-22g), and the first included angle is less than 90 degrees. More specifically, the first included angle (the included angle θ1~θ3, the included angle between the probe center axis CL1 of the impedance matching probe 21c and the center axis CL2 of at least one cantilever probe 22b~22g) is preferably 35°~55° between.

4B~4E, the through hole 202a has a plurality of slots L5~L8, wherein each impedance matching probe 21a~21c corresponds to one of the slots L5, L6, L8, each impedance matching probe The signal transmission parts 211 of the needles 21a~21c respectively pass through one of the slots L5, L6, L8 corresponding to the through hole 202a, and in one of the slots L5, L6, L8 along the first axis X or the second axis X. Two-axis Y advances the needle straight. One of the slots L5 has two sidewalls W5, W6 parallel to the first axis X, wherein at least one cantilever probe 22b-22g is from the sidewalls W5, W6 along the first axis X to the through hole 202a to be tested. Insert the needle obliquely in the direction of object side B.

In addition, in one embodiment, the plurality of first cantilever probes of the probe card 2 include a plurality of cantilever probes 23-23f corresponding to another slot L7, and the plurality of cantilever probes 23-23f are formed by the first An axis X moves straight toward the object-to-be-measured side B of the through hole 202 a , and one end of the cantilever section 231 of each cantilever probe 23 - 23 f is electrically connected to the probe base 20 . Please refer to FIG. 1A at the same time. More specifically, one end of the cantilever section 231 of each cantilever probe 23 - 23f is electrically connected to the contact point on the third surface of the circuit substrate 201 of the probe base 20 . Among them, the probe center axis CL1 of the impedance matching probe 21c in the slot L5 opposite to the other slot L7 corresponding to the plurality of cantilever probes 23~23f and the center axis CL3 of the plurality of cantilever probes 23~23f parallel.

The plurality of second cantilever probes of the probe card 2 have a plurality of cantilever probes 25a~25n, which are inserted along the first axis toward the side of the through hole 202a to be tested, and are located between the plurality of cantilever probes 25~25n. A plurality of cantilever probes 26a~26f are arranged on each side, the cantilever section 250 of each cantilever probe 25~25n has a central axis CL4, and the cantilever section 221 of each cantilever probe 26a~26f has a central axis CL5, at least one of which The central axis CL4 and at least one central axis CL5 have a second included angle (angle θ9) greater than zero degrees, and the second included angle is less than 90 degrees. More specifically, the second included angle (the included angle θ9) is preferably between 35 degrees and 55 degrees.

In the embodiment of Figures 4B-4E, the probe base 20 as shown in Figure 1A and Figure 1B, the probe base 20 further has a fixed substrate 200, a circuit substrate 201, a plurality of bearing bases 200d-200f and positioning Structure 202. Wherein, the fixed substrate 200 has a third surface 200a facing the side B of the object to be tested, a fourth surface 200b facing the side A of the testing machine, and a second through hole 200c passing through the first and fourth surfaces 200a and 200c, so that the through hole 202a Corresponding to the second through hole 200c. The circuit substrate 201 is disposed on the fourth surface 200b. The circuit substrate 201 has a first through hole 201a corresponding to the second through hole 200c. One end of the cantilever section 221 of the plurality of cantilever probes 22-22g is electrically connected to the circuit substrate 201. A plurality of bearing seats 200d~200f are arranged in the first through hole 201a and fixed on the fourth surface 200b, each bearing seat 200d~200f corresponds to one of the impedance matching probes 21a~21c, and each impedance matching probe The signal connection connectors 21 on the 21a-21c are electrically connected to one end of the signal transmission part 211 of the corresponding impedance matching probes 21a-21c. The positioning structure 202 is disposed on the third surface 200 a of the fixed substrate 200 , and the positioning structure 202 has a through hole 202 a for the signal transmission part 211 to pass through. Please also refer to the part shown in FIG. 2C, which corresponds to the positioning structure 202 and the cantilever probes 22-22g. In one embodiment, the positioning structure 202 has a connecting surface 202b and a fixing surface 202c, and the connecting surface 202b is in contact with the third surface 200a. The connecting and fixing surface 202c further has a sealant layer 24 , wherein a part of the cantilever segments 221 of the plurality of cantilever probes 22 - 22g is covered by the sealant layer 24 .

The central axis CL2 in the present invention is determined based on the cantilever section 221 of the cantilever probe 22 ~ 22g from the end surface of the sealant layer 24 to the tip section 220 . The central axis CL3 is determined based on the cantilever section 231 of the cantilever probes 23 - 23 f from the end surface of the sealant layer 24 to the tip section 230 . The central axis CL4 is determined based on the cantilever section 251 of the cantilever probes 25 a - 25 n from the end surface of the sealant layer 24 to the tip section 250 . The central axis CL5 is determined based on the cantilever section 261 of the cantilever probes 26 a - 26 f from the end surface of the sealant layer 24 to the tip section 260 .

In one embodiment, there are a plurality of positioning plates 200g-200i around each bearing base 200d-200f, at least one positioning plate 200g-200i is used to limit the position of the bearing base 200d-200f, and fix the bearing base 200d-200f on the fourth surface 200b.

In the embodiment shown in FIGS. 4B-4F , the tip segment 230 of each cantilever probe 23-23f has a first height H4. The tip segments 250 of some of the plurality of cantilever probes 25 a - 25 n have the second height H5 , for example, the tip segments 250 of the cantilever probes 25 j - 25 n have the second height H5 . The tip segments 250 of another part of the plurality of cantilever probes 25 a - 25 n have a third height H6 , for example, the tip segments 250 of the cantilever probes 25 a - 25 i have a third height H6 . Each tip segment 250 with the second height H5 is used to touch an electrical contact on the first side of the object under test. In the embodiment shown in FIGS. 4B-4F , each tip segment 250 of the cantilever probes 25j-25n having the second height H5 is used to touch an electrical contact on the first side SL1 of the object under test S4. Each tip segment 250 with the third height H6 is used to touch an electrical contact on a second side opposite to the first side of the object under test. In the embodiment shown in FIGS. 4B-4F , each tip segment 250 of the cantilever probes 25a-25n having a third height H6 is used to touch the second side SL2 opposite to the first side SL1 on the object to be tested S4. on the electrical contacts. Wherein the first height H4 is greater than the second height H5 and greater than the third height H6.

In the embodiment shown in FIGS. 4B-4F , referring to the part corresponding to the positioning structure 202 in FIG. 2A , the probe base 20 is located on the side B of the object to be tested and further has a sealant layer 24 . Parts of the cantilever sections 221 of the plurality of cantilever probes 22 - 22 g are covered by the sealing layer 24 . In addition, a part of the cantilever section 231 of the plurality of cantilever probes 23-23f, a part of the cantilever section 251 of the plurality of cantilever probes 25-25n, and a part of the cantilever section 261 of the plurality of cantilever probes 26a-26f are all sealed with glue. covered by layer 24. Each cantilever probe 23 - 23 f has a first length LC1 from the end surface of the sealant layer 24 to the cantilever segment 231 of the tip segment 230 along the first axis X. A part of the plurality of cantilever probes 25a~25n has a second length LC2 from the end face of the sealant layer 24 along the cantilever section 251 along the first axis X, for example, the cantilever probes 25j~25n extend from the end face of the sealant layer 24 along the first axis X. The cantilever section 251 of an axis X has a second length LC2. Another part of the plurality of cantilever probes 25 a - 25 n has a third length LC3 along the cantilever segment 251 along the first axis X from the end surface of the sealing layer 24 . For example, the cantilever section 251 of the cantilever probes 25 a - 25 i along the first axis X from the end surface of the sealing layer 24 has a third length LC3 . Each cantilever section 251 with the second length LC2 is respectively connected to each tip section 250 with the second height H5 for touching an electrical contact on the first side of an object under test. For example, in the embodiment shown in FIGS. 4B-4F , each cantilever segment 251 of the cantilever probes 25j-25n having the second length LC2 is respectively connected to each tip segment 250 having the second height H5, so as to touch the object under test. An electrical contact on the first side SL1 on S4. Each cantilever segment 251 having a third length LC3 is connected to each tip segment 250 having a third height H6 for touching an electrical contact on a second side opposite to the first side on the object under test. For example, in the embodiment shown in FIGS. 4B-4F , each cantilever segment 251 of the cantilever probes 25a-25n having a third height H6 is connected to each tip segment 250 having a third height H6 for touching the object under test. An electrical contact on the second side SL2 opposite to the first side SL1 on S4. Wherein the first length LC1 is greater than the second length LC2 and is greater than the third length LC3.

The first included angle and the second included angle in the present invention are greater than 0 degrees and less than 90 degrees, preferably between 35 degrees and 55 degrees. Mainly because the center axis CL2 of the cantilever probes 22b~22g corresponds to the shape and spatial arrangement of the electrical contacts of the object under test, so that the needle tip section 220 of the cantilever probes 22b~22g contacts the electrical contacts of the object under test. The pin marks may be within a predetermined range of electrical contacts.

The above description is only a description of the preferred implementation or examples of the technical means used to solve the problems in the present invention, and is not intended to limit the scope of the patent implementation of the present invention. That is, all equivalent changes and modifications that are consistent with the scope of the patent application of the present invention, or made according to the scope of the patent of the present invention, are covered by the scope of the patent of the present invention. In the present invention, the object to be tested is not a necessary condition for defining the distance between the first survey area and the second survey area, and the first survey area can also be defined without the test object (S1~S4). The distance between the hit area and the second hit area. For example, in this embodiment, the distance between the first survey area and the second survey area can also be the distance between any tip segment of the probe module PC1 (such as the tip segment 230 of the cantilever probe 23 ) and the probe. The distance between any tip segments of the module PC2 (for example, the tip segment 260 of the cantilever probe 26 ).

2. 2a: probe card 20: probe seat 200: fixed substrate 200a: third surface 200b: fourth surface 200c: second perforation 200d~200f: bearing seat 200g~200i: positioning plate 200j: top surface 200k~200r : side wall part 200s, 200t: reinforcement structure 2001: fixed through hole 201: circuit substrate 201a: first through hole 201b~201d: notch 201e: first surface 201f: second surface 202: positioning structure 202a: through hole 202b: connection Surface 202c: fixed surface 21a~21c: impedance matching probe 210: probe part 210a, 210b, 210c: sub-probe 2100: needle point section 2101: connecting section 211: signal transmission part 2110: outer conductor 212: structural body 2120: Fixed through hole 2121: Signal connector 22~22g: Cantilever probe 220: Needle tip section 221: Cantilever section 222: Turning section 23~23f: Cantilever probe 230: Needle tip section 231: Cantilever section 24: Sealant layer 25a~25n : cantilever probe 250: needle tip section 251: cantilever section 26a~26f: cantilever probe 260: needle tip section 261: cantilever section 27: signal adapter 27a~27c: telecommunications connection interface 270: support frame 271: board body 2710: Connection surface 2711: connection surface 28, 28': signal transfer wire 5: testing machine 91: fixed component A: testing machine side B: object side under test S0: object under test PAD _RF : electrical contact PAD: electrical Contact L1~L4: Side L5~L8: Slot C1: Cantilever Probe Group C2: Cantilever Probe Group CL1: Probe Central Axis CL2: Central Axis CL3: Central Axis CL4: Central Axis CL5: Central Axis H1~ H3: Height DA~DD: Height PC1: Probe module PC2: Probe module S1~Sn: Object to be measured θ1~θ9: Angle TA: End face

FIG. 1A is an exploded perspective view of an embodiment of the probe card of the present invention. FIG. 1B is a schematic top view of an embodiment of the probe card of the present invention. FIG. 1C and FIG. 1D are schematic diagrams of different impedance matching probe embodiments of the present invention. FIG. 1E and FIG. 1F are schematic diagrams of connection of signal transfer wires of the impedance matching probe of the present invention. FIG. 2A is a schematic top view of the configuration relationship between the impedance matching probe and the cantilever probe. FIG. 2B is a three-dimensional schematic diagram of the configuration of the impedance matching probe and the cantilever probe. 2C is a schematic bottom view of the probe card embodiment of the present invention viewed from the side of the object to be tested. 2D and 2E are schematic diagrams of different layout embodiments of the first and cantilever probes of the present invention for signal testing. FIG. 3A is a schematic diagram of an embodiment of the needle arrangement method of the cantilever probe of the present invention. FIG. 3B is a schematic diagram of an embodiment of the needle arrangement method of the cantilever probe of the present invention. 4A to 4C are schematic diagrams of another embodiment of the probe card swing needle of the present invention. FIG. 4D is a schematic top view of another embodiment of the probe card of the present invention. FIG. 4E and FIG. 4F are schematic diagrams of an embodiment of the layout of the cantilever probe pin layer on the fourth side of the positioning structure when one object under test performs a radio frequency characteristic test and another object under test performs a signal characteristic test in the present invention.

2: Probe card

20: Probe seat

200: fixed substrate

200a: third surface

200b: fourth surface

200c: second perforation

200d~200f: bearing seat

200g~200i: Positioning plate

200j: top face

200k~200r: side wall

200s: reinforcement structure

2001: fixed through hole

201: circuit substrate

201a: First piercing

201b~201d: notch

201e: First Surface

201f: Second Surface

202: Positioning structure

202a: through hole

21a~21c: impedance matching probe

210: Probe Department

210a, 210b, 210c: subprobes

2100: needle tip segment

2101: Connection section

211: Signal transmission department

2110: Outer conductor

212: Structural ontology

2120: fixed through hole

2121: Signal connection connector

22~22g: cantilever probe

220: needle point segment

221: Cantilever section

222: Turning point

23~23f: Cantilever probe

230: needle point segment

231: Cantilever section

28: Signal transfer cable

91: fixed element

A: Test machine side

B: The side of the object to be measured

TA: end face

Claims (15)

A probe card integrating different electrical tests is used to test the electrical properties of an object under test. The probe card includes: a plurality of probes comprising at least one impedance matching probe and a plurality of cantilever probes; and A probe base has an object-to-be-tested side and a testing machine side corresponding to the object-to-be-tested side, and the probe base includes: A circuit substrate, the circuit substrate has a first surface facing the object-to-be-tested side, a second surface facing the testing machine side, and a first through hole penetrating the first surface and the second surface; and a fixed substrate, the fixed substrate has a third surface facing the object to be tested, a fourth surface facing the testing machine, and a second through hole passing through the third surface and the fourth surface; Wherein, the fixed substrate is arranged on the circuit substrate with the fourth surface facing the first surface, the second through hole corresponds to the first through hole, and the diameter of the first through hole is larger than the diameter of the second through hole, The at least one impedance matching probe is disposed on the fourth surface of the fixed substrate through the first through hole, a probe portion of the at least one impedance matching probe passes through the second through hole, each of the cantilever probes One end of one cantilever section is electrically connected to the first surface of the circuit substrate, and the other end of one cantilever section of each of the cantilever probes is connected to a tip section corresponding to each of the cantilever probes, and each of the cantilever probes The needle tip segment is disposed on the side of the analyte of the second perforation. The probe card integrating different electrical tests as described in claim 1, wherein the probe base further has a plurality of bearing bases, which are arranged on the fourth surface of the fixed substrate, and each bearing base corresponds to one of the One of the impedance matching probes, wherein there is at least one positioning plate around each of the bearing bases, and the at least one positioning plate is adjacent to the bearing base to limit the impedance matching of the one of the bearing bases. The position of the probe. The probe card integrating different electrical tests as described in claim 2, wherein each of the bearing seats has a top surface, a first side wall, a second side wall, a third side wall and a fourth Side wall parts, these side wall parts respectively surround the top part, the first side wall part is corresponding to the probe part facing the impedance matching probe disposed thereon, and the second side wall part is located on the carrier relative to the probe part. On the opposite side of the first side wall portion, and away from the probe portion of the impedance matching probe disposed thereon, the third side wall portion and the fourth side wall portion are respectively located on the first side wall portion and the second side wall portion Between the parts, and adjacent to the first side wall part, wherein the at least one positioning plate is arranged on at least one of the second side wall part, the third side wall part and the fourth side wall part. The probe card for integrating different electrical tests as described in claim 3, wherein the at least one positioning plate is provided to protrude from the top surface. The probe card for integrating different electrical tests as described in claim 2, wherein the bearing seats are in a T-shape when viewed on a plane. The probe card integrating different electrical tests as described in claim 1, wherein each of the impedance matching probes has a probe part and a signal transmission part connected to the probe part, and the probe part has at least Two needle tip segments, one end of the signal transmission part is located on the tester side of the circuit substrate and higher than the second surface, the signal transmission part passes through the first through hole and the second through hole, so that at least the probe part The two needle tip segments are located on the side of the fixed substrate and lower than the third surface. The probe card that integrates different electrical tests as described in claim 1 further includes at least one signal adapter set on the probe base, the signal adapter has a board, and the board is located on the at least one The impedance matches the tester side of the probe. The probe card integrating different electrical tests as described in claim 7, wherein the signal adapter seat further has a support frame, one end of which is set on the second surface of the circuit substrate of the probe base or on the probe The other end of the fourth surface of the fixed base plate of the needle base is connected with the board body of the signal adapter base. The probe card integrating different electrical tests as described in claim item 7, wherein the board of the signal adapter base has a plurality of telecommunications connection interfaces, and a plurality of signal transfer lines are arranged on the signal adapter base. Between the board body and one end of a signal transmission part of the impedance matching probe, one end of each signal transfer line is coupled to the telecommunications connection interface, and the other end is electrically connected to the signal connection socket of the corresponding impedance matching probe. connect. According to the probe card integrating different electrical tests described in claim 6, the signal transmission part has a probe central axis, and the plurality of cantilever probes have at least one first probe and a plurality of second probes, each At least one side of the impedance matching probe has at least one of the first probes, and the central axis of the probe has a first angle greater than zero with the first central axis of the at least one first probe; the impedances The matching probe has a first impedance matching probe, the opposite of the first impedance matching probe has the plurality of second probes, and the probe central axis of the first impedance matching probe is connected to the second probes. The second central axis of the needle has a second included angle equal to zero degrees. The probe card integrating different electrical tests as described in claim 10, wherein the probe base further includes a positioning structure, the positioning structure has a connection surface and a fixing surface, and the connection surface is connected to the third surface , the fixed surface is further provided with a sealant layer, wherein a part of the cantilever sections of the plurality of cantilever probes is disposed on the fixed surface and covered by the sealant layer, and the cantilever sections extend and connect toward the tip section, The first central axis is the axial direction in which each first probe extends from the end surface of the sealant layer along the tip section of the first probe, and the second central axis is the axial direction in which each second probe extends from the sealing layer. The end face of the adhesive layer is along the axis along which the needle tip section of the second probe extends. The probe card integrating different electrical tests as described in Claim 1, wherein the fourth surface of the fixed substrate is lower than the second surface of the circuit substrate. The probe card integrating different electrical tests as described in Claim 1, wherein a plurality of reinforcement structures are arranged on the fourth surface of the fixed substrate, and the reinforcement structures are arranged between the impedance matching probes. The probe card for integrating different electrical tests according to claim 13, wherein the reinforcing structure radially extends from a position close to the first through hole to the outer periphery of the fixed substrate. The probe card integrating different electrical tests as described in claim item 10, wherein the range of the first included angle and the second included angle is between 35 degrees and 55 degrees, so that the first central axis of the cantilever probe corresponds to a The shape and spatial arrangement of the electrical contacts of the object under test, and the needle marks caused by contacting the tip section of the cantilever probe with the electrical contacts of the object under test can be within the preset range of the electrical contacts.

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