TWI786165B - Protection sheet and layered body with protection sheet - Google Patents
Protection sheet and layered body with protection sheet Download PDFInfo
- Publication number
- TWI786165B TWI786165B TW107128404A TW107128404A TWI786165B TW I786165 B TWI786165 B TW I786165B TW 107128404 A TW107128404 A TW 107128404A TW 107128404 A TW107128404 A TW 107128404A TW I786165 B TWI786165 B TW I786165B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- protective sheet
- mentioned
- fluororesin
- protected
- Prior art date
Links
- 239000012790 adhesive layer Substances 0.000 claims abstract description 145
- 239000000853 adhesive Substances 0.000 claims abstract description 87
- 230000001070 adhesive effect Effects 0.000 claims abstract description 83
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 7
- 239000011737 fluorine Substances 0.000 claims abstract description 7
- 230000001681 protective effect Effects 0.000 claims description 107
- 239000000463 material Substances 0.000 claims description 28
- 125000000524 functional group Chemical group 0.000 claims description 15
- 239000003505 polymerization initiator Substances 0.000 claims description 12
- 229920000578 graft copolymer Polymers 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 125000005373 siloxane group Chemical class [SiH2](O*)* 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 239000000412 dendrimer Substances 0.000 claims 1
- 229920000736 dendritic polymer Polymers 0.000 claims 1
- 238000006384 oligomerization reaction Methods 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 26
- 230000001678 irradiating effect Effects 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 description 25
- 239000000178 monomer Substances 0.000 description 23
- 206010040844 Skin exfoliation Diseases 0.000 description 14
- 239000003431 cross linking reagent Substances 0.000 description 14
- 239000004925 Acrylic resin Substances 0.000 description 13
- 229920000178 Acrylic resin Polymers 0.000 description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 12
- -1 dimethylsiloxane group Chemical group 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229920005862 polyol Polymers 0.000 description 7
- 150000003077 polyols Chemical class 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- 125000001153 fluoro group Chemical group F* 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/04—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing halogen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Materials For Medical Uses (AREA)
Abstract
Description
本發明係關於一種保護片材及附保護片材之積層體。The present invention relates to a protective sheet and a laminate with the protective sheet.
例如,於軟性印刷電路基板(Flexible printed circuits:FPC)或印刷基板(Printed circuit board:PCB)等之製造步驟中,有產生上述基板之因劃傷或化學品導致之污染、因製造步驟中所使用之化學品或製造步驟中之加熱導致之上述基板之劣化之情形。因此,於上述基板之製造步驟中,為了防止如上所述之劃傷或污染、劣化等,提出有使用保護上述基板之表面之保護片材之技術(例如專利文獻1~3)。此種保護片材例如具有基材、及配置於上述基材之一個面之黏著層。又,保護片材係最終自作為被保護構件之製品剝離之構件。 [先前技術文獻] [專利文獻]For example, in the manufacturing steps of flexible printed circuit boards (Flexible printed circuits: FPC) or printed circuit boards (Printed circuit board: PCB), there are scratches or contamination of the above-mentioned boards caused by chemicals. Deterioration of the above-mentioned substrates due to the chemicals used or the heating in the manufacturing steps. Therefore, in order to prevent the above-mentioned scratches, contamination, deterioration, etc. in the manufacturing steps of the above-mentioned substrates, a technique of using a protective sheet for protecting the surface of the above-mentioned substrates has been proposed (for example,
[專利文獻1]日本專利第5361760號 [專利文獻2]日本專利第5875318號 [專利文獻3]日本專利特開2017-8173號公報[Patent Document 1] Japanese Patent No. 5361760 [Patent Document 2] Japanese Patent No. 5875318 [Patent Document 3] Japanese Patent Laid-Open No. 2017-8173
[發明所欲解決之問題][Problem to be solved by the invention]
貼附於被保護構件之保護片材係最終自被保護構件剝離之構件。因此,對於保護片材,較佳為使用具有可自被保護構件將保護片材剝離之特性之黏著層。作為此種黏著層,先前使用黏著力為微黏著之黏著層。黏著力為微黏著之上述黏著層具備具有特定之剝離力之優點,另一方面,因初期黏著力為微黏著,故而無法充分密接於被保護構件,於保護被保護構件之功能方面存在課題。針對該問題,有可藉由照射能量線而降低黏著力,提高剝離力之黏著層。藉由照射能量線而降低黏著力之上述黏著層可提高照射能量線之前之初期黏著力,且使照射能量線後之黏著力自初期黏著力降低。因此,使用上述黏著層之保護片材可提高對被保護構件之密接性,且亦容易地進行自被保護構件之剝離。The protective sheet attached to the member to be protected is a member that is finally peeled off from the member to be protected. Therefore, for the protective sheet, it is preferable to use an adhesive layer having a property of peeling the protective sheet from the member to be protected. As such an adhesive layer, an adhesive layer whose adhesive force is slightly adhesive has been used previously. The above-mentioned adhesive layer with slight adhesion has the advantage of having a specific peeling force. On the other hand, since the initial adhesion is slight adhesion, it cannot be fully adhered to the protected member, and there is a problem in the function of protecting the protected member. To solve this problem, there is an adhesive layer that can reduce the adhesive force and increase the peeling force by irradiating energy rays. The adhesive layer whose adhesive force is reduced by energy ray irradiation can increase the initial adhesive force before energy ray irradiation, and can reduce the adhesive force after energy ray irradiation from the initial adhesive force. Therefore, the protective sheet using the above-mentioned adhesive layer can improve the adhesiveness to the member to be protected, and can also perform peeling from the member to be protected easily.
近年來,使用各種製品作為被保護構件,結果例如於被保護構件中貼附保護片材之側之面為範圍廣之寬廣面積之情形時,發現如下之新穎課題。即,發現於將貼附於被保護構件之保護片材剝離時,自被保護構件剝離保護片材所需之力增加,無法自被保護構件容易地剝離保護片材之新穎課題。In recent years, various products have been used as protected members. As a result, for example, when the surface of the protected member on which the protective sheet is attached has a wide area, the following novel problems have been found. That is, when the protective sheet attached to the member to be protected is peeled off, the force required to peel the protective sheet from the member to be protected increases, and the novel problem that the protective sheet cannot be easily peeled off from the member to be protected has been found.
本發明係鑒於上述實際情況而成立者,其主要目的在於提供一種可使用可藉由照射能量線而降低黏著力之黏著層,更容易地進行自被保護構件之剝離之保護片材。 [解決問題之技術手段]The present invention was established in view of the above circumstances, and its main purpose is to provide a protective sheet that can be more easily peeled off from a protected member using an adhesive layer that can reduce the adhesive force by irradiating energy rays. [Technical means to solve the problem]
本發明提供一種保護片材,其具有黏著層、及配置於上述黏著層之一個面之基材,且上述黏著層具有藉由照射能量線而黏著力自初期黏著力降低之特性,上述黏著層含有氟樹脂。The present invention provides a protective sheet comprising an adhesive layer and a base material disposed on one side of the adhesive layer, and the adhesive layer has the characteristic that the adhesive force is reduced from the initial adhesive force by irradiation of energy rays, and the adhesive layer Contains fluororesin.
又,於本發明中,提供一種附保護片材之積層體,其係將保護片材與被保護構件積層而成者,且上述保護片材具有黏著層、及配置於上述黏著層之一個面之基材,上述黏著層具有藉由照射能量線而黏著力自初期黏著力降低之特性,上述黏著層含有氟樹脂。 [發明之效果]Also, in the present invention, there is provided a laminate with a protective sheet, which is formed by laminating the protective sheet and the member to be protected, wherein the protective sheet has an adhesive layer and is arranged on one surface of the adhesive layer. In the base material, the above-mentioned adhesive layer has the characteristic that the adhesive force is reduced from the initial adhesive force by irradiation of energy rays, and the above-mentioned adhesive layer contains a fluororesin. [Effect of Invention]
本發明之保護片材具有可使用可藉由照射能量線而降低黏著力之黏著層,更容易地進行自被保護構件之剝離之效果。The protective sheet of the present invention has the effect of enabling easier peeling from the member to be protected by using an adhesive layer that can reduce adhesive force by irradiating energy rays.
於本說明書中,於設為某構件或某區域等之某構成位於其他構件或其他區域等之其他構成之「上(或下)」或「面」之情形時,只要無特別限定,則其不僅包含位於其他構成之正上方(或正下方)之情形,亦包含位於其他構成之上方(或下方)之情形,即,亦包含於其他構成之上方(或下方)於中間包含其他構成元件之情形。In this specification, when it is assumed that a certain component of a certain member or a certain region is positioned “on (or below)” or “surface” of other components of another member or other region, unless otherwise specified, the It includes not only the situation of being located directly above (or directly below) other components, but also the situation of being located above (or below) other components, that is, it also includes the situation of being above (or below) other components and including other components in the middle situation.
以下,一面參照圖式等一面說明本發明之實施態樣。然而,本發明能以大量不同之態樣實施,並不限定於以下例示之實施態樣之記載內容而解釋。又,關於圖式,為了更明確地說明,有與實施態樣相比而對各部之寬度、厚度、形狀等模式性地表示之情形,但僅為一例,並不限定本發明之解釋。又,於本說明書與各圖中,關於既有之圖,有時對與上述者相同之元件標註相同之符號,適宜省略詳細之說明。又,為了方便說明,有使用上方或下方之語句進行說明之情形,但上下方向亦可反轉。Hereinafter, embodiments of the present invention will be described with reference to the drawings and the like. However, the present invention can be implemented in many different forms, and should not be construed as limited to the description of the embodiments exemplified below. In addition, the drawings may schematically show the width, thickness, shape, etc. of each part in comparison with the embodiments for clearer description, but these are just examples and do not limit the interpretation of the present invention. In addition, in this specification and each drawing, with regard to existing drawings, the same reference numerals may be assigned to the same elements as those described above, and detailed descriptions are appropriately omitted. In addition, for the convenience of explanation, there are cases where an upper or lower phrase is used for explanation, but the up and down direction can also be reversed.
以下,對本發明之保護片材及附保護片材之積層體詳細地說明。 再者,於本發明中,有將「片材」及「膜」作為同義使用之情形。Hereinafter, the protective sheet and the laminate with the protective sheet of the present invention will be described in detail. In addition, in this invention, a "sheet" and a "film" may be used synonymously.
A.保護片材 本發明之保護片材係具有黏著層、及配置於上述黏著層之一個面之基材,且上述黏著層具有藉由照射能量線而黏著力自初期黏著力降低之特性,上述黏著層含有氟樹脂之構件。A. Protective sheet The protective sheet of the present invention has an adhesive layer and a base material disposed on one side of the adhesive layer, and the adhesive layer has the characteristic that the adhesive force is reduced from the initial adhesive force by irradiation of energy rays, The above-mentioned adhesive layer contains a member of fluororesin.
使用圖對本發明之保護片材進行說明。圖1係表示本發明之保護片材之一例之概略剖視圖,圖2係表示使本發明之保護片材積層於被保護部的附保護片材之積層體之一例之概略剖視圖。如圖1所示般,本發明之保護片材10具有黏著層1、及配置於黏著層1之一個面之基材2。又,本發明之黏著層1具有藉由照射能量線而黏著力自初期黏著力降低之特性,黏著層1含有氟樹脂。此種本發明之保護片材係如圖2所示般貼附於被保護構件20之表面而保護被保護構件20之表面之構件。The protective sheet of the present invention will be described using drawings. Fig. 1 is a schematic cross-sectional view showing an example of a protective sheet of the present invention, and Fig. 2 is a schematic cross-sectional view showing an example of a laminate with a protective sheet in which the protective sheet of the present invention is laminated on a portion to be protected. As shown in FIG. 1 , the
近年來,使用各種製品作為被保護構件,結果例如於被保護構件中貼附保護片材之側之面為範圍廣之寬廣面積之情形時,發現如下之新穎課題。即,發現於將貼附於被保護構件之保護片材剝離時,自被保護構件剝離保護片材所需之力增加,而無法自被保護構件容易地剝離保護片材之新穎課題。 又,近年來,伴隨各種電子構件等之精密化或複雜化,謀求被保護構件之薄膜化、功能之積體化或微細化。因此,有被保護構件本身或被保護構件之表面容易破壞之傾向,為了保護被保護構件而需要保護片材。另一方面,於存在被保護構件本身或被保護構件之表面容易破壞之傾向之情形時,即便藉由保護片材保護被保護構件,亦有於自被保護構件將保護片材剝離時,對被保護構件施加負荷而破壞被保護構件之問題。 相對於此,根據本發明,藉由使黏著層含有具有疏水性之氟樹脂,可於將保護片材貼附於被保護構件後,自被保護構件將保護片材剝離時,使黏著層之黏著力更良好地降低,可發揮良好之剝離性。因此,即便於被保護構件中貼附保護片材之側之面為範圍廣之寬廣面積之情形時,亦可於將貼附於被保護構件之保護片材剝離時,抑制自被保護構件剝離保護片材所需之力之增大,自被保護構件容易地剝離保護片材。又,即便於被保護構件本身或被保護構件之表面容易破壞之情形時,亦可於自被保護構件將保護片材剝離時,抑制對被保護構件之負荷,從而抑制被保護構件之破壞。 可認為其原因在於,藉由黏著層中含有氟樹脂,黏著層之表面自由能降低。In recent years, various products have been used as protected members. As a result, for example, when the surface of the protected member on which the protective sheet is attached has a wide area, the following novel problems have been found. That is, when the protective sheet attached to the member to be protected is peeled off, the force required to peel the protective sheet from the member to be protected increases, and the novel problem that the protective sheet cannot be easily peeled off from the member to be protected has been found. In addition, in recent years, along with the precision and complexity of various electronic components, etc., thinning of protected members and integration or miniaturization of functions have been sought. Therefore, the member to be protected itself or the surface of the member to be protected tends to be easily damaged, and a protective sheet is required in order to protect the member to be protected. On the other hand, when the member to be protected itself or the surface of the member to be protected tends to be easily damaged, even if the member to be protected is protected by a protective sheet, when the protective sheet is peeled off from the member to be protected, the The problem of damage to the protected component due to the load applied to the protected component. On the other hand, according to the present invention, by making the adhesive layer contain a hydrophobic fluororesin, after the protective sheet is attached to the member to be protected, when the protective sheet is peeled off from the member to be protected, the adhesion of the adhesive layer can be reduced. The adhesive force is lowered more favorably, and good peelability can be exerted. Therefore, even when the surface of the member to be protected on which the protective sheet is attached has a wide area, when the protective sheet attached to the member to be protected is peeled off, peeling from the member to be protected can be suppressed. The increase in the force required for the protective sheet allows the protective sheet to be easily peeled off from the member to be protected. In addition, even when the protected member itself or the surface of the protected member is easily damaged, when the protective sheet is peeled off from the protected member, the load on the protected member can be suppressed, thereby suppressing damage to the protected member. The reason for this is considered to be that the surface free energy of the adhesive layer is lowered by containing the fluororesin in the adhesive layer.
1.黏著層 本發明之黏著層係配置於基材之一個面之構件。又,黏著層係與被保護構件之表面密接之構件。此處,所謂「黏著」,係指包含在「接著」內之概念。黏著係以暫時之接著現象之含義使用,相對於此,接著係以永久之接著現象之含義使用,在這一方面存在區別(岩波書店 理化學事典第5版)。所謂「黏著性」及「黏著力」,係指藉由感壓進行接著之性質及彼時之接著力。1. Adhesive layer The adhesive layer of the present invention is a member arranged on one side of the substrate. Also, the adhesive layer is a member that is in close contact with the surface of the member to be protected. Here, the so-called "adhesion" refers to the concept included in "next". Adhesion is used in the sense of a temporary bonding phenomenon, whereas sticking is used in the sense of a permanent bonding phenomenon, and there is a difference in this respect (Iwanami Shoten Rikaji Jiki 5th edition). The so-called "adhesiveness" and "adhesive force" refer to the property of bonding by sensing pressure and the bonding force at that time.
以下,對黏著層之特性及組成進行說明。Hereinafter, the characteristics and composition of the adhesive layer will be described.
(1)特性 本發明之黏著層係用以將保護片材貼附於被保護構件之層。又,黏著層具有藉由照射能量線而黏著力自初期黏著力降低之特性。換言之,黏著層具有藉由照射能量線而自被保護構件剝離之再剝離性。此處,所謂黏著層顯示再剝離性,係指可藉由黏著層而將保護片材黏著及密接於被保護構件而固定,且於自被保護構件將保護片材剝離時,可不破壞被保護構件而抑制於被保護構件表面產生糊劑殘留並剝離。(1) Characteristics The adhesive layer of the present invention is a layer for affixing a protective sheet to a member to be protected. In addition, the adhesive layer has a characteristic that the adhesive force is reduced from the initial adhesive force by irradiation of energy rays. In other words, the adhesive layer has re-peelability to be peeled off from the protected member by irradiation of energy rays. Here, the term "adhesive layer showing re-peelability" means that the protective sheet can be adhered and fixed to the member to be protected by the adhesive layer, and the protected sheet can not be damaged when the protective sheet is peeled off from the member to be protected. Components to prevent paste residue and peeling on the surface of the protected component.
本發明之黏著層可藉由初期黏著力而充分地密接固定於被保護構件之表面。又,於自被保護構件將保護片材剝離時,藉由對黏著層照射能量線,黏著層之黏著力降低而剝離性提高,故而可抑制於被保護構件表面產生糊劑殘留,容易地剝離保護片材。The adhesive layer of the present invention can be fully adhered and fixed on the surface of the protected member through the initial adhesive force. In addition, when peeling the protective sheet from the member to be protected, by irradiating the adhesive layer with energy rays, the adhesive force of the adhesive layer is reduced and the releasability is improved. Therefore, it is possible to suppress the occurrence of paste residue on the surface of the member to be protected, and it can be easily peeled off. Protect the sheet.
此處,所謂本發明之黏著層藉由能量線照射而自被保護構件剝離,係指本發明之黏著層可於受到能量線照射之前顯示強黏著性而密接固定於被保護構件,但若受到能量線之照射,則黏著力明顯降低而可自被保護構件容易地剝離。具體而言,本發明之黏著層較佳為能量線照射前之黏著力為0.5 N/25 mm以上且20 N/25 mm以下,能量線照射後之黏著力為2.0 N/25 mm以下。黏著層之黏著力可藉由以下方式測定:以聚酯膜作為基材,於上述基材之單面使用以使本發明之黏著層成為下述厚度之範圍內之方式所形成之黏著性基材,於依據JIS Z0237之標準之條件下層壓於被接著體,最後將試片於剝離角180°、室溫下之條件下,於試片之長度方向上剝離。又,於此種180°剝離強度測定時,例如可使用Instron公司製造之萬能試驗機5565。Here, the so-called adhesive layer of the present invention is peeled from the member to be protected by energy ray irradiation, which means that the adhesive layer of the present invention can show strong adhesiveness and be tightly fixed on the member to be protected before being irradiated by energy rays. The irradiation of energy rays significantly reduces the adhesive force and can be easily peeled off from the protected member. Specifically, the adhesive layer of the present invention preferably has an adhesive force of 0.5 N/25 mm or more and 20 N/25 mm or less before energy ray irradiation, and an adhesive force of 2.0 N/25 mm or less after energy ray irradiation. The adhesive force of the adhesive layer can be measured by using the polyester film as the base material, and using the adhesive base formed in such a way that the adhesive layer of the present invention falls within the following thickness range, to be used on one side of the above base material. The material is laminated on the substrate under the conditions of JIS Z0237, and finally the test piece is peeled off in the longitudinal direction of the test piece at a peeling angle of 180° and at room temperature. In addition, in such 180 degree peel strength measurement, the universal testing machine 5565 by Instron Corporation can be used, for example.
作為照射至黏著層之能量線,例如除遠紫外線、紫外線、近紫外線、紅外線等光線、X射線、γ射線等電磁波以外,可列舉電子束、質子束、中子束等。其中,就通用性等觀點而言,較佳為紫外線。Examples of energy rays irradiated to the adhesive layer include electron beams, proton beams, and neutron beams in addition to light rays such as far ultraviolet rays, ultraviolet rays, near ultraviolet rays, and infrared rays, and electromagnetic waves such as X-rays and γ-rays. Among these, ultraviolet rays are preferable from the viewpoint of versatility and the like.
本發明之黏著層較佳為具有特定之透光性。具體而言,本發明之黏著層之依據JIS K-7136之霧度值較佳為5%以下,其中,較佳為2%以下,尤佳為1%以下。藉由黏著層之霧度值為上述範圍內,可製成具有良好之透光性之黏著層。因此,可於將保護片材貼附於被保護構件後,對保護片材中之黏著層照射能量線而弱黏著化時,對黏著層充分地照射能量線。又,藉由使黏著層具有良好之透光性,亦可提高作為保護片材之透光性。因此,於在製造過程中對貼附有保護片材之被保護構件進行光照射時,可抑制光被保護片材阻斷之不良情況之產生。再者,黏著層之霧度值例如可使用霧度、透光率計(村上色彩技術研究所製造,製品型號:HM-150)進行測定。The adhesive layer of the present invention preferably has specific light transmittance. Specifically, the haze value according to JIS K-7136 of the adhesive layer of the present invention is preferably 5% or less, particularly preferably 2% or less, particularly preferably 1% or less. When the haze value of the adhesive layer is within the above range, an adhesive layer with good light transmission can be produced. Therefore, when the adhesive layer in the protective sheet is irradiated with energy rays to weaken the adhesion after the protective sheet is attached to the member to be protected, the adhesive layer can be sufficiently irradiated with energy rays. Moreover, by making the adhesive layer have favorable light-transmittance, the light-transmittance as a protective sheet can also be improved. Therefore, when light is irradiated to the member to be protected to which the protective sheet is attached during the manufacturing process, it is possible to suppress occurrence of a problem in which light is blocked by the protective sheet. Furthermore, the haze value of the adhesive layer can be measured, for example, using a haze and light transmittance meter (manufactured by Murakami Color Technology Laboratory, product model: HM-150).
(2)組成 本發明之黏著層之組成只要為含有氟樹脂且於能量線照射前後顯示特定之黏著力者即可。作為此種黏著層,例如可設為除氟樹脂以外,至少包含樹脂(黏著主劑)、能量線聚合性低聚物、及聚合起始劑之組成。藉由含有氟樹脂,可於將保護片材貼附於被保護構件後,對保護片材中之黏著層進行能量照射時,充分降低黏著力,而獲得良好之剝離性。又,可藉由照射能量線而使本發明之黏著層中所含之能量線聚合性低聚物硬化,降低黏著力,又,此時凝聚力提高,故而不易產生向被保護構件之轉接著,剝離變得容易。(2) Composition The composition of the adhesive layer of the present invention may contain fluororesin and exhibit specific adhesive force before and after energy ray irradiation. As such an adhesive layer, for example, in addition to a fluororesin, at least a resin (adhesive main agent), an energy ray polymerizable oligomer, and a polymerization initiator can be used. By containing the fluororesin, after the protective sheet is attached to the member to be protected, when energy is irradiated to the adhesive layer in the protective sheet, the adhesive force can be sufficiently reduced to obtain good peelability. In addition, the energy ray polymerizable oligomer contained in the adhesive layer of the present invention can be cured by irradiating energy rays, thereby reducing the adhesive force, and at this time, the cohesive force is improved, so it is difficult to cause transfer to the protected member. , peeling becomes easy.
以下,對構成黏著層之黏著劑組成物中所含之各組成進行說明。Hereinafter, each component contained in the adhesive composition which comprises an adhesive layer is demonstrated.
(a)氟樹脂 所謂本發明之「氟樹脂」,係指至少包含氟之樹脂。作為此種氟樹脂,例如可列舉:於多元醇樹脂之骨架中具有氟基之樹脂。作為上述氟基,例如可列舉氟伸烷基。氟樹脂之氟含有率、即多元醇樹脂之骨架中之氟基之含有率例如較佳為0.5質量%以上,其中,較佳為1質量%以上。藉由使多元醇樹脂之骨架中之氟基之含有率具有上述下限,可於將保護片材貼附於被保護構件後,對保護片材中之黏著層進行能量照射時,充分降低黏著力,獲得良好之剝離性。又,氟樹脂之氟含有率、即多元醇樹脂之骨架中之氟基之含有率例如較佳為100質量%以下,其中,較佳為80質量%以下。藉由使多元醇樹脂之骨架中之氟基之含有率具有上述上限,可抑制與下述其他組成物之相溶性之降低。(a) Fluororesin The "fluororesin" in the present invention means a resin containing at least fluorine. As such a fluororesin, the resin which has a fluorine group in the frame|skeleton of a polyol resin is mentioned, for example. As said fluorine group, a fluoroalkylene group is mentioned, for example. The fluorine content of the fluororesin, that is, the content of fluorine groups in the skeleton of the polyol resin is, for example, preferably at least 0.5% by mass, and particularly preferably at least 1% by mass. By making the fluorine group content in the skeleton of the polyol resin have the above-mentioned lower limit, the adhesive force can be sufficiently reduced when energy is irradiated to the adhesive layer in the protective sheet after the protective sheet is attached to the member to be protected. , to obtain good peelability. Also, the fluorine content of the fluororesin, that is, the content of fluorine groups in the skeleton of the polyol resin is, for example, preferably 100% by mass or less, especially preferably 80% by mass or less. By making the content rate of the fluorine group in the frame|skeleton of a polyol resin have the said upper limit, the fall of the compatibility with the following other components can be suppressed.
多元醇樹脂之重量平均分子量(Mw)例如可設為20000以上且400000以下。藉由使多元醇樹脂之重量平均分子量為上述範圍內,可抑制氟樹脂與溶劑或其他交聯劑之相溶性之降低。The weight average molecular weight (Mw) of a polyol resin can be made into 20000 or more and 400000 or less, for example. By setting the weight average molecular weight of the polyol resin within the above range, it is possible to suppress a decrease in the compatibility of the fluororesin with a solvent or other crosslinking agents.
本發明之氟樹脂較佳為含官能基之氟樹脂。此處,所謂含官能基之氟樹脂,係指具有官能基之氟樹脂。於本發明中,其中較佳為氟樹脂具有交聯性官能基。氟樹脂係藉由具有交聯性官能基,而使該交聯性官能基與下述組成物進行交聯鍵結而硬化,故而可降低黏著層之黏著力。作為交聯性官能基,例如可列舉羥基或烷氧基等,其中較佳為羥基。又,於本發明中,較佳為僅具有羥基作為交聯性官能基。氟樹脂之羥值例如較佳為5 mgKOH/g以上且250 mgKOH/g以下,其中較佳為10 mgKOH/g以上且200 mgKOH/g以下。藉由氟樹脂之羥值具有上述下限,可抑制黏著層之交聯密度之降低,故而可獲得所需之黏著力。又,藉由氟樹脂之羥值具有上述上限,可抑制氟樹脂與溶劑之相溶性之降低。The fluororesin of the present invention is preferably a functional group-containing fluororesin. Here, the term "functional group-containing fluororesin" refers to a fluororesin having a functional group. In the present invention, it is preferable that the fluororesin has a crosslinkable functional group. The fluororesin has a cross-linkable functional group, and the cross-linkable functional group is cross-linked with the following composition to harden, so the adhesive force of the adhesive layer can be reduced. As a crosslinkable functional group, a hydroxyl group, an alkoxy group, etc. are mentioned, for example, Among them, a hydroxyl group is preferable. Moreover, in this invention, it is preferable to have only a hydroxyl group as a crosslinkable functional group. The hydroxyl value of the fluororesin is, for example, preferably not less than 5 mgKOH/g and not more than 250 mgKOH/g, particularly preferably not less than 10 mgKOH/g and not more than 200 mgKOH/g. Since the hydroxyl value of the fluororesin has the above-mentioned lower limit, the reduction of the crosslink density of the adhesive layer can be suppressed, so that desired adhesive force can be obtained. Moreover, since the hydroxyl value of a fluororesin has the said upper limit, the fall of the compatibility of a fluororesin and a solvent can be suppressed.
於本發明中,較佳為含官能基之氟樹脂為使氟樹脂與矽氧烷複合化而成之矽氧烷接枝型聚合物。具體而言,較佳為含官能基之氟樹脂於氟樹脂之分子骨架中具有矽氧烷基作為接枝鏈之分子結構。作為上述矽氧烷基,例如可列舉二甲基矽氧烷基。於本發明中,藉由含官能基之氟樹脂為矽氧烷接枝型聚合物,可於將保護片材貼附於被保護構件後,對保護片材中之黏著層進行能量照射時,充分降低黏著力,獲得良好之剝離性。作為氟樹脂中之二甲基矽氧烷基之含有率,例如較佳為設為5質量%以上且100質量%以下,其中較佳為10質量%以上且90質量%以下。藉由氟樹脂中之二甲基矽氧烷基之含有率為上述範圍內,可於將保護片材貼附於被保護構件後,對保護片材中之黏著層進行能量照射時,充分降低黏著力,獲得良好之剝離性。In the present invention, it is preferable that the functional group-containing fluororesin is a siloxane-grafted polymer formed by compounding fluororesin and siloxane. Specifically, it is preferable that the functional group-containing fluororesin has a molecular structure in which siloxane groups are grafted chains in the molecular skeleton of the fluororesin. As said siloxane group, a dimethylsiloxane group is mentioned, for example. In the present invention, since the functional group-containing fluororesin is a siloxane-grafted polymer, after the protective sheet is attached to the member to be protected, when energy is irradiated to the adhesive layer in the protective sheet, Sufficiently reduce the adhesive force and obtain good peelability. The content of the dimethylsiloxane group in the fluororesin is, for example, preferably from 5% by mass to 100% by mass, particularly preferably from 10% by mass to 90% by mass. When the content of the dimethylsiloxane group in the fluororesin is within the above range, the adhesive layer in the protective sheet can be irradiated with energy after the protective sheet is attached to the member to be protected. Adhesive force, good peelability.
作為如上所述之氟樹脂之具體例,例如可列舉:作為市售品之ZX-007C、ZX-001、ZX-017、ZX-022、ZX-022H、ZX-047D、ZX-058A、ZX-212、ZX-201、ZX-202(T&K TOKA公司製造之氟樹脂-矽氧烷接枝型聚合物),或KP-911(信越化學工業公司製造之氟聚矽氧),Lumiflon LF-100、LF-200、LF-302、LF-400、LF-554、LF-600、LF-986N(旭硝子公司製造)等。Specific examples of the aforementioned fluororesins include, for example, commercially available ZX-007C, ZX-001, ZX-017, ZX-022, ZX-022H, ZX-047D, ZX-058A, ZX- 212. ZX-201, ZX-202 (fluororesin-siloxane graft polymer manufactured by T&K TOKA), or KP-911 (fluoropolysiloxane manufactured by Shin-Etsu Chemical Co., Ltd.), Lumiflon LF-100, LF-200, LF-302, LF-400, LF-554, LF-600, LF-986N (manufactured by Asahi Glass Co., Ltd.), etc.
又,於本發明中,所謂「含有氟樹脂」,係指黏著層至少含有氟樹脂。例如,黏著層中所含之氟樹脂之含量相對於黏著層之黏著主劑100質量份,較佳為0.1質量份以上,其中較佳為0.5質量份以上,尤佳為1.0質量份以上。藉由黏著層中之氟樹脂之含量具有上述下限,可於對黏著層照射能量線時,使黏著層具有之黏著力自初期黏著力充分地降低,可良好地提高黏著層之剝離性。又,黏著層中所含之氟樹脂之含量相對於黏著層之黏著主劑100質量份,較佳為30質量份以下,其中較佳為20質量份以下,尤佳為10質量份以下。藉由黏著層中之氟樹脂之含量具有上述上限,可抑制如下問題之產生:因黏著層中所含之氟樹脂過度增加而導致黏著層之初期黏著力降低,無法使保護片材充分地密接於被保護構件之表面。又,藉由黏著層中之氟樹脂之含量具有上述上限,可抑制氟樹脂成為殘渣而對其他組成產生不良影響之不良情況之產生。進而,藉由黏著層中之氟樹脂之含量具有上述上限,可抑制因黏著層白濁導致之霧度值之上升。In addition, in the present invention, "containing a fluororesin" means that the adhesive layer contains at least a fluororesin. For example, the content of the fluororesin contained in the adhesive layer is preferably not less than 0.1 part by mass, preferably not less than 0.5 part by mass, particularly preferably not less than 1.0 part by mass, relative to 100 parts by mass of the main adhesive agent of the adhesive layer. When the content of the fluororesin in the adhesive layer has the above-mentioned lower limit, when the adhesive layer is irradiated with energy rays, the adhesive force possessed by the adhesive layer can be sufficiently reduced from the initial adhesive force, and the detachability of the adhesive layer can be favorably improved. Also, the content of the fluororesin contained in the adhesive layer is preferably not more than 30 parts by mass, preferably not more than 20 parts by mass, particularly preferably not more than 10 parts by mass, relative to 100 parts by mass of the main adhesive agent of the adhesive layer. By having the above-mentioned upper limit of the content of the fluororesin in the adhesive layer, it is possible to suppress the following problems: the initial adhesive force of the adhesive layer decreases due to excessive increase of the fluororesin contained in the adhesive layer, and the protective sheet cannot be sufficiently adhered on the surface of the protected component. Moreover, since the content of the fluororesin in the adhesive layer has the above-mentioned upper limit, it is possible to suppress occurrence of a problem that the fluororesin remains as a residue and adversely affects other components. Furthermore, since the content of the fluororesin in an adhesive layer has the said upper limit, the increase of the haze value by the adhesive layer being cloudy can be suppressed.
(b)樹脂(黏著主劑) 作為可用作黏著主劑之樹脂,例如可列舉丙烯酸系樹脂。關於丙烯酸系樹脂,並無特別限定,例如可列舉:使(甲基)丙烯酸酯均聚而成之(甲基)丙烯酸酯聚合物、以(甲基)丙烯酸酯作為主成分並使(甲基)丙烯酸酯與其他單體共聚而成之(甲基)丙烯酸酯共聚物,較佳為(甲基)丙烯酸酯共聚物。作為(甲基)丙烯酸酯及其他單體之具體例,例如可列舉日本專利特開2012-31316號公報中揭示者。其他單體可單獨使用,或將兩種以上組合而使用。再者,所謂此處之主成分,意指共聚比率為51質量%以上,較佳為65質量%以上。(b) Resin (adhesive base agent) Examples of resins usable as the adhesive base include acrylic resins. The acrylic resin is not particularly limited, and examples thereof include (meth)acrylate polymers obtained by homopolymerizing (meth)acrylates, (meth)acrylates as main components and (meth)acrylates ) (meth)acrylate copolymer formed by copolymerization of acrylate and other monomers, preferably (meth)acrylate copolymer. Specific examples of (meth)acrylates and other monomers include, for example, those disclosed in JP-A-2012-31316. Other monomers may be used alone or in combination of two or more. In addition, the main component here means that the copolymerization ratio is 51 mass % or more, Preferably it is 65 mass % or more.
其中,作為上述丙烯酸系樹脂,可較佳地使用以(甲基)丙烯酸酯作為主成分且藉由與可與上述(甲基)丙烯酸酯共聚之含羥基之單體的共聚所獲得之(甲基)丙烯酸酯共聚物、或以(甲基)丙烯酸酯作為主成分且藉由與可與上述(甲基)丙烯酸酯共聚之含羥基之單體及含羧基之單體的共聚所獲得之(甲基)丙烯酸酯共聚物。Among them, as the above-mentioned acrylic resin, (meth)acrylate obtained by copolymerization with a hydroxyl group-containing monomer copolymerizable with the above-mentioned (meth)acrylate can be preferably used. base) acrylate copolymer, or a (meth)acrylate as a main component obtained by copolymerization with a hydroxyl-containing monomer and a carboxyl-containing monomer that can be copolymerized with the above-mentioned (meth)acrylate ( Meth)acrylate copolymer.
作為可共聚之含羥基之單體及含羧基之單體,並無特別限定,例如可使用日本專利特開2012-31316號公報中揭示之含羥基之單體及含羧基之單體。The copolymerizable hydroxyl group-containing monomer and carboxyl group-containing monomer are not particularly limited, and for example, the hydroxyl group-containing monomers and carboxyl group-containing monomers disclosed in JP-A-2012-31316 can be used.
作為上述丙烯酸系樹脂之質量平均分子量(Mw),較佳為20萬~100萬之範圍內,其中較佳為20萬~80萬之範圍內。其原因在於:藉由將丙烯酸系樹脂之質量平均分子量設為上述範圍內,可發揮充分之初期黏著力。The mass average molecular weight (Mw) of the above-mentioned acrylic resin is preferably within a range of 200,000 to 1 million, and particularly preferably within a range of 200,000 to 800,000. This is because sufficient initial adhesive force can be exhibited by making the mass average molecular weight of an acrylic resin into the said range.
又,於上述丙烯酸系樹脂為與可與(甲基)丙烯酸酯共聚之含羥基之單體及含羧基之單體的(甲基)丙烯酸酯共聚物之情形時,作為上述含羥基之單體與上述含羧基之單體之質量比,較佳為51:49~100:0之範圍內,其中較佳為75:25~100:0。其原因在於:若各單體之質量比為上述範圍內,則可期待藉由能量線照射帶來之有效之黏著力之降低,可防止將本發明之黏著層剝離時於被保護構件側產生糊劑殘留。In addition, when the above-mentioned acrylic resin is a (meth)acrylate copolymer with a hydroxyl-containing monomer and a carboxyl-containing monomer copolymerizable with (meth)acrylate, as the above-mentioned hydroxyl-containing monomer The mass ratio to the above-mentioned carboxyl group-containing monomer is preferably in the range of 51:49 to 100:0, particularly preferably 75:25 to 100:0. The reason is that if the mass ratio of each monomer is within the above range, the effective adhesive force can be expected to be reduced by energy ray irradiation, and it is possible to prevent the adhesive layer of the present invention from occurring on the protected member side when the adhesive layer is peeled off. Paste residue.
(c)能量線聚合性低聚物 能量線聚合性低聚物只要為受到能量線之照射而聚合者,則並無特別限定,例如可列舉:光自由基聚合性、光陽離子聚合性、光陰離子聚合性等之低聚物。其中,較佳為光自由基聚合性低聚物。其原因在於:硬化速度較快,又,可自多種多樣之化合物中選擇,進而,可容易地控制硬化前之黏著性或硬化後之剝離性等物性。作為光自由基聚合性低聚物,例如可列舉日本專利特開2012-31316號公報中揭示者,該等可單獨使用,或將兩種以上組合而使用。(c) Energy ray polymerizable oligomers. Energy ray polymerizable oligomers are not particularly limited as long as they are polymerized by irradiation with energy rays. For example, photoradical polymerizability, photocationic polymerizability, photo Oligomers with anionic polymerizability, etc. Among these, photoradical polymerizable oligomers are preferred. The reasons for this are that the curing speed is fast, and various compounds can be selected from, and furthermore, physical properties such as adhesiveness before curing and peelability after curing can be easily controlled. As a photoradically polymerizable oligomer, what was disclosed by Unexamined-Japanese-Patent No. 2012-31316 is mentioned, for example, These can be used individually or in combination of 2 or more types.
能量線聚合性低聚物之質量平均分子量(Mw)並無特別限定,例如為250~8000之範圍內,其中較佳為250~5000之範圍內。其原因在於:若質量平均分子量為上述範圍內,則本發明之黏著層於能量線照射前顯示所需之黏著性,於剝離步驟中之能量線照射後,抑制於被保護構件側產生糊劑殘留,可容易地剝離。The mass average molecular weight (Mw) of the energy ray polymerizable oligomer is not particularly limited, and is, for example, within the range of 250-8000, preferably within the range of 250-5000. The reason is that if the mass average molecular weight is within the above range, the adhesive layer of the present invention exhibits the desired adhesiveness before energy ray irradiation, and suppresses generation of paste on the protected member side after energy ray irradiation in the peeling step. Residue, can be easily peeled off.
黏著劑組成物藉由調整能量線聚合性低聚物之量,可控制能量線照射後之本發明之黏著層之黏著力。作為黏著劑組成物中之能量線聚合性低聚物之含量,相對於丙烯酸系樹脂100質量份,較佳為10質量份以上且180質量份以下,其中較佳為20質量份以上且150質量份以下。若上述含量為上述範圍內,則能量線照射後之本發明之黏著層之交聯密度變得充分,故而可實現所需之剝離性。又,可抑制因黏著劑組成物之凝聚力之降低導致之於被保護構件側產生糊劑殘留。Adhesive Composition By adjusting the amount of the energy ray polymerizable oligomer, the adhesive force of the adhesive layer of the present invention after energy ray irradiation can be controlled. The content of the energy ray polymerizable oligomer in the adhesive composition is preferably not less than 10 parts by mass and not more than 180 parts by mass, and preferably not less than 20 parts by mass and not more than 150 parts by mass relative to 100 parts by mass of the acrylic resin. servings or less. If the said content is in the said range, since the crosslink density of the adhesive layer of this invention after energy-beam irradiation becomes sufficient, desired peelability can be realizable. In addition, it is possible to suppress the occurrence of paste residue on the protected member side due to the decrease in the cohesive force of the adhesive composition.
(d)聚合起始劑 上述聚合起始劑可使用通常之光聚合起始劑。例如可根據基材之種類或照射至黏著層之能量線之種類,而自與其波長匹配之任意之聚合起始劑中選擇。於被保護構件為光學構件之情形時,對保護片材要求光學特性,故而例如較佳為使用黃色指數值(YI值)較低之光聚合起始劑。作為光聚合起始劑之YI值,例如較佳為2.0以下。再者,YI值可使用分光色差計(日本電色公司製造之SE6000)進行測定。作為此種聚合起始劑之市售品,例如可列舉IRGACURE184(BASF Japan公司製造)等。(d) Polymerization initiator As the above-mentioned polymerization initiator, a general photopolymerization initiator can be used. For example, it can be selected from any polymerization initiator matching the wavelength according to the type of substrate or the type of energy ray irradiated to the adhesive layer. When the member to be protected is an optical member, since optical characteristics are required for the protective sheet, for example, it is preferable to use a photopolymerization initiator with a low yellow index value (YI value). The YI value of the photopolymerization initiator is preferably, for example, 2.0 or less. In addition, YI value can be measured using a spectrocolorimeter (SE6000 by Nippon Denshoku Co., Ltd.). As a commercial item of such a polymerization initiator, IRGACURE184 (made by BASF Japan company) etc. are mentioned, for example.
黏著劑組成物中之聚合起始劑之含量相對於丙烯酸系樹脂及能量線聚合性低聚物之合計100質量份,為0.01質量份以上且10質量份以下,其中較佳為0.5質量份以上且7質量份以下。若聚合起始劑之含量未達上述範圍,則有未充分引起能量線聚合性低聚物之聚合反應,能量線照射後之本發明之黏著層之黏著力過度提高,而無法實現剝離性之情形,另一方面,若超過上述範圍,則有能量線僅到達能量線照射面之附近,本發明之黏著層之硬化變得不充分之情形。又,亦有黏著劑組成物之凝聚力降低而導致產生糊劑殘留之情形。再者,於在黏著劑組成物中含有能量線聚合性低聚物與下述能量線聚合性單體之情形時,較佳為相對於丙烯酸系樹脂、能量線聚合性低聚物、及能量線聚合性單體之合計100質量份,聚合起始劑之含量為上述範圍內。The content of the polymerization initiator in the adhesive composition is not less than 0.01 parts by mass and not more than 10 parts by mass, preferably not less than 0.5 parts by mass, based on 100 parts by mass of the total of the acrylic resin and the energy ray polymerizable oligomer And 7 mass parts or less. If the content of the polymerization initiator is less than the above-mentioned range, the polymerization reaction of the energy ray polymerizable oligomer may not be sufficiently induced, and the adhesive force of the adhesive layer of the present invention after energy ray irradiation is excessively increased, and the peelability cannot be achieved. On the other hand, if the above-mentioned range is exceeded, the energy ray may only reach the vicinity of the energy ray irradiated surface, and the curing of the adhesive layer of the present invention may become insufficient. In addition, the cohesive force of the adhesive composition decreases, resulting in paste residues. Furthermore, when an energy ray polymerizable oligomer and the following energy ray polymerizable monomer are contained in the adhesive composition, it is preferable to use The content of the polymerization initiator is within the above-mentioned range for a total of 100 parts by mass of linear polymerizable monomers.
(e)交聯劑 交聯劑只要為至少將丙烯酸系樹脂間交聯者,則並無特別限定,例如可列舉異氰酸酯系交聯劑、環氧系交聯劑等。作為異氰酸酯系交聯劑及環氧系交聯劑之具體例,可列舉日本專利特開2012-31316號公報中所揭示者。交聯劑可單獨使用,或將兩種以上組合而使用,可根據丙烯酸系樹脂之種類等而適宜選擇。(e) Cross-linking agent The cross-linking agent is not particularly limited as long as it cross-links at least acrylic resins, and examples thereof include isocyanate-based cross-linking agents and epoxy-based cross-linking agents. Specific examples of the isocyanate-based crosslinking agent and the epoxy-based crosslinking agent include those disclosed in JP-A-2012-31316. A crosslinking agent can be used individually or in combination of 2 or more types, It can select suitably according to the kind etc. of acrylic resin.
作為黏著劑組成物中之交聯劑之含量,可根據交聯劑之種類而適宜設定,例如相對於丙烯酸系樹脂100質量份,為0.01質量份以上且20質量份以下,其中較佳為0.01質量份以上且15質量份以下。 若交聯劑之含量未達上述範圍,則有本發明之黏著層與被保護構件之密接性較差之情形,或於將保護片材自被保護構件剝離時,本發明之黏著層發生凝聚破壞而於被保護構件側產生糊劑殘留之情形。另一方面,若交聯劑之含量超過上述範圍,則有上述交聯劑作為未反應單體而殘留於能量線照射後之本發明之黏著層中,由此凝聚力降低而導致產生糊劑殘留之情形。The content of the crosslinking agent in the adhesive composition can be appropriately set according to the type of crosslinking agent, for example, it is 0.01 to 20 parts by mass with respect to 100 parts by mass of the acrylic resin, preferably 0.01 More than 15 parts by mass and less than or equal to 15 parts by mass. If the content of the crosslinking agent does not reach the above range, the adhesion between the adhesive layer of the present invention and the member to be protected may be poor, or when the protective sheet is peeled off from the member to be protected, the adhesive layer of the present invention may be coagulated and destroyed. However, the paste remains on the protected member side. On the other hand, if the content of the cross-linking agent exceeds the above range, the above-mentioned cross-linking agent remains as an unreacted monomer in the adhesive layer of the present invention after energy ray irradiation, thereby reducing the cohesive force and resulting in paste residue. situation.
(f)任意之組成 黏著劑組成物亦可除了上述能量線聚合性低聚物以外,含有能量線聚合性單體。其原因在於:於照射能量線時,使黏著劑組成物藉由三維交聯而硬化而降低黏著力,並且提高黏著劑組成物之凝聚力而無法轉接著於被保護構件側。作為能量線聚合性單體,較佳為光自由基聚合性單體,其中,較佳為於一分子中具有3個以上之(甲基)丙烯醯基之多官能性丙烯酸酯或多官能性甲基丙烯酸酯。具體而言,可列舉日本專利特開2010-173091號公報中記載之能量線聚合性單體。(f) Arbitrary composition The adhesive composition may contain an energy ray polymerizable monomer in addition to the above energy ray polymerizable oligomer. The reason for this is that when the energy ray is irradiated, the adhesive composition is hardened by three-dimensional crosslinking to reduce the adhesive force, and the cohesive force of the adhesive composition is increased so that it cannot be transferred to the protected member side. The energy ray polymerizable monomer is preferably a photoradical polymerizable monomer, and among them, polyfunctional acrylates or polyfunctional acrylic acid esters having three or more (meth)acryl groups in one molecule are preferred. Methacrylate. Specifically, energy ray polymerizable monomers described in JP-A-2010-173091 may be mentioned.
於在上述黏著劑組成物中含有上述能量線聚合性低聚物與上述能量線聚合性單體之情形時,作為其合計含量,相對於丙烯酸系樹脂100質量份,為10質量份以上且180質量份以下,其中更佳為20質量份以上且150質量份以下。其原因在於:能量線照射後之交聯密度變得充分,可實現適合之剝離性,又,可抑制因黏著劑組成物之凝聚力之降低導致之於被保護構件側產生糊劑殘留。When the above-mentioned energy ray polymerizable oligomer and the above-mentioned energy ray polymerizable monomer are contained in the above-mentioned adhesive composition, the total content thereof is 10 parts by mass or more and 180 parts by mass with respect to 100 parts by mass of the acrylic resin. It is not more than 20 parts by mass and not more than 150 parts by mass. The reason for this is that the cross-linking density after energy ray irradiation becomes sufficient to achieve suitable peelability, and also to suppress the occurrence of paste residue on the protected member side due to the decrease in the cohesive force of the adhesive composition.
黏著劑組成物亦可視需要含有矽烷偶合劑、黏著賦予劑、金屬螯合劑、界面活性劑、抗氧化劑、紫外線吸收劑、顏料、染料、著色劑、抗靜電劑、防腐劑、消泡劑、潤濕性調整劑等各種添加劑。The adhesive composition may also contain silane coupling agents, adhesion imparting agents, metal chelating agents, surfactants, antioxidants, ultraviolet absorbers, pigments, dyes, colorants, antistatic agents, preservatives, defoamers, wetting agents, etc. Various additives such as moisture regulators.
(3)其他 作為本發明之黏著層之厚度,只要為可獲得充分之黏著力且能量線可透過至內部之大小即可,具體而言為3 μm以上且125 μm以下,其中較佳為5 μm以上且100 μm以下。(3) Others The thickness of the adhesive layer of the present invention is sufficient as long as sufficient adhesive force can be obtained and energy rays can penetrate to the inside. Specifically, it is 3 μm or more and 125 μm or less, preferably 5 μm or less. μm or more and 100 μm or less.
本發明之黏著劑組成物可將上述各成分進行混合,視需要進行混練或分散而製備。混練或分散方法並無特別限定,例如可應用日本專利特開2014-234460號公報中揭示之先前公知之混練分散機等。又,黏著劑組成物亦可為了調整黏度而添加稀釋溶劑並將各成分混合。The adhesive composition of the present invention can be prepared by mixing the above-mentioned components and kneading or dispersing them as necessary. The kneading or dispersing method is not particularly limited, and for example, a conventionally known kneading and dispersing machine disclosed in JP-A-2014-234460 can be used. In addition, in order to adjust the viscosity of the adhesive composition, a diluting solvent may be added and the components may be mixed.
2.基材 本發明之保護片材係於黏著層之一個面具有基材。基材較佳為可支持黏著層之層。本發明之基材係可對保護片材賦予耐熱性或耐化學品性等之構件。因此,例如於被保護構件之製造步驟中,為了抑制被保護構件之表面因製造過程中之加熱或化學品而劣化或污染,於被保護構件之表面貼附具有基材之保護片材時,可良好地保護被保護構件免受熱或化學品之影響。2. Substrate The protective sheet of the present invention has a substrate on one side of the adhesive layer. The substrate is preferably a layer that can support the adhesive layer. The base material of the present invention is a member capable of imparting heat resistance, chemical resistance, and the like to the protective sheet. Therefore, for example, in the manufacturing process of the member to be protected, in order to prevent the surface of the member to be protected from deteriorating or polluting due to heating or chemicals in the manufacturing process, when a protective sheet having a base material is attached to the surface of the member to be protected, It can well protect the protected components from heat or chemicals.
本發明之基材較佳為具有耐熱性。基材之耐熱性例如較佳為基材材料之150℃~250℃之範圍內之熱膨脹係數為5 ppm/℃~50 ppm/℃之範圍內,其中,較佳為10 ppm/℃~30 ppm/℃之範圍內。The substrate of the present invention preferably has heat resistance. For example, the heat resistance of the base material is preferably within the range of 5 ppm/°C to 50 ppm/°C, and preferably 10 ppm/°C to 30 ppm in the range of 150°C to 250°C of the base material. /°C range.
上述基材可具有可撓性,亦可不具有。作為此種基材,例如可列舉:石英玻璃、Pyrex(註冊商標)玻璃、合成石英板等無機基材、樹脂膜、光學用樹脂板等樹脂基材等。The aforementioned base material may or may not have flexibility. Examples of such substrates include inorganic substrates such as quartz glass, Pyrex (registered trademark) glass, and synthetic quartz plates; resin substrates such as resin films and optical resin plates; and the like.
作為可用於樹脂基材之樹脂,較佳為顯示上述熱膨脹係數者,其中,除上述物性以外,就尺寸穩定性、能量線透過性、剛性、伸長性、積層適性、耐化學品性亦優異之方面而言,較佳為聚醯亞胺系樹脂、聚苯硫醚系樹脂、聚酯系樹脂、玻璃環氧樹脂(Glass epoxy,環氧樹脂)。樹脂基材可為由一種樹脂所構成之單層,亦可為將兩種以上之樹脂基材積層而成之多層體。As the resin that can be used for the resin base material, it is preferable to show the above-mentioned thermal expansion coefficient, and among them, in addition to the above-mentioned physical properties, it is also excellent in dimensional stability, energy ray permeability, rigidity, elongation, lamination suitability, and chemical resistance. In terms of aspects, polyimide-based resins, polyphenylene sulfide-based resins, polyester-based resins, and glass epoxy resins are preferred. The resin base material may be a single layer composed of one resin, or a multi-layer body formed by laminating two or more resin base materials.
基材之厚度並無特別限定,可根據材質或可撓性之有無、黏著層之種類而適宜選擇。The thickness of the substrate is not particularly limited, and can be appropriately selected according to the material, the presence or absence of flexibility, and the type of the adhesive layer.
基材之形態並無特別限定,根據可撓性之有無,例如可列舉:板狀、片狀、膜狀、帶狀等。又,上述基材可為卷狀,亦可為單片狀。The form of the base material is not particularly limited, and examples thereof include a plate shape, a sheet shape, a film shape, and a tape shape depending on the presence or absence of flexibility. In addition, the above-mentioned base material may be in the form of a roll or in the form of a single sheet.
基材較佳為具有透明性。可自基材側照射足以使黏著層之黏著力降低之能量線。關於此時之基材之光透過率,只要可使所需之量之能量線透過即可,可適宜設定。The substrate preferably has transparency. Energy rays sufficient to reduce the adhesive force of the adhesive layer can be irradiated from the substrate side. The light transmittance of the base material at this time can be appropriately set as long as it can transmit a required amount of energy rays.
關於基材,為了提高與黏著層之密接性,亦可對要形成黏著層之面實施電暈處理或底塗處理等表面處理。Regarding the base material, in order to improve the adhesion with the adhesive layer, surface treatment such as corona treatment or primer treatment may be performed on the surface where the adhesive layer is to be formed.
3.其他構成 本發明之保護片材只要具有上述黏著層及基材即可,但亦可視需要具有其他構成。例如,本發明之保護片材可於黏著層及基材之間具有其他構成,亦可於基材之與黏著層相反側之面具有其他構成。作為其他構成,例如可列舉分隔件。再者,分隔件通常係配置於基材之與黏著層相反側之面。以下,對各個構成進行說明。3. Other configurations The protective sheet of the present invention only needs to have the above-mentioned adhesive layer and base material, but may have other configurations as needed. For example, the protective sheet of the present invention may have other structures between the adhesive layer and the substrate, or may have other structures on the surface of the substrate opposite to the adhesive layer. As another structure, a separator is mentioned, for example. Furthermore, the separator is usually disposed on the surface of the substrate opposite to the adhesive layer. Each configuration will be described below.
本發明之保護片材亦可於黏著層之與基材相反側之面具有分隔件。分隔件係自黏著層可剝離地設置,於將保護片材貼附於被保護構件時,自黏著層剝離。藉由於黏著層之表面設置分隔件,可於經由黏著層將保護片材貼附於被保護構件之前之期間中,抑制黏著層之表面被污染或劃傷而黏著層之初期黏著力降低之不良情況之產生。The protective sheet of the present invention may also have a separator on the surface of the adhesive layer opposite to the substrate. The separator is provided releasably from the adhesive layer, and is peeled off from the adhesive layer when the protective sheet is attached to the member to be protected. By providing the spacer on the surface of the adhesive layer, it is possible to prevent the initial adhesive force of the adhesive layer from being reduced due to contamination or scratches on the surface of the adhesive layer during the period before the protective sheet is attached to the member to be protected through the adhesive layer. the occurrence of the situation.
作為此種分隔件,例如可使用:脫模膜、隔離紙、隔離膜、分隔紙、剝離膜、剝離紙等先前公知之分隔件。具體而言,可列舉聚丙烯或聚乙烯、氟膜等。又,分隔件可為上述所例示之單層且具有脫模性,但亦可使用於道林紙、塗料紙、含浸紙、塑膠膜等脫模紙用基材之單面或雙面形成有脫模層之積層體。作為脫模層,只要為具有脫模性之材料,則並無特別限定,例如有聚矽氧樹脂、有機樹脂改性聚矽氧樹脂、氟樹脂、胺基醇酸樹脂、三聚氰胺樹脂、丙烯酸系樹脂、聚酯樹脂、長鏈烷基樹脂等。該等樹脂可使用乳液型、溶劑型或無溶劑型之任一種。As such a separator, conventionally known separators, such as a release film, release paper, release film, separator paper, release film, and release paper, can be used, for example. Specifically, polypropylene, polyethylene, a fluorine film, etc. are mentioned. In addition, the separator can be a single layer as exemplified above and has release properties, but it can also be used on one or both sides of release paper substrates such as Dolly paper, coated paper, impregnated paper, and plastic film to form a The laminate of the release layer. The mold release layer is not particularly limited as long as it is a material with mold release properties, such as silicone resin, organic resin modified silicone resin, fluororesin, amino alkyd resin, melamine resin, acrylic resin, etc. Resin, polyester resin, long chain alkyl resin, etc. Any of emulsion type, solvent type, or solvent-free type can be used for these resins.
分隔件較佳為於與黏著層接觸之面實施有易剝離處理。The separator is preferably provided with easy-peeling treatment on the surface in contact with the adhesive layer.
分隔件亦可具有防濕性。其原因在於:藉由使分隔件具有防濕性,可於經由黏著層將保護片材貼附於被保護構件之前之期間中,防止黏著層與濕氣之接觸。所謂分隔件具有防濕性,係指例如溫度40℃濕度90%RH下之分隔件之水蒸氣透過度較佳為1 g/m2 /day以下,其中較佳為0.1 g/m2 /day以下。水蒸氣透過度可依據JIS K7129進行測定。作為具有防濕性之分隔件,例如可列舉:經聚矽氧等之剝離處理之鋁蒸鍍膜、二氧化矽蒸鍍膜、鋁箔、厚度為0.1 mm以上之聚乙烯膜、包含防濕填料之膜等。The separator may also have moisture resistance. The reason for this is that by making the separator moisture-proof, it is possible to prevent the adhesive layer from coming into contact with moisture during the period before the protective sheet is attached to the member to be protected via the adhesive layer. The so-called moisture-proof property of the separator means that, for example, the water vapor permeability of the separator at a temperature of 40°C and a humidity of 90%RH is preferably less than 1 g/m 2 /day, and preferably 0.1 g/m 2 /day the following. The water vapor permeability can be measured in accordance with JIS K7129. Examples of moisture-proof separators include aluminum vapor-deposited films, silica-deposited films, aluminum foils, polyethylene films with a thickness of 0.1 mm or more, films containing moisture-proof fillers, etc. Wait.
分隔件亦可根據黏著層中含有之材料之種類、或施工環境而具有遮光性。其原因在於:可於經由黏著層將被保護片材貼附於保護構件之前之期間中,抑制黏著層受到紫外線等之照射而劣化。作為具有遮光性之分隔件,例如可列舉:鋁箔分隔件、鋁蒸鍍膜或紙分隔件、著色分隔件、加入有紫外線吸收劑之膜分隔件等。The separator may also have light-shielding properties depending on the type of material contained in the adhesive layer or the construction environment. This is because it is possible to suppress deterioration of the adhesive layer due to irradiation of ultraviolet rays or the like until the sheet to be protected is attached to the protective member via the adhesive layer. Examples of the separator having light-shielding properties include aluminum foil separators, aluminum vapor-deposited films or paper separators, colored separators, film separators containing ultraviolet absorbers, and the like.
4.用途 本發明之保護片材可用作用以保護被保護構件之構件。具體而言,可將被保護構件之加工時之保護作為目的而使用。此外,本發明之保護片材可用作被保護構件之搬送用之構件,或亦可用作支持膜。即,本發明之保護片材亦有作為承載膜之用途。4. Application The protective sheet of the present invention can be used as a member for protecting a member to be protected. Specifically, it can be used for the purpose of protection during processing of the member to be protected. Moreover, the protective sheet of this invention can be used as a member for conveyance of the member to be protected, or can also be used as a support film. That is, the protective sheet of the present invention is also useful as a carrier film.
B.附保護片材之積層體 本發明之附保護片材之積層體係將保護片材與被保護構件積層而成者,且上述保護片材具有黏著層、配置於上述黏著層之一個面之基材,上述黏著層具有藉由照射能量線而黏著力自初期黏著力降低之特性,上述黏著層含有氟樹脂。B. Laminated body with protective sheet The laminated system with protective sheet of the present invention is formed by laminating the protective sheet and the member to be protected, and the protective sheet has an adhesive layer and is arranged on one side of the adhesive layer In the base material, the above-mentioned adhesive layer has a characteristic that the adhesive force decreases from the initial adhesive force by irradiation of energy rays, and the above-mentioned adhesive layer contains a fluororesin.
關於本發明之附保護片材之積層體之使用圖式之說明,可設為與上述「A.保護片材」之項中所說明之圖2之說明相同,故而省略此處之記載。The description of the usage diagram of the laminate with protective sheet of the present invention can be set to be the same as the description of Fig. 2 described in the above "A. Protective sheet", so the description here is omitted.
根據本發明,藉由具有上述保護片材,可製成如下附保護片材之積層體,該附保護片材之積層體可使用可藉由照射能量線而降低黏著力之黏著層,更容易地進行自被保護構件之剝離。再者,本發明之詳細效果之說明可設為與上述「A.保護片材」之項中所說明之內容相同,故而省略此處之記載。According to the present invention, by having the above-mentioned protective sheet, it is possible to produce a laminate with a protective sheet as follows. This laminate with a protective sheet can use an adhesive layer that can reduce the adhesive force by irradiating energy rays, making it easier to Peel off from the protected member. Furthermore, the description of the detailed effects of the present invention can be assumed to be the same as that described in the item "A. Protective sheet" above, so the description here is omitted.
1.保護片材 本發明之保護片材係積層於被保護構件之構件。又,保護片材係如下構件:具有黏著層、及配置於上述黏著層之一個面之基材,上述黏著層具有藉由照射能量線而黏著力自初期黏著力降低之特性,上述黏著層含有氟樹脂。1. Protective sheet The protective sheet of the present invention is a member laminated on the member to be protected. In addition, the protective sheet is a member having an adhesive layer and a base material arranged on one side of the adhesive layer, the adhesive layer has the characteristic that the adhesive force is reduced from the initial adhesive force by irradiation of energy rays, and the adhesive layer contains Fluorine resin.
關於本發明之保護片材,可設為與上述「A.保護片材」之項中所說明之內容相同,故而省略此處之記載。Regarding the protective sheet of the present invention, it can be assumed to be the same as that described in the item "A. Protective sheet" above, so the description here is omitted.
2.被保護構件 本發明之被保護構件係可積層上述保護片材之構件,並無特別限定。其中,較佳為FPC或PCB等於製造步驟中需要保護表面之製品。此外,較佳為具有端子者,例如可列舉:IC(Integrated Circuit,積體電路)晶片、LSI(Large Scale Integration,大規模積體電路)晶片等半導體晶片、半導體封裝、晶片電容器、晶片電阻、電晶體、電感器等,又,可列舉圖像顯示裝置等電子機器、建築材料或汽車等。於本發明中,被保護構件較佳為具有寬廣面積之表面之製品。於具有寬廣面積之表面之被保護構件之情形時,貼附於該表面之保護片材要求更良好之剝離性。因此,藉由使用上述本發明之保護片材而獲得之效果變得明顯。2. Protected member The protected member of the present invention is a member that can be laminated with the above-mentioned protective sheet, and is not particularly limited. Among them, FPC or PCB are preferred, which are products that need to protect the surface in the manufacturing process. In addition, those having terminals are preferred, for example, semiconductor chips such as IC (Integrated Circuit, integrated circuit) chips, LSI (Large Scale Integration, large-scale integrated circuits) chips, semiconductor packages, chip capacitors, chip resistors, Transistors, inductors, etc., and electronic devices such as image display devices, building materials, automobiles, and the like are exemplified. In the present invention, the member to be protected is preferably a product having a surface with a wide area. In the case of a member to be protected having a surface with a wide area, the protective sheet attached to the surface requires better peelability. Therefore, the effects obtained by using the protective sheet of the present invention described above become apparent.
再者,本發明並不限定於上述實施形態。上述實施形態為例示,具有與本發明之申請專利範圍中所記載之技術思想實質上相同之構成且發揮相同之作用效果者無論為哪種,均包含於本發明之技術範圍中。 [實施例]In addition, this invention is not limited to the said embodiment. The above-mentioned embodiments are examples, and any one having substantially the same configuration as the technical idea described in the claims of the present invention and exerting the same effect is included in the technical scope of the present invention. [Example]
[實施例] (黏著劑組成物之製備) 相對於丙烯酸系黏著劑(綜研化學股份有限公司製造之商品名:SK Dyne 1811L)100質量份,將能量線聚合性低聚物(新中村化學工業股份有限公司製造之商品名:NK Oligo U-10PA)50質量份、聚合起始劑(BASF Japan股份有限公司製造之商品名:IRGACURE819)1.5質量份、氟樹脂(T&K TOKA股份有限公司製造之商品名:ZX-022)3質量份、交聯劑(綜研化學股份有限公司製造之商品名:L-45)3質量份利用甲苯及甲基乙基酮之混合溶劑(DIC GRAPHICS股份有限公司製造之商品名:KT-11)以固形物成分比成為30%之方式進行稀釋,使其等充分地分散,而製備黏著劑組成物。[Example] (Preparation of Adhesive Composition) Energy ray polymerizable oligomer (Shin Nakamura Chemical Co., Ltd. Co., Ltd. product name: NK Oligo U-10PA) 50 parts by mass, polymerization initiator (BASF Japan Co., Ltd. product name: IRGACURE819) 1.5 parts by mass, fluororesin (T&K TOKA Co., Ltd. product product) Name: ZX-022) 3 parts by mass, crosslinking agent (trade name: L-45 manufactured by Soken Chemical Co., Ltd.) 3 parts by mass using a mixed solvent of toluene and methyl ethyl ketone (manufactured by DIC GRAPHICS Co., Ltd. Product name: KT-11) was diluted so that the solid content ratio became 30%, and was sufficiently dispersed to prepare an adhesive composition.
(保護片材之製作) 藉由刮刀式塗佈,以乾燥後之厚度成為75 μm之方式將上述黏著劑組成物塗敷於聚對苯二甲酸乙二酯(PET)分隔件(東洋紡織股份有限公司製造之商品名:E7304 厚度:50 μm),形成黏著層。黏著層之乾燥後,將基材(東洋紡織股份有限公司製造之商品名:A4100 厚度:50 μm)進行層壓,獲得本發明之保護片材。(Preparation of protective sheet) The above-mentioned adhesive composition was applied to a polyethylene terephthalate (PET) separator (Toyobo Co., Ltd. Co., Ltd. product name: E7304 thickness: 50 μm), forming an adhesive layer. After the adhesive layer was dried, a substrate (trade name: A4100 manufactured by Toyobo Co., Ltd., thickness: 50 μm) was laminated to obtain the protective sheet of the present invention.
[比較例] 於黏著劑組成物中不含氟樹脂,除此以外,以與實施例相同之方式獲得保護片材。[Comparative Example] A protective sheet was obtained in the same manner as in Examples except that no fluororesin was included in the adhesive composition.
[評價] 對實施例及比較例中所獲得之保護片材之剝離力進行評價。剝離力之評價係使用Kapton 200H作為被保護構件,依據JIS Z0237進行。結果係示於表1。[Evaluation] The peeling force of the protective sheets obtained in Examples and Comparative Examples was evaluated. The evaluation of the peeling force was carried out in accordance with JIS Z0237 using Kapton 200H as the protected member. The results are shown in Table 1.
[表1]
根據實施例及比較例之結果,藉由黏著層含有氟樹脂,可使黏著層之表面自由能降低,進一步降低能量照射後之黏著力。According to the results of Examples and Comparative Examples, the surface free energy of the adhesive layer can be reduced by containing the fluororesin in the adhesive layer, and the adhesive force after energy irradiation can be further reduced.
1‧‧‧黏著層2‧‧‧基材10‧‧‧保護片材20‧‧‧被保護構件100‧‧‧附保護片材之積層體1‧‧‧
圖1係表示本發明之保護片材一例之概略剖視圖。 圖2係表示本發明之附保護片材之積層體之一例之概略剖視圖。Fig. 1 is a schematic sectional view showing an example of the protective sheet of the present invention. Fig. 2 is a schematic cross-sectional view showing an example of a laminate with a protective sheet of the present invention.
1‧‧‧黏著層 1‧‧‧adhesive layer
2‧‧‧基材 2‧‧‧Substrate
10‧‧‧保護片材 10‧‧‧protective sheet
Claims (2)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017161243A JP6693487B2 (en) | 2017-08-24 | 2017-08-24 | Protective sheet and laminate with protective sheet |
| JP2017-161243 | 2017-08-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201912407A TW201912407A (en) | 2019-04-01 |
| TWI786165B true TWI786165B (en) | 2022-12-11 |
Family
ID=65440090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107128404A TWI786165B (en) | 2017-08-24 | 2018-08-15 | Protection sheet and layered body with protection sheet |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6693487B2 (en) |
| TW (1) | TWI786165B (en) |
| WO (1) | WO2019039340A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113574083B (en) * | 2019-03-20 | 2025-06-10 | 积水化学工业株式会社 | Adhesive composition, adhesive tape, and method for treating electronic component |
| KR102797178B1 (en) * | 2020-10-01 | 2025-04-21 | 디아이씨 가부시끼가이샤 | Adhesive composition and laminated film using the same |
| KR102376882B1 (en) * | 2021-02-10 | 2022-03-21 | (주)이녹스첨단소재 | Adhesive sheet for display |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003073629A (en) * | 2001-09-03 | 2003-03-12 | Somar Corp | Adhesive composition and adhesive sheet |
| JP2011184603A (en) * | 2010-03-10 | 2011-09-22 | Furukawa Electric Co Ltd:The | Self-adhesive tape and tape for processing semiconductor |
| JP2016044186A (en) * | 2014-08-19 | 2016-04-04 | リンテック株式会社 | Surface protection film |
| JP2017019158A (en) * | 2015-07-09 | 2017-01-26 | 三菱樹脂株式会社 | Laminate film |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10120994A (en) * | 1996-10-23 | 1998-05-12 | Sekisui Chem Co Ltd | Curable adhesive sheet and method of joining members |
| JP4676297B2 (en) * | 2005-01-24 | 2011-04-27 | 電気化学工業株式会社 | An adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet. |
| JP4538398B2 (en) * | 2005-10-31 | 2010-09-08 | 株式会社巴川製紙所 | Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device |
| JP2008138130A (en) * | 2006-12-05 | 2008-06-19 | Nitto Denko Corp | Photocurable adhesive tape or sheet manufacturing method, and photocurable adhesive tape or sheet |
| TWI461501B (en) * | 2010-12-20 | 2014-11-21 | 漢高智慧財產控股公司 | Photocurable cutting adhesive tape |
| JP5945438B2 (en) * | 2012-03-26 | 2016-07-05 | リンテック株式会社 | Dicing sheet |
| JP5998762B2 (en) * | 2012-09-03 | 2016-09-28 | 大日本印刷株式会社 | Adhesive composition and adhesive tape |
| WO2017150290A1 (en) * | 2016-03-04 | 2017-09-08 | 日東電工株式会社 | Surface protective film |
-
2017
- 2017-08-24 JP JP2017161243A patent/JP6693487B2/en active Active
-
2018
- 2018-08-13 WO PCT/JP2018/030212 patent/WO2019039340A1/en not_active Ceased
- 2018-08-15 TW TW107128404A patent/TWI786165B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003073629A (en) * | 2001-09-03 | 2003-03-12 | Somar Corp | Adhesive composition and adhesive sheet |
| JP2011184603A (en) * | 2010-03-10 | 2011-09-22 | Furukawa Electric Co Ltd:The | Self-adhesive tape and tape for processing semiconductor |
| JP2016044186A (en) * | 2014-08-19 | 2016-04-04 | リンテック株式会社 | Surface protection film |
| JP2017019158A (en) * | 2015-07-09 | 2017-01-26 | 三菱樹脂株式会社 | Laminate film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019038922A (en) | 2019-03-14 |
| JP6693487B2 (en) | 2020-05-13 |
| WO2019039340A1 (en) | 2019-02-28 |
| TW201912407A (en) | 2019-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9394465B2 (en) | Transparent adhesive sheet and image display device | |
| TWI818233B (en) | Transparent double-sided adhesive sheet and adhesive sheet laminate | |
| TWI643756B (en) | Image display device | |
| WO2016024618A1 (en) | Transparent adhesive sheet | |
| TWI780255B (en) | Adhesive sheet, structure and manufacturing method thereof | |
| CN106133079B (en) | Adhesive composition, adhesive and adhesive sheet | |
| KR20190098046A (en) | Pressure-sensitive adhesive sheet and pressure-sensitive adhesive sheet laminate | |
| JP2017019903A (en) | Adhesive sheet for image display device, method for producing image display device and image display device | |
| TWI786165B (en) | Protection sheet and layered body with protection sheet | |
| JP6086298B2 (en) | Adhesive composition and adhesive sheet using the same | |
| JP2014196442A (en) | Adhesive composition and adhesive sheet using the same | |
| KR20220121181A (en) | Method for producing antistatic surface-protective film, and antistatic surface-protective film | |
| CN107075079B (en) | Assembly method or staged PSA system using ultraviolet curable Pressure Sensitive Adhesive (PSA) | |
| JP6214797B2 (en) | Adhesive sheet | |
| KR102503920B1 (en) | Surface-protective film | |
| KR102171407B1 (en) | Adhesive protective film and optical member comprising the same | |
| KR102494761B1 (en) | Multilayer sheet and manufacturing method thereof | |
| JP2014237763A (en) | Adhesive composition, self-adhesive film using the same, and surface protective film using the same | |
| TW201805158A (en) | Laminated body and protective film | |
| JP7239660B2 (en) | Adhesive film and surface protection film | |
| WO2018105413A1 (en) | Pressure-sensitive adhesive sheet and production method therefor | |
| JP6827670B2 (en) | Adhesive composition for optical member protective film and optical member protective film | |
| CN120958095A (en) | Adhesive sheet and display body | |
| WO2023153152A1 (en) | Pressure-sensitive adhesive and pressure-sensitive adhesive sheet | |
| CN121002139A (en) | Adhesive sheet and display body |